Retooling apparatus and method for wafer translation between cassettes

Abstract

Embodiments of the present application relate to a transfer device for wafer translation between cassettes, comprising: a base; a first positioning structure disposed on the base for positioning a first cassette loaded with wafers; a second positioning structure disposed on the base and located on one side of the first positioning structure for positioning a second cassette for receiving wafers; a translation structure comprising a sliding part in sliding connection with the base, a pushing part connected to the sliding part, and a connecting arm connecting the sliding part and the pushing part; wherein the base is configured with an open avoidance slot extending to the first positioning structure and / or the second positioning structure along the sliding direction of the translation structure; the pushing part is located above the avoidance slot, the connecting arm moves with the sliding part and at least partially enters the avoidance slot, and the avoidance slot is used for avoiding the connecting arm to enable the pushing part to move to the first cassette or the second cassette and push the wafers to translate between the first cassette and the second cassette. Embodiments of the present application also relate to a transfer method.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing auxiliary tooling technology, and in particular to a transfer device and method for wafer translation between wafer cassettes. Background Technology

[0002] In semiconductor wafer fabrication, wafers are typically stored in wafer cassettes and moved between different processes via these cassettes. For example, before or after processes such as cleaning, inspection, drying, or temporary storage, wafers may need to be transferred from one wafer cassette to another. Different wafer cassettes may differ in their external dimensions, equipment compatibility, or application scenarios, but they generally all have wafer slots inside to support the wafer edges. To ensure that wafers can smoothly enter the receiving wafer cassette, a relatively accurate relative positional relationship must be maintained between the outgoing and receiving wafer cassettes, and the wafers must move along the corresponding slot direction.

[0003] In current operations, wafer transfer between wafer cassettes typically relies on manual single-wafer handling or simple clamps for assisted transport. During manual single-wafer handling, operators need to contact or clamp each wafer individually, which can easily lead to wafer misalignment, edge damage, or surface contamination due to inconsistent force application. Furthermore, wafer-by-wafer transfer depends on operator skill, making it difficult to maintain wafer sequence and slot correspondence. For batch wafer handling, single-wafer operations are time-consuming, and each wafer requires individual removal, movement, and placement, increasing the number of times the wafer comes into contact with external tools or the environment. Summary of the Invention

[0004] One object of this application is to provide a transfer apparatus and method for wafer translation between wafer cassettes, at least to solve the above-mentioned problems.

[0005] To achieve the above objectives, some embodiments of this application provide a transfer device for inter-cassette wafer translation, including:

[0006] Base;

[0007] The first positioning structure, located on the base, is used to position and place the first wafer cassette containing the wafer.

[0008] The second positioning structure is disposed on the base and located on one side of the first positioning structure, and is used to position the second wafer cassette for placing the receiving wafer; one of the first wafer cassette and the second wafer cassette is a wafer ejector cassette for loading wafers, and the other is a wafer receiver cassette for receiving wafers.

[0009] The translation structure includes a sliding part slidably connected to the base, a pushing part connected to the sliding part, and a connecting arm connecting the sliding part and the pushing part. The pushing part is used to push the wafer to translate between the first wafer cassette and the second wafer cassette.

[0010] The base has an open clearance groove that extends along the sliding direction of the translation structure to the first positioning structure and / or the second positioning structure.

[0011] The pushing part is located above the clearance groove. The connecting arm moves with the sliding part and at least partially enters the clearance groove, which is used to avoid the connecting arm, so that the pushing part can move to the first wafer cassette or the second wafer cassette and push the wafer to translate between the first wafer cassette and the second wafer cassette. That is, the pushing part can move to the side of the wafer in the transfer cassette and / or the transfer area between the first wafer cassette and the second wafer cassette, and push the wafer to translate between the first wafer cassette and the second wafer cassette.

[0012] Some embodiments of this application provide a wafer translation and transfer method between wafer cassettes, employing the transfer device for wafer translation between wafer cassettes as provided in the foregoing embodiments. The method includes:

[0013] The first piece box is positioned and placed in the first positioning structure, and the second piece box is positioned and placed in the second positioning structure;

[0014] Based on the wafer transfer orientation, a wafer transfer cassette for loading wafers and a wafer receiving cassette for receiving wafers are determined in the first wafer cassette and the second wafer cassette.

[0015] The drive translation structure slides relative to the base along the direction from the outgoing wafer cassette toward the receiving wafer cassette, causing the pusher to move to the side of the wafer inside the outgoing wafer cassette;

[0016] The translation structure continues to slide along the direction from the output wafer cassette toward the receiving wafer cassette, so that the connecting arm at least partially enters the clearance slot, and the pushing part located above the clearance slot pushes the wafer from the output wafer cassette to the receiving wafer cassette.

[0017] Compared with related technologies, in the solution provided by the embodiments of this application, the first positioning structure and the second positioning structure respectively position the first wafer cassette and the second wafer cassette, so that the relative position of the two wafer cassettes on the base is determined, which facilitates the translation of the wafer between the two wafer cassettes in a predetermined direction; the translation structure slides with the base through the sliding part and drives the pushing part to move through the connecting arm, so that the pushing part can push the wafer in a controlled path, without the need for manual single wafer picking, and without the need to transfer the wafer by passing through the wafer center hole, thereby reducing the risk of edge bumps and surface contact caused by changes in pick-up and drop posture, partial clamping or suspended transport during wafer transfer.

