Anti-shake camera module with photosensitive chip

Abstract

The application provides a photosensitive chip anti-shake camera module, which comprises a photosensitive part, a movable part, a fixed part and a driving part. The movable part comprises a first movable member and a second movable member. The photosensitive part is fixed to the first movable member. The second movable member is arranged above the first movable member and moves to drive the first movable member to move. The first movable member and the second movable member are movably installed on the fixed part. The driving part comprises a first driving part and a second driving part. The first driving part is located on opposite sides of a first axis perpendicular to the optical axis. The second driving part is located on opposite sides of a second axis perpendicular to the optical axis and the first axis. The first driving part is connected with the first movable member and the second movable member and drives the first movable member to move along the first axis relative to the second movable member and the fixed part. The second driving part is connected with the second movable member and the fixed part and drives the second movable member to drive the first movable member to move along the second axis relative to the fixed part.

Description

Photosensitive chip anti-shake camera module Technical Field

[0001] The present application relates to the field of camera modules, and more specifically to a photosensitive chip anti-shake camera module. Background Art

[0002] Camera modules are an essential component of mobile electronic devices. With the advancement of camera module technology, user demands for these modules are becoming increasingly sophisticated and demanding. The development of camera products must not only meet high performance requirements but also meet the requirements for miniaturization, lightness, and compactness.

[0003] The camera module consists of a lens, a motor, and a photosensitive component. Light passes through the lens and reaches the photosensitive component, where it is received by the photosensitive chip. The motor is used to drive the lens or photosensitive component to adjust its position.

[0004] To further improve image quality and enable more imaging functions, camera modules typically include autofocus (AF) and optical image stabilization (OIS). These functions require a motor to drive the lens, which has a certain weight, requiring the motor to have sufficient driving force to drive the lens. Furthermore, as image quality requirements increase, the number of optical lenses increases, and their weight increases, requiring a corresponding increase in motor driving force, resulting in an increase in motor size, which is contrary to the compactness requirement of the camera module.

[0005] Currently, there are also camera modules that achieve optical image stabilization by moving the photosensitive chip. Since the size and weight of the photosensitive chip are smaller than the lens, the driving force required for the motor is lower, which helps to reduce the size of the motor and the space it occupies, thereby making the camera module more miniaturized and compact. If the motor is in the form of a voice coil motor, it includes magnets and coils, and has a certain volume, resulting in the photosensitive part of the camera module being too large. In addition, the motor carrier and the photosensitive chip need to be fixedly connected to cause the photosensitive chip to move, which may cause damage to the photosensitive chip. If the motor carrier and the photosensitive chip are connected by contact, the movement of the photosensitive chip becomes unreliable. Summary of the Invention

[0006] One advantage of the present application is that it provides a photosensitive chip anti-shake camera module, which uses shape memory alloys (shape memory alloys) to generate driving force to achieve a photosensitive chip displacement optical image stabilization function.

[0007] One advantage of the present application is that it provides a photosensitive chip anti-shake camera module, which eliminates the magnets and coils of the voice coil motor, reduces the volume of the photosensitive chip anti-shake camera module, and meets the miniaturization and compactness requirements of the camera module.

[0008] One advantage of the present application is that it provides a photosensitive chip anti-shake camera module, whose driving part includes a first driving part and a second driving part. The first driving part and the second driving part are distributed along a direction perpendicular to the optical axis to drive the photosensitive part to move along the direction perpendicular to the optical axis to realize the photosensitive chip displacement optical anti-shake function, reduce the requirements for driving force, and improve the anti-shake effect.

[0009] One advantage of the present application is that it provides a photosensitive chip anti-shake camera module, which includes a movable part and a fixed part. The movable part and the fixed part are connected by a shape memory alloy wire to promote the movable part to move relative to the fixed part, thereby simplifying the driving structure.

[0010] One advantage of the present application is that it provides a photosensitive chip anti-shake camera module, in which the photosensitive portion of the photosensitive chip anti-shake camera module is mounted on a movable portion and moves with the movement of the movable portion.

[0011] One advantage of the present application is that it provides a photosensitive chip anti-shake camera module, in which the first movable part is molded on the photosensitive circuit board of the photosensitive part, and the photosensitive chip is mounted on the photosensitive circuit board, so that the photosensitive chip and the movable part are indirectly fixedly connected to avoid damage to the photosensitive chip.

[0012] One advantage of the present application is that it provides a photosensitive chip anti-shake camera module, in which the photosensitive chip is fixedly connected to the associated parts through a photosensitive circuit board, thereby avoiding the size of the photosensitive chip being limited by the size of the associated parts, which is conducive to the installation of large-size photosensitive chips and improves the performance of the camera module.

[0013] One advantage of the present application is that it provides a photosensitive chip anti-shake camera module, in which the circuit board also includes a peripheral portion of the circuit board and an elastic portion. The elastic portion elastically connects the peripheral portion of the circuit board and the associated portion. There is a gap between the remaining portion of the photosensitive circuit board and the peripheral portion of the circuit board and the elastic portion to avoid affecting the deformation of the elastic portion, reduce friction, and improve the flexibility of the anti-shake movement.

[0014] One advantage of the present application is that it provides a photosensitive chip anti-shake camera module, wherein the fixing portion includes a base, and the base is located on the periphery of the first movable part, thereby avoiding a stacked arrangement that increases the height of the photosensitive chip anti-shake camera module.

[0015] One advantage of the present application is that it provides a photosensitive chip anti-shake camera module, in which the first movable part is directly driven to move along the first axis, and the second movable part is directly driven to move along the second axis, so as to avoid crosstalk between the translational movements of the first axis and the second axis.

[0016] One advantage of the present application is that it provides a photosensitive chip anti-shake camera module, in which the movable part includes a first guide part and a second guide part that are staggered up and down, thereby avoiding mutual interference between the two layers of the guide structure and improving the guidance accuracy.

[0017] One advantage of the present application is that it provides a photosensitive chip anti-shake camera module, in which the driving part also includes a connector, which is coupled to the shape memory alloy wire to achieve fixation and conductivity, so that electricity can be applied to the shape memory alloy wire through the connector to adjust the length of the shape memory alloy wire, thereby causing the movable part to move.

[0018] One advantage of the present application is that it provides a photosensitive chip anti-shake camera module, in which the first movable part also includes a built-in metal part, and the metal part and the connecting part are conductively connected, thereby conducting the circuit board and the driving part of the camera module to achieve power transmission, and the built-in conductive structure saves internal space, which is conducive to reducing the volume of the camera module.

[0019] According to one aspect of the present application, the present application provides a photosensitive chip anti-shake camera module, comprising:

[0020] The photosensitive portion defines an optical axis;

[0021] a movable portion, the movable portion comprising a first movable member and a second movable member, the photosensitive portion being fixed to the first movable member, and the second movable member being disposed above the first movable member;

[0022] a fixed portion on which the first movable member and the second movable member are movably mounted; and

[0023] The driving part includes a first driving part and a second driving part, the first driving part is located on opposite sides of a first axial direction perpendicular to the optical axis, and the second driving part is located on opposite sides of a second axial direction perpendicular to the optical axis and the first axial direction, the first driving part connects the first movable part and the second movable part, and drives the first movable part to perform translational motion along the first axial direction relative to the second movable part and the fixed part, and the second driving part connects the second movable part and the fixed part, and drives the second movable part to drive the first movable part to perform translational motion along the second axial direction relative to the fixed part.

[0024] According to an example of the present application, the photosensitive chip anti-shake camera module includes a first guide portion, which is arranged between the second movable part and the first movable part, and the first guide portion is configured to guide the first movable part to perform translational movement along the first axis.

[0025] According to an example of the present application, the first guide portion includes a first guide groove and a first ball, the first guide groove is arranged in one of the first movable part and the second movable part, and the first ball is placed in the first guide groove, wherein the first guide portion has a length extending along the first axial direction.

[0026] According to an example of the present application, the photosensitive chip anti-shake camera module also includes a shell, which is installed on the fixed part and covers the second movable part, wherein a second guide part is provided between the second movable part and the shell, and the second guide part is configured to guide the second movable part to perform translational movement along the second axis.

[0027] According to an example of the present application, the second guide portion includes a second guide groove and a second ball, the second guide groove is provided on the second movable part and has a length extending along the second axial direction, and the second ball is placed in the second guide groove.

[0028] According to an example of the present application, the photosensitive portion includes a photosensitive circuit board and a photosensitive chip, the first movable part is integrally formed on the outer periphery of the photosensitive circuit board, and the photosensitive chip is mounted on the photosensitive circuit board.

[0029] According to an example of the present application, the fixed part includes a peripheral part of the circuit board, the movable part includes an elastic part and an associated part, the elastic part connects the peripheral part of the circuit board and the associated part, and the associated part and the photosensitive circuit board are fixedly connected.

[0030] According to an example of the present application, each part of the driving part includes at least two first connecting members, at least one second connecting member and a shape memory alloy wire, the first connecting member is installed on the second movable member, and the shape memory alloy wire connects the first connecting member and the second connecting member, wherein the first connecting member is installed on the second movable member, the second connecting member of the first driving part is installed on the first movable member, and the second connecting member of the second driving part is installed on the fixed part.

