Camera module

Abstract

The camera module includes a first body including a hole, a lens module coupled to the hole, and a substrate module disposed in the first body, wherein the substrate module includes a first substrate having an upper surface on which an image sensor facing the lens module in an optical axis direction is disposed, a second substrate disposed at a rear side of the first substrate, and an electronic component disposed on a rear surface of the first substrate, a recessed groove is disposed on an upper surface of the second substrate, and a metal layer is disposed in the groove, and a lower surface of the electronic component is in contact with an upper surface of the metal layer.

Description

Technical Field

[0001] This embodiment relates to a camera module. Background Technology

[0002] In recent years, miniature camera modules have been developed and widely used in small electronic products such as smartphones, laptops and game consoles.

[0003] With the increasing popularity of automobiles, miniature cameras are not only widely used in small electronic products, but also in vehicles. For example, vehicles are equipped with dashcam cameras for vehicle protection or to collect objective data on traffic accidents, rearview cameras to allow drivers to monitor blind spots behind the vehicle to ensure safety when reversing, and ambient detection cameras to monitor the surrounding environment of the vehicle.

[0004] The camera may include: a lens; the lens being coupled to the body; an image sensor that converts the image of the subject captured by the lens into an electrical signal; and a printed circuit board on which the image sensor is mounted. In addition to the image sensor, many other electronic components for driving the camera may also be located on the printed circuit board.

[0005] Electronic components generate heat during operation. Since the heat generated significantly affects the lifespan and operation of electronic components, heat dissipation measures are a fundamental factor that must be considered. Summary of the Invention

[0006] Technical issues

[0007] This embodiment aims to provide a camera module that can improve heat dissipation efficiency through structural improvements.

[0008] Technical solution

[0009] The camera module according to this embodiment includes: a first body, the first body including a hole; a lens module connected to the hole; and a substrate module disposed within the first body, wherein the substrate module includes: a first substrate, an image sensor facing the lens module in the optical axis direction is disposed on the upper surface of the first substrate; a second substrate disposed behind the first substrate; and an electronic component disposed on the rear surface of the first substrate, a concave groove is provided on the upper surface of the second substrate, a metal layer is provided in the groove, and the lower surface of the electronic component is in contact with the upper surface of the metal layer.

[0010] The cross-sectional area of ​​the metal layer can be larger than the cross-sectional area of ​​the electronic component.

[0011] This metal layer can be a grounded area.

[0012] A third substrate disposed between the first substrate and the second substrate may include holes for the electronic component to be disposed therein.

[0013] The cross-sectional area of ​​the hole can be larger than the cross-sectional area of ​​the electronic component, and the side surface of the electronic component can be spaced apart from the inner surface of the hole.

[0014] The camera module may include a first connection portion connecting the first substrate and the third substrate, and a second connection portion connecting the second substrate and the third substrate.

[0015] The cross-sectional area of ​​the first substrate can be larger than that of the second substrate.

[0016] The thickness of the third substrate can be greater than the thickness of the first substrate but less than the thickness of the second substrate.

[0017] The thickness of the electronic component can be greater than the thickness of the third substrate.

[0018] The camera module may include a second body connected to the rear of the first body and including a space for the substrate module to be disposed therein, and the second substrate may contact the second body.

[0019] Beneficial effects

[0020] In this embodiment, the driving heat of the image sensor, the first substrate, and the electronic components is directly transferred to the metal layer through the contact structure between the electronic components and the metal layer, thereby further improving the heat dissipation efficiency of the camera module.

[0021] In addition, by using a structure for accommodating electronic components through holes, the height of the substrate module in the optical axis direction can be reduced, thus enabling miniaturization. Attached Figure Description

[0022] Figure 1 This is a perspective view showing the appearance of a camera module according to an embodiment of the present disclosure.

[0023] Figure 2 This is an exploded perspective view showing a camera module according to an embodiment of the present disclosure.

[0024] Figure 3 This is a cross-sectional view showing a substrate module according to an embodiment of the present disclosure.

[0025] Figure 4 This is a cross-sectional view showing the connection structure of a first substrate, a second substrate, and a third substrate according to an embodiment of the present disclosure.

