A process cavity heating system and method

Abstract

The application provides a process cavity heating system and method, wherein the system comprises a cavity, a common pipeline, a first branch, a second branch, a heating device and a filtering device; the common pipeline has a liquid inlet section and a liquid outlet section, and the cavity has a liquid inlet and a liquid outlet; the liquid inlet section is connected with the liquid inlet, and the liquid outlet section is connected with the liquid outlet; the heating device is arranged on the common pipeline, and the filtering device is arranged on the second branch; wherein the first branch and the second branch are connected in parallel, one end of which is communicated with the liquid inlet section, and the other end is communicated with the liquid outlet section, so that the first branch and the common pipeline form a heating loop, the second branch and the common pipeline form a filtering loop, and the on-off state of the first branch and the second branch is mutually exclusive. When the system heats the chemical liquid, the resistance generated by the filter on the chemical liquid can be avoided, the circulation rate during heating of the chemical liquid is improved, the heat exchange efficiency between the chemical liquid and the heating device is improved, the chemical liquid heating time is shortened, and the waiting time of the chemical liquid applied to the process treatment is shortened.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a process cavity heating system and method. Background Technology

[0002] With the development of semiconductor process technology, semiconductors are widely used in fields such as artificial intelligence, 5G communication, and new energy vehicles. Semiconductor applications require processing, primarily through wet and dry processes. Wet processes involve heating chemical solutions to reach a predetermined process temperature, ensuring the stability of the chemical reaction rate and etching / cleaning effect.

[0003] Currently, the most common method for heating chemical solutions involves installing heaters in pipelines and using pumps to circulate and heat the solution. However, because particulate matter such as photoresist particles or metal debris is generated during the chemical process, which can affect the process results, a filter device needs to be installed in the pipeline system for filtration. However, the filter device creates significant resistance in the liquid path, causing a decrease in circulation flow and thus reducing the efficiency of heat exchange between the solution and the heater.

[0004] In summary, existing technologies struggle to achieve efficient heating of chemical solutions, thereby reducing the efficiency of semiconductor processing. Summary of the Invention

[0005] In view of this, embodiments of this application provide a process cavity heating system. One or more embodiments of this specification also relate to a process cavity heating method to address the technical deficiencies existing in the prior art.

[0006] According to a first aspect of the embodiments of this application, a process cavity heating system is provided, comprising: The cavity, common pipeline, first branch, second branch, heating device, and filtration device; The common pipeline has an inlet section and an outlet section, and the cavity has an inlet and an outlet. The liquid inlet section is connected to the liquid inlet, the liquid outlet section is connected to the liquid outlet, the heating device is installed in the common pipeline, and the filtration device is installed in the second branch. Among them, after the first branch and the second branch are connected in parallel, one end is connected to the liquid inlet section and the other end is connected to the liquid outlet section, so that the first branch and the common pipeline form a heating circuit, and the second branch and the common pipeline form a filtration circuit. The on / off states of the first branch and the second branch are mutually exclusive.

[0007] According to a second aspect of the embodiments of this application, a process cavity heating method is provided, applied to the above-mentioned process cavity heating system, comprising: Add the medicine into the cavity to the preset level; The controller monitors the temperature of the liquid and the presence of wafers within the cavity. If the liquid temperature is lower than the target temperature and there is no wafer in the cavity, the controller opens the first branch, closes the second branch, and makes the heating device operate at the first power. If the liquid temperature reaches the target temperature, the controller closes the first branch, opens the second branch, and makes the heating device operate at the second power.

[0008] In one embodiment of this application, the process chamber heating system includes a chamber, a common pipeline, a first branch, a second branch, a heating device, and a filtering device. The common pipeline has an inlet section and an outlet section, and the chamber has an inlet port and an outlet port. The inlet section and the outlet port are connected, and the outlet section and the outlet port are connected. The heating device is located in the common pipeline, and the filtering device is located in the second branch. The first branch and the second branch are connected in parallel, with one end connected to the inlet section and the other end connected to the outlet section, so that the first branch and the common pipeline form a heating circuit, and the second branch and the common pipeline form a filtering circuit. The on / off states of the first branch and the second branch are mutually exclusive. By placing the filtering device in the second branch and connecting the first branch and the second branch in parallel, with both ends connected to the inlet section and the outlet section respectively, the heating circuit formed by the first branch and the common pipeline does not include the filtering device. This avoids the flow resistance generated by the filtering device on the liquid path, thereby maintaining a high circulation flow rate during the heating stage, allowing the liquid to quickly exchange heat with the heating device, and shortening the heating time. Meanwhile, the filtration loop formed by the second branch and the common pipeline includes a filtration device. When the liquid medicine enters the chamber for processing after passing through the filtration device, the heating device is in heat preservation mode, continuously replenishing the lost heat of the liquid medicine to achieve a stable heat preservation process. In addition, by keeping the on / off states of the two branches mutually exclusive, it can be ensured that only one branch is in a conducting state at any given time. This avoids the problem of flow diversion caused by the liquid medicine flowing through two branches simultaneously, which would lead to reduced heating efficiency and poor filtration effect. The heating loop and the filtration loop can be switched according to the process stage, avoiding the efficiency contradiction caused by heating and filtering in a single loop, and improving the response speed and energy efficiency of liquid medicine temperature control. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the structure of a process cavity heating system provided in one embodiment of this application; Figure 2 This is a schematic diagram of another process cavity heating system provided in one embodiment of this application; Figure 3 This is a schematic diagram of the structure of another process cavity heating system provided in one embodiment of this application; Figure 4 This is a schematic diagram of the structure of another process cavity heating system provided in one embodiment of this application; Figure 5 This is a flowchart of a process cavity heating method provided in one embodiment of this application.

[0010] Figure Labels Cavity-10; Inlet-102; Outlet-104; Common Pipeline-20; Inlet Section-202; Outlet Section-204; First Branch-302; Second Branch-304; Third Branch-306; Heating Device-40; First Heating Device-402; Second Heating Device-404; Filter Device-50; First On / Off Valve-602; Second On / Off Valve-604; Third On / Off Valve-606; Power Unit-70; First Temperature Monitoring Device-802; Second Temperature Monitoring Device-804; First Flow Monitoring Device-902; Second Flow Monitoring Device-904; Liquid Supply Device-110. Detailed Implementation

[0011] Many specific details are set forth in the following description to provide a full understanding of this specification. However, this specification can be implemented in many other ways than those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this specification. Therefore, this specification is not limited to the specific implementations disclosed below.

[0012] The terminology used in one or more embodiments of this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the one or more embodiments of this specification. The singular forms “a,” “described,” and “the” as used in one or more embodiments of this specification and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in one or more embodiments of this specification refers to and includes any or all possible combinations of one or more associated listed items.

[0013] It should be understood that although the terms first, second, etc., may be used to describe various information in one or more embodiments of this specification, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, first may also be referred to as second without departing from the scope of one or more embodiments of this specification, and similarly, second may also be referred to as first. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to a determination."

[0014] Furthermore, it should be noted that the data involved in one or more embodiments of this specification (including but not limited to data used for analysis, stored data, displayed data, etc.) are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of related data must comply with the relevant laws, regulations and standards of the relevant countries and regions, and corresponding operation entry points are provided for users to choose to authorize or refuse.

[0015] First, the terms and concepts used in one or more embodiments of this specification will be explained.

[0016] NMP: N-methylpyrrolidone, an organic solvent commonly used in semiconductor processes, especially in resist removal processes.

[0017] Cavity: also known as process cavity, is a closed space where process reactions / processes occur, and can also be called a tank.

[0018] Wafer: refers to the thin, sheet-like substrate material used to carry integrated circuits in semiconductor manufacturing, usually made of high-purity single-crystal silicon.

[0019] PR Stripper: refers to the material or process used in photolithography to remove photoresist, usually a chemical solvent or oxygen plasma. Its function is to completely remove the useless photoresist from the wafer surface after pattern transfer without damaging the underlying structure.

[0020] Lift-off is a microfabrication patterning method. First, photoresist is coated on the wafer, exposed and developed to form an opening pattern. Then, metal or other thin films are deposited on the whole wafer. Finally, the photoresist is dissolved with a PR Stripper. At this time, the excess film covering the photoresist surface will be peeled off along with the photoresist, leaving only the pattern bonded to the substrate at the developed opening.

[0021] In semiconductor wet processes, such as PR stripper and lift-off processes, NMP and other reagents need to be heated to a high temperature, such as 85 degrees Celsius, within the process chamber before wafer processing, such as resist removal, can begin.

[0022] The current mainstream method in the industry is to install heaters in the pipeline and use pumps to circulate and heat the liquid medicine.

