Mold mechanism, upper mold jig, and press bonding apparatus

Abstract

A molding mechanism, an upper mold fixture, and a pressing device are disclosed. The molding mechanism includes a keyed assembly and a molding assembly. The keyed assembly includes a shaft, a bushing sleeved on the shaft, and at least one keyed structure connecting the shaft and the bushing. The molding assembly is located at the bottom end of the shaft and has a molding die capable of pressing against a pressed object. The upper mold fixture includes at least one molding mechanism and an upper mold base. The upper mold base has the same number of mounting areas as the at least one molding mechanism, for mounting the at least one molding mechanism. The at least one molding mechanism is engaged in the mounting area by the bushing, and the shaft can be driven to linearly move the molding assembly vertically relative to the upper mold base. Through the design of the keyed assembly, the molding mechanism can linearly press the pressed object downwards.

Description

Technical Field

[0001] This invention relates to an apparatus suitable for wafer packaging processes, and more particularly to a molding mechanism, an upper mold fixture, and a pressing device. Background Technology

[0002] Known lamination equipment for wafer packaging processes includes a lower mold fixture for arranging multiple objects to be pressed in a matrix, and an upper mold fixture that can be driven to move up and down to cooperate with the lower mold fixture to press the objects to be pressed. Each object to be pressed has a rectangular horizontal cross-section, and from bottom to top consists of a substrate, a die, a thermal interface material, and a heat sink. The upper mold fixture has the same number of molding units as the objects to be pressed. These molding units correspond vertically to the objects to be pressed. Ideally, the molding units should press the objects to be pressed in a straight downward direction in the vertical direction to achieve good lamination quality and good packaging quality in subsequent processes. Examples of molding units include those disclosed in Taiwan Patent No. I804790.

[0003] Patent No. I804790's molding unit design uses a complex fixing component to maintain the horizontal radial positioning and vertical longitudinal positioning of the pressure rod, but this increases the manufacturing cost of the molding unit and still needs improvement. Summary of the Invention

[0004] Therefore, the object of the present invention is to provide a molding mechanism, upper mold fixture and pressing device that can at least overcome the disadvantages of the prior art.

[0005] The pressing mechanism includes a keyed assembly and a pressing die assembly. The keyed assembly includes a shaft, a bushing sleeved on the shaft, and at least one keyed structure connecting the shaft and the bushing. The pressing die assembly is located at the bottom end of the shaft and includes a pressing die that can press against a pressed object.

[0006] The upper mold fixture includes at least one pressing mechanism and an upper mold base. The upper mold base has the same number of mounting areas as the at least one pressing mechanism, which are used to mount the at least one pressing mechanism. The at least one pressing mechanism is engaged in the mounting area by the bushing, and the shaft can be driven to move the pressing assembly linearly up and down relative to the upper mold base.

[0007] The pressing equipment includes an upper mold fixture and a lower mold fixture that cooperates with the upper mold fixture to press at least one of the objects to be pressed.

[0008] The advantages of this invention are as follows: By using the keyed structure to connect the shaft and the bushing, the pressing mechanism can achieve a simple and uncomplicated structure, allowing the shaft to move vertically up and down relative to the bushing while preventing the shaft from rotating relative to the bushing. This allows the shaft to drive the pressing assembly to press the object vertically downwards. Furthermore, since the upper mold fixture of the pressing equipment is equipped with at least one pressing mechanism, the upper mold fixture can cooperate with the lower mold fixture to press the object corresponding to the at least one pressing mechanism, thereby achieving the purpose of the pressing equipment. Attached Figure Description

[0009] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the accompanying drawings, wherein:

[0010] Figure 1 This is a perspective view illustrating an embodiment of the pressing mechanism, upper mold fixture, and pressing equipment of the present invention.

