Wiring substrate and electronic module having the same

Abstract

The possibility of damage to a wiring substrate is reduced, and heat dissipation of the wiring substrate is improved. The side surface of the wiring substrate has a main side surface at a central portion in the thickness direction and an inclined surface. The inclined surface has a first portion and a second portion from the first surface side having a mounting region, the first portion and the second portion have different surface shapes, and the second portion has a plurality of convex portions.

Description

Technical Field

[0001] This disclosure relates to a wiring substrate and an electronic module having the wiring substrate. Background Technology

[0002] A wiring substrate for mounting electronic components, consisting of a plurality of ceramic layers, is known.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2009-170499 Summary of the Invention

[0006] One aspect of the present disclosure is a wiring substrate, wherein the wiring substrate has an insulating substrate having a first surface and a plurality of side surfaces connected to the first surface, at least one of the side surfaces having: a main side surface having at least a portion located at a central portion in the thickness direction of the side surface having a surface parallel to the thickness direction; and an inclined surface connecting the first surface and the main side surface, the inclined surface having a first portion connected to the first surface and a second portion located between the first portion and the main side surface, the first portion and the second portion having different surface shapes, the second portion having a plurality of protrusions. Attached Figure Description

[0007] Figure 1 This is a perspective view of the electronic module involved in the embodiments of this disclosure.

[0008] Figure 2 This is a magnified view of a portion of the mother substrate.

[0009] Figure 3 yes Figure 1 An enlarged view of region P shown.

[0010] Figure 4 yes Figure 3 Microscopic image of region Q shown.

[0011] Figure 5 Viewed from the negative X-axis direction Figure 3 A side view of the wiring substrate.

[0012] Figure 6 Shot from the negative X-axis direction Figure 5 Microscopic photograph of region R shown.

[0013] Figure 7 It is taken from an oblique upward direction relative to the wiring board. Figure 5 Microscopic image of region R shown.

[0014] Figure 8 These are microscope photographs showing the surface shape of the first part involved in the embodiments of this disclosure.

[0015] Figure 9 These are microscope photographs showing the surface shape of the second part involved in the embodiments of this disclosure.

[0016] Figure 10 These are microscope images of the mother substrate taken from an oblique, upward angle.

[0017] Figure 11 yes Figure 3 The sectional view along line IX-IX shown.

[0018] Figure 12 yes Figure 3 The sectional view along line XX is shown.

[0019] Figure 13 This is an enlarged perspective view of the wiring substrate involved in other embodiments of this disclosure.

[0020] Figure 14 This is a top view of a wiring substrate involved in other embodiments of this disclosure. Detailed Implementation

[0021] In wiring boards, it is desirable to improve the quality of the wiring board.

[0022] According to one aspect of this disclosure, the possibility of damage to the wiring substrate can be reduced, and the heat dissipation of the wiring substrate can be improved.

[0023] [Implementation Method]

[0024] The wiring substrate and electronic module involved in the embodiments of this disclosure are described in detail with reference to the accompanying drawings.

[0025] The distinction between "top" and "bottom" in the following description is for convenience and does not limit the actual use of wiring substrates and electronic modules. In this specification, the surface on the wiring substrate where the electronic components are mounted is defined as the top surface. Furthermore, in the accompanying drawings, the positive Z-axis is defined as the top direction. The X-axis is the minor axis direction of the wiring substrate, and the Y-axis is the axis perpendicular to both the X-axis and Z-axis. Additionally, the Z-axis is defined as the thickness direction of the wiring substrate.

[0026] Figure 1 This is a perspective view of the exemplary electronic module 700 disclosed herein. (See figure.) Figure 1 As shown, the electronic module 700 includes a wiring substrate 500 and electronic components 600. The wiring substrate 500 includes an insulating substrate 100 and wiring conductors 300.

