Substrate processing apparatus and control method for substrate processing apparatus

Abstract

This invention relates to a substrate processing apparatus and a control method for the substrate processing apparatus. As a pre-filtration operation, during the period from the opening of the first intermediate valve to the opening of the second intermediate valve, while the first intermediate valve is open and the inlet valve, outlet valve, and second intermediate valve are closed, the controller of the substrate processing apparatus causes the filling pump to adjust the pressure of the processing liquid within the filling pump so that the pressure value measured by the filling pressure sensor becomes the second supply pressure. After the first intermediate valve is opened, while the first intermediate valve is open and the inlet valve, outlet valve, and second intermediate valve are closed, the ejection pump causes the ejection pump to adjust the pressure of the processing liquid within the ejection pump so that the pressure value measured by the ejection pressure sensor becomes the third supply pressure.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus for processing substrates and a method for controlling the substrate processing apparatus. Examples of substrates include semiconductor substrates, substrates for FPDs (Flat Panel Displays), glass substrates for photomasks, substrates for optical discs, substrates for magnetic disks, ceramic substrates, and substrates for solar cells. Examples of FPDs include liquid crystal display devices and organic EL (electroluminescence) display devices. Background Technology

[0002] Conventional substrate processing apparatus includes: a nozzle, piping connected to the nozzle, an upstream pump, a filter, and a downstream pump respectively disposed on the piping (for example, see Japanese Patent Application Publication No. 2019-044619). The filter is disposed between the upstream pump and the downstream pump. The upstream pump and the downstream pump are disposed close to each other.

[0003] In Japan, Japanese Patent Application Publication No. 2022-138462 discloses a configuration where the downstream pump and the upstream pump are arranged separately. That is, the upstream pump is located near the liquid treatment bottle, while the downstream pump is separate from the upstream pump and located within the liquid treatment unit.

[0004] In Japan, Japanese Patent Application Publication No. 2007-005576 discloses a substrate processing system comprising: a pressurizing unit that pressurizes a bottle to deliver a processing liquid; a pump that internally stores the processing liquid pressurized by the pressurizing unit; and multiple modules stacked together. The pump is disposed next to each of the multiple modules. Summary of the Invention

[0005] The problem that the invention aims to solve

[0006] Particle reduction in processing solutions (such as photoresists) has been a significant challenge in the past. One cause of particle formation is air bubbles in the processing solution. Gel formation occurs at the interface between the air bubbles and the coating solution (such as the photoresist), and the gel itself becomes a particle.

[0007] For example, when the filling pump (upstream pump) is positioned low near the bottle and the ejection pump (downstream pump) is positioned high near the processing chamber, the difference in their elevations can easily generate bubbles.

[0008] Furthermore, when bubbles are generated in the filling pump, the bubbles and the particles they generate are captured by the filter, but this may accelerate filter degradation. Additionally, when bubbles are generated in the ejection pump, a processing liquid containing bubbles and their generated particles may be ejected onto the substrate. For example, when this processing liquid containing bubbles and their generated particles is applied to the substrate, that portion may become a defect.

[0009] The present invention was made in view of the following circumstances, and its object is to provide a substrate processing apparatus and a method for controlling the substrate processing apparatus capable of suppressing the generation of bubbles in the processing liquid.

[0010] Methods for solving problems

[0011] To achieve this objective, the present invention employs the following structure.That is, the present invention is a substrate processing apparatus for processing a substrate, characterized in that the substrate processing apparatus comprises: a plurality of processing chambers stacked in a vertical direction; a liquid supply mechanism for supplying processing liquid to at least one of the plurality of processing chambers; a controller, wherein each of the plurality of processing chambers comprises: a chuck for holding a substrate; and a nozzle for spraying the processing liquid onto the substrate held by the chuck, wherein the liquid supply mechanism comprises: a delivery pipe for supplying the processing liquid to the nozzle of a first processing chamber, i.e., a first nozzle; a filling pump disposed in the delivery pipe at a layer lower than the first processing chamber; and an ejection pump disposed at a layer at or below the first processing chamber. The delivery piping is disposed between the filling pump and the first nozzle in a high layer; an inlet valve is disposed upstream of the filling pump in the delivery piping; an outlet valve is disposed between the discharge pump and the first nozzle in the delivery piping; a filter is disposed between the filling pump and the discharge pump in the delivery piping; a first intermediate valve is disposed between the filling pump and the filter in the delivery piping; a second intermediate valve is disposed between the filter and the discharge pump in the delivery piping; the filling pump has a filling pressure sensor that measures the pressure of the processing fluid within the filling pump; the discharge pump has a discharge pressure sensor that measures the pressure of the processing fluid within the discharge pump. The controller is configured to sequentially perform a pre-filtration operation and an actual filtration operation, depending on the pressure of the filtration solution. The controller performs the following actions for the pre-filtration operation: with the inlet valve, the outlet valve, the first intermediate valve, and the second intermediate valve closed, the filling pump adjusts the pressure of the filtration solution within the filling pump so that the pressure value measured by the filling pressure sensor becomes a first supply pressure; when the pressure value measured by the filling pressure sensor reaches the first supply pressure, the first intermediate valve is opened, thereby pushing the filtration solution into the second intermediate valve; during the period from the opening of the first intermediate valve to the opening of the second intermediate valve, the inlet valve and the second intermediate valve are closed... In the current state, the filling pump adjusts the pressure of the processing liquid within the filling pump so that the pressure value measured by the filling pressure sensor becomes the second supply pressure; after the first intermediate valve is opened, with the outlet valve and the second intermediate valve closed, the ejection pump adjusts the pressure of the processing liquid within the ejection pump so that the pressure value measured by the ejection pressure sensor becomes the third supply pressure; when the pressure value measured by the ejection pressure sensor reaches the third supply pressure, the second intermediate valve is opened, and the controller performs the following action as the actual filtration action: while the inlet valve and the outlet valve are closed, the processing liquid is delivered from the filling pump to the ejection pump.

[0012] According to the substrate processing apparatus of the present invention, a pre-filtration operation is performed as a preparatory operation for the actual filtration operation before the actual filtration operation. During the pre-filtration operation, the pressure of the processing liquid in the filling pump may drop significantly when the first intermediate valve and the second intermediate valve are opened, respectively. According to the present invention, during the period from the opening of the first intermediate valve to the opening of the second intermediate valve, with the first intermediate valve open and the inlet valve, outlet valve, and second intermediate valve closed, the pressure of the processing liquid in the filling pump is adjusted so that the pressure value measured by the filling pressure sensor becomes the second supply pressure. Therefore, even when the first intermediate valve is opened, a significant drop in the pressure of the processing liquid in the filling pump can be suppressed.

[0013] Furthermore, according to the present invention, after the first intermediate valve is opened, with the first intermediate valve open and the inlet valve, outlet valve, and second intermediate valve closed, the ejection pump adjusts the pressure of the processing fluid within the ejection pump so that the pressure value measured by the ejection pressure sensor becomes a predetermined third supply pressure. As a result, the pressure of the processing fluid on the inflow and outflow sides of the second intermediate valve is approximately the same. Even when the second intermediate valve is open, a significant drop in the pressure of the processing fluid within the filling pump is prevented. Consequently, the generation of air bubbles in the processing fluid can be suppressed.

[0014] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the liquid supply mechanism further comprises: a return pipe connecting the ejector pump to the return position of the delivery pipe between the first intermediate valve and the inlet valve; a purge valve disposed on the return pipe, and the controller being configured to perform the following actions as a purge action: opening the inlet valve while the first intermediate valve and the purge valve are closed, thereby allowing the processing liquid from the filler pump to escape upstream of the atmospheric pressure of the inlet valve; and closing the inlet valve after a predetermined time has elapsed since the inlet valve was opened. A valve is provided to prevent the pressure value measured by the ejection pressure sensor from becoming negative when the purge valve is opened; after the inlet valve is closed, the purge valve opening action is performed with the outlet valve, the first intermediate valve, and the second intermediate valve closed; after the purge valve is opened, the actual purge action of returning the treatment liquid from the ejection pump to the filling pump through the return piping is performed with the purge valve open and the inlet valve, the outlet valve, the first intermediate valve, and the second intermediate valve closed.

[0015] According to the substrate processing apparatus of the present invention, a purging operation is performed. During the purging operation, when the inlet valve and the purging valve are opened, due to the height difference between the filling pump and the ejection pump, the processing liquid in the ejection pump is drawn to the filling pump side, resulting in the pressure of the processing liquid in the ejection pump potentially becoming negative. According to the present invention, after a predetermined time has elapsed since the inlet valve was opened, the inlet valve is closed so that the pressure value measured by the ejection pressure sensor does not become negative when the purging valve is opened. Therefore, even when the purging valve is opened, the pressure of the processing liquid in the ejection pump is prevented from becoming negative, thereby suppressing the generation of air bubbles in the processing liquid.

[0016] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the controller performs the following actions as the purging action: after closing the inlet valve and before opening the purging valve, with the outlet valve, the second intermediate valve, and the purging valve closed, the processing liquid is started to be pushed from the ejector pump toward the purging valve and through the return pipe to the ejector pump; the controller performs the following actions as the purging valve opening action of the purging action: after a predetermined time has elapsed since the processing liquid was started being pushed in through the return pipe, the purging valve is opened with the inlet valve, the outlet valve, the first intermediate valve, and the second intermediate valve closed.

[0017] Before opening the purge valve, the treatment fluid is pushed towards it. This causes the pressure of the treatment fluid in the ejection pump to rise. Therefore, when the purge valve is opened, it further prevents the treatment fluid in the ejection pump from becoming negative pressure. In addition, it allows the pressure in the ejection pump to decrease more slowly.

[0018] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the controller performs the following actions as the purging action: after closing the inlet valve and before opening the purging valve, with the outlet valve, the second intermediate valve, and the purging valve closed, the ejector pump adjusts the pressure of the processing liquid within the ejector pump so that the pressure value measured by the ejection pressure sensor becomes the first purging pressure. The controller then performs the following actions as the purging valve opening action for the purging action: when the pressure value measured by the ejection pressure sensor reaches the first purging pressure, with the inlet valve, the outlet valve, the first intermediate valve, and the second intermediate valve closed, the purging valve is opened. The controller then performs the following actions as the purging action: when the outlet valve, the second intermediate valve, and the third intermediate valve are closed, the purging valve is opened. After the purge valve is closed, with the inlet valve, the outlet valve, the first intermediate valve, and the second intermediate valve closed, the ejector pump adjusts the pressure of the treatment fluid within the ejector pump so that the pressure value measured by the ejector pressure sensor becomes the second purge pressure. The controller performs the following actions as the actual purge action: when the pressure value measured by the ejector pressure sensor reaches the second purge pressure, with the purge valve open and the inlet valve, the outlet valve, the first intermediate valve, and the second intermediate valve closed, the filling pump and the ejector pump return the treatment fluid from the ejector pump to the filling pump through the return piping so that the pressure value measured by the ejector pressure sensor maintains the second purge pressure.

[0019] Before opening the purge valve, the pressure of the treatment fluid inside the ejector pump is adjusted so that the pressure value measured by the ejector pressure sensor becomes the first purge pressure. Furthermore, after opening the purge valve, the pressure of the treatment fluid inside the ejector pump is adjusted so that the pressure value measured by the ejector pressure sensor becomes the second purge pressure. In other words, the treatment fluid pressure is adjusted before and after the purge valve is opened. Therefore, when the purge valve is opened, it is possible to further prevent the treatment fluid inside the ejector pump from becoming negative pressure. Additionally, it allows the pressure inside the ejector pump to decrease more slowly.