[0031] According to an example of the present application, the shape memory alloy wire of each portion includes a first shape memory alloy wire and a second shape memory alloy wire, which cross in a direction perpendicular to the optical axis to be controlled to extend or contract respectively.

[0032] According to an example of the present application, at least two first connecting members are symmetrically arranged on both sides of the second connecting member to respectively fix one end of the first shape memory alloy wire and the second shape memory alloy wire, and the other ends of the first shape memory alloy wire and the second shape memory alloy wire are fixed to the second connecting member.

[0033] According to an example of the present application, the first connector includes a first connector body and a first coupling portion, the first coupling portion is formed by extending outward from the first connector body, the second connector includes a second connector body and at least two second coupling portions, at least two second coupling portions extend outward from the same side of the second connector body, wherein the first coupling portion and the second coupling portion of each part of the driving portion are oriented in opposite directions.

[0034] According to an example of the present application, the fixing portion includes a base having a first window, the first movable member is installed on the first window, and the second connecting member of the second driving portion is installed on the base.

[0035] According to an example of the present application, the second movable part includes two first sides opposite to each other along the first axial direction and two second sides opposite to each other along the second axial direction, and a corner part connecting the first side parts and the second side parts, the first connecting part is installed at the corner part, and the second side part is closer to the optical axis than the first side part.

[0036] According to an example of the present application, the first movable part includes a second mounting protrusion relatively distributed along the first axial direction, the second mounting protrusion is located on the inner side of the first side portion, the second connecting part of the first driving part is installed on the second mounting protrusion, and the second coupling part faces the base.

[0037] According to an example of the present application, the base includes a first mounting protrusion relatively distributed along the second axial direction, the first mounting protrusion is located on the outside of the second side portion, the second connecting member of the second driving part is installed on the first mounting protrusion, and the second coupling part faces the first movable part.

[0038] According to an example of the present application, the second movable part is provided with a metal part, the metal part is built into the second movable part, the metal part is conductively connected to the first connecting part, and is conductively connected to the first shape memory alloy wire and the second shape memory alloy wire.

[0039] According to an example of the present application, the first shape memory alloy wire of each part and the second shape memory alloy wire of each part generate a force pointing in a clockwise or counterclockwise direction around the optical axis, driving the movable part to rotate the photosensitive part around the optical axis to prevent shaking. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] FIG1A is a top perspective diagram of the overall structure of an embodiment of a photosensitive chip anti-shake camera module according to the present application.

[0041] FIG1B is a schematic bottom perspective view of the overall structure of an embodiment of a photosensitive chip anti-shake camera module according to the present application.

[0042] FIG2 is an exploded schematic diagram of an embodiment of a photosensitive chip anti-shake camera module according to the present application.

[0043] FIG3A is a schematic cross-sectional view and a partially enlarged view of the internal structure of an embodiment of a photosensitive chip anti-shake camera module according to the present application.

[0044] FIG3B is a cross-sectional schematic diagram of an embodiment of a photosensitive chip anti-shake camera module according to the present application.

[0045] FIG3C is a schematic diagram of a conductive structure of an embodiment of a photosensitive chip anti-shake camera module according to the present application.

[0046] FIG4A is another exploded schematic diagram of an embodiment of a photosensitive chip anti-shake camera module according to the present application.

[0047] FIG4B is a schematic structural diagram of the first movable part and the photosensitive portion of an embodiment of the photosensitive chip anti-shake camera module according to the present application.

[0048] FIG4C is another schematic cross-sectional view of an embodiment of the photosensitive chip anti-shake camera module according to the present application.

[0049] FIG5A is a schematic diagram showing the installation of a driving unit in a photosensitive chip anti-shake camera module according to an embodiment of the present application.

[0050] FIG5B is a schematic diagram of a specific installation structure of a driving unit according to an embodiment of a photosensitive chip anti-shake camera module of the present application.

[0051] FIG6A is a schematic diagram showing movement along the X-axis of an embodiment of a photosensitive chip anti-shake camera module according to the present application.

[0052] FIG6B is a schematic diagram of the movement along the Y-axis of an embodiment of the photosensitive chip anti-shake camera module according to the present application.

[0053] FIG6C is a schematic diagram of an implementation of a guide portion of an embodiment of a photosensitive chip anti-shake camera module according to the present application.

[0054] FIG7A is a schematic diagram of a clockwise rotation of an embodiment of a photosensitive chip anti-shake camera module according to the present application.

[0055] FIG7B is a schematic diagram of the counterclockwise rotation of an embodiment of the photosensitive chip anti-shake camera module according to the present application.

[0056] FIG8 is a schematic diagram of implementing closed-loop anti-shake motion control according to an embodiment of the photosensitive chip anti-shake camera module of the present application. DETAILED DESCRIPTION

[0057] The following description is intended to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are for illustrative purposes only, and those skilled in the art will readily appreciate other obvious variations. The basic principles of the present invention defined in the following description may be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0058] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0059] It is understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the elements may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0060] The present application provides a photosensitive chip anti-shake camera module that uses shape memory alloys (SMA) to drive the photosensitive chip to move, thereby realizing mobile optical image stabilization of the photosensitive chip. Referring to the schematic diagrams of Figures 1A to 8 of the specification, a shape memory alloy wire (SMA wire) is connected between the movable part and the fixed part of the photosensitive chip anti-shake camera module of the present application, and the deformation of the shape memory alloy wire causes the movable part to move relative to the fixed part. The length of the shape memory alloy wire is adjusted by applying electric power to control the extension or contraction, thereby causing the movable part to move.

[0061] 1A and 1B , the image stabilization camera module with a photosensitive chip includes a movable portion 10 and a fixed portion 20, with the movable portion 10 being movably mounted on the fixed portion 20. The movable portion 10 is positioned inside the fixed portion 20, perpendicular to the optical axis, to avoid increasing the thickness of the camera module due to a stacked design.

[0062] The photosensitive chip anti-shake camera module further includes a photosensitive portion 30, which is mounted on the movable portion 10 and moves with the movable portion 10 to move relative to the fixed portion 20. The photosensitive portion 30 defines an optical axis and has a light sensing path.

[0063] Furthermore, the photosensitive portion 30 moves on a plane perpendicular to the optical axis to achieve an optical image stabilization function, wherein the movement on the plane perpendicular to the optical axis includes translational movement along the first axis, along the second axis, and rotational movement around the optical axis.

[0064] The photosensitive chip anti-shake camera module also includes a driving part 40, at least a part of the driving part 40 is installed on the movable part 10, and at least a part is installed on the fixed part 20. The deformation of the driving part 40 causes the movable part 10 to move relative to the fixed part 20.

[0065] The photosensitive chip anti-shake camera module further includes a filter unit 50 , which is arranged in the photosensitive path of the photosensitive unit 30 .

[0066] As shown in FIG. 2 , the driving portion 40 includes a plurality of shape memory alloy wires 41 . The shape memory alloy wires 41 connect the movable portion 10 and the fixed portion 20 , so that the movable portion 10 can move relative to the fixed portion 20 by changing their length.

[0067] The driving portion 40 also includes a plurality of connectors 42. The connectors 42 are fixedly and conductively connected to shape-memory alloy wires 41. At least a portion of the connectors 42 is mounted on the fixed portion 20, and at least a portion is mounted on the movable portion 10. At least one set of shape-memory alloy wires 41 connects the connectors 42 located on the fixed portion 20 and the connectors 42 located on the movable portion 10. When energized, the shape-memory alloy wires 41 deform, causing the connectors 42 mounted on the movable portion 10 to be pulled, thereby driving the movable portion 10 to move relative to the fixed portion 20. When the shape-memory alloy wires 41 are de-energized, the elastic restoring force of the connectors 42 can cause the movable portion 10 to reset.

[0068] 2 and 3A , the movable portion 10 includes a first movable member 11 and a second movable member 12, and the fixed portion 20 includes a base 21. The first movable member 11 is located inside the base 21, and the second movable member 12 is located above the base 21 and the first movable member 11. The first movable member 11 and the second movable member 12 are movably mounted on the fixed portion 20. The first movable member 11 and the second movable member 12 are movable relative to the base 21.

[0069] Specifically, the base 21 includes a base portion 211 and a base protrusion 212 . The base portion 211 is in a circumferential frame shape and defines the first window 210 . The base protrusion 212 is formed by protrudingly extending from the base portion 211 .

[0070] The first movable member 11 is mounted in the first window 210 of the base 21. The first movable member 11 is movable relative to the base 21. The first movable member 11 includes a movable bottom portion 111 and a mounting protrusion 112. The movable bottom portion 111 is frame-shaped and defines the second window 110. The movable bottom portion 111 is located inside the base 211, closer to the optical axis. The mounting protrusion 112 extends protrudingly from the top of the movable bottom portion 111.

[0071] The second movable member 12 is frame-shaped and has a third window 120. The first movable member 11 and the second movable member 12 are stacked one above the other along the optical axis. The second window 110 is located below the third window 120 of the second movable member 12. Furthermore, the first movable member 11 and the second movable member 12 are stacked within the first window 210 to avoid extending beyond the top of the base 21. The space in the first window 210 is utilized to stack the movable member 10, saving space and reducing the size of the camera module.

