An automatic patching process for silicon controlled rectifier module

Abstract

The application relates to a controllable silicon module automatic patching process, which comprises the following steps: step one: providing a patching device, the device comprising a processing table, a chip placing table and a substrate placing table arranged above the processing table, and the application relates to the patching technical field.The controllable silicon module automatic patching process is characterized in that a plurality of adsorption units, suction cups, fixing plates and springs are arranged, and a slidable moving block and a slope at the bottom of the moving block are matched, so that all the chips are adsorbed by negative pressure at one time, then the moving block is slid in one direction to sequentially press each guide rod, and the chips are sequentially patched. The mode of "parallel material taking and serial patching" not only retains the high efficiency of multi-station parallel operation, but also avoids the interference or inaccurate positioning problems caused by simultaneous pressing.

Description

Technical Field

[0001] This invention relates to the field of surface mount technology, specifically to an automated surface mount process for silicon controlled rectifier (SCR) modules. Background Technology

[0002] In the manufacturing process of SCR modules, the precise mounting of chips onto the substrate is a critical step that determines the module's electrical performance and reliability. Traditional chip mounting processes often employ a single nozzle for picking up, positioning, and placing chips one by one, which has the following drawbacks: First, sequential operation of individual chips is inefficient and cannot meet the needs of large-scale production; second, the relative positional accuracy between chips is difficult to control when mounting multiple chips, resulting in large cumulative errors; third, uneven pressure when the chuck contacts the chip can easily cause chip tilting or damage. Although existing technologies use devices that pick up and place multiple chips simultaneously, the high consistency of the nozzles is difficult to guarantee, and the mounting action often requires complex servo control for individual drive, resulting in complex structures and high costs. Therefore, there is an urgent need in the field for an automated chip mounting process that can simultaneously pick up and sequentially mount multiple chips, with a simple structure and high reliability. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides an automated surface mount technology (SMT) process for silicon controlled rectifier (SCR) modules, which solves the aforementioned problems.

[0004] To achieve the above objectives, the present invention provides an automated surface mount technology (SMT) process for silicon controlled rectifier (SCR) modules, comprising the following steps: Step 1: Provide a chip mounting device, which includes a processing table, a chip placement table and a substrate placement table disposed above the processing table. Both the chip placement table and the substrate placement table are driven by a drive mechanism to move along the XYZ axes in a plane. A rotating plate driven by a drive shaft is rotatably connected to the surface of the processing table. Multiple adsorption units are disposed on the surface of the rotating plate. Each adsorption unit includes a guide rod that passes through the rotating plate and slides within its cavity. A suction cup is fixedly connected to the bottom end of the guide rod, and a fixing plate is fixedly connected to the top end of the guide rod. A spring is sleeved on the surface of the guide rod, with its bottom end fixedly connected to the top of the rotating plate. The spring is used to apply an upward thrust to the fixing plate. A limiting plate located at the bottom of the fixing plate is fixedly connected to the top of the rotating plate. A guide frame is fixedly connected to the top of the rotating plate. A moving block that slides left and right driven by a lead screw is slidably connected to the surface of the guide frame. Inclined surfaces are formed on both sides of the bottom of the moving block. A cutting surface coinciding with the movement trajectory of the inclined surfaces is formed at the top end of the guide rod. A positioning groove is formed at the bottom of the moving block. A top plate located directly above the fixing plate is fixedly connected to the surface of the guide frame. Step 2: Arrange multiple chips for the thyristor module in multiple horizontal straight lines on the surface of the chip placement stage, with the number of chips being the same as the number of suction cups; Step 3: Drive the chip placement stage to move using the drive mechanism, so that each suction cup is aligned with the corresponding chip; at the same time, drive the substrate placement stage to move using the drive mechanism, so that the substrate is positioned at the chip placement location. Step 4: Drive the chip placement stage to rise along the Z-axis so that each chip makes direct contact with its corresponding suction cup. Activate the negative pressure of the suction cup to simultaneously attract all chips, and then drive the chip placement stage to descend and reset. Step 5: Drive the rotating plate to rotate, transferring the adsorbed chip to the top of the substrate placement stage; Step Six: Drive the moving block to slide along the guide frame. The inclined surface at the bottom of the moving block contacts the cutting surface of each guide rod in sequence and presses down the corresponding guide rod, causing each suction cup to move downward in sequence. When the fixing plate descends to contact the limiting plate, the suction cup is in the placement position, thereby placing the chip onto the substrate in sequence. After each placement, the positioning groove of the moving block laterally limits the top of the guide rod. Then the moving block continues to slide, and the spring pushes the fixing plate to reset the guide rod until all chips are placed.

