Display panel and display device

Abstract

The application relates to a display panel and a display device, and is applied to the field of display technology. The display panel comprises a substrate, a plurality of light emitting devices arranged on one side of the substrate, and a plurality of packaging parts arranged on the side, away from the substrate, of the plurality of light emitting devices and corresponding to the plurality of light emitting devices. The plurality of light emitting devices comprises first light emitting devices and second light emitting devices with different wavelengths of emitted light. The plurality of packaging parts comprises first packaging parts corresponding to the first light emitting devices and second packaging parts corresponding to the second light emitting devices. The optical thickness of the first packaging parts is different from the optical thickness of the second packaging parts. The application actively compensates for the different degrees of optical path changes and microcavity drifts of different wavelengths of light when the viewing angle increases by means of the differential design of the optical thickness of the packaging layer, thereby improving the viewing angle deviation and the brightness decay caused by the same packaging layer structure.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and display device. Background Technology

[0002] Silicon-based microdisplays (silicon-based OLED microdisplays) typically employ independent emission of RGB subpixels to achieve full-color display. In existing technologies, the fabrication of RGB subpixels in silicon-based microdisplays generally adopts a process route of "full-area evaporation + full-area encapsulation," combined with photolithography technology to achieve the patterning definition of subpixels.

[0003] To improve luminous efficiency and color purity from a frontal viewing angle, existing designs have incorporated microcavity compensation into the organic light-emitting layers of RGB subpixels. Specifically, by precisely designing different thicknesses of the organic light-emitting layers in the red, green, and blue subpixels, the optical microcavity effect is utilized to achieve optimal resonance enhancement for each wavelength of light from a frontal viewing angle. Typically, red light has the longest wavelength (approximately 620-750nm) and the thickest organic layer; blue light has the shortest wavelength (approximately 450-480nm) and the thinnest organic layer; green light falls in between.

[0004] However, the RGB subpixels share the exact same encapsulation layer structure, which is only used for water and oxygen barrier and surface planarization, and is not involved in the optical design. Since light of different wavelengths behaves differently in the microcavity, the peak wavelength of short-wavelength light (such as blue light) will shift more significantly as the viewing angle increases. This results in a much more severe brightness attenuation and color shift in the blue subpixel than in the long-wavelength light (such as red light), making it difficult to maintain good color consistency and brightness uniformity across the entire viewing angle. Summary of the Invention

[0005] Therefore, it is necessary to provide a display panel and display device to improve the color shift and brightness decay problems of silicon-based microdisplays at different viewing angles.

[0006] In a first aspect, this application provides a display panel, which adopts the following technical solution:

[0007] A display panel includes a substrate, a plurality of light-emitting devices, and a plurality of encapsulation portions. The plurality of light-emitting devices are spaced apart on one side of the substrate. The plurality of light-emitting devices include a first light-emitting device and a second light-emitting device that emit light with different wavelengths. The plurality of encapsulation portions are spaced apart on one side of the substrate. The plurality of encapsulation portions are correspondingly arranged with the plurality of light-emitting devices, and the encapsulation portion is located on the side of the corresponding light-emitting device that is away from the substrate. The plurality of encapsulation portions include a first encapsulation portion and a second encapsulation portion, the first encapsulation portion being correspondingly arranged with the first light-emitting device, and the second encapsulation portion being correspondingly arranged with the second light-emitting device. The optical thickness of the first encapsulation portion and the optical thickness of the second encapsulation portion are different.

[0008] In one embodiment, the wavelength of the light emitted by the first light-emitting device is less than the wavelength of the light emitted by the second light-emitting device, and the optical thickness of the first package is greater than the optical thickness of the second package.

[0009] In one embodiment, the plurality of light-emitting devices further includes a third light-emitting device, wherein the wavelengths of the light emitted by the first light-emitting device, the second light-emitting device, and the third light-emitting device are different, and the plurality of encapsulation portions further include a third encapsulation portion corresponding to the third light-emitting device; wherein the wavelength of the light emitted by the third light-emitting device is greater than the wavelength of the light emitted by the second light-emitting device; and the optical thickness of the third encapsulation portion is less than or equal to the optical thickness of the second encapsulation portion.

[0010] In one embodiment, at least one of the encapsulation portions includes an optical compensation layer for increasing the optical thickness of the light emitted by the corresponding light-emitting device.

[0011] In one embodiment, the first encapsulation portion includes an optical compensation layer, and the optical compensation layer in the second encapsulation portion and the third encapsulation portion has a dimension of 0 along the thickness direction of the substrate.

