Reflux cooling type hot isostatic pressing apparatus

Abstract

The application provides a backflow cooling type hot isostatic pressing equipment, comprising: a processing cavity, which is internally provided with a processing space; an air inlet pipeline, which is communicated with the processing space; an air outlet pipeline, which is communicated with the processing space; a backflow pipeline, which is connected and communicated with the air outlet pipeline and the air inlet pipeline; and a first adjusting valve, which is arranged on the backflow pipeline and communicated with the backflow pipeline; wherein the air inlet pipeline is used for connecting the cooling gas, the air outlet pipeline is used for receiving the heated gas discharged from the processing space, the temperature of the heated gas is higher than that of the cooling gas, the air outlet pipeline is used for making at least part of the heated gas flow into the air inlet pipeline and mix with the cooling gas, forming the mixed gas and flowing into the processing space, and the first adjusting valve is used for adjusting the flow rate of the heated gas flowing from the backflow pipeline into the air inlet pipeline. Through the backflow cooling type hot isostatic pressing equipment provided by the application, the mixed gas formed by mixing the cooling gas and the heated gas can cool the processing space, and the cooling efficiency can be improved.

Description

Technical Field

[0001] This application relates to the technical field of photovoltaic and semiconductor product processing, and in particular to a reflux cooling type hot isostatic pressing equipment. Background Technology

[0002] In the processing of photovoltaic and semiconductor products, hot isostatic pressing (HIP) equipment can process sheet materials and other workpieces. HIP equipment can have a processing space. After the workpiece or its raw material enters the processing space, the HIP equipment increases the temperature and pressure of the workpiece by injecting inert gas and heating the processing space, thus completing the processing.

[0003] However, after the workpiece is processed, it usually needs to cool down naturally in the processing space until the temperature drops to a preset value before it can be removed from the processing space, and before workpieces or raw materials to be processed can be placed into the processing space. Waiting for the processing space to cool down naturally takes a long time, which affects the processing efficiency of the equipment. Summary of the Invention

[0004] In view of the above, it is necessary to provide a reflux-cooled hot isostatic pressing device to solve the above-mentioned defects.

[0005] An embodiment of this application provides a reflux-cooled hot isostatic pressing (HIP) device, comprising: a processing chamber with a processing space inside; an inlet pipe connected to the processing chamber and communicating with the processing space; an exhaust pipe connected to the processing chamber and communicating with the processing space; a reflux pipe connected to and communicating with the exhaust pipe and the inlet pipe; and a first regulating valve disposed on and communicating with the reflux pipe. The inlet pipe is used to receive cooling gas, the exhaust pipe is used to receive heated gas discharged from the processing space, the temperature of the heated gas being higher than the temperature of the cooling gas, the exhaust pipe is used to allow at least a portion of the heated gas to flow into the inlet pipe and mix with the cooling gas to form a mixed gas that flows into the processing space, and the first regulating valve is used to regulate the flow rate of the heated gas flowing from the reflux pipe into the inlet pipe.

[0006] Optionally, the hot isostatic pressing device further includes: a first detection element connected to the return pipeline, the first detection element being used to detect the temperature and / or flow rate of the heated gas in the return pipeline and output first detection information; and a processor being communicatively connected to the first regulating valve and the first detection element, the processor being used to receive the first detection information and output first regulating information to the first regulating valve to regulate the opening degree of the first regulating valve.

[0007] Optionally, the hot isostatic pressing equipment further includes: a temperature sensor disposed in the processing cavity, the temperature sensor being used to detect the temperature of the processing cavity and output temperature detection information; and a processor, which is communicatively connected to the first regulating valve and the temperature sensor, the processor being used to receive the temperature detection information and output first regulating information to the first regulating valve to regulate the opening degree of the first regulating valve.

[0008] Optionally, the hot isostatic pressing equipment further includes: an air inlet nozzle disposed in the processing chamber and connected to an air inlet pipeline, the air inlet nozzle extending at least partially into the processing space, the portion of the air inlet nozzle extending into the processing space extending obliquely, the air inlet nozzle being used to inject the mixed gas into the processing space.

[0009] Optionally, there are multiple air intake nozzles, which are spaced apart along the direction surrounding the processing space and spaced apart along the height direction of the hot isostatic pressing equipment, so that the mixed gas entering the processing space through the multiple air intake nozzles flows in a spiral direction surrounding the processing cavity.

[0010] Optionally, the intake pipe includes a first pipe section and a second pipe section, the connection between the first pipe section and the second pipe section is connected to the end of the return pipe away from the exhaust pipe, the second pipe section is connected to the processing space, and the first pipe section is used to receive cooling gas; the hot isostatic pressing equipment further includes: a second regulating valve, which is disposed in the first pipe section and connected to the first pipe section, and the second regulating valve is used to regulate the flow rate of the cooling gas flowing from the first pipe section into the second pipe section, so as to regulate the flow rate and temperature of the mixed gas in the second pipe section.

[0011] Optionally, the hot isostatic pressing device further includes: a second detection element connected to the first pipe section, the second detection element being used to detect the temperature and / or flow rate of the cooling gas in the first pipe section and output second detection information; and a processor communicatively connected to the second regulating valve and the second detection element, the processor being used to receive the second detection information and output second regulating information to the second regulating valve to adjust the opening degree of the second regulating valve.

[0012] Optionally, the hot isostatic pressing equipment further includes: a temperature sensor, disposed in the processing chamber and / or exhaust pipe, the temperature sensor being used to detect the temperature of the heated gas in the processing chamber and output temperature detection information; and a processor, communicatively connected to the second regulating valve and the temperature sensor, the processor being used to receive the temperature detection information and output second regulating information to the second regulating valve to adjust the opening degree of the second regulating valve.

[0013] Optionally, an air inlet and an exhaust outlet are provided on the processing cavity. The air inlet is connected to the processing space and the air inlet pipeline, and the exhaust outlet is connected to the processing space and the exhaust pipeline. In the height direction of the hot isostatic pressing equipment, the height of the air inlet is greater than the height of the exhaust outlet.

[0014] Optionally, the hot isostatic pressing equipment also includes: a housing, a processing chamber disposed inside the housing, and an intake pipe and an exhaust pipe passing through the inside of the housing.

