Wafer degumming machine compatible with multiple sizes

Abstract

The application provides a wafer degumming machine compatible with multiple sizes, which comprises a support and a soaking tank arranged in the support; a gantry mechanism is arranged at the upper end of the soaking tank, the lower end of the gantry mechanism is connected with a soaking carrier, and the soaking carrier is located in the soaking tank; a degumming cavity is arranged in the support, a cleaning cavity is arranged above the degumming cavity, a wafer transfer robot is arranged in the middle part of the degumming cavity and the soaking tank, and the wafer transfer robot is used for transferring a square piece carrier loaded with a wafer. The cleaning cavity is arranged at the middle layer position of the support, the degumming cavity is arranged below the cleaning cavity, the wafer transfer robot is used as a unified transfer mechanism between process stations, the transmission path of a workpiece between a degumming process and a cleaning process is shortened, the exposure time of the workpiece in a low-cleanliness area is reduced, the process efficiency is improved, the pollution of a degumming chemical solution residue to the cleaning cavity is avoided, and the product yield is ensured.

Description

Technical Field

[0001] This invention relates to the field of wafer stripping, and more particularly to a wafer stripping machine compatible with multiple sizes. Background Technology

[0002] Wafer stripper is a key piece of equipment used in semiconductor manufacturing to remove photoresist and related process residues from the surface of wafers or workpieces. It is widely used in the cleaning process after etching, ion implantation, thin film deposition and other processes.

[0003] In existing technologies, wafer stripping machines often employ a layout where the stripping and cleaning processes are separated, either front-to-back or side-to-side, or a top-to-bottom structure with electrical control at the top, a mixing process in the middle, and liquid supply at the bottom. With this layout, after stripping, the workpiece needs to be transported horizontally over long distances or through layers to reach the cleaning process. This long transport path and extended exposure to areas with lower cleanliness not only reduce process efficiency but also easily carry residual stripping solution into the cleaning process, causing contamination of the cleaning chamber and affecting product yield. Furthermore, the process chambers and support mechanisms of existing equipment are mostly designed with fixed specifications, typically only suitable for single or a few wafer sizes. They lack universally compatible structures for 3-6 inch wafers and small square wafers. Processing different sizes of workpieces requires changing specialized tooling fixtures or even adjusting the equipment chamber, resulting in long production preparation times and high costs, failing to meet the flexible production needs of multi-variety, small-batch production. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the defects of the existing technology. The present invention proposes a wafer stripper compatible with multiple sizes.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a wafer stripper compatible with multiple sizes, comprising: a support and an immersion tank disposed inside the support; It also includes a gantry mechanism located at the top of the soaking tank, with a soaking carrier connected to the bottom of the gantry mechanism. The soaking carrier is located inside the soaking tank. The support has a desmearing chamber inside, and a cleaning chamber is located above the desmearing chamber. A wafer handling robot is located in the middle of the desmearing chamber and the soaking tank. The wafer handling robot is used to transport the wafer carrier containing the wafers. The desmearing chamber contains a carrier. The wafer handling robot sequentially moves the wafer carrier containing the wafers to the soaking carrier, the carrier, and the cleaning chamber, and sequentially soaks, desmears, and cleans the wafers inside the wafer carrier.

[0006] Preferably, a wafer loading platform is provided on one side of the support, a dual-station wafer carrier platform is provided on the upper surface of the wafer loading platform, and wafer alignment platforms are provided on opposite sides of the dual-station wafer carrier platform. The wafer alignment platforms are used to clamp and align the wafer cassettes placed on the surface of the dual-station wafer carrier platform.

[0007] Preferably, the carrier has a disc-shaped structure, and the upper surface of the carrier is provided with an upwardly expanding multi-layered stepped structure. The different step sizes of the multi-layered stepped structure are respectively matched with the outer dimensions of the square carrier corresponding to the wafers of different sizes.

[0008] Preferably, the square carrier has a disc-shaped structure, the upper surface of the square carrier is provided with a plurality of square receiving slots arranged in parallel, and the outer periphery of the square carrier is provided with a positioning edge that cooperates with the multi-layer outward-expanding stepped structure of the carrier.

[0009] Preferably, the wafer handling robot is equipped with a gripper at its end, and an electrostatic eliminator is provided near the gripper, with the ion outlet of the electrostatic eliminator facing the surface of the gripper.

[0010] Preferably, the support is provided with a chemical supply area, and the interior of the chemical supply area is provided with multiple chemical storage tanks for storing degumming agent, IPA pure water, neutralizing solution, rinsing solution and soaking solution respectively. The chemical supply area is connected to the cleaning chamber, the degumming chamber and the soaking tank respectively.

