Micro-porous channel based chip heat dissipation waste heat recovery device, preparation method and application

Abstract

This invention relates to the fields of chip thermal management and low-grade heat recovery technology, and particularly to a chip heat dissipation waste heat recovery device, its preparation method, and its application based on microporous channels. The device includes, from bottom to top, a heat source coupling layer, a microporous channel functional layer, an ion transport adhesion layer, and a current-collecting active electrode layer. The heat source coupling layer is in contact with the microporous channel functional layer, which has an inlet and an outlet. Circulating water flows through the microporous channels to remove heat from the heat source. The microporous channel functional layer, ion transport adhesion layer, and current-collecting active electrode layer form a water-based waste heat recovery unit. The preparation method and application of the above device are also disclosed. By using the above-mentioned chip heat dissipation waste heat recovery device, preparation method, and application based on microporous channels, heat dissipation and waste heat recovery of the chip are achieved through the coupling of the microporous channels in the microporous channel functional layer with the water-based waste heat recovery unit, thereby reducing the heat source temperature while recovering waste heat.

Description

Technical Field

[0001] This invention relates to the fields of chip thermal management and low-grade heat recovery technology, and in particular to a chip heat dissipation waste heat recovery device, preparation method and application based on microporous channels. Background Technology

[0002] With the rapid development of artificial intelligence computing, power electronics, and high-density packaging technologies, the power density of electronic devices such as CPUs, GPUs, Chiplet / 3D (chip-in-3D) packaged devices, LEDs, and micromotors continues to increase, making the problem of localized heat accumulation increasingly prominent. Excessively high operating temperatures not only reduce the output stability of devices but also accelerate material aging, solder joint failure, and interface debonding, seriously affecting device lifespan and reliability.

[0003] Existing chip cooling technologies mainly include air cooling, heat pipes, vapor chambers, liquid cooling plates, and microchannel liquid cooling. Among these, microchannel or multi-channel liquid cooling can significantly improve heat transfer capacity per unit area, but its core design logic still focuses on removing heat as quickly as possible. On the one hand, although heat is removed, it is not further utilized. On the other hand, the cooling process of data centers and high-performance electronic systems itself consumes a large amount of electrical energy. Therefore, relying solely on passive cooling or energy-intensive active cooling makes it difficult to balance thermal management efficiency and energy utilization efficiency.

[0004] Therefore, developing an integrated structure that can simultaneously achieve chip heat dissipation and waste heat recovery, and is suitable for device-level integration, is of great significance for promoting the transformation of thermal management from simple heat dissipation to heat dissipation-recovery synergistic utilization. Summary of the Invention

[0005] The purpose of this invention is to provide a chip heat dissipation waste heat recovery device, preparation method and application based on microporous channels. By constructing a synergistic structure between the microporous channel functional layer, the ion transport adhesion layer and the current collecting active electrode layer, heat transfer, liquid transport, ion migration and charge collection can occur continuously on the same platform, thereby reducing the temperature of the heat source while outputting usable electrical energy.

[0006] To achieve the above objectives, the present invention provides a chip heat dissipation waste heat recovery device, comprising, from bottom to top, a heat source coupling layer, a microporous channel functional layer, an ion transport adhesion layer, and a current collector active electrode layer; the heat source coupling layer is in contact with the microporous channel functional layer, which is connected to an inlet and an outlet for guiding circulating water to flow in the microporous channels inside the microporous channel functional layer to remove the heat exchanged between the heat source coupling layer and the chip; the microporous channel functional layer, the ion transport adhesion layer, and the current collector active electrode layer form a water-based waste heat recovery unit; heat dissipation and waste heat recovery of the chip are achieved through the coupling of the microporous channels in the microporous channel functional layer with the water-based waste heat recovery unit.

[0007] Preferably, the microporous channel functional layer serves as both a heat dissipation function and a negative electrode for the water-based waste heat recovery unit. The microporous channel functional layer is a thermally conductive porous material with a three-dimensional interconnected pore structure. The thermally conductive porous material is one or more of foamed copper, foamed aluminum, foamed iron, and carbon-based porous framework. The surface of the thermally conductive porous material is formed by oxidation, metal deposition, roughening, or hydrophilic modification to create a functional surface with thermal conductivity, wettability, and interfacial potential difference. The inlet and outlet are arranged along the same straight line or adopt an opposed flow channel structure.

