Substrate processing apparatus

Abstract

A substrate processing apparatus includes a solvent scattering mechanism that scatters solvent outward in a radial direction of a rotary chuck in cooperation with a rotating mechanism, and a cup. The cup includes an upper cup, a lower cup that is divided to have a liquid discharge region and a gas discharge region, and a middle cup that is annularly arranged between the upper cup and the lower cup so as to cover an upper portion of the gas discharge region of the lower cup. The middle cup is inclined downward from an outer peripheral end portion thereof toward an inner peripheral end portion thereof, is capable of receiving coating liquid and solvent flowing down along an inner surface of the upper cup at the outer peripheral end portion side, causes the received coating liquid and solvent to flow down toward the inner peripheral end portion side, and guides the coating liquid and solvent to the liquid discharge region of the lower cup.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus for processing substrates. Examples of substrates include semiconductor substrates, substrates for FPDs (Flat Panel Displays), glass substrates for photomasks, substrates for optical discs, substrates for magnetic disks, ceramic substrates, and substrates for solar cells. Examples of FPDs include liquid crystal display devices and organic EL (electroluminescence) display devices. Background Technology

[0002] Conventionally, substrate processing apparatus includes a rotating chuck for holding a substrate and a cup for collecting coating liquid that spills from the substrate held by the rotating chuck. The cup includes an upper cup surrounding the side of the substrate, a lower cup connected to the lower side of the upper cup, and a middle cup disposed between the upper cup and the lower cup (for example, see Japanese Patent Application Publication No. 2001-176767).

[0003] The lower cup is divided into a drainage area for discharging the application liquid and an venting area for venting air from the inside of the cup. The middle cup (referred to as a rectifier in Japanese Patent Application Publication No. 2001-176767) prevents the splashed application liquid from flowing into the venting area. The middle cup has an inclined surface that slopes downward from the inner circumference to the outer circumference. The middle cup guides the splashed medicine liquid to the drainage area of ​​the lower cup along this inclined surface. In addition, a flow path for allowing the application liquid to flow is formed between the outer circumference of the middle cup and the outer circumference wall of the upper cup. Summary of the Invention

[0004] The problem that the invention aims to solve

[0005] In recent years, high-viscosity coating solutions have been used to form thick films on substrates. As the viscosity of the coating solution increases, the maintenance cycle (e.g., the cycle of changing the cup) tends to become shorter.

[0006] Coating liquid that splashes from the substrate adheres to and accumulates on the upper surface of the cup. The high viscosity of the coating liquid makes it difficult to flow, and its drying process further increases the amount adhering to the upper surface of the cup. The surface of the coating liquid accumulated on the upper surface of the cup is uneven. Therefore, sometimes coating liquid splashed from the substrate hits the accumulated coating liquid on the upper surface of the cup and bounces back, re-adhering to the coating film on the substrate. This results in defects in the coating film.

[0007] Therefore, it is desirable to clean the upper surface of the cup. For example, after forming a coating film on the upper surface of the substrate, a back-side rinsing process is performed. The back-side rinsing process cleans the lower surface of the substrate by supplying solvent to the lower surface of the rotating substrate. Here, the solvent supplied to the lower surface of the substrate is dispersed within the upper cup under the centrifugal force generated by the rotation of the substrate. However, the solvent disperses from the rotating substrate in a generally horizontal direction. Therefore, it is difficult for the solvent to reach the upper surface of the cup.

[0008] Furthermore, the cup cleaning tray periodically supplies solvent into the upper cup to clean the inside of the upper cup and the upper surface of the middle cup. However, if the time until the next cleaning is long, the coating liquid accumulated on the upper surface of the middle cup dries slowly. As a result, it becomes difficult to remove the coating liquid from the upper surface of the middle cup. In addition, cleaning using the cup cleaning tray is not performed when coating liquid is applied to the upper surface of the substrate, i.e., during the manufacturing of semiconductors, etc.

[0009] Therefore, it is impossible to prevent the coating liquid from accumulating on the upper surface of the cup, thus shortening the maintenance cycle (e.g., the cup replacement cycle).

[0010] Furthermore, Japanese Patent Application Publication No. 2001-176767 discloses a method of supplying organic solvents such as diluents to the upper surface of the rectifier plate (middle cup) through a supply hole via a liquid supply section inside the rectifier plate (middle cup). However, the structure of the middle cup may become complicated.

[0011] The present invention was made in view of this situation, and its object is to provide a substrate processing apparatus capable of suppressing the accumulation of coating liquid on the upper surface of a cup.

[0012] Solution for solving the problem

[0013] To achieve this objective, the present invention employs the following structure. Specifically, the substrate processing apparatus of the present invention for applying a coating liquid to a substrate comprises: a substrate holding portion that holds the substrate in a horizontal position; a rotation mechanism that rotates the substrate holding portion about a vertical axis passing through the center of the substrate held by the substrate holding portion; a coating liquid nozzle that sprays the coating liquid onto the upper surface of the substrate held by the substrate holding portion; a solvent dispersion mechanism that cooperates with the rotation mechanism to disperse the solvent outward in the direction of the rotation radius of the substrate holding portion; and a cup that collects the dispersed solvent, the cup comprising: an upper cup configured to surround the substrate. The substrate is held on the side by a retaining part; a lower cup is an annular container disposed below the upper cup, and a draining area and an venting area are divided within the container; and a middle cup is arranged annularly between the upper cup and the lower cup such that it covers the venting area of ​​the lower cup. The middle cup is inclined downward from its outer peripheral end toward its inner peripheral end, and is able to receive the coating liquid and the solvent flowing down along the inner surface of the upper cup on the outer peripheral end side, so that the received coating liquid and the solvent flow down to the inner peripheral end side and are guided toward the draining area of ​​the lower cup.

[0014] According to the substrate processing apparatus of the present invention, the middle cup is inclined downward from its outer peripheral end toward its inner peripheral end, and can receive the coating liquid and solvent flowing down along the inner surface of the upper cup on the outer peripheral end side of the middle cup. Furthermore, the received coating liquid and solvent are directed downward towards the inner peripheral end side and guided to the drainage area of ​​the lower cup. Thus, the solvent received from the inner side of the upper cup can flow from the outer peripheral end to the inner peripheral end of the middle cup across approximately the entire upper surface of the middle cup. Therefore, drying of the coating liquid adhering to the upper surface of the middle cup can be suppressed, and the coating liquid and solvent flow along the inclination of the middle cup. This prevents coating liquid from accumulating on the upper surface of the middle cup. As a result, the maintenance cycle (e.g., the cup replacement cycle) can be extended. Additionally, since the middle cup covers the area above the venting region, the flow of coating liquid and solvent into the vent pipe can be suppressed.

[0015] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the outer peripheral end of the middle cup is connected to the inner surface of the upper cup. Since the outer peripheral end of the middle cup is connected to the inner surface of the upper cup, it is possible to allow all the solvent flowing down along the inner surface of the upper cup to flow to the upper surface of the middle cup as a whole.

[0016] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that a gap is formed between the inner peripheral end of the middle cup and the inner peripheral wall of the lower cup. This gap between the inner peripheral end of the middle cup and the inner peripheral wall of the lower cup allows the coating liquid and solvent to be guided to the drainage area, and also allows gas to be guided to the exhaust area.

[0017] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the gap is located below the outer peripheral end of the substrate. Gas flows relatively vertically downwards from near the outer peripheral end of the substrate into the gap between the inner peripheral end of the middle cup and the inner peripheral wall of the lower cup, thus allowing, for example, the smooth flow of gas containing the coating liquid mist.

[0018] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the middle cup hangs vertically downward from the front end of its inner circumferential end, thereby forming a downwardly extending gap between it and the inner circumferential wall of the lower cup. By extending the gap downward between the inner circumferential end of the middle cup and the inner circumferential wall of the lower cup, turbulence in the airflow passing through this gap can be suppressed.

[0019] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the solvent dispersing mechanism includes a first solvent nozzle that sprays the solvent onto the substrate held by the substrate holding portion, and that the rotating mechanism is configured to rotate the substrate held by the substrate holding portion around the vertical axis, thereby causing the solvent sprayed onto the substrate to disperse toward the inner side of the upper cup.

[0020] Whenever the substrate is treated with solvent sprayed from the first solvent nozzle (e.g., at least one of pre-wetting treatment and back rinsing treatment), the solvent can flow over substantially the entire upper surface of the middle cup.

[0021] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the solvent dispersing mechanism comprises: a cup cleaning clamp formed in the shape of a circular plate; and a first solvent nozzle that sprays the solvent onto the cup cleaning clamp held by the substrate holding portion, and the rotating mechanism is configured to rotate the cup cleaning clamp held by the substrate holding portion about the vertical axis, thereby causing the solvent sprayed onto the cup cleaning clamp to disperse toward the inner side of the upper cup.

[0022] The middle cup slopes downwards from its outer peripheral end toward its inner peripheral end. For example, sometimes a cup cleaning fixture held by a substrate holding part and a first solvent nozzle are used to supply solvent to the upper surface of the middle cup. In this case, if the solvent is dispersed to the inner side of the upper cup, the solvent can flow over almost the entire upper surface of the middle cup. Therefore, it is easy to supply solvent to the upper surface of the middle cup.

[0023] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the solvent scattering mechanism includes: a cup cleaning clamp disposed inside the upper cup and below the substrate holding portion; and a second solvent nozzle that supplies the solvent to the cup cleaning clamp, and the rotation mechanism is configured to rotate the cup cleaning clamp about the vertical axis, thereby causing the solvent supplied to the cup cleaning clamp to scatter toward the inner side of the upper cup.

[0024] The middle cup slopes downwards from its outer peripheral end toward its inner peripheral end. For example, sometimes a cup cleaning clamp and a second solvent nozzle disposed below the substrate holding portion are used to supply solvent to the upper surface of the middle cup. In this case, if the solvent is dispersed to the inner side of the upper cup, the solvent can flow over approximately the entire upper surface of the middle cup. Therefore, it is easy to supply solvent to the upper surface of the middle cup.

[0025] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the lower cup includes: a bottom wall; an exhaust pipe disposed on the bottom wall in the exhaust region; and a drain pipe disposed on the bottom wall in the drain region, the drain pipe being positioned on the outer periphery side of the exhaust pipe.

