Alignment substrate for smart card chip programmer contact pins

Abstract

An alignment substrate includes a test chip connected with contact pads and alignment features and is positioned relative to a chip programming head. When the alignment substrate and chip programming head are actuated into close proximity with each other such that contact pins are in close proximity to or in contact with the contact pads, the alignment features enable a user to visually verify that the contact pins are in the same alignment plane as the alignment substrate, and thus in the same alignment plane as a card having programmable chips to be programmed.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 558,279, filed February 27, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This technical disclosure relates to programming an integrated circuit chip on a card (sometimes called a smart card or chip card), such as a financial card (e.g., a credit card and a debit card), an identity card, and other personalized cards. Background Technology

[0004] To program a contact-type integrated circuit chip (or simply programmable chip) on a card, the contact pins on the chip programmer's programming head must be correctly aligned and engaged with the electrical contacts on the programmable chip. If the contact pins are not correctly aligned with the electrical contacts, communication may not be established between the programmable chip and the chip programmer. If misalignment exists, the position of the contact pins can be adjusted, for example, by adjusting the chip programmer head, to align the contact pins with the electrical contacts. Summary of the Invention

[0005] This document describes a technique for simplifying the alignment of contact pins of a chip programming head to ensure proper alignment with electrical contact pads on a card's programmable chip. An alignment substrate, comprising a test chip electrically connected to the contact pads and alignment features, is positioned relative to the chip programming head. When the alignment substrate and the chip programming head are actuated to bring them close together, such that the contact pins approach or contact the contact pads on the test chip, the alignment features allow a user to visually verify that the contact pins are in the same alignment plane as the alignment substrate, and thus in the same alignment plane as the card with the programmable chip to be programmed. In an embodiment, the alignment substrate may be configured such that it does not have alignment features.

[0006] If the contact pins and the alignment substrate are not on the same alignment plane, the position of the contact pins can be adjusted while the alignment substrate is still in a certain position, allowing for visual verification of alignment using alignment features during the adjustment process. Once alignment is complete, the alignment substrate can be removed, and the card with the programmable chip to be programmed can be moved to a position where it engages with the contact pins of the chip programming head. The programmable chip can then be reset by the chip programming head to ensure communication and / or programming of the programmable chip.

[0007] The alignment substrate can have any configuration suitable for use in a card personalization system. In embodiments, the alignment substrate can be configured as a card-shaped substrate, in which case it can also be referred to as an alignment card. When a card-shaped substrate is used, the substrate is configured to be conveyed by the card conveying mechanism of the card personalization system. For example, the size of the card-shaped substrate can be similar to or the same as the cards typically handled by the card personalization system. For example, the card-shaped substrate can have the shape and size of an ID-1 card conforming to ISO / IEC 7810, or the shape and size of an ID-2 card conforming to ISO / IEC 7810.

[0008] In one embodiment of the alignment substrate, the alignment substrate may include a card-shaped substrate having a first surface, a second surface opposite to the first surface, and a periphery. A test chip is disposed on the card-shaped substrate and is connected to contact pads exposed on the first or second surface. Furthermore, alignment indicators intersecting the contact pads may be disposed on the first or second surface.

[0009] In another embodiment of the alignment substrate, the alignment substrate may include a substrate having a first surface, a second surface opposite to the first surface, a first side edge and a second side edge, and a first end edge and a second end edge. A programmable test chip is disposed on the substrate and is electrically connected to electrical contact pads exposed on the first surface or the second surface. Furthermore, alignment lines visible to the naked eye and intersecting with the electrical contact pads may be disposed on the first surface or the second surface.

[0010] In another embodiment, a method for aligning contact pins of a chip programming head to program a programmable chip on a card-shaped substrate may include: positioning an alignment substrate below the chip programming head; then bringing the chip programming head and the alignment substrate close together until the contact pins approach or contact electrical contact pads; then determining whether the contact pins are aligned with the electrical contact pads; if the contact pins are not aligned with the electrical contact pads, adjusting the position of the contact pins until they are aligned with the electrical contact pads; subsequently, removing the alignment substrate and moving the card-shaped substrate to a position below the chip programming head, and then communicating with the programmable chip on the card-shaped substrate using the contact pins of the chip programming head.