[0005] As a further aspect of the present invention: in step six, the sliding direction of the moving block is unidirectional, pressing down sequentially, and after all patches are applied, the moving block returns to its initial position.

[0006] As a further aspect of the present invention: the depth of the positioning groove is less than the height of the top of the guide rod, and it is only used for lateral positioning without restricting the lifting and lowering movement of the guide rod.

[0007] As a further aspect of the present invention: in step six, when the fixing plate descends to contact the limiting plate, the precise height of the patch position is defined by the limiting plate.

[0008] As a further aspect of the present invention: in step four, during the process of the suction cup adsorbing the chip, the upward stroke of the fixing plate is limited by the top plate to prevent the guide rod from rising excessively.

[0009] The chip mounting equipment includes a processing table, a chip placement stage, and a substrate placement stage positioned above the processing table. Both the chip placement stage and the substrate placement stage are driven by a drive mechanism to move along the XYZ axes in a plane. Chips are arranged in multiple transverse straight lines on the surface of the chip placement stage, with the number matching the number of suction cups. A rotating plate driven by a drive shaft is rotatably connected to the surface of the processing table. Multiple suction units are arranged on the surface of the rotating plate. Each suction unit includes a guide rod that passes through the rotating plate and slides within its cavity. A suction cup is fixedly connected to the bottom end of the guide rod, and a fixing plate is fixedly connected to the top end of the guide rod. A spring is fitted onto the surface of the guide rod, with its bottom end fixedly connected to the top of the rotating plate to apply a pushing force to the fixing plate. A limiting plate located at the bottom of the fixing plate and fixedly connected to the top of the rotating plate limits its downward movement. When the fixing plate descends and presses against the limiting plate... The rotating plate is positioned precisely at the chip placement location. A guide frame is fixedly connected to the top of the rotating plate, and a movable block driven by a lead screw is slidably connected to the surface of the guide frame. The bottom sides of the movable block have inclined surfaces, and the top of the guide rod has a cutting surface that coincides with the movement trajectory of the inclined surfaces. The bottom of the movable block has a positioning groove that matches the top of the guide rod. The positioning groove is shallow and is only used to laterally limit the guide rod. A top plate is fixedly connected to the surface of the guide frame, located directly above the fixed plate. The top plate limits the fixed plate and prevents it from rising excessively. Multiple chips can be adsorbed at once and then placed sequentially, reducing the path required for chip placement. In existing systems, each chip placement requires the rotating plate to rotate back and forth, and the movable block can press down the guide rod sequentially, driving the suction cup to place the chips downwards in sequence. A single power source can drive all of these processes, and the system is stable and reliable.

[0010] Compared with the prior art, the present invention has the following advantages: This system enables highly efficient operation of simultaneous picking up and sequential placement of multiple chips: by setting up multiple adsorption units, suction cups, fixing plates, and springs, along with a sliding moving block and its inclined bottom, all chips are adsorbed under negative pressure in one go. Then, the moving block slides unidirectionally to press down each guide rod sequentially, completing the chip placement one by one. This "parallel picking up, serial placement" mode retains the high efficiency of multi-station parallel operation while avoiding interference or inaccurate positioning problems that may be caused by simultaneous pressing.

