A loading device and detection apparatus

Abstract

The application relates to a loading device and a detection equipment. The loading device comprises a loading plate, a liquid accumulation groove with an upward opening and a drainage port in communication with the liquid accumulation groove, the liquid accumulation groove is used for containing a light-transmitting liquid, and the drainage port is located at a side edge of the liquid accumulation groove; a lifting assembly arranged above the loading plate and used for picking up a wafer and driving the wafer to ascend or descend; a liquid supply module in communication with the drainage port; and a control module electrically connected with the lifting assembly and the liquid supply module, the control module is used for controlling the lifting assembly to drive the wafer to descend from above a first preset position to the first preset position at a first preset descending speed, and to descend from the first preset position to contact with the loading plate at a second preset descending speed, the second preset descending speed is smaller than the first preset descending speed; and the control module is further used for controlling the liquid supply module to inject the light-transmitting liquid into the liquid accumulation groove through the drainage port when the lifting assembly drives the wafer to descend at the second preset descending speed.

Description

Technical Field

[0001] This application relates to the field of wafer inspection equipment technology, specifically to a loading device and inspection equipment. Background Technology

[0002] During wafer dicing, the wafer is typically supported on a tensioned support medium (such as a blue film), which results in a blue film adhering to the back side of the diced wafer. Due to the high roughness of the blue film, dicing defects on the back side of the wafer cannot be completely detected.

[0003] In related technologies, a common approach is to inject liquid and bring it into contact with the blue film. After the injected liquid comes into contact with the blue film, it can change the optical properties of the blue film, making the blue film present a clearer imaging effect in the camera's field of view, thereby meeting the functional requirements for wafer back defect detection.

[0004] However, bubbles are easily formed during the contact between the blue film and the liquid surface. The presence of bubbles greatly reduces the clarity of imaging the back side of the wafer and significantly reduces the accuracy of wafer back side inspection. Summary of the Invention

[0005] Therefore, it is necessary to provide a loading device and inspection equipment that can improve the clarity of imaging the back side of the wafer and improve the visual inspection accuracy of the back side of the wafer, in order to address the above problems.

[0006] On one hand, this application provides a loading device, including:

[0007] A carrier tray having an upward-opening liquid collection tank and a drain port communicating with the liquid collection tank, the liquid collection tank being used to contain light-transmitting liquid, and the drain port being located on one side edge of the liquid collection tank;

[0008] A lifting assembly, positioned above the carrier tray, is used to pick up the wafer and move it up or down.

[0009] The liquid supply module is connected to the drainage port; and

[0010] The control module is electrically connected to the lifting assembly and the liquid supply module. The control module is used to control the lifting assembly to drive the wafer from above the first preset position to the first preset position at a first preset descent speed, and from the first preset position to contact the carrier at a second preset descent speed, wherein the second preset descent speed is less than the first preset descent speed.

[0011] The control module is also used to control the liquid supply module to inject transparent liquid into the liquid accumulation tank through the drain port when the lifting component drives the wafer to descend at a second preset descent speed.

[0012] In some embodiments, the liquid supply module includes a liquid supply source, a first connecting pipe, and a first control valve. The first connecting pipe is connected between the liquid supply source and the drain port. The first control valve is installed on the first connecting pipe and electrically connected to the control module. The control module is used to control the first control valve to open when or after the lifting assembly descends to the first preset position.

[0013] In some embodiments, the carrier disk is further provided with a liquid injection port communicating with the liquid accumulation tank, and the liquid supply module is connected to the liquid injection port; the control module is further configured to control the liquid supply module to fill the liquid accumulation tank with transparent liquid through the liquid injection port before the lifting assembly drives the wafer to descend to the first preset position.

[0014] In some embodiments, the second preset descent speed is 0.1 mm / s-2 mm / s.

[0015] In some embodiments, the control module is further configured to control the lifting assembly to lift the wafer from the position in contact with the carrier at a first preset lifting speed to a second preset position, and from the second preset position at a second preset lifting speed, wherein the first preset lifting speed is less than the second preset lifting speed.

[0016] In some embodiments, the first preset rising speed is 0.1 mm / s-2.0 mm / s.

[0017] In some embodiments, the lifting assembly includes a lifting drive mechanism and a picking mechanism. The lifting drive mechanism includes a mounting base, a lead screw, a rotary drive component, and a lead screw nut. The picking mechanism is movably and vertically connected to the mounting base. The lead screw is rotatably connected to the mounting base. The output shaft of the rotary drive component is connected to the lead screw, enabling the rotary drive component to drive the lead screw to rotate. The lead screw nut is threaded onto the lead screw and connected to the picking mechanism, which is used to pick up wafers.

[0018] The rotary drive is electrically connected to the control module so that the control module can control the rotary drive to adjust its rotation speed.

[0019] In some embodiments, the carrier tray further has an overflow groove surrounding the outside of the liquid collection groove for containing translucent liquid overflowing from the liquid collection groove.

[0020] In some embodiments, the sidewall of the liquid accumulation tank is a closed ring, and the top surface of the sidewall forms a first support surface for supporting the support medium of the wafer; the carrier disk is further provided with a support portion, which is disposed around the outer periphery of the sidewall of the liquid accumulation tank, and the top surface of the support portion forms a second support surface for supporting the frame of the wafer.

[0021] In some embodiments, the first support surface is higher than the second support surface.