[0026] For example, the lower cup can be of the same shape as the lower cup of the developing apparatus used for developing. Since a shared component (lower cup) can be used, the cost of the substrate processing apparatus can be reduced.

[0027] Furthermore, in the substrate processing apparatus, it is preferable that the upper cup has an upper opening disposed in the upper and central portion of the upper cup, the outer peripheral end of the middle cup is connected to the inner surface of the upper cup, and the lower cup has: a bottom wall; an exhaust pipe disposed in the bottom wall in the exhaust area; a drain pipe disposed in the bottom wall in the drain area; and an inner peripheral wall extending upward from the bottom wall in a cylindrical shape. The exhaust pipe is configured to discharge gas that flows into the upper opening of the upper cup and passes between the inner peripheral end of the middle cup and the inner peripheral wall of the lower cup.

[0028] The middle cup slopes downwards from its outer circumference towards its inner circumference. The outer circumference of the middle cup connects to the inner surface of the upper cup. Furthermore, the upper opening is positioned at the center of the upper cup. Therefore, gas flowing in from the upper opening does not circumvent, but easily flows towards the space between the inner circumference of the middle cup and the inner wall of the lower cup. That is, gas flowing in from the upper opening is less likely to flow through the inner side of the upper cup towards the front end of the middle cup. Consequently, the coating liquid and solvent adhering to the upper surface of the middle cup do not easily dry. Therefore, the coating liquid adhering to the upper surface of the middle cup can flow easily.

[0029] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the cup includes an inner cup extending cylindrically upward from the upper end of the inner peripheral wall of the lower cup toward the lower surface of the substrate held by the substrate holding portion. The inner cup includes: an inner cup body formed in a cylindrical shape; and a rectifier formed in an annular shape at the upper end portion of the inner cup body, the outer peripheral end of the rectifier protruding outward from the outer peripheral end of the substrate held by the substrate holding portion.

[0030] Gas flowing in from the upper opening does not meander and tends to flow towards the space between the inner circumferential end of the middle cup and the inner circumferential wall of the lower cup. For example, when the outer circumferential end of the substrate held by the substrate holding part protrudes further outward than the outer circumferential end of the rectifying member, the flow of gas flowing in from the upper opening affects the outer circumferential end of the substrate. As a result, the drying condition of the coating liquid near the outer circumferential end of the substrate changes, and the thickness of the coating film near the outer circumferential end of the substrate may change. According to the present invention, the outer circumferential end of the rectifying member protrudes further outward than the outer circumferential end of the substrate held by the substrate holding part. As a result, the flow of gas flowing in from the upper opening deviates outward from the outer circumferential end of the substrate. As a result, changes in the drying condition of the coating liquid near the outer circumferential end of the substrate can be suppressed, thereby suppressing changes in the thickness of the coating film near the outer circumferential end of the substrate.

[0031] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the upper cup comprises: a cylindrical outer peripheral wall; and a top wall that extends from the upper part of the outer peripheral wall toward the inward direction toward the vertical axis and is formed in an annular shape, the top wall being formed in an annular shape in the inner peripheral portion and having a downwardly protruding trapping portion, the trapping portion having a trapping surface formed on its outer peripheral side.

[0032] The trapping surface extends vertically and is formed in a cylindrical shape. Therefore, it is possible to easily trap at least one of the coating liquid and solvent toward the substrate held by the substrate holding part along the inner surface of the outer peripheral wall and the inner surface of the top wall of the upper cup.

[0033] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the position of the cup is fixed so that it does not rise or fall relative to the substrate holding portion. For example, when the cups (upper cup, middle cup, and lower cup) are configured to rise or fall, the substrate processing apparatus may become larger. According to the present invention, it is possible to suppress the large size of the substrate processing apparatus and to construct the substrate processing apparatus more compactly.

[0034] Furthermore, preferably, the aforementioned substrate processing apparatus further comprises: at least three support pins arranged around the vertical axis to support the substrate, the at least three support pins being disposed on the outer periphery of the substrate holding portion and the inner periphery of the upper cup; and a support pin lifting mechanism that causes the at least three support pins to rise and fall, the upper cup having an upper opening disposed on the upper portion and the center portion of the upper cup, the support pin lifting mechanism being configured to cause the substrate to rise and fall between a holding position on the upper surface of the substrate holding portion and a junction position higher than the upper end of the upper cup via the upper opening.

[0035] Therefore, the substrate can be placed on the upper surface of the substrate holding part housed in the upper cup through the upper opening of the upper cup, and the substrate on the upper surface of the substrate holding part can be removed from the upper cup through the upper opening of the upper cup.

[0036] Invention Effects

[0037] According to the substrate processing apparatus of the present invention, it is possible to suppress the accumulation of coating liquid on the upper surface of the cup. Attached Figure Description

[0038] Although several preferred embodiments have been illustrated for the purpose of illustrating the invention, it should be understood that the invention is not limited to the structures and countermeasures shown in the illustrations.

[0039] Figure 1 This is a longitudinal sectional view of the substrate processing apparatus of Embodiment 1.

[0040] Figure 2 It is Figure 1 An enlarged longitudinal sectional view of the right side of the cup shown.

[0041] Figure 3 This is a top view of the lower cup.

[0042] Figure 4 It is a top view that mainly shows the upper cup, inner cup, and base plate.

[0043] Figure 5 This is a side view showing the substrate lifting mechanism.

[0044] Figure 6 It is a block diagram representing the structure of the control.

[0045] Figure 7 This is a flowchart illustrating an example of the operation of a substrate processing apparatus.

[0046] Figure 8 This is a magnified longitudinal sectional view of the cup to illustrate the flow of the solvent.

[0047] Figure 9 This is a magnified longitudinal sectional view of the cup to illustrate the spread of the coating liquid.

[0048] Figure 10 This is a magnified longitudinal sectional view of the cup to illustrate the flow of gas.

[0049] Figure 11 This is a longitudinal sectional view used to illustrate the problem of the outer peripheral end of the substrate protruding more than the outer peripheral end of the rectifier component of the inner cup.

[0050] Figure 12 This is a longitudinal sectional view used to illustrate the effect when the outer peripheral end of the rectifier component of the inner cup protrudes beyond the outer peripheral end of the substrate.

[0051] Figure 13 This is a magnified longitudinal sectional view of the cup in Example 2.

[0052] Figure 14 This is a longitudinal sectional view of the substrate processing apparatus of Embodiment 3.

[0053] Figure 15 This is a flowchart illustrating an example of the operation of the substrate processing apparatus in Embodiment 3.

[0054] Figure 16 This is a longitudinal sectional view of the substrate processing apparatus of Embodiment 4.

[0055] Figure 17 It is a magnified longitudinal sectional view of a portion of the cup in the modified example. Detailed Implementation

[0056] The embodiments of the present invention will be described below.

[0057] [Example 1]

[0058] Hereinafter, Embodiment 1 of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a longitudinal sectional view of the substrate processing apparatus 1 of Embodiment 1. Figure 2 It is Figure 1 The image shows an enlarged longitudinal sectional view of the right portion of cup 41. Furthermore, in this embodiment, the horizontal direction is orthogonal to the vertical direction Z.

[0059] <1. Basic Structure of Substrate Processing Device>

[0060] Reference Figure 1 The substrate processing apparatus 1 applies a coating liquid to the substrate W. The substrate processing apparatus 1 includes a rotary chuck 2, a rotation mechanism 3, and a support plate 5. The substrate W is formed, for example, in a circular plate shape.

[0061] A rotary chuck 2 holds the substrate W in a horizontal position. The rotary chuck 2 is, for example, a vacuum chuck. The vacuum chuck is configured to hold the center portion of the lower surface of the substrate W by vacuum suction from a pump. When the rotary chuck 2 is a vacuum chuck, the diameter of the upper surface 2A (holding surface) of the rotary chuck 2 is smaller than the diameter of the substrate W. Furthermore, the rotary chuck 2 is not limited to a vacuum chuck; for example, it can also be a mechanical chuck. A mechanical chuck has a circular rotating base and at least three holding pins disposed on the upper surface of the rotating base. The mechanical chuck uses at least three holding pins to hold the side of the horizontally positioned substrate W.

[0062] The rotating mechanism 3 rotates the rotary chuck 2 about a vertical axis AX1. The vertical axis AX1 passes through the center of the base plate W held by the rotary chuck 2. The rotating mechanism 3 includes a rotating shaft 7 and an electric motor 9. The upper end of the rotating shaft 7 is fixed to the lower end of the rotary chuck 2. The rotating shaft 7 extends vertically downward from the rotary chuck 2. The output rotating shaft of the electric motor 9 is connected to the lower part of the rotating shaft 7. The electric motor 9 rotates the rotary chuck 2 about the vertical axis AX1 via the rotating shaft 7.

[0063] The support plate 5 is formed in the shape of a circular plate. It is positioned between the rotary chuck 2 and the rotating mechanism 3 in the vertical direction Z. A through hole 5A is provided in the central part of the support plate 5, through which the rotating shaft 7 passes. Additionally, three pin through holes 5B are provided in the support plate 5, through which the three support pins 83 (described later) pass respectively. The support plate 5 is fixed. That is, the support plate 5 does not rotate like the rotary chuck 2, and neither moves horizontally nor rises or falls.

[0064] <1-1. Processing Fluid Supply Mechanism>

[0065] The substrate processing apparatus 1 includes a coating liquid supply mechanism 11, a first solvent supply mechanism 13, and a second solvent supply mechanism 15. For coating processing, the coating liquid supply mechanism 11 supplies coating liquid to the upper surface of the substrate W. The first solvent supply mechanism 13 supplies solvent to the upper surface of the substrate W for pre-wetting processing. Then, the second solvent supply mechanism 15 supplies solvent to the lower surface of the substrate W for back-side rinsing processing.

[0066] The coating liquid supply mechanism 11 includes a coating liquid nozzle 21, a coating liquid piping 23, a switching valve V1, and a first pump (not shown). The coating liquid nozzle 21 sprays coating liquid onto the upper surface of the substrate W held by the rotating chuck 2. For example, a photoresist liquid is used as the coating liquid. Alternatively, the coating liquid can be a liquid other than a photoresist liquid (e.g., a liquid used to form films such as anti-reflective films). Furthermore, the viscosity of the coating liquid can be high or low.