[0020] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the first intermediate valve, the second intermediate valve, and the filter are respectively disposed on the same layer as the first processing chamber or on a layer higher than the first processing chamber. For example, by disposing the filter on the same layer as the ejector pump, i.e., near the ejector pump, the distance between the filter and the first nozzle can be shortened.

[0021] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the purge valve and the return position are respectively disposed on the same layer as the first processing chamber or on a layer higher than the first processing chamber. For example, the return piping can be made relatively short. Therefore, the processing liquid can be ejected from the return piping earlier.

[0022] Furthermore, in the aforementioned substrate processing apparatus, it is preferable that the filling pump includes: a first storage space for storing the processing liquid; a first volume changing member for changing the volume of the first storage space; a first pump drive mechanism for operating the pump by actuating the first volume changing member; and a filling pressure sensor configured to measure the pressure of the processing liquid in the first storage space. The ejection pump includes: a second storage space for storing the processing liquid; a second volume changing member for changing the volume of the second storage space; a second pump drive mechanism for operating the pump by actuating the second volume changing member; and an ejection pressure sensor configured to measure the pressure of the processing liquid in the second storage space.

[0023] Furthermore, the present invention is a substrate processing apparatus for processing a substrate, characterized in that the substrate processing apparatus comprises: a plurality of processing chambers stacked in a vertical direction; a liquid supply mechanism for supplying processing liquid to at least one of the plurality of processing chambers; a controller, wherein each of the plurality of processing chambers comprises: a chuck for holding the substrate; a nozzle for spraying the processing liquid onto the substrate held by the chuck, and the liquid supply mechanism comprises: a delivery pipe for supplying the processing liquid to the nozzle, i.e., the first nozzle, of the first processing chamber among the plurality of processing chambers; and a filling pump. The delivery piping is located in a layer lower than the first processing chamber; the ejection pump is located in the delivery piping between the filling pump and the first nozzle in the same layer as or higher than the first processing chamber; the inlet valve is located in the delivery piping upstream of the filling pump; the outlet valve is located in the delivery piping between the ejection pump and the first nozzle; the first intermediate valve is located in the delivery piping between the filling pump and the ejection pump; and the return piping connects the ejection pump to the... The return position connection of the delivery piping between the first intermediate valve and the inlet valve; a purge valve, which is provided on the return piping; the filling pump having a filling pressure sensor that measures the pressure of the processing fluid in the filling pump; the ejection pump having an ejection pressure sensor that measures the pressure of the processing fluid in the ejection pump; the controller performing the following action as a purge action: opening the inlet valve with the outlet valve, the first intermediate valve, and the purge valve closed, thereby allowing the processing fluid from the filling pump to flow into the inlet valve at atmospheric pressure. Upstream escape; after a preset time has elapsed since the inlet valve was opened, the inlet valve is closed so that the pressure value measured by the pressure sensor for the spraying does not become negative when the purge valve is opened; after the inlet valve is closed, the purge valve opening action is performed with the outlet valve and the first intermediate valve closed; after the purge valve is opened, the actual purge action is performed with the outlet valve and the first intermediate valve closed, so that the treatment fluid returns from the spraying pump to the filling pump through the return piping.

[0024] Furthermore, the present invention relates to a control method for a substrate processing apparatus for processing a substrate, characterized in that the substrate processing apparatus comprises: a plurality of processing chambers stacked in a vertical direction; a liquid supply mechanism for supplying processing liquid to at least one of the plurality of processing chambers, each of the plurality of processing chambers comprising: a chuck for holding a substrate; a nozzle for spraying the processing liquid onto the substrate held by the chuck; the liquid supply mechanism comprising: a delivery pipe for supplying the processing liquid to the nozzle of a first processing chamber, i.e., a first nozzle; a filling pump disposed in the delivery pipe at a layer lower than the first processing chamber; and an ejection pump disposed at a layer at the same level as or lower than the first processing chamber. The delivery piping is disposed in a layer of a processing chamber between the filling pump and the first nozzle; an inlet valve is disposed upstream of the filling pump in the delivery piping; an outlet valve is disposed between the discharge pump and the first nozzle in the delivery piping; a filter is disposed between the filling pump and the discharge pump in the delivery piping; a first intermediate valve is disposed between the filling pump and the filter in the delivery piping; a second intermediate valve is disposed between the filter and the discharge pump in the delivery piping; the filling pump has a filling pressure sensor that measures the pressure of the processing fluid within the filling pump; the discharge pump has a discharge pressure sensor that measures... The control method for controlling the pressure of the treatment fluid in the ejector pump includes the following actions as a pre-filtration action: with the inlet valve, the outlet valve, the first intermediate valve, and the second intermediate valve closed, the filling pump adjusts the pressure of the treatment fluid in the filling pump so that the pressure value measured by the filling pressure sensor becomes a first supply pressure; when the pressure value measured by the filling pressure sensor reaches the first supply pressure, the first intermediate valve is opened, thereby pushing the treatment fluid into the second intermediate valve; during the period from the opening of the first intermediate valve to the opening of the second intermediate valve, with the inlet valve and the second intermediate valve closed, the filling pump adjusts the pressure of the treatment fluid in the filling pump. The pressure of the processing fluid in the filling pump is adjusted so that the pressure value measured by the filling pressure sensor becomes the second supply pressure; after the first intermediate valve is opened, with the outlet valve and the second intermediate valve closed, the pressure of the processing fluid in the ejection pump is adjusted so that the pressure value measured by the ejection pressure sensor becomes the third supply pressure; when the pressure value measured by the ejection pressure sensor reaches the third supply pressure, the second intermediate valve is opened; after the pre-filtration operation, the control method further includes the following operation as the actual filtration operation: with the inlet valve and the outlet valve closed, the processing fluid is delivered from the filling pump to the ejection pump.

[0025] Furthermore, the present invention relates to a control method for a substrate processing apparatus for processing a substrate, characterized in that the substrate processing apparatus comprises: a plurality of processing chambers stacked in a vertical direction; a liquid supply mechanism for supplying processing liquid to at least one of the plurality of processing chambers, each of the plurality of processing chambers comprising: a chuck for holding a substrate; a nozzle for spraying the processing liquid onto the substrate held by the chuck; the liquid supply mechanism comprising: a delivery pipe for supplying the processing liquid to the nozzle, i.e., the first nozzle, of the first processing chamber among the plurality of processing chambers; and a filling pump. A filling pump is disposed in the delivery piping at a lower level than the first processing chamber; a spray pump is disposed in the delivery piping between the filling pump and the first nozzle at the same level as or higher than the first processing chamber; an inlet valve is disposed in the delivery piping upstream of the filling pump; an outlet valve is disposed in the delivery piping between the spray pump and the first nozzle; a first intermediate valve is disposed in the delivery piping between the filling pump and the spray pump; and a return piping connects the spray pump to the... The return position connection of the delivery piping between the first intermediate valve and the inlet valve; a purge valve, which is provided on the return piping; the filling pump having a filling pressure sensor that measures the pressure of the processing fluid in the filling pump; the ejection pump having an ejection pressure sensor that measures the pressure of the processing fluid in the ejection pump; the control method having the following action as a purge action: opening the inlet valve while the outlet valve, the first intermediate valve, and the purge valve are closed, thereby allowing the processing fluid from the filling pump to pass through the atmospheric pressure at the inlet valve. The upstream escape; after a preset time has elapsed since the inlet valve was opened, the inlet valve is closed so that the pressure value measured by the pressure sensor for the spraying does not become negative when the purge valve is opened; after the inlet valve is closed, the purge valve opening action is performed with the outlet valve and the first intermediate valve closed; after the purge valve is opened, the actual purge action is performed to return the treatment fluid from the spraying pump to the filling pump through the return piping with the outlet valve and the first intermediate valve closed.

[0026] Invention Effects

[0027] According to the substrate processing apparatus and the control method of the substrate processing apparatus of the present invention, the generation of bubbles in the processing liquid can be suppressed. Attached Figure Description

[0028] Several preferred embodiments are illustrated for the purpose of illustrating the invention, but it should be understood that the invention is not limited to the structures and countermeasures shown in the illustrations.

[0029] Figure 1This is a side view showing the schematic structure of the substrate processing apparatus of Embodiment 1.

[0030] Figure 2 This is a piping diagram of the substrate processing device.

[0031] Figure 3 This is a side view showing the general structure of the first pump mechanism.

[0032] Figure 4 It is a block diagram used to illustrate control-related structures.

[0033] Figure 5 This is a flowchart used to explain the operation of the first pump mechanism.

[0034] Figure 6A It is a diagram representing the preparation to complete an action. Figure 6B It is a diagram representing the ejection action. Figure 6C This is a diagram representing the filtering action. Figure 6D It is a diagram illustrating the blowing action. Figure 6E This is a diagram representing the filling action.

[0035] Figure 7 This is a diagram used to illustrate the filtering process (pre-filtering and actual filtering).

[0036] Figure 8 It is a graph used to illustrate the changes in pressure values ​​measured by the filling pressure sensor and the ejection pressure sensor, respectively.

[0037] Figure 9 This is a diagram used to illustrate the purging action of Example 2.

[0038] Figure 10 This is a graph used to illustrate the changes in pressure values ​​measured by the filling pressure sensor and the ejection pressure sensor, respectively, in Example 2.

[0039] Figure 11 This is a diagram used to illustrate the purging action of Example 3.

[0040] Figure 12 This is a graph used to illustrate the changes in pressure values ​​measured by the filling pressure sensor and the ejection pressure sensor, respectively, in Example 3.

[0041] Explanation of reference numerals in the attached figures

[0042] 1…Substrate processing apparatus, 3 (3A, 3B, 3C, 3D)…Processing chamber, 7…Liquid supply mechanism, 9…Rotary chuck, 13…Nozzle, 41…First pump mechanism, 45…Delivery piping, 45A, 45B, 45C, 45D…Pipes, 46, 48…Branch pipes, 55, 71…Diaphragms, 57, 73…Pump drive mechanism, M1, M2…Electric motors, 81…Filter, IN…Inlet valve, ISO…First intermediate valve, BAR…Second intermediate valve, OT2…Outlet valve, 85…Return piping, FP…Filling pump, DP…Ejection pump, 101…Controller, 103…Memory, SSF…Filling pressure sensor, SSD…Ejection pressure sensor, P1…First supply pressure, P2…Second supply pressure, P3…Third supply pressure, P4D…Filtration pressure, P7…First purge pressure, P8…Second purge pressure, GR1…First confluence pipe. Detailed Implementation

[0043] The embodiments of the present invention will be described below.

[0044] [Example 1]

[0045] Hereinafter, Embodiment 1 of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a side view showing the schematic structure of the substrate processing apparatus 1 of Embodiment 1. Figure 2 This is a piping diagram of substrate processing device 1.

[0046] <1. Structure of the substrate processing device>

[0047] Reference Figure 1 The substrate processing apparatus 1 processes the substrate W. The substrate W is formed, for example, in a circular plate shape. The substrate processing apparatus 1 includes a plurality of processing chambers 3, a housing 5, and a liquid supply mechanism 7. In this embodiment, the substrate processing apparatus 1 has, for example, four processing chambers 3A, 3B, 3C, and 3D. Without distinguishing between processing chambers 3A to 3D, they are referred to as "processing chamber 3".