[0026] Figure 5This is a plan view showing the upper surface of a second substrate according to an embodiment of the present disclosure.

[0027] Figure 6 This is a plan view showing a third substrate according to an embodiment of the present disclosure. Detailed Implementation

[0028] Preferred embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0029] However, the technical concept of this disclosure is not limited to those in the first to third embodiments described, but can be implemented in various different forms, and within the scope of the technical concept of this disclosure, one or more of the components between the first to third embodiments can be selectively combined, replaced and used.

[0030] Furthermore, unless explicitly and specifically defined and described, the terms (including technical and scientific terms) used in the first to third embodiments can be interpreted as having a meaning that is generally understood by those skilled in the art to which the first to third embodiments pertain, and commonly used terms (such as terms defined in a dictionary) can be interpreted taking into account the contextual meaning of the relevant art.

[0031] Furthermore, the terminology used in the first to third embodiments is for describing the first to third embodiments and is not intended to limit this disclosure.

[0032] In this specification, unless otherwise specifically stated in the phrase, the singular may also include the plural, and when it is described as “at least one (or one or more) of A, B, C”, it may include one or more of all combinations that can be combined with A, B, C.

[0033] Furthermore, when describing the components of the first to third embodiments, terms such as first, second, A, B, (a), (b), etc., may be used. These terms are intended only to distinguish the components from other components and are not intended to limit the nature, order, or sequence of the components.

[0034] In addition, when a component is described as “connected,” “linked,” or “accessed” to another component, it can include not only cases where the component is directly “connected,” “linked,” or “accessed” to another component, but also cases where the component is “connected,” “linked,” or “accessed” through another component between the component and the other component.

[0035] Additionally, when described as being formed or positioned "above" or "below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or positioned between the two components. Furthermore, when expressed as "above" or "below," it may also include the meaning of a downward direction and an upward direction based on a component.

[0036] The term "optical axis direction" as used below is defined as the optical axis direction of the lens. "Optical axis direction" can also correspond to "vertical direction," "Z-axis direction," etc.

[0037] This disclosure will now be described in more detail with reference to the accompanying drawings.

[0038] Figure 1 This is a perspective view showing the appearance of a camera module according to an embodiment of the present disclosure. Figure 2 This is an exploded perspective view showing a camera module according to an embodiment of the present disclosure. Figure 3 This is a cross-sectional view showing a substrate module according to an embodiment of the present disclosure. Figure 4 This is a cross-sectional view showing the structure of the connection of the first substrate, the second substrate, and the third substrate according to an embodiment of the present disclosure. Figure 5 This is a plan view showing the upper surface of a second substrate according to an embodiment of the present disclosure, and Figure 6 This is a plan view showing a third substrate according to an embodiment of the present disclosure.

[0039] Reference Figures 1 to 6 According to one embodiment of this disclosure, the camera module 10 can be an in-vehicle camera module. The camera module 10 can be connected to a vehicle. The camera module 10 can be used in one or more of a front camera, side cameras, rear cameras, and a black box in the vehicle. The camera module 10 can be disposed at the front of the vehicle. The camera module 10 can be disposed at the rear of the vehicle. The camera module 10 can be connected to the windshield of the vehicle. The camera module 10 can be connected to the windshield at the front or rear of the vehicle. The camera module 10 can be disposed on the side of the vehicle. The camera module 10 can capture an image of an object and output it as an image to a display (not shown).

[0040] The camera module 10 may include a first body 100, a second body 200, a lens module 300, a substrate module 400, and a sealing member 900.

[0041] The camera module 10 may include a first body 100. The first body 100 may be referred to as any of the following: front body, front housing, upper housing, first housing, or front cover. The first body 100 may be positioned in front of the second body 200.

[0042] The first body 100 may include a main body portion 110 and a cylindrical portion 130. The main body portion 110 and the cylindrical portion 130 may be integrally formed.

