Cleaning device and cleaning method

Abstract

A cleaning device and a cleaning method for cleaning a workpiece having a plurality of chips arranged at intervals on a surface of a sheet-shaped carrier. The cleaning device includes a holding portion that holds the workpiece in a horizontal posture; a nozzle that is disposed above the workpiece and sprays a cleaning liquid toward the workpiece; and a moving mechanism that relatively moves the nozzle and the holding portion in a direction of extension of a groove formed in the intervals between the chips. A workpiece having a configuration in which a plurality of chips are arranged at intervals on a carrier can be effectively cleaned.

Description

Technical Field

[0001] This invention relates to a technique for cleaning workpieces, such as those formed by mounting diced semiconductor chips on a sheet-like carrier. Background Technology

[0002] In the semiconductor device manufacturing process, there is a dicing process that cuts individual chips (bare chips) from a semiconductor wafer on which multiple devices are formed. Chip separation is achieved by attaching the wafer to a flexible, sheet-like carrier, stretching the carrier to create gaps between the chips (expansion processing). Particles such as cutting chips can sometimes enter these gaps (grooves), thus requiring cleaning.

[0003] For example, in the technology described in Japanese Patent Application Publication No. 2023-178867 (Patent Document 1), a workpiece is cleaned using a so-called rotary cleaning method. In this method, a cleaning fluid is supplied to the upper surface of the workpiece while it is rotated in a horizontal position, and centrifugal force is used to distribute the cleaning fluid throughout the entire workpiece, thereby performing cleaning. Summary of the Invention

[0004] The problem that the invention aims to solve

[0005] Typically, chips are arranged in a two-dimensional matrix on a wafer, so slots separating the chips on the workpiece are arranged in a two-dimensional lattice. On the other hand, in rotary cleaning, the cleaning fluid supplied to the workpiece flows radially from the center of rotation towards the periphery using centrifugal force. Therefore, the sweeping action achieved by the cleaning fluid may not be sufficiently effective against particles adhering to the inside of the tank. Thus, rotary cleaning, as described in the prior art, sometimes leaves particles remaining inside the tank, and there is room for improvement in terms of more efficient cleaning.

[0006] Solution for solving the problem

[0007] The present invention was made in view of the above-mentioned problems, and provides a technique for effectively cleaning a workpiece having a structure in which multiple chips are arranged at intervals on a carrier.

[0008] One aspect of the present invention is a cleaning apparatus for cleaning a workpiece having a plurality of chips arranged at intervals on the surface of a sheet-like carrier, comprising: a holding part for holding the workpiece in a horizontal position; a nozzle disposed above the workpiece and spraying cleaning fluid toward the workpiece; and a moving mechanism for moving the nozzle and the holding part relative to each other along the extension direction of a groove formed by the gaps between the chips.

[0009] Another aspect of the present invention is a cleaning method for cleaning a workpiece in which multiple chips are arranged at intervals on the surface of a sheet-like carrier, wherein the workpiece is held in a horizontal position, a nozzle is disposed above the workpiece, and cleaning fluid is sprayed from the nozzle toward the workpiece, such that the nozzle and the workpiece move relative to each other along the extension direction of the groove formed by the gaps between the chips.

[0010] In this invention, the supply position of the cleaning fluid from the nozzle relative to the workpiece changes over time along the direction of the groove formed between the chips due to the relative movement of the nozzle and the workpiece. Therefore, particles adhering to the groove are efficiently discharged to the outside along with the cleaning fluid flowing along the groove. As a result, in this invention, workpieces having a structure in which multiple chips are arranged at intervals on a carrier can be effectively cleaned.

[0011] Invention Effects

[0012] As described above, according to the present invention, the supply position of the cleaning fluid changes over time along the direction of the grooves formed between the chips spaced apart on the workpiece. Therefore, it is possible to suppress particle residue in the grooves and effectively clean the workpiece.

[0013] A more comprehensive understanding of the above-mentioned and other objects and novel features of the present invention will be obtained by reading the following detailed description with reference to the accompanying drawings. However, the drawings are for illustrative purposes only and do not limit the scope of the invention. Attached Figure Description

[0014] Figures 1A to 1C It is a diagram that schematically represents an example of the structure of a workpiece.

[0015] Figures 2A to 2C It is a diagram that schematically illustrates the specific methods of cleaning treatment.

[0016] Figure 3A and Figure 3B This is a diagram illustrating a first embodiment of the cleaning apparatus of the present invention.

[0017] Figure 4 This is a flowchart illustrating the cleaning process in the first embodiment.

[0018] Figure 5 This is a top view showing a second embodiment of the cleaning apparatus of the present invention.