[0015] The recirculation-cooling hot isostatic pressing (HIP) equipment provided in this application allows for the connection of cooling gas to the inlet pipe after the workpiece is processed. The heated gas in the processing space can then enter the inlet pipe through the recirculation pipe, allowing the cooling gas and heated gas in the inlet pipe to mix and form a mixed gas. This mixed gas then enters the processing space, cooling it. In this way, the heated gas that was originally discharged from the processing space flows back into the inlet pipe to participate in cooling the processing space, achieving recirculation cooling of the HIP equipment. The cooling of the processing space by the mixed gas improves the cooling efficiency of the processing space and reduces the time spent waiting for the processing space to cool down. This allows for an increase in the number of times the HIP equipment processes the workpiece within a fixed time period, thereby improving the processing efficiency of the HIP equipment. Attached Figure Description

[0016] Figure 1 This is a first schematic diagram of the hot isostatic pressing equipment and carrier in the embodiments of this application.

[0017] Figure 2 This is a schematic diagram of the hot isostatic pressing equipment in the embodiments of this application.

[0018] Figure 3 This is a second schematic diagram of the hot isostatic pressing equipment and carrier in the embodiments of this application.

[0019] Figure 4 This is a first flowchart of the cooling method in the embodiments of this application.

[0020] Figure 5 This is a second flowchart of the cooling method in the embodiments of this application.

[0021] Figure 6 This is the third flowchart of the cooling method in the embodiments of this application.

[0022] Explanation of key component symbols: 100. Hot isostatic pressing equipment; 10. Machining cavity; 11. Machining space; 12. Air inlet; 13. Exhaust outlet; 20. Air inlet pipe; 21. First pipe section; 22. Second pipe section; 30. Exhaust pipe; 40. Return pipe; 50. First regulating valve; 60. Air inlet nozzle; 70. First detection element; 80. Processor; 90. Temperature detection element; 110. Second regulating valve; 120. Second detection element; 130. Housing; 200. Carrier. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments.

[0024] The term "multiple" in this application refers to two or more. Furthermore, it should be understood that the terms "first," "second," etc., used in the description of this application are used only for descriptive purposes and should not be construed as indicating or implying relative importance, nor as indicating or implying order.

[0025] In the description of the embodiments in this application, the words "exemplary" or "for example" are used to indicate that they are examples, illustrations, or descriptions. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design options. Specifically, the use of the words "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0026] Please see Figure 1 , Figure 1 An embodiment of this application illustrates a reflux-cooled hot isostatic pressing device 100.

[0027] It is understood that the hot isostatic pressing (HIP) apparatus 100 can process workpieces (not shown in the figure). This processing can be performed by processing the raw material of the workpiece to obtain a workpiece with a rigid structure or a semi-finished workpiece, or it can be performed on a workpiece or a semi-finished workpiece that already has a rigid structure. The embodiments of this application do not limit this specific method. Furthermore, the embodiments of this application do not specifically limit the process by which the HIP apparatus 100 processes the workpiece.

[0028] For example, the hot isostatic pressing (HIP) equipment 100 can be a hot isostatic pressing (HIP) equipment, and the workpiece can be used in photovoltaic or semiconductor products. For instance, the workpiece can be a silicon carbide polycrystalline substrate in a semiconductor product. The HIP equipment 100 can process a green blank containing silicon carbide material through the HIP process to obtain a silicon carbide polycrystalline substrate with a hard structure.

[0029] It is understood that when the hot isostatic pressing equipment 100 is a hot isostatic pressing equipment, the hot isostatic pressing equipment 100 can also process other general workpieces in the relevant fields that are not mentioned in the above examples, which will not be elaborated here.

[0030] It is understood that the hot isostatic pressing apparatus 100 can be a vertically installed furnace. The height direction of the hot isostatic pressing apparatus 100 can be defined as the vertical direction. For example, the vertical direction could be... Figure 1The Z direction and its opposite direction are shown, with the side towards which the Z direction arrow points being the upper side or top of the hot isostatic pressing equipment 100 and its components, and the side away from the Z direction arrow being the lower side or bottom of the hot isostatic pressing equipment 100 and its components.

[0031] In one embodiment, the hot isostatic pressing (HIP) apparatus 100 may include a processing chamber 10, an inlet pipe 20, an exhaust pipe 30, a return pipe 40, and a first regulating valve 50. The inlet pipe 20, the exhaust pipe 30, and the return pipe 40 are all composed of pipe groups formed by rigid pipes, flexible pipes, or rigid pipes connected to flexible pipes, and have internal structures for gas passage.

[0032] A processing space 11 can be formed inside the processing cavity 10. The processing space 11 can accommodate a carrier 200, which can hold multiple workpieces or semi-finished workpieces; that is, workpieces or semi-finished workpieces can be stored within the processing space 11. The processing cavity 10 can heat the processing space 11, thereby increasing the temperature of the workpieces or semi-finished workpieces within the processing space 11. When processing workpieces in the hot isostatic pressing equipment 100, the processing space 11 can be filled with inert gas, and the inert gas can be heated by the processing cavity 10 to form a heated gas.

[0033] One end of the intake pipe 20 can penetrate into the machining cavity 10 and communicate with the intake port 12 on the inner wall of the machining space 11, thereby achieving communication with the machining space 11. The other end of the intake pipe 20 can extend out of the machining cavity 10 and can be connected to an intake device (not shown). The intake device can supply cooling gas to the intake pipe 20. The cooling gas can be an inert gas, and the temperature of the cooling gas is lower than the temperature of the heated gas.

[0034] One end of the exhaust pipe 30 can penetrate into the machining cavity 10 and communicate with the exhaust port 13 on the inner wall of the machining space 11, thereby achieving communication with the hot isostatic pressing equipment 100. The other end of the exhaust pipe 30 can extend out of the machining cavity 10 and can be connected to and communicate with a vacuum device (not shown). The exhaust pipe 30 can receive the heated gas flowing out of the machining space 11, and the vacuum device can evacuate the exhaust pipe 30 to drive the heated gas from the machining space 11 to the exhaust pipe 30.

[0035] One end of the return pipe 40 can be fixedly connected to and communicate with the intake pipe 20, and the other end can be fixedly connected to and communicate with the exhaust pipe 30. The return pipe 40 allows the heated gas in the exhaust pipe 30 to pass through, allowing the heated gas to enter the intake pipe 20 and mix with the cooling gas in the intake pipe 20 to form a mixed gas. The first regulating valve 50 can be fixedly installed on the return pipe 40. The first regulating valve 50 is an adjustable valve. Adjusting the opening of the first regulating valve 50 can regulate the flow rate of the heated gas entering the intake pipe 20 from the return pipe 40, that is, it can regulate the volume of heated gas entering the intake pipe 20 from the return pipe 40 per unit time.