[0023] However, the chemical processing steps generate particulate matter such as photoresist particles or metal debris. These particles can affect the process results and product yield, so a filter device needs to be installed in the piping system for filtration and cleaning.

[0024] However, the introduction of a filtration device creates resistance in the liquid path, slowing down the circulation of the liquid and preventing the liquid from fully exchanging heat with the heater, which in turn slows down the heating of the liquid.

[0025] Therefore, how to increase the heating rate of the liquid medicine is a technical problem to be solved in this working condition.

[0026] To address the aforementioned issues, this specification provides a process cavity heating system and a process cavity heating method, which will be described in detail in the following embodiments.

[0027] See Figure 1 , Figure 1 This application provides a schematic diagram of the structure of a process cavity heating system according to an embodiment of the present application, including: Cavity 10, common pipeline 20, first branch 302, second branch 304, heating device 40 and filter device 50; The common pipeline 20 has an inlet section 202 and an outlet section 204, and the cavity 10 has an inlet 102 and an outlet 104; The liquid inlet section 202 is connected to the liquid inlet 102, the liquid outlet section 204 is connected to the liquid outlet 104, the heating device 40 is installed in the common pipeline 20, and the filter device 50 is installed in the second branch 304. Among them, the first branch 302 and the second branch 304 are connected in parallel, with one end connected to the liquid inlet section 202 and the other end connected to the liquid outlet section 204, so that the first branch 302 and the common pipeline 20 form a heating circuit, and the second branch 304 and the common pipeline 20 form a filtration circuit.

[0028] The cavity 10 is a container for containing chemical solutions and performing wet processing on the wafer. For example, the cavity 10 may be a tank for a resist removal process or a reaction chamber for a stripping process.

[0029] The common pipeline 20 is the pipeline through which the liquid medicine flows continuously in the heating system of cavity 10. It is the main pipeline for the circulation of the chemical liquid medicine in various pipelines of the system, and it always provides a flow path for the liquid medicine medicine regardless of the changes in the operating modes of heating device 40 and filtration device 50. For example, the common pipeline 20 can be a pipeline made of various engineering plastics (such as PEEK (polyether ether ketone), PTFE (polytetrafluoroethylene), PFC (phenolic resin fabric), etc.) or stainless steel.

[0030] The first branch 302 is a pipe without a filter device 50. It is used to provide a high-speed flow path for the liquid medicine from the outlet section 204 to the inlet section 202, so that the liquid medicine can quickly circulate in the first branch 302 and the common pipe 20, and exchange heat efficiently with the heating device 40 to achieve rapid heating.

[0031] The second branch 304 is a pipe equipped with a filter device 50, which is used to filter impurity particles (such as photoresist particles or metal particles) in the liquid.

[0032] The heating device 40 is a device for heating chemical solutions, such as an immersion electric heater or a tubular heat exchanger.

[0033] The filtration device 50 is a device for filtering out impurity particles from chemical solutions, such as a cartridge filter or a filter element 50.

[0034] The liquid inlet section 202 is the section of the common pipeline 20 used to deliver the drug solution into the cavity 10.

[0035] The liquid outlet section 204 is the section of the common pipeline 20 used to deliver the liquid medicine in the cavity 10.

[0036] The inlet 102 is an opening for receiving chemical liquid into the cavity 10. For example, it can be an inlet port located on the side wall or bottom of the cavity 10.

[0037] The outlet 104 is an opening for discharging chemical liquid from the cavity 10, for example, an outlet port located at the bottom or side wall of the cavity 10.

[0038] The on / off state refers to whether the pipeline supports the flow of liquid medicine within it, and can include the on state and the off state.

[0039] Mutually exclusive on / off states mean that different pipelines can be in different on / off states at the same time; that is, the on / off states of the first branch and the second branch are different at the same moment. For example, when the first branch is in a conducting state, the second branch is in a disconnected state, and when the second branch is in a disconnected state, the second branch is in a conducting state.

[0040] Optionally, one way to achieve mutual exclusion of the on / off states of the first and second branches is to use a control device to output control signals to control the on / off states of the first and second branches respectively. For example, the controller outputs opposite control signals to the actuators of the first and second branches, so that they are in opposite states at the same time. Another way to achieve this is to set a mechanical linkage mechanism between the first and second branches. For example, the switching elements of the first and second branches are linked together by a mechanical linkage mechanism. When the mechanical linkage mechanism is in a first position, the first branch is on and the second branch is off; when the mechanical linkage mechanism is in a second position, the second branch is on and the first branch is off. The embodiments in this specification do not limit the implementation method of mutual exclusion of the on / off states of the first and second branches.

[0041] Optionally, the connection between the liquid inlet section 202 and the liquid inlet 102 can be achieved by using a flange or threaded joint. Another option is to use a hose or bellows. Yet another option is to use a quick coupling or clamp. This specification does not limit the specific implementation of these methods.

[0042] Optionally, the first branch 302 can be one or more, the second branch 304 can be one or more, the number of heating devices 40 can be one or more, and the number of filtering devices 50 can also be one or more. This specification does not limit the embodiments in this way.

[0043] Preferably, the heating device 40 can be set in the liquid inlet section 202 to reduce the heat loss of the liquid after passing through the heating device 40, ensure that the temperature of the liquid entering the cavity reaches the process temperature, and improve the controllability of the liquid temperature.

[0044] For example, the specific process of applying the process chamber heating system of this embodiment to NMP heating may include: closing the second branch 304 and opening the first branch 302, so that the NMP chemical solution forms a heating circuit along the first branch 302 and the common pipeline 20; starting the circulation pump to drive the solution circulation, and turning on the heating device 40 to heat the solution in the common pipeline 20, so that the solution temperature rises rapidly. When the solution temperature reaches a preset range (e.g., 85 degrees Celsius-90 degrees Celsius), closing the first branch 302 and opening the second branch 304, so that the solution circulates through the filter device 50 to filter out photoresist particles or metal debris in the solution, while keeping the solution temperature stable; during the heat preservation process, keeping the temperature stable within the preset range, for example, according to the feedback of the temperature sensor, intermittently turning on the heating device 40 to supplement heat (or controlling the heating temperature of the heating device 40 to a value slightly higher than the target temperature), so that the solution temperature is kept within the above-mentioned preset range.

[0045] In this embodiment, by placing the filter device 50 in the second branch 304 and connecting the first branch 302 and the second branch 304 in parallel, with one end connected to the inlet section 202 and the other end connected to the outlet section 204, the heating circuit formed by the first branch 302 and the common pipeline 20 does not include the filter device 50. This avoids the flow resistance generated by the filter device 50 on the liquid path, thereby maintaining a high circulation flow rate during the heating stage, allowing the liquid to quickly exchange heat with the heating device 40 and shortening the heating time. Simultaneously, the filter circuit formed by the second branch 304 and the common pipeline 20 includes the filter device 50. When the liquid enters the cavity 10 for processing after passing through the filter device 50, the heating device 40 is in a heat preservation mode, continuously replenishing the lost heat to the liquid, achieving a stable heat preservation process. By keeping the on / off states of the two branches mutually exclusive, it ensures that only one branch is in a conductive state at any given time, avoiding the problem of flow diversion caused by the liquid flowing through both branches simultaneously, which leads to reduced heating efficiency and poor filtration effect. In addition, the required heat power is low at this time, and the flow rate limited by the filter flow resistance can meet the heat preservation requirements. The heating circuit and the filtration circuit can be switched according to the process stage, avoiding the efficiency contradiction caused by heating and filtering in a single circuit, and improving the response speed and energy efficiency of the liquid temperature control.

[0046] In one embodiment of this application, the process cavity heating system further includes a controller; The controller is configured to, when there is no wafer in the cavity 10 and the liquid temperature is below the target temperature, control the second branch 304 to be in the off state, control the first branch 302 to be in the on state, and control the heating device 40 to operate at a first power; and, When the temperature of the liquid medicine is not lower than the target temperature, the second branch 304 is controlled to be in the conducting state, the first branch 302 is controlled to be in the disconnected state, and the heating device 40 is controlled to operate at the second power, wherein the first power is greater than the second power.

[0047] The controller is a processing unit used to receive signals generated by various devices in the system (such as the temperature of the liquid medicine, the liquid level of the medicine, etc.) and to control various devices in the system (such as controlling the working mode of the heating device 40, controlling the switches of each branch, etc.) based on the signals generated by each device. For example, it can be a programmable logic controller or an embedded microcontroller.

[0048] The liquid temperature refers to the temperature of the liquid inside the cavity 10, or the temperature of the liquid in each pipeline of the system.

[0049] The first power is the operating power of the heating device 40 to rapidly raise the temperature of the medicinal liquid. The first power can be preset with multiple power values. For example, when the heating device 40 is running at the first power (such as 5 kW, 6 kW, 7 kW), the heating device 40 is in heating mode and rapidly raises the temperature of the medicinal liquid.