[0022] In some embodiments, the height difference between the first preset position and the support surface of the carrier plate is L, where L = 2mm-20mm.

[0023] In some embodiments, the bottom wall of the liquid collection tank forms a light-transmitting section that allows light to pass through into the liquid collection tank.

[0024] On the other hand, this application provides an inspection device, including a visual inspection device and a loading device as described in any of the above embodiments. The visual inspection device includes an imaging module arranged below the carrier tray. The imaging module is used to acquire imaging light from the wafer and passing through the light-transmitting liquid in the liquid accumulation tank to image the wafer.

[0025] Compared with the prior art, this application has the following beneficial effects:

[0026] Before visual operation, the aforementioned loading device and testing equipment first have the lifting assembly pick up the wafer to be tested at an initial position. The control module then controls the lifting assembly to lower the wafer to a preset position at a first preset descent speed. At this point, the wafer is close to the carrier disk, meaning the distance between the wafer's support medium and the surface of the transparent liquid in the liquid accumulation tank is relatively short. Next, the control module controls the lifting assembly to decelerate, lowering the wafer to a second preset descent speed. During this descent, the control module controls the liquid supply module to inject transparent liquid into the liquid accumulation tank through a drain port. Simultaneously, the surface of the transparent liquid in the accumulation tank gradually rises from the side with the drain port to the opposite side, gradually bringing the wafer's support medium into contact with the raised liquid surface until the support medium is in full contact with the entire liquid surface. Subsequently, a visual inspection device can be used to acquire images. The imaging light from the bottom surface of the wafer body and passing through the support medium and the transparent liquid in sequence is acquired by the visual inspection device, so that the visual inspection device can use the imaging light to image the bottom surface of the wafer body, and then determine whether there are dicing defects based on the image of the bottom surface of the wafer body, that is, to realize the visual inspection of the bottom surface of the wafer body.

[0027] Thus, when the wafer's support medium is about to contact the surface of the transparent liquid in the accumulating tank, the lifting assembly reduces the wafer's descent speed to a second preset descent speed. This matches the wafer's descent speed with the rising speed of the transparent liquid surface in the accumulating tank, ensuring that as the liquid surface gradually rises from the side near the inlet to the opposite side, the wafer's support medium contacts the rising liquid surface sequentially. This allows air between the wafer's support medium and the liquid surface to be expelled to one side, preventing the formation of air bubbles between the liquid surface and the support medium. Consequently, the presence of air bubbles avoids a decrease in the clarity of the image of the bottom surface of the wafer by the vision inspection device, thus improving the accuracy of the vision inspection device's visual inspection of the bottom surface of the wafer. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the wafer structure in one embodiment of this application;

[0029] Figure 2 This is a schematic diagram of the structure of the detection device in one embodiment of this application;

[0030] Figure 3 for Figure 2 A schematic diagram of the detection device shown from another perspective;

[0031] Figure 4 for Figure 2 The diagram shows the structural schematic of the loading device of the detection equipment.

[0032] Figure 5 for Figure 4 A schematic diagram of the carrier plate of the loading device is shown;

[0033] Figures 6 to 7 for Figure 4 The diagram illustrates the process of the lifting assembly of the loading device lowering the wafer.

[0034] Figures 8 to 9 for Figure 4 The diagram shows a demonstration of the process by which the lifting assembly of the loading device drives the wafer to rise.

[0035] Explanation of reference numerals in the attached drawings: 100, wafer; 101, support medium; 102, frame; 103, wafer body; 10, loading device; 11, carrier tray; 112, liquid accumulation tank; 1121, side wall; 1123, bottom wall; 1125, light-transmitting part; 113, support part; 114, overflow tank; 12, lifting assembly; 1210, mounting base; 1212, rotary drive component; 121, lifting drive mechanism; 123, pickup mechanism; 20, vision inspection device; 21, motion assembly; 22, imaging module; a1, first support surface; a2, second support surface; b1, drain port; b2, injection port; b3, drain port; d0, initial position; d1, first preset position; d2, second preset position; V1, first preset descent speed; V2, second preset descent speed; V3, first preset ascent speed; V4, second preset ascent speed. Detailed Implementation

[0036] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0037] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0040] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0042] Please see Figures 1 to 5 This application provides a testing device, including a loading device 10 and a vision inspection device 20. The loading device 10 is used to load a wafer 100 to be inspected. The wafer 100 includes a wafer body 103, a frame 101 surrounding the outer periphery of the wafer body 103, and a support medium 102 attached to the surfaces of the wafer body 103 and the frame 101, i.e., the frame 101 supports and fixes the support medium 102, and the wafer body 103 is supported on the support medium 102. The vision inspection device 20 is arranged below the loading device 10 and is used to perform visual inspection on the bottom surface of the wafer body 103 of the wafer 100 on the loading device 10.

