Wafer loading mechanism

Abstract

This invention relates to the technical field of semiconductor processing equipment, specifically to a wafer loading mechanism. Its wafer transfer assembly includes a wafer retaining ring with a stop on its inner sidewall. The inner sidewall of the stop has a slot, and the inner wall of the slot has a resilient pin. An elastic pressure member is provided on the wafer retaining ring, which pushes the wafer into the slot and compresses the elastic pin, thus clamping the wafer. A lever is integrated on the wafer pick-up assembly, which drives the elastic pressure member to switch to a released state. This allows the wafer pick-up assembly to transfer the wafer onto the wafer retaining ring, or allows the elastic pin to push the wafer off the slot from the wafer retaining ring, enabling the wafer pick-up assembly to remove the wafer from the wafer retaining ring. This invention can both clamp and fix the wafer radially and limit axial displacement, increasing the reliability of wafer fixation.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor processing equipment, and more specifically to a wafer loading mechanism. Background Technology

[0002] A die bonder, also known as a die attacher, wafer bonding machine, or chip bonding machine, is one of the core pieces of equipment in the semiconductor back-end packaging and testing process. Its main function is to pick up individual wafers attached to the blue film on the wafer and accurately mount them to designated positions such as lead frames, PCB substrates, or ceramic substrates through a high-precision automated process.

[0003] The wafer consists of a rigid outer ring, a blue film fixed inside the rigid outer ring, and individual wafers attached to the upper surface of the blue film. When loading wafers, the wafers need to be transferred from the wafer feeding assembly to the wafer transfer assembly for fixation. Existing wafer transfer assemblies only press the wafers radially. However, due to factors such as machine vibration, failure of radial clamping components, and wafer picking along the wafer axis in subsequent processes, there is a risk that the wafers may not be completely clamped, which in turn affects the accuracy of wafer picking in subsequent processes. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer loading mechanism that addresses the problems existing in the prior art.

[0005] The wafer loading mechanism includes a wafer feeding assembly, a wafer picking assembly, a wafer transfer assembly, and a wafer picking assembly connected in sequence. The wafer transfer assembly includes a wafer retaining ring with a stop on it. The inner wall of the stop has a slot, and the inner wall of the slot has a spring pin. The wafer retaining ring has a spring pressure member that can push the wafer into the slot and compress the spring pin, thus pressing the wafer. The wafer picking assembly integrates a lever that can drive the spring pressure member to switch to a released state, so that the wafer picking assembly can transport the wafer onto the wafer retaining ring, or so that the spring pin can push the wafer on the wafer retaining ring out of the slot, allowing the wafer picking assembly to remove the wafer from the wafer retaining ring. The elastic pressure member includes two pressure rods. The middle part of the pressure rods is hinged to the wafer fixing ring via a pivot. The ends of the two pressure rods that are far apart from each other are respectively provided with compression springs. One end of the compression spring presses against the wafer fixing ring, and the other end of the compression spring presses against the pressure rod, so that the two pressure rods are in a figure-eight shape.

[0006] In one specific embodiment, the wafer transfer assembly further includes an XY-axis adjustment stage, on which a turntable is disposed, and the wafer fixing ring is disposed on the turntable.

[0007] In one specific embodiment, the wafer fixing ring is a fixed wafer fixing ring or a rotatable wafer fixing ring, and the turntable is provided with one or both of the fixed wafer fixing ring and the rotatable wafer fixing ring.

[0008] In one specific embodiment, the fixed wafer holding ring includes an adapter plate disposed at the edge of the turntable, a cantilever ring disposed on the adapter plate, the top of the cantilever ring being provided with a support surface for placing the wafer and a stepped groove for avoiding the wafer picking assembly, and the stop block and the elastic pressure member being disposed opposite to each other on the top of the cantilever ring.

