Antenna and electronic device including the same

Abstract

The electronic device may include: a printed circuit board; an antenna chip disposed on the printed circuit board; a first conductive pattern disposed on the printed circuit board spaced apart from the antenna chip; a second conductive pattern disposed spaced apart from the first conductive pattern; at least one first lumped element disposed in an electrical path connecting the antenna chip and the first conductive pattern; and at least one second lumped element connected to the first and second conductive patterns, wherein the electronic device may include: a wireless communication circuit configured to transmit or receive radio signals in at least one frequency band via the first and second conductive patterns.

Description

Technical Field

[0001] The various embodiments disclosed herein relate to an antenna and an electronic device including the antenna. Background Technology

[0002] Recently, with the widespread adoption of high-speed, high-capacity wireless communication, communication between electronic devices via networks has increased. For example, wireless communication between electronic devices (such as TVs or home appliances) and electronic devices (such as mobile communication terminals) can be performed through communication networks, Bluetooth communication, or Wi-Fi communication. Since wireless signals are transmitted and received in frequency bands determined according to the communication scheme, various antennas corresponding to each communication scheme can be installed in the electronic device.

[0003] For purposes of facilitating understanding of this disclosure, the above information may be provided as related technology. No assertion or determination is made as to whether anything in the foregoing can be considered prior art to this disclosure. Summary of the Invention

[0004] Technical issues As consumers demand, electronic devices are becoming thinner and smaller. Consequently, antenna components housed within these devices may need to be miniaturized.

[0005] In some embodiments, due to space constraints within the electronic device, the antenna module disposed within the device may not have sufficient size. For example, the size of the printed circuit board constituting the antenna module may be limited by the size of the internal space of the electronic device. In such cases, the conductive pattern (e.g., the antenna radiating pattern) disposed on the printed circuit board and configured to transmit or receive communication signals may not have sufficient length as an antenna radiating pattern. Therefore, it may be difficult to ensure antenna performance.

[0006] Furthermore, in the antenna module, the shape of the conductive pattern and the capacitance and inductance of the lumped elements (e.g., capacitors and inductors) can be determined according to the usage conditions in a specific electronic device. However, because such an antenna module has a structure optimized for a specific electronic device, its antenna performance may be degraded when used in another electronic device.

[0007] The technical objectives achieved in this disclosure are not limited to those described above. Other technical objectives not mentioned herein can be clearly understood by those skilled in the art from the following description.

[0008] Technical solution According to embodiments of this disclosure, an electronic device may include a printed circuit board. In one embodiment, the electronic device may include an antenna chip disposed on the printed circuit board. In another embodiment, the electronic device may include a first conductive pattern disposed on the printed circuit board and spaced apart from the antenna chip. In yet another embodiment, the electronic device may include a second conductive pattern spaced apart from the first conductive pattern. In still another embodiment, the electronic device may include at least one first lumped element disposed in an electrical path connecting the antenna chip and the first conductive pattern. In yet another embodiment, the electronic device may include at least one second lumped element connected to both the first and second conductive patterns. In yet another embodiment, the electronic device may include a wireless communication circuit configured to transmit or receive wireless signals in at least one frequency band via the first and second conductive patterns.

[0009] According to embodiments of this disclosure, an antenna module may include a printed circuit board. In one embodiment, the antenna module may include an antenna chip disposed on the printed circuit board. In another embodiment, the antenna module may include a first conductive pattern disposed on the printed circuit board and spaced apart from the antenna chip. In yet another embodiment, the antenna module may include a second conductive pattern spaced apart from the first conductive pattern. In a further embodiment, the antenna module may include at least one first lumped element disposed in an electrical path connecting the antenna chip and the first conductive pattern. In still another embodiment, the antenna module may include at least one second lumped element electrically connected to both the first and second conductive patterns. Finally, the antenna module may include a wireless communication circuit configured to transmit or receive wireless signals in at least one frequency band via the first and second conductive patterns.

[0010] Beneficial effects According to embodiments of this disclosure, the antenna module can be used in various electronic devices by changing the arrangement of lumped elements and the capacitance and inductance of the lumped elements on a printed circuit board comprising multiple conductive patterns. For example, depending on the electronic device, the antenna module can adjust the resonant frequency of the antenna by adjusting the connections between the multiple conductive patterns, the capacitance value of the lumped elements, and the inductance value of the lumped elements. Therefore, the antenna module can achieve stable antenna performance in various electronic devices.

[0011] Furthermore, when multiple conductive patterns are connected, the antenna module can transmit and / or receive communication signals in multiple frequency bands.

[0012] The beneficial effects that can be obtained from this disclosure are not limited to those described above, and other effects not mentioned herein will be clearly understood by those skilled in the art to which this disclosure pertains from the following description. Attached Figure Description

[0013] In the description of the accompanying drawings, the same or similar reference numerals may be used to refer to the same or similar elements.

[0014] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to various embodiments.

[0015] Figure 2 This is a block diagram of an electronic device configured to support conventional network communication and 5G network communication according to various embodiments.

[0016] Figure 3a This is a view illustrating the connection relationship between lumped elements and a first conductive pattern and a second conductive pattern disposed on a printed circuit board according to an embodiment of the present disclosure.

[0017] Figure 3b It shows through Figure 3a A view of an embodiment of antenna radiation of the first conductive pattern in the image.

[0018] Figure 3c It is shown Figure 3a A view of an embodiment in which the third conductive pattern is electrically connected to the first conductive pattern and the second conductive pattern.

[0019] Figure 3d It is shown Figure 3b A view of an embodiment in which the third conductive pattern is electrically connected to the first conductive pattern.

[0020] Figure 4 This is a configuration diagram of a switching circuit connected to a lumped element according to an embodiment of the present disclosure.

[0021] Figure 5a It is shown Figure 3c The image shows a view of the current flow in the first frequency band of the antenna module.

[0022] Figure 5b It is shown Figure 3c The image shows a view of the current flow in the second frequency band of the antenna module.

[0023] Figure 6 This is a graph showing the antenna radiation performance according to an embodiment of the present disclosure. Detailed Implementation

[0024] In the following description, various embodiments of the present disclosure will be described with reference to the accompanying drawings. It will be understood that the various embodiments of the present disclosure and the terminology used to describe the embodiments are not intended to limit the technical features disclosed herein to the specific embodiments, and the embodiments include various modifications, equivalents, or alternatives to the corresponding embodiments.

[0025] In the description of the accompanying drawings, similar reference numerals may be used for similar or related components. Unless the context clearly indicates otherwise, the singular form of the noun corresponding to an item may include one or more items.

[0026] As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B or C” may include any or all possible combinations of the items listed together with the corresponding phrase in the phrase. Terms such as “first” and “second” may be used to simply distinguish one element from another without limiting the element in any other respect (e.g., importance or order). It will be understood that, whether or not the terms “operably” or “communically” are used, if an element (e.g., a first element) is referred to as being “combined” with, “combined to”, “connected to”, or “attached to” another element (e.g., a second element), it means that the first element may be directly (e.g., wiredly) combined with the other element, wirelessly combined with the other element, or combined with the other element via a third element.

