Lidar driving device and lidar system including the same

Abstract

A LIDAR driving device according to the present application includes: a stator unit including a first housing, a first PCB disposed on the first housing, a first holder disposed to surround a shaft, and a first FPCB connected to the first PCB and disposed along an outer peripheral surface of the first holder; the shaft disposed in the stator unit; and a rotor unit including a second housing, a second PCB disposed on the second housing, a second holder disposed to surround the shaft and the first holder, and a second FPCB connected to the second PCB and disposed along an inner peripheral surface of the second holder. The first FPCB and the second FPCB are respectively disposed to be spaced apart from each other and face each other on the outer peripheral surface of the first holder and the inner peripheral surface of the second holder. The first FPCB includes a first metal pattern disposed along the outer peripheral surface of the first holder, and the second FPCB includes a second metal pattern disposed along the inner peripheral surface of the second holder.

Description

Technical Field

[0001] This invention relates to a lidar driving device and a lidar system including the same. Background Technology

[0002] LiDAR (Light Detection and Ranging) uses laser pulses emitted from a light-emitting unit and reflected back from a target object to measure the distance to the object or to create the object's shape. LiDAR is used in various technical fields requiring 3D imaging. For example, LiDAR can be applied in fields such as meteorology, aviation, aerospace, and transportation. Recently, LiDAR has become increasingly important in the field of autonomous driving.

[0003] Typically, a LiDAR's light emitting unit generates an output light signal and illuminates an object, a light receiving unit receives the input light signal reflected from the object, and an information generation unit uses the input light signal received by the light receiving unit to generate information about the object.

[0004] LiDARs can be broadly classified into mechanical LiDARs and solid-state LiDARs. Mechanical LiDARs achieve a 360-degree field of view by rotating the light emitting and receiving units. Solid-state LiDARs can be, for example, microelectromechanical system (MEMS) LiDARs, flash LiDARs, or optical phase array (OPA) LiDARs. In MEMS LiDARs, the tilt angle of the mirrors can be precisely changed via electrical signals. In flash LiDARs, an optical flash lamp is used, and a single large-area laser pulse can illuminate the environment in front. In OPAs, an optical phase modulator controls the speed of light passing through the lens, and thus the shape of the optical wavefront can be controlled.

[0005] In the case of a mechanical LiDAR, a light emitting unit and a light receiving unit are mounted on a LiDAR drive unit, and the light emitting unit and the light receiving unit rotate on the LiDAR drive unit. For this purpose, the LiDAR drive unit includes a fixed part and a rotating part, wherein the fixed part is fixed to the vehicle, and the light emitting unit and the light receiving unit mounted on the rotating part rotate due to the interaction between the fixed part and the rotating part.

[0006] Simultaneously, in order to transmit control signals for controlling the optical emitting unit and the optical receiving unit to the optical emitting unit and the optical receiving unit, and in order to transmit the electrical signals received by the optical receiving unit to the vehicle side, wireless communication between the fixed part and the rotating part of the LiDAR drive device is required. For example, wireless communication between the fixed part and the rotating part can be achieved using an optical communication scheme utilizing optical sensors and a capacitive link scheme utilizing a metal ring.

[0007] In optical communication solutions, optical sensors are susceptible to foreign objects, so an airtight structure must be ensured, and there is a problem that the sensing performance changes with temperature.

[0008] In a capacitive link scheme, to ensure the impedance value of the communication line, resistors must be soldered to a metal ring, and to connect the printed circuit board (PCB) and the metal ring, wires must be soldered to the metal ring. Due to the difficulty in dimensional management during soldering, quality degradation may occur due to interference during the rotation of the rotating parts.

[0009] In particular, the need for high-speed communication requires a total of four metal rings for bidirectional communication, which may be a significant constraint for applying the capacitive link scheme to LiDAR devices. Summary of the Invention

[0010] Technical issues

[0011] The technical objective of this invention is to provide a LiDAR driving device capable of bidirectional communication and a LiDAR system including the same.

[0012] Technical solution

[0013] A LiDAR driving device according to an embodiment of the present invention includes: a stator portion; a shaft disposed on the stator portion; and a rotor portion disposed on the shaft, wherein the stator portion includes: a first housing; a first printed circuit board (PCB) disposed on the first housing; a first retainer disposed around the shaft; and a first flexible printed circuit board (FPCB) connected to the first PCB and disposed along the outer peripheral surface of the first retainer, wherein the rotor portion includes: a second housing; a second PCB disposed on the second housing; a second retainer disposed around the shaft and the first retainer; and a second FPCB connected to the second PCB and disposed along the inner peripheral surface of the second retainer, wherein the first FPCB and the second FPCB are configured to face each other and spaced apart on the outer peripheral surface of the first retainer and the inner peripheral surface of the second retainer, wherein the first FPCB includes a first metal pattern disposed along the outer peripheral surface of the first retainer, and wherein the second FPCB includes a second metal pattern disposed along the inner peripheral surface of the second retainer.

[0014] The first FPCB includes a first transmitting FPCB connected to the transmitting portion of the first PCB and a first receiving FPCB connected to the receiving portion of the first PCB. The second FPCB includes a second transmitting FPCB connected to the transmitting portion of the second PCB and a second receiving FPCB connected to the receiving portion of the second PCB. The first transmitting FPCB and the second receiving FPCB may be configured to face each other and be spaced apart between the outer peripheral surface of the first holder and the inner peripheral surface of the second holder. The first receiving FPCB and the second transmitting FPCB may also be configured to face each other and be spaced apart between the outer peripheral surface of the first holder and the inner peripheral surface of the second holder.

[0015] The second FPCB may also include an amplifier disposed on the second receiving FPCB.

[0016] The amplifier can be positioned between the second PCB and the second retainer.

[0017] At least one of the first FPCB and the second FPCB may include at least one of a resistor and a capacitor.

[0018] The first transmitting FPCB, the first receiving FPCB, the second transmitting FPCB, and the second receiving FPCB can all have a T-shaped form.

[0019] The first holder includes a first lower holder and a first upper holder disposed on the first lower holder. The second holder includes a second lower holder and a second upper holder disposed on the second lower holder. The first transmitting FPCB can be disposed along the outer peripheral surface of the first upper holder, and the second receiving FPCB can be disposed along the inner peripheral surface of the second upper holder. The first receiving FPCB can be disposed along the outer peripheral surface of the first lower holder, and the second transmitting FPCB can be disposed along the inner peripheral surface of the second lower holder.

[0020] The first metal pattern may include a first lower metal pattern disposed along the outer peripheral surface of the first lower holder and a first upper metal pattern disposed along the outer peripheral surface of the first upper holder, and the second metal pattern may include a second lower metal pattern disposed along the inner peripheral surface of the second lower holder and a second upper metal pattern disposed along the inner peripheral surface of the second upper holder.