[0009] In one specific embodiment, the rotatable wafer holding ring includes a cantilever support ring disposed at the edge of the turntable, a wafer synchronizing wheel rotatably disposed on the cantilever support ring, a cantilever ring disposed on the wafer synchronizing wheel, the top of the cantilever ring being provided with a support surface for placing the wafer and a stepped groove for avoiding the wafer picking assembly, and the stop block and the elastic pressure member being disposed opposite to each other on the top of the cantilever ring; a wafer driving component is disposed on the turntable, and the wafer driving component is connected to the wafer synchronizing wheel via a synchronous belt drive.

[0010] In one specific embodiment, the wafer picking assembly includes a transport X-axis linear module, a support arm is provided on the drive plate of the transport X-axis linear module, a transport Z-axis linear module is provided on the support arm, and a transport cylinder gripper capable of gripping the wafer is provided on the transport Z-axis linear module; a push Y-axis linear module is provided on the support arm, and a lever is provided on the drive plate of the push Y-axis linear module. The push Y-axis linear module can drive the lever to simultaneously press the ends of the two pressure rods that are close to each other, so that the two pressure rods switch to a released state.

[0011] In one specific embodiment, the wafer feeding assembly includes a feeding bin and a bin Z-axis linear module. The bin Z-axis linear module can drive the feeding bin to move up and down. The feeding bin is provided with multiple carrier plates, and the wafer is placed on the carrier plates.

[0012] In one specific embodiment, the wafer picking assembly includes a lifting linear module, on which a pin is provided on the drive plate of the lifting linear module. The lifting linear module can drive the pin to pierce the blue film of the wafer and lift the wafer. The wafer picking assembly also includes a transfer pen, which can pick up the wafer lifted by the pin and transfer it to the next working mechanism.

[0013] In one specific embodiment, the wafer picking assembly further includes a positioning camera, which acquires the position information of the wafer on the blue film, and the transfer pen picks up the wafer according to the position information; the positioning camera further includes a coaxial light source, which is a combination of multiple independently controllable light sources.

[0014] The present invention has at least the following beneficial effects: The wafer retaining ring structure provided by the present invention can both press and fix the wafer radially and limit the wafer's axial displacement, thereby increasing the reliability of wafer fixation. Furthermore, the structure of providing elastic pins on the inner wall of the slot makes it very convenient to place and remove wafers on the wafer retaining ring. Attached Figure Description

[0015] Figure 1 This is an overall structural diagram of one embodiment of the present invention.

[0016] Figure 2 This is an assembly structure diagram of a wafer feeding assembly in one embodiment of the present invention.

[0017] Figure 3 This is an assembly structure diagram of a wafer feeding assembly in one embodiment of the present invention.

[0018] Figure 4 This is an assembly structure diagram of a wafer transfer assembly in one embodiment of the present invention.

[0019] Figure 5 This is an assembly structure diagram of a fixed wafer fixing ring in one embodiment of the present invention.

[0020] Figure 6 This is an assembly structure diagram of a rotatable wafer fixing ring and a turntable in one embodiment of the present invention.

[0021] Figure 7 This is an assembly structure diagram of the lifting linear module, voice coil motor, and vacuum suction rod in one embodiment of the present invention.

[0022] Figure 8 This is a structural diagram showing the relationship between the adsorption hole, the needle outlet hole, and the ejector pin on the vacuum suction rod in one embodiment of the present invention.

[0023] Figure 9 This is an assembly structure diagram of the voice coil motor and vacuum suction rod in one embodiment of the present invention.

[0024] Figure 10 This is an assembly structure diagram of the clamping block and the ejector pin in one embodiment of the present invention.

[0025] Figure 11 This is an enlarged view of the assembly structure of the clamping block and the ejector pin in one embodiment of the present invention.

[0026] Figure 12This is an assembly structure diagram of the clamping cap, clamping block and ejector pin in one embodiment of the present invention.

[0027] Figure 13 This is an assembly structure diagram of the wafer picking X-axis linear module, positioning camera, ZR-axis actuator and handling suction pen in one embodiment of the present invention.

