An IC package magnetically shielded structure and method of manufacture

Abstract

The application belongs to the technical field of semiconductor device packaging, and relates to an IC packaging anti-magnetic shielding structure and a manufacturing method. The IC packaging anti-magnetic shielding structure comprises a lead frame, a die-bonding material, and an anti-magnetic shielding pad; the anti-magnetic shielding pad is arranged on the base island of the lead frame through the die-bonding material; the chip body is fixed on the anti-magnetic shielding pad through the die-bonding material, the conductive carrier is arranged on the anti-magnetic shielding pad through the die-bonding material, the dense wires are arranged on the conductive carrier, and the plastic encapsulation body is used for wrapping the lead frame, the anti-magnetic shielding pad, the chip body, the conductive carrier and the dense wires; the anti-magnetic shielding pad and the dense wires are arranged in parallel and at intervals, and the anti-magnetic shielding pad and the dense wires cooperatively shield the interference of the external magnetic field on the chip body. The technical problem that the anti-magnetic capability is insufficient and the external magnetic field cannot effectively interfere with the chip body in the existing IC packaging technology is solved.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor device packaging technology, and relates to an antimagnetic shielding structure for IC packaging and its manufacturing method. Background Technology

[0002] In traditional integrated circuit packaging, to prevent external environmental impacts on the wire bonding and chip, EMC (epoxy resin) is used to encapsulate the finished product after wire bonding. This involves sealing the integrated circuit in a hermetically sealed or non-hermetically sealed manner to protect the integrated circuit and its electrical connections.

[0003] Epoxy resin molding compound is a thermosetting chemical material used for semiconductor packaging. It is mainly composed of epoxy resin, hardener, filler, additives, etc., mixed and processed. Its main functions are as follows: protecting the chip from the influence of the external environment (resisting external moisture, solvents, and impact); electrically insulating the chip from the external environment; providing good mounting performance (resisting thermal shock and mechanical vibration during installation); and thermal diffusion.

[0004] As can be seen, antimagnetic capability is not a strength of traditional packaged products. However, in telecommunications technology, some communication devices generate mutual inductance. To ensure the accurate and stable operation of chips in various precision instruments, the influence of stray magnetic fields and the Earth's magnetic field must be avoided, which necessitates magnetic shielding. Therefore, designing an antimagnetic structure to solve the above problems becomes crucial for meeting the specific needs of products and enhancing their competitiveness. Summary of the Invention

[0005] The purpose of this invention is to provide an antimagnetic shielding structure and manufacturing method for IC packaging, so as to solve the technical problem that the existing IC packaging technology relies on epoxy resin molding compound for packaging, resulting in insufficient antimagnetic capability and difficulty in effectively suppressing the interference of external magnetic fields on the chip body.

[0006] To achieve the above objectives, the present invention employs the following technical solution: In a first aspect, this application discloses an antimagnetic shielding structure for IC packaging, comprising: Leadframe, the leadframe has a base island; Adhesive materials; The antimagnetic shielding pad is set on the base island of the lead frame using adhesive material; The chip body is fixed to the antimagnetic shielding pad by adhesive material. The antimagnetic shielding pad is used to shield the interference of external magnetic fields in the corresponding direction on the back of the chip body. The conductive carrier and dense wire bonding are used to shield the interference of external magnetic fields in the corresponding direction on the front of the chip body. The conductive carrier is set on the antimagnetic shielding pad by the adhesive material, and the dense wire bonding is set on the conductive carrier. The molding compound encapsulates the lead frame, antimagnetic shielding pad, chip body, conductive carrier, and dense wire bonding. The antimagnetic shielding pads are arranged parallel to and spaced apart from the dense bonding wires. The antimagnetic shielding pads and dense bonding wires work together to shield the chip body from interference from external magnetic fields.

[0007] Optionally, a first adhesive layer is provided between the antimagnetic shielding pad and the base island of the lead frame, a second adhesive layer is provided between the chip body and the antimagnetic shielding pad, and a third adhesive layer is provided between the conductive carrier and the antimagnetic shielding pad. The first, second, and third adhesive layers are all formed of adhesive material.

[0008] Optionally, the conductive carrier is configured as two, which are respectively disposed on opposite sides of the chip body, and dense wire bonding is connected between the two conductive carriers, and the chip body is covered inside the dense wire bonding and the conductive carrier.

[0009] Optionally, the material of the densely packed wires is gold wire, copper wire, or aluminum wire.