[0067] The coating fluid nozzle 21 is moved to any position, such as the spray position, above the center of the substrate W held by the rotating chuck 2, via a nozzle moving mechanism (not shown). One end of the coating fluid pipe 23 is connected to the coating fluid nozzle 21. The other end of the coating fluid pipe 23 is connected to the coating fluid supply source 25. A switching valve V1 and a first pump are provided on the coating fluid pipe 23. The first pump delivers coating fluid from the coating fluid supply source 25 to the coating fluid nozzle 21 through the coating fluid pipe 23. The switching valve V1 selectively supplies and stops the supply of coating fluid.

[0068] The first solvent supply mechanism 13 includes a solvent nozzle 27, a solvent piping 29, a switching valve V2, and a second pump (not shown). The solvent nozzle 27 sprays solvent onto the upper surface of the substrate W held by the rotating chuck 2. The solvent (organic solvent) used is, for example, a diluent, PGMEA (propylene glycol monomethyl ether acetate), NMP (N-methyl-2-pyrrolidone), or cyclopentanone.

[0069] The solvent nozzle 27 is moved to any position, such as an ejection position, above the center of the substrate W held by the rotary chuck 2, via a nozzle moving mechanism (not shown). One end of the solvent nozzle 27 is connected to a solvent piping 29. The other end of the solvent piping 29 is connected to a first solvent supply source 31. A switching valve V2 and a second pump are provided on the solvent piping 29. The second pump delivers solvent from the first solvent supply source 31 to the solvent nozzle 27 via the solvent piping 29. The switching valve V2 selectively supplies and stops the solvent supply.

[0070] The second solvent supply mechanism 15 includes two solvent nozzles 33, a solvent piping 35, a switching valve V3, and a third pump (not shown). The two solvent nozzles 33 spray solvent onto the lower surface of the substrate W held by the rotating chuck 2. The two solvent nozzles 33 are disposed on the upper surface of the support plate 5. The two solvent nozzles 33 are disposed below the substrate W held by the rotating chuck 2.

[0071] Solvent piping 35 is connected to each of the two solvent nozzles 33. The base of the solvent piping 35 is connected to a second solvent supply source 37. A switching valve V3 and a third pump are located on the solvent piping 35. The third pump delivers solvent from the second solvent supply source 37 to each solvent nozzle 33 through the solvent piping 35. The switching valve V3 selectively supplies and stops the solvent supply. Furthermore, the number of solvent nozzles 33 must be at least one.

[0072] <1-2 cups>

[0073] The substrate processing apparatus 1 includes a cup 41. The cup 41 houses a rotary chuck 2 and a substrate W held by the rotary chuck 2. The cup 41 recovers coating liquid and solvent that spills from the substrate W held by the rotary chuck 2. Figure 1 As shown, the cup 41 is mounted on the outer periphery of the support plate 5. Therefore, the cup 41 does not rotate like the rotating chuck 2, and it neither moves horizontally nor rises or falls. That is, the cup 41 is fixed in position relative to the rotating chuck 2 without rising or falling.

[0074] Reference Figure 1 , Figure 2 The cup 41 comprises an upper cup 43, a middle cup 45, a lower cup 46, and an inner cup 48. The upper cup 43 is arranged to surround the side of the base plate W held by the rotating chuck 2. The upper cup 43 is formed in a cylindrical shape. The central axis of the cylindrical upper cup 43 extending in the vertical direction Z coincides with the vertical axis AX1. The upper part of the upper cup 43 extends inward to the inner circumference, that is, inward toward the vertical axis AX1. Furthermore, the upper cup 43, the middle cup 45, the lower cup 46, and the inner cup 48 are formed in a concentric circle when viewed from above.

[0075] <1-2-1. Cup>

[0076] The upper cup 43 includes an outer peripheral wall 51, a top wall 53 (with a trapping portion 55), and an upper opening 57. The upper opening 57 is located in the upper part and center of the upper cup 43. The upper opening 57 is formed from the inner peripheral end of the trapping portion 55. The upper opening 57 is sized to allow a horizontally positioned substrate W to pass through. The outer peripheral wall 51 is cylindrical. The outer peripheral wall 51 has a side surface 51A (side surface) on its inner side. The side surface 51A extends cylindrically in the vertical direction Z.

[0077] The top wall 53 extends inward toward the vertical axis AX1 from the upper part of the outer peripheral wall 51 and forms a ring. Specifically, the top wall 53 extends obliquely upward toward the inward direction from the upper part of the outer peripheral wall 51 and forms a ring. The top wall 53 has a liquid receiving surface 53A (side surface) on the inner side of the top wall 53. The liquid receiving surface 53A is the surface that receives liquid splashed from the substrate W held by the rotating chuck 2.

[0078] The liquid receiving surface 53A is formed as the side surface of a frustum. In other words, the liquid receiving surface 53A extends obliquely upward from the upper part of the side surface 51A of the outer peripheral wall 51 toward the vertical axis AX1 and is formed in a cylindrical shape. Therefore, the liquid receiving surface 53A faces inward and obliquely downward. In addition, the liquid receiving surface 53A is formed to intersect with an imaginary line VT (or imaginary surface) extending outward in the radial direction from the outer peripheral end of the substrate W held by the rotating chuck 2. The imaginary line VT extends in the horizontal direction.

[0079] This allows liquid splashed from the substrate W held by the rotating chuck 2 to bounce downwards. Therefore, it prevents the liquid splashed from the substrate W from rebounding onto the liquid receiving surface 53A and re-adhering to the substrate W.

[0080] The trapping section 55 prevents at least one of the coating liquid and solvent mist that has splashed from the substrate W held by the rotary chuck 2 from re-adhering to the substrate W held by the rotary chuck 2. The trapping section 55 is formed in a ring shape on the inner peripheral portion of the top wall 53 and protrudes downward from the inner surface (liquid receiving surface 53A) of the top wall 53. The trapping section 55 has a trapping surface 55A formed on its outer peripheral side. That is, the trapping section 55 has a trapping surface 55A that extends in the vertical direction Z and is formed in a cylindrical shape. The trapping surface 55A is the surface on the outer peripheral wall 51 side of the trapping section 55. The trapping surface 55A faces the outer peripheral wall 51 when viewed from above.

[0081] The lower end of the collecting section 55 is positioned higher than the imaginary line VT, so that the coating liquid and solvent flying from the substrate W held by the rotating chuck 2 can come into contact with the liquid receiving surface 53A. Figure 2 In the middle, the lower end of the collecting section 55 is also the lower end of the collecting surface 55A.

[0082] Furthermore, the side surface 51A, the liquid receiving surface 53A, and the collecting surface 55A are configured as follows. Figure 2 As shown, the upper portion of the trapping surface 55A is connected to the upper portion of the liquid receiving surface 53A. Furthermore, the lower portion of the liquid receiving surface 53A is connected to the upper portion of the side surface 51A. Moreover, as described above, the trapping surface 55A is formed to extend in a cylindrical shape along the vertical direction Z. Therefore, the trapping surface 55A can more effectively trap mist flowing from the side surface 51A along the liquid receiving surface 53A as indicated by arrow AR1. As a result, it is possible to prevent liquid from re-adhering to the substrate W held by the rotating chuck 2.

[0083] In this embodiment, the top wall 53 has a liquid-receiving surface 53A. However, the top wall 53 may also not have a liquid-receiving surface 53A. In this case, the outer peripheral wall 51 may have both a side surface 51A and a liquid-receiving surface 53A. Furthermore, the outer peripheral wall 51 and the top wall 53 may share the liquid-receiving surface 53A.

[0084] <1-2-2. Medium Cup>

[0085] First, the general outline of the middle cup 45 is described. The middle cup 45 is arranged in a ring shape between the upper cup 43 and the lower cup 46, covering the venting area GA of the lower cup 46. The middle cup 45 covers the venting area GA when viewed from above. The middle cup 45 slopes downward from its outer peripheral end toward its inner peripheral end. The middle cup 45 is capable of receiving coating liquid and solvent flowing down along the inner surface of the upper cup 43 (e.g., the liquid receiving surface 53A and the side surface 51A) on the outer peripheral end side. The middle cup 45 allows the received coating liquid and solvent to flow down towards the inner peripheral end side of the middle cup 45 and be guided to the drainage area LA of the lower cup 46.

[0086] Next, the middle cup 45 will be described in detail. The outer periphery of the middle cup 45 is connected to the inner surface (e.g., side surface 51A) of the upper cup 43. In other words, the middle cup 45 is disposed on the side wall of the upper cup 43. Figure 2 In the middle, the middle cup 45 is set on the outer peripheral wall 51 of the upper cup 43.

[0087] The middle cup 45 is formed in a ring shape. The middle cup 45 slopes downwards from its outer peripheral wall 51 toward the vertical axis AX1 and the rotation axis 7. Furthermore, no hole is provided at the base portion on the outer peripheral wall 51 side of the middle cup 45, extending from the upper surface 59A to the lower surface of the middle cup 45. Thus, the middle cup 45 allows all coating liquid and solvents that have splashed from the substrate W held by the rotating chuck 2 to flow in the direction from the outer peripheral wall 51 toward the vertical axis AX1 (arrow AR2). Furthermore, the middle cup 45 is positioned in a more... Figure 2 The hypothetical line VT is shown at a low position. This prevents the liquid received by the upper surface 59A of the middle cup 45 from bouncing back upwards, and the bouncing liquid from re-adhering to the substrate W.

[0088] The middle cup 45 comprises a middle cup body 59, a middle component 60, and a front end component 61. The base end of the middle cup body 59 is located on the outer peripheral wall 51. The middle cup body 59 extends obliquely downward toward the vertical axis AX1 and forms a ring shape. Figure 2 As shown, the angle AG1 of the middle cup body 59 relative to the horizontal direction is, for example, 20 degrees.

[0089] An intermediate component 60 is disposed at the front end of the middle cup body 59. The intermediate component 60 extends obliquely downward toward the vertical axis AX1 and is formed into a cylindrical shape. The angle of the intermediate component 60 relative to the horizontal direction is greater than the angle AG1 (e.g., 20 degrees) and less than 90 degrees of the angle of the middle cup body 59. A front end component 61 is disposed at the front end of the intermediate component 60. The front end component 61 is formed into a cylindrical shape extending along the vertical direction Z. Alternatively, the intermediate component 60 may be omitted, and the front end component 61 may be disposed directly at the front end of the middle cup body 59. Furthermore, the structure of the middle cup 45 related to the lower cup 46 will be described later.