[0012] In one embodiment, each of the packaging portions includes an optical compensation layer; the dimension of the optical compensation layer of the first packaging portion along the thickness direction of the substrate is larger than the dimension of the optical compensation layer of the second packaging portion along the thickness direction of the substrate.

[0013] In one embodiment, the dimension of the optical compensation layer of the second package portion along the thickness direction of the substrate is greater than or equal to the dimension of the optical compensation layer of the third package portion along the thickness direction of the substrate.

[0014] In one embodiment, the refractive index of the optical compensation layer of the first package is greater than the refractive index of the optical compensation layer of the second package.

[0015] In one embodiment, the refractive index of the optical compensation layer of the second package is greater than or equal to the refractive index of the optical compensation layer of the third package.

[0016] In one embodiment, each of the encapsulation portions includes a barrier layer; in the encapsulation portion having the optical compensation layer, the barrier layer is disposed on the side of the optical compensation layer facing away from the light-emitting device; wherein the distance between the surfaces of the first encapsulation portion, the second encapsulation portion, and the third encapsulation portion facing away from the substrate and the substrate is equal.

[0017] In one embodiment, the dimension of the barrier layer of the first package portion along the thickness direction of the substrate is smaller than the dimension of the barrier layer of the second package portion along the thickness direction of the substrate.

[0018] In one embodiment, the dimension of the barrier layer of the second encapsulation portion along the thickness direction of the substrate is less than or equal to the dimension of the barrier layer of the third encapsulation portion along the thickness direction of the substrate.

[0019] In one embodiment, the refractive index of the optical compensation layer is in the range of 1.45-2.00.

[0020] In one embodiment, each of the encapsulation portions includes a buffer layer; in the encapsulation portion provided with the optical compensation layer, the buffer layer is disposed between the optical compensation layer and the light-emitting device.

[0021] In one embodiment, the dimension of the buffer layer along the thickness direction of the substrate is smaller than the dimension of the optical compensation layer along the thickness direction of the substrate.

[0022] Secondly, this application provides a display device, which adopts the following technical solution:

[0023] A display device includes the display panel described above.

[0024] The aforementioned display panel, by providing a first encapsulation part with a larger optical thickness for the first light-emitting device with a shorter wavelength (such as blue light) and a second encapsulation part with a smaller optical thickness for the second light-emitting device with a longer wavelength (such as red light), actively compensates for the different degrees of optical path change and microcavity drift caused by different wavelengths of light when the viewing angle increases by utilizing the differentiated design of the optical thickness of the encapsulation layer. This effectively improves the viewing angle color shift and brightness attenuation problems caused by sharing the same encapsulation layer structure in the prior art, and enhances the color consistency and brightness uniformity of the display panel across the entire viewing angle range. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of a display panel in the prior art.

[0026] Figure 2 This is a schematic diagram of the structure of the display panel in one embodiment of this application.

[0027] Figure 3 This is a schematic diagram of the structure of the display panel in another embodiment of this application.

[0028] Figure 4 This is a schematic diagram of the structure of the display panel in another embodiment of this application.

[0029] Figure 5This is a schematic diagram of the structure of the display panel in another embodiment of this application.

[0030] Figure 6 for Figure 4 A partial schematic diagram of the display panel shown.

[0031] Figure 7 for Figure 6 A magnified view of part A in the middle.

[0032] Attached image annotations:

[0033] 1. Substrate; 2. First light-emitting device; 21. First electrode layer; 22. First light-emitting material layer; 23. Second electrode layer; 3. Second light-emitting device; 4. Third light-emitting device; 5. First encapsulation part; 51. First optical compensation layer; 52. First barrier layer; 53. First buffer layer; 6. Second encapsulation part; 61. Second optical compensation layer; 62. Second barrier layer; 63. Second buffer layer; 7. Third encapsulation part; 71. Third optical compensation layer; 72. Third barrier layer; 73. Third buffer layer; 8. Pixel definition layer; 9. First conductive layer; 10. Second conductive layer; 11. First full-surface encapsulation layer; 111. First encapsulation sub-layer; 112. Second encapsulation sub-layer; 113. Third encapsulation sub-layer; 12. Second full-surface encapsulation layer; 100. Encapsulation layer structure; 101. R sub-pixel; 102. G sub-pixel; 103. B sub-pixel. Detailed Implementation

[0034] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0035] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0036] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0038] It is understood that the "optical thickness" referred to in this application belongs to the category of thin film optics and interference optics, rather than the attenuation optical thickness in the field of radiation transmission.

[0039] In this application, optical thickness is synonymous with optical path and is defined by the following formula: τ = n * d. In the formula, τ represents optical thickness (or optical path), with the unit being a unit of length (e.g., nanometer, nm); n is the refractive index of the dielectric layer material (dimensionless); and d is the physical thickness of the dielectric layer (with the same unit as τ, e.g., nm).