[0027] exist Figure 1In the diagram, the outline of the electronic component 600 is represented by dashed lines. The electronic component 600 can be mounted on the first surface 120, for example, by bonding it to the first surface 120 using bonding materials such as solder, glass, or adhesive, or indirectly mounted on the first surface 120 using components such as a pedestal. The electronic component 600 can be a semiconductor element, a piezoelectric element, a sensor element, or a passive element, such as a CCD (Charge-Coupled Device) element or a CMOS (Complementary Metal-Oxide Semiconductor) element. Alternatively, the electronic component 600 can also be a display element such as a liquid crystal display. Figure 1 An example of an electronic component 600 mounted on a wiring substrate 500 is shown, but multiple electronic components 600 of multiple types can also be mounted on an electronic module 700.

[0028] The insulating substrate 100 of the wiring substrate 500 is, for example, a flat insulator with a rectangular shape when viewed from above. Figure 1 The insulating substrate 100 shown has a first surface 120, a second surface 130 located on the opposite side of the first surface, four side surfaces 140, and corners 150.

[0029] The first surface 120 may include a mounting area for mounting the electronic component 600. The mounting area 180 in the first surface 120 may be an area that overlaps with the electronic component 600 when the wiring substrate 500 is viewed from above. In addition, a plurality of connection electrodes 310 electrically connected to the electrodes of the electronic component 600 may be located on the first surface 120. The connection electrodes 310 are electrically connected to the electrodes of the electronic component 600, for example, via conductive bonding materials such as bonding wires or solder.

[0030] The connecting electrode 310 may be part of the wiring conductor 300 of the wiring substrate 500. For example... Figure 3 As shown, the wiring substrate 500, in addition to the connecting electrode 310, may also have internal wiring 320 located inside the insulating substrate 100 and extending in a direction parallel to the first surface 120. Furthermore, the wiring conductor 300 may include via conductors extending along the thickness direction of the insulating substrate 100. The wiring conductor 300 may also include external terminal electrodes located on the second surface 130 and electrically connected to electrodes of external devices. The connecting electrode 310 may be electrically connected to the external terminal electrode via the via conductor and / or the internal wiring 320.

[0031] Side 140 may be the surface connecting the first surface 120 and the second surface 130. Corner 150 may be the portion located between the two side surfaces 140. Figure 1As shown, the corner 150 can be chamfered. Alternatively, the corner 150 located between the two side surfaces 140 can have a surface that connects the two side surfaces 140. By chamfering the corner 150, the possibility of notches being formed in the corner 150 of the insulating substrate 100 can be reduced.

[0032] The insulating substrate 100 may be, for example, an alumina sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body, etc. The insulating substrate 100 may comprise a plurality of stacked insulating layers.

[0033] The wiring substrate 500 can be a substrate formed by cutting a mother substrate along a slitting groove. Specifically, the wiring substrate 500 can be manufactured, for example, by fabricating a mother substrate and dividing the mother substrate into individual pieces. The mother substrate can also be referred to as a multi-piece substrate. Figure 2 This is an enlarged view of the adjacent portion of two wiring substrate regions 500B in the mother substrate before splitting. The mother substrate has a plurality of wiring substrate regions 500B arranged longitudinally and transversely on the substrate surface. Each wiring substrate region 500B is a region that is monolithically processed to become a wiring substrate 500. The mother substrate has a dividing groove G at the boundary between two adjacent wiring substrate regions 500B, and a monolithically processed wiring substrate 500 is obtained by breaking the mother substrate along the dividing groove G. The two wiring substrate regions 500B do not necessarily need to be adjacent. For example, a portion not used as a wiring substrate 500 (hereinafter referred to as a dummy region) can be formed between two wiring substrate regions 500B, and the wiring substrate regions 500B can be arranged with these dummy regions spaced apart. That is, in the mother substrate, the dummy regions can be located between each wiring substrate region 500B.

