Bonding apparatus and method of interfacing a carrier

Abstract

The application belongs to the technical field of semiconductor material bonding equipment, and discloses a bonding device and a transfer method of a bearing piece. The bonding device comprises an upper pressing head, a bearing device, a lower pressing head and a mechanical arm. The upper pressing head is used for fixing a wafer and making a bonding surface of the wafer face downward. The bearing device comprises a plurality of bearing mechanisms which are arranged at the periphery of the upper pressing head in a spaced manner. Each bearing mechanism is used for fixing a bearing piece. The lower pressing head is arranged opposite to the upper pressing head and is used for selectively fixing a bearing piece and driving the bearing piece to ascend and descend along the Z direction. The mechanical arm is used for transferring the bearing piece between the bearing mechanism and the lower pressing head. The application can reduce the risk of the bonding surface of the wafer falling into particles, reduce the pollution of the surface contacted by the bearing mechanism and the wafer, and further improve the bonding quality.

Description

Technical Field

[0001] This invention relates to the field of semiconductor material bonding equipment technology, and in particular to a bonding equipment and carrier handover method. Background Technology

[0002] The grain-to-wafer bonding process refers to the process of tightly bonding the grain and the wafer through physical or chemical means. Most existing bonding methods are top-down bonding methods with the grain on top and the wafer on the bottom.

[0003] Bonding fixtures include support fixtures for carrying the die. The setting of the support fixtures can achieve precise positioning of the die and uniform force during bonding, protect the die and adapt to the bonding process, and ensure bonding quality and efficiency.

[0004] In the above bonding method, the wafer is placed with the bonding surface facing upwards for a long time, which increases the risk of particles falling in and introducing voids at the bonding interface. In addition, the existing bonding tooling and the surface in contact with the die are fixed to the bonding tooling by a fixing structure. During the transfer or fixing of the bonding tooling, the surface in contact with the die is easily contaminated, which reduces the quality of subsequent bonding. Summary of the Invention

[0005] The purpose of this invention is to provide a method for handing over bonding equipment and carrier components, which aims to solve the problem in the prior art that when bonding a die and a wafer, the surface of the wafer to be bonded is always facing upwards, making it easy for particles to fall in, and the surface of the bonding fixture and the die to be in contact is easily contaminated. This method for handing over bonding equipment and carrier components can reduce the risk of particles falling into the surface of the wafer to be bonded, reduce contamination of the carrier mechanism and the surface of the die to be in contact, and improve the bonding quality.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] Bonding apparatus, including:

[0008] The upper pressure head is used to fix the wafer and position the wafer with the bonding surface facing downwards;

[0009] The support device includes multiple support mechanisms, which are spaced apart and arranged around the periphery of the upper pressure head. Each support mechanism is used to adsorb and fix a support member, which is used to support the crystal grain.

[0010] A lower pressure head is disposed opposite to the upper pressure head. The lower pressure head is used to selectively fix one of the carrier members and drive the carrier members to move up and down along the Z direction.

[0011] A robotic arm is used to transfer the carrier between the carrier mechanism and the pressing head.

[0012] In some possible implementations, the pressure head fixes the wafer via an adaptive adsorption structure.

[0013] In some possible implementations, the carrier members fixed by each of the carrier mechanisms are of different specifications, and each of the carrier members is adapted to the grains of different sizes.

[0014] In some possible implementations, the pressing head includes a first driving member and an adsorption member, the adsorption member being connected to the output end of the first driving member, the first driving member being used to drive the adsorption member to move up and down in the Z direction, and the carrier member adsorbing and fixing itself to the adsorption member.

[0015] In some possible implementations, the top of the adsorption member has a plurality of positioning posts, which are spaced apart along the periphery of the carrier member, wherein one of the positioning posts corresponds to and engages with a foolproof groove on the side of the carrier member.

[0016] In some possible implementations, the edge of the front side of the carrier is adsorbed onto the carrier mechanism, and the bonding device further includes multiple gripper units, which are arranged in a one-to-one correspondence with the multiple carrier mechanisms. The carrier mechanism clamps the back side of the carrier through the gripper units.

[0017] In some possible implementations, a boss is provided on the front side of the carrier for placing the grain, and the non-boob portion of the front side of the carrier is adsorbed onto the carrier mechanism, which has clearance space to avoid the boss.