[0028] Reference numerals: 1. Working platform; 2. Wafer feeding assembly; 21. Z-axis linear module of the hopper; 22. Feeding hopper; 221. Handle; 23. Carrier plate; 24. Protective cover; 3. Wafer picking assembly; 3. X-axis linear module of the transport; 31. Support arm; 32. Z-axis linear module of the transport; 33. Transport cylinder gripper; 34. Clamping part; 341. Y-axis linear module of the pusher; 35. Lever; 36. Wafer transfer assembly; 4. XY-axis adjustment table; 41. Turntable; 42. Wafer fixing ring; 43. Adapter plate; 431. Cantilever ring; 432. Step groove; 4321. Cantilever support ring; 433. Wafer synchronous wheel; 434. Circular drive component 435, synchronous belt 436, stop block 44, slot 441, elastic pin 45, elastic pressure component 46, pressure rod 461, compression spring 462, wafer picking assembly 5, adjusting Y-axis linear module 51, lifting linear module 52, voice coil motor 53, clamping block 531, clamping cap 532, hollow part 533, vacuum suction rod 54, suction hole 541, needle outlet hole 542, vacuum fixing seat 543, vacuum cap 544, anti-rotation plane 545, ejector pin 55, wafer picking X-axis linear module 56, positioning camera 57, ZR axis actuator 58, handling suction pen 59. Detailed Implementation

[0029] To enable those skilled in the art to better understand the technical solutions of the present invention, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0030] Please see Figure 1 The present invention provides a wafer loading mechanism, including a working platform 1, on which a wafer feeding component 2, a wafer picking component 3, a wafer transfer component 4 and a wafer picking component 5 are sequentially connected.

[0031] Please see Figure 2The wafer feeding assembly 2 includes a Z-axis linear module 21 mounted on the work platform 1. The drive end of the Z-axis linear module 21 is equipped with a feeding bin 22, which can be driven to move up and down. The feeding bin 22 contains multiple layers of carrier plates 23. Wafers fully coated with wafers are manually placed onto the carrier plates 23. A protective cover 24 surrounds the feeding bin 22 on the work platform 1 to improve safety.

[0032] In this embodiment of the invention, to facilitate the replacement of multiple wafers at one time, the feed bin 22 and the feed bin Z-axis linear module 21 are configured as detachable structures. The top of the feed bin 22 is provided with a handle 221, and the operator can directly replace the entire feed bin 22 to replace multiple wafers at one time.

[0033] Please see Figure 3 The wafer handling assembly 3 includes a transport X-axis linear module 31 mounted on the work platform 1. A support arm 32 is mounted on the drive plate of the transport X-axis linear module 31, and a transport Z-axis linear module 33 is mounted on the support arm 32. A transport cylinder gripper 34 is mounted on the transport Z-axis linear module 33. When handling wafers in the feed hopper 22, the transport X-axis linear module 31 drives the gripping portion 341 of the transport cylinder gripper 34 to extend into the feed hopper 22. The gripping portion 341 of the transport cylinder gripper 34 then grips the wafer on the carrier plate 23, or places the wafer on the carrier plate 23 and then releases it.

[0034] In this embodiment, when the transfer cylinder gripper 34 clamps the wafer, the gripping portion 341 of the transfer cylinder gripper 34 clamps onto the rigid outer ring of the wafer to prevent clamping onto the wafer on the blue film. Since the width of the rigid outer ring is limited, the gripping portion 341 of the transfer cylinder gripper 34 is configured as an arc shape adapted to the rigid outer ring of the wafer to increase the gripping area and improve gripping stability.