[0043] The loading device 10 includes a carrier tray 11, a lifting assembly 12, a liquid supply module (not shown), and a control module (not shown). The carrier tray 11 has an upward-opening liquid collection tank 112 and a drain port b1 communicating with the liquid collection tank 112. The liquid collection tank 112 is used to contain transparent liquid, and the drain port b1 is located on one edge of the liquid collection tank 112. The lifting assembly 12 is arranged above the carrier tray 11 and is used to pick up the wafer 100 and move the wafer 100 up or down. The liquid supply module is connected to the drain port b1, allowing the liquid supply module to inject transparent liquid into the liquid collection tank 112 through the drain port b1. The control module is electrically connected to the lifting assembly 12 and the liquid supply module, enabling signal feedback between the control module and the lifting assembly 12 and the liquid supply module to control the lifting assembly 12 and the liquid supply module to perform corresponding operations. The control module is used to control the lifting assembly 12 to lower the wafer 100 from its initial position to a first preset position d1 at a first preset d1 (see...). Figure 6 ), and from the first preset position d1, it descends at the second preset descent speed V2 to the position where it contacts the carrier plate 11 (see Figure 7 The second preset descent speed V2 is less than the first preset descent speed V1. The control module is also used to control the liquid supply module to inject transparent liquid into the liquid accumulation tank 112 through the drain port b1 when the lifting component 12 drives the wafer 100 to descend at the second preset descent speed V2. This causes the liquid level in the liquid accumulation tank 112 to gradually spread and rise from the area near the drain port b1 to the surrounding areas, ensuring that when the lifting component 12 drives the wafer 100 to descend, the liquid level and the support medium 102 of the wafer 100 gradually come into contact along the direction in which the liquid level rises, until the support medium 102 of the wafer 100 is in complete contact with the entire liquid surface. After the support medium 102 of the wafer 100 is in complete contact with the liquid surface of the transparent liquid in the liquid accumulation tank 112, the vision inspection device 20 located below the carrier 11 collects imaging light from the bottom surface of the wafer body 103 and passes through the support medium 102 and the transparent liquid in sequence to image the bottom surface of the wafer body 103, and determines whether there is a dicing defect based on the image of the bottom surface of the wafer body 103, that is, to realize the vision inspection of the bottom surface of the wafer body 103.

[0044] For the above-mentioned testing equipment, please refer to [the relevant documentation / reference] during actual use. Figure 6 and Figure 7 First, the lifting assembly 12 is in the initial position d0 (see...) Figure 6 The control module picks up the wafer 100 to be inspected, and controls the lifting assembly 12 to lower the wafer 100 to a preset position d1 at a first preset d1 speed V1 (see...). Figure 6At this point, the wafer 100 is relatively close to the carrier 11, meaning the distance between the support medium 102 of the wafer 100 and the liquid surface of the transparent liquid in the liquid collection tank 112 is relatively close. (Before the wafer 100 contacts the carrier 11, a certain amount of transparent liquid can be pre-injected into the empty liquid collection tank 112 to make it level with or approximately level with the opening of the liquid collection tank 112. This can be done by pouring directly or by injecting through the injection port b2, avoiding temporary liquid injection during testing that would occupy testing time and reduce efficiency.) Then, the control module controls the lifting assembly 12 to decelerate, causing the wafer 100 to continue descending at a second preset descent speed V2. During the process of the lifting assembly 12 driving the wafer 100 to descend at the second preset descent speed V2, the control module controls the liquid supply module to inject transparent liquid into the liquid collection tank 112 through the drainage port b1. During liquid injection, the liquid level of the transparent liquid in the liquid accumulation tank 112 gradually rises from the side with the drain port b1 to the opposite side, so that the support medium 102 of the wafer 100 gradually contacts the raised liquid level until the support medium 102 of the wafer 100 contacts the entire liquid level. Then, the imaging light from the bottom surface of the wafer body 103, passing through the support medium 102 and the transparent liquid in sequence, is collected by the vision inspection device 20, so that the vision inspection device 20 uses the imaging light to image the bottom surface of the wafer body 103, and then determines whether there is a dicing defect based on the image of the bottom surface of the wafer body 103, that is, to realize the visual inspection of the bottom surface of the wafer body 103. It should be noted that the control module can be a host computer, and the lifting assembly 12 and the liquid supply module are electrically connected to the host computer, so that the host computer can transmit signals with the lifting assembly 12 and the liquid supply module, thereby controlling the lifting assembly 12 and the liquid supply module to complete the corresponding operations.

[0045] Thus, when the support medium 102 of the wafer 100 is about to contact the surface of the transparent liquid in the liquid accumulation tank 112, the lifting component 12 reduces the descent speed of the wafer 100 to a second preset descent speed V2, so that the descent speed of the wafer 100 matches the rising speed of the transparent liquid in the liquid accumulation tank 112. This ensures that as the liquid surface gradually rises from the side near the drain port b1 to the opposite side, the support medium 102 of the wafer 100 contacts the rising liquid surface in sequence, causing the air between the support medium 102 and the liquid surface to be discharged to one side. This avoids the formation of air bubbles between the liquid surface and the support medium 102, thereby preventing the visual inspection device 20 from reducing the clarity of the image of the bottom surface of the wafer body 103 due to the presence of air bubbles. This helps to improve the accuracy of the visual inspection device 20 in visually inspecting the bottom surface of the wafer body 103.

[0046] It should be noted that during the process of the lifting assembly 12 driving the wafer 100 to descend, the lifting assembly 12 first drives the wafer 100 to descend at a relatively fast first preset descent speed V1, which helps to shorten the descent time of the wafer 100 and improve the detection efficiency. When the wafer 100 reaches the first preset position d1, the lifting assembly 12 drives the wafer 100 to continue descending at a slower second preset descent speed V2, so that the descent speed of the wafer 100 matches the rising speed of the light-transmitting liquid in the liquid accumulation tank 112, ensuring that the support medium 102 of the wafer 100 gradually contacts the raised liquid surface (i.e., the liquid surface that is raised first contacts the support medium 102 first, and the liquid surface that is raised later contacts the support medium 102 later), driving the air between the support medium 102 and the liquid surface to be discharged from one side, and avoiding the formation of air bubbles between the support medium 102 and the liquid surface.

