A silicon wafer traceable ingot plug device

Abstract

This invention provides a wafer insertion device for a traceable silicon wafer master rod, relating to the field of silicon wafer manufacturing technology. The insertion device includes a silicon rod station, two conveying components, two insertion baskets, and a driving component. The two conveying components are respectively located on opposite sides of the silicon rod station along its axial direction, and the two insertion baskets are respectively located on the side of each conveying component away from the silicon rod station. The driving component is connected to the conveying components and is used to drive the conveying components to move towards or away from the silicon rod station. This invention enables precise physical traceability of silicon wafers and master rods, improves insertion efficiency, reduces operating and maintenance costs, and enhances traceability reliability.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer manufacturing technology, and more specifically, to a wafer insertion device for a traceable silicon wafer master rod. Background Technology

[0002] In the manufacturing process of photovoltaic silicon wafers, the silicon rods that have been sliced ​​need to undergo processes such as debinding, wafer insertion, cleaning, and sorting. In related technologies, wafer insertion equipment typically uses a multi-rod alternating insertion method, where the production line simultaneously carries multiple silicon rods for wafer running and insertion. Once a basket is filled on any one line, a robotic arm picks it up and places it on a conveyor belt into a cleaning tank. After cleaning, the baskets are grouped and sent to a sorting machine for sorting and packaging. To trace the origin of the silicon wafers, some production lines install RFID chips on the cleaning baskets and RFID readers on the robotic arms that pick up the baskets. The baskets and the silicon wafers within them are identified by writing coded information into the RFID chips.

[0003] However, silicon wafers from different silicon rods are prone to mixing during the basket transfer process. Since each basket at the cleaning and unloading station may contain a mixture of wafers from different silicon rods, the sorting machine cannot identify which silicon rod a particular basket's wafer originated from. This results in inaccurate traceability of the wafers to their parent rod, and the electrical performance data of the parent rod (such as minority carrier lifetime, oxygen content, and carbon content) cannot be matched one-to-one with the silicon wafers, causing data confusion and distortion. The RFID (Radio Frequency Identification) chip installed on the basket undergoes simultaneous immersion in the corrosive solution and high-temperature drying process in the cleaning tank, making it highly susceptible to failure or damage. This renders the RFID chip a consumable item during production line operation, leading to high operating and maintenance costs. Summary of the Invention

[0004] The present invention aims to provide a wafer insertion device with traceable master rods for silicon wafers, which can achieve precise physical traceability between silicon wafers and master rods, improve insertion efficiency, reduce operation and maintenance costs, and improve traceability reliability.

[0005] The embodiments of the present invention can be implemented as follows: This invention provides a wafer insertion device for a traceable silicon wafer master rod, comprising: Silicon rod station, used to hold silicon rods that have been sliced; Two conveying components are respectively located on both sides of the silicon rod station along the axial direction; Two insertion baskets are respectively set on the side of the conveying assembly away from the silicon rod station. The conveying assembly is used to convey the silicon wafers after the silicon rods are sliced ​​on the silicon rod station to the insertion baskets for insertion. A driving component, which is connected to the conveying component, is used to drive the conveying component to move toward or away from the silicon rod station.

[0006] In an optional embodiment, each of the conveying components includes a drive motor, a drive roller assembly, and a conveyor belt wound around the drive roller assembly, wherein the drive motor is driven to drive the drive roller assembly to move the conveyor belt.

[0007] In an optional embodiment, the drive roller assembly includes an upper roller and a lower roller located below the upper roller, the lower roller being disposed on the discharge side of the silicon rod station; the upper rollers are multiple in number and are disposed horizontally on the feed side of the insertion basket; the conveyor belt is wound around the outside of the lower roller and the upper roller; the drive motor is connected to the upper roller and the lower roller respectively, so that the silicon wafers on the conveyor belt are guided by the lower roller and the upper roller to change from a vertical state to a horizontal state, so as to be inserted into the insertion basket.

[0008] In an optional embodiment, the conveying assembly further includes a support component; the upper roller and the lower roller are movably mounted on the support component; the support component is also provided with a moving device, which is drivenly connected to the upper roller and / or the lower roller, for driving the upper roller and / or the lower roller to move up and down relative to the support component, so as to adjust the tilt angle and horizontal position of the conveyor belt.

[0009] In an optional embodiment, the silicon rod at the silicon rod station includes, along the axial direction, end regions located on both sides and a central region located between the two end regions; when the conveying assembly clamps the silicon wafer in the end region, the conveyor belt is at a first tilt angle; when the conveying assembly clamps the silicon wafer in the central region, the conveyor belt is at a second tilt angle; wherein, the first tilt angle is greater than the second tilt angle.

[0010] In an optional embodiment, the end region accounts for 40% to 60% of the total length of the silicon rod; the first tilt angle ranges from 45° to 75°, and the second tilt angle ranges from 30° to 45°.

