UV unmasking lamp SRD rotor and matched file lever

Abstract

The application provides a UV film stripping lamp SRD rotor and a matched stop lever, which comprises an SRD rotor body, a stop lever, a limiting sleeve, a locking butterfly nut, a wafer bearing plug, a main shaft butt joint seat is arranged at the bottom end of the SRD rotor body, the wafer bearing plug is assembled on the two sides of the upper end of the SRD rotor body, the stop lever is a single integrated middle stop lever and is vertically fixed at the center position of the upper end of the SRD rotor body, reverse thread teeth are arranged on the outer wall of the middle stop lever, and the limiting sleeve is threadedly sleeved outside the reverse thread teeth. The UV film stripping lamp SRD rotor and the matched stop lever avoid wafer functional surface contact damage, improve wafer finished product yield, realize middle single lever limiting, realize balanced and stable stress, inhibit wafer rotation shaking, realize double locking limiting, prevent the sleeve from rotating and loosening, are suitable for long-term mass production operation, are convenient to disassemble, assemble and debug, are suitable for multi-specification wafer processing, are controllable in part processing precision, are suitable for semiconductor dust-free processing standards, have simple structure, low modification cost and compatibility with existing equipment.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer post-processing technology, and in particular to a UV film peeling lamp SRD rotor and matching stop bar. Background Technology

[0002] In key processing steps of semiconductor wafer manufacturing, such as photolithography, bonding, and temporary bonding UV adhesive curing, after the wafer has undergone UV curing and the film removal process, its surface often contains contaminants such as pure water, residual colloids, and fine dust. To ensure the smooth progress of subsequent processes and the reliability of wafer quality, the wafer must be immediately transferred to the SRD centrifugal drying station. The powerful centrifugal force generated by high-speed rotation thoroughly and efficiently cleans these surface residues. This is crucial for ensuring the cleanliness of the wafer surface and the integrity of the process, and is an indispensable core link in the semiconductor wafer manufacturing process. Therefore, a UV film removal lamp SRD rotor and matching stop are particularly needed.

[0003] However, the existing SRD rotor uses a double-sided symmetrical crossbar baffle structure. The baffles are scattered and the force is uneven. During the high-speed rotation of the wafer, the radial sway is large. The wafer edge is continuously squeezed and adheres to the inner wall of the cassette. The main surface of the wafer polishing and the photolithographic pattern surface are very easy to be scratched, have adhesive residue, and particle contamination. Ultra-thin wafers are also prone to edge chipping and breakage. The conventional rotor cassette installation station is a horizontal and straight structure. The wafer is placed flat inside the cassette slot. The entire wafer is in contact with the cassette support surface. The UV film removal residue and cleaning pure water remain on the contact surface between the wafer and the cassette and cannot be centrifuged away. This causes secondary adhesion to the wafer photolithographic surface and increases the frequency of wafer rework and cleaning. Summary of the Invention

[0004] The purpose of this invention is to provide a UV film removal lamp SRD rotor and matching stop bar to solve the problems mentioned in the background art. The existing SRD rotor adopts a double-sided symmetrical crossbar stop bar structure, which results in dispersed stop bar placement, uneven force distribution, large radial sway during high-speed wafer rotation, continuous squeezing and adhesion of the wafer edge to the inner wall of the cassette, and easy generation of scratches, adhesive residue, and particulate contamination on the wafer polishing surface and photolithography surface. Ultra-thin wafers are also prone to edge chipping and breakage. The conventional rotor cassette installation station is a horizontal and straight structure, with the wafer placed flat inside the cassette slot. The entire wafer is in contact with the cassette support surface, and residual adhesive residue from UV film removal and cleaning pure water remain on the contact surface between the wafer and the cassette, which cannot be centrifuged away and re-adhere to the wafer photolithography surface, increasing the frequency of wafer rework and cleaning.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a UV film-removing lamp SRD rotor and matching stop bar, comprising an SRD rotor body, a stop bar, a limiting sleeve, a locking wing nut, and a wafer bearing plug. The bottom end of the SRD rotor body is provided with a main shaft docking seat. The wafer bearing plug is assembled on both sides of the upper end of the SRD rotor body. The stop bar is a single, integrated, centrally located stop bar and is vertically fixed to the center position of the upper end of the SRD rotor body. The outer wall of the centrally located stop bar has reverse threads. The positioning sleeve is threaded onto the outside of the reverse thread. The locking wing nut is threaded onto the upper part of the central stop bar and presses against the upper end face of the positioning sleeve. The upper end of the SRD rotor body has two slots for inserting inserts. The bottom of the slots on both sides is inclined at an angle of 8°-15° to the horizontal plane. The wafer carrier insert is fixed inside the slot. The wafer reference edge is placed inside the wafer carrier insert with the wafer reference edge facing upward. The flat edge of the outer wall of the positioning sleeve presses against the outer reference edge of the positioning wafer. The positioning sleeve is a flat-edge sleeve structure.