[0050] The second power is the operating power of the heating device 40 to maintain a stable temperature of the liquid medicine. The second power can be preset with multiple power values. For example, when the heating device 40 is running at the second power (such as 0.4kw, 0.5kw, 0.6kw), the heating device 40 is in heat preservation mode, continuously replenishing the lost heat of the liquid medicine to maintain a stable temperature within the preset range.

[0051] The target temperature is the temperature value that the liquid medicine in cavity 10 is required to reach according to the process, for example, the target temperature is 85 degrees Celsius. Optionally, the target temperature can be a temperature range that the liquid medicine in cavity 10 is required to reach according to the process, for example, the target temperature can be a temperature range of 85 degrees Celsius to 87 degrees Celsius.

[0052] The disconnected state is a state in which the liquid medicine cannot flow in this branch. For example, when the solenoid valve is de-energized, the branch is in the disconnected state.

[0053] The conducting state is the state in which the liquid medicine can flow freely in the branch. For example, when the solenoid valve is energized, the branch is in the open state.

[0054] Optionally, the controller can be located in an external control cabinet of the cavity 10, near the common pipeline 20, or integrated inside the heating device 40. This specification does not limit this embodiment.

[0055] Optionally, the controller can be controlled by connecting each valve and heating device 40 via cable, or by connecting each valve and heating device 40 via Ethernet. This specification does not limit the embodiments in this way.

[0056] For example, before the semiconductor resist stripping process begins, no wafer is placed in cavity 10. The temperature sensor detects that the temperature of the solution in cavity 10 is 25 degrees Celsius, lower than the preset 85 degrees Celsius. The controller controls the valve of the second branch 304 to close, putting it in an open state, controls the valve of the first branch 302 to open, and controls the heating device 40 to switch to heating mode, operating at full power. The solution circulates along the first branch 302 and the common pipeline 20 without obstruction by the filter device 50, resulting in a large flow rate and rapid temperature rise. When the temperature sensor detects that the temperature of the solution in cavity 10 reaches 85 degrees Celsius, the controller controls the valve of the first branch 302 to close, the valve of the second branch 304 to open, and switches the heating device 40 to heat preservation mode, operating at low power. At this time, the wafer is sent into the cavity 10 for the photoresist removal process. The solution is circulated through the filter device 50 in the second branch 304 to filter out the photoresist particles generated in the process. The heating device 40 is in the heat preservation mode and heats the solution with low power to keep the solution temperature stable at around 85 degrees Celsius.

[0057] Optionally, the controller can control the opening and closing of the first and second on / off valves based on whether a wafer is present in the cavity and whether the liquid temperature has reached the target temperature, so as to switch the system between the heating circuit and the filtration circuit.

[0058] For example, Table 1 shows the I / O status table of the controller controlling the first and second on / off valves based on whether the temperature of the liquid in the cavity meets the standard and whether a wafer is present:

[0059] Optionally, when the liquid temperature has not reached the target temperature range, the controller determines that a wafer cannot be placed in the cavity 10. Therefore, it controls the first on-off valve 602 to open and the second on-off valve 604 to close, and the heating device 40 to operate in heating mode to rapidly heat the liquid. When the liquid temperature reaches the target temperature, the controller determines that a wafer can be placed in the cavity 10 for processing. Therefore, it controls the first on-off valve 602 to close and the second on-off valve 604 to open, and the heating device 40 to operate in heat preservation mode to maintain the liquid temperature within the target temperature range, ensuring continuous and stable processing. When the liquid temperature has not reached the target temperature range, if the controller receives a wafer inside the cavity 10, it indicates that the wafer has been mistakenly placed in the cavity 10, and it can issue a warning signal to prompt the operator to remove the wafer promptly. The above embodiment determines whether a wafer can be placed in cavity 10 based on whether the solution temperature reaches the target temperature range, and accordingly switches the on / off states of the first and second on / off valves and the operating mode of the heating device. This avoids incorrect placement of wafers when the solution temperature is below the target, which could lead to process defects or wafer scrap, thereby improving the yield rate. Furthermore, timely switching to the filtration circuit after the wafer is placed in cavity 10 ensures the cleanliness and temperature stability of the solution during the process, improving the reliability and consistency of the process. By jointly controlling the two on / off valves based on whether the solution temperature meets the target and whether a wafer is present in the cavity, the efficiency of wafer processing is improved, as is the standardization of the wafer processing flow, effectively avoiding process problems caused by placing wafers into cavity 10 when the temperature is below the target.

[0060] In this embodiment, the controller automatically switches the on / off state of the first branch 302 and the second branch 304 and adjusts the working mode of the heating device 40 according to whether there is a wafer in the cavity 10 and whether the temperature has reached the target temperature. When there is no wafer and the temperature is insufficient, a high-flow heating circuit without filtration and a high-power heating mode are used to achieve rapid heating. When there is a wafer and the temperature reaches the target, a filtration circuit with filtration and a low-power heat preservation mode are used to ensure the cleanliness and temperature stability of the liquid during the process. This shortens the process preparation time, avoids the heat waste caused by the filtration device 50 during the heating stage, reduces the frequent start and stop of the heating device 40, and improves the overall energy efficiency and temperature control accuracy of the system.

[0061] Indicatively, Figure 2 A schematic diagram of another process cavity heating system provided in one embodiment of this application is shown.

[0062] refer to Figure 2 In one embodiment of this application, a first on / off valve 602 is provided in the first branch 302, and a second on / off valve 604 is provided in the second branch 304. The first on / off valve 602 is used to control the opening or closing of the first branch 302 in response to the first control signal of the controller; The second on / off valve 604 is used to control the opening or closing of the second branch 304 in response to the second control signal of the controller.

[0063] The first on / off valve 602 is a component used to control the on / off of the liquid medicine in the first branch 302. For example, it can be a pneumatic diaphragm valve.

[0064] The second on / off valve 604 is a component used to control the on / off of the liquid medicine in the second branch 304. For example, it can be a pneumatic diaphragm valve.

[0065] The first control signal is a signal (such as an electrical signal or a pneumatic signal) used to switch the on / off state of the first on / off valve 602.

[0066] The second control signal is used to switch the on / off state of the second on / off valve 604.

[0067] Optionally, one implementation of the on / off valve responding to the control signal is as follows: after receiving a voltage signal from the controller, the on / off valve's electromagnet engages to drive the valve core to move. Another implementation is as follows: after receiving a pneumatic pressure signal from the controller, the on / off valve drives a pneumatic actuator to move the valve core. This specification does not limit the implementation to these methods.

[0068] For example, during the rapid heating phase, the controller outputs a 24V DC first control signal to the first on-off valve 602, causing the first on-off valve 602 to open and the first branch 302 to conduct; simultaneously, the controller outputs a 0V second control signal to the second on-off valve 604, causing the second on-off valve 604 to close and the second branch 304 to disconnect. When the liquid temperature reaches the target temperature, the controller stops outputting the first control signal (outputs 0V), the first on-off valve 602 closes, and the first branch 302 disconnects; simultaneously, it outputs a 24V DC second control signal, causing the second on-off valve 604 to open and the second branch 304 to conduct. By keeping the on-off states of the two on-off valves mutually exclusive, the controller ensures that only one branch is conducting at any given time, avoiding the problem of flow diversion caused by the liquid flowing through both branches simultaneously, which leads to reduced heating efficiency and poor filtration effect.

[0069] In this embodiment, by setting a first on / off valve 602 and a second on / off valve 604 on the first branch 302 and the second branch 304 respectively, and controlling them by sending a first control signal and a second control signal respectively, the precise switching and protection of the two branches can be achieved. This avoids the problem of reduced heating efficiency and poor filtration effect caused by the flow of the liquid medicine being divided when it flows through two parallel branches at the same time. It ensures that all the liquid medicine in the heating circuit flows through the first branch 302 without the filter device 50, thereby maximizing the circulation flow and heat exchange efficiency; and that all the liquid medicine in the filtration circuit flows through the second branch 304 with the filter device 50, achieving full filtration.

[0070] Indicatively, Figure 3 A schematic diagram of the structure of another process cavity heating system provided in one embodiment of this application is shown.

[0071] refer to Figure 3 In one embodiment of this application, the process cavity heating system further includes a temperature monitoring device: A temperature monitoring device is used to monitor the temperature of the liquid medicine inside the cavity 10, so that the controller generates a first control signal and a second control signal based on the temperature of the liquid medicine. Optionally, the temperature monitoring device can be installed in a common pipeline, for example, near the inlet of the liquid inlet section, to monitor the temperature of the liquid medicine about to enter the cavity. The temperature monitoring device can also be installed inside the cavity 10, for example, near the outlet of the liquid inlet on the inner wall of the cavity, to monitor the real-time temperature of the liquid medicine inside the cavity. The embodiments in this specification do not limit the location of the temperature monitoring device.