[0036] The temperature of the mixed gas formed by the mixing of cooling gas and heated gas is lower than the temperature of the processing space 11. Compared with waiting for the processing chamber 10 to stand still and cool down naturally, cooling the processing space 11 by mixing gas can improve the cooling efficiency and reduce the waiting time for the processing space 11 to cool down. This can increase the number of times the hot isostatic pressing equipment 100 processes the workpiece within a fixed period of time, thereby improving the efficiency of workpiece processing.

[0037] The mixed gas formed by the mixing of cooling gas and heated gas in the intake pipe 20 can enter the processing space 11 through the intake port 12. At this time, the temperature of the mixed gas is lower than the temperature of the heated gas in the processing space 11. After entering the processing space 11, the mixed gas can mix with the existing heated gas in the processing space 11 to form a new heated gas, and can also reduce the temperature of the heated gas, so that the temperature of the newly formed heated gas is lower than the temperature of the heated gas originally discharged from the exhaust pipe 30. The decrease in the temperature of the heated gas reduces the temperature inside the processing space 11.

[0038] In the initial period after the hot isostatic pressing (HIP) equipment 100 completes the processing of the workpiece, the processing space 11 is at its highest temperature. At this time, the opening of the first regulating valve 50 can be increased, thereby increasing the volume of heated gas entering the intake pipe 20 from the return pipe 40 to participate in the formation of the mixed gas. This raises the temperature of the mixed gas, thereby reducing the temperature difference between the mixed gas entering the processing space 11 and the heated gas located in the processing space 11. This reduces the probability of structural damage to the processing cavity 10 due to excessive temperature difference between the mixed gas and the processing space 11. In this way, the heated gas that was originally discharged from the processing space 11 can flow back into the intake pipe 20 to participate in the cooling of the processing space 11, realizing the reflux cooling of the HIP equipment 100.

[0039] As the mixed gas enters the processing space 11, it cools down the processing space 11. The temperature inside the processing space 11 gradually decreases, so that the lower limit of the mixed gas temperature that the processing cavity 10 can withstand without structural damage gradually decreases. At this time, the opening of the first regulating valve 50 can be reduced, thereby reducing the volume of the heated gas participating in the formation of the mixed gas, and lowering the temperature of the mixed gas, thereby improving the efficiency of the mixed gas in cooling the processing space 11.

[0040] It is understood that the end of the exhaust pipe 30 away from the processing chamber 10 can be connected to and communicate with the exhaust system of the workshop where the hot isostatic pressing equipment 100 is located. Part of the heated gas in the exhaust pipe 30 can enter the intake pipe 20 through the return pipe 40, and the remaining heated gas can be discharged into the exhaust system. The exhaust system can discharge the heated gas into the atmosphere, or it can recycle the heated gas, or it can discharge the heated gas into a purification device for purification before discharging it into the atmosphere or recycling it. The embodiments of this application do not limit this.

[0041] It is understood that the cooling gas and the heating gas can be the same type of inert gas. In the embodiments of this application, the types of cooling gas and heating gas are not specifically limited. For example, both cooling gas and heating gas can be, but are not limited to, nitrogen.

[0042] In the embodiments of this application, the temperature of the cooling gas is not specifically limited. For example, the temperature of the cooling gas can be between 10°C and 50°C.

[0043] In the embodiments of this application, the temperature of the heated gas is not specifically limited. For example, when the hot isostatic pressing device 100 is a hot isostatic pressing device, the upper limit of the temperature of the heated gas can be between 900°C and 2000°C, and as the mixed gas enters the heating space to cool the heated gas, the temperature of the heated gas can gradually decrease to between 10°C and 50°C.

[0044] In other embodiments, the return pipe 40 can also be connected to a gas supply device (not shown) via a pipe. The gas supply device can serve as an external gas source supply device to supply heated gas to the return pipe 40, so that the return pipe 40 does not need to obtain heated gas from the exhaust pipe 30. In this case, the exhaust pipe 30 and the return pipe 40 can be isolated.

[0045] In the embodiments of this application, the fixing method during fixed connection and fixed installation is not specifically limited. For example, the fixing method may include, but is not limited to, bolt fixing, screw fixing, welding fixing, integral molding fixing, and interference fixing.

[0046] In the embodiments of this application, the structure of the processing cavity 10 is not specifically limited. For example, the processing cavity 10 may include a cavity body, a heat insulation layer, and a heating element. The cavity body may enclose a processing space 11. One end of the cavity body may be provided with a detachable end cap. When the end cap is open, the carrier 200 loaded with the workpiece or workpiece raw material can enter or leave the processing space 11. When the end cap is closed, the hot isostatic pressing equipment 100 can begin processing the workpiece. The heat insulation layer may cover the outside of the cavity body to prevent heat loss within the processing space 11. The heating element may pass through the cavity body and enter the processing space 11, or it may be arranged around the outside of the cavity body and located inside the heat insulation layer. The materials, structures, and working principles of the heat insulation layer and the heating element are well known in the relevant art and will not be described in detail here.

[0047] In the embodiments of this application, the positions of the air inlet 12 and the exhaust outlet 13 are not specifically limited. Vertically, the height of the air inlet 12 can be greater than the height of the exhaust outlet 13, meaning the air inlet 12 can be located above the exhaust outlet 13. Thus, the mixed gas entering the processing space 11 from the air inlet 12 can flow towards the bottom of the processing space 11 under gravity, while the exhaust outlet 13 allows gas exiting from the bottom of the processing space 11 to the exhaust pipe 30 to pass through. This allows the hotter gas located on the lower side of the processing space 11 to exit the processing space 11 before the cooler gas located on the upper side, thereby improving the cooling efficiency of the processing space 11.

[0048] In some cases, the air inlet 12 can be located on the side wall of the machining space 11, and the exhaust outlet 13 can be located on the bottom wall of the machining space 11.

[0049] In other cases, the air inlet 12 may also be located on the top wall of the processing space 11, and the exhaust outlet 13 may also be located on the side wall of the processing space 11. The embodiments of this application do not limit this.

[0050] In the embodiments of this application, the number of air inlets 12 is not specifically limited. For example, there can be multiple air inlets 12, the processing cavity 10 can be a cylindrical cavity, and the multiple air inlets 12 can be spaced apart along the direction surrounding the processing cavity 10, and can also be spaced apart in the vertical direction, so that the multiple air inlets 12 are spaced apart in the spiral direction surrounding the processing wall, and the mixed gas can enter the processing space 11 through the multiple air inlets 12 to simultaneously cool multiple areas of the processing space 11.

