Chip mounting device and chip mounting method

Abstract

This invention relates to the field of chip mounting technology in semiconductor device manufacturing, specifically disclosing a chip mounting apparatus and method. The apparatus includes mounting posts, a main suction cup, a holding member, a movable frame, multiple peripheral suction cups, and a release drive. The main suction cup and peripheral suction cups are connected to independently switchable suction channels. The holding member holds the periphery of the main suction cup at a lower position, and the peripheral suction cups are arranged around the main suction cup on the movable frame. During chip mounting, the main suction cup and peripheral suction cups jointly adsorb the chip. After the chip is placed on the target substrate, the movable frame moves upward along a first release stroke, causing the peripheral suction cups to leave the chip first, while the main suction cup continues to hold the chip in position. The movable frame continues to move upward, causing the holding member to release the pressure on the periphery of the main suction cup, simultaneously depressurizing the main suction cup, allowing the periphery of the main suction cup to elastically reset and release adsorption. This invention releases adsorption sequentially from the periphery to the center, reducing chip warping, rotation, and positional displacement.

Description

Technical Field

[0001] This invention relates to the field of chip mounting technology in semiconductor device manufacturing, and specifically to a chip mounting apparatus and a chip mounting method. Background Technology

[0002] In semiconductor device manufacturing, a chip placement device is typically used to pick up chips from a carrier film, tray, or feed table, and after handling and positioning, place them on a designated placement area on the substrate. The placement device generally uses a vacuum nozzle to adhere to the chip surface, reducing damage caused by mechanical clamping. For chips with large areas, thin thicknesses, or surfaces with grinding marks or localized unevenness, it is difficult to form a continuous and stable seal between the nozzle and the chip. This can easily lead to vacuum leakage, chip slippage, or detachment during chip picking and handling. Therefore, a flexible adsorption structure is needed to increase the adsorption range and adapt to variations in the chip surface.

[0003] Chinese invention patent CN109037420B discloses a flip chip die bonding apparatus and method, including a flip chip support stage, ejector pins, ejector pin driving device, receiving bracket, pick-up mechanism, rotation mechanism, and translation mechanism. The pick-up mechanism includes vacuum nozzles for adsorbing different surfaces of the flip chip, the rotation mechanism is used to rotate the vacuum nozzles and the flip chips they adsorb, and the translation mechanism is used to move the flip chip to a corresponding position on the receiving bracket. During the die bonding process, the vacuum nozzles pick up the flip chip separated from the thin film and switch the adsorption position of the flip chip between different pick-up components. After the flip chip moves to the receiving bracket, the adsorption action of the vacuum nozzles is stopped, and the flip chip is placed in the corresponding position.

[0004] While the aforementioned device can pick up, flip, transfer, and place flip-chips using vacuum nozzles, it still has shortcomings: its multiple vacuum nozzles are mainly used to switch pick-up positions between different surfaces of the flip-chip. After the flip-chip reaches the receiving bracket, placement is still completed by stopping the suction and removing the vacuum nozzles. It does not employ a phased, coordinated removal process using multiple dispersed suction cups for handling large, thin chips. When the sealing degree and residual negative pressure at multiple suction positions differ, or when there are grinding marks or localized adhesion between the suction cups and the back of the chip, directly releasing the suction cups and moving them upwards may still cause inconsistent pulling from different positions on the chip. This can cause the not-yet-stable chip to tilt, rotate, or shift position, affecting the chip placement accuracy. Summary of the Invention

[0005] This invention provides a chip mounting device and a chip mounting method, aiming to solve the problem in related technologies where multiple suction cups are removed simultaneously after chip placement, causing the chip to be pulled up, rotated, or misaligned due to the different residual suction forces of each suction cup.

[0006] A chip mounting device of the present invention includes a mounting post, a main suction cup, a holding member, a movable frame, multiple peripheral suction cups, and a release drive. The main suction cup is disposed at the lower end of the mounting post, and its periphery is elastically deformable. The holding member moves up and down along the mounting post and holds the periphery of the main suction cup at a lower position. A reset member is disposed between the holding member and the mounting post to reset the holding member to a lower position. The movable frame is disposed on the outer periphery of the holding member. Multiple peripheral suction cups are spaced apart on the movable frame and distributed around the main suction cup. The release drive is connected to the movable frame. The main suction cup and multiple peripheral suction cups are respectively connected to suction channels that can independently switch suction states. The movable frame has a first release stroke relative to the holding member. When the movable frame moves upward along the first release stroke, it drives the multiple peripheral suction cups to leave the chip first, while the main suction cup remains attached. After the movable frame passes the first release stroke, it drives the holding member to move upward to release the pressure on the periphery of the main suction cup, so that the periphery of the main suction cup elastically resets and releases the attachment.