[0048] Multiple (e.g., four) processing chambers 3 are stacked in the vertical direction Z. Additionally, when a housing 5 is included, multiple (e.g., four) processing chambers 3 and housing 5 are stacked in the vertical direction Z. The four processing chambers 3 and housing 5 form five layers.

[0049] Processing chamber 3A is configured on the top layer, which is the highest layer. Processing chamber 3B is configured on the next layer below processing chamber 3A. In other words, processing chamber 3B is configured on a layer lower than processing chamber 3A. Processing chamber 3C is configured on the next layer below processing chamber 3B. Processing chamber 3D is configured on the next layer below processing chamber 3C.

[0050] The housing 5 is disposed in a layer lower than the four processing chambers 3A-3D. That is, the housing 5 is disposed in the layer below the lowest processing chamber 3D among the four processing chambers 3A-3D. In addition, a drain pipe for conveying the processing liquid recovered by the cup 15 described later is provided in the housing 5, for example, but it may also be empty.

[0051] <1-1. Each processing chamber>

[0052] Each of the four processing chambers 3 has a rotary chuck 9, a rotation mechanism 11, a nozzle 13, and a cup 15. For example, processing chamber 3B is configured in the same way as the three processing chambers 3A, 3C, and 3D. Therefore, the rotary chuck 9, rotation mechanism 11, nozzle 13, and cup 15 of processing chamber 3B will be described.

[0053] The rotary chuck 9 holds the substrate W in a horizontal position. The rotary chuck 9 is, for example, a vacuum chuck, but is not limited to this. The vacuum chuck is configured, for example, to hold the center of the lower surface of the substrate W by vacuum suction from a pump.

[0054] The rotating mechanism 11, for example, has an electric motor. The rotating mechanism 11 rotates the substrate W about the vertical axis AX1 via the rotating chuck 9. In other words, the rotating mechanism 11 rotates the rotating chuck 9 that holds the substrate W about the vertical axis AX1. The vertical axis AX1 passes through the center of the substrate W held by the rotating chuck 9.

[0055] Nozzle 13 sprays processing liquid onto the substrate W held by the rotating chuck 9. Cup 15 surrounds the sides of the substrate W held by the rotating chuck 9. Cup 15 collects the processing liquid that splashes out from the rotating substrate W. Furthermore, in the case where there are four nozzles 13 that separate four processing chambers 3A to 3D, the four nozzles 13 are referred to as four nozzles 13A, 13B, 13C, and 13D.

[0056] <1-2. Liquid Supply Mechanism>

[0057] Reference Figure 1 , Figure 2 The liquid supply mechanism 7 supplies processing liquid to at least one of a plurality of (e.g., four) processing chambers 3. In this embodiment, the liquid supply mechanism 7 selectively supplies processing liquid to each of the four processing chambers 3.

[0058] The liquid supply mechanism 7 is disposed to the side of the four processing chambers 3 and the housing 5. That is, the liquid supply mechanism 7, the four processing chambers 3, and the housing 5 are arranged in a horizontal direction. The liquid supply mechanism 7 includes: a common pipe 21, a processing liquid bottle 23, a gas supply mechanism 25, a capture box 27, and a first branch pipe BK1.

[0059] The base of the common pipe 21 is inserted into the processing solution bottle 23. The front end of the common pipe 21 is connected to the first branch pipe BK1. The processing solution bottle 23 stores the processing solution. The processing solution may include, for example, photoresist, a coating solution for forming an antireflective film, a solvent (e.g., a diluent), a rinsing solution, a developer, or an etching solution. For example, deionized water (DIW) may be used as the rinsing solution.

[0060] The gas supply mechanism 25 is configured to supply gas to the processing liquid bottle 23, and also to allow the processing liquid bottle 23 to be open to the atmosphere. The gas supply mechanism 25 includes: two gas pipes 31 and 33, a vent pipe 35, and a three-way valve V1.

[0061] The front end of gas pipe 31 is connected to the treatment liquid bottle 23, and the base end of gas pipe 31 is connected to the three-way valve V1. The front end of gas pipe 33 is connected to the three-way valve V1, and the base end of gas pipe 33 is connected to the gas supply source 37. The gas supply source 37 supplies gas to the treatment liquid bottle 23 via the two gas pipes 31 and 33 and the three-way valve V1. An inert gas, such as nitrogen, is used as the gas. The front end of vent pipe 35 is connected to the three-way valve V1, and the other end of vent pipe 35 is open to the atmosphere.

[0062] The three-way valve V1 selectively connects gas pipe 31 to either gas pipe 33 or vent pipe 35. Normally, the three-way valve V1 connects gas pipe 31 to vent pipe 35. This brings the pressure inside the treated liquid bottle 23 to atmospheric pressure. Additionally, the three-way valve V1 connects both gas pipes 31 and 33. This allows the treated liquid stored in the treated liquid bottle 23 to be discharged to the common pipe 21.

[0063] A capture tank 27 is disposed on the common pipe 21 between the processing fluid bottle 23 and the first branch pipe BK1. The capture tank 27 is capable of storing the processing fluid delivered from the processing fluid bottle 23 inside the capture tank 27. In addition, the capture tank 27 is configured to detect the remaining amount of processing fluid in the capture tank 27 using a liquid level sensor (not shown).

[0064] One end of a vent pipe 39 is connected to the top of the capture tank 27. A vent valve V2 is installed on the vent pipe 39. For example, when the liquid supply mechanism 7 is in the state of opening the vent valve V2 and closing the two inlet valves IN (described later), it supplies processing liquid from the processing liquid bottle 23 to the capture tank 27. As a result, the processing liquid containing air bubbles in the capture tank 27 is discharged through the vent pipe 39.

[0065] <1-2-1.2 Pump Mechanisms>

[0066] Furthermore, the liquid supply mechanism 7 includes, for example, a first pump mechanism 41 and a second pump mechanism 43. The first pump mechanism 41 supplies processing liquid to the two upper processing chambers 3A and 3B. The second pump mechanism 43 supplies processing liquid to the two lower processing chambers 3C and 3D. First, the first pump mechanism 41 will be described.

[0067] <1-2-2. First Pump Mechanism>

[0068] Reference Figure 2 , Figure 3 . Figure 3 This is a side view showing the schematic structure of the first pump mechanism 41. The first pump mechanism 41 has a delivery pipe 45 and a second branch pipe BK2, and for example, two branch pipes 46 and 48. The base end of the delivery pipe 45 is connected to the first branch pipe BK1, and the front end of the delivery pipe 45 is connected to the second branch pipe BK2.

[0069] The base ends of the two branch pipes 46 and 48 are each connected to the second branch pipe BK2. The front end of the branch pipe 46 is connected to the nozzle 13A of the processing chamber 3A. Similarly, the front end of the branch pipe 48 is connected to the nozzle 13B of the processing chamber 3B. For example, the delivery pipe 45 and the branch pipe 48 supply processing fluid to the nozzle 13B of the processing chamber 3B in the four processing chambers 3A to 3D.

[0070] The first pump mechanism 41 also includes a filling pump FP and a discharge pump DP. The filling pump FP is disposed in the delivery piping 45 between the first branch pipe BK1 and the second branch pipe BK2. In other words, as Figure 1 As shown, the filling pump FP is provided in the delivery piping 45, for example, in a layer lower than the processing chamber 3B, that is, in the same layer as the housing 5.

[0071] Additionally, the ejector pump DP is located in the delivery piping 45 between the filling pump FP and the second branch pipe BK2. In other words, as... Figure 1 As shown, the ejector pump DP is disposed, for example, in the same layer as the processing chamber 3B, in the delivery piping 45 between the filling pump FP and the nozzle 13B of the processing chamber 3B. In other words, the ejector pump DP is disposed on the side of the processing chamber 3B. The ejector pump DP is positioned downstream of the filling pump FP and at a higher position than the filling pump FP.

[0072] like Figure 3 As shown, the delivery piping 45 has four pipes 45A, 45B, 45C, and 45D. The filling pump FP is positioned between two pipes 45A and 45B. The ejection pump DP is positioned between two pipes 45C and 45D. Furthermore, the base of pipe 45A is connected to the first branch pipe BK1. Additionally, the front end of pipe 45D is connected to the second branch pipe BK2.

[0073] The filling pump FP includes: a frame 51, an inlet 53, an outlet 54, a diaphragm 55, a pump drive mechanism 57, and a filling pressure sensor SSF. A storage space SP1 is provided inside the frame 51. The processing fluid is stored in the storage space SP1. The inlet 53 and outlet 54 are respectively located on the wall of the frame 51 and communicate with the storage space SP1. The front end of pipe 45A is connected to the inlet 53, and the base end of pipe 45B is connected to the outlet 54.

[0074] The diaphragm 55 (volume-changing component) changes the volume of the storage space SP1. The periphery of the diaphragm 55 is fixed to the inner wall of the frame 51. For example, a rolling diaphragm is used as both the diaphragm 55 and the diaphragm 71 (described later). The pump drive mechanism 57 operates by actuating (deforming) the diaphragm 55. The pump drive mechanism 57 includes a first rod 59, a switching mechanism 61, and an electric motor M1.

[0075] The front end of the first rod 59 is connected to the central portion of the diaphragm 55. The base portion of the first rod 59 is connected to the rotary output shaft M1A of the electric motor M1 via a conversion mechanism 61. The conversion mechanism 61 and the conversion mechanism 76 described later have, for example, two or more gears or lead screws and nuts. The conversion mechanism 61 converts the rotation of the rotary output shaft M1A of the electric motor M1 into linear movement of the first rod 59 along the axial direction AX11. Therefore, the central portion of the diaphragm 55 moves forward and backward along the axial direction AX11.

[0076] As a result, the diaphragm 55 deforms, and the volume of the storage space SP1 within the frame 51 changes. Furthermore, by advancing the central portion of the diaphragm 55, the pressure of the processing fluid in the storage space SP1 can be increased at least. Conversely, by retracting the central portion of the diaphragm 55, the pressure of the processing fluid in the storage space SP1 can be decreased at least.

[0077] A filling pressure sensor SSF is disposed on the inner wall of the housing 51. The filling pressure sensor SSF is configured, for example, to face the diaphragm 55. The filling pressure sensor SSF measures the pressure of the processing fluid inside the filling pump FP, i.e., the storage space SP1.

[0078] The ejection pump DP is constructed similarly to the filling pump FP. The ejection pump DP includes: a frame 63, an inlet 65, an outlet 67, a return outlet 69, a diaphragm 71, a pump drive mechanism 73, and an ejection pressure sensor SSD. The processing fluid is stored in the storage space SP2 of the frame 51. The inlet 65, outlet 67, and return outlet 69 are respectively located on the wall of the frame 63 and communicate with the storage space SP2. The inlet 65 is connected to the front end of the piping 45C, and the outlet 67 is connected to the base end of the piping 45D. The return outlet 69 is connected to the base end of the return piping 85, described later.

[0079] The diaphragm 71 (volume-changing component) changes the volume of the storage space SP2. The periphery of the diaphragm 71 is fixed to the inner wall of the frame 63. The pump drive mechanism 73 actuates the pump by moving (deforming) the diaphragm 71. The pump drive mechanism 73 includes a second rod 75, a switching mechanism 76, and an electric motor M2.

[0080] The front end of the second rod 75 is connected to the central portion of the diaphragm 71. The base portion of the second rod 75 is connected to the rotary output shaft M2A of the electric motor M2 via a conversion mechanism 76. The conversion mechanism 76 converts the rotation of the rotary output shaft M2A of the electric motor M2 into linear movement of the second rod 75 along the axial direction AX12. Therefore, the central portion of the diaphragm 71 moves forward and backward along the axial direction AX12.