[0011] In an optional embodiment, the conveying assembly further includes a pressing device disposed in the conveyor belt area between the upper roller and the lower roller, for pressing the silicon wafer onto the conveyor belt.

[0012] In an optional embodiment, a force sensing device is also included, which is installed on the part of the lower roller that is in contact with the end face of the silicon rod at the silicon rod station, for detecting the pressure of the conveyor belt on the end face of the silicon rod.

[0013] In an optional embodiment, the conveyor belt is further provided with an extension section on the side near the insert basket; the conveying assembly also includes an unwinding device that clamps the extension section and is used to release or retract the extension section when the conveyor belt moves.

[0014] In an optional embodiment, the insertable flower basket includes multiple slots arranged vertically; it also includes a lifting device connected to the insertable flower basket for moving the insertable flower basket vertically so that each of the slots is sequentially aligned with the discharge end of the conveying component.

[0015] The beneficial effects of the silicon wafer traceable master rod insertion device provided in this embodiment of the invention include: The silicon wafer traceability master rod insertion device provided in this embodiment of the invention sets two conveying components on both sides of the silicon rod station along the axial direction, and sets two insertion baskets on the side away from the silicon rod station of each conveying component. This ensures that the silicon wafers of a single silicon rod are fed into their respective insertion baskets only through the conveying components on both sides, thereby ensuring that the silicon wafers in each insertion basket come from the same silicon rod. This achieves precise physical traceability between the silicon wafers and the master rod, eliminating the need to install RFID or other electronic tags on the baskets. It also avoids the failure and damage of RFID chips due to corrosion and high temperature during the cleaning and drying process, reducing operation and maintenance costs and improving traceability reliability. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the wafer insertion device for the traceable silicon wafer master rod provided in this embodiment.

[0018] Icons: 100-Insertion equipment; 10-Silicon rod station; 20-Transfer assembly; 211-Lower roller; 212-Upper roller; 22-Conveyor belt; 23-Supporting component; 24-Moving device; 30-Insertion basket; 40-Drive assembly; 200-Silicon rod; 201-End area; 202-Middle area. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0021] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0022] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0023] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0024] It should be noted that, where there is no conflict, the features in the embodiments of the present invention can be combined with each other.

[0025] The following detailed description of the overall structure, working principle, and technical effects of the silicon wafer traceable master rod insertion device provided by the present invention, through embodiments and in conjunction with the accompanying drawings, is a detailed account of these embodiments.

[0026] Please refer to Figure 1 The silicon wafer traceable master rod insertion device 100 provided by the present invention is applied to the insertion process of silicon wafers after degumming in the photovoltaic silicon wafer manufacturing process.

[0027] The wafer insertion equipment 100 includes a silicon rod station 10, two conveying components 20, two insertion baskets 30, and a drive component 40.

[0028] The silicon rod station 10 is located in the central area of ​​the equipment and is used to support and fix the silicon rods 200 that have been sliced ​​but not yet completely separated. The silicon rods 200 are placed horizontally along their axial direction on the silicon rod station 10, with their left and right end faces facing the conveying assemblies 20 on both sides.

[0029] Specifically, the silicon rod station 10 includes a support base and a clamping mechanism. The support base is used to lift the silicon rod 200 from below, and the clamping mechanism is used to fix the position of the silicon rod 200 from above or the side to prevent it from shifting during the wafer insertion process.

[0030] Two conveying components 20 are respectively disposed on both sides of the silicon rod station 10 along the axial direction, namely the left conveying component 20 and the right conveying component 20. Each conveying component 20 has an inlet end and an outlet end. The inlet end is disposed close to the silicon rod station 10 and is used to clamp silicon wafers from the corresponding end face of the silicon rod 200; the outlet end is disposed away from the silicon rod station 10 and is used to deliver the silicon wafers out. The conveying components 20 can convey the silicon wafers after slicing the silicon rod 200 on the silicon rod station 10 to the corresponding insertion basket 30 for insertion.

[0031] Two insertion baskets 30 are respectively located on the side of each conveying component 20 away from the silicon rod station 10, namely the left insertion basket 30 and the right insertion basket 30. The insertion baskets 30 are used to receive and contain the silicon wafers delivered by the conveying components 20.

[0032] The drive assembly 40 is connected to the conveying assembly 20 and is used to drive the conveying assembly 20 to move toward or away from the silicon rod station 10. The drive assembly 40 may be a power source including but not limited to a servo motor, stepper motor, or cylinder, and is connected to the moving parts in the conveying assembly 20. The moving parts convert the rotational motion of the power source into the linear motion of the conveying assembly 20 through, for example, a lead screw and nut mechanism, a gear and rack mechanism, or a synchronous belt mechanism. When the drive assembly 40 drives the conveying assembly 20 to move toward the silicon rod station 10, the conveying assembly 20 contacts the end face of the silicon rod 200 and maintains a certain contact pressure. After all the silicon wafers on the silicon rod 200 have been inserted, the drive assembly 40 drives the conveying assembly 20 away from the silicon rod station 10 and back to the initial position, waiting for the next silicon rod 200 to be loaded.