[0019] Figure 6 This is a top view showing a third embodiment of the cleaning apparatus of the present invention.

[0020] Figure 7A and Figure 7B This is a diagram illustrating a fourth embodiment of the cleaning apparatus of the present invention.

[0021] Figure 8 This is a flowchart illustrating the cleaning process in this embodiment. Detailed Implementation

[0022] Hereinafter, several embodiments of the cleaning apparatus according to embodiments of the present invention will be described. In these embodiments, the workpiece to be cleaned is common, and the principle of the cleaning process is also common. Therefore, the workpiece to be cleaned and the principle of the cleaning process will be described first.

[0023] <Workpiece Description>

[0024] Figures 1A to 1C This is a schematic diagram illustrating an example of the structure of a workpiece. More specifically, Figure 1A This is a diagram showing the appearance of workpiece Wk. Figure 1B This is a schematic diagram illustrating the dicing process of a semiconductor wafer (hereinafter referred to as "wafer") Wf. Additionally, Figure 1C This is a schematic diagram illustrating the expansion process of a wafer Wf after dicing.

[0025] like Figure 1A As shown, in the embodiments described later, the workpiece Wk that is the object of processing is a workpiece in which multiple chips Cp cut from a wafer Wf are arranged in a two-dimensional matrix on the upper surface of a sheet-like cutting strip W2 mounted on the hollow part of a flat ring-shaped cutting frame W1. Each chip Cp eventually becomes a semiconductor device such as an integrated circuit.

[0026] The dicing process of cutting multiple chips Cp formed together on wafer Wf from wafer Wf is well known, and therefore will be briefly explained here. For example... Figure 1B As shown, a roughly circular wafer Wf is divided into multiple bare chips Di along the cutting line shown by the dashed line using appropriate cutting units such as diamond blades or laser cutters.

[0027] At this point, to prevent the detached bare die Di from being lost, the wafer Wf is mounted on the dicing tape W2. That is, the dicing tape W2 is pre-attached to the back of the wafer Wf. The dicing tape W2 is a sheet material with elasticity, such as resin, and is held in place by an adhesive applied to its surface. The dicing tape is also known as DAF (Die Attach Film).

[0028] After cutting the wafer, as Figure 1CAs shown, the dicing tape W2 is stretched outward in the face direction (expansion process). This widens the spacing between the separated bare chips Di. Consequently, it becomes easier to remove each bare chip Di (chip Cp) from the dicing tape W2. It should be noted that here, the small piece cut from the wafer Wf is called a bare chip Di, and the one on which circuitry is pre-formed and functions as a semiconductor device is called a chip Cp.

[0029] The cutting strip W2 is made of a soft raw material; therefore, for ease of handling, its periphery is fixed by a ring-shaped cutting frame W1. This forms the workpiece Wk. It should be noted that the workpiece Wk, which is the object to be cleaned, can be either a workpiece with a relatively narrow spacing between the chips Cp after cutting and before expansion, or a workpiece with a wider spacing between the chips Cp after expansion.

[0030] <Principles of Cleaning Process>

[0031] In the workpiece Wk constructed as described above, chips Cp are arranged in a two-dimensional matrix, with gaps between each chip Cp. Therefore, slots are formed between adjacent chips Cp. When each chip Cp is rectangular and their arrangement is one-dimensional, the chip arrangement direction intersects with the extension direction of the slots formed between these chips. On the other hand, when the chips Cp are arranged in a two-dimensional configuration along two arrangement directions, the slots extending along their respective arrangement directions are formed in a lattice pattern.

[0032] These grooves contain particles such as cutting chips generated during cutting, necessitating a cleaning process to remove them. However, in rotary cleaning methods, such as those using existing techniques where the workpiece is rotated while the cleaning fluid is supplied, the radial flow of the cleaning fluid due to centrifugal force may not align with the direction of the grooves between the chips. Consequently, the sides of the chip Cp become barriers, preventing particle discharge, resulting in particle residue within the grooves. This hinders improvements in cleaning efficiency.

[0033] In view of this problem, in the embodiments described later, the nozzle that sprays the cleaning fluid and the workpiece Wk are moved relative to each other along the extension direction of the tank. This generates a flow of cleaning fluid along the tank, promoting the removal of residual particles adhering to the inside of the tank and improving the cleaning effect.

[0034] It should be noted that the workpiece Wk, as described above, is an integrated assembly of the cutting frame W1, the cutting tape W2, and the bare die Di (die Cp). However, the cutting frame W1 and the cutting tape W2 are auxiliary tools used to maintain the posture of the bare die Di. Therefore, in the following description, the workpiece Wk is sometimes illustrated as an assembly of bare dies Di (die Cp) with the cutting frame W1 and the cutting tape W2 omitted.