[0027] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. (Refer to...) Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0028] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0029] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0030] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0031] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0032] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0033] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0034] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0035] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0036] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0037] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0038] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0040] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0041] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0042] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0043] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0044] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0045] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to embodiments, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to embodiments, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to embodiments, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197. According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to an embodiment, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on a second surface (e.g., the top surface or the side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of a specified high-frequency band.

[0046] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0047] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0048] Figure 2 An electronic device 101 in a network environment 200 including multiple cellular networks is shown according to one embodiment of the present disclosure.

[0049] Reference Figure 2The electronic device 101 includes a first communication processor 212, a second communication processor 214, a first RFIC 222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, a first radio frequency front-end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, an antenna 248, a processor 120, and a memory 130. The second network 199 includes a first cellular network 292 and a second cellular network 294. The electronic device 101 may also include references... Figure 1 At least one of the described components, the second network 199 may also include at least one other network. The first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and the second RFFE 234 may form at least a portion of the wireless communication module 192. The fourth RFIC 228 may be omitted or included as part of the third RFIC 226.

[0050] The first communication processor 212 can establish a communication channel in a frequency band used for wireless communication with the first cellular network 292, and support traditional network communication through the established communication channel. The first cellular network can be a traditional network including second-generation (2G), 3G, 4G, or Long Term Evolution (LTE) networks. The second communication processor 214 can establish a communication channel corresponding to a specified frequency band (e.g., about 6 GHz to about 60 GHz) in the frequency band used for wireless communication with the second cellular network 294, and support 5G network communication through the established communication channel. The second cellular network 294 can be a 5G network defined in the 3G Partnership Program (3GPP). The first communication processor 212 or the second communication processor 214 can establish a communication channel corresponding to another specified frequency band (e.g., about 6 GHz or less) in the frequency band used for wireless communication with the second cellular network 294, and support 5G network communication through the established communication channel. The first communication processor 212 and the second communication processor 214 can be implemented as a single chip or a single package. The first communication processor 212 or the second communication processor 214 can be formed as a single chip or a single package with the processor 120, the auxiliary processor 123 or the communication module 190.

[0051] When transmitting, the first RFIC 222 can convert the baseband signal generated by the first communication processor 212 into a radio frequency (RF) signal of approximately 700 MHz to approximately 3 GHz used in the first cellular network 292 (e.g., a conventional network). When receiving, the RF signal can be obtained from the first cellular network 292 through the first antenna module 242 and preprocessed by the first RFFE 232. The first RFIC 222 can convert the preprocessed RF signal back into a baseband signal for processing by the first communication processor 212.

[0052] When transmitting, the second RFIC 224 can convert the baseband signal generated by the first communication processor 212 or the second communication processor 214 into a Sub6 band (e.g., 6 GHz or less) RF signal (hereinafter referred to as a 5G Sub6 RF signal) to be used in the second cellular network 294 (e.g., a 5G network). When receiving, the 5G Sub6 RF signal can be obtained from the second cellular network 294 (e.g., a 5G network) via the second antenna module 244, and preprocessed by the second RFFE 234. The second RFIC 224 can convert the preprocessed 5G Sub6 RF signal back into a baseband signal, which can then be processed by the corresponding communication processor in the first communication processor 212 or the second communication processor 214.

[0053] The third RFIC 226 can convert the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as a 5G Above6 RF signal) in the 5G Above6 band (e.g., about 6 GHz to about 60 GHz) to be used in the second cellular network 294 (e.g., a 5G network). Upon reception, the 5G Above6 RF signal can be obtained from the second cellular network 294 via antenna 248 and preprocessed by the third RFFE 236. The third RFIC 226 can convert the preprocessed 5G Above6 RF signal back into a baseband signal for processing by the second communication processor 214. The third RFFE 236 can be formed as part of the third RFIC 226.

[0054] Electronic device 101 may include a fourth RFIC 228, separate from or at least part of the third RFIC 226. In this case, the fourth RFIC 228 may convert a baseband signal generated by the second communication processor 214 into an intermediate frequency (IF) RF signal (e.g., about 9 GHz to about 11 GHz) and transmit the IF signal to the third RFIC 226. The third RFIC 226 may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from the second cellular network 294 via antenna 248 and converted into an IF signal by the third RFIC 226. The fourth RFIC 228 may convert the IF signal back into a baseband signal for processing by the second communication processor 214.

[0055] The first RFIC 222 and the second RFIC 224 can be implemented as at least part of a single package or a single chip. The first RFFE 232 and the second RFFE 234 can be implemented as at least part of a single package or a single chip. At least one of the first antenna module 242 and the second antenna module 244 can be omitted, or can be combined with another antenna module to process RF signals of corresponding multiple frequency bands.

[0056] The third RFIC 226 and antenna 248 can be disposed on the same substrate to form a third antenna module 246. For example, the wireless communication module 192 or processor 120 can be disposed on the first substrate (e.g., a main printed circuit board (PCB)). The third RFIC 226 is disposed in a local area (e.g., the lower surface) of the first substrate and a separate second substrate (e.g., a sub-PCB), and the antenna 248 is disposed in another local area (e.g., the upper surface) of the first substrate and the separate second substrate, thereby forming the third antenna module 246. By disposing the third RFIC 226 and antenna 248 on the same substrate, the length of the transmission line between them can be reduced. This can reduce signal loss (e.g., attenuation) in the high-frequency bands (e.g., from about 6 GHz to about 60 GHz) used in 5G network communications caused by the transmission line. Therefore, the electronic device 101 can improve the quality or speed of communication with the second cellular network 294.

[0057] Antenna 248 can be configured as an antenna array comprising multiple antenna elements suitable for beamforming. In this case, the third RFIC 226 may include multiple phase shifters 238 corresponding to the multiple antenna elements as part of the third RFFE 236. During transmission, each of the multiple phase shifters 238 can shift the phase of a 5G Above6 RF signal that will be transmitted through the corresponding antenna element to an external location (e.g., a base station of a 5G network) of the electronic device 101. During reception, each of the multiple phase shifters 238 can convert the phase of a 5G Above6 RF signal received from the external location through the corresponding antenna element to the same or substantially the same phase. This enables transmission or reception to be performed via beamforming between the electronic device 101 and the external location.

[0058] The second cellular network 294 can operate independently of the first cellular network 292 (e.g., a legacy network) (e.g., standalone (SA)) or can operate in conjunction with the first cellular network 292 (e.g., non-standalone (NSA)). For example, a 5G network may only have an access network (e.g., a 5G radio access network (RAN) or a next-generation (NG) RAN) and not a next-generation core network (NGC). After accessing the access network of the 5G network, the electronic device 101 can access an external network (e.g., the Internet) under the control of the core network of the legacy network (e.g., an evolved packet-switched core network (EPC)). LTE protocol information for communicating with the legacy network or new radio (NR) protocol information for communicating with the 5G network can be stored in memory 130 for access by processor 120, the first communication processor 212, or the second communication processor 214.

