Manufacturing method, device, equipment, medium and product of display panel

Abstract

This application discloses a method, apparatus, equipment, medium, and product for manufacturing a display panel. The manufacturing method may include: obtaining the first film thickness of the first common functional layer for each light-emitting element after the first common functional layer has been deposited; determining the second film thickness of the second common functional layer for each light-emitting element based on a preset microcavity thickness and the first film thickness of the first common functional layer; adjusting the evaporation parameters for depositing the second common functional layer based on the second film thickness, and depositing the second common functional layer for each light-emitting element based on the evaporation parameters, so that the film thickness of the second common functional layer reaches the second film thickness. By adjusting the evaporation parameters in a timely manner based on the thickness of the first common film layer during the film deposition process, so that the thickness of the second common film layer reaches the second film thickness, the product yield of the display panel can be improved.

Description

Technical Field

[0001] This application belongs to the field of computer technology, and in particular relates to a method, apparatus, equipment, medium and product for manufacturing a display panel. Background Technology

[0002] Organic light-emitting diode (OLED) and flat panel display devices based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide application range, becoming the mainstream display device. However, the display performance of current OLED display products needs to be improved. Summary of the Invention

[0003] This application provides a method, apparatus, device, medium, and product for manufacturing a display panel, which can improve the product yield of the display panel.

[0004] In a first aspect, embodiments of this application provide a method for manufacturing a display panel, applicable to a display panel comprising multiple light-emitting elements, each light-emitting element comprising a first common functional layer and a second common functional layer, the first common functional layer being used to transmit a first type of charge carrier, and the second common functional layer being used to transmit a second type of charge carrier. The manufacturing method includes:

[0005] After the first common functional layer is deposited, the first film thickness of the first common functional layer of each light-emitting element is obtained.

[0006] Based on the preset microcavity thickness and the first film thickness of the first common functional layer, the second film thickness of the second common functional layer of each light-emitting element is determined.

[0007] The evaporation parameters for the second common functional layer are adjusted based on the thickness of the second film layer, and the second common functional layer for each light-emitting element is evaporated based on the evaporation parameters, so that the film thickness of the second common functional layer reaches the thickness of the second film layer.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the second film thickness of the second common functional layer of each light-emitting element is determined based on a preset microcavity thickness and the first film thickness of the first common function, including:

[0009] Based on the target type of the target light-emitting element, the thickness of the target microcavity is determined. The target light-emitting element can be any one of multiple light-emitting elements.

[0010] Based on the target microcavity thickness and the first film thickness, the second film thickness of the second common functional layer of the target light-emitting element corresponding to the first film thickness is determined.

[0011] According to any of the foregoing embodiments of the first aspect of this application, obtaining the first film thickness of the first common functional layer includes:

[0012] During the process of vapor deposition of the first common functional layer, the first vapor deposition rate and vapor deposition time of the first common functional layer are obtained;

[0013] The thickness of the first film layer is determined based on the first evaporation rate and evaporation time.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the thickness of the first film layer is determined based on the first evaporation rate and evaporation time, satisfying the following conditions:

[0015]

[0016] Where d1 is the thickness of the first film layer, t1 is the start time of the evaporation of the first common functional layer, and t n v(t) represents the end time of vapor deposition of the first common functional layer and v(t) represents the first vapor deposition rate.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the first evaporation rate includes a plurality of sub-evaporation rates, the evaporation time includes the evaporation time of each sub-evaporation rate, and determining the first film thickness based on the first evaporation rate and the evaporation time includes:

[0018] The thickness of the sub-film layer within each sub-evaporation rate and the evaporation time at each sub-evaporation rate is determined.

[0019] The thickness of the first film layer is determined based on the thicknesses of multiple sub-film layers.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the vapor deposition parameters include a second vapor deposition rate for vapor deposition of the second common functional layer;

[0021] According to any of the foregoing embodiments of the first aspect of this application, the first common functional layer includes a hole transport layer, and the second common functional layer includes an electron transport layer.

[0022] Secondly, embodiments of this application provide a display panel manufacturing apparatus, applied to a display panel, the display panel including a plurality of light-emitting elements, each light-emitting element including a first common functional layer and a second common functional layer, the first common functional layer being used to transmit a first type of charge carrier, and the second common functional layer being used to transmit a second type of charge carrier, the manufacturing apparatus including:

[0023] The acquisition module is used to acquire the first film thickness of the first common functional layer of each light-emitting element after the first common functional layer has been deposited.

[0024] The determination module is used to determine the second film thickness of the second common functional layer of each light-emitting element based on the preset microcavity thickness and the first film thickness of the first common functional layer;

[0025] The vapor deposition module is used to adjust the vapor deposition parameters of the second common functional layer based on the second film thickness, and to vapor deposit the second common functional layer of each light-emitting element based on the vapor deposition parameters, so that the film thickness of the second common functional layer reaches the second film thickness.