[0040] The "optical thickness" defined in this application describes the effective propagation distance of light in a medium due to the refractive index, and its value directly affects the interference conditions and the directionality of the emitted light. In contrast, in the field of radiative transmission, "optical thickness" usually refers to a logarithmic measure (dimensionless) of the attenuation of light intensity due to absorption or scattering. The two have completely different physical meanings and should be distinguished according to the context.

[0041] Currently, the fabrication of RGB subpixels in silicon-based microdisplays mostly employs a process route combining full-surface evaporation and full-surface encapsulation, with photolithography used to define the patterned subpixels. To improve luminous efficiency and color purity from a frontal viewing angle, existing designs have incorporated microcavity compensation into the organic light-emitting layers of RGB subpixels. By precisely designing different thicknesses of the organic light-emitting layers in the red, green, and blue subpixels, optimal resonance enhancement effects are achieved for each wavelength of light from a frontal viewing angle.

[0042] However, see Figure 1As shown, the existing structure has the following shortcomings: R sub-pixel 101, G sub-pixel 102, and B sub-pixel 103 share the same identical encapsulation layer structure 100. The encapsulation layer structure 100 is only used for water and oxygen barrier and surface planarization, and does not participate in the optical design. Because different wavelengths of light behave differently in the microcavity, as the viewing angle increases, the peak wavelength of short-wavelength light, such as blue light, undergoes a more significant shift, resulting in much more severe brightness attenuation and color shift in the blue sub-pixel than in long-wavelength light, such as red light. The existing identical encapsulation layer structure 100 cannot differentiate the viewing angle dependence of different sub-pixels, making it difficult to maintain good color consistency and brightness uniformity across the entire viewing angle range.

[0043] To address the aforementioned technical problems, this application provides a display panel and a display device including the display panel. The following description, in conjunction with the accompanying drawings, illustrates this. Figure 2-7 The embodiments of this application will be described in further detail.

[0044] One embodiment of this application provides a display panel, which includes, but is not limited to, a silicon-based microdisplay. This display panel can be applied to electronic paper, mobile phones, tablets, televisions, monitors, laptops, digital photo frames, smart bracelets, smartwatches, supercomputers, navigators, wireless devices, personal digital assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, clocks, calculators, television monitors, computer monitors, automotive displays (e.g., odometer displays), cockpit controllers and / or displays, camera view displays (e.g., displays of rearview cameras in vehicles), electronic billboards or signs, projectors, and other mobile or fixed terminals.

[0045] See Figures 2 to 5 As shown, the display panel of this application includes a substrate 1, a plurality of light-emitting devices, and a plurality of encapsulation portions. The plurality of light-emitting devices are spaced apart on one side of the substrate 1, and the plurality of encapsulation portions are spaced apart on one side of the substrate 1. Specifically, the encapsulation portions are located on the side of the corresponding light-emitting device facing away from the substrate 1, and the plurality of encapsulation portions are correspondingly arranged with the plurality of light-emitting devices.

[0046] In this application embodiment, the correspondence between A and B can refer to: one A corresponding to at least one B, or one B corresponding to at least one A. This application embodiment only uses the example of one A corresponding to one B for illustration. For example, the correspondence between a light-emitting device and a packaging part can refer to: one light-emitting device corresponding to at least one packaging part, or one packaging part corresponding to at least one light-emitting device.

[0047] Specifically, the multiple light-emitting devices include a first light-emitting device 2 and a second light-emitting device 3 that emit light with different wavelengths, and the multiple packaging parts include a first packaging part 5 and a second packaging part 6. The first packaging part 5 is correspondingly arranged with the first light-emitting device 2, and the second packaging part 6 is correspondingly arranged with the second light-emitting device 3. The optical thickness of the first packaging part 5 is different from that of the second packaging part 6.

[0048] The difference in wavelength between the light emitted by the first light-emitting device 2 and the second light-emitting device 3 is specifically manifested in the different colors of the emitted light.

[0049] Within the fields of thin-film optics and interferometric optics, optical thickness is defined as the equivalent geometric path length of light propagating in a medium. It is determined by the product of the physical thickness of the medium layer and the refractive index of the medium material, and is measured in units of length, such as nanometers. Optical thickness determines the amount of phase change accumulated during light wave propagation; when the optical thickness changes, the phase of the outgoing light also changes accordingly. Unlike the dimensionless optical thickness used in radiative transmission to describe light intensity attenuation, the optical thickness discussed in this application is a concept within thin-film interferometric optics, and its value directly affects the interference conditions and the directionality of the outgoing light.