[0011] In another embodiment, the alignment card may include a card-shaped substrate having a first surface, a second surface opposite the first surface, and a periphery. Furthermore, a programmable test chip is mounted on the card-shaped substrate and is electrically connected to electrical contact pads exposed on the card-shaped substrate.

[0012] In embodiments, the alignment substrate may not have a card shape, but rather a shape similar to or the same as another personalized identification document having a programmable chip thereon. In this case, the alignment substrate may have the features of a card-shaped alignment substrate as described herein, including a test chip and an alignment indicator. For example, a passport may include a programmable chip, in which case the alignment substrate may have the shape and size of a passport, or the shape and size of a page of a passport on which the programmable chip is mounted. Attached Figure Description

[0013] Figure 1 The surface of the alignment substrate described herein in the form of a card-shaped substrate is shown.

[0014] Figure 2A The chip programming head is shown schematically.

[0015] Figure 2B yes Figure 2A A side view of the chip programming head.

[0016] Figure 3 An example of a card personalization system that can employ the alignment substrate described herein is illustrated schematically.

[0017] Figure 4 Another example of a card personalization system that can employ the alignment substrate described herein is illustrated schematically.

[0018] Figure 5A The first surface of a card with a programmable chip that can be programmed is shown.

[0019] Figure 5B It shows Figure 5A The second surface of the card.

[0020] Figure 6 This illustrates a method for aligning the contact pins of a chip programming head. Detailed Implementation

[0021] The following describes in detail a technique for simplifying the alignment of the contact pins of a chip programming head to ensure proper alignment with the electrical contact pads of the programmable chip on the card. As described in more detail below, an alignment substrate, comprising a test chip electrically connected to the contact pads and optional alignment features, is positioned relative to the chip programming head. The alignment substrate can be considered planar or substantially planar, and rigid or substantially rigid. When the alignment substrate and the chip programming head are actuated to bring them close together, such that the contact pins approach or contact the contact pads on the test chip, the alignment features allow the user to visually verify that the contact pins are in the same alignment plane as the alignment substrate, and thus in the same alignment plane as the card with the programmable chip to be programmed. If the contact pins are not in the same alignment plane as the alignment substrate, the position of the contact pins can be adjusted while the alignment substrate is still in position, allowing for visual verification of alignment using the alignment features during the adjustment of the contact pin position. Once alignment is complete, the alignment substrate can be removed, and the card with the programmable chip to be programmed can be moved to a position where it is engaged by the contact pins of the chip programming head. The programmable chip can then be reset by the chip programming head to ensure that communication and / or programming of the programmable chip is possible.

[0022] Figure 1 An example of an alignment substrate 10 is shown. In this example, the alignment substrate is shown as a card shape; in this case, the alignment substrate 10 can also be referred to as an alignment card. Card shape refers to having a first surface 12 and a second surface opposite to the first surface 12 (not shown, but substantially similar). Figure 5B The alignment substrate 10 has the following structures: a second surface of the card shown, a first side 14, a second side 16, a first end edge 18, a second end edge 20, and a rounded corner 22. The alignment substrate 10 can have any configuration suitable for use in a card personalization system and for transport by the card transport mechanism of the card personalization system. For example, the dimensions of the alignment substrate 10 can be similar to or the same as those of cards typically handled by the card personalization system. For example, the alignment substrate 10 can have the shape and dimensions of an ID-1 card conforming to ISO / IEC 7810, or the shape and dimensions of an ID-2 card conforming to ISO / IEC 7810. In one embodiment, the card dimensions can conform to ISO / IEC 7810, with dimensions of approximately 85.60 mm × 53.98 mm (approximately 3 3 / 8 inches × approximately 2 1 / 8 inches), and the radius of the rounded corner 22 is approximately 2.88 to 3.48 mm (approximately 1 / 8 inch).

[0023] The alignment substrate 10 can be made of any material capable of enabling the alignment substrate to perform the functions described herein. For example, the alignment substrate 10 can be formed wholly or primarily of a material such as plastic, or a combination of materials such as plastic and non-plastic materials, or wholly or primarily of a metal. The alignment substrate 10 can also be formed of materials used in the manufacture of printed circuit boards, such as composites of epoxy resin and braided glass fiber. In embodiments, the alignment substrate 10 can be planar or substantially planar, and rigid or substantially rigid.