[0006] Preferably, the center point of the force of the central baffle coincides with the center of rotation of the SRD rotor body, and the single central baffle is symmetrically arranged with wafer bearing plugs on both sides, so that there is no eccentric lateral force when the rotor rotates at high speed.

[0007] Preferably, the reverse thread tooth rotation direction is the same as the high-speed rotation direction of the SRD rotor body. When the rotor is centrifugally rotating, the reverse thread tooth and the limiting sleeve automatically lock together, limiting the rotational deviation of the limiting sleeve.

[0008] Preferably, the optimal tilt angle of the insert slot is 11°. The wafer-carrying insert tilts synchronously with the slot, and the main surface of the wafer photolithography is completely suspended from the bottom of the insert slot, with only the wafer edge reference edge bearing pressure contact at a single point.

[0009] Preferably, the bottom of the locking wing nut is integrally provided with an anti-slip pressure pad. The anti-slip pressure pad fits against the upper end face of the limiting sleeve to increase the locking friction and realize the axial double locking and limiting of the sleeve.

[0010] Preferably, the clearance between the inner diameter of the limiting sleeve and the outer diameter of the central stop bar is 0.01mm-0.03mm, and the outer flat edge of the limiting sleeve is a matte anti-collision contact surface that flexibly fits the edge of the wafer for limiting.

[0011] Preferably, the SRD rotor body, the central stop bar, and the limiting sleeve are all made of antistatic PEEK semiconductor engineering plastic, and the overall antistatic resistance value is controlled within 10. 6 Ω-10 9 Ω, the symmetry error of the tilt angle of the insert grooves on both sides is ≤ ±0.3°, and the verticality error of the central stop rod assembly is ≤ 0.02mm.

[0012] Preferably, the locking wing nut is a tool-free, hand-operated structure that can be directly screwed and adjusted to accommodate fine-tuning of the travel of the limiting sleeve for wafers with different outer diameters.

[0013] Preferably, the SRD rotor body is adapted to a speed range of 2000r / min-4500r / min, and the inclined wafer support plugs allow UV film removal residue and cleaning pure water to flow out autonomously along the inclined surface.