[0026] According to any of the foregoing embodiments of the second aspect of this application, the determining module can specifically be used for:

[0027] Based on the target type of the target light-emitting element, the thickness of the target microcavity is determined. The target light-emitting element can be any one of multiple light-emitting elements.

[0028] Based on the target microcavity thickness and the first film thickness, the second film thickness of the second common functional layer of the target light-emitting element corresponding to the first film thickness is determined.

[0029] According to any of the foregoing embodiments of the second aspect of this application, the acquisition module may specifically be used for:

[0030] During the process of vapor deposition of the first common functional layer, the first vapor deposition rate and vapor deposition time of the first common functional layer are obtained;

[0031] The thickness of the first film layer is determined based on the first evaporation rate and evaporation time.

[0032] According to any of the foregoing embodiments of the second aspect of this application, the thickness of the first film layer is determined based on the first evaporation rate and evaporation time, satisfying the following conditions:

[0033]

[0034] Where d1 is the thickness of the first film layer, t1 is the start time of the evaporation of the first common functional layer, and t n v(t) represents the end time of vapor deposition of the first common functional layer and v(t) represents the first vapor deposition rate.

[0035] According to any of the foregoing embodiments of the second aspect of this application, the first evaporation rate includes multiple sub-evaporation rates, the evaporation time includes the evaporation time of each sub-evaporation rate, and the determining module can specifically be used for:

[0036] The thickness of the sub-film layer within each sub-evaporation rate and the evaporation time at each sub-evaporation rate is determined.

[0037] The thickness of the first film layer is determined based on the thicknesses of multiple sub-film layers.

[0038] According to any of the foregoing embodiments of the second aspect of this application, the vapor deposition parameters include a second vapor deposition rate for vapor deposition of the second common functional layer.

[0039] According to any of the foregoing embodiments of the second aspect of this application, the first common functional layer includes a hole transport layer, and the second common functional layer includes an electron transport layer.

[0040] Thirdly, embodiments of this application provide an electronic device, the device comprising:

[0041] Processor and memory storing computer program instructions;

[0042] The method for manufacturing the display panel described in the first aspect above is used by the processor to execute computer program instructions.

[0043] Fourthly, embodiments of this application provide a computer storage medium storing computer program instructions, which, when executed by a processor, implement the method for manufacturing the display panel described in the first aspect.

[0044] Fifthly, embodiments of this application provide a computer program product, including a computer program that, when processed by a processor, implements the method for manufacturing a display panel as described in the first aspect.

[0045] The display panel manufacturing method, apparatus, equipment, medium, and product provided in this application embodiment obtain the thickness of a first common functional layer of the first common functional layer of the light-emitting element after the first common functional layer is deposited. Based on the first film layer thickness and the preset microcavity thickness, the thickness of a second film layer of the second common functional layer is determined, thereby adjusting the evaporation parameters in a timely manner. This enables timely adjustment of the evaporation parameters during the film layer evaporation process, and the second common functional layer is deposited based on the evaporation parameters, so that the thickness of the second common functional layer of each light-emitting element reaches the second film layer thickness, thereby improving the product yield of the display panel. Attached Figure Description

[0046] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0047] Figure 1 This is a schematic diagram of the structure of a light-emitting element provided in some embodiments of this application.

[0048] Figure 2This is a flowchart illustrating a method for manufacturing a display panel according to some embodiments of this application.

[0049] Figure 3 This is a flowchart illustrating another method for manufacturing a display panel, provided in some embodiments of this application.

[0050] Figure 4 This is a flowchart illustrating another method for manufacturing a display panel, provided in some embodiments of this application.

[0051] Figure 5 This is a schematic diagram of the structure of a vapor deposition machine provided in some embodiments of this application.

[0052] Figure 6 This is a schematic diagram of an apparatus for manufacturing a display panel according to some embodiments of this application.

[0053] Figure 7 This is a schematic diagram of the hardware structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0054] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0055] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0056] Before describing the technical solutions provided in the embodiments of this application, in order to facilitate understanding of the embodiments of this application, this application first specifically explains the problems existing in the related technologies:

[0057] In display panel manufacturing technology, microcavities for light-emitting elements are often created to control the light field, optimize charge carriers, and manage the spectrum. For example... Figure 1 As shown, Figure 1 This is a schematic diagram of an exemplary light-emitting element. The light-emitting element may include a stacked anode 101, a hole injection layer (HIL) 102, a hole transport layer (HTL) 103, a light-emitting layer (EML) 104, an electron transport layer (ETL) 105, an electron injection layer (EIL) 106, and a cathode 107. The hole injection layer 102, hole transport layer 103, light-emitting layer 104, electron transport layer 105, and electron injection layer 106 together constitute a microcavity film structure.