[0033] By placing two conveying components 20 on opposite sides of the silicon rod station 10 along its axial direction, and placing two insertion baskets 30 on the side of each conveying component 20 furthest from the silicon rod station 10, the silicon wafers from a single silicon rod 200 are fed into their respective insertion baskets 30 only through the left and right conveying components 20. All silicon wafers picked up by the left conveying component 20 enter the left insertion basket 30, and all silicon wafers picked up by the right conveying component 20 enter the right insertion basket 30. Furthermore, the silicon wafers in both insertion baskets 30 originate from the same silicon rod 200, thus ensuring a unique correspondence between the silicon wafers in each insertion basket 30 and the corresponding silicon rod 200, achieving precise physical traceability between the silicon wafers and the mother rod. This invention achieves traceability without any electronic tags, avoiding the failure and damage of RFID chips due to corrosive solutions and high temperatures during subsequent cleaning and drying processes, reducing operating and maintenance costs, and improving traceability reliability.

[0034] Each conveying assembly 20 includes a drive motor, a drive roller assembly, and a conveyor belt 22 wound around the drive roller assembly. The drive motor is driven by the drive roller assembly to move the conveyor belt 22. The drive motor, as a power source, can be a servo motor or a stepper motor, and its output shaft is connected to at least one drive roller in the drive roller assembly via a coupling, synchronous belt, or chain. The drive roller assembly includes at least one drive roller, which is rotated by the drive motor, thereby driving the conveyor belt 22 wound around the drive roller assembly to move cyclically.

[0035] The conveyor belt 22 is an annular belt wound around the outside of each roller in the drive roller assembly. The conveyor belt 22 can be made of elastic and wear-resistant materials such as polyurethane, rubber, or silicone. Its surface can be roughened or have anti-slip textures to increase friction with the silicon wafers and prevent slippage during transport. The outer surface of the conveyor belt 22 is used to directly contact the silicon wafers, peeling them from the end face of the silicon rod 200 and conveying them along the transport path towards the insertion basket 30.

[0036] Each roller in the drive roller assembly supports and tensions the conveyor belt 22 and guides its direction. By setting up a drive motor and drive roller assembly to move the conveyor belt 22, silicon wafers can be stably and continuously removed from the end face of the silicon rod 200 and transported to the insertion basket 30. The conveying speed and the tension of the conveyor belt 22 can be adjusted as needed to accommodate the insertion requirements of silicon wafers of different specifications.

[0037] Specifically, the drive roller assembly includes an upper roller 212 and a lower roller 211 located below the upper roller 212. The lower roller 211 is disposed on the discharge side of the silicon rod station 10. Multiple upper rollers 212 are arranged horizontally on the feed side of the insertion basket 30. A conveyor belt 22 is wound around the outside of the lower roller 211 and the upper roller 212. Drive motors are connected to the upper roller 212 and the lower roller 211 respectively, so that the silicon wafers on the conveyor belt 22 are guided by the lower roller 211 and the upper roller 212, changing from a vertical state to a horizontal state, so as to be inserted into the insertion basket 30.

[0038] Furthermore, there can be one or more lower rollers 211. In this embodiment, there is one lower roller 211, whose axial direction is perpendicular to the axial direction of the silicon rod 200. The outer peripheral surface of the lower roller 211 contacts the inner surface of the conveyor belt 22, providing support and guidance for the conveyor belt 22 at the feeding end. After the silicon wafer is peeled off from the end face of the silicon rod 200, it first enters the area of ​​the conveyor belt 22 near the lower roller 211. At this time, the silicon wafer is in a roughly vertical or inclined state.

[0039] Multiple upper rollers 212 are arranged horizontally on the feed side of the insert basket 30, i.e., close to the insert basket 30. The multiple upper rollers 212 are spaced apart horizontally, forming a horizontal conveying path. The axial direction of each upper roller 212 is parallel to the axial direction of the lower roller 211. The conveyor belt 22 starts from the lower roller 211, winds upwards around the area of ​​the upper rollers 212, and is sequentially wound around the outside of the multiple upper rollers 212. The conveyor belt 22 forms an inclined conveying section in the area between the lower roller 211 and the upper rollers 212, and a horizontal conveying section in the area between the multiple upper rollers 212.

[0040] The drive motors are connected to the upper roller 212 and the lower roller 211 respectively, wherein at least one upper roller 212 or lower roller 211 is the driving roller, and the rest are driven rollers.