[0051] When there are multiple air inlets 12, in some cases, there can be multiple air intake pipes 20, with each air intake pipe 20 corresponding one-to-one with a specific air inlet 12. Each air intake pipe 20 communicates with the processing space 11 through its corresponding air inlet 12. In other cases, the number of air intake pipes 20 may be less than the number of air inlets 12. One air intake pipe 20 may communicate with the processing space 11 through all or more of the multiple air inlets 12. The embodiments of this application do not limit this.

[0052] When there are multiple intake pipes 20, in some cases, there are also multiple exhaust pipes 30 and multiple return pipes 40. Each exhaust pipe 30 corresponds one-to-one with each intake pipe 20, and each return pipe 40 corresponds one-to-one with each intake pipe 20. The corresponding intake pipes 20, return pipes 40, and exhaust pipes 30 are connected and interconnected. Each return pipe 40 is equipped with a first regulating valve 50, meaning that the multiple first regulating valves 50 can respectively regulate the flow rate of the heated gas in the multiple return pipes 40. In other cases, the number of exhaust pipes 30 and the number of return pipes 40 may be less than the number of intake pipes 20. One return pipe 40 can be connected and interconnected with one or more portions of the intake pipes 20, and can be connected and interconnected with one or more corresponding portions of the exhaust pipes 30. The embodiments of this application do not limit this.

[0053] In some embodiments, the hot isostatic pressing apparatus 100 may further include an air inlet nozzle 60. The air inlet nozzle 60 may be fixedly installed in the processing chamber 10 and may be located at the air inlet 12. The air inlet nozzle 60 may communicate with the air inlet pipe 20 through the air inlet 12, and the air inlet nozzle 60 may extend into and communicate with the processing space 11. The air inlet nozzle 60 may receive the mixed gas in the air inlet pipe 20 and spray the mixed gas into the processing space 11 based on the Venturi principle.

[0054] The portion of the air intake nozzle 60 that extends into the processing space 11 extends at an angle, and its extension direction can form an acute angle with the length direction, width direction, and / or vertical direction of the hot isostatic pressing equipment 100. The length direction, width direction, and vertical direction of the hot isostatic pressing equipment 100 can be perpendicular to each other. The orientation of the outlet end of the angled air intake nozzle 60 can be the same as its extension direction.

[0055] In the embodiments of this application, the extension direction of the air intake nozzle 60 is not specifically limited. For example, the processing space 11 can be a cylindrical space, the sidewall of the processing space 11 can be arc-shaped, the extension direction of the air intake nozzle 60 can form an acute angle with the tangent of the sidewall of the processing space 11, and can also form an acute angle with the vertical direction and be inclined towards the lower side of the processing space 11.

[0056] It is understood that the inclined extension of the intake nozzle 60 allows the gas blown out from the intake nozzle 60 to be blown onto the arc-shaped side wall of the processing space 11. This allows the gas ejected from the intake nozzle 60 to flow in the direction surrounding the processing space 11 and towards the lower side of the processing space 11. As a result, the mixed gas can flow in the spiral direction surrounding the processing space 11 after entering the processing space 11. This can improve the uniformity of the flow of the mixed gas after entering the processing space 11. The mixed gas with a lower temperature than the original heated gas in the processing space 11 can be mixed into the heated gas in different areas of the processing space 11, thereby achieving uniform cooling of the processing space 11 and reducing the occurrence of mixed gas stagnation near the intake port 12.

[0057] It is understood that when there are multiple air inlets 12, and these multiple air inlets 12 are spaced apart along a spiral direction surrounding the processing space 11, at least one inclined air inlet nozzle 60 is installed at each air inlet 12, so that the multiple air inlet nozzles 60 can be spaced apart along a spiral direction surrounding the processing space 11. In this way, by injecting mixed gas into the processing space 11 at various positions in the spiral direction, and through the inclined extension of the air inlet nozzles 60 into the processing space 11, the volume of mixed gas entering the processing space 11 can be increased while maintaining the flow of mixed gas along the spiral direction, thereby improving the cooling efficiency of the processing space 11.

[0058] For example, such as Figure 1 As shown, the mixed gas ejected from the intake nozzle 60 can flow in the spiral direction shown by the S trajectory.

[0059] Please refer to the following: Figure 2 In some embodiments, the hot isostatic pressing (HIP) apparatus 100 may further include a first detection element 70 and a processor 80. The first detection element 70 may be fixedly installed in the return pipe 40 and may detect the temperature and flow rate of the heated gas flowing through the return pipe 40, and generate and output first detection information based on the detection results. The processor 80 may be communicatively connected to the first detection element 70 and the first regulating valve 50. The processor 80 may receive the first detection information and may determine the temperature and flow rate of the heated gas flowing through the return pipe 40 through the first detection information. Then, the processor 80 may output first regulating information to the first regulating valve 50, and the first regulating valve 50 may adjust its own opening degree after receiving the first regulating information.

[0060] When the processor 80 determines the temperature and flow rate of the heated gas flowing through the return pipe 40 based on the first detection information, and determines whether the flow rate of the heated gas is sufficient to make the mixed gas reach the target temperature, if it is sufficient, the opening of the first regulating valve 50 can remain unchanged; if it is insufficient, the processor 80 can output the first regulating information to the first regulating valve 50 to increase the opening of the first regulating valve 50, thereby increasing the temperature of the mixed gas and reducing the temperature difference between the mixed gas and the processing space 11.

[0061] As the mixed gas cools the processing space 11, the temperature of the heated gas discharged from the processing space 11 gradually decreases, thereby improving the cooling efficiency of the processing space 11. Therefore, the processor 80 can further determine, based on the first detection information, whether the flow rate of the heated gas in the return pipe 40 is too fast, and whether this will lead to an excessively high temperature of the mixed gas. When it is determined that the flow rate of the heated gas is too fast, the processor 80 outputs the first adjustment information to the first regulating valve 50, causing the opening of the first regulating valve 50 to decrease, thereby reducing the volume of the heated gas participating in the formation of the mixed gas, lowering the temperature of the mixed gas, and improving the cooling efficiency of the processing space 11. At this time, the decrease in the opening of the first regulating valve 50 increases the volume of gas discharged from the end of the exhaust pipe 30 away from the processing chamber 10 into the exhaust system.