[0058] The light-emitting process of the aforementioned light-emitting element mainly includes: the electron injection layer 106 injects electrons generated by the cathode 107 into the electron transport layer 105, and the electron transport layer 105 transports the electrons to the light-emitting layer 104; the hole injection layer 102 injects holes generated by the anode 101 into the hole transport layer 103, and the hole transport layer 103 transports the holes to the light-emitting layer 104; in the light-emitting layer 104, electrons and holes meet and generate a recombination effect; during the recombination process, excitons are generated, and the excitons move in the electric field... Under the influence of the light-emitting layer 104, electrons migrate and transfer energy to the light-emitting material. After absorbing energy, electrons doped in the light-emitting material transition from the ground state to the excited state, and then from the excited state back to the ground state. When transitioning from the excited state back to the ground state, they release energy and generate photons, causing the light-emitting element to emit fluorescence or phosphorescence. As can be seen from the above, the microcavity plays an important role in the light emission of the light-emitting device, and the thickness of the microcavity needs to meet the resonance condition to achieve normal light emission of the light-emitting element. Therefore, monitoring the evaporation thickness of different film layers is particularly important.

[0059] However, in the existing technology, the thickness of each film layer can only be known after all film layers have been deposited. Due to the lag in detection, the film thickness may not meet expectations, resulting in a low yield of display panels.

[0060] Based on this, embodiments of this application provide a method, apparatus, device, medium, and product for manufacturing a display panel, which can solve the above-mentioned problems.

[0061] like Figure 2 As shown, this application provides a method for manufacturing a display panel, applied to a real-world panel. The display panel includes multiple light-emitting elements, each of which includes a first common functional layer and a second common functional layer. The first common functional layer is used to transmit a first type of charge carrier, and the second common functional layer is used to transmit a second type of charge carrier. The manufacturing method includes the following steps S210-S230:

[0062] S210: After the first common functional layer has been deposited, obtain the first film thickness of the first common functional layer for each light-emitting element.

[0063] Here, the first common functional layer and the second common functional layer mentioned above are common layers for each light-emitting device. The first common functional layer can transport a first type of charge carrier, such as holes, and the second common functional layer can transport a second type of charge carrier, such as electrons. It is conceivable that the first common functional layer is closer to the substrate than the second common functional layer.

[0064] Once the first common functional layer has been deposited, the first film thickness of the first common functional layer for each light-emitting element can be obtained. Here, the first film thickness can be determined based on the deposition rate and deposition time during the deposition of the first common functional layer.

[0065] S220: Based on the preset microcavity thickness and the first film thickness of the first common functional layer, determine the second film thickness of the second common functional layer of each light-emitting element.

[0066] Here, the aforementioned microcavity thickness can be a preset microcavity thickness set by an individual. For example, after determining the microcavity thickness, the preset thickness of the film layer included in the microcavity thickness can be determined. For example, the first preset thickness of the first common functional layer and the second preset thickness of the second common functional layer can be determined based on the microcavity thickness. Based on the aforementioned first preset thickness and the first film layer thickness, the evaporation error value of the first common functional group after evaporation is completed can be determined. Based on the aforementioned evaporation error value and the second preset thickness, the second film layer thickness of the aforementioned second common functional layer can be determined.

[0067] In some examples, after determining the preset thickness of the membrane layers included in the microcavity based on the microcavity thickness, the sum of the preset membrane thicknesses of the first common functional layer and the second common functional layer can be determined, and the thickness of the second membrane layer can be determined based on the sum of the preset membrane thicknesses and the thickness of the first membrane layer.

[0068] In some examples, the preset thickness of each film layer included in the microcavity can be determined based on the refractive index of each film layer, the phase shift of light reflection at the cathode and anode surfaces, and the wavelength of the light. Here, the preset thickness of each film layer can be determined based on the following formula (1):

[0069]

[0070] Where, n i Let d be the refractive index of each film layer. i For the thickness of each film layer, Let λ be the phase shift of light reflected at the cathode and anode surfaces, λ be the wavelength of the light, and m be the order of the microcavity, which is a positive integer.

[0071] S230: Adjust the evaporation parameters of the second common functional layer based on the second film thickness, and evaporate the second common functional layer of each light-emitting element based on the evaporation parameters, so that the film thickness of the second common functional layer reaches the second film thickness.

[0072] The deposition parameters of the second common functional layer can be adjusted based on the thickness of the second film layer. For example, the deposition rate or deposition time of the second common functional layer can be adjusted so that the second common functional layer of each light-emitting element reaches the thickness of the second film layer.