[0011] Preferably, the support is provided with an electrical control area, and the electrical control area is provided with a programmable logic controller. The control signal output terminal of the programmable logic controller is electrically connected to the cleaning chamber, the de-adhesive chamber, the wafer handling robot and the gantry mechanism respectively.

[0012] Preferably, the cleaning chamber is provided with a support station for the square plate carrier, and the bottom of the cleaning chamber is connected to a waste liquid discharge pipeline.

[0013] Preferably, a lifting drive mechanism is connected to one side of the crossbeam of the gantry mechanism, and the output end of the lifting drive mechanism is connected to a lifting screw located below the crossbeam of the gantry mechanism. The soaking carrier is connected to the lower end of the lifting screw.

[0014] Preferably, the immersion carrier is a support basket structure with a hollowed-out bottom surface.

[0015] Compared with the prior art, the beneficial effects of the present invention include: by setting the cleaning chamber in the middle layer of the support and the desizing chamber below the cleaning chamber, and using a wafer handling robot as a unified transfer mechanism between each process station, the transfer path of the workpiece between the desizing and cleaning processes is shortened, the exposure time of the workpiece in areas with low cleanliness is reduced, process efficiency is improved, and contamination of the cleaning chamber by residual desizing solution is avoided, ensuring product yield. At the same time, by setting a carrier with a multi-layer outward stepped structure inside the desizing chamber, and setting a positioning edge on the outer periphery of the wafer carrier that cooperates with the multi-layer outward stepped structure of the carrier, universal compatibility and support for different specifications of wafer carriers corresponding to 3-6 inch wafers, 10×10 wafers and 15×15mm wafers are achieved, avoiding frequent changes of tooling fixtures or adjustments of equipment cavities when changing workpiece specifications, shortening production preparation time, reducing usage costs, and meeting the flexible production needs of multiple varieties and small batches. Attached Figure Description

[0016] The disclosure of this invention is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this invention. In the drawings, the same reference numerals are used to refer to the same parts. Wherein: Figure 1 The schematic diagram shows a three-dimensional structural diagram of a wafer stripper according to an embodiment of the present invention.

[0017] Figure 2 The diagram schematically shows the top structure of a wafer stripper according to one embodiment of the present invention.

[0018] Figure 3 The schematic diagram shows a side view of a wafer stripper according to an embodiment of the present invention.

[0019] Figure 4 The schematic diagram shows a side view of a wafer stripper according to an embodiment of the present invention.

[0020] Figure 5 The schematic diagram shows a vehicle structure according to one embodiment of the present invention.

[0021] Figure 6 The schematic diagram shows a structural schematic of a gantry and immersion vehicle according to an embodiment of the present invention.

[0022] Figure 7 The schematic diagram shows a structural schematic of a square carrier according to an embodiment of the present invention.

[0023] The diagram is labeled as follows: 1. Electrical control area; 2. Cleaning chamber; 3. Resin removal chamber; 4. Wafer loading platform; 5. Immersion tank; 6. Chemical supply area; 7. Wafer handling robot; 8. Dual-station wafer carrier platform; 9. Wafer alignment platform; 10. Carrier; 11. Gantry mechanism; 12. Immersion carrier; 13. Wafer carrier; 14. Support. Detailed Implementation

[0024] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0026] See Figures 1-7 The bracket 14 is the supporting frame of the whole machine. The bracket 14 is a rectangular frame structure assembled by welding square steel. The interior of the bracket 14 is divided into three independent functional cavities: top layer, middle layer and bottom layer, by welding and bolt fixing.

[0027] The electrical control area 1 is fixed to the top layer of the bracket 14 by bolts. The electrical control area 1 contains a main power switch, a programmable logic controller, a frequency converter, a relay group and a terminal block (not shown). The control signal output terminal of the programmable logic controller in the electrical control area 1 is electrically connected to the various actuators and sensors inside the cleaning chamber 2, the degumming chamber 3, the wafer handling robot 7, the wafer alignment platform 9, the gantry mechanism 11 and the chemical supply area 6 through control cables. The electrical control area 1 provides power input and control signal output to the various actuators, sensors and control circuits of the whole machine.

[0028] The cleaning chamber 2 is fixedly connected to the middle layer of the support 14 via a flange. The cleaning chamber 2 is a closed chamber with an openable and closable door. Inside the cleaning chamber 2, there is a bearing position for the support plate carrier 13, a liquid spraying pipeline and a nitrogen drying pipeline. The liquid spraying pipeline of the cleaning chamber 2 is connected to the chemical supply area 6 through a pipe, and the nitrogen drying pipeline of the cleaning chamber 2 is connected to an external nitrogen source through a pipe. The bottom of the cleaning chamber 2 is connected to a waste liquid discharge pipeline.