[0018] In some possible implementations, the gripper unit includes a drive member and a gripper structure. The gripper structure includes a first gripper assembly for clamping the carrier. The first gripper assembly includes two symmetrically arranged anti-drop grippers. The second drive member is used to drive the two anti-drop grippers to move closer or further apart from each other. Two support structures are provided on the back of the carrier. The two support structures correspond to the two anti-drop grippers, and the shapes of the support structures and the anti-drop grippers match.

[0019] In some possible implementations, the supporting mechanism includes a base plate and a mounting plate connected to each other. The mounting plate is arranged parallel to the base plate and located below the base plate. The second driving member is mounted on the base plate. The bottom of the mounting plate is provided with a receiving groove. The bottom of the receiving groove is provided with an adsorption air passage for adsorbing the supporting member. The bottom of the receiving groove is provided with a clearance hole for avoiding the first gripper assembly. When the supporting member is adsorbed in the receiving groove, the boss extends into the clearance hole.

[0020] The method for transferring the carrier component, using the bonding equipment described in any of the above embodiments, includes:

[0021] When picking up the item, the carrying mechanism releases the carrying component, and the robotic arm transports the carrying component to the lower pressure head for fixation;

[0022] When returning the component, the pressing head releases the carrier component, and the robotic arm transports the carrier component to the carrier mechanism.

[0023] When returning the item, check whether the position of the carrier is correct. If the position of the carrier is correct, the carrier is adsorbed and fixed to the carrier mechanism. Check whether the adsorption force between the carrier mechanism and the carrier is constant. If the adsorption force between the carrier mechanism and the carrier is constant, the carrier and the carrier mechanism are fixed stably.

[0024] The beneficial effects of this invention are:

[0025] The bonding equipment provided by this invention fixes the wafer to the upper pressure head with the bonding surface of the wafer facing downwards, and adopts a bottom-up bonding method during bonding, which reduces the risk of particles falling into the bonding surface of the wafer and avoids introducing voids at the bonding interface. By setting a carrier to be adsorbed on the carrier mechanism, compared with the existing fixing structure, it reduces the contamination of the surface in contact with the carrier and the grain, and improves the bonding quality.

[0026] The method for transferring the carrier provided by the present invention uses the bonding equipment described above and a robotic arm to complete the transfer of the carrier. When returning the carrier, the position of the carrier and the adsorption force between the carrier mechanism and the carrier are detected to determine whether the carrier and the carrier mechanism are fixed and stable, thereby improving the reliability of the carrier transfer. Attached Figure Description

[0027] Figure 1 This is a three-dimensional view of a bonding device from one perspective provided in an embodiment of the present invention;

[0028] Figure 2 This is a three-dimensional view of the bonding device from another perspective provided in the embodiments of the present invention;

[0029] Figure 3 This is a three-dimensional view of the bearing mechanism from one perspective provided in an embodiment of the present invention;

[0030] Figure 4 This is a front view of the bearing mechanism provided in an embodiment of the present invention;

[0031] Figure 5 This is a bottom view of the support mechanism (with a fixed support component) provided in an embodiment of the present invention;

[0032] Figure 6 This is a bottom view of the support mechanism (without a fixed support component) provided in an embodiment of the present invention;

[0033] Figure 7 This is a three-dimensional view of the bearing mechanism from another perspective provided in the embodiments of the present invention;

[0034] Figure 8 This is a schematic diagram of the structure after the carrier is fixed to the adsorption component according to an embodiment of the present invention.

[0035] In the picture:

[0036] 100. Bonding cavity; 200. Upper pressure head; 310. Bearing mechanism; 311. Base plate; 312. Mounting plate; 3121. Receiving groove; 3122. Mounting groove; 3123. Clearance hole; 3131. Guide rod; 314. Spring; 315. Adsorption air passage; 316. Anti-fool pin; 317. Connector; 318. Bushing; 400. Bearing component; 410. Anti-fool groove; 421. Support groove; 430. Boss; 500. Lower pressure head; 510. Positioning post; 520. First driving component; 530. Adsorption component; 600. Gripper unit; 610. Second driving component; 620. Anti-drop gripper; 700. Detection sensor; 800. Positioning pin; 900. Threaded component. Detailed Implementation

[0037] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0038] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0039] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0040] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0041] like Figures 1 to 8 As shown, this invention provides a bonding apparatus, including an upper pressure head 200, a carrier device, a lower pressure head 500, and a robotic arm. The upper pressure head 200 is used to fix a wafer with the bonding surface facing downwards. The carrier device includes multiple carrier mechanisms 310, spaced apart around the periphery of the upper pressure head 200. Each carrier mechanism 310 is used to adsorb and fix a carrier element 400, which is used to hold a die. The lower pressure head 500 is disposed opposite to the upper pressure head 200, and is used to selectively fix a carrier element 400 and drive the carrier element 400 to move up and down along the Z-direction. The robotic arm is used to transfer the carrier element 400 between the carrier mechanisms 310 and the lower pressure head 500. For example, the robotic arm picks up the carrier 400 from the carrier mechanism 310 and transfers the carrier 400 to the pressing head 500; or picks up the carrier 400 from the pressing head 500 and transfers the carrier 400 to the carrier mechanism 310.