[0059] Figure 3a This is a view illustrating the connection relationship between lumped elements and a first conductive pattern and a second conductive pattern disposed on a printed circuit board according to an embodiment of the present disclosure.

[0060] According to an embodiment, the electronic device 101 may include an antenna module 300. In this embodiment, the antenna module 300 can wirelessly transmit communication signals to and / or receive communication signals from external electronic devices (e.g., home appliances, portable electronic devices, Bluetooth headsets, and / or smartwatches) via wireless communication. The aforementioned types of external electronic devices are examples, and the antenna module 300 can wirelessly communicate with various types of external electronic devices.

[0061] In an embodiment, the antenna module 300 may be connected to a wireless communication circuit (e.g., Figure 1 Communication module 190 or Figure 3aThe antenna module 300 is a wireless communication circuit F and can be configured to operate in a predetermined frequency band. In embodiments, the predetermined frequency band may include at least one of the following frequency bands: a low frequency band of about 600 MHz to 960 MHz, a mid frequency band of about 1700 MHz to 2200 MHz, a high frequency band of about 2300 MHz to 2800 MHz, a sub-6 frequency band of about 5 GHz to 6 GHz, an ultra-high frequency band (UHB) of about 3.2 GHz to 4.5 GHz, Bluetooth (BT), Global Positioning System (GPS), or Wi-Fi of about 2.4 GHz to 2.5 GHz and about 5 GHz to 6 GHz. In the following description, the antenna module 300 will be described based on communication in at least one of the first frequency band (e.g., about 2.4 GHz to 2.5 GHz) and the second frequency band (e.g., about 5 GHz to 6 GHz). However, the frequency band may be changed to at least one of the above-described frequency bands.

[0062] According to an embodiment, the antenna module 300 may include a printed circuit board 301, an antenna chip 310, and a plurality of conductive patterns (e.g., Figure 3c The first conductive pattern 320, the second conductive pattern 330 and / or the third conductive pattern 340), and a plurality of lumped elements 360 (e.g., Figure 3c The first lumped element 361, the second lumped element 362, the third lumped element 363, the fourth lumped element 364 and / or the fifth lumped element 365) and the wireless communication circuit F. At least one of the above components may be omitted, or another component may be added.

[0063] In one embodiment, the antenna chip 310 may be disposed on a printed circuit board 301. In another embodiment, the antenna chip 310 may be disposed within an electronic device 101 with limited space (such as a smartphone, tablet, wearable device, or home appliance) and may transmit communication signals to and / or receive communication signals from an external electronic device. In another embodiment, the antenna chip 310 may be an antenna for short-range wireless communication. For example, the antenna chip 310 may transmit and / or receive communication signals in at least one frequency band of Wi-Fi, Bluetooth, BLE, or Zigbee. In another embodiment, the wireless communication circuit F may transmit and / or receive wireless signals in at least one frequency band by being connected to the antenna chip 310 via multiple conductive patterns (e.g., a first conductive pattern 320, a second conductive pattern 330, and / or a third conductive pattern 340).

[0064] In embodiments, antenna module 300 may include various types of lumped elements for adjusting the resonant frequency. In embodiments, the lumped elements may be passive elements (such as inductors or capacitors and / or lumped constant elements). In embodiments, antenna module 300 may adjust the capacitance (C) of a capacitor and the inductance (L) (inductive capability) of an inductor to perform antenna functions within a predetermined frequency band. For example, in antenna module 300, the capacitor and / or inductor may be replaced with a capacitor having a predetermined capacitance and / or an inductor having a predetermined inductance to adjust the resonant frequency.

[0065] In one embodiment, a plurality of conductive patterns 320, 330, and 340 may be formed on a printed circuit board 301. In another embodiment, the plurality of conductive patterns 320, 330, and 340 may be a plating formed of conductive material on the printed circuit board 301. In another embodiment, the length and shape of the plurality of conductive patterns 320, 330, and 340 may be determined based on the resonant frequency supported by the antenna module 300. For example, the length and shape of the plurality of conductive patterns 320, 330, and 340 may be determined to support Wi-Fi frequency bands (e.g., a first band (e.g., about 2.4 GHz to 2.5 GHz) and a second band (e.g., about 5 GHz to 6 GHz)). In another embodiment, the resonant frequency of the antenna module 300 may be adjusted depending on whether the plurality of conductive patterns 320, 330, and 340 are electrically connected to each other via lumped elements.

[0066] In an embodiment, the antenna module 300 can transmit and / or receive communication signals in multiple frequency bands (e.g., a first frequency band and a second frequency band) via multiple conductive patterns 320, 330, and 340. In another embodiment, the antenna module 300 can transmit communication signals to and / or receive communication signals from external electronic devices in a first frequency band including frequencies of approximately 2.4 GHz to 2.5 GHz and a second frequency band including frequencies of approximately 5 GHz to 6 GHz.

[0067] According to embodiments of this disclosure, the antenna module 300 can adjust or tune its resonant frequency band by changing the shape (form, size, length, and area) of the conductive patterns 320, 330, and 340, whether the conductive patterns 320, 330, and 340 are connected to each other via lumped elements 360, the number of lumped elements 360 connected to the conductive patterns 320, 330, and 340, and the capacitance and / or inductance of the lumped elements 360. In embodiments, a plurality of conductive patterns 320, 330, and 340 having predetermined shapes can be formed on a printed circuit board 301. Therefore, by tuning the resonant frequency based on whether the conductive patterns 320, 330, and 340 are connected and based on changes in the capacitance and inductance of the lumped elements 360 according to the usage environment, the antenna module 300 can be used in various electronic devices 101. In this case, since the printed circuit board 301 including the conductive patterns 320, 330, and 340 can be mass-produced and used in various electronic devices 101, the production cost of the antenna module 300 can be reduced.

[0068] The following Figures 3a to 3d The antenna module 300 shown can be used in various electronic devices. For example, in Figures 3a to 3d In the antenna module 300 shown, the resonant frequency can be adjusted by adjusting the antenna radiation length based on whether the conductive patterns 320, 330, and 340 are connected to each other via lumped elements 360, according to the usage conditions in the electronic device 101 on which the antenna module 300 is provided. Furthermore, in the antenna module 300, the resonant frequency band can be adjusted by changing the number of lumped elements 360 connected to the conductive patterns 320, 330, and 340, as well as the capacitance and / or inductance of the lumped elements 360. The adjusted resonant frequency band may include at least a first frequency band (e.g., about 2.4 GHz to 2.5 GHz) and a second frequency band (e.g., about 5 GHz to 6 GHz). Additionally, the antenna module 300 can transmit and / or receive communication signals at the resonant frequency set in various electronic devices 101 by changing whether the conductive patterns 320, 330, and 340 are connected and the capacitance and / or inductance of the lumped elements 360.

