A detachable packaging reinforcing support

Abstract

This invention provides a detachable packaging reinforcement bracket, which includes a base plate and a movable plate stacked on the base plate. The movable plate has a hollow through-slot, and the front and rear edges of the through-slot have limiting portions lower than the upper surface of the movable plate. The left and right edges of the through-slot have supporting portions lower than the upper surface of the movable plate. A clamping frame is fastened to the upper surface of the limiting portion. A substrate is placed between the base plate and the movable plate. The clamping frames on the front and rear sides are in close contact with the front and rear edges of the upper surface of the substrate, forming an initial fixation of the substrate. As the movable plate moves down into position, the upper surface of the substrate is in contact with the lower surface of the supporting portion and the lower edge of the clamping frame, achieving fixation. The chip is placed on the two symmetrical supporting portions and pressed down and fixed by the clamping mechanism, thereby providing additional mechanical support, ensuring that the relative position of the substrate and the chip remains unchanged, protecting the chip and substrate from various impacts and vibrations that may occur during the packaging process, and ensuring the stability and reliability of the packaging.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a detachable packaging reinforcement bracket. Background Technology

[0002] FCBGA packaging involves attaching the chip to a substrate in a flip-chip manner and using ball solder as electrical connection points. This packaging method inverts the chip and connects it to the packaging substrate located below, fixing the chip to the substrate through ball solder points.

[0003] In the FCBGA packaging process, the chip and the substrate are connected by ball solder. Although this connection method performs well under normal conditions, it is prone to creep, oxidation or fatigue fracture of the solder balls under specific packaging environment conditions, such as high temperature, high humidity and high vibration. This weakens the connection strength between the chip and the substrate, and ultimately affects the overall performance and long-term reliability of the FCBGA package. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the purpose of this invention is to provide a detachable packaging reinforcement bracket to solve the above-mentioned problems caused by packaging under extreme conditions such as high temperature, high humidity and high vibration.

[0005] To achieve the above and other related objectives, the present invention provides a detachable encapsulation reinforcement bracket, comprising:

[0006] Base plate;

[0007] A movable plate is stacked on the base plate. The movable plate has a hollow through slot, and the slot wall has a stepped groove edge. The groove edges on the front and rear sides have limiting portions lower than the upper surface of the movable plate, and the groove edges on the left and right sides have supporting portions lower than the upper surface of the movable plate. The base plate and the movable plate are used to place the substrate to be packaged and soldered. The chip to be packaged and soldered crosses the through slot and is attached to the upper surface of the supporting portion.

[0008] The limiting part is fastened with an L-shaped clamping frame, which includes a connecting strip and a lower pressure strip that are perpendicular to each other. The connecting strip is horizontally arranged above the limiting part, and the lower pressure strip is attached to the side wall of the limiting part near the through groove. A first spring is connected between the lower surface of the connecting strip and the limiting part, thereby providing a downward force to the clamping frame. The upper surface of the substrate is in contact with the lower surface of the support part and the lower edge of the lower pressure strip.

[0009] Optionally, a vertically upward-facing screw is fixed to the edge of the base plate; the screw passes through a waist-shaped perforation located on the edge of the movable plate, and a pad and a fastening nut are fitted onto the segment of the screw located above the movable plate.

[0010] Optionally, there are multiple first springs located between the connecting bar and the limiting part, and the limiting part and / or the connecting bar have slots for fixing the first springs, with the multiple slots arranged in the left-right direction; when the first spring is in a free state, the lower edge of the pressure bar is lower than the lower surface of the support part.

[0011] Optionally, the lower surface of the movable plate is provided with a limiting groove, the limiting groove is concave relative to the lower surface of the movable plate, the lower surface of the limiting part is lower than the lower surface of the support part, the limiting groove is located between the limiting parts on the front and rear sides and the limiting groove covers the through groove in the left and right direction, and the bottom of the upper groove of the limiting groove is flush with the lower surface of the support part.

[0012] Optionally, the upper surface of the base plate is provided with pads, and a plurality of the pads are arranged in an array to cover the area where the substrate is located, with the substrate located between the pads and the movable plate.

[0013] Optionally, the chip and the substrate are separated by the support portion to form a gap, the gap being used to accommodate spherical solder for welding.

[0014] Optionally, mounting holes for fixing are provided at the corners of the base plate.