[0024] Continue to refer to Figure 1 A test chip 24 is disposed on a substrate 10. The test chip 24 may be partially or fully embedded in the substrate 10. The test chip 24 is electrically connected to contact pads 26 on a substrate 28. In the illustrated example, a surface of the substrate 28 is exposed at a first surface 12, such that the contact pads 26 are exposed at the first surface 12. Alternatively, the surface of the substrate 28 having the contact pads 26 may be exposed at a second surface of the substrate 10. In an embodiment, the exposed surface of the substrate 28 may be flush with the first surface 12. The illustrated example shows eight contact pads 26, but more or fewer contact pads 26 may be provided. In an embodiment, the contact pads 26 may be non-functional and used only to provide a reference position for alignment with contact pins on an alignment head during the alignment process. In another embodiment, the test chip 24 may be programmable, in which case the contact pads 26 may be electrical contacts that allow data (e.g., commands) to be input to or output from the test chip 24. The test chip 24 on the substrate 10 may have a size corresponding to a conventional chip on a conventional card. Contact pad 26 may have a size corresponding to conventional contact pads on conventional cards, or contact pad 26 may have a smaller size relative to conventional contact pads to improve the sensitivity of the alignment substrate 10 to calibration. Once the contact pins make contact with contact pad 26, the coupler can reset the chip 24 to ensure communication is possible and to verify position via the contact connection.

[0025] The alignment substrate 10 may also include a plurality of alignment indicators 36 located on the first surface 12 (or on the second surface if the contact pads are exposed at the second surface), for example... Figure 1 As shown. The alignment indicator 36 is configured to allow the user to visually verify that the contact pins of the programming head are on the same alignment plane as the alignment substrate 10, and thus on the same alignment plane as the card with the programmable chip to be programmed. The alignment indicator 36 is located on the first surface 12 to achieve this visual verification.

[0026] For example, in Figure 1In the figure, the alignment indicator 36 is shown intersecting with the contact pad 26. The alignment indicator 36 is shown as including a vertical alignment indicator 36a and a horizontal alignment indicator 36b. Two vertical alignment indicators 36a are shown in the figure, but fewer or more vertical alignment indicators 36a may be provided depending on the number and arrangement of the contact pads 26. Four horizontal alignment indicators 36b are shown in the figure, but fewer or more horizontal alignment indicators 36b may be provided depending on the number and arrangement of the contact pads 26.

[0027] The vertical alignment indicator 36a may be parallel to the first end edge 18 and the second end edge 20. In an embodiment, the vertical alignment indicator 36a extends from both the first side edge 14 and the second side edge 16, and may also extend through the contact pads 26 arranged in two rows in the illustrated example. The horizontal alignment indicator 36b may be parallel to the first side edge 14 and the second side edge 16. In an embodiment, the horizontal alignment indicator 36b extends from the first end edge 18 and the second end edge 20, and may extend through the contact pads 26 arranged in four rows in the illustrated example. The alignment indicators 36a and 36b may take any form suitable for indicating alignment. For example, the alignment indicators 36a and 36b may include alignment lines visible to the naked eye (i.e., visible without special equipment such as a magnifying glass, microscope, or magnifying lens). The alignment indicators 36a and 36b may be solid lines, dashed lines, combinations thereof, or other indicators suitable for indicating alignment. In another embodiment, alignment indicators 36a, 36b may be formed so that they are visible only under special lighting conditions, such as infrared or ultraviolet radiation.

[0028] As described in more detail below, the alignment substrate 10 is configured to be conveyed by the card delivery mechanism of the card personalization system, thereby being moved to a position during the alignment process to align the contact pins of the chip programming head. The alignment substrate 10 can be manually inserted into and ultimately manually removed from the card personalization system. Alternatively, the alignment substrate 10 can be mechanically inserted into and ultimately mechanically removed from the card personalization system. For example, in the case where the alignment substrate 10 is card-shaped, the substrate 10 can initially be located in a feed hopper, then fed out of the feed hopper, and mechanically conveyed to a position relative to the chip programming head. In an embodiment, when the alignment substrate 10 is correctly positioned relative to the chip programming head during the alignment process, the alignment substrate 10 can be laid flat with the first surface 12 facing upwards, and the chip programming head positioned above the substrate 10. However, during the alignment process, the substrate 10 and the chip programming head can have any position relative to each other. For example, the alignment substrate can be arranged vertically in a vertical plane with the first surface 12 facing forward or backward.