[0072] The second movable member 12 includes two opposing first side portions 121 and two opposing second side portions 122, and also includes four corner portions 123. The corner portions 123 connect adjacent first side portions 121 and second side portions 122. Furthermore, in a direction perpendicular to the optical axis, the second side portions 122 are closer to the optical axis than the first side portions 121.

[0073] The two first sides 121 are opposite to each other along the first axis and extend along the second axis, and the two second sides 122 are opposite to each other along the second axis and extend along the first axis. Furthermore, the first axis and the second axis are orthogonal and perpendicular to the optical axis.

[0074] The second movable member 12 is movable relative to the base 21. Preferably, the outer periphery of the second movable member 12 overlaps with the projection of the base 21 in the optical axis direction. Specifically, the outer periphery of the corner portion 123 of the second movable member 12 overlaps with the projection of the base 211 of the base 21 in the optical axis direction. The outer periphery of the first side portion 121 of the second movable member 12 overlaps with the projection of the base 211 of the base 21 in the optical axis direction.

[0075] The second side 122 of the second movable member 12 is located on the inner side of the base 21 in a direction perpendicular to the optical axis, so that a gap perpendicular to the optical axis exists between the second side 122 and the base 211. A base protrusion 212 is formed in the portion of the base 211 adjacent to the second side 122. The second movable member 12 includes two opposing second sides 122, with two opposing base protrusions 212 formed in the two adjacent portions of the base 211 and the second side 122. The base protrusions 212 are located outside the second side 122 and serve to limit the second side 122.

[0076] The projections of the movable base 111 and the corner portion 123 of the second movable member 12 in the optical axis direction overlap. Furthermore, the projection of the inner peripheral portion of the corner portion 123 in the optical axis direction does not extend beyond the inner peripheral edge of the projection of the movable base 111 in the optical axis direction.

[0077] Mounting protrusions 112 are formed adjacent to the movable base 111 and the first side 121 of the second movable member 12. The second movable member 12 includes two opposing first sides 121. Two opposing mounting protrusions 112 extend from the movable base 111 and adjacent portions of the first side 121. Mounting protrusions 112 are located inwardly of the first side 121, with a gap between them.

[0078] The arrangement direction of the mounting protrusions 112 is orthogonal to the arrangement direction of the base protrusions 212. The mounting protrusions 112 and the base protrusions 212 are respectively adapted to mount a portion of the connector 42.

[0079] The projection of the second side 122 of the second movable member 12 along the optical axis falls within the projection of the movable base 111 along the optical axis. That is, the two opposing second side 122 are located on two opposing portions of the movable base 111 where the mounting protrusion 112 is not formed.

[0080] In addition, a step structure is formed between the outer side of the mounting protrusion 112 of the first movable member 11 and the movable bottom 111 , with an escape space 1120 to avoid the first side portion 121 .

[0081] 3B , the movable portion 10 further includes a guide portion 13 that guides the movement of the second movable member 12 and the first movable member 11. Furthermore, the guide portion 13 guides the second movable member 12 and the first movable member 11 to perform translational movement in a direction perpendicular to the optical axis. Specifically, the guide portion 13 may guide the first movable member 11 to translate along a first axial direction perpendicular to the optical axis, and guide the second movable member 12 to translate along a second axial direction perpendicular to the optical axis, where the first and second axial directions are perpendicular to each other.

[0082] Because the shape memory alloy wires 41 of each section of the driving portion 40 are cross-distributed, the force generated by each shape memory alloy wire 41 is tilted relative to the first and second axial directions. The combined force generated by each shape memory alloy wire 41 is required to drive the movable portion 20 along the first and second axial directions. The guide portion 13 prevents the movable portion 20 from tilting during translational motion, further limiting the translational motion of the movable portion 20 to the first and second axial directions.

[0083] Furthermore, the guide portion 13 can assist the movable portion 20 in rotating about the optical axis.

[0084] The guide portion 13 includes a first guide portion 131 and a second guide portion 132. The first guide portion 131 is located between the first movable member 11 and the second movable member 12. The bottom of the first guide portion 131 is located on the first movable member 11, and the top of the first guide portion 131 is in contact with the second movable member 12. The first guide portion 131 assists in supporting the second movable member 12 above the first movable member 11, guiding the movement of the first movable member 11 and the second movable member 12.

[0085] The fixed portion 20 further includes a housing 22, which covers the base 21, the second movable member 12, and the first movable member 11. The housing 22 includes a longitudinal portion 221 and a transverse portion 222. The transverse portion 222 is located above the second movable member 12. The second guide portion 132 is located between the second movable member 12 and the transverse portion 222 to guide the second movable member 12 to move relative to the transverse portion 222.

[0086] By providing the guide portion 13 , longitudinal spacing along the optical axis is provided between the second movable member 12 and the first movable member 11 , between the second movable member 12 and the base 21 , and between the second movable member 12 and the housing 22 , thereby reducing movement friction.

[0087] Specifically, the first guide portion 131 includes a plurality of first balls 1311. The first movable member 11 is provided with a first receiving groove 1111. The first balls 1311 are disposed in the first receiving groove 1111. The first receiving groove 1111 is located at a corner of the movable bottom 111 or near a corner.

[0088] The second movable member 12 is provided with a second lower guide groove 124 . The second lower guide groove 124 is located at the corner portion 123 and matches the position of the first receiving groove 1111 to accommodate a portion of the first rolling ball 1311 .

[0089] The second movable part 12 is provided with a second upper guide groove 125, and the second upper guide groove 125 is formed at the corner portion 123. The second upper guide groove 125 and the second lower guide groove 124 are staggered along the optical axis direction, that is, the projections along the optical axis direction do not overlap, so that the first guide portion 131 and the second guide portion 132 are staggered along the optical axis direction to avoid mutual interference.

[0090] The second guide portion 132 includes a plurality of second rolling balls 1321 . The second rolling balls 1321 are disposed in the second upper guide groove 125 .

[0091] Furthermore, the second lower guiding groove 124 and the second upper guiding groove 125 are alternately disposed on the lower surface and the upper surface of the corner portion 123 .

[0092] There is a certain distance between the first ball 1311 and the inner wall defining the first accommodating groove 1111 or the inner wall defining the second lower guide groove 124, so as to provide the first guide part 131 with a certain translational movement stroke. Similarly, there is a certain distance between the second ball 1321 and the inner wall defining the second upper guide groove 125, so that the movement of the first movable part 11 and the second movable part 12 has a certain stroke.

[0093] In addition, there is a certain distance between the first movable member 11 and the base 21 , and there is a certain distance between the second movable member 12 and the base 21 , so as to meet the travel requirements of the movement of the first movable member 11 and the second movable member 12 .

[0094] In an example of the present application, the number of the first rolling balls 1311 and the second rolling balls 1321 are four respectively, and the number of the first receiving grooves 1111 , the second lower guide grooves 124 and the second upper guide grooves 125 matches the number of the rolling balls.

[0095] The movable portion 10 also includes a magnet 17. The first movable member 11 is provided with a second receiving groove 1112 adapted to accommodate the magnet 17. The second receiving groove 1112 is located on the movable bottom portion 111, adjacent to the first receiving groove 1111. The projections of the magnet 17 and the second guide portion 132 along the optical axis overlap. In other words, the magnet 17 is located below the second guide portion 132.

[0096] 3C , the movable portion 10 includes a metal member 16 embedded within the second movable member 12. The metal member 16 includes an outer frame 161, a plurality of first conductive portions 162, and a plurality of second conductive portions 163. The outer frame 161 is frame-shaped, with the first conductive portions 162 and the second conductive portions 163 formed at the four corners of the outer frame 161. The first conductive portions 162 and the second conductive portions 163 are adjacently arranged and extend inwardly from the outer frame 161 in a protruding manner.

[0097] The first conductive portion 162 and the second conductive portion 163 are located inside the corner portion 13. In one example of the present application, as shown in FIG3B , the first conductive portion 162 is located at the bottom of the second upper guide groove 125, and the second conductive portion 163 is located at the top of the second lower guide groove 124.

[0098] The magnet 17 is located below the second upper guide groove 125 and generates a magnetic attraction force on the first conductive portion 162 located at the bottom of the second upper guide groove 125. This magnetic attraction force is suitable for generating a holding force on the second movable member 12 to prevent the second movable member 12 from separating from the first movable member 11, thereby reducing the posture difference of the photosensitive chip anti-shake camera module and improving control accuracy. The first guide portion 131 is disposed between the first movable member 11 and the second movable member 12. The magnet 17 and the first conductive portion 162 generate a magnetic attraction force to generate a preload between the first movable member 11 and the second movable member 12, pressing the second movable member 12 onto the first movable member 11, so that the first guide portion 131 is stably maintained between the first movable member 11 and the second movable member 12.

[0099] Next, the structure of the photosensitive portion 30 of the photosensitive chip stabilization camera module of this application will be described. Referring to Figures 4A to 4C , the photosensitive portion 30 is fixedly connected to the first movable member 11. When the first movable member 11 moves, the photosensitive portion 30 also moves, thereby achieving photosensitive chip displacement optical image stabilization.

