Substrate clamp preventing warpage

Abstract

The application provides a substrate clamp capable of preventing warping, which comprises a placing plate provided with a placing groove, and fixing assemblies are arranged on both sides of the placing groove; under the elastic force of the first spring of the fixing assembly, the substrate in the placing groove is tightly clamped between the clamping blocks on both sides, so that a fixing effect is achieved; then the surface of the substrate is fixed by pressing down through a pressing assembly; under the cooperation of the fixing assembly and the pressing assembly, the substrate is subjected to the double pressing effect of the side surface and the surface, so that the stability of the substrate is ensured. The bottom surface of the placing plate is provided with a heating wire and a temperature sensor; the heat of the heating wire is transmitted to the substrate through the groove bottom of the placing groove; in the process, the fixing assembly and the pressing assembly apply moderate pressure to the substrate, so that the warping phenomenon that may occur in the preheating stage of the substrate is prevented, so that the uniform transmission of heat is ensured, the heating efficiency is improved, the warping problem of the substrate caused by overheating or overcooling is avoided, and the stability and reliability are further improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a substrate clamp that prevents warping. Background Technology

[0002] FCBGA substrate, or flip-chip ball grid array packaging substrate, is a type of substrate used for high-density IC packaging. During the FCBGA substrate packaging process, it is usually necessary to use fixtures for fixation.

[0003] In the FCBGA packaging process, substrate preheating is a critical step. Preheating ensures that the packaging materials (such as solder balls) reach the appropriate temperature during soldering, thereby achieving good soldering results. However, when using existing FCBGA substrate fixtures, the preheating effect of the FCBGA substrate is not good. Insufficient preheating often leads to warping of the FCBGA substrate during processing or testing. Warping not only affects the flatness of the substrate, but may also cause poor soldering, signal transmission problems, and a decrease in overall performance. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the purpose of this invention is to provide an anti-warping substrate clamp to solve the problem of poor preheating effect of the substrate when using existing clamps.

[0005] To achieve the above and other related objectives, the present invention provides an anti-warping substrate clamp, the substrate clamp comprising:

[0006] The placement plate has an upward-facing placement groove, and the left and right edges of the placement groove are formed with mutually symmetrical limiting plates. The front and rear edges of the placement groove are respectively formed with one or multiple limiting blocks arranged in the left and right direction. The limiting blocks divide the areas on the front and rear sides of the placement groove into multiple through grooves arranged in the left and right direction.

[0007] A fixing assembly, the fixing assembly including a clamping block, the clamping block being received within the through groove and used to clamp the substrate located in the placement groove from both the front and rear sides;

[0008] A pressing assembly, comprising a connecting rod that spans the placement groove in a front-to-back direction and pressure plates fixed to the left and right sides of the connecting rod, the pressure plates being used to press against the surface of the substrate;

[0009] Optionally, the fixing assembly further includes a support plate, which is vertically fixed to the bottom surface of the placement plate. A stabilizing rod and a first spring are vertically connected to the outer surface of the support plate facing the outside of the placement plate. The first spring is sleeved around the stabilizing rod. A movable tube is connected to the outer end of the first spring away from the support plate. The end of the movable tube facing the first spring is provided with a columnar hole that can accommodate the stabilizing rod. The first spring can provide a force to the movable tube towards the support plate.

[0010] The end of the movable tube away from the first spring is connected to an L-shaped connecting frame. The connecting frame includes a vertical section extending upward from the movable tube and a horizontal section extending from the vertical section toward the placement plate. The clamping block is connected to the horizontal section.

[0011] Optionally, the groove walls on the left and right sides of the through groove are formed with sliding grooves extending in the front-back direction; the left and right side walls of the clamping block are fixed with sliding rods extending in the front-back direction, and the sliding rods are located in the sliding grooves.

[0012] Optionally, the connecting frame, movable tube, stabilizer bar, and first spring form a set of connecting parts, and a single fixing component includes two sets of connecting parts.

[0013] Optionally, the front and rear ends of the connecting rod are connected to the connecting block upwards via an L-shaped support frame. The connecting block is horizontally arranged and has a threaded screw running vertically inside. The lower segment of the screw is fitted with a second spring, and the bottom end of the screw is fixed to the upper surface of the limiting block. The upper segment of the screw is fitted with a fastening nut.