[0073] In some examples, when the second common functional layer is deposited based on a evaporation line source, the scanning rate of the evaporation line source can be adjusted to adjust the evaporation parameters.

[0074] This application embodiment obtains the thickness of a film layer of the first common functional layer of the light-emitting element after the first common functional layer is deposited. Based on the first film layer thickness and a preset microcavity thickness, the thickness of a second film layer of the second common functional layer is determined. This achieves compensation for the thickness of the first film layer based on the thickness of the second film layer. During the deposition of the second common functional layer, the deposition parameters are adjusted in a timely manner, and the second common functional layer is deposited based on the deposition parameters, so that the thickness of the second common functional layer of each light-emitting element reaches the thickness of the second film layer. This achieves timely adjustment of the film layer thickness during the film deposition process, avoiding the drawback of the prior art where the film layer thickness can only be known after all film layers have been deposited, and can improve the yield of the display panel.

[0075] It is conceivable that there may be different types of light-emitting devices, such as R light-emitting devices, G light-emitting devices, and B light-emitting devices based on the color of light emitted. The microcavity thickness mentioned above is related to the wavelength of light. Therefore, the microcavity thickness of different types of light-emitting devices may be different. For any light-emitting device, the thickness of the second film layer can be determined based on the type of light-emitting device, the microcavity thickness, and the thickness of the first film layer to improve the display effect of the display panel.

[0076] In some embodiments, such as Figure 3 As shown, step S220 above: determining the second film thickness of the second common functional layer of each light-emitting element based on the preset microcavity thickness and the first film thickness of the first common function, may include the following steps S310-S320:

[0077] S310: Determine the target microcavity thickness based on the target type of the target light-emitting element. The target light-emitting element can be any one of multiple light-emitting elements.

[0078] For any given light-emitting element, the microcavity thickness of the light-emitting element can be determined based on the type of the light-emitting element. The target microcavity thickness can be determined based on the target type of the target light-emitting element. The target type can be any one of R light-emitting device, G light-emitting device, and B light-emitting device. The target microcavity thickness of the target light-emitting element can be determined based on the following formula (2):

[0079] 2nd cosθ=mλ (2)

[0080] Where n can be the average refractive index of each film layer included in the microcavity, θ can be the emission angle of light, λ can be the wavelength of the emitted light, and m is a positive integer.

[0081] S320: Based on the target microcavity thickness and the first film thickness, determine the second film thickness of the second common functional layer of the target light-emitting element corresponding to the first film thickness.

[0082] The thickness of the second film layer can be determined based on the target microcavity thickness and the thickness of the first film layer. For example, the sum of the preset film layer thicknesses of the first common functional layer and the second common functional layer can be determined based on the target microcavity thickness. The thickness of the second film layer can be determined based on the sum of the preset film layer thicknesses and the thickness of the first film layer.

[0083] In this application embodiment, for any target light-emitting element, the target microcavity thickness can be determined based on the type of the light-emitting element, and then the second film thickness can be determined based on the target microcavity thickness and the first film thickness. This allows for separate control of the film thickness during the evaporation process for different types of light-emitting elements, thereby improving the product yield of the display panel and significantly enhancing the display effect of the display panel.

[0084] It is conceivable that, in order to improve the speed of determining the thickness of the first film layer, the evaporation rate and evaporation time can be obtained during the evaporation process of depositing the first common film layer, and the thickness of the first film layer can be quickly determined based on the evaporation rate and evaporation time, thereby improving the efficiency of the display panel manufacturing process.

[0085] In some embodiments, such as Figure 4 As shown, step S210 above: obtaining the first film thickness of the first common functional layer may include the following steps S410-S420:

[0086] S410: During the process of vapor deposition of the first common functional layer, obtain the first vapor deposition rate and vapor deposition time of the first common functional layer.

[0087] During the vapor deposition of the first common functional layer, the first vapor deposition rate and the vapor deposition time can be acquired using a data acquisition device. The data acquisition device can be a data acquisition device installed inside the vapor deposition machine cavity, and the data acquisition device can be a high-temperature laser Doppler velocimeter. It is conceivable that acquiring the vapor deposition rate based on the above-mentioned high-temperature laser Doppler velocimeter can improve the accuracy and timeliness of the acquired vapor deposition rate.

[0088] S420: Determine the thickness of the first film layer based on the first evaporation rate and evaporation time.

[0089] The thickness of the first film layer can be determined based on the integral of the first evaporation rate and evaporation time.

[0090] In some embodiments, determining the first film thickness based on the first evaporation rate and evaporation time can satisfy the following conditions:

[0091]

[0092] Where d1 is the thickness of the first film layer, t1 is the start time of the evaporation of the first common functional layer, and t n v(t) represents the end time of vapor deposition of the first common functional layer and v(t) represents the first vapor deposition rate.