[0069] According to the embodiments, such as Figure 3a As shown, the antenna module 300 may include a first conductive pattern 320, a second conductive pattern 330, an antenna chip 310, a matching element 350, a first lumped element 361, a second lumped element 362, a third lumped element 363, and / or a fourth lumped element 364. In embodiments, the antenna module 300 can transmit and / or receive communication signals in at least one frequency band via the antenna chip 310, the first conductive pattern 320, and the second conductive pattern 330. For example, Figure 3aThe antenna module 300 can transmit and / or receive communication signals in a first frequency band (e.g., about 2.4 GHz to 2.5 GHz) and a second frequency band (e.g., about 5 GHz to 6 GHz) determined based on a first conductive pattern 320, a second conductive pattern 330, an antenna chip 310, a matching element 350, a first lumped element 361, a second lumped element 362, a third lumped element 363 and a fourth lumped element 364.

[0070] In the embodiments, reference is made to Figure 3a The first conductive pattern 320 may include a (1-1) portion 321, extending from the (1-1) portion 321 along a direction (e.g., Figure 3a The (1-2) portion 322 extending from the (1-1) portion 321 in a direction parallel to the (1-2) portion 322 (e.g., in the -Y direction), and from the (1-1) portion 321 in a direction parallel to the (1-2) portion 322 (e.g., Figure 3a The (1-3)th part 323 extends from the -Y direction.

[0071] In the embodiments, reference is made to Figure 3a The first conductive pattern 320 and the second conductive pattern 330 can be formed on the printed circuit board 301 at a predetermined interval between them. In an embodiment, the second conductive pattern 330 may be located relative to the (1-2) portion 322 of the first conductive pattern 320. Figure 3a -Y direction.

[0072] In the embodiments, reference is made to Figure 3a A matching element 350 may be disposed in the first electrical path 302 connecting the feed portion of the printed circuit board 301 and the antenna chip 310. In an embodiment, the matching element 350 may include an inductor and / or a capacitor. In an embodiment, the matching element 350 may enable impedance matching between the antenna chip 310 and the feed portion. In an embodiment, the matching element 350 may enable impedance matching between the antenna chip 310 and the feed portion to 50 ohms.

[0073] In the embodiments, reference is made to Figure 3a At least one lumped element may be disposed on the printed circuit board 301. In an embodiment, at least one first lumped element 361 may be disposed in the second electrical path 303 connecting the antenna chip 310 and the first conductive pattern 320, and may be electrically connected to the first conductive pattern 320. In an embodiment, the first lumped element 361 may be electrically connected to the (1-1) portion 321 of the first conductive pattern 320 and the ground of the printed circuit board 301. In an embodiment, as... Figure 3aAs shown, the first lumped element 361 may include, but is not limited to, lumped element 3611 (1-1), lumped element 3612 (1-2), and lumped element 3613 (1-3). In an embodiment, it may be determined whether lumped element 3611 (1-1), lumped element 3612 (1-2), and lumped element 3613 (1-3) are connected, such that the resonant frequency of the antenna module 300 can be adjusted according to the usage conditions in various electronic devices and the arrangement environment of the antenna module 300. In an embodiment, at least one of lumped element 3611 (1-1), lumped element 3612 (1-2), and lumped element 3613 (1-3) may be omitted from the antenna module 300, or another element may be additionally provided in the second electrical path 303, such that the electrical path and / or antenna radiation length of the antenna module 300 can be modified, and the resonant frequency can be tuned.

[0074] In the embodiments, reference is made to Figure 3a At least one second lumped element 362 may be disposed on the printed circuit board 301 and electrically connected to the first conductive pattern 320 and the second conductive pattern 330. In an embodiment, the second lumped element 362 may be electrically connected to the second conductive pattern 330 at a (1-2) portion 322 of the first conductive pattern 320. In an embodiment, the second lumped element 362 may be connected to the ground of the printed circuit board 301.

[0075] In the embodiments, reference is made to Figure 3a At least one third lumped element 363 may be disposed in the third electrical path 304 connecting the wireless communication circuit F and the second conductive pattern 330. In an embodiment, the third lumped element 363 may be electrically connected to the ground of the second conductive pattern 330 and the printed circuit board 301.

[0076] In one embodiment, the fourth lumped element 364 may be electrically connected to the (1-3) portion 323. In another embodiment, the fourth lumped element 364 may be electrically connected to the ground of the second conductive pattern 330 and the printed circuit board 301.

[0077] According to an embodiment, Figure 3a The antenna module 300 may include a third conductive pattern 340. In an embodiment, in Figure 3a In the antenna module 300, the third conductive pattern 340 may be omitted. In an embodiment, the third conductive pattern 340 may be formed on a printed circuit board 301 spaced apart from the first conductive pattern 320. For example, the third conductive pattern 340 may be formed relative to the (1-1) portion 321 of the first conductive pattern 320. Figure 3a The second conductive pattern 330 is spaced apart in the -X direction. In this case, the third conductive pattern 340 may be disposed in the opposite direction to the second conductive pattern 330 relative to the antenna chip 310. In the embodiment, the following will describe... Figure 3a and Figure 3b The third conductive pattern 340 shown may be in a state where it is not physically connected and / or electrically connected to the first conductive pattern 320 and the second conductive pattern 330. Refer to the description below. Figure 3c and Figure 3d The third conductive pattern 340 can be physically connected and / or electrically connected to the first conductive pattern 320 via the fifth lumped element 365. Therefore, in the antenna module 300, the resonant frequency band can be adjusted when the antenna radiation length is increased via the third conductive pattern 340.

[0078] According to embodiments of this disclosure, the antenna module 300 can be adapted to various electronic devices by changing its resonant frequency according to the usage environment in various electronic devices. In embodiments, the antenna module 300 can adjust its resonant frequency by connecting all of the (1-1) lumped element 3611, the (1-2) lumped element 3612, and the (1-3) lumped element 3613 to the first conductive pattern 320 or by omitting at least one of them. Furthermore, the first lumped element 361, the second lumped element 362, the third lumped element 363, and the fourth lumped element 364 may have capacitors and / or inductors to allow the antenna module 300 to operate at a configured resonant frequency.

[0079] Figure 3b It shows through Figure 3a A view of an embodiment of antenna radiation of the first conductive pattern in the image.

[0080] In an embodiment, Figure 3b It can be shown in the form of Figure 3a The view of the antenna module 300 in a state where the second conductive pattern 330 or the first conductive pattern 320 and the second conductive pattern 330 are not electrically connected is omitted. In the following description, the first conductive pattern 320 will be described based on the state where the first conductive pattern 320 is not electrically connected to the second conductive pattern 330. Furthermore, in the following description, the description of components that are repeated with the above components will be omitted.