[0014] Optionally, at least one of the limiting plates has a vertical groove facing the placement slot.

[0015] Optionally, the bottom of the placement groove is provided with through holes, and a plurality of through holes are arranged in an array.

[0016] Optionally, a heating wire is installed on the bottom surface of the placement plate.

[0017] Optionally, a temperature sensor is also installed on the bottom surface of the placement plate.

[0018] Optionally, the substrate includes an FCBGA substrate.

[0019] As described above, the present invention provides an anti-warping substrate clamp, which includes a placement plate with a placement groove. Fixing components are provided on both sides of the placement groove. Under the elastic force of a first spring in the fixing components, the substrate located in the placement groove is tightly clamped between the clamping blocks on both sides, initially achieving a fixing effect. Then, a pressing component presses down on the substrate surface for fixation. With the cooperation of the fixing and pressing components, a double pressing effect on the side and surface of the substrate is achieved, ensuring the stability of the substrate. A heating wire and a temperature sensor are installed on the bottom surface of the placement plate. The heat from the heating wire is transferred to the substrate through the bottom of the placement groove. During this process, the fixing and pressing components apply appropriate pressure to the substrate, preventing warping that may occur during the preheating stage, thereby ensuring uniform heat transfer and improving heating efficiency. Simultaneously, the equipped temperature sensor can monitor the heating temperature in real time and make precise adjustments, ensuring that the heating temperature is always maintained within a suitable range, avoiding substrate warping caused by overheating or overcooling, further improving stability and reliability. Attached Figure Description

[0020] Figure 1 The diagram shown is a schematic representation of the overall structure of the substrate clamp in Embodiment 1 of the present invention.

[0021] Figure 2 The diagram shown is a structural schematic of the placement plate in Embodiment 1 of the present invention.

[0022] Figure 3 The diagram shown is a structural schematic of the fixing component in Embodiment 1 of the present invention.

[0023] Figure 4 The diagram shown is a structural schematic of the clamping assembly in Embodiment 1 of the present invention.

[0024] Component designation explanation

[0025] 1. Placement plate; 2. Placement slot; 3. Through hole; 4. Heating wire; 5. Temperature sensor; 6. Fixing assembly; 7. Clamping assembly; 8. Through slot; 9. Slide groove; 11. Limiting plate; 12. Limiting block; 61. Clamping block; 62. Connecting frame; 63. Movable tube; 64. Stabilizing rod; 65. First spring; 66. Support plate; 67. Slide rod; 71. Connecting rod; 72. Pressure plate; 73. Support frame; 74. Connecting block; 75. Screw; 76. Fastening nut; 77. Second spring. Detailed Implementation

[0026] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0027] In the detailed description of embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged and not to scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In actual fabrication, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0028] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the drawings for the device in use or operation. Furthermore, when a layer is referred to as being “between” two layers, it can be the only layer between the two layers, or there may be one or more layers in between. The phrase “between” as used herein includes both endpoint values.

[0029] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are formed in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0030] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0031] Example 1

[0032] like Figures 1 to 4 As shown, this embodiment provides an anti-warping substrate clamp, the substrate clamp comprising:

[0033] Placement plate 1, the placement plate 1 having an upward-facing placement groove 2, the placement groove 2 being used to place a substrate to be heated, the substrate including but not limited to an FCBGA substrate;

[0034] The left and right edges of the placement groove 2 are provided with mutually symmetrical limiting plates 11, and the front and rear edges of the placement groove are provided with a plurality of limiting blocks 12 arranged in the left and right direction. At least one of the limiting plates 11 has a vertical groove facing the placement groove 2, thereby clamping the substrate from the left and right sides.

[0035] The limiting block 12 divides the area on the front and back sides of the placement groove 2 into multiple through grooves 8 arranged in the left and right direction; through grooves 8 are formed between adjacent limiting blocks 12 in the left and right direction and between adjacent limiting blocks 12 and limiting plate 11 in the left and right direction, and the groove walls on the left and right sides of the through groove 8 are formed with sliding grooves 9 extending in the front and back direction.