[0029] Reference Figure 2A and Figure 2BA chip programming head 40 is schematically shown. The general structure and operation of a chip programming head are well known in the art. The chip programming head 40 includes a plurality of contact pins 42 mounted on a support 44, which, when properly aligned, are configured and positioned to contact electrical contact pads on a programmable chip of a card. In one embodiment, the support 44 and thus the contact pins 42 themselves can be actuated relative to an alignment substrate along the X, Y, and Z axes during the alignment process to properly align the contact pins 42 with contact pads on the alignment card. In another embodiment, the support 44 can be fixed stationary, and the contact pins 42 can be adjusted relative to the support 44 along the X, Y, and Z axes to achieve alignment. In another embodiment, the alignment substrate can be actuated relative to the chip programming head 40 along the X, Y, and Z axes during the alignment process to properly align the contact pads of the alignment substrate with the contact pins 42. In yet another embodiment, both the chip programming head 40 and the alignment substrate can be adjusted along the X, Y, and Z axes to achieve alignment.

[0030] Figure 3 An example of a card personalization system 50 that can implement the alignment substrate described herein is shown. System 50 is configured as a high-volume card personalization system (sometimes referred to as a central card issuing personalization system). High-volume card personalization systems are configured to process multiple cards simultaneously, with each card processed sequentially and the cards moving substantially along the card transport direction / path. High-volume card personalization systems typically process cards at high throughputs, such as hundreds or even thousands per hour, and employ multiple processing stations or modules to process multiple cards simultaneously to reduce the total processing time per card. Examples of such high-volume card personalization machines include the MX and MPR series of central card issuing personalization machines from Entrust Corporation, Shacopi, Minnesota. Other examples of central card issuing personalization machines are disclosed in U.S. Patents 4,825,054, 5,266,781, 6,783,067, 6,902,107, and 10,049,320, all of which are incorporated herein by reference in their entirety.

[0031] exist Figure 3In the system 50 shown, a card input section 52 is provided, which is configured to accommodate multiple cards awaiting processing. Cards are fed one by one from the card input section 52 into the rest of the system 50, where each card is processed individually. Processed cards are conveyed to a card output section 54, which is configured to accommodate multiple processed cards. The system 50 is also shown to include a chip programmer 56 (or chip programming module or chip programming station), which includes the aforementioned chip programming head. The chip programmer 56 may include a single chip programming head to program a single card at a time. Alternatively, the chip programmer 56 may include multiple chip programming heads to program multiple cards simultaneously. The system 50 is also shown to include an optional magnetic stripe encoder 58 (or magnetic stripe read / write system or magnetic stripe module), which is configured to read data from the magnetic stripe on the card and / or encode data on the magnetic stripe. The system 50 may also include a printing mechanism 60 (or printing station or printing module). Printing unit 60 can use any printing technology used in the card personalization system, including but not limited to: on-demand inkjet printing using ultraviolet (UV) radiation-cured inks; re-transfer printing; or thermal printing using a printing ribbon and a thermal printhead. If the printing unit uses UV-cured inks, a UV curing station can also be provided. The operation of systems 52-60 is controlled by one or more controllers. Alternatively, each of systems 52-60, or selected systems within systems 52-60, may have its own dedicated controller. Magnetic stripe encoding systems and chip programmers are disclosed, for example, in U.S. Patents 6,902,107 and 6,695,205 and are found in the MX™ and MPR™ series of central card issuing systems from Entrust Corporation, Sacopi, Minnesota. An example of a UV curing station is the UV curing station used in the MX™ series of card issuing systems from Entrust Corporation, Sacopi, Minnesota.

[0032] Figure 4 Another example of a card personalization system 70 that can implement the alignment substrate described herein is shown. Figure 4 In, with Figure 3The same or similar elements are indicated by the same reference numerals. System 70 is shown as a desktop card personalization system. Desktop card personalization systems are typically designed for relatively small-scale single-card personalization at relatively low throughput, such as tens or hundreds of cards per hour, and typically process one card at a time. These card personalization machines are often called desktop personalization machines because of their relatively small footprint and the fact that they can be placed on a desktop. Many examples of desktop card personalization machines are known, such as the SIGMA™ and ARTITA™ series of desktop card printers from Entrust Corporation, Shacopi, Minnesota. Other examples of desktop card personalization machines are disclosed in U.S. Patents 7,434,728 and 7,398,972, all of which are incorporated herein by reference in their entirety.

