Nail cosmetic, nail cosmetic film

Abstract

Provided is a nail cosmetic including infrared-absorbing particles and a film-forming agent.

Description

Technical Field

[0001] This invention relates to cosmetics for nails and cosmetic films for nails. Background Technology

[0002] Nail cosmetics are applied to the nails to form a cosmetic film. These cosmetics are used to protect the nails or to add color and other aesthetic benefits.

[0003] Nail cosmetics often consist of a mixture of resins such as nitrocellulose and acrylic acid to form a film, solvents, and pigments such as organic pigments. For example, Patent Document 1 discloses a nail cosmetic containing pearlescent agents such as titanium mica.

[0004] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2009-179573 Summary of the Invention The problem that the invention aims to solve Nail cosmetics have long been known for their role in protecting and beautifying nails. Achieving nail protection and aesthetics remains a crucial aspect of nail cosmetics. However, there is a growing demand for nail cosmetics with functions distinct from those of the past.

[0005] Therefore, in one aspect of the present invention, the object is to provide a nail cosmetic with new functions.

[0006] Methods for solving problems In one aspect of the present invention, a nail cosmetic is provided, which includes infrared absorbing particles and a film-forming agent.

[0007] The effects of the invention One aspect of the present invention provides a nail cosmetic with novel functions. Attached Figure Description

[0008] Figure 1 This is an illustration of nail cosmetics.

[0009] Figure 2 This is a diagram of a cosmetic film for nails. Detailed Implementation

[0010] The following description, with reference to the accompanying drawings, illustrates a specific example of a nail cosmetic film according to one embodiment of the present disclosure (hereinafter referred to as "this embodiment"). Furthermore, the present invention is not limited to these examples, but is defined by the claims, and is intended to include all modifications in the meaning and scope equivalent to the claims.

[0011] [Nail cosmetics] The inventors of this invention have researched nail cosmetics with novel functions. Furthermore, they discovered that by producing nail cosmetics containing infrared-absorbing particles, they can generate heat upon exposure to sunlight, thereby eliminating coldness at the fingertips even in winter without wearing gloves or other cold-weather gear, thus completing this invention.

[0012] The nail cosmetic product described in this embodiment includes infrared absorbing particles and a film-forming agent.

[0013] For example Figure 1 As shown, the nail cosmetic 10 of this embodiment can contain infrared absorbing particles 11 and a film-forming agent 12. The infrared absorbing particles 11 can be dispersed in the film-forming agent 12.

[0014] in addition, Figure 1 The illustrations are for illustrative purposes only; the nail cosmetic of this embodiment is not limited to the forms described herein. For example... Figure 1 In this text, the infrared absorbing particle 11 is represented by a circle and described as a spherical particle. The shape of the infrared absorbing particle 11 is not limited to the aforementioned form and can have any shape. In addition to the infrared absorbing particle 11 and the film-forming agent 12, the nail cosmetic 10 can contain other ingredients as needed.

[0015] This describes the ingredients contained in the nail cosmetic product of this embodiment.

[0016] (1) Infrared absorbing particles The nail cosmetic of this embodiment includes infrared absorbing particles. As infrared absorbing particles, any material capable of converting infrared radiation from sunlight into heat can be used. Examples of infrared absorbing particles selected from general formula W can be used as such. a O b The tungsten oxide shown has the general formula XB. m The boride compounds shown have the general formula M x W y O z One or more of the composite tungsten oxides shown.

[0017] (1-1) Regarding infrared absorbing particles (Tungsten oxide) Tungsten oxides are expressed in general formula W a O b express.

[0018] In the above general formula, the molar ratio of oxygen to tungsten, b / a, is preferably less than 3, and more preferably 2.2 ≤ b / a ≤ 2.999. A value of b / a of 2.2 or higher can prevent the formation of undesirable WO2 crystalline phases in tungsten oxide and improve the chemical stability of the material.

[0019] Furthermore, if b / a is less than 3, the necessary amount of free electrons are generated in the tungsten oxide, resulting in an efficient infrared absorbing material.

[0020] As a tungsten oxide, for example, W 18 O 49 W 20 O 58 W4O 11 In the above general formula, the oxygen to tungsten composition ratio b / a can be, for example, 2.45 or more and 2.999 or less, i.e., 2.45 ≤ b / a ≤ 2.999. When x is 2.45 or more, the appearance of unwanted WO2 crystalline phases can be completely avoided, and the chemical stability of the material can be improved. Furthermore, when x is 2.999 or less, a sufficient amount of free electrons are generated, thereby efficiently producing infrared absorbing materials.

[0021] Furthermore, when b / a is in the range of 2.45 ≤ b / a ≤ 2.95, tungsten oxide is contained in a compound known as the magnesium phase.

[0022] (Boron compound) Boride compounds are represented by the general formula XB m express.

[0023] In the above general formula, X is one or more metallic elements selected from Y (yttrium), La (lanthanum), Ce (cerium), Pr (praseodymium), Nd (neodymium), Sm (samarium), Eu (europium), Gd (gadolinium), Tb (terbium), Dy (dysprosium), Ho (holmium), Er (erbium), Tm (thulium), Yb (ytterbium), Lu (lutetium), Sr (strontium), and Ca (calcium). Furthermore, B represents boron, and m is a number indicating the amount of boron in the general formula.

[0024] General formula XB m In this context, the value of m, representing the molar ratio of B (boron) to element X, is not particularly limited, but is preferably 3 ≤ m ≤ 20, more preferably 4.0 ≤ m ≤ 6.2, and even more preferably 5.8 ≤ m ≤ 6.2.

[0025] General formula XB m The value of m in the figure is, for example, the ratio of the number of boron (B) to the number of elements X (1 atom) in the case where a powder containing boride compounds has been chemically analyzed using ICP emission spectroscopy (high-frequency inductively coupled plasma emission spectroscopy).

[0026] Lanthanum hexaboride, as a hexaboride of lanthanum, has particularly high absorption energy in the near-infrared range. Therefore, lanthanum hexaboride is preferably included in boride-based compounds.

[0027] (Composite tungsten oxide) Composite tungsten oxides in the form of general formula M x W y O z express.

[0028] In the above general formula, element M can be one or more elements selected from H (hydrogen), He (helium), alkali metals, alkaline earth metals, rare earth elements, Mg (magnesium), Zr (zirconium), Cr (chromium), Mn (manganese), Fe (iron), Ru (ruthenium), Co (cobalt), Rh (rhodium), Ir (iridium), Ni (nickel), Pd (palladium), Pt (platinum), Cu (copper), Ag (silver), Au (gold), Zn (zinc), Cd (cadmium), Al (aluminum), Ga (gallium), In (indium), Tl (thallium), Si (silicon), Ge (germanium), Sn (tin), Pb (lead), Sb (antimony), B (boron), F (fluorine), P (phosphorus), S (sulfur), Se (selenium), Br (bromine), Te (tellurium), Ti (titanium), Nb (niobium), V (vanadium), Mo (molybdenum), Ta (tantalum), Re (rhenium), Be (beryllium), Hf (hafnium), Os (osmium), Bi (bismuth), and I (iodine). In addition, W represents tungsten, O represents oxygen, and x, y, z preferably satisfy 0.001≤x / y≤1, 2.0≤z / y<4.0.