[0035] Figures 2A to 2CThis diagram schematically illustrates the specific method of cleaning. Here, to uniformly explain directions, in a workpiece Wk with rectangular chips Cp arranged in two dimensions, one arrangement direction of the chips Cp is designated as the x-direction, another arrangement direction orthogonal to it is designated as the y-direction, and the direction perpendicular to the main surface of the workpiece Wk is designated as the z-direction, thus establishing an orthogonal coordinate system. Furthermore, in Figures 2A to 2C In the image, the left image is a perspective view showing the cleaning method, and the right image is a partial side sectional view.

[0036] exist Figure 2A In the example shown, a nozzle N1 with an outlet D1 is positioned above the workpiece Wk. The nozzle N1 is positioned such that the outlet D1 is directly above a groove Dc formed on the workpiece Wk and extending in the x-direction. While spraying cleaning fluid from the outlet D1 toward the groove Dc, the nozzle N1 scans along the x-direction as shown by the dashed arrow. Thus, in the groove Dc supplied with cleaning fluid, particles are propelled in the x-direction by the cleaning fluid and are ultimately removed from the workpiece Wk. The method of spraying the cleaning fluid can be any of the following: a spray, a continuous flow, or an intermittent drip.

[0037] When scanning of a tank Dc is completed, the position of nozzle N1 is moved sequentially along the y-direction. Therefore, for other tanks, by positioning the nozzle D1 directly above the tank to spray cleaning fluid, the tank can also be effectively cleaned. Thus, in Figure 2A In the first example shown, a nozzle N1 with a single nozzle outlet D1 is used to scan and move along the x and y directions, thereby cleaning the grooves formed on the workpiece Wk.

[0038] exist Figure 2B In the second example shown, a nozzle N2 with multiple nozzle outlets D2 arranged at the same spacing as the arrangement spacing of the chips Cp in the workpiece Wk is used. The nozzle N2 is positioned in the y-direction such that each nozzle outlet D2 is at the same position as each groove Dc in the workpiece Wk, and then scans along the x-direction. In this case, the multiple grooves Dc, each extending along the x-direction and arranged relative to each other along the y-direction, are simultaneously cleaned by the cleaning fluid ejected from the nozzle N2. Therefore, compared to the first example, the workpiece Wk can be cleaned in a shorter time.

[0039] exist Figure 2CIn the third example shown, a nozzle N3 with multiple nozzle outlets D3 arranged at a spacing smaller than the chip Cp arrangement spacing in the workpiece Wk is used. Therefore, a curtain-like cleaning fluid with the y-direction as its long side is supplied to the workpiece Wk. In this state, the nozzle N3 is scanned along the x-direction. Thus, not only the groove Dc, but also the surface of the chip Cp can be cleaned with the cleaning fluid. Furthermore, since the arrangement of the nozzle outlets does not need to be consistent with the chip Cp arrangement spacing, it is possible to handle workpieces Wk with different chip sizes.

[0040] As described above, the basic idea behind cleaning workpiece Wk is to promote the discharge of particles from the groove Dc by scanning the nozzle spraying the cleaning fluid along the extension direction of the groove Dc formed on the workpiece Wk. This allows for effective cleaning of the groove Dc. Figure 2C In the third example shown, the surface of chip Cp can also be cleaned simultaneously.

[0041] It should be noted that the above explanation only mentions cleaning grooves extending along the x-direction, but cleaning grooves extending along the y-direction can also be performed in the same way. That is, while supplying cleaning fluid from the nozzle to the groove extending along the y-direction, the nozzle is moved along the y-direction, thereby cleaning the groove. Furthermore, an example of moving the nozzle relative to the workpiece is given here, but any relative movement between the workpiece and the nozzle is sufficient. Therefore, the nozzle can also be fixed while the workpiece is moved. Additionally, as long as relative movement along the groove is achieved, the movement of the workpiece and the movement of the nozzle can be combined.

[0042] Hereinafter, several specific embodiments of the cleaning apparatus of the present invention, constructed based on the above principles, will be described. It should be noted that common structures are labeled with common reference numerals across the various embodiments, and their descriptions will not be repeated unless specifically required.

[0043] <First Implementation Method>

[0044] Figure 3A and Figure 3B This is a diagram illustrating a first embodiment of the cleaning apparatus of the present invention. More specifically, Figure 3A This is a top view of the cleaning apparatus 1A according to the first embodiment. Figure 3B This is its side view. It should be noted that... Figure 3B In order to easily understand the structure of the device, the cutting frame W1 in the workpiece Wk is represented by its cross-section.