[0021] The first transmitting FPCB, the first receiving FPCB, the second transmitting FPCB, and the second receiving FPCB may all include an insulating layer, a ground layer disposed on a first surface of the insulating layer, and a signal layer disposed on a second surface of the insulating layer. A first lower metal pattern may be disposed on the first surface of the insulating layer of the first receiving FPCB, a first upper metal pattern may be disposed on the first surface of the insulating layer of the first transmitting FPCB, a second lower metal pattern may be disposed on the first surface of the insulating layer of the second transmitting FPCB, and a second upper metal pattern may be disposed on the first surface of the insulating layer of the second receiving FPCB.

[0022] Between the first upper holder and the second upper holder, the first surface of the insulating layer of the first transmitting FPCB and the second surface of the insulating layer of the second receiving FPCB can be configured to face each other, and between the first lower holder and the second lower holder, the second surface of the insulating layer of the first receiving FPCB and the first surface of the insulating layer of the second transmitting FPCB can be configured to face each other.

[0023] A LiDAR system according to an embodiment of the present invention includes: a light emitting unit configured to illuminate an object with a light signal; a light receiving unit configured to receive a light signal reflected from the object; and a driving unit configured to rotate the light emitting unit and the light receiving unit, wherein the driving unit includes: a stator portion; a shaft disposed on the stator portion; and a rotor portion disposed on the shaft, wherein the stator portion includes: a first housing; a first PCB disposed on the first housing; a first retainer disposed around the shaft; and a first FPCB connected to the first PCB and disposed along the outer peripheral surface of the first retainer, wherein the rotor portion includes: a second housing; a second PCB disposed on the second housing; a second retainer disposed around the shaft and the first retainer; and a second FPCB connected to the second PCB and disposed along the inner peripheral surface of the second retainer, wherein the first FPCB and the second FPCB are configured to face each other and spaced apart, wherein the first FPCB includes a first metal pattern disposed along the outer peripheral surface of the first retainer, and wherein the second FPCB includes a second metal pattern disposed along the inner peripheral surface of the second retainer.

[0024] Beneficial effects

[0025] According to embodiments of the present invention, a LiDAR driving device capable of bidirectional communication and a LiDAR system including the same can be obtained. In particular, according to embodiments of the present invention, since soldering for connecting resistors or wires is not required, a LiDAR driving device and a LiDAR system including the same can be obtained with improved manufacturability, high assemblability, robustness to temperature changes, and a low defect rate. Furthermore, according to embodiments of the present invention, a LiDAR driving device and a LiDAR system including the same can be obtained with improved high-speed communication quality. Attached Figure Description

[0026] Figure 1 This is a block diagram of a LiDAR system according to an embodiment of the present invention.

[0027] Figure 2 This is a cross-sectional view of an optical receiving unit according to an embodiment of the present invention.

[0028] Figure 3 This is a top view of an image sensor according to an embodiment of the present invention.

[0029] Figure 4 This is a bottom view of a microlens array according to an embodiment of the present invention.

[0030] Figure 5 This is a view used to illustrate the correspondence between the light source, the condenser lens, the first homogenizer lens, and the second homogenizer lens of the light emitting unit according to an embodiment of the present invention.

[0031] Figure 6 This is a partial perspective view of a LiDAR system according to an embodiment of the present invention.

[0032] Figure 7 This is a partial exploded view of a LiDAR system according to an embodiment of the present invention.

[0033] Figure 8 This is a partial exploded view of a LiDAR device according to an embodiment of the present invention.

[0034] Figure 9 This is a perspective view of a LiDAR driving device according to an embodiment of the present invention.

[0035] Figure 10 This is a cross-sectional perspective view of a LiDAR driving device according to an embodiment of the present invention.

[0036] Figure 11 This is a partial cross-sectional perspective view of a LiDAR driving device according to an embodiment of the present invention.

[0037] Figure 12This is a view used to describe the arrangement shape of the FPCB (flexible printed circuit board) of a LiDAR driving device according to an embodiment of the present invention.

[0038] Figures 13 to 16 are the FPCBs of a LiDAR driving device according to an embodiment of the present invention.

[0039] Figure 17 This is a partial perspective view of a LiDAR driving device according to an embodiment of the present invention.

[0040] Figure 18 The eye diagram test results are shown based on the length of the second receiving FPCB connected to the receiving portion of the second PCB.

[0041] Figure 19 The eye diagram test results are shown before and after the amplifier is set on the second receiver FPCB connected to the receiver section of the second PCB. Detailed Implementation

[0042] In the following, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0043] However, the spirit of the invention is not limited to the embodiments described below, and the invention can be implemented in various forms. Within the spirit or scope of the invention, one or more components of the embodiments may be selectively combined or substituted with each other.

[0044] Furthermore, unless otherwise explicitly defined, the terms (including technical and scientific terms) used in the embodiments of the present invention shall be interpreted as having the meaning commonly understood by one of ordinary skill in the art to which the present invention pertains, and terms having the commonly understood meaning (such as terms defined in a dictionary) shall be interpreted in the context of the relevant art.

[0045] Furthermore, the terminology used in the embodiments of the present invention is for the purpose of describing the embodiments only and is not intended to limit the scope of the present invention.

[0046] In this specification, unless otherwise stated, the singular form may be understood to include the plural form, and the expression "at least one of A, B and / or C" may be understood to include any combination of one or more A, B and C.

[0047] In addition, expressions such as "first", "second", "A", "B", "(a)" and "(b)" can be used to describe components of embodiments of the present invention.

[0048] These terms are intended only to distinguish one part from another, and the nature, order, or sequence of the corresponding parts are not limited by these terms.

[0049] Furthermore, when a component is described as "connected", "combined", or "accessed" to another component, the component can not only be directly connected, combined, or accessed to the other component, but can also be "connected", "combined", or "accessed" due to the presence of other components between the component and the other component.

[0050] Furthermore, when described as being formed or disposed "above" or "below" each component, "above" or "below" includes not only the case where two components are in direct contact with each other, but also the case where one or more other components are formed or disposed between the two components. Additionally, when expressed as "above" or "below," it can include not only the meaning of an upward direction based on a component, but also the meaning of a downward direction based on a component.

[0051] The LiDAR system according to embodiments of the present invention can refer to a LiDAR system installed in a vehicle to measure the distance between the vehicle and an object, but is not limited thereto. The LiDAR system according to embodiments of the present invention can use the time-of-flight (ToF) principle or the phase-shift principle to extract depth information. In this specification, the LiDAR system may also be referred to as an information generation device, a depth information generation device, or a camera device.

[0052] Figure 1 This is a block diagram of a LiDAR system according to an embodiment of the present invention.

[0053] Reference Figure 1 According to an embodiment of the present invention, the LiDAR system 1000 includes a light emitting unit 100, a light receiving unit 200, an information generating unit 300, a control unit 400, and a driving unit 500.

