electronic control device

Abstract

An electronic control device (100) includes: a circuit board (3) on which an electronic component (4) is mounted; and an upper housing (1) and a lower housing (2) that house the circuit board (3), the upper housing (1) including a protruding portion (7) having a top surface opposite the circuit board (3), at least a portion of an upper surface of the electronic component (4) being thermally connected to the upper housing (1) via a heat dissipation member (6), and at least a portion of a side surface of the electronic component (4) being opposite the protruding portion (7) with the heat dissipation member (6) interposed therebetween. Thus, an electronic control device is provided that achieves further heat dissipation and radiation noise suppression compared to conventional structures.

Description

Technical Field

[0001] This invention relates to electronic control devices. Background Technology

[0002] As an example of an electronic control device capable of efficiently dissipating heat from a heating element, Patent Document 1 describes a cover mounted on a circuit board on which a heating element is mounted, the cover having a foot and a plate. The foot is erected around the heating element on the circuit board, and the plate for heat dissipation is connected to the upper part of the foot, the lower surface of which is close to the upper surface of the heating element, and the upper surface of which is close to the inner wall of the upper housing.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2005-012127 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] To achieve highly automated driving functions, vehicle-mounted electronic control devices are equipped with microcomputers capable of high-speed computing and processing. However, as the required automated driving functions are upgraded, the computing power of microcomputers increases year by year, and the heat generation also increases proportionally.

[0008] The following problem has existed in the past: if thermal grease is applied to electronic components for heat dissipation, the potential changes caused by the operation of the electronic components will propagate to the casing due to the parasitic capacitance of the thermal grease, and electromagnetic noise will be radiated to the outside from the gaps in the casing.

[0009] To address this issue, the technology described in Patent Document 1 suppresses radiated noise by applying a localized shielding structure to electronic components that become noise sources. Furthermore, since the heat dissipation component is coated on the semiconductor chip, both heat dissipation and EMC can be considered.

[0010] In recent years, due to the further improvement of autonomous driving levels, the continuous expansion of ECU (Electronic Control Unit) integration and the continuous improvement of performance requirements, the SiP (System in Package) and chiplet development of electronic components have continued, and further high heat generation and high frequency have become issues.

[0011] Research has revealed that when attempting to apply the technology described in Patent Document 1 to next-generation products, the thermal grease may be insufficient in heat dissipation because it is only applied to the semiconductor chip. Furthermore, due to the parasitic capacitance of the thermal grease, the loop of potential changes caused by the operation of electronic components becomes a path from the upper surface of the chip through the pins, resulting in insufficient suppression of radiated noise. Therefore, there is room for improvement.

[0012] The present invention provides an electronic control device that achieves further improved heat dissipation and radiated noise suppression compared to conventional structures.

[0013] Methods for solving problems

[0014] The present invention includes several means for solving the above-mentioned problems. For example, it includes: a circuit board on which electronic components are mounted; and a housing for accommodating the circuit board, the housing having a protrusion having a top surface opposite to the circuit board, at least a portion of the upper surface of the electronic components being thermally connected to the housing via a heat dissipation member, and at least a portion of the side surface of the electronic components being opposite to the protrusion through the heat dissipation member.

[0015] The effects of the invention

[0016] According to the present invention, further improvements in heat dissipation and radiated noise suppression compared to conventional structures can be achieved. Other issues, structures, and effects beyond those described above will become clear through the following description of embodiments. Attached Figure Description

[0017] Figure 1 This is a perspective view of the electronic control device according to the first embodiment of the present invention.

[0018] Figure 2 This is a top perspective view of the housing of the electronic control device according to the first embodiment.

[0019] Figure 3 yes Figure 2 Sectional view along line II.

[0020] Figure 4 yes Figure 2 Sectional view along line II-II.

[0021] Figure 5 This is a graph showing the results verifying the noise current reduction effect of the present invention and the comparative example.

[0022] Figure 6 This is a graph showing the results of verifying the effect of the present invention on reducing the temperature rise compared to the comparative example.

[0023] Figure 7 The electronic control device according to the second embodiment is equivalent to Figure 2 The diagram of the cross section along line II.

[0024] Figure 8 The electronic control device according to the second embodiment is equivalent to Figure 2 A diagram of the cross section along line II-II.

[0025] Figure 9 The electronic control device involved in the variation of the second embodiment is equivalent to Figure 2 The diagram of the cross section along line II.

[0026] Figure 10 The electronic control device involved in the third embodiment is equivalent to Figure 2 A diagram of the cross section along line II-II.