[0050] The display panel shown in this application adopts the above-mentioned structural design. By making the optical thickness of the encapsulation part corresponding to the first light-emitting device 2 and the second light-emitting device 3 with different wavelengths different, the differential design of the optical thickness of the encapsulation part can be used to actively compensate for the different degrees of optical path change and microcavity drift caused by different wavelengths of light when the viewing angle increases. This is beneficial to improve the viewing angle color deviation and brightness attenuation problem in the entire viewing angle range without significantly increasing the process complexity.

[0051] For example, the wavelength of the light emitted by the first light-emitting device 2 is shorter than the wavelength of the light emitted by the second light-emitting device 3, and the optical thickness of the first encapsulation portion 5 is greater than the optical thickness of the second encapsulation portion 6. Since the shorter the wavelength of light, the stronger its microcavity effect is generally, the more easily the light undergoes color changes and brightness attenuation when the viewing angle increases. Therefore, making the optical thickness of the encapsulation portion corresponding to the shorter-wavelength first light-emitting device 2 larger is beneficial to improving the viewing angle compensation intensity of the light emitted by the first light-emitting device 2, thereby helping to improve the viewing angle distortion and brightness attenuation problems across the entire viewing angle range.

[0052] In an exemplary embodiment, the first light-emitting device 2 may specifically be a light-emitting device for emitting blue light, and the second light-emitting device 3 may specifically be a light-emitting device for emitting green light. The wavelength of blue light is approximately 450-480 nm, and the wavelength of green light is approximately 520-560 nm. Since the wavelength of blue light is significantly shorter than that of green light, blue light exhibits a stronger microcavity effect and viewing angle dependence compared to green light.

[0053] In some other embodiments, the plurality of light-emitting devices also include a third light-emitting device 4. The wavelengths of the light emitted by the first light-emitting device 2, the second light-emitting device 3, and the third light-emitting device 4 are different. Correspondingly, the plurality of packaging portions also include a third packaging portion 7 disposed corresponding to the third light-emitting device 4. The optical thicknesses of the first packaging portion 5, the second packaging portion 6, and the third packaging portion 7 are different.

[0054] In this design, the wavelength of light emitted by the third light-emitting device 4 is greater than that of light emitted by the second light-emitting device 3, and the optical thickness of the third encapsulation portion 7 is less than or equal to the optical thickness of the second encapsulation portion 6. Therefore, the optical thicknesses of the encapsulation portions of the three light-emitting devices are arranged in reverse order of wavelength, with shorter wavelength light-emitting devices corresponding to larger encapsulation portion optical thicknesses. This thickness relationship allows for greater phase adjustment of short-wavelength light, thus better compensating for microcavity effect drift as the viewing angle increases.

[0055] In an exemplary embodiment, the third light-emitting device 4 may specifically be a light-emitting device for emitting red light. The wavelength of red light is approximately 620-750 nm. The wavelength of red light is significantly longer than that of green light. Therefore, the microcavity effect and viewing angle dependence of blue light, green light and red light gradually decrease.

[0056] In summary, in the display panel shown in this application, by adjusting the physical thickness and / or refractive index of the encapsulation layer above different color light-emitting devices, the encapsulation layer of different light-emitting devices has different optical thicknesses. This differentiated optical thickness can change the phase delay of light waves passing through the encapsulation layer, thereby compensating for color shift and brightness attenuation caused by the microcavity effect at different viewing angles.

[0057] Specifically, shorter wavelength light (such as blue light) corresponds to a larger optical thickness of the package to more significantly adjust its phase and offset the drift of the microcavity resonance condition when the viewing angle increases; longer wavelength light (such as red light) corresponds to a smaller optical thickness of the package, thereby improving color consistency and brightness uniformity across the entire viewing angle range.

[0058] Continue reading Figures 2 to 5 As shown, to achieve differentiation in the optical thickness of the packaging section, an optical compensation layer is provided in the packaging section. At least one packaging section includes an optical compensation layer, which is used to increase the optical thickness of the light emitted by the corresponding light-emitting device when it passes through the optical compensation layer.

[0059] In this embodiment, the optical compensation layer can be made of silicon oxynitride (SiON). During the deposition of silicon oxynitride, its refractive index can be changed within a continuous range by adjusting the gas ratio in the deposition process. Specifically, the refractive index of silicon oxynitride can be as low as about 1.45, similar to silicon dioxide, and as high as about 2.00, similar to silicon nitride, which provides great flexibility for optical design.