[0007] Its effect is as follows: the main suction cup and multiple peripheral suction cups can jointly adsorb the chip to disperse the force on the chip during the picking and handling process; after the chip is placed, the movable frame first moves the peripheral suction cups away from the chip along the first release stroke, so that the adsorption effect on the chip's periphery is released first, while the main suction cup continues to hold the chip in position; the movable frame then moves the holding member to release the pressure on the periphery of the main suction cup, so that the periphery of the main suction cup reduces the sealing effect with the chip through elastic reset and releases the adsorption, so that multiple adsorption positions are withdrawn in the order of peripheral suction cups and main suction cup, reducing the possibility of residual suction pulling the chip from different positions.

[0008] Preferably, the mounting column is connected to the lower end of the lifting shaft, and the release drive is a telescopic drive source located between the lifting shaft and the movable frame.

[0009] Its effect is that the lifting shaft can drive the mounting column and each suction cup to complete the picking and placement of the chip, while the telescopic drive source can drive the movable frame to move independently when the lifting shaft is in position, providing driving force for the phased removal of the peripheral suction cups and the main suction cup.

[0010] Preferably, the holding member is a suction cup cover that is slidably sleeved on the outside of the mounting post, and the lower end of the suction cup cover is provided with an annular holding part corresponding to the periphery of the main suction cup.

[0011] Its effect is that when the suction cup cover moves along the mounting column, the annular pressing part can press or release the periphery of the main suction cup in the circumferential direction, so that the main suction cup remains in the unfolded state during the adsorption stage, and releases the seal through the periphery elastic reset during the release stage.

[0012] Preferably, the suction cup cover is provided with a sliding part extending along the axial direction of the mounting column, and the movable frame is slidably disposed on the sliding part. After the movable frame moves to the upper end of the sliding part, it abuts against the suction cup cover.

[0013] Its effect is that the movable frame can move independently before contacting the suction cup cover, so as to form the first release stroke of the peripheral suction cups being withdrawn first; after the movable frame reaches the upper end of the sliding part, it drives the suction cup cover to move, thus structurally limiting the release sequence of the peripheral suction cups and the main suction cup.

[0014] Preferably, the reset element is an elastic element disposed between the suction cup cover and the mounting post, and the mounting post is provided with a limiting block to restrict the upward movement of the suction cup cover.

[0015] Its effect is that the elastic element can push the suction cup cover to press the periphery of the main suction cup again after the movable frame is reset downwards, while the limiting block restricts the upward movement of the suction cup cover, preventing the suction cup cover from moving excessively and ensuring the repeating position of the release action.

[0016] Preferably, the movable frame is connected to multiple outwardly extending telescopic rods, and multiple peripheral suction cups are respectively set at the ends of the telescopic rods, and the extension length of the telescopic rods is adjustable.

[0017] Its effect is that by adjusting the extension length of the telescopic rod, the radial position of the peripheral suction cup relative to the main suction cup can be changed, so that the peripheral suction cup corresponds to the peripheral area of ​​chips of different sizes, and the adsorption position can be selected according to the texture distribution on the chip surface.

[0018] Preferably, a flexible pad is detachably connected to the lower end face of the main suction cup, and the flexible pad is arranged around the adsorption area of ​​the main suction cup.

[0019] Its effects are as follows: the flexible pad can deform according to the grinding texture or local unevenness of the chip surface, improving the sealing between the main suction cup and the chip; the flexible pad is detachable, making it easy to replace according to the condition of the chip surface.

[0020] Preferably, the mounting column is provided with a main suction channel that communicates with the main suction cup, and multiple peripheral suction cups are each provided with a peripheral suction channel. The main suction channel and the peripheral suction channels are respectively connected to a vacuum source or the outside through independent vacuum control branches.

[0021] Its effect is that the main suction cup and the peripheral suction cup can work together to establish an adsorption effect, and after the chip is placed, the suction state of the peripheral suction channel is switched first, so that the peripheral suction cup is released from negative pressure first, while the main suction cup continues to maintain the chip position, in order to cooperate with the phased removal of the suction cup.

[0022] On the other hand, the present invention also provides a chip mounting method using the above-mentioned chip mounting device, comprising the following steps: S1, pressing the periphery of the main suction cup with a holding member, and the chip being adsorbed by the main suction cup and multiple peripheral suction cups; S2, moving the chip and placing it in the mounting area of ​​the target substrate; S3, releasing the adsorption of the multiple peripheral suction cups, and driving the movable frame to move upward along the first release stroke, so that the multiple peripheral suction cups leave the chip first, while the main suction cup maintains the position of the chip; S4, continuing to move the movable frame upward and driving the holding member to release the pressure on the periphery of the main suction cup, while switching the suction channel connected to the main suction cup to the depressurization state, so that the periphery of the main suction cup elastically resets and releases the adsorption.

[0023] Its effect is that the method sequentially connects the chip's common adsorption, placement, the removal of the peripheral suction cups first, and the subsequent release of the main suction cup, so that the multi-point adsorption constraint on the chip is first concentrated to the middle, and then released by the main suction cup, reducing the traction caused by the simultaneous removal of multiple suction cups.

[0024] Preferably, after the patch is applied, the movable frame is reset downwards, and the reset component pushes the holding component to press the periphery of the main suction cup, so that the main suction cup and multiple peripheral suction cups return to the common adsorption state.