[0043] The main body portion 110 can be disposed on the second body portion 200. The main body portion 110 can be connected to the second body portion 200. The lower end of the main body portion 110 can be fixed to the second body portion 200. A connecting portion 120, which protrudes further rearward than other areas, can be formed on the rear side of the main body portion 110. Multiple connecting portions 120 can be provided, and each connecting portion can be disposed in the four corner areas of the main body portion 110. Threaded holes for screws can be formed on the rear side of the connecting portion 120. The connecting portion 120 can be connected to a connecting groove 230 of the second body portion 200, which will be described later. The connecting portion 120 can be screwed into the connecting groove 230.

[0044] The main body portion 110 can be formed into a rectangular shape with an open bottom. The corners of the main body portion 110 can be formed into rounded shapes. The main body portion 110 may include an upper plate 112 and a first side plate 114 extending downward from the edge of the upper plate 112. The upper plate 112 can be formed into a rectangular shape. The upper plate 112 can extend outward from the lower outer surface of the cylindrical portion 130. The first side plate 114 can extend downward from the outer peripheral edge of the upper plate 112. A plurality of first side plates 114 may be provided. The first side plate 114 may include four side plates. The first side plate 114 can be formed into a rectangular plate shape. The first side plate 114 may include a first-1 side plate and a first-2 side plate, a first-3 side plate disposed opposite to the first-1 side plate, and a first-4 side plate disposed opposite to the first-2 side plate. The first side plate 114 may include first-1 corner portions to first-4 corner portions respectively disposed between the first-1 side plate and the first-4 side plate. At least a portion of each of the first-1 corners to the first-4 corners may have a circular shape.

[0045] The inner side of the main body 110 may have a space separate from other areas. This space may have an open bottom and an upper part, the upper part being covered by the lower surface of the cylindrical part 130 and the lens module 300.

[0046] The main body 110 may include a guide (not shown). This guide may have a shape that projects downward from the lower surface of the upper plate 112. This guide may contact the upper surface of the substrate module 400. This guide may contact the upper surface of the first substrate 410 of the substrate module 400, which will be described later. The substrate module 400 may be supported within the space of the camera module 10 by the guide.

[0047] A cylindrical portion 130 may be disposed on the main body portion 110. The cylindrical portion 130 may have a circular cross-sectional shape. The cylindrical portion 130 may have a shape that protrudes upward from the upper surface of the upper plate 120. The cylindrical portion 130 may house a lens module 300. A hole 132 to which the lens module 300 is connected may be formed at the center of the cylindrical portion 130. The space within the hole 132 may communicate with the space within the main body portion 110. The lens module 300 may be connected to the hole 132 of the cylindrical portion 130.

[0048] The camera module 10 may include a second body 200. The second body 200 may be referred to as a rear body, rear housing, lower housing, second housing, or rear cover. The second body 200 may be formed in a rectangular shape with an open top. The second body 200 may be formed of a metallic material. The second body 200 may be disposed below the first body 100. The second body 200 may be coupled to the first body 100. The second body 200 may form an internal space by being coupled to the first body 100. The second body 200 may include a spatial portion 202 with an open upper surface.

[0049] The second body 200 may include a base plate 220. The base plate 220 may face the upper plate 112 of the first body 100 in the optical axis direction. The base plate 220 may be spaced apart from the upper plate 112 of the first body 100 in the optical axis direction. The base plate 220 may be parallel to the upper plate 112 of the first body 100. The base plate 220 may be formed in a square shape. In this case, at least a portion of the corners of the base plate 220 may include a circular shape.

[0050] The second body 200 may include a second side plate 210. The second side plate 210 may extend from the base plate 220. The second side plate 210 may extend upward from the outer edge of the base plate 220. A shielding member (not shown) may be disposed on the second side plate 210. The shielding member may be in surface contact with the inner surface of the second side plate 210. The upper end of the second side plate 210 may be connected to the first body 100. The upper surface of the second side plate 210 may be configured to face the lower surface of the first side plate 114 in the optical axis direction. The upper surface of the second side plate 210 may be in contact with the lower surface of the first side plate 114. The first side plate 114 and the second side plate 210 may be joined together by at least one of welding, bonding, and fusion. The outer surface of the second side plate 210 may be disposed on the same plane as the outer surface of the first side plate 114 of the first body 100. The sealing member 900 is disposed between the first side plate 114 and the second side plate 210, thereby preventing foreign objects from entering the space inside the camera module 10 through the space between the first side plate 114 and the second side plate 210.