[0015] Optionally, it also includes a pressing mechanism, which includes a pad frame fixed to the upper surface of a movable plate at the corner of the slot. One end of a horizontally arranged rotating arm is rotatably connected to the pad frame. A connecting rod that can move up and down passes through the end of the rotating arm away from the pad frame. A pressing block is fixed to the bottom end of the connecting rod. The pressing block can reach above the support part and press the chip under the rotation of the rotating arm.

[0016] Optionally, a connecting block is fixed to the top of the connecting rod, and a second spring is sleeved around the connecting rod. The upper and lower ends of the second spring are respectively connected to the connecting block and the rotating arm, thereby providing a downward force to the pressing block.

[0017] Optionally, the number of pads is set to four, and a clamping mechanism is provided at each of the four corners of the through slot.

[0018] As described above, the present invention provides a detachable packaging reinforcement bracket, which includes a base plate and a movable plate stacked on the base plate. The movable plate has a hollow through-slot, and the groove edges on the front and rear sides of the through-slot have limiting portions lower than the upper surface of the movable plate. The groove edges on the left and right sides of the through-slot have supporting portions lower than the upper surface of the movable plate. An L-shaped clamping frame is fastened to the upper surface of the limiting portion. The substrate to be packaged and soldered is placed between the base plate and the movable plate. The clamping frames on the front and rear sides are respectively pressed against the front and rear edges of the upper surface of the substrate, forming an initial fixation of the substrate. As the movable plate moves down into position, the upper surface of the substrate is in contact with the lower surface of the supporting portion and the lower edge of the clamping frame, thus fixing the substrate. The chip to be packaged and soldered is placed on the two symmetrical supporting portions and pressed down and fixed by the clamping mechanism, thereby providing additional mechanical support, ensuring that the relative position of the substrate and the chip remains unchanged, protecting the chip and the substrate from various impacts and vibrations that may occur during the packaging process, and ensuring the stability and reliability of the packaging. Attached Figure Description

[0019] Figure 1 The diagram shown is a schematic representation of the overall structure of the encapsulation and reinforcement bracket in Embodiment 1 of the present invention.

[0020] Figure 2 The diagram shown is a schematic representation of the overall structure of the movable plate in Embodiment 1 of the present invention.

[0021] Figure 3 The diagram shown is a disassembled structural diagram of the movable plate in Embodiment 1 of the present invention.

[0022] Figure 4 The diagram shown is a structural schematic of the clamping mechanism in Embodiment 1 of the present invention.

[0023] Component designation explanation

[0024] Base plate 1; mounting hole 2; screw 3; movable plate 4; pad 5; fastening nut 6; pad block 7; clamping mechanism 8; waist-shaped through hole 45; through groove 42; limiting part 46; support part 44; first step 41; second step 43; limiting part 46; clamping frame 49; connecting strip 491; lower pressure strip 492; first spring 48; slot 47; limiting groove 40; connecting rod 81; rotating arm 82; pad frame 83; clamping block 84; connecting block 85; second spring 86. Detailed Implementation

[0025] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0026] In the detailed description of embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged and not to scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In actual fabrication, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0027] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the drawings for the device in use or operation. Furthermore, when a layer is referred to as being “between” two layers, it can be the only layer between the two layers, or there may be one or more layers in between. The phrase “between” as used herein includes both endpoint values.

[0028] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are formed in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0029] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0030] Example 1

[0031] like Figures 1 to 4 As shown, this embodiment provides a detachable encapsulation reinforcement bracket, including:

[0032] Base plate 1, with a vertically upward screw 3 fixed to the edge of the base plate;

[0033] A movable plate 4 is stacked on the base plate. A screw 3 passes through a waist-shaped perforation 45 located at the edge of the movable plate 4. The segment of the screw 3 above the movable plate 4 is fitted with a pad 5 and a fastening nut 6, thereby pressing the movable plate 4 down to make it fit against the base plate 1. The waist-shaped perforation 45 ensures that the movable plate 4 and the base plate 1 have a certain amount of relative movement. The screw 3 can be two symmetrically arranged or more, as long as it forms a limiting and fixing effect on the movable plate 4; no excessive limitation is made here. The base plate 1 and the movable plate 4 are used to place the substrate to be packaged and welded. Those skilled in the art will understand that the extension direction of the waist-shaped perforation 45 at each edge of the movable plate 4 is determined by the predetermined relative movement direction between the movable plate 4 and the base plate 1.