[0047] It should also be noted that, in some embodiments, when the lifting assembly 12 lowers the wafer 100 to the first preset position d1, the control module controls the liquid supply module to start continuously injecting transparent liquid into the liquid accumulation tank 112 through the drain port b1. After the support medium 102 of the wafer 100 comes into contact with the entire liquid surface, the control module controls the liquid supply module to stop injecting transparent liquid into the liquid accumulation tank 112.

[0048] Assuming the time when wafer 100 descends to the first preset position d1 is 0, and the time when the second preset descent speed V2 reaches contact with the carrier disk (or the top surface of the liquid film) is P seconds, optionally, P = 2 seconds to 60 seconds, with no specific limitation, then in the above embodiment, the process of the control module controlling the liquid supply module to inject transparent liquid into the liquid accumulation tank 112 through the drainage port b1 is continuously performed between 0 and the Pth second.

[0049] Since the top surface of the liquid film generally protrudes a distance L from the first support surface a1 on the carrier 11 due to surface tension, the height difference h1 between the set first preset position d1 and the first support surface a1 on the carrier 11 needs to exceed the distance L. Otherwise, too late deceleration may generate bubbles that are difficult to eliminate due to the rapid contact between the wafer 100 and the liquid film. However, it cannot be too far either, otherwise a long and slow descent to contact the carrier 11 would be too time-consuming and inefficient, resulting in more harm than good. Preferably, h1 = 2mm-20mm. Therefore, based on the above principle, as long as the bottom of the wafer 100 has not yet contacted the top surface of the liquid film, it is not necessary to start the flow immediately. In other embodiments, after the lifting assembly 12 lowers the wafer 100 to a first preset position d1, and before the support medium 102 of the wafer 100 contacts the surface of the transparent liquid in the liquid accumulation tank 112, a preset time is optionally set. This preset time can be any time between 0 and 0.5P seconds, for example, starting from 0.1P seconds, 0.15P seconds, or 0.2P seconds, etc., and continuing until P seconds. The control module controls the liquid supply module to continuously inject transparent liquid into the liquid accumulation tank 112 through the drainage port b1 from the preset time until P seconds. After the support medium 102 of the wafer 100 contacts the entire liquid surface, the control module controls the liquid supply module to stop injecting transparent liquid into the liquid accumulation tank 112.

[0050] It should be noted that the second preset descent speed V2 can be from 0.1 mm / s to 2.0 mm / s, for example, 0.1 mm / s, 0.2 mm / s, 0.3 mm / s, 0.4 mm / s, 0.5 mm / s, 0.6 mm / s, 0.7 mm / s, 0.8 mm / s, 0.9 mm / s, 1.0 mm / s, 1.1 mm / s, 1.2 mm / s, 1.3 mm / s, 1.4 mm / s, 1.5 mm / s, 1.6 mm / s, 1.7 mm / s, 1.8 mm / s, 1.9 mm / s, or 2.0 mm / s. Preferably, the second preset descent speed V2 can be from 0.6 mm / s to 1.0 mm / s. The first preset descent speed V1 only needs to be greater than the second preset descent speed V2, and is not specifically limited here.

[0051] Specifically, in this embodiment, the liquid supply module includes a liquid supply source, a first connecting pipe, and a first control valve. The liquid supply source provides a transparent liquid. The first connecting pipe connects the liquid supply source and the drain port b1, allowing the transparent liquid supplied by the liquid supply source to be transported to the collection tank 112 through the first connecting pipe. The first control valve is installed on the first connecting pipe and electrically connected to the control module, enabling the control module to control the opening or closing of the first control valve. When the first control valve is closed, the first connecting pipe is in a closed state, and the liquid supply source cannot inject transparent liquid into the collection tank 112 through the first connecting pipe. When the first control valve is open, the first connecting pipe is in an open state, and the liquid supply source can inject transparent liquid into the collection tank 112 through the first connecting pipe.

[0052] During the descent of the wafer 100 driven by the lifting assembly 12, the control module controls the first control valve to open when the lifting assembly 12 descends to the first preset position d1, thereby allowing the transparent liquid supplied by the liquid supply source to be injected into the liquid accumulation tank 112 through the first connecting pipe and the drain port b1. After the support medium 102 of the wafer 100 is in complete contact with the liquid surface of the transparent liquid in the liquid accumulation tank 112, the control module controls the first control valve to close, so that the transparent liquid supplied by the liquid supply source cannot be injected into the liquid accumulation tank 112 through the first connecting pipe and the drain port b1, that is, the injection of transparent liquid into the liquid accumulation tank 112 is stopped.

[0053] In a specific embodiment, the carrier 11 is also provided with a liquid injection port b2 that communicates with the liquid accumulation tank 112. The liquid supply module is connected to the liquid injection port b2, so that the liquid supply module can inject transparent liquid into the liquid accumulation tank 112 through the liquid injection port b2. The control module is also used to control the liquid supply module to fill the liquid accumulation tank 112 with transparent liquid through the liquid injection port b2 before the lifting assembly 12 drives the wafer 100 down to the first preset position d1. This avoids the liquid accumulation tank 112 not being filled with transparent liquid when the wafer 100 descends to contact the carrier 11, which would prevent the support medium 102 of the wafer 100 from being in complete contact with the liquid surface of the transparent liquid in the liquid accumulation tank 112.