[0081] According to the embodiments, such as Figure 3b As shown, the antenna module 300 may include a first conductive pattern 320, a second conductive pattern 330, an antenna chip 310, a matching element 350, a first lumped element 361, a second lumped element 362, and / or a fourth lumped element 364. In an embodiment, the second lumped element 362 may be disposed between the (1-2) portion 322 of the first conductive pattern 320 and the wireless communication circuit (e.g., Figure 1 Communication module 190 or Figure 3b In the third electrical path 304 of the wireless communication circuit F). In the embodiment, with Figure 3a Compared to the antenna module 300, Figure 3bThe antenna module 300 can be in a state where the first conductive pattern 320 and the second conductive pattern 330 are not connected through the second lumped element 362. In this case, the antenna module 300 can transmit and / or receive communication signals in at least one frequency band via the antenna chip 310 and the first conductive pattern 320. For example, Figure 3b The antenna module 300 can transmit and / or receive communication signals in a first frequency band (e.g., about 2.4 GHz to 2.5 GHz) and a second frequency band (e.g., about 5 GHz to 6 GHz).

[0082] Figure 3c It is shown Figure 3a A view of an embodiment in which the third conductive pattern is electrically connected to the first conductive pattern and the second conductive pattern.

[0083] In an embodiment, Figure 3c It can be shown Figure 3a A view of an embodiment in which a third conductive pattern 340 for adjusting the resonant frequency of antenna module 300 is physically connected and / or electrically connected to a first conductive pattern 320. In the following description, descriptions of components that are repeated above will be omitted.

[0084] According to the embodiments, such as Figure 3c As shown, the antenna module 300 may include a first conductive pattern 320, a second conductive pattern 330, a third conductive pattern 340, an antenna chip 310, a matching element 350, a first lumped element 361, a second lumped element 362, a third lumped element 363, a fourth lumped element 364, and / or a fifth lumped element 365. In embodiments, the antenna module 300 can transmit and / or receive communication signals in at least one frequency band via the antenna chip 310, the first conductive pattern 320, the second conductive pattern 330, and the third conductive pattern 340. For example, Figure 3c The antenna module 300 can transmit and / or receive communication signals in a first frequency band (e.g., about 2.4 GHz to 2.5 GHz) and a second frequency band (e.g., about 5 GHz to 6 GHz) determined based on a first conductive pattern, a second conductive pattern 330, a third conductive pattern 340, an antenna chip 310, a matching element 350, a first lumped element 361, a second lumped element 362, a third lumped element 363, a fourth lumped element 364 and a fifth lumped element 365.

[0085] In the embodiments, reference is made to Figure 3c The third conductive pattern 340 can be physically connected and / or electrically connected to the first conductive pattern 320 via the fifth lumped element 365. Therefore, in the antenna module 300, the resonant frequency band can be adjusted by changing the antenna radiation length via the third conductive pattern 340.

[0086] Figure 3dIt is shown Figure 3b A view of an embodiment in which the third conductive pattern is electrically connected to the first conductive pattern.

[0087] In an embodiment, Figure 3d It can be shown Figure 3b A view of an embodiment in which the third conductive pattern 340, used to adjust the resonant frequency of the antenna module 300, is physically connected and / or electrically connected to the first conductive pattern 320. Furthermore, as... Figure 3b Antenna module 300, Figure 3d The antenna module 300 can be in a state where the first conductive pattern 320 and the second conductive pattern 330 are not connected through the second lumped element 362. In the following description, descriptions of components that are repeated above will be omitted.

[0088] According to the embodiments, such as Figure 3b As shown, the antenna module 300 may include a first conductive pattern 320, a second conductive pattern 330, a third conductive pattern 340, an antenna chip 310, a matching element 350, a first lumped element 361, a second lumped element 362, a fourth lumped element 364, and / or a fifth lumped element 365. In embodiments, the antenna module 300 can transmit and / or receive communication signals in at least one frequency band via the antenna chip 310, the first conductive pattern 320, and the third conductive pattern 340. For example, Figure 3d The antenna module 300 can transmit and / or receive communication signals in a first frequency band (e.g., about 2.4 GHz to 2.5 GHz) and a second frequency band (e.g., about 5 GHz to 6 GHz) determined based on a first conductive pattern 320, a third conductive pattern 340, an antenna chip 310, a matching element 350, a first lumped element 361, a second lumped element 362, a fourth lumped element 364 and a fifth lumped element 365.

[0089] In the embodiments, reference is made to Figure 3d In the antenna module 300, when the first conductive pattern 320 and the third conductive pattern 340 are electrically connected through the fifth lumped element 365, the antenna radiation length can be changed and the resonant frequency band can be adjusted.

[0090] Figure 4 This is a configuration diagram of a switching circuit connected to a lumped element according to an embodiment of the present disclosure.

[0091] According to an embodiment, the antenna module 300 may include various antenna-related circuits (such as switching circuits S1, S2, S3, S4, and S5) that allow the antenna to support broadband characteristics. In an embodiment, the antenna module 300 may include switching circuits S1, S2, S3, S4, and S5 connected to the lumped element 360.

[0092] According to an embodiment, the switching circuits S1, S2, S3, S4, and S5 (e.g., variable circuits) may include a switch 400, which is configured to open a connection between multiple elements (e.g., a first lumped element 361, a second lumped element 362, a third lumped element 363, a fourth lumped element 364, and / or a fifth lumped element 365) and a wireless communication circuit (e.g., Figure 1 Communication modules and / or Figure 3a The wireless communication circuit F is a circuit. According to an embodiment, switching circuits S1, S2, S3, S4, and S5, under the control of processor 120, can short-circuit the following circuit: this circuit connects the wireless communication circuit F to a lumped element 360 (e.g., a first lumped element 361, a second lumped element 362, a third lumped element 363, a fourth lumped element 364, and / or a fifth lumped element 365) that connects multiple conductive patterns 320, 330, and 340. Therefore, in antenna module 300, when the multiple conductive patterns 320, 330, and 340 are electrically connected or short-circuited through switching circuits S1, S2, S3, S4, and S5, the antenna radiation length can be changed, and the resonant frequency can be adjusted.

[0093] In the embodiments, reference is made to Figures 3a to 3d The first switching circuit S1 can be connected to a circuit that connects a plurality of first lumped elements 361 (e.g., lumped element (1-1) 3611, lumped element (1-2) 3612, and lumped element (1-3) 3613) to the wireless communication circuit F. In an embodiment, the first switching circuit S1 can, under the control of the processor 120, short-circuit at least one of the lumped elements (1-1) 3611, lumped element (1-2) 3612, and lumped element (1-3) 3613 to the wireless communication circuit F. Therefore, in the antenna module 300, the resonant frequency can be adjusted by changing the antenna radiation length and the number of capacitors (e.g., lumped elements) and inductors (e.g., lumped elements) based on the on / off state of the first switching circuit S1.

[0094] In one embodiment, the second switching circuit S2 can be connected to the circuit connecting the second lumped element 362 and the wireless communication circuit F. In another embodiment, the second switching circuit S2 can, under the control of the processor 120, short-circuit the circuit connecting the second lumped element 362 and the wireless communication circuit F. In yet another embodiment, refer to… Figure 3a and Figure 3cIn the antenna module 300, the first conductive pattern 320 and the second conductive pattern 330 can be electrically connected via the second switching circuit S2, or the electrical connection between the first conductive pattern 320 and the second conductive pattern 330 can be short-circuited. Therefore, in the antenna module 300, the resonant frequency can be adjusted by changing the antenna radiation length and the number of capacitors (e.g., lumped elements) and inductors (e.g., lumped elements) based on the on / off state of the second switching circuit S2.