[0011] Figure 2 This is an exploded perspective view illustrating the molding mechanism of this embodiment;

[0012] Figure 3 It is along Figure 1 A cross-sectional view taken by line III-III in the figure illustrates the molding mechanism of this embodiment;

[0013] Figure 4 It is along Figure 1 A cross-sectional view taken along line IV-IV in the figure illustrates the molding mechanism of this embodiment;

[0014] Figure 5 It is along Figure 3 A cross-sectional view taken by the VV line in the figure illustrates a key connection component of the molding mechanism in this embodiment;

[0015] Figure 6 It is an exploded sectional view illustrating the key assembly of the molding mechanism in this embodiment;

[0016] Figure 7 It is similar to Figure 5 A view illustrating another embodiment of the keying component of the molding mechanism of this embodiment;

[0017] Figure 8 It is similar to Figure 5 A view illustrating another embodiment of the keying component of the molding mechanism of this embodiment;

[0018] Figure 9 This is a perspective view illustrating a pressing device according to this embodiment;

[0019] Figure 10This is a front view illustrating the pressing device of this embodiment;

[0020] Figure 11 This is a partial exploded perspective view illustrating an upper mold fixture of this embodiment;

[0021] Figure 12 This is a partial exploded perspective view illustrating the upper mold fixture of this embodiment;

[0022] Figure 13 This is an incomplete top view illustrating the upper mold fixture of this embodiment;

[0023] Figure 14 This is an incomplete perspective view illustrating a guide frame of the upper mold fixture in this embodiment;

[0024] Figure 15 It is a cross-sectional view illustrating that a fixture drive member of the pressing device in this embodiment drives the upper mold fixture downward so that one of the pressing mechanisms presses against a pressed object; and

[0025] Figure 16 It is a cross-sectional view illustrating that a pressing drive member of the pressing device in this embodiment drives the corresponding pressing mechanism to press the object downward.

[0026] [Symbol Explanation]

[0027] 1: Key component

[0028] 11: Shaft

[0029] 110: Through hole

[0030] 111: Groove

[0031] 12: Bushing

[0032] 120: Shaft hole

[0033] 121: Second side

[0034] 122: Second Axis

[0035] 13: Keyed structure

[0036] 131: Keyway

[0037] 132: Keyboard

[0038] 133: Key connector

[0039] 134: Ball bearing

[0040] 135: Key Block

[0041] 14: Sealing ring

[0042] 2: Compression molding assembly

[0043] 21: Pressure seat

[0044] 210: Lower fixing hole

[0045] 22: Thermal insulation components

[0046] 220: Second Channel

[0047] 23: Press mold

[0048] 230: Third Channel

[0049] 3: Pressure sensing component

[0050] 31: Placement

[0051] 311: Loading section

[0052] 312: Socket part

[0053] 313: First side

[0054] 314: First Axis

[0055] 32: Pressure sensing component

[0056] 4: Upper fastener

[0057] 5: Pads

[0058] 50: carving

[0059] 6: Lower fixing component

[0060] 60: First Channel

[0061] 7: Temperature sensing element

[0062] 8: Upper mold base

[0063] 81: Settings Area

[0064] 82: Conductor frame

[0065] 821: Sidewall

[0066] 824: Wire Hole

[0067] 822: Bottom wall

[0068] 823: Cable Tray

[0069] 9: Lower mold fixture

[0070] 91: Lower mold

[0071] A0: Pressurized object

[0072] B0: Compression molding drive component

[0073] C0: Fixture driver

[0074] D0: Gap

[0075] O1: Compression molding mechanism

[0076] O2: Upper mold fixture

[0077] O3: Pressing equipment Detailed Implementation

[0078] See Figure 1 , Figure 2 and Figure 3 The present invention includes a molding mechanism O1, an upper mold fixture O2, and a pressing device O3 (see auxiliary documentation). Figure 9 In one embodiment, the molding mechanism O1 includes a keying component 1, a molding component 2 disposed at the bottom of the keying component 1, a pressure sensing component 3 disposed at the top of the keying component 1, an upper fixing member 4 connecting the keying component 1 and the pressure sensing component 3, a pad 5 sandwiched between the keying component 1 and the pressure sensing component 3, a lower fixing member 6 connecting the keying component 1 and the molding component 2, and a temperature sensing element 7 passing through the top of the keying component 1, the keying component 1, and the molding component 2 to the bottom of the molding component 2.