[0093] In some embodiments, when the first common functional layer is deposited based on a deposition line source, the scanning rate of the deposition line source can be adjusted to adjust the deposition parameters.

[0094] In this embodiment, by obtaining the first evaporation rate and evaporation time of the first common functional layer during the evaporation process, and determining the first film thickness based on the first evaporation rate and evaporation time, the timeliness of determining the first film thickness can be improved. This facilitates timely adjustment of evaporation parameters based on the first film thickness so that the thickness of the second common functional layer reaches the second film thickness, thereby improving the product yield of the display panel.

[0095] It is conceivable that the evaporation rate may change. To further improve the accuracy of the determined first film thickness, the first film thickness can be determined based on multiple varying evaporation rates and the evaporation time corresponding to each evaporation rate.

[0096] In some embodiments, the first evaporation rate includes a plurality of sub-evaporation rates, and the evaporation time includes the evaporation time for each sub-evaporation rate. Determining the first film thickness based on the first evaporation rate and the evaporation time includes:

[0097] The thickness of the sub-film layer within each sub-evaporation rate and the evaporation time of each sub-evaporation rate is determined; the thickness of the first film layer is determined based on the thicknesses of multiple sub-film layers.

[0098] Here, based on each sub-evaporation rate and the evaporation time of each sub-evaporation rate, the sub-film thickness within each sub-evaporation time is determined. It can be imagined that after determining multiple sub-film thicknesses, the multiple sub-film thicknesses can be summed to obtain the aforementioned first film thickness.

[0099] The thickness of the first film layer can be determined based on the following formula (4):

[0100]

[0101] Where d1 is the thickness of the first film layer, t1 is the start time of the evaporation of the first common functional layer, and t n The time from v1(t) to v is the end time of the evaporation of the first common functional layer. n (t) represents the multiple sub-evaporation rates.

[0102] The embodiments of this application determine the thickness of multiple sub-film layers based on multiple sub-evaporation rates and the evaporation time of each sub-evaporation rate, and determine the thickness of the first film layer based on the thickness of the multiple sub-film layers. This can accurately determine the thickness of the first film layer when the evaporation rate changes, improving both the efficiency and accuracy of determining the thickness of the first film layer.

[0103] In some embodiments, the vapor deposition parameters include a second vapor deposition rate for depositing the second common functional layer.

[0104] The evaporation parameters can be adjusted by adjusting the second evaporation rate of the second common functional layer. For example, the correspondence between multiple second film thicknesses and evaporation rates can be determined, and the corresponding second evaporation rate can be determined based on the second film thickness. The second common functional layer is then evaporated based on the second evaporation rate so that the thickness of the second common functional layer reaches the thickness of the second film.

[0105] In some examples, if the second common functional layer is deposited based on a evaporation line source, the second evaporation rate of the second common functional layer can be adjusted by changing the scanning rate of the evaporation line source.

[0106] In some examples, the second evaporation rate can be adjusted before the start of the second common film deposition to avoid the evaporation machine crashing that may occur when adjusting the second evaporation rate during the evaporation process.

[0107] This application embodiment improves the product yield of the display panel by setting the evaporation parameters, including the second evaporation rate of the second common functional layer, so that the thickness of the second common functional layer reaches the thickness of the second film layer.

[0108] In some embodiments, the first common functional layer includes a hole transport layer, and the second common functional layer includes an electron transport layer.

[0109] Here, the first common functional layer can be a hole transport layer, and the second common functional layer can be an electron transport layer. After obtaining the first film thickness of the hole transport layer, the second film thickness of the electron transport layer is determined based on the preset microcavity thickness and the first film thickness. The evaporation parameters of the electron transport layer are adjusted based on the second film thickness so that the thickness of the electron transport layer reaches the second film thickness. This makes the actual evaporated microcavity thickness close to the preset microcavity thickness, thereby improving the product yield of the display panel.

[0110] In some embodiments, such as Figure 5 As shown in the figure, this application provides a vapor deposition machine, which may include:

[0111] The host computer 501 is used to obtain the first film thickness of the first common functional layer of each light-emitting element after the first common functional layer has been deposited, determine the second film thickness of the second common functional layer of each light-emitting element based on the preset microcavity thickness and the first film thickness of the first common functional layer, and adjust the evaporation parameters of the second common functional layer based on the second film thickness.

[0112] Evaporation source 502 is used to vapor deposit a second common functional layer for each light-emitting element based on evaporation parameters, so that the film thickness of the second common functional layer reaches the second film thickness.