[0095] In one embodiment, the third switching circuit S3 may be connected to the circuit connecting the third lumped element 363 and the wireless communication circuit F. In another embodiment, refer to... Figure 3a and Figure 3c The third switching circuit S3, under the control of the processor 120, can short-circuit the circuit connecting the second lumped element 362 and the wireless communication circuit F. Therefore, in the antenna module 300, the resonant frequency can be adjusted by changing the antenna radiation length and the number of capacitors (e.g., lumped elements) and inductors (e.g., lumped elements) based on the on / off state of the third switching circuit S3.

[0096] In one embodiment, the fourth switching circuit S4 may be connected to the circuit connecting the fourth lumped element 364 and the wireless communication circuit F. In another embodiment, refer to... Figures 3a to 3d The fourth switching circuit S4, under the control of the processor 120, can short-circuit the circuit connecting the fourth lumped element 364 to the wireless communication circuit F. Therefore, in the antenna module 300, the resonant frequency can be adjusted by changing the antenna radiation length and the number of capacitors (e.g., lumped elements) and inductors (e.g., lumped elements) based on the on / off state of the fourth switching circuit S4.

[0097] In an embodiment, the fifth switching circuit (e.g., an additional switching circuit) S5 may be connected to the circuit connecting the fifth lumped element 365 and the wireless communication circuit F. In an embodiment, refer to... Figure 3c and Figure 3d The fifth switching circuit S5, under the control of the processor 120, can short-circuit the circuit connecting the fifth lumped element 365 to the wireless communication circuit F. In an embodiment, in the antenna module 300, the first conductive pattern 320 and the third conductive pattern 340 can be electrically connected via the fifth switching circuit S5, or the electrical connection between the first conductive pattern 320 and the third conductive pattern 340 can be short-circuited. Therefore, in the antenna module 300, the resonant frequency can be adjusted by changing the antenna radiation length and the number of capacitors (e.g., lumped elements) and inductors (e.g., lumped elements) based on the on / off state of the fifth switching circuit S5.

[0098] According to an embodiment, a memory 130 electrically connected to the processor 120 may store a switch table, which includes information about drive signals for a first switch circuit S1, a second switch circuit S2, a third switch circuit S3, a fourth switch circuit S4, and a fifth switch circuit S5 for each frequency band. In an embodiment, the memory 130 may store instructions for short-circuiting the circuits connecting the wireless communication circuit F to lumped elements (e.g., first lumped element 361, second lumped element 362, third lumped element 363, fourth lumped element 364, and / or fifth lumped element 365) via the first switch circuit S1, second switch circuit S2, third switch circuit S3, fourth switch circuit S4, and fifth switch circuit S5 based on a resonant frequency to be configured. The processor 120 may recognize the switch table stored in the memory 130 and control the on / off states of the first switch circuit S1, second switch circuit S2, third switch circuit S3, fourth switch circuit S4, and fifth switch circuit S5, thereby adjusting the resonant frequency of the antenna module 300.

[0099] Figure 5a It is shown Figure 3c The image shows a view of the current flow in the first frequency band of the antenna module. Figure 5b It is shown Figure 3c The image shows a view of the current flow in the second frequency band of the antenna module.

[0100] According to an embodiment, Figure 5a The current flow in the plurality of conductive patterns 320, 330 and 340 shown is based on the first conductive pattern 320, the second conductive pattern 330 and the third conductive pattern 340 as follows Figure 3c The electrical connection shown is a prerequisite. In the embodiment, Figure 5a The current flow in the multiple conductive patterns 320, 330 and 340 shown can be the current flow when the antenna module 300 is operating in a first frequency band (e.g., about 2.4 GHz to 2.5 GHz).

[0101] In the embodiments, reference is made to Figure 5a The current flow in the first frequency band may include a first closed-loop flow, which includes the (1-1) portion 321 of the first conductive pattern 320, the second electrical path 303, the first electrical path 302, and the (1-3) portion 323 of the first conductive pattern 320. In an embodiment, the current flow in the first frequency band may include a second closed-loop flow, which includes the (1-1) portion 321 of the first conductive pattern 320, the second electrical path 303, the first electrical path 302, the second conductive pattern 330, and the (1-2) portion 322 of the first conductive pattern 320. In an embodiment, since the third conductive pattern 340 has an open-circuit structure, the current flow toward the third conductive pattern 340 may be open-loop.

[0102] According to an embodiment, Figure 5b The current flow in the plurality of conductive patterns 320, 330 and 340 shown is based on the first conductive pattern 320, the second conductive pattern 330 and the third conductive pattern 340 as follows Figure 3c The electrical connection shown is a prerequisite. In the embodiment, Figure 5b The current flow in the plurality of conductive patterns 320, 330, and 340 shown may be the current flow when the antenna module 300 operates in a second frequency band (e.g., about 5 GHz to 6 GHz). In an embodiment, reference is made to... Figure 5b Since the third conductive pattern 340 has an open-circuit structure, the current flow toward the third conductive pattern 340 can be open-loop.

[0103] Figure 6 This is a graph showing the antenna radiation performance according to an embodiment of the present disclosure.

[0104] In an embodiment, Figure 6 A graph showing the antenna's radiation performance can be used to illustrate... Figure 3c The graph shows the radiation performance of the antenna module 300. In the embodiment, in Figure 6 In the graph, the X-axis represents the resonant frequency (GHz), and the Y-axis represents the input reflection coefficient (S11). The input reflection coefficient (S11) can be a coefficient used to identify the degree to which the frequency resonates in the antenna module 300. For example, when the value of the input reflection coefficient (S11) is low, less loss (reflection) occurs, and more radiation occurs.

[0105] In the embodiments, reference is made to Figure 6 It can be determined that, in antenna module 300, the input reflection coefficient (S11) is approximately -25 dB or less at approximately 2.4 GHz to 2.5 GHz, which constitutes the first frequency band. Therefore, antenna module 300 can ensure a specific level of antenna radiation performance in the first frequency band.

[0106] In the embodiments, reference is made to Figure 6 It can be determined that the input reflection coefficient (S11) is approximately -20 dB or less in the vicinity of approximately 5 GHz, which is the second frequency band. Furthermore, it can be determined that the input reflection coefficient (S11) is approximately -25 dB or less in the vicinity of approximately 6 GHz, which is the second frequency band. Therefore, the antenna module 300 can ensure a specific level of antenna performance in the second frequency band.

[0107] According to embodiments of this disclosure, an electronic device 101 may include a printed circuit board 301. In one embodiment, the electronic device may include an antenna chip 310 disposed on the printed circuit board. In another embodiment, the electronic device may include a first conductive pattern 320 disposed on the printed circuit board and spaced apart from the antenna chip. In yet another embodiment, the electronic device may include a second conductive pattern 330 spaced apart from the first conductive pattern. In one embodiment, the electronic device may include at least one first lumped element 361 disposed in an electrical path 303 connecting the antenna chip and the first conductive pattern. In yet another embodiment, the electronic device may include at least one second lumped element 362 connected to both the first and second conductive patterns. In yet another embodiment, the electronic device may include a wireless communication circuit F (e.g., Figure 1 The first communication module 190), and the wireless communication circuit F are configured to transmit or receive wireless signals in at least one frequency band via a first conductive pattern and a second conductive pattern.