[0041] The silicon wafers on the conveyor belt 22 are guided by the lower roller 211 and the upper roller 212, changing from a vertical to a horizontal state. Specifically, the silicon wafers are roughly vertical when they are peeled from the end face of the silicon rod 200. As they move upward along the lower roller 211 on the conveyor belt 22, they are in an inclined state, adhering to the conveyor belt 22. After passing through the inclined conveying section between the lower roller 211 and the first upper roller 212, the angle of the silicon wafer changes from vertical to inclined. After passing through the horizontal conveying section formed by multiple upper rollers 212, the silicon wafers are completely converted to a horizontal state so that they can be inserted into the slots of the insertion basket 30 in a horizontal posture. Through the layout design of the lower roller 211 and multiple upper rollers 212, the natural conversion of the silicon wafer posture is achieved, eliminating the need for an additional flipping mechanism. The structure is compact, the force is evenly distributed during the silicon wafer conversion process, and it is not easy to generate fragments.

[0042] Furthermore, the conveying assembly 20 also includes a support member 23. The upper roller 212 and the lower roller 211 are movably mounted on the support member 23. A moving device 24 is also provided on the support member 23. The moving device 24 is drively connected to the upper roller 212 and / or the lower roller 211, and is used to drive the upper roller 212 and / or the lower roller 211 to move up and down relative to the support member 23, thereby adjusting the inclination angle and horizontal position of the conveyor belt 22. It should be noted that the inclination angle of the conveyor belt 22 refers to the angle between the conveyor belt 22 and the horizontal plane.

[0043] It is understood that the support component 23 serves as the skeleton structure of the conveying assembly 20, used to support and install components such as the upper roller 212, lower roller 211, drive motor, and moving device 24. The support component 23 can be a frame structure, a plate structure, or a combination of both, and is made of metal materials such as aluminum alloy or stainless steel, possessing sufficient rigidity and strength.

[0044] The upper roller 212 and the lower roller 211 are movably mounted on the support member 23. Specifically, the two ends of the roller shafts of the upper roller 212 and the lower roller 211 are respectively mounted on the slider or the sliding bearing seat. The slider or the sliding bearing seat slides in cooperation with the guide rail or the slide groove provided on the support member 23, so that the upper roller 212 and the lower roller 211 can slide up and down along the support member 23.

[0045] Optionally, the moving device 24 can be driven only to the upper roller 212, changing the height difference between the upper roller 212 and the lower roller 211 by driving the upper roller 212 up and down, thereby adjusting the tilt angle of the conveyor belt 22; it can also be driven only to the lower roller 211, changing the height and tilt angle of the feed end by driving the lower roller 211 up and down; or it can be driven to both the upper roller 212 and the lower roller 211 simultaneously, allowing for more flexible adjustment of the tilt angle and feed / discharge height of the conveyor belt 22 by adjusting the positions of the upper roller 212 and the lower roller 211 respectively. With these settings, the posture of the conveyor belt 22 can be flexibly adjusted according to the wafer insertion process and the state of the silicon wafers, improving the adaptability and conveying stability of the equipment.

[0046] Specifically, the moving device 24 can be a linear drive mechanism such as a screw mechanism, an electric telescopic rod, or a pneumatic telescopic rod. In this embodiment, the moving device 24 is a screw mechanism, including a screw and a nut seat that is threadedly engaged with the screw. The nut seat is fixedly connected to the slider on which the upper roller 212 or the lower roller 211 is mounted. The screw is driven to rotate by a motor, which drives the nut seat and the slider to move along the screw axis, thereby realizing the up-and-down movement of the upper roller 212 or the lower roller 211 relative to the support member 23.

[0047] The tilt angle and horizontal position of the conveyor belt 22 can be adjusted by driving the upper roller 212 and / or the lower roller 211 to move up and down relative to the support member 23 via the moving device 24. When the lower roller 211 moves upward relative to the upper roller 212, the height difference between the lower roller 211 and the upper roller 212 decreases, and the tilt angle of the tilted section of the conveyor belt 22 becomes smaller; when the lower roller 211 moves downward relative to the upper roller 212, the tilt angle becomes larger. When the conveyor assembly 20 needs to move towards the silicon rod station 10 for feeding, the entire conveyor assembly 20 moves horizontally as a whole with the support member 23, and the feed end of the conveyor belt 22 maintains contact pressure on the end face of the silicon rod 200. Through the movable upper roller 212 and lower roller 211 structure, the tilt angle and horizontal position of the conveyor belt 22 can be flexibly adjusted according to the wafer insertion process and the state of the silicon wafer, improving the adaptability of the equipment and the stability of silicon wafer conveying.