[0018] Meanwhile, the base has an open clearance groove that extends along the sliding direction of the translation structure to the first positioning structure and / or the second positioning structure; the pushing part is located above the clearance groove, and the connecting arm moves with the sliding part and at least partially enters the clearance groove. Through this structure, the clearance groove avoids the connecting arm, while the pushing part can be maintained at a height corresponding to the wafer edge. Thus, when the translation structure moves to the vicinity of the wafer cassette placement area, the connecting arm is not restricted by the solid portion of the base, allowing the pushing part to move to the transfer area between the first and second wafer cassettes and apply a translational thrust to the wafer along the inter-cassette transfer direction.

[0019] Therefore, this transfer device combines wafer cassette positioning, translational pushing, and connecting arm clearance on the same base. While ensuring the wafer cassette positioning reference, it provides the necessary movement space for the translational structure to enter the push position, enabling the wafer to be transferred between the first and second wafer cassettes by translation. This reduces the possibility of wafer jamming, skew, or incomplete entry into the receiving wafer cassette caused by wafer cassette alignment deviation, insufficient push stroke, or interference of the push part by the base. Attached Figure Description

[0020] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0021] Figure 1 This is a schematic diagram of the structure of the transfer device provided in the embodiments of this disclosure;

[0022] Figure 2 This is a schematic diagram of the transfer device provided in an embodiment of the present disclosure from another perspective;

[0023] Figure 3 This is a schematic diagram of the transfer device provided in an embodiment of the present disclosure from another perspective;

[0024] Figure 4 This is a schematic diagram of the transfer device provided in an embodiment of the present disclosure from another perspective;

[0025] Figure 5 This is a schematic diagram of the transfer device provided in an embodiment of the present disclosure from another perspective;

[0026] Figure 6 This is an assembly diagram of the transfer device, the first sheet box, and the second sheet box provided in the embodiments of this disclosure;

[0027] Figure 7 This is an assembly schematic diagram of the transfer device, the first sheet box, and the second sheet box provided in the embodiments of this disclosure from another perspective;

[0028] Figure 8 This is a schematic flowchart of the conversion method provided in the embodiments of this disclosure.

[0029] Figure label:

[0030] 1: Base; 101: Intermediate connecting part; 11: Clearance groove; 112: First clearance section; 113: Second clearance section; 121: First sliding guide; 122: Second sliding guide; 2: First positioning structure; 21: Corner limiting member; 22: Lateral limiting member; 3: Second positioning structure; 4: Translation structure; 41: Sliding part; 42: Pushing part; 421: Pushing surface; 43: Connecting arm; 5: First piece box; 6: Second piece box. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this disclosure described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0033] In this disclosure, the terms "upper," "lower," "inner," "middle," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for better description of the embodiments of this disclosure and their implementations, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to require them to be constructed and operated in a specific orientation. Furthermore, some of the aforementioned terms may be used to indicate other meanings besides orientation or positional relationship; for example, the term "upper" may in some cases indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in the embodiments of this disclosure according to the specific circumstances.

[0034] Furthermore, the terms "set up," "connect," and "fix" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0035] Unless otherwise stated, the term "multiple" means two or more.

[0036] In this embodiment of the disclosure, the character " / " indicates that the objects before and after it are in an "or" relationship. For example, A / B means: A or B.

[0037] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0038] It should be noted that, unless otherwise specified, the embodiments and features described in the present disclosure can be combined with each other.

[0039] Combination Figures 1 to 7 As shown in the embodiment of this disclosure, the transfer device for wafer translation between wafer cassettes includes: a base 1; a first positioning structure 2 disposed on the base 1 for positioning and placing a first wafer cassette 5 loaded with wafers; a second positioning structure 3 disposed on the base 1 and located on one side of the first positioning structure 2 for positioning and placing a second wafer cassette 6 receiving wafers; one of the first wafer cassette and the second wafer cassette is a wafer-loading transfer cassette, and the other is a wafer-receiving cassette; a translation structure 4 including a sliding part 41 slidably connected to the base 1, a pushing part 42 connected to the sliding part 41, and a connecting part 42 to the sliding part 41. The connecting arm 43 of the moving part 41 and the pushing part 42 is used to push the wafer to translate between the first wafer cassette 5 and the second wafer cassette 6. The base 1 is constructed with an open clearance groove 11, which extends along the sliding direction of the translation structure 4 to the first positioning structure 2 and / or the second positioning structure 3. The pushing part 42 is located above the clearance groove 11, and the connecting arm 43 moves with the sliding part 41 and at least partially enters the clearance groove 11. The clearance groove 11 is used to avoid the connecting arm 43, so that the pushing part moves to the first wafer cassette or the second wafer cassette and pushes the wafer to translate between the first and second wafer cassettes. That is, the pushing part can move to the side of the wafer in the wafer cassette and / or the transfer area between the first and second wafer cassettes, and push the wafer to translate between the first and second wafer cassettes.