[0081] As a result, the diaphragm 71 deforms, changing the volume of the storage space SP2 within the frame 63. Furthermore, by advancing the central portion of the diaphragm 71, the pressure of the processing fluid within the storage space SP2 can be increased at least. Conversely, by retracting the central portion of the diaphragm 71, the pressure of the processing fluid within the storage space SP2 can be decreased at least.

[0082] The ejection pressure sensor SSD is disposed on the inner wall of the housing 63. The ejection pressure sensor SSD is configured, for example, opposite to the diaphragm 71. The ejection pressure sensor SSD measures the pressure of the processing fluid inside the ejection pump DP, i.e., inside the storage space SP2.

[0083] The first pump mechanism 41 also includes: a filter 81, a vent pipe 83, and a vent valve VNT. The filter 81 is disposed on the delivery pipe 45 between the filling pump FP and the ejection pump DP. Specifically, as Figure 3 As shown, filter 81 is configured between two pipes 45B and 45C. Filter 81 filters the treatment liquid, thereby capturing air bubbles and particles in the treatment liquid.

[0084] The filter 81 is connected to the front end of pipe 45B and the base end of pipe 45C. Air bubbles and particles in the treatment fluid transported from pipe 45B are captured by the filter body inside the filter 81, and the treated fluid, with air bubbles removed, is transported to pipe 45C. Additionally, a vent pipe 83 is connected to the filter 81. A vent valve VNT is installed on the vent pipe 83. By opening the vent valve VNT, air bubbles and other particles that have passed through the filter body inside the filter 81 can be discharged through the vent pipe 83.

[0085] The first pump mechanism 41 also includes: an inlet valve IN, a first intermediate valve ISO, a second intermediate valve BAR, and two outlet valves OT1 and OT2. The inlet valve IN is located on the delivery pipe 45 (pipe 45A) upstream of the filling pump FP. The first intermediate valve ISO is located on the delivery pipe 45 (pipe 45B) between the filling pump FP and the filter 81. The second intermediate valve BAR is located on the delivery pipe 45 (pipe 45C) between the filter 81 and the discharge pump DP.

[0086] The outlet valve OT1 is located on the branch pipe 46 between the ejection pump DP and the nozzle 13A of the processing chamber 3A. The outlet valve OT2 is located on the branch pipe 48 between the ejection pump DP and the nozzle 13B of the processing chamber 3B.

[0087] The first pump mechanism 41 also includes: a return pipe 85, a first confluence pipe GR1, and a purge valve PUR. The return pipe 85 connects the return position of the delivery pipe 45 between the ejector pump DP and the first intermediate valve ISO and the inlet valve IN. The return position can also be the delivery pipe 45 between the first intermediate valve ISO and the filling pump FP. The return position is the first confluence pipe GR1. The first confluence pipe GR1 is located within pipe 45B. The base of the return pipe 85 is connected to the return outlet 69 of the ejector pump DP, and the front end of the return pipe 85 is connected to the first confluence pipe GR1. The purge valve PUR is located within the return pipe 85.

[0088] <1-2-3. Height Relationship>

[0089] Reference Figure 1 , Figure 2 The common piping 21, the processing liquid bottle 23, the capture tank 27, and the first branch pipe BK1 are disposed on the same layer as the housing 5. Additionally, the filling pump FP and the inlet valve IN of the first pump mechanism 41 are also disposed on the same layer as the housing 5. The delivery piping 45 is disposed from the same layer as the housing 5 to the same layer as the processing chamber 3B.

[0090] In the first pump mechanism 41, the first confluence pipe GR1, the first intermediate valve ISO, the filter 81, the second intermediate valve BAR, the ejector pump DP, the second branch pipe BK2, the branch control pipe 48, the return pipe 85, and the purge valve PUR are arranged on the same layer as the processing chamber 3B. The branch control pipe 46 is arranged from the same layer as the processing chamber 3B to the same layer as the processing chamber 3A. The outlet valve OT1 is arranged inside the uppermost processing chamber 3A. Additionally, the outlet valve OT2 is arranged inside the processing chamber 3B. Furthermore, the outlet valve OT2 can also be arranged outside the processing chamber 3B. The same applies to the outlet valve OT1.

[0091] Furthermore, in the first pump mechanism 41, at least one of the first confluence pipe GR1, the first intermediate valve ISO, the filter 81, the second intermediate valve BAR, the ejector pump DP, the second branch pipe BK2, the return pipe 85, and the purge valve PUR can be located on the same layer as the processing chamber 3A, or at the boundary between the two processing chambers 3A and 3B.

[0092] Furthermore, in the first pump mechanism 41, the second intermediate valve BAR and the filter 81 are respectively arranged adjacent to the ejector pump DP. The filter 81 may also be arranged adjacent to the second intermediate valve BAR. The first intermediate valve ISO may also be arranged adjacent to at least one of the second intermediate valve BAR and the filter 81. The first confluence pipe GR1 may also be arranged adjacent to the first intermediate valve ISO.

[0093] By positioning the filter 81 at the same level as the ejector pump DP, i.e., near the ejector pump DP, the distance between the filter 81 and the nozzle 13 can be shortened. As a result, particles generated downstream of the filter 81 can be suppressed from being ejected from the nozzle 13. By positioning the first intermediate valve ISO at the same level as the ejector pump DP, i.e. near the ejector pump DP, the first confluence pipe GR1 can be brought closer to the ejector pump DP. Therefore, the return pipe 85 can be made relatively short. Consequently, the treatment fluid can be ejected from the return pipe 85 earlier.

[0094] <1-2-4. Second Pump Mechanism>

[0095] The second pump mechanism 43 shares many structural similarities with the first pump mechanism 41. Therefore, the description of the parts common to the first pump mechanism 41 is omitted.

[0096] The second pump mechanism 43 has a delivery pipe 91 and a third branch pipe BK3, and for example, two sub-pipes 93 and 95. The delivery pipe 91 connects the first branch pipe BK1 to the third branch pipe BK3. The sub-pipe 93 connects the third branch pipe BK3 to the nozzle 13C of the processing chamber 3C. Similarly, the sub-pipe 95 connects the third branch pipe BK3 to the nozzle 13D of the processing chamber 3D.

[0097] The second pump mechanism 43 also includes a filling pump FP2 and an ejection pump DP2. The filling pump FP2 is disposed in the delivery piping 91, for example, in a layer lower than the processing chamber 3D, i.e., in the same layer as the housing 5. The ejection pump DP2 is disposed in the delivery piping 91 between the filling pump FP2 and the nozzle 13D of the processing chamber 3D, for example, in the same layer as the processing chamber 3D. The ejection pump DP2 is disposed on the side of the processing chamber 3D. The ejection pump DP2 is positioned higher than the filling pump FP2.

[0098] The filling pump FP2 and the ejection pump DP2 of the second pump mechanism 43 are configured in the same way as the filling pump FP and the ejection pump DP of the first pump mechanism 41.

[0099] The second pump mechanism 43 also includes: a filter 81, an inlet valve IN, a first intermediate valve ISO, a second intermediate valve BAR, and two outlet valves OT3 and OT4. The filter 81 is installed in the delivery piping 91 between the filling pump FP2 and the ejection pump DP2. The inlet valve IN is installed in the delivery piping 91 upstream of the filling pump FP2. The first intermediate valve ISO is installed in the delivery piping 91 between the filling pump FP2 and the filter 81. The second intermediate valve BAR is installed in the delivery piping 91 between the filter 81 and the ejection pump DP2.

[0100] The outlet valve OT3 is located in the branch pipe 93 between the ejection pump DP2 and the nozzle 13C of the processing chamber 3C. The outlet valve OT4 is located in the branch pipe 95 between the ejection pump DP2 and the nozzle 13D of the processing chamber 3D.

[0101] The second pump mechanism 43 also includes: a return pipe 85, a second confluence pipe GR2, and a purge valve PUR. In the second pump mechanism 43, the return pipe 85 connects the ejector pump DP2 to the second confluence pipe GR2. The second confluence pipe GR2 is located in the delivery pipe 91 between the first intermediate valve ISO and the inlet valve IN. The purge valve PUR is located in the return pipe 85.

[0102] <1-3. Control-related structures>

[0103] Reference Figure 4 The substrate processing apparatus 1 includes a controller 101 and a memory 103. The controller 101 controls various structures of the substrate processing apparatus 1.

[0104] Controller 101 controls, for example, four processing chambers 3A-3D, a three-way valve V1, a vent valve V2, a first pump mechanism 41, and a second pump mechanism 43. Within the first pump mechanism 41, controller 101 controls the inlet valve IN, the first intermediate valve ISO, the second intermediate valve BAR, two outlet valves OT1 and OT2, the vent valve VNT, the purge valve PUR, and two electric motors M1 and M2. Controller 101 receives pressure values ​​measured by the filling pressure sensor SSF and the ejection pressure sensor SSD, respectively.

[0105] The controller 101 may have one or more processors, such as a central processing unit (CPU). The memory 103 is also referred to as a storage medium. The memory 103 may include at least one of ROM (Read-Only Memory), RAM (Random-Access Memory), and a hard disk. The memory 103 stores the computer programs and parameters required for each structure of the control board processing device 1. The controller 101 reads necessary information (e.g., parameters) from the memory 103.

[0106] Furthermore, the rotary chuck 9 corresponds to the chuck of the present invention. Each processing chamber 3A-3D corresponds to the first processing chamber of the present invention. When processing chamber 3B is the first processing chamber, the nozzle 13B of processing chamber 3B corresponds to the first nozzle of the present invention. The delivery piping 45 and the branch pipe 48 correspond to the delivery piping of the present invention. In addition, the delivery piping of the present invention may also include at least one of the branch pipe 46 and the common piping 21.

[0107] <2. Operation of the substrate processing apparatus>

[0108] Reference Figure 5 , Figures 6A-6E The operation of the substrate processing apparatus 1, particularly the liquid supply mechanism 7, will be explained.

[0109] <2-1. Summary of the operation of the liquid supply mechanism 7>

[0110] As an example of the operation of the liquid supply mechanism 7, an example of supplying processing liquid to nozzle 13B of processing chamber 3B will be described. This operation is performed similarly when processing liquid is supplied to the three nozzles 13A, 13C, and 13D of the other three processing chambers 3A, 3C, and 3D respectively. Furthermore, in Figures 6A-6E In the middle, outlet valve OT1 (refer to) Figure 3 ) and the vent valve VNT is closed. In Figures 6A-6E In this diagram, each valve (e.g., inlet valve IN) is represented by a quadrilateral. If an X is marked on the quadrilateral, the valve is in the closed state. Conversely, if no X is marked on the quadrilateral, the valve is in the open state.

[0111] [Step S01] Ready

[0112] Figure 6A This diagram represents the preparatory completion state. This state is achieved by sequentially performing steps S02 through S05: the ejection action, the filtering action, the purging action, and the filling action. Figure 6A In the middle, the inlet valve IN, the outlet valve OT2, the first intermediate valve ISO, the second intermediate valve BAR, and the purge valve PUR are all in the closed state.