[0029] The adhesive removal chamber 3 is fixedly connected to the lower part of the cleaning chamber 2 via a flange. The adhesive removal chamber 3 is a closed chamber with an openable and closable door. The door of the adhesive removal chamber 3 is connected to the chamber body in an openable and closable manner. A carrier 10 is rotatably installed inside the adhesive removal chamber 3. The carrier 10 has a disc-shaped structure. The upper surface of the carrier 10 has an upwardly expanding multi-layered stepped structure. The different step sizes of the multi-layered stepped structure correspond to the outer dimensions of the square carrier 13 corresponding to 3-6 inch wafers, 10×10 wafers, and 15×15mm wafers, respectively. The cube carrier 13 is placed in the carrier 10 and falls into the corresponding bearing position of the step according to its own shape and size. The bottom of the carrier 10 is connected to the output shaft of the rotary drive motor located outside and below the glue removal chamber 3 through a coupling. The rotary drive motor drives the carrier 10 to drive the cube carrier 13 to rotate inside the glue removal chamber 3. The top of the glue removal chamber 3 is connected to the liquid spraying pipeline, which is connected to the chemical agent supply area 6 through a pipe. The bottom of the glue removal chamber 3 is connected to the waste liquid discharge pipeline.

[0030] The wafer loading platform 4 is fixedly connected to one side of the middle layer of the bracket 14 by bolts. The upper surface of the wafer loading platform 4 is fixed with a dual-station wafer carrier platform 8 by bolts. The upper surface of the dual-station wafer carrier platform 8 is provided with two parallel carrier stations, each of which is used to place a wafer cassette containing a wafer carrier 13. The wafer alignment platform 9 is fixedly connected to the opposite sides of the dual-station wafer carrier platform 8 by bolts. The wafer alignment platform 9 is provided with a clamping mechanism driven by an alignment drive cylinder. The clamping end of the clamping mechanism faces the wafer cassette on the surface of the dual-station wafer carrier platform 8. The wafer alignment platform 9 is used to clamp and center the wafer cassette placed on the surface of the dual-station wafer carrier platform 8, so that the wafer cassette is kept in the center position of the dual-station wafer carrier platform 8.

[0031] The immersion tank 5 is bolted to the bottom side of the support 14. The immersion tank 5 has an open top and contains an immersion solution for immersing photoresist on the wafer surface. The immersion solution inlet of the immersion tank 5 is connected to the chemical supply area 6 via a pipe. An immersion solution recovery pipeline is connected to the bottom of the immersion tank 5. The gantry mechanism 11 is bolted to the upper end of the immersion tank 5. The gantry mechanism 11 has a gate-shaped support structure. A lifting drive mechanism is connected to one side of the crossbeam of the gantry mechanism 11 via a sliding pair. The output of the lifting drive mechanism... The end is connected to the lifting screw located below the crossbeam of the gantry mechanism 11 via a coupling; the soaking carrier 12 is fixedly connected to the lower end of the lifting screw by bolts. The soaking carrier 12 is located directly above the opening of the soaking tank 5. The soaking carrier 12 is a bearing basket structure with a hollow bottom surface. The soaking carrier 12 is used to carry the square carrier 13 and rises or falls relative to the soaking tank 5 under the drive of the lifting screw. When the soaking carrier 12 falls into the soaking tank 5, the square carrier 13 inside the soaking carrier 12 comes into contact with the soaking liquid in the soaking tank 5.

[0032] The chemical supply area 6 is fixed to the bottom of the bracket 14 by bolts. The chemical supply area 6 is equipped with multiple chemical storage tanks, metering pumps, solenoid valve groups, flow meters and pipelines. The multiple chemical storage tanks are used to store degumming solution, IPA pure water, neutralizing solution, rinsing solution and soaking solution respectively. The chemical supply area 6 is connected to the chemical spraying pipeline of the cleaning chamber 2, the chemical spraying pipeline of the degumming chamber 3 and the soaking solution inlet of the soaking tank 5 through corresponding chemical pipelines. The chemical supply area 6 is used to deliver the corresponding chemical media to the cleaning chamber 2, the degumming chamber 3 and the soaking tank 5 according to the process sequence.