[0072] The temperature monitoring device is a component used to detect the temperature of the chemical solution inside the cavity 10 in real time and convert the temperature into an electrical signal. For example, it can be a platinum resistance temperature sensor or a thermocouple temperature sensor.

[0073] Optionally, one implementation of the controller generating the first and second control signals based on the temperature of the liquid is as follows: when the temperature value detected by the temperature monitoring device is lower than the target temperature and there is no wafer in the cavity 10, the controller outputs the first control signal to open the first on / off valve 602 and outputs the second control signal to close the second on / off valve 604. Another implementation is: when the temperature value detected by the temperature monitoring device fluctuates near the target temperature, the controller adjusts the state of the on / off valve in advance according to the temperature change trend to maintain temperature stability. This specification does not limit the implementation of this method.

[0074] For example, before the desizing process begins, a temperature monitoring device collects the temperature of the NMP solution inside the cavity 10 in real time and transmits the temperature value to the controller in the form of an analog electrical signal. The controller has a preset target temperature of 85 degrees Celsius. Initially, the temperature monitoring device reports a temperature of 25 degrees Celsius. The controller determines that there is no wafer inside the cavity 10 and the temperature is lower than the target temperature. It generates a first control signal (24V high level) and sends it to the first on / off valve 602 to open it, and generates a second control signal (0V low level) and sends it to the second on / off valve 604 to close it. At the same time, it controls the heating device 40 to operate in heating mode. As the solution circulates and heats, the temperature monitoring device detects that the temperature of the solution gradually rises. When the reported temperature reaches 85 degrees Celsius, the controller determines that a wafer has been placed inside the cavity 10 and the temperature is not lower than the target temperature. It generates a first control signal (0V low level) to close the first on / off valve 602, generates a second control signal (24V high level) to open the second on / off valve 604, and switches the heating device 40 to heat preservation mode. Throughout the process, the temperature monitoring device continuously monitors the temperature of the liquid medicine. If the temperature drops below the set deviation value (e.g., below 80 degrees Celsius), the controller can increase the power of the heating device 40 and then reduce the power of the heating device 40 after the temperature of the liquid medicine recovers.

[0075] In this embodiment, the temperature of the liquid medicine is acquired in real time by a temperature monitoring device installed in the cavity 10, enabling the controller to generate a first control signal and a second control signal based on accurate temperature feedback. This achieves automatic and precise switching between the heating circuit and the filtration circuit, avoiding temperature deviations and energy waste caused by relying on manual judgment or timed switching. It ensures that the circulation flow is maximized during the heating stage to shorten the heating time, and that the power of the heating device 40 is increased in a timely manner during the heat preservation stage to maintain the stability of the liquid medicine temperature, thereby improving the automation level and temperature control accuracy of the system.

[0076] refer to Figure 3 In one embodiment of this application, the process cavity heating system further includes a third branch 306, and the third branch 306 is provided with a third on / off valve 606. The third branch, 306, is used to add chemicals to the system; The third on / off valve 606 is used to control the opening or closing of the third branch 306 in response to the third control signal of the controller.

[0077] The third branch 306 is a pipeline used to add or replenish chemical solutions to the system. For example, the third branch 306 can be connected to an external chemical solution supply source (such as a plant), injecting the chemical solution into the common pipeline 20 and flowing into the cavity 10.

[0078] The third on / off valve 606 is a component used to control the flow of liquid in the third branch 306. For example, it can be a manual ball valve or an electric shut-off valve.

[0079] The third control signal is a signal (such as an electrical signal or a pneumatic signal) used to switch the on / off state of the third on / off valve 606. For example, it can be a DC signal or a pulse signal.

[0080] Optionally, the cavity 10 is provided with an opening that is connected to the third branch for receiving the liquid medicine in the third branch.

[0081] In one embodiment of this application, the process chamber heating system further includes a liquid supply device 110; One end of the third branch is connected between the heating device 40 and the filtering device 50, and the other end is connected to the liquid supply device 110.

[0082] The liquid supply device 110 refers to the equipment that supplies liquid medicine to the system.

[0083] For example, refer to Figure 2 One end of the third branch 306 is connected to the liquid inlet section (above the first heating device 402), and the other end is connected to the liquid supply device 110 via the third on / off valve 606. When the third on / off valve 606 is open, the liquid medicine in the liquid supply device 110 is added to the liquid inlet section, heated by the first heating device 402 and the second heating device 404, and then enters the cavity 10. When the third on / off valve 606 is closed, the addition of liquid medicine to the system stops.

[0084] For example, upon initial system startup, the controller first controls both the first on-off valve 602 and the second on-off valve 604 to be in the off state, and then outputs a third control signal to open the third on-off valve 606. An external drug supply pump injects room-temperature NMP solution into the common pipeline 20 via the third branch 306. The solution enters the cavity 10 through the inlet section 202 and the inlet port 102 until the solution level in the cavity 10 reaches the predetermined level. After injection is complete, the controller stops the third control signal, the third on-off valve 606 opens, and the system then switches to either the heating circuit or the filtration circuit according to the process stage. During injection, because the third branch 306 does not pass through the filter device 50, the injection flow rate is large, enabling rapid injection.

[0085] For example, after the chemical solution reaches the target temperature, the liquid level in cavity 10 gradually decreases due to the evaporation of the chemical solution during wafer processing. When the liquid level monitoring device (such as a float level sensor) detects that the liquid level is lower than the preset minimum liquid level threshold (e.g., 60% of the total cavity volume), the controller acquires the liquid level signal and outputs a third control signal to open the third on-off valve 606. The chemical solution supply device 110 replenishes new chemical solution into the inlet section 202 through the third branch 306. After the replenished new chemical solution mixes with the hot chemical solution in the inlet section 202, it is heated to the target temperature by the second heating device 404 and then enters cavity 10 through inlet 102. When the liquid level monitoring device reports that the liquid level has risen back to the preset maximum liquid level threshold (e.g., 85% of the total cavity volume), the controller stops the third control signal, the third on-off valve 606 is opened, and the replenishment stops. Throughout the replenishment process, since the third branch 306 does not pass through the filter device 50, the replenishment flow rate is large, which can quickly replenish the liquid level to the normal range. At the same time, the replenished medicine is heated by the heating device 40 before entering the cavity 10, which avoids the sudden drop in local temperature caused by the room temperature medicine directly entering the cavity, thus affecting the stability of the process.

[0086] In this embodiment, by setting a third branch 306 and its third on / off valve 606, with one end of the third branch 306 connected between the heating device and the filtration device and the other end connected to the liquid supply device, the system can have an independent liquid filling function. During liquid filling, the new liquid bypasses the filtration device 50, avoiding the limitation of the filling flow rate by the filtration device 50, improving filling efficiency, and avoiding unnecessary filtration of the new liquid, reducing the ineffective load on the filtration device 50. Furthermore, the new liquid can be preheated by the heating device 40 before entering the cavity 10, preventing the new liquid from directly entering the cavity 10 and affecting the wafer processing. Simultaneously, the third branch can be completely disconnected after filling, and subsequent replenishment of the system will not affect the system's switching between the heating and filtration circuits, making the system's functional divisions clearer and its operation safer and more reliable.

[0087] In one embodiment of this application, the process chamber heating system further includes a liquid level monitoring device disposed within the chamber 10: The liquid level monitoring device is used to monitor the liquid level of the medicine in the cavity 10 so that the controller can generate a third control signal based on the liquid level of the medicine.

[0088] The liquid level monitoring device is a sensing element used to detect the liquid level height of the chemical liquid in the cavity 10. For example, the liquid level monitoring device can be a float liquid level sensor, an ultrasonic liquid level sensor, etc.

[0089] Optionally, one implementation of the controller generating a third control signal based on the liquid level is as follows: when the liquid level monitoring device detects that the liquid level is lower than a preset minimum liquid level threshold, the controller outputs a third control signal to open the third on-off valve 606 to replenish the liquid. Another implementation is: when the liquid level monitoring device detects that the liquid level has reached a preset maximum liquid level threshold, the controller stops outputting the third control signal to open the third on-off valve 606 to stop replenishing the liquid. This specification does not limit the implementation of this method in the embodiments.