[0079] See Figure 3 , Figure 5 and Figure 6 The keying assembly 1 includes a shaft 11, a bushing 12 sleeved on the shaft 11, three keying structures 13 arranged in a ring at angular intervals between the shaft 11 and the bushing 12, and two sealing rings 14 respectively disposed on the top and bottom sides of the bushing 12 adjacent to the shaft 11. The shaft 11 has a through hole 110 and a groove 111 located at the top end and communicating with the through hole 110 (see auxiliary reference). Figure 2 The shaft 11 can be vertically displaced relative to the bushing 12. The bushing 12 has a shaft hole 120 through which the shaft 11 passes. The keying structure 13 connects the shaft 11 and the bushing 12. Each keying structure 13 has a keyway 131 located on the outer peripheral surface of the shaft 11 and extending along the axial direction of the shaft 11, a key seat 132 located on the inner peripheral surface of the shaft hole 120 and positioned corresponding to the keyway 131, and a plurality of keying members 133 connecting the keyway 131 and the key seat 132. The keying members 133 are arranged in a straight line between the keyway 131 and the key seat 132. Each keying member 133 is a ball bearing 134 that can roll freely in multiple axes.

[0080] See Figure 5 , Figure 7 and Figure 8It should be noted that the number of keying structures 13 is not limited to three. In other variations of this embodiment, there may be one, two, four, or more. The more keying structures 13 there are, the smaller the interval angle between them arranged in a ring. It is preferable for a plurality of keying structures 13 to be arranged in a ring at equal angular intervals, thus reducing the sway of the shaft 11. Furthermore, the number of keying elements 133 provided in each keying structure 13 is not limited to a plurality; in other variations of this embodiment, there may be an odd number. When the number of keying elements 133 is odd, the keying element 133 may be, for example, but not limited to, a key block 135 with a square horizontal cross-section.

[0081] See Figure 2 , Figure 3 and Figure 4 The molding assembly 2 is detachably mounted on the bottom end of the shaft 11. The molding assembly 2 includes a pressure seat 21 detachably fixed to the bottom end of the through hole 110 by the lower fixing member 6, a heat insulation member 22 connected to the bottom end of the pressure seat 21, and a pressure object A0 connected to the bottom end of the heat insulation member 22 and capable of pressing against it (see auxiliary document). Figure 15 A pressure mold 23 is provided. The pressure base 21 has a lower fixing hole 210 for the lower fixing member 6 to pass through. The pressure mold 23 is made of non-metallic material and has the characteristics of pressure resistance and high temperature resistance. The pressure object A0 can be an assembly formed after the heat sink process in semiconductor manufacturing, and the assembly can be in the following order from bottom to top: substrate, die, thermal interface material, and heat sink, but the pressure object A0 is not limited to this. The pressure base 21, the heat insulation member 22, and the pressure mold 23 can be assembled together by screws not shown in the figure.

[0082] The pressure sensing component 3 is connected to the top end of the shaft 11 and has a seat 31 connected to the shaft 11, and a pressure sensing element 32 mounted on the top of the seat 31. The seat 31 has a mounting portion 311 for supporting the pressure sensing element 32 and a sleeve portion 312 that fits onto the shaft 11. The width of the mounting portion 311 is larger than the width of the sleeve portion 312. The sleeve portion 312 is fixed to the top end of the through hole 110 by the upper fixing member 4.

[0083] It should be noted that the base 31 has two parallel first sides 313, and the bushing 12 has two parallel second sides 121. The projections of a first axis 314 passing through the first side 313 and a second axis 122 passing through the second side 121 on the horizontal plane are not parallel. In this embodiment, the projections of the first axis 314 and the second axis 122 on the horizontal plane intersect at a 45-degree angle.