[0113] In this embodiment, the host computer determines the second film thickness of the second common functional layer of the light-emitting element based on the first film thickness of the first common functional layer, and through the preset microcavity thickness and the first film thickness. The evaporation parameters for the second common functional layer are adjusted based on the second film thickness. This allows for timely adjustment of the evaporation parameters during the film deposition process. Then, the second common functional layer of each light-emitting element is deposited using the evaporation source based on the aforementioned evaporation parameters, ensuring that the film thickness of the second common functional layer reaches the preset film thickness. This makes the microcavity thickness of the display panel obtained by the evaporation machine closer to the preset microcavity thickness, thereby improving the product yield of the display panel.

[0114] In some examples, the host computer can determine the target microcavity thickness based on the target type of the target light-emitting element, and determine the second film thickness based on the target microcavity thickness and the first film thickness, so as to separately adjust the evaporation parameters in the evaporation process for different types of light-emitting elements, thereby improving the product yield of the display panel and significantly improving the display effect of the display panel.

[0115] In some embodiments, such as Figure 5 As shown, the above-mentioned vapor deposition machine also includes a vapor deposition chamber 503 and a detection device 504. The detection device can be installed in the chamber. The detection device 504 can be used to obtain the first vapor deposition rate of the first common functional layer during the vapor deposition process.

[0116] The aforementioned host computer 501 can be used to determine the thickness of the first film layer based on the first evaporation rate and evaporation time.

[0117] Here, the host computer can determine the thickness of the first film layer based on the aforementioned formula (3). When the evaporation rate includes multiple sub-evaporation rates, the host computer can determine the thickness of the first film layer based on the aforementioned formula (4).

[0118] In some examples, the detection device may include a high-temperature laser Doppler velocimeter, which can more accurately measure the evaporation rate, thereby making the determined film thickness more accurate.

[0119] In some embodiments, such as Figure 5 As shown, the vapor deposition chamber 503 may include a first vapor deposition chamber 5031 and a second vapor deposition chamber 5032. A first vapor deposition source 5021 is disposed in the first vapor deposition chamber, and a first common functional layer can be vapor deposited in the first vapor deposition chamber 5031. A second vapor deposition source 5022 is disposed in the second vapor deposition chamber 5032, and a second common functional layer can be vapor deposited in the second vapor deposition chamber. The detection device 504 may be disposed in the first vapor deposition chamber 5031.

[0120] The vapor deposition machine provided in this application embodiment can determine the thickness of the first film layer in a timely manner during the vapor deposition process of the first common functional layer and the second common functional layer, and adjust the vapor deposition parameters in a timely manner based on the thickness of the first film layer, so that the thickness of the second common functional layer reaches the thickness of the second film layer, thereby improving the product yield of the display panel.

[0121] In some examples, a first detection device can be installed within the second evaporation chamber. This first detection device can monitor the second evaporation rate of the second common functional layer in real time and send the second evaporation rate to the host computer 501. The host computer can calculate the film thickness of the second common functional layer in real time based on the second evaporation rate and the evaporation time of the second common functional layer, allowing the user to monitor the film thickness in real time during the evaporation process and adjust the evaporation process parameters accordingly.

[0122] In some examples, when there are multiple display panels, the host computer can establish a correspondence between the identifier of each display panel and the corresponding first film thickness and second film thickness, so that the user can promptly view the corresponding first film thickness and second film thickness based on the identifier of the display panel.

[0123] Based on the same inventive concept, embodiments of this application also provide an apparatus for manufacturing a display panel.

[0124] In some embodiments, such as Figure 6 As shown, this application provides an apparatus for manufacturing a display panel, which is applied to a display panel. The display panel includes multiple light-emitting elements, each of which includes a first common functional layer and a second common functional layer. The first common functional layer is used to transmit a first type of charge carrier, and the second common functional layer is used to transmit a second type of charge carrier. The manufacturing apparatus includes:

[0125] The acquisition module 601 is used to acquire the first film thickness of the first common functional layer of each light-emitting element after the first common functional layer has been deposited.

[0126] The determining module 602 is used to determine the second film thickness of the second common functional layer of each light-emitting element based on the preset microcavity thickness and the first film thickness of the first common functional layer.

[0127] The vapor deposition module 603 is used to adjust the vapor deposition parameters of the second common functional layer based on the second film thickness, and to vapor deposit the second common functional layer of each light-emitting element based on the vapor deposition parameters, so that the film thickness of the second common functional layer reaches the second film thickness.

[0128] In some embodiments, the determining module may specifically be used for:

[0129] Based on the target type of the target light-emitting element, the thickness of the target microcavity is determined. The target light-emitting element can be any one of multiple light-emitting elements.

[0130] Based on the target microcavity thickness and the first film thickness, the second film thickness of the second common functional layer of the target light-emitting element corresponding to the first film thickness is determined.