[0090] For example, upon initial system startup, the controller first controls both the first on-off valve 602 and the second on-off valve 604 to be in the off state. Then, it outputs a third control signal to open the third on-off valve 606, allowing the external drug source to begin injecting NMP solution into the cavity 10. A float-type liquid level sensor installed on the inner wall of the cavity 10 monitors the liquid level in real time and transmits the liquid level signal to the controller in the form of an analog current signal. The controller has preset maximum and minimum liquid level thresholds. When the liquid level signal fed back by the liquid level sensor reaches the maximum liquid level threshold, the controller stops outputting the third control signal, the third on-off valve 606 opens, and the injection is completed. When the liquid level drops to the minimum liquid level threshold due to drug consumption during subsequent processes, the controller outputs the third control signal again to automatically replenish the drug solution to the maximum liquid level threshold.

[0091] In this embodiment, the liquid level of the medicine is obtained in real time by the liquid level monitoring device in the cavity 10, so that the controller can automatically generate a third control signal based on the accurate liquid level feedback. This realizes the automated control of medicine filling and replenishment, avoids filling errors and operation delays caused by manual observation of liquid level and manual operation of valve, and prevents the heating device 40 from being damaged by dry burning due to too low liquid level or the medicine from overflowing and being wasted due to too high liquid level.

[0092] refer to Figure 3 In one embodiment of this application, the process cavity heating system further includes a power unit 70; The power unit 70 is located in the liquid outlet section 204 and is used to provide circulation power for the liquid medicine in the system.

[0093] The power unit 70 is a power element used to drive the chemical liquid to circulate in the pipeline system. For example, the power unit 70 can be a centrifugal pump, a magnetic drive pump, or a pneumatic diaphragm pump, etc. The embodiments in this specification do not limit this.

[0094] For example, in the heating circuit, the power unit 70 starts operating, drawing the liquid medicine flowing from the outlet 104 of the cavity 10 into the outlet section 204 and pressurizing it, then pumping it to the parallel first branch 302 or second branch 304. In heating mode, the first branch 302 is open and the second branch 304 is closed. The liquid medicine flows through the first branch 302 without the filter device 50 and enters the inlet section 202, where it is heated by the heating device 40, and finally returns to the cavity 10 from the inlet 102. In heat preservation mode, the second branch 304 is open and the first branch 302 is closed. The liquid medicine flows through the second branch 304 equipped with the filter device 50 for filtration, then enters the inlet section 202, where it is heated by the heating device 40 (in heat preservation mode), and finally returns to the cavity 10. In the heating circuit, the first branch 302 has no filter device 50, resulting in low flow resistance and a large circulation flow. In this case, the heating device 40 operates at its first power (heating mode) to achieve rapid temperature rise. In the filtration circuit, the second branch 304 is equipped with a filter device 50, resulting in high flow resistance and a decreased circulation flow. In this case, the heating device 40 operates at its second power (heat preservation mode) to maintain a stable temperature. Optionally, a specific proportional relationship can be preset between the operating power of the power unit 70 and the operating power of the heating device 40. For example, if the power of the heating device 40 is doubled, the operating power of the power unit 70 will also be doubled accordingly. This allows the increased output power of the heating device 40 to increase the circulation rate of the liquid medicine in the pipeline, thereby improving the efficiency of the liquid medicine absorbing the energy output from the heating device 40.

[0095] In this embodiment, a power device 70 is provided in the liquid outlet section 204 to provide a stable and controllable driving force for the circulation of the liquid medicine, ensuring that the liquid medicine can circulate between the cavity 10 and each pipeline to complete heat exchange and filtration purification.

[0096] refer to Figure 3 In one embodiment of this application, the process cavity heating system further includes a first temperature monitoring device 802 and a second temperature monitoring device 804, and the heating device 40 includes a first heating device 402 and a second heating device 404. The first temperature monitoring device 802 is disposed between the first heating device 402 and the second heating device 404, and is used to monitor the temperature of the liquid medicine flowing out of the first heating device 402. The second temperature monitoring device 804 is located between the second heating device 404 and the liquid inlet 102, and is used to monitor the temperature of the liquid medicine when it flows out of the second heating device 404.

[0097] The first temperature monitoring device 802 is a temperature measuring element used to detect the temperature of the liquid medicine after it flows through the first heating device 402. For example, it can be an insertion-type resistance temperature sensor or a patch-type thermocouple temperature sensor.

[0098] The second temperature monitoring device 804 is a temperature measuring element used to detect the temperature of the liquid medicine after it flows through the second heating device 404.

[0099] The first heating device 402 is a heat exchange device for primary heating of the medicinal liquid, such as a tubular electric heater or something else.

[0100] The second heating device 404 is a heat exchange device used for secondary heating of the medicinal liquid.

[0101] For example, in the heating circuit, the liquid medicine first flows through the first heating device 402 for primary heating. The first temperature monitoring device 802 detects the temperature of the liquid medicine after primary heating and feeds it back to the controller. The controller adjusts the output power of the first heating device 402 according to the feedback value of the first temperature monitoring device 802, so that the temperature after primary heating is close to but slightly lower than the target temperature. Subsequently, the liquid medicine flows through the second heating device 404 for secondary heating. The second temperature monitoring device 804 detects the temperature of the liquid medicine that finally enters the cavity 10. The controller fine-tunes the output power of the second heating device 404 according to the difference between the feedback value of the second temperature monitoring device 804 and the target temperature to achieve precise temperature control. When the temperature detected by the second temperature monitoring device 804 exceeds the safety threshold, the controller can shut down the first heating device 402 and the second heating device 404 to prevent the liquid medicine from overheating and deteriorating.

[0102] In this embodiment, by setting up a first temperature monitoring device 802, a second temperature monitoring device 804, a first heating device 402, and a second heating device 404, a connected structure of two-stage heating and two-stage temperature monitoring is formed. On the one hand, this achieves a stepped temperature increase, avoiding local overheating and drug decomposition that may be caused by single-stage high-power heating. On the other hand, the feedback from the first temperature monitoring device 802 is used to coarsely adjust the primary heating, and the feedback from the second temperature monitoring device 804 is used to finely adjust the secondary heating, improving the temperature control accuracy of the drug entering the cavity 10. Simultaneously, the two temperature monitoring devices are redundant; if one fails, the other can still provide temperature protection, enhancing the reliability of the system.

[0103] refer to Figure 3 In one embodiment of this application, the process chamber heating system further includes a first flow monitoring device 902 and a second flow monitoring device 904; The first flow monitoring device 902 is installed in the second branch 304 to monitor the flow rate of the medicine liquid in the second branch 304; The second flow monitoring device 904 is installed in the liquid inlet section 202 and is used to analyze the flow rate of the medicine liquid in the liquid inlet section 202.

[0104] The first flow monitoring device 902 is an instrument used to detect the flow rate of the medicinal liquid in the second branch 304. For example, it can be a turbine flow meter or an ultrasonic flow meter.

[0105] The second flow monitoring device 904 is an instrument used to detect the flow rate of the liquid medicine in the liquid inlet section 202. For example, it can be a turbine flow meter or an ultrasonic flow meter.

[0106] For example, during the operation of the filtration loop, the first flow monitoring device 902 monitors the flow rate of the liquid medicine flowing through the filter device 50, and the second flow monitoring device 904 monitors the flow rate in the inlet section 202 that is about to enter the cavity 10. Assuming no system leaks and the pipeline is intact, all the liquid medicine flowing through the second branch 304 should enter the inlet section 202; therefore, the readings of the first flow monitoring device 902 and the second flow monitoring device 904 should remain approximately consistent. As particulate matter gradually accumulates inside the filter device 50, the flow resistance of the filter device 50 increases, and the circulating flow rate of the entire loop decreases synchronously. At this time, the readings of the first flow monitoring device 902 and the second flow monitoring device 904 show a synchronous decreasing trend, indicating that the filter device 50 is clogged and needs to be replaced or cleaned. If the controller compares the readings of the two flow monitoring devices and finds a discrepancy (i.e., the reading of the first flow monitoring device 902 is greater than the reading of the second flow monitoring device 904), it indicates that the liquid flowing out of the second branch 304 has leaked or diverted before entering the inlet section 202 (for example, there is external leakage at the pipe joint or damage to the pipe). Based on this, the controller issues a leak alarm signal, prompting the operator to check the system's pipe sealing to prevent liquid leakage from causing process abnormalities, environmental pollution, or equipment corrosion.

[0107] In this embodiment of the application, by setting a first flow monitoring device 902 and a second flow monitoring device 904 in the second branch 304 and the liquid inlet section 202 respectively, the flow rate of the second branch 304 and the flow rate of the liquid inlet section 202 can be monitored in real time. Based on the flow rate changes of the two pipelines, it can be analyzed whether the filter device is blocked or whether there is a liquid leakage fault in the system, thereby improving the safety of the system.