[0045] In addition, Figure 3A In subsequent diagrams, an XYZ orthogonal coordinate system is introduced to represent the orientation within the apparatus. This is consistent with... Figure 2AThe local coordinate system used to represent the arrangement direction of chip Cp, i.e., the xyz coordinate system, is different from the local coordinate system used in other languages. In actual space, it is defined as a coordinate system in which the XY plane represents the horizontal plane and the Z axis represents the vertical axis.

[0046] The cleaning apparatus 1A comprises a holding unit 2, a first cleaning unit 31, a second cleaning unit 32, a cleaning fluid supply unit 4, and a control unit 5 as its main structures. The holding unit 2 holds the workpiece Wk in a roughly horizontal position. The first cleaning unit 31 and the second cleaning unit 32 spray cleaning fluid toward the workpiece Wk, respectively. The cleaning fluid supply unit 4 supplies cleaning fluid to the first cleaning unit 31 and the second cleaning unit 32.

[0047] The control unit 5 controls each part of the device according to a pre-prepared control program, thereby achieving the desired action. For this purpose, the control unit 5 includes a CPU, memory, storage, interface, etc. (not shown). That is, in the control unit 5, the CPU executes the control program stored in the memory, and performs the cleaning process by controlling the actions of each part of the device.

[0048] The holding unit 2 holds the workpiece Wk in a horizontal or approximately horizontal position. For this purpose, the holding unit 2 includes: a workpiece base 21 having a planar dimension slightly larger than the outer dimensions of the workpiece Wk, and on which the workpiece Wk is placed; a chuck mechanism 22 for fixing the workpiece Wk; and a lifting mechanism 23 for supporting the workpiece base 21 and lifting the workpiece base 21 along the Z direction. Multiple chuck mechanisms 22 are provided at approximately equal angular intervals on the upper surface of the workpiece base 21. The chuck mechanisms 22 switch between a holding state (fixing the workpiece Wk placed on the workpiece base 21) and a releasing state (releasing the fixation) according to control commands from the control unit 5. The lifting mechanism 23 adjusts the distance between the workpiece Wk and the nozzle (described later) by raising and lowering the workpiece base 21.

[0049] The first cleaning unit 31 includes: a base portion 311, which is disposed adjacent to the (-X) side of the holding portion 2; and a nozzle arm 312, which extends horizontally from above the base portion 311 in the (+X) direction. A moving mechanism 313 is built into the base portion 311, which moves the nozzle arm 312 horizontally in the Y direction as shown by the dashed arrow, according to control commands from the control unit 5. Various actuators can be used as the moving mechanism 313 to achieve such linear motion. For example, a linear motor, a ball screw mechanism, a linear guide, or a single-axis robot can be used as the moving mechanism 313.

[0050] The nozzle arm 312 extends along the X direction above the workpiece Wk held by the retaining part 2, and a nozzle 314 is provided on its lower surface. The spacing of the nozzle outlets provided in the nozzle 314 is as follows: Figure 2B The spacing shown is the same as the chip Cp arrangement in workpiece Wk, or as... Figure 2CThe spacing between the chips Cp in the workpiece Wk is smaller than that shown. The length of the nozzle 314 in the X direction is set to cover the entire distribution range of the chips Cp arranged in the X direction in the workpiece Wk.

[0051] Cleaning fluid is supplied from the cleaning fluid supply unit 4 to the nozzle 314. The composition of the cleaning fluid is not particularly limited; for example, pure water or deionized water (DIW) can be used. Flexible piping is preferred for conveying the cleaning fluid to follow the movement of the nozzle arm 312.

[0052] The second cleaning unit 32 also has a similar structure to the first cleaning unit 31. That is, the second cleaning unit 32 includes a base portion 321 disposed adjacent to the (-Y) side of the holding portion 2 and a nozzle arm 322 extending horizontally from above the base portion 321 in the (+Y) direction. A moving mechanism 323 is built into the base portion 321, which moves the nozzle arm 322 horizontally in the X direction as shown by the dashed arrow, according to control commands from the control unit 5. It should be noted that... Figure 3B The illustration of the second cleaning section 32 is omitted in the text.

[0053] The nozzle arm 322 extends along the Y direction above the workpiece Wk held by the retaining part 2, and a nozzle 324 is provided on its lower surface. The spacing of the nozzle outlets of the nozzle 324 is as follows: Figure 2B The spacing shown is the same as the chip Cp arrangement in workpiece Wk, or as... Figure 2C The spacing between the chips Cp in the workpiece Wk is smaller than that shown. The length of the nozzle 324 in the Y direction is set to cover the entire distribution range of the chips Cp arranged in the Y direction in the workpiece Wk. Cleaning fluid is supplied from the cleaning fluid supply unit 4 to the nozzle 324.