[0014] Compared with the prior art, the beneficial effects of the present invention are: This UV film peeling lamp's SRD rotor and matching stop bar avoid contact damage to the wafer's functional surfaces, improving wafer yield. The rotor's side plugs are installed with an 8°-15° tilt structure, with the wafer's reference edge facing upwards inside the plugs. The wafer's photolithography surface and UV film processing surface are completely prevented from contacting the plug's inner wall, eliminating friction and contact between the wafer and the plugs during high-speed rotation. This avoids scratches and dust / residue buildup on the wafer surface, reducing wafer defects and scrap. It is suitable for cleanroom precision semiconductor manufacturing processes. The centrally located single-bar limiter provides balanced and stable force, suppressing wafer rotation and wobbling. It abandons the traditional dual-sided split stop bar structure, adopting a single centrally located stop bar structure. The overall clamping force is concentrated at the rotor's center, resulting in uniform force without lateral force. Combined with the flat-edge sleeve clamping the wafer edge, it provides all-around wafer restraint. The wafer exhibits no radial or axial wobbling during high-speed centrifugal drying with the rotor, resulting in stronger clamping stability. This UV film peeling lamp's SRD rotor and matching stop bar feature a double-locking limit to prevent the sleeve from rotating and loosening. Suitable for long-term mass production operations, the stop bar has a reverse thread structure. The sleeve thread is threaded onto the outside of the stop bar, and a wing nut is used for tightening and locking, forming a double-limiting structure of thread self-locking and nut tightening. Even if the sleeve is subjected to slight centrifugal force, it will not rotate or shift on its own, maintaining a long-term limited and locked state. Frequent shutdowns for adjustment and locking are unnecessary, reducing equipment maintenance frequency. Disassembly and adjustment are convenient, and it is suitable for processing various wafer sizes. The wing nut can be tightened by hand without special tools, allowing for quick adjustment of sleeve height and rapid opening and closing for wafer loading and unloading. Feeding, sampling, and maintenance operations are simple. With an adjustable 8°-15° stopper tilt angle, it can be used for limiting wafers of different thicknesses and sizes, offering wider tooling adaptability. This UV film peeling lamp's SRD rotor and matching stop bar feature controllable machining precision, conforming to semiconductor cleanroom processing standards. The matching limit flat-edge sleeve is uniformly machined with a tolerance of ±0.02mm (unspecified) and a uniform C0.5×45° chamfer. The parts are free of scratches and wear marks, and undergo deburring and cleaning after machining. The assembly gaps are small, and the operating resonance is low. The overall assembly exhibits excellent sealing and coaxiality, preventing wafer wobble and collisions caused by machining errors. The structure is simple, with low modification costs, and is compatible with existing equipment. The overall modular structure is simple, requiring no modification to existing UV film peeling machines, SRD spin dryer main unit electrical control, or frame structure. Existing rotor components can be directly replaced, resulting in low component replacement costs. The durable structure is resistant to deformation and is suitable for high-volume, continuous UV film peeling centrifugal processing operations in semiconductor workshops. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the rotor structure of the present invention; Figure 2 This is a schematic diagram of the rotor cross-section structure of the present invention; Figure 3 This is a schematic diagram of the flat-side sleeve structure of the present invention; Figure 4 This is a schematic diagram of the front view of the flat-edge sleeve of the present invention; Figure 5 This is a schematic diagram of the cross-sectional structure of the flat-side sleeve of the present invention. Detailed Implementation

[0016] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] Please see Figure 1-5This invention provides a technical solution: a UV film peeling lamp SRD rotor and matching stop bar, including an SRD rotor body, a stop bar, a limiting sleeve, a locking wing nut, and a wafer carrier plug. The bottom end of the SRD rotor body is provided with a main shaft docking seat. The wafer carrier plug is assembled on both sides of the upper end of the SRD rotor body. The stop bar is a single integrated central stop bar and is vertically fixed at the center position of the upper end of the SRD rotor body. The outer wall of the central stop bar has reverse threads. The limiting sleeve is threaded onto the outside of the reverse threads. The locking wing nut is threaded onto the upper part of the central stop bar and presses against the upper end face of the limiting sleeve. The upper end of the SRD rotor body has plug insertion grooves on both sides. The bottom of the plug insertion grooves on both sides is inclined at an angle of 8°-15° with the horizontal plane. The wafer carrier plug is embedded and fixed inside the plug insertion groove. The wafer reference edge is placed inside the wafer carrier plug with the wafer reference edge facing upward. The flat edge of the outer wall of the limiting sleeve abuts against the outer reference edge of the limiting wafer. The limiting sleeve is a flat-edge sleeve structure.

[0018] The center of force of the central baffle coincides with the rotation center of the SRD rotor body. Each central baffle is symmetrically arranged with wafer bearing clips on both sides, ensuring no eccentric lateral force when the rotor rotates at high speed. This prevents rotational torque deviation and avoids eccentric vibration of the rotor at high speed from the structural source, ensuring a constant wafer clamping position and eliminating wafer offset and collision problems.

[0019] The reverse thread helix is ​​in the same direction as the high-speed rotation of the SRD rotor body. When the rotor rotates centrifugally, the reverse thread automatically self-locks with the limiting sleeve, limiting the rotational deviation of the limiting sleeve. Relying on the meshing characteristics of the same-direction reverse thread, it can automatically achieve thread engagement and self-locking. The higher the speed, the stronger the thread self-locking clamping force, which can autonomously counteract centrifugal shear force and fluid disturbance force, comprehensively limiting the autonomous rotation and radial deviation of the limiting sleeve, and maintaining the sleeve's clamping posture for a long time without the need for manual secondary locking.