[0029] Examples of alkali metal elements include Li (lithium), Na (sodium), K (potassium), Rb (rubidium), Cs (cesium), and Fr (francium).

[0030] Examples of alkaline earth metal elements include Ca (calcium), Sr (strontium), Ba (barium), and Ra (radium).

[0031] Rare earth elements include Sc (scandium), Y (yttrium), La (lanthanum), Ce (cerium), Pr (praseodymium), Nd (neodymium), Pm (cerium), Sm (samarium), Eu (europium), Gd (gadolinium), Tb (terbium), Dy (dysprosium), Ho (holmium), Er (erbium), Tm (thulium), Yb (ytterbium), and Lu (lutetium).

[0032] The crystal structure of composite tungsten oxides is not particularly limited; for example, it can be one or more crystal structures selected from tetragonal, cubic, and hexagonal crystals. In particular, it exhibits excellent visible light transparency and infrared absorption characteristics, thus composite tungsten oxides can possess a hexagonal crystal structure.

[0033] Therefore, element M preferably includes elements that facilitate the adoption of a hexagonal crystal structure in the composite tungsten oxide, such as preferably one or more elements selected from Cs, Rb, K, Tl, In, Ba, Li, Ca, Sr, Fe, and Sn. However, element M is not limited to the aforementioned elements when the composite tungsten oxide adopts a hexagonal crystal structure.

[0034] When the infrared-absorbing particles contain composite tungsten oxide, and the composite tungsten oxide has a hexagonal crystal structure, especially when element M includes one or more selected from K, Rb, and Cs, the infrared absorption capacity in the region with wavelengths above 780 nm becomes particularly high. Therefore, by using a nail cosmetic containing infrared-absorbing particles of composite tungsten oxide with a hexagonal crystal structure and element M including one or more selected from K, Rb, and Cs, the nail cosmetic film obtained is heated particularly effectively from the fingertips through heat generated from infrared absorption.

[0035] The general formula M for composite tungsten oxides x W y O z In this case, x / y is preferably 0.001 ≤ x / y ≤ 1, more preferably 0.20 ≤ x / y ≤ 0.37, and even more preferably around 0.33. This is because the x / y value theoretically calculated from the hexagonal crystal structure is 0.33, and the amount added before and after this value yields particularly preferred optical properties.

[0036] As a typical example of a composite tungsten oxide, Cs can be cited. 0.33 WO3, Rb 0.33 WO3, K 0.33 WO3, Ba 0.33 WO3, etc., if x, y, z are within the above range, useful infrared absorption characteristics can be obtained.

[0037] Infrared absorbing particles can contain a variety of compounds, or they can consist of only one compound. For example, infrared absorbing particles can be composed solely of, for example, composite tungsten oxides.

[0038] Examples of compounds used for the aforementioned infrared absorbing particles include tungsten oxide, boride-based compounds, and composite tungsten oxides; however, the infrared absorbing particles can be substances other than these compounds. Preferably, the infrared absorbing particles contain composite tungsten oxides, which may be composed of composite tungsten oxides. However, in this case, the presence of unavoidable impurities in the infrared absorbing particles is not excluded.

[0039] The dispersion containing composite tungsten oxide infrared absorbing particles, dispersed in a resinous film-forming agent, etc., allows visible light to pass through while absorbing infrared radiation and remains transparent. Therefore, it does not impair the aesthetic appeal of pearlescent agents and gloss agents added to nail cosmetics, nor does it affect the color development of pigments and dyes. Thus, the infrared absorbing particles in the nail cosmetic of this embodiment contain composite tungsten oxide, thereby giving the nail cosmetic of this embodiment a novel heating function not previously known, and also improving its aesthetic appeal.

[0040] (1-2) Particle size of infrared absorbing particles Regarding the particle size of infrared absorbing particles, from the viewpoint of improving near-infrared absorption characteristics, it is preferably below 200 nm.

[0041] Infrared absorbing particles are preferably dispersed in a resinous film-forming agent or the like (described later) to efficiently absorb infrared radiation while maintaining visible light transparency. These infrared absorbing particles preferably transmit light in the visible light region (wavelengths of 380 nm to 780 nm) and significantly absorb near-infrared radiation, particularly light with wavelengths between 780 nm and 2200 nm. Therefore, the transmittance hue of the infrared absorbing particles sometimes changes from blue to green. Specifically, to suppress coloration of the infrared absorbing particles and maintain transparency while absorbing infrared radiation, it is sufficient to reduce the particle size (number-average particle size), preferably to 200 nm or less. If greater transparency is desired, the particle size of the infrared absorbing particles can be 100 nm or less.

[0042] On the other hand, with a particle size of 1 nm or more, industrial manufacturing is easy, so the particle size of infrared absorbing particles can be, for example, 1 nm or more but less than 200 nm, or 1 nm or more but less than 100 nm.

[0043] The number-average particle size of infrared absorbing particles preferably meets the above-mentioned range.

[0044] The particle size of infrared absorbing particles can be defined as the diameter of the smallest enclosing circle drawn on the infrared absorbing particles when observed using, for example, SEM or TEM.

[0045] Infrared absorbing particles absorb infrared radiation and convert it into heat. Therefore, in nail cosmetic films, which are formed by coating nails exposed to sunlight or similar light, the infrared absorbing particles contain heat that can effectively heat the fingertips.

[0046] (1-3) Methods for manufacturing infrared absorbing particles There are no particular limitations on the manufacturing method of infrared absorbing particles; the method can be selected based on the compounds contained in the infrared absorbing particles.

[0047] Here, we will use the case where the infrared absorbing particles are composite tungsten oxide particles as an example for explanation.

[0048] From general formula M x W y O z The described composite tungsten oxide particles can be manufactured by heat treatment of a mixture containing tungsten and element M. That is, the manufacturing method of the composite tungsten oxide particles can include, for example, the following raw material preparation step and heat treatment step.

[0049] In the raw material preparation process, it is possible to prepare a mixture containing tungsten and element M.

[0050] In the heat treatment process, the mixture obtained from the raw material preparation process can be heat-treated.

[0051] The following describes each process.

[0052] (Mixture preparation process) In the mixture preparation process, it is possible to prepare a mixture containing tungsten and element M (hereinafter referred to as "raw material mixture").

[0053] In order to obtain the previously stated general formula M x W y O z The starting material for the described composite tungsten oxide particles can be, for example, a mixture of a tungsten source containing tungsten and an element M source containing element M. Therefore, the mixture preparation process can be a process of mixing the tungsten source and the element M source.

[0054] Furthermore, as a tungsten source, tungsten monomers and compounds containing tungsten can be used. Additionally, as a source of element M, monomers of element M and compounds containing element M can be used.