[0054] The light emitting unit 100 can generate and output an output light signal in the form of a pulsed wave or a continuous wave. The continuous wave can be in the form of a sine wave or a square wave. By generating an output light signal in the form of a pulsed wave or a continuous wave, the LiDAR system 1000 can detect the time difference or phase difference between the output light signal output from the light emitting unit 100 and the input light signal reflected from the target area and then input to the light receiving unit 200. In this specification, output light can refer to light output from the light emitting unit 100 and incident on an object, and input light can refer to light output from the light emitting unit 100, reaching the target area, then reflected from the target area and input to the light receiving unit 200. From the perspective of the target area, the output light can be the incident light, and the input light can be the reflected light. In this specification, the target area can be used interchangeably with the object or the target object.

[0055] The light receiving unit 200 can receive light signals reflected from the target area. In this case, the received light signal can be a light signal output by the light emitting unit 100 and reflected from the target area.

[0056] The light receiving unit 200 includes an image sensor, a lens unit disposed on the image sensor, and a filter.

[0057] The light signal reflected from the target area can pass through the lens unit of the light receiving unit 200. The optical axis of the lens unit of the light receiving unit 200 can be aligned with the optical axis of the image sensor. A filter can be disposed in the optical path between the target area and the image sensor. The filter can filter light with a predetermined wavelength range. The filter can allow light with a specific wavelength to pass through. For example, the filter can allow light in the infrared or near-infrared band to pass through while blocking light outside the infrared or near-infrared band. The image sensor receives the light signal and can output the received light signal as an electrical signal. The image sensor can detect light with a wavelength corresponding to the wavelength of the light output by the light emitting unit 100. For example, the image sensor can detect light in the infrared or near-infrared band.

[0058] Image sensors can be configured with a structure in which multiple pixels are arranged in a grid.

[0059] The optical receiving unit 200 and the optical emitting unit 100 can be arranged side by side. The optical receiving unit 200 can be located next to the optical emitting unit 100. The optical receiving unit 200 can be configured to face the same direction as the optical emitting unit 100. Alternatively, the optical receiving unit 200 and the optical emitting unit 100 can be configured to face different directions from each other. When the optical receiving unit 200 and the optical emitting unit 100 are configured to face different directions from each other, an optical path conversion component can be further provided between the optical receiving unit 200 and the optical emitting unit 100.

[0060] The information generation unit 300 uses the input light signal input to the light receiving unit 200 to generate information about the target region. The information about the target region may include three-dimensional information about the target region. For example, the information about the target region may include a point cloud. Alternatively, the information about the target region may include depth information or shape information about the target region. For example, the information generation unit 300 can use the time of flight of the output light signal output from the light emitting unit 100 from the object until it is input to the light receiving unit 200 to calculate the depth information of the object. For example, the information generation unit 300 can use the electrical signal received by the image sensor to calculate the time difference between the output light signal and the input light signal, and use the calculated time difference to calculate the distance between the target region and the LiDAR system 1000. For example, the information generation unit 300 can use the electrical signal received by the image sensor to calculate the phase difference between the output light signal and the input light signal, and use the calculated phase difference to calculate the distance between the target region and the LiDAR system 1000.

[0061] The control unit 400 controls the operation of the light emitting unit 100, the light receiving unit 200, and the information generating unit 300. The information generating unit 300 and the control unit 400 can be implemented as a printed circuit board (PCB). Alternatively, the information generating unit 300 and the control unit 400 can be implemented as other types of components. Alternatively, the control unit 400 can be included in a terminal or vehicle equipped with the LiDAR system 1000 according to an embodiment of the present invention. For example, the control unit 400 can be implemented as an application processor (AP) of a smartphone equipped with the LiDAR system 1000 according to an embodiment of the present invention, or as an electronic control unit (ECU) of a vehicle equipped with the LiDAR system 1000 according to an embodiment of the present invention.

[0062] The LiDAR system 1000 according to an embodiment of the present invention can be a mechanical LiDAR that rotates 360°. For this purpose, the LiDAR system 1000 also includes a drive unit 500. The drive unit 500 includes a stator portion, a shaft disposed on the stator portion, and a rotor portion disposed on the shaft. Through the interaction between the stator portion and the rotor portion, the LiDAR system 1000 can have a 360° field of view (FOV).

[0063] Figure 2 This is a cross-sectional view of a light receiving unit according to an embodiment of the present invention. Figure 3 This is a top view of an image sensor according to an embodiment of the present invention, and Figure 4 This is a bottom view of a microlens array according to an embodiment of the present invention.

[0064] Reference Figures 2 to 4The light receiving unit 200 included in the LiDAR system 1000 according to an embodiment of the present invention includes an image sensor 210, a microlens array 220 disposed on the image sensor 210, a lens unit 230 disposed on the microlens array 220, a window 250 disposed on the lens unit 230, and a filter 240 disposed between the image sensor 210 and the window 250. Although the filter 240 is shown as being disposed between the lens unit 230 and the window 250, it is not limited thereto.

[0065] According to an embodiment of the present invention, the image sensor 210 includes a pixel array. Here, the pixel array may be a single-photon avalanche detector (SPAD) array, and the SPAD array may include multiple SPADs. When a SPAD receives an optical signal, it can detect photons through the avalanche phenomenon.

[0066] Here, the image sensor 210 includes a pixel array arranged along a first direction and a second direction, and the number of pixels arranged along the first direction may be greater than the number of pixels arranged along the second direction. For example, the image sensor 210 according to an embodiment of the present invention includes m An n-pixel array, where m can be greater than n. When the ratio of m to n is 8 or greater, the pixel array can be called a one-dimensional pixel array or a one-dimensional SPAD array.

[0067] According to embodiments of the present invention, the image sensor 210 may include a one-dimensional pixel array. For example, the image sensor 210 according to embodiments of the present invention may include 16 2-pixel array, 32 2-pixel array, 64 2-pixel array, 128 2-pixel array, 256 2-pixel array, 512 2-pixel array or 1024 2-pixel array.

[0068] According to an embodiment of the present invention, a microlens array 220 is disposed on and spaced apart from an image sensor 210. The microlens array 220 includes a first surface 220A facing the image sensor 210 and a second surface opposite to the first surface 220A, and a plurality of microlenses protrude from the first surface 220A to face the image sensor 210. For ease of description, the first surface 220A of the microlens array 220 may be referred to as the bottom surface of the microlens array 220, and the second surface of the microlens array 220 may be referred to as the top surface of the microlens array 220. According to an embodiment of the present invention, a plurality of microlenses are formed on the first surface 220A of the microlens array 220, and the second surface of the microlens array 220 may be a planar surface.

[0069] According to an embodiment of the present invention, the first surface 220A of the microlens array 220 includes: an effective region 220A1, including a plurality of microlenses corresponding to the pixel array of the image sensor 210; a buffer region 220A2, including a plurality of microlenses disposed around the effective region 220A1; and a peripheral region 220A3, disposed around the buffer region 220A2.

[0070] Here, the effective area 220A1 can correspond one-to-one with the pixel array. That is, when the image sensor 210 includes m When using an n-pixel array, the effective region 220A1 includes m The image sensor 210 has n microlenses, and each pixel corresponds one-to-one with a microlens in the effective area 220A1. Therefore, of the light signals incident on the light receiving unit 200, the light signals incident on the effective area 220A1 can be detected by the image sensor 210 and used for object recognition. The light signals incident on the light receiving unit 200 are collected by the microlenses in the effective area 220A1 of the microlens array 220, thus increasing the light receiving efficiency of each pixel. Therefore, the microlens array 220 can also be referred to as a sensor window.