[0025] Its effect is that the movable frame and the holding component can return to the initial state after one chip placement is completed, where the main suction cup is held at the periphery and the peripheral suction cups are in the chip picking position, which facilitates the device to continuously perform the next chip placement operation.

[0026] The beneficial effects of this invention are as follows: 1. This invention uses a main suction cup and multiple peripheral suction cups arranged around the main suction cup to jointly adsorb the chip, which can distribute the load during chip picking and transportation to the central and peripheral areas; after the chip is placed, the multiple peripheral suction cups leave the chip first, while the main suction cup continues to hold the chip in position, reducing the possibility of residual suction force from the peripheral suction cups pulling on the chip edge and causing warping, rotation or positional displacement.

[0027] 2. The present invention enables the movable frame to form a first release stroke relative to the holding member. Within this stroke, the movable frame first drives the peripheral suction cup to retract, and after passing this stroke, it drives the holding member to move. Two consecutive release stages are formed by the same release drive, ensuring that the peripheral suction cup and the main suction cup exit in a determined order, without the need to set up independent drive mechanisms for the two release stages.

[0028] 3. In this invention, the holding member presses the elastic periphery of the main suction cup during the adsorption stage, so that the main suction cup and the chip remain sealed. After the holding member moves upward, it releases the pressure on the periphery of the main suction cup, and the periphery of the main suction cup elastically resets and weakens the sealing effect. With the replacement flexible pad and the separately switchable suction channels, it can adapt to the grinding texture or local unevenness on the chip surface and reduce the pulling on the middle of the chip when the main suction cup moves directly upward. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0030] Figure 2 This is a schematic diagram of the adjustment mechanism and patch assembly structure of the present invention.

[0031] Figure 3 This is a front view structural diagram of the patch assembly of the present invention.

[0032] Figure 4 This is a schematic diagram of the isometric structure of the patch assembly of the present invention.

[0033] Figure 5 This is a schematic diagram of the state when the main suction cup and the peripheral suction cups of the present invention are not in the same adsorption state.

[0034] Figure 6 This is a schematic diagram of the structure of the holding member of the present invention when the pressure around the main suction cup is released.

[0035] Figure 7 This is a schematic diagram from another perspective showing the release of the main suction cup's periphery from the pressure member of the present invention.

[0036] Figure 8 This is a schematic diagram of the assembly structure of the mounting post, the holding member, and the main suction cup of the present invention.

[0037] Figure label: 1. Housing; 11. Observation window; 12. Operating table; 2. Adjustment mechanism; 3. Patch assembly; 31. Lifting shaft; 32. Mounting column; 321. Main suction port; 322. Limiting block; 33. Main suction cup; 331. Flexible pad; 34. Holding component; 341. Sliding part; 342. Annular holding part; 343. Reset component; 35. Movable frame; 351. Telescopic rod; 352. Peripheral suction cup; 353. Peripheral suction port; 36. Release drive component. Detailed Implementation

[0038] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0039] like Figures 1 to 8 As shown, a chip mounting device of the present invention includes a housing 1, an adjustment mechanism 2 disposed within the housing 1, and a mounting assembly 3 connected to the moving end of the adjustment mechanism 2. The adjustment mechanism 2 is used to drive the mounting assembly 3 to move between the chip pickup position and the mounting area of ​​the target substrate. The mounting assembly 3 is used to pick up the chip, maintain the chip transport posture, and release the adsorption in the order of peripheral side first and then center after the chip is placed in the mounting area of ​​the target substrate.

[0040] This embodiment uses a bare chip with a large area and a small thickness as an example. The back of the chip may have grinding marks, shallow grooves, or local unevenness. When using a single suction cup, air leakage is likely to occur due to insufficient effective sealing area. When using multiple suction cups together, inconsistent pulling can easily occur after the chip is placed due to the different residual suction forces of each suction cup. Therefore, this embodiment utilizes a main suction cup 33 located in the center of the chip and multiple peripheral suction cups 352 distributed around the main suction cup 33 to jointly bear the picking and handling load, and uses the relative stroke between the movable frame 35 and the holding member 34 to form a defined phased release action.

[0041] like Figure 1 As shown, the housing 1 consists of a frame and a plate disposed on the outside of the frame. A protective door that can be opened and closed is provided on the front side of the housing 1, and an observation window 11 is provided on the protective door. The protective door is closed when the equipment is running to reduce the entry of external dust into the chip mounting area; the operator can observe the chip picking, handling and placement status through the observation window 11. An operating table 12 is provided on one side of the housing 1. The operating table 12 is equipped with display components and operating components for setting the chip picking position, the mounting area of ​​the target substrate, the vacuum adsorption status, and the release and reset actions of the mounting assembly 3.

[0042] The main suction cup 33, flexible pad 331, and peripheral suction cup 352 used for adsorbing the chip are made of a low-exudation and elastic material to reduce the possibility of particle or electrostatic accumulation when in contact with the chip. A clean filter structure is installed in the external vacuum pipeline connected to the main suction port 321 and the peripheral suction port 353 to prevent particles in the pipeline from entering the contact area between the suction cup and the chip with the airflow. The above materials and airflow treatment are designed to adapt to the clean operating environment in semiconductor device manufacturing.