[0027] Figure 11 The electronic control device according to the fourth embodiment is equivalent to Figure 2 The diagram of the cross section along line II.

[0028] Figure 12 The electronic control device according to the fifth embodiment is equivalent to Figure 2 The diagram of the cross section along line II.

[0029] Figure 13 The electronic control device according to the sixth embodiment is equivalent to Figure 2 The diagram of the cross section along line II.

[0030] Figure 14 This is a top perspective view of the housing of the electronic control device according to the seventh embodiment.

[0031] Figure 15 This is a top perspective view of the housing of the electronic control device according to the eighth embodiment.

[0032] Figure 16 This is a top perspective view of the housing of the electronic control device according to the ninth embodiment.

[0033] Figure 17 The electronic control device according to the ninth embodiment is equivalent to Figure 2 The diagram of the cross section along line II.

[0034] Figure 18 The electronic control device according to the tenth embodiment is equivalent to Figure 2 The diagram of the cross section along line II.

[0035] Figure 19 It is equivalent to the electronic control device according to the eleventh embodiment. Figure 2 The diagram of the cross section along line II.

[0036] Figure 20 The equivalent of the electronic control device in the twelfth embodiment Figure 2 The diagram of the cross section along line II.

[0037] Figure 21 The equivalent of the electronic control device in the thirteenth embodiment Figure 2 The diagram of the cross section along line II. Detailed Implementation

[0038] Hereinafter, embodiments of the electronic control device of the present invention will be described using the accompanying drawings. Furthermore, in the drawings used in this specification, the same or corresponding constituent elements are labeled with the same or similar symbols, and sometimes repeated descriptions of these constituent elements are omitted.

[0039] <First Implementation>

[0040] The first embodiment of the electronic control device of the present invention will be described with reference to Figures 1 to 6.

[0041] First, the overall structure and cross-sectional structure of the electronic control device will be described with reference to Figures 1 to 4. Figure 1 This is a perspective view of the electronic control device according to the first embodiment of the present invention. Figure 2 This is a perspective view of the housing of the electronic control device according to the first embodiment. Figure 3 yes Figure 2 Sectional view along line II, Figure 4 yes Figure 2 Sectional view along line II-II.

[0042] Figure 1 and Figure 2 The electronic control device 100 shown includes: an upper housing 1 and a lower housing 2 that house the circuit board 3, a heat sink 9 formed on the upper surface of the upper housing 1, and a connector 10 that serves as a connection terminal to the outside.

[0043] like Figure 1 As shown, the electronic control device 100 consists of a lower housing 2 and an upper housing 1, and is generally box-shaped. A circuit board 3 is housed and disposed within this housing. Specifically, the circuit board 3 is sandwiched between the lower housing 2 and the upper housing 1, and in this state, a screw (not shown) is passed through the lower housing 2 and the circuit board 3 and screwed into the upper housing 1, thereby fixing the circuit board 3.

[0044] In order to dissipate heat from the electronic component 4 to the outside of the housing, the upper housing 1 is made of metals such as copper, iron, aluminum, and magnesium, or resin on which at least a portion of its surface has been coated with a metal film through electroplating or the like. The lower housing 2 is also made of the same metals as the upper housing 1, such as copper, iron, aluminum, and magnesium, or resin on which at least a portion of its surface has been coated with a metal film through electroplating or the like.

[0045] like Figure 2 As shown, electronic components 4 and grounding parts 5 are mounted on circuit board 3. Furthermore, it goes without saying that the mounting positions of electronic components 4 and grounding parts 5 on circuit board 3 are merely an example and can be appropriately changed according to the design.

[0046] The electronic component 4 consists of one or more high-heat-generating components 4a and one or more low-heat-generating components 4b that serve as heat sources such as I / O circuits, and a substrate 4c on which these high-heat-generating components 4a and low-heat-generating components 4b are mounted. The high-heat-generating components 4a and low-heat-generating components 4b are arranged on the substrate 4c opposite to the upper housing 1.

[0047] like Figure 3 As shown, a protrusion 7 is provided on the upper housing 1 at a position corresponding to the side on the circuit board 3 where the electronic component 4 is mounted, protruding to cover the electronic component 4. The top surface of this protrusion 7 faces the grounding portion 5 of the circuit board 3. That is, the upper housing 1 has a protrusion 7, which has a top surface facing the circuit board 3.