[0108] In an embodiment, the electronic device may further include a matching element 350 disposed in an electrical path 302 connecting a feed portion of a printed circuit board and an antenna chip on the printed circuit board, and configured to match the impedance between the antenna chip and the feed portion.

[0109] In an embodiment, in an electronic device, the first conductive pattern may include a (1-1) portion 321, a (1-2) portion 322 extending from the (1-1) portion in one direction and electrically connected to a second lumped element, and a (1-3) portion 323 extending from the (1-1) portion in a direction parallel to the (1-2) portion.

[0110] In an embodiment, the electronic device may further include at least one of a third lumped element 363 connected to the second conductive pattern and at least one fourth lumped element 364 connected to the (1-3) portion.

[0111] In an embodiment, the electronic device may further include a third conductive pattern 340 disposed on a printed circuit board and spaced apart from the first conductive pattern, and at least one fifth lumped element 365 electrically connecting the first conductive pattern and the third conductive pattern.

[0112] In one embodiment, the second conductive pattern and the third conductive pattern may be arranged in opposite directions relative to the antenna chip.

[0113] In an embodiment, the wireless communication circuit can transmit or receive wireless signals in a first frequency band and a second frequency band different from the first frequency band via a first conductive pattern, a second conductive pattern, and a third conductive pattern.

[0114] In an embodiment, the first frequency band may include frequencies from 2.4 GHz to 2.5 GHz, and the second frequency band may include frequencies from 5 GHz to 6 GHz.

[0115] In one embodiment, the electronic device may include a first switching circuit S1 disposed in an electrical path electrically connecting the wireless communication circuit to at least one first lumped element. In another embodiment, the electronic device may include a second switching circuit S2 disposed in an electrical path electrically connecting the wireless communication circuit to at least one second lumped element. In yet another embodiment, the electronic device may include a processor 120 configured to control the first and / or second switching circuits to adjust the frequency band.

[0116] In one embodiment, the electronic device may include a third conductive pattern 340 disposed on a printed circuit board and spaced apart from the first conductive pattern. In another embodiment, the electronic device may include at least one fifth lumped element 365 electrically connecting the first and third conductive patterns. In yet another embodiment, the electronic device may include an additional switching circuit S5 disposed in an electrical path electrically connecting a wireless communication circuit to at least one fifth lumped element and electrically connected to a processor. The processor may control the additional switching circuit to adjust the frequency band.

[0117] In one embodiment, the electronic device may include a memory 130 electrically connected to the processor. The memory may store a switching table, which includes information about drive signals for a first switching circuit, a second switching circuit, and an additional switching circuit for each frequency band.

[0118] According to embodiments of this disclosure, an antenna module 300 may include a printed circuit board 301. In one embodiment, the antenna module may include an antenna chip 310 disposed on the printed circuit board. In another embodiment, the antenna module may include a first conductive pattern 320 disposed on the printed circuit board and spaced apart from the antenna chip. In yet another embodiment, the antenna module may include a second conductive pattern 330 spaced apart from the first conductive pattern. In a further embodiment, the antenna module may include at least one first lumped element 361 disposed in an electrical path connecting the antenna chip and the first conductive pattern. In yet another embodiment, the antenna module may include at least one second lumped element 362 electrically connected to both the first and second conductive patterns. Finally, the antenna module may include a wireless communication circuit F configured to transmit or receive wireless signals in at least one frequency band via the first and second conductive patterns.

[0119] In an embodiment, the antenna module may include a matching element 350, which is disposed in the electrical path 302 connecting the feed portion of the printed circuit board and the antenna chip on the printed circuit board, and is configured to match the impedance between the antenna chip and the feed portion.

[0120] In an embodiment, the first conductive pattern may include a (1-1) portion 321, a (1-2) portion 322 extending from the (1-1) portion in one direction and electrically connected to the second lumped element, and a (1-3) portion 323 extending from the (1-1) portion in a direction parallel to the (1-2) portion.

[0121] In one embodiment, the antenna module may include at least one third lumped element 363 connected to the second conductive pattern. In another embodiment, the antenna module may include at least one fourth lumped element 364 connected to the (1-3) portion.

[0122] In one embodiment, the antenna module may include a third conductive pattern 340 disposed on a printed circuit board and spaced apart from the first conductive pattern. In another embodiment, the antenna module may include at least one fifth lumped element 365 electrically connecting the first conductive pattern and the third conductive pattern.

[0123] In one embodiment, the second conductive pattern and the third conductive pattern may be arranged in opposite directions relative to the antenna chip.

[0124] In an embodiment, the wireless communication circuit can transmit or receive wireless signals in a first frequency band and a second frequency band different from the first frequency band via a first conductive pattern, a second conductive pattern, and a third conductive pattern.

[0125] In one embodiment, the antenna module may include a first switching circuit S1 disposed in an electrical path that electrically connects the wireless communication circuit to at least one first lumped element. In another embodiment, the antenna module may include a second switching circuit S2 disposed in an electrical path that electrically connects the wireless communication circuit to at least one second lumped element.

[0126] In an embodiment, the antenna module may further include an additional switching circuit S5 disposed in the electrical path that electrically connects the wireless communication circuit to at least one fifth lumped element.

[0127] As consumers demand, electronic devices are becoming thinner and smaller. Consequently, antenna components housed within these devices may need to be miniaturized.

[0128] In this embodiment, due to space constraints within the electronic device, the antenna module disposed in the electronic device 101 may not have sufficient size. For example, the size of the printed circuit board constituting the antenna module may be limited by the size of the internal space of the electronic device. In this case, the conductive pattern (e.g., the antenna radiating pattern) disposed on the printed circuit board and configured to transmit or receive communication signals may not have sufficient length as an antenna radiating pattern. Therefore, it may be difficult to ensure antenna performance.

[0129] Furthermore, in the antenna module, the shape of the conductive pattern and the capacitance and inductance of the lumped elements (e.g., capacitors and inductors) can be determined according to the usage conditions in a specific electronic device. However, because such an antenna module has a structure optimized for a specific electronic device, its antenna performance may be degraded when used in another electronic device.