[0055] In the mixture preparation process, for example, tungsten-containing powder from a tungsten source and element M-containing powder from an element M source can be mixed to prepare a raw material mixture powder as a mixture.

[0056] As a tungsten source, one or more of the following can be used: tungsten trioxide powder, tungsten dioxide powder, hydrated tungsten oxide, tungsten hexachloride powder, ammonium tungstate powder, hydrated tungsten oxide powder obtained by dissolving tungsten hexachloride in alcohol and then drying it, hydrated tungsten oxide powder obtained by dissolving tungsten hexachloride in alcohol, adding water to precipitate it, and then drying it, tungsten compound powder obtained by drying an aqueous solution of ammonium tungstate, and metallic tungsten powder.

[0057] Here, examples of using mixed powders as starting materials are given for illustration, without limiting the form involved. For example, a tungsten-containing solution or dispersion can be used as a tungsten source for obtaining composite tungsten oxides. When the tungsten source is a tungsten-containing solution or dispersion, the elements contained in the resulting mixture can be mixed uniformly particularly easily.

[0058] Examples of tungsten-containing solutions or dispersions that can be used as tungsten sources include alcoholic solutions of tungsten hexachloride, aqueous solutions of ammonium tungstate, and dispersions in which tungsten hexachloride is dissolved in alcohol and then water is added to form a precipitate.

[0059] Furthermore, when a tungsten-containing solution or dispersion is used as the tungsten source, a powder containing element M or a solution containing element M can be used as the element M source. Therefore, for example, it is possible to use a mixture of the above-mentioned tungsten-containing solution or dispersion with a powder containing element M or a solution containing element M, and then dry the mixture before supplying it to the raw material mixture of the heat treatment process.

[0060] Furthermore, as the starting material source of element M, a solution containing element M can be used, and as the tungsten source, tungsten-containing powder can be used. In this case, for example, a mixture of the aforementioned tungsten-containing powder and the solution containing element M, which is then dried, can be supplied as a raw material mixture to the heat treatment process.

[0061] The element M source is not particularly limited, and examples include one or more selected from the monomers of element M, tungstates of element M, chloride salts, nitrates, sulfates, oxalates, oxides, carbonates, hydroxides, etc. Furthermore, as described above, when the element M source is a solution, a solution-like element M source can be used by adding a solvent such as water.

[0062] In the industrial manufacturing of composite tungsten oxide particles, it is preferable to use raw materials that do not easily generate toxic gases or the like. Therefore, for example, if hydrated powder of tungsten oxide or tungsten trioxide powder is used as the tungsten source, and carbonates or hydroxides of element M are used as the element M source, then no harmful gases or the like are generated during heat treatment or other stages, which is therefore preferable.

[0063] The molar ratio x / y, representing the mass ratio (molar ratio) of element M and tungsten contained in the mixture of tungsten source and element M source, preferably has a value corresponding to the composition ratio of the target composite tungsten oxide. Specifically, as described in the description of the composition of the composite tungsten oxide, x / y is preferably 0.001 ≤ x / y ≤ 1.0, more preferably 0.20 ≤ x / y ≤ 0.37.

[0064] (Heat treatment process) In the heat treatment process, the raw material mixture prepared by the mixture preparation process can be heat treated.

[0065] The atmosphere during heat treatment in the heat treatment process is not particularly limited. For example, it can be carried out in any atmosphere, such as a reducing gas atmosphere, a mixed gas atmosphere of reducing gas and inactive gas, or an inactive gas atmosphere.

[0066] Here, the heat treatment conditions in the heat treatment process are not particularly limited, and can be selected according to the heat treatment atmosphere, etc.

[0067] Preferably, when the raw material mixture of the heat treatment process is heat-treated in a reducing gas atmosphere or a mixed gas atmosphere of reducing gas and inactive gas, the heat treatment temperature is higher than the crystallization temperature of the composite tungsten oxide contained in the composite tungsten oxide particles.

[0068] When the raw material mixture of the raw materials for the heat treatment process is heat treated in a reducing gas atmosphere or a mixed gas atmosphere of reducing gas and inactive gas, the heat treatment temperature is preferably 500°C to 1000°C, more preferably 500°C to 800°C.

[0069] Alternatively, after heat treatment in a reducing gas atmosphere or a mixed gas atmosphere of reducing gas and inert gas, further heat treatment can be performed in an inert gas atmosphere at a temperature of 500°C to 1200°C, as needed.

[0070] As described above, when using a reducing gas, there are no particular limitations on the reducing gas, but H2 (hydrogen) is preferred. Furthermore, when using a mixture of a reducing gas and an inert gas, there are no particular limitations on the types of the reducing gas and the inert gas. For example, H2 can be used as the reducing gas, and one or more types selected from Ar (argon), N2 (nitrogen), etc., can be used as the inert gas.

[0071] When using a mixture of reducing gas and inactive gas, the concentration of the reducing gas can be appropriately selected based on the firing temperature, the amount of the starting material mixture, and the type of reducing gas, without any particular limitation.

[0072] For example, in a mixture of reducing gas and inert gas, when H2 is used as the reducing gas, its concentration is preferably 0.1% by volume or more, and more preferably 2% by volume or more. This is because when the concentration of H2 gas in the mixture of reducing gas and inert gas is 0.1% by volume or more, reduction can be carried out efficiently, and the ratio of oxygen to tungsten in the resulting composite tungsten oxide can be easily adjusted to the desired range.

[0073] Furthermore, in the mixture of reducing gas and inactive gas, when H2 is used as the reducing gas, the H2 concentration is preferably, for example, 20 vol% or less, more preferably 10 vol% or less, and even more preferably 7 vol% or less. This is because a reducing gas concentration of 20 vol% or less can more reliably prevent the formation of WO2, which has no infrared absorption energy, due to rapid reduction.

[0074] When the raw material mixture of the heat treatment process is heat-treated in an inert gas atmosphere, the heat treatment temperature is preferably 650°C to 1000°C. The mixture heat-treated at 650°C to 1000°C has sufficient infrared absorption energy and is efficient as an infrared absorbing particle.

[0075] In addition, as an inactive gas, one or more inactive gases selected from Ar, N2, etc. can be used.

[0076] Preferably, the heat treatment temperature and heat treatment time are adjusted so that the z / y, which represents the molar ratio of tungsten to oxygen in the composite tungsten oxide contained in the obtained composite tungsten oxide particles, is 2.0 ≤ z / y < 4.0, as previously stated.

[0077] Examples of solid-state reaction methods for preparing composite tungsten oxide particles include heat treatment of a raw material mixture prepared by a mixture preparation process using a heat treatment process. The method for manufacturing composite tungsten-containing particles is not limited to the methods described herein. Composite tungsten oxide particles can be manufactured, for example, by thermal plasma methods. In the case of manufacturing composite tungsten oxide particles by thermal plasma methods, composite tungsten oxide particles with the desired composition can be obtained by adjusting the manufacturing conditions. Examples of adjustable manufacturing conditions include, for example, the feed rate of the raw material during raw material supply in the thermal plasma, the flow rate of the carrier gas used for raw material supply, the flow rate of the plasma gas maintaining the plasma region, and the flow rate of the sheath gas flowing through the outermost layer of the plasma region.