[0043] like Figure 2 As shown, the adjustment mechanism 2 is located in the upper part of the housing 1, and the patch assembly 3 is mounted on the moving end of the adjustment mechanism 2 and faces the patch working area inside the housing 1. In this embodiment, the adjustment mechanism 2 includes a linear moving module arranged in intersecting directions, used to drive the patch assembly 3 to move horizontally; the lifting shaft 31 in the patch assembly 3 is used to complete the vertical chip picking and dropping actions. The specific transmission structure of the adjustment mechanism 2 adopts a linear drive structure that can meet the chip positioning accuracy requirements in the patching equipment. This embodiment focuses on explaining the adsorption and release coordination relationship of each suction cup inside the patch assembly 3.

[0044] like Figure 3 and Figure 4As shown, the chip mounting assembly 3 includes a lifting shaft 31, a mounting post 32, a main suction cup 33, a holding member 34, a movable frame 35, multiple peripheral suction cups 352, and a release drive member 36. The upper end of the lifting shaft 31 is connected to the adjustment mechanism 2, and the mounting post 32 is connected to the lower end of the lifting shaft 31. The main suction cup 33 is located below the center of the mounting post 32, and the multiple peripheral suction cups 352 are distributed around the main suction cup 33 at intervals via the movable frame 35, so that the main suction cup 33 corresponds to the central area of ​​the chip, and the multiple peripheral suction cups 352 correspond to the peripheral areas outside the central area of ​​the chip.

[0045] Driven by the adjustment mechanism 2, the lifting shaft 31 moves in planar position along with the patch assembly 3 and can move vertically relative to the adjustment mechanism 2. During chip pickup and placement, the lifting shaft 31 drives the mounting post 32, main suction cup 33, holding member 34, movable frame 35, and peripheral suction cup 352 to rise and fall as a whole. During the phased release process after chip placement, the lifting shaft 31 remains at the current height, and the release drive 36 drives the movable frame 35 to move upward relative to the mounting post 32 and holding member 34, thereby preventing the entire patch assembly 3 from being lifted directly before the suction cups have completely released their adsorption.

[0046] like Figure 4 , Figure 5 and Figure 8 As shown, the mounting post 32 is a vertically extending columnar structure with a main suction port 321 at its upper part. Inside the mounting post 32 is a main suction channel communicating with the main suction port 321 and the main suction cup 33. The main suction port 321 is connected to an external main vacuum control branch via a vacuum tube. The main vacuum control branch is equipped with a reversing valve controlled by the control system within the operating console 12, allowing the main suction cup 33 to connect to a vacuum source to establish negative pressure, or to connect to the outside environment for pressure relief. The main suction channel and the peripheral suction channel of the peripheral suction cup 352 use independent control branches, ensuring that the main suction cup 33 maintains the chip's position even when the peripheral suction cup 352 is released from adsorption.

[0047] The main suction cup 33 is disposed at the lower end of the mounting post 32 and is relatively fixed to the mounting post 32. The main suction cup 33 includes a central region connected to the mounting post 32 and an elastic periphery formed around the central region. The lower side of the main suction cup 33 forms an adsorption area facing the chip. After the main suction cup 33 establishes a negative pressure, the back of the chip seals the adsorption area of ​​the main suction cup 33. An external vacuum source extracts the air in the adsorption area, causing the main suction cup 33 to adsorb the center of the chip.

[0048] A flexible pad 331 is detachably connected to the lower end face of the main suction cup 33, and the flexible pad 331 is arranged around the adsorption area of ​​the main suction cup 33. An annular mounting groove is formed at the lower end of the main suction cup 33, and an annular snap-fit ​​portion is formed on the upper side of the flexible pad 331 to mate with the annular mounting groove. After the annular snap-fit ​​portion is inserted into the annular mounting groove, the flexible pad 331 is held at the lower end of the main suction cup 33. For maintenance or replacement, the flexible pad 331 can be removed by taking the annular snap-fit ​​portion out of the annular mounting groove. When the flexible pad 331 contacts the back of the chip, it can undergo local deformation according to the grinding texture or slight unevenness to fill the small gap between the main suction cup 33 and the chip. For chips of different sizes or with different back surface conditions, flexible pads 331 with matching thickness, hardness, or contact contours can be replaced, thereby adjusting the contact seal without replacing the entire main suction cup 33.

[0049] like Figure 5 and Figure 8 As shown, the holding member 34 is slidably sleeved on the outside of the mounting post 32. In this embodiment, the holding member 34 is a suction cup cover that gradually expands at the bottom. The lower end of the holding member 34 is disposed around the main suction cup 33, and its lower inner end forms an annular holding portion 342 corresponding to the elastic periphery of the main suction cup 33. When the holding member 34 is in the lower position, the annular holding portion 342 presses the periphery of the main suction cup 33 from the upper side, causing the elastic periphery of the main suction cup 33 to unfold towards the back of the chip, thereby expanding the contact range of the main suction cup 33 and improving the adhesion between the flexible pad 331 and the back of the chip.