[0051] A connecting groove 230 may be formed on the upper surface of the second body 200. Compared with other areas, the connecting groove 230 may have a shape that is recessed from the upper surface of the second body 200 toward the rear. Multiple connecting grooves 230 may be provided, and each connecting groove 230 may be provided in the four corner areas of the second body 200. The connecting portion 120 of the first body 100 may be connected to the connecting groove 230. A threaded hole is formed on the bottom surface of the connecting groove 230, and a screw may pass through the threaded hole of the second body 200 and be screwed into the threaded hole formed on the lower surface of the connecting portion 120 of the first body 100.

[0052] The second body 200 may include a connector pull-out portion (not shown). This connector pull-out portion may have a shape that protrudes downwards from the lower surface of the base plate 220. A connector 490, described later, may be disposed inside the connector pull-out portion. The connector pull-out portion may be formed of a metallic material. The interior of the connector pull-out portion may be hollow and tubular. A sealing member (not shown) is disposed between the inner surface of the connector pull-out portion and the outer surface of the connector 490 to prevent external foreign objects from entering the space inside the camera module 10.

[0053] The camera module 10 may include a lens module 300. The lens module 300 may be coupled to the first body 100. The lens module 300 may be coupled to a hole 132 in the cylindrical portion 130. The lens module 300 may be configured such that at least a portion of it is disposed inside the cylindrical portion 130, and the remainder protrudes upward from the first body 100.

[0054] The lens module 300 may include a lens barrel 310 and one or more lenses 330 housed within the lens barrel 310. The lens barrel 310 may include a cylindrical shape having an open top surface and a bottom surface. A space for accommodating the lenses 330 may be formed inside the lens barrel 310. A flange 320 is disposed on the side of the lens barrel 310 and has a shape that projects outward from other areas, and when the lens module 300 is connected to the first body 100, the lower surface of the flange 320 may be configured to face the upper surface of the cylindrical portion 130 of the first body 100 in the optical axis direction. A sealing member (not shown) is provided between the lower surface of the flange 320 and the upper surface of the cylindrical portion 130 to prevent external foreign objects from entering the space inside the camera module 10.

[0055] Lens 330 can be disposed within the space inside lens barrel 310. Lens 330 can be configured to face image sensor 412, which will be described later, located inside substrate module 400, in the optical axis direction. Lens 330 can be aligned with image sensor 412 in the optical axis direction. Multiple lenses 330 can be provided and disposed spaced apart from each other in the optical axis direction within lens barrel 310. Among the multiple lenses 330, the outermost lens can be exposed upward from camera module 10 through an opening formed in lens barrel 310.

[0056] The camera module 10 may include a substrate module 400. The substrate module 400 may be disposed within the space of the camera module 10. The substrate module 400 may be disposed between the first body 100 and the second body 200.

[0057] The substrate module 400 may include a first substrate 410, a second substrate 430 and a third substrate 450.

[0058] The first substrate 410 may be a printed circuit board (PCB). The first substrate 410 may be formed in a plate shape. An image sensor 412 may be disposed on the upper surface of the first substrate 410. The image sensor 412 may be positioned facing the lens 330 in the optical axis direction. The image sensor 412 may be soldered to the first substrate 410 using solder balls. The first substrate 410 may have a first thickness t1.

[0059] The second substrate 430 may be disposed behind the first substrate 410. The second substrate 430 may be a printed circuit board (PCB). The second substrate 430 may be disposed spaced apart from the first substrate 410 in the optical axis direction. A connector 490 may be disposed on the rear surface of the second substrate 430. The connector 490 may be soldered to the rear surface of the second substrate 430. A plurality of electronic components 482, 484 may be disposed on the surface of the second substrate 430. For example, the upper electronic component 482 may be disposed on the upper surface of the second substrate 430 facing the first substrate 410, while the lower electronic component 484 may be disposed on the rear surface of the second substrate 430. The upper electronic component 482 and the lower electronic component 484 may each be soldered to the surface of the second substrate 430.