[0020] The optimal tilt angle of the insert slot is 11°. The wafer-carrying insert tilts synchronously with the slot, ensuring that the wafer's photolithographic main surface is completely suspended from the bottom of the insert slot, with only the wafer's edge reference edge bearing pressure contact at a single point. After placement, the wafer is tilted and suspended, with the wafer's photolithographic pattern main surface and UV-curable film functional surface completely suspended from the inner wall of the insert slot bottom. There is no surface contact between the two; only the wafer's hard edge reference edge bears pressure contact with the insert slot at a single point, minimizing the wafer's contact area and protecting the wafer's functional surface from frictional damage.

[0021] The locking wing nut features an integrated anti-slip pressure washer at its bottom. This washer adheres to the upper surface of the limiting sleeve, increasing locking friction and achieving dual axial locking and limiting of the sleeve. This disperses the nut's clamping pressure, and combined with the reverse thread self-locking structure of the stop rod, forms a dual locking and limiting structure: radial self-locking of the thread and axial clamping of the nut end face. This dual-limit closed-loop locking prevents the sleeve from shifting vertically or rotating circumferentially, significantly improving locking stability.

[0022] The clearance between the inner diameter of the limiting sleeve and the outer diameter of the central stop bar is 0.01mm-0.03mm. The outer flat edge of the limiting sleeve is a matte anti-collision contact surface, flexibly fitting the wafer edge for limiting. It features high assembly coaxiality, minimal wobble allowance, moderate contact surface hardness, and no sharp edges, allowing for flexible fitting of the wafer's outer edge for limiting, preventing hard sleeves from scratching the wafer edge, and is suitable for protecting and limiting ultra-thin, brittle wafers.

[0023] The SRD rotor body, central stop bar, and limit sleeve are all made of anti-static PEEK semiconductor engineering plastic, with the overall anti-static resistance value controlled at 10. 6 Ω-10 9 The Ω-shaped insert slots on both sides have a symmetrical tilt angle error of ≤±0.3°, and the verticality error of the central stop bar assembly is ≤0.02mm. The material is resistant to UV aging and wafer cleaning solutions, making it suitable for long-term use in cleanrooms. It dissipates static electricity from high-speed rotational friction, preventing electrostatic discharge from damaging the wafer's photolithography lines. Furthermore, the symmetrical tilt angle error of the insert slots on both sides is ≤±0.3°, and the verticality error of the central stop bar assembly is ≤0.02mm. Strict control of assembly form and position tolerances ensures that the wafer clamping height and tilt angle on both sides are completely consistent.

[0024] The locking wing nut features a tool-free, manual assembly / disassembly structure, allowing for direct screwing and adjustment. It is suitable for fine-tuning the travel of the limiting sleeve on wafers of different outer diameters. The locking wing nut utilizes a widened wing lug tool-free design, with the lugs designed for easy hand gripping and screwing. This purely tool-free assembly / disassembly adjustment structure eliminates the need for wrenches, clamps, or other specialized tooling. Operators can directly screw the wing nut by hand to quickly unlock, raise, lower, and adjust the axial travel of the sleeve. It is compatible with edge limiting adjustments for 6-inch, 8-inch, and 12-inch wafers of different outer diameters, offering strong tooling versatility and high debugging efficiency.

[0025] The SRD rotor body is compatible with speeds ranging from 2000 r / min to 4500 r / min. The tilted wafer support plugs allow residual UV film removal adhesive and cleaning water to flow outwards via centrifugal force along the inclined surface. It can accommodate low-speed precision adhesive removal and high-speed centrifugal dehydration. Utilizing the 8°-15° tilted wafer support plugs, the wafers are placed at an angle to allow for self-flow. Residual UV film removal adhesive, surface cleaning water, and dust impurities flow outwards via centrifugal force along the inclined surface, preventing accumulation at the wafer-plug contact surface. This keeps the wafer's functional surfaces clean and reduces the probability of secondary contamination.