[0033] The wafer handling robot 7 is bolted to the middle layer of the support 14. The wafer handling robot 7 is a multi-joint robot structure. The end of the wafer handling robot 7 is fixedly connected to a gripper by a flange. The gripper is used to grip the wafer carrier 13. The movement range of the wafer handling robot 7 covers four working positions on the wafer loading platform 4: the dual-station wafer carrier platform 8, the soaking carrier 12, the de-adhesive chamber 3, and the cleaning chamber 2. An electrostatic eliminator is bolted near the gripper of the wafer handling robot 7. The ion air outlet of the electrostatic eliminator faces the surface of the gripper. The electrostatic eliminator is used to eliminate static electricity on the surface of the gripper before the wafer handling robot 7 grips the wafer carrier 13.

[0034] The wafer carrier 13 has a disc-shaped structure. The upper surface of the wafer carrier 13 is provided with four square receiving slots arranged in parallel. Each square receiving slot is used to accommodate a 3-6 inch wafer, a 10×10 wafer, or a 15×15 mm wafer. The outer periphery of the wafer carrier 13 is provided with a positioning edge that cooperates with the multi-layer outward-expanding stepped structure of the carrier 10 inside the de-adhesive cavity 3. After the wafer carrier 13 is placed into the carrier 10, the positioning edge falls into the corresponding step of the carrier 10 to complete the positioning.

[0035] After the machine is powered on, the programmable logic controller in the electrical control area 1 enters the process waiting state, and the chemical supply area 6 transports the soaking solution to the soaking tank 5 through the pipeline and maintains the soaking solution at the concentration and temperature set by the process, in preparation for the subsequent soaking steps.

[0036] The operator places the wafer cassette, which contains 3-6 inch wafers, 10×10 wafers, or 15×15mm wafers, onto the carrier station of the dual-station wafer carrier platform 8. The clamping mechanism of the wafer alignment platform 9, driven by the alignment drive cylinder, clamps and aligns the wafer cassette on the surface of the dual-station wafer carrier platform 8, keeping the wafer cassette in the center position of the dual-station wafer carrier platform 8.

[0037] After wafer alignment is completed, the wafer handling robot 7 moves to the dual-station wafer carrier platform 8 on the wafer loading platform 4. Before the gripper of the wafer handling robot 7 approaches the wafer carrier 13, the electrostatic eliminator is activated and neutralizes the static electricity on the surface of the gripper with ion wind to eliminate the static electricity on the surface of the gripper and avoid damage to the wafer caused by static electricity during the gripping process. Then the wafer handling robot 7 grips the wafer carrier 13 and transfers the wafer carrier 13 from the wafer box to the immersion carrier 12.

[0038] The lifting drive mechanism of the gantry mechanism 11 is activated and drives the immersion carrier 12 to move downward through the lifting screw. The immersion carrier 12, together with the square carrier 13 inside it, descends into the immersion tank 5. The photoresist on the wafer surface inside the square carrier 13 comes into full contact with the immersion liquid in the immersion tank 5 and undergoes a swelling reaction. After the reaction time set by the process is reached, the lifting drive mechanism reverses and drives the immersion carrier 12 to rise and reset through the lifting screw. The square carrier 13 inside the immersion carrier 12 rises out of the immersion liquid, and the residual liquid adhering to the surface of the square carrier 13 flows back into the immersion tank 5 through the hollow bottom surface of the immersion carrier 12.

[0039] The wafer handling robot 7 moves again, removing the wafer carrier 13 from the soaking carrier 12 and sending it into the desmearing chamber 3. The wafer carrier 13 falls into the multi-layered outward-expanding stepped structure of the carrier 10 inside the desmearing chamber 3 according to its own size, thus adapting to the loading requirements of wafer carriers of different sizes. After the wafer carrier 13 is in place, the chamber door of the desmearing chamber 3 is closed, the rotary drive motor is started and drives the carrier 10 to rotate the wafer carrier 13 inside the desmearing chamber 3. At the same time, the chemical supply area 6 sends the desmearing solution into the desmearing chamber 3 through the chemical spray pipe. The desmearing solution is sprayed onto the wafer surface on the wafer carrier 13 through the nozzle of the spray pipe. With the carrier 10 driving the wafer to rotate continuously, combined with the dual action of the desmearing solution spray, the residual photoresist on the wafer surface is removed. After the desmearing is completed, the waste liquid inside the desmearing chamber 3 is discharged through the bottom waste liquid discharge pipe, and the chamber door of the desmearing chamber 3 is opened.