[0048] The protrusion 7 is made of metals such as copper, iron, aluminum, and magnesium, or resin with a metal coating formed on at least a portion of its surface. It has high thermal conductivity and can be made of the same material as the upper shell 1. In this embodiment, the upper shell 1 and the protrusion 7 are made of the same molded body made of the same material.

[0049] like Figure 3 As shown, a heat dissipation member 6 is filled in the inner circumferential side of the protrusion 7, on the upper surface side of the electronic component 4, where the high-heat-generating component 4a and the low-heat-generating component 4b are formed, so that there is no space between them for gas to exist. Thus, in the electronic component 4, the upper surfaces of the high-heat-generating component 4a and the low-heat-generating component 4b are thermally connected to the upper housing 1 via the heat dissipation member 6.

[0050] Furthermore, in the electronic control device 100 of this embodiment, such as Figure 3As shown, not only the upper surface of the electronic component 4, but also the sides of the high-heat-generating component 4a and the low-heat-generating component 4b in the electronic component 4, are filled with heat dissipation component 6 in a manner that is separated from the protrusion 7 by heat dissipation component 6. Therefore, there is no gas between the sides of the high-heat-generating component 4a and the low-heat-generating component 4b in the electronic component 4 and the inner peripheral surface of the protrusion 7 opposite to the sides of the sides.

[0051] In addition, Figure 3 The diagram shows the sides of all the high-heat-generating components 4a and low-heat-generating components 4b of the electronic component 4 facing the protrusion 7 with the heat dissipation component 6 in between, but it is sufficient that at least one of the high-heat-generating components 4a or low-heat-generating components 4b on the electronic component 4 faces the protrusion 7 with the heat dissipation component 6 in between.

[0052] For example, as described later. Figure 9 and Figure 17 As shown, a portion of either the high-heat-generating component 4a or the low-heat-generating component 4b may be positioned opposite the protrusion 7 without being separated by the heat dissipation component 6.

[0053] In addition, not limited to, as in Figure 3 The arrangement shown is such that the heat dissipation component 6 is also filled inside the protrusion 7, which is located further up to the upper housing 1 than the highest heat-generating component 4a facing the upper housing 1, and there is no gas inside it. That is, most of the space inside the protrusion 7 is filled with the heat dissipation component 6. Alternatively, the heat dissipation component 6 could not be filled inside the protrusion 7, which is located further up to the upper housing 1 than the highest heat-generating component 4a facing the upper housing 1, thus creating a space where gas can exist. However, from a manufacturing point of view, the arrangement shown is preferred. Figure 3 That is filled by the heat dissipation component 6.

[0054] in addition, Figure 3 The portion of the upper surface of the substrate 4c where the high-heat-generating component 4a and the low-heat-generating component 4b are not formed is also covered by the heat dissipation component 6 and filled with the heat dissipation component 6 so that there is no gas between them. That is, the upper surface of the substrate 4c is also thermally connected to the upper housing 1 via the heat dissipation component 6. However, for the upper surface of the substrate 4c, as long as at least one of the high-heat-generating component 4a or the low-heat-generating component 4b on the electronic component 4 has its side facing the protrusion 7 through the heat dissipation component 6, it may not be covered by the heat dissipation component 6.

[0055] In addition, although it is shown that the side of the substrate 4c in the electronic component 4 is not covered by the heat dissipation component 6 and faces the protrusion 7 through the heat dissipation component 6, the side of the substrate 4c may also face the protrusion 7 through the heat dissipation component 6.

[0056] and then, Figure 3 The illustration shows a case where the inner peripheral surface of the protrusion 7 is a generally rectangular cuboid with a flat surface, but the inner peripheral surface of the protrusion 7 can also be as described in the fourth embodiment below. Figure 11 It can be a way that has multiple planes as shown, or a way that has curved surfaces formed in at least a portion of it, or a way that is formed only by curved surfaces.

[0057] Since at least a portion of the upper surface of the electronic component 4 is thermally connected to the upper housing 1, and at least a portion of the side surface of the electronic component 4 is thermally connected to the protrusion 7, the heat dissipation component 6 filling the inner side of the protrusion 7 is preferably a semi-cured adhesive component (silicone grease). Because the semi-cured adhesive has high adhesion, the contact thermal resistance between the electronic component 4 and the protrusion 7 is reduced, and improved heat dissipation is expected. Furthermore, the semi-curing process prevents the heat dissipation component 6 from leaking towards the circuit board 3 while mitigating stress caused by vibration or heat.

[0058] In contrast, the part of the electronic control device 100 that does not have electronic components 4 installed, such as... Figure 4 As shown, there is space where the heat dissipation component 6 is not filled.