[0054] Figure 4 This is a flowchart illustrating the cleaning process in the first embodiment. The workpiece Wk, which is the object to be cleaned after cutting or expanding, is moved into the cleaning apparatus 1A by an external transport device (step S101). The workpiece Wk is placed horizontally on the workpiece base 21 and fixed by the chuck mechanism 22. At this time, the workpiece Wk is positioned such that the xy direction in which the groove extends in the workpiece Wk coincides with the xy direction defined in the cleaning apparatus 1A.

[0055] Next, a scan performed by the first cleaning unit 31 is executed (step S102). Specifically, while the nozzle 314 of the first cleaning unit 31 is spraying cleaning fluid supplied from the cleaning fluid supply unit 4, the moving mechanism 313 moves the nozzle arm 312 along the Y direction. In this way, the workpiece Wk is scanned by the cleaning fluid. As a result, the grooves extending along the Y direction in the workpiece Wk are cleaned.

[0056] Next, a scan performed by the second cleaning unit 32 is executed (step S103). That is, while the nozzle 324 of the second cleaning unit 32 is spraying cleaning fluid supplied from the cleaning fluid supply unit 4, the moving mechanism 323 moves the nozzle arm 322 along the X direction. As a result, the workpiece Wk is scanned by the cleaning fluid, and the grooves extending along the X direction in the workpiece Wk are cleaned. In this way, the grooves in both the X and Y directions are cleaned.

[0057] Steps S102 and S103 can be repeated multiple times as needed. After stopping the spraying and scanning of the cleaning fluid, the workpiece Wk is removed (step S104), and the series of processes is completed. This action is basically the same in the second and third embodiments described later.

[0058] Thus, in the cleaning apparatus 1A of this embodiment, a first cleaning unit 31 for scanning grooves extending in the Y direction in the workpiece Wk and a second cleaning unit 32 for scanning grooves extending in the X direction are provided. The first cleaning unit 31 scans all grooves extending in the Y direction using cleaning fluid, while the second cleaning unit 32 scans all grooves extending in the X direction using cleaning fluid. Therefore, by combining the scanning performed by the first cleaning unit 31 and the scanning performed by the second cleaning unit 32, all grooves in the workpiece Wk that are the objects of cleaning can be cleaned.

[0059] In principle, by performing one scan each by the first cleaning unit 31 and the second cleaning unit 32, the entire workpiece Wk can be effectively cleaned in a short time. Furthermore, when using... Figure 2C When the nozzles shown are nozzles 314 and 324, they can clean not only the grooves between chip Cp, but also the surface of the chip Cp simultaneously. Furthermore, when nozzles 314 and 324 are... Figure 2B In the configuration shown, if the arrangement spacing of the chips Cp in the workpiece Wk is changed, then the arrangement spacing of the nozzles also needs to be prepared to match it. On the other hand, when nozzles 314 and 324 are... Figure 2C The configuration shown does not require changes to the nozzle arrangement spacing to match the chip Cp.

[0060] <Second Implementation Method>

[0061] Figure 5 This is a top view showing a second embodiment of the cleaning apparatus of the present invention. The difference between the cleaning apparatus 1B of the second embodiment and the cleaning apparatus 1A of the first embodiment is that the front ends of the nozzle arms 312, 322 engage with the guide rail. Apart from this, there are no differences between the first and second embodiments. Therefore, as described above, common structures are labeled with common reference numerals, and descriptions of their structure and operation are omitted.

[0062] In the first cleaning section 31B of this embodiment, a guide rail 315 extending in the Y direction is provided on the (+X) side of the holding section 2. A slider 316 mounted on the (+X) side front end of the nozzle arm 312 is movable in the Y direction and engages with the guide rail 315. Similarly, in the second cleaning section 32B, a guide rail 325 extending in the X direction is provided on the (+Y) side of the holding section 2. A slider 326 mounted on the (+Y) side front end of the nozzle arm 322 is movable in the X direction and engages with the guide rail 325.

[0063] In the case where the nozzle arms 312 and 322 are cantilevered as in the first embodiment, their construction may cause the nozzle tip to droop due to its own weight or vibrate during movement, thus making the supply position of the cleaning fluid unstable. This problem can be eliminated by engaging the arm tip with the guide rail as in this embodiment.

[0064] <Third Implementation Method>

[0065] Figure 6 This is a top view illustrating a third embodiment of the cleaning apparatus of the present invention. In this embodiment, the construction of the nozzle arm and the nozzle differs from that of the first and second embodiments. It should be noted that this embodiment is shown here based on a construction having the same guide rail as the second embodiment, but it could also be based on the construction of the first embodiment without the guide rail.