[0113] [Step S02] Spray

[0114] Figure 6B This diagram illustrates the ejection action. Subsequently, controller 101 opens outlet valve OT2 with inlet valve IN, outlet valve OT2, first intermediate valve ISO, second intermediate valve BAR, and purge valve PUR closed. In this state, controller 101 causes pump drive mechanism 73 to advance second lever 75. In other words, controller 101 causes ejection pump DP to adjust the pressure of the treatment fluid within ejection pump DP so that the pressure value measured by ejection pressure sensor SSD becomes the preset ejection pressure, and causes ejection pump DP to deliver treatment fluid from ejection pump DP toward nozzle 13B.

[0115] Thus, nozzle 13B sprays processing liquid onto the substrate W held by the rotating chuck 9 of processing chamber 3B.

[0116] [Step S03] Filtering

[0117] Figure 6C This is a diagram illustrating the filtration process. Subsequently, with the first intermediate valve ISO and the second intermediate valve BAR open, and the inlet valve IN, outlet valve OT2, and purge valve PUR closed, controller 101 causes the fill pump FP and the discharge pump DP to deliver the treatment fluid from the fill pump to the discharge pump, so that the pressure value measured by the discharge pressure sensor SSD becomes the preset filtration pressure. Furthermore, this action is the actual filtration process described later.

[0118] Through actual filtration, the treatment fluid delivered from the fill pump FP is conveyed towards the ejection pump DP via the filter 81. Therefore, the amount of treatment fluid required for the ejection and purging actions in steps S02 and S04 is stored in the ejection pump DP. The filter 81 captures air bubbles and particles in the treatment fluid. Furthermore, details of the filtration operation will be described later.

[0119] [Step S04] Purge

[0120] Figure 6D This is a diagram illustrating the purging action. Afterwards, with the purge valve PUR open and the inlet valve IN, outlet valve OT2, first intermediate valve ISO, and second intermediate valve BAR closed, controller 101 slightly advances the second lever 75 of the ejector pump DP and slightly retracts the first lever 59 of the filling pump FP.

[0121] Therefore, by returning the air bubbles that have accumulated near the return outlet 69 in the ejector pump DP, they are returned towards the first confluence pipe GR1 upstream of the filter 81 via the return pipe 85. If the treated liquid stagnates, particles may be generated, but by allowing the treated liquid to flow in the return pipe 85, particle generation can be suppressed. In addition, air bubbles and the like in the treated liquid in the ejector pump DP return to the first confluence pipe GR1, and the returned air bubbles and the like are captured by the filter 81 during the filtration operation in the next subsequent step S03.

[0122] [Step S05] Fill

[0123] Figure 6E This is a diagram illustrating the filling operation. Afterwards, with the inlet valve IN open and the outlet valve OT2, the first intermediate valve ISO, the second intermediate valve BAR, and the purge valve PUR closed, the controller 101 retracts the first lever 59 of the filling pump FP so that the pressure value measured by the filling pressure sensor SSF becomes the preset filling pressure. At this time, for example, the three-way valve V1, through connecting two gas pipes 31 and 33, delivers positive-pressure processing fluid from the processing fluid bottle 23 to the filling pump FP via the capture box 27. Thus, it becomes... Figure 6A The preparation is complete.

[0124] Furthermore, steps S01 to S05 are repeated. When the processing liquid is ejected from nozzle 13A of the processing chamber 3A, during the ejection operation in step S02, outlet valve OT1 is opened instead of outlet valve OT2. In addition, the filling operation in step S05 may be performed in parallel with part or all of the ejection operation in step S02.

[0125] <2-2. Details of the filtering action in step S03>

[0126] The filtration process consists of a pre-filtration step and the actual filtration step. The pre-filtration step is a preparatory step for the actual filtration step. In the pre-filtration step, to prevent backflow, the first intermediate valve ISO and the second intermediate valve BAR are opened sequentially.

[0127] Pre-filtration operations sometimes present the following problems. For example, in the first pump mechanism 41, the ejector pump DP is positioned at a higher level than the filling pump FP. Therefore, sometimes when the first intermediate valve ISO is opened, the pressure value measured by the filling pressure sensor SSF drops sharply. If the pressure drop per unit time is large, air bubbles may be generated within the filling pump FP. Therefore, it is desirable to suppress the sharp drop in pressure value.

[0128] The controller 101 is configured to perform pre-filtering and actual filtering actions sequentially. (Refer to...) Figure 7 , Figure 8The pre-filtering action and the actual filtering action will be explained in turn. Figure 7 This is a diagram used to illustrate the filtering process (pre-filtering and actual filtering). Figure 8 This is a graph used to illustrate the changes in pressure values ​​measured by the filling pressure sensor and the ejection pressure sensor, respectively. Figure 8 In the diagram, the horizontal axis represents time, and the vertical axis represents the pressure value (kPa).

[0129] In addition, Figure 7 , Figure 8 The instructions state that the vent valve VNT and the outlet valve OT1 remain closed (refer to...). Figure 3 Additionally, in Figure 7 For example, when the first intermediate valve ISO is closed, it is indicated by the reference numeral CL. Conversely, when the first intermediate valve ISO is open, it is indicated by the reference numeral OP. Furthermore, arrows indicate that the actions of the previous steps continue.

[0130] like Figure 7 As shown, steps S11 to S15 are pre-filtering actions. Steps S16 to S18 are actual filtering actions.

[0131] [Step S11] Adjusting the pressure of the filling pump

[0132] when Figure 5 When the ejection action in step S02 is completed, the inlet valve IN, outlet valve OT2, first intermediate valve ISO, second intermediate valve BAR, and purge valve PUR are in the closed state. Figure 8 At time point t1). In this state, controller 101 causes filling pump FP to adjust the pressure of the processing fluid in filling pump FP so that the pressure value measured by filling pressure sensor SSF becomes the first supply pressure P1 ( Figure 8 (Time point t2).

[0133] At this time, the electric motor M1 of the filling pump FP adjusts the pressure by moving the first lever 59 forward and backward according to the pressure value measured by the filling pressure sensor SSF.

[0134] Additionally, in step S11, the electric motor M1 of the filling pump FP operates (ON), while the electric motor M2 of the discharge pump DP does not operate (OFF). Electric motor M1 continues to operate in steps S11 to S14.

[0135] [Step S12] Open the first intermediate valve at a specified pressure.

[0136] When the pressure value measured by the filling pressure sensor SSF reaches the first supply pressure P1, the controller 101 opens the first intermediate valve ISO ( Figure 8 (Time point t3). Therefore, the treatment fluid is pushed into the second intermediate valve BAR. Furthermore, when the first intermediate valve ISO is opened, the inlet valve IN, outlet valve OT2, second intermediate valve BAR, and purge valve PUR are closed.

[0137] Here, as Figure 8 As indicated by the double-dotted line of reference numeral DC1 in the attached diagram, the pressure of the processing fluid in the fill pump FP may drop significantly when the first intermediate valve ISO is opened. Therefore, continuing from steps S11 and S12, the fill pump FP adjusts the pressure of the processing fluid. Furthermore, in step S12, the electric motor M1 of the fill pump FP continues to operate. That is, the fill pump FP adjusts the pressure of the processing fluid.

[0138] The specific operation is explained below. During the period from the opening of the first intermediate valve ISO to the opening of the second intermediate valve BAR, while the first intermediate valve ISO is open and the inlet valve IN, outlet valve OT2, second intermediate valve BAR, and purge valve PUR are closed, the controller 101 causes the filling pump FP to adjust the pressure of the processing fluid within the filling pump FP so that the pressure value measured by the filling pressure sensor SSF becomes the second supply pressure P2. Furthermore, the second supply pressure P2 is the same as the first supply pressure P1, but it can also be different.

[0139] [Step S13] Adjusting the pressure of the ejector pump

[0140] Here, as Figure 8 As indicated by the double-dotted line of reference numeral DC2 in the attached diagram, the pressure of the processing fluid in the fill pump FP may decrease when the second intermediate valve BAR is opened. Therefore, the ejector pump DP adjusts the pressure of the processing fluid on the outflow side (secondary side) of the second intermediate valve BAR so that the pressure of the processing fluid on the inflow side (primary side) and the outflow side (secondary side) of the second intermediate valve BAR is approximately the same.

[0141] The specific operation is explained below. After the first intermediate valve ISO opens and before the second intermediate valve BAR opens, the controller 101 is in a state where the first intermediate valve ISO is open and the inlet valve IN, outlet valve OT2, second intermediate valve BAR, and purge valve PUR are closed. In this state, the controller 101 causes the ejector pump DP to adjust the pressure of the processing fluid within the ejector pump DP so that the pressure value measured by the ejector pressure sensor SSD becomes a predetermined third supply pressure P3 flowing into the second intermediate valve BAR. Figure 8 (Time point t4).

[0142] "Flowing into one side of the second intermediate valve BAR" is, for example, Figure 3The location is indicated by reference numeral ST1 in the attached diagram. This location is adjacent to the second intermediate valve BAR. The third supply pressure P3 is adjusted so that the pressure of the processed fluid on the inflow and outflow sides of the second intermediate valve BAR is approximately the same. The pressure on the inflow side of the second intermediate valve BAR can be determined experimentally beforehand. Alternatively, the specified pressure can be achieved by adding a correction value (e.g., the pressure difference caused by the height difference between the filling pump FP and the ejection pump DP) to the second supply pressure P2.

[0143] Furthermore, in step S13, the electric motor M1 of the fill pump FP continues to operate. That is, the fill pump FP adjusts the pressure of the processing fluid on the inflow side (primary side) of the second intermediate valve BAR. Additionally, in step S13, the electric motor M2 of the ejection pump DP adjusts the pressure by moving the second lever 75 forward and backward based on the pressure value measured by the ejection pressure sensor SSD. The electric motor M2 continues to operate (pressure adjustment) in steps S13-S14.

[0144] [Step S14] Open the second intermediate valve at a specified pressure.

[0145] When the pressure value measured by the ejection pressure sensor SSD reaches the third supply pressure P3, the controller 101 opens the second intermediate valve BAR ( Figure 8 (Time point t5). When the second intermediate valve BAR is opened, the first intermediate valve ISO is open, and the inlet valve IN, outlet valve OT2, and purge valve PUR are closed.

[0146] As described above, the pressure of the ejector pump DP is adjusted so that the pressure of the processed fluid on the inlet and outlet sides of the second intermediate valve BAR is approximately the same. Therefore, when the second intermediate valve BAR is opened, the pressure drop of the processed fluid in the filler pump FP can be suppressed.

[0147] [Step S15] Adjust the pressure of each pump

[0148] In step S15, the first intermediate valve ISO and the second intermediate valve BAR are open, while the inlet valve IN, the outlet valve OT2, and the purge valve PUR are closed. At this time, as... Figure 8 As shown, due to the height difference between the filling pump FP and the ejection pump DP, there is a pressure difference between the two pressure values ​​measured by the filling pressure sensor SSF and the ejection pressure sensor SSD (refer to...). Figure 8 (The attached figure is labeled DIF).

[0149] The fill pump FP and the ejection pump DP (at least the fill pump FP) are pressure-adjusted so that the pressure value measured by the ejection pressure sensor SSD becomes the filtration pressure P4D. When the treatment fluid in the ejection pump DP is at the filtration pressure P4D, the treatment fluid in the fill pump FP is at the filtration pressure P4F due to the pressure difference (labeled DIF in the attached diagram). Furthermore, the filtration pressure P4F is greater than the filtration pressure P4D (filtration pressure P4F > filtration pressure P4D).