[0090] <1-2-3.Place a cup>

[0091] The lower cup 46 is located below the upper cup 43. The lower cup 46 is an annular container with a bottom wall 67. The lower cup 46 collects the coating liquid and solvent flowing down from the middle cup 45. The lower cup 46 has a drainage area LA and an venting area GA. The lower cup 46 has the drainage area LA and the venting area GA divided within its container.

[0092] The lower cup 46 has an outer peripheral wall 63, an inner peripheral wall 65, a bottom wall 67, two vent pipes 69, and a drain pipe 71. In addition, there must be at least one vent pipe 69 and one drain pipe 71.

[0093] The outer peripheral wall 63 and the inner peripheral wall 65 are cylindrical. The outer peripheral wall 63 extends vertically upward from the outer peripheral end of the bottom wall 67. The upper end of the outer peripheral wall 63 is connected to or adjacent to the lower end of the outer peripheral wall 51 of the upper cup 43. The inner peripheral wall 65 is horizontally disposed between the rotating chuck 2 and the outer peripheral wall 63. The inner peripheral wall 65 extends vertically upward from the inner peripheral end of the bottom wall 67. The bottom wall 67 is annular, connecting the lower part of the outer peripheral wall 63 to the lower part of the inner peripheral wall 65. The bottom wall 67 slopes downward from the inner peripheral wall 65 toward the outer peripheral wall 63. Therefore, the coating liquid and solvent flowing down to the bottom surface 67A (upper surface) on the inner side of the bottom wall 67 flow in the direction from the inner peripheral wall 65 toward the outer peripheral wall 63 (arrow AR3).

[0094] Two exhaust pipes 69 and a drain pipe 71 are respectively disposed on the bottom wall 67. Specifically, the two exhaust pipes 69 are disposed on the bottom wall 67 in the exhaust area GA. In this embodiment, as... Figure 3 As shown, the exhaust region GA is the area provided with two exhaust pipes 69. Additionally, in this embodiment, the drainage region LA is the area outside the exhaust region GA, which is surrounded by the outer peripheral wall 63 and the inner peripheral wall 65 and has two exhaust pipes 69.

[0095] like Figure 2 , Figure 3As shown, two vent pipes 69 are respectively positioned approximately at the center of the outer peripheral wall 63 and the inner peripheral wall 65 of the lower cup 46. The two vent pipes 69 are arranged at equal intervals (180-degree intervals) around the rotating chuck 2 and the vertical axis AX1. The drain pipe 71 is formed, for example, in a tubular shape. The drain pipe 71 is connected to the factory's draining equipment.

[0096] The drain pipe 71 is disposed on the outer periphery of the two exhaust pipes 69. Specifically, the central axis AX2 of the drain pipe 71 extending in the vertical direction Z is disposed on the outer periphery side compared to the central axis AX3 extending in the vertical direction Z of each exhaust pipe 69. In other words, as Figure 3 As shown, the radius RA2 between the vertical axis AX1 and the central axis AX2 is longer than the radius RA3 between the vertical axis AX1 and the central axis AX3. By configuring the two exhaust pipes 69 and the drain pipe 71 in this way, the lower cup 46 can use a component with the same shape as the lower cup of the developing apparatus used for developing. Since a shared component (lower cup) can be used, the cost of the substrate processing apparatus 1 can be reduced.

[0097] like Figure 2 As shown, the upper end of each vent pipe 69 is positioned higher than the bottom surface 67A and lower than the middle cup body 59. This suppresses the flow of coating liquid and solvent down to the bottom surface 67A into each vent pipe 69. Furthermore, the upper end of each vent pipe 69 is preferably positioned higher than the lower end of the front end member 61 of the middle cup 45. This further suppresses the flow of coating liquid and solvent into each vent pipe 69.

[0098] The lower ends of the two exhaust pipes 69 are each connected to a single exhaust box 73. The exhaust box 73 is, for example, U-shaped when viewed from above. The exhaust box 73 is connected to the factory's exhaust equipment (e.g., equipped with a pump) to exhaust gas at a preset flow rate. Therefore, the gas inside the cup 41 is drawn in through the two exhaust pipes 69. That is, the two exhaust pipes 69 are configured to discharge gas that flows in from the upper opening 57 of the upper cup 43 and passes between the inner circumferential end of the middle cup 45 and the inner circumferential wall 65 of the lower cup 46.

[0099] Here, the structure of the middle cup 45 related to the lower cup 46 is described. The base of the middle cup 45 is provided on the outer peripheral wall 63 of the lower cup 46 (and the outer peripheral wall 51 of the upper cup 43). Furthermore, the middle cup 45 is formed to cover the two exhaust pipes 69 and extend obliquely downward toward the vertical axis AX1. Therefore, the middle cup 45 is housed within the lower cup 46.

[0100] A flow path RR1 for the flow of coating liquid, solvent, and gas is formed between the front end component 61 of the middle cup 45 and the inner peripheral wall 65. In other words, a gap (flow path RR1) is formed between the inner peripheral end of the middle cup 45 and the inner peripheral wall 65 of the lower cup 46. The gap between the inner peripheral end of the middle cup 45 and the inner peripheral wall 65 of the lower cup 46 can guide the coating liquid and solvent to the drainage area LA, and can guide the gas to the exhaust area GA.

[0101] Furthermore, the gap (flow path RR1) is located below the outer peripheral end of the substrate W. Gas flows from near the outer peripheral end of the substrate W into the gap between the inner peripheral end of the middle cup 45 and the inner peripheral wall 65 of the lower cup 46 in a relatively vertical direction, thus enabling, for example, the smooth flow of gas containing the coating liquid mist.

[0102] The front end component 61 of the middle cup 45 extends vertically downward along the inner peripheral wall 65 of the lower cup 46, which will be described later. In other words, the middle cup 45 hangs vertically downward from the front end of its inner peripheral end, thereby forming a downwardly extending gap (flow path RR1) between itself and the inner peripheral wall 65 of the lower cup 46. By extending downward through this gap between the inner peripheral end of the middle cup 45 and the inner peripheral wall 65 of the lower cup, turbulence in the airflow passing through this gap can be suppressed.

[0103] A flow path RR2 is formed between the front end component 61 and the bottom wall 67 to allow the coating liquid, solvent, and gas to flow. Furthermore, the front end component 61 is positioned horizontally in a position closer to the inner circumference than the center between the outer peripheral wall 63 and the inner peripheral wall 65 of the lower cup 46. This reduces the spacing of the flow path RR1, increasing the gas velocity (m / s) passing through it. Moreover, the front end component 61 is positioned horizontally in a position closer to the inner circumference than the inner circumference ends of the two exhaust pipes 69. This allows the middle cup 45 to further cover the top of the two exhaust pipes 69, thereby preventing the coating liquid and solvent from flowing into each exhaust pipe 69.

[0104] <1-2-4. Inner Cup>

[0105] The inner cup 48 extends vertically upward from the upper end of the inner peripheral wall 65 of the lower cup 46 toward the lower surface of the substrate W held by the rotary chuck 2 in a cylindrical shape. The upper end of the inner cup 48 is located near the lower surface of the substrate W held by the rotary chuck 2. A flow path RR3 is formed between the upper end of the inner cup 48 and the lower surface of the substrate W held by the rotary chuck 2. During back-side rinsing, the solvent flowing on the lower surface of the substrate W passes through the flow path RR3.

[0106] The inner cup 48 is formed in a cylindrical shape. The inner cup 48 includes an inner cup body 75 and a flow straightening component 76. The inner cup body 75 is formed in a cylindrical shape. The inner cup body 75 has an outer peripheral surface 75A on the outer side of the inner cup body 75. The flow straightening component 76 is formed in an annular shape at the upper end of the inner cup body 75.

[0107] Furthermore, the outer peripheral end EG of the rectifier 76 protrudes further outward than the outer peripheral surface 75A. As a result, the rectifier 76 (e.g., the lower surface 76A of the outer peripheral portion of the rectifier 76) inhibits the adhesion of coating liquid and solvent to the lower surface of the substrate W held by the rotating chuck 2.

[0108] In addition, such as Figure 2 As shown, the outer peripheral end EG of the preferred rectifier 76 protrudes further outward than the outer peripheral end of the substrate W held by the rotating chuck 2. That is, as Figure 4 As shown, the rectifier 76 is configured such that the diameter DM1 of the outer peripheral end EG of the rectifier 76 (i.e., the inner cup 48) is larger than the diameter DM2 of the substrate W held by the rotating chuck 2 (diameter DM1 > diameter DM2). In addition, the diameter DM1 of the outer peripheral end EG of the rectifier 76 is preferably smaller than the diameter DM3 of the upper opening 57 (diameter DM3 > diameter DM1).

[0109] <1-3. Substrate Lifting Mechanism>

[0110] In this embodiment, the cup 41 of the substrate processing apparatus 1 does not move in the vertical direction Z relative to the rotating chuck 2. That is, the cup 41 (e.g., the upper cup 43 and the middle cup 45) is fixed in a position without moving up or down relative to the rotating chuck 2. Therefore, the substrate processing apparatus 1 of this embodiment is equipped with a substrate lifting mechanism 81 for lifting the substrate W in order to transfer the substrate W. Figure 1 , Figure 5 As shown, the substrate lifting mechanism 81 includes at least three (e.g., three) support pins 83, a base component 85, and a lifting mechanism 87.

[0111] Three support pins 83 support the base plate W. The base plate W is mounted on the three front ends of the three support pins 83. At least three support pins 83 are arranged at equal angular intervals (e.g., 120-degree intervals) around the vertical axis AX1. The three support pins 83 are arranged horizontally on the outer periphery of the rotating chuck 2 and on the inner periphery of the upper cup 43 and the inner cup 48. The three support pins 83 are mounted on the upper surface of the base component 85. The base component 85 is formed in a C-shape or annular shape when viewed from above.

[0112] The lifting mechanism 87 raises and lowers the three support pins 83 of the supporting base plate W via the base member 85. Furthermore, the lifting mechanism 87 raises and lowers the three support pins 83 between a standby position H1, a holding position H2, and a transition position H3. The transition position H3 is higher than the holding position H2, and the holding position H2 is higher than the standby position H1 (transition position H3 > holding position H2 > standby position H1). Therefore, the lifting mechanism 87 raises and lowers the base plate W between the holding position H2 on the upper surface of the rotating chuck 2 and the transition position H3, which is higher than the upper end of the upper cup 43, via the upper opening 57. The lifting mechanism 87 includes, for example, two pulleys 87A and 87B, a belt 87C, a slider 87D, and an electric motor 87E.