[0008] Preferably, the ion transport adhesion layer is used to provide a continuous ion transport pathway in an aqueous environment and to achieve adhesion and fixation between the microporous channel functional layer and the current collector active electrode layer. The ion transport adhesion layer is a polymer gel, electrolyte gel, or hydrogel containing hydrophilic units, hydrophobic confinement units, and adhesion functional units. The hydrophilic units are used to adsorb and retain water, the hydrophobic confinement units are used to inhibit excessive swelling of the gel, and the adhesion functional units are used to improve underwater adhesion performance. The ion transport adhesion layer contains inorganic salts, electrolytes, or ionic liquids to enhance ion conductivity and maintain continuous ion migration under thermal-humid disturbance conditions.

[0009] Preferably, the current collecting active electrode layer is one or a combination of carbon cloth, carbon paper, graphene film, carbon nanotube film, and activated carbon layer. The contact surface between the current collecting active electrode layer and the ion transport adhesion layer is provided with needle-shaped, rod-shaped, sheet-shaped, or flower-shaped micron or nano-structured active materials to increase the effective wetting interface area and improve charge collection efficiency. The active material is one or more of metal oxides, conductive polymers, and MOF derivatives.

[0010] Preferably, the heat source coupling layer includes a heat diffusion sheet and a thermally conductive substrate arranged sequentially. The heat diffusion sheet is connected to the heat source chip, and the thermally conductive substrate is connected to the microporous channel functional layer through a thermally conductive interface material, encapsulating adhesive, or mechanical clamping structure.

[0011] A preparation method for preparing the above-mentioned chip heat dissipation waste heat recovery device based on microporous channels includes the following steps: Step S1: Prepare the microporous channel functional layer, the ion transport adhesion layer, and the current collecting active electrode layer; Step S2: The microporous channel functional layer, ion transport adhesion layer and current collecting active electrode layer are layered and composited, and an inlet end, an outlet end and an external electrode are set to obtain the chip heat dissipation and waste heat recovery device.

[0012] Preferably, in step S1, the method for preparing the microporous channel functional layer is as follows: the thermally conductive porous material substrate is cleaned, and the microporous channel functional layer is constructed by oxidation, deposition or surface modification.

[0013] Preferably, in step S1, the ion transport adhesion layer is prepared by solution polymerization, in-situ crosslinking, impregnation curing, or solvent replacement, so that the ion transport adhesion layer forms a continuous ion migration network in an aqueous environment.

[0014] Preferably, in step S1, the method for preparing the current-collecting active electrode layer is: to grow or load an active material on the surface of a conductive substrate in situ to obtain the current-collecting active electrode layer.

[0015] The above-mentioned chip heat dissipation and waste heat recovery device based on micro-channels is used in electronic devices, including power devices and integrated packaged devices. The chip heat dissipation and waste heat recovery device can suppress temperature rise and output voltage, current or power signals simultaneously, whether there is cooling water circulation or not.

[0016] Therefore, the present invention, employing the above-mentioned chip heat dissipation waste heat recovery device, preparation method, and application based on microporous channels, has the following beneficial effects: (1) The microporous channel liquid cooling structure and the hydrovoltaic power generation structure are integrated into a single design. The microporous channel functional layer simultaneously serves as the heat transfer framework and the hydrovoltaic negative electrode, avoiding the structural complexity and interface loss problems caused by the separate arrangement of the traditional heat dissipation module and energy recovery module. When external circulating water is present, the heat source temperature can be rapidly reduced through fluid-structure interaction heat exchange; when there is no external circulating water, a certain degree of temperature rise suppression and power output can still be achieved through moisture absorption-evaporation latent heat extraction and interface ion migration, making the working mode flexible.

[0017] (2) A stable aqueous ion migration network is established through the ion transport adhesion layer, and excellent underwater adhesion ability is given between the layers, so that the device can maintain structural integrity and output stability under continuous water supply, immersion or cold and heat disturbance conditions.

[0018] (3) It can be modularly integrated for chips, LEDs, micro motors and other high heat flux density devices, providing new engineering solutions for low-grade heat energy recovery and efficient thermal management.