[0150] The specific actions are explained below. After opening the second intermediate valve BAR, controller 101 is in a state where the first intermediate valve ISO and the second intermediate valve BAR are open, and the inlet valve IN, outlet valve OT2, and purge valve PUR are closed. In this state, controller 101 causes the filling pump FP and the ejection pump DP to adjust the pressure within the ejection pump DP so that the pressure value measured by the ejection pressure sensor SSD becomes the filter pressure P4D. Figure 8 (between time point t6 and time point t7). The pressure adjustment in step S15 takes approximately 1 to 1.5 seconds to prevent the pressure value from dropping sharply.

[0151] [Steps S16~S19] Actual Filtering Actions

[0152] When the pressure value measured by the ejection pressure sensor SSD reaches the filtration pressure P4D, the controller 101 is in a state where the first intermediate valve ISO and the second intermediate valve BAR are open, and the inlet valve IN, outlet valve OT2, and purge valve PUR are closed. In this state, the controller 101 causes the fill pump FP and the ejection pump DP to deliver the treatment fluid from the fill pump FP to the ejection pump DP, so as to maintain the filtration pressure P4D (filtration pressure) as measured by the ejection pressure sensor SSD. Figure 8 Between time point t7 and time point t8.

[0153] That is, when the pressure value measured by the ejection pressure sensor SSD reaches the filtration pressure P4D, the pumps of the filling pump FP and the ejection pump DP are activated (step S16). The electric motor M1 of the filling pump FP mainly moves the first lever 59 forward, and the electric motor M2 of the ejection pump DP mainly moves the second lever 75 backward. Thus, while maintaining the filtration pressure P4D, the filling pump FP delivers the treatment fluid, and the ejection pump DP receives the treatment fluid.

[0154] Wait for the filling pump FP and the discharge pump DP to complete their pumping operations (step S17). Upon completion of the pumping operations, stop the operation of each electric motor M1 and M2 (step S18, see reference). Figure 6C Then, close both the first intermediate valve ISO and the second intermediate valve BAR (step S19). Figure 8 (Time point t8). After that, proceed... Figure 5The purging action shown in step S04.

[0155] In addition, such as Figure 8 As shown, the first supply pressure P1, the second supply pressure P2, the third supply pressure P3, and the filtration pressures P4D and P4F are positive values. The first supply pressure P1 and the second supply pressure P2 are greater than the filtration pressure P4F. The filtration pressure P4F is greater than the filling pressure P6 (refer to...). Figure 10 )big.

[0156] According to the substrate processing apparatus 1 of this embodiment, a pre-filtration operation is performed as a preparatory operation for the actual filtration operation before the actual filtration operation. During the pre-filtration operation, when the first intermediate valve ISO and the second intermediate valve BAR are opened respectively, the pressure of the processing liquid in the fill pump FP may drop significantly. According to this embodiment, during the period from the opening of the first intermediate valve ISO to the opening of the second intermediate valve BAR, while the first intermediate valve ISO is open and the inlet valve IN, outlet valve OT2, and second intermediate valve BAR are closed, the pressure of the processing liquid in the fill pump FP is adjusted so that the pressure value measured by the filling pressure sensor SSF becomes the second supply pressure P2. Therefore, even when the first intermediate valve ISO is opened, a significant drop in the pressure of the processing liquid in the fill pump FP can be suppressed.

[0157] Furthermore, according to this embodiment, during the period from the opening of the first intermediate valve ISO to the opening of the second intermediate valve BAR, while the first intermediate valve ISO is open and the inlet valve IN, the second intermediate valve BAR, and the outlet valve OT2 are closed, the pressure of the processing fluid in the ejection pump DP is adjusted so that the pressure value measured by the ejection pressure sensor SSD becomes the third supply pressure P3 on the inflow side of the second intermediate valve BAR. Thus, the pressures of the processing fluid on the inflow and outflow sides of the second intermediate valve BAR are approximately the same. Even when the second intermediate valve BAR is open, the pressure drop of the processing fluid in the fill pump FP is suppressed. As a result, the generation of bubbles in the processing fluid can be suppressed.

[0158] [Example 2]

[0159] Next, Embodiment 2 of the present invention will be described with reference to the accompanying drawings. Furthermore, descriptions common to Embodiment 1 will be omitted. Figure 9 This is a diagram used to illustrate the purging action of Example 2. Figure 10 This is a graph illustrating the changes in pressure values ​​measured by the filling pressure sensor and the ejection pressure sensor, respectively, in Example 2. In Example 1, the generation of air bubbles during the pre-filtration operation was suppressed. In Example 2, the generation of air bubbles during the purging operation is also suppressed.

[0160] <3. Details of the purging action in step S04>

[0161] Previously, the purging action was performed by opening the inlet valve IN and the purging valve PUR to allow atmospheric access. As a result, the pressure of the process fluid in the fill pump FP and the discharge pump DP was reduced to approximately 0 (zero) kPa.

[0162] The purging action sometimes has the following problems. For example... Figure 2 As shown, for example, in the first pump mechanism 41, the ejector pump DP is positioned at a higher level than the filler pump FP. Furthermore, with the outlet valve OT2, the first intermediate valve ISO, and the second intermediate valve BAR closed, both the inlet valve IN and the purge valve PUR are open. In this case, the pressure of the processing fluid in the filler pump FP decreases to approximately 0 (zero) kPa. In contrast, as... Figure 10 As shown by reference numeral DC3 in the attached diagram, the ejector pump DP is under negative pressure. When it is under negative pressure, bubbles are easily generated in the treatment fluid inside the ejector pump DP. Furthermore, the longer the negative pressure is maintained, the more bubbles are generated.

[0163] In addition, such as Figure 10 As shown by reference numeral DC4 in the attached diagram, the pressure drops sharply when the inlet valve IN and the purge valve PUR are opened respectively. Therefore, bubbles may momentarily form in the treatment fluid. More bubbles are formed when the negative pressure is maintained compared to this initial bubble formation.

[0164] Therefore, in Example 2, the generation of bubbles during the purging action is suppressed. (Refer to...) Figure 9 , Figure 10 The purging operation of Example 2 will be described below. Furthermore, in Example 2, both the outlet valve OT1 and the vent valve VNT are closed. Figure 10 At time t8, the inlet valve IN, outlet valve OT2, first intermediate valve ISO, second intermediate valve BAR, and purge valve PUR are all closed.

[0165] [Step S21] Opening action of the inlet valve

[0166] Controller 101 opens inlet valve IN while outlet valve OT2, first intermediate valve ISO, second intermediate valve BAR, and purge valve PUR are closed. Figure 10 (Time point t9). Additionally, the three-way valve V1 connects the gas pipe 31 to the vent pipe 35, and the gas in the processed liquid bottle 23 is at atmospheric pressure. This causes the processed liquid in the filling pump FP to escape upstream of the atmospheric pressure at the inlet valve IN. Furthermore, it causes the processed liquid in the return pipe 85 from the purge valve PUR to the inlet valve IN and in the delivery pipes 45 (pipes 45A, 45B) to escape upstream of the atmospheric pressure at the inlet valve IN.

[0167] [Step S22] Closing action of the inlet valve

[0168] The controller 101 closes the inlet valve IN after a preset time (e.g., 0.5 seconds) has elapsed since the inlet valve IN was opened, so that the pressure value measured by the ejection pressure sensor SSD will not become negative when the purge valve PUR is opened. Figure 10 (Time point t10). The pressure inside the filling pump FP drops to approximately 0 (zero) kPa.

[0169] [Step S23] The operation of the ejection pump begins.

[0170] After closing the inlet valve IN and before opening the purge valve PUR, the controller 101, with the inlet valve IN, outlet valve OT2, first intermediate valve ISO, second intermediate valve BAR, and purge valve PUR closed, causes the ejector pump DP to begin pushing the treatment fluid from the ejector pump DP toward the purge valve PUR through the return piping 85. Figure 10 (Time point t11). As a result, the pressure of the treatment fluid in the ejector pump DP increases.

[0171] In step S23, the electric motor M2 of the ejector pump DP advances the second lever 75. The advancement occurs at a preset speed (e.g., a constant speed). The electric motor M2 continues to operate in steps S23 through S26.

[0172] [Step S24] The purge valve opens after a preset time.

[0173] After a preset time (e.g., 50 milliseconds) has elapsed since the processing fluid was introduced via return piping 85, controller 101 opens purge valve PUR while inlet valve IN, outlet valve OT2, first intermediate valve ISO, and second intermediate valve BAR are closed. Figure 10 (Time point t12). That is, the purge valve PUR is opened with a delay from the start of the injection of the treatment fluid based on the ejector pump DP.

[0174] When the purge valve PUR is opened, the inlet valve IN is closed. Therefore, the treated fluid in the ejector pump DP is not excessively drawn to the filler pump FP side via the return pipe 85. This prevents the treated fluid in the ejector pump DP from becoming negatively pressured. Furthermore, before opening the purge valve PUR, treated fluid is initially pushed towards it. That is, the pressure of the treated fluid in the ejector pump DP increases. Therefore, when the purge valve PUR is opened, it further prevents the treated fluid in the ejector pump DP from becoming negatively pressured. Additionally, the pressure decrease in the ejector pump DP is made more gradual.

[0175] Furthermore, when the purge valve PUR is opened, the processing fluid in the ejector pump DP is drawn to the filler pump FP side. Additionally, the ejector pump DP is located at a higher level than the filler pump FP. Consequently, the pressure of the processing fluid in the ejector pump DP decreases, while the pressure of the processing fluid in the filler pump FP increases (see reference). Figure 10 ).

[0176] [Step S25] The filling pump begins operation (actual purging action).

[0177] After the purge valve PUR is opened, and with the purge valve PUR open and the inlet valve IN, outlet valve OT2, first intermediate valve ISO, and second intermediate valve BAR closed, the filling pump FP draws in (receives) the treatment fluid delivered through the return pipe 85 and the first confluence pipe GR1. Figure 10 (Time point t13).

[0178] The filling pump FP draws in the treatment fluid so that the pressure value measured by the filling pressure sensor SSF becomes positive. The filling pump FP draws in the same amount of treatment fluid as the ejector pump DP delivers towards the purge valve PUR via the return pipe 85. For example, if the ejector pump DP advances the second rod 75 a second distance, the filling pump FP retracts the first rod 59 a first distance equal to the second distance. Furthermore, the second distance is the distance moved from time point t11, and the first distance is the distance moved from time point t13. The first and second distances are preset.

[0179] In step S25, the controller 101 causes the ejector pump DP to continue pushing the treated fluid from the ejector pump DP through the return pipe 85 toward the purge valve PUR. That is, in step S25, after opening the purge valve PUR, the controller 101 performs an actual purge action on the filling pump FP and the ejector pump DP, causing the treated fluid to return from the ejector pump DP through the return pipe 85 toward the filling pump, while the purge valve PUR is open and the inlet valve IN, outlet valve OT2, first intermediate valve ISO, and second intermediate valve BAR are closed.

[0180] Furthermore, the electric motor M1 of the filling pump FP causes the first lever 59 to retract. The retraction occurs at a preset speed (e.g., a constant speed). The electric motor M1 continues to operate in steps S25-S26.

[0181] [Steps S26~S28] Waiting for each pump to complete its operation ~ Closing of the purge valve

[0182] During the actual purging operation, wait for the filling pump FP and the ejection pump DP to complete their pumping actions (step S26). When the pumping actions are completed, stop the operation of each electric motor M1 and M2 (step S27).