[0108] In one embodiment of this application, the process chamber heating system further includes a first impurity particle analysis device (not shown in the figure) and a second impurity particle analysis device (not shown in the figure). The first impurity particle analysis device is installed in the second branch 304 and is used to analyze the impurity particle content of the medicine solution in the second branch 304. The impurity particles include at least one of photoresist particles and metal particles. The second impurity particle analysis device is installed in the liquid inlet section 202 and is used to analyze the impurity particle content of the medicine liquid in the liquid inlet section 202.

[0109] The first impurity particle analysis device is an instrument used to detect the concentration of impurity particles in the 304 solution in the second branch. For example, it can be a laser scattering particle monitor.

[0110] The second impurity particle analysis device is an analytical instrument used to detect the concentration or quantity of impurity particles in the liquid inlet section 202. For example, it can be a laser scattering particle monitor.

[0111] The impurity particle content refers to the number of particles or the particle mass concentration contained in a unit volume of drug solution. For example, it can be the concentration of photoresist particles per milliliter of drug solution, or the concentration of metal particles in the pharmaceutical industry.

[0112] Photoresist particles are microparticles formed from photoresist residue that detaches from the wafer surface during wet processing; for example, they may be incompletely dissolved photoresist fragments.

[0113] Metal particles are metal debris generated during the manufacturing process by friction or chemical corrosion of metal parts; for example, they can be particles of iron, copper, or aluminum.

[0114] For example, during the operation of the filtration loop, the first impurity particle analyzer continuously monitors the impurity particle content in the liquid treated by the filter device 50 in the second branch 304, while the second impurity particle analyzer monitors the impurity particle content in the liquid about to enter the cavity 10 in the inlet section 202. The controller compares the detection values ​​of the two devices: if the detection value of the second impurity particle analyzer is lower than that of the first impurity particle analyzer, it indicates that the filtration effect of the filter device 50 is good; if the detection values ​​of both devices are lower than the process allowable threshold, the system operates normally; if the detection values ​​of both devices are higher than the allowable threshold, it indicates that the filter device 50 may have failed or the liquid has been severely contaminated, requiring shutdown and replacement of the liquid or the filter device 50; if the detection value of the first impurity particle analyzer is lower than the threshold while the detection value of the second impurity particle analyzer is higher than the threshold, it indicates that there is a secondary contamination source in the pipeline downstream of the filter device 50 to the inlet 102, which needs to be investigated. Optionally, the controller can also predict the replacement time of the filter device 50 based on the changing trend of the impurity particle content.

[0115] In this embodiment of the application, by setting a first impurity particle analysis device and a second impurity particle analysis device in the second branch 304 and the liquid inlet section 202 respectively, the cleanliness of the drug solution before and after filtration can be compared and analyzed, thereby enabling real-time evaluation of the working status of the filtration device 50, timely detection of abnormalities such as decreased filtration efficiency, damage to the filtration device 50 or secondary contamination of the pipeline, and prevention of unqualified drug solution from entering the cavity 10 and contaminating the wafer.

[0116] For example, Figure 4A schematic diagram of a process cavity heating system according to an embodiment of this application is shown. The following is in conjunction with... Figure 4 The heating system for the process cavity is described with reference to a specific embodiment.

[0117] like Figure 4 As shown, the process chamber heating system includes a chamber 10, a common pipeline 20, a first branch 302, a second branch 304, a third branch 306, a heating device 40, a filtering device 50, a power device 70, a controller (not shown in the figure), a first on / off valve 602, a second on / off valve 604, a third on / off valve 606, a temperature monitoring device (not shown in the figure), a liquid level monitoring device (not shown in the figure), a first temperature monitoring device 802, a second temperature monitoring device 804, a first heating device 402, a second heating device 404, a first flow monitoring device 902, and a second flow monitoring device 904.

[0118] The common pipeline 20 has an inlet section 202 and an outlet section 204, and the cavity 10 has an inlet port 102 and an outlet port 104. The inlet section 202 and the inlet port 102 are connected, and the outlet section 204 and the outlet port 104 are connected. A power unit 70 is located in the outlet section 204 to provide circulation power for the liquid medicine in the system. A heating device 40 is located in the inlet section 202. The first branch 302, the second branch 304, and the third branch 306 are connected in parallel and communicate with the inlet section 202. The first branch 302 is equipped with a first on / off valve 602, and no filter device 50 is installed inside the first branch 302. The first branch 302 and the common pipeline 20 together form a heating circuit. The second branch 304 is equipped with a second on / off valve 604 and a filter device 50. The second branch 304 and the common pipeline 20 together form a filtration circuit. The third branch 306 is equipped with a third on / off valve 606 for initial filling or replenishment of the system with medicine. A first temperature monitoring device 802 is located between the first heating device 402 and the second heating device 404 to monitor the temperature of the medicine flowing out of the first heating device 402. A second temperature monitoring device 804 is located between the second heating device 404 and the inlet 102 to monitor the temperature of the medicine flowing out of the second heating device 404 and about to enter the cavity 10. A temperature monitoring device is located inside the cavity 10 to monitor the temperature of the medicine inside the cavity 10 in real time. A liquid level monitoring device is located inside the cavity 10 to monitor the liquid level of the medicine inside the cavity 10. A first flow rate monitoring device 902 is located in the second branch 304, downstream of the filter device 50, to monitor the flow rate of the medicine after passing through the filter device 50. A second flow rate monitoring device 904 is located in the inlet section 202, between the second heating device 404 and the inlet 102, to monitor the flow rate of the medicine in the inlet section 202. The controller is electrically connected to the first on / off valve 602, the second on / off valve 604, the third on / off valve 606, the heating device 40, the power device 70, the temperature monitoring device, the liquid level monitoring device, the first temperature monitoring device 802, the second temperature monitoring device 804, the first flow monitoring device 902, and the second flow monitoring device 904, respectively, and is used to receive feedback signals from each monitoring device and send control commands to each actuator according to preset logic.

[0119] For example, the execution logic for process processing using the above system is as follows: After the medicine solution is added, the temperature monitoring device detects that the temperature of the medicine solution in cavity 10 is 25 degrees Celsius, which is lower than the preset target temperature of 85 degrees Celsius. The controller obtains the signal from the wafer presence sensor and confirms that there is no wafer in cavity 10. Based on this, the controller determines that it needs to enter the rapid heating stage, controls the first on-off valve 602 to open, the second on-off valve 604 to open, and the third on-off valve 606 to remain open. At this time, the second branch 304 and the third branch 306 are both in the open state, and only the first branch 302 and the common pipeline 20 form a heating circuit. The controller controls the heating device 40 to operate in heating mode (first power), and the power unit 70 is also started. The medicine solution flows out from the outlet 104 of cavity 10, then enters the first branch 302, and then flows through the first heating device 402 and the second heating device 404 in sequence. The heated medicine solution returns to cavity 10 from the inlet 102. The first temperature monitoring device 802 monitors the temperature after primary heating, and the second temperature monitoring device 804 monitors the final temperature entering the cavity 10. The controller adjusts the output power of the first heating device 402 and the second heating device 404 respectively based on the feedback from the two temperature monitoring devices to achieve two-stage precise temperature control and avoid local overheating.

[0120] When the temperature monitoring device detects that the temperature of the liquid in the cavity 10 has reached the target temperature of 85 degrees Celsius, the controller determines that the process can proceed. After the operator places the wafer into the cavity 10, the controller responds to the signal of wafer placement into the cavity 10 by controlling the first on-off valve 602 to open, the second on-off valve 604 to open, and the third on-off valve 606 to remain open. The second branch 304 and the common pipeline 20 form a filtration loop. The controller switches the heating device 40 to the heat preservation mode (second power operation), and the power unit 70 continues to operate. The liquid flows out from the outlet 104 of the cavity 10, enters the second branch 304 through the outlet section 204, flows through the filter device 50 for filtration, then enters the inlet section 202, flows through the heating device 40 in heat preservation mode for heat replenishment, and finally returns to the cavity 10 through the inlet 102. The first flow monitoring device 902 monitors the flow rate of the medicine in the second branch 304 after passing through the filter device 50 in real time, while the second flow monitoring device 904 monitors the flow rate of the medicine in the inlet section 202 in real time. The controller continuously compares the readings of the two devices: if the readings of the two flow monitoring devices show a synchronous downward trend, it indicates that the filter device 50 is clogged due to particle accumulation and the filter element needs to be replaced; if the reading of the first flow monitoring device 902 is greater than the reading of the second flow monitoring device 904, it indicates that there is a leak or loss of medicine in the system, and the pipeline sealing needs to be checked.