[0071] Simultaneously, the buffer region 220A2 can be disposed around the effective region 220A1 to surround the effective region 220A1. For example, when the image sensor 210 includes m n-pixel array and the effective region 220A1 includes m When there are n microlenses, the first surface 220A of the microlens array 220 may include a buffer region 220A2, thus including a total of (m+2a). (n+2b) microlenses. Here, a and b can be the same or different from each other. For example, each of a and b can be between 1 and 10, preferably between 1 and 5, and more preferably between 2 and 3. For example, a can be 3 and b can be 2. In this way, when the first surface 220A of the microlens array 220 includes a buffer region 220A2 surrounding the effective region 220A1, the light collection efficiency of the effective region 220A1 is improved, and the loss of optical signal can be reduced.

[0072] Meanwhile, the peripheral region 220A3 can be disposed around the buffer region 220A2 to surround the buffer region 220A2. In this case, the peripheral region 220A3 can be a planar surface. Therefore, the microlens array 220 can be connected to the image sensor 210 or to a structure within the light receiving unit 200 through the peripheral region 220A3.

[0073] exist Figure 2In this configuration, lens unit 230 may include multiple lenses. For example, lens unit 230 may include two lenses spaced apart from each other, but is not limited thereto. Filter 240 may be a bandpass filter. For example, it may be a bandpass filter that transmits only the IR optical signal from the optical signal input to receiving unit 200. Although not shown, lens group 230 and filter 240 may be disposed on the lens barrel.

[0074] Window 250 is disposed outside the lens barrel, and after the light signal reflected from the object is transmitted through window 250, it sequentially incident on filter 240, lens group 230, microlens array 220, and image sensor 210. Therefore, window 250 can be referred to as a glass window or external window. The light signal output from light emitting unit 100 can also be output to the outside through window 250.

[0075] Figure 5 This is a view used to illustrate the correspondence between the light source, the condenser lens, the first homogenizing lens, and the second homogenizing lens of the light emitting unit according to an embodiment of the present invention.

[0076] Reference Figure 5 The light emitting unit 100 may include a light source 110, a condenser lens 120, a first light-diffusing lens 130, and a second light-diffusing lens 140.

[0077] Light source 110 generates and outputs laser pulses. The light source can use light-emitting diodes (LEDs) and can have multiple LEDs arranged in a predetermined pattern. Alternatively, the light source can include organic light-emitting diodes (OLEDs) or laser diodes (LDs). Alternatively, the light source can be a vertical-cavity surface-emitting laser (VCSEL). A VCSEL is one type of laser diode that converts an electrical signal into an optical signal and can output wavelengths of approximately 800 nm to 1000 nm, for example, approximately 850 nm or approximately 940 nm. Alternatively, the light source can output short-wavelength infrared (SWIR). SWIR can refer to wavelengths of 900 nm to 2500 nm, for example, approximately 1430 nm. The light source is repeatedly turned on / off at predetermined time intervals to generate an output optical signal in the form of a pulsed wave or a continuous wave. The predetermined time interval can be the frequency of the output optical signal. Alternatively, the light source can include an edge-emitting laser (EEL). This reduces the spectral width of the laser and suppresses wavelength variations based on temperature.

[0078] According to an embodiment of the present invention, the light source 110 may include a plurality of point light sources 111 in a one-dimensional array shape.

[0079] According to an embodiment of the present invention, a condenser lens 120 converges the light emitted from each point light source, converts it into parallel light, and outputs parallel light. For this purpose, the condenser lens 120 may be disposed above and spaced apart from the light source 110. Here, the term "above the light source 110" may refer to the side from which light is emitted from the light source 110. The condenser lens 120 may be at least one lens, and when the condenser lens 120 comprises multiple lenses, the multiple condenser lenses may be aligned relative to a central axis to form an optical system. Here, the central axis may be the same as the optical axis of the optical system.

[0080] According to an embodiment of the present invention, the first homogenizing lens 130 and the second homogenizing lens 140 homogenize the light that has been parallelized by the condenser lens 120 and output homogenized light. For this purpose, the first homogenizing lens 130 is disposed above and spaced apart from the light source 110, and the second homogenizing lens 140 is also spaced apart from the light source 110, with the first homogenizing lens 130 located between the second homogenizing lens and the light source. That is, the light source 110, the condenser lens 120, the first homogenizing lens 130, and the second homogenizing lens 140 are sequentially arranged to be spaced apart from each other. Both the first homogenizing lens 130 and the second homogenizing lens 140 include a plurality of convex patterns, and each point light source included in the light source 110 can correspond to each convex pattern included in the first homogenizing lens 130 and the second homogenizing lens 140.

[0081] For example, light emitted from the first point light source 111 is converted into parallel light by the condenser lens 120, and then incident on the first convex pattern 131 of the first homogenizing lens 130. The light passing through the first convex pattern 131 of the first homogenizing lens 130 can then be incident on the first convex pattern 141 of the second homogenizing lens 140, homogenized, and then output. In this case, the distance between the first homogenizing lens 130 and the second homogenizing lens 140 can be set such that the focal plane of the light passing through the first convex pattern 131 of the first homogenizing lens 130 becomes the first convex pattern 141 of the second homogenizing lens 140.

[0082] Figure 6 This is a partial perspective view of a LiDAR system according to an embodiment of the present invention. Figure 7 This is a partial exploded view of a LiDAR system according to an embodiment of the present invention. Figure 8 This is a partially exploded view of a LiDAR device according to an embodiment of the present invention. Figures 6 to 8 The drive unit 500 of the LiDAR system 1000 is not shown in the diagram; that is, the LiDAR drive device 900, which will be described later.

[0083] Reference Figures 6 to 8The light emitting unit 100 and the light receiving unit 200 can be housed within the housing 50 of the LiDAR system 1000. As shown, a LiDAR system 1000 may include multiple light emitting units 100 and light receiving units 200. For example, a LiDAR system 1000 may include two pairs of light emitting units 100 and light receiving units 200, and these two pairs of light emitting units 100 and light receiving units 200 may be configured to face each other. Of these two pairs of light emitting units 100 and light receiving units 200, one pair of light emitting units 100 and light receiving units 200 may be used for medium distance (1000-1), while the other pair of light emitting units 100 and light receiving units 200 may be used for long distance (1000-2).

[0084] Multiple openings can be formed in the housing 50. Among the multiple openings, the first opening 51 can be configured to correspond to the window 250 and can be used as a channel for light emission and light reception. Among the multiple openings, the second opening 52 can be used as a channel for dissipating heat generated from the light emission unit 100 and the light reception unit 200 housed within the housing 50.

[0085] The number of first openings 51 can be less than the number of second openings 52, and the diameter of the first opening 51 can be greater than the diameter of the second opening 52. Since the first openings 51 are configured to correspond to the window 250, the number of first openings 51 formed in the housing 50 can be the same as the number of light emitting units 100 and light receiving units 200 housed in the housing 50.