[0035] Please see Figure 4 The wafer transfer assembly 4 includes an XY-axis adjustment stage 41 mounted on the work platform 1. A turntable 42 is mounted on the XY-axis adjustment stage 41, and a wafer retaining ring 43 is mounted on the turntable 42. After the transport cylinder gripper 34 takes out the wafer covered with wafers from the feed bin 22, it is driven by the transport X-axis linear module 31 and the transport Z-axis linear module 33 to place the wafer onto the wafer retaining ring 43 for fixation, and then the turntable 42 transfers it to the position where it docks with the wafer picking assembly 5.

[0036] Please see Figure 5The wafer retaining ring 43 is provided with a stop 44, the inner side wall of the stop 44 is provided with a slot 441, the inner wall of the slot 441 is provided with an elastic pin 45, and the wafer retaining ring 43 is provided with an elastic pressure member 46. Under the action of its own elastic force, the elastic pressure member 46 can push the wafer placed on the wafer retaining ring 43 into the slot 441 and compress the elastic pin 45.

[0037] Specifically, in this embodiment, the elastic pressure member 46 includes two pressure rods 461. The middle part of the pressure rods 461 is hinged to the wafer fixing ring 43 through a rotating shaft. The ends of the two pressure rods 461 that are far apart from each other are respectively provided with compression springs 462. One end of the compression spring 462 presses against the wafer fixing ring 43, and the other end of the compression spring 462 presses against the pressure rods 461, so that the two pressure rods 461 are in the shape of an "eight".

[0038] Please see Figure 3 The wafer pick-up assembly 3 has a Y-axis linear module 35 on its support arm 32. The drive plate of the Y-axis linear module 35 has a lever 36. When the transport cylinder gripper 34 transports the wafer to the top of the wafer fixing ring 43, the Y-axis linear module 35 can drive the lever 36 to press the two pressure rods 461 close to each other, so that the two pressure rods 461 switch to the released state. The transport cylinder gripper 34 then places the wafer on the wafer fixing ring 43, and the lever 36 resets. Under the action of its own elastic force, the elastic pressure member 46 pushes the wafer into the slot 441 and compresses the elastic pin 45, so that the wafer is pressed and fixed on the wafer fixing ring 43 by the elastic pressure member 46.

[0039] This structure, which fixes the wafer by engaging the elastic clamp 46 with the slot 441, not only facilitates automatic clamping of the wafer but also limits the wafer's tendency to shift up and down along the axial direction, thus increasing the reliability of the wafer fixation.

[0040] This structure, which integrates the Y-axis linear push module 35 and the lever 36 onto the support arm 32 of the wafer pick-up assembly 3, is more convenient for wiring and air connection than setting the Y-axis linear push module 35 and the lever 36 on the turntable 42, and avoids wire tangling.

[0041] After all the wafers on the wafer have been removed by the wafer pick-up assembly 3, the transport cylinder gripper 34 moves back to directly above the wafer retaining ring 43. The lever 36 drives the elastic pressure member 46 to switch to the released state. The elastic pin 45 pushes the wafer on the wafer retaining ring 43 out of the slot 441. The wafer pick-up assembly 3 removes the wafer from the wafer retaining ring 43. The lever 36 then resets. Driven by the transport X-axis linear module 31 and the transport Z-axis linear module 33, the wafer is placed back into the feed hopper 22.

[0042] By setting an elastic pin 45 on the inner wall of the slot 441, the wafer can be automatically pushed out of the slot 441. The structure is very simple and practical, simplifying the structural design.

[0043] Specifically, in this embodiment, the turntable 42 is provided with six wafer fixing rings 43 for placing wafers with different types of wafers attached, enabling the simultaneous or individual loading of different types of wafers. Of the six wafer fixing rings 43, four are fixed and two are rotatable. For wafers requiring specific loading orientation, they are placed on the rotatable wafer fixing rings 43. Before picking up the wafer, the wafer picking assembly 5 adjusts the wafer angle using the rotatable wafer fixing rings 43 to ensure correct loading orientation.

[0044] Of course, in other embodiments of the present invention, the type and number of wafer retaining rings 43 can be selected according to actual usage requirements.