[0033] exist Figure 4 In this system 70, the card input section 52 and the card output section 54 are shown located at the same end. However, in other desktop card personalization systems, the card input section 52 and the card output section 54 may have other relative positions in the system 70. The system 70 may also include a card flipping section 72, which is configured to flip the card 180 degrees after it has been printed by the printing mechanism 60, and then guide the card back to the printing mechanism 60 for double-sided printing.

[0034] Cards can be transferred via card personalization systems 50 and 70 using any suitable mechanical card transfer mechanism known in the art. Examples of card transfer mechanisms that can be used are known in the art and include, but are not limited to, transfer rollers, conveyor belts (with or without tabs), vacuum transfer mechanisms, transfer racks, and combinations thereof. Card transfer mechanisms are well known in the art. Those skilled in the art will readily understand the types of card transfer mechanisms that can be used, as well as the structure and operation of such card transfer mechanisms.

[0035] Systems 50 and 70 may include Figure 3-4 Other card personalization systems, not shown, are well-known in the field of card processing. For example, systems 50 and 70 may include: a card embossing system configured to imprint characters on a card; a card debossing system configured to deboss characters on a card; a laminating system configured to apply a lamination to a card; a laser system that performs laser processing on the card, such as laser marking; a topcoat station configured to apply a topcoat to a portion or the entire surface of the card; a quality control station configured to inspect the quality of the personalization / processing applied to the card; a security station configured to apply security features, such as holographic foil patches, to the card; and other card processing operations. Additional card personalization systems may be located anywhere within systems 50 and 70.

[0036] Reference Figure 1 and Figure 3-4 During the alignment process, the alignment substrate 10 can be manually input into systems 50 and 70. For example, the substrate 10 can be manually input into the system via the card input unit 52 and then transferred to a position in the chip programmer 56, or the substrate 10 can be directly manually input into the chip programmer 56. Alternatively, the substrate 10 can be mechanically fed from the input unit 52 and then transferred to a position in the chip programmer 56. After the alignment process is completed using the alignment substrate, the substrate 10 can be removed, for example, by manually or mechanically transferring the substrate 10 to the output unit 54 and then removing it. Once the chip programming head is aligned, the card personalization system can be used to personalize the card.

[0037] Figure 5A and Figure 5B An example structure is shown that, once the chip programming head is aligned, card 80 can be processed using a card personalization system. In this example, card 80 includes a front or first surface 82 ( Figure 5A ) and the back, rear, or second surface 84 opposite to the front 82 ( Figure 5B Card 80 can be printed on only one side (referred to as single-sided printing), such as printing only on the front 82 or the back 84, or printed on both sides (referred to as double-sided printing), such as printing on the front 82 and the back 84 respectively.

[0038] The front panel 82 can have a variety of possible layouts. For example, the front panel 82 can include a horizontal card layout, a vertical card layout, and other known layout configurations and orientations. Figure 5A In the example shown, the front side 82 may include various printed cardholder data, such as a printed portrait image, cardholder name 86, and account information such as account number and expiration date. The front side 82 may also include other printed data, such as printed information about the entity issuing the card 80, such as the company name and / or logo of the issuing bank (e.g., STATE BANK), and / or printed information about the card brand name (e.g., VISA®, MASTERCARD®, DISCOVER®, etc.). The card 80 may also include a programmable contact integrated circuit chip 88 that can store various data associated with the card 80, such as account number and / or cardholder name. The chip 88 is electrically connected to a plurality of electrical contact pads 90 exposed on the surface 82, which are engaged by contact pins of a chip programmer's chip programming head to communicate with the chip 88, such as resetting and / or programming the chip 88.

[0039] Reference Figure 5BThe back side 84 can have a variety of possible layouts, which may or may not be similar to the front side 82. For example, the back side 84 may include a horizontal card layout, a vertical card layout, and other known layout configurations and orientations. Figure 5B In the example shown, the back 84 may include a magnetic stripe 92 storing various data associated with the card 80 (e.g., account number or cardholder's name), a signature pad 94 providing a signature location for the cardholder, a Card Verification Value (CVV) field 96, and a hologram. The magnetic stripe 92, signature pad 94, CVV field 96, and hologram are common elements found in many cards. The back 84 may also include printed personal data unique to or specifically assigned to the cardholder. For example, the account number assigned to the cardholder, the cardholder's name, and the card's expiration date may be printed on the back 84. Other personal cardholder data, such as the cardholder's facial image, may also be printed on the back 84. Non-personal data, such as the issuing bank's name and contact information for the issuing bank, may also be printed on the back 84.