[0066] The cleaning device 1C of this embodiment uses Figure 2A The example shown illustrates the principle of the cleaning process. Specifically, in the cleaning apparatus 1C, the nozzle arm 317 of the first cleaning unit 31C has a nozzle moving mechanism 318, on which a nozzle 319 is mounted. As the nozzle moving mechanism 318, a suitable direct-acting mechanism can be appropriately applied, such as a linear motor, ball screw mechanism, direct-acting guide, or single-axis robot. The nozzle 319 has a single outlet, spraying cleaning fluid supplied from the cleaning fluid supply unit 4.

[0067] Similarly, in the second cleaning unit 32C, the nozzle arm 327 has a nozzle moving mechanism 328, on which a nozzle 329 is mounted. The nozzle 329 has a single outlet, spraying cleaning fluid supplied from the cleaning fluid supply unit 4.

[0068] According to this structure, the Y-direction scan performed by the first cleaning unit 31C and the X-direction scan performed by the second cleaning unit 32C clean one groove at a time. Therefore, to clean all grooves, the following procedure can be followed: In the first cleaning unit 31C, the Y-direction scan movement performed by the moving mechanism 313 is used as the main scan movement. After each main scan movement ends, the nozzle moving mechanism 318 moves the nozzle 319 in the X-direction by the spacing of the chip Cp. Thus, all grooves extending along the Y-direction can ultimately be cleaned.

[0069] Similarly, in the second cleaning unit 32C, the X-direction scanning movement performed by the moving mechanism 323 is used as the main scanning movement. After each main scanning movement ends, the nozzle moving mechanism 328 uses the nozzle 329 to perform a sub-scanning movement in the Y-direction to adjust the spacing between the chip Cp. As a result, all grooves extending along the X-direction can be cleaned.

[0070] In this embodiment, the feed pitch of the nozzle position during sub-scanning movement can be arbitrarily set via control from the control unit 5. Therefore, it can handle various workpieces Wk with different chip sizes and their arrangement spacings, without requiring nozzle changes each time the type of workpiece Wk changes.

[0071] It should be noted that, here, both the first cleaning unit 31C and the second cleaning unit 32C use nozzles with a single spray outlet, but either of them may also have the configuration shown in the first or second embodiment.

[0072] <Fourth Implementation Method>

[0073] Figure 7A and Figure 7B This is a diagram illustrating a fourth embodiment of the cleaning apparatus of the present invention. More specifically, Figure 7A This is a top view of the cleaning apparatus 1D according to the fourth embodiment. Figure 7B This is its side view. For example... Figure 7A As shown, the second cleaning unit is omitted in the cleaning apparatus 1D of this embodiment. The structure of the first cleaning unit 31D is the same as that of the first cleaning unit 31 in the first embodiment. Therefore, scanning of the workpiece Wk can only be performed in the Y direction. Therefore, only the grooves extending in the Y direction are cleaned in the workpiece Wk.

[0074] The groove extending in the x-direction is cleaned by rotating the workpiece Wk 90 degrees around the vertical axis. That is, in the holding part 2D of this embodiment, a rotating mechanism 24 is provided between the lifting mechanism 23 and the workpiece base 21. The rotating mechanism 24 rotates the workpiece base 21 around... Figure 7BThe vertical axis, indicated by the single-dotted line, rotates 90 degrees. Various actuators can be applied to this rotation mechanism 24. For example, the rotation mechanism 24 can consist of a rotating shaft and a motor that rotates the rotating shaft. Thus, it is possible to switch between a state where the X-direction in actual space aligns with the x-direction in workpiece Wk and a state where the X-direction in actual space aligns with the y-direction in workpiece Wk.

[0075] Figure 8 This is a flowchart illustrating the cleaning process in this embodiment. The process is the same as in the first embodiment: the workpiece Wk is moved in with the x-direction aligned with the X-direction in actual space (step S201), and a scan in the Y-direction is performed by the first cleaning unit 31D (step S202). This cleans the grooves in the Y-direction of the workpiece Wk.

[0076] Next, the rotating mechanism 24 rotates the workpiece base 21 by 90 degrees (step S203). This brings the workpiece Wk to a state where the x-direction aligns with the Y-direction in actual space. In this state, the first cleaning unit 31D performs a scan in the Y-direction, i.e., along the x-direction of the workpiece Wk (step S204). This cleans the groove extending along the x-direction as well. Afterwards, as in the first embodiment, the workpiece Wk is removed, and the process ends (step S205). It should be noted that the following procedure can also be provided: before removing the workpiece, the rotating mechanism 24 rotates the workpiece base 21 by 90 degrees in the opposite direction to return it to its original position.