[0086] The light emitting unit 100 and the light receiving unit 200 can be mounted on the base 600. The light emitting unit 100 is disposed on the side surface of the light receiving unit 200, and the light emitted from the light emitting unit 100 and the light incident on the light receiving unit 200 after being reflected from the object can both pass through the window 250.

[0087] Although not specifically shown, the light emitting unit 100 may include a substrate, a light source, optical components, a shielding component, and a diffusion component. The substrate may include a printed circuit board (PCB). The substrate may also be connected to a connector via a flexible PCB (FPCB). The light source is disposed on the substrate, and the substrate may include terminals. The light source may correspond to the light source 110 of the light emitting unit 100 described above. That is, the light source may include multiple emitters arranged in an array. The driving of the multiple emitters may be controlled individually or collectively. Alternatively, the light source may be an edge-emitting laser diode (EEL). The optical components may converge light emitted from the light source or redirect the optical path of light emitted from the light source. For example, when the light source is not positioned facing window 250, the optical components may redirect the optical path so that light emitted from the light source is emitted through window 250. The optical components may correspond to the condenser lens 120 of the light emitting unit 100 described above. The shielding component surrounds the substrate and the light source and may be referred to as a cover can, and may be made of a non-magnetic material to block electromagnetic interference (EMI). The diffusion component may be a diffusion lens or a diffuser. The diffusion component may be disposed in the optical path of light emitted from the light source. The diffusion component may correspond to the first light-diffusing lens 130 and the second light-diffusing lens 140 of the light-emitting unit 100 described above.

[0088] The light receiving unit 200 may include a sensor unit and a lens unit. The sensor unit may include a substrate, an image sensor 210 disposed on the substrate, and a microlens array disposed on the image sensor 210. The image sensor 210 can detect infrared or near-infrared light. The image sensor 210 can detect light of a specific wavelength within the infrared or near-infrared light. The lens unit may include a lens barrel, multiple lenses, a filter, and a lens shield. The image sensor 210 can detect light that has passed through the filter. The image sensor 210 can detect light within the wavelength band of the light source. Thus, the image sensor 210 detects light emitted from the light source and reflected from the object, thereby sensing 3D image information of the object.

[0089] As described above, the LiDAR system according to embodiments of the present invention can be a mechanical LiDAR system. Therefore, the LiDAR system according to embodiments of the present invention can be designed to rotate 360 ​​degrees via a drive unit.

[0090] The driving unit included in a LiDAR system according to embodiments of the present invention will be described in detail below. In this specification, the driving unit may also be referred to as a LiDAR driving device. Figures 6 to 8In the accompanying drawings, the LiDAR driving device 900 may be located at the lower part. The light emitting unit 100 and light receiving unit 200 included in the LiDAR system according to an embodiment of the present invention may also be referred to as a LiDAR device. Alternatively, at least a portion of the information generation unit 300 and control unit 400, the light emitting unit 100 and the light receiving unit 200 included in the LiDAR system according to an embodiment of the present invention may also be referred to as a LiDAR device.

[0091] Figure 9 This is a perspective view of a LiDAR driving device according to an embodiment of the present invention. Figure 10 This is a cross-sectional perspective view of a LiDAR driving device according to an embodiment of the present invention. Figure 11 This is a partial cross-sectional perspective view of a LiDAR driving device according to an embodiment of the present invention. Figure 12 These are views illustrating the arrangement shape of the FPCB (flexible printed circuit board) of a LiDAR driving device according to an embodiment of the present invention. Figures 13 to 16 are FPCBs of a LiDAR driving device according to an embodiment of the present invention. Figure 17 This is a partial perspective view of a LiDAR driving device according to an embodiment of the present invention.

[0092] Reference Figures 9 to 10 According to an embodiment of the present invention, a LiDAR drive device 900 includes a stator portion 910, a shaft 920, and a rotor portion 930. The shaft 920 is fixed relative to the stator portion 910, and the rotor portion 930 is rotatable relative to the fixed shaft 920. Although not shown in detail, magnets and coils are provided in the stator portion 910 and the rotor portion 930, and an interaction between the coils and magnets is generated by electricity applied by the coils, and the rotor portion 930 can rotate by the interaction between the coils and magnets.

[0093] The stator portion 910 is fixed to an object on which the LiDAR system 1000 is mounted, such as a vehicle, and the rotor portion 930 mounts the light emitting unit 100 and the light receiving unit 200 of the LiDAR system 1000 and can rotate together with the light emitting unit 100 and the light receiving unit 200.

[0094] According to an embodiment of the present invention, the stator portion 910 includes a first housing 911, a first printed circuit board (PCB) 912, a first retainer 913, and a first flexible printed circuit board (FPCB) 914. Furthermore, the rotor portion 930 includes a second housing 931, a second PCB 932, a second retainer 933, and a second FPCB 934.

[0095] like Figures 9 to 11As shown, a first PCB 912 is disposed on a first housing 911, and a second PCB 932 is disposed on a second housing 931. The first PCB 912 may be disposed on the outer surface of the first housing 911, and the second PCB 932 may be disposed on the outer surface of the second housing 931. That is, in a structure where a rotating coil and magnet are disposed within the internal space formed by the first housing 911 and the second housing 931, both the first PCB 912 and the second PCB 932 may be disposed outside the internal space formed by the first housing 911 and the second housing 931. For example, as... Figure 10 As shown, the first PCB 912, the first housing 911, the second housing 931, and the second PCB 932 are arranged sequentially from bottom to top, and the coil and magnet can be disposed between the first housing 911 and the second housing 931. In this specification, the first housing 911 is described as being disposed at the bottom and the second housing 931 as being disposed at the top by way of example, but this is for ease of description, and obviously the top and bottom can be reversed.

[0096] Here, the first PCB 912 may be disposed close to the object on which the LiDAR system 1000 is applied according to an embodiment of the present invention (e.g., the vehicle side), and the second PCB 932 may be disposed close to the light emitting unit 100 and the light receiving unit 200 included in the LiDAR system 1000 according to an embodiment of the present invention.

[0097] The aforementioned information generation unit 300 and control unit 400 can be configured separately from the LiDAR driving device 900 according to an embodiment of the present invention, implemented as separate PCBs on the light emitting unit 100 and light receiving unit 200 sides. Alternatively, some functions of the information generation unit 300 and control unit 400 can be performed in the first PCB 912 of the LiDAR driving device 900 according to an embodiment of the present invention. Alternatively, some functions of the information generation unit 300 and control unit 400 can be performed in the first PCB 912 or the second PCB 932 of the LiDAR driving device 900 according to an embodiment of the present invention.