[0010] Optionally, the antimagnetic shielding pad is made of ferromagnetic material.

[0011] Optionally, the encapsulation body includes a resin matrix in which magnetic shielding material is dispersed to enhance the magnetic field shielding function of the antimagnetic encapsulation structure.

[0012] Optionally, both the dense wire bonding and the antimagnetic shielding pad are used to absorb the magnetic field lines of the external magnetic field, so as to form a magnetic vacuum in the area where the chip body is located.

[0013] Optionally, the outer contour dimensions of the antimagnetic shielding pad are matched with the base island dimensions of the lead frame and the dimensions of the chip body.

[0014] Optionally, the height of the dense wire bonding is determined based on the dimensions of the molding compound, the depth of the lead frame, the dimensions of the chip body, the arc height of the wire, and the dimensions of the antimagnetic shielding pad.

[0015] Secondly, this application discloses a method for manufacturing an IC package antimagnetic shielding structure as described in any one of the above claims, comprising: The antimagnetic shielding pad is attached to the base island of the lead frame using adhesive material and then cured. The conductive carrier is attached to the antimagnetic shielding pad using adhesive material and then cured. The chip body is attached to the antimagnetic shielding pad with its back side using an adhesive material, and then cured. Cleaning is performed on the structure with the chip body mounted before pressure soldering. The pads on the front of the chip body are electrically connected to the pins of the lead frame via chip bonding wires. The conductive carrier is connected by dense wire bonding, so that the dense wire bonding covers the chip body. The lead frame, antimagnetic shielding pad, chip body, conductive carrier, and dense wire bonding are encapsulated using molding compound to form a molded body. The antimagnetic shielding pads are arranged parallel to and spaced apart from the densely packed wires, which are used to work together to shield the chip body from interference from external magnetic fields.

[0016] Compared with the prior art, the present invention has the following beneficial effects: This application places an antimagnetic shielding pad on the base island of the lead frame and fixes the chip body to the antimagnetic shielding pad. Simultaneously, conductive carriers and dense wire bonding are placed on the antimagnetic shielding pad, forming a parallel double-layer shielding structure on the back and front sides of the chip body, respectively. The two work together to effectively suppress magnetic field lines from different directions from opposite sides of the chip body, thus creating a comprehensive magnetic field shielding effect in the area where the chip body is located. This significantly improves the package structure's resistance to external magnetic fields. Furthermore, this antimagnetic shielding structure is embedded within the molding compound, without altering the dimensions of the packaged product. It enhances the antimagnetic performance of the product without affecting soldering and assembly compatibility. Moreover, this structure is suitable for various packaging forms, exhibiting good process adaptability and versatility.

[0017] Furthermore, by setting the adhesive layers between the antimagnetic shielding pad and the lead frame base island, between the chip body and the antimagnetic shielding pad, and between the conductive carrier and the antimagnetic shielding pad to be formed of the same adhesive material, a stable connection of the three-layer structure can be achieved with a unified adhesive process and material system. This ensures reliable positioning between the antimagnetic shielding pad and the lead frame, firm fixation between the chip body and the antimagnetic shielding pad, and stable installation between the conductive carrier and the antimagnetic shielding pad. It also simplifies the die bonding process in the pre-packaging stage, improves process connection efficiency and overall structural consistency, thereby ensuring the parallel spacing accuracy and reliability of the synergistic shielding effect between the antimagnetic shielding pad and the dense wire bonding. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a main cross-sectional view of the antimagnetic shielding structure of the IC package of the present invention; Figure 2 This is a side cross-sectional view of the antimagnetic shielding structure of the IC package of the present invention; Figure 3 This is a top view of the antimagnetic shielding structure of the IC package of the present invention.

[0020] Wherein: 01-lead frame; 02-die bonding material; 03-antimagnetic shielding pad; 04-chip body; 05-dense wire bonding; 06-molding body; 07-chip bonding wire; 08-conductive carrier. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0023] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0024] In the description of the embodiments of the present invention, it should be noted that if terms such as "upper," "lower," "horizontal," or "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, terms such as "first" and "second" are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] Furthermore, the use of the term "horizontal" does not imply that the component must be absolutely horizontal, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0026] In the description of the embodiments of the present invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific circumstances.

