Substrate processing apparatus

Abstract

This invention provides a substrate processing apparatus capable of performing gas-liquid separation in a space-saving manner. The substrate processing apparatus includes: a rotating base for holding a substrate; a rotating shaft mounted on the rotating base; a rotating motor for rotating the rotating shaft about a vertically extending axis of rotation; a nozzle for supplying processing liquid to the substrate held on the rotating base; a bottomed cylindrical lower cup disposed around and below the rotating base; an annular middle cup located below the rotating base and above the bottom wall of the lower cup; and a cylindrical airflow distribution plate erected from the bottom wall of the lower cup towards the middle cup. The airflow distribution plate has a plurality of openings. The lower cup has: an exhaust port disposed radially inward of the airflow distribution plate; and a liquid discharge port disposed radially inward of the airflow distribution plate.

Description

Technical Field

[0001] The subject matter disclosed in this specification relates to substrate processing apparatus. Background Technology

[0002] In the manufacturing process of liquid crystal display devices and semiconductor devices, circuit patterns are formed on substrates such as glass substrates and semiconductor wafers. Specifically, these substrates undergo development, etching, or resist stripping processes. During these processes, a developer, etchant, or stripping solution is supplied to the substrate for a prescribed treatment, followed by a cleaning solution such as pure water for cleaning. Furthermore, in recent years, the above-mentioned processes have also been applied to substrates used in panel-level packages (PLPs), which are so-called semiconductor packaging substrates.

[0003] For example, Patent Document 1 discloses a substrate processing apparatus for performing a developing process. This substrate processing apparatus includes: a rotating chuck for holding the substrate in a horizontal position and rotating the substrate; a nozzle for supplying developing solution to the substrate; and a cup surrounding the substrate held by the rotating chuck. During the developing process, developing solution is supplied from the nozzle to the substrate rotating via the rotating chuck. During the developing process, the developing solution supplied to the substrate disperses around the substrate. Most of the developing solution dispersed around the substrate is caught and recovered by the cup.

[0004] The developer and cleaning solution that scatters from the substrate diffuses within the cup, generating mist. In Patent Document 1, to recover this mist from the processing solution, a gas-liquid separator is installed in a drain pipe connected to the bottom of the cup. After the processing solution falls to the bottom of the cup, it flows into the gas-liquid separator through the drain pipe. Then, the gas and liquid are separated by the gas-liquid separator; the gas is discharged by an exhaust blower, and the liquid is appropriately recovered.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2010-010555

[0008] However, as with existing technologies, when the gas-liquid separator is placed within the exhaust pipe, it is necessary to further ensure installation space within a limited device size, thus hindering the miniaturization of the device. Furthermore, when the gas-liquid separator is positioned below the cup, the processing position of the substrate increases, consequently raising the maintenance space and the path used for moving the substrate in and out relative to the substrate processing device. Therefore, a space-saving approach to gas-liquid separation is required. Summary of the Invention

[0009] The purpose of this invention is to provide a technology that can perform gas-liquid separation in a space-saving manner.

[0010] To address the aforementioned issues, a first approach is a substrate processing apparatus comprising: a chuck for holding a substrate; a rotating shaft mounted on the chuck; a motor for rotating the rotating shaft about a rotation axis extending vertically; a nozzle for supplying processing liquid to the substrate held in the chuck; a bottomed cylindrical lower cup disposed around and below the chuck; an annular middle cup located below the chuck and above the bottom of the lower cup; and a cylindrical airflow distribution member extending upward from the bottom of the lower cup toward the middle cup, the airflow distribution member having at least one opening, the lower cup having: an exhaust port disposed radially inward of the airflow distribution member; and a drain port disposed radially inward of the airflow distribution member.

[0011] The second approach is a substrate processing apparatus of the first approach, wherein the airflow distribution member has a plurality of the openings arranged circumferentially.

[0012] The third method is a substrate processing apparatus of the first or second method, wherein a gap is formed between the lower end of the middle cup and the bottom surface of the lower cup, and the opening is located above the gap.