[0121] During the heat preservation and filtration stage, the temperature monitoring device continuously monitors the temperature of the liquid medicine inside the cavity 10. If the detected liquid medicine temperature drops to the minimum temperature threshold (e.g., 83 degrees Celsius), the controller checks the status of the wafer in-situ sensor. If the wafer is still inside the cavity 10, the output power of the heating device 40 is increased to gradually raise the temperature. If the wafer has been removed, the controller controls the first on / off valve 602 to open and the second on / off valve 604 to open, and the heating device 40 switches to heating mode (first power operation). After the liquid medicine temperature rises back to the target temperature, it switches back to the filtration circuit.

[0122] Throughout the heating or heat preservation process, the liquid level monitoring device continuously monitors the liquid level inside the cavity 10. When the detected liquid level is lower than the preset minimum liquid level threshold, the controller outputs a third control signal to open the third on-off valve 606, allowing the external liquid supply source to replenish the system via the third branch 306. When the liquid level monitoring device reports that the liquid level has risen back to the preset maximum liquid level threshold, the controller stops the third control signal, the third on-off valve 606 opens, and liquid replenishment stops.

[0123] For example, the specific steps of applying the above system to heat NMP may include: 1. Add room temperature process solution to cavity 10. Room temperature NMP is added to cavity 10 via the system until the liquid level reaches the preset H high level. A liquid level sensor, such as a float level sensor, is used within cavity 10 to monitor the liquid level.

[0124] 2. Automatic Cyclic Switching. The controller monitors the readings of the temperature sensor inside the cavity 10 in real time (the temperature sensor used in this application is designed for measuring liquid temperature and can accurately measure the current temperature of the liquid inside the cavity). Simultaneously, a target temperature value is set within the controller. When the detected temperature is consistently below the target temperature and there is no wafer inside the cavity, the first on / off valve 602 is opened, and the second on / off valve 604 is closed.

[0125] 3. The medicinal solution begins to circulate and be heated. Start the circulation pump (i.e., power unit 70) to circulate the medicinal solution in chamber 10 through the circulation pipeline. And start the heater (heating device 40) to circulate and heat the medicinal solution.

[0126] 4. Automatically switch to the filter line (second branch 304). The controller continuously monitors the temperature sensor readings inside chamber 10. When the temperature reaches the target temperature range, the first on / off valve 602 closes and the second on / off valve 604 opens.

[0127] 5. Place the wafer into cavity 10 for processing. The circulation pump and heater run continuously to maintain the circulation of the chemical solution, and the heater keeps the chemical solution at a constant temperature. Place the wafer into cavity 10 to begin processing.

[0128] 6. Continuous monitoring of process temperature. The controller continues to monitor the readings of the temperature sensors (temperature monitoring devices) inside the chamber. When the temperature is lower than the preset lower limit of the target temperature, the equipment repeats the above process and automatically switches to raise the temperature of the liquid medicine.

[0129] The above solution has the following technical effects: 1. High heating efficiency: This design significantly reduces the heating process time, allowing the equipment to reach operational status more quickly and greatly improving equipment utilization.

[0130] 2. Better process performance: This design allows the liquid temperature to quickly and effectively recover to the required temperature when it drops to the lower limit of the target temperature, reducing the temperature fluctuation window and achieving better process performance.

[0131] In one embodiment of this application, the process chamber heating system is a chemical heating system used in a resist stripping machine or a chemical heating system used in a wet etching machine.

[0132] A photoresist stripper is a semiconductor wet processing device used to perform photoresist removal (PR Stripper) or lift-off processes.

[0133] A wet etching machine is a device used to perform wet etching on wafers; for example, it can be a single-wafer etching machine or a rotary spray etching machine.

[0134] For example, in the chemical heating system applied to a resist stripper, the NMP chemical solution needs to be heated and circulated within the cavity 10 of the resist stripper. When the system is in the heating phase, the chemical solution circulates along the heating loop formed by the first branch 302 and the common pipeline 20. Since the first branch 302 has no filter device 50, the circulation resistance is low and the flow rate is large, allowing the heating device 40 to efficiently heat the chemical solution. Once the chemical solution reaches the process temperature, the system switches to the filtration loop formed by the second branch 304 and the common pipeline 20. The chemical solution circulates through the filter device 50, filtering out photoresist particles generated during the resist stripping process. The heating device 40 operates in a heat preservation mode, maintaining the chemical solution temperature stably near the process temperature, ensuring the stable execution of the resist stripping process.

[0135] For example, in a chemical heating system applied to a wet etching machine, the etching flux needs to be heated to a specific process temperature. After the system starts, the second branch 304 is closed and the first branch 302 is opened. The heating device 40 operates in heating mode. The chemical flux forms a heating circuit along the first branch 302 (without filter device 50) and the common pipeline 20, and the chemical flux rapidly heats up to the target temperature. When the chemical flux temperature reaches the process requirements, the second branch 304 is turned on and the first branch 302 is turned off. The heating device 40 switches to heat preservation mode. The chemical flux circulates through the filter device 50 to filter out metal debris and reaction product particles generated during the etching process. Combined with the heat preservation function of the heating device 40, the chemical flux temperature is stably maintained within the target range, ensuring the normal operation of wet etching.

[0136] In this embodiment, by applying the above-mentioned process chamber heating system to a resist stripper, the first branch 302 and the second branch 304 connected in parallel achieve rapid heating and filtration / heat preservation, respectively. By keeping the on / off states of the two branches mutually exclusive, it ensures that only one branch is in a conducting state at any given time. This avoids the problem of flow diversion caused by the liquid flowing through both branches simultaneously, which leads to reduced heating efficiency and poor filtration effect. It solves the problem of slow heating and high energy consumption caused by the resistance of the filter device 50 in the resist stripper, thus improving the process efficiency of the resist stripper. By applying the above-mentioned process chamber heating system to a wet etching machine, the heating circuit without the filter device 50 achieves rapid heating of the etching solution, shortening the process waiting time. The filtration circuit with the filter device 50 keeps the solution clean and the temperature stable during the etching process, avoiding flow loss and heat dissipation interference caused by the filter device 50 during the heating stage.

[0137] Corresponding to the above-described process cavity heating system embodiments, this specification also provides embodiments of process cavity heating methods applied to the above-described process cavity heating system. Figure 5 A flowchart illustrating a process cavity heating method according to an embodiment of this application is shown, including the following specific steps. Figure 5 As shown, the method includes: Step 502: Add the medicine into the cavity 10 to the preset liquid level.

[0138] Step 504: Monitor the temperature of the liquid solution using the controller, and monitor whether there is a wafer inside the cavity 10.

[0139] Step 506: If the temperature of the liquid is lower than the target temperature and there is no wafer in the cavity 10, the first branch 302 is opened by the controller, the second branch 304 is closed, and the heating device 40 is operated at the first power.

[0140] Step 508: If the liquid temperature reaches the target temperature, close the first branch 302 through the controller, open the second branch 304 and make the heating device 40 operate at the second power.

[0141] The preset liquid level is a preset liquid level value within the cavity 10 that allows for safe process handling. For example, it could be the liquid level height corresponding to 80% of the total volume of the cavity 10.

[0142] The definitions of the first power and the second power have been described above and will not be repeated here.

[0143] Optionally, one way to add liquid medicine to the cavity 10 to a preset level is to have the controller close the third on / off valve 606 after receiving a signal from the level monitoring device to stop the injection. Another way is for the operator to manually close the injection valve after observing the level gauge to stop the injection. This specification does not limit the embodiments in this way.

[0144] Optionally, one way to monitor the temperature of the liquid solution and the presence of a wafer within the cavity 10 via a controller is to collect temperature values ​​in real time using a temperature monitoring device and detect whether a wafer is placed inside using a wafer-in-place sensor. Another approach is to collect temperature values ​​using a temperature monitoring device and determine whether the wafer is in the cavity based on the operating status signal of the process equipment. This specification does not limit the scope of this approach.

[0145] For example, after the system starts up, the controller first opens the third on / off valve 606 on the third branch 306, and an external drug source injects NMP solution into the cavity 10. The liquid level monitoring device monitors the liquid level in real time. When the liquid level reaches the preset level, the controller closes the third on / off valve 606 to stop the injection of drug solution. Subsequently, the temperature monitoring device starts to monitor the temperature of the drug solution in the cavity 10, and at the same time, the wafer presence sensor detects whether there is a wafer in the cavity 10. In the initial state, no wafer is inserted, and the temperature monitoring device displays that the drug solution temperature is 25 degrees Celsius. The controller determines that this temperature is lower than the preset temperature, opens the first on / off valve 602 on the first branch 302, closes the second on / off valve 604 on the second branch 304, and switches the heating device 40 to heating mode. When the temperature monitoring device shows that the liquid temperature reaches 85 degrees Celsius, the operator sends the wafer into the cavity 10. The wafer in-situ sensor sends a signal, and the controller responds to the signal by closing the first on / off valve 602, opening the second on / off valve 604, and switching the heating device 40 to the heat preservation mode. The liquid is circulated through the filtration device 50, maintaining cleanliness while keeping it warm.