[0019] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of a chip heat dissipation waste heat recovery device based on microporous channels according to the present invention. Figure 2 This is a graph showing the electrical output curve of the present invention under conditions without external circulating water. Figure 3 This is a bar chart showing the temperature rise suppression under conditions without external circulating water, as described in this invention. Figure 4This is a graph showing the test results when the present invention is applied to LEDs; Figure 5 This is a graph showing the test results of Example 2; Figure 6 The image shows the test results for Example 3.

[0021] Figure Labels 1. Heat source coupling layer; 11. Heat diffusion sheet; 12. Thermally conductive substrate; 2. Microporous channel functional layer; 21. Water inlet end; 22. Water outlet end; 3. Ion transport adhesion layer; 4. Current collector active electrode layer; 5. Heat source chip; 6. Temperature sensor. Detailed Implementation

[0022] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0023] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0024] Example 1 like Figure 1 As shown, a chip heat dissipation waste heat recovery device based on microporous channels includes a heat source coupling layer 1, a microporous channel functional layer 2, an ion transport adhesion layer 3, and a current-collecting active electrode layer 4 arranged sequentially from bottom to top. In this embodiment, the heat source chip 5 has a size of 40mm × 40mm × 0.2mm.

[0025] The heat source coupling layer 1 includes a heat diffusion sheet 11 and a thermally conductive substrate 12 arranged sequentially. The heat diffusion sheet 11 is connected to the heat source chip 5, and the thermally conductive substrate 12 is connected to the microporous channel functional layer 2 through encapsulant, thus realizing thermal coupling with the heat source chip 5. In this embodiment, in order to detect the temperature of the heat source chip 5, a temperature sensor 6 is set on the heat source chip 5 to collect the temperature data of the heat source chip 5 for subsequent effect verification.

[0026] The microporous channel functional layer 2 is connected to an inlet end 21 and an outlet end 22, which are arranged along the same straight line to improve the coverage and temperature uniformity of the coolant in the porous framework. This guides the circulating water to flow through the microporous channels inside the microporous channel functional layer 2 to remove the heat exchanged between the heat source coupling layer 1 and the chip. The microporous channel functional layer 2, the ion transport adhesion layer 3, and the current collector active electrode layer 4 form a water-based waste heat recovery unit. Heat dissipation and waste heat recovery of the chip are achieved through the coupling of the microporous channels in the microporous channel functional layer 2 with the water-based waste heat recovery unit.

[0027] The microporous channel functional layer 2 serves as both a heat dissipation function and a negative electrode for the water-based waste heat recovery unit. The microporous channel functional layer 2 is a thermally conductive porous material with a three-dimensional interconnected pore structure. The microporous channel functional layer 2 uses a 40mm×40mm×5mm foamed copper skeleton. The thermally conductive porous material can also be one or more of foamed aluminum, foamed iron, and carbon-based porous skeletons. The surface of the thermally conductive porous material is formed by oxidation, metal deposition, roughening, or hydrophilic modification to form a functional surface with thermal conductivity, wettability, and interfacial potential difference. The current collector active electrode layer 4 uses carbon cloth as the conductive substrate, and can also use one or a combination of carbon paper, graphene film, carbon nanotube film, and activated carbon layer. The contact surface between the current collector active electrode layer 4 and the ion transport adhesion layer 3 is provided with needle-shaped, rod-shaped, sheet-shaped, or flower-shaped micron or nano-structured active materials to increase the effective wetting interface area and improve the charge collection efficiency. The active materials are one or more of metal oxides, conductive polymers, and MOF derivatives. In this embodiment, metal oxide (MnO2) is used. This structure is beneficial to expand the solid-liquid contact area and improve the charge collection efficiency in the photovoltaic power generation process.

[0028] The ion transport adhesion layer 3 is used to provide a continuous ion transport pathway in an aqueous environment and to achieve adhesion and fixation between the microporous channel functional layer 2 and the current collecting active electrode layer 4. The ion transport adhesion layer 3 is a polymer gel, electrolyte gel or hydrogel containing hydrophilic units, hydrophobic confinement units and adhesion functional units. The hydrophilic units are used to adsorb and retain water, the hydrophobic confinement units are used to inhibit excessive swelling of the gel, and the adhesion functional units are used to improve underwater adhesion performance. The ion transport adhesion layer 3 contains inorganic salts, electrolytes or ionic liquids to improve ion conductivity and maintain continuous ion migration under thermal-humid disturbance conditions.