[0013] The fourth method is a substrate processing apparatus of any one of the first to third methods, wherein the middle cup has a portion that tilts inward toward the radial direction as it faces upward.

[0014] The fifth embodiment is a substrate processing apparatus in any one of the first to fourth embodiments, further comprising: a stand on which the motor is mounted and supports the lower cup; a drive pulley mounted on the drive shaft of the motor; a driven pulley mounted on the rotating shaft; and a drive belt mounted on the drive pulley and the driven pulley.

[0015] The effects of the invention

[0016] According to the substrate processing apparatus of the first to fifth embodiments, gas-liquid separation can be performed by an airflow distribution member provided with an opening. Therefore, a gas-liquid separator can be omitted, thus saving space during gas-liquid separation.

[0017] According to the substrate processing apparatus of the second method, by providing a plurality of openings, it is possible to reduce the concentration of exhaust gas near the exhaust port.

[0018] According to the third-party substrate processing device, it is possible to suppress the liquid contained in the mist that has passed through the gap from passing through the opening. Attached Figure Description

[0019] Figure 1 This is a top view schematically illustrating the structure of a substrate processing system having the substrate processing apparatus according to the embodiments.

[0020] Figure 2 This is a schematic cross-sectional view showing the structure of the substrate processing apparatus involved in the embodiment.

[0021] Figure 3 It means Figure 2 The diagram shows the lower cup and the airflow distribution plate.

[0022] Figure 4 This is a control block diagram of the substrate processing device.

[0023] Figure 5 This is a schematic cross-sectional view showing the structure of the substrate processing apparatus involved in the modified example.

[0024] Explanation of reference numerals in the attached figures

[0025] 10: Substrate processing apparatus

[0026] 21: Rotating base (chuck)

[0027] 25: Rotation axis

[0028] 31: Nozzle

[0029] 41: Next cup

[0030] 43: Medium Cup

[0031] 50: Airflow distribution plate

[0032] 51: Opening

[0033] 281: Drive pulley

[0034] 283: Driven pulley

[0035] 285: Drive belt

[0036] 611: Exhaust port

[0037] 631: Drain port

[0038] A1: Axis of rotation

[0039] H: Gap

[0040] W: substrate Detailed Implementation

[0041] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Furthermore, in the drawings, for ease of understanding, the dimensions and quantities of various parts are sometimes exaggerated or simplified.

[0042] <1. Implementation Method>

[0043] Figure 1 This is a top view schematically illustrating the structure of a substrate processing system having the substrate processing apparatus 10 according to the embodiment. The substrate processing system 100 is, for example, installed in a cleanroom. The substrate processing system 100 has a plurality of substrate processing apparatuses 10. Each substrate processing apparatus 10 is an apparatus for processing substrates W one by one. Each substrate processing apparatus 10 receives a rectangular substrate W, for example, for PLP (Plastic Pulse Surface Mount), and supplies developing solution to its upper surface for developing. Figure 1 In the example shown, four substrate processing devices 10 are arranged in the same horizontal plane.

[0044] The substrate processing system 100 has a substrate processing area 110 for processing rectangular substrates W. A transfer unit 120 is disposed adjacent to the substrate processing area 110. The transfer unit 120 is, for example, an EFEM (Equipment Front End Module) and has a container holding part 121 for holding a container C containing the substrates W. The container C is capable of holding a plurality of substrates W in a sealed state. In each container C, a plurality of substrates W are held in a generally horizontal position. The container C includes, for example, a FOUP (Front Opening Unified Pod), an SMIF (Standard Mechanical Interface) box, and an OC (Open Cassette). The transfer unit 120 has a transfer robot 122. The transfer robot 122 accesses the container C held by the container holding part 121, removes the unprocessed substrate W from the container C, and stores the processed substrate W into the container C.

[0045] The transport manipulator 122 has a base portion 122a fixed to the device housing, a multi-joint arm 122b, and a hand 122c. The multi-joint arm 122b is configured to rotate about a vertical axis relative to the base portion 122a. The hand 122c is mounted on the top of the multi-joint arm 122b.