[0042] By fixing the wafer to the upper pressure head 200 with the bonding surface facing downwards, a bottom-up bonding method is adopted during bonding, reducing the risk of particles falling into the bonding surface of the wafer and avoiding the introduction of voids at the bonding interface. By setting the carrier 400 to be adsorbed on the carrier mechanism 310, compared with the existing fixing structure, the contamination of the surface in contact between the carrier 400 and the grain is reduced, and the bonding quality is improved.

[0043] Optionally, the bonding apparatus further includes a bonding cavity 100, with the upper pressure head 200 and the support device both disposed on the top wall of the bonding cavity 100, and the lower pressure head 500 disposed on the bottom wall of the bonding cavity 100, opposite to the upper pressure head 200. In other embodiments, a frame may also be disposed within the bonding cavity 100, with the upper pressure head 200 and the support device both disposed on the top of the frame, and the lower pressure head 500 disposed on the bottom of the frame.

[0044] In some embodiments, the carriers 400 fixed to each carrier mechanism 310 have different specifications, and each carrier 400 is adapted to grains of different sizes. This allows the operator to select the corresponding carrier 400 for alignment processing according to the actual size of the grain to be bonded during bonding operations, thereby expanding the application range of the bonding equipment and improving its compatibility.

[0045] In some embodiments, the pressure head 200 fixes the wafer using an adaptive adsorption structure. This adaptive adsorption structure automatically compensates for wafer positional misalignment, buffering the impact force when the robotic arm places the wafer. Exemplarily, the adaptive adsorption structure may include components such as a vacuum path assembly and a floating adsorption element. For example, the vacuum path assembly includes multiple independent vacuum diversion channels, and the floating adsorption element includes multiple sets of floating adsorption units. Each vacuum diversion channel is connected to one floating adsorption unit, and each vacuum diversion channel is equipped with an independent pressure regulating component (such as a pressure regulating valve and a vacuum sensor). This allows for independent adjustment of the adsorption negative pressure in different zones, adaptively adsorbing the wafer according to its position. The specific structures and connection methods of the vacuum diversion channels, floating adsorption units, and pressure regulating components are existing technologies and will not be described in detail here.

[0046] Optionally, the pressing head 500 includes a first driving member 520 and an adsorption member 530. The adsorption member 530 is connected to the output end of the first driving member 520. The first driving member 520 drives the adsorption member 530 to move up and down in the Z direction. The carrier member 400 is adsorbed and fixed to the adsorption member 530. The carrier member 400 is detachably fixed to the adsorption member 530 by vacuum adsorption. The carrier member 400 and the adsorption member 530 form a flexible connection to buffer the impact of the first driving member 520 during lifting and lowering, thereby reducing the mechanical stress on the grains. For example, the first driving member 520 can be a motor, and the adsorption member 530 can be a vacuum suction cup.

[0047] In some embodiments, the top end of the adsorption member 530 has a plurality of positioning posts 510, which are spaced apart along the periphery of the support member 400. One positioning post 510 corresponds to and engages with the anti-foolproof groove 410 on the side of the support member 400. The arrangement of the plurality of positioning posts 510 along the periphery of the support member 400 can limit the radial offset of the support member 400 and improve the installation positioning accuracy of the support member 400. The corresponding engagement of one positioning post 510 with the anti-foolproof groove 410 on the side of the support member 400 ensures that the support member 400 and the adsorption member 530 form a unique assembly alignment structure, preventing the support member 400 from being installed backwards or misaligned.

[0048] Optionally, a boss 430 is provided on the front side of the carrier 400. The boss 430 is used to place the die. The area on the front side of the carrier 400 outside the boss 430 is adsorbed onto the carrier mechanism 310. The carrier mechanism 310 has a clearance space to avoid the boss 430. When the carrier 400 is not in use, its front side is adsorbed onto the carrier mechanism 310, and the boss 430 extends into the clearance space, reducing the contamination of the front side of the carrier 400 and the top surface of the boss 430 by external particles. When the carrier 400 is picked up, the carrier mechanism 310 releases the carrier 400, and the robot arm contacts the back side of the carrier 400, which also does not contaminate the front side of the carrier 400 and the top surface of the boss 430. In this embodiment, the front side of the carrier 400 refers to the surface facing the wafer during bonding; the back side of the carrier 400 refers to the surface away from the wafer during bonding.