[0027] The present invention will now be described in further detail with reference to the accompanying drawings: See Figure 1 This application discloses an antimagnetic shielding structure for IC packaging, characterized in that it includes: Lead frame 01, lead frame 01 has a base island; Adhesive material 02; The antimagnetic shielding pad 03 is set on the base island of the lead frame 01 by means of adhesive material 02; The chip body 04 is fixed to the antimagnetic shielding pad 03 by the adhesive material 02. The antimagnetic shielding pad 03 is used to shield the interference of external magnetic fields in the corresponding direction on the back of the chip body 04. The conductive carrier 08 and the dense wire bonding 05 are used to shield the interference of external magnetic fields in the corresponding direction on the front side of the chip body 04. The conductive carrier 08 is set on the antimagnetic shielding pad 03 by the adhesive material 02, and the dense wire bonding 05 is set on the conductive carrier 08. The molding compound 06 encapsulates the lead frame 01, the antimagnetic shielding pad 03, the chip body 04, the conductive carrier 08, and the dense wire bonding 05. The antimagnetic shielding pad 03 and the dense bonding wire 05 are arranged parallel to each other and spaced apart. The antimagnetic shielding pad 03 and the dense bonding wire 05 work together to shield the external magnetic field from interference to the chip body 04.

[0028] The antimagnetic shielding structure of the IC package in this embodiment has a densely bonded wire 05 of conductive carrier 08 and an antimagnetic shielding pad 03. The densely bonded wire 05 of conductive carrier 08 and the antimagnetic shielding pad 03 are parallel double-layer magnetic shielding layers. The densely bonded wire 05 of conductive carrier 08 and the antimagnetic shielding pad 03 work together to shield the interference of external magnetic fields on the chip body 04. The double-layer magnetic shielding layer can guide magnetic field lines in different directions from the chip surface, thereby improving the antimagnetic performance of the antimagnetic packaging structure. This embodiment is an internal structure of the plastic package. The appearance size of the packaged product will not be changed because it includes this structure. That is, the antimagnetic capability can be increased without affecting its soldering and assembly, and it is applicable to various packaging forms.

[0029] In some embodiments, a first adhesive layer is provided between the antimagnetic shielding pad 03 and the base island of the lead frame 01, a second adhesive layer is provided between the chip body 04 and the antimagnetic shielding pad 03, and a third adhesive layer is provided between the conductive carrier 08 and the antimagnetic shielding pad 03. All three adhesive layers are formed of adhesive material 02. By using the same adhesive material 02 to form the first, second, and third adhesive layers between the antimagnetic shielding pad 03 and the base island of the lead frame 01, between the chip body 04 and the antimagnetic shielding pad 03, and between the conductive carrier 08 and the antimagnetic shielding pad 03, a stable multi-layered bonding system can be constructed within the package structure. This ensures the precise positioning and firm attachment of the antimagnetic shielding pad, chip body, and conductive carrier on the lead frame, while avoiding the process complexity and interface matching risks associated with introducing multiple different types of adhesive materials. This simplifies the pre-packaging process, improves manufacturing efficiency, and enhances product consistency while ensuring reliable connections between functional layers.

[0030] In some embodiments, two conductive carriers 08 are provided, each disposed on opposite sides of the chip body 04. A dense wire bonding 05 connects the two conductive carriers 08, enclosing the chip body 04 within the dense wire bonding 05 and the conductive carriers 08. By providing two conductive carriers 08 on opposite sides of the chip body 04 and connecting them with the dense wire bonding 05, a shield-like shielding space covering the front and lateral areas of the chip body 04 is formed by the conductive carriers 08 and the dense wire bonding 05. This effectively encloses the chip body 04 within the shielding structure, creating a continuous magnetic field shielding barrier on the front and sides of the chip body 04. This further expands the shielding direction, preventing external magnetic fields from intruding through lateral gaps and weakening the shielding effect, thus improving the comprehensiveness and reliability of the antimagnetic shielding. Simultaneously, this dual-sided conductive carrier and dense wire bonding architecture is simple in structure and compatible with existing wire bonding processes, facilitating implementation through two bonding processes in the pre-packaging stage, and exhibiting good manufacturability.

[0031] In some embodiments, the dense wire bonding 05 is made of gold, copper, or aluminum wire. These materials are all high-conductivity metals, capable of achieving good electrical connections while forming a stable magnetic shielding mesh with the conductive carrier 08. This effectively guides and absorbs magnetic field lines from external magnetic fields, thereby enhancing the magnetic field shielding effect on the front side of the chip body 04. Furthermore, gold, copper, and aluminum wires are all mature wire bonding materials that can be directly implemented using existing bonding equipment and processes without incurring additional process change costs, thus helping to maintain packaging efficiency and product yield.