[0060] The second substrate 430 may have a second thickness t2 that is greater than the first thickness t1 of the first substrate 410. The cross-sectional area of ​​the second substrate 430 may be greater than the cross-sectional area of ​​the first substrate 410 and the cross-sectional area of ​​the third substrate 450.

[0061] A first pad 431 may be disposed on the upper surface of the second substrate 430. The first pad 431 is used for electrical connection with the third substrate 450 and may be a metal pad. Multiple first pads 431 may be provided in various quantities, and they may be disposed along the periphery of a centrally located metal layer 433, such as... Figure 5 As shown.

[0062] A metal layer 433 may be disposed on the second substrate 430. The metal layer 433 may have a ground power supply. Because the metal layer 433 has a ground power supply, it may be referred to as a ground layer or ground portion. As another example, the metal layer 433 may be referred to as a metal pad. The metal layer 433 may be a pad made of a metallic material. In this case, a groove for connecting the metal layer 433 may be formed on the upper surface of the second substrate 430. This groove may have a shape that is recessed downwards on a portion of the upper surface of the second substrate 430. The cross-sectional area of ​​the groove may correspond to the cross-sectional area of ​​the metal layer 433. Alternatively, the cross-sectional area of ​​the groove may be formed to be larger than the cross-sectional area of ​​the metal layer 433, and a connection device such as a molding member (not shown) or an adhesive member (not shown) may be provided between the inner surface of the groove and the side surface of the metal layer 433.

[0063] The upper surface of the metal layer 433 may be coplanar with the upper surface of the second substrate 430. The cross-sectional area of ​​the metal layer 433 may be larger than the cross-sectional area of ​​the electronic component 460, which will be described later. The upper surface of the metal layer 433 may be in contact with the lower surface of the electronic component 460, which will be described later.

[0064] As another example, the metal layer 433 may be an area within the second substrate 430 where the copper foil is exposed upwards. The third substrate 450 may be disposed between the first substrate 410 and the second substrate 430.

[0065] The third substrate 450 may be a printed circuit board (PCB). The third substrate 450 may be electrically connected to the first substrate 410 and the second substrate 430. A first connection portion 472 may be disposed between the first substrate 410 and the third substrate 450. A second connection portion 474 may be disposed between the second substrate 430 and the third substrate 450. The first connection portion 472 and the second connection portion 474 may each be a soldering area for electrically and physically connecting the first substrate 410 and the third substrate 450, and the second substrate 430 and the third substrate 450, respectively.

[0066] The third substrate 450 may have a third thickness t3, which is greater than the thickness t1 of the first substrate 410 but less than the thickness t2 of the second substrate 430. The cross-sectional area of ​​the third substrate 450 may be smaller than the cross-sectional area of ​​the first substrate 410.

[0067] like Figure 6 As shown, the second pad 456 can be disposed on the upper or lower surface of the third substrate 450. The second pad 456 is used for electrical connection with the first substrate 410 or the second substrate 430, and can be a metal pad. Multiple second pads 456 can be provided, and the multiple second pads 456 can be disposed around the periphery of the central hole 452, such as... Figure 6 As shown.

[0068] The substrate module 400 may include an electronic component 460. The electronic component 460 may be disposed on the lower surface of the first substrate 410. The electronic component 460 may be soldered to the lower surface of the first substrate 410. The electronic component 460 may be electrically connected to the first substrate 410 via a third connection portion 476. The electronic component 460 may be a communication chip for transmitting images acquired from the image sensor 412 to an external device via a connector 490.

[0069] The third substrate 450 may include a hole 452 in which at least a portion of the electronic component 460 is disposed. The hole 452 may be shaped to penetrate from the upper surface to the lower surface of the third substrate 450. The cross-sectional area of ​​the hole 452 may be larger than the cross-sectional area of ​​the electronic component 460. Therefore, the sides of the electronic component 460 may be spaced apart in a direction perpendicular to the inner surface of the hole 452 and the optical axis direction.

[0070] Electronic component 460 may be configured as a through-hole 452. The lower surface of electronic component 460 may contact the upper surface of metal layer 433. Therefore, heat from the first substrate 410 and heat from electronic component 460 may be conducted to metal layer 433 and the second substrate 430, thereby allowing heat dissipation.