[0100] The photosensitive unit 30 includes a photosensitive chip 31 and a photosensitive circuit board 32. The photosensitive chip 31 is mounted on the photosensitive circuit board 32 and is electrically connected to the photosensitive circuit board 32. The photosensitive circuit board 32 is provided with electronic components 33.

[0101] The first movable member 11 is fixedly connected to the photosensitive circuit board 32. The photosensitive chip 31 is exposed through the second window 110 of the first movable member 11 and moves with the movement of the first movable member 11. The first movable member 11 and the photosensitive chip 31 are indirectly fixedly connected through the photosensitive circuit board 32 to prevent damage to the photosensitive chip 31.

[0102] The first movable member 11 is coupled to the photosensitive circuit board 32. Further, the first movable member 11 is formed to protrude upward from the surface of the photosensitive circuit board 32. Further, the first movable member 11 covers the outer peripheral portion of the photosensitive circuit board 32. The first movable member 11 is formed to protrude upward from the outer peripheral portion of the surface of the photosensitive circuit board 32 to cover the upper side of the outer peripheral portion of the surface of the photosensitive circuit board 32. Alternatively, the first movable member 11 is formed to protrude upward from the outer peripheral portion of the surface of the photosensitive circuit board 32 to cover the upper side and the circumferential side of the outer peripheral portion of the surface of the photosensitive circuit board 32.

[0103] Preferably, the first movable member 11 is integrally formed with the photosensitive circuit board 32. A molding process can be employed to form the first movable member 11 on the surface of the photosensitive circuit board 32, so that the outer periphery of the photosensitive circuit board 21 is covered by the first movable member 11, thereby forming a fixed connection between the first movable member 11 and the photosensitive circuit board 32. Furthermore, the first movable member 11 covers the electronic components 33 to protect them, and provides a smooth surface for the exposed portion of the photosensitive circuit board 32, thereby improving the flatness of the photosensitive portion 30.

[0104] The movable portion 10 further includes an elastic portion 14 and an associated portion 15. The fixed portion 20 includes a circuit board peripheral portion 23. The elastic portion 14 connects the associated portion 15 and the circuit board peripheral portion 23 to form a circuit board 61. The elastic portion 14 can generate elastic deformation and elastic restoring force to movably connect the associated portion 15 to the circuit board peripheral portion 23. The associated portion 15 is associated with the elastic portion 14 and the first movable member 11. The elastic portion 14 is associated with the first movable member 11 to promote the movement of the first movable member 11 through elastic deformation, and to assist the first movable member 11 in resetting through the elastic restoring force, thereby making the photosensitive portion 30 movable relative to the fixed portion 20 and capable of resetting under the action of the elastic restoring force.

[0105] The connecting portion 15 is fixedly connected to the photosensitive circuit board 32, thereby fixing the first movable member 11 to the connecting portion 15. The elastic portion 14 movably connects the connecting portion 15 to the circuit board peripheral portion 23, allowing the first movable member 11 to move relative to the circuit board peripheral portion 23, thereby enabling the first movable member 11 to be movably mounted on the fixed portion 20. The first movable member 11 and the second movable member 12 are stacked on the connecting portion 15, and the elastic portion 14 connects the connecting portion 15 to the circuit board peripheral portion 23, thereby enabling the first movable member 11 and the second movable member 12 to be movably mounted on the fixed portion 20.

[0106] Therefore, when the drive unit 40 is not powered, the elastic portion 14 can maintain the photosensitive portion 30 in its initial position, suspending the photosensitive portion 30 from the fixed portion 20. When the drive unit 40 is powered and deformed, the elastic portion 14 is subjected to force and elastic deformation. When the drive unit 40 is powered off, the elastic reset force restores the photosensitive portion 30 to its initial position without consuming power from the drive unit 40. When the photosensitive portion 30 is reset, the elastic portion 14 resets the first movable element 11 and may also reset the second movable element 12.

[0107] The connecting portion 15 is fixed to the lower surface of the photosensitive circuit board 32. The elastic portion 14 extends from the outer periphery of the connecting portion 15 to the inner periphery of the circuit board peripheral portion 23, thereby connecting the circuit board peripheral portion 23 and the connecting portion 15. The connecting portion 15 moves with the movement of the photosensitive circuit board 32. The elastic portion 14 is made of an elastic material and deforms under force. Furthermore, the elastic portion 14 extends and is distributed in a plane perpendicular to the optical axis, parallel or approximately parallel to the shape memory alloy wire 41 of the aforementioned drive unit 40.

[0108] The elastic portion 14 is made of a conductive material and forms a conductive connection between the circuit board peripheral portion 23 and the associated portion 15, thereby forming a conductive connection between the circuit board peripheral portion 23, the elastic portion 14, and the associated portion 15, thereby supplying power to the photosensitive portion 30. The photosensitive circuit board 32 of the photosensitive portion 30 is conductively connected to the associated portion 15, so that the photosensitive chip 31 is turned on.

[0109] In one example of the present application, as shown in FIG4A , the circuit board 61 further includes a connecting portion 612 , which is formed by extending outward from the edge of the peripheral portion 23 of the circuit board and is suitable for conducting connection with the circuit outside the photosensitive chip anti-shake camera module.

[0110] Referring to FIG4B , the photosensitive circuit board 32 includes an inner portion 321 and an outer portion 322. The electronic component 33 is disposed on the outer portion 322. The first movable member 11 covers the outer portion 322 and the electronic component 33. The inner portion 321 is exposed at the second window 110. The photosensitive chip 31 is mounted on the inner portion 321.

[0111] Furthermore, in one example of the present application, referring to the schematic diagrams of Figures 4B and 4C, the upper surface of the photosensitive circuit board 32 has a sunken area 320 suitable for mounting the photosensitive chip 31 to reduce the height of the photosensitive chip 31. The sunken area 320 is formed in the inner portion 321, and the edge of the sunken area 320 is spaced a certain distance from the boundary between the inner portion 321 and the outer portion 322 to prevent contact between the first movable member 11 and the photosensitive chip 31. The sunken area 320 can be achieved by thinning the thickness of the photosensitive circuit board 32 in the area where the photosensitive chip 31 is mounted, which helps to reduce the thickness of the module.

[0112] The projection of the first movable part 11 along the optical axis is located outside the projection of the associated part 15 along the optical axis, and overlaps with the projection of the elastic part 14 along the optical axis and the projection of the peripheral part 23 of the circuit board along the optical axis. The projection area of ​​the photosensitive circuit board 32 along the optical axis is larger than the projection area of ​​the associated part 15 along the optical axis, so that a photosensitive chip 31 with an area larger than that of the associated part 15 can be installed on the photosensitive circuit board 32, which is conducive to the installation of a large-sized photosensitive chip 31 and improves the imaging quality of the camera module.

[0113] The lower surface of the photosensitive circuit board 32 has a protrusion 323 at the position of the installation-related portion 15, so that there is a certain distance between the elastic portion 14, the circuit board peripheral portion 23 and the lower surface of the photosensitive circuit board 32, so as to avoid the photosensitive circuit board 32 from coming into contact with the elastic portion 14 when the first movable part 11 drives the photosensitive portion 30 to move, thereby affecting the deformation of the elastic portion 14, and also to avoid the photosensitive circuit board 32 from rubbing against the circuit board peripheral portion 23 and the elastic portion 14, thereby affecting the speed of the anti-shake movement.

[0114] 2 and 3A , the base 21 is mounted on the peripheral portion 23 of the circuit board, surrounding the first movable member 11. The second movable member 12 is located above the first movable member 11, and the photosensitive chip 31 is exposed sequentially through the first window 210, the second window 110, and the third window 120. The base 21 is fixedly connected to the peripheral portion 23 of the circuit board, and the first movable member 11 is close to the base 11, so that the first movable member 11 is close to the elastic portion 14 along the optical axis. The second window 110 defined by the first movable member 11 is close to the elastic portion 14 along the optical axis, necessitating the provision of a photosensitive circuit board 32 for fixing the photosensitive chip 31 and the first movable member 11, thereby indirectly fixing the photosensitive chip 31 and the first movable member 11.

[0115] Continuing with Figures 4A and 4C , the filter unit 50 is located in the light sensing path of the photosensitive unit 30. A filter holder 52 is mounted on the photosensitive circuit board 32, with a gap between its lower surface and the photosensitive chip 31, forming a recessed space 520. The filter 51 is mounted on top of the filter holder 52 to maintain it in the light sensing path of the photosensitive chip 31.

[0116] The filter holder 52 is located in the second window 110, and the filter 51 is exposed through the second window 110. Furthermore, the mounting protrusion 112 is higher than the filter holder 52, forming a protective structure for the filter unit 50. In combination with the aforementioned sunken installation of the photosensitive chip 31, the height of the filter unit 50 can also be reduced, thereby reducing the overall thickness of the module.