[0050] The annular pressing part 342 applies a downward pressing force towards the chip to the periphery of the main suction cup 33, keeping the periphery of the main suction cup 33 extended under this force. After the pressing member 34 moves upward, the annular pressing part 342 moves away from the periphery of the main suction cup 33, and the periphery of the main suction cup 33 recovers upward and inward under its own elasticity, causing the contact area between the flexible pad 331 and the back of the chip to decrease from the outer periphery to the inward, and forming an air intake gap between the periphery of the main suction cup 33 and the chip. This air intake gap allows outside air to enter the adsorption area, accelerating the elimination of residual negative pressure inside the main suction cup 33.

[0051] The elastic periphery of the main suction cup 33 is an annular thin-walled portion extending outward and downward from the central region. When not pressed by the annular holding portion 342, the annular thin-walled portion has an elastic tendency to retract upward and inward. When the annular holding portion 342 is in the lower position, it acts on the upper outer edge of the annular thin-walled portion, causing the annular thin-walled portion to unfold towards the back of the chip and expand the sealing perimeter. After the holding member 34 moves upward, the outer edge of the annular thin-walled portion first leaves the chip, and outside air enters the adsorption area from the circumference of the main suction cup 33. Subsequently, the contact area between the flexible pad 331 and the chip decreases from the outside to the inside, thereby gradually releasing the seal and residual negative pressure while the main suction cup 33 maintains its original position.

[0052] The upper part of the holding member 34 is provided with a sliding part 341 extending axially along the mounting post 32. The movable frame 35 is sleeved on the outside of the sliding part 341 and can move up and down along the sliding part 341. The sliding part 341 provides vertical guidance for the movable frame 35 and restricts the movable frame 35 from significant horizontal swaying relative to the holding member 34, so that the multiple peripheral suction cups 352 remain relatively synchronized when moving upward and retracting.

[0053] The inner circumference of the movable frame 35 slides in conjunction with the sliding part 341, and the upper end of the sliding part 341 forms a receiving position for the movable frame 35 to abut. In the initial state, there is an axial gap between the movable frame 35 and this receiving position, which constitutes the first release stroke of the movable frame 35 relative to the holding member 34. When the release drive 36 drives the movable frame 35 to move upward, the movable frame 35 first moves independently relative to the holding member 34 within the first release stroke; when the movable frame 35 moves to the upper end of the sliding part 341, the movable frame 35 abuts against the holding member 34, and the holding member 34 moves upward synchronously only when the movable frame 35 continues to move upward.

[0054] like Figure 8 As shown, a reset member 343 is provided between the holding member 34 and the mounting post 32. In this embodiment, the reset member 343 is a compression spring sleeved on the outside of the mounting post 32. One end of the reset member 343 acts on the mounting post 32, and the other end acts on the holding member 34, to push the holding member 34 downward, so that the holding member 34 is held in the lower position around the periphery of the holding main suction cup 33 when it is not pulled upward by the movable frame 35. A limit block 322 is provided on the mounting post 32. After the holding member 34 moves upward to the set position, it forms a limit engagement with the limit block 322 to limit the holding member 34 from moving upward further, and to prevent the reset member 343 from affecting the repeated operation due to excessive deformation.

[0055] The release drive component 36 is located between the lifting shaft 31 and the movable frame 35. For example... Figure 3 As shown, in this embodiment, two telescopic drive sources are symmetrically distributed relative to the mounting column 32. The fixed end of the telescopic drive source is connected to the lifting shaft 31, and the telescopic end is connected to the movable frame 35. When the two telescopic drive sources shorten synchronously, they pull the movable frame 35 upward, enabling the movable frame 35 to move smoothly on the sliding part 341, reducing the possibility of the movable frame 35 tilting or jamming due to driving from only one side. When the release drive 36 extends, it pushes the movable frame 35 downward to reset.

[0056] The movable frame 35 is connected circumferentially to multiple outwardly extending telescopic rods 351. In this embodiment, four telescopic rods 351 are provided, and the four telescopic rods 351 are arranged in a crisscross pattern around the main suction cup 33. A peripheral suction cup 352 is installed at the outer end of each telescopic rod 351, so that the four peripheral suction cups 352 are respectively close to the four peripheral areas of the rectangular chip. When the multiple peripheral suction cups 352 and the main suction cup 33 jointly adsorb the chip, the center and periphery of the chip are adsorbed and supported, which can reduce the possibility of peripheral vibration and local sagging during the handling of large-size thin chips.

[0057] The telescopic rod 351 consists of inner and outer rod segments that slide against each other. Adjusting the overlap length of the inner and outer rod segments changes the radial position of the peripheral suction cup 352 relative to the main suction cup 33. After adjustment, it is locked with fasteners. Before removing the chip, each telescopic rod 351 is adjusted according to the chip's shape and back surface texture to ensure that the peripheral suction cup 352 is located in a relatively flat area around the chip that allows contact, and that the suction positions of the multiple peripheral suction cups 352 are basically balanced relative to the chip's center.