[0034] The dividing groove G can be formed, for example, by using a laser to locally remove the mother substrate before or after firing. As for the laser used to form the dividing groove G, for example, a carbon dioxide laser, a fiber laser, a YAG (Yttrium-Aluminum-Garnet) laser, a femtosecond laser, or a picosecond laser can be used. Femtosecond or picosecond lasers remove the target material by photons breaking interatomic bonds. Therefore, when using a femtosecond or picosecond laser to form the dividing groove, the thermal impact on the wiring substrate 500 can be reduced compared to forming the dividing groove G on the mother substrate using a fiber laser or the like.

[0035] Figure 3 yes Figure 1 A magnified view of region P in the image. (See image below.) Figure 3As shown, the side surface 140 of the wiring substrate 500 has: a main side surface 143, located at the center of the side surface 140 in the thickness direction (Z direction) and having a surface parallel to the thickness direction; and an inclined surface 140B, connecting the first surface 120 to the main side surface 143. Furthermore, the inclined surface 140B has a first portion 141 connected to the first surface 120, and a second portion 142 located between the first portion 141 and the main side surface 143. In this specification, "parallel" does not need to be strictly parallel; it can be approximately parallel. For example, the main side surface 143 may be slightly inclined (±5°) relative to the Z-axis. Additionally, if the main side surface 143 is not strictly flat, it is sufficient that it is mainly parallel to the Z-axis.

[0036] The wiring substrate 500 may also have an inclined surface 140C on the second surface 130 side, connecting the second surface 130 to the main surface 143. The inclined surface 140C has a fifth portion 145 connected to the second surface 130, and a fourth portion 144 located between the fifth portion 145 and the main surface 143. That is, the wiring substrate 500 may have: a main surface 143, located at the center of the side 140 in the thickness direction; and inclined surfaces 140B and 140C, respectively located closer to the first surface 120 and the second surface 130 than the main surface 143.

[0037] When the wiring substrate 500 is a substrate manufactured by dividing a mother substrate, the inclined surfaces 140B and 140C can be surfaces corresponding to the inner surfaces of the dividing grooves G in the mother substrate. In addition, the main side surface 143 can be a portion corresponding to the fracture surface formed when the mother substrate breaks during the division.

[0038] The following uses Figures 4 to 12 The side 140 structure of the wiring substrate 500 is described in detail.

[0039] Figure 4 yes Figure 3 Microscopic image of region Q shown. Figure 5 Viewed from the negative X-axis direction Figure 3 A side view of the wiring substrate. Figure 6 Shot from the negative X-axis direction Figure 5 Microscopic photograph of region R shown. Figure 7 Shot from an oblique angle relative to the wiring board 500 Figure 5 Microscopic photograph of region R shown. Figure 8 It is a microscope photograph showing the surface shape of the first part 141. Figure 9 It is a microscope photograph showing the surface shape of the second part 142. Figure 8 as well as Figure 9 The photos were taken at the same scale. Figure 10This is a microscope photograph taken from an oblique upward direction relative to the mother substrate before the wiring board 500 is monolithized. Figure 11 It is Figure 3 A sectional view taken along line IX-IX when cut with a plane perpendicular to the first plane. Figure 12 It is Figure 3 A view of the end face when cut along line XX with a plane perpendicular to the first part 141. Figure 11 as well as Figure 12 It is a rough sketch used to illustrate the shape and is not necessarily recorded in the correct dimensions.

[0040] like Figures 4 to 12 As shown, the first portion 141 and the second portion 142 of the inclined surface 140B have different surface shapes. The differences between the surface shapes of the first portion 141 and the second portion 142 are described in detail below.

[0041] like Figure 6 , Figure 7 as well as Figure 9 As shown, the second portion 142 has a plurality of protrusions 142P. The protrusions 142P can extend in a direction along the first surface 120. The protrusions 142P extending along the first surface 120 may not be straight, but may have a wavy shape. In other words, the protrusions 142P can undulate, and their distance from the first surface 120 can also vary. The plurality of protrusions 142P extending along the first surface 120 can be located at different heights in the wiring substrate 500. Through the plurality of protrusions 142P located at different heights in the wiring substrate 500 and extending along the first surface 120, the surface of the second portion 142 can be as follows: Figure 5 as well as Figure 11 As shown, it forms a stepped shape.