[0040] Figure 6 A method 100 for aligning the contact pins of a chip programming head is shown. Unless otherwise stated by the applicant, the term "step" is intended to cover a single action or behavior, or multiple actions or behaviors constituting a step. (See also...) Figure 6 as well as Figure 1 , Figure 2A-2B , Figure 3 and Figure 4 In step 102, the alignment substrate 10 is input into the system. The alignment substrate 10 can be input manually into the system, or mechanically, for example, by being fed by the system's card input unit 52. The alignment substrate 10 can be input upstream (or downstream) of the chip programmer 56 and then transferred to the chip programmer 56 using the system's transfer mechanism. Alternatively, the alignment substrate 10 can be directly input into the chip programmer 56.

[0041] In step 104, once the chip programmer 56 is entered, the alignment substrate 10 is positioned below the chip programming head 40 at a programming position corresponding to the intended card position, i.e., the position where the card to be programmed is located with the contact pads facing upwards. This positioning assumes that the chip programming head 40 is vertically positioned above the programming position. Alternatively, if the card is positioned in the chip programmer 56 at the programming position with the contact pads facing downwards or to the side, the chip programming head can be located below or to the side of the programming position.

[0042] In step 106, the chip programming head 40 and the alignment substrate 10 are then brought close together. In one embodiment, the chip programming head 40 is actuated toward the alignment substrate 10, which is held stationary or fixed. In another embodiment, the alignment substrate 10 is actuated toward the chip programming head 40, which is held stationary or fixed. In yet another embodiment, both the alignment substrate 10 and the chip programming head 40 may move toward each other. The chip programming head 40 and the alignment substrate 10 are brought close together until the contact pins 42 approach, substantially approach, or actually physically contact the contact pads 26 of the alignment substrate 10. The contact pins 42 and the contact pads 26 should be close enough that a user can visually verify using the alignment feature 36 that the contact pins 42 are in the same alignment plane as the alignment substrate 10, and thus in the same alignment plane as the card with the programmable chip to be programmed.

[0043] In step 108, the user uses alignment feature 36 to visually verify that the contact pin 42 and the alignment substrate 10 are on the same alignment plane, thereby verifying that the contact pin is aligned with the contact pad 26. For example, the user can visually determine whether the contact pin 42 is in contact with the contact pad 26 of the alignment substrate 10, and / or the user can observe alignment indicators 36a, 36b to more easily see whether the contact pin 42 is centered on the alignment indicators 36a, 36b. If it is determined that the contact pin 42 is not aligned with the contact pad 26, the method proceeds to step 110, and the position of the contact pin is adjusted. The position of the contact pin can be adjusted in any suitable manner. Techniques for adjusting the position of the contact pins on the chip programming head are generally known in the art. For example, the orientation of the chip programming head 40 can be adjusted to adjust the position of the contact pins. In another embodiment, the position of the contact pins can be adjusted relative to the chip programming head, which is kept stationary. The position of the contact pins can be adjusted manually by the user or automatically using a predetermined program of the controller. After adjusting the contact pin position, method 100 can return to step 108 to re-determine whether the contact pin is aligned with the contact pad 26. Alternatively, if the chip programming head is retracted before adjusting the contact pin position, method 100 can return to step 106 to bring the chip programming head and alignment substrate closer together again, and then perform step 108 to determine whether the contact pin is aligned with the contact pad 26.

[0044] In step 108, if it is determined that the contact pins are aligned with the contact pads, method 100 proceeds to step 112. In step 112, the chip programming head is retracted, and the alignment substrate 10 is removed from under the chip programming head. For example, the alignment substrate 10 can be removed manually by the user, or mechanically by conveying the alignment substrate to a suitable position (e.g., card output section 54). Furthermore, in step 112, and referring to... Figure 3-4 , Figure 5A , Figure 5B and Figure 6 The card 80, containing the chip 88 to be programmed, is transferred to the chip programmer 56 and positioned in the programming position relative to the chip programming head. Then, the contact pins of the chip programming head are engaged with the contact pads 90 connected to the chip 88, and the chip 88 is programmed. After programming the initial card, one or more additional chips on one or more additional cards can be programmed sequentially.