[0040] The wafer handling robot 7 operates again, removing the wafer carrier 13 from the carrier 10 and transferring it to the carrying station in the cleaning chamber 2. The chemical supply area 6 sequentially delivers IPA pure water, neutralizing solution, and rinsing solution to the chemical spraying pipeline of the cleaning chamber 2 through corresponding pipes. The chemical spraying pipeline of the cleaning chamber 2 sequentially rinses, neutralizes, and rinses the wafer on the wafer carrier 13 with IPA pure water, cleaning away the residual adhesive remover and reaction byproducts on the wafer surface. After cleaning, the chemical supply area 6 stops delivering the chemical solution, and the nitrogen drying pipeline of the cleaning chamber 2 sprays dry nitrogen gas onto the wafer on the wafer carrier 13 to dry the liquid adhering to the wafer carrier 13 and the wafer surface. After drying, the wafer handling robot 7 removes the wafer carrier 13 from the cleaning chamber 2 and sends it back to the wafer cassette of the dual-station wafer carrying platform 8, thus completing the entire process of removing adhesive from a wafer on the wafer carrier 13.

[0041] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0042] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A wafer stripper compatible with multiple sizes, characterized in that, include: The support (14) and the soaking tank (5) disposed inside the support (14); It also includes a gantry mechanism (11) set at the upper end of the soaking tank (5), the lower end of the gantry mechanism (11) is connected to the soaking carrier (12), the soaking carrier (12) is located in the soaking tank (5); the bracket (14) is provided with a desizing chamber (3), the desizing chamber (3) is provided with a cleaning chamber (2) above it, the desizing chamber (3) and the middle of the soaking tank (5) are provided with a wafer handling robot (7), the wafer handling robot (7) is used to handle the wafer-containing square carrier (13), the desizing chamber (3) is provided with a carrier (10), the wafer handling robot (7) sequentially transfers the wafer-containing square carrier (13) to the soaking carrier (12), the carrier (10) and the cleaning chamber (2), and sequentially soaks, desizing and cleaning the wafer inside the square carrier (13).

2. The wafer stripper compatible with multiple sizes according to claim 1, characterized in that, The support (14) has a wafer loading platform (4) on one side, a dual-station wafer carrier platform (8) on the upper surface of the wafer loading platform (4), and wafer alignment platforms (9) on opposite sides of the dual-station wafer carrier platform (8). The wafer alignment platforms (9) are used to clamp and align the wafer cassette placed on the surface of the dual-station wafer carrier platform (8).

3. The wafer stripper compatible with multiple sizes according to claim 1, characterized in that, The carrier (10) has a disc-shaped structure. The upper surface of the carrier (10) is provided with an upwardly expanding multi-layer stepped structure. The different step sizes of the multi-layer stepped structure are matched with the outer dimensions of the square carrier (13) corresponding to the wafers of different sizes.

4. The wafer stripper compatible with multiple sizes according to claim 3, characterized in that, The square carrier (13) has a disc-shaped structure. The upper surface of the square carrier (13) is provided with multiple square receiving slots arranged in parallel. The outer periphery of the square carrier (13) is provided with a positioning edge that cooperates with the multi-layer outward-expanding stepped structure of the carrier (10).

5. A wafer stripper compatible with multiple sizes according to claim 1, characterized in that, The wafer handling robot (7) is connected to a gripper at its end. An electrostatic eliminator is provided near the gripper, and the ion air outlet of the electrostatic eliminator faces the surface of the gripper.

6. A wafer stripper compatible with multiple sizes according to claim 1, characterized in that, The support (14) is provided with a chemical supply area (6). The interior of the chemical supply area (6) is provided with multiple chemical storage tanks for storing degumming solution, IPA pure water, neutralizing solution, rinsing solution and soaking solution respectively. The chemical supply area (6) is connected to the cleaning chamber (2), the degumming chamber (3) and the soaking tank (5) respectively.

7. A wafer stripper compatible with multiple sizes according to claim 1, characterized in that, The bracket (14) is provided with an electrical control area (1), and the electrical control area (1) is provided with a programmable logic controller. The control signal output terminal of the programmable logic controller is electrically connected to the cleaning chamber (2), the de-adhesive chamber (3), the wafer handling robot (7) and the gantry mechanism (11).

8. A wafer stripper compatible with multiple sizes according to claim 1, characterized in that, The cleaning chamber (2) is equipped with a support station for the square carrier (13), and the bottom of the cleaning chamber (2) is connected to a waste liquid discharge pipeline.

9. A wafer stripper compatible with multiple sizes according to claim 1, characterized in that, A lifting drive mechanism is connected to one side of the crossbeam of the gantry mechanism (11). The output end of the lifting drive mechanism is connected to the lifting screw located below the crossbeam of the gantry mechanism (11). The soaking carrier (12) is connected to the lower end of the lifting screw.

10. A wafer stripper compatible with multiple sizes according to claim 1, characterized in that, The immersion carrier (12) is a support basket structure with a hollow bottom surface.

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