[0071] The cross-sectional area of ​​the electronic component 460 can be smaller than the cross-sectional area of ​​the metal layer 433. The lower surface of the electronic component 460 can have a stepped portion located below the lower surface of the third substrate 450. The thickness of the electronic component 460 can be greater than the thickness t3 of the third substrate 450.

[0072] According to the above structure, the driving heat of the image sensor 412, the first substrate 410 and the electronic component 460 is directly transferred to the metal layer 433 through the hole 452 using the contact structure of the electronic component 460, thus having the advantage of further improving the heat dissipation efficiency of the camera module 10.

[0073] In addition, the structure for accommodating electronic components 460 through holes 452 allows the height of the substrate module 400 in the optical axis direction to be reduced, thereby providing the advantage of miniaturization.

[0074] Meanwhile, a guide (not shown) for supporting the second substrate 430 is formed on the inner surface of the second body 200 facing the second substrate 430, so that heat can be more easily discharged to the outside through the contact structure between the second substrate 430 and the second body 200.

[0075] In addition, other electronic components 461 besides electronic component 460 can be disposed on the rear surface of the first substrate 410 and can be accommodated in these other electronic components 461 or holes 452.

[0076] Although all components constituting embodiments of this disclosure have been described as being combined or operated in combination, this disclosure is not necessarily limited to such embodiments. In other words, all such components may be selectively combined and operated in one or more ways within the scope of the purposes of this disclosure. Furthermore, unless specifically stated otherwise, terms such as “comprising,” “forming,” or “having” described above mean that the relevant components may be inherent; therefore, they should be interpreted as allowing the inclusion of other components rather than excluding them. Unless otherwise defined, all terms (including technical or scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Unless expressly defined in this disclosure, commonly used terms (such as those predefined) should be interpreted according to their meaning in the context of the relevant art and should not be interpreted in an ideal or overly formal sense.

[0077] The foregoing description is merely an illustrative explanation of the technical concept of this disclosure, and those skilled in the art will be able to make various modifications and changes within the scope of the basic features of this disclosure. Therefore, the embodiments disclosed herein are intended to explain, not limit, the technical concept of this disclosure, and the scope of the technical concept of this disclosure is not limited by these embodiments. The scope of protection of this disclosure should be interpreted by the following claims, and all technical concepts within the equivalent scope should be interpreted as being included within the scope of the rights of this disclosure.

Claims

1. A camera module, comprising: A first body, the first body including a hole; The lens module is connected to the hole; as well as The substrate module is disposed within the first main body. The substrate module includes: A first substrate has an image sensor disposed on its upper surface, the image sensor facing the lens module in the optical axis direction; A second substrate is disposed behind the first substrate; and Electronic components are disposed on the rear surface of the first substrate. The concave groove is disposed on the upper surface of the second substrate and includes a metal layer disposed in the groove. The lower surface of the electronic component is in contact with the upper surface of the metal layer.

2. The camera module according to claim 1, in, The cross-sectional area of ​​the metal layer is larger than the cross-sectional area of ​​the electronic component.

3. The camera module according to claim 1, in, The metal layer is a grounded area.

4. The camera module according to claim 1, further comprising: A third substrate is disposed between the first substrate and the second substrate. The third substrate includes holes for the electronic components to be disposed therein.

5. The camera module according to claim 4, in, The cross-sectional area of ​​the hole is larger than the cross-sectional area of ​​the electronic component, and One side of the electronic component is spaced apart from the inner surface of the hole.

6. The camera module according to claim 4, further comprising: The first connecting portion connects the first substrate and the third substrate, and The second connection portion connects the second substrate and the third substrate.

7. The camera module according to claim 4, in, The cross-sectional area of ​​the second substrate is larger than that of the first substrate.

8. The camera module according to claim 4, in, The thickness of the third substrate is greater than the thickness of the first substrate but less than the thickness of the second substrate.

9. The camera module according to claim 4, in, The thickness of the electronic component is greater than the thickness of the third substrate.

10. The camera module according to claim 1, further comprising: The second body is connected to the rear of the first body and includes space for the substrate module to be disposed therein. The second substrate is in contact with the second body.

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