[0048] In this embodiment, the silicon rod 200 on the silicon rod station 10 includes, along its axial direction, end regions 201 located on both sides and a central region 202 located between the two end regions 201. When the conveying assembly 20 clamps the silicon wafer in the end region 201, the conveyor belt 22 is at a first tilt angle. When the conveying assembly 20 clamps the silicon wafer in the central region 202, the conveyor belt 22 is at a second tilt angle. The first tilt angle is greater than the second tilt angle.

[0049] The silicon rod 200 at silicon rod station 10 can be divided into three regions along its axial direction: end regions 201 located on both sides and a central region 202 located between the two end regions 201. The end regions 201 correspond to the early stage of the wafer insertion process, i.e., the region where the transfer assembly 20 begins to clamp silicon wafers from both ends of the silicon rod 200; the central region 202 corresponds to the later stage of the wafer insertion process, i.e., the region where the transfer assembly 20 gradually advances towards the center of the silicon rod 200 and clamps the middle portion of the silicon wafers. The specific proportions of the end regions 201 and the central region 202 can be determined based on the total length of the silicon rod 200.

[0050] When the conveyor assembly 20 picks up the silicon wafer in the end region 201, that is, in the early stage of the wafer insertion process, the conveyor belt 22 is at a first tilt angle. At this time, the tilt angle of the conveyor belt 22 is relatively large, and the silicon wafer is in a relatively tilted state on the conveyor belt 22. The larger tilt angle facilitates the rapid drainage of water adhering to the surface of the silicon wafer under the action of gravity, reducing the residence time of water on the surface of the silicon wafer, thereby reducing the risk of impurities such as adhesives mixed in the water depositing on the surface of the silicon wafer and forming stains. At the same time, in the early stage, there is more water on the surface of the silicon wafer, and the friction between the silicon wafer and the conveyor belt 22 is greater. Using a larger tilt angle will not cause the silicon wafer to slip.

[0051] When the conveyor assembly 20 picks up the silicon wafer in the central region 202, that is, in the later stage of the wafer insertion process, the conveyor belt 22 is at a second tilt angle. The first tilt angle is greater than the second tilt angle. As the wafer insertion process progresses, the silicon wafer is exposed to air for a longer period, the surface water film gradually evaporates and decreases, and the friction between the silicon wafer and the conveyor belt 22 weakens accordingly. Adjusting the conveyor belt 22 to a smaller tilt angle at this time increases the normal pressure component of the silicon wafer on the surface of the conveyor belt 22, thereby increasing the friction between the silicon wafer and the conveyor belt 22, effectively preventing the silicon wafer from slipping during transport, reducing the risk of breakage, and ensuring the stability of the silicon wafer transport.

[0052] By adjusting the different tilt angles of the conveyor belt 22 according to different areas of the silicon rod 200, a large tilt angle can be used to quickly drain water and reduce surface contamination in the early stage, while a small tilt angle can be used to increase friction and prevent slippage in the later stage, thus taking into account both the requirements of silicon wafer surface quality and conveying stability.

[0053] Specifically, the end region 201 accounts for 40% to 60% of the total length of the silicon rod 200; the first tilt angle ranges from 45° to 75°, and the second tilt angle ranges from 30° to 45°.

[0054] The end regions 201 account for 40% to 60% of the total length of the silicon rod 200, meaning the total length of the two end regions 201 accounts for a proportion of the total length of the silicon rod 200 within this range. Correspondingly, the middle region 202 is the remaining portion, accounting for 40% to 60% of the total length of the silicon rod 200. This proportion is determined based on the statistical laws governing the distribution and evaporation of moisture on the silicon wafer surface during actual production.

[0055] The first tilt angle, i.e., the tilt angle of the conveyor belt 22 when clamping the silicon wafer in the end region 201, ranges from 45° to 75°. Within this angle range, moisture on the surface of the silicon wafer can be effectively drained downwards under the action of gravity, while the silicon wafer will not slip due to an excessively large angle. When the tilt angle is less than 45°, the drainage effect is not ideal; when the tilt angle is greater than 75°, there is a risk that the silicon wafer will slip off the conveyor belt 22.

[0056] The second tilt angle, i.e., the tilt angle of the conveyor belt 22 when clamping the silicon wafer in the middle region 202, ranges from 30° to 45°. Within this angle range, the positive pressure of the silicon wafer on the conveyor belt 22 is moderate, providing sufficient friction to prevent the silicon wafer from slipping. When the tilt angle is less than 30°, the conveyor belt 22 tends to be horizontal, and residual moisture on the silicon wafer surface is not easily discharged; when the tilt angle is greater than 45°, the friction is insufficient when there is less water film in the later stages, posing a risk of wafer slippage.

[0057] The specific values ​​of the first and second tilt angles can be selected and adjusted within the aforementioned range based on factors such as silicon wafer specifications, conveyor belt 22 material, and surface roughness. By setting reasonable area division ratios and tilt angle ranges, the optimal posture of the conveyor belt 22 can be automatically or manually adjusted at different wafer insertion stages, ensuring a balance between drainage and anti-slip effects.