[0084] The pad 5 is disposed between the base 31 and the bushing 12, and has a perforation 50 for the shaft 11 to pass through. The lower fixing member 6 has a first channel 60 communicating with the through hole 110, the heat insulation member 22 has a second channel 220 communicating with the first channel 60, and the mold 23 has a third channel 230 communicating with the second channel 220. The shaft hole 120, the through hole 110, the first channel 60, the second channel 220, and the third channel 230 are coaxial. The temperature sensing element 7 is linear. The temperature sensing element 7 enters the groove 111 from outside the shaft 11, and sequentially passes through the through hole 110, the first channel 60, the second channel 220, and the third channel 230 to the bottom end of the mold 23.

[0085] See Figure 9 , Figure 10 , Figure 11 and Figure 12 The upper mold fixture O2 has fifty pressing mechanisms O1 as described above, an upper mold base 8 supporting the pressing mechanisms O1, and fifty pressing drive members B0 located above the pressing mechanisms O1 to drive the pressing mechanisms O1 to move downward. The upper mold base 8 has fifty mounting areas 81 for mounting the pressing mechanisms O1, and eleven guide frames 82 arranged in pairs on both sides of five of the mounting areas 81 arranged in a row. The mounting areas 81 are arranged in a row of five between any two adjacent guide frames 82. Each mounting area 81 is a circular hole penetrating the upper mold base 8.

[0086] The five molding mechanisms O1 are arranged in a straight line between any two adjacent guide frames 82. Each molding mechanism O1 is secured by a bushing 12 between its respective mounting area 81 and the guide frames 82 located on both sides. The heights of the seats 31 of each pair of adjacent molding mechanisms O1 extending upwards from their respective bushings 12 are different. Therefore, the molding mechanisms O1 can be arranged closely on the upper mold base 8 with staggered heights, allowing more molding mechanisms O1 to be installed within the limited space of the upper mold base 8, thereby minimizing the size of the upper mold base 8. Viewed from a top viewpoint (see auxiliary reference). Figure 13 The mounting portion 311 of the pressure sensing component 3 of any two adjacent molding mechanisms O1 overlaps with each other. The molding drive B0 is, for example, but not limited to, a pneumatic cylinder drive.

[0087] See Figure 2 , Figure 11 and Figure 12In this embodiment, the steps for installing the molding mechanism O1 onto the upper mold base 8 are as follows: First, the keying component 1 of each molding mechanism O1 is placed with the bottom of its bushing 12 into the corresponding setting area 81, and the top of its bushing 12 is engaged with the top surface of the setting area 81. Therefore, the top of the shaft 11 is exposed above the upper mold base 8, and the bottom of the shaft 11 is exposed below the upper mold base 8. Second, the molding component 2 of each molding mechanism O1 is fixed to the shaft 11 from below the upper mold base 8. Third, after the keying component 1 and the molding component 2 of the molding mechanism O1 are installed, the wire frame 82 is set. Finally, the pad 5 and the pressure sensing component 3 of each molding mechanism O1 are sequentially set onto the keying component 1 from above the upper mold base 8. It should be noted that in other embodiments, the method of installing the molding mechanism O1 onto the upper mold base 8 is not limited to this and can be varied according to actual needs (e.g., different sizes of the setting area 81, the bushing 12, and the molding assembly 2).

[0088] See Figure 11 , Figure 13 and Figure 14 Each wire frame 82 has two spaced-apart sidewalls 821 and a bottom wall 822 connecting the bottom of the sidewalls 821. The sidewalls 821 and the bottom wall 822 cooperate to define a wire groove 823. The wire groove 823 allows the wires of the pressure sensing element 32 and the temperature sensing element 7 to be placed therein, so that the wires are constrained in the wire groove and do not become too messy. Each sidewall 821 has a plurality of wire holes 824. The wires of the pressure sensing element 32 and the temperature sensing element 7 can pass through the wire holes 824 and be pulled out of the upper mold fixture O2 along the corresponding wire groove 823.