[0046] The substrate processing system 100 includes a substrate handling robot 111 and a mounting stage 112. The substrate handling robot 111 is disposed approximately in the center of the substrate processing area 110. The mounting stage 112 is disposed in the substrate processing area 110. The mounting stage 112 is a stage for receiving substrate W from the transfer robot 122.

[0047] Figure 2This is a schematic cross-sectional view showing the structure of the substrate processing apparatus 10 according to the embodiment. The substrate processing apparatus 10 rotates the substrate W about a rotation axis A1 in the vertical direction and supplies a processing liquid (developer or rinse liquid) to the upper surface Wf of the substrate W to process the substrate W. In the following description, the direction of rotation about the rotation axis A1 is referred to as the "circumferential direction". In addition, the direction in which a straight line orthogonal to the rotation axis A1 extends is referred to as the "radial direction". The radial direction toward the rotation axis A1 is defined as the radial inner side, and the radial direction away from the rotation axis A1 is defined as the radial outer side.

[0048] The substrate processing apparatus 10 has a box-shaped chamber 11. The chamber 11 has an inlet / outlet 14 and a baffle 15. The inlet / outlet 14 and the baffle 15 are disposed on the side wall of the chamber 11. The inlet / outlet 14 is a through hole for the substrate W to pass through. The baffle 15 controls the opening and closing of the inlet / outlet 14. Figure 2 As shown, with the baffle 15 open, the substrate W is moved into the chamber 11 via the loading / unloading outlet 14.

[0049] The substrate processing apparatus 10 includes a rotary chuck unit 20. The rotary chuck unit 20 includes a rotary base 21, a suction pump 22, a suction pipe 23, a suction valve 24, a rotary shaft 25, a rotary motor 26, a motor housing 27, and a power transmission mechanism 28. Furthermore, the suction pump 22 may not be installed in the substrate processing apparatus 10 if the factory's public facilities are used as the suction source (negative pressure source).

[0050] The rotating base 21 (chuck) is a device that horizontally holds the substrate W and rotates it. A plurality of suction grooves are radially formed on the upper surface of the rotating base 21. Additionally, a suction hole communicating with the plurality of suction grooves is provided at the center of the upper surface of the rotating base 21. Alternatively, a plurality of suction holes may be provided within the suction grooves. The suction hole is connected to the suction pump 22 (or suction source) via a suction pipe 23. A suction valve 24 is located midway through the suction pipe 23. The suction valve 24 opens and closes the flow path of the suction pipe 23 based on commands from the control unit 80. The suction valve 24 is, for example, a solenoid valve.

[0051] The rotating shaft 25 has a cylindrical shape extending vertically. The rotating shaft 25 is connected to the central portion of the lower surface of the rotating base 21. The rotating motor 26 rotates the rotating base 21 and the rotating shaft 25 about the rotation axis A1 based on commands from the control unit 80. The rotating motor 26 is arranged radially outward relative to the rotating shaft 25.

[0052] Motor housing 27 houses rotary motor 26. The output shaft (shaft) of rotary motor 26 protrudes upward from motor housing 27. Lower cup 41 is fixed to the upper surface of motor housing 27. Motor housing 27 is a support for lower cup 41.

[0053] The power transmission mechanism 28 has a drive pulley 281, a driven pulley 283, and a drive belt 285. The drive pulley 281 is integrated with the output shaft of the rotary motor 26. The driven pulley 283 is fixed to the lower end of the rotating shaft 25. The drive belt 285 is an annular belt mounted on the drive pulley 281 and the driven pulley 283.

[0054] The rotation of the output shaft in the rotary motor 26 is transmitted to the drive pulley 281. The drive pulley 281 rotates the driven pulley 283 via the drive belt 285. As a result, the rotary shaft 25 rotates about the rotation axis A1.

[0055] The suction pump 22 operates based on commands from the control unit 80, and the suction valve 24 opens the flow path of the suction pipe 23 based on commands from the control unit 80. As a result, the suction orifice draws in the atmosphere of the suction tank, creating a negative pressure lower than atmospheric pressure within the suction tank. Consequently, the center of the lower surface of the substrate W, which is placed on the upper surface of the rotating base 21, is attracted to the rotating base 21.