[0117] As shown in Figure 4A, the photosensitive chip anti-shake camera module also includes a reinforcement portion 70, which is disposed at the bottom of the circuit board 61 and is suitable for strengthening the structural strength of the circuit board 61. In one example of the present application, the reinforcement portion 70 includes a first reinforcement member 71 and a second reinforcement member 72. The first reinforcement member 71 is mounted on the bottom surface of the associated portion 15 and is suitable for strengthening the structural strength of the associated portion 15. The second reinforcement member 72 is mounted on the bottom surface of the circuit board peripheral portion 23 and is suitable for strengthening the structural strength of the circuit board peripheral portion 23. The reinforcement portion 70 also includes a third reinforcement member 73, which is suitable for covering the first reinforcement member 71, the second reinforcement member 72 and the elastic portion 14 to further strengthen the structural strength.

[0118] In other examples of the present application, the reinforcing portion 70 includes at least one reinforcing member, which is adapted to entirely cover the associated portion 15 , the elastic portion 14 and the circuit board peripheral portion 23 .

[0119] Next, referring to the schematic diagrams of FIG. 5A to FIG. 7B , an implementation method of deforming the driving portion 40 of the photosensitive chip anti-shake camera module provided by the present application to prompt the aforementioned photosensitive portion 30 to perform anti-shake movement is described.

[0120] First, referring to the schematic diagrams of Figures 5A and 5B , an embodiment of the driver unit 40 of the image stabilization camera module with a photosensitive chip provided in this application will be described. Driver unit 40 includes a first driver unit 40A and a second driver unit 40B. First driver unit 40A is entirely mounted on movable unit 10 , while second driver unit 40B is partially mounted on movable unit 10 and partially mounted on fixed unit 20 .

[0121] Specifically, the first driving portion 40A connects the first movable member 11 and the second movable member 12, allowing relative movement between the first movable member 11 and the second movable member 12. The second driving portion 40B connects the second movable member 12 and the base 21, allowing the second movable member 12 to be movably mounted on the fixed portion 20, with the base 21 providing support for the second movable member 12, thereby preventing uncontrollable movement of the movable portion 10.

[0122] The first driving part 40A is deformed to cause the first movable part 11 to move, so that the photosensitive part 30 fixed to the first movable part 11 moves; the second driving part 40B is deformed to cause the second movable part 12 to move relative to the base 21, driving the first movable part 11 to move, and then causing the photosensitive part 30 fixed to the first movable part 11 to move.

[0123] 4A , the first movable member 11 is movably connected to the fixed member 20 via the elastic member 14, and the second movable member 12 is movably connected to the fixed member 20 via the second driving member 40B. The first driving member 40A movably connects the first movable member 11 and the second movable member 12. The first driving member 40A and the second driving member 40B drive the first movable member 11 and the second movable member 12 to move, and the elastic member 14 causes the first movable member 11 and the second movable member 12 to return to their original position.

[0124] The first drive unit 40A and the second drive unit 40B each comprise two opposing portions. The two portions of the first drive unit 40A are arranged opposite each other along a first axial direction, while the two portions of the second drive unit 40B are arranged opposite each other along a second axial direction. The first and second axial directions are orthogonal. The first drive unit 40A generates a driving force along the first axial direction, causing the movable unit 10 to move along the first axial direction; the second drive unit 40B generates a driving force along the second axial direction, causing the movable unit 10 to move along the second axial direction.

[0125] The shape memory alloy wire 41 of the first driving portion 40A connects the first movable element 11 and the second movable element 12 , and the shape memory alloy wire 41 of the second driving portion 40B connects the second movable element 12 and the base 21 .

[0126] When the first driving portion 40A deforms, the first movable element 11 moves, and the second movable element 12 needs to remain relatively stationary with the base 21 to avoid interfering with the first movable element 11. In one example, the shape memory alloy wire 41 of the second driving portion 40B can pull the second movable element 12, helping the second movable element 21 remain relatively stationary with the base 21. When the second driving portion 40B deforms, the second movable element 12 drives the first movable element 11 to move relative to the fixed portion 20. The second movable element 12 and the first movable element 11 preferably remain relatively stationary, and the entire movable element moves relative to the base 21. The shape memory alloy wire 41 of the first driving portion 40A is connected between the second movable element 12 and the first movable element 11 and moves with the movable portion 10, avoiding interference with the overall movement. This can also reduce or eliminate power consumption of the second driving portion 40B.

[0127] In addition, the first movable part 11 drives the photosensitive part 30 to perform anti-shake movement along the first axis, and the second movable part 12 drives the photosensitive part 30 to perform anti-shake movement along the second axis. The anti-shake movement crosstalk between the first axis and the second axis is small, the anti-shake accuracy is higher, and the effect is better.

[0128] Among them, the shape memory alloy wire 41 connects the first movable part 11 and the second movable part 12 in a straight line, and can generate tension in the non-powered state to maintain the relative stillness between the first movable part 11 and the second movable part 12, and the second movable part 12 and the base 21, preventing the first movable part 11, the second movable part 12, and the base 21 from moving randomly, and avoiding posture differences when the shape memory alloy wire 41 is not powered.

[0129] The number of shape memory alloy wires 41 in each part is at least two, which connect the first movable part 11 and the second movable part 12, and the second movable part 12 and the base 21 in a cross form, and are arranged diagonally along the first driving part 40A and the second driving part 40B respectively, so that the shape memory alloy wire 41 has sufficient length and can produce sufficient elongation or contraction, thereby making the movable part 10 have a larger motion stroke range, thereby improving the anti-shake performance of the photosensitive chip anti-shake camera module.

[0130] Each shape-memory alloy wire 41 can be an elongated strip with a circular cross-section or any other cross-section. Each shape-memory alloy wire 41 can have the same or similar dimensions and shape as the other shape-memory alloy wires 41. The shape-memory alloy wires 41 are flexible and can be deformed. Each shape-memory alloy wire 41 can be individually controlled to extend or contract, thereby causing the movable portion 10 to perform translational and / or rotational motion.

[0131] Preferably, the shape memory alloy wires 41 include four groups, each group including a first shape memory alloy wire 411 and a second shape memory alloy wire 412, wherein the first shape memory alloy wires 411 and the second shape memory alloy wires 412 are intersectingly arranged. Furthermore, the first shape memory alloy wires 411 and the second shape memory alloy wires 412 intersect in a direction perpendicular to or approximately perpendicular to the optical axis. The number of first shape memory alloy wires 411 and second shape memory alloy wires 412 in each group is at least one.

[0132] The four groups of first shape memory alloy wires 411 and second shape memory alloy wires 412 are distributed roughly symmetrically around the optical axis and in roughly the same plane perpendicular to the optical axis, so as to generate a pulling force on the movable part 10 along two directions of the first axis and two directions of the second axis, respectively, to keep the movable part 10 flat, prevent tilting, and reduce the static tilt of the camera module.

[0133] The four groups of shape memory alloy wires 41 include a total of four first shape memory alloy wires 411, two of which are arranged relative to each other and parallel to each other, and further, are rotationally symmetrical around the optical axis. The other two first shape memory alloy wires 411 are arranged relative to each other and parallel to each other, and further, are rotationally symmetrical around the optical axis. That is, the first shape memory alloy wires 411 are arranged relative to each other in pairs and parallel to each other, so that the extension directions of the four first shape memory alloy wires 411 intersect to form a parallelogram. Similarly, the second shape memory alloy wires 412 of the four groups of shape memory alloy wires 41 are arranged relative to each other in pairs and parallel to each other, so that the extension directions of the four second shape memory alloy wires 412 intersect to form a parallelogram. The four sides of the two parallelograms are arranged crosswise.

[0134] Each section of the drive unit 40 includes two first connecting members 421 and one second connecting member 422. The two first connecting members 421 are located on either side of the second connecting member 422. Furthermore, the two first connecting members 421 of each section are symmetrically distributed on either side of the second connecting member 422. The first connecting members 421 of the first drive unit 40A and the second drive unit 40B are both mounted on the second movable member 12, the second connecting member 422 of the first drive unit 40A is mounted on the first movable member 11, and the second connecting member 422 of the second drive unit 40B is mounted on the base 21.

[0135] Furthermore, the two opposite parts of the driving part 40 are symmetrically arranged, and the other two opposite parts are symmetrically arranged, that is, the first connecting member 421 and the second connecting member 422 of the two opposite parts of the first driving part 40A are symmetrically arranged, and the first connecting member 421 and the second connecting member 422 of the two opposite parts of the second driving part 40B are symmetrically arranged.

[0136] The first connector 421 includes a first connector body 4211 and a first coupling portion 4212 . The first coupling portion 4212 extends outward from the first connector body 4211 and is adapted to fix the shape memory alloy wire 41 . The end of the shape memory alloy wire 41 is fixed to the end of the first coupling portion 4212 .

[0137] In one example of the present application, the projection of the first coupling portion 4212 along the optical axis does not overlap with the projection of the second movable member 12 along the optical axis, so that the first coupling portion 4212 is suspended or not in contact with the second movable member 12, thereby avoiding friction with the second movable member 12. In another example of the present application, the first coupling portion 4212 is formed to extend obliquely upward from the first connector body 4211, so that the end of the first coupling portion 4212 is higher than the first connector body 4211, thereby avoiding friction between the shape memory alloy wire 41 and the second movable member 12 at the bottom.