[0058] Furthermore, the conveying assembly 20 also includes a pressing device disposed in the area of ​​the conveyor belt 22 between the upper roller 212 and the lower roller 211, for pressing the silicon wafer onto the conveyor belt 22.

[0059] The pressing device is located in the area of ​​the conveyor belt 22 between the upper roller 212 and the lower roller 211, specifically at the position corresponding to the inclined conveying section of the conveyor belt 22. In this embodiment, the pressing device is a high-pressure air blowing device, including an air source, an air blowing pipeline, and an air blowing nozzle. The air blowing nozzle is located above the conveyor belt 22 and blows air towards the outer surface of the conveyor belt 22. When the high-pressure gas is ejected from the air blowing nozzle onto the silicon wafer on the conveyor belt 22, the gas applies a force towards the conveyor belt, thereby pressing the silicon wafer firmly onto the conveyor belt.

[0060] Optionally, the conveyor assembly 20 may also be equipped with a vacuum adsorption device, including a vacuum generator, a suction pipe, and adsorption holes. Multiple adsorption holes are formed on the conveyor belt 22, extending through the thickness of the conveyor belt 22. The suction pipe is connected to the vacuum generator and leads to the adsorption hole area on the back side of the conveyor belt 22. When the vacuum generator operates, a negative pressure is generated at the adsorption holes on the back side of the conveyor belt 22. This negative pressure is transmitted through the adsorption holes to the front side of the conveyor belt 22, tightly adsorbing the silicon wafer onto the surface of the conveyor belt 22.

[0061] In this embodiment, the conveying assembly 20 further includes a force sensing device. The force sensing device is installed on the lower roller 211 at the portion that contacts the end face of the silicon rod 200 on the silicon rod station 10, and is used to detect the pressure of the conveyor belt 22 on the end face of the silicon rod 200. Specifically, both ends of the lower roller 211 are mounted via bearing seats, and the force sensing device is disposed between the bearing seats and the support component 23, or the force sensing device is integrated into the surface or interior of the lower roller 211. The force sensing device can be a pressure sensor, a strain gauge force sensor, or a piezoelectric force sensor, etc.

[0062] A conveyor belt 22 is wound around the outside of the lower roller 211, and its outer surface is in direct contact with the end face of the silicon rod 200. When the drive assembly 40 drives the conveyor assembly 20 to move toward the silicon rod station 10, the outer surface of the conveyor belt 22 at the lower roller 211 contacts the end face of the silicon rod 200 and generates pressure. This pressure is transmitted to the lower roller 211 through the conveyor belt 22 and is then detected by a force sensor installed at the lower roller 211. The force sensor outputs the detected pressure signal to the control unit of the equipment, and the control unit controls the feed speed and feed amount of the drive assembly 40 based on the pressure signal.

[0063] By incorporating a force sensor, the pressure of the conveyor belt 22 on the end face of the silicon rod 200 can be monitored in real time. When the pressure is too high, the control unit can reduce the feed speed or stop the feed to prevent damage to the silicon wafer due to excessive pressure. When the pressure is too low, the control unit can increase the feed speed to ensure reliable contact between the conveyor belt 22 and the end face of the silicon rod 200, ensuring that the silicon wafer can be stably peeled and conveyed. The force sensor enables closed-loop control of the feed of the conveyor assembly 20, improving the automation and safety of the wafer insertion process.

[0064] In this embodiment, an extension section is provided on the side of the conveyor belt 22 near the insertion basket 30. The conveyor assembly 20 also includes an unwinding device. The unwinding device clamps the extension section and is used to release or retract the extension section as the conveyor belt 22 moves.

[0065] It is understandable that the overall path length of the conveyor belt 22 will change as the silicon rod 200 is consumed during the wafer insertion process, requiring the conveyor assembly 20 to move towards the silicon rod station 10. To accommodate this length change, the conveyor belt 22 has an extra extension section near the discharge end of the insertion basket 30. The length of the extension section should at least meet the movement requirements of the conveyor assembly 20 throughout the entire wafer insertion stroke.

[0066] Specifically, the unwinding device includes a pair of clamping rollers and a take-up / unwind reel or tensioning wheel mechanism. The clamping rollers clamp the extended section from both sides and can provide a constant clamping force via springs or cylinders. The take-up / unwind reel is connected to the end of the extended section and is rotatably mounted on the support member 23. When the conveyor assembly 20 moves towards the silicon rod station 10, the overall path length of the conveyor belt 22 increases, requiring the release of some length from the extended section. At this time, the unwinding device releases the clamping force or actively releases the conveyor belt 22 via the take-up / unwind reel, allowing the conveyor belt 22 in the extended section to supplement the working path. When the conveyor assembly 20 returns to its initial position after inserting the wafer, the overall path length of the conveyor belt 22 decreases, and the excess length needs to be retracted. At this time, the unwinding device retracts the excess conveyor belt 22 back into the extended section, maintaining the conveyor belt 22 at an appropriate tension.