[0042] The spacing D6 between the plurality of protrusions 142P can be greater than 1 μm and less than 20 μm. For example... Figure 11 As shown, the spacing D6 between the protrusions 142P in this specification can be the spacing between the tips of the protrusions 142P when viewed from a direction perpendicular to the main side surface 143 (Y direction). Figure 6 , Figure 7 , Figure 11 As shown, the interval D6 can be larger the further away from the first face 120.

[0043] The second portion 142 has a plurality of protrusions 142P, increasing its surface area. This improves the heat dissipation of the wiring substrate 500. Furthermore, by extending the protrusions 142P along the first surface 120, the likelihood of the bonding material connecting the electronic component 600 to the wiring substrate 500 reaching the main side surface 143 when flowing from the first surface 120 towards the side surface 140 is reduced. This reduces the possibility of changes in the external dimensions of the wiring substrate 500 due to the bonding material. By setting the spacing D6 between the protrusions 142P to be larger the further away from the first surface 120, it is easy to restrict the movement of the bonding material. Furthermore, by setting the spacing D6 between the protrusions 142P to be 1 μm or more and 20 μm or less, it is easy to further improve heat dissipation and restrict the movement of the bonding material.

[0044] Furthermore, the second part 142 may have a melt-resolidified layer. This melt-resolidified layer is formed by the molten ceramic being ignited by a laser and then cooled and resolidified. For example... Figure 8 as well as Figure 9 As shown, by having a melt-resolidified layer in the second portion 142, the surface of the second portion 142 can be made smoother than that of the first portion 141. Therefore, when the insulating substrate 100 is made of ceramic material, since the second portion 142 melts and solidifies, the possibility of the ceramic material on the surface of the insulating substrate 100 being peeled off can be reduced.

[0045] The first portion 141 differs from the second portion 142 described above in that it does not have a protrusion 142P extending in the direction along the first surface 120. That is, on the inclined surface 140B, the portion without the protrusion 142P can be defined as the first portion 141, and the portion with the protrusion 142P can be defined as the second portion 142. For example... Figure 7 , Figure 10 as well as Figure 12 As shown, the first portion 141 may have a plurality of grooves 141C extending in a direction from the first surface 120 toward the second portion 142. The surface irregularities of the first portion 141 formed by the grooves 141C may be finer than the surface irregularities of the second portion 142 formed by the protrusions 142P. Specifically, the spacing between adjacent grooves 141C may be smaller than the spacing between adjacent protrusions 142P. The spacing between the grooves 141C may be the distance between the centers of each groove 141C in the width direction.

[0046] The heat dissipation of the wiring board 500 can be further improved by having a plurality of slots 141C in the first part 141.

[0047] Thus, the first part 141 and the second part 142 have different surface shapes. These different surface shapes can be obtained by changing the laser irradiation conditions in the part corresponding to the first part 141 and the part corresponding to the second part 142 when the dividing groove G is made by laser in the state of the mother substrate.

[0048] And, as Figure 10 As shown, the first portion 141 may have a convex curved surface. A convex curved surface refers to a portion of the wiring substrate 500 that has a convex surface shape in a direction away from the center of the wiring substrate 500. The first portion 141 may have a convex curved surface in at least a portion thereof. Alternatively, the surface of the first portion 141 may be a curved surface that is convex overall relative to the wiring substrate 500. In other words, the entire surface of the first portion 141 may be a convex curved surface. The curvature of this surface may not be fixed in the height direction of the wiring substrate 500, and may be greater closer to the first surface 120. By having a convex curved surface in the first portion 141, the corners between the first surface 120 and the side surface 140 of the wiring substrate 500 can be made smoother. This reduces the possibility of the wiring substrate 500 being chipped in the event of collision with other components, such as during the mounting of the electronic component 600.