[0011] Precise placement height control and pressure buffering are provided: each guide rod has a cutting surface at its tip that mates with the inclined surface of the moving block. As the moving block slides, the inclined surface pushes the cutting surface, allowing the guide rod to descend smoothly against the spring force. When the fixing plate descends to contact the limiting plate, the suction cup reaches the precise placement position, and the limiting plate acts as a hard limit, ensuring the consistency of the placement height for each chip. At the same time, the spring provides buffering during the placement process, preventing impact damage to the chip.

[0012] The guide rod's reset and lateral limiting functions have been optimized: a positioning groove is provided at the bottom of the moving block, its depth being less than the height of the guide rod's top. This groove is used only for lateral limiting and does not restrict the guide rod's vertical movement. When the moving block slides to the positioning groove corresponding to the guide rod's top, it prevents the guide rod from swaying during patch placement, improving positioning accuracy. After patch placement is complete, the moving block continues to slide, the positioning groove disengages, and a spring pushes the fixing plate to automatically reset the guide rod. After completing all patch placement, the moving block returns to its initial position, ready for the next cycle.

[0013] The simplified equipment structure and reduced manufacturing costs are achieved by using a single moving block drive mechanism for all suction cups, eliminating the need for individual lifting cylinders or servo motors for each placement head. The top plate limits the upward stroke of the fixed plate, preventing the guide rod from over-rising. The entire process is clearly defined, the equipment operates simply and reliably, and is easily automated. Attached Figure Description

[0014] Figure 1 This is a top view of the structure of the present invention; Figure 2 This is a schematic diagram of the rotating plate of the present invention; Figure 3 For the present invention Figure 2 A magnified view of a portion of point A in the middle.

[0015] In the diagram: 1. Processing table; 2. Chip placement table; 3. Substrate placement table; 4. Rotating plate; 5. Guide frame; 6. Moving block; 7. Inclined surface; 8. Positioning groove; 9. Guide rod; 10. Top plate; 11. Fixing plate; 12. Spring; 13. Limiting plate; 14. Suction cup; 15. Cutting surface; 16. Drive shaft. Detailed Implementation

[0016] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided below.

[0017] Please see Figure 1-3 This invention provides a technical solution: an automated surface mount technology (SMT) process for silicon controlled rectifier (SCR) modules, comprising the following steps: Step 1: Provide a chip mounting equipment, which includes a processing table 1, a chip placement stage 2 and a substrate placement stage 3 positioned above the processing table 1. Both the chip placement stage 2 and the substrate placement stage 3 are driven by a drive mechanism to move along the XYZ axes in a plane. A rotating plate 4 driven by a drive shaft 16 is rotatably connected to the surface of the processing table 1. Multiple adsorption units are provided on the surface of the rotating plate 4. Each adsorption unit includes a guide rod 9 that passes through the rotating plate 4 and slides within its cavity. A suction cup 14 is fixedly connected to the bottom end of the guide rod 9, and a fixing plate 11 is fixedly connected to the top end of the guide rod 9. A bottom plate is sleeved on the surface of the guide rod 9. A spring 12 is fixedly connected to the top of the rotating plate 4. The spring 12 is used to apply an upward thrust to the fixed plate 11. A limiting plate 13 located at the bottom of the fixed plate 11 is fixedly connected to the top of the rotating plate 4. A guide frame 5 is fixedly connected to the top of the rotating plate 4. A moving block 6 driven by a screw to slide left and right is slidably connected to the surface of the guide frame 5. Inclined surfaces 7 are opened on both sides of the bottom of the moving block 6. A cutting surface 15 coinciding with the movement trajectory of the inclined surface 7 is opened at the top of the guide rod 9. A positioning groove 8 is opened at the bottom of the moving block 6. A top plate 10 located directly above the fixed plate 11 is fixedly connected to the surface of the guide frame 5. Step 2: Arrange the chips for the multiple thyristor modules in multiple horizontal straight lines on the surface of the chip placement stage 2, and the number of chips is the same as the number of suction cups 14. Step 3: Drive the chip placement stage 2 to move using the drive mechanism, so that each suction cup 14 is aligned with the corresponding chip; at the same time, drive the substrate placement stage 3 to move using the drive mechanism, so that the substrate is located at the position to be mounted. Step 4: Drive the chip placement stage 2 to rise along the Z-axis so that each chip directly contacts the corresponding suction cup 14. Activate the negative pressure of the suction cups to simultaneously adsorb all chips, and then drive the chip placement stage 2 to descend and reset. Step 5: Drive the rotating plate 4 to rotate, transferring the adsorbed chip to the top of the substrate placement stage 3; Step 6: Drive the moving block 6 to slide along the guide frame 5. The inclined surface 7 at the bottom of the moving block 6 contacts the cutting surface 15 of each guide rod 9 in sequence and presses down the corresponding guide rod 9, so that each suction cup 14 moves downward in sequence. When the fixing plate 11 descends to contact the limiting plate 13, the suction cup 14 is in the chip placement position, thereby placing the chip onto the substrate in sequence. After each chip placement, the positioning groove 8 of the moving block 6 laterally limits the top of the guide rod 9. Then the moving block 6 continues to slide, and the spring 12 pushes the fixing plate 11 to reset the guide rod 9 until all chips are placed.