[0029] The preparation method of the above-mentioned device includes the following steps: Step S1: Prepare the microporous channel functional layer 2, the ion transport adhesion layer 3, and the current collecting active electrode layer 4.

[0030] Preparation of microporous channel functional layer 2: After degreasing, pickling and cleaning with deionized water, the foamed copper skeleton is subjected to thermal oxidation treatment to form a rough copper oxide layer on its surface to improve hydrophilicity and specific surface area; then, a zinc layer can be introduced by electrodeposition, chemical deposition or impregnation to obtain CF@CuO@Zn microporous channel functional layer 2 with both heat transfer and hydrovoltaic power generation functions. A@B is a common standard notation in the fields of materials and electrochemistry, which characterizes the core-shell structure of the composite material. A@B represents A as the substrate or core, and B as the outer layer loading or coating. CF@CuO@Zn represents a three-layer hierarchical core-shell structure.

[0031] Preparation of ion transport adhesion layer 3: A gel precursor is prepared by free radical polymerization using hydrophilic monomers containing methacrylic acid, hydrophobic monomers containing butyl acrylate, and monomers or crosslinking agents with adhesion functions. Lithium salts or other electrolytes are then added, and solvent displacement or immersion treatment is performed to form ion transport adhesion layer 3, which has a continuous ion migration network and underwater adhesion capabilities. This gel maintains relative volume stability in an aqueous environment and avoids excessive swelling.

[0032] Fabrication of the current collector active electrode layer 4: After acid treatment to improve the surface activity of carbon cloth, an array of MnO2 nanoneedles is grown in situ on its fiber surface to obtain the CC@MnO2 current collector active electrode layer 4. By introducing micron or nano active structures on the surface of the current collector active electrode layer 4, the effective wetting area and charge collection interface are significantly expanded, thereby improving the coupling heat transfer efficiency and electrical output performance.

[0033] Step S2: The microporous channel functional layer 2, the ion transport adhesion layer 3 and the current collecting active electrode layer 4 are layered and composited, and an inlet end, an outlet end and an external electrode are set to obtain the chip heat dissipation and waste heat recovery device.

[0034] The work process is as follows: When the heat source chip 5 is working, the heat released by the heat source chip 5 is first conducted to the microporous channel functional layer 2. When the external coolant flows in from the water inlet 21, it forms a flow heat exchange inside the porous skeleton and is discharged through the water outlet 22, thereby quickly removing the heat. At the same time, a stable water-containing interface environment is formed between the surface of the microporous channel functional layer 2, the ion transport adhesion layer 3, and the current collector active electrode layer 4. Under the thermal-humid coupling disturbance, ion migration and interface charge separation occur, thereby outputting voltage and current signals in the external circuit. Figure 2 The current and voltage of the device under long-term testing are shown.

[0035] To verify the technical effectiveness of this embodiment, a comparative experiment was conducted on water circulation and waterless circulation, such as... Figure 3As shown, under conditions of continuous water circulation and a heating voltage of 3V (heating power of 0.774W), the device in this embodiment can reduce the heat source temperature from 119.42℃ to 28.85℃ and output approximately 101.86μW / cm². -2 The power density is [not specified]; even without external water flow, the heat source temperature can still be reduced from 119.42℃ to 69.78℃ through moisture absorption and evaporation alone, with an output of approximately 119.29 μW / cm². -2 The power density.

[0036] Using LEDs as heat source devices, such as Figure 4 As shown, when further applied to commercial LEDs and small motors, the operating temperature can be reduced from 99.15℃ to 28.79℃ and from approximately 80℃ to 27.93℃, respectively. This indicates that the device has good potential for device-level applications and can be used with power devices (such as LEDs and motors) as well as integrated packaged devices (such as processor chips and sensor modules).