[0078] Furthermore, the manufacturing method of composite tungsten oxide particles is not limited to the above-mentioned mixture preparation process and heat treatment process, and can include any other process.

[0079] The method for manufacturing composite tungsten oxide particles can include, for example, a pulverization process after a heat treatment process, in which the resulting composite tungsten oxide particles are micronized using a pulverization process or the like to achieve a predetermined particle size. The pulverization method used in the pulverization process is not particularly limited; for example, a dry pulverization method such as a jet mill can be used.

[0080] Furthermore, the method for manufacturing composite tungsten oxide particles can include a coating process in which the surface of composite tungsten oxide particles obtained by heat treatment and pulverization is coated with an oxide containing one or more metals selected from Si, Ti, Zr, and Al.

[0081] Performing a coating process to coat the surface of the composite tungsten oxide particles, thereby improving weather resistance, is preferred. The coating method is not particularly limited; an example is adding an alkoxide of one or more metals selected from Si, Ti, Zr, and Al to a solution in which the composite tungsten oxide particles are dispersed.

[0082] (1-4) Regarding the content of infrared absorbing particles The content (compound amount) of infrared absorbing particles in the nail cosmetic of this embodiment is not particularly limited, and can be selected according to the type of infrared absorbing particles, the required heating characteristics, etc.

[0083] For example, in the nail cosmetic of this embodiment, the content of infrared absorbing particles can be 0.05% by mass or more and 10% by mass or 0.1% by mass or more and 5% by mass. When the content of infrared absorbing particles in the nail cosmetic is 0.05% by mass or more, the infrared absorption characteristics can be sufficiently improved. However, even when the content of infrared absorbing particles in the nail cosmetic exceeds 10% by mass, no significant change in the heating effect was observed. Therefore, the content of infrared absorbing particles in the nail cosmetic can be 10% by mass or less.

[0084] (2) Film-forming agent The film-forming agent is a material used to form a film after the nail cosmetic of this embodiment is applied to the nail, and it may contain infrared absorbing particles, etc. In the nail cosmetic of this embodiment, the infrared absorbing particles may be dispersed in the film-forming agent.

[0085] (2-1) Types of film-forming agents As a film-forming agent, one or more can be selected from resinous film-forming agents and photocurable film-forming agents. The following describes film-forming agents.

[0086] A resinous film-forming agent is a film-forming agent that can be dissolved or dispersed in solvents such as organic solvents. It refers to a film-forming agent that is dried to remove the solvent such as organic solvent and forms a film from a resin.

[0087] Photocurable film-forming agents are film-forming agents that are formed by photopolymerization of resins when exposed to light such as ultraviolet light to produce a film.

[0088] (Resin-like film-forming agent) Examples of resinous film-forming agents include one or more selected from nitrocellulose, alkyd resin, acrylic resin, sulfonamide resin, sucrose benzoate resin, toluenesulfonamide resin, etc.

[0089] Nitrocellulose is graded according to its viscosity, and can be selected from one or more of the following: nitrocellulose RS 1 / 2 sec, nitrocellulose LIG 1 / 2 sec, nitrocellulose HIG 1 / 2 sec, nitrocellulose SS 1 / 2 sec, nitrocellulose HIG 1 sec, nitrocellulose HIG 2 sec, nitrocellulose HIG 7 sec, nitrocellulose HIG 20 sec, nitrocellulose LIG 1 / 4 sec, nitrocellulose HIG 1 / 4 sec, nitrocellulose LIG 1 / 8 sec, nitrocellulose HIG 1 / 8 sec, nitrocellulose HIG 1 / 16 sec.

[0090] When a resinous film-forming agent is used as a film-forming agent, the cosmetic film for nails in this embodiment can contain a resinous film-forming agent as a resin and infrared absorbing particles.

[0091] (Photocurable film-forming agent) As a photocurable film-forming agent, one or more monomers or oligomers selected from those having olefinic unsaturated bonds can be cited. The monomers or oligomers having olefinic unsaturated bonds may possess unsaturated groups having olefinic unsaturated bonds.

[0092] A photocurable coating forming agent is a cured resin formed by photopolymerization of a coating forming agent when exposed to ultraviolet light in the presence of a photopolymerization initiator. Gel nails are examples of nail cosmetics containing photocurable coating forming agents.

[0093] When a light-curing film-forming agent is used as a film-forming agent, the nail cosmetic film manufactured using this nail cosmetic can contain a cured film-forming agent as a resin and infrared absorbing particles.

[0094] Examples of unsaturated groups having olefinic unsaturated bonds (olefinic unsaturated groups) include functional groups having one or more unsaturated bonds selected from the group consisting of (meth)acrylate, (meth)acrylamido, vinyl, vinyl ether, methvinyl ether, allyl, (meth)allyl ether, and maleimide. Examples of monomers possessing olefinic unsaturated groups include (meth)acrylic acid, alkyl (meth)acrylates containing straight-chain, branched, or cyclic alkyl groups having 1 to 22 carbon atoms, hydroxyalkyl (meth)acrylates containing straight-chain, branched, or cyclic hydroxyalkyl groups having 1 to 18 carbon atoms, ethyl (meth)acrylate carboxylic acid, ethyl (meth)acrylate succinic acid, ethyl (meth)acrylate phthalic acid, ethyl (meth)acrylate hexahydrophthalic acid, etc., including (meth)acrylic acid and hydroxyalkyl carboxylic acids, and alkyl (meth)acrylate carboxylic acids containing straight-chain, branched, or cyclic alkyl groups having 1 to 18 carbon atoms. Alkyl sulfonic acid (meth)acrylates, alkyl sulfonic acids with alkyl groups, alkyl phosphates (meth)acrylates with straight-chain, branched, or cyclic alkyl phosphate groups having 1 to 18 carbon atoms, alkoxyalkylene glycol (meth)acrylates with functional groups including alkyl groups having 1 to 18 carbon atoms and alkylene glycol groups having 1 to 4 carbon atoms, alkoxydialkylene glycol (meth)acrylates, alkoxytrialkylene glycol (meth)acrylates, alkoxypolyalkylene glycol (meth)acrylates, and phenoxyalkylene glycol (meth)acrylates with functional groups including phenoxy groups and alkylene glycol groups having 1 to 4 carbon atoms. Phenooxydialkylene glycol (meth)acrylates, phenoxytrialkylene glycol (meth)acrylates, phenoxypolyalkylene glycol (meth)acrylates, N-alkylamino (meth)acrylates containing amino alkyl groups of 1 to 6 carbon atoms, N-alkylaminoalkyl (meth)acrylates containing both amino alkyl groups of 1 to 6 carbon atoms and alkyl groups of 1 to 6 carbon atoms, N,N-dialkylaminoalkyl (meth)acrylates containing both amino alkyl groups of 1 to 6 carbon atoms and alkyl groups of 1 to 6 carbon atoms, benzyl (methyl)propane Acrylates, phenoxyethyl (meth)acrylates, dicyclopentyl (meth)acrylates, dicyclopentyloxyethyl (meth)acrylates, dicyclopentenyl (meth)acrylates, dicyclopentenyloxyethyl (meth)acrylates, borneol (meth)acrylates, isoborneol (meth)acrylates, tetrahydrofurfuryl (meth)acrylates, 2-methyl-2-adamantyl (meth)acrylates, and other cyclic (meth)acrylates; glycidyl (meth)acrylates, 4-hydroxybutyl (meth)acrylate glycidyl ethers, and other epoxy-containing (meth)acrylates, etc.