[0060] In a specific deposition scheme, inductively coupled plasma-enhanced chemical vapor deposition (ICP-CVD) is used for SiON deposition. The process gases are silane, nitrogen, and nitrous oxide. The oxygen content in the film is adjusted by changing the nitrous oxide flow rate. A lower nitrous oxide flow rate results in a higher nitrogen content and a higher refractive index, while a higher flow rate results in a higher oxygen content and a lower refractive index. Based on this process, the refractive index of silicon oxynitride can be continuously varied while the deposition rate remains essentially constant.

[0061] Understandably, depending on the actual process requirements, there are multiple options for configuring the thickness of the optical compensation layer among multiple light-emitting devices.

[0062] For details, please refer to [link / reference]. Figure 2 As shown, in an exemplary embodiment, the first encapsulation portion 5 includes an optical compensation layer 51, and the compensation layers in the second encapsulation portion 6 and the third encapsulation portion 7 have a dimension of 0 along the thickness direction of the substrate 1. In other words, the optical compensation layer is only provided above the light-emitting device with the shortest wavelength, such as the first light-emitting device 2, and no optical compensation layer is provided above other light-emitting devices.

[0063] The above configuration can reduce the difficulty of manufacturing and material costs. At the same time, blue light has the greatest potential to benefit from viewing angle compensation. Therefore, even if only blue light is compensated, the viewing angle bias problem can be improved overall.

[0064] Combination Figure 3 and Figure 4 As shown, in another exemplary embodiment, each encapsulation unit includes an optical compensation layer. For ease of description, the optical compensation layer of the first encapsulation unit 5 is defined as the first optical compensation layer 51, the optical compensation layer of the second encapsulation unit 6 is defined as the second optical compensation layer 61, and the optical compensation layer of the third encapsulation unit 7 is defined as the third optical compensation layer 71.

[0065] For details, please refer to [link / reference]. Figure 3 As shown, the physical thickness of the first optical compensation layer 51 is greater than the physical thickness of the second optical compensation layer 61, and the physical thickness of the second optical compensation layer 61 is equal to the physical thickness of the third optical compensation layer 71; see reference. Figure 4 As shown, the physical thickness of the first optical compensation layer 51 is greater than the physical thickness of the second optical compensation layer 61, and the physical thickness of the second optical compensation layer 61 is greater than the physical thickness of the third optical compensation layer 71. In this embodiment, the physical thickness specifically refers to the dimension of the optical compensation layer along the thickness direction of the substrate 1.

[0066] Furthermore, in some other embodiments, the optical compensation layers above different light-emitting devices may have different refractive indices, that is, the refractive index of the first optical compensation layer 51 is greater than the refractive index of the second optical compensation layer 61, and the refractive index of the second optical compensation layer 61 is greater than or equal to the refractive index of the third optical compensation layer 71.

[0067] See Figure 5 As shown, in an exemplary embodiment, the first optical compensation layer 51, the second optical compensation layer 61, and the third optical compensation layer 71 have the same physical thickness, but their refractive indices decrease sequentially. In the above embodiment, by adjusting at least one parameter among the physical thickness and refractive index of the optical compensation layers, this application can more flexibly achieve precise control over the optical thickness of the encapsulation portion, so that the first encapsulation portion 5 above the first light-emitting device 3 obtains the maximum optical thickness.

[0068] See Figures 2 to 5 As shown, in addition to the optical compensation layer, each encapsulation unit also includes a barrier layer. In the encapsulation unit with the optical compensation layer, the barrier layer is disposed on the side of the optical compensation layer away from the light-emitting device, and is used to block the penetration of external moisture and oxygen, thereby protecting the organic light-emitting material that is extremely sensitive to water and oxygen, and ensuring the long lifespan of the OLED device. In the stacked structure of the encapsulation layers, after the barrier layer meets the water and oxygen barrier requirements, its upper surface also plays a planarization role. To make the surface of the display panel flat, the distance between the surfaces of the first encapsulation unit 5, the second encapsulation unit 6, and the third encapsulation unit 7 away from the substrate 1 and the substrate 1 is equal.

[0069] In one exemplary embodiment, the barrier layer is primarily composed of silicon nitride (SiN) material, which, due to its dense thin-film structure, can very effectively block the penetration of external moisture and oxygen.

[0070] It is understandable that, due to the differences in the thickness of the optical compensation layer above different light-emitting devices, if a barrier layer of uniform thickness is deposited directly on these structures with different step heights, the final surface will exhibit a step distribution corresponding to the thickness of the underlying optical compensation layer. However, in actual processes, the deposition thickness of the barrier layer can be adjusted as needed, allowing for differences in the thickness of the barrier layer above different light-emitting devices while ensuring water and oxygen barrier performance.