[0040] The wafer transfer device for inter-cassette translation provided in this embodiment of the present disclosure positions the first cassette 5 and the second cassette 6 respectively by the first positioning structure 2 and the second positioning structure 3, so that the relative positions of the two cassettes on the base 1 are fixed, which facilitates the translation of the wafer between the two cassettes in a predetermined direction; the translation structure 4 slides with the base 1 through the sliding part 41 and drives the pushing part 42 to move through the connecting arm 43, so that the pushing part 42 can push the wafer in a controlled path, without the need for manual single wafer picking, and without the need to transfer the wafer by passing through the wafer center hole, thereby reducing the risk of edge bumps and surface contact caused by changes in pick-up and drop posture, partial clamping or suspended transport of the wafer during the transfer process.

[0041] Meanwhile, the base 1 is constructed with an open clearance groove 11, which extends along the sliding direction of the translation structure 4 to the first positioning structure 2 and / or the second positioning structure 3; the pushing part 42 is located above the clearance groove 11, and the connecting arm 43 moves with the sliding part 41 and at least partially enters the clearance groove 11. Through this structure, the clearance groove 11 avoids the connecting arm 43, while the pushing part 42 can be maintained at a height position corresponding to the edge of the wafer. In this way, when the translation structure 4 moves to the vicinity of the wafer cassette placement area, the connecting arm 43 will not be restricted by the solid part of the base 1, thus allowing the pushing part 42 to move to the transfer area between the first wafer cassette 5 and the second wafer cassette 6 and apply a translational thrust to the wafer along the transfer direction between wafer cassettes.

[0042] Therefore, this transfer device combines wafer cassette positioning, translational pushing, and connecting arm 43 clearance on the same base 1. While ensuring the wafer cassette positioning reference, it provides the necessary movement space for the translational structure 4 to enter the push position, so that the wafer can be transferred between the first wafer cassette 5 and the second wafer cassette 6 by translation. This reduces the possibility of wafer jamming, skew, or incomplete entry into the receiving wafer cassette caused by wafer cassette alignment deviation, insufficient push stroke, or interference of the pushing part 42 by the base 1.

[0043] The translation structure 4 includes a sliding part 41, a pushing part 42, and a connecting arm 43. The sliding part 41 is slidably connected to the base 1, the pushing part 42 is connected to the sliding part 41 and is used to push the wafer to translate between the first wafer cassette 5 and the second wafer cassette 6, and the connecting arm 43 is connected between the sliding part 41 and the pushing part 42. When the translation structure 4 slides relative to the base 1, the sliding part 41 drives the connecting arm 43 to move, and the connecting arm 43 further drives the pushing part 42 to move along the transfer direction between the first wafer cassette 5 and the second wafer cassette 6. The pushing part 42 is used to contact the edge of the wafer and apply a pushing force to the wafer along the wafer cassette slot direction, so that the wafer is translated from the transfer-out wafer cassette to the receiving wafer cassette. Since the pushing part 42 forms a controlled movement through the sliding part 41 and the connecting arm 43, instead of the operator directly contacting the wafer, the force position and force direction of the wafer during the transfer process can be defined by the device structure, thereby reducing the situation of wafer skew caused by inconsistent manual pushing angles.

[0044] The base 1 has an open clearance groove 11 that extends along the sliding direction of the translation structure 4 to the first positioning structure 2 and / or the second positioning structure 3. "Open" here means that the clearance groove 11 has an opening for the connecting arm 43 to enter. This opening can be positioned facing the side where the pushing part 42 is located, or it can be recessed inward from the upper surface of the base 1. The pushing part 42 is located above the clearance groove 11, and the connecting arm 43 moves with the sliding part 41 and at least partially enters the clearance groove 11. The clearance groove 11 is used to avoid the connecting arm 43, ensuring that the connecting arm 43 does not interfere with the base 1 when the translation structure 4 moves to the vicinity of the wafer cassette placement area. This allows the pushing part 42 to move between the first wafer cassette 5 and the second wafer cassette 6 and push the wafer to translate. In this structure, the connecting arm 43 enters the clearance groove 11, while the pushing part 42 does not need to enter the clearance groove 11 but remains at a height corresponding to the edge of the wafer. In this way, the base 1 can retain the physical part for supporting and positioning the wafer cassette, while also providing space for the connecting arm 43 to move, so that the pusher 42 has enough stroke to reach the wafer side.

[0045] Optionally, the base 1 includes an intermediate connecting portion 101 located between the first positioning structure 2 and the second positioning structure 3, and the clearance groove 11 includes a clearance section located on at least one side of the intermediate connecting portion 101, the clearance section extending from the end of the base 1 toward the intermediate connecting portion 101; wherein, the connecting arm 43 at least partially enters the clearance section when the sliding portion 41 moves to the corresponding positioning structure.