[0037] Example 2 The difference between this embodiment and Embodiment 1 lies in the following: the current-collecting active electrode layer 4 is different, and the carbon cloth is treated with plasma or acidification to introduce hydrophilic functional groups. The treated carbon cloth is immersed in a hydrochloric acid solution containing aniline, allowing aniline monomers to adsorb onto the carbon fiber surface; subsequently, a hydrochloric acid solution containing ammonium persulfate is added dropwise, and the reaction is carried out at 0℃-25℃ for 4h-24h, allowing aniline to undergo in-situ oxidative polymerization on the carbon cloth surface to form polyaniline nanofibers or nanorod arrays. After the reaction, the surface is washed with hydrochloric acid, water, and ethanol and dried to obtain the polyaniline-modified current-collecting active electrode layer 4. By introducing micron or nano-sized active structures onto the surface of the current-collecting active electrode layer 4, the effective wetting area and charge collection interface are significantly expanded, thereby improving the coupling heat transfer efficiency and electrical output performance.

[0038] The working process is the same as in Example 1. To verify the technical effect of this example, a comparative experiment was conducted on water circulation and waterless circulation. Figure 5 As shown, under continuous water circulation and a heating voltage of 3V (heating power of 0.774W), the device in this embodiment can reduce the heat source temperature from 119.42℃ to 30.97℃; under conditions without external water flow, the heat source temperature can still be reduced from 119.42℃ to 70.02℃ through moisture absorption and evaporation alone.

[0039] Example 3 The difference between this embodiment and Embodiment 1 is that the current-collecting active electrode layer 4 is different, and the carbon cloth undergoes oxygen plasma treatment or acidification treatment. Co(NO3)2·6H2O and 2-methylimidazole are dissolved in deionized water or methanol to form a precursor solution, wherein the amount of Co(NO3)2·6H2O is 0.5-1.0 g, the amount of 2-methylimidazole is 1.0-2.0 g, and the solvent volume is 50-100 mL. The treated carbon cloth is vertically immersed in the above solution and reacted at room temperature for 4-12 h, allowing ZIF-67 to nucleate and grow in situ on the carbon cloth surface. After washing with water and ethanol and drying, the ZIF-67-modified carbon cloth precursor is obtained. The obtained ZIF-67-modified carbon is arranged in a tube furnace and heated at 5°C for 1 minute under a nitrogen or argon atmosphere. -1 The heating rate is increased to 600-800℃, and the temperature is held for 1-3 hours to obtain a cobalt / nitrogen-doped carbon-modified current-collecting active electrode layer; or the obtained ZIF-67-modified carbon is arranged in an air atmosphere and heated at 2℃ / min. -1 The heating rate is increased to 300-400℃ and held for 1-3 hours to oxidize ZIF-67 in situ into Co3O4 micro / nano structures, thus obtaining a Co3O4 modified current collector active electrode layer.

[0040] The working process is the same as in Example 1. To verify the technical effect of this example, a comparative experiment was conducted on water circulation and waterless circulation, as follows: Figure 6 As shown, under continuous water circulation and a heating voltage of 3V (heating power of 0.774W), the device in this embodiment can reduce the heat source temperature from 119.42℃ to 29.71℃; under conditions without external water flow, the heat source temperature can still be reduced from 119.42℃ to 69.94℃ through moisture absorption and evaporation alone.

[0041] It should be noted that the specific parameters described above are merely preferred embodiments and do not constitute a limitation on the scope of protection of this invention. Equivalent substitutions for porous framework materials, gel composition, electrode active layer types, encapsulation forms, liquid inlet / outlet layouts, and device dimensions should all fall within the scope of protection of this invention. The above embodiments are only used to illustrate the technical solutions of this invention and not to limit them. Although this invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the technical solutions of this invention, and these modifications or equivalent substitutions should not cause the modified technical solutions to deviate from the spirit and scope of the technical solutions of this invention.

Claims

1. A chip heat dissipation waste heat recovery device based on microporous channels, characterized in that: It includes, from bottom to top, a heat source coupling layer, a microporous channel functional layer, an ion transport adhesion layer, and a current-collecting active electrode layer; The heat source coupling layer is in contact with the microporous channel functional layer. The microporous channel functional layer is connected to the water inlet and water outlet, which is used to guide the circulating water to flow in the microporous channels inside the microporous channel functional layer to remove the heat exchanged between the heat source coupling layer and the chip. The microporous channel functional layer, the ion transport adhesion layer and the current collector active electrode layer form a water-voltaic waste heat recovery unit. The heat dissipation and waste heat recovery of the chip are realized by coupling the microporous channels in the microporous channel functional layer with the water-voltaic waste heat recovery unit.