[0034] The movable plate 4 has a hollow through-slot 42. The through-slot 42 is square, and its walls have stepped edges. The edges on the front and rear sides are symmetrical and have limiting portions 46 that are lower than the upper surface of the movable plate 4, forming a first step 41. The edges on the left and right sides are symmetrical and have supporting portions 44 that are lower than the upper surface of the movable plate, forming a second step 43. The upper surface of the limiting portion 46 is lower than the upper surface of the supporting portion 44, meaning the height of the first step 41 is greater than the height of the second step 43. Simultaneously, the lower surface of the limiting portion 46 is lower than the lower surface of the supporting portion 44; for example, the upper surface of the limiting portion 46 is flush with the lower surface of the supporting portion 44, thereby confining the substrate between the limiting portions 46 on the front and rear sides. The chip to be packaged and soldered spans the through-slot 42 and is placed on the two symmetrical supporting portions 44.

[0035] Furthermore, the limiting part 46 is fastened with an L-shaped clamping frame 49. The clamping frame 49 includes a connecting strip 491 and a lower pressing strip 492 that are perpendicular to each other. The connecting strip 491 is horizontally arranged above the limiting part 46, and the lower pressing strip 492 is attached to the side wall of the limiting part 46 near the through groove 42. A first spring 48 is connected between the lower surface of the connecting strip 491 and the limiting part 46, thereby providing a downward force to the clamping frame 49.

[0036] As an example, the number of first springs 48 located between the connecting bar 491 and the limiting part 46 is three. The limiting part 46 and / or the connecting bar have corresponding slots 47 for fixing the first springs 48, and the multiple slots 47 are arranged in the left-right direction. When the first springs 48 are in the free state, the lower edge of the pressure bar 492 is lower than the lower surface of the support part 44.

[0037] Furthermore, the lower surface of the movable plate 4 is provided with a limiting groove 40 for limiting the substrate. The limiting groove 40 is concave relative to the lower surface of the movable plate 4. The limiting groove 40 is located between the limiting parts 46 on the front and rear sides and covers the through groove 42 in the left and right direction. The bottom of the upper groove of the limiting groove 40 is flush with the lower surface of the support part 44.

[0038] Specifically, the substrate is located between the base plate 1 and the movable plate 4. First, the substrate is placed on the upper surface of the base plate 1. Then, the movable plate 4 is inserted through two oblong holes 45 onto the outer surface of the two screws 3. The substrate is located between the limiting parts 46 on the front and rear sides. During the descent of the movable plate 41, the lower edges of the lower pressure strips 492 of the pressing frames 49 on the front and rear sides are respectively pressed against the front and rear edges of the upper surface of the substrate, forming a preliminary fixation of the substrate. During the continuous descent of the movable plate 4, due to the obstruction of the substrate, the pressing frame 49 pulls the first spring 48 fixedly connected to it, thereby causing the first spring 48 to extend. Under the elastic force of the first spring 48, the lower pressure strips 492 of the pressing frame 49 continuously press the substrate. When the movable plate 4 is pressed against the base plate 1, the movable plate 4 falls into place, the substrate is accommodated in the limiting groove, and the upper surface of the substrate is in contact with the lower surface of the support and the lower edge of the lower pressure strip of the pressing frame, thus fixing the substrate. During the process, the pad 5 is inserted through the outer surface of the screw 3, and then the fastening nut 6 is tightened. The bottom end of the fastening nut 6 is in close contact with the top end of the pad 5, thereby causing the movable plate to move down and finally locking the bottom plate and the movable plate together.

[0039] Furthermore, the upper surface of the base plate 1 is provided with pads 7, and multiple pads 7 are arranged in an array to cover the area where the substrate is located. The substrate is located between the pads 7 and the movable plate 4. The chip to be packaged and soldered is placed on the upper surface of the support part 44, and the support part 44 separates the chip and the substrate to form a gap, which is used to accommodate the spherical solder used for soldering.