[0183] Then, close the purge valve PUR (step S28). Figure 10 (Time point t14). Afterwards, proceed... Figure 5 The filling operation is shown in step S05. Furthermore, during the filling operation, if the pressure of the processing fluid in the filling pump FP is high, the inlet valve IN can be opened while the outlet valve OT2, the first intermediate valve ISO, the second intermediate valve BAR, and the purge valve PUR are closed. Therefore, the pressure value measured by the filling pressure sensor SSF is approximately 0 (zero). Additionally, the pressure value measured by the ejection pressure sensor SSD is preferably positive between time points t8 and t14.

[0184] According to this embodiment, a purging operation is performed. During the purging operation, when the inlet valve IN and the purging valve PUR are opened, due to the height difference between the filling pump FP and the ejection pump DP, the processing fluid in the ejection pump DP is drawn to the filling pump FP side. As a result, the pressure of the processing fluid in the ejection pump DP may become negative. According to this embodiment, after a preset time has elapsed since the inlet valve IN was opened, the inlet valve IN is closed so that the pressure value measured by the ejection pressure sensor SSD when the purging valve PUR is opened will not become negative. Therefore, even if the purging valve PUR is opened, the pressure of the processing fluid in the ejection pump DP will be prevented from becoming negative, thereby suppressing the generation of air bubbles in the processing fluid.

[0185] Before opening the purge valve PUR, the treatment fluid is introduced towards the purge valve PUR. This causes the pressure of the treatment fluid in the ejector pump DP to rise. Therefore, when the purge valve PUR is opened, it is possible to further prevent the treatment fluid in the ejector pump DP from becoming negative pressure. Additionally, it allows the pressure in the ejector pump DP to decrease more slowly (see reference). Figure 10 (The symbol is DC5). If the pressure decreases relatively slowly, it can suppress the generation of bubbles in the treatment fluid.

[0186] [Example 3]

[0187] Next, Embodiment 3 of the present invention will be described with reference to the accompanying drawings. Furthermore, descriptions common to Embodiments 1 and 2 will be omitted. Figure 11 This is a diagram used to illustrate the purging action of Example 3. Figure 12 This is a graph used to illustrate the changes in pressure values ​​measured by the filling pressure sensor and the ejection pressure sensor, respectively, in Example 3.

[0188] Example 3 relates to a purging operation. In Example 2, the purging valve PUR is opened after the ejection pump DP begins to push the treatment fluid toward the purging valve PUR. In Example 3, the purging valve PUR can also be opened when the pressure value measured by the ejection pressure sensor SSD reaches a preset first purging pressure P7.

[0189] <4. Details of other purging actions in step S04>

[0190] Reference Figure 11 , Figure 12 The purging operation of Example 3 will be described below. Furthermore, in Example 3, both the outlet valve OT1 and the vent valve VNT are closed. Common descriptions are omitted.

[0191] Open the inlet valve IN (step S31, Figure 12 At time point t9). This causes the process fluid in the filling pump FP to escape upstream of the atmospheric pressure of the inlet valve IN (e.g., to the side of the process fluid bottle 23). Additionally, the process fluid in the return piping 85 from the purge valve PUR to the inlet valve IN and in the delivery piping 45 (pipes 45A, 45B) escape upstream of the atmospheric pressure of the inlet valve IN. Afterwards, after a predetermined time has elapsed since the inlet valve IN was opened, the inlet valve IN is closed (step S32). Figure 12 (Time point t10).

[0192] [Step S33] Adjusting the pressure of the ejector pump

[0193] After closing the inlet valve IN and before opening the purge valve PUR, the controller 101, with the inlet valve IN, outlet valve OT2, first intermediate valve ISO, second intermediate valve BAR, and purge valve PUR closed, adjusts the pressure of the processing fluid in the ejection pump DP so that the pressure value measured by the ejection pressure sensor SSD becomes the first purge pressure P7. Figure 12 (Time point t11A). As a result, the pressure of the treatment fluid in the ejector pump DP increases.

[0194] In step S33, the electric motor M2 of the ejector pump DP primarily moves the second lever 75 forward. Additionally, the electric motor M2 can also move the second lever 75 backward. The electric motor M2 continues to operate in steps S33 to S36.

[0195] [Step S34] Open the purge valve at a specified pressure.

[0196] When the pressure value measured by the ejection pressure sensor SSD reaches the first purge pressure P7, the controller 101 opens the purge valve PUR while the inlet valve IN, outlet valve OT2, first intermediate valve ISO, and second intermediate valve BAR are closed. Figure 12 (Time point t12A).

[0197] Additionally, after the purge valve PUR is opened, and with the purge valve PUR open and the inlet valve IN, outlet valve OT2, first intermediate valve ISO, and second intermediate valve BAR closed, the controller 101 adjusts the pressure of the processing fluid in the ejection pump DP so that the pressure value measured by the ejection pressure sensor SSD becomes the second purge pressure P8. That is, the pressure adjustment of the processing fluid in the ejection pump DP begins. Figure 12 (Time point t13A).

[0198] [Step S35] Start the operation of each pump at the specified pressure (actual purging operation)

[0199] Then, when the pressure value measured by the ejection pressure sensor SSD reaches the second purge pressure P8, the controller 101 causes the fill pump FP and the ejection pump DP to return the treatment fluid from the ejection pump DP to the fill pump FP through the return pipe 85, so as to maintain the second purge pressure P8 by the pressure value measured by the ejection pressure sensor SSD. Figure 12 (between time point t13B and time point t14). In other words, controller 101 performs the actual purging action. During this action, controller 101 is in a state where the purging valve PUR is open and the inlet valve IN, outlet valve OT2, first intermediate valve ISO, and second intermediate valve BAR are closed.

[0200] In the actual purging operation, the first rod 59 and the second rod 75 move by approximately the same amount. Furthermore, the electric motor M1 of the filling pump FP primarily causes the first rod 59 to move backward. The electric motor M1 can also cause the first rod 59 to move forward. The electric motor M1 continues to operate in steps S35-S36.

[0201] Furthermore, both the first purging pressure P7 and the second purging pressure P8 are positive values. The first purging pressure P7 is preferably greater than the filtration pressure P4D. The first purging pressure P7 is preferably greater than the second purging pressure P8. The second purging pressure P8 is preferably greater than both the filtration pressure P4D and the ejection pressure P9 (see reference). Figure 8 )Small.

[0202] [Steps S36~S38] Waiting for each pump to complete its operation ~ Closing of the purge valve

[0203] In the actual purging operation, wait for the filling pump FP and the discharge pump DP to complete their operation (step S36). When the pumps have completed their operation, stop the operation of each electric motor M1 and M2 (step S37). Then, close the purge valve PUR (step S28). Figure 12 (Time point t14).

[0204] According to this embodiment, the inlet valve IN is closed after a preset time has elapsed since it was opened, so that the pressure value measured by the ejection pressure sensor SSD will not become negative when the purge valve PUR is opened. Therefore, even if the purge valve PUR is opened, the pressure of the treatment fluid in the ejection pump DP will be prevented from becoming negative, and as a result, the generation of bubbles in the treatment fluid can be suppressed.

[0205] Furthermore, before opening the purge valve PUR, the ejector pump DP adjusts the pressure of the processing fluid within the ejector pump DP so that the pressure value measured by the ejection pressure sensor SSD becomes the first purge pressure P7. After opening the purge valve PUR, the ejector pump DP adjusts the pressure of the processing fluid within the ejector pump DP so that the pressure value measured by the ejection pressure sensor SSD becomes the second purge pressure P8. In other words, the processing fluid pressure is adjusted before and after the opening of the purge valve PUR. Therefore, when the purge valve PUR is opened, it is possible to further prevent the processing fluid within the ejector pump DP from becoming negative pressure. Additionally, it allows for a more gradual decrease in pressure within the ejector pump DP.

[0206] The present invention is not limited to the above embodiments, and can be implemented in variations as described below.

[0207] (1) In the above embodiment, the first pump mechanism 41 supplies processing liquid to two processing chambers 3A and 3B. Alternatively, the first pump mechanism 41 may supply processing liquid to one or more processing chambers.

[0209] (2) In the above-described embodiments and variations (1), a housing 5 is provided in the lower layer of the four processing chambers 3A to 3D. Alternatively, the housing 5 may not be provided. In this case, for example, the processing liquid bottle 23, the capture box 27, and the filling pump FP of the first pump mechanism 41 may also be located in the same layer as at least one of the processing chambers 3C and 3D.

[0210] (3) In the above embodiments and modifications, the front end of the return pipe 85 is connected to the first confluence pipe GR1 of the pipe 45B. In this respect, the front end of the return pipe 85 can also be connected to the filling pump FP. This allows the processing fluid transported by the return pipe 85 to be directly returned to the filling pump FP. However, since the filling pump FP is located on the same layer as the housing 5, the return pipe 85 becomes longer. As a result, particles may be easily generated.

[0211] (4) In the above embodiments and modifications, the substrate processing apparatus 1 includes a single tower having a plurality of processing chambers 3 and a housing 5 stacked in the vertical direction Z. In this respect, the substrate processing apparatus 1 may also have multiple towers. Each tower has a plurality of processing chambers 3 and a housing 5 stacked in the vertical direction Z.

[0212] (5) In the above embodiments and modifications, for example, the ejection pump DP of the first pump mechanism 41 is disposed outside the processing chamber 3B. Alternatively, the ejection pump DP may be disposed inside the processing chamber 3B.

[0213] (6) In the above embodiments and modifications, a vent pipe 39 equipped with a vent valve V2 is connected to the capture box 27. The capture box 27 can also be made to be at atmospheric pressure by opening the vent valve V2.

[0214] (7) In the above embodiments and modifications, the first intermediate valve ISO, the second intermediate valve BAR, and the filter 81 are respectively disposed on, for example, the same layer as the processing chamber 3B or a layer higher than the processing chamber 3B. In this respect, at least one of the first intermediate valve ISO, the second intermediate valve BAR, and the filter 81 may also be disposed on the same layer as the filling pump FP (e.g., the same layer as the housing 5).

[0215] For example, sometimes the first intermediate valve ISO is located on the same level as the fill pump FP, and the second intermediate valve BAR is located on the same level as the processing chamber 3B. In this case, when the second intermediate valve BAR is opened, the pressure of the processing fluid in the fill pump FP may drop significantly.

[0216] This invention can be implemented in other specific forms without departing from its idea or essence; therefore, as a description indicating the scope of the invention, reference should be made to the appended claims rather than the above description.