[0059] Next, referring to Figures 5 and 6, we will describe the specific research results regarding the situation where the side of the electronic component 4 faces the protrusion 7 across the heat dissipation component 6. Figure 5 This is a graph showing the results verifying the noise current reduction effect of the present invention and the comparative example. Figure 6 This is a graph showing the results of verifying the effect of the present invention on reducing the temperature rise compared to the comparative example.

[0060] In the simulation, thermal resistance calculation was used to evaluate heat dissipation, and equivalent circuit simulation was performed to evaluate electromagnetic compatibility. The specific conditions were set as follows: the next-generation product is equipped with SiP, the outer diameter of electronic component 4 is 65 [mm], the chip size of high heat generation component 4a is 25 [mm], the heat generation is 36 [W], and the thickness of TIM (Thermal Interface Material) is 1.2 [mm].

[0061] The results are as follows Figure 5 As shown, in the structure described in Patent Document 1 above, where the heat dissipation component 6 is formed only on the chip corresponding to the high-heat-generating component 4a, the noise current at 100 MHz is 60 dBμA. Figure 5(Comparative example) In contrast, in the structure shown in this embodiment, where the heat dissipation member 6 is filled to the chip side corresponding to the high-heat-generating member 4a, thus facing the protrusion 7 across the heat dissipation member 6, the noise current at 100 MHz is 50 dBμA, which is clearly improved by 10 dBμA. Furthermore, although not shown, it is determined that compared to the structure described in Patent Document 1, which lacks a structure corresponding to the protrusion, the noise current can be reduced by 35 dBμA.

[0062] In addition, such as Figure 6 As shown, in the structure described in Patent Document 1, where the heat dissipation component 6 is formed only on the chip corresponding to the high-heat-generating component 4a, the temperature rise ΔT is 13.7 [°C]. Figure 6 (Comparative example) In contrast, in the structure of this embodiment, where the heat dissipation component 6 is filled to the side of the chip corresponding to the high-heat-generating component 4a and thus faces the protrusion 7 across the heat dissipation component 6, the temperature rise ΔT is 8.6 [°C], which can reduce the temperature rise by 5.1 [°C]. It is known that this structure has great potential for further improvement of chips such as the high-heat-generating component 4a.

[0063] Next, the effects of this embodiment will be explained.

[0064] The electronic control device 100 of the first embodiment of the present invention described above includes: a circuit board 3 on which an electronic component 4 is mounted; and an upper housing 1 and a lower housing 2 that house the circuit board 3. The upper housing 1 has a protrusion 7, which has a top surface opposite to the circuit board 3. At least a portion of the upper surface of the electronic component 4 is thermally connected to the upper housing 1 via a heat dissipation member 6, and at least a portion of the side surface of the electronic component 4 is opposite to the protrusion 7 through the heat dissipation member 6.

[0065] Therefore, compared with the conventional structure, the heat dissipation area of ​​the electronic component 4 can be increased, thus further improving heat dissipation. Furthermore, a loop with small potential fluctuation can be formed between the end of the electronic component 4 and the side of the protrusion 7, thus reducing radiated noise compared with the conventional structure.

[0066] In addition, since the heat dissipation component 6 is a semi-cured adhesive component, it has the effects of further improving heat dissipation, preventing contamination of the heat dissipation component 6, and relieving stress in the welding part of the electronic component 4.

[0067] <Second Implementation>

[0068] Reference Figures 7 to 9 The electronic control device of the second embodiment of the present invention is described. Figure 7 The electronic control device according to the second embodiment is equivalent to Figure 2 The diagram of the section along line II. Figure 8 The electronic control device according to the second embodiment is equivalent to Figure 2 A cross-sectional view along line II-II. Figure 9 The electronic control device involved in the variation of the second embodiment is equivalent to Figure 2 The diagram of the cross section along line II.

[0069] Figure 7 and Figure 8 In the electronic control device 100A of this embodiment, the protrusion 7 faces the ground portion 5 provided on the circuit board 3 via the conductive member 8, thereby electrically connecting the protrusion 7 to the ground portion 5 of the circuit board 3, thus forming an electrical conduction or capacitive coupling with the ground portion 5 via the conductive member 8. Consequently, the impedance from the protrusion 7 to the circuit board 3 is reduced, and the noise current path 11 becomes smaller than in the first embodiment, thus further reducing radiated noise.

[0070] The conductive component 8 is made of a gasket or a conductive adhesive, etc.