[0089] See Figure 9 , Figure 10 and Figure 15 The pressing device O3 includes an upper mold fixture O2, a lower mold fixture 9 cooperating with the upper mold fixture O2 to press the same number of the objects A0 as the pressing mechanism O1, and a fixture drive C0 for driving the upper mold fixture O2 downward so that the pressing mechanism O1 can press down on the objects A0. The pressing device O3 can be used after the heat sink installation process in semiconductor manufacturing, but is not limited thereto. The lower mold fixture 9 has the same number of lower molds 91 as the pressing mechanism O1. Each lower mold 91 is used to mount a different object A0. The fixture drive C0 is, for example, but not limited to, a pneumatic cylinder drive.

[0090] See Figure 9 , Figure 15 and Figure 16When the pressing device O3 is to perform the pressing operation on the object A0, firstly, the fixture drive C0 drives the upper mold fixture O2 to move downwards towards the lower mold fixture 9 until the pressing mold 23 of each pressing mechanism O1 presses against the top surface of the corresponding object A0. Since the bushing 12 of each pressing mechanism O1 is fixed to the upper mold base 8, and the shaft 11 can move up and down relative to the bushing 12, the shaft 11 can be driven to move the pressing assembly 2 linearly up and down relative to the upper mold base 8. When the pressing mold 23 presses against the top surface of the corresponding object A0, the shaft 11 will move slightly upwards relative to the upper mold base 8, creating a gap D0 between the pressure sensing component 3 and the pad 5. At this time, the pressure driving component B0 corresponding to each pressure molding mechanism O1 is driven to move downward to push the pressure sensing component 3 downward and push the shaft 11 downward to eliminate the gap D0, and then drive the pressure molding component 2 to press the object A0 downward to complete the pressing operation of the pressing device O3.

[0091] During the pressing process of the object A0, the upper mold fixture O2 and / or the lower mold fixture 9 can apply heat to the object A0. Since the bottom of the mold 23 can contact the object A0, the molding mechanism O1 is designed to be equipped with the temperature sensor 7 to monitor the real-time temperature of the object A0, so that the heat applied to the object A0 can be adjusted according to the sensed temperature.

[0092] In summary, the pressing mechanism O1, upper mold fixture O2, and pressing device O3 of the present invention, through the design and application of the keying structure 13 connecting the shaft 11 and the bushing 12, allow the pressing mechanism O1 to move vertically up and down relative to the bushing 12 with a simple and uncomplicated structure, while preventing the shaft 11 from rotating relative to the bushing 12. This enables the shaft 11 to drive the pressing assembly 2 to press the object A0 vertically downwards, thus effectively achieving the purpose of the present invention. Furthermore, since the upper mold fixture O2 of the pressing device O3 is equipped with at least one pressing mechanism O1, and the upper mold fixture O2 can cooperate with the lower mold fixture 9 to press the object A0 corresponding to the at least one pressing mechanism O1, the purpose of the pressing device O3 can be achieved.

[0093] The above description is merely an embodiment of the present invention and should not be construed as limiting the scope of protection of the present invention. Any simple equivalent changes and modifications made based on the scope of protection of the present invention and the contents of the patent specification shall still fall within the scope of the patent of the present invention.

Claims

1. A molding mechanism, comprising: A one-key connection assembly includes a shaft, a bushing sleeved on the shaft, and at least one key connection structure for keying the shaft and the bushing; and A pressure mold assembly is located at the bottom end of the shaft and has a pressure mold that can press against a pressure object.

2. The molding mechanism as described in claim 1, wherein, The keying assembly has a keying structure with multiple angular intervals.

3. The molding mechanism as described in claim 2, wherein, The bushing has a shaft hole through which the shaft passes. Each keyed structure has a keyway located on the outer circumferential surface of the shaft and extending along the axial direction of the shaft, a key seat located on the inner circumferential surface of the shaft hole and positioned corresponding to the keyway, and a key connector connecting the keyway and the key seat. The key connector is a key block with a square horizontal cross-section.