[0054] Furthermore, the liquid supply module also includes a second connecting pipe and a second control valve. The second connecting pipe connects the liquid supply source and the injection port b2, allowing the transparent liquid supplied by the liquid supply source to be delivered to the collection tank 112 via the second connecting pipe. The second control valve is installed on the second connecting pipe and electrically connected to the control module, enabling the control module to control the opening or closing of the second control valve. When the second control valve is closed, the second connecting pipe is in a closed state, and the liquid supply source cannot inject transparent liquid into the collection tank 112 through the second connecting pipe and the injection port b2. When the second control valve is open, the second connecting pipe is in an open state, and the liquid supply source can inject transparent liquid into the collection tank 112 through the second connecting pipe and the injection port b2.

[0055] Before the lifting assembly 12 lowers the wafer 100 to the first preset position d1, the control module controls the second control valve to open, so that the liquid supply source injects light-transmitting liquid into the liquid accumulation tank 112 through the second connecting pipe and the liquid injection port b2 until the liquid accumulation tank 112 is full or nearly full.

[0056] It should be noted that while the control module controls the second control valve to open, allowing the liquid supply source to inject transparent liquid into the liquid accumulation tank 112 through the second connecting pipe and the injection port b2, the control module can also control the first control valve to open, allowing the liquid supply source to inject transparent liquid into the liquid accumulation tank 112 through the first connecting pipe and the drain port b1 until the liquid accumulation tank 112 is full. In other words, the liquid supply module can simultaneously inject transparent liquid into the liquid accumulation tank 112 through both the injection port b2 and the drain port b1 until the liquid accumulation tank 112 is full, thereby shortening the time required to fill the liquid accumulation tank 112 with transparent liquid and improving the injection efficiency.

[0057] Optionally, the number of drainage ports b1 can be one or two arranged side by side. In an embodiment where two drainage ports b1 are arranged side by side, both drainage ports b1 are connected to a liquid supply source through a first connecting pipe, thereby using a first control valve on the first connecting pipe to control the two drainage ports b1 to simultaneously inject liquid into the liquid accumulation tank 112 or simultaneously stop injecting liquid into the liquid accumulation tank 112. That is, when the control module controls the first control valve to open, the light-transmitting liquid supplied by the liquid supply source is injected into the liquid accumulation tank 112 through the first connecting pipe and the two drainage ports b1. When the control module controls the first control valve to close, the light-transmitting liquid supplied by the liquid supply source cannot be injected into the liquid accumulation tank 112 through the first connecting pipe and the two drainage ports b1.

[0058] Optionally, there can be one or more injection ports b2. In an embodiment where there are multiple injection ports b2, the multiple injection ports b2 and drainage ports b1 are spaced apart along the peripheral edge of the liquid accumulation tank 112. All injection ports b2 are connected to the liquid supply source through a second connecting pipe, thereby using a second control valve on the second connecting pipe to simultaneously control all injection ports b2 to inject liquid into the liquid accumulation tank 112 or simultaneously stop injecting liquid into the liquid accumulation tank 112. That is, when the control module controls the second control valve to open, the light-transmitting liquid supplied by the liquid supply source is injected into the liquid accumulation tank 112 through the second connecting pipe and each injection port b2. When the control module controls the second control valve to close, the light-transmitting liquid supplied by the liquid supply source cannot be injected into the liquid accumulation tank 112 through the second connecting pipe and each injection port b2.

[0059] In a specific embodiment, the loading device 10 further includes a liquid return module for recovering the translucent liquid. The carrier tray 11 is also provided with a drain port b3 communicating with the liquid collection tank 112. The liquid return module is connected to the drain port b3 via a pipeline, allowing the liquid return module to draw the translucent liquid from the liquid collection tank 112 through the drain port b3. Thus, when the translucent liquid in the liquid collection tank 112 needs to be replaced, the control module controls the liquid return module to draw the translucent liquid from the liquid collection tank 112 through the drain port b3. It should be noted that the number of drain ports b3 can be one or more (i.e., two or more). When there are multiple drain ports b3, the liquid return module can draw the translucent liquid from the liquid collection tank 112 through each drain port b3 to improve drainage efficiency.

[0060] In a specific embodiment, the carrier tray 11 also has an overflow groove 114, which surrounds the outside of the liquid collection tank 112. The overflow groove 114 is used to contain the light-transmitting liquid overflowing from the liquid collection tank 112. In this way, the light-transmitting liquid overflowing from the liquid collection tank 112 flows into the overflow groove 114, thereby preventing the light-transmitting liquid from leaking.

[0061] It should be noted that, as the lifting assembly 12 lowers the wafer 100 at a relatively slow second preset descent speed V2, the control module controls the liquid supply module to inject transparent liquid into the liquid accumulation tank 112 through the drain port b1, so that part of the transparent liquid in the liquid accumulation tank 112 overflows from the liquid accumulation tank 112 into the overflow tank 114, thereby preventing leakage of transparent liquid.