[0095] Furthermore, if monomers and oligomers with two or more olefinic unsaturated bonds within their molecules are used in combination, the viscosity of the formulated nail cosmetic can be easily adjusted. Moreover, for nail cosmetics, both spreadability and adhesion to the nail surface can be improved simultaneously. In addition, the nail cosmetic film, which is a light-cured coating such as gel nails obtained from nail cosmetics, exhibits excellent flexibility, is not prone to cracking, and has sufficient durability.

[0096] Monomers and oligomers containing two or more olefinic unsaturated bonds within their molecules can be selected from (di)ethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, (tri)propylene glycol di(meth)acrylate, di-tetraethylene glycol di(meth)acrylate, polyalkylene (carbon 1-4) glycol di(meth)acrylate, polybutanediol di(meth)acrylate, 1,3 (or 1,4)-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, and cyclohexanediethanol di(meth)acrylate. Esters, acrylates (dioxanediol diacrylate), alkoxylated (cyclo)hexanediol di(meth)acrylate, epoxy di(meth)acrylate, dicyclopentyl di(meth)acrylate, caprolactone-modified dicyclopentenyl di(meth)acrylate, tricyclodecanediethanol di(meth)acrylate, polyester di(meth)acrylate, ethylene oxide-modified bisphenol A di(meth)acrylate, propylene oxide-modified bisphenol A di(meth)acrylate, polyurethane di(meth)acrylate, allyl (meth)acrylate Ester, Methylene bis(meth)acrylamide, Ethylene bis(meth)acrylamide, Polyurethane di(meth)acrylamide, Allyl(meth)acrylamide, Pentaerythritol tri(meth)acrylate, Pentaerythritol tetra(meth)acrylate, Trimethylolethane tri(meth)acrylate, Trimethylolpropane tri(meth)acrylate, Dipentaerythritol tri(meth)acrylate, Di(trimethylolpropane)tetra(meth)acrylate, Dipentaerythritol tetra(meth)acrylate, Dipentaerythritol penta(meth)acrylate, Dipentaerythritol penta(meth)acrylate, Dipentaerythritol penta(meth)acrylate One or more of the following are included: tetraol hexa(meth)acrylate, tri(meth)acryloyloxyethoxytrimethylolpropane, glycerol polyglycidyl ether poly(meth)acrylate, ethylene oxide-modified tri(meth)acrylate of isocyanuric acid, ethylene oxide-modified dipentaerythritol penta(meth)acrylate, ethylene oxide-modified dipentaerythritol hexa(meth)acrylate, ethylene oxide-modified pentaerythritol tri(meth)acrylate, ethylene oxide-modified pentaerythritol tetra(meth)acrylate, and succinic acid-modified pentaerythritol tri(meth)acrylate. These multifunctional unsaturated compounds may be used alone or in combination with two or more.

[0097] In addition, the term "(meth)acrylate" refers to a term that includes both "acrylate" and "methacrylate".

[0098] The term "(meth)acrylic acid" refers to a term that includes both "acrylic acid" and "methacrylic acid".

[0099] The term "(meth)acryloyl" refers to a term that includes both "acryloyl" and "methacryloyl".

[0100] The statement “(II)” refers to a statement that includes both “two” and “single”, while the statement “(III)” refers to a statement that includes both “three” and “single”.

[0101] These monomers and oligomers with intramolecular olefinic unsaturated bonds possess fluidity as long as they do not undergo photopolymerization, thus imparting fluidity to nail cosmetics. Therefore, when using monomers and oligomers with intramolecular olefinic unsaturated bonds as photocurable film-forming agents, the film-forming agent does not need to contain additional components such as organic solvents to adjust fluidity.

[0102] When a photocurable film-forming agent is used as a film-forming agent, nail cosmetics may contain a photopolymerization initiator in addition to the film-forming agent and infrared absorbing particles.

[0103] Photopolymerization initiators can be appropriately selected from common initiators such as acetophenone, benzoin, benzophenone, α-aminoketone, xanthonesone, anthraquinone, acylphosphine oxide, and polymer photopolymerization initiators. 2,4,6-trimethylbenzoyl-diphenylphosphine oxide is an example of an acylphosphine oxide.

[0104] (2-2) Regarding the amount of film-forming agent The nail cosmetic of this embodiment may contain one film-forming agent or two or more.

[0105] The amount (content) of the resinous film-forming agent in the nail cosmetic of this embodiment is not particularly limited, and can be selected according to the type of film-forming agent, the required characteristics, etc.

[0106] In the case where the nail cosmetic of this embodiment contains a resinous film-forming agent, the nail cosmetic of this embodiment may contain, for example, 5% to 30% by mass or 7% to 25% by mass relative to the total amount of the nail cosmetic.

[0107] By incorporating a resinous film-forming agent at a rate of 5% or more by mass relative to the total amount of nail cosmetic, the drying speed of the nail cosmetic is accelerated, and the reduction of the gloss of the nail cosmetic film formed over time can be prevented. Furthermore, by incorporating a resinous film-forming agent at a rate of 30% or less by mass relative to the total amount of nail cosmetic, the viscosity of the nail cosmetic is prevented from increasing, allowing for the production of a nail cosmetic that is easy to apply.

[0108] When the nail cosmetic of this embodiment contains a light-curing film-forming agent, the nail cosmetic of this embodiment may contain, for example, 5% or more and 99.5% or less of the light-curing film-forming agent relative to the total amount of the nail cosmetic, more preferably 50% or more and 95% or less of the light-curing film-forming agent, and even more preferably 70% or more and 95% or less of the light-curing film-forming agent.

[0109] (3) Other ingredients The nail cosmetic of this embodiment may further contain infrared absorbing particles and any ingredients other than film-forming agents.

[0110] (Organic solvents) The nail cosmetic of this embodiment can contain, for example, an organic solvent. By containing an organic solvent, the viscosity and other properties of the nail cosmetic can be adjusted, thereby improving its workability and spreadability when applied to the nail.

[0111] There are no particular limitations on the organic solvent; for example, known solvents such as esters, alcohols, and hydrocarbons that have been used in nail cosmetics can be used. For instance, one or more non-aromatic organic solvents selected from methyl acetate, ethyl acetate, butyl acetate, amyl acetate, ethyl lactate, butyl lactate, ethyl alcohol, isopropyl alcohol, butyl alcohol, isobutyl acetate, propyl acetate, isopropyl acetate, and propyl alcohol are suitable. One organic solvent can be used alone, or two or more can be used in combination.