[0071] In this embodiment of the application, for ease of description, the barrier layer of the first encapsulation part 5 is defined as the first barrier layer 52, the barrier layer of the second encapsulation part 6 is defined as the second barrier layer 62, and the barrier layer of the third encapsulation part 7 is defined as the third barrier layer 72.

[0072] See Figure 2 and Figure 3As shown, in an exemplary embodiment, the physical thickness of the first barrier layer 52 is less than the physical thickness of the second barrier layer 62, and the physical thickness of the second barrier layer 62 is equal to the physical thickness of the third barrier layer 72. See also... Figure 4 As shown, the physical thickness of the first barrier layer 52 is less than the physical thickness of the second barrier layer 62, and the physical thickness of the second barrier layer 62 is less than the physical thickness of the third barrier layer 72. (See reference...) Figure 5 As shown, the physical thicknesses of the first barrier layer 52, the second barrier layer 62, and the third barrier layer 72 are the same, in order to simplify the preparation process of the barrier layers.

[0073] In the above embodiments, the physical thickness specifically refers to the dimension of the barrier layer along the thickness direction of the substrate 1. By reversing the physical thickness of each barrier layer, the thickness difference of the lower optical compensation layer is compensated, thereby making the upper surface (the surface facing away from the substrate 1) of each package part basically flat.

[0074] Combination Figures 2 to 7 As shown, in some embodiments, each encapsulation unit includes a buffer layer. In an encapsulation unit with an optical compensation layer, the buffer layer is disposed between the optical compensation layer and the light-emitting device; in an encapsulation unit without an optical compensation layer, the buffer layer is directly disposed between the light-emitting device and the corresponding barrier layer. In an exemplary embodiment, the buffer layer is made of alumina (Al2O3) material, including but not limited to materials prepared using an original conductive electron layer deposition process.

[0075] The buffer layer plays two main roles: first, by utilizing the extremely low ion damage characteristics of alumina, it protects the underlying organic light-emitting layer from damage caused by plasma bombardment during subsequent deposition processes; second, it serves as a stress-regulating layer in the multilayer encapsulation stack, improving the adhesion between films.

[0076] In some embodiments, the physical thickness of the buffer layer is set to be less than that of the optical compensation layer. This is because the deposition rate of the original conductive electronic layer is slow and the cost is high. In actual mass production, it is necessary to control the physical thickness of the alumina buffer layer to avoid excessive cost increases.

[0077] In this embodiment of the application, for ease of description, the buffer layer of the first encapsulation part 5 is defined as the first buffer layer 53, the buffer layer of the second encapsulation part 6 is defined as the second buffer layer 63, and the buffer layer of the third encapsulation part 7 is defined as the third buffer layer 73.

[0078] The first buffer layer 53, the second buffer layer 63, and the third buffer layer 73 have the same physical thickness. Here, the physical thickness specifically refers to the dimension of the buffer layer along the thickness direction of the substrate 1.

[0079] For details, please refer to [link / reference]. Figure 4As shown, in some embodiments, the display panel further includes a first full-surface encapsulation layer 11, which includes multiple encapsulation sub-layers. These sub-layers include a first encapsulation sub-layer 111 corresponding to the first encapsulation portion 5, a second encapsulation sub-layer 112 corresponding to the second encapsulation portion 6, and a third encapsulation sub-layer 113 corresponding to the third encapsulation portion 7. The encapsulation sub-layers are disposed on the side of the corresponding encapsulation portion away from the light-emitting device, thereby protecting the defined area of ​​each light-emitting device.

[0080] Continue reading Figure 4 As shown, in some embodiments, the display panel further includes a pixel definition layer 8, which is disposed on one side of the substrate 1 and has a plurality of pixel openings. The plurality of pixel openings are correspondingly disposed with a plurality of light-emitting devices, and at least a portion of the light-emitting devices are located within the corresponding pixel openings.

[0081] Combination Figures 2 to 6 As shown, each light-emitting device includes a first electrode layer 21, an organic light-emitting layer, and a second electrode layer 23, which are sequentially stacked from the side closest to the substrate 1 to the side furthest from the substrate 1. In this application, only the first electrode layer 21, the first light-emitting material layer 22, and the second electrode layer 23 corresponding to the first light-emitting device 2 are used as examples.

[0082] In this embodiment, one of the first electrode layer 21 and the second electrode layer 23 can be an anode, and the other can be a cathode. This embodiment is described using the example of the first electrode layer 21 being the anode and the second electrode layer 23 being the cathode. The first electrode layer 21 can be electrically connected to a pixel driving circuit, which is electrically connected to a first power line. The second electrode layer 23 can be electrically connected to a second power line.