[0071] Furthermore, in the variations of this embodiment... Figure 9 In the electronic control device 100A1 shown, the high-heat-generating component 4a and the low-heat-generating component 4b are thermally connected to the upper housing 1 and the lower housing 2 via the heat dissipation component 6. The sides of the high-heat-generating component 4a and the low-heat-generating component 4b opposite to the protrusion 7 are separated from the protrusion 7 by the heat dissipation component 6A1. This is consistent with... Figure 3 and Figure 7 Same, but some low-heating components 4b ( Figure 9 The leftmost low-heat component 4b in the diagram is not covered by the heat dissipation component 6A1.

[0072] Should Figure 9 The method shown achieves the following effect: heat from the high-heat-generating component 4a covered by the heat dissipation component 6A1 is difficult to propagate to the low-heat-generating component 4b not covered by the heat dissipation component 6A1, thus enabling a more flexible design.

[0073] In addition, Figure 9 In the structure shown, the protrusion 7 is shown facing the ground portion 5 provided on the circuit board 3 through the conductive member 8, but it is also possible for the protrusion 7 to face the ground portion 5 provided on the circuit board 3 without the conductive member 8 in between, that is, in the same manner as the first embodiment.

[0074] The other structures and operations are substantially the same as those of the electronic control device in the first embodiment described above, and detailed descriptions are omitted.

[0075] In the electronic control device of the second embodiment of the present invention, almost the same effect as that of the electronic control device of the first embodiment described above can also be obtained.

[0076] In addition, the protrusion 7 is opposite to the grounding portion 5 provided on the circuit board 3 through the conductive component 8, and forms electrical conduction or capacitive coupling with the grounding portion 5 through the conductive component 8, thereby achieving further reduction of radiated noise.

[0077] <Third Implementation Method>

[0078] Reference Figure 10 The electronic control device of the third embodiment of the present invention is described. Figure 10 The electronic control device involved in the third embodiment Figure 2 Sectional view along line II-II.

[0079] Figure 10 In the electronic control device 100B of this embodiment, the protrusion 7B includes: a housing portion 7B1 that forms an opening toward the circuit board 3; and a foot portion 7B2 that protrudes from the housing portion 7B1 toward the circuit board 3. Since the heat dissipation component 6 can be applied to the side of the protrusion 7B without any omissions through the housing portion 7B1, a substantial improvement in heat dissipation can be achieved. Furthermore, since a gap can be formed between the electronic component 4 and the housing portion 7B1 through the foot portion 7B2, it is possible to mount components at a high density around the electronic component 4.

[0080] The other structures and operations are substantially the same as those of the electronic control device in the second embodiment described above, and detailed descriptions are omitted.

[0081] In the electronic control device of the third embodiment of the present invention, almost the same effect as that of the electronic control device of the second embodiment described above can also be obtained.

[0082] In addition, the protrusion 7B has a housing portion 7B1 that forms an opening toward the circuit board 3; and a foot portion 7B2 that protrudes from the housing portion 7B1 toward the circuit board 3, thereby enabling improved heat dissipation and high-density mounting.

[0083] In addition, this embodiment shows the protrusion 7B facing the ground portion 5 provided on the circuit board 3 through the conductive member 8, but it is also possible to show the protrusion 7B facing the ground portion 5 through space, without the conductive member 8, as in the first embodiment.

[0084] <Fourth Implementation>

[0085] Reference Figure 11 The electronic control device according to the fourth embodiment of the present invention is described. Figure 11 The electronic control device according to the fourth embodiment is equivalent to Figure 2 The diagram of the cross section along line II.

[0086] exist Figure 11 In the electronic control device 100C of this embodiment, the upper housing 1 has a protrusion 7C1 on the surface opposite to the plurality of electronic components 4. The distance between the protrusion 7C1 and the circuit board 3 varies depending on the height of the electronic component 4 opposite to the protrusion 7C1. By providing such a protrusion 7C1, the gap between the electronic component 4 and the heat dissipation component 6C between the heat dissipation component 4 and the inner side of the upper housing 1 can be adjusted. Therefore, the coating amount of the heat dissipation component 6C can be minimized, and further improvement in heat dissipation can be expected.

[0087] The other structures and operations are substantially the same as those of the electronic control device in the second embodiment described above, and detailed descriptions are omitted.

[0088] In the electronic control device of the fourth embodiment of the present invention, almost the same effect as that of the electronic control device of the second embodiment described above can also be obtained.