[0131] In some embodiments, the acquisition module may be specifically used for:

[0132] During the process of vapor deposition of the first common functional layer, the first vapor deposition rate and vapor deposition time of the first common functional layer are obtained;

[0133] The thickness of the first film layer is determined based on the first evaporation rate and evaporation time.

[0134] In some embodiments, the thickness of the first film layer is determined based on the first evaporation rate and evaporation time, satisfying the following conditions:

[0135]

[0136] Where d1 is the thickness of the first film layer, t1 is the start time of the evaporation of the first common functional layer, and t n v(t) represents the end time of vapor deposition of the first common functional layer and v(t) represents the first vapor deposition rate.

[0137] In some embodiments, the first evaporation rate includes multiple sub-evaporation rates, and the evaporation time includes the evaporation time for each sub-evaporation rate. The determining module can specifically be used for:

[0138] The thickness of the sub-film layer within each sub-evaporation rate and the evaporation time at each sub-evaporation rate is determined.

[0139] The thickness of the first film layer is determined based on the thicknesses of multiple sub-film layers.

[0140] In some embodiments, the vapor deposition parameters include a second vapor deposition rate for depositing the second common functional layer.

[0141] In some embodiments, the first common functional layer includes a hole transport layer, and the second common functional layer includes an electron transport layer.

[0142] The apparatus described above is used to implement the manufacturing method of the corresponding display panel in any of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0143] Figure 7 A schematic diagram of the hardware structure of an electronic device is provided in the application embodiment.

[0144] The electronic device 700 may include a processor 701 and a memory 702 storing computer program instructions.

[0145] Specifically, the processor 701 may include a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits that can be configured to implement the embodiments of this application.

[0146] Memory 702 may include mass storage for data or instructions. For example, and not limitingly, memory 702 may include a hard disk drive (HDD), floppy disk drive, flash memory, optical disk, magneto-optical disk, magnetic tape, or Universal Serial Bus (USB) drive, or a combination of two or more of these. Where appropriate, memory 702 may include removable or non-removable (or fixed) media. Where appropriate, memory 702 may be internal or external to the integrated gateway disaster recovery device. In a particular embodiment, memory 702 is non-volatile solid-state memory.

[0147] In a particular embodiment, memory 702 includes read-only memory (ROM). Where appropriate, the ROM may be a mask-programmed ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), an electrically rewritable ROM (EAROM), or flash memory, or a combination of two or more of these.

[0148] Memory may include read-only memory (ROM), random access memory (RAM), disk storage media devices, optical storage media devices, flash memory devices, and electrical, optical, or other physical / tangible memory storage devices. Therefore, typically, memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described with reference to the method according to the first aspect of this application.

[0149] The processor 701 reads and executes computer program instructions stored in the memory 702 to implement any of the display panel manufacturing methods in the above embodiments.

[0150] In one example, the electronic device may also include a communication interface 703 and a bus 704. Wherein, as... Figure 7 The processor 701, memory 702, and communication interface 703 are connected through bus 704 and complete communication with each other.

[0151] The communication interface 703 is mainly used to realize communication between various modules, devices, units and / or equipment in the embodiments of this application.

[0152] Bus 704 includes hardware, software, or both, that couples components of an online data traffic metering device together. For example, and not limitingly, the bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an Infinite Bandwidth Interconnect, a Low Pin Count (LPC) bus, a memory bus, a Microchannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable buses, or combinations of two or more of these. Where appropriate, bus 704 may include one or more buses. Although specific buses are described and illustrated in embodiments of this application, any suitable bus or interconnect is contemplated herein.

[0153] The electronic devices described above are used to implement the manufacturing method of the corresponding display panel in any of the foregoing embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0154] Furthermore, in conjunction with the display panel manufacturing method in the above embodiments, this application embodiment can provide a computer storage medium for implementation. This computer storage medium stores computer program instructions; when these computer program instructions are executed by a processor, they implement any of the display panel manufacturing methods in the above embodiments.

[0155] Furthermore, in conjunction with the display panel manufacturing method in the above embodiments, this application embodiment can provide a computer program product to implement it. When the instructions of this computer program product are executed by the processor of an electronic device, they implement any of the display panel manufacturing methods in the above embodiments.

[0156] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0157] The functional blocks shown in the above-described structural diagram can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, they can be, for example, electronic circuits, application-specific integrated circuits (ASICs), appropriate firmware, plug-ins, function cards, etc. When implemented in software, the elements of this application are programs or code segments used to perform the required tasks. Programs or code segments can be stored on a machine-readable medium or transmitted over a transmission medium or communication link via data signals carried on a carrier wave. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, fiber optic media, radio frequency (RF) links, etc. Code segments can be downloaded via computer networks such as the Internet, intranets, etc.