4. The molding mechanism as described in claim 2, wherein, The bushing has a shaft hole through which the shaft passes. Each key structure has a keyway located on the outer circumferential surface of the shaft and extending along the axial direction of the shaft, a key seat located on the inner circumferential surface of the shaft hole and positioned corresponding to the keyway, and a plurality of key components connecting the keyway and the key seat. Each key component is a ball that can roll freely in multiple axes.

5. The molding mechanism as described in claim 1, wherein, The bushing has a shaft hole for the shaft to pass through. The molding assembly is detachably disposed at the bottom end of the shaft. The molding assembly also has a pressure seat disposed on the shaft and a heat insulation member disposed on the pressure seat. The heat insulation member is provided for the molding.

6. The molding mechanism as described in claim 5 further includes a lower fixing member, wherein the shaft has a through hole, and the molding assembly is fixed to the through hole by the lower fixing member.

7. The molding mechanism as described in claim 6, wherein, The pressure base is provided with a lower fixing hole for the lower fixing member to pass through, the lower fixing member is provided with a first channel communicating with the through hole, the heat insulation member is provided with a second channel communicating with the first channel, and the pressure mold is provided with a third channel communicating with the second channel.

8. The molding mechanism as described in claim 7, wherein, The shaft hole, the through hole, the first channel, the second channel, and the third channel are coaxial.

9. The molding mechanism as described in claim 7 further includes a temperature sensing element, which passes through the through hole, the first channel, the second channel and the third channel to the molding die.

10. The molding mechanism as described in claim 9, wherein the top end of the shaft is further provided with a groove communicating with the through hole, and the temperature sensing element passes through the groove from outside the shaft.

11. The molding mechanism as claimed in claim 1, further comprising a pressure sensing component disposed at the top end of the shaft.

12. The molding mechanism as claimed in claim 11, wherein, The pressure sensing component includes a base and a pressure sensing element disposed on the top of the base.

13. The molding mechanism as claimed in claim 12, wherein, The mounting base has a mounting portion for supporting the pressure sensing element and a sleeve portion that is fitted onto the shaft. The width of the mounting portion is larger than the width of the sleeve portion.

14. The molding mechanism as described in claim 12, further comprising an upper fixing member, wherein the shaft has a through hole, and the seat is fixed to the through hole by the upper fixing member.

15. The molding mechanism as described in claim 12 further includes a pad disposed between the seat and the bushing, the pad having a perforation for the shaft to pass through.

16. The molding mechanism as claimed in claim 12, wherein, The seat has two parallel first sides, and the bushing has two parallel second sides. The projections of a first axis passing through the first side and a second axis passing through the second side on the horizontal plane are not parallel.

17. An upper mold fixture, comprising: At least one molding mechanism as described in claim 1; and An upper mold base is provided with a number of setting areas equal to the number of the at least one pressing mechanism, and the setting areas are for the at least one pressing mechanism to set; The at least one molding mechanism is engaged in the setting area by the bushing, and the shaft can be driven to move the molding assembly linearly up and down relative to the upper mold base.

18. The upper mold fixture as described in claim 17, wherein the upper mold fixture is provided with a plurality of the pressing mechanisms, wherein, The upper mold base is provided with multiple setting areas for the molding mechanism. Each molding mechanism is also provided with a pressure sensing component located at the top of each shaft. Each pressure sensing component is provided with a seat and a pressure sensing element located on the top of the seat. The height at which each seat of each of two adjacent molding mechanisms extends upward from each bushing is different.

19. The upper mold fixture as described in claim 18, wherein, The upper mold base is also provided with multiple guide wire frames, and the pressing mechanism is arranged in a straight line between any two adjacent guide wire frames.

20. A pressing apparatus comprising an upper mold fixture as described in any one of claims 17 to 19, and a lower mold fixture cooperating with the upper mold fixture to press at least one of the presses.

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