[0058] Each peripheral suction cup 352 is equipped with a peripheral suction channel, which is connected to an external peripheral vacuum branch through a peripheral suction port 353. The peripheral suction channels of multiple peripheral suction cups 352 can simultaneously establish or release negative pressure, and their suction states switch independently from the main suction channel of the main suction cup 33. The peripheral suction cups 352 are small-area flexible suction cups, which can be distributed across multiple locally flat areas on the back of the chip, and when the sealing of a certain peripheral area is poor, the other suction cups continue to provide auxiliary adsorption.

[0059] In the co-adsorption state, the flexible pad 331 at the lower end of the main suction cup 33 and the flexible adsorption lips at the lower ends of the multiple peripheral suction cups 352 are located on the same adsorption reference plane. During assembly, the installation height of each peripheral suction cup 352 is calibrated so that multiple adsorption positions can simultaneously contact the back of the chip; after contacting the chip, the elastic deformation of the flexible pad 331 and the peripheral suction cups 352 themselves is used to compensate for small assembly height differences, reducing the possibility of localized stress caused by a single suction cup pressing the chip first.

[0060] like Figure 3 and Figure 4 As shown, when the device is in the initial state of co-adsorption, the release drive 36 is in the extended state, the movable frame 35 is located below the sliding part 341, the reset member 343 pushes the holding member 34 to the lower position, and the annular holding part 342 presses the elastic periphery of the main suction cup 33. By adjusting the telescopic rod 351, the lower contact position of the main suction cup 33 and each peripheral suction cup 352 is matched with the back of the chip. At this time, the main suction channel of the main suction cup 33 and the peripheral suction channels of the peripheral suction cups 352 are both in a state that can establish negative pressure.

[0061] When picking up the chip, the adjusting mechanism 2 moves the chip mounting assembly 3 above the chip-bearing position, and the lifting shaft 31 descends, causing the main suction cup 33 and multiple peripheral suction cups 352 to contact the back of the chip. The main suction channel and the peripheral suction channels are connected to a vacuum source. The main suction cup 33 adsorbs the center of the chip, and the multiple peripheral suction cups 352 adsorb the periphery of the chip. The holding member 34 presses the elastic periphery of the main suction cup 33 with the annular holding part 342, keeping the periphery of the main suction cup 33 and the flexible pad 331 unfolded and in contact with the back of the chip, thereby maintaining the seal of the central adsorption area when there are shallow grooves on the back.

[0062] After confirming that the chip is stably adsorbed, the lifting shaft 31 drives the placement assembly 3 to rise, causing the chip to leave the carrier film, tray, or feed table. The adjusting mechanism 2 then moves the placement assembly 3 above the target substrate and completes the planar alignment of the chip with the target placement area according to the position set by the equipment. During the handling process, the main suction cup 33 and multiple peripheral suction cups 352 share the weight of the chip and the inertial force generated by the movement, avoiding the load being concentrated in the middle of the chip or a single peripheral position.

[0063] After the chip moves above the target substrate, the lifting shaft 31 lowers the mounting assembly 3, placing the chip in the mounting area of ​​the target substrate. Once the chip contacts the target substrate, the lifting shaft 31 temporarily maintains its current height, preventing the main suction cup 33 and peripheral suction cups 352 from rising with the mounting assembly 3. At this time, the peripheral suction channel is switched, stopping the suction of multiple peripheral suction cups 352 and connecting them to the outside environment, while the main suction channel of the main suction cup 33 continues to maintain its suction state, utilizing the suction effect located in the center of the chip to restrict in-plane movement or rotation of the chip.

[0064] like Figure 5 As shown, after the peripheral suction channel switches to the depressurization state, the multiple peripheral suction cups 352 no longer jointly adsorb the chip with the main suction cup 33, while the main suction cup 33 still maintains adsorption on the center of the chip. At this time, the release drive 36 begins to drive the movable frame 35 to move upward along the first release stroke, the holding member 34 is still held in the lower position by the reset member 343, and the annular holding part 342 continues to hold the periphery of the main suction cup 33. Figure 5 The state shown represents the first release phase, where the peripheral suction cup 352 releases its adsorption and begins to withdraw, while the main suction cup 33 continues to maintain the chip position.

[0065] exist Figure 5In the first release phase shown, the release drive 36 continues to shorten and pull the movable frame 35 upward. The movable frame 35 moves upward along the first release stroke on the sliding part 341, and the four telescopic rods 351 and the corresponding peripheral suction cups 352 move upward synchronously with the movable frame 35, so that the peripheral suction cups 352 leave the chip before the main suction cup 33. When the movable frame 35 is within the first release stroke, it has not yet abutted the holding member 34, so the holding member 34 is still in the lower position under the action of the reset member 343, and the annular holding part 342 continues to hold the periphery of the main suction cup 33, and the main suction cup 33 maintains adsorption and positional constraint on the center of the chip.