[0056] The substrate processing apparatus 10 includes a processing liquid supply unit 30. The processing liquid supply unit 30 is a device for supplying processing liquid to the upper surface Wf of a rotating substrate W. The processing liquid supply unit 30 includes a nozzle 31, a nozzle moving part 32, a pipe 33, branch pipes 34 and 35, and supply valves 36 and 37.

[0057] Nozzle 31 has a downward-facing outlet. Nozzle moving unit 32 moves nozzle 31 horizontally based on commands from control unit 80. Specifically, nozzle moving unit 32 moves nozzle 31 between a position above the center of the upper surface Wf of substrate W and a position away from substrate W in the horizontal direction. Nozzle moving unit 32 may include, for example, an arm supporting nozzle 31 and a motor that rotates the arm in the horizontal plane. Alternatively, nozzle moving unit 32 may also have an actuator that moves nozzle 31 vertically. The actuator may include a pneumatic cylinder or a hydraulic cylinder.

[0058] Nozzle 31 is connected to piping 33. Piping 33 branches into two sub-pipes 34 and 35. Sub-pipe 34 is connected to the flow path of a tank (not shown) containing developer. Supply valve 36 is located in the middle of sub-pipe 34. Supply valve 36 opens and closes the flow path of sub-pipe 34 based on commands from control unit 80. Sub-pipe 35 is connected to the flow path of a tank (not shown) containing rinsing solution. If the rinsing solution is pure water, sub-pipe 35 can also be connected to a pure water source flow path, which is a public utility of the plant. Supply valve 37 opens and closes the flow path of sub-pipe 35 based on commands from control unit 80.

[0059] According to the command from the control unit 80, when the supply valve 36 is opened and the supply valve 37 is closed, the nozzle 31 sprays developer solution downward from the nozzle outlet. Thus, by supplying developer solution to the upper surface Wf of the substrate W, a developing process is performed on the substrate W. On the other hand, when the supply valve 37 is opened and the supply valve 36 is closed according to the command from the control unit 80, the nozzle 31 sprays rinsing solution downward from the nozzle outlet. Thus, by supplying rinsing solution to the upper surface Wf of the substrate W, a rinsing process is performed on the substrate W.

[0060] The substrate processing apparatus 10 includes a cup unit 40. The cup unit 40 is a component for recovering the processing liquid ejected from the substrate W during the development and rinsing processes. The cup unit 40 includes a lower cup 41, a protective member 42, and a middle cup 43. The rotation axis 25 and the cup unit 40 are coaxially arranged about the rotation axis A1.

[0061] The lower cup 41 is a bottomed cylindrical container disposed around and below the rotating base 21. Specifically, the lower cup 41 has a bottom wall portion 411, a side wall portion 413, and an inner wall portion 415. The bottom wall portion 411 is circular in shape when viewed from above, and has a vertical through hole in the center. A rotating shaft 25 is inserted into the through hole of the bottom wall portion 411. The side wall portion 413 is a cylindrical shape that rises vertically from the outer peripheral end of the bottom wall portion 411. The inner wall portion 415 is a cylindrical shape that rises vertically from the inner peripheral end of the bottom wall portion 411.

[0062] The protective member 42 catches the processing liquid carried outward from the substrate W by the airflow generated as the substrate W rotates. The protective member 42 is a cylindrical shape that tilts radially inward as it faces upward. The protective member 42 is movable in the vertical direction relative to the lower cup 41.

[0063] The protective member 42 is equipped with a lifting unit 421. Based on commands from the control unit 80, the lifting unit 421 causes the protective member 42 to move vertically between an upper position (the position shown by the double-dotted line) and a lower position (the position shown by the solid line). The lifting unit 421 includes a motor as a drive source and a guide member that guides the protective member 42 to move vertically. The drive mechanism for the lifting unit 421 can be, for example, a linear motor mechanism or a ball screw mechanism.