[0032] In some embodiments, the antimagnetic shielding pad 03 is made of a ferromagnetic material. Utilizing the high permeability of ferromagnetic materials, it can effectively attract and concentrate magnetic field lines from external magnetic fields, causing these lines to preferentially pass through the interior of the antimagnetic shielding pad 03. This creates a low magnetic resistance path on the back side of the chip body 04, diverting magnetic field energy from the chip area and reducing the magnetic flux density at the location of the chip body 04. This effectively isolates and attenuates the magnetic field on the back side of the chip body 04, improving the reliability of the antimagnetic shielding. Furthermore, ferromagnetic materials are conventional industrial materials, with controllable costs, easy processing into desired shapes and sizes, and good process compatibility with lead frames and die-attach materials.

[0033] In some embodiments, the encapsulation body 06 includes a resin matrix in which magnetic shielding material is dispersed to enhance the magnetic field shielding function of the antimagnetic packaging structure. By dispersing the magnetic shielding material in the resin matrix of the encapsulation body 06, the encapsulation body 06 itself has the dual functions of encapsulation protection and magnetic field shielding. While encapsulating the chip body 04 and the internal shielding structure, it further absorbs and attenuates stray magnetic fields that pass through or leak into the area of ​​the encapsulation body 06 from the outside. This forms a multi-level shielding system from the inside out with the antimagnetic shielding pad 03 and the dense wire bonding 05, enhancing the overall magnetic field shielding effect of the antimagnetic packaging structure and further reducing the interference of external magnetic fields on the chip body 04. At the same time, the magnetic shielding material dispersed in the resin matrix does not increase the external size of the package, which is beneficial for maintaining the miniaturization and standardized package shape of the product.

[0034] In some embodiments, both the dense wire bonding 05 and the antimagnetic shielding pad 03 are used to absorb magnetic field lines from the external magnetic field, thereby creating a magnetic vacuum in the area where the chip body 04 is located. By having the dense wire bonding 05 and the antimagnetic shielding pad 03 jointly absorb the magnetic field lines from the external magnetic field, the magnetic field lines are guided to pass through the interior of the antimagnetic shielding pad 03 and the dense wire bonding 05, thus creating a magnetic vacuum effect in the area where the chip body 04 is located. This means that the magnetic field line density in this area is significantly reduced, and the magnetic field strength approaches zero. This achieves comprehensive magnetic field isolation of the chip body 04 from a physical perspective, effectively preventing interference from external magnetic fields on the internal electrical signals and operational accuracy of the chip. It significantly improves the antimagnetic protection effect for sensitive chips in precision instruments and communication equipment, ensuring that the chip maintains a stable and accurate working state even in complex electromagnetic environments.

[0035] In some embodiments, the outer contour dimensions of the antimagnetic shielding pad 03 match the base island dimensions of the lead frame 01 and the dimensions of the chip body 04. This ensures that the antimagnetic shielding pad 03 completely covers the back surface area of ​​the chip body 04, avoiding shielding blind spots or edge magnetic leakage due to insufficient pad size, thereby guaranteeing comprehensive and uniform shielding of the magnetic field in the back direction of the chip body 04. At the same time, matching the base island dimensions also ensures stable mounting and accurate positioning of the pad on the lead frame, which is beneficial for the smooth progress of subsequent processes and improves the overall reliability and process consistency of the packaging structure.

[0036] In some embodiments, the height of the dense wire bonding 05 is determined based on the dimensions of the molding compound 06, the depth of the lead frame 01, the dimensions of the chip body 04, the arc height of the wire, and the dimensions of the antimagnetic shielding pad 03. This ensures that the dense wire bonding 05 has a reasonable and precise spatial position within the package, guaranteeing that the wire bonding completely covers the front side of the chip body 04 to form an effective magnetic shielding layer, while avoiding the wire bonding from touching the inner wall of the molding compound 06 or being exposed due to being too high, or from interfering with the chip body 04 or the bonding wires due to being too low. This ensures the antimagnetic shielding effect while improving the space utilization and process yield of the package structure, and enhancing the adaptability to different package forms and size specifications.