[0036] The substrate clamp also includes a fixing component 6, which includes a clamping block 61, a connecting frame 62, a movable tube 63, a stabilizing rod 64, a first spring 65, a support plate 66, and a sliding rod 67. The support plate 66 is vertically fixed to the bottom surface of the placement plate 1. The outer surface of the support plate 66 facing the outer side of the placement plate 1 is vertically connected to the stabilizing rod 64 and the first spring 65. The first spring 65 is sleeved around the stabilizing rod 64. The outer end of the first spring 65 away from the support plate 66 is connected to the movable tube 63. The end of the movable tube 63 facing the first spring 65 is provided with a columnar hole that can accommodate the stabilizing rod 64. The first spring 65 can provide a force to the movable tube 63 towards the support plate 66. Here, the stabilizing rod 64 plays a guiding role to prevent the movable tube 63 from deflecting when it moves.

[0037] An L-shaped connecting frame 62 is connected to the end of the movable tube 63 away from the first spring 65. The connecting frame 62 is located above the movable tube 63, with its upper end facing the inside of the placement plate 1. A clamping block 61 is connected to the upper end of the connecting frame 62. The connecting frame includes a vertical section extending upward from the movable tube and a horizontal section extending from the vertical section toward the placement plate. The clamping block is connected to the horizontal section. Slide rods 67 extending in the front-back direction are fixed to the left and right side walls of the clamping block 61. The clamping block 61 is accommodated in the through groove 8, and the slide rods 67 are engaged in the slide groove 9, so that the clamping block 61 can clamp the front and rear edges of the substrate located in the placement groove 2. Here, by confining the clamping block 61 in the through groove 8 and the slide rods 67 in the slide groove 9, the stability of the displacement of the movable tube 63 and the clamping block 61 is improved, ensuring that they move strictly in the front-back direction without deflection.

[0038] It should be noted that the connecting frame 62, movable tube 63, stabilizing rod 64, and first spring 65 form a set of connecting components for connecting the support plate 66 and the clamping block 61. This set of connecting components is at least one set, preferably two sets. The number of fixing components located on one side of the placement slot is at least two, meaning there is at least one limiting block, or at least two through-slots. The fixing components 6 on the front and rear sides are opposite to each other. Here, the spring force is transmitted to the clamping block through the movable tube 63 and the L-shaped connecting frame 62, thus allowing the spring to be hidden at the bottom of the placement plate, saving space.

[0039] Furthermore, the substrate clamp also includes a clamping assembly 7, which includes a connecting rod 71, a pressure plate 72, a support frame 73, a connecting block 74, a screw 75, a fastening nut 76, and a second spring 77.

[0040] The connecting rod 71 is horizontally arranged in the front-to-back direction. Symmetrical pressure plates 72 are fixed on the left and right sides of the connecting rod 71 to press the substrate surface and prevent warping. The front and rear ends of the connecting rod 71 are connected to the connecting block 74 upward through the L-shaped support frame 73. The connecting block 74 is horizontally arranged and has a screw 75 running vertically inside. The lower section of the screw is fitted with a second spring 77, and the bottom end of the screw is fixed to the upper surface of the limiting block. The upper section of the screw 75 is fitted with a fastening nut 76. By tightening the fastening nut 76, the connecting block 74 is pressed down, causing the connecting rod 71 and the pressure plate 72 to move downward. The second spring 77 can provide a restoring force for the connecting rod 71 and the pressure plate 72 to move upward.

[0041] It should be noted that the number of the clamping components is determined according to the number of the limiting blocks, and the number is at least one. When there are multiple clamping components, the multiple clamping components are arranged in the left and right direction, thereby forming an intermittent downward pressure on the substrate to prevent warping and deformation during the heating process.