[0040] Furthermore, mounting holes 2 are provided at the corners of the base plate 1, with four mounting holes 2 in total, meaning there is one mounting hole 2 at each of the four corners of the base plate 1. The mounting holes 2 are used to fix the base plate 1, for example, to fix the base plate into a reflow soldering device. Heating melts the spherical solder, achieving bonding between the substrate and the chip. Under the limiting effect of this packaging reinforcement bracket, the relative position of the substrate and the chip remains unchanged, avoiding the influence of external environment (such as temperature and vibration) on the soldering effect. The pad 7 on the upper surface of the base plate 1 is used to expose the lower surface of the substrate, thereby providing a channel for heated airflow to reach the substrate.

[0041] Furthermore, it also includes a clamping mechanism 8, which includes a connecting rod 81, a rotating arm 82, a pad 83, a clamping block 84, a connecting block 85, and a second spring 86. The pad 83 is fixed to the upper surface of the movable plate at the corner of the slot 42. One end of the horizontally arranged rotating arm 82 is rotatably connected to the pad 83. The end of the rotating arm 82 away from the pad 83 has a connecting rod 81 that can move up and down through it. The bottom end of the connecting rod 81 is fixed with the clamping block 84, and the top end of the connecting rod 81 is fixed with the connecting block 85. The second spring 86 is sleeved around the connecting rod 81, and its upper and lower ends are respectively connected to the connecting block 85 and the rotating arm 82, thereby providing a downward force to the clamping block 84. The number of pads 83 is set to four, that is, a clamping mechanism is provided at each of the four corners of the slot 42.

[0042] The clamping block 84 can reach above the support portion 44 under the rotation of the rotating arm 82, thereby clamping the chip located on the support portion 44.

[0043] During the packaging process, the chip is connected to the substrate using spherical solder. The bottom sides of the chip are respectively attached to the upper surfaces of the two support portions 44. The rotating arm 82 is pulled and rotates around the pad 83, which at the same time drives the connecting rod 81 that is movably inserted with it to move. The connecting rod 81 drives the pressing block 84 to move. When the pressing block 84 moves to the upper end of the support portion 44, the elasticity of the second spring 86 is used to make the pressing block 84 move downward and attach to the corner of the chip surface, thereby providing additional mechanical support and ensuring the stability and reliability of the packaging.

[0044] The usage process of the above-mentioned encapsulation and reinforcement bracket is as follows:

[0045] First, the substrate is placed securely on the pad 7. Then, the movable plate 4 is inserted through the waist-shaped through holes 45 on both sides onto the outer surface of the two vertically arranged screws 3. During this process, the lower pressure strip of the clamping frame 49 is closely attached to the front and rear edges of the upper surface of the substrate, which plays a preliminary limiting role.

[0046] As the movable plate 4 continues to move downward, the blocking effect of the substrate causes the clamping frame 49 to pull the first spring 48 that is firmly connected to it, resulting in the elastic extension of the first spring 48; under the elastic force of the first spring 48, the lower pressure bar of the clamping frame 49 continues to press the substrate.

[0047] Next, the pad 5 is inserted onto the outer surface of the screw 3, and then the fastening nut 6 is tightened. As the fastening nut 6 rotates, its bottom end gradually presses against the top end of the pad 5, causing the lower surface of the support part 44 to press against the upper surface of the substrate. This fastening mechanism achieves a stable fixation of the substrate. The chip to be packaged and soldered is placed on the upper surface of the support parts 44 on both the left and right sides.

[0048] To further ensure the stability and reliability of the packaging, this design is also equipped with a clamping mechanism 8. By pulling the rotating arm 82, it can rotate flexibly relative to the pad 83, and at the same time, it drives the connecting rod 81, which is movably interlocked with it, to move. The displacement of the connecting rod 81 will further drive the clamping block 84 to move until the clamping block 84 moves to the upper end of the support part 44. At this time, by utilizing the elasticity of the second spring 86, the clamping block 84 can move downward and fit tightly against the chip surface, providing additional mechanical support and protection for the chip.