[0062] It is understood that the first detection element 70 can be located on the side of the first regulating valve 50 away from the exhaust pipe 30 and close to the intake pipe 20, so that the first detection element 70 can detect the flow rate of the gas passing through the first regulating valve 50.

[0063] In the embodiments of this application, the type of the first detection element 70 is not specifically limited. For example, the first detection element 70 may be an electronic device formed by integrating a temperature detection element and a flow rate detection element. As another example, the first detection element 70 may include a temperature detection element and a flow rate detection element, and the first detection information may include temperature information and flow rate information. The temperature detection element can detect the temperature of the heated gas in the return pipe 40 and output the temperature information to the processor 80; the flow rate detection element can detect the flow rate of the heated gas in the return pipe 40 and output the flow rate information to the processor 80; after receiving the temperature information and flow rate information, the processor 80 can output first adjustment information to the first regulating valve 50 to adjust the opening degree of the first regulating valve 50.

[0064] In the embodiments of this application, the types of temperature sensing elements and flow rate sensing elements are not specifically limited. For example, the temperature sensing element may be a temperature sensor or a thermocouple, and the flow rate sensing element may be a flow meter.

[0065] In the embodiments of this application, the type of the first regulating valve 50 is not specifically limited. For example, the first regulating valve 50 may be, but is not limited to, a proportional regulating valve.

[0066] It is understood that when there are multiple return pipes 40, each return pipe 40 can be equipped with at least one first detection element 70 and at least one first regulating valve 50. The processor 80 can communicate with each first detection element 70 and the first regulating valve 50, and can output the corresponding first regulating information to the first regulating valve 50 on the same return pipe 40 according to the first detection information generated by the first detection element 70 on each return pipe 40.

[0067] It is understood that the communication connection can be a wired communication connection implemented through hardware such as signal lines, or a wireless communication connection implemented through technologies such as wireless local area networks, Bluetooth, 3G, 4G, 5G and cellular networks. The embodiments of this application do not limit this.

[0068] It is understood that the processor 80 may be, but is not limited to, a general-purpose central processing unit (CPU), a programmable controller (PLC), a microprocessor, or an application-specific integrated circuit (ASIC). The embodiments of this application do not limit this.

[0069] In some embodiments, the hot isostatic pressing apparatus 100 may further include a temperature sensing element 90. The temperature sensing element 90 may be communicatively connected to the processor 80. The temperature sensing element 90 may be fixedly installed in the processing chamber 10 and / or the exhaust pipe 30. The temperature sensing element 90 may detect the temperature of the heated gas in the processing space 11, and may output temperature detection information to the processor 80 based on the detection results.

[0070] At this time, after receiving the temperature detection information, the processor 80 can determine the temperature in the processing space 11 based on the temperature detection information, and determine the required temperature of the mixed gas that needs to enter the processing space 11 for cooling based on the temperature in the processing space 11. Then, the processor 80 can output the first adjustment information to the first regulating valve 50 based on the combination of the first detection information and the temperature detection information, so that the first regulating valve 50 can adjust its opening degree according to the required temperature of its mixed gas and the flow rate of the heated gas that participates in forming the mixed gas as needed.

[0071] In the embodiments of this application, the type of temperature sensing element 90 is not specifically limited. For example, temperature sensing element 90 may be, but is not limited to, a temperature sensor or a thermocouple.

[0072] It is understandable that when the temperature sensor 90 is installed in the machining cavity 10, the temperature sensor 90 can extend into the machining space 11 to directly detect the temperature inside the machining space 11. When the temperature sensor 90 is installed in the exhaust pipe 30, the temperature sensor 90 can detect the temperature of the heated gas in the exhaust pipe 30 and use the detection result as the detection result of the temperature inside the machining space 11; or, the temperature sensor 90 can extend into the machining space 11 to directly detect the temperature inside the machining space 11.

[0073] In some cases, the processor 80 can determine the temperature within the processing space 11 based solely on temperature detection information, and determine the flow rate and temperature of the heated gas in the return line 40 based solely on the first detection information.

[0074] In other cases, the processor 80 can combine the temperature detection information and the first detection information to determine the temperature in the processing space 11, and then determine the flow rate and temperature of the heated gas in the return pipe 40 based on the first detection information. The processor 80 can calculate the temperature value indicated by the first detection information and the temperature value indicated by the temperature detection information by averaging or by converting according to a preset weight, and use the calculation result as the temperature of the processing space 11.

[0075] It is understandable that the principle by which the processor 80 combines temperature detection information and the first detection information to determine the temperature within the processing space 11 is a general principle in the relevant field, and will not be elaborated here.

[0076] In other embodiments, the hot isostatic pressing equipment 100 does not have a temperature detection element 90. In this case, since the heated gas in the processing space 11 can enter the return pipe 40 after being discharged to the exhaust pipe 30, the temperature of the heated gas in the return pipe 40 can be detected by the first detection element 70 to indicate the temperature in the processing space 11.

[0077] When the temperature indicated by the first detection information is high, the processor 80 can determine that the temperature inside the processing space 11 is high. At this time, the opening of the first regulating valve 50 can be increased, thereby increasing the temperature of the mixed gas in the intake pipe 20 and reducing the temperature difference between the mixed gas and the processing space 11. At this time, the processor 80 can output the first regulating information to the first regulating valve 50 to increase the opening of the first regulating valve 50.

[0078] As the mixed gas cools the processing space 11, the temperature of the heated gas exiting the processing space 11 gradually decreases. The processor 80 can monitor the temperature of the heated gas exiting the processing space 11 based on real-time first detection information. As the temperature of the heated gas decreases, the temperature of the mixed gas can also decrease, thereby improving the cooling efficiency of the processing space 11. At this time, the processor 80 can output first adjustment information to the first regulating valve 50, causing the opening degree of the first regulating valve 50 to decrease, thereby reducing the volume of heated gas participating in the formation of the mixed gas, lowering the temperature of the mixed gas, and improving the cooling efficiency of the processing space 11.

[0079] In some embodiments, the number of temperature sensors 90 can be multiple, and the multiple temperature sensors 90 can be spaced apart in the processing cavity 10 and / or the exhaust pipe 30. The processor 80 is communicatively connected to the multiple temperature sensors 90 and receives temperature detection information from the multiple temperature sensors 90.