[0112] There are no particular limitations on the amount of organic solvent used, and the choice can be made based on the required viscosity and other ingredients contained in the nail cosmetic.

[0113] In the case where the nail cosmetic of this embodiment contains a resinous film-forming agent as a film-forming agent, the nail cosmetic of this embodiment may contain an organic solvent in a proportion of 25% to 85% by mass relative to the total amount of the nail cosmetic.

[0114] The nail cosmetic of this embodiment, in which a photocurable film-forming agent is included as a film-forming agent, and the fluidity of the nail cosmetic is improved to the extent that it can be easily applied by monomers or oligomers having olefinic unsaturated bonds, may not contain organic solvents. Furthermore, if the nail cosmetic of this embodiment contains a photocurable film-forming agent as a film-forming agent and contains an organic solvent, the aforementioned organic solvent can be used.

[0115] The nail cosmetic of this embodiment can be formulated without using organic solvents such as toluene and xylene, which are commonly used as diluents. That is, the nail cosmetic of this embodiment can be formulated without diluents such as toluene and xylene.

[0116] (Coloring components) In order to improve the appearance of the nail cosmetic film produced in this embodiment, the nail cosmetic may contain coloring ingredients as needed.

[0117] As a coloring ingredient that can be used in the nail cosmetic of this embodiment, one or more can be selected from pearlescent agents, gloss agents, pigments, dyes, pigments, etc., and known ingredients can be used as pearlescent agents, gloss agents, pigments, dyes, pigments.

[0118] Examples of pearlescent agents include titanium mica, iron oxide red coated mica, iron oxide red coated titanium mica, magenta coated titanium mica, dark blue coated titanium mica, titanium oxide coated synthetic phlogopite, iron oxide red-titanium oxide coated synthetic phlogopite, titanium oxide coated glass flakes, titanium oxide coated alumina flakes, titanium oxide coated silica flakes, iron oxide-silica coated aluminum, and iron oxide-silica coated iron oxide.

[0119] Examples of gloss agents include polyethylene terephthalate-polymethyl methacrylate laminated film powder, polyethylene terephthalate-polyolefin laminated film powder, epoxy resin coated aluminum vapor-deposited polyethylene terephthalate, aluminum vapor-deposited polyethylene terephthalate, urethane resin coated aluminum vapor-deposited polyethylene terephthalate, and acrylic resin coated aluminum powder.

[0120] In the case where the nail cosmetic of this embodiment contains coloring ingredients, there is no particular limitation on the amount of coloring ingredients. The nail cosmetic of this embodiment may contain more than 0.01% by mass and less than 20% by mass, more than 0.05% by mass and less than 20% by mass, or more than 0.5% by mass and less than 7% by mass relative to the total amount of nail cosmetic.

[0121] (Other ingredients) The nail cosmetic of this embodiment may further include other ingredients without impairing the effects of the present invention. These other ingredients may include resins other than those mentioned above, plasticizers such as acetyltritol tributyl citrate, fragrances, pharmaceuticals, moisturizers, UV absorbers, matting agents, fillers, surfactants, dispersants, and metallic soaps, which are commonly used in nail cosmetics.

[0122] (4) Manufacturing methods for nail cosmetics The method for manufacturing nail cosmetics according to this embodiment includes a mixing step that mixes infrared absorbing particles and a film-forming agent. During the mixing step, the infrared absorbing particles can be dispersed within the film-forming agent.

[0123] There are no particular limitations on the method of mixing infrared absorbing particles with the film-forming agent. For example, one or more mixing and dispersing devices selected from bead mills, sand mills, ball mills, paint shakers, ultrasonic homogenizers, etc., can be used. In particular, as a mixing and dispersing device, a media-stirred mill such as a bead mill, ball mill, sand mill, or paint shaker that uses beads, balls, or sand as a media is preferred. This is because, by using a media-stirred mill, the infrared absorbing particles can be dispersed to the desired particle size, especially in a short time, which is preferable from the viewpoints of productivity and suppression of impurity contamination.

[0124] The materials used in media mixing mills, such as beads, sand, and balls, are not particularly limited; examples include glass, alumina, zirconium oxide, titanium, and steel. Furthermore, the size of the media is not particularly limited; for example, media with a diameter of 0.1 mm to 2.0 mm can be used.

[0125] During the mixing process, other additives such as coloring agents can be added to mix the infrared absorbing particles, film-forming agents, and other additives. Alternatively, other additives can be added after mixing the infrared absorbing particles and film-forming agents.

[0126] Prior to the above mixing process, there is a dispersion preparation process that prepares an infrared absorbing particle dispersion in an organic solvent.

[0127] In this case, during the mixing process, the infrared absorbing particle dispersion and the film-forming agent can be mixed. Furthermore, during the mixing process, other additives such as coloring agents can be added, and the infrared absorbing particle dispersion, film-forming agent, and other additives can be mixed.

[0128] In addition, the infrared absorbing particles obtained from the dispersion preparation process can be dried to remove the organic solvent, and then the recovered infrared absorbing particles can be used in the mixing process.

[0129] In this case, during the dispersion preparation process, infrared absorbing particles, a dispersant, and an organic solvent with a boiling point below 120°C can be mixed. As a dispersant, for example, a dispersant having one or more functional groups selected from amine groups, hydroxyl groups, carboxyl groups, carboxylic acid esters, phosphate groups, phosphate esters, sulfonic acid groups, sulfonate esters, thiols, and epoxy groups can be used.

[0130] Furthermore, by drying the obtained infrared absorbing particle dispersion to remove the organic solvent, an infrared absorbing particle dispersion powder is obtained. In this case, the infrared absorbing particle dispersion powder has a dispersant disposed on the surface of the infrared absorbing particles, thereby improving the dispersibility of the infrared absorbing particles in the nail cosmetic obtained after the mixing process.

[0131] In the mixing process, as a method for mixing infrared absorbing particle dispersion powder with film forming agent, etc., in addition to the above-mentioned mixing-dispersion device, one or more of the following can be used: propeller mixer, planetary mixer, three-roll mill, kneader mill, etc.

[0132] (5) Regarding the uses of nail cosmetics, etc. The nail cosmetic of this embodiment can be used as nail polish, nail paint, nail strengthener, toenail polish, gel nail, etc.

[0133] The nail cosmetic of this embodiment can be used with one or more layers selected from the base coat, base layer, color layer and top coat of artificial nails.

[0134] There are no particular limitations on the method for applying the nail cosmetic of this embodiment; any known method may be used. Examples of methods for applying the nail cosmetic of this embodiment include application using a brush or pen, spraying, inkjet coating, rod coating, spin coating, curtain coating, dip coating, air knife coating, scraper coating, and roller coating.