[0026] Example 1 (Lower limit tilt angle: 8°, suitable for 6-inch ultra-thin epitaxial wafers) This embodiment is adapted for centrifugal drying of 6-inch ultrathin epitaxial brittle wafers after UV film removal. The angle between the bottom of the insert slot and the horizontal plane is set to 8°, which is the lower limit of the structural tilt angle. The centrally mounted stop bar is vertically centered and has a left-hand reverse thread on the outer wall to accommodate the counterclockwise rotation of the equipment rotor. Rotation of the rotor automatically locks the sleeve thread. A standard flat-edge limiting sleeve is selected, with a matte anti-collision treatment on the flat edge. It is equipped with a widened anti-slip wing nut and a thickened anti-slip pad at the bottom to reduce the pressure per unit area and prevent edge chipping of the ultrathin wafer. The equipment is set to a constant spin-drying speed. 2800r / min, operating procedure: Place the 6-inch wafer with the reference edge facing up inside the wafer carrier plug. The wafer is slightly tilted and suspended in the air at an 8° angle. The photolithography main surface is completely detached from the bottom of the plug groove, with only the edge reference edge bearing the weight at a single point. Screw the limiting sleeve to fit the outer edge of the wafer and tighten the wing nut to lock the limiting position axially. The whole machine is continuously centrifuged and spun dry for 5 minutes. The wafer has no radial or axial shaking throughout the process. The UV film removal residue and cleaning pure water flow out smoothly along the inclined slope. The sleeve has no self-rotation or offset. The wafer has no scratches, no chipping, and no electrostatic damage. It is suitable for low-stress spin drying of ultra-thin sheets.

[0027] Example 2 (Optimal tilt angle: 11°, suitable for 8-inch conventional photolithography wafers) This embodiment is the optimal embodiment of the present invention, suitable for mass production of 8-inch conventional photolithography wafers in workshops, with an optimal tilt angle of 11° for the insert slot; the central stop bar has a right-hand reverse thread, suitable for the mainstream clockwise high-speed rotation conditions of the equipment, and has the best centrifugal self-locking stability; the height of the limiting sleeve can be adjusted manually without tools, suitable for the outer edge positioning of standard 8-inch wafers; the standard spin-drying speed of the equipment is 3200 r / min, which is the conventional mass production speed in the factory; the wafer reference edge is placed upwards, and the 11° tilt angle takes into account both wafer suspension protection and residual glue drainage efficiency, with a moderate outflow speed of impurities; relying on the single central stop bar for symmetrical force distribution, the rotor operates at high speed without eccentric vibration, and the reverse thread + wing nut double locking ensures that the sleeve will not shift under force; a single spin-drying time of 6 minutes provides high wafer clamping stability, significantly reduces the defect rate of wafer contamination and scratches, and the tooling is easy to debug and suitable for continuous batch production line operations, which is the main mass production assembly condition promoted by the present invention.

[0028] Example 3 (Upper tilt angle: 15°, suitable for 12-inch power thick wafers) This embodiment is adapted for centrifugal UV coating removal of 12-inch semiconductor power thick wafers. The upper limit tilt angle of the insert slot is set at 15° to increase the wafer tilt angle and accelerate the centrifugal drainage efficiency of high-viscosity UV curing residue and residual cleaning solution. The outer diameter of the integrated central baffle is thickened to improve the bending load-bearing capacity during high-speed rotation, and the contact area of ​​the flat edge of the limiting sleeve is widened to disperse the clamping force on the edge of the large-size wafer. The right-hand reverse thread of the baffle matches the clockwise rotation of the rotor, and the maximum adaptable speed of the equipment is 4500r / min. After the wafer is placed, it is suspended at a large angle with a very small contact surface to avoid the squeezing and wear of the thick wafer edges. The locking wing nut fully presses the limiting sleeve to resist the shearing force of high-speed centrifugal rotation, and the sleeve is locked firmly without movement. The whole machine has excellent coaxiality during long-term high-speed operation without resonance or vibration, which meets the requirements of efficient spin drying and adhesive removal of large-size wafers in high-power UV coating removal stations.