[0158] It should also be noted that the exemplary embodiments mentioned in this application describe methods or apparatuses based on a series of steps or devices. However, this application is not limited to the order of the above steps; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

[0159] The aspects of this application have been described above with reference to flowchart illustrations and / or block diagrams of methods, apparatus (devices), and computer program products according to embodiments of this application. It should be understood that each block in the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that these instructions, executable via the processor of the computer or other programmable data processing apparatus, enable the implementation of the functions / actions specified in one or more blocks of the flowchart illustrations and / or block diagrams. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field-programmable logic circuit. It is also understood that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can also be implemented by dedicated hardware performing the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

[0160] The above description is merely a specific embodiment of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the devices, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

Claims

1. A method for manufacturing a display panel, characterized in that, The display panel includes multiple light-emitting elements, each of which includes a first common functional layer and a second common functional layer. The first common functional layer is used to transmit a first type of charge carrier, and the second common functional layer is used to transmit a second type of charge carrier. The manufacturing method includes: After the first common functional layer has been deposited, the first film thickness of the first common functional layer of each light-emitting element is obtained. Based on the preset microcavity thickness and the first film thickness of the first common functional layer, the second film thickness of the second common functional layer of each light-emitting element is determined. The evaporation parameters for depositing the second common functional layer are adjusted based on the second film thickness, and the second common functional layer for each light-emitting element is deposited based on the evaporation parameters, so that the film thickness of the second common functional layer reaches the second film thickness.

2. The method for manufacturing a display panel according to claim 1, characterized in that, The determination of the second film thickness of the second common functional layer of each light-emitting element based on the preset microcavity thickness and the first film thickness of the first common function includes: The thickness of the target microcavity is determined based on the target type of the target light-emitting element, wherein the target light-emitting element is any one of the plurality of light-emitting elements; Based on the target microcavity thickness and the first film thickness, the second film thickness of the second common functional layer of the target light-emitting element corresponding to the first film thickness is determined.

3. The method for manufacturing a display panel according to claim 1, characterized in that, The step of obtaining the first film thickness of the first common functional layer includes: During the process of vapor deposition of the first common functional layer, the first vapor deposition rate and vapor deposition time of the first common functional layer are obtained; The thickness of the first film layer is determined based on the first evaporation rate and the evaporation time.

4. The method for manufacturing a display panel according to claim 3, characterized in that, The thickness of the first film layer is determined based on the first evaporation rate and the evaporation time, satisfying the following conditions: Where d1 is the thickness of the first film layer, t1 is the start time of the evaporation of the first common functional layer, and t n v(t) represents the end time of vapor deposition of the first common functional layer, and v(t) represents the first vapor deposition rate.

5. The method for manufacturing a display panel according to claim 3, characterized in that, The first evaporation rate includes multiple sub-evaporation rates, and the evaporation time includes the evaporation time for each sub-evaporation rate. Determining the thickness of the first film layer based on the first evaporation rate and the evaporation time includes: The thickness of the sub-film layer within each sub-evaporation time is determined based on each sub-evaporation rate and the evaporation time of each sub-evaporation rate. The thickness of the first film layer is determined based on the thicknesses of the multiple sub-film layers.

6. The method for manufacturing a display panel according to claim 1, characterized in that, The vapor deposition parameters include the second vapor deposition rate for vapor deposition of the second common functional layer; Preferably, the first common functional layer includes a hole transport layer, and the second common functional layer includes an electron transport layer.

7. An apparatus for manufacturing a display panel, characterized in that, The display panel includes multiple light-emitting elements, each of which includes a first common functional layer and a second common functional layer. The first common functional layer is used to transmit a first type of charge carrier, and the second common functional layer is used to transmit a second type of charge carrier. The fabrication apparatus includes: The acquisition module is used to acquire the first film thickness of the first common functional layer of each light-emitting element after the first common functional layer has been deposited. The determination module is used to determine the second film thickness of the second common functional layer of each light-emitting element based on the preset microcavity thickness and the first film thickness of the first common functional layer. The vapor deposition module is used to adjust the vapor deposition parameters for the second common functional layer based on the second film thickness, and to vapor deposit the second common functional layer for each light-emitting element based on the vapor deposition parameters, so that the film thickness of the second common functional layer reaches the second film thickness.

8. An electronic device, characterized in that, The device includes: a processor, and a memory storing computer program instructions; The processor reads and executes the computer program instructions to implement the method for manufacturing a display panel as described in any one of claims 1 to 6.

9. A readable storage medium, characterized in that, The readable storage medium stores computer program instructions, which, when executed by a processor, implement the method for manufacturing a display panel as described in any one of claims 1 to 6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is processed by a processor, it implements the method for manufacturing a display panel as described in any one of claims 1 to 6.

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