[0077] In this embodiment, the device structure is simplified by omitting the second cleaning section, particularly regarding the cleaning fluid supply system. On the other hand, a mechanism for rotating the workpiece base 21 is added. Which side has a greater advantage varies depending on the situation, but in terms of the device's footprint, this embodiment can reduce space requirements compared to other embodiments. It should be noted that here, the nozzle arm 312 is not supported by a guide rail, but it could also be as described above. Figure 5 The first cleaning section 31B shown is supported by a guide rail.

[0078] <Other>

[0079] As described above, in the various embodiments, the cleaning devices 1A to 1D correspond to the "cleaning device" of the present invention. Furthermore, the holding part 2, nozzles 314 and 324, and the moving mechanism 313 function as the "holding part," "nozzle," and "moving mechanism" of the present invention, respectively. Additionally, the x-direction and y-direction correspond to the "arrangement direction" of the present invention. When the y-direction and x-direction are considered as the "first direction" and "second direction" of the present invention, respectively, nozzles 314 and 319 correspond to the "first nozzle" of the present invention; conversely, nozzles 324 and 329 correspond to the "second nozzle" of the present invention. Moreover, the rotating mechanism 24 functions as the "rotating mechanism" of the present invention. Additionally, the cutting strip W2 corresponds to the "carrier" of the present invention.

[0080] It should be noted that the present invention is not limited to the embodiments described above. Various modifications can be made beyond the above descriptions as long as they do not depart from the main idea. For example, in the descriptions of the above embodiments, the cutting frame W1 is described as an annular shape and the workpiece base 21 as a circular plate shape for the purpose of illustrating the principle. However, the cutting frame used in actual manufacturing, as disclosed in Patent Document 1, has a more complex shape. Therefore, the shape of the workpiece base can also be appropriately changed according to the shape and structure of the cutting frame.

[0081] In particular, when the shape of the cutting frame is asymmetrical with respect to rotation, its shape characteristics can be used to simply and reliably achieve the "consistency between the xy direction and the XY direction" in the above embodiments.

[0082] Furthermore, in the above embodiment, the relative movement between the nozzle 314 and the fixed workpiece Wk is achieved by moving the nozzle 314 or the like relative to the fixed nozzle. However, for example, the structure could also involve the workpiece moving relative to the fixed nozzle. For example, when processing multiple workpieces, if the multiple workpieces are configured to pass sequentially below the fixed nozzle, these workpieces can be cleaned efficiently.

[0083] Furthermore, for example, in the above embodiment, the workpiece Wk is fixed to the workpiece base 21 by using a chuck mechanism 22 that mechanically presses the workpiece Wk. However, the method of holding the workpiece Wk is not limited to this and can be arbitrary. For example, by providing suction holes with negative pressure on the upper surface of the workpiece base, the workpiece Wk can be held in place by vacuum suction of the lower surface of the cutting frame W1.

[0084] Alternatively, for example, in the above embodiment, only one cleaning solution is used for cleaning, but multiple cleaning solutions, such as chemical solutions and rinsing solutions, can also be used. In this case, the entire tank or the entire workpiece can be treated with one cleaning solution before cleaning with other cleaning solutions. Alternatively, multiple nozzles can be arranged along the relative movement direction, and different cleaning solutions can be sprayed from each nozzle, thereby achieving cleaning based on multiple cleaning solutions with a single relative movement.

[0085] As described above with reference to specific embodiments, in the cleaning apparatus of the present invention, the nozzle can be configured to spray cleaning liquid from a spray outlet located directly above the tank. With this configuration, the sprayed cleaning liquid can be directly guided into the tank, thus enabling effective cleaning of the tank.

[0086] In this case, for example, the moving mechanism can move the nozzle and the holding part relative to each other along the chip arrangement direction, and sequentially position the nozzle outlet relative to multiple slots. Each time this positioning is performed, the nozzle and the holding part move relative to each other along the slot direction. Thus, cleaning can be performed sequentially for multiple slots. If the chip arrangement spacing changes, this can be addressed by changing the feed spacing in the arrangement direction.

[0087] Alternatively, multiple nozzles can be provided on the nozzle, each corresponding to a different tank. With this structure, multiple tanks can be cleaned with a single relative movement, thus reducing processing time.

[0088] Furthermore, for example, multiple nozzles can be arranged along the arrangement direction at a spacing smaller than the spacing between the slots in the arrangement direction. With this structure, cleaning fluid can be supplied to the spaces between the slots, i.e., to the surface of the chips arranged on the workpiece. Therefore, the chip surface and the surrounding slots can be cleaned simultaneously. That is, in addition to the cleaning effect of the slots, the cleaning effect of the chip surface can also be obtained.