[0018] In step six, the sliding direction of the moving block 6 is one-way downward pressing. After all the patches are applied, the moving block 6 returns to its initial position.

[0019] The depth of the positioning groove 8 is less than the height of the top of the guide rod 9, and it is only used for lateral limiting and does not restrict the lifting and lowering movement of the guide rod 9.

[0020] In step six, when the fixing plate 11 descends to contact the limiting plate 13, the limiting plate 13 limits the precise height of the patch position.

[0021] In step four, during the process of the suction cup 14 adsorbing the chip, the top plate 10 restricts the upward stroke of the fixing plate 11 to prevent the guide rod 9 from rising excessively.

[0022] The chip mounting equipment includes a processing table 1, a chip placement table 2 and a substrate placement table 3 positioned above the processing table 1. Both the chip placement table 2 and the substrate placement table 3 are driven by a drive mechanism to move along the XYZ axes in a plane. Chips are arranged in multiple horizontal straight lines on the surface of the chip placement table 2, with the number matching the number of suction cups 14. A rotating plate 4, driven by a drive shaft 16, is rotatably connected to the surface of the processing table 1. Multiple suction units are provided on the surface of the rotating plate 4. Each suction unit includes a guide rod 9 that passes through the rotating plate 4 and slides within its cavity. A suction cup 14 is fixedly connected to the bottom end of the guide rod 9, and a fixing plate 11 is fixedly connected to the top end of the guide rod 9. A spring 12, whose bottom end is fixedly connected to the top of the rotating plate 4, is fitted onto the surface of the guide rod 9 to apply a pushing force to the fixing plate 11. A limiting plate 13, located at the bottom of the fixing plate 11, is fixedly connected to the top of the rotating plate 4 to limit its downward movement. When the fixing plate 11 descends and presses against the limiting plate 11... At position 3, the chip is positioned for chip placement. A guide frame 5 is fixedly connected to the top of the rotating plate 4. A movable block 6, driven by a lead screw, is slidably connected to the surface of the guide frame 5. Inclined surfaces 7 are provided on both sides of the bottom of the movable block 6. A cutting surface 15, which coincides with the movement trajectory of the inclined surface 7, is provided at the top of the guide rod 9. A positioning groove 8, which is adapted to the top of the guide rod 9, is provided at the bottom of the movable block 6. The positioning groove 8 is shallow and is only used to laterally limit the guide rod 9. A top plate 10, located directly above the fixed plate 11, is fixedly connected to the surface of the guide frame 5. The top plate 10 limits the fixed plate 11 and prevents it from rising excessively. Multiple chips can be adsorbed at once and then placed sequentially, reducing the path required for chip placement. In the past, each chip placement required the rotating plate 4 to rotate back and forth, and the movable block 6 could press down the guide rod 9 sequentially, driving the suction cup 14 to place the chips sequentially. A single power source can drive all of them, and it is stable and reliable.