[0049] In summary, this invention provides a detachable packaging reinforcement bracket, which includes a base plate and a movable plate stacked on the base plate. The movable plate has a hollow through-slot, and the groove edges on both sides of the through-slot have limiting portions lower than the upper surface of the movable plate. The groove edges on both sides of the through-slot have supporting portions lower than the upper surface of the movable plate. An L-shaped clamping frame is fastened to the upper surface of the limiting portion. The base plate and the movable plate are used to place the substrate to be packaged and soldered. The clamping frames on both sides are respectively close to the front and rear edges of the upper surface of the substrate, forming an initial fixation of the substrate. As the movable plate moves down into position, the upper surface of the substrate is in contact with the lower surface of the supporting portion and the lower edge of the clamping frame, thus fixing the substrate. The chip to be packaged and soldered is placed on the two symmetrical supporting portions and pressed down and fixed by the clamping mechanism, thereby providing additional mechanical support, ensuring that the relative position of the substrate and the chip remains unchanged, protecting the chip and the substrate from various impacts and vibrations that may occur during the packaging process, and ensuring the stability and reliability of the packaging.

[0050] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A detachable encapsulation and reinforcement bracket, characterized in that, include: Base plate; A movable plate is stacked on the base plate. The movable plate has a hollow through slot, and the slot wall has a stepped groove edge. The groove edges on the front and rear sides have limiting portions lower than the upper surface of the movable plate, and the groove edges on the left and right sides have supporting portions lower than the upper surface of the movable plate. The base plate and the movable plate are used to place the substrate to be packaged and soldered. The chip to be packaged and soldered crosses the through slot and is attached to the upper surface of the supporting portion. The limiting part is fastened with an L-shaped clamping frame, which includes a connecting strip and a lower pressure strip that are perpendicular to each other. The connecting strip is horizontally arranged above the limiting part, and the lower pressure strip is attached to the side wall of the limiting part near the through groove. A first spring is connected between the lower surface of the connecting strip and the limiting part, thereby providing a downward force to the clamping frame. The upper surface of the substrate is in contact with the lower surface of the support part and the lower edge of the lower pressure strip.

2. The detachable encapsulation reinforcement bracket according to claim 1, characterized in that: The bottom plate is fixed with a vertically upward screw; the screw passes through a waist-shaped hole located on the edge of the movable plate, and the segment of the screw located above the movable plate is fitted with a pad and a fastening nut.

3. The detachable encapsulation reinforcement bracket according to claim 1, characterized in that: There are multiple first springs located between the connecting bar and the limiting part. The limiting part and / or the connecting bar have slots for fixing the first springs. The multiple slots are arranged in the left-right direction. When the first spring is in a free state, the lower edge of the pressure bar is lower than the lower surface of the support part.

4. The detachable encapsulation reinforcement bracket according to claim 1, characterized in that: The lower surface of the movable plate is provided with a limiting groove. The limiting groove is concave relative to the lower surface of the movable plate. The lower surface of the limiting part is lower than the lower surface of the support part. The limiting groove is located between the limiting parts on the front and rear sides and covers the through groove in the left and right direction. The bottom of the upper groove of the limiting groove is flush with the lower surface of the support part.

5. The detachable encapsulation reinforcement bracket according to claim 1, characterized in that: The upper surface of the base plate is provided with pads, and multiple pads are arranged in an array to cover the area where the substrate is located. The substrate is located between the pads and the movable plate.

6. The detachable encapsulation reinforcement bracket according to claim 1, characterized in that: The chip and the substrate are separated by the support portion to form a gap, which is used to accommodate the spherical solder used for welding.

7. The detachable encapsulation reinforcement bracket according to claim 1, characterized in that: The base plate has mounting holes at its corners for fixing.

8. The detachable encapsulation reinforcement bracket according to claim 1, characterized in that: It also includes a pressing mechanism, which includes a pad frame. The pad frame is fixed to the upper surface of the movable plate at the corner of the slot. One end of a horizontally arranged rotating arm is rotatably connected to the pad frame. A connecting rod that can move up and down passes through the end of the rotating arm away from the pad frame. A pressing block is fixed to the bottom end of the connecting rod. The pressing block can reach above the support part and press the chip under the rotation of the rotating arm.

9. The detachable encapsulation reinforcement bracket according to claim 7, characterized in that: A connecting block is fixed to the top of the connecting rod, and a second spring is sleeved around the connecting rod. The upper and lower ends of the second spring are respectively connected to the connecting block and the rotating arm, thereby providing a downward force to the pressing block.

10. The detachable encapsulation reinforcement bracket according to claim 7, characterized in that: The number of pads is set to four, and a clamping mechanism is provided at each of the four corners of the slot.

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