[0042] As can be seen from the above, when the FCBGA substrate is placed in the placement slot 2, the clamping blocks 61 on both sides are pushed by the front and rear edges of the FCBGA substrate during the placement process. The clamping blocks 61 slide in the through slot 8. At the same time, the clamping blocks 61 will drive the slide rod 67 to slide in the slide groove 9. When the clamping blocks 61 are displaced, they will drive the connecting frame 62 to displace. The connecting frame 62 pushes the movable tube 63 to slide on the outer surface of the stabilizing rod 64. When the movable tube 63 moves, it will drive the first spring 65 to extend, thereby clamping the FCBGA substrate between the clamping blocks 61 on both sides to achieve initial fixation. Furthermore, the clamping assembly applies appropriate pressure to prevent the FCBGA substrate from warping during preheating. Rotating the fastening nut 76 causes it to move downwards along the external thread of the screw 75. As the fastening nut 76 moves, it pushes the connecting block 74, which is in close contact with it, to slide on the outer periphery of the screw 75. This causes the connecting block 74 to push the second spring 77, causing the second spring 77 to contract. Simultaneously, the displacement of the connecting block 74 drives the support frame 73 to move downwards. The support frame 73 drives the connecting rod 71 to move downwards, and the connecting rod 71 drives the pressure plate 72 to move downwards, causing the pressure plate 72 to press tightly against the surface of the FCBGA substrate, thereby pressing and fixing the FCBGA substrate.

[0043] Furthermore, the bottom of the placement groove 2 is provided with through holes 3, and multiple through holes 3 are arranged in an array. A heating wire 4 and a temperature sensor 5 are mounted on the bottom surface of the placement plate 1. The heat generated by the heating wire 4 is guided to the bottom surface of the placement plate 1 and transferred to the FCBGA substrate through the bottom of the placement groove 2. Because the FCBGA substrate is subjected to appropriate pressure by the fixing component 6 and the clamping component 7 to prevent warping during preheating, heat can be evenly transferred to the FCBGA substrate. During preheating, the temperature can be monitored in real time by the temperature sensor 5, which is connected to a temperature controller to adjust the heating temperature in real time, ensuring that the heating temperature is always kept within an appropriate range, avoiding warping of the FCBGA substrate due to overheating or overcooling. In addition, the through holes 3 allow heat to be conducted upwards to the substrate more quickly and evenly.

[0044] The entire process of using the above-mentioned substrate fixture is as follows:

[0045] First, the FCBGA substrate is placed inside the designed placement slot 2. During this process, the front and rear edges of the FCBGA substrate will push the clamping blocks 61 arranged on both sides, causing these clamping blocks 61 to slide smoothly in the through slot 8. At the same time, the sliding of the clamping blocks 61 will also move the slide rod 67 fixedly connected to it in the slide groove 9. As the clamping blocks 61 are displaced, the connecting bracket 62 tightly connected to them will also move, thereby pushing the movable tube 63 to slide smoothly along the outer surface of the stabilizing rod 64. The movement of the movable tube 63 will also drive the extension of the first spring 65. Under the elastic force of the first spring 65, the FCBGA substrate is tightly clamped between the clamping blocks 61 on both sides, achieving a preliminary fixing effect.

[0046] After the FCBGA substrate is securely placed, further tightening is performed. By rotating the fastening nut 76, it slides smoothly on the outer periphery of the screw 75. The displacement of the fastening nut 76 pushes the connecting block 74, which is in close contact with it, to slide on the screw 75 as well. This causes the connecting block 74 to compress the second spring 77, putting it in a contracted state. At the same time, the displacement of the connecting block 74 also causes the support frame 73, which is fixedly connected to it, to move downward. The support frame 73 then causes the connecting rod 71 and the pressure plate 72, which is fixedly connected to it, to descend synchronously until the pressure plate 72 is in close contact with the top of the FCBGA substrate, thereby achieving a firm fixation of the FCBGA substrate.

[0047] Subsequently, the heating wire 4 is energized and heated. Heat is transferred from the heating wire 4 to the bottom of the placement plate 1 and then evenly transferred to the FCBGA substrate through the placement plate 1. During this process, the fixing component 6 and the clamping component 7 apply appropriate pressure to the FCBGA substrate, effectively preventing warping that may occur during the preheating stage and ensuring uniform heat transfer. In addition, the equipped temperature sensor 5 is connected to the temperature controller, which can monitor and adjust the heating temperature in real time to ensure that the heating temperature is always maintained within a suitable range, effectively avoiding FCBGA substrate warping caused by overheating or overcooling.