[0045] Specifically, in this embodiment, please refer to Figure 5 The fixed wafer holding ring 43 includes an adapter plate 431 and a cantilever ring 432. The adapter plate 431 is disposed at the edge of the turntable 42, and the cantilever ring 432 is disposed on the adapter plate 431. The top of the cantilever ring 432 is provided with a support surface for placing the wafer and a stepped groove 4321 for avoiding the transport grippers. The stop block 44 and the elastic pressure member 46 are disposed opposite to each other on the top of the cantilever ring 432.

[0046] Specifically, in this embodiment, please refer to Figure 6 The rotatable wafer holding ring 43 includes a cantilever support ring 433 disposed at the edge of the turntable 42. A wafer synchronous pulley 434 is rotatably disposed on the cantilever support ring 433, and a cantilever ring 432 is disposed on the wafer synchronous pulley 434. The top of the cantilever ring 432 is provided with a support surface for placing the wafer and a stepped groove 4321 for avoiding the transport grippers. A stop block 44 and an elastic pressure member 46 are disposed opposite to each other on the top of the cantilever ring 432. A wafer drive unit 435 is disposed on the turntable 42. The wafer drive unit 435 is a rotary motor. A drive wheel is disposed on the output shaft of the rotary motor. The drive wheel and the wafer synchronous pulley 434 are connected by a synchronous belt 436.

[0047] The wafer picking assembly 5 includes a lifting linear module 52 disposed on the working platform 1. The drive board of the lifting linear module 52 is provided with a ejector pin 55. The lifting linear module 52 can drive the ejector pin 55 to pierce the blue film of the wafer and lift the wafer.

[0048] Specifically, in this embodiment, please refer to Figure 1 , Figure 7 , Figure 8The wafer picking assembly 5 also includes an adjustment Y-axis linear module 51 set on the working platform 1. The drive plate of the adjustment Y-axis linear module 51 is provided with three lifting linear modules 52. The drive plate of the lifting linear module 52 is also provided with a voice coil motor 53 and a vacuum suction rod 54. The drive rod of the voice coil motor 53 is located inside the vacuum suction rod 54. The top surface of the vacuum suction rod 54 is provided with several suction holes 541 and needle outlet holes 542. The ejector pin 55 is fixed on the drive rod of the voice coil motor 53.

[0049] Furthermore, in this embodiment, please refer to Figure 9 The vacuum suction rod 54 includes a vacuum fixing base 543 and a vacuum cap 544. The vacuum fixing base 543 and the vacuum cap 544 are inserted and fixed together. The mating surfaces of the vacuum fixing base 543 and the vacuum cap 544 are provided with an anti-rotation plane 545 to prevent the vacuum cap 544 from rotating relative to the vacuum fixing base 543. This vacuum suction rod 54 has a simple assembly structure and is easy to assemble and disassemble.

[0050] Furthermore, in this embodiment, please refer to Figures 10-12 A clamping block 531 is bolted to the drive rod of the voice coil motor 53. The clamping block 531 is a four-part clamping block with the clamping surfaces of adjacent clamping blocks having arc surfaces that fit the outer wall of the ejector pin 55. The ejector pin 55 is inserted into the clamping surfaces of the two adjacent clamping blocks along the arc surfaces. A clamping cap 532 is fitted on the outside of the clamping block 531 to lock the clamping block 531, thereby fixing the ejector pin 55. This assembly structure of the ejector pin 55 can assemble different numbers of ejector pins 55 as needed, and the assembly structure is simple and easy to disassemble and assemble.

[0051] Furthermore, in this embodiment, the clamping block 531 and the clamping cap 532 adopt a plug-in structure. Of course, in other embodiments of the present invention, this plug-in structure can also be replaced by a threaded connection structure.