[0049] In some embodiments, the bonding apparatus further includes a plurality of gripper units 600, which are correspondingly arranged with a plurality of carrier mechanisms 310. The carrier mechanisms 310 clamp the back side of the carrier member 400 through the gripper units 600. The arrangement of the gripper units 600 can improve the fixing stability of the carrier member 400; in addition, the gripper units 600 clamping the back side of the carrier member 400 will not contaminate the front side of the carrier member 400 and the top surface of the boss 430.

[0050] Optionally, the gripper unit 600 includes a second drive member 610 and a first gripper assembly. The first gripper assembly includes two symmetrically arranged anti-drop grippers 620. The second drive member 610 is used to drive the two anti-drop grippers 620 to move closer or further apart. Two support structures are provided on the back of the carrier member 400, and the two support structures correspond to the two anti-drop grippers 620 respectively, and the shape of the support structures matches the shape of the anti-drop grippers 620. This arrangement improves the gripping stability of the anti-drop grippers 620 and effectively prevents the carrier member 400 from slipping.

[0051] like Figure 5 and Figure 6 As shown, exemplarily, the anti-drop gripper 620 has a U-shaped structure, and the supporting structure includes two symmetrically arranged supporting grooves 421. The supporting grooves 421 penetrate the side of the bearing member 400, and the ends of the two side plates of the U-shaped structure away from the bottom connecting plate respectively correspond to and match the shapes of the two supporting grooves 421. This improves the gripping stability of the anti-drop gripper 620.

[0052] In some embodiments, the support mechanism 310 includes a base plate 311 and a mounting plate 312 connected to each other. The mounting plate 312 is arranged parallel to the base plate 311 and located below the base plate 311. The second drive member 610 is mounted on the base plate 311. The bottom of the mounting plate 312 is provided with a receiving groove 3121. The bottom of the receiving groove 3121 is provided with an adsorption air passage 315 for adsorbing the support member 400. The bottom of the receiving groove 3121 is provided with a clearance hole 3123 for avoiding the first gripper assembly. When the support member 400 is adsorbed in the receiving groove 3121, the boss 430 extends into the clearance hole 3123. This allows for a compact layout of the bonding device, reducing the space occupied, while avoiding interference between the anti-drop gripper 620 and the mounting plate 312.

[0053] Optionally, a guide structure and a buffer are provided between the base plate 311 and the mounting plate 312. The guide structure includes multiple guide rods 3131. The base plate 311 is detachably mounted on the top wall of the bonding cavity 100. The mounting plate 312 is arranged parallel to the base plate 311 and located below the base plate 311. The top ends of the guide rods 3131 are fixedly connected to the base plate 311, and the bottom ends of the guide rods 3131 slide through the mounting plate 312. A limiting piece is provided at the bottom end of the guide rods 3131. When the mounting plate 312 moves to its lowest point along the Z direction, the limiting piece and the bottom of the mounting plate 312 abut against each other. The buffer is provided between the base plate 311 and the mounting plate 312, and the carrier 400 is adsorbed onto the bottom of the mounting plate 312. Normally, when the robot picks up the carrier 400, it will apply an upward thrust along the Z direction to the carrier 400. If the mounting plate 312 and the base plate 311 are rigidly connected, the carrier 400 will be damaged by impact. By setting up a buffer, when the robot arm picks up the carrier 400, the carrier 400 is subjected to an upward thrust, and the carrier 400 and the mounting plate 312 move towards the base plate 311. The buffer plays a buffering role to avoid damage to the carrier 400. By setting up a guide structure, the stability of the mounting plate 312 when moving towards the base plate 311 is improved.

[0054] like Figure 4 As shown, exemplarily, the base plate 311 is mounted to the top wall of the bonding cavity 100 via threaded fittings 900, facilitating easy assembly and disassembly. The top surface of the base plate 311 is also provided with positioning pins 800. During assembly, the base plate 311 is first positioned in the positioning hole of the top wall of the bonding cavity 100 using the positioning pins 800, and then the base plate 311 and the top wall of the bonding cavity 100 are connected using the threaded fittings 900, making the assembly process accurate and efficient. In this embodiment, two threaded fittings 900 and three positioning pins 800 are provided, evenly distributed on the base plate 311 to improve assembly stability.