[0098] For this purpose, communication between the first PCB 912 and the second PCB 932 is required. For example, control signals for controlling the optical transmitting unit 100 and the optical receiving unit 200 can be transmitted from the first PCB 912 toward the second PCB 932. Therefore, the first PCB 912 becomes the transmitting side, and the second PCB 932 becomes the receiving side; this can be referred to as the downlink. Conversely, electrical signals detected by the optical receiving unit 200 can be transmitted from the second PCB 932 toward the first PCB 912. Therefore, the second PCB 932 becomes the transmitting side, and the first PCB 912 becomes the receiving side; this can be referred to as the uplink.

[0099] According to an embodiment of the present invention, the shaft 920 can be fixed to the stator portion 910. For example, the shaft 920 is fixed to the first housing 911 of the stator portion 910 and can be disposed in the internal space formed by the first housing 911 and the second housing 931. In this way, the shaft 920 can be a fixed shaft.

[0100] According to an embodiment of the present invention, a first retainer 913 is configured to surround a shaft 920. The first retainer 913 may contact the outer peripheral surface of the shaft 920 and may be configured to be fixed to the outer peripheral surface of the shaft 920. Furthermore, a second retainer 933 is configured to surround the shaft 920 and the first retainer 913. The second retainer 933 may be configured to be spaced apart from the first retainer 913. The inner peripheral surface of the second retainer 933 may be configured to face the outer peripheral surface of the first retainer 913 and be spaced apart from the outer peripheral surface of the first retainer 913. Furthermore, the first retainer 913 is fixed together with the first housing 911 and the shaft 920, and the second retainer 933 may rotate together with the second housing 931.

[0101] According to an embodiment of the present invention, a first FPCB 914 is connected to a first PCB 912 and disposed along the outer peripheral surface of a first holder 913. A second FPCB 934 is connected to a second PCB 912 and disposed along the inner peripheral surface of a second holder 933. Therefore, the first FPCB 914 and the second FPCB 934 are configured to face each other and be spaced apart between the outer peripheral surface of the first holder 913 and the inner peripheral surface of the second holder 933.

[0102] In this case, such as Figures 12 to 1As shown in Figure 6, the first FPCB 914 includes a first metal pattern 9141 disposed along the outer peripheral surface of the first holder 913, and the second FPCB 934 includes a second metal pattern 9341 disposed along the inner peripheral surface of the second holder 933. Therefore, the first metal pattern 9141 and the second metal pattern 9341 serve as a metal ring according to a capacitive link scheme and can enable wireless communication between the first PCB 912 and the second PCB 932. Here, the first metal pattern 9141 and the second metal pattern 9341 can be copper foil patterns.

[0103] Therefore, according to embodiments of the present invention, since soldering for connecting the metal ring and resistors or wires is not required, a LiDAR drive device with improved manufacturability and high assemblability can be obtained. Furthermore, since the function of the metal ring is achieved using a metal pattern provided on the FPCB, the FPCB can be easily assembled onto the outer and inner circumferential surfaces of the retainer, without being limited by the shape and size of the retainer, thereby significantly improving manufacturability. Additionally, according to embodiments of the present invention, since the FPCB flexibly stretches with temperature changes, communication errors caused by the difference in thermal expansion coefficients between the metal ring and the retainer, which occurs in conventional embodiments using metal rings, can be prevented.

[0104] The LiDAR driving device 900 according to an embodiment of the present invention performs bidirectional communication. For this purpose, as... Figures 11 to 12 As shown, the first holder 913 may include a first lower holder 9131 and a first upper holder 9132 disposed on the first lower holder 9131, and the second holder 933 may include a second lower holder 9331 and a second upper holder 9332 disposed on the second lower holder 9331. Furthermore, the first FPCB 914 may include a first transmitting FPCB 914T connected to the transmitting portion of the first PCB 912 and a first receiving FPCB 914R connected to the receiving portion of the first PCB 912, and the second FPCB 934 may include a second transmitting FPCB 934T connected to the transmitting portion of the second PCB 932 and a second receiving FPCB 934R connected to the receiving portion of the second PCB 932.

[0105] In this configuration, the first transmitting FPCB 914T, the first receiving FPCB 914R, the second transmitting FPCB 934T, and the second receiving FPCB 934R can be represented as shown in Figures 13 to 16. Figures 13(a) and 14(b) show the front and rear surfaces of the first transmitting FPCB 914T, respectively; Figures 14(a) and 14(b) show the front and rear surfaces of the first receiving FPCB 914R, respectively; Figures 15(a) and 15(b) show the front and rear surfaces of the second transmitting FPCB 934T, respectively; and Figures 16(a) and 16(b) show the front and rear surfaces of the second receiving FPCB 934R, respectively.

[0106] As shown in Figures 13 to 16, each FPCB has a T-shaped form, wherein the vertical region (VR) of the T-shaped form is the region that connects to the PCB and extends to the retainer, and the horizontal region (HR) of the T-shaped form can be the region set along the retainer.

[0107] Each FPCB includes insulating layers 9142, 9342, ground layers 9143, 9343 disposed on the first surface of insulating layers 9142, 9342, and signal layers 9144, 9344 disposed on the second surface of insulating layers 9142, 9342, and the aforementioned metal patterns 9141, 9341 may be disposed on the first surface of insulating layers 9142, 9342.

[0108] On the second surface of insulating layers 9142 and 9342, signal connection patterns 9145 and 9345 are formed at the ends of the T-shape, signal layers 9144 and 9344 are formed along the vertical region of the T-shape, and signal layers 9144 and 9344 extend along the horizontal region of the T-shape.

[0109] On the first surfaces of insulating layers 9142 and 9342, ground layers 9143 and 9343 are formed along the vertical regions of the T-shape, and metal patterns 9141 and 9341 are disposed along the horizontal regions of the T-shape. In this case, vias t are formed in the horizontal regions of the T-shape of insulating layers 9142 and 9342, and signal layers 9144 and 9344 and metal patterns 9141 and 9341 can be electrically connected through vias t.

[0110] As described above, the second retainer 933 is configured to surround the first retainer 913. For ease of understanding, Figure 12 The first retainer 913 and the second retainer 933 are shown in a separate shape, but in the assembled state, the second retainer 933 can be arranged to surround the first retainer 913.

[0111] Therefore, the first transmitting FPCB 914T and the second receiving FPCB 934R can be configured to face each other and be spaced apart between the outer peripheral surface of the first holder 913 and the inner peripheral surface of the second holder 933, and the first receiving FPCB 914R and the second transmitting FPCB 934T can be configured to face each other and be spaced apart between the outer peripheral surface of the first holder 913 and the inner peripheral surface of the second holder 933.

[0112] As described above, the first holder 913 may include a first lower holder 9131 and a first upper holder 9132 disposed on the first lower holder 9131, and the second holder 933 may include a second lower holder 9331 and a second upper holder 9332 disposed on the second lower holder 9331. Therefore, the T-shaped horizontal region of the first transmitting FPCB 914T is disposed along the outer peripheral surface of the first upper holder 9132, the T-shaped horizontal region of the second receiving FPCB 934R is disposed along the inner peripheral surface of the second upper holder 9332, the T-shaped horizontal region of the first receiving FPCB 914R is disposed along the outer peripheral surface of the first lower holder 9131, and the T-shaped horizontal region of the second transmitting FPCB 934T may be disposed along the inner peripheral surface of the second lower holder 9331. That is, the first transmitting FPCB 914T and the second receiving FPCB 934R are configured to face each other and be spaced apart between the outer peripheral surface of the first upper holder 9132 and the inner peripheral surface of the second upper holder 9332, and the first receiving FPCB 914R and the second transmitting FPCB 934T can be configured to face each other and be spaced apart between the outer peripheral surface of the first lower holder 9131 and the inner peripheral surface of the second lower holder 9331.