[0052] Furthermore, in this embodiment, please refer to Figure 11 A hollow portion 533 is provided between the clamping surfaces of two adjacent clamping blocks. The hollow portion 533 can increase the elasticity of the clamping blocks and make it easier to remove the ejector pin 55 from the clamping block 531.

[0053] When the wafer picking assembly 5 picks up the wafer from the wafer film, it first moves the corresponding lifting linear module 52 below the wafer fixing ring 43 by adjusting the Y-axis linear module 51. The lifting linear module 52 then moves the voice coil motor 53 and the vacuum suction rod 54 upward together, so that the vacuum suction rod 54 contacts the wafer blue film. The vacuum suction rod 54 adsorbs and fixes the wafer blue film. The voice coil motor 53 then drives the ejector pin 55 to pierce the wafer blue film and lift the wafer, so that the wafer separates from the blue film.

[0054] This design structure, which first adsorbs and fixes the blue film on the wafer before performing a 55mm puncture with a jack, can reduce the axial displacement of the wafer when puncturing along the wafer axis.

[0055] It should be noted that the number of pins 55 fixed on the voice coil motor 53 drive rod can be selected and set according to the size of the chip.

[0056] Please see Figure 13 The wafer picking assembly 5 also includes a wafer picking X-axis linear module 56 mounted on the work platform 1. The drive board of the wafer picking X-axis linear module 56 is equipped with a positioning camera 57 and a ZR-axis actuator 58. The drive end of the ZR-axis actuator 58 is equipped with a transfer pen 59. After the ejector pin 55 lifts the wafer, the wafer picking X-axis linear module 56 first drives the positioning camera 57 to move directly above the ejector pin 55. The positioning camera 57 acquires the position information of the lifted wafer on the blue film. The wafer picking X-axis linear module 56 then drives the ZR-axis actuator 58 to move directly above the ejector pin 55 according to the position information. The ZR-axis actuator 58 then drives the transfer pen 59 to descend and pick up the wafer lifted by the ejector pin 55, and transfer it to the next working mechanism.

[0057] It should be noted that the ZR axis actuator 58 is existing technology. It can drive along the Z-axis and rotate around the R-axis. Its specific structure and working principle will not be described in detail here.

[0058] Since different types of chips may have films with different reflective colors on their surfaces, in order to ensure that the positioning camera 57 can accurately acquire the position information of various chips, the positioning camera 57 also includes a coaxial light source. The coaxial light source is a combination of multiple independently controllable light sources. During operation, different light sources or combinations of multiple light sources can be selected according to the type of chip.

[0059] It should be noted that, in the embodiments of the present invention, the above-mentioned linear modules can be selected as needed to use existing module structures that can realize linear motion, such as lead screw linear modules, synchronous belt linear modules, and cylinder linear modules.

[0060] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions and substitutions can be made without departing from the inventive concept, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A wafer loading mechanism, comprising a wafer feeding assembly (2), a wafer picking assembly (3), a wafer transfer assembly (4), and a wafer picking assembly (5) sequentially connected, characterized in that, The wafer transfer assembly (4) includes a wafer retaining ring (43), a stop (44) is provided on the wafer retaining ring (43), a slot (441) is provided on the inner side wall of the stop (44), and an elastic pin (45) is provided on the inner wall of the slot (441); an elastic pressure member (46) is provided on the wafer retaining ring (43), the elastic pressure member (46) can push the wafer into the slot (441) and compress the elastic pin (45), so that the wafer is pressed; the wafer removal The wafer pick-up assembly (3) is integrated with a lever (36), which can drive the elastic pressure member (46) to switch the elastic pressure member (46) to the loose state, so that the wafer pick-up assembly (3) can transport the wafer onto the wafer retaining ring (43), or so that the elastic pin (45) can push the wafer on the wafer retaining ring (43) out of the slot (441), so that the wafer pick-up assembly (3) can remove the wafer from the wafer retaining ring (43); The elastic pressure member (46) includes two pressure rods (461). The middle part of the pressure rod (461) is hinged to the wafer fixing ring (43) through a rotating shaft. The ends of the two pressure rods (461) that are far apart from each other are respectively provided with compression springs (462). One end of the compression spring (462) presses against the wafer fixing ring (43), and the other end of the compression spring (462) presses against the pressure rod (461), so that the two pressure rods (461) are in the shape of an "eight".