[0046] The clearance section can extend from the end of the base 1, the cassette placement area corresponding to the first positioning structure 2, or the cassette placement area corresponding to the second positioning structure 3 towards the intermediate connecting part 101. The intermediate connecting part 101 connects the solid parts of the base 1 on both sides of the clearance section, so that the base 1 still maintains continuous support between the first positioning structure 2 and the second positioning structure 3. With this structure, the base 1 does not need to form a completely through slot between the first positioning structure 2 and the second positioning structure 3. Instead, the clearance section is set at the position where the connecting arm 43 needs to pass through, and the intermediate connecting part 101 is retained at the position where clearance is not required. This satisfies the clearance requirements of the connecting arm 43 and reduces the impact of large-area slots on the support rigidity of the base 1 and the cassette positioning reference.

[0047] In some embodiments, there may be one or two clearance sections. When there is one clearance section, it may extend to the first positioning structure 2 or the second positioning structure 3 to adapt to unidirectional conversion or the main direction of use. When there are two clearance sections, they may extend from opposite ends of the base 1 toward the intermediate connecting portion 101 and be spaced apart by the intermediate connecting portion 101. When the translation structure 4 slides along the first direction, the connecting arm 43 can enter one of the clearance sections; when the translation structure 4 slides along the second direction opposite to the first direction, the connecting arm 43 can enter the other clearance section. With this arrangement, the same base 1 can adapt to conversion strokes in both directions, from the first piece box 5 to the second piece box 6 and from the second piece box 6 to the first piece box 5, without needing to set up a separate clearance structure for reverse conversion.

[0048] Optionally, the clearance slot 11 includes a first clearance section 112 and a second clearance section 113 located on both sides of the intermediate connecting portion 101. The first clearance section 112 and the second clearance section 113 extend from opposite ends of the base 1 toward the intermediate connecting portion 101 and are spaced apart by the intermediate connecting portion 101. The first clearance section 112 extends to the first wafer cassette 5 placement area corresponding to the first positioning structure 2. The connecting arm 43 moves with the sliding portion 41 and at least partially enters the first clearance section 112, so that the pushing portion 42 can move to the side of the wafer in the first wafer cassette 5 and push the wafer to translate. Since the initial pushing position of the pushing portion 42 can be close to the edge of the wafer in the first wafer cassette 5, the pushing portion 42 can apply a translational pushing force to the wafer before the wafer leaves the slot of the first wafer cassette 5. In this way, when the wafer is removed from the slot of the first wafer cassette 5, the direction of the force is consistent with the extension direction of the slot, which can reduce the possibility of the wafer swaying, tilting, or scraping against the slot entrance when it first starts to move.

[0049] Optionally, the second clearance section 113 extends to the second wafer cassette 6 placement area corresponding to the second positioning structure 3, and the connecting arm 43 can move with the sliding part 41 and at least partially enter the second clearance section 113 so that the pushing part 42 can move to the side of the wafer in the second wafer cassette 6 and push the wafer to translate.

[0050] By extending the second clearance section 113 to the placement area of ​​the second wafer cassette 6 corresponding to the second positioning structure 3, the connecting arm 43 can at least partially enter the second clearance section 113 when the translation structure 4 moves to the side of the second wafer cassette 6, thus avoiding interference between the connecting arm 43 and the base 1 near the second positioning structure 3. Consequently, the pushing part 42 can continue to move to the side of the wafer within the second wafer cassette 6, or move to the wafer receiving position of the second wafer cassette 6 when the second wafer cassette 6 is used as a receiving wafer cassette, giving the pushing part 42 an effective stroke to enter the side of the second wafer cassette 6.

[0051] Based on this structure, when the wafer is transferred from the first wafer cassette 5 to the second wafer cassette 6, the pushing unit 42 can push the wafer to the receiving depth of the slot in the second wafer cassette 6, instead of just pushing the wafer to the entrance of the second wafer cassette 6. This reduces the risk of the wafer not fully entering the slot of the second wafer cassette 6, remaining at the wafer cassette entrance, or getting stuck. When the wafer is transferred in the reverse direction from the second wafer cassette 6 to the first wafer cassette 5, the second clearance section 113 allows the pushing unit 42 to move to the side of the wafer inside the second wafer cassette 6, so that the pushing unit 42 applies translational thrust from the side of the wafer closest to the second wafer cassette 6, reducing the skewness during the initial movement stage of the wafer.

[0052] Optionally, the pushing part 42 extends longitudinally along the wafer arrangement direction; wherein, the connecting arm 43 is connected to the middle region of the pushing part 42, and the connecting arm 43 is located in the extension direction of the clearance groove 11 so as to enter the clearance groove 11 during the movement of the sliding part 41 and drive the pushing part 42 to move above the clearance groove 11.

[0053] The wafer arrangement direction can be the direction in which multiple wafers are arranged longitudinally and alternately within the wafer cassette. The length of the pushing part 42 can cover the entire wafer arrangement range within the wafer cassette, or it can cover multiple wafers arranged consecutively within it. The connecting arm 43 is connected to the middle region of the pushing part 42, and the connecting arm 43 is located in the extension direction of the clearance groove 11. When the sliding part 41 moves, the connecting arm 43 enters the clearance groove 11 and drives the pushing part 42 to move above the clearance groove 11. Since the connecting arm 43 is connected to the middle region of the pushing part 42, the driving force received by both ends of the pushing part 42 during the wafer pushing process is closer to a balanced state, which can reduce the situation where one end of the pushing part 42 moves ahead along the wafer arrangement direction, so that multiple wafers maintain similar translational displacements in the same pushing process.