[0080] In some cases, the processor 80 can select a temperature value from the temperature values ​​indicated by multiple temperature detection information according to a preset rule as the temperature value of the processing space 11; or, it can calculate the temperature value of the processing space 11 by averaging the temperature values ​​indicated by multiple temperature detection information or by converting them according to a preset weight. Then, the processor 80 can determine the required temperature of the mixed gas entering the processing space 11 based on the obtained temperature value and output the corresponding first adjustment information to the first regulating valve 50.

[0081] In other cases, each temperature sensor 90 may correspond to an air intake nozzle 60. Each temperature sensor 90 may be located in the direction the jet end of the air intake nozzle 60 faces, thereby detecting the temperature of the area where the air intake nozzle 60 sprays mixed gas for cooling. Multiple temperature sensors 90 are communicatively connected to the processor 80. The processor 80 can determine the temperature of different areas within the processing space 11 based on the temperature detection information output by each temperature sensor 90. Furthermore, by analyzing the first detection information from multiple first sensors 70 connected to the multiple air intake nozzles 60, the processor 80 can output corresponding first adjustment information to the first regulating valves 50 connected to the multiple air intake nozzles 60, thereby controlling the cooling progress of different areas within the processing space 11. Thus, through the cooperation of multiple temperature sensors 90, multiple air intake nozzles, multiple first sensors 70, and multiple first regulating valves 50, zoned cooling of multiple areas within the processing space 11 can be achieved, thereby improving the uniformity of cooling within the processing space 11.

[0082] In some embodiments, the intake pipe 20 may include a first pipe section 21 and a second pipe section 22 that are interconnected. One end of the first pipe section 21 extends to connect and communicate with an intake device, thereby allowing cooling gas to enter the intake pipe 20; the other end extends to connect and communicate with the end of the return pipe 40 away from the exhaust pipe 30. One end of the second pipe section 22 penetrates into the processing cavity 10 and extends to the intake port 12 to communicate with the processing space 11; the other end extends to connect and communicate with the first pipe section 21, and also connects and communicates with the end of the return pipe 40 away from the exhaust pipe 30, that is, the connection point between the first pipe section 21 and the second pipe section 22 is connected and communicated with the end of the return pipe 40 away from the exhaust pipe 30. The second pipe section 22 can be used to pass through a mixture of cooling gas and heated gas.

[0083] The hot isostatic pressing (HIP) apparatus 100 may further include a second regulating valve 110 and a second detection element 120. Both the second regulating valve 110 and the second detection element 120 are fixedly installed on the first pipe section 21 and are both connected to the first pipe section 21. The first regulating valve 110 and the second detection element 120 can be communicatively connected to the processor 80. The second regulating valve 110 is an adjustable valve. Adjusting the opening of the second regulating valve 110 can regulate the flow rate of the cooling gas entering the second pipe section 22 from the first pipe section 21, that is, it can regulate the volume of cooling gas entering the second pipe section 22 from the first pipe section 21 per unit time.

[0084] The second detection element 120 can detect the temperature and flow rate of the cooling gas flowing through the first pipe section 21, and generate and output second detection information based on the detection results. The processor 80 can receive the second detection information and determine the temperature and flow rate of the cooling gas flowing through the first pipe section 21 based on the second detection information. The processor 80 can determine the target temperature of the mixed gas entering the processing space 11 based on the temperature of the processing space 11 detected by the temperature detection element 90, and then determine the ratio of heated gas to cooled gas required for the mixed gas to reach the target temperature based on the temperature and flow rate of the heated gas detected by the first detection element 70 and the temperature and flow rate of the cooled gas detected by the second detection element 120. Then, based on the required ratio of heated gas to cooled gas, the processor 80 outputs first adjustment information to the first regulating valve 50 and second adjustment information to the second regulating valve 110. After receiving the second adjustment information, the second regulating valve 110 can adjust its own opening.

[0085] It is understood that the type of the second detection element 120 can be the same as or similar to the type of the first detection element 70, the type of the second regulating valve 110 and the first regulating valve 50 can be the same as or similar, and the principle by which the processor 80 regulates the opening of the second regulating valve 110 is the same as or similar to the principle by which it regulates the opening of the first regulating valve 50, which will not be elaborated here.

[0086] It is understood that when the temperature and flow rate of the cooling gas transmitted from the intake device to the intake pipe 20 change, the second detection element 120 can detect the temperature and flow rate of the cooler body in a timely manner and output the corresponding second detection information to the processor 80. This allows the processor 80 to adjust the opening of the second regulating valve 110 according to the changes in the temperature and flow rate of the cooling gas transmitted from the intake device, thereby maintaining the stability of the temperature and flow rate of the mixed gas when the temperature and flow rate of the cooling gas change.

[0087] It is understood that when there are multiple intake pipes 20, each intake pipe 20 may include at least one first pipe section 21 and at least one second pipe section 22. Each first pipe section 21 is provided with a second regulating valve 110 and a second detection element 120. Adjusting the opening of each second regulating valve 110 can adjust the temperature of the mixed gas in its corresponding second pipe section 22, thereby adjusting the cooling operation of the area cooled by the intake nozzle 60 corresponding to the second regulating valve 110.

[0088] It is understood that the second detection element 120 can be located on the side of the second regulating valve 110 away from the air intake device and close to the second pipe 22, so that the second detection element 120 can detect the flow rate of the gas passing through the second regulating valve 110.

[0089] Please refer to the following: Figure 3 In some embodiments, the hot isostatic pressing apparatus 100 may further include a housing 130. The housing 130 may be fixedly connected to the processing chamber 10, and the processing chamber 10 may be located inside the housing 130. The exhaust pipe 30 and the first pipe section 21 may both pass through the housing 130 and extend to the outside of the housing 130, thereby connecting to the air extraction device and the air intake device located on the outside of the housing 130, respectively.

[0090] In some cases, such as Figure 1 As shown, the return pipe 40 and the first pipe section 21 are both located outside the housing 130, and the first regulating valve 50, the first detection element 70, the second regulating valve 110 and the second detection element 120 are all located outside the housing 130.

[0091] In other cases, such as Figure 3 As shown, the return pipe 40, the first regulating valve 50, the first detection element 70, the second regulating valve 110, and the second detection element 120 can all be located inside the housing 130, and the first pipe section 21 is at least partially housed inside the housing 130. In this case, a support structure can be provided at the bottom of the processing cavity 10 to maintain the vertical distance between the bottom of the processing cavity 10 and the bottom of the housing 130.