[0135] [Cosmetic film for nails] The nail cosmetic film of this embodiment includes infrared absorbing particles and a coating containing at least a portion of the infrared absorbing particles. Of the infrared absorbing particles in the nail cosmetic film of this embodiment, all particles may be disposed within the coating, while some may be exposed from the coating.

[0136] For example, Figure 2As schematically shown, the nail cosmetic film 20 can include infrared absorbing particles 21 and a coating 22, with at least a portion of the infrared absorbing particles 21 disposed within the coating 22. The infrared absorbing particles 21 can be dispersed within the coating 22. Furthermore, Figure 2 The diagram is for illustrative purposes only; the nail cosmetic film 20 of this embodiment is not limited to the form described herein. For example... Figure 2 In this context, infrared absorbing particles 21 are represented by circles. They are described as spherical particles, and their shape is not limited to the aforementioned form; they can have any shape. In addition to the infrared absorbing particles 21 and the coating 22, the nail cosmetic film 20 can contain other components as needed.

[0137] The nail cosmetic film of this embodiment can be manufactured by applying the nail cosmetic of one aspect of this disclosure to the nail and then drying or curing it. Therefore, the coating of the nail cosmetic film of this embodiment is derived from a coating forming agent, which is formed by drying and curing. The nail cosmetic film of this embodiment can contain additives such as pigments included in the nail cosmetic of this embodiment.

[0138] The nail cosmetic film of this embodiment can contain infrared absorbing particles. These infrared absorbing particles can contain, for example, materials that absorb infrared rays from sunlight and can convert them into heat. The infrared absorbing particles can contain, for example, materials selected from general formula W. a O b The tungsten oxide shown has the general formula XB. m The boride compounds shown have the general formula M x W y O z One or more of the composite tungsten oxides shown.

[0139] In particular, the infrared absorbing particles preferably contain composite tungsten oxide, which can be composed of composite tungsten oxide. However, in this case, it is not ruled out that the infrared absorbing particles may contain unavoidable impurities. The composite tungsten oxide can be composed of general formula M x W y O z The details are explained in the nail cosmetics, so the explanation is omitted here. The infrared absorbing particles have already been explained, so the explanation is omitted here as well.

[0140] Depending on the intended use of the nail cosmetic film of this embodiment, the thickness of the nail cosmetic film of this embodiment may be, for example, 1 μm or more and 1.2 mm or less, or 10 μm or more and 1.0 mm or less.

[0141] When the nail cosmetic of this embodiment is used in nail polish, nail paint, nail strengthener, or toenail polish, the film thickness of the nail cosmetic film can be 10 μm to 500 μm, 10 μm to 400 μm, or 10 μm to 100 μm. If the nail cosmetic of this embodiment is used as a gel nail, the film thickness of the nail cosmetic film can be 10 μm to 1 mm or 100 μm to 1 mm.

[0142] The content of infrared absorbing particles per unit area of ​​the nail cosmetic film in this embodiment is not particularly limited; for example, it can be 0.05 g / m². 2 Above 1g / m 2 The following can be 0.05g / m 2 Above 0.5g / m 2 The following can be 0.1g / m 2 Above 0.3g / m 2 The following applies if the content of infrared absorbing particles per unit area is 0.05 g / m². 2 Therefore, the average transmittance at wavelengths of 800nm ​​to 1300nm is reduced by more than 5% compared to a film without infrared absorbing particles. Furthermore, if the content of infrared absorbing particles per unit area is 0.1 g / m²... 2 The average transmittance of wavelengths from 800nm ​​to 1300nm is reduced by more than 10% compared to films without infrared absorbing particles.

[0143] Furthermore, infrared rays that are absorbed by the nail cosmetic film but do not penetrate it are converted into heat. The more infrared rays absorbed, the more heat the nail cosmetic film generates. However, under natural light, the heat from the nail cosmetic film diffuses into the surrounding environment, thus not generating more than 10°C compared to the surroundings. Therefore, even if the content of infrared absorbing particles per unit area of ​​the nail cosmetic film exceeds 1 g / m², it is still a significant heat source. 2 The heating effect was not significantly different, therefore the content of infrared absorbing particles per unit area of ​​the nail cosmetic film could be 1g / m². 2 the following.

[0144] Example The following specific embodiments are provided for illustration, but the present invention is not limited to these embodiments.

[0145] (1) Regarding evaluation methods (1-1) Number-average particle size of infrared absorbing particles In each embodiment and comparative example, the number-average particle size of the infrared absorbing particles used was calculated by observing 100 composite tungsten oxide particles contained in the nail cosmetic film prepared by each embodiment and comparative example using a transmission electron microscope. For the observed composite tungsten oxide particles, the diameter of the smallest inclusion circle of the composite tungsten oxide particle was measured as the particle size. Furthermore, the number-average particle size of the measured 100 composite tungsten oxide particles was calculated.

[0146] (1-2) Storage period The storage period was evaluated by visually observing the appearance of the nail cosmetics manufactured in each example and comparative example after they were placed in glass bottles and stored in a constant temperature bath at 40°C for one month. The evaluation criteria were: no change (◎), very little sediment (○), and sediment (×). The storage period characteristics were: ◎ was the best, and the evaluation decreased in the order of ○ and ×.

[0147] (1-3) Coating properties The spreadability was evaluated by applying the nail cosmetics manufactured according to the various examples and comparative examples to artificial nails (nail tip material) using a nail brush, based on the ease of application. The evaluation results were: very smooth application (◎), smooth application (〇), and difficult application (×). ◎ represented the best spreadability, with 〇 and × indicating decreasing spreadability.

[0148] (1-4) Drying speed The drying speed was evaluated by measuring the time from when the nail cosmetic of each embodiment and comparative example was applied to the artificial nail until fingerprints no longer adhered upon touch. A drying speed of less than 3 minutes was rated ◎, 3 minutes to 6 minutes was rated 0, and 6 minutes or more was rated ×. A drying speed of ◎ was considered best, with 0 and × indicating decreasing performance. The evaluation results are shown in the "Drying Performance" column of Table 2.

[0149] (1-5) Temperature of the test piece before and after light irradiation When evaluating temperature rise using light irradiation, prepare a light irradiation test piece according to the following steps.

[0150] To achieve a film thickness of 50 μm after drying, as described in the embodiments and comparative examples of the nail cosmetic, a coating agent was used to coat a PET film. After coating on the PET film, the organic solvent was removed in a constant temperature oven at 100°C to obtain a dried film.

[0151] Test pieces were cut from the dried film to form squares of 70mm x 70mm, creating light irradiation test pieces for the nail cosmetic films described in the various embodiments and comparative examples. The test pieces were irradiated for 5 minutes with a photographic illumination lamp (Iwasaki Electric eye lamp PFR250 250W) simulating sunlight, placed 30cm away from the dried film side of the test pieces. The temperature of the back side (the side opposite to the dried film) of the light irradiation test piece was measured and designated as "temperature of the light irradiation test piece after light irradiation." The temperature of the back side of the light irradiation test piece was also measured before light irradiation and designated as "temperature of the light irradiation test piece before light irradiation." Furthermore, the temperature change, which is the difference between "temperature of the light irradiation test piece after light irradiation" and "temperature of the light irradiation test piece before light irradiation," was calculated. The difference of 9°C from the temperature change in Comparative Example 1 is displayed in the "Difference in temperature change from Comparative Example 1" column.