[0037] This application also discloses a method for manufacturing an IC package antimagnetic shielding structure as described in any one of the above claims, comprising: The antimagnetic shielding pad 03 is attached to the base island of the lead frame 01 using adhesive material 02 and then cured. The conductive carrier 08 is attached to the antimagnetic shielding pad 03 using adhesive material 02 and then cured. The chip body 04 is attached to the antimagnetic shielding pad 03 with its back side using adhesive material 02, and then cured. Cleaning is performed on the structure with the chip body 04 mounted before pressure soldering. The pads on the front of the chip body 04 are electrically connected to the pins of the lead frame 01 via chip bonding wires 07. The conductive carrier 08 is connected by dense wire bonding 05, so that the dense wire bonding 05 covers the chip body 04 inside it; The molding compound is used to form a molding body 06 that encapsulates the lead frame 01, the antimagnetic shielding pad 03, the chip body 04, the conductive carrier 08, and the dense wire bonding 05. The antimagnetic shielding pad 03 is parallel to and spaced apart from the densely packed wires 05, and is used to work together to shield the chip body 04 from interference by external magnetic fields.

[0038] Example 1: This invention provides an antimagnetic shielding structure for IC packaging, which can solve the problem of insufficient antimagnetic capability of epoxy resin molding compound used in existing IC packaging technology, thereby improving the magnetic shielding capability of the product and enhancing its competitiveness.

[0039] A magnetic shielding structure for IC packaging, comprising: Lead frame 01, the base island of which has sufficient mounting dimensions; Adhesive material 02, which can adhere to metal materials and silicon-based materials; An antimagnetic shielding pad 03 is disposed between the back of the chip body 04 and the lead frame 01 base island. The antimagnetic shielding pad 03 is used to shield the chip body 04 from interference by external magnetic fields in the corresponding direction on the back of the chip body 04. The chip body 04 is attached to the antimagnetic shielding pad 03 by means of adhesive material 02 on the back side of the chip body 04, and the front side of the chip has metal leads connected to the frame pins. The conductive carrier 08 and the dense bonding wire 05 are placed on the antimagnetic shielding pad 03 and bonded together using adhesive material 02. The conductive carrier 08 and the dense bonding wire 05 connected to it are used to shield the chip body 04 from interference by external magnetic fields in the direction corresponding to the front of the chip body 04. The encapsulation body 06 is an epoxy resin encapsulation material. The encapsulation body is used to encapsulate the lead frame 01 base island, the antimagnetic shielding pad 03, the chip body 04, the conductive carrier 08 and the dense wire bonding 05. The antimagnetic shielding pad 03 is arranged parallel to the upper surface of the densely bonded wires 05 of the conductive carrier 08. The antimagnetic shielding pad 03 and the densely bonded wires 05 of the conductive carrier 08 work together to shield the chip body 04 from interference by the external magnetic field.

[0040] Optionally, a first adhesive layer is provided between the antimagnetic shielding pad 03 and the lead frame 01 base island, the first adhesive layer being used to attach the antimagnetic shielding pad 03 to the lead frame 01 base island.

[0041] Optionally, a second adhesive layer is provided between the chip body 04 and the antimagnetic shielding pad 03, the second adhesive layer being used to attach the chip body 04 to the antimagnetic shielding pad 03.

[0042] Optionally, a third adhesive layer is provided between the conductive carrier 08 and the antimagnetic shielding pad 03, the third adhesive layer being used to attach the conductive carrier 08 to the antimagnetic shielding pad 03.

[0043] Optionally, the densely packed wires 05 of the conductive carrier 08 and the antimagnetic shielding pad 03 are both used to absorb the magnetic field lines of the external magnetic field, forming a magnetic vacuum in the area where the chip body 04 is located.

[0044] Optionally, the encapsulation layer includes a resin matrix in which a magnetic shielding material is disposed, the magnetic shielding material being used to enhance the magnetic field shielding function of the antimagnetic encapsulation structure.

[0045] Optionally, the antimagnetic shielding pad 03 is made of ferromagnetic material; the bonding wire is a conductor (gold wire, copper wire, aluminum wire, etc.). Example 2: This application discloses an antimagnetic shielding structure for IC packaging, used to encapsulate the die unit of a chip to obtain an antimagnetic package structure. This chip is highly sensitive to external magnetic fields. A magnetic shielding layer is provided to shield the chip body from magnetic fields in the vertical direction. This invention is an internal structure of a plastic package; the external dimensions of the packaged product will not change due to the inclusion of this structure. That is, antimagnetic capability can be increased without affecting its soldering and assembly, and it is applicable to various packaging forms.