[0066] After the peripheral suction cup 352 is completely removed from the chip, the movable frame 35 moves to the upper end of the sliding part 341 and abuts against the holding member 34. As the release drive member 36 continues to shorten, the movable frame 35 transmits an upward traction force to the holding member 34, causing the holding member 34 to overcome the elastic force of the reset member 343 and move upward along the mounting post 32. Thus, the same continuous upward movement of the movable frame 35 first completes the removal of the peripheral suction cup 352, and then triggers the holding member 34 to release the pressure on the periphery of the main suction cup 33, eliminating the need for separate vertical removal drive mechanisms for the two release stages.

[0067] like Figures 6 to 8 As shown, after the holding member 34 moves upward, the annular holding portion 342 gradually moves away from the elastic periphery of the main suction cup 33, and the periphery of the main suction cup 33 elastically resets upward and inward, thus reducing the contact area between the flexible pad 331 and the back of the chip. When the movable frame 35 moves to abut against the holding member 34 and begins to drive the holding member 34 upward, the control system controls the reversing valve of the main vacuum control branch to operate, causing the main suction channel to stop communicating with the vacuum source and switch to the depressurization state; outside air enters the adsorption area through the air intake gap formed around the periphery of the main suction cup 33, causing the internal pressure of the main suction cup 33 to gradually approach the external pressure. After the holding member 34 moves upward to the position defined by the limiting block 322, the periphery of the main suction cup 33 is released from pressure, and the residual adsorption effect of the main suction cup 33 on the chip is significantly reduced.

[0068] After the main suction cup 33 releases its adsorption, the chip is supported by the target substrate and held in the target mounting area. The lifting shaft 31 then drives the mounting post 32, main suction cup 33, holding member 34, movable frame 35, and peripheral suction cup 352 to rise as a whole, allowing the main suction cup 33 to smoothly leave the center of the chip. Since the peripheral suction cup 352 has been removed beforehand, and the main suction cup 33 has reduced the contact area and residual negative pressure by retracting its periphery and depressurizing the air passage before being lifted as a whole, the possibility of multiple suction cups pulling the chip upward from different positions at the same time can be reduced.

[0069] After the chip assembly 3 leaves the chip, the release drive 36 extends and pushes the movable frame 35 downward. After the movable frame 35 leaves the upper end of the sliding portion 341, the reset member 343 releases the previously stored elastic potential energy and pushes the holding member 34 downward to reset until the annular holding portion 342 re-presses the periphery of the main suction cup 33. The movable frame 35 continues to descend along the sliding portion 341 to the initial position, and the multiple peripheral suction cups 352 return to the common chip picking height with the movable frame 35. The main suction channel and the peripheral suction channel return to the ready-to-adhere state, thus completing the mechanical reset after one chip placement cycle.

[0070] For chips with irregularly distributed textures on the back, the extension length of the telescopic rod 351 is first adjusted according to the texture position, so that multiple peripheral suction cups 352 avoid deeper grooves and land on relatively flat areas; the main suction cup 33 adapts to the shallow textures in the central area through the flexible pad 331. This structure mainly compensates for the sealing differences caused by grinding textures, shallow grooves, and slight local unevenness, and does not require crossing deep grooves or large open cavities that penetrate the adsorption area as a working premise, thereby ensuring the feasibility of the adsorption and release process.

[0071] The working principle of this invention is as follows: During chip removal, the holding member 34 presses against the periphery of the main suction cup 33, forming a stable central adsorption area, and multiple peripheral suction cups 352 jointly bear the peripheral load of the chip; after chip removal, the movable frame 35 moves relative to the holding member 34, allowing the peripheral suction cups 352 to retract while the main suction cup 33 holds the chip in position; after the movable frame 35 passes the first release stroke, it drives the holding member 34 to move upward, causing the periphery of the main suction cup 33 to elastically retract and form an air intake gap, and finally the lifting shaft 31 drives the entire chip mounting assembly 3 to retract. The adsorption constraint on the chip changes from multi-point constraint in the center and periphery to a single-point constraint in the center and then to a completely released state.

[0072] Based on the above-described chip mounting apparatus, the chip mounting method of the present invention specifically includes the following steps: S1. The release drive 36 is extended, and the reset 343 pushes the holding 34 to the lower position, so that the annular holding part 342 presses the periphery of the main suction cup 33; the telescopic rod 351 is adjusted according to the chip size and the position of the texture on the back, so that multiple peripheral suction cups 352 are distributed around the main suction cup 33 in the peripheral adsorption area of ​​the chip; the lifting shaft 31 is controlled to descend, so that the main suction cup 33 and multiple peripheral suction cups 352 contact the back of the chip, and negative pressure is established through the main suction channel and the peripheral suction channel respectively, so as to adsorb the chip together.

[0073] S2. Control the lifting shaft 31 to move the chip away from the chip support position, and the adjustment mechanism 2 moves the mounting assembly 3 above the target substrate; after the chip and the mounting area of ​​the target substrate are aligned, control the lifting shaft 31 to descend, place the chip in the mounting area, and keep the lifting shaft 31 at the current height during the release of the suction cup.