[0029] Working Principle: Workers pre-verify the component machining accuracy, confirming that the limit sleeve meets the requirements of unspecified tolerance ±0.02mm, C0.5×45° chamfer, no scratches or wear marks, and deburring and cleaning. The wafer carrier plug is then interference-fitted into the plug mounting slots on both sides of the rotor. The symmetry error of the mounting slot inclination is verified to be ≤±0.3°, and the verticality error of the central stop bar is verified to be ≤0.02mm. The rotor bottom spindle docking seat is then locked and connected to the SRD drive spindle of the UV film peeling equipment, completing the overall assembly and alignment. The equipment is powered on and tested under no-load to confirm that the rotor operates smoothly within the 2000-4500 r / min speed range without jamming or eccentric vibration. The upper locking wing nut is loosened by hand, and the limit sleeve is raised upwards along the reverse thread, reserving space for wafer feeding. With the UV-cured wafer reference edge facing upwards, vertically insert it into the wafer carrier cassette slots on both sides. Utilizing an 8°-15° cassette tilt angle, the entire wafer is placed at an angle, ensuring the functional surface is completely suspended and does not contact the bottom of the cassette slots. Only the wafer edge (reference edge) bears pressure for positioning, preventing wafer bonding friction damage. Lower the screw-in limiting sleeve, ensuring its matte outer edge precisely fits against the outer reference edge of the wafer, completing the outer edge limiting. Manually tighten the wing nut downwards. The anti-slip pressure pad at the bottom of the nut presses against the upper surface of the sleeve, applying pressure for locking. Utilizing the self-locking characteristic of the reverse thread, combined with the nut's end face pressure, this achieves dual locking of the sleeve against rotation and movement. After locking, the sleeve will not rotate or shift under slight external force or centrifugal force. The settings are adjusted according to the wafer size and residual adhesive amount. The spin speed is set at 2800 rpm for 6-inch ultrathin wafers, 3200 rpm for 8-inch standard wafers, and 4500 rpm for 12-inch high-power wafers. The rotor rotates uniformly and coaxially, with the central baffle providing balanced force without lateral force. The wafer is held in place by three points without radial or axial movement. Simultaneously, relying on the tilt angle of the clamps, UV residue and cleaning water on the wafer surface are autonomously discharged outwards by centrifugal force along the inclined surface, preventing impurities from adhering to the wafer's functional surfaces. After a single batch of centrifugal spin-drying is completed, the control equipment is stopped and reset to zero. The rotor stops rotating and returns to a stationary state. The wing nut is loosened manually, the limit sleeve is raised to release the outer edge limit of the wafer, and the cleaned wafer is directly removed, completing a single operation. To accommodate wafers of different outer diameters, simply adjust the sleeve's lifting stroke by turning the wing nut; no tooling replacement is required. After batch processing, inspect the sleeve threads and the wear on the plug contact surface, clean any residual adhesive residue from the bevel, reset the limiting sleeve and wing nut, and maintain the device in a locked standby state. The device can then directly proceed to the next batch of wafer feeding, locking, and spin-drying cycles. Periodically disassemble the sleeve to clean thread impurities, ensuring thread self-locking accuracy and extending tooling life. This device is suitable for the centrifugal spin-drying process after UV film removal from semiconductor wafers. Based on four core mechanisms—coaxial centering limit, tilted suspension bearing, reverse thread self-locking, and three-point clamping limit—it solves the problems of traditional rotor wafer wobbling, contact surface scratches, and sleeve loosening and displacement. The overall linkage principle is as follows.This device abandons the traditional double-sided eccentric stop bar structure and adopts a coaxial, integrated central stop bar. The clamping force coincides with the rotor's rotation center, eliminating rotational eccentric torque. Relying on the 8°-15° inclined insert slots on both sides of the rotor, in conjunction with the wafer-bearing insert, the wafer is tilted and suspended, with the wafer reference edge facing upwards and single-point clamping. The wafer's photolithography main surface and UV film functional surface are completely detached from the inner wall of the insert slot, eliminating friction, impact, and contamination from the source. The outer wall of the central stop bar has reverse threads in the same direction as the rotor's rotation. The limiting sleeve is threaded and assembled. When the rotor rotates at high speed and generates centrifugal torque, the threads can automatically lock. The higher the speed, the tighter the sleeve locks and grips. The stronger the force, the more it can autonomously counteract centrifugal shear force, preventing the sleeve from rotating and shifting. Combined with a butterfly nut with anti-slip pads at the bottom for axial clamping and limiting, it forms a double-locking structure of radial self-locking threads and axial clamping of the nut. The matte flat edge of the limiting sleeve flexibly presses against the outer edge of the wafer reference, achieving a three-point closed-loop limiting of the wafer. Simultaneously, the entire machine is made of anti-static PEEK material to dissipate static electricity from rotational friction. The inclined surface allows UV residue and cleaning water to drain out by centrifugal force. Combined with the ±0.02mm precision machining tolerance of the sleeve and extremely small gap assembly, it ensures low resonance during high-speed rotor operation and stable wafer clamping without any shaking, stably completing the centrifugal drying operation after UV film removal.