[0054] Optionally, the pushing part 42 has a pushing surface 421 facing the wafer, which extends along the wafer arrangement direction and is used to simultaneously abut the edges of multiple wafers. The pushing surface 421 is a continuous surface structure, suitable for wafer cassettes where the exposed edges of multiple wafers are substantially the same. When the pushing part 42 moves, the continuous pushing surface 421 can form a unified pushing reference for the multiple wafers, allowing them to move synchronously along the wafer cassette slot direction. In other embodiments, the pushing surface 421 may have multiple pushing parts spaced apart along the wafer arrangement direction, each pushing part abutting the edge of a corresponding wafer. An avoidance interval is formed between adjacent pushing parts, which can be used to avoid the spacers, slot protrusions, or spaces between adjacent wafers in the wafer cassette. Through either a continuous surface structure or spaced pushing parts, the pushing part 42 can select a pushing method matching the wafer edges according to different wafer cassette slot structures, reducing unintended interference between the pushing part 42 and the wafer cassette structure.

[0055] Optionally, the base 1 is provided with a sliding guide, the sliding part 41 is slidably engaged with the sliding guide, the sliding guide is arranged parallel to the clearance groove 11, and the sliding guide is located on one side of the clearance groove 11.

[0056] Specifically, the sliding guide can be a slide rail, a guide groove, a guide rod, or a slider guide assembly. The sliding guide extends along the arrangement direction of the first positioning structure 2 and the second positioning structure 3, causing the sliding part 41 to reciprocate only in a predetermined direction. Since the sliding guide is parallel to the clearance groove 11, the movement direction of the connecting arm 43 when it enters the clearance groove 11 is consistent with the extension direction of the clearance groove 11, which can reduce the possibility of the connecting arm 43 making oblique contact with the side wall of the clearance groove 11, and at the same time ensure that the direction of the pushing force applied to the wafer by the pushing part 42 is consistent with the transfer direction between the two wafer cassettes.

[0057] Optionally, the sliding guide includes a first sliding guide 121 and a second sliding guide 122. The first sliding guide 121 and the second sliding guide 122 are respectively disposed on both sides of the width direction of the clearance groove 11, and the sliding part 41 slides in cooperation with the first sliding guide 121 and the second sliding guide 122.

[0058] The sliding part 41 may include a sliding seat that spans the clearance groove 11. The two ends of the sliding seat are connected or cooperate with the first sliding guide 121 and the second sliding guide 122, respectively. The connecting arm 43 is connected to the sliding seat and located between the two sliding guides. During the wafer pushing process, the wafer edge generates a reaction force on the pushing part 42, which is transmitted to the sliding part 41 through the connecting arm 43. By supporting the sliding part 41 with the sliding guides on both sides, the tendency of the sliding part 41 to swing left and right or twist relative to the base 1 can be reduced, so that the pushing part 42 maintains a more stable posture when pushing multiple wafers.

[0059] Optionally, the first positioning structure 2 and the second positioning structure 3 respectively include a corner limiting member 21 and a lateral limiting member 22 arranged along the outer periphery of the film box. The corner limiting member 21 and the lateral limiting member 22 cooperate to limit the position of the corresponding film box in the sliding direction of the translation structure 4 and in the sliding direction perpendicular to the translation structure 4.

[0060] The corner limiting member 21 can be located at the corner of the outer periphery of the bottom of the wafer cassette to limit the front-to-back position of the wafer cassette along the sliding direction of the translation structure 4; the lateral limiting member 22 can be located on the outer side wall of the wafer cassette to limit the left-to-right position of the wafer cassette along the sliding direction perpendicular to the translation structure 4. After the wafer cassette is placed on the base 1, the corner of the wafer cassette abuts against the corner limiting member 21, and the side wall of the wafer cassette abuts against the lateral limiting member 22, thereby limiting the position of the wafer cassette relative to the base 1. The relative positions of the first positioning structure 2 and the second positioning structure 3 can be determined according to the outer dimensions, slot spacing, and wafer outer diameter of the first wafer cassette 5 and the second wafer cassette 6, so that the wafer slots of the first wafer cassette 5 and the wafer slots of the second wafer cassette 6 correspond one-to-one along the sliding direction of the translation structure 4. With this positioning method, after the wafer is removed from the outgoing wafer cassette, it can enter the receiving wafer cassette along the corresponding receiving slot, reducing the possibility of wafer cross-slotting or jamming due to misalignment of the two wafer cassettes.

[0061] In some embodiments, the first positioning structure 2 and the second positioning structure 3 are used to make the wafer slots of the first wafer cassette 5 correspond one-to-one with the wafer slots of the second wafer cassette 6 along the sliding direction of the translation structure 4.