[0138] The second connector 422 includes a second connector body 4221 and two second coupling portions 4222. The two second coupling portions 4222 are formed on the same side of the second connector body 4221, spaced apart from each other, and located adjacent to opposite sides of the second connector 422. The ends of the shape memory alloy wire 41 are fixed to the ends of the second coupling portions 4222.

[0139] In one example of the present application, two second coupling parts 4222 are formed to extend obliquely upward from the same side of the second connector body 4221, so that the end of the second coupling part 4222 is higher than the second connector body 4221, and is suspended or not in contact with the first movable part 11 and the base 21, thereby avoiding friction between the shape memory alloy wire 41 and the first movable part 11 and the base 21 at the bottom.

[0140] The first coupling portion 4212 and the second coupling portion 4222 of each portion are adjacent to each other and are adapted to fix one end of the first shape memory alloy wire 411 and the second shape memory alloy wire 412 .

[0141] Preferably, each first connecting member 421 and each second connecting member 422 have the same size and shape to simplify the design of the connecting members.

[0142] The first coupling portion 4212 of the first connecting member 421 and the second coupling portion 4222 of the second connecting member 422 of each part are oriented in opposite directions, and the two second coupling portions 4222 of the second connecting member 422 are respectively close to the first coupling portions 4212 on both sides, so that the first shape memory alloy wire 411 and the second shape memory alloy wire 412 of each part are fixed crosswise.

[0143] Specifically, one end of the first shape memory alloy wire 411 is mounted on the first connector 421 on one side of the second connector 422 and secured by the first coupling portion 4212, while the other end is mounted on the second connector 422 and secured by the second coupling portion 4222 near the other side of the second connector 422. One end of the second shape memory alloy wire 412 is mounted on the first connector 421 on the other side of the second connector 422 and secured by the first coupling portion 4212 on the other side, while the other end is mounted on the second connector 422 and secured by the second coupling portion 4222 near the second connector 422, such that the first shape memory alloy wires 411 and the second shape memory alloy wires 412 are arranged in a cross pattern.

[0144] It is also more preferred that the ends of the two second coupling parts 4222 of each part are not in the same plane, that is, the heights of the second coupling parts 4222 of each second connecting member are different, and the first shape memory alloy wire 411 and the second shape memory alloy wire 412 are clamped at different heights at the ends of the two second coupling parts 4222, so that the first shape memory alloy wire 411 and the second shape memory alloy wire 412 have a square gap along the optical axis at the intersection position, so that the first shape memory alloy wire 411 and the second shape memory alloy wire 412 are insulated to avoid mutual interference and short circuit.

[0145] In one example of the present application, each second connector 422 has a higher second coupling portion 4222 and a lower second coupling portion 4222. The two second connectors 422 on two opposing portions of the driving unit 40 are arranged such that the higher second coupling portions 422 are diagonally disposed and the lower second coupling portions 422 are diagonally disposed. Furthermore, the first coupling portion 4212 of each first connector 421 is lower in height than the higher second coupling portion 4222 and higher in height than the lower second coupling portion 4222. One of the first shape memory alloy wire 411 and the second shape memory alloy wire 412 in each part is fixed by the first coupling portion 4212 and the higher second coupling portion 4222, and the other is fixed by the first coupling portion 4212 and the lower second coupling portion 4222, so that the first shape memory alloy wire 411 and the second shape memory alloy wire 412 are fixed at different heights to be insulated from each other, and the first shape memory alloy wires 411 of the two opposite parts have the same or similar heights to form a parallel arrangement; the second shape memory alloy wires 412 of the two opposite parts have the same or similar heights to form a parallel arrangement.

[0146] In other examples of the present application, the number of second connectors 422 in each part is two, and each second connector 422 has a second coupling portion 4222, which is close to the first connector 421 on both sides. In other words, the second connecting body 4221 of the second connector 422 is composed of two independent parts, which are installed in a position close to the first connector 421, so that the second coupling portion 4222 of each second connecting body 4221 is adjacent to the first coupling portion 4212.

[0147] 5B , the first connecting member 421 is mounted on the corner portion 123 of the second movable member 12. The first connecting members 421 of each of the adjacent first and second driving units 40A and 40B are mounted adjacent to each other on the same corner portion 123. The other first connecting members 421 of each of the adjacent first and second driving units 40A and 40B are mounted opposite each other on two opposing corner portions 123. The second connecting members 422 of each of the adjacent first and second driving units 40A and 40B are mounted on the first movable member 11 and the base 21, respectively.

[0148] The embodiment of the first driving unit 40A is described in detail. The second connecting member 422 of the first driving unit 40A is mounted on the first movable member 11. The first movable member 11 includes two mounting protrusions 112 arranged opposite each other along the first axial direction, located inside two opposing first side portions 121. The second connecting member body 4221 is fixed to the mounting protrusions 112. The two second coupling portions 4222 face in a direction opposite to the optical axis along the first axial direction, that is, toward the base 21.

[0149] Correspondingly, the first coupling portions 4212 of the first connectors 421 on both sides face the opposite side of the second coupling portions 4222 along the first axial direction, that is, toward the optical axis. The first connector body 4211 is fixed to the corner portion 123 of the second movable member 12, near the edge adjacent to the corner portion 123 and the first edge portion 121. The two opposing first shape memory alloy wires 411 and the two second shape memory alloy wires 412 are arranged parallel to each other, and the first shape memory alloy wires 411 and the second shape memory alloy wires 412 are arranged crosswise.

[0150] The first side portion 121 and the mounting protrusion 112 are located between the two corner portions 123, so that the second connector 422 is located between the two corner portions 123. The first coupling portion 4212 is adjacent to the mounting protrusion 112, and the second connector body 4221 is located between the two first coupling portions 4212. The first connector body 4211 is adjacent to the first side portion 121, and the two second coupling portions 4222 are located above the first side portion 121, adjacent to the first connector body 4211 on either side.

[0151] The implementation method of the second driving part 40B is specifically described. The second connecting member 422 of the second driving part 40B is installed on the base 21. Among them, the base 21 includes two base protrusions 212 opposite to each other along the second axial direction, located on the outside of the second side portion 122. The second connecting member body 4221 is fixed to the base protrusion 212, and the second coupling portion 4222 faces the optical axis along the second axial direction, that is, toward the direction of the first movable member 11. Correspondingly, the first coupling portion 4212 of the first connecting member 421 faces the direction opposite to the optical axis along the second axial direction, that is, toward the base 21. The first connecting member body 4211 is fixed to the corner portion 123 of the second movable member 12, close to the side of the corner portion 123 facing the second side portion 122. The two opposite first shape memory alloy wires 411 and the two second shape memory alloy wires 412 are arranged parallel to each other, and the first shape memory alloy wire 411 and the second shape memory alloy wire 412 are arranged crosswise.

[0152] The second side portion 122 is located between the two corner portions 123, the base protrusion 212 is located outside the second side portion 122, and the second connector body 4221 is located outside the second side portion 122 and between the two first coupling portions 4212. The second coupling portion 4222 is located above the second side portion 122 and between the two first connector bodies 4211.

[0153] The first driving part 40A and the second driving part 40B are deformed to promote the movable part 10 to move, thereby driving the photosensitive part 30 to move, thereby realizing the photosensitive chip mobile optical image stabilization.

[0154] When the first shape memory alloy wires 411 and the second shape memory alloy wires 412 of the same portion of the driving unit 40 contract in the same direction, and when the first shape memory alloy wires 411 and the second shape memory alloy wires 412 of another portion of the driving unit 40 extend in the same direction, the movable unit 10 is caused to translate in the extension direction. When the first shape memory alloy wires 411 and the second shape memory alloy wires 412 of each portion of the driving unit 40 contract and extend in the clockwise or counterclockwise direction, the movable unit 10 is caused to rotate about the optical axis.

[0155] Furthermore, when the translational stroke of the movable portion 10 is at its minimum, the angle of the movable portion 10's rotational motion is at its maximum. In other words, when the movable portion 10 is not generating translational motion, the rotational angle of the movable portion 10 is at its maximum. As the translational stroke of the movable portion 10 increases, the rotational angle of the movable portion 10 decreases. In other words, the rotational angle of the movable portion 10 driven and the translational stroke are inversely related.

[0156] 6A to 7B , the first driving portion 40A includes two portions facing each other along the X-axis (first axial direction), and the second driving portion 40 includes two portions facing each other along the Y-axis (second axial direction).

[0157] FIG6A shows an example of how the first driving unit 40A deforms to cause the movable unit 10 to move along the X-axis. Specifically, the first shape memory alloy wire 411 and the second shape memory alloy wire 412 in one portion of the first driving unit 40A contract in one direction along the X-axis, while the first shape memory alloy wire 411 and the second shape memory alloy wire 412 in the other portion of the first driving unit 40A extend in the same direction along the X-axis, causing the movable unit 10 to move in the direction in which the shape memory alloy wire 41 extended.

[0158] Among them, the second connecting part 422 of the first driving part 40A is fixed to the first movable part 11, and the first connecting part 421 is fixed to the second movable part 12. The deformation of the first shape memory alloy wire 411 and the second shape memory alloy wire causes the displacement of the first coupling part 4212 and the second coupling part 4222 to pull the first movable part 11 and the second movable part 12 to displace.