[0074] S3. Switch the suction state of the peripheral suction channel to release the negative pressure of multiple peripheral suction cups 352; control the release drive 36 to shorten and drive the movable frame 35 to move upward along the first release stroke of the sliding part 341, so that multiple peripheral suction cups 352 leave the chip simultaneously, while maintaining the adsorption of the main suction cup 33, so that the main suction cup 33 keeps its placement position from the middle of the chip.

[0075] S4. The release drive 36 continues to move the movable frame 35 upward until the movable frame 35 abuts against the holding member 34 and moves the holding member 34 upward against the action of the reset member 343; the main suction channel is switched to the depressurization state, so that the annular holding part 342 releases the pressure on the periphery of the main suction cup 33, and the periphery of the main suction cup 33 is elastically reset and forms an air intake gap with the chip; after the main suction cup 33 is released from adsorption, the lifting shaft 31 is controlled to move the patch assembly 3 away from the chip.

[0076] In continuous chip placement operations, a reset process is also included: the release drive 36 extends and pushes the movable frame 35 downward, the reset component 343 pushes the holding component 34 back to the lower position and re-holds the periphery of the main suction cup 33, the movable frame 35 and multiple peripheral suction cups 352 continue to descend to the initial position of common adsorption, and then the adjustment mechanism 2 drives the placement assembly 3 back to the pick-up position of the next chip, and repeats the above steps.

[0077] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A chip mounting device, characterized in that, The device includes a mounting post, a main suction cup, a holding member, a movable frame, multiple peripheral suction cups, and a release drive. The main suction cup is located at the lower end of the mounting post, and its periphery is elastically deformable. The holding member moves up and down along the mounting post and holds the periphery of the main suction cup at its lower position. A reset member is provided between the holding member and the mounting post to reset the holding member to its lower position. The movable frame is located on the outer periphery of the holding member. Multiple peripheral suction cups are spaced apart on the movable frame and distributed around the main suction cup. The release drive is connected to the movable frame. The main suction cup and multiple peripheral suction cups are respectively connected to suction channels that can independently switch suction states. The movable frame has a first release stroke relative to the holding member. When the movable frame moves upward along the first release stroke, it causes the multiple peripheral suction cups to leave the chip first, while the main suction cup remains attached. After the movable frame passes the first release stroke, it causes the holding member to move upward to release the pressure on the periphery of the main suction cup, allowing the periphery of the main suction cup to elastically reset and release the attachment.

2. The chip mounting apparatus according to claim 1, characterized in that, The mounting column is connected to the lower end of the lifting shaft, and the release drive is a telescopic drive source located between the lifting shaft and the movable frame.

3. The chip mounting apparatus according to claim 1, characterized in that, The holding member is a suction cup cover that is slidably sleeved on the outside of the mounting post, and the lower end of the suction cup cover is provided with an annular holding part corresponding to the periphery of the main suction cup.

4. A chip mounting apparatus according to claim 3, characterized in that, The suction cup cover is provided with a sliding part that extends axially along the mounting column. The movable frame is slidably disposed on the sliding part. After the movable frame moves to the upper end of the sliding part, it abuts against the suction cup cover.

5. A chip mounting apparatus according to claim 3, characterized in that, The reset component is an elastic component disposed between the suction cup cover and the mounting post, and the mounting post is provided with a limiting block to restrict the upward movement of the suction cup cover.

6. A chip mounting apparatus according to claim 1, characterized in that, The movable frame is connected to multiple outwardly extending telescopic rods, and multiple peripheral suction cups are respectively disposed at the ends of the telescopic rods. The extension length of the telescopic rods is adjustable.

7. A chip mounting apparatus according to claim 1, characterized in that, A flexible pad is detachably connected to the lower end face of the main suction cup, and the flexible pad is arranged around the adsorption area of ​​the main suction cup.

8. A chip mounting apparatus according to claim 1, characterized in that, The mounting column is provided with a main suction channel that communicates with the main suction cup, and the multiple peripheral suction cups are each provided with a peripheral suction channel. The main suction channel and the peripheral suction channel are respectively connected to a vacuum source or the outside through independent vacuum control branches.

9. A chip mounting method, characterized in that, The chip mounting apparatus according to any one of claims 1 to 8 includes the following steps: S1. Press the periphery of the main suction cup with the holding member, and the chip is adsorbed by the main suction cup and multiple peripheral suction cups together; S2. Move the chip and place it in the patch area of ​​the target substrate; S3. Release the adsorption of the multiple peripheral suction cups and drive the movable frame to move upward along the first release stroke, so that the multiple peripheral suction cups leave the chip first, while the main suction cup keeps the chip in position; S4. The movable frame continues to move upward and causes the holding member to release the pressure on the periphery of the main suction cup. At the same time, the suction channel connected to the main suction cup is switched to the depressurization state, so that the periphery of the main suction cup is elastically reset and the adsorption is released.

10. A chip mounting method according to claim 9, characterized in that, After the patch is applied, the movable frame returns to its downward position, and the reset member pushes the holding member to press the periphery of the main suction cup, so that the main suction cup and the multiple peripheral suction cups return to a common adsorption state.

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