[0062] Furthermore, the carrier plate 11 is also provided with a return port that communicates with the overflow tank 114. The return module is connected to the return port through a pipeline, which enables the return module to extract the light-transmitting liquid in the overflow tank 114, thereby realizing the recovery of the light-transmitting liquid.

[0063] Specifically, in this embodiment, the sidewall 1121 of the liquid accumulation tank 112 is a closed annulus, and the top surface of the sidewall 1121 forms a first support surface a1 for supporting the support medium 102 of the wafer 100. Since the sidewall 1121 of the liquid accumulation tank 112 is a closed annulus, the first support surface a1 is also a closed annulus. Thus, when the pickup mechanism lowers the wafer 100 to the position where it contacts the carrier disk 11, the support medium 102 of the wafer 100 adheres to the first support surface a1. On the one hand, this serves to tension the support medium 102; on the other hand, the adhesion between the support medium 102 and the first support surface a1 provides a certain sealing effect, sealing the light-transmitting liquid within the liquid accumulation tank 112. This ensures the stability of the liquid film on the lower surface of the support medium 102, which helps improve the clarity of the imaging of the bottom surface of the wafer body 103 by the vision inspection device 20, thereby improving the accuracy of the vision inspection.

[0064] It should be noted that the aforementioned drainage port b1, injection port b2, and drainage port b3 can all be located on the side wall 1121 of the liquid accumulation tank 112. Of course, in other embodiments, the drainage port b1, injection port b2, and drainage port b3 can also be located on the bottom wall 1123 of the liquid accumulation tank 112, and no special limitation is made here.

[0065] Furthermore, a support portion 113 is also provided on the carrier 11, which surrounds the outer periphery of the side wall 1121 of the liquid accumulation tank 112. The top surface of the support portion 113 forms a second support surface a2 for supporting the frame 101 of the wafer 100. Thus, when the lifting assembly 12 lowers the wafer 100 until it is pressed firmly onto the carrier 11, the frame 101 of the wafer 100 is pressed against the second support surface a2 of the support portion 113, and the support medium 102 of the wafer 100 is supported on the first support surface a1 on the carrier 11 and is in contact with the liquid surface of the light-transmitting liquid in the liquid accumulation tank 112.

[0066] Furthermore, the first support surface a1 on the carrier 11 is higher than the second support surface a2. It is understood that when the liquid collection tank 112 is filled with transparent liquid, the liquid level will be slightly higher than the first support surface a1 due to the surface tension of the liquid. That is, the liquid level of the transparent liquid in the liquid collection tank 112 is slightly higher than the first support surface a1, and the first support surface a1 is higher than the second support surface a2. Therefore, during the process of the lifting assembly 12 lowering the wafer 100, the support medium 102 of the wafer 100 first contacts the liquid level of the transparent liquid in the liquid collection tank 112, then contacts and adheres to the first support surface a1, and finally the frame 101 of the wafer 100 contacts and is pressed against the second support surface a2 of the support portion 113. This achieves both the effect of tensioning the support medium 102 and the effect of pressing and fixing the wafer 100 onto the carrier 11. At this point, the lifting assembly 12 stops descending and maintains the state of pressing the frame 101 of the wafer 100 against the second support surface a2, thus achieving the goal of pressing and fixing the wafer 100 onto the carrier 11. Subsequently, a visual inspection device can be used for image acquisition.

[0067] Optionally, the height difference between the first preset position d1 and the first support surface a1 on the carrier plate 11 is h1, where h1 = 2 mm - 20 mm, for example, h1 = 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, 15 mm, 16 mm, 17 mm, 18 mm, 19 mm, or 20 mm. Preferably, the height difference h1 between the first preset position d1 and the first support surface a1 on the carrier plate 11 is 0.8 mm / s.

[0068] Specifically, in this embodiment, the bottom wall 1123 of the liquid accumulation tank 112 forms a light-transmitting portion 1125 for light to pass through into the liquid accumulation tank 112. Thus, when the lifting mechanism 12 lowers the wafer 100 and presses the frame 101 of the wafer 100 against the second support surface a2 on the carrier 11, the visual inspection device 20 collects imaging light from the bottom surface of the wafer body 103 at the bottom of the light-transmitting portion 1125. This light passes sequentially through the support medium 102, the light-transmitting liquid in the liquid accumulation tank 112, and the light-transmitting portion 1125, thereby achieving an image of the bottom surface of the wafer body 103. Based on this image, it is determined whether there are defects on the bottom surface of the wafer body 103, thus achieving visual inspection of the bottom surface of the wafer body 103.

[0069] It should be noted that the light-transmitting liquid can be water, or a liquid or combination thereof such as glycerin or ethanol, as long as the refractive index of the light-transmitting liquid is similar to that of the light-transmitting element and the supporting medium 102. The light-transmitting part 1125 can be made of light-transmitting glass with a refractive index between 1.5 and 1.9, or it can be made of other organic or inorganic materials. The supporting medium 102 of the wafer 100 can be a film such as a blue film, PET film, or UV film, as long as it can support the wafer 100, and no special limitation is made here.

[0070] Specifically, in this embodiment, the visual inspection device 20 includes a motion component 21 and an imaging module 22 disposed on the motion component 21. The motion component 21 drives the imaging module 22 to move in a horizontal plane, thereby changing the position of the imaging module 22 relative to the carrier 11 and the wafer 100 pressed onto the carrier 11, so that the imaging module 22 can perform visual inspection on different areas of the bottom surface of the wafer body 103. This process eliminates the need to move the wafer, the sealed liquid film, and the stably fixed wafer 100, enabling stable inspection of the wafer body 103 over a wide range.