[0113] Two pulleys 87A and 87B are arranged vertically in the Z direction. A belt 87C is wound around the two pulleys 87A and 87B. A slider 87D is fixed to the belt 87C, and a base component 85 is mounted on the slider 87D. The output shaft of an electric motor 87E is connected to, for example, pulley 87A. If the electric motor 87E causes the output shaft to rotate clockwise, the three support pins 83, the base component 85, and the slider 87D rise. Conversely, when the electric motor 87E causes the output shaft to rotate counterclockwise, the three support pins 83, etc., fall. Alternatively, instead of these structures, the lifting mechanism 87 may also include a cylinder or an actuator with an electric motor and a lead screw.

[0114] According to the substrate lifting mechanism 81, the substrate W can be placed on the upper surface of the rotating chuck 2 housed in the upper cup 43 through the upper opening 57 of the upper cup 43. In addition, the substrate W on the upper surface of the rotating chuck 2 can be removed from the upper cup 43 through the upper opening 57 of the upper cup 43.

[0115] <1-4. Solvent Dispersion Mechanism>

[0116] The substrate processing apparatus 1 includes a solvent dispersing mechanism 91. The solvent dispersing mechanism 91 cooperates with the rotation mechanism 3 to disperse the solvent outwards in the direction of the rotation radius of the rotary chuck 2. In other words, the solvent dispersing mechanism 91 cooperates with the rotation mechanism 3 to disperse the solvent onto the inner side surface (e.g., the liquid receiving surface 53A) of the upper cup 43. Furthermore, the solvent dispersing mechanism 91 can also disperse the solvent onto the side surface 51A of the outer peripheral wall 51. In this embodiment, the solvent dispersing mechanism 91 includes at least one of two solvent nozzles 27 and 33. Additionally, the solvent dispersing mechanism 91 may also include a substrate W held by the rotary chuck 2.

[0117] For example, solvent nozzle 27 sprays solvent onto the upper surface of the substrate W held by the rotating chuck 2. Additionally, the rotating mechanism 3 rotates the substrate W held by the rotating chuck 2 about the vertical axis AX1. As a result, the solvent sprayed onto the upper surface of the substrate W is dispersed onto the liquid receiving surface 53A inside the upper cup 43.

[0118] Additionally, solvent nozzle 33 sprays solvent onto the lower surface of the substrate W held by the rotating chuck 2. Furthermore, the rotating mechanism 3 rotates the substrate W held by the rotating chuck 2 around the vertical axis AX1. As a result, the solvent sprayed onto the lower surface of the substrate W is dispersed onto the liquid receiving surface 53A inside the upper cup 43.

[0119] <1-5. Structures related to control>

[0120] Reference Figure 6 The substrate processing apparatus 1 includes a controller 93 and a memory 95. The controller 93 controls various structures of the substrate processing apparatus 1. For example, the controller 93 controls the rotation mechanism 3, three switching valves V1, V2, and V3, and the substrate lifting mechanism 81. The controller 93 may include one or more processors, such as a central processing unit (CPU). The memory 95 is also referred to as a storage medium. The memory 95 may include at least one of ROM (Read-Only Memory), RAM (Random-Access Memory), and a hard disk. The memory 95 stores the computer programs and parameters required to control the various structures of the substrate processing apparatus 1. The controller 93 reads necessary information (e.g., parameters) from the memory 95.

[0121] The rotating chuck 2 corresponds to the chuck and substrate holding part of the present invention, respectively. The solvent nozzle 27 and the solvent nozzle 33 correspond to the first solvent nozzle of the present invention, respectively. At least one of the side surface 51A and the liquid receiving surface 53A corresponds to the inner side surface of the present invention. The lifting mechanism 87 corresponds to the support pin lifting mechanism of the present invention.

[0122] <2. Operation of the substrate processing apparatus>

[0123] Next, refer to Figure 7 The flowchart below explains the operation of the substrate processing apparatus 1. First, a substrate transport robot (not shown) moves the hand of the substrate W, which is held horizontally, above the rotating chuck 2.

[0124] [Step S01] Holding the substrate

[0125] Subsequently, the lifting mechanism 87 of the substrate lifting mechanism 81 raises the three support pins 83 from the standby position H1 to the handover position H3. As a result, the three support pins 83 lift the substrate W from the hand of the substrate transport robot. That is, the three support pins 83 receive the substrate W from the substrate transport robot. Then, the substrate transport robot moves its hand, which is not holding the substrate W, above the rotary chuck 2.

[0126] Then, the lifting mechanism 87 lowers the three support pins 83 supporting the horizontally positioned substrate W from the handover position H3 to the standby position H1. During this descent, in the holding position H2, the substrate W is placed on the upper surface of the rotary chuck 2, and the three support pins 83 move away from the lower surface of the substrate W. Afterward, the rotary chuck 2 holds the horizontally positioned substrate W by vacuum suction.

[0127] [Step S02] Pre-humidification treatment

[0128] The pre-wetting treatment is performed in step S03 of the coating process to facilitate the application of the spreading coating liquid to the upper surface of the substrate W. Figure 1 The solvent nozzle 27 shown is moved above the center of the substrate W held by the rotating chuck 2 via a nozzle moving mechanism (not shown).

[0129] Subsequently, the controller 93 sprays solvent from the solvent nozzle 27 onto the upper surface of the substrate W held by the rotating chuck 2 by opening the switching valve V2. Furthermore, the controller 93 controls the rotation mechanism 3 to rotate the substrate W held by the rotating chuck 2 around the vertical axis AX1 at a preset rotational speed (rpm). As a result, the solvent sprayed onto the upper surface of the substrate W is spread and coated across the entire upper surface of the substrate W by the rotation of the substrate W. That is, a liquid film of solvent is formed on the upper surface of the substrate W.

[0130] Furthermore, excess solvent on the upper surface of substrate W is dispersed from substrate W due to the centrifugal force generated by the rotation of substrate W. For example... Figure 8 As shown, the solvent is dispersed from the rotating substrate W in a generally horizontal direction. The solvent dispersed in a generally horizontal direction hits the liquid receiving surface 53A of the upper cup 43 and flows down to the base end of the middle cup 45, that is, the upper surface 59A of the middle cup 45 on the outer peripheral end side. Thereafter, the solvent flows from the outer peripheral end side of the middle cup 45 toward the front end member 61 on the upper surface 59A of the middle cup 45.

[0131] Here, the middle cup 45 is disposed on the outer peripheral wall 51 of the upper cup 43, and is formed to extend obliquely downward from the outer peripheral wall 51 toward the vertical axis AX1. Therefore, the solvent can flow from the outer peripheral end side of the middle cup 45 toward the front end member 61. Therefore, whenever the substrate W is pre-wetted, the solvent can flow substantially throughout the upper surface 59A of the middle cup 45. As a result, the drying of the coating liquid adhering to the upper surface 59A of the middle cup 45 can be suppressed, and the coating liquid can be easily rinsed into the lower cup 46.

[0132] Then, the solvent flows down from the upper surface 59A of the middle cup 45 to the bottom surface 67A of the lower cup 46 through the flow path RR1 between the inner peripheral wall 65 of the lower cup 46 and the front end component 61. Afterward, the solvent is discharged from the bottom surface 67A to the drain pipe 71.

[0133] After a predetermined amount of solvent is ejected from the solvent nozzle 27, the switch valve V2 is closed, thereby stopping the ejection of solvent from the solvent nozzle 27. Then, the rotation mechanism 3 stops the rotation of the substrate W held by the rotary chuck 2. In this respect, the rotation mechanism 3 can also cause the substrate W to continue rotating at a predetermined speed.

[0134] [Step S03] Coating treatment

[0135] After the pre-wetting treatment of substrate W (step S02) is completed, for example, a nozzle moving mechanism (not shown) moves the coating liquid nozzle 21 to above the center of substrate W held by the rotary chuck 2. By opening the switch valve V1, the coating liquid nozzle 21 sprays coating liquid onto the upper surface of substrate W held by the rotary chuck 2. Additionally, the rotation mechanism 3 rotates substrate W held by the rotary chuck 2 around the vertical axis AX1 at a predetermined rotational speed. Thus, while replacing the liquid film of solvent formed on the upper surface of substrate W with coating liquid, the coating liquid sprayed onto the upper surface of substrate W is spread to the entire upper surface of substrate W by the rotation of substrate W. That is, a coating liquid film is formed on the upper surface of substrate W.

[0136] Furthermore, excess coating liquid on the upper surface of substrate W is dispersed from substrate W by the rotation of substrate W. Figure 9 In the initial stages of coating, for example, when the rotational speed of the substrate W is relatively low, the coating liquid spreads from the substrate W in a parabolic trajectory. Therefore, the coating liquid spreads to and adheres to the upper surface 59A of the middle cup 45. Conversely, when the rotational speed of the substrate W is relatively high, the coating liquid spreads from the substrate W in a generally horizontal direction. Furthermore, during coating liquid flow, the coating liquid flows towards the drain pipe 71 in the same direction as the solvent.

[0137] After a predetermined amount of coating liquid is sprayed from the coating liquid nozzle 21, the switch valve V1 is closed, thereby stopping the spraying of coating liquid from the coating liquid nozzle 21. Then, the rotation mechanism 3 stops the rotation of the substrate W held by the rotary chuck 2. In this regard, the rotation mechanism 3 can also cause the substrate W to continue rotating at a predetermined speed.

[0138] [Step S04] Backside rinsing treatment

[0139] The back-side rinsing process is a process of cleaning the lower surface of the substrate W to prevent the coating liquid adhering to the lower surface of the substrate W from being transferred to, for example, the hand of a substrate transport robot (not shown). Figure 1 The solvent nozzle 33 shown is positioned below the substrate W held by the rotating chuck 2.

[0140] After the coating process on substrate W (step S03) is completed, the rotating mechanism 3 rotates substrate W, held by the rotating chuck 2, around the vertical axis AX1 at a preset rotational speed. Then, by opening the switching valve V3, solvent is sprayed from the solvent nozzle 33 onto the lower surface of the rotating substrate W held by the rotating chuck 2. As a result, the solvent sprayed onto the lower surface of substrate W spreads in a ring shape on the lower surface of substrate W due to the centrifugal force generated by the rotation of substrate W.