[0083] The organic light-emitting layers of the three light-emitting devices emit different colors. Specifically, the organic light-emitting layer of the first light-emitting device 2 emits blue light, the organic light-emitting layer of the second light-emitting device 3 emits green light, and the organic light-emitting layer of the third light-emitting device 4 emits red light.

[0084] In some other embodiments, the display panel further includes a first conductive layer 9 and a second conductive layer 10, which are in contact with each other to achieve electrical connection. Specifically, both the first conductive layer 9 and the second conductive layer 10 can be made of indium zinc oxide to ensure their conductivity and transparency.

[0085] In this embodiment, the first conductive layer 9 includes multiple conductive sublayers (not shown), which are correspondingly disposed with multiple light-emitting devices. The multiple conductive sublayers include a first conductive sublayer corresponding to the first light-emitting device 2, a second conductive sublayer corresponding to the second light-emitting device 3, and a third conductive sublayer corresponding to the third light-emitting device 4.

[0086] Specifically, a first conductive electron layer is disposed on the side of the corresponding second electrode layer 23 away from the first light-emitting material layer 22 and in contact with the second electrode layer 23; a second conductive electron layer is disposed on the side of the corresponding second electrode layer 23 away from the second light-emitting material layer and in contact with the second electrode layer 23; and a third conductive electron layer is disposed on the side of the corresponding second electrode layer 23 away from the third light-emitting material layer and in contact with the second electrode layer 23, thereby ensuring the electron injection efficiency and transmittance of each light-emitting device to optimize the microcavity effect.

[0087] In this embodiment, the second conductive layer 10 is a full-surface film layer, and the second conductive layer 10 is disposed on the side of the first full-surface encapsulation layer 11, each light-emitting device, and the pixel definition layer 8 that is away from the substrate 1. That is, the projection of the second conductive layer 10 on the substrate 1 completely covers the projections of the first full-surface encapsulation layer 11, each light-emitting device, and the pixel definition layer 8 on the substrate 1.

[0088] Specifically, for a single light-emitting device, the encapsulation portion only covers a part of the second electrode layer 23, while the remaining area of ​​the second electrode layer 23 is exposed outside the encapsulation portion. The second conductive layer 10 forms direct physical and electrical contact with the portion of the second electrode layer 23 exposed outside the encapsulation portion in each light-emitting device, thereby electrically connecting the second electrode layers 23 of all light-emitting devices into a single unit, forming a common cathode electrode.

[0089] In the above embodiments, as a common cathode bus, the second conductive layer 10 can reduce the overall resistance of the cathode circuit, effectively suppress the uneven display brightness caused by the resistance voltage drop, and at the same time provide a flat covering base for other encapsulation layer structures deposited subsequently.

[0090] Continue reading Figures 2 to 5 As shown, in some embodiments, the display panel further includes a second full-surface encapsulation layer 12, which is disposed on the side of the second conductive layer 10 facing away from the substrate 1 and covers the entire display area. The main function of the second full-surface encapsulation layer 12 is to provide final water and oxygen barrier protection, ensuring the reliability of the OLED device during long-term use.

[0091] Specifically, the second full-surface encapsulation layer 12 can adopt a stacked structure similar to the first full-surface encapsulation layer 11, for example, including at least one inorganic barrier layer and one organic planarization layer. The inorganic barrier layer can be formed from silicon nitride or silicon oxynitride through plasma-enhanced chemical vapor deposition to block water and oxygen penetration; the organic planarization layer can be formed from acrylate monomers through inkjet printing or coating followed by UV curing to cover particle defects on the surface of the inorganic layer and release stress. To simplify the process and reduce costs, the second full-surface encapsulation layer 12 can also consist of only one dense silicon nitride film.

[0092] After the deposition of the second full-surface encapsulation layer 12 is completed, the encapsulation process of the display panel is basically completed, and subsequent processes such as cutting, bonding, and module assembly can be carried out.

[0093] Combination Figures 2 to 7 As shown, in some embodiments, this application also provides a display device, which includes a display panel as shown in any of the foregoing embodiments. The display device can be an electronic paper device, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, smart bracelet, smartwatch, supercomputer, navigator, wireless device, personal digital assistant (PDA), handheld or portable computer, GPS receiver / navigator, camera, MP4 video player, camcorder, game console, clock, calculator, television monitor, computer monitor, automotive display (e.g., odometer display), cockpit controller and / or display, camera view display (e.g., display of a rearview camera in a vehicle), electronic billboard or sign, projector, and other mobile or fixed terminals.

[0094] Since near-eye display devices have extremely high requirements for viewing angle characteristics and color consistency, the display panel using the technical solution of this application can significantly improve the color shift and brightness attenuation problems under large viewing angles, and enhance the user's immersive visual experience.