[0071] It is understandable that the dimensions of the outline opening of the liquid accumulation tank 112 and the outline dimensions of the light-transmitting part 1125 are both greater than or equal to the outline dimensions of the wafer body 103 of the wafer 100, so that the light-transmitting liquid in the liquid accumulation tank 112 and the orthographic projection of the light-transmitting part 1125 on a horizontal plane can completely cover the orthographic projection of the wafer body 103 on that horizontal plane, ensuring that the imaging module 22 can perform visual inspection on each area of ​​the bottom surface of the wafer body 103.

[0072] In embodiments of this application, the control module is further configured to control the lifting assembly 12 to lift the wafer 100 from the position in contact with the carrier 11 at a first preset lifting speed V3 to a second preset position d2 (see...). Figure 8The wafer 100 is raised from the second preset position d2 at a second preset rising speed V4. The first preset rising speed V3 is less than the second preset rising speed V4. After the visual inspection device 20 completes the visual inspection of the bottom surface of the wafer body 103, the control module first controls the lifting assembly 12 to rise at a slower first preset rising speed V3, so that the frame 101 of the wafer 100 separates from the carrier 11, and the support medium 102 of the wafer 100 also gradually separates from the liquid surface of the transparent liquid in the liquid accumulation tank 112. When the lifting assembly 12 drives the wafer 100 to the second preset position d2 at the first preset rising speed V3, the support medium 102 of the wafer 100 has completely separated from the liquid surface of the transparent liquid in the liquid accumulation tank 112. At this time, the control module controls the lifting assembly 12 to accelerate the wafer 100 to the second preset rising speed V4 and continue to rise until it returns to the initial position d0 (see Figure 9 ).

[0073] Thus, during the process of the lifting assembly 12 driving the wafer 100 to rise, please refer to... Figures 8 to 9 The lifting assembly 12 first slowly raises the wafer 100 (i.e., the rising speed is the first preset rising speed V3), allowing the support medium 102 of the wafer 100 to slowly separate from the surface of the light-transmitting liquid in the liquid accumulation tank 112. This allows sufficient time for the light-transmitting liquid to separate from the support medium 102, preventing excessive pulling force on the support medium 102 due to the wafer 100 rising too quickly. After the support medium 102 of the wafer 100 has completely separated from the surface of the light-transmitting liquid in the liquid accumulation tank 112, the lifting assembly 12 then rapidly raises the wafer 100, thereby shortening the time required for the wafer 100 to rise to the initial position d0, which helps improve production efficiency.

[0074] It should be noted that the first preset rising speed V3 can be from 0.1 mm / s to 2.0 mm / s, for example, 0.1 mm / s, 0.2 mm / s, 0.3 mm / s, 0.4 mm / s, 0.5 mm / s, 0.6 mm / s, 0.7 mm / s, 0.8 mm / s, 0.9 mm / s, 1.0 mm / s, 1.1 mm / s, 1.2 mm / s, 1.3 mm / s, 1.4 mm / s, 1.5 mm / s, 1.6 mm / s, 1.7 mm / s, 1.8 mm / s, 1.9 mm / s, or 2.0 mm / s. Preferably, the first preset rising speed V3 can be 0.8 mm / s. The second preset rising speed V4 only needs to be greater than the first preset rising speed V3, and is not specifically limited here.

[0075] It should be noted that the second preset position d2 and the first preset position d1 can be the same position, that is, the height difference between the second preset position d2 and the first support surface a1 on the carrier 11 is h2, which is equal to h1. Of course, in other embodiments, the second preset position d2 and the first preset position d1 can be two different positions, that is, the height difference between the second preset position d2 and the first support surface a1 on the carrier 11 is not equal to h1.

[0076] Please continue reading Figures 2 to 5 Specifically, in this embodiment, the lifting assembly 12 includes a lifting drive mechanism 121 and a pickup mechanism 123. The lifting drive mechanism 121 includes a mounting base 1210, a lead screw, a rotary drive component 1212, and a lead screw nut. The pickup mechanism 123 is movably connected to the mounting base 1210. The lead screw is rotatably connected to the mounting base 1210, and its axis is parallel to the vertical direction. The rotary drive component 1212 is mounted on the mounting base 1210, and its drive end is connected to the lead screw, enabling the rotary drive component 1212 to drive the lead screw to rotate relative to the mounting base 1210. The lead screw nut is threaded onto the lead screw and connected to the pickup mechanism 123, so that when the lead screw rotates, it drives the lead screw nut to rise or fall, which in turn drives the pickup mechanism 123 to rise or fall.

[0077] Thus, when it is necessary to lower the wafer 100, the rotary drive 1212 drives the lead screw to rotate, thereby causing the lead screw nut to move downward along the axis of the lead screw. The lead screw nut then drives the pickup mechanism 123 to move downward, and the pickup mechanism 123 lowers the picked-up wafer 100. When it is necessary to raise the wafer 100, the rotary drive 1212 drives the lead screw to rotate in the opposite direction, thereby causing the lead screw nut to move upward along the axis of the lead screw. The lead screw nut then drives the pickup mechanism 123 to move upward, and the pickup mechanism 123 raises the picked-up wafer 100.