[0159] When the first shape memory alloy wire 411 and the second shape memory alloy wire 412 of one part shrink from the second coupling part 4222 relative to the first coupling part 4212, a driving force is generated, prompting the second coupling part 4222 to move toward the first coupling part 4212, and the common movement of the two second coupling parts 4222 generates a resultant force along the X-axis pointing in the shrinkage direction, so that the first movable part 11 moves in the contraction direction along the X-axis; the first shape memory alloy wire 411 and the second shape memory alloy wire 412 of the other part extend from the first coupling part 4212 toward the second coupling part 4222, a driving force is generated, prompting the first coupling part 4212 to move toward the second coupling part 4222, and the common movement of the two first coupling parts 4212 generates a resultant force along the X-axis pointing in the extension direction, so that the first movable part 11 moves in the extension direction along the X-axis.

[0160] More preferably, when the first movable member 11 moves along the X-axis (the first axial direction), the second movable member 12 remains relatively stationary to prevent the second movable member 12 from interfering with the first movable member 11 .

[0161] In one embodiment, combined with the schematic diagram of Figure 6C, the first guide portion 131 includes a first ball 1311 and a first guide groove 1310, the first guide groove 1310 has a length along the first axial direction, and the first ball 1313 moves along the first axial direction in the first guide groove 1310 to guide the first movable part 11 to move parallel to the first axial direction, which can prevent the first movable part 11 from tilting.

[0162] The second guide portion 132 includes a second ball 1321 and a second guide groove 1320. The inner wall of the second guide groove 1320 along the first axial direction prevents the second ball 1321 from translating along the first axial direction, thereby preventing the second movable member 12 from translating along the first axial direction, thereby forming a stop structure for the second movable member 12 along the first axial direction. The second ball 1321 abuts against the inner wall surface of the second guide groove 1320 along the first axial direction.

[0163] That is, the width of the second guide groove 1320 along the first axial direction limits the translational movement of the second movable member 12 along the first axial direction. Therefore, when the first driving portion 40A causes the first movable member 11 to translate along the first axial direction, the second movable member 12 is prevented from translating along the first axial direction, and remains relatively stationary with the base 21.

[0164] The second guide groove 1320 is selectively provided on the second movable member 12 or the housing 22 . Referring to FIG. 3B , the second guide groove 1320 is implemented as a second upper guide groove 125 located on the upper surface of the second movable member 12 .

[0165] FIG6B shows an example in which the second driving unit 40B deforms to cause the movable unit 10 to move along the Y-axis. Specifically, the first shape memory alloy wire 411 and the second shape memory alloy wire 412 in one portion of the second driving unit 40B contract, while the first shape memory alloy wire 411 and the second shape memory alloy wire 412 in the other portion of the second driving unit 40B extend, causing the movable unit 10 to move in the direction in which the shape memory alloy wire 41 extends.

[0166] The second connecting member 422 of the second driving unit 40B is mounted on the base 21, and the first connecting member 421 is mounted on the second movable member 12. When the first shape memory alloy wire 411 and the second shape memory alloy wire 412 of one portion extend from the second coupling portion 4222 toward the first coupling portion 4212, a driving force is generated, causing the second coupling portion 4222 to move toward the first coupling portion 4212. The combined movement of the two coupling portions 4222 generates a combined force along the Y-axis in the extension direction, causing the second movable member 12 to move along the Y-axis extension direction, driving the first movable member 11 to move along the Y-axis extension direction.

[0167] The first shape memory alloy wire 411 and the second shape memory alloy wire 412 of the other relative part shrink from the first coupling part 4212 toward the second coupling part 4222, generating a driving force, prompting the first coupling part 4212 to move toward the second coupling part 4222. The joint movement of the two first coupling parts 4212 generates a resultant force pointing in the shrinkage direction along the Y-axis, prompting the first movable part 11 to move in the shrinkage direction along the Y-axis, driving the second movable part 12 to move in the shrinkage direction along the Y-axis.

[0168] More preferably, the first movable member 11 and the second movable member 12 remain relatively still when performing translational motion along the second axial direction, so that the motion is controllable and more precise.

[0169] In one embodiment, as shown in FIG6C , the second guide groove 1320 of the second guide portion 132 has a length along the second axial direction, and the second ball 1321 moves in the second guide groove 1320 along the second axial direction, guiding the second movable member 12 to move along the second axial direction. The width of the first guide groove 1310 of the first guide portion 131 along the second axial direction prevents relative movement between the first movable member 11 and the second movable member 12 along the second axial direction, forming a stop structure for the first movable member 11 relative to the second movable member 12 along the second axial direction. Specifically, the inner wall of the first guide groove 1310 along the second axial direction prevents the first ball 1311 from moving along the second axial direction, thereby preventing relative movement between the first movable member 11 and the second movable member 12 along the second axial direction, allowing the first movable member 11 to follow the second movable member 12 in translation along the second axial direction. That is, the first ball 1311 is abutted against the inner wall surface of the first guide groove 1310 along the second axial direction.

[0170] The deformation of the second driving part 40B causes the second movable member 12 to generate translational motion along the second axis. The first movable member 11 follows the second movable member 12 to generate translational motion along the second axis, causing the photosensitive part 30 to translate along the second axis for anti-shake.

[0171] The first guide groove 1310 is selectively provided on the first movable part 11 or the second movable part 12. Combined with the schematic diagram of Figure 3B, the first guide groove 1310 can be implemented as a first accommodating groove 1111 and / or a second lower guide groove 124, located on the upper surface of the first movable part 11 and / or the lower surface of the second movable part 12.

[0172] In addition, in one example of the present application, the first guide groove 1310 has a length along the first axial direction, and the first ball 1311 moves along the first axial direction to guide the first movable part 11 to perform translational movement along the first axial direction; the second guide groove 1320 has a length along the second axial direction, and the second ball 1321 moves along the second axial direction to guide the second movable part 11 to perform translational movement along the second axial direction, and the first movable part 11 follows the second movable part 11 to perform translational movement along the second axial direction.

[0173] In summary, the guide portion 13 is configured to limit the translational movement direction of the movable member 10 to the first axial direction and the second axial direction, wherein the first guide portion 131 is configured to guide the first movable member 10 to move along the first axial direction.

[0174] 7A and 7B illustrate an example in which the first drive portion 40A and the second drive portion 40B are deformed to cause the movable portion 10 to rotate about the optical axis.

[0175] In the example shown in FIG7A , the first shape memory alloy wire 411 of each portion of the drive unit 40 contracts in a clockwise direction, while the second shape memory alloy wire 412 extends in a clockwise direction, causing the first movable member 11 to rotate clockwise about the optical axis. Specifically, the first shape memory alloy wire 411 of the first drive unit 40A contracts from the second coupling portion 4222 toward the first coupling portion 4212, while the first shape memory alloy wire 411 of the second drive unit 40B contracts from the first coupling portion 4212 toward the second coupling portion 4222. The second shape memory alloy wire 412 of the first drive unit 40A extends from the first coupling portion 4212 toward the second coupling portion 4222, while the second shape memory alloy wire 412 of the second drive unit 40B extends from the second coupling portion 4222 toward the first coupling portion 4212, causing the first movable member 11 to rotate clockwise about the optical axis.

[0176] In the example shown in FIG7B , the first shape memory alloy wire 411 of each portion of the drive unit 40 extends counterclockwise, while the second shape memory alloy wire 412 contracts counterclockwise, causing the first movable member 11 to rotate counterclockwise about the optical axis. Specifically, the first shape memory alloy wire 411 of the first drive unit 40A extends from the first coupling portion 4212 toward the second coupling portion 4222, while the first shape memory alloy wire 411 of the second drive unit 40B extends from the second coupling portion 4222 toward the first coupling portion 4212. The second shape memory alloy wire 412 of the first drive unit 40A contracts from the second coupling portion 4222 toward the first coupling portion 4212, while the second shape memory alloy wire 412 of the second drive unit 40B contracts from the first coupling portion 4212 toward the second coupling portion 4222, causing the first movable member 11 to rotate counterclockwise about the optical axis.

[0177] Furthermore, the guide portion 13 prevents the first movable member 11 and the second movable member 12 from being tilted relative to each other, thereby jointly generating a rotational motion.

[0178] 5A and 5B , the base 21 includes a limiting portion 213 that limits the displacement of the second movable member 12 relative to the base 21. The limiting portion 213 is located on at least one side of the base protrusion 212. In one example of the present application, the limiting portion 213 is formed on both sides of the base protrusion 212. The limiting portion 213, the base protrusion 212, and the other limiting portion 213 are distributed along the circumferential extension of the movable bottom portion 212.

[0179] The second movable member 12 is located inside the limiting portion 212 and the base protrusion 212, so that the translational movement space of the second movable member 12 toward the limiting portion 212 and the base protrusion 212 is limited, preventing the second movable member 12 from separating from the base. The limiting portion 213 is located outside the corner portion 123 to limit the translational movement space of the corner portion 123 and prevent the four corners of the second movable member 12 from tilting. A certain distance is provided between the limiting portion 213 and the base protrusion 212, forming a spacing space 214. The first coupling portion 4212 can extend into or above the spacing space 214.