[0064] When the protective member 42 is in the upper position, the upper end of the protective member 42 is located above the position of the substrate W supported by the rotating base 21 (support position). When the protective member 42 is in the lower position, the upper end of the protective member 42 is located below the support position of the substrate W.

[0065] The middle cup 43 is located above the bottom wall portion 411 of the lower cup 41. The middle cup 43 is a ring-shaped component when viewed from above. The middle cup 43 has an upper wall portion 431 and an outer wall portion 433. The inner circumferential end of the upper wall portion 431 is fixed to the outer surface of the inner wall portion 415 of the lower cup 41. The upper wall portion 431 slopes radially outwards towards the lower surface, forming a mountain-shaped overall structure. The outer wall portion 433 has a cylindrical shape extending vertically downwards from the outer circumferential end of the upper wall portion 431. The lower end of the upper wall portion 431 is located upwards from the bottom wall portion 411 of the lower cup 41.

[0066] The substrate processing apparatus 10 includes a dividing plate 47 and a cylindrical portion 48. The dividing plate 47 is circular in shape when viewed from above. It divides the processing space and non-processing space of the substrate processing apparatus 10. A vertically oriented through-hole is formed in the center of the dividing plate 47. When processing the substrate W with a processing liquid, the nozzle 31 supplies the processing liquid to the substrate W through the through-hole of the dividing plate 47.

[0067] The cylindrical portion 48 has a cylindrical shape extending downward from the outer edge of the dividing plate 47. The inner diameter of the cylindrical portion 48 is larger than the outer diameter of the upper end of the protective member 42. The cylindrical portion 48 is positioned so that the upper end of the protective member 42 can be inserted into the inner side of the cylindrical portion 48. Thus, when the protective member 42 rises, the upper end of the protective member 42 can be inserted into the cylindrical portion 48 without contacting it.

[0068] The substrate processing apparatus 10 includes an airflow distribution plate 50 (airflow distribution member). The airflow distribution plate 50 is cylindrical (cylindrical or square, etc.). The airflow distribution plate 50 is radially disposed at a position that is inside the outer wall portion 433 of the middle cup 43 and outside the inner wall portion 415 of the lower cup 41. The airflow distribution plate 50 is vertically disposed between the bottom wall portion 411 of the lower cup 41 and the upper wall portion 431 of the middle cup 43. The airflow distribution plate 50 rises upward from the bottom surface (upper surface of the bottom wall portion 411) of the lower cup 41 to the inner surface of the upper wall portion 431 of the middle cup 43. That is, the lower end of the airflow distribution plate 50 contacts the bottom wall portion 411, and the upper end of the airflow distribution plate 50 contacts the upper wall portion 431 of the middle cup 43.

[0069] Figure 3 This is a perspective view showing the airflow distribution plate 50 disposed within the lower cup 41. Furthermore, in Figure 3 The image shows the upper part of the lower cup 41 cut off. The airflow distribution plate 50 has a plurality of openings 51 arranged circumferentially. Each opening 51 is a through hole that radially penetrates the airflow distribution plate 50. The shape of the opening 51 is, for example, generally rectangular when viewed from the front. However, the shape of the opening 51 can be arbitrarily changed. The circumferential length of the opening 51 is shorter than the circumferential length (circumference) of the airflow distribution plate 50. The plurality of openings 51 are arranged at equal angular intervals in the circumferential direction. In this embodiment, the eight openings 51 are arranged at 45° (=360 / 8) intervals. However, it is not necessary for the openings 51 to be arranged at equal angular intervals.

[0070] like Figure 2 and Figure 3 As shown, each opening 51 is disposed upwards, separated from the bottom wall portion 411 of the lower cup 41. The lower end of the opening 51 is located further upwards than the lower end of the outer wall portion 433 of the middle cup 43. That is, the lower end of each opening 51 is located upwards relative to the annular gap H between the bottom wall portion 411 of the lower cup 41 and the outer wall portion 433 of the middle cup 43.