[0078] Furthermore, the rotary drive 1212 is electrically connected to the control module, enabling the control module to control the rotary drive 1212 to adjust its rotational speed, thereby adjusting the rotational speed of the lead screw, and subsequently adjusting the upward or downward movement speed of the lead screw nut and the pickup mechanism 123, ultimately adjusting the speed at which the pickup mechanism 123 drives the wafer 100 to rise or fall. Optionally, the rotary drive 1212 can be a motor.

[0079] It should be noted that the lifting drive mechanism 121 can also use other linear drive modules, such as electric cylinders or linear motors, as long as they can drive the picking mechanism 123 to rise or fall and change speed under the control of the control module. No special limitations are made here.

[0080] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0081] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A loading device, characterized in that, include: The carrier plate (11) has an upward-opening liquid collection tank (112) and a drain port (b1) communicating with the liquid collection tank (112), the liquid collection tank (112) being used to contain light-transmitting liquid, and the drain port (b1) being located on one side edge of the liquid collection tank (112). A lifting assembly (12) is arranged above the carrier (11) for picking up the wafer (100) and driving the wafer (100) to rise or fall; The liquid supply module is connected to the drainage port (b1); and The control module is electrically connected to the lifting assembly (12) and the liquid supply module. The control module is used to control the lifting assembly (12) to drive the wafer (100) from above the first preset position to the first preset position at a first preset descent speed, and from the first preset position to contact the carrier disk (11) at a second preset descent speed. The second preset descent speed is less than the first preset descent speed. The control module is also used to control the liquid supply module to inject transparent liquid into the liquid accumulation tank (112) through the drain port (b1) when the lifting component (12) drives the wafer (100) to descend at a second preset descending speed.

2. The loading device according to claim 1, characterized in that, The liquid supply module includes a liquid supply source, a first connecting pipe and a first control valve. The first connecting pipe is connected between the liquid supply source and the drain port (b1). The first control valve is installed on the first connecting pipe and is electrically connected to the control module. The control module is used to control the first control valve to open when or after the lifting assembly (12) descends to the first preset position.

3. The loading device according to claim 1, characterized in that, The carrier disk (11) is also provided with a liquid injection port that communicates with the liquid accumulation tank (112), and the liquid supply module is connected to the liquid injection port; the control module is also used to control the liquid supply module to fill the liquid accumulation tank with transparent liquid through the liquid injection port before the lifting component (12) drives the wafer to descend to the first preset position.

4. The loading device according to claim 1, characterized in that, The second preset descent speed is 0.1 mm / s-2 mm / s.

5. The loading device according to claim 1, characterized in that, The control module is also used to control the lifting component (12) to drive the wafer (100) from the position in contact with the carrier disk (11) to the second preset position at a first preset lifting speed, and from the second preset position to the second preset lifting speed, wherein the first preset lifting speed is less than the second preset lifting speed.

6. The loading device according to claim 5, characterized in that, The first preset rising speed is 0.1 mm / s-2.0 mm / s.

7. The loading device according to claim 1 or 5, characterized in that, The lifting assembly (12) includes a lifting drive mechanism (121) and a picking mechanism (123). The lifting drive mechanism (121) includes a mounting base (1210), a lead screw, a rotary drive component (1212), and a lead screw nut. The picking mechanism (123) is movably connected to the mounting base (1210). The lead screw is rotatably connected to the mounting base (1210). The output shaft of the rotary drive component (1212) is connected to the lead screw, so that the rotary drive component (1212) can drive the lead screw to rotate. The lead screw nut is threaded onto the lead screw and connected to the picking mechanism (123). The picking mechanism (123) is used to pick up the wafer (100). The rotary drive (1212) is electrically connected to the control module so that the control module can control the rotary drive (1212) to adjust the rotation speed.

8. The loading device according to claim 1, characterized in that, The carrier plate (11) also has an overflow groove (114) which is arranged around the outside of the liquid collection tank (112) to contain the light-transmitting liquid overflowing from the liquid collection tank (112).

9. The loading device according to claim 1, characterized in that, The sidewall (1121) of the liquid accumulation tank (112) is a closed ring, and the top surface of the sidewall (1121) forms a first support surface (a1) for supporting the support medium (102) for supporting the wafer (100); a support part (113) is also provided on the carrier disk (11), the support part (113) is arranged around the outer periphery of the sidewall (1121) of the liquid accumulation tank (112), and the top surface of the support part (113) forms a second support surface (a2) for supporting the frame (101) for supporting the wafer (100).

10. The loading device according to claim 9, characterized in that, The first support surface (a1) is higher than the second support surface (a2).

11. The loading device according to any one of claims 1-6 and 8-10, characterized in that, The height difference between the first preset position and the support surface of the carrier plate (11) is L, where L = 2mm - 20mm.

12. The loading device according to claim 1, characterized in that, The bottom wall (1123) of the liquid collection tank (112) forms a light-transmitting part (1125) that allows light to pass through into the liquid collection tank (112).

13. A testing device, characterized in that, The device includes a visual inspection device (20) and a loading device (10) as described in claims 1 to 12. The visual inspection device (20) includes an imaging module (22) arranged below the carrier (11). The imaging module (22) is used to acquire imaging light from the wafer (100) and passing through the light-transmitting liquid in the liquid accumulation tank (112) to image the wafer (100).

Images