[0089] Furthermore, when the workpiece to be processed is a two-dimensional arrangement of multiple chips in two intersecting arrangement directions, the moving mechanism can also be configured to perform relative movement of the nozzle and the holding part along the two arrangement directions respectively. In such a two-dimensionally arranged workpiece, grooves are formed in two directions along the two arrangement directions. By performing relative movement of the nozzle and the holding part in the two arrangement directions respectively, both of the two grooves can be cleaned.

[0090] In this case, during the relative movement between the moving mechanism and the holding part, a first nozzle that moves in a first direction of the two arrangement directions and a second nozzle that moves in a second direction different from the first direction of the two arrangement directions can also be provided. That is, dedicated nozzles can be provided respectively corresponding to the two types of grooves that extend in different directions and intersect each other. By moving these nozzles relative to the workpiece respectively, grooves with different extension directions can be cleaned efficiently.

[0091] Alternatively, the device can be configured such that a rotating mechanism rotates the holding part about a vertical axis, changing the rotation angle of the holding part, thereby achieving relative movement between the nozzle and the holding part by moving mechanisms along two different arrangement directions. With this structure, the same nozzle can be used to clean both sides of two tanks with different extension directions. Therefore, a compact device structure can be achieved.

[0092] The invention has been described above with reference to specific embodiments, but this description is not intended to be interpreted in a limiting sense. Referring to the description of the invention, as with other embodiments of the invention, various modifications of the disclosed embodiments will be apparent to those skilled in the art. Therefore, the appended claims may be considered to include such modifications or embodiments without departing from the true scope of the invention.

[0093] Industrial availability

[0094] This invention can be applied to all processes involving dicing semiconductor wafers into chip units, and is particularly suitable for cleaning the workpiece after dicing.

[0095] Symbol Explanation

[0096] 1A~1D—Cleaning device; 2—Holding part; 24—Rotating mechanism; 313, 323—Moving mechanism; 314, 319—Nozzle (nozzle, first nozzle); 324, 329—Nozzle (nozzle, second nozzle); Cp—Chip; Dc—Groove; W1—Cutting frame; W2—Cutting strip (carrier); Wk—Workpiece.

Claims

1. A cleaning apparatus for cleaning a workpiece in which multiple chips are arranged at intervals on the surface of a sheet-like carrier. The cleaning device is characterized by having: A holding part that holds the workpiece in a horizontal position; A nozzle, positioned above the workpiece, sprays cleaning fluid toward the workpiece; and A moving mechanism that moves the nozzle and the retaining portion relative to each other along the extending direction of the groove formed in the gap between the chips.

2. The cleaning device according to claim 1, characterized in that, The nozzle sprays the cleaning fluid into the tank from an outlet located directly above the tank.

3. The cleaning device according to claim 2, characterized in that, The moving mechanism causes the nozzle and the holding portion to move relative to each other along the arrangement direction of the chips, and sequentially positions the nozzle outlet relative to the plurality of slots. During each positioning, the nozzle and the retaining part are moved relative to each other along the direction of the groove.

4. The cleaning device according to claim 2, characterized in that, The nozzle is provided with a plurality of spray outlets corresponding to the plurality of slots respectively.

5. The cleaning device according to claim 2, characterized in that, The nozzle has a plurality of nozzle outlets arranged along the arrangement direction at a spacing smaller than the spacing between the slots in the arrangement direction.

6. The cleaning apparatus according to any one of claims 1 to 5, characterized in that, The workpiece, which consists of multiple chips arranged in a two-dimensional configuration along two intersecting directions, is cleaned. The moving mechanism performs relative movement between the nozzle and the holding part along the two arrangement directions respectively.

7. The cleaning apparatus according to claim 6, characterized in that, The nozzle includes a first nozzle and a second nozzle. During relative movement with respect to the holding part by the moving mechanism, the first nozzle moves along a first direction of the two arrangement directions, and the second nozzle moves along a second direction of the two arrangement directions that is different from the first direction.

8. The cleaning apparatus according to claim 6, characterized in that, It includes a rotation mechanism that allows the holding part to rotate about a vertical axis. The rotating mechanism changes the rotation angle of the holding part, thereby realizing the relative movement of the nozzle and the holding part by the moving mechanism along the two arrangement directions respectively.

9. A cleaning method for cleaning a workpiece in which multiple chips are arranged at intervals on the surface of a sheet-like carrier, characterized in that, Keep the workpiece in a horizontal position. A nozzle is positioned above the workpiece, and cleaning fluid is sprayed from the nozzle toward the workpiece. The nozzle and the workpiece are moved relative to each other along the extension direction of the groove formed in the gap between the chips.

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