[0071] The substrate processing apparatus 10 has a plurality of exhaust pipes 61 and a plurality of drain pipes 63. The plurality of exhaust pipes 61 direct the atmosphere within the chamber 11 to an exhaust device disposed outside the chamber 11. The exhaust device includes, for example, a pump or a fan. Alternatively, the exhaust device can also be an exhaust source for a common facility in the factory. The plurality of exhaust pipes 61 can also be merged into a single pipe along the way. Figure 3As shown, each exhaust pipe 61 is inserted into a through hole in the bottom wall portion 411 of the lower cup 41. The exhaust port 611, which is the open end of the exhaust pipe 61, is located above the bottom wall portion 411 and is arranged vertically upward. The exhaust port 611 is radially positioned inside the airflow distribution plate 50. The exhaust port 611 is positioned below the opening portion 51 of the airflow distribution plate 50. That is, in the vertical direction, the exhaust port 611 is positioned between the opening portion 51 and the bottom wall portion 411.

[0072] A plurality of exhaust ports 611 are arranged at equal angular intervals in the circumferential direction. In this example, four exhaust pipes 61 are fixed to the bottom wall portion 411. Moreover, the four exhaust ports 611 are arranged at 90° (=360 / 4) intervals in the circumferential direction on the bottom wall portion 411. However, it is not necessary for the plurality of exhaust ports 611 to be arranged at equal angular intervals.

[0073] By providing a plurality of openings 51 on the airflow distribution plate 50, exhaust gas can be prevented from concentrating near the openings 51 of the exhaust ports 611. Furthermore, the plurality of openings 51 and the plurality of exhaust ports 611 are staggered in that their positions (angles) do not overlap. In this example, eight openings 51 are positioned at 0°, 45°, 90°, 135°, 180°, 225°, 270°, and 315°, while four exhaust ports 611 are positioned at 22.5°, 112.5°, 202.5°, and 292.5°. Thus, by staggering the positions of the openings 51 and the exhaust ports 611, exhaust gas can be prevented from being directed towards specific openings 51.

[0074] A plurality of drain pipes 63 are respectively connected to a plurality of through holes provided in the bottom wall portion 411 of the lower cup 41. When the substrate W is processed with the processing liquid, the plurality of drain pipes 63 guide the processing liquid flowing from the protective member 42 into the bottom wall portion 411 of the lower cup 41 to a drain device provided outside the chamber 11. The drain device includes a pump for pressurizing the processing liquid and a tank for storing the processing liquid.

[0075] The drain port 631, which serves as the opening end of the drain pipe 63, is located at the same position as or slightly lower than the upper surface (bottom surface) of the bottom wall portion 411. Vertically, the drain port 631 is located lower than the exhaust port 611 of the exhaust pipe 61. The drain ports 631 are arranged at equal angular intervals in the circumferential direction. In this example, two drain pipes 63 are fixed to the bottom wall portion 411. Furthermore, the two drain ports 631 are arranged at 180° (=360 / 2) intervals on the bottom wall portion 411. Additionally, the upper surface of the bottom wall portion 411 in the lower cup 41 can also slope downwards as it approaches the drain port 631. This allows the processing liquid to be guided into the drain port 631.

[0076] Figure 4This is a control block diagram of the substrate processing apparatus 10. The control unit 80 is a unit for controlling the operation of various parts of the substrate processing apparatus 10. The control unit 80 includes a processor 81, a memory 83, and an auxiliary storage device 85.

[0077] Processor 81 includes a CPU (Central Processing Unit) or an MPU (Microprocessing Unit). Processor 81 may include a general-purpose computer, a special-purpose computer, a GPU (Graphics Processing Unit), an NPU (Neural Network Processing Unit), or a quantum computer. Special-purpose arithmetic units include, for example, ASICs (Application Specific Integrated Circuits).

[0078] Memory 83 includes a main storage device. The main storage device is, for example, a semiconductor memory such as RAM (Random-Access Memory). Memory 83 may include non-volatile memory such as ROM (Read-Only Memory) for storing programs and data. Auxiliary storage device 85 is, for example, a solid-state drive (SSD) or a hard disk drive (HDD). Auxiliary storage device 85 may include removable media such as a USB flash drive.