[0045] The examples disclosed in this application should be considered illustrative rather than restrictive in all respects. The scope of the invention is defined by the appended claims, not by the foregoing description; therefore, all variations falling within the equivalent meaning and scope of the claims are intended to be included therein.

Claims

1. An alignment card, comprising: The card-shaped substrate has a first surface, a second surface opposite to the first surface, and a periphery; A test chip is attached to a contact pad exposed on the first surface on the card-shaped substrate. as well as An alignment indicator is disposed on the first surface, and the alignment indicator intersects with the contact pad.

2. The alignment card according to claim 1, wherein, The test chip is programmable, and the contact pads are electrical contacts electrically connected to the test chip.

3. The alignment card according to any one of claims 1 or 2, wherein, The periphery includes a first side edge and a second side edge, as well as a first end edge and a second end edge; The alignment indicator includes a vertical alignment indicator and a horizontal alignment indicator. The vertical alignment indicator is parallel to the first end edge and the second end edge, and the horizontal alignment indicator is parallel to the first side edge and the second side edge.

4. The alignment card according to claim 3, wherein, The vertical alignment indicator extends from the first side and from the second side.

5. The alignment card according to claim 3, wherein, The horizontal alignment indicator extends from the first end edge and from the second end edge.

6. The alignment card according to claim 3, wherein, The vertical alignment indicator includes a visible alignment line, and the horizontal alignment indicator includes a visible alignment line.

7. The alignment card according to any one of claims 1 to 6, wherein, The card-shaped substrate measures 85.60 mm × 53.98 mm and has rounded corners.

8. A method comprising aligning contact pins of a chip programming head using an alignment card according to any one of claims 1 to 7.

9. An alignment card, comprising: The card-shaped substrate has a first surface, a second surface opposite to the first surface, and a periphery; And a programmable test chip, which is electrically connected to electrical contact pads exposed on the card-shaped substrate.

10. The alignment card according to claim 9, further comprising an alignment indicator portion on the card-shaped substrate adjacent to the electrical contact pad.

11. An alignment substrate, comprising: The substrate has a first surface, a second surface opposite to the first surface, a first side and a second side, and a first end and a second end; A programmable test chip is provided on the substrate and is electrically connected to an electrical contact pad exposed on the first surface. as well as Alignment lines, visible to the naked eye on the first surface, intersect with the electrical contact pads.

12. The alignment substrate according to claim 11, wherein, The alignment lines include a vertical alignment line and a horizontal alignment line. The vertical alignment line is parallel to the first end edge and the second end edge, and the horizontal alignment line is parallel to the first side edge and the second side edge.

13. The alignment substrate according to claim 12, wherein, The vertical alignment line extends from the first side and from the second side.

14. The alignment substrate according to claim 12, wherein, The horizontal alignment line extends from the first end edge and from the second end edge.

15. The alignment substrate according to any one of claims 11 to 14, wherein, The substrate measures 85.60 mm × 53.98 mm and has rounded corners.

16. A method comprising aligning contact pins of a chip programming head using an alignment substrate according to any one of claims 11 to 15.

17. A method for aligning contact pins of a chip programming head to program a programmable chip on a card, comprising: Position the alignment substrate below the chip programming head; The alignment substrate has a first surface, a second surface opposite to the first surface, a first side and a second side, a first end and a second end, a programmable test chip, and alignment lines. The programmable test chip is electrically connected to an electrical contact pad exposed on the first surface. The alignment lines are on the first surface and are visible to the naked eye and intersect with the electrical contact pads. Bring the chip programming head and the alignment substrate close to each other until the contact pins approach or contact the electrical contact pads; Determine whether the contact pin is aligned with the electrical contact pad; If the contact pin is not aligned with the electrical contact pad, adjust the position of the contact pin until the contact pin is aligned with the electrical contact pad; as well as Remove the alignment substrate and move the card to a position below the chip programming head, then use the contact pins of the chip programming head to communicate with the programmable chip on the card.

18. The method according to claim 17, wherein, Communicating with the programmable chip on the card using the contact pins of the chip programming head includes resetting the programmable chip or programming the programmable chip.

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