[0180] Next, with reference to the schematic diagrams of Figures 3A to 3C, the conductive structure of the photosensitive chip anti-shake camera module of the present application is explained. The metal part 16 has conductive properties and is conductively connected to the circuit board 61. The metal part 16 is embedded in the second movable part 12 so that the second movable part 12 can be conductively connected to the driving part 40. Specifically, the outer frame part 161 is conductively connected to the circuit board 61 to obtain power, and the power is transmitted to the first conductive part 162 and the second conductive part 163. Two first connectors 421 are installed on each corner part 123, one of which is conductively connected to the first conductive part 162, and the other first connector 421 is conductively connected to the second conductive part 163. Electricity is transmitted to the first connector body 4211 of the first connector 421, and is transmitted to the shape memory alloy wire through the first coupling part 4212, so that the shape memory alloy wire 41 is extended or contracted by the power applied to the shape memory alloy wire 41, thereby realizing the movement of the movable part 10.

[0181] That is, the photosensitive chip anti-shake camera module includes a conductive portion 60, which includes at least a circuit board 61, a metal member 16, a first connector 421, and a shape memory alloy wire 41. The circuit board 61, the metal member 16, the first connector 421, and the shape memory alloy wire 41 are sequentially connected to apply electricity to the shape memory alloy wire 41, thereby causing the movable portion 10 to move. The applied electricity adjusts the elongation and contraction of the shape memory alloy wire, as well as its direction and degree of movement, thereby controlling the translational movement, rotational movement, movement range, and rotation angle of the photosensitive portion 30.

[0182] In one example of the present application, as shown in FIG8 , a position sensing element 62 is provided on a circuit board 61 to detect the displacement of the movable portion 10. Specifically, the position sensing element 62 is provided on the outer peripheral portion 23 of the circuit board at a position corresponding to the position of the magnet 17 above the first movable member 11. That is, the position sensing element 62 is located below the magnet 17. As the magnet 17 moves with the first movable member 11, the position sensing element 62 can detect the displacement of the magnet 17 to control the deformation of the shape memory alloy wire 41 and achieve closed-loop anti-shake motion control.

[0183] In one example of the present application, the resistance value of the shape memory alloy wire is detected to determine the displacement of the movable part 10 , thereby controlling the deformation of the shape memory alloy wire 41 to achieve closed-loop anti-shake motion control.

[0184] In one example of the present application, a detection magnet is provided in the photosensitive chip anti-shake camera module to detect the displacement of the movable part 10, thereby controlling the deformation of the shape memory alloy wire 41 to achieve closed-loop anti-shake motion control.

[0185] In addition, in other examples of the present application, the photosensitive chip and the associated part are directly fixed, and a first movable part is formed in the non-photosensitive area of ​​the photosensitive chip, so that the first movable part is movable relative to the outer periphery of the circuit board, thereby being movably installed on the fixed part.

[0186] The above description is merely a preferred embodiment of the present application and an illustration of the technical principles employed. Those skilled in the art should understand that the scope of the invention herein is not limited to the technical solutions formed by the specific combination of the above-mentioned technical features, but also encompasses other technical solutions formed by any combination of the above-mentioned technical features or their equivalents without departing from the inventive concept. For example, a technical solution formed by replacing the above-mentioned features with (but not limited to) technical features having similar functions disclosed in this application.

Claims

1. Photosensitive chip anti-shake camera module, characterized by: include: The photosensitive portion defines an optical axis; a movable portion, the movable portion comprising a first movable member and a second movable member, the photosensitive portion being fixed to the first movable member, and the second movable member being disposed above the first movable member; a fixed portion, the first movable member and the second movable member being movably mounted on the fixed portion; as well as The driving part includes a first driving part and a second driving part, the first driving part is located on opposite sides of a first axial direction perpendicular to the optical axis, and the second driving part is located on opposite sides of a second axial direction perpendicular to the optical axis and the first axial direction, the first driving part connects the first movable part and the second movable part, and drives the first movable part to perform translational motion along the first axial direction relative to the second movable part and the fixed part, and the second driving part connects the second movable part and the fixed part, and drives the second movable part to drive the first movable part to perform translational motion along the second axial direction relative to the fixed part.

2. The photosensitive chip anti-shake camera module according to claim 1, characterized in that: The invention comprises a first guide portion, which is arranged between the second movable member and the first movable member, and the first guide portion is configured to guide the first movable member to perform translational movement along the first axial direction.

3. The photosensitive chip anti-shake camera module according to claim 2, characterized in that: The first guide portion includes a first guide groove and a first ball, the first guide groove is provided in one of the first movable member and the second movable member, the first ball is placed in the first guide groove, wherein the first guide portion has a length extending along the first axial direction.

4. The photosensitive chip anti-shake camera module according to claim 2, characterized in that: The photosensitive chip anti-shake camera module also includes a shell, which is installed on the fixed part and covers the second movable part, wherein a second guide part is provided between the second movable part and the shell, and the second guide part is configured to guide the second movable part to perform translational movement along the second axis.

5. The photosensitive chip anti-shake camera module according to claim 4, characterized in that: The second guide portion includes a second guide groove and a second rolling ball. The second guide groove is provided on the second movable member and has a length extending along the second axial direction. The second rolling ball is placed in the second guide groove.

6. The photosensitive chip anti-shake camera module according to claim 1, characterized in that: The photosensitive portion includes a photosensitive circuit board and a photosensitive chip. The first movable member is integrally formed on the outer periphery of the photosensitive circuit board, and the photosensitive chip is mounted on the photosensitive circuit board.

7. The photosensitive chip anti-shake camera module according to claim 6, characterized in that: The fixed portion includes a peripheral portion of the circuit board, and the movable portion includes an elastic portion and an associated portion. The elastic portion connects the peripheral portion of the circuit board and the associated portion, and the associated portion is fixedly connected to the photosensitive circuit board.

8. The photosensitive chip anti-shake camera module according to claim 1, characterized in that: Each part of the driving part includes at least two first connecting members, at least one second connecting member and a shape memory alloy wire, the first connecting member is installed on the second movable member, and the shape memory alloy wire connects the first connecting member and the second connecting member, wherein the first connecting member is installed on the second movable member, the second connecting member of the first driving part is installed on the first movable member, and the second connecting member of the second driving part is installed on the fixed part.

9. The photosensitive chip anti-shake camera module according to claim 8, characterized in that: The shape memory alloy wires of each portion include a first shape memory alloy wire and a second shape memory alloy wire, which cross in a direction perpendicular to the optical axis to be controlled to extend or contract, respectively.

10. The photosensitive chip anti-shake camera module according to claim 9, characterized in that: At least two first connecting members are symmetrically arranged on both sides of the second connecting member to respectively fix one end of the first shape memory alloy wire and the second shape memory alloy wire, and the other ends of the first shape memory alloy wire and the second shape memory alloy wire are fixed to the second connecting member.

11. The photosensitive chip anti-shake camera module according to claim 10, characterized in that: The first connecting member includes a first connecting member body and a first coupling portion, the first coupling portion is formed by extending outward from the first connecting member body, and the second connecting member includes a second connecting member body and at least two second coupling portions, at least two second coupling portions extend outward from the same side of the second connecting member body, wherein the first coupling portion and the second coupling portion of each part of the driving portion are oriented in opposite directions.

12. The photosensitive chip anti-shake camera module according to claim 11, characterized in that: The fixing portion includes a base having a first window, the first movable member is installed in the first window, and the second connecting member of the second driving portion is installed in the base.

13. The photosensitive chip anti-shake camera module according to claim 12, characterized in that: The second movable part includes two first sides opposite to each other along the first axial direction and two second sides opposite to each other along the second axial direction, and a corner part connecting the first side parts and the second side parts, the first connecting part is installed at the corner part, and the second side part is closer to the optical axis than the first side part.

14. The photosensitive chip anti-shake camera module according to claim 13, characterized in that: The first movable part includes a second mounting protrusion relatively distributed along the first axial direction, the second mounting protrusion is located on the inner side of the first side portion, the second connecting part of the first driving part is mounted on the second mounting protrusion, and the second coupling part faces the base.

15. The photosensitive chip anti-shake camera module according to claim 13, characterized in that: The base includes first mounting protrusions relatively distributed along the second axial direction, the first mounting protrusions are located outside the second side portion, the second connecting member of the second driving portion is mounted on the first mounting protrusions, and the second coupling portion faces the first movable member.

16. The photosensitive chip anti-shake camera module according to claim 9, characterized in that: The second movable member is provided with a metal member, the metal member is built into the second movable member, and the metal member is conductively connected to the first connecting member so as to be conductively connected to the first shape memory alloy wire and the second shape memory alloy wire.

17. The photosensitive chip anti-shake camera module according to claim 9, characterized in that: The first shape memory alloy wire of each part and the second shape memory alloy wire of each part generate a force pointing in a clockwise direction or a counterclockwise direction around the optical axis, driving the movable part to rotate around the optical axis with the photosensitive part to prevent shaking.

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