[0141] Additionally, the solvent applied to the lower surface of substrate W is dispersed from substrate W due to the rotation of substrate W. Similar to the pre-wetting process, the solvent disperses from the rotating substrate W in a generally horizontal direction (see reference). Figure 8 The solvent, which is dispersed in a generally horizontal direction, comes into contact with the liquid receiving surface 53A of the upper cup 43 and flows down to the base end of the middle cup 45, that is, the upper surface 59A of the middle cup 45 on the outer peripheral side. Then, in the same manner as the pre-wetting treatment, it flows to the drain pipe 71.

[0142] Therefore, whenever the substrate W is backwashed, the solvent can flow substantially across the entire upper surface 59A of the middle cup 45. As a result, the drying of the coating liquid adhering to the upper surface 59A of the middle cup 45 can be suppressed, and the coating liquid can be easily rinsed into the lower cup 46.

[0143] After a predetermined amount of solvent is ejected from the solvent nozzle 33, the switch valve V3 is closed, thereby stopping the ejection of solvent from the solvent nozzle 33. Then, the rotation mechanism 3 rotates the substrate W at a predetermined speed, thereby drying the substrate W. Then, the rotation mechanism 3 stops the rotation of the substrate W held by the rotary chuck 2. In addition, the coating liquid nozzle 21 and the solvent nozzle 27 are moved to a standby position outside the cup 41 when viewed from above by a nozzle moving mechanism (not shown).

[0144] [Step S05] Release the holding of the substrate

[0145] Then, the rotary chuck 2 releases the substrate W from its holding position. Afterwards, the lifting mechanism 87 of the substrate lifting mechanism 81 raises the three support pins 83 from the standby position H1 to the handover position H3. At this time, the three support pins 83 receive the substrate W, which has undergone coating or similar processing, from the rotary chuck 2 in the holding position H2.

[0146] Then, the substrate transport robot (not shown) moves its hand under the substrate W held by three support pins 83. Then, the lifting mechanism 87 lowers the three support pins 83 from the handover position H3 to the standby position H1. Thus, the substrate transport robot's hand receives the substrate W from the three support pins 83. The substrate transport robot then transports the substrate W to its next destination.

[0147] According to this embodiment, the middle cup 45 is inclined downwards from its outer peripheral end toward its inner peripheral end, allowing it to receive the coating liquid and solvent flowing down along the inner surface of the upper cup 43 on the outer peripheral end side. Furthermore, the received coating liquid and solvent flow down towards the inner peripheral end side and are guided to the drainage area LA of the lower cup 46. This allows the solvent received by the inner side of the upper cup 43 to flow from the outer peripheral end to the inner peripheral end of the middle cup 45 across approximately the entire upper surface of the middle cup 45. Therefore, drying of the coating liquid adhering to the upper surface of the middle cup 45 can be suppressed, and the coating liquid and solvent can flow along the inclination of the middle cup 45. This also prevents coating liquid from accumulating on the upper surface of the middle cup 45. As a result, the maintenance cycle (e.g., the cup replacement cycle) can be extended.

[0148] In addition, since the middle cup 45 covers the area above the exhaust region GA, it can suppress the flow of coating liquid and solvent into the exhaust pipe 69.

[0149] In addition, whenever the substrate W is treated with solvent sprayed from solvent nozzles 27 and 33 (at least one of pre-wetting treatment and back rinsing treatment), solvent can be supplied to approximately the entire upper surface 59A of the middle cup 45.

[0150] Furthermore, since the outer periphery of the middle cup 45 is connected to the inner surface of the upper cup 43, all the solvent flowing down the inner surface of the upper cup 43 can flow to the upper surface 59A of the middle cup 45 as a whole.

[0151] Additionally, the upper surface 59A of the middle cup 45 receives the coating liquid that splashes from the substrate W when a liquid film is formed on the upper surface of the substrate W. Conversely, the solvent can be allowed to flow substantially throughout the upper surface 59A of the middle cup 45.

[0152] Furthermore, the middle cup 45 slopes downwards from its outer peripheral end toward its inner peripheral end. The outer peripheral end of the middle cup 45 is connected to the inner surface of the upper cup 43. Additionally, the upper opening 57 is located in the center of the upper cup 43. Thus, as... Figure 10 As indicated by arrow AR5, the gas flowing in from the upper opening 57 flows vertically downwards between the inner circumferential end (front end component 61) of the middle cup 45 and the inner circumferential wall 65 of the lower cup 46. That is, as... Figure 10 As indicated by the dashed arrow AR6, the gas flowing in from the upper opening 57 has difficulty flowing through the inner side 51A of the upper cup 43 to the space between the inner circumferential end of the middle cup 45 and the inner circumferential wall 65 of the lower cup 46. Therefore, the coating liquid and solvent adhering to the upper surface 59A of the middle cup 45 are difficult to dry. Thus, the coating liquid adhering to the upper surface 59A of the middle cup 45 can flow easily.

[0153] In addition, such as Figure 10As indicated by arrow AR5, the gas flowing in from the upper opening 57 does not circumvent, but instead flows relatively vertically downwards between the inner circumferential end (front end component 61) of the middle cup 45 and the inner circumferential wall 65 of the lower cup 46. For example, as... Figure 11 As shown, when the outer peripheral end of the substrate W held by the rotating chuck 2 protrudes further outward than the outer peripheral end EG of the rectifier 76, the flow of gas flowing in from the upper opening 57 becomes turbulent at the outer peripheral end of the substrate W, affecting this end. Consequently, the drying of the coating liquid near the outer peripheral end of the substrate W changes, and the thickness of the coating film near the outer peripheral end of the substrate W may change. According to this embodiment, as... Figure 12 As shown, the outer peripheral end EG of the rectifier 76 protrudes beyond the outer peripheral end of the substrate W held by the rotating chuck 2. Consequently, the flow of gas entering from the upper opening 57 is deflected outward from the outer peripheral end of the substrate W. As a result, variations in the drying of the coating liquid near the outer peripheral end of the substrate W can be suppressed, thereby suppressing variations in the thickness of the coating film near the outer peripheral end of the substrate W.

[0154] Furthermore, the capturing surface 55A extends along the vertical direction Z and is formed into a cylindrical shape. Therefore, it is possible to easily capture at least one of the coating liquid and solvent toward the substrate W held by the rotating chuck 2 along the inner surface (side surface 51A) of the outer peripheral wall 51 of the upper cup 43 and the inner surface (liquid receiving surface 53A).

[0155] Furthermore, the cups 41 (upper cup 43, middle cup 45, lower cup 46, and inner cup 48) are fixed in position without moving up or down relative to the rotating chuck 2. For example, if the cups 41 were configured to move up or down, the substrate processing apparatus 1 could potentially become larger. According to this embodiment, the large size of the substrate processing apparatus 1 can be suppressed, and the substrate processing apparatus 1 can be configured to be more compact.

[0156] [Example 2]

[0157] Next, Embodiment 2 of the present invention will be described with reference to the accompanying drawings. Furthermore, descriptions common to Embodiment 1 will be omitted. Figure 13 This is a longitudinal sectional view of cup 41 in Embodiment 2.

[0158] In Embodiment 1, each exhaust pipe 69 is disposed approximately at the center of the outer peripheral wall 63 and the inner peripheral wall 65 of the lower cup 46, and the drain pipe 71 is disposed on the outer peripheral side of each exhaust pipe 69. In Embodiment 2, in this respect, each exhaust pipe 69 may be disposed on the outer peripheral wall 63 side, and the drain pipe 71 may be disposed on the inner peripheral wall 65 side.

[0159] Reference Figure 13 Cup 41 has a lower cup 101. Lower cup 101 and... Figure 2The lower cup 46 shown is similarly positioned below the upper cup 43 and is an annular container with a bottom wall 67. In addition to the outer peripheral wall 63, inner peripheral wall 65, bottom wall 67, vent pipe 69, and drain pipe 71, the lower cup 101 also has a partition wall 103.

[0160] The partition wall 103 extends upward from the bottom wall 67 and is cylindrical. The partition wall 103 is positioned horizontally approximately at the center of the outer peripheral wall 63 and the inner peripheral wall 65. Furthermore, the partition wall 103 is positioned between the outer peripheral wall 63 and the front end member 61 of the middle cup 45. In other words, the front end member 61 of the middle cup 45 is positioned between the partition wall 103 and the inner peripheral wall 65. A flow path RR4 is formed between the upper end of the partition wall 103 and the middle cup 45 (i.e., the middle cup body 59) to allow the discharged gas to pass through.

[0161] Additionally, a drainage region LA is formed on the inner circumferential side of the partition wall 103. The drainage region LA is the area between the inner circumferential wall 65 of the lower cup 101 and the partition wall 103. A drainage pipe 71 is provided on the bottom wall 67 of the drainage region LA on the inner circumferential side of the partition wall 103. Conversely, an venting region GA is formed on the outer circumferential side of the partition wall 103. The venting region GA is the area between the partition wall 103 and the outer circumferential wall 63 of the lower cup 101. A venting pipe 69 is provided on the bottom wall 67 of the venting region GA on the outer circumferential side of the partition wall 103. The partition wall 103 separates liquids (coating liquid and solvent) from gases.

[0162] This embodiment also has the same effect as Embodiment 1. Furthermore, in the lower cup 101, the drain pipe 71 is disposed on the inner circumferential side of the partition wall 103. That is, the drain pipe 71 is positioned relatively close to the front end component 61 of the middle cup 45. Therefore, as... Figure 2 As shown, the coating solution will not flow along the bottom surface 67A of the inner side of the bottom wall 67 of the lower cup 46 to the outer peripheral end of the lower cup 46. Therefore, the coating solution can flow to the drain pipe 71 relatively quickly.

[0163] [Example 3]

[0164] Next, Embodiment 3 of the present invention will be described with reference to the accompanying drawings. Furthermore, descriptions common to Embodiments 1 and 2 will be omitted. Figure 14 This is a longitudinal sectional view of the substrate processing apparatus 1 of Embodiment 3. Figure 15 This is a flowchart illustrating an example of the operation of the substrate processing apparatus 1 in Embodiment 3.