[0049] As described above, the wiring substrate 500 has a main side surface 143 and an inclined surface 140B. The inclined surface 140B has a first portion 141 connected to the first surface 120 and a second portion 142 located between the first portion 141 and the main side surface 143. The first portion 141 and the second portion 142 have different surface shapes. In addition, the second portion 142 has a plurality of protrusions 142P. With this structure, the possibility of damage to the wiring substrate 500 can be reduced, and the heat dissipation of the wiring substrate can be improved.

[0050] The following is a detailed description of the main side panel 143. Figure 4 In the diagram, the boundary of the main side surface 143 near corner 150 is shown by a dashed line. (See diagram below.) Figure 4 As shown, the thickness dimension of the insulating substrate 100 of the main side surface 143 can decrease as it approaches the corner 150. In other words, the main side surface 143 is rounded as it approaches the corner 150. With this structure, the length of the sharp angle at the boundary between the corner 150 and the main side surface 143 is reduced, thus decreasing the likelihood of the wiring substrate 500 being damaged in the event of a collision between the wiring substrate 500 and other components during the mounting of the electronic component 600. The main side surface 143 may or may not be connected to the corner 150. When the main side surface 143 is not connected to the corner 150, the second portion 142 may be located between the corner 150 and the main side surface 143.

[0051] Furthermore, the surface roughness of the main side surface 143 can be greater than the surface roughness of the first portion 141. In other words, the surface roughness of the first portion 141 can be less than the surface roughness of the main side surface 143. The surface roughness in this disclosure can be an arithmetic mean roughness Ra, for example, it can be measured by AFM (Atomic Force Microscope). By reducing the surface roughness of the first portion 141, the corner connected to the first surface 120 of the wiring substrate 500 can be rounded, thus reducing the possibility of notches forming in the wiring substrate 500. In addition, by increasing the surface roughness of the main side surface 143, heat can also be released efficiently on the main side surface 143.

[0052] Moreover, such as Figure 3 as well as Figure 4 As shown, the end of the internal wiring 320 can be exposed on the main side 143. By exposing a portion of the internal wiring 320 on the surface of the wiring substrate 500, the heat dissipation of the wiring substrate 500 can be further improved.

[0053] like Figure 5 As shown, the inclination angle F1 of the first portion 141 relative to the main side surface 143 can be greater than the inclination angle F2 of the second portion 142 relative to the main side surface 143. As described above, the inclined surface 140B including the first portion 141 and the second portion 142 can correspond to the dividing groove G formed on the mother substrate. Because the inclination angle F1 of the first portion 141 relative to the main side surface 143 is greater than the inclination angle F2 of the second portion 142 relative to the main side surface 143, the groove formed by adjacent second portions 142 further becomes an acute angle. Therefore, it is easier to break the mother substrate. Therefore, the quality of the wiring board 500 can be improved. More specifically, the inclination angle of the main side surface 143 relative to the first surface 120 and / or the second surface 130 can be close to 90°.

[0054] Moreover, such as Figure 5 As shown, the inclination angle F1 of the first portion 141 relative to the main side surface 143 can be greater than the inclination angle F2 of the second portion 142 relative to the main side surface 143. In the Z-axis direction, the dimension D1 of the first portion 141 can be greater than the dimension D2 of the second portion 142. This structure makes it easier to break the mother substrate, thus improving the quality of the wiring substrate 500. When the thickness of the wiring substrate 500 is small, the dimension D1 of the first portion 141 can also be smaller than the dimension D2 of the second portion 142. A small thickness of the wiring substrate 500 can be, for example, a dimension T in the Z-axis direction from the first surface 120 to the second surface 130 of 0.4 mm or less.