[0152] [Example 1] Make and evaluate nail cosmetics by following these steps.

[0153] As infrared absorbing particles, a hexagonal cesium-tungsten bronze (Cs) containing cesium (Cs) and tungsten (W) in a molar ratio of Cs / W = 0.33 was prepared. 0.33 WO z The composite tungsten oxide coarse powder has a concentration of 2.0 ≤ z < 4.0. Additionally, in Tables 1 and 3, the oxygen content of the composite tungsten oxide is set to 3 for convenience, with Cs... 0.33 It should be expressed like WO3.

[0154] The mixture shown in Table 1 was filled into a paint shaker containing 0.3 mm φ ZrO2 beads, and subjected to pulverization, dispersion, and mixing processes to obtain the nail cosmetic product involved in Example 1 (mixing process). The number average particle size of the composite tungsten oxide particles contained in the pulverized nail cosmetic product was 25 nm.

[0155] Table 2 shows the evaluation results.

[0156] [Examples 2-4, Comparative Example 1] Except for the composition shown in Table 1, the nail cosmetics involved in the examples and comparative examples were obtained under the same conditions as in Example 1, and evaluated using the same steps as in Example 1.

[0157] In Examples 3 and 4, hexagonal tungsten bronze (Rb) containing rubidium (Rb) and tungsten (W) in a molar ratio of Rb / W = 0.33 was used as the infrared absorbing particles. 0.33 WO z Composite tungsten oxides (2.0≤z<4.0).

[0158] Table 2 shows the evaluation results.

[0159] [Table 1] [Table 2] [Example 5] 20 parts by weight of the composite tungsten oxide coarse powder used in Example 1, 10 parts by weight of a dispersant having amine-containing functional groups and an acrylic acid backbone (amine value 48 mg KOH / g, decomposition temperature 250°C) (sometimes referred to as "dispersant a" in this invention), and 70 parts by weight of ethyl acetate (boiling point 77.1°C) as an organic solvent were weighed. These raw materials were loaded into a paint shaker containing 0.3 mm φ ZrO2 beads, and pulverized and dispersed for 10 hours to obtain the dispersion involved in Example 5.

[0160] For the dried film involved in Example 5, in which the dispersion was coated onto a PET film and dried, the number-average particle size of the composite tungsten oxide particles was calculated and shown in the "Number-average particle size of infrared absorbing particles" column of Table 3.

[0161] Furthermore, a portion of the dispersion from Example 5 was taken and diluted 10 times with ethyl acetate, confirming that it appeared to be colorless. This indicates that even with the addition of a colorless film-forming agent, the diluted dispersion remains colorless.

[0162] Next, to prepare the dispersion of Example 5, the mass ratio of the composite tungsten oxide particles (which are infrared absorbing particles in the dispersion) to the dispersant a is such that [composite tungsten oxide particles] / [dispersant] = 100 / 200. After adding the dispersant a, the mixture is thoroughly mixed to form a mixture.

[0163] The obtained mixture was loaded into a stirred vacuum dryer. Furthermore, the ethyl acetate was removed by vacuum drying at room temperature using the stirred vacuum dryer, resulting in the dispersed powder described in Example 5.

[0164] The infrared absorbing particles, film-forming agent, photopolymerization initiator, and coloring ingredients shown in Table 3 were mixed using a planetary mixer to obtain the nail cosmetic product of Example 5. Furthermore, the mixture was mixed while being kept in the dark, without being exposed to light.

[0165] The monomers containing olefinic unsaturated groups in Table 3 refer to 2-hydroxyethyl methacrylate, while monomers with two or more olefinic unsaturated bonds within their molecules refer to triethylene glycol dimethacrylate. 1-hydroxycyclohexylphenyl ketone is used as the photopolymerization initiator.

[0166] The nail cosmetic product described in Example 5 was coated onto a PET film to achieve a cured film thickness of 100 μm, and then irradiated with a 36W ultraviolet lamp for 2 minutes to produce the nail cosmetic film described in Example 5.

[0167] A 70mm × 70mm square was cut from the nail cosmetic film described in Example 5 to prepare the light irradiation test piece described in Example 5, and evaluated in the same manner as in Example 1. Table 3 shows the results.

[0168] [Table 3] [Summarize] It can be explained that the temperature rise caused by simulated sunlight irradiation of the light-irradiated test pieces in Examples 1 to 5, which contain infrared absorbing particles, is higher than that of the light-irradiated test piece in Comparative Example 1, which does not contain infrared absorbing particles.

[0169] As a result of these results, the nail cosmetic film obtained by applying nail cosmetic according to one method of this disclosure has a new function that was not previously known, such as generating heat when exposed to sunlight, and can eliminate the coldness of fingertips in winter.

[0170] This application claims priority based on Japan Patent Application No. 2024-028823 filed with the Japan Patent Office on February 28, 2024, and incorporates the entire contents of Japan Patent Application No. 2024-028823 into this international application.

[0171] Explanation of symbols 10 Nail cosmetics 11 Infrared Absorbing Particles 12 Film-forming agents 20. Nail cosmetic film 21 Infrared Absorbing Particles 22. Membrane

Claims

1. A nail cosmetic comprising: infrared absorbing particles and a film-forming agent.

2. The nail cosmetic according to claim 1, The infrared absorbing particles comprise the general formula M x W y O z The composite tungsten oxide shown, wherein, Element M is selected from one or more of H, He, alkali metals, alkaline earth metals, rare earth elements, Mg, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Al, Ga, In, Tl, Si, Ge, Sn, Pb, Sb, B, F, P, S, Se, Br, Te, Ti, Nb, V, Mo, Ta, Re, Be, Hf, Os, Bi, and I, satisfying 0.001≤x / y≤1 and 2.0≤z / y<4.

0.

3. The nail cosmetic according to claim 1 or 2, The infrared absorbing particles contain a content of more than 0.05% by mass and less than 10% by mass.

4. A cosmetic film for nails, comprising: Infrared absorbing particles, and The interior contains a coating containing at least a portion of the infrared absorbing particles.

5. The cosmetic film for nails according to claim 4, The infrared absorbing particles comprise the general formula M x W y O z The composite tungsten oxide shown has element M selected from one or more of the following: H, He, alkali metals, alkaline earth metals, rare earth elements, Mg, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Al, Ga, In, Tl, Si, Ge, Sn, Pb, Sb, B, F, P, S, Se, Br, Te, Ti, Nb, V, Mo, Ta, Re, Be, Hf, Os, Bi, and I, satisfying 0.001 ≤ x / y ≤ 1 and 2.0 ≤ z / y < 4.

0.

6. The nail cosmetic film according to claim 4 or 5, The content of the infrared absorbing particles is 0.05 g / m². 2 Above 1g / m 2 the following.

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