[0165] In Embodiment 1, the solvent spraying mechanism 91 includes, for example, a solvent nozzle 27 that sprays solvent onto the upper surface of the substrate W held by the rotary chuck 2. Here, the substrate W in Embodiment 1 is a manufacturing substrate used for manufacturing semiconductors, etc. In Embodiment 3, the solvent spraying mechanism 107 may also include a cup cleaning fixture JG1 and a solvent nozzle 27 that sprays solvent onto the cup cleaning fixture JG1 held by the rotary chuck 2.

[0166] Reference Figure 14 The substrate processing apparatus 1 includes a solvent scattering mechanism 107. The solvent scattering mechanism 107 includes a cup cleaning fixture JG1 and a solvent nozzle 27. The cup cleaning fixture JG1 is a fixture used for cleaning the inner surface of the cup 41, and is not a substrate for manufacturing. The cup cleaning fixture JG1 is formed in the shape of a circular plate and is held by a rotating chuck 2. The cup cleaning fixture JG1 may also be a dummy substrate formed of silicon, for example. The cup cleaning fixture is also referred to as a cup cleaning tray.

[0167] Solvent nozzle 27 sprays solvent onto the upper surface of the cup cleaning fixture JG1 held by the rotary chuck 2. Rotation mechanism 3 rotates the cup cleaning fixture JG1 held by the rotary chuck 2 about the vertical axis AX1. As a result, the solvent sprayed onto the cup cleaning fixture JG1 disperses onto the inner side of the upper cup 43.

[0168] Next, refer to Figure 15 The flowchart illustrates the cup cleaning process in step S14.

[0169] In steps S01 to S05, the substrate W (manufacturing substrate) undergoes coating treatment, etc. Furthermore, Figure 15 Steps S01 to S05 shown are Figure 7 Steps S01 to S05 shown are the same, so their descriptions are omitted.

[0170] [Step S11] Should the cup be cleaned?

[0171] Information regarding whether to clean cup 41 is stored in memory 95 beforehand. For example, the controller 93 determines to perform cup cleaning when a predetermined number of substrates W have undergone coating treatment. Alternatively, the controller 93 may also determine to perform cup cleaning when a predetermined time has elapsed since the last cup cleaning.

[0172] If the controller 93 decides to perform cup cleaning, proceed to step S13. If the controller 93 decides not to perform cup cleaning, proceed to steps S01 to S05 for the next substrate W.

[0173] [Step S13] Holding the cup cleaning clamp

[0174] A substrate transport robot (not shown) moves the hand holding the cup cleaning fixture JG1 above the rotary chuck 2. Then, the lifting mechanism 87 of the substrate lifting mechanism 81 raises the three support pins 83 from the standby position H1 to the handover position H3. Thus, the three support pins 83 receive the substrate W from the substrate transport robot. Then, the substrate transport robot moves the hand not holding the substrate W above the rotary chuck 2.

[0175] Subsequently, the lifting mechanism 87 lowers the three support pins 83 from the junction position H3 to the standby position H1, thereby placing the cup cleaning fixture JG1 on the upper surface 2A of the rotary chuck 2. The rotary chuck 2 then holds the cup cleaning fixture JG1.

[0176] [Step S14] Cup cleaning process

[0177] The rotating mechanism 3 causes the cup cleaning fixture JG1, held by the rotating chuck 2, to rotate around the vertical axis AX1 at a preset speed. Additionally, by opening the switching valve V2, solvent is sprayed from the solvent nozzle 27 onto the upper surface of the cup cleaning fixture JG1 held by the rotating chuck 2. As a result, the solvent reaching the upper surface of the cup cleaning fixture JG1 diffuses on the upper surface of the cup cleaning fixture JG1 and is dispersed from the outer periphery of the cup cleaning fixture JG1 by centrifugal force.

[0178] Solvent, for example, is dispersed in a generally horizontal direction from the rotating cup cleaning fixture JG1. The dispersed solvent comes into contact with the liquid receiving surface 53A of the upper cup 43 and flows down to the base end of the middle cup 45, i.e., the outer peripheral end side, on the upper surface 59A of the middle cup 45. Therefore, the solvent can flow almost entirely on the upper surface 59A of the middle cup 45. As a result, the coating liquid adhering to the upper surface 59A of the middle cup 45 can be easily rinsed into the lower cup 46.

[0179] After a preset time, solvent is stopped from being ejected from solvent nozzle 27 by closing switch valve V2. Then, rotating mechanism 3 rotates cup cleaning fixture JG1 at a preset speed, thereby drying cup cleaning fixture JG1. Afterwards, rotating mechanism 3 stops the rotation of cup cleaning fixture JG1 held by rotating chuck 2.

[0180] [Step S15] Release the holding of the cup cleaning clamp.

[0181] Then, the rotary chuck 2 releases the cup cleaning fixture JG1 from its holding position. Next, the lifting mechanism 87 of the substrate lifting mechanism 81 raises the three support pins 83 from the standby position H1 to the handover position H3. Thus, the three support pins 83 receive the cup cleaning fixture JG1 from the rotary chuck 2.

[0182] Next, the substrate transport robot (not shown) moves its hand below the cup cleaning fixture JG1, which is supported by three support pins 83. The lifting mechanism 87 lowers the three support pins 83 from the handover position H3 to the standby position H1. Thus, the substrate transport robot's hand receives the cup cleaning fixture JG1 from the three support pins 83. Then, the substrate transport robot transports the cup cleaning fixture JG1 from a position above the rotary chuck 2.

[0183] According to this embodiment, it has the same effect as in Embodiment 1. Furthermore, the middle cup 45 slopes downwards from its outer peripheral end toward its inner peripheral end. For example, sometimes a cup cleaning clamp JG1 held by a rotating chuck 2 and a solvent nozzle 27 are used to supply solvent to the upper surface 59A of the middle cup 45. In this case, if the solvent is dispersed to the inner side of the upper cup 43, the solvent can flow substantially throughout the upper surface 59A of the middle cup 45. Therefore, it is easy to supply solvent to the upper surface 59A of the middle cup 45.

[0184] [Example 4]

[0185] Next, Embodiment 4 of the present invention will be described with reference to the accompanying drawings. Furthermore, descriptions common to Embodiments 1 through 3 will be omitted. Figure 16 This is a longitudinal sectional view of the substrate processing apparatus 1 of Embodiment 4.

[0186] In embodiment 3, the cup cleaning clamp JG1 is a component held by the rotary chuck 2 and is capable of conveying. Regarding this, in embodiment 4, the cup cleaning clamp JG2 can also be disposed inside the cup 41.

[0187] Reference Figure 16 The solvent dispersing mechanism 109 of Example 4 has a cup cleaning clamp JG2 and two solvent nozzles 111. The cup cleaning clamp JG2 is disposed inside the cup 41 (e.g., the upper cup 43) and below the rotating chuck 2. Furthermore, the cup cleaning clamp JG2 is disposed between the rotating chuck 2 and the support plate 5 in the vertical direction Z. The cup cleaning clamp JG2 is fixed, for example, to the rotating shaft 7. Thus, the cup cleaning clamp JG2 can rotate about the vertical axis AX1 via the rotating mechanism 3. Furthermore, the cup cleaning clamp JG2 can also be mounted and detached relative to the rotating shaft 7.

[0188] The cup cleaning fixture JG2 has a single storage section 113 and multiple spray nozzles 115. The single storage section 113 is located on the lower surface of the cup cleaning fixture JG2. The single storage section 113 receives and stores solvent sprayed from two solvent nozzles 111. The single storage section 113 communicates with the multiple spray nozzles 115. The multiple spray nozzles 115 are located on the side of the cup cleaning fixture JG2. The multiple spray nozzles 115 spray the solvent stored in the single storage section 113 into the cup 41 by rotating the cup cleaning fixture JG2.

[0189] The substrate processing apparatus 1 includes a third solvent supply mechanism 117. In addition to two solvent nozzles 111, the third solvent supply mechanism 117 also includes a solvent piping 119, a switching valve V4, and a fourth pump (not shown). The two solvent nozzles 111 spray (supply) solvent into the cup cleaning fixture JG2. The two solvent nozzles 111 are disposed on the upper surface of the support plate 5. The two solvent nozzles 111 are disposed below the cup cleaning fixture JG2. Furthermore, the two solvent nozzles 111 can also be disposed separately from the two solvent nozzles 33 used in the backwashing process.

[0190] Solvent piping 119 is connected to each of the two solvent nozzles 111. The base of the solvent piping 119 is connected to a third solvent supply source 121. A switching valve V4 and a fourth pump are located on the solvent piping 119. The fourth pump delivers solvent from the third solvent supply source 121 to each solvent nozzle 111 through the solvent piping 119. The switching valve V4 selectively supplies and stops the solvent supply. Furthermore, the number of solvent nozzles 111 is at least one.

[0191] The substrate processing apparatus 1 includes a cup lifting mechanism 123. The cup lifting mechanism 123 moves the cup 41 and support plate 5, etc., up and down between the lower cup cleaning position H11 and the substrate processing position H12. The cup lifting mechanism 123 includes an actuator or cylinder with an electric motor. The actuator may have a belt, like the lifting mechanism 87, or it may have a lead screw.

[0192] The rotating mechanism 3 causes the cup cleaning fixture JG2 to rotate about the vertical axis AX1. As a result, the solvent sprayed onto the cup cleaning fixture JG2 disperses to the inner side of the upward-facing cup 43. Additionally, Figure 6 The controller 93 shown controls the switching valve V4 and the cup lifting mechanism 123. Furthermore, in this embodiment, the substrate W can also be fed to the rotary chuck 2 when the cup 41 is in the cup cleaning position H11. In this embodiment, the substrate processing apparatus 1 may not include the substrate lifting mechanism 81.

[0193] Reference Figure 15 The flowchart below briefly illustrates the operation of the substrate processing apparatus 1 in Embodiment 4. In Embodiment 4, no... Figure 15 Steps S13 and S15 are shown. Detailed explanations of steps S01 to S05 and step S11 are omitted.

[0194] After coating the substrate W (manufacturing substrate) in steps S01 to S05, the controller 93 determines to clean the cup 41. Therefore, the substrate processing apparatus 1 performs cup cleaning. Furthermore, the cup 41 is lowered from the substrate processing position H12 to the cup cleaning position H11 by the cup lifting mechanism 123. Therefore, the plurality of spray outlets 115 of the cup cleaning fixture JG2 are opposite to the liquid receiving surface 53A of the upper cup 43.