[0062] In some alternative embodiments, the base 1 is provided with a transition support between the first positioning structure 2 and the second positioning structure 3. The transition support is located on at least one side of the clearance groove 11 and is used to support the edge of the wafer when the wafer is translated from the first wafer cassette 5 to the second wafer cassette 6.

[0063] The transition support can be integrally formed with the base 1, or it can be installed on the base 1 as a detachable part. The upper surface of the transition support can be lower than or substantially flush with the support position of the wafer slot in the wafer cassette, so that the wafer can transition to the transition support after sliding out of the wafer cassette, and then enter the receiving wafer cassette. Since there is usually a gap between the first wafer cassette 5 and the second wafer cassette 6, the transition support can provide support for the wafer edge when the wafer passes through the gap, reducing the possibility of the wafer sagging or edge stress concentration at the wafer cassette gap.

[0064] In some alternative embodiments, the transition support is provided with a guide surface extending along the sliding direction of the translation structure 4, the guide surface being used to limit the lateral displacement of the wafer when it is translated between the first wafer cassette 5 and the second wafer cassette 6.

[0065] The guide surface can be a vertical surface, an inclined surface, a rounded transition surface, or a guide structure formed by a combination of the above surfaces. The guide surface is located laterally at the edge of the wafer and is used to limit the lateral offset of the wafer relative to the sliding direction of the translation structure 4 when the wafer translates between the first wafer cassette 5 and the second wafer cassette 6. When the wafer passes through the transition area between the two wafer cassettes, the guide surface can confine the wafer edge within the entrance range of the corresponding slot, ensuring that the wafer maintains an orientation corresponding to the receiving slot before entering the receiving wafer cassette.

[0066] Combination Figures 1 to 8 As shown in the embodiments of this disclosure, a wafer translation and transfer method between wafer cassettes is also provided, including the transfer device for wafer translation between wafer cassettes provided in the above embodiments. The method includes:

[0067] Step 1: Position the first piece box 5 in the first positioning structure 2, and position the second piece box 6 in the second positioning structure 3;

[0068] Step 2: Based on the wafer transfer orientation, determine the wafer transfer cassette for loading wafers and the wafer receiving cassette for receiving wafers in the first wafer cassette 5 and the second wafer cassette 6.

[0069] Step 3: Drive the translation structure 4 to slide relative to the base 1 along the direction from the wafer tray to the receiving wafer tray, so that the pushing part 42 moves to the side of the wafer inside the wafer tray;

[0070] Step 4: Continue to drive the translation structure 4 to slide along the direction from the wafer tray toward the receiving wafer tray, so that the connecting arm 43 enters at least partially into the clearance groove 11, and the pushing part 42 located above the clearance groove 11 pushes the wafer from the wafer tray to the receiving wafer tray.

[0071] The wafer transfer method between wafer cassettes employs the transfer device of any of the above embodiments. In use, the first wafer cassette 5 is positioned on the first positioning structure 2, and the second wafer cassette 6 is positioned on the second positioning structure 3. Based on the wafer transfer direction, a wafer ejector cassette for loading the wafer and a wafer receiver cassette for receiving the wafer are determined in the first wafer cassette 5 and the second wafer cassette 6. Subsequently, the drive translation structure 4 slides relative to the base 1 along the direction from the wafer ejector cassette to the wafer receiver cassette, causing the pusher 42 to move to the side of the wafer within the wafer ejector cassette. As the drive translation structure 4 continues to slide along this direction, the connecting arm 43 at least partially enters the clearance groove 11, and the pusher 42, located above the clearance groove 11, pushes the wafer from the wafer ejector cassette to the wafer receiver cassette. In this method, the "ejector" and "receiver" identities of the first wafer cassette 5 and the second wafer cassette 6 are determined according to the wafer cassette in which the wafer is located; therefore, the same device can accommodate wafer transfers in two opposite directions.

[0072] In some embodiments, when the wafer transfer direction is from the first wafer cassette 5 to the second wafer cassette 6, the first wafer cassette 5 serves as the transfer-out cassette, and the second wafer cassette 6 serves as the receiving cassette. The translation structure 4 slides along the direction from the first wafer cassette 5 to the second wafer cassette 6, so that the pushing part 42 pushes the wafer from the first wafer cassette 5 to the second wafer cassette 6. After the pushing part 42 moves to the side of the wafer in the first wafer cassette 5, the pushing surface 421 abuts against the edge of the multiple wafers and pushes the wafer along the wafer slot of the first wafer cassette 5 to the second wafer cassette 6. After leaving the first wafer cassette 5, the wafer passes through the transition support and guide surface, and then enters the corresponding wafer slot in the second wafer cassette 6. This process keeps the wafer moving along the slot direction during the transfer process, eliminating the need to lift the wafers one by one from the cassette.