[0095] In summary, this application, through differentiated design of the structure of each packaging section, especially by configuring optical compensation layers of different optical thicknesses above light-emitting devices of different colors, combined with the synergistic effect of buffer and barrier layers, effectively improves the color shift and brightness attenuation problems of silicon-based microdisplays at different viewing angles without significantly increasing process complexity and cost. It enhances the color consistency and brightness uniformity of the display panel and the display device using the display panel across the entire viewing angle range.

[0096] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: substrate; Multiple light-emitting devices are spaced apart on one side of the substrate; the multiple light-emitting devices include a first light-emitting device and a second light-emitting device that emit light with different wavelengths; and Multiple encapsulation portions are spaced apart on one side of the substrate; the multiple encapsulation portions are correspondingly disposed with the multiple light-emitting devices, and the encapsulation portion is located on the side of the corresponding light-emitting device away from the substrate; the multiple encapsulation portions include a first encapsulation portion and a second encapsulation portion, the first encapsulation portion is correspondingly disposed with the first light-emitting device, the second encapsulation portion is correspondingly disposed with the second light-emitting device, and the optical thickness of the first encapsulation portion and the optical thickness of the second encapsulation portion are different.

2. The display panel according to claim 1, characterized in that, The wavelength of the light emitted by the first light-emitting device is shorter than the wavelength of the light emitted by the second light-emitting device, and the optical thickness of the first package is greater than the optical thickness of the second package.

3. The display panel according to claim 1 or 2, characterized in that, The plurality of light-emitting devices further includes a third light-emitting device, wherein the light emitted by the first light-emitting device, the second light-emitting device, and the third light-emitting device are all of different wavelengths, and the plurality of encapsulation portions further includes a third encapsulation portion corresponding to the third light-emitting device; Wherein, the wavelength of the light emitted by the third light-emitting device is greater than the wavelength of the light emitted by the second light-emitting device; and the optical thickness of the third encapsulation part is less than or equal to the optical thickness of the second encapsulation part.

4. The display panel according to claim 3, characterized in that, At least one of the encapsulation portions includes an optical compensation layer for increasing the optical thickness of the light emitted by the corresponding light-emitting device.

5. The display panel according to claim 4, characterized in that, The first packaging portion includes an optical compensation layer, and the optical compensation layer in the second packaging portion and the third packaging portion has a dimension of 0 along the thickness direction of the substrate.

6. The display panel according to claim 4, characterized in that, Each of the aforementioned packaging portions includes an optical compensation layer; the dimension of the optical compensation layer of the first packaging portion along the thickness direction of the substrate is larger than the dimension of the optical compensation layer of the second packaging portion along the thickness direction of the substrate.

7. The display panel according to claim 6, characterized in that, The dimension of the optical compensation layer of the second package portion along the thickness direction of the substrate is greater than or equal to the dimension of the optical compensation layer of the third package portion along the thickness direction of the substrate.

8. The display panel according to claim 4, characterized in that, The refractive index of the optical compensation layer in the first package is greater than the refractive index of the optical compensation layer in the second package.

9. The display panel according to claim 8, characterized in that, The refractive index of the optical compensation layer of the second packaging part is greater than or equal to the refractive index of the optical compensation layer of the third packaging part.

10. The display panel according to any one of claims 4-9, characterized in that, Each of the encapsulation portions includes a barrier layer; in the encapsulation portion provided with the optical compensation layer, the barrier layer is disposed on the side of the optical compensation layer opposite to the light-emitting device; The distance between the surfaces of the first encapsulation portion, the second encapsulation portion, and the third encapsulation portion opposite to the substrate and the substrate is equal.

11. The display panel according to claim 10, characterized in that, The dimension of the barrier layer of the first package portion along the thickness direction of the substrate is smaller than the dimension of the barrier layer of the second package portion along the thickness direction of the substrate.

12. The display panel according to claim 11, characterized in that, The dimension of the barrier layer of the second encapsulation portion along the thickness direction of the substrate is less than or equal to the dimension of the barrier layer of the third encapsulation portion along the thickness direction of the substrate.

13. The display panel according to any one of claims 4-9, characterized in that, The refractive index of the optical compensation layer is in the range of 1.45-2.

00.

14. The display panel according to any one of claims 4-9, characterized in that, Each of the encapsulation portions includes a buffer layer; in the encapsulation portion provided with the optical compensation layer, the buffer layer is disposed between the optical compensation layer and the light-emitting device.

15. The display panel according to claim 14, characterized in that, The dimension of the buffer layer along the thickness direction of the substrate is smaller than the dimension of the optical compensation layer along the thickness direction of the substrate.

16. A display device, characterized in that, The display device includes a display panel as described in any one of claims 1-15.

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