[0055] In addition, such as Figure 5As shown, in the Z-axis direction, the combined dimension D12 of the first part 141 (dimension D1) and the second part 142 (dimension D2) can be 15% to 30% of the dimension T from the first surface 120 to the second surface 130. This structure ensures the area of ​​the main side surface 143. Therefore, the internal wiring 320 is not exposed on the inclined surfaces 140B and 140C, but is easily exposed at the connection points between adjacent wiring substrates in the mother substrate state, i.e., the main side surface 143, thereby facilitating interconnection between the wiring substrates in the mother substrate state. By facilitating interconnection between the wiring substrates, a plating layer can be easily formed on the wiring conductor 300 of the wiring substrate 500. The value of dimension T can be, for example, 0.3 mm or more and 2.0 mm or less.

[0056] Figure 3 as well as Figure 5 The fifth part 145 shown may have the same or similar surface shape as the first part 141. The fourth part 144 may have the same or similar surface shape as the second part 142.

[0057] The dimension D5 of the fifth part 145 in the Z-axis direction can be the same as or different from the dimension D1 of the first part 141. The dimension D4 of the fourth part 144 in the Z-axis direction can be the same as or different from the dimension D2 of the second part 142. The total dimension D45 of dimensions D4 and D5 can be the same as or different from the dimension D12.

[0058] The dimension D3 of the main side surface 143 in the Z-axis direction can be more than 40% and less than 70% of the dimension T. This structure ensures the area of ​​the main side surface 143.

[0059] Figure 13 as well as Figure 14 This diagram illustrates a wiring substrate 500 according to other embodiments of the present disclosure. In other embodiments, the wiring substrate 500 may have an opening 121 on its first surface 120. The opening 121 may penetrate the wiring substrate 500. Furthermore, the opening 121 may be configured to be offset towards any one of the plurality of side surfaces 140 in the X-axis or Y-axis direction. More specifically, as... Figure 13 as well as Figure 14 As shown, the distance L1 from the first part 141 in the X direction to the opening 121 can be greater than the distance L2 from the first part 141 in the Y direction to the opening 121.

[0060] The main side surface 143 may have one or more protrusions protruding outwards (in the X or Y direction of the drawing) toward the outer side of the wiring substrate 500. These protrusions improve the heat dissipation of the wiring substrate 500. The protrusions may be integral with the insulating substrate 100. Alternatively, the protrusions may be so-called flash, which is formed when the mother substrate is cut along the dividing groove G. Protrusions are defined as portions in the X, Y, and Z directions whose dimensions are larger than the protrusion 142P.

[0061] More specifically, such as Figure 13 as well as Figure 14 As shown, the wiring substrate 500 may have a first protrusion 1431 protruding from the main side surface 143 along the Y direction in the X direction and a second protrusion 1432 protruding from the main side surface 143 along the X direction in the Y direction. The first protrusion 1431 and the second protrusion 1432 are examples of protrusions of the present disclosure. A plurality of the first protrusion 1431 and the second protrusion 1432 may exist on each main side surface 143. In addition, the distance T1 (hereinafter referred to as the first protrusion amount T1) from the main side surface 143 along the Y direction to the location of the first protrusion 1431 furthest from the main side surface 143 in the X direction may be less than the distance T2 (hereinafter referred to as the second protrusion amount T2) from the main side surface 143 along the X direction to the location of the second protrusion 1432 furthest from the main side surface 143 in the Y direction.

[0062] The wiring substrate 500 has an opening 121. When the distance L1 from the first portion 141 in the X direction to the opening 121 is greater than the distance L2 from the first portion 141 in the Y direction to the opening 121, the thickness of the edge of the wiring substrate 500 in the X direction is less than the thickness of the edge of the wiring substrate 500 in the Y direction. In this case, the heat dissipation of the edge of the wiring substrate 500 in the X direction can be improved by making the second protrusion T2 of the second protrusion 1432 protruding from the main side surface 143 in the X direction in the Y direction greater than the first protrusion T1 of the first protrusion 1431 protruding from the main side surface 143 in the Y direction in the X direction, thereby reducing the deviation of the heat dissipation performance of the wiring substrate 500 in the XY direction. That is, when the distance L1 > the distance L2, the first protrusion T1 can be less than the second protrusion T2.