[0073] In some embodiments, when the wafer transfer direction is from the second wafer cassette 6 to the first wafer cassette 5, the second wafer cassette 6 serves as the transfer-out cassette, and the first wafer cassette 5 serves as the receiving cassette. The translation structure 4 slides along the direction from the second wafer cassette 6 to the first wafer cassette 5, so that the pushing part 42 pushes the wafer from the second wafer cassette 6 to the first wafer cassette 5. After the pushing part 42 moves to the side of the wafer in the second wafer cassette 6, it pushes the wafer along the wafer slot of the second wafer cassette 6 to the first wafer cassette 5. If the clearance groove 11 includes two clearance sections extending to the first positioning structure 2 and the second positioning structure 3 respectively, the connecting arm 43 can enter the clearance section on the corresponding side during the reverse transfer process, so that the pushing part 42 reaches the wafer push position in the second wafer cassette 6. In this way, wafers that have completed cleaning, inspection, or other processes can be reverse-transferred into the original wafer cassette or another receiving wafer cassette without replacing the base 1 or setting up a separate reverse push mechanism.

[0074] In some embodiments, after the first wafer cassette 5 and the second wafer cassette 6 are positioned, the wafer slots of the first wafer cassette 5 and the wafer slots of the second wafer cassette 6 are made to correspond one-to-one along the sliding direction of the translation structure 4.

[0075] In some embodiments, when the drive translation structure 4 slides, the push part 42 remains above the clearance groove 11, the connecting arm 43 moves with the sliding part 41 and at least partially enters the clearance groove 11, the clearance groove 11 avoids the connecting arm 43, so as to allow the push part 42 to move between the out wafer cassette and the receiving wafer cassette and push the wafer translation.

[0076] In some embodiments, when the pushing part 42 pushes the wafer to translate, the pushing surface 421 of the pushing part 42 simultaneously abuts against the edges of multiple wafers to push the multiple wafers synchronously from the outgoing wafer cassette to the receiving wafer cassette. During the synchronous translation process, the relative arrangement order between the multiple wafers is defined by the wafer cassette slot and the pushing surface 421, reducing wafer sequence disorder or single wafer retention caused by wafer-by-wafer handling. If multiple spaced pushing parts are used, each pushing part can act on the corresponding wafer edge, so that each wafer has a relatively independent pushing position, which is suitable for situations where the spacing teeth in the wafer cassette are high or the spacing between adjacent wafers is small.

[0077] In some embodiments, during the translation of the wafer from the outgoing wafer cassette to the receiving wafer cassette, the wafer edge is supported by a transition support located between the first positioning structure 2 and the second positioning structure 3.

[0078] In some embodiments, when the wafer passes through the region between the first wafer cassette 5 and the second wafer cassette 6, the lateral displacement of the wafer relative to the sliding direction of the translation structure 4 is limited by the guide surface of the transition support.

[0079] In a specific usage scenario, the transfer device is placed on a cleanroom workbench. The operator first places the first wafer cassette 5, loaded with wafers, into the first positioning structure 2, ensuring that the corners and sidewalls of the first wafer cassette 5 abut against the corner limiting member 21 and the lateral limiting member 22, respectively. Then, the empty second wafer cassette 6 is placed into the second positioning structure 3, whereby the second wafer cassette 6 is similarly positioned by the corresponding corner limiting member 21 and lateral limiting member 22. After both cassettes are in place, the wafer slots in the first wafer cassette 5 and the wafer slots in the second wafer cassette 6 correspond along the sliding direction of the translation structure 4. Subsequently, the operator pushes the translation structure 4, causing the sliding part 41 to move along the sliding guide. The connecting arm 43 moves with the sliding part 41 and enters the clearance section extending into the first positioning structure 2. The pushing part 42 remains above the clearance groove 11 and moves to the side of the wafer in the first wafer cassette 5.

[0080] As the translation structure 4 continues to move, the pushing surface 421 of the pushing part 42 contacts the edges of multiple wafers, simultaneously pushing the wafers from the first wafer cassette 5 toward the second wafer cassette 6. After the wafers are removed from the first wafer cassette 5, their edges pass through the transition support located between the two wafer cassettes. The transition support supports the wafer edges, and the guide surface restricts the lateral displacement of the wafers. After the wafers continue to move, they enter the corresponding wafer slot in the second wafer cassette 6. When the translation structure 4 moves to the pushing termination position, the connecting arm 43 can enter the clearance section extending to the second positioning structure 3, allowing the pushing part 42 to push the wafers to the receiving position within the second wafer cassette 6. After the transfer is completed, the wafers are supported by the wafer slots in the second wafer cassette 6, and the operator can remove the second wafer cassette 6 containing the wafers from the second positioning structure 3.

[0081] In another specific application, when a wafer in the second wafer cassette 6 needs to be transferred back to the first wafer cassette 5, the second wafer cassette 6 acts as the outgoing wafer cassette, and the first wafer cassette 5 acts as the receiving wafer cassette. The operator drives the translation structure 4 to slide along the direction from the second wafer cassette 6 toward the first wafer cassette 5, causing the pushing part 42 to move to the side of the wafer in the second wafer cassette 6. During the sliding process in this direction, the connecting arm 43 enters the corresponding clearance section, which makes way for the connecting arm 43. The pushing part 42 remains above the clearance groove 11 and opposite the edge of the wafer. When the translation structure 4 is continued to be driven, the pushing part 42 pushes the wafer from the second wafer cassette 6 to the first wafer cassette 5. After passing through the transition support and guide surface, the wafer enters the corresponding wafer slot in the first wafer cassette 5. Thus, the same transfer device can change the sliding direction of the translation structure 4 according to the wafer cassette, realizing bidirectional translational transfer between the two wafer cassettes.