[0046] The antimagnetic packaging structure of the chip will be described in detail below with reference to the accompanying drawings. Figure 1 This is a cross-sectional schematic diagram of an electromagnetic shielding packaging structure according to an embodiment of the present invention. Figure 2 for Figure 1 A side view of the electromagnetic shielding encapsulation structure.

[0047] refer to Figure 1 and Figure 2 As shown, the electromagnetic shielding packaging structure mainly includes a lead frame 01, a bonding material 02, an antimagnetic shielding pad 03, a chip body 04, a bonding wire 05 connecting to the conductive carrier, a molding compound 06, and a conductive carrier 08.

[0048] The antimagnetic shielding pad 03 is connected to the base island of the lead frame 01 via the adhesive material 02, and the chip body 04 is then connected to the antimagnetic shielding pad 03 via the adhesive material 02. The antimagnetic shielding pad forms a magnetic shielding layer on the back side of the chip body 04. This is used to shield the chip body 04 from interference from external magnetic fields in the corresponding direction on the back side of the chip body 04.

[0049] The bonding wire 05 connecting the conductive carriers and the two conductive carriers 08 form a shield to accommodate the chip and leads. The conductive carriers 08 are connected to the antimagnetic shielding pad 03 via the adhesive material 02. The dense bonding wires connecting the conductive carriers connect the two conductive carriers together by ultrasonic bonding, enclosing the chip body 04 within it, forming a magnetic shielding layer on the front side of the chip body 04. This is used to shield the chip body 04 from interference from external magnetic fields in the corresponding direction on the front side of the chip body 04.

[0050] Epoxy molding compound fills the gap between the bonding wire 05 connecting the conductive carrier and the chip body 04 and the antimagnetic shielding pad 03, and wraps the bonding wire 05 connecting the conductive carrier and the lead frame 01 to form a molding compound with a predetermined shape.

[0051] In this embodiment, the antimagnetic packaging structure of the chip is disposed inside the plastic package, and the antimagnetic shielding pad 03 is mounted on the base island of the lead frame 01. The antimagnetic shielding pad 03 is made of ferromagnetic material, is plate-shaped, and its external contour dimensions need to match the dimensions of the lead frame base island and the chip. It is placed on the front side of the lead frame base island and is bonded to the base island using adhesive material. It is used to shield the chip body 04 from interference by external magnetic fields in the direction corresponding to the back side of the chip body 04. The chip body 04 is mounted on the front side of the antimagnetic shielding pad 03. The densely bonded wires 05 connecting the conductive carrier are mounted on the front side of the antimagnetic shielding pad 03 through the conductive carrier, enveloping the chip within it. The size of the conductive carrier and the height of the wires need to be considered in conjunction with the package size, the depth of the frame recess, the chip size, the arc height of the wires, and the size of the antimagnetic shielding pad. The densely bonded wires connecting the conductive carrier envelop the bonded chip body 04 within it. It is used to shield the chip body 04 from interference by external magnetic fields in the direction corresponding to the front side of the chip body 04. The antimagnetic encapsulation structure is set inside the plastic encapsulation body, thereby avoiding the influence of harmful factors such as water vapor and heat in the environment, further ensuring the electromagnetic shielding effect of the electromagnetic shielding component, thus reducing interference from other electronic devices and having better stability.

[0052] In this embodiment, the pre-packaging process flow is as follows: chip mounting 1, chip baking 1, chip mounting 2, chip baking 2, chip mounting 3, chip baking 3, pre-bonding cleaning, bonding 1, bonding 2, and molding. Specifically, chip mounting 1 and chip baking 1 involve bonding the antimagnetic shielding pad to the frame using adhesive material and then curing it; chip mounting 2 and chip baking 2 involve bonding the conductive carrier to the antimagnetic shielding pad using adhesive material and then curing it; chip mounting 3, chip baking 3, pre-bonding cleaning, and bonding 1 involve bonding the chip to the antimagnetic shielding pad using adhesive material, followed by baking curing and pre-bonding cleaning, and then wire bonding; bonding 2 involves connecting two conductive carriers together using wire bonding and encapsulating the chip within a dense wire bonding enclosure; and molding is the process of encapsulating the antimagnetic shielding structure with molding compound.