[0055] Optionally, the bottom end of the guide rod 3131 is slidably connected to the mounting plate 312 via a bushing 318. The bushing 318 can reduce the sliding friction resistance, so that the guide rod 3131 can move smoothly and without jamming in the Z direction, ensuring stable lifting and lowering movement.

[0056] Optionally, the buffer element is configured as a spring 314, with multiple springs 314 evenly distributed circumferentially along the base plate 311. One end of each spring 314 is connected to the base plate 311, and the other end is connected to the mounting plate 312. The springs 314 provide stable buffering performance and high rebound accuracy, resulting in high reliability. The even circumferential arrangement of multiple springs 314 uniformly absorbs the upward thrust from the mounting plate 312, ensuring stable and reliable buffering.

[0057] Optionally, the adsorption duct 315 controls the vacuum adsorption flow rate through a speed regulating valve, thereby controlling the adsorption force as needed and improving the versatility of the bonding equipment.

[0058] like Figure 5 and Figure 6 As shown, a connector 317 is provided on the side of the mounting plate 312. One end of the connector 317 is connected to the adsorption air channel 315, and the other end of the connector 317 is connected to an external negative pressure device. This does not increase the space occupied by the mounting plate 312 in the Z direction, and at the same time avoids interference between the connector 317 and the carrier 400 when the carrier 400 is picked up or put down.

[0059] Optionally, a misalignment pin 316 is provided at the bottom of the mounting plate 312, and a misalignment groove 410 is provided on the side of the carrier 400 to cooperate with the misalignment pin 316. The misalignment pin 316 and the misalignment groove 410 on the side of the carrier 400 cooperate accordingly, so that the carrier 400 and the mounting plate 312 form a unique limiting alignment structure to prevent the carrier 400 from being installed backwards or misplaced.

[0060] In some embodiments, the bonding equipment further includes a detection sensor 700. A mounting groove 3122 is provided at the bottom of the mounting plate 312, with a portion of the mounting groove 3122 extending to the bottom surface of the receiving groove 3121. The depth of the mounting groove 3122 is greater than the depth of the receiving groove 3121. The detection sensor 700 is mounted on the bottom surface of the mounting groove 3122, and its probe extends above the carrier 400. It is used to detect whether the carrier 400 is correctly positioned and whether the adsorption force between the carrier 400 and the bottom of the receiving groove 3121 is constant. By setting the detection sensor 700 to detect whether the carrier 400 is properly installed, abnormalities such as missing parts or improper assembly can be identified in a timely manner, reducing the abnormal downtime rate of the bonding equipment and ensuring continuous operation of the production line.

[0061] This embodiment also provides a method for handing over a carrier component, the method including:

[0062] When picking up the part, the carrying mechanism 310 releases the carrying component 400, and the robotic arm transports the carrying component 400 to the lower pressing head 500 for fixation;

[0063] When returning the component, the pressing head 500 releases the carrier component 400, and the carrier component 400 is transported to the carrier mechanism 310 by the robotic arm;

[0064] When returning the item, check whether the position of the carrier 400 is correct. If the position of the carrier 400 is correct, the carrier 400 is adsorbed and fixed to the carrier mechanism 310. Check whether the adsorption force between the carrier mechanism 310 and the carrier 400 is constant. If the adsorption force between the carrier mechanism 310 and the carrier 400 is constant, the carrier 400 and the carrier mechanism 310 are fixed and stable.

[0065] The carrier handover method provided in this embodiment uses the bonding equipment described above and a robot arm to complete the transfer of the carrier 400. When returning the carrier, the position of the carrier 400 and the adsorption force between the carrier mechanism 310 and the carrier 400 are detected to determine whether the carrier 400 and the carrier mechanism 310 are fixed and stable, thereby improving the reliability of the transfer of the carrier 400.

[0066] For example, a detection sensor 700 (such as a dual-sensor combination sensor) can be used to detect the position of the carrier 400 and the adsorption force between the carrier mechanism 310 and the carrier 400. During return, the boss 430 of the carrier 400 extends into the clearance hole 3123 of the mounting plate 312. The detection sensor 700 detects whether the position of the carrier 400 is correct. If the position of the carrier 400 is correct, the area on the front of the carrier 400 located outside the boss 430 adsorbs onto the bottom of the receiving groove 3121. The detection sensor 700 detects the adsorption force between the carrier 400 and the bottom of the receiving groove 3121. If the adsorption force between the carrier mechanism 310 and the carrier 400 is constant, the carrier 400 and the carrier mechanism 310 are stably fixed, completing the transfer of the carrier 400.