[0063] Furthermore, when the wiring substrate 500 has a shape with a short side and a long side, the volume of the components constituting the wiring substrate 500 is smaller on the short side compared to the long side, thus the heat capacity tends to be smaller. Therefore, the deviation in heat dissipation performance when the wiring substrate 500 has a shape with a short side and a long side can be reduced by making the second protrusion T2 of the second protrusion 1432 protruding from the main side 143 along the short side larger than the first protrusion T1 of the first protrusion 1431 protruding in the X direction from the main side 143 along the long side. When the length of a certain side is set as t1 and the lengths of different sides are set as t2, if t1 > t2, the first protrusion T1 can be < the second protrusion T2.

[0064] 〔Summarize〕

[0065] (1) A wiring substrate of embodiment 1 of the present disclosure, wherein the wiring substrate has an insulating substrate, the insulating substrate has a first surface and a plurality of side surfaces connected to the first surface, at least one of the side surfaces having: a main side surface, at least a portion of which is located in the central portion in the thickness direction of the side surface and has a surface parallel to the thickness direction; and an inclined surface connecting the first surface and the main side surface, the inclined surface having a first portion connected to the first surface and a second portion located between the first portion and the main side surface, the first portion and the second portion having different surface shapes, the second portion having a plurality of protrusions.

[0066] (2) The wiring substrate of the present disclosure in embodiment 2, wherein in embodiment 1 above, the insulating substrate further has a corner located between the sides, and the dimension of the insulating substrate in the thickness direction of the main side decreases toward the corner.

[0067] (3) The wiring substrate of the present disclosure in embodiment 3, in embodiment 1 or 2 above, a plurality of the protrusions extend in the direction along the first surface.

[0068] (4) In any of the above embodiments 1 to 3, the inclination of the first part relative to the main side surface is greater than the inclination of the second part relative to the main side surface in the wiring substrate of embodiment 4 of this disclosure.

[0069] (5) The wiring substrate of the present disclosure in any of the above embodiments 1 to 4 has a convex curved surface in the first part.

[0070] (6) In the wiring substrate of the present disclosure 6, in the above-described embodiment 4, the size of the first portion is larger than the size of the second portion in the direction perpendicular to the first surface.

[0071] (7) The wiring substrate of the present disclosure in any of the above embodiments 1 to 6, wherein the first portion has a plurality of grooves extending in a direction from the first surface toward the second portion.

[0072] (8) The wiring substrate of embodiment 8 of this disclosure, in any of the embodiments 1 to 7 above, the insulating substrate has a second side located on the opposite side of the first side, and in a direction perpendicular to the first side, the total dimension of the first part and the second part is more than 15% and less than 30% of the dimension from the first side to the second side.

[0073] (9) In any of the above embodiments 1 to 8, the wiring substrate of embodiment 9 of this disclosure has a spacing of 1 μm or more and 20 μm or less between the plurality of said protrusions.

[0074] (10) The wiring substrate of the present disclosure in embodiment 10, in embodiment 9 above, wherein the spacing between the protrusions increases as they move away from the first surface.

[0075] (11) The wiring substrate of embodiment 11 of the present disclosure, in any of embodiments 1 to 10, further has a wiring conductor located within the insulating substrate, a portion of the wiring conductor being exposed on the main side.

[0076] (12) In any of the embodiments 1 to 11 described herein, the first portion of the wiring substrate does not have a protrusion extending in the direction along the first surface.

[0077] (13) In any of the above embodiments 1 to 12, the surface roughness of the main side surface is greater than the surface roughness of the first part of the wiring substrate of the present disclosure 13.