[0030] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A UV film peeling lamp SRD rotor and matching stop bar, comprising an SRD rotor body, a stop bar, a limiting sleeve, a locking wing nut, and a wafer carrier plug, wherein the bottom end of the SRD rotor body is provided with a main shaft docking seat, and the wafer carrier plug is assembled on both sides of the upper end of the SRD rotor body, characterized in that: The stop bar is a single, integrated, centrally located stop bar, vertically fixed to the upper center of the SRD rotor body. The outer wall of the centrally located stop bar has reverse threads. The limiting sleeve is threaded onto the outside of the reverse threads. The locking wing nut is threaded onto the upper part of the centrally located stop bar and presses against the upper end face of the limiting sleeve. The upper end of the SRD rotor body has two side slots for inserting inserts. The bottom of the side slots is inclined at an angle of 8°-15° to the horizontal plane. The wafer carrier insert is fixed inside the insert slot. The wafer reference edge is placed inside the wafer carrier insert with the wafer reference edge facing upward. The flat edge of the outer wall of the limiting sleeve presses against the outer reference edge of the limiting wafer. The limiting sleeve has a flat edge sleeve structure.

2. The UV film-removing lamp SRD rotor and matching stop bar according to claim 1, characterized in that: The center point of the force of the central baffle coincides with the center of rotation of the SRD rotor body. The single central baffle is symmetrically arranged with wafer bearing plugs on both sides, so that there is no eccentric lateral force when the rotor rotates at high speed.

3. The UV film-removing lamp SRD rotor and matching stop bar according to claim 1, characterized in that: The reverse thread tooth rotates in the same direction as the high-speed rotation of the SRD rotor body. When the rotor rotates centrifugally, the reverse thread tooth and the limiting sleeve automatically lock together, limiting the rotational deviation of the limiting sleeve.

4. The UV film-removing lamp SRD rotor and matching stop bar according to claim 1, characterized in that: The optimal tilt angle of the insert slot is 11°. The wafer-carrying insert tilts synchronously with the slot, and the main surface of the wafer photolithography is completely suspended from the bottom of the insert slot, with only the wafer edge reference edge bearing pressure contact at a single point.

5. The UV film-removing lamp SRD rotor and matching stop bar according to claim 1, characterized in that: The bottom of the locking wing nut is integrally equipped with an anti-slip pressure pad. The anti-slip pressure pad fits against the upper end face of the limiting sleeve to increase the locking friction and achieve double axial locking and limiting of the sleeve.

6. The UV film-removing lamp SRD rotor and matching stop bar according to claim 1, characterized in that: The clearance between the inner diameter of the limiting sleeve and the outer diameter of the central stop bar is 0.01mm-0.03mm. The outer flat edge of the limiting sleeve is a matte anti-collision contact surface, which flexibly fits the edge of the wafer for limiting.

7. The UV film-removing lamp SRD rotor and matching stop bar according to claim 1, characterized in that: The SRD rotor body, central stop bar, and limiting sleeve are all made of anti-static PEEK semiconductor engineering plastic, and the overall anti-static resistance value is controlled within 10. 6 Ω-10 9 Ω, the symmetry error of the tilt angle of the insert grooves on both sides is ≤ ±0.3°, and the verticality error of the central stop rod assembly is ≤ 0.02mm.

8. The UV film-removing lamp SRD rotor and matching stop bar according to claim 1, characterized in that: The locking wing nut is a tool-free, hand-operated assembly / disassembly structure that can be directly screwed and adjusted, adapting to the fine-tuning of the travel of the limiting sleeve for wafers with different outer diameters.