[0067] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A bonding apparatus, characterized in that, include: The upper pressure head (200) is used to fix the wafer and position the wafer with the bonding surface facing downwards; The support device includes a plurality of support mechanisms (310), which are spaced apart around the periphery of the upper pressure head (200). Each support mechanism (310) is used to adsorb and fix a support member (400), which is used to support the grains. A lower pressure head (500) is disposed opposite to the upper pressure head (200). The lower pressure head (500) is used to selectively fix one of the carrier members (400) and drive the carrier member (400) to move up and down in the Z direction. A robotic arm for transferring the carrier (400) between the carrier mechanism (310) and the pressing head (500).

2. The bonding apparatus according to claim 1, characterized in that, The upper pressure head (200) fixes the wafer through an adaptive adsorption structure.

3. The bonding apparatus according to claim 1, characterized in that, Each of the carrier mechanisms (310) has a different specification of the carrier (400) fixed to it, and each carrier (400) is adapted to a different size of grain.

4. The bonding apparatus according to claim 1, characterized in that, The pressing head (500) includes a first driving member (520) and an adsorption member (530). The adsorption member (530) is connected to the output end of the first driving member (520). The first driving member (520) is used to drive the adsorption member (530) to move up and down in the Z direction. The carrier member (400) is adsorbed and fixed to the adsorption member (530).

5. The bonding apparatus according to claim 4, characterized in that, The top of the adsorption member (530) has a plurality of positioning posts (510), which are spaced apart along the periphery of the support member (400), wherein one of the positioning posts (510) corresponds to and cooperates with the anti-foolproof groove (410) on the side of the support member (400).

6. The bonding apparatus according to claim 1, characterized in that, The front side of the support member (400) is provided with a boss (430), the boss (430) is used to place the grain, and the area on the front side of the support member (400) outside the boss (430) is adsorbed by the support mechanism (310), and the support mechanism (310) has a clearance space to avoid the boss (430).

7. The bonding apparatus according to claim 6, characterized in that, The bonding device further includes multiple gripper units (600), and the multiple gripper units (600) and multiple carrier mechanisms (310) are arranged in a one-to-one correspondence. The carrier mechanism (310) clamps the back side of the carrier (400) through the gripper units (600).

8. The bonding apparatus according to claim 7, characterized in that, The gripper unit (600) includes a second drive member (610) and a first gripper assembly. The first gripper assembly includes two symmetrically arranged anti-drop grippers (620). The second drive member (610) is used to drive the two anti-drop grippers (620) to move closer or further apart from each other. The back of the carrier member (400) is provided with two support structures. The two support structures and the two anti-drop grippers (620) correspond to each other, and the shape of the support structure matches the shape of the anti-drop gripper (620).

9. The bonding apparatus according to claim 8, characterized in that, The supporting mechanism (310) includes a base plate (311) and a mounting plate (312) connected to each other. The mounting plate (312) is arranged parallel to the base plate (311) and is located below the base plate (311). The second driving member (610) is mounted on the base plate (311). The bottom of the mounting plate (312) is provided with a receiving groove (3121). The bottom of the receiving groove (3121) is provided with an adsorption air passage (315) for adsorbing the supporting member (400). The bottom of the receiving groove (3121) is provided with a clearance hole (3123). The clearance hole (3123) is used to avoid the first gripper assembly. When the supporting member (400) is adsorbed in the receiving groove (3121), the boss (430) extends into the clearance hole (3123).

10. A method for handing over a load-bearing component, characterized in that, Using the bonding apparatus as described in any one of claims 1-9, the method for handing over the carrier includes: When picking up the item, the carrying mechanism (310) releases the carrying component (400), and the carrying component (400) is transported to the lower pressure head (500) for fixing by the robotic arm; When returning the component, the pressing head (500) releases the carrier (400), and the carrier (400) is transported to the carrier mechanism (310) by the robot arm; When returning the item, check whether the position of the carrier (400) is correct. If the position of the carrier (400) is correct, the carrier (400) is adsorbed and fixed to the carrier mechanism (310). Check whether the adsorption force between the carrier mechanism (310) and the carrier (400) is constant. If the adsorption force between the carrier mechanism (310) and the carrier (400) is constant, the carrier (400) and the carrier mechanism (310) are fixed stably.

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