[0067] By setting an extended section and an unwinding device, the conveyor belt 22 maintains appropriate tension during the movement of the conveyor assembly 20, and will not become loose or over-tensioned due to changes in path length, thus ensuring the smooth operation of the conveyor belt 22 and the reliability of silicon wafer conveying.

[0068] Furthermore, the insert basket 30 includes multiple slots arranged vertically. The inserting device 100 also includes a lifting device connected to the insert basket 30, which is used to move the insert basket 30 vertically so that each slot is sequentially aligned with the discharge end of the conveying assembly 20.

[0069] The lifting device can be a screw lifting mechanism, a cylinder lifting mechanism, or a linear motor lifting mechanism, etc. The lifting device includes a fixed base and a movable end. The fixed base is mounted on the equipment frame or base, and the movable end is fixedly connected to the insert basket 30. The lifting device drives the insert basket 30 to move vertically, moving the height of one slot spacing at a time.

[0070] During the wafer insertion process, the discharge end of the conveying assembly 20 is fixed in position, and the silicon wafer is fed out from the discharge end in a horizontal posture. The lifting device drives the insertion basket 30 to gradually rise or fall, so that each empty slot of the insertion basket 30 is aligned with the discharge end of the conveying assembly 20 in sequence. When a slot is full of silicon wafers or a wafer insertion is completed, the lifting device drives the insertion basket 30 to move one slot, so that the next empty slot is aligned with the discharge end, ready to receive the next silicon wafer.

[0071] By setting up an insertion basket 30 with multiple slots and a lifting device that moves the insertion basket 30 up and down, silicon wafers can be inserted layer by layer in the insertion basket 30 from bottom to top or from top to bottom, making full use of the storage space of the insertion basket 30. The lifting device can automatically adjust the height of the insertion basket 30 according to the insertion progress, so that the discharge end of the conveying component 20 is always aligned with the slot position of the wafer to be inserted, improving the automation level and insertion accuracy of the insertion process.

[0072] The working principle and process of the silicon wafer traceable master rod insertion device 100 provided in this embodiment of the invention are as follows: The wafer-cut silicon ingot 200 is placed on the silicon ingot station 10, and is fixed horizontally along its axis, with its left and right end faces facing the conveyor assemblies 20 on both sides. The drive assembly 40 drives the two conveyor assemblies 20 to move synchronously toward the silicon ingot station 10, so that the conveyor belts 22 of the two conveyor assemblies 20 contact the left and right end faces of the silicon ingot 200 respectively. A force sensor detects the pressure of the conveyor belts 22 on the end faces of the silicon ingot 200 in real time and feeds the pressure signal back to the control unit. The control unit controls the feed speed and feed amount of the drive assembly 40 based on this signal, keeping the pressure of the conveyor belts 22 on the end faces of the silicon ingot 200 constant. The drive motor drives the drive roller assembly to rotate, and the drive roller assembly drives the conveyor belts 22 to move cyclically. The outer surface of the conveyor belts 22 contacts the end faces of the silicon ingot 200, and the silicon wafers are peeled off one by one from the end faces of the silicon ingot 200 by friction and transported along the conveyor path.

[0073] The silicon wafer is initially peeled off in a roughly vertical position and moves upward along the lower roller 211 on the conveyor belt 22. As it passes through the inclined conveyor section between the lower roller 211 and the upper roller 212, the wafer's orientation gradually changes from vertical to inclined. A wafer pressing device operates in this area, applying a force towards the conveyor belt 22 using high-pressure air to press the wafer firmly against the belt 22 surface, preventing slippage and simultaneously removing any residual moisture from the wafer surface. The wafer continues along the conveyor belt 22 through a horizontal conveyor section formed by multiple upper rollers 212, eventually becoming completely horizontal for insertion into the insertion basket 30.

[0074] During the wafer insertion process, as the silicon rod 200 is gradually consumed, the conveyor assembly 20, driven by the drive assembly 40, continuously feeds horizontally towards the center of the silicon rod station 10. The extended section of the conveyor belt 22 near the insertion basket 30 works in conjunction with the unwinding device to release the required length when the conveyor belt 22 moves and to retract the excess length when the conveyor belt 22 retracts, keeping the conveyor belt 22 at an appropriate tension at all times.