[0079] The auxiliary storage device 85 stores a computer program P1. The computer program P1 includes a program for controlling the operation of the substrate processing device 10. The processor 81 controls the operating elements of the substrate processing device 10 by reading the computer program P1 from the auxiliary storage device 85 into the memory 83 and executing it.

[0080] The control unit 80 is electrically connected to the input unit 87 and the output unit 88. The input unit 87 inputs instructions or data corresponding to the operator's actions to the control unit 80. The input unit 87 includes, for example, a keyboard 871 and a mouse 873. The input unit 87 may include a reading device for reading data from a removable medium. The output unit 88 includes a display 881 that displays various information. The display 881 is, for example, a liquid crystal display (LCD) or an organic EL (Electroluminescent) display. Furthermore, the input unit 87 may also include a touch panel sensor overlapping the display surface of the display 881. The output unit 88 may include a speaker, a printer, or indicator lights.

[0081] The control unit 80 is electrically connected to the suction pump 22, suction valve 24, rotary motor 26, nozzle moving part 32, supply valves 36 and 37, and lifting part 421. By controlling these components, the substrate W is processed using a treatment liquid. Specifically, the control unit 80 controls the suction pump 22 and suction valve 24 to horizontally hold the substrate W, which has been moved into the chamber 11, using the rotating base 21 (chuck). Next, the control unit 80 controls the lifting part 421 to position the protective member 42 in the upper position. Additionally, the control unit 80 controls the nozzle moving part 32 to position the nozzle 31 above the center of the upper surface Wf of the substrate W. Next, the control unit 80 controls the rotary motor 26 to rotate the substrate W about a vertical rotation axis A1 passing through the center WC of the substrate W. In this state, the control unit 80 controls the supply valves 36 and 37 to supply the treatment liquid (developer or rinse liquid) from the nozzle 31 to the rotating substrate W.

[0082] During substrate processing, air is drawn into the exhaust port 611 via an exhaust device, thereby generating an airflow towards the exhaust port 611 within the cup unit 40. Specifically, airflow is generated sequentially passing through the gap H between the protective member 42 and the middle cup 43, between the lower cup 41 and the middle cup 43, between the middle cup 43 and the lower cup 41, and through a plurality of openings 51 of the airflow distribution plate 50. The space radially outer of the airflow distribution plate 50 and the space radially inner of the airflow distribution plate 50 are connected only through the plurality of openings 51. Therefore, when air is drawn into the exhaust port 611, the atmosphere passing through the gap H is drawn into the exhaust port 611 only through the plurality of openings 51.

[0083] The processing liquid supplied from nozzle 31 to substrate W is dispersed laterally due to the rotation of substrate W and collides with protective member 42. The mist generated in this collision enters the middle cup 43 through the gap H between the lower cup 41 and the middle cup 43. The mist of the processing liquid cannot enter the opening 51 due to its own weight and remains on the outside of the airflow distribution plate 50. Therefore, it falls down to the bottom wall 411 of the lower cup 41 and is discharged from the drain port 631. In this way, by providing the airflow distribution plate 50 inside the middle cup 43, proper gas-liquid separation can be achieved within the middle cup 43.

[0084] As is common practice, the installation of a gas-liquid separator in the exhaust pipe 61 results in a larger device size. Especially when the gas-liquid separator is located at the bottom of the substrate processing apparatus 10, the space within the substrate processing apparatus 10 for processing the substrate W increases depending on the size of the gas-liquid separator. In this case, the maintenance space and the path for transferring the substrate W are also positioned higher. Therefore, by replacing the gas-liquid separator with an airflow distribution plate 50, space-saving gas-liquid separation can be achieved, thus enabling device miniaturization. Furthermore, the maintenance space and path can be positioned lower.

[0085] <2. Variations>

[0086] The embodiments have been described above, but the present invention is not limited to the embodiments described above and can be modified in various ways.

[0087] For example, it is not necessary for the airflow distribution plate 50 to have a plurality of openings 51; there can be only one. Similarly, it is not necessary for the exhaust port 611 to be a plurality; there can be only one. Furthermore, it is not necessary for the drain port 631 to be a plurality; there can be only one.