[0023] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. An automated surface mount technology (SMT) process for silicon controlled rectifier (SCR) modules, characterized in that, Includes the following steps: Step 1: Provide a chip mounting device, which includes a processing table (1), a chip placement stage (2) and a substrate placement stage (3) set above the processing table (1). The chip placement stage (2) and the substrate placement stage (3) are both driven by a drive mechanism to move along the XYZ axes in a plane. A rotating plate (4) driven by a drive shaft (16) is rotatably connected to the surface of the processing table (1). Multiple adsorption units are provided on the surface of the rotating plate (4). Each adsorption unit includes a guide rod (9) that passes through the rotating plate (4) and slides within its cavity. A suction cup (14) is fixedly connected to the bottom end of the guide rod (9), and a fixing plate (11) is fixedly connected to the top end of the guide rod (9). 9) is fitted with a spring (12) whose bottom end is fixedly connected to the top of the rotating plate (4). The top of the rotating plate (4) is fixedly connected to a limiting plate (13) located at the bottom of the fixed plate (11). The top of the rotating plate (4) is fixedly connected to a guide frame (5). The surface of the guide frame (5) is slidably connected to a moving block (6) that is driven to slide left and right by a screw. The bottom sides of the moving block (6) are provided with inclined surfaces (7). The top of the guide rod (9) is provided with a cutting surface (15) that coincides with the movement trajectory of the inclined surface (7). The bottom of the moving block (6) is provided with a positioning groove (8). The surface of the guide frame (5) is fixedly connected to a top plate (10) located directly above the fixed plate (11). Step 2: Arrange the chips for the multiple thyristor modules in multiple horizontal straight lines on the surface of the chip placement stage (2), and the number of chips is the same as the number of suction cups (14). Step 3: Drive the chip placement stage (2) to move by the drive mechanism so that each suction cup (14) is aligned with the corresponding chip; at the same time, drive the substrate placement stage (3) to move by the drive mechanism so that the substrate is located at the position to be mounted. Step 4: Drive the chip placement stage (2) to rise along the Z-axis so that each chip is in direct contact with the corresponding suction cup (14). Start the suction cup (14) to apply negative pressure to simultaneously adsorb all chips, and then drive the chip placement stage (2) to descend and reset. Step 5: Drive the rotating plate (4) to rotate and transfer the adsorbed chip to the top of the substrate placement stage (3); Step 6: Drive the moving block (6) to slide along the guide frame (5). The inclined surface (7) at the bottom of the moving block (6) contacts the cutting surface (15) of each guide rod (9) in sequence and presses down the corresponding guide rod (9), so that each suction cup (14) moves downward in sequence. When the fixing plate (11) descends to contact the limiting plate (13), the suction cup (14) is in the chip placement position, so that the chip is placed onto the substrate in sequence. After each chip placement, the positioning groove (8) of the moving block (6) laterally limits the top of the guide rod (9). Then the moving block (6) continues to slide, and the spring (12) pushes the fixing plate (11) to reset the guide rod (9) until all chips are placed.

2. The automated surface mount technology (SMT) for thyristor modules according to claim 1, characterized in that: In step six, the sliding direction of the moving block (6) is one-way downward pressing, and after all the patches are applied, the moving block (6) returns to the initial position.

3. The automated surface mount technology (SMT) for thyristor modules according to claim 1, characterized in that: The depth of the positioning groove (8) is less than the height of the top of the guide rod (9), and it is only used for lateral positioning and does not restrict the lifting and lowering movement of the guide rod (9).

4. The automated surface mount technology (SMT) for thyristor modules according to claim 1, characterized in that: In step six, when the fixing plate (11) descends to contact the limiting plate (13), the precise height of the patch position is defined by the limiting plate (13).

5. The automated surface mount technology (SMT) for thyristor modules according to claim 1, characterized in that: In step four, during the process of the suction cup (14) adsorbing the chip, the top plate (10) restricts the upward stroke of the fixing plate (11) to prevent the guide rod (9) from rising excessively.

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