[0130] According to embodiments of this disclosure, the antenna module 300 can be used in various electronic devices by changing the arrangement of the lumped element 360 and the capacitance and inductance of the lumped element 260 on a printed circuit board 301 comprising multiple conductive patterns 320, 330, and 340. For example, depending on the electronic device in which the antenna module 300 is provided, the resonant frequency of the antenna can be adjusted by adjusting the connections between the multiple conductive patterns 320, 330, and 340, the capacitance value of the lumped element 360, and the inductance value of the lumped element 360. Therefore, in the antenna module 300, single resonance and dual resonance can be selectively implemented depending on the electronic device in which the antenna module 300 is provided. Furthermore, compared to antenna modules that perform antenna functions by providing a separate metal on a printed circuit board 301, the antenna module 300 of this disclosure can have antenna radiation achieved by conductive patterns 320, 330, and 340 formed on the printed circuit board 301 (instead of a separate metal). Therefore, compared to antenna modules that include metal for antenna radiation, the antenna module 300 of this disclosure can have a reduced height / thickness. Thus, the antenna module 300 of this disclosure can transmit or receive communication signals in at least one frequency band by customizing the capacitance and inductance of the lumped elements 360 provided on the mass-produced printed circuit board 301, as well as the connections between the multiple conductive patterns 320, 330, and 340, according to the shape factors of various products and the antenna arrangement environment.

[0131] It will be understood that the various embodiments of this disclosure and the terminology used to describe the embodiments are not intended to limit the technical features disclosed herein to particular embodiments, and that embodiments include various modifications, equivalents, or alternatives to the corresponding embodiments. In the description of the drawings, similar reference numerals may be used for similar or related components. Unless the context clearly indicates otherwise, the singular form of a noun corresponding to an item may include one or more items. In this disclosure, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one of the items listed together in the corresponding phrase or all possible combinations of items. Terms such as “first” and “second” may be used to simply distinguish a corresponding element from another element and do not limit the element in other respects (e.g., importance or order). When the terms “functionally” or “communically” are used, or when the terms “functionally” or “communically” are not used, when a particular (e.g., first) component is described as “combined” or “connected” to another (e.g., second) component, it means that the particular component can be connected to the other component directly (e.g., wired), wirelessly, or via a third component.

[0132] According to various embodiments, each of the above components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above components or operations may be omitted, or one or more other components or operations may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated element may still perform one or more functions of the corresponding elements in the multiple elements in the same or similar manner as each of the multiple elements performed its function before integration. According to various embodiments, operations performed by a module, program, or other element may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be performed in a different order or omitted, or one or more other operations may be added.

[0133] It will be understood that, in addition to the embodiments disclosed above, this disclosure also contemplates and includes embodiments based on any two or more combinations of the embodiments disclosed above, as well as embodiments including any combination of the features described above. These are disclosed herein. That is, the absence of an explicit indication that two features or two embodiments can be combined does not mean that such combinations are not contemplated, but rather that such combinations should be considered to be included herein.

Claims

1. An electronic device (101), comprising: Printed circuit board (301); Antenna chip (310) is disposed on the printed circuit board; A first conductive pattern (320) is disposed on the printed circuit board and spaced apart from the antenna chip. The second conductive pattern (330) is configured to be spaced apart from the first conductive pattern; At least one first lumped element (361) is disposed in the electrical path (303) connecting the antenna chip and the first conductive pattern; At least one second lumped element (362) is connected to the first conductive pattern and the second conductive pattern; as well as The wireless communication circuit (F) is configured to transmit or receive wireless signals in at least one frequency band via the first conductive pattern and the second conductive pattern.

2. The electronic device of claim 1, further comprising: A matching element (350) is disposed in the electrical path (302) connecting the feed portion of the printed circuit board to the antenna chip on the printed circuit board, and is configured to match the impedance between the antenna chip and the feed portion.

3. The electronic device as claimed in claim 1, wherein, The first conductive pattern includes: Part (1-1) (321); Part (1-2) (322) extends from part (1-1) in one direction and is electrically connected to the second lumped element; and Part (1-3) (323) extends from part (1-1) in a direction parallel to part (1-2).

4. The electronic device of claim 3, further comprising at least one of the following: At least one third lumped element (363) is connected to the second conductive pattern; and At least one fourth lumped element (364) is connected to the (1-3) section.

5. The electronic device of claim 1, further comprising: A third conductive pattern (340) is disposed on the printed circuit board and spaced apart from the first conductive pattern. as well as At least one fifth lumped element (365) is electrically connected to the first conductive pattern and the third conductive pattern.

6. The electronic device as claimed in claim 5, wherein, The wireless communication circuit is configured to transmit or receive wireless signals in a first frequency band and a second frequency band different from the first frequency band via the first conductive pattern, the second conductive pattern and the third conductive pattern.

7. The electronic device as claimed in claim 6, wherein, The first frequency band includes frequencies from 2.4 GHz to 2.5 GHz, and The second frequency band includes frequencies from 5 GHz to 6 GHz.

8. The electronic device of claim 1, further comprising: A first switching circuit (S1) is provided in the electrical path that electrically connects the wireless communication circuit to the at least one first lumped element; The second switching circuit (S2) is provided in the electrical path that electrically connects the wireless communication circuit to the at least one second lumped element; as well as The processor (120) is configured to control the first switching circuit and / or the second switching circuit to adjust the frequency band.

9. The electronic device of claim 8, further comprising: A third conductive pattern (340) is disposed on the printed circuit board and spaced apart from the first conductive pattern. At least one fifth lumped element (365) is electrically connected to the first conductive pattern and the third conductive pattern; and An additional switching circuit (S5) is provided in the electrical path that electrically connects the wireless communication circuit to the at least one fifth lumped element, and is also electrically connected to the processor. The processor is configured to control the additional switching circuit to adjust the frequency band.

10. The electronic device of claim 9, further comprising: The memory (130) is electrically connected to the processor. The memory is configured to store a switch table, which includes information about the drive signals of the first switch circuit, the second switch circuit, and the additional switch circuit for each frequency band.

11. An antenna module (300), comprising: Printed circuit board (301); Antenna chip (310) is disposed on the printed circuit board; A first conductive pattern (320) is disposed on the printed circuit board and spaced apart from the antenna chip. The second conductive pattern (330) is configured to be spaced apart from the first conductive pattern; At least one first lumped element (361) is disposed in the electrical path (303) connecting the antenna chip and the first conductive pattern; At least one second lumped element (362) is connected to the first conductive pattern and the second conductive pattern; as well as The wireless communication circuit (F) is configured to transmit or receive wireless signals in at least one frequency band via the first conductive pattern and the second conductive pattern.

12. The antenna module of claim 11, further comprising: A matching element (350) is disposed in the electrical path (302) connecting the feed portion of the printed circuit board to the antenna chip on the printed circuit board, and is configured to match the impedance between the antenna chip and the feed portion.

13. The antenna module as claimed in claim 11, wherein, The first conductive pattern includes: Part (1-1) (321); Part (1-2) (322) extends from part (1-1) in one direction and is electrically connected to the second lumped element; and Part (1-3) (323) extends from part (1-1) in a direction parallel to part (1-2).

14. The antenna module of claim 13, further comprising: At least one third lumped element (363) is connected to the second conductive pattern; as well as At least one fourth lumped element (364) is connected to the (1-3) section.

15. The antenna module of claim 11, further comprising: A third conductive pattern (340) is disposed on the printed circuit board and spaced apart from the first conductive pattern. as well as At least one fifth lumped element (365) is electrically connected to the first conductive pattern and the third conductive pattern.

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