[0092] According to the embodiments of this application, after the hot isostatic pressing (HIP) equipment 100 completes the processing of the workpiece, the inlet pipe 20 can be connected to cooling gas. The heated gas in the processing space 11 can enter the inlet pipe 20 through the return pipe 40, so that the cooling gas and the heated gas in the inlet pipe 20 can mix to form a mixed gas, which can then enter the processing space 11. Since the temperature of the mixed gas is lower than that of the processing space 11, the mixed gas entering the processing space 11 can cool the processing space 11. The heated gas that was originally discharged from the processing space 11 flows back into the inlet pipe 20 to participate in the cooling of the processing space 11, which can realize the return cooling of the HIP equipment 100, improve the cooling efficiency of the processing space 11, reduce the time spent waiting for the processing space 11 to cool down, and thus increase the number of times the HIP equipment 100 processes the workpiece within a fixed period of time, thereby improving the processing efficiency of the HIP equipment 100.

[0093] Simultaneously, when the temperature inside the processing chamber 10 is high, the opening of the first regulating valve 50 can be increased, and the opening of the second regulating valve 110 can be decreased. This increases the proportion of heated gas in the mixed gas and decreases the proportion of cooling gas, allowing the mixed gas to maintain a temperature lower than that inside the processing space 11 while reducing the temperature difference between the processing space 11 and the mixed gas. This reduces the probability of structural damage to the processing chamber 10 caused by an excessive temperature difference between the mixed gas and the processing space 11. After the mixed gas continuously cools the processing space 11, as the temperature inside the processing space 11 decreases, the opening of the first regulating valve 50 can be decreased, and the opening of the second regulating valve 110 can be increased. This increases the proportion of cooling gas in the mixed gas and decreases the proportion of heated gas, causing the temperature of the mixed gas to drop. This improves the cooling effect of the mixed gas on the processing space 11 and increases the cooling efficiency of the processing space 11. Consequently, the number of times the hot isostatic pressing equipment 100 processes the workpiece can be increased within a fixed time, improving the processing efficiency of the hot isostatic pressing equipment 100.

[0094] Please refer to the following: Figure 4 , Figure 4 This application illustrates a cooling method for a thermal isostatic pressing apparatus 100 provided by this application. Figure 4 The cooling method shown can be implemented in processor 80. The following is combined with... Figure 4 The cooling method provided in this application is described in detail.

[0095] In some embodiments, when the processor 80 regards the temperature of the heated gas in the return pipe 40 indicated by the first detection information as the temperature of the processing space 11, the cooling method may include the following steps S41 to S45.

[0096] Step S41: Determine the temperature of the processing space 11 based on the first detection information.

[0097] It is understandable that the first detection information can indicate the temperature and flow rate of the heated gas in the return pipe 40. Since the heated gas in the processing space 11 can enter the return pipe 40 after being discharged to the exhaust pipe 30, the temperature of the heated gas in the return pipe 40 can be used to indicate the temperature of the processing space 11.

[0098] Step S42: Determine the target temperature of the mixed gas based on the temperature of the processing space 11.

[0099] It is understood that when the processing space 11 is at different temperatures, the mixed gas can have different target temperatures, and each target temperature can be a temperature value obtained through experiments or the experience of the personnel, and each target temperature can be a preset value. After determining the temperature of the processing space 11, the processor 80 can obtain the corresponding target temperature from a plurality of preset target temperatures based on the value of that temperature.

[0100] Step S43: Determine the temperature and flow rate of the heated gas in the return pipe 40 based on the first detection information, and determine the temperature and flow rate of the cooling gas in the intake pipe 20 based on the second detection information.

[0101] The processor 80 determines the temperature and flow rate of the heated gas based on the first detection information, and determines the temperature and flow rate of the cooling gas based on the second detection information, in a manner that can be referenced. Figures 1 to 3 The relevant textual description of the hot isostatic pressing equipment 100 shown will not be repeated here.

[0102] Step S44: Generate first regulation information and second regulation information based on the target temperature of the mixed gas, the temperature and flow rate of the heated gas, and the temperature and flow rate of the cooling gas.

[0103] It is understandable that, in order to achieve the target temperature for the gas mixture, the processor 80 can determine the ratio of heated gas to cooled gas in the mixture, and can calculate the required opening degrees of the first regulating valve 50 and the second regulating valve 110, given that the temperatures of the heated and cooled gases are already determined, in order to achieve the corresponding ratio. Then, the processor 80 can generate corresponding first and second regulation information based on the required opening degrees of the first regulating valve 50 and the second regulating valve 110.

[0104] The principle by which the processor 80 calculates the ratio of heated gas to cooled gas based on the target temperature of the mixed gas, and the principle by which it determines the opening degree of the first regulating valve 50 and the second regulating valve 110 based on the ratio of heated gas to cooled gas, can be a general principle in the relevant field and will not be elaborated here.

[0105] Step S45: Output the first adjustment information to the first adjustment valve 50, and output the second adjustment information to the second adjustment valve 110.

[0106] It is understood that after the first regulating valve 50 and the second regulating valve 110 receive the first regulating information and the second regulating information respectively, they can adjust their own opening degree according to the opening degree indicated by the information, so that the opening degree of the first regulating valve 50 and the second regulating valve 110 can meet the requirements for forming a mixed gas at the target temperature.

[0107] Please refer to the following: Figure 5 In other embodiments, when the processor 80 directly determines the temperature of the processing space 11 through temperature detection information, the cooling method may include... Figure 5 Steps S51 to S55 are shown. Wherein, Figure 5 Steps S52 to S55 shown are Figure 4 Steps S42 to S45 shown are the same or similar, and will not be repeated here. The following is combined with... Figure 5 Detailed introduction Figure 5 Step S51 is shown.

[0108] Step S51: Determine the temperature of the processing space 11 based on the temperature detection information.

[0109] It is understood that the temperature detection element 90 can detect the temperature of the processing space 11, or the temperature of the heated gas entering the exhaust pipe 30 from the processing space 11, thereby directly measuring the temperature of the processing space 11. The processor 80 can determine the temperature of the processing space 11 based on the temperature detection information generated by the temperature detection element 90, and continue to execute steps S52 to S55.