[0195] [Step S14] Cup cleaning process

[0196] The rotating mechanism 3 rotates the cup cleaning fixture JG2 around the vertical axis AX1 at a preset rotational speed. Additionally, by opening the switch valve V4, solvent is sprayed from the solvent nozzle 111 into the storage section 113 located on the lower surface of the cup cleaning fixture JG2. Thus, the centrifugal force generated by the rotation of the cup cleaning fixture JG2 causes the solvent sprayed into the storage section 113 to disperse from multiple nozzles 115.

[0197] Solvent, for example, is dispersed in a generally horizontal direction from multiple nozzles 115 of the rotating cup cleaning fixture JG2. The dispersed solvent comes into contact with the liquid receiving surface 53A of the upper cup 43 and flows down to the base end of the middle cup 45, i.e., the outer peripheral end side, on the upper surface 59A of the middle cup 45. Therefore, the solvent can flow substantially throughout the upper surface 59A of the middle cup 45. As a result, the coating liquid adhering to the upper surface 59A of the middle cup 45 can be easily rinsed into the lower cup 46.

[0198] After a preset time, the solvent is stopped from being ejected from the solvent nozzle 111 by closing the switch valve V4. Then, the rotating mechanism 3 rotates the cup cleaning fixture JG2 at a preset speed, thereby drying the cup cleaning fixture JG2. Afterwards, the rotating mechanism 3 stops the rotation of the cup cleaning fixture JG2.

[0199] According to this embodiment, it has the same effect as in Embodiment 1. Furthermore, the middle cup 45 slopes downwards from its outer peripheral end toward its inner peripheral end. For example, sometimes a cup cleaning fixture JG2 disposed below the rotating chuck 2 and a solvent nozzle 111 are used to supply solvent to the upper surface 59A of the middle cup 45. In this case, if the solvent is dispersed to the inner side of the upper cup 43, the solvent can flow substantially throughout the upper surface 59A of the middle cup 45. Therefore, it is easy to supply solvent to the upper surface 59A of the middle cup 45.

[0200] Furthermore, the solvent nozzle 111 corresponds to the second solvent nozzle of the present invention. Additionally, in this embodiment, the cup cleaning fixture JG2 has a single storage section 113 and multiple nozzle outlets 115. In this regard, the cup cleaning fixture JG2 can also be a dummy substrate.

[0201] The present invention is not limited to the above embodiments, and can be implemented in variations as described below.

[0202] (1) In the above embodiment, the liquid receiving surface 53A is formed in a cylindrical shape, inclined upwards and inwards from the upper end portion of the side surface 51A of the outer peripheral wall 51. In this respect, the liquid receiving surface 53A may also be formed to extend in the vertical direction Z.

[0203] (2) In the above-described embodiments and variations (1), the trapping surface 55A is formed to extend in a cylindrical shape along the vertical direction Z. In this respect, the trapping surface 55A can also be formed in a cylindrical shape extending obliquely downward toward the vertical axis AX1. In this case, the trapping surface 55A faces outward and obliquely downward. Furthermore, when the trapping surface 55A extends along the vertical direction Z, it is easier to trap fog. Also, "outward" is the opposite of "inward".

[0204] (3) In the above embodiments and modifications, the outer peripheral end of the middle cup 45 is connected to the inner surface of the upper cup 43. Regarding this, as... Figure 17 As shown, the outer peripheral end of the middle cup 45 may not be connected to the inner surface of the upper cup 43, depending on the circumstances. That is, the middle cup 45 may also be configured to be away from the outer peripheral wall 51 of the upper cup 43 and the outer peripheral wall 63 of the lower cup 46. For example, an annular vent hole 131 may be formed between the outer peripheral end of the middle cup 45 and the outer peripheral wall 51 of the upper cup 43.

[0205] This invention may be practiced in other specific forms without departing from its idea or essence; therefore, the scope of the invention should be indicated by reference to the appended claims rather than the foregoing description.

[0206] Symbol Explanation

[0207] 1—Substrate processing apparatus; 2—Rotating chuck; 3—Rotating mechanism; 21—Coating liquid nozzle; 27—Solvent nozzle; 33—Solvent nozzle; 43—Upper cup; 45—Middle cup; 46, 101—Lower cup; 48—Inner cup; 51—Outer peripheral wall; 51A—Side side; 53—Top wall; 53A—Liquid receiving surface; 55—Collecting part; 55A—Collecting surface; 57—Upper opening; 59A—Upper surface; 61—Front end component ; 65—Inner peripheral wall; 67—Bottom wall; 69—Exhaust port; 71—Drain pipe; 75—Inner cup body; 76—Rectifying component; 83—Support pin; 87—Lifting mechanism; 91, 107, 109—Solvent scattering mechanism; 93—Controller; 95—Memory; JG1, JG2—Cup cleaning fixture; 111—Solvent nozzle; AX1—Vertical axis; H2—Holding position; H3—Transfer position; Z—Vertical direction.

Claims

1. A substrate processing apparatus, which applies a coating liquid to a substrate, characterized in that, have: A substrate holding portion that holds the substrate in a horizontal position; A rotating mechanism that causes the substrate holding portion to rotate about a vertical axis that passes through the center of the substrate held by the substrate holding portion; A coating liquid nozzle sprays the coating liquid onto the upper surface of the substrate held by the substrate holding portion; A solvent dispersion mechanism, which cooperates with the rotation mechanism, disperses the solvent outward in the direction of the rotation radius of the substrate holding portion; and A cup that recovers the spilled solvent. The cup has: The upper cup is configured to surround the sides of the substrate held by the substrate holding portion; The lower cup is a ring-shaped container located below the upper cup, and the container is divided into a drain area and an vent area. as well as The middle cup is arranged in a ring between the upper cup and the lower cup, covering the venting area of ​​the lower cup. The middle cup tilts downward from its outer peripheral end toward its inner peripheral end, so as to receive the coating liquid and the solvent flowing down along the inner surface of the upper cup on the outer peripheral end side, and to guide the received coating liquid and the solvent down to the inner peripheral end side and toward the drainage area of ​​the lower cup.

2. The substrate processing apparatus according to claim 1, characterized in that, The outer periphery of the middle cup is connected to the inner surface of the upper cup.

3. The substrate processing apparatus according to claim 1 or 2, characterized in that, A gap is formed between the inner circumferential end of the middle cup and the inner circumferential wall of the lower cup.

4. The substrate processing apparatus according to claim 3, characterized in that, The gap is located below the outer peripheral end of the substrate.

5. The substrate processing apparatus according to claim 3, characterized in that, The middle cup hangs vertically downward from the front end of the inner circumferential end of the middle cup, thereby forming the downwardly extending gap between it and the inner circumferential wall of the lower cup.

6. The substrate processing apparatus according to claim 1 or 2, characterized in that, The solvent spraying mechanism includes a first solvent nozzle that sprays the solvent onto the substrate held by the substrate holding portion. The rotating mechanism is configured to rotate the substrate held by the substrate holding portion about the vertical axis, thereby causing the solvent sprayed onto the substrate to scatter toward the inner side of the upper cup.

7. The substrate processing apparatus according to claim 1 or 2, characterized in that, The solvent dispersion mechanism comprises: A cup cleaning fixture, which is formed in the shape of a circular plate; and A first solvent nozzle sprays the solvent into the cup cleaning fixture held by the substrate holding portion. The rotating mechanism is configured to rotate the cup cleaning fixture held by the substrate holding portion about the vertical axis, thereby causing the solvent sprayed onto the cup cleaning fixture to scatter towards the inner side of the upper cup.

8. The substrate processing apparatus according to claim 1 or 2, characterized in that, The solvent dispersion mechanism comprises: A cup cleaning clamp, disposed inside the upper cup and below the substrate holding portion; and A second solvent nozzle supplies the solvent to the cup cleaning fixture. The rotating mechanism is configured to rotate the cup cleaning fixture about the vertical axis, thereby causing the solvent supplied to the cup cleaning fixture to scatter towards the inner side of the upper cup.

9. The substrate processing apparatus according to claim 1 or 2, characterized in that, The lower cup has the following features: bottom wall; An exhaust pipe disposed on the bottom wall of the exhaust area; and A drain pipe is disposed on the bottom wall of the drain area. The drain pipe is positioned on the outer periphery side of the exhaust pipe.

10. The substrate processing apparatus according to claim 1, characterized in that, The upper cup has an upper opening, which is located in the upper part and center of the upper cup. The outer peripheral end of the middle cup is connected to the inner surface of the upper cup. The lower cup has the following features: bottom wall; An exhaust pipe is disposed on the bottom wall of the exhaust area; A drain pipe, disposed on the bottom wall of the drain area; and The inner peripheral wall extends upward in a cylindrical shape from the bottom wall. The exhaust pipe is configured to discharge gas that flows in from the upper opening of the upper cup and passes between the inner circumferential end of the middle cup and the inner circumferential wall of the lower cup.

11. The substrate processing apparatus according to claim 10, characterized in that, The cup includes an inner cup that extends cylindrically upward from the upper end of the inner peripheral wall of the lower cup toward the lower surface of the substrate held by the substrate holding portion. The inner cup has: The inner cup body is cylindrical in shape; and The rectifier component is formed in a ring shape at the upper end of the inner cup body. The outer peripheral end of the rectifier component protrudes outward from the outer peripheral end of the substrate held by the substrate holding portion.

12. The substrate processing apparatus according to claim 1 or 2, characterized in that, The upper cup has the following features: The cylindrical outer peripheral wall; and The top wall extends from the upper part of the outer peripheral wall inward toward the vertical axis and forms a ring. The top wall is formed in a ring shape on its inner circumference and has a downwardly protruding trapping portion. The trapping section has a trapping surface formed on its outer periphery.

13. The substrate processing apparatus according to claim 1 or 2, characterized in that, The position of the cup is fixed so that it does not rise or fall relative to the substrate holding part.

14. The substrate processing apparatus according to claim 13, characterized in that, It also has: At least three support pins supporting the substrate are arranged around the vertical axis, and the at least three support pins are disposed on the outer peripheral side of the substrate holding portion and the inner peripheral side of the upper cup. as well as A support pin lifting mechanism that raises and lowers the at least three support pins. The upper cup has an upper opening, which is located in the upper part and center of the upper cup. The support pin lifting mechanism is configured to move the substrate between a holding position on the upper surface of the substrate holding portion and a junction position higher than the upper end of the upper cup via the upper opening.

Images