Claims

1. A substrate processing apparatus for processing a substrate, characterized in that, The substrate processing apparatus includes: Multiple processing chambers are stacked in the vertical direction; A liquid supply mechanism that supplies processing liquid to at least one of the plurality of processing chambers; Controller The plurality of processing chambers each have: A chuck that holds the substrate; A nozzle that sprays the processing liquid onto the substrate held by the chuck. The liquid supply mechanism has: A delivery piping system supplies the treatment liquid to the nozzle, i.e., the first nozzle, of the first treatment chamber among the plurality of treatment chambers; A filling pump is disposed in the delivery piping in a layer lower than the first processing chamber; A jet pump, which is disposed in the delivery piping between the filling pump and the first nozzle in the same layer as or higher than the first processing chamber; An inlet valve is located on the delivery piping upstream of the filling pump; An outlet valve is disposed in the delivery piping between the ejection pump and the first nozzle; A filter is disposed in the delivery piping between the filling pump and the ejection pump; A first intermediate valve is disposed in the delivery piping between the filling pump and the filter; A second intermediate valve is disposed in the delivery piping between the filter and the ejector pump. The filling pump includes a filling pressure sensor that measures the pressure of the processing fluid within the filling pump. The ejection pump includes: an ejection pressure sensor that measures the pressure of the treatment fluid inside the ejection pump. The controller is configured to perform pre-filtering and actual filtering actions sequentially. The controller performs the following actions as part of the pre-filtering action: With the inlet valve, the outlet valve, the first intermediate valve, and the second intermediate valve closed, the filling pump adjusts the pressure of the processing liquid inside the filling pump so that the pressure value measured by the filling pressure sensor becomes the first supply pressure. When the pressure value measured by the filling pressure sensor reaches the first supply pressure, the first intermediate valve is opened, thereby pushing the processing fluid into the second intermediate valve; During the period from the opening of the first intermediate valve to the opening of the second intermediate valve, with the inlet valve and the second intermediate valve closed, the filling pump adjusts the pressure of the processing fluid inside the filling pump so that the pressure value measured by the filling pressure sensor becomes the second supply pressure. After the first intermediate valve is opened, with the outlet valve and the second intermediate valve closed, the ejection pump adjusts the pressure of the processing liquid inside the ejection pump so that the pressure value measured by the ejection pressure sensor becomes the third supply pressure. When the pressure value measured by the ejection pressure sensor reaches the third supply pressure, the second intermediate valve is opened. The controller performs the following actions as the actual filtering action: The treatment fluid is delivered from the filling pump to the ejection pump with the inlet valve and the outlet valve closed.

2. The substrate processing apparatus according to claim 1, characterized in that, The liquid supply mechanism also has: The return piping connects the discharge pump to the return position of the delivery piping between the first intermediate valve and the inlet valve; A purge valve, which is located on the return piping, The controller is configured to perform the following actions as a purging action: With the first intermediate valve and the purge valve closed, the inlet valve is opened, thereby allowing the processing fluid from the fill pump to escape upstream of the inlet valve at atmospheric pressure. After a preset time has elapsed since the inlet valve was opened, the inlet valve is closed so that the pressure value measured by the ejection pressure sensor does not become negative when the purge valve is opened; After closing the inlet valve, with the outlet valve, the first intermediate valve, and the second intermediate valve closed, the purge valve is opened. After the purge valve is opened, with the purge valve open and the inlet valve, the outlet valve, the first intermediate valve, and the second intermediate valve closed, the filling pump and the ejection pump are subjected to an actual purge action to return the treatment liquid from the ejection pump toward the filling pump through the return piping.

3. The substrate processing apparatus according to claim 2, characterized in that, The controller performs the following actions as the purging action: After closing the inlet valve and before opening the purge valve, with the outlet valve, the second intermediate valve, and the purge valve closed, the treatment fluid begins to be pushed from the ejector pump toward the purge valve and through the return piping back to the ejector pump. The controller performs the following actions to open the purge valve as part of the purge action: After a predetermined time has elapsed since the processing fluid was first introduced through the return piping, the purge valve is opened while the inlet valve, the outlet valve, the first intermediate valve, and the second intermediate valve are closed.

4. The substrate processing apparatus according to claim 2, characterized in that, The controller performs the following actions as the purging action: After closing the inlet valve and before opening the purge valve, with the outlet valve, the second intermediate valve, and the purge valve closed, the ejector pump adjusts the pressure of the treatment fluid within the ejector pump so that the pressure value measured by the ejector pressure sensor becomes the first purge pressure. The controller performs the following actions to open the purge valve as part of the purge action: When the pressure value measured by the ejection pressure sensor reaches the first purge pressure, the purge valve is opened while the inlet valve, the outlet valve, the first intermediate valve, and the second intermediate valve are closed. The controller performs the following actions as the purging action: After opening the purge valve, with the inlet valve, outlet valve, first intermediate valve, and second intermediate valve closed, the ejector pump adjusts the pressure of the treatment fluid within it so that the pressure value measured by the ejection pressure sensor becomes the second purge pressure. The controller performs the following actions as the actual blowing action: When the pressure value measured by the ejection pressure sensor reaches the second purge pressure, with the purge valve open and the inlet valve, the outlet valve, the first intermediate valve, and the second intermediate valve closed, the filling pump and the ejection pump return the treatment fluid from the ejection pump toward the filling pump through the return piping, so that the pressure value measured by the ejection pressure sensor maintains the second purge pressure.

5. The substrate processing apparatus according to claim 1, characterized in that, The first intermediate valve, the second intermediate valve, and the filter are respectively disposed on the same layer as the first processing chamber or on a layer higher than the first processing chamber.

6. The substrate processing apparatus according to claim 2, characterized in that, The purge valve and the return position are respectively configured on the same layer as the first processing chamber or on a layer higher than the first processing chamber.

7. The substrate processing apparatus according to claim 1, characterized in that, The filling pump has: The first storage space stores the treatment liquid; The first volume-changing component causes a change in the volume of the first storage space; The first pump drive mechanism actuates the pump by activating the first volume change component. The filling pressure sensor is configured to measure the pressure of the processing liquid within the first storage space. The ejection pump has: The second storage space stores the treatment liquid; The second volume-changing component causes the volume of the second storage space to change; The second pump drive mechanism actuates the pump by activating the second volume change component. The ejection pressure sensor is configured to measure the pressure of the treatment liquid in the second storage space.

8. A substrate processing apparatus for processing a substrate, characterized in that, The substrate processing apparatus includes: Multiple processing chambers are stacked in the vertical direction; A liquid supply mechanism that supplies processing liquid to at least one of the plurality of processing chambers; Controller The plurality of processing chambers each have: A chuck that holds the substrate; A nozzle that sprays the processing liquid onto the substrate held by the chuck. The liquid supply mechanism has: A delivery piping system supplies the treatment liquid to the nozzle, i.e., the first nozzle, of the first treatment chamber among the plurality of treatment chambers; A filling pump is disposed in the delivery piping in a layer lower than the first processing chamber; A jet pump, which is disposed in the delivery piping between the filling pump and the first nozzle in the same layer as or higher than the first processing chamber; An inlet valve is located on the delivery piping upstream of the filling pump; An outlet valve is disposed in the delivery piping between the ejection pump and the first nozzle; A first intermediate valve is disposed in the delivery piping between the filling pump and the ejection pump; The return piping connects the discharge pump to the return position of the delivery piping between the first intermediate valve and the inlet valve; A purge valve is provided on the return piping. The filling pump includes a filling pressure sensor that measures the pressure of the processing fluid within the filling pump. The ejection pump includes: an ejection pressure sensor that measures the pressure of the treatment fluid inside the ejection pump. The controller is configured to perform the following actions as a purging action: With the outlet valve, the first intermediate valve, and the purge valve closed, the inlet valve is opened, thereby allowing the processing fluid from the fill pump to escape upstream of the inlet valve at atmospheric pressure. After a preset time has elapsed since the inlet valve was opened, the inlet valve is closed so that the pressure value measured by the ejection pressure sensor does not become negative when the purge valve is opened; After closing the inlet valve, and with the outlet valve and the first intermediate valve closed, the purge valve is opened. After opening the purge valve, with the outlet valve and the first intermediate valve closed, an actual purge action is performed to return the treatment fluid from the spray pump to the filling pump through the return pipe.

9. A control method for a substrate processing apparatus for processing a substrate, characterized in that, The substrate processing apparatus includes: Multiple processing chambers are stacked in the vertical direction; A liquid supply mechanism supplies processing liquid to at least one of the plurality of processing chambers. The plurality of processing chambers each have: A chuck that holds the substrate; A nozzle that sprays the processing liquid onto the substrate held by the chuck. The liquid supply mechanism has: A delivery piping system supplies the treatment liquid to the nozzle, i.e., the first nozzle, of the first treatment chamber among the plurality of treatment chambers; A filling pump is disposed in the delivery piping in a layer lower than the first processing chamber; A jet pump, which is disposed in the delivery piping between the filling pump and the first nozzle in the same layer as or higher than the first processing chamber; An inlet valve is located on the delivery piping upstream of the filling pump; An outlet valve is disposed in the delivery piping between the ejection pump and the first nozzle; A filter is disposed in the delivery piping between the filling pump and the ejection pump; A first intermediate valve is disposed in the delivery piping between the filling pump and the filter; A second intermediate valve is disposed in the delivery piping between the filter and the ejector pump. The filling pump includes a filling pressure sensor that measures the pressure of the processing fluid within the filling pump. The ejection pump includes: an ejection pressure sensor that measures the pressure of the treatment fluid inside the ejection pump. The control method includes the following actions as pre-filtering actions: With the inlet valve, the outlet valve, the first intermediate valve, and the second intermediate valve closed, the filling pump adjusts the pressure of the processing liquid inside the filling pump so that the pressure value measured by the filling pressure sensor becomes the first supply pressure. When the pressure value measured by the filling pressure sensor reaches the first supply pressure, the first intermediate valve is opened, thereby pushing the processing fluid into the second intermediate valve; During the period from the opening of the first intermediate valve to the opening of the second intermediate valve, with the inlet valve and the second intermediate valve closed, the filling pump adjusts the pressure of the processing fluid inside the filling pump so that the pressure value measured by the filling pressure sensor becomes the second supply pressure. After the first intermediate valve is opened, with the outlet valve and the second intermediate valve closed, the ejection pump adjusts the pressure of the processing liquid inside the ejection pump so that the pressure value measured by the ejection pressure sensor becomes the third supply pressure. When the pressure value measured by the ejection pressure sensor reaches the third supply pressure, the second intermediate valve is opened. Following the pre-filtering action, the control method further includes the following actions as the actual filtering action: With the inlet valve and the outlet valve closed, the treatment fluid is delivered from the filling pump to the ejection pump.

10. A control method for a substrate processing apparatus for processing a substrate, characterized in that, The substrate processing apparatus includes: Multiple processing chambers are stacked in the vertical direction; A liquid supply mechanism supplies processing liquid to at least one of the plurality of processing chambers. The plurality of processing chambers each have: A chuck that holds the substrate; A nozzle that sprays the processing liquid onto the substrate held by the chuck. The liquid supply mechanism has: A delivery piping system supplies the treatment liquid to the nozzle, i.e., the first nozzle, of the first treatment chamber among the plurality of treatment chambers; A filling pump is disposed in the delivery piping in a layer lower than the first processing chamber; A jet pump, which is disposed in the delivery piping between the filling pump and the first nozzle in the same layer as or higher than the first processing chamber; An inlet valve is located on the delivery piping upstream of the filling pump; An outlet valve is disposed in the delivery piping between the ejection pump and the first nozzle; A first intermediate valve is disposed in the delivery piping between the filling pump and the ejection pump; The return piping connects the discharge pump to the return position of the delivery piping between the first intermediate valve and the inlet valve; A purge valve is provided on the return piping. The filling pump includes a filling pressure sensor that measures the pressure of the processing fluid within the filling pump. The ejection pump includes: an ejection pressure sensor that measures the pressure of the treatment fluid inside the ejection pump. The control method has the following actions as a purging action: With the outlet valve, the first intermediate valve, and the purge valve closed, the inlet valve is opened, thereby allowing the processing fluid from the fill pump to escape upstream of the inlet valve at atmospheric pressure. After a preset time has elapsed since the inlet valve was opened, the inlet valve is closed so that the pressure value measured by the ejection pressure sensor does not become negative when the purge valve is opened; After closing the inlet valve, and with the outlet valve and the first intermediate valve closed, the purge valve is opened. After opening the purge valve, with the outlet valve and the first intermediate valve closed, an actual purge action is performed to return the treatment fluid from the spray pump to the filling pump through the return pipe.

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