[0113] In other words, the first upper metal pattern 9141T, which is the metal pattern of the first transmitting FPCB 914T, is disposed along the outer peripheral surface of the first upper holder 9132, the second upper metal pattern 9341R, which is the metal pattern of the second receiving FPCB 934R, is disposed along the inner peripheral surface of the second upper holder 9332, the first lower metal pattern 9141R, which is the metal pattern of the first receiving FPCB 914R, is disposed along the outer peripheral surface of the first lower holder 9131, and the second lower metal pattern 9341T, which is the metal pattern of the second transmitting FPCB 934T, can be disposed along the inner peripheral surface of the second lower holder 9331. Therefore, the first upper metal pattern 9141T, which is the metal pattern of the first transmitting FPCB 914T, and the second upper metal pattern 9341R, which is the metal pattern of the second receiving FPCB 934R, are configured to correspond to each other, and the first lower metal pattern 9141R, which is the metal pattern of the first receiving FPCB 914R, and the second lower metal pattern 9341T, which is the metal pattern of the second transmitting FPCB 934T, are configured to correspond to each other, so that wireless communication according to the capacitive link scheme can be performed.

[0114] Meanwhile, as described above, each FPCB includes: insulating layers 9142 and 9342; ground layers 9143 and 9343 disposed on the first surfaces of the insulating layers 9142 and 9342; and signal layers 9144 and 9344 disposed on the second surfaces of the insulating layers 9142 and 9342. Metal patterns 9141 and 9341 can be disposed on the first surfaces of the insulating layers 9142 and 9342. Therefore, a first lower metal pattern 9141R is disposed on the first surface of the insulating layer of the first receiving FPCB 914R, a first upper metal pattern 9141T is disposed on the first surface of the insulating layer of the first transmitting FPCB 914T, a second lower metal pattern 9341T is disposed on the first surface of the insulating layer of the second transmitting FPCB 934T, and a second upper metal pattern 9341R can be disposed on the first surface of the insulating layer of the second receiving FPCB 934R. Therefore, between the first upper holder 9132 and the second upper holder 9332, the first surface of the insulating layer of the first transmitting FPCB 914T and the second surface of the insulating layer of the second receiving FPCB 934R are configured to face each other, and between the first lower holder 9131 and the second lower holder 9331, the second surface of the insulating layer of the first receiving FPCB 914R and the first surface of the insulating layer of the second transmitting FPCB 934T can be configured to face each other.

[0115] at the same time, Figure 17 This is a schematic diagram of the shape of the second FPCB disposed on the second holder according to an embodiment of the present invention.

[0116] Reference Figure 17 The second upper retainer 9332 is disposed on the second lower retainer 9331. The second receiving FPCB 934R can be configured to surround the inner circumferential surface of the second upper retainer 9332, and the second sending FPCB 934T can be configured to surround the inner circumferential surface of the second lower retainer 9331. In this case, the second receiving FPCB 934R and the second upper retainer 9332, as well as the second sending FPCB 934T and the second lower retainer 9331, can be fixed by the fixing member 1800. For example, the fixing member 1800 can be a member with insulating and heat-insulating properties. For example, the fixing member 1800 can be a polyimide film. For example, the fixing member 1800 can be a heat-treated polyimide film. Therefore, after the second receiving FPCB 934R and the second sending FPCB 934T are wound according to the inner circumferential surface shape of the second upper retainer 9332 and the second lower retainer 9331, they are not only stably fixed, but can also stably withstand temperature changes. For example, the fixing member 1800 can be Kapton tape (polyimide tape).

[0117] Additionally, a washer 1810 may be provided between the second lower retainer 9331 and the second upper retainer 9332. Therefore, the load between the second lower retainer 9331 and the second upper retainer 9332 is distributed, and electromagnetic interference between the second lower retainer 9331 and the second upper retainer 9332 can be prevented.

[0118] Meanwhile, high-speed data communication technology is required between the object on which the LiDAR system is mounted (e.g., a vehicle) and the LiDAR device. Therefore, bidirectional communication between the vehicle and the LiDAR device is required, and as described above, both the first PCB 912 and the second PCB 932 must include both a transmitting part and a receiving part.

[0119] In this case, the length of the FPCB connected to the transmitting or receiving section of each PCB may affect the communication quality. In particular, in the downlink from the first PCB 912 to the second PCB 932, the communication error rate increases as the length of the second receiving FPCB 934R connected to the receiving section of the second PCB 932 increases.

[0120] Figure 18 The eye diagram test results are shown based on the length of the second receiving FPCB connected to the receiving portion of the second PCB.

[0121] exist Figure 18 In (a), the length of the second receiving FPCB connected to the receiving portion of the second PCB is 1.5 cm. Figure 18In (b), the length of the second receiving FPCB connected to the receiving portion of the second PCB is 3.5 cm, and... Figure 18 In (c), the length of the second receiving FPCB connected to the receiving portion of the second PCB is designed to be 5cm. Here, the length of the second receiving FPCB connected to the receiving portion of the second PCB refers to the length of the vertical region of the T-shape, that is, the length from the receiving portion of the second PCB to the front of the second upper holder.

[0122] Reference Figure 18 As can be seen from (a) to (c), as the length of the second receiving FPCB connected to the receiving part of the second PCB increases, the signal quality decreases, and therefore communication errors occur more frequently.

[0123] Therefore, in embodiments of the present invention, to minimize the length of the second receiving FPCB 934R connected to the receiving portion (Rx) of the second PCB 932, the second receiving FPCB 934R can be disposed on the second upper hold 9332 instead of the second lower hold 9331. Thus, the first transmitting FPCB 914T connected to the transmitting portion (Tx) of the first PCB 912 is disposed on the first upper hold 9132, the second transmitting FPCB 934T connected to the transmitting portion (Tx) of the second PCB 932 is disposed on the second lower hold 9331, and the first receiving FPCB 914R connected to the receiving portion (Rx) of the first PCB 912 can be disposed on the first lower hold 9131. Furthermore, an amplifier is also disposed on the second receiving FPCB connected to the receiving portion of the second PCB to improve signal quality.