[0048] In summary, this invention provides an anti-warping substrate clamp, which includes a placement plate with a placement groove. Fixing components are provided on both sides of the placement groove. Under the elastic force of a first spring in the fixing components, the substrate located in the placement groove is tightly clamped between the clamping blocks on both sides, initially achieving a fixing effect. Then, a pressing component presses down on the substrate surface for fixation. With the cooperation of the fixing and pressing components, a double pressing effect on the side and surface of the substrate is achieved, ensuring the stability of the substrate. A heating wire and a temperature sensor are installed on the bottom surface of the placement plate. The heat from the heating wire is transferred to the substrate through the bottom of the placement groove. During this process, the fixing and pressing components apply appropriate pressure to the substrate, preventing warping that may occur during the preheating stage, thereby ensuring uniform heat transfer and improving heating efficiency. Simultaneously, the equipped temperature sensor can monitor the heating temperature in real time and make precise adjustments, ensuring that the heating temperature is always maintained within a suitable range, avoiding substrate warping problems caused by overheating or overcooling, further improving stability and reliability.

[0049] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A substrate clamp for preventing warping, characterized in that, The substrate clamp includes: The placement plate has an upward-facing placement groove, and the left and right edges of the placement groove are formed with mutually symmetrical limiting plates. The front and rear edges of the placement groove are respectively formed with one or multiple limiting blocks arranged in the left and right direction. The limiting blocks divide the areas on the front and rear sides of the placement groove into multiple through grooves arranged in the left and right direction. A fixing assembly, the fixing assembly including a clamping block, the clamping block being received in the through groove and used to clamp the substrate located in the placement groove from the front and rear sides; A clamping assembly, comprising a connecting rod spanning the placement groove and pressure plates fixed to the left and right sides of the connecting rod, the pressure plates being used to clamp the substrate surface.

2. The anti-warping substrate clamp according to claim 1, characterized in that: The fixing assembly also includes a support plate, which is vertically fixed to the bottom surface of the placement plate. A stabilizing rod and a first spring are vertically connected to the outer surface of the support plate facing the outside of the placement plate. The first spring is sleeved around the stabilizing rod. A movable tube is connected to the outer end of the first spring away from the support plate. The end of the movable tube facing the first spring is provided with a columnar hole that can accommodate the stabilizing rod. The first spring can provide a force to the movable tube towards the support plate. The end of the movable tube away from the first spring is connected to an L-shaped connecting frame. The connecting frame includes a vertical section extending upward from the movable tube and a horizontal section extending from the vertical section toward the placement plate. The clamping block is connected to the horizontal section.

3. The anti-warping substrate clamp according to claim 2, characterized in that: The groove walls on the left and right sides of the through groove are formed with sliding grooves extending in the front-back direction; the left and right side walls of the clamping block are fixed with sliding rods extending in the front-back direction, and the sliding rods are located in the sliding grooves.

4. The anti-warping substrate clamp according to claim 2, characterized in that: The connecting frame, movable tube, stabilizer bar, and first spring form a set of connecting parts, and a single fixed component includes two sets of connecting parts.

5. The anti-warping substrate clamp according to claim 1, characterized in that: The front and rear ends of the connecting rod are connected to the connecting block upwards via an L-shaped support frame. The connecting block is horizontally positioned and has a threaded screw running vertically inside. The lower section of the screw is fitted with a second spring, and the bottom end of the screw is fixed to the upper surface of the limiting block. The upper section of the screw is fitted with a fastening nut.

6. The anti-warping substrate clamp according to claim 1, characterized in that: At least one of the limiting plates has a vertical groove facing the placement slot.

7. The anti-warping substrate clamp according to claim 1, characterized in that: The bottom of the placement groove has through holes, and multiple through holes are arranged in an array.

8. The anti-warping substrate clamp according to claim 1, characterized in that: A heating wire is installed on the bottom surface of the placement plate.

9. The anti-warping substrate clamp according to claim 8, characterized in that: A temperature sensor is also installed on the bottom surface of the placement plate.

10. The anti-warping substrate clamp according to claim 1, characterized in that: The substrate includes an FCBGA substrate.

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