[0088] In the above embodiments, the substrate processing apparatus is configured to supply a developer as a processing liquid, but it may also be configured to supply other processing liquids (e.g., etching liquid). That is, the present invention is applicable to all substrate processing techniques that involve rotating the substrate and supplying processing liquid to the upper surface of the substrate for processing.

[0089] In the above embodiment, the opening 51 is formed by a through hole provided in the airflow distribution plate 50. However, the opening 51 may also be formed by a cutout formed in the airflow distribution plate 50 and other components that close the cutout.

[0090] Figure 5 This is a schematic cross-sectional view showing the structure of the substrate processing apparatus 10 according to a modified example. The substrate processing apparatus 10 according to the modified example has a partition plate 45 and an airflow distribution plate 50a. The partition plate 45 is disposed inside the middle cup 43. The partition plate 45 has an annular shape that extends radially from the inner wall portion 415 of the lower cup 41 to the inner peripheral surface of the middle cup 43. The partition plate 45 divides the inner side of the middle cup 43 into two spaces in the vertical direction.

[0091] An airflow distribution plate 50a is located between the bottom wall 411 of the lower cup 41 and the partition plate 45. The airflow distribution plate 50a has a plurality of cutouts 52 in its upper part. Each cutout 52 has a downwardly recessed shape. The upper part of the airflow distribution plate 50a, except for the plurality of cutouts 52, contacts the lower surface of the partition plate 45, and the upper parts of the cutouts 52 are closed by the partition plate 45. The closure of the upper parts of the plurality of cutouts 52 by the partition plate 45 forms a plurality of openings 51.

[0092] In this modified example, gas-liquid separation can also be appropriately performed by the airflow distribution plate 50a disposed within the middle cup 43. Therefore, gas-liquid separation can be performed in a space-saving manner. In addition, by providing a cutout 52 at the upper part of the airflow distribution plate 50a, the opening 51 can be positioned at the highest possible position even when the vertical length of the airflow distribution plate 50a is short. Therefore, gas-liquid separation can be performed appropriately. Furthermore, the partition plate 45 may not be necessary. For example, the upper part of the airflow distribution plate 50a may contact the upper wall 431 of the middle cup 43, and the upper part of the cutout 52 may be closed by the upper wall 431, thereby forming the opening 51.

[0093] The invention has been described in detail, but the above description is illustrative in all respects and the invention is not limited thereto. It should be understood that numerous modifications not illustrated can be conceived without departing from the scope of the invention. The structures described in the above embodiments and modifications can be appropriately combined or omitted as long as they do not contradict each other.

Claims

1. A substrate processing apparatus, wherein, have: Chuck, holding the substrate; A rotating shaft is mounted on the chuck; A motor that causes the rotating shaft to rotate about a rotation axis extending vertically. The nozzle supplies processing fluid to the substrate held in the chuck; A bottomed cylindrical cup is disposed around and below the chuck; A circular, middle cup is located below the chuck and above the bottom of the lower cup; and A cylindrical airflow distribution component rises upwards from the bottom of the lower cup toward the middle cup. The airflow distribution component has at least one opening. The lower cup has: an exhaust port, which is radially disposed at a position inside the airflow distribution member; and a liquid outlet, which is radially disposed at a position outside the airflow distribution member.

2. The substrate processing apparatus according to claim 1, wherein, The airflow distribution member has a plurality of openings arranged circumferentially.

3. The substrate processing apparatus according to claim 1 or 2, wherein, A gap is formed between the lower end of the middle cup and the bottom surface of the lower cup. The opening is located above the gap.

4. The substrate processing apparatus according to claim 1, wherein, The middle cup has a portion that slopes outward in the radial direction as it faces downward.

5. The substrate processing apparatus according to any one of claims 1 to 4, wherein, It also has: A stand is equipped with the motor and supports the lower cup; A drive pulley is mounted on the drive shaft of the motor; Driven pulley, mounted on the rotating shaft; as well as A drive belt is mounted on the drive pulley and the driven pulley.

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