2. The chip heat dissipation waste heat recovery device based on microporous channels according to claim 1, characterized in that: The microporous channel functional layer serves as both a heat dissipation function and a negative electrode for the water-based waste heat recovery unit. The microporous channel functional layer is a thermally conductive porous material with a three-dimensional interconnected pore structure. The thermally conductive porous material is one or more of foamed copper, foamed aluminum, foamed iron, and carbon-based porous framework. The surface of the thermally conductive porous material is formed by oxidation, metal deposition, roughening, or hydrophilic modification to form a functional surface with thermal conductivity, wettability, and interfacial potential difference. The inlet and outlet are arranged along the same straight line or adopt an opposed flow channel structure.

3. The chip heat dissipation waste heat recovery device based on microporous channels according to claim 1, characterized in that: An ion transport adhesion layer is used to provide a continuous ion transport pathway in an aqueous environment and to achieve adhesion and fixation between the microporous channel functional layer and the current collector active electrode layer. The ion transport adhesion layer is a polymer gel, electrolyte gel, or hydrogel containing hydrophilic units, hydrophobic confinement units, and adhesion functional units. The hydrophilic units are used to adsorb and retain water, the hydrophobic confinement units are used to inhibit excessive swelling of the gel, and the adhesion functional units are used to improve underwater adhesion performance. The ion transport adhesion layer contains inorganic salts, electrolytes, or ionic liquids to enhance ion conductivity and maintain continuous ion migration under thermal-humid disturbance conditions.

4. The chip heat dissipation waste heat recovery device based on microporous channels according to claim 1, characterized in that: The current collector active electrode layer is one or a combination of carbon cloth, carbon paper, graphene film, carbon nanotube film, and activated carbon layer. The contact surface between the current collector active electrode layer and the ion transport adhesion layer is provided with needle-shaped, rod-shaped, sheet-shaped, or flower-shaped micron or nano-structured active materials to increase the effective wetting interface area and improve charge collection efficiency. The active material is one or more of metal oxides, conductive polymers, and MOF derivatives.

5. The chip heat dissipation waste heat recovery device based on microporous channels according to claim 1, characterized in that: The heat source coupling layer includes a heat diffusion sheet and a thermally conductive substrate arranged sequentially. The heat diffusion sheet is connected to the heat source chip, and the thermally conductive substrate is connected to the micro-channel functional layer through a thermally conductive interface material, encapsulating adhesive, or mechanical clamping structure.

6. A preparation method for preparing a chip heat dissipation waste heat recovery device based on microporous channels as described in any one of claims 1-5, characterized in that, The steps include the following: Step S1: Prepare the microporous channel functional layer, the ion transport adhesion layer, and the current collecting active electrode layer; Step S2: The microporous channel functional layer, ion transport adhesion layer and current collecting active electrode layer are layered and composited, and an inlet end, an outlet end and an external electrode are set to obtain the chip heat dissipation and waste heat recovery device.

7. The preparation method according to claim 6, characterized in that: In step S1, the method for preparing the microporous channel functional layer is as follows: the thermally conductive porous material substrate is cleaned, and the microporous channel functional layer is constructed by oxidation, deposition or surface modification.

8. The preparation method according to claim 6, characterized in that: In step S1, the ion transport adhesion layer is prepared by solution polymerization, in-situ crosslinking, impregnation curing or solvent replacement, so that the ion transport adhesion layer forms a continuous ion migration network in an aqueous environment.

9. The preparation method according to claim 6, characterized in that: In step S1, the method for preparing the current-collecting active electrode layer is as follows: an active material is grown or loaded in situ on the surface of a conductive substrate to obtain the current-collecting active electrode layer.

10. An application characterized in that, The chip heat dissipation and waste heat recovery device based on micro-channel as described in any one of claims 1-5 is applied to electronic devices, including power devices and integrated packaged devices. The chip heat dissipation and waste heat recovery device can suppress temperature rise and output voltage, current or power signals simultaneously, whether there is cooling water circulation or not.

Images