2. The wafer loading mechanism according to claim 1, characterized in that, The wafer transfer assembly (4) also includes an XY axis adjustment stage (41), on which a turntable (42) is provided, and the wafer fixing ring (43) is provided on the turntable (42).

3. The wafer loading mechanism according to claim 2, characterized in that, The wafer fixing ring (43) is a fixed wafer fixing ring (43) or a rotatable wafer fixing ring (43), and the turntable (42) is provided with one or both of the fixed wafer fixing ring (43) and the rotatable wafer fixing ring (43).

4. The wafer loading mechanism according to claim 3, characterized in that, The fixed wafer holding ring (43) includes a transition plate (431) disposed at the edge of the turntable (42), and a cantilever ring (432) is disposed on the transition plate (431). The top of the cantilever ring (432) is provided with a support surface for placing the wafer and a stepped groove (4321) for avoiding the wafer picking assembly (3). The stop block (44) and the elastic pressure member (46) are disposed opposite to each other on the top of the cantilever ring (432).

5. The wafer loading mechanism according to claim 3, characterized in that, The rotatable wafer retaining ring (43) includes a cantilever support ring (433) disposed at the edge of the turntable (42). A wafer synchronous wheel (434) is rotatably disposed on the cantilever support ring (433). A cantilever ring (432) is disposed on the wafer synchronous wheel (434). The top of the cantilever ring (432) is provided with a support surface for placing the wafer and a stepped groove (4321) for avoiding the wafer pick-up assembly (3). The stop block (44) and the elastic pressure member (46) are disposed opposite to each other on the top of the cantilever ring (432). A wafer drive member (435) is disposed on the turntable (42). The wafer drive member (435) is connected to the wafer synchronous wheel (434) by a synchronous belt (436).

6. The wafer loading mechanism according to claim 1, characterized in that, The wafer picking assembly (3) includes a transport X-axis linear module (31), a support arm (32) is provided on the drive plate of the transport X-axis linear module (31), a transport Z-axis linear module (33) is provided on the support arm (32), and a transport cylinder gripper (34) capable of gripping the wafer is provided on the transport Z-axis linear module (33); a push Y-axis linear module (35) is provided on the support arm (32), and a lever (36) is provided on the drive plate of the push Y-axis linear module (35). The push Y-axis linear module (35) can drive the lever (36) to simultaneously press the two pressure rods (461) that are close to each other, so that the two pressure rods (461) switch to the released state.

7. The wafer loading mechanism according to claim 1, characterized in that, The wafer feeding assembly (2) includes a feeding bin (22) and a bin Z-axis linear module (21). The bin Z-axis linear module (21) can drive the feeding bin (22) to rise and fall. The feeding bin (22) is provided with a multi-layer carrier plate (23), and the wafer is placed on the carrier plate (23).

8. The wafer loading mechanism according to claim 1, characterized in that, The wafer picking assembly (5) includes a lifting linear module (52), on which a pin (55) is provided on the drive plate of the lifting linear module (52). The lifting linear module (52) can drive the pin (55) to pierce the blue film of the wafer and lift the wafer. The wafer picking assembly (5) also includes a transfer pen (59), which can pick up the wafer lifted by the pin (55) and transfer it to the next working mechanism.

9. The wafer loading mechanism according to claim 8, characterized in that, The wafer picking component (5) also includes a positioning camera (57), which acquires the position information of the wafer on the blue film, and the transfer pen (59) picks up the wafer according to the position information; the positioning camera (57) also includes a coaxial light source, which is a combination of multiple independently controllable light sources.

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