9. The UV film-removing lamp SRD rotor and matching stop bar according to claim 1, characterized in that: The SRD rotor body is adapted to a speed range of 2000r / min-4500r / min, and the inclined wafer support plugs allow UV film removal residue and cleaning pure water to flow out autonomously along the inclined surface.

10. A method of using a UV film-removing lamp SRD rotor and matching stop bar, characterized in that: The UV film-removing lamp SRD rotor and matching stop bar according to any one of claims 1-9 further include the following steps: S1. Assembly self-inspection pre-processing: Staff verify the machining accuracy of components in advance, confirming that the limit sleeve meets the unspecified tolerance of ±0.02mm, C0.5×45° chamfer, no scratches or grinding marks, and is deburred and cleaned to meet the completion requirements; the wafer bearing plug is interference-fitted into the plug mounting slots on both sides of the rotor, and the symmetry error of the inclination angle of the mounting slots on both sides is verified to be ≤±0.3° and the verticality error of the central stop rod is ≤0.02mm. The main shaft docking seat at the bottom of the rotor is locked and connected to the SRD drive main shaft of the UV film peeling equipment to complete the assembly and alignment of the whole machine. The equipment is powered on and tested under no-load to confirm that the rotor runs in the speed range of 2000-4500r / min without jamming or eccentric vibration. S2. Wafer tilting and suspension feeding: Loosen the upper locking wing nut by hand, and raise the limiting sleeve upward along the reverse thread to reserve space for wafer feeding; Place the wafer with the reference edge facing up after UV film removal, vertically into the wafer carrier cassette slots on both sides, relying on the cassette tilt angle of 8°-15° (11° tilt angle is the optimal choice for conventional mass production) to tilt the entire wafer, so that the functional surface of the wafer is completely suspended and does not contact the bottom of the cassette slot, and only the reference edge of the wafer is pressure-held and positioned to avoid wafer bonding friction damage; S3. Dual locking and limiting of sleeve alignment: Lower and screw the limiting sleeve so that the matte flat edge of the sleeve is precisely fitted against the outer reference edge of the wafer, completing the wafer outer edge limiting; manually screw down the locking wing nut, the anti-slip pressure pad at the bottom of the nut is pressed against the upper end face of the sleeve to lock it, relying on the self-locking characteristics of the reverse thread in the same direction, and with the pressure of the nut end face, the sleeve is locked to prevent rotation and movement. After locking, the sleeve will not rotate or shift on its own under slight external force or centrifugal force; S4. Graded speed centrifugal drying operation: The equipment speed is set according to the wafer size and residual adhesive amount. 6-inch ultra-thin wafers are set to low-speed drying of 2800r / min, 8-inch conventional wafers are set to standard drying of 3200r / min, and 12-inch high-power wafers are set to high-speed drying of 4500r / min. The rotor rotates uniformly and coaxially, and the central baffle is evenly stressed without lateral force. The wafer is clamped and fixed at three points without radial or axial sway. At the same time, relying on the tilt angle of the stopper, UV residual adhesive and cleaning pure water on the wafer surface are discharged outward autonomously along the inclined slope with the help of centrifugal force, avoiding impurities adhering to the functional surface of the wafer. S5. Shutdown, pressure relief, sampling, and unloading: After a single batch of centrifugal drying is completed, the control equipment is stopped and reset to zero, the rotor stops rotating and returns to a stationary state; the wing nut is loosened by hand, the limit sleeve is raised to release the outer edge limit of the wafer, and the processed clean wafer is directly taken out, completing a single operation; if it is necessary to adapt to wafers of different outer diameters, only the wing nut needs to be turned to finely adjust the lifting stroke of the sleeve, without the need to change tooling parts; S6. Operation and maintenance reset cycle: After the batch processing is completed, check the wear of the sleeve thread and the contact surface of the plug, and clean the residual glue and impurities on the slope; reset the limit sleeve and the wing nut to keep the device locked and ready for use, so that it can directly enter the next batch of wafer feeding, locking, and drying cycle processing; periodically disassemble the sleeve to clean the thread impurities, ensure the thread self-locking accuracy, and extend the service life of the tooling.

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