[0078] (14) In any of the embodiments 1 to 13 described above, the main side has one or more protrusions protruding toward the outside of the wiring substrate.

[0079] (15) The electronic module of method 15 of this disclosure, wherein, have: The wiring substrate described in any of the methods 1 to 14 above; and Electronic components located on the wiring substrate.

[0080] The invention disclosed herein has been described above based on the accompanying drawings and embodiments. However, the invention disclosed herein is not limited to the embodiments described above. That is, the invention involved in this disclosure can be modified in various ways within the scope shown in this disclosure, and embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included within the technical scope of the invention involved in this disclosure. In other words, those skilled in the art should note that various modifications or alterations can be easily made based on this invention. In addition, it should be noted that these modifications or alterations are included within the scope of this invention.

[0081] Explanation of reference numerals in the attached figures: 100 Insulating substrate 120 First page 121 Opening 130 Second page 140° side view 140B and 140C inclined surfaces 141 Part One 142 Part Two 142P convex part 143 Main and side views 1431 First protrusion 1432 Second protrusion 150 corner 300 wiring conductor 310 Connecting Electrode 320 Internal wiring 500 Wiring Board 600 electronic components 700 Electronic Module

Claims

1. A wiring substrate, wherein, The wiring substrate has an insulating substrate, the insulating substrate having a first surface and a plurality of side surfaces connected to the first surface. At least one of the sides has: The main side surface, at least a portion of which is located in the central part in the thickness direction of the side surface, has a surface parallel to the thickness direction; as well as An inclined surface connects the first surface and the main side surface. The inclined surface has a first portion connected to the first surface and a second portion located between the first portion and the main side surface. The first part and the second part have different surface shapes. The second part has a plurality of protrusions.

2. The wiring substrate according to claim 1, wherein, The insulating substrate also has corner portions located between the side surfaces. The thickness dimension of the insulating substrate on the main side surface decreases as it approaches the corner.

3. The wiring substrate according to claim 1 or 2, wherein, The plurality of the protrusions extend in a direction along the first surface.

4. The wiring substrate according to any one of claims 1 to 3, wherein, The inclination of the first part relative to the main side is greater than the inclination of the second part relative to the main side.

5. The wiring substrate according to any one of claims 1 to 4, wherein, The first part has a convex curved surface.

6. The wiring substrate according to claim 4, wherein, In a direction perpendicular to the first surface, the size of the first part is larger than the size of the second part.

7. The wiring substrate according to any one of claims 1 to 6, wherein, The first portion has a plurality of grooves extending in a direction from the first surface toward the second portion.

8. The wiring substrate according to any one of claims 1 to 7, wherein, The insulating substrate has a second side located on the opposite side of the first side. In the direction perpendicular to the first face, the combined size of the first portion and the second portion is more than 15% and less than 30% of the size from the first face to the second face.

9. The wiring substrate according to any one of claims 1 to 8, wherein, The plurality of said protrusions are spaced apart from each other by more than 1 μm and less than 20 μm.

10. The wiring substrate according to claim 9, wherein, The spacing between the protrusions increases as they move away from the first surface.

11. The wiring substrate according to any one of claims 1 to 10, wherein, The wiring substrate also has wiring conductors located within the insulating substrate. A portion of the wiring conductor is exposed on the main side.

12. The wiring substrate according to any one of claims 1 to 11, wherein, The first portion does not have a protrusion extending in the direction along the first surface.

13. The wiring substrate according to any one of claims 1 to 12, wherein, The surface roughness of the main side is greater than that of the first part.

14. The wiring substrate according to any one of claims 1 to 13, wherein, The main side has one or more protrusions that protrude outward toward the outside of the wiring substrate.

15. An electronic module, wherein, have: Wiring substrate according to any one of claims 1 to 14; and Electronic components located on the wiring substrate.

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