[0082] The foregoing description and accompanying drawings fully illustrate embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included or substituted for parts and features of other embodiments. Embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from its scope. The scope of the present disclosure is limited only by the appended claims, and the foregoing embodiments should be considered exemplary and non-limiting.

Claims

1. A transfer device for wafer translation between wafer cassettes, characterized in that, include: Base; The first positioning structure, located on the base, is used to position and place the first wafer cassette containing the wafer. The second positioning structure is disposed on the base and located on one side of the first positioning structure, and is used to position the second wafer cassette for placing the receiving wafer. The translation structure includes a sliding part slidably connected to the base, a pushing part connected to the sliding part, and a connecting arm connecting the sliding part and the pushing part. The pushing part is used to push the wafer to translate between the first wafer cassette and the second wafer cassette. The base has an open clearance groove that extends along the sliding direction of the translation structure to the first positioning structure and / or the second positioning structure. The pusher is located above the clearance slot, and the connecting arm moves with the sliding part and at least partially enters the clearance slot. The clearance slot is used to avoid the connecting arm so that the pusher moves to the first wafer cassette or the second wafer cassette and pushes the wafer to translate between the first wafer cassette and the second wafer cassette.

2. The transfer device according to claim 1, characterized in that, The base includes an intermediate connecting portion located between the first positioning structure and the second positioning structure, and the clearance groove includes a clearance section located on at least one side of the intermediate connecting portion, the clearance section extending from the end of the base toward the intermediate connecting portion; When the sliding part moves to the corresponding positioning structure, the connecting arm at least partially enters the avoidance section.

3. The transfer device according to claim 2, characterized in that, The clearance groove includes a first clearance section and a second clearance section located on both sides of the intermediate connecting part. The first clearance section and the second clearance section extend from opposite ends of the base toward the intermediate connecting part and are spaced apart through the intermediate connecting part. The first clearance section extends to the first wafer cassette placement area corresponding to the first positioning structure. The connecting arm moves with the sliding part and at least partially enters the first clearance section so that the pushing part can move to the side of the wafer in the first wafer cassette and push the wafer to translate.

4. The transfer device according to claim 3, characterized in that, The second clearance section extends to the second wafer cassette placement area corresponding to the second positioning structure. The connecting arm can move with the sliding part and at least partially enter the second clearance section so that the pushing part can move to the side of the wafer in the second wafer cassette and push the wafer to translate.

5. The transfer device according to claim 1, characterized in that, The driving section extends longitudinally along the wafer's arrangement direction; The connecting arm is connected to the middle region of the pusher and is located in the extension direction of the clearance groove so that it enters the clearance groove during the movement of the sliding part and drives the pusher to move along the top of the clearance groove.

6. The transshipment device according to claim 1, characterized in that, The pushing part has a pushing surface facing the wafer, which extends along the wafer arrangement direction and is used to simultaneously abut the edges of multiple wafers; The pushing surface is a continuous surface structure, or the pushing surface is provided with multiple pushing parts arranged at intervals along the wafer arrangement direction, and the multiple pushing parts are used to abut the edge of the corresponding wafer.

7. The transfer device according to claim 1, characterized in that, The base is equipped with a sliding guide, and the sliding part slides in cooperation with the sliding guide. The sliding guide is set parallel to the clearance groove, and the sliding guide is located on one side of the clearance groove.

8. The transfer device according to claim 7, characterized in that, The sliding guide includes a first sliding guide and a second sliding guide, which are respectively disposed on both sides of the width direction of the clearance groove, and the sliding part slides in cooperation with the first sliding guide and the second sliding guide.

9. The transfer device according to claim 1, characterized in that, The first positioning structure and the second positioning structure respectively include a corner limiting member and a lateral limiting member arranged along the outer periphery of the film box. The corner limiting member and the lateral limiting member cooperate to limit the position of the corresponding film box in the sliding direction of the translation structure and perpendicular to the sliding direction of the translation structure.

10. A method for wafer translation and transfer between wafer cassettes, characterized in that, The method employs the transfer apparatus for inter-cassette wafer translation as described in any one of claims 1 to 9, the method comprising: The first piece box is positioned and placed in the first positioning structure, and the second piece box is positioned and placed in the second positioning structure; Based on the wafer transfer orientation, a wafer transfer cassette for loading wafers and a wafer receiving cassette for receiving wafers are determined in the first wafer cassette and the second wafer cassette. The drive translation structure slides relative to the base along the direction from the outgoing wafer cassette toward the receiving wafer cassette, causing the pusher to move to the side of the wafer inside the outgoing wafer cassette; The translation structure continues to slide along the direction from the output wafer cassette toward the receiving wafer cassette, so that the connecting arm at least partially enters the clearance slot, and the pushing part located above the clearance slot pushes the wafer from the output wafer cassette to the receiving wafer cassette.

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