[0110] It is understood that when there are multiple temperature sensors 90, each temperature sensor 90 has a corresponding first sensor 70, a first regulating valve 50, a second sensor 120, and a second regulating valve 110. In this case, when executing step S51, the processor 80 can determine the temperature of a corresponding region in the processing space 11 based on the temperature detection information of a certain temperature sensor 90. It can also execute step S54 based on the first detection information generated by the first sensor 70 corresponding to that region and the second detection information generated by the second sensor 120 corresponding to that region. In step S55, the processor 80 outputs the first and second regulating information to the first regulating valve 50 and the second regulating valve 110 corresponding to that region, respectively. Thus, when executing steps S51 to S55, the processor 80 can simultaneously determine the required temperature of the mixed gas for different regions after determining the temperature of the different regions in the processing space 11. Then, based on the required temperature of the mixed gas for different regions, it can simultaneously output multiple first regulating information to the corresponding first regulating valve 50 and multiple second regulating information to the corresponding second regulating valve 110, thereby achieving synchronous cooling of various regions within the processing space 11.

[0111] Please refer to the following: Figure 6 In other embodiments, when the processor 80 determines the temperature of the processing space 11 by combining the temperature detection information and the first detection information, the cooling method may include... Figure 6 Steps S61 to S65 are shown. Wherein, Figure 6 Steps S62 to S65 shown are Figure 4 Steps S42 to S45 shown are the same or similar, and will not be repeated here. The following is combined with... Figure 6 Detailed introduction Figure 6 Step S61 is shown.

[0112] Step S61: Combine the temperature detection information and the first detection information to determine the temperature of the processing space 11.

[0113] It is understood that the processor 80 can determine the temperature of the processing space 11 based on the detection information generated by the temperature detection element 90 and the first detection element 70, and continue to execute steps S62 to S65.

[0114] In some cases, the processor 80 can select a temperature from the temperature indicated by the temperature detection information and the temperature indicated by the first detection information as the temperature of the hot isostatic pressing device 100 according to preset rules.

[0115] In other cases, the processor 80 can calculate a result by averaging the temperature indicated by the first detection information and the temperature indicated by the temperature detection information or by converting it according to a preset weight, and use the calculation result as the temperature value of the processing space 11.

[0116] It is understandable that the beneficial effects of the cooling method provided in this application are related to... Figures 1 to 3 The beneficial effects of the hot isostatic pressing apparatus 100 shown are the same or similar, and will not be described again here.

[0117] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments described above should be considered exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application.

Claims

1. A reflux-cooled hot isostatic pressing device, characterized in that, include: The machining cavity has a machining space inside; An air intake pipe is connected to the processing cavity and communicates with the processing space; An exhaust pipe is connected to the processing cavity and communicates with the processing space; The return pipe is connected to and communicates with the exhaust pipe and the intake pipe; A first regulating valve is installed in the return pipeline and is connected to the return pipeline; The intake pipe is used to receive cooling gas, and the exhaust pipe is used to receive heated gas discharged from the processing space. The temperature of the heated gas is higher than that of the cooling gas. The exhaust pipe is used to allow at least a portion of the heated gas to flow into the intake pipe and mix with the cooling gas to form a mixed gas that flows into the processing space. The first regulating valve is used to regulate the flow rate of the heated gas flowing into the intake pipe from the return pipe.

2. The hot isostatic pressing equipment as described in claim 1, characterized in that, Also includes: A first detection element is connected to the return pipeline. The first detection element is used to detect the temperature and / or flow rate of the heated gas in the return pipeline and output first detection information. The processor is communicatively connected to the first regulating valve and the first detection element. The processor is used to receive the first detection information and output the first regulation information to the first regulating valve to adjust the opening degree of the first regulating valve.

3. The hot isostatic pressing equipment as described in claim 1, characterized in that, Also includes: A temperature detection element is disposed in the processing cavity and / or the exhaust pipe. The temperature detection element is used to detect the temperature of the processing cavity and output temperature detection information. The processor is communicatively connected to the first regulating valve and the temperature sensing element. The processor is used to receive the temperature sensing information and output first regulating information to the first regulating valve to adjust the opening degree of the first regulating valve.

4. The hot isostatic pressing equipment as described in claim 1, characterized in that, Also includes: An air intake nozzle is disposed in the machining cavity and connected to the air intake pipe. The air intake nozzle extends at least partially into the machining space. The portion of the air intake nozzle extending into the machining space is inclined. The air intake nozzle is used to inject the mixed gas into the machining space.

5. The hot isostatic pressing equipment as described in claim 4, characterized in that, The number of air intake nozzles is multiple, and the multiple air intake nozzles are spaced apart along the direction surrounding the processing space and spaced apart along the height direction of the hot isostatic pressing equipment, so that the mixed gas entering the processing space through the multiple air intake nozzles flows in a spiral direction surrounding the processing cavity.

6. The hot isostatic pressing apparatus as described in claim 1, characterized in that, The intake pipe includes a first pipe section and a second pipe section. The connection between the first pipe section and the second pipe section is connected to the end of the return pipe that is away from the exhaust pipe. The second pipe section is connected to the processing space. The first pipe section is used to connect to the cooling gas. The hot isostatic pressing equipment also includes: A second regulating valve is disposed in and connected to the first pipe section. The second regulating valve is used to regulate the flow rate of the cooling gas flowing from the first pipe section into the second pipe section, so as to regulate the flow rate and temperature of the mixed gas in the second pipe section.

7. The hot isostatic pressing equipment as described in claim 6, characterized in that, Also includes: The second detection element is connected to the first pipe section. The second detection element is used to detect the temperature and / or flow rate of the cooling gas in the first pipe section and output second detection information. The processor is communicatively connected to the second regulating valve and the second detection element. The processor is used to receive the second detection information and output the second regulation information to the second regulating valve to adjust the opening degree of the second regulating valve.

8. The hot isostatic pressing apparatus as described in claim 6, characterized in that, Also includes: A temperature detection element is disposed in the processing cavity and / or the exhaust pipe. The temperature detection element is used to detect the temperature of the heated gas in the processing cavity and output temperature detection information. The processor is communicatively connected to the second regulating valve and the temperature detection element. The processor is used to receive the temperature detection information and output second regulation information to the second regulating valve to adjust the opening degree of the second regulating valve.

9. The hot isostatic pressing equipment as described in claim 1, characterized in that, An air inlet and an exhaust outlet are provided on the processing cavity. The air inlet is connected to the processing space and the air inlet pipe, and the exhaust outlet is connected to the processing space and the exhaust pipe. In the height direction of the hot isostatic pressing equipment, the height of the air inlet is greater than the height of the exhaust outlet.

10. The hot isostatic pressing apparatus as described in claim 1, characterized in that, Also includes: The outer casing has the processing cavity disposed inside it, and the air intake pipe and the exhaust pipe pass through the inner side of the outer casing.

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