[0053] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A magnetic shielding structure for IC packaging, characterized in that, include: The lead frame (01) has a base island; Adhesive material (02); The antimagnetic shielding pad (03) is set on the base island of the lead frame (01) by means of adhesive material (02); The chip body (04) is fixed to the antimagnetic shielding pad (03) by adhesive material (02). The antimagnetic shielding pad (03) is used to shield the interference of external magnetic fields in the corresponding direction on the back of the chip body (04). The conductive carrier (08) and the dense wire bonding (05) are provided on the antimagnetic shielding pad (03) by means of the adhesive material (02), and the dense wire bonding (05) is provided on the conductive carrier (08) to shield the interference of external magnetic field on the front side of the chip body (04). The molding compound (06) encapsulates the lead frame (01), the antimagnetic shielding pad (03), the chip body (04), the conductive carrier (08), and the dense bonding wire (05); The antimagnetic shielding pad (03) and the dense bonding wire (05) are arranged parallel and spaced apart. The antimagnetic shielding pad (03) and the dense bonding wire (05) work together to shield the external magnetic field from interference to the chip body (04).

2. The antimagnetic shielding structure for IC packaging according to claim 1, characterized in that, A first adhesive layer is provided between the antimagnetic shielding pad (03) and the base island of the lead frame (01), a second adhesive layer is provided between the chip body (04) and the antimagnetic shielding pad (03), and a third adhesive layer is provided between the conductive carrier (08) and the antimagnetic shielding pad (03). The first adhesive layer, the second adhesive layer and the third adhesive layer are all formed by adhesive material (02).

3. The antimagnetic shielding structure for IC packaging according to claim 1, characterized in that, The conductive carrier (08) is configured as two, and the two conductive carriers (08) are respectively disposed on opposite sides of the chip body (04). The dense bonding wire (05) is connected between the two conductive carriers (08) and covers the chip body (04) inside the dense bonding wire (05) and the conductive carrier (08).

4. The antimagnetic shielding structure for IC packaging according to claim 3, characterized in that, The densely packed wire (05) is made of gold wire, copper wire or aluminum wire.

5. The antimagnetic shielding structure for IC packaging according to claim 1, characterized in that, The antimagnetic shielding pad (03) is made of ferromagnetic material.

6. The antimagnetic shielding structure for IC packaging according to claim 1, characterized in that, The encapsulation body (06) includes a resin matrix in which magnetic shielding material is dispersed to enhance the magnetic field shielding function of the antimagnetic encapsulation structure.

7. The antimagnetic shielding structure for IC packaging according to claim 1, characterized in that, Both the dense bonding wire (05) and the antimagnetic shielding pad (03) are used to absorb the magnetic field lines of the external magnetic field to form a magnetic vacuum in the area where the chip body (04) is located.

8. The antimagnetic shielding structure for IC packaging according to claim 1, characterized in that, The outer contour dimensions of the antimagnetic shielding pad (03) are matched with the base island dimensions of the lead frame (01) and the dimensions of the chip body (04).

9. The antimagnetic shielding structure for IC packaging according to claim 1, characterized in that, The height of the dense bonding wire (05) is determined based on the size of the molding compound (06), the depth of the lead frame (01), the size of the chip body (04), the arc height of the wire, and the size of the antimagnetic shielding pad (03).

10. A method for manufacturing an IC package antimagnetic shielding structure according to any one of claims 1 to 9, characterized in that, include: The antimagnetic shielding pad (03) is attached to the base island of the lead frame (01) using adhesive material (02) and then cured. The conductive carrier (08) is attached to the antimagnetic shielding pad (03) using adhesive material (02) and then cured. The chip body (04) is attached to the antimagnetic shielding pad (03) with its back side using the adhesive material (02), and then cured. Clean the structure with the chip body (04) mounted on it before pressure bonding; The pads on the front of the chip body (04) are electrically connected to the pins of the lead frame (01) via chip bonding wires (07); The conductive carrier (08) is connected by dense wire bonding (05), so that the dense wire bonding (05) covers the chip body (04) inside it; The molding compound is used to form a molding compound (06) that encapsulates the lead frame (01), the antimagnetic shielding pad (03), the chip body (04), the conductive carrier (08), and the dense wire bonding (05). The antimagnetic shielding pad (03) is parallel to and spaced apart from the dense bonding wire (05) to work together to shield the chip body (04) from interference by external magnetic fields.

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