[0146] In this embodiment, the controller automatically monitors the temperature of the liquid and the state of the wafer, and switches the branch and heating mode accordingly. When there is no wafer and the temperature is insufficient, a high-flow heating circuit without filtration is used to quickly raise the temperature. When the temperature reaches the target, the circuit is switched to a filter circuit with filtration to maintain the process conditions. This not only shortens the process preparation time, but also ensures the cleanliness of the liquid and the temperature stability during the process, improves the process efficiency and yield, and realizes automated control from filling, heating to heat preservation.

[0147] In one embodiment of this application, the target temperature includes a minimum temperature and a maximum temperature; After closing the first branch 302, opening the second branch 304, and operating the heating device 40 at the second power, the process also includes: The temperature of the medicine solution is monitored in real time via a controller; If the temperature of the liquid is not between the minimum and maximum temperatures, in response to the signal that the wafer is taken out of the cavity 10, the controller opens the first branch 302, closes the second branch 304, and makes the heating device 40 operate at the first power. If the temperature of the liquid medicine is between the minimum and maximum temperatures, keep the first branch 302 closed, open the second branch 304, and make the heating device 40 operate at the second power.

[0148] The minimum temperature is the lowest temperature threshold set according to the process requirements for heating the solution. For example, for the homogenization and development process, the minimum temperature can be set to 23 degrees Celsius; for the stripping and peeling process, the minimum temperature can be set to 83 degrees Celsius.

[0149] The maximum temperature is the highest temperature threshold set according to the process requirements for heating the solution. For example, for the homogenization and development process, the maximum temperature can be set to 25 degrees Celsius; for the stripping and peeling process, the maximum temperature can be set to 87 degrees Celsius.

[0150] For example, during the heat preservation stage of the adhesive stripping process, the temperature monitoring device provides real-time feedback that the temperature of the liquid inside the cavity 10 is 82 degrees Celsius. The controller determines that this temperature is below the minimum temperature of 83 degrees Celsius. At this time, the controller checks the status of the wafer in-situ sensor: if the wafer is still inside the cavity 10, the controller does not switch the circuit, keeps the second branch 304 on and in heat preservation mode, and increases the output power of the heating device 40 to gradually raise the temperature; if the wafer has been removed, the controller responds to the wafer removal signal by opening the first branch 302, closing the second branch 304, and switching the heating device 40 to heating mode to heat the liquid to the target temperature. When the liquid temperature rises to 84 degrees Celsius, the controller maintains the first branch 302 closed, the second branch 304 on, and the heat preservation mode, and does not switch again.

[0151] In this embodiment, by using the minimum and maximum temperatures as temperature control boundaries, and further determining whether the wafer is inside the cavity when the solution temperature is not between the minimum and maximum temperatures, and switching back to the high-flow-rate heating circuit when the wafer has been removed, the flow field disturbance and temperature fluctuation caused by switching branches during the wafer processing are avoided, thus protecting the stability of the process and the wafer processing quality. When the solution temperature is between the minimum and maximum temperatures, the first branch 302 is kept closed, the second branch 304 is opened, and the heating device 40 is in heat preservation mode, which can maintain the solution temperature between the minimum and maximum temperatures, ensuring the continuous and stable operation of various wet processes such as spin coating, development, and stripping.

[0152] The above is a schematic scheme of a process cavity heating method according to this embodiment. It should be noted that the technical solution of this process cavity heating method and the technical solution of the process cavity heating system described above belong to the same concept. For details not described in detail in the technical solution of the process cavity heating method, please refer to the description of the technical solution of the process cavity heating system described above.

[0153] The foregoing has described specific embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired results. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0154] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments of this application are not limited to the described order of actions, because according to the embodiments of this application, some steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also understand that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to the embodiments of this application.

[0155] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0156] The preferred embodiments disclosed above are merely illustrative of this specification and do not exhaustively describe all details, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the embodiments of this application. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the embodiments of this application, thereby enabling those skilled in the art to better understand and utilize this specification. This specification is limited only by the claims and their full scope and equivalents.

Claims

1. A heating system for a process cavity, characterized in that, include: The cavity, common pipeline, first branch, second branch, heating device, and filtration device; The common pipeline has an inlet section and an outlet section, and the cavity has an inlet and an outlet. The liquid inlet section is connected to the liquid inlet, the liquid outlet section is connected to the liquid outlet, the heating device is installed in the common pipeline, and the filtration device is installed in the second branch. Wherein, after the first branch and the second branch are connected in parallel, one end is connected to the liquid inlet section and the other end is connected to the liquid outlet section, so that the first branch and the common pipeline form a heating circuit, and the second branch and the common pipeline form a filtration circuit, and the on / off states of the first branch and the second branch are mutually exclusive.

2. The process cavity heating system according to claim 1, characterized in that, The process chamber heating system also includes a controller; The controller is configured to, when there is no wafer in the cavity and the liquid temperature is below the target temperature, control the second branch to be disconnected, control the first branch to be connected, and control the heating device to operate at a first power; and When the temperature of the liquid medicine is not lower than the target temperature, the second branch is controlled to be in a conducting state, the first branch is controlled to be in a disconnected state, and the heating device is controlled to operate at a second power, wherein the first power is greater than the second power.

3. The process cavity heating system according to claim 2, characterized in that, The first branch is equipped with a first on / off valve, and the second branch is equipped with a second on / off valve; The first on / off valve is used to control the opening or closing of the first branch in response to a first control signal from the controller; The second on / off valve is used to control the opening or closing of the second branch in response to a second control signal from the controller.

4. The process cavity heating system according to claim 3, characterized in that, The process chamber heating system also includes a temperature monitoring device: The temperature monitoring device is used to monitor the temperature of the liquid medicine, so that the controller generates the first control signal and the second control signal based on the temperature of the liquid medicine.

5. The process cavity heating system according to claim 2, characterized in that, The process chamber heating system also includes a third branch, which is equipped with a third on / off valve. The third branch is used to add medicine to the system; The third on / off valve is used to control the opening or closing of the third branch in response to the third control signal of the controller.

6. The process cavity heating system according to claim 5, characterized in that, The process chamber heating system also includes a liquid supply device; One end of the third branch is connected between the heating device and the filtering device, and the other end is connected to the liquid medicine supply device.

7. The process cavity heating system according to claim 5, characterized in that, The process chamber heating system also includes a liquid level monitoring device disposed within the chamber: The liquid level monitoring device is used to monitor the liquid level of the medicine in the cavity, so that the controller generates the third control signal based on the liquid level of the medicine.

8. The process cavity heating system according to claim 1, characterized in that, The process chamber heating system also includes a power unit; The power unit is located in the liquid outlet section and is used to provide circulation power for the liquid medicine in the system.

9. The process cavity heating system according to any one of claims 1-8, characterized in that, The process chamber heating system further includes a first temperature monitoring device and a second temperature monitoring device, and the heating device includes a first heating device and a second heating device. The first temperature monitoring device is disposed between the first heating device and the second heating device, and is used to monitor the temperature of the liquid medicine when it flows out of the first heating device; The second temperature monitoring device is located between the second heating device and the liquid inlet, and is used to monitor the temperature of the liquid medicine when it flows out of the second heating device.

10. The process cavity heating system according to any one of claims 1-8, characterized in that, The process chamber heating system is either a chemical heating system used in a glue stripping machine or a chemical heating system used in a wet etching machine.

11. A method for heating a process cavity, characterized in that, The process cavity heating system applied to any one of claims 2-10 comprises: Add the medicine into the cavity to the preset level; The controller monitors the temperature of the liquid medicine and the presence of a wafer within the cavity. If the temperature of the liquid medicine is lower than the target temperature and there is no wafer in the cavity, the controller opens the first branch, closes the second branch, and makes the heating device operate at the first power. If the temperature of the liquid reaches the target temperature, the controller shuts down the first branch, opens the second branch, and causes the heating device to operate at the second power.

12. The method according to claim 11, characterized in that, The target temperature includes both the minimum temperature and the maximum temperature; After closing the first branch, opening the second branch, and operating the heating device at the second power, the process further includes: The temperature of the liquid medicine is monitored in real time by the controller. If the temperature of the liquid medicine is not between the minimum temperature and the maximum temperature, in response to the signal that the wafer is taken out of the cavity, the controller opens the first branch, closes the second branch, and makes the heating device operate at the first power. If the temperature of the liquid medicine is between the minimum temperature and the maximum temperature, keep the first branch closed, open the second branch, and make the heating device operate at the second power.

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