[0124] Reference Figure 12 As shown in Figure 16(a), amplifier 940 is disposed on a second receiving FPCB 934R connected to the receiving portion of the second PCB 932. Amplifier 940 is a component that amplifies the signal transmitted from the transmitting portion of the first PCB 912 to the receiving portion of the second PCB 932. Amplifier 940 may be disposed on the second surface of the insulating layer 9342 of the second receiving FPCB 934R, on which the signal layer 9344 is disposed. Amplifier 940 may be disposed in the vertical region of the T-shape of the second receiving FPCB 934R. That is, amplifier 940 may be disposed between the second upper holder 9332 and the receiving portion of the second PCB 932. Therefore, when amplifier 940 is disposed close to the receiving portion of the second PCB 932, the signal received at the receiving portion of the second PCB 932 is amplified, thereby improving signal quality.

[0125] In particular, such as Figure 12As shown, amplifier 940 can be disposed between the upper surface of the second housing 931 and the lower surface of the second PCB 932. That is, amplifier 940 can be mounted on the upper surface of the second housing 931. According to an embodiment of the invention, due to the flexibility of the FPCB, the second receiving FPCB 934R can be bent according to the specific configuration of the LiDAR drive device 900. Therefore, amplifier 940 can be easily disposed on the upper surface of the second housing 931, close to the receiving portion of the second PCB 932, and can be mechanically supported. In this case, to support the bent FPCB, FPCB retainer 950 can also be disposed in the bent region of the FPCB. Therefore, the FPCB can be fixed in a stable shape.

[0126] At the same time, such as Figures 12 to 1 As shown in Figure 6, the first FPCB 914 and the second FPCB 934 may further include a passive component 960. The passive component 960 may include at least one of a resistor and a capacitor, but is not limited thereto. Although the passive component 960 is shown disposed on the second surface of the insulating layer where the signal layer is located, it is not limited thereto and may be disposed on the first surface opposite to the second surface, and electrically connected to the signal layer through a via in the insulating layer. The passive component 960 may be disposed on a metal pattern of at least one of the first FPCB 914 and the second FPCB 934, or may be disposed on a side surface of the metal pattern. Therefore, the passive component can be connected to the metal pattern without solder.

[0127] Figure 19 Table 1 shows the eye diagram test results before and after the amplifier was set on the second receiver FPCB connected to the receiver section of the second PCB.

[0128] Figure 19 (a) is the eye diagram test result before the amplifier is set on the second receiving FPCB connected to the receiving section of the second PCB, and Figure 19 (b) is the eye diagram test result after the amplifier is set on the second receiver FPCB connected to the receiver section of the second PCB.

[0129] [Table 1]

[0130] Reference Figure 19 As shown in (a) and (b) and Table 1, signal quality is improved when the amplifier is placed on the second receiving FPCB. Therefore, even when the length of the second receiving FPCB increases, the problem of increased communication error rate can be prevented.

[0131] Although embodiments have been described above, these are merely examples and do not limit the invention. Those skilled in the art will understand that various modifications and applications not illustrated above can be made without departing from the essential characteristics of these embodiments. For example, each element specifically shown in the embodiments can be modified. Furthermore, differences associated with such modifications and applications should be interpreted as being included within the scope of the invention as defined by the appended claims.

Claims

1. A LiDAR driving device, comprising: Stator section; A shaft is disposed on the stator portion; as well as The rotor portion is mounted on the shaft. The stator portion includes: a first housing; a first printed circuit board (PCB) disposed on the first housing; a first retainer configured to surround the axis; and a first flexible printed circuit board (FPCB) connected to the first PCB and disposed along the outer peripheral surface of the first retainer. The rotor portion includes: a second housing; a second PCB disposed on the second housing; a second retainer configured to surround the shaft and the first retainer; and a second FPCB connected to the second PCB and disposed along the inner circumferential surface of the second retainer. Wherein, the first FPCB and the second FPCB are configured to face each other and be spaced apart on the outer peripheral surface of the first holder and the inner peripheral surface of the second holder, respectively. The first FPCB includes a first metal pattern disposed along the outer peripheral surface of the first holder, and the second FPCB includes a second metal pattern disposed along the inner peripheral surface of the second holder.

2. The LiDAR driving device according to claim 1, in, The first FPCB includes a first transmitting FPCB connected to the transmitting portion of the first PCB and a first receiving FPCB connected to the receiving portion of the first PCB. The second FPCB includes a second transmitting FPCB connected to the transmitting portion of the second PCB and a second receiving FPCB connected to the receiving portion of the second PCB. Wherein, the first transmitting FPCB and the second receiving FPCB are configured to face each other and be spaced apart between the outer peripheral surface of the first holder and the inner peripheral surface of the second holder, and The first receiving FPCB and the second transmitting FPCB are configured to face each other and be spaced apart between the outer peripheral surface of the first holder and the inner peripheral surface of the second holder.

3. The LiDAR driving device according to claim 2, in, The second FPCB also includes an amplifier disposed on the second receiving FPCB.

4. The LiDAR driving device according to claim 3, in, The amplifier is positioned between the second PCB and the second retainer.

5. The LiDAR driving device according to claim 2, in, At least one of the first FPCB and the second FPCB includes at least one of a resistor and a capacitor.

6. The LiDAR driving device according to claim 2, in, The first transmitting FPCB, the first receiving FPCB, the second transmitting FPCB, and the second receiving FPCB all have a T-shaped form.

7. The LiDAR driving device according to claim 2, in, The first retainer includes a first lower retainer and a first upper retainer disposed on the first lower retainer. The second retainer includes a second lower retainer and a second upper retainer disposed on the second lower retainer. Wherein, the first transmitting FPCB is disposed along the outer peripheral surface of the first upper holder, and the second receiving FPCB is disposed along the inner peripheral surface of the second upper holder, and The first receiving FPCB is disposed along the outer peripheral surface of the first lower holder, and the second transmitting FPCB is disposed along the inner peripheral surface of the second lower holder.

8. The LiDAR driving device according to claim 7, in, The first metal pattern includes a first lower metal pattern disposed along the outer peripheral surface of the first lower holder and a first upper metal pattern disposed along the outer peripheral surface of the first upper holder. The second metal pattern includes a second lower metal pattern disposed along the inner circumferential surface of the second lower retainer and a second upper metal pattern disposed along the inner circumferential surface of the second upper retainer.

9. The LiDAR driving device according to claim 8, in, The first transmitting FPCB, the first receiving FPCB, the second transmitting FPCB, and the second receiving FPCB all include an insulating layer, a ground layer disposed on a first surface of the insulating layer, and a signal layer disposed on a second surface of the insulating layer. The first lower metal pattern is disposed on the first surface of the insulating layer of the first receiving FPCB. The first upper metal pattern is disposed on the first surface of the insulating layer of the first transmitting FPCB. The second lower metal pattern is disposed on the first surface of the insulating layer of the second transmitting FPCB, and The second upper metal pattern is disposed on the first surface of the insulating layer of the second receiving FPCB.

10. The LiDAR driving device according to claim 9, in, Between the first upper holder and the second upper holder, the first surface of the insulating layer of the first transmitting FPCB and the second surface of the insulating layer of the second receiving FPCB are configured to face each other, and Wherein, between the first lower holder and the second lower holder, the second surface of the insulating layer of the first receiving FPCB and the first surface of the insulating layer of the second sending FPCB are arranged to face each other.

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