[0075] After all silicon wafers on the silicon rod 200 have been inserted, the drive assembly 40 drives the two conveying assemblies 20 to move away from the silicon rod station 10 and back to their initial positions, waiting for the next silicon rod 200 to be loaded. During this process, the silicon wafers picked up by the left and right conveying assemblies 20 enter the insertion baskets 30 on the left and right sides respectively. The silicon wafers in both insertion baskets 30 originate from the same silicon rod 200, thus achieving precise physical traceability between the silicon wafers and the master rod.

[0076] The beneficial effects of the silicon wafer traceable master rod insertion device 100 provided in this embodiment of the invention are as follows: By setting two conveying components 20 on both sides of the silicon rod station 10 along the axial direction, and setting two insertion baskets 30 on the side of each conveying component 20 away from the silicon rod station 10, the silicon wafers of a single silicon rod 200 are fed into their respective insertion baskets 30 only through the conveying components 20 on the left and right sides. This ensures that the silicon wafers in each insertion basket 30 come from the same silicon rod 200, achieving precise physical traceability between the silicon wafers and the mother rod. There is no need to install RFID or other electronic tags on the baskets, avoiding the failure and damage of RFID chips due to immersion in corrosive solutions and high temperatures during subsequent cleaning and drying processes. This reduces operating and maintenance costs and improves traceability reliability.

[0077] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A wafer insertion device for a traceable silicon wafer master rod, characterized in that, include: Silicon rod station, used to hold silicon rods that have been sliced; Two conveying components are respectively located on both sides of the silicon rod station along the axial direction; Two insertion baskets are respectively set on the side of the conveying assembly away from the silicon rod station. The conveying assembly is used to convey the silicon wafers after the silicon rods are sliced ​​on the silicon rod station to the insertion baskets for insertion. A driving component, which is connected to the conveying component, is used to drive the conveying component to move toward or away from the silicon rod station.

2. The wafer insertion device for a traceable silicon wafer master rod according to claim 1, characterized in that, Each of the conveying components includes a drive motor, a drive roller assembly, and a conveyor belt wound around the drive roller assembly. The drive motor is driven to the drive roller assembly to move the conveyor belt.

3. The wafer insertion device for a traceable silicon wafer master rod according to claim 2, characterized in that, The drive roller assembly includes an upper roller and a lower roller located below the upper roller, with the lower roller positioned on the discharge side of the silicon rod station. Multiple upper rollers are arranged horizontally on the feed side of the insertion basket. A conveyor belt is wound around the outer sides of the lower and upper rollers. A drive motor is connected to both the upper and lower rollers to guide the silicon wafers on the conveyor belt from a vertical to a horizontal position, allowing them to be inserted into the insertion basket.

4. The wafer insertion device for a traceable silicon wafer master rod according to claim 3, characterized in that, The conveying assembly further includes a support component; the upper roller and the lower roller are movably mounted on the support component; the support component is also provided with a moving device, which is drivenly connected to the upper roller and / or the lower roller, for driving the upper roller and / or the lower roller to move up and down relative to the support component, so as to adjust the tilt angle and horizontal position of the conveyor belt.

5. The wafer insertion device for a traceable silicon wafer master rod according to claim 4, characterized in that, The silicon rod at the silicon rod station includes, along its axial direction, end regions located on both sides and a central region located between the two end regions; when the conveying assembly clamps the silicon wafer in the end region, the conveyor belt is at a first tilt angle; when the conveying assembly clamps the silicon wafer in the central region, the conveyor belt is at a second tilt angle; wherein, the first tilt angle is greater than the second tilt angle.

6. The wafer insertion device for a traceable silicon wafer master rod according to claim 5, characterized in that, The end region accounts for 40% to 60% of the total length of the silicon rod; the first tilt angle ranges from 45° to 75°, and the second tilt angle ranges from 30° to 45°.

7. The wafer insertion device for a traceable silicon wafer master rod according to claim 3, characterized in that, The conveying assembly further includes a pressing device disposed in the conveyor belt area between the upper roller and the lower roller, for pressing the silicon wafer onto the conveyor belt.

8. The wafer insertion device for a traceable silicon wafer master rod according to claim 3, characterized in that, The conveying assembly also includes a force sensing device, which is installed on the part of the lower roller that contacts the end face of the silicon rod at the silicon rod station, and is used to detect the pressure of the conveyor belt on the end face of the silicon rod.

9. The wafer insertion device for a traceable silicon wafer master rod according to claim 2, characterized in that, The conveyor belt is also provided with an extension section on the side near the insert flower basket; the conveyor assembly also includes an unwinding device, which clamps the extension section and is used to release or retract the extension section when the conveyor belt moves.

10. The wafer insertion device for a traceable silicon wafer master rod according to claim 1, characterized in that, The insertable flower basket includes multiple slots arranged vertically; it also includes a lifting device connected to the insertable flower basket and used to move the insertable flower basket vertically so that each of the slots is sequentially aligned with the discharge end of the conveying component.

Images