[0089] In addition, the following effect is achieved: the upper housing 1 has a protrusion 7C1 on the surface opposite to the multiple electronic components 4. The distance between the protrusion 7C1 and the circuit board 3 varies depending on the height of the electronic component 4 opposite to the protrusion 7C1, thereby minimizing the amount of coating on the heat dissipation component.

[0090] In addition, this embodiment also shows a way in which the protrusion 7 faces the ground portion 5 provided on the circuit board 3 through the conductive member 8. However, it is also possible to provide the protrusion 7 with the ground portion 5 separated by space, as in the first embodiment, without the conductive member 8. Regardless of whether there is a conductive member 8, the protrusion 7 can be configured as being composed of a box portion and a foot portion, as in the third embodiment.

[0091] <Fifth Implementation>

[0092] Reference Figure 12 The electronic control device according to the fifth embodiment of the present invention is described. Figure 12 The electronic control device according to the fifth embodiment is equivalent to Figure 2 The diagram of the cross section along line II.

[0093] exist Figure 12 In the electronic control device 100D of this embodiment shown, the protrusion 7D is separately provided from the upper housing 1, is thermally connected to the upper housing 1 via the heat dissipation component 6D, and is thermally connected to the electronic component 4 via the heat dissipation component 6D.

[0094] In this case, the design freedom of the protrusion 7D is increased. That is, compared with the case where it is formed as an integral part of the upper shell 1, the shape can be chosen more freely. Similarly, the material of the protrusion 7D can be freely chosen to be a different material from the upper shell 1, such as aluminum or copper. As a result, measures such as further improving heat dissipation or further reducing radiated noise by making the shape thicker can be taken.

[0095] The other structures and operations are substantially the same as those of the electronic control device in the first embodiment described above, and detailed descriptions are omitted.

[0096] In the electronic control device of the fifth embodiment of the present invention, almost the same effect as that of the electronic control device of the first embodiment described above can also be obtained.

[0097] In addition, the protrusion 7D is separately provided from the upper housing 1 and is thermally connected to the upper housing 1 via the heat dissipation component 6, thereby improving heat dissipation and reducing radiated noise by increasing design freedom.

[0098] In addition, in this embodiment, the conductive component 8 can be omitted, and the protrusion 7D can be positioned opposite the grounding portion 5 with a gap in space, just as in the first embodiment. Regardless of whether the conductive component 8 is present, a structure like that in the third or fourth embodiment can be assembled.

[0099] <Sixth Implementation Method>

[0100] Reference Figure 13 The electronic control device according to the sixth embodiment of the present invention is described. Figure 13 The electronic control device according to the sixth embodiment is equivalent to Figure 2 The diagram of the cross section along line II.

[0101] exist Figure 13 In the electronic control device 100E shown in this embodiment, similar to the protrusion 7D of the electronic control device 100D shown in the fifth embodiment, the protrusion 7E is separately provided from the upper housing 1 and is thermally connected to the upper housing 1 via a heat dissipation member 6E1. Furthermore, at least a portion of the top surface of the protrusion 7E opposite to the circuit board 3 has a folded-back portion 7E1 extending in the direction of the electronic component 4. This folded-back portion 7E1 increases the contact area with the conductive component 8, further reducing radiated noise and more reliably preventing leakage of the heat dissipation member 6E towards the circuit board 3.

[0102] The other structures and operations are substantially the same as those of the electronic control device in the fifth embodiment described above, and detailed descriptions are omitted.

[0103] In the electronic control device of the sixth embodiment of the present invention, almost the same effect as that of the electronic control device of the fifth embodiment described above can also be obtained.

[0104] Furthermore, since a folded-back portion 7E1 extending in the direction of the electronic component 4 is provided on at least a portion of the top surface of the protrusion 7E opposite to the circuit board 3, not only can radiated noise be further reduced, but also contamination of the heat dissipation component 6 can be further prevented.

[0105] In addition, in this embodiment, as in the first embodiment, the conductive component 8 may not be provided, but the protrusion 7E is positioned opposite the grounding portion 5 across the space. Regardless of whether the conductive component 8 is provided, any one or more structures from the third to the fifth embodiments can be combined.

[0106] <Seventh Implementation>

[0107] Reference Figure 14 The electronic control device of the seventh embodiment of the present invention is described. Figure 14 This is a top perspective view of the housing of the electronic control device according to the seventh embodiment.

[0108] exist Figure 14 In the electronic control device 100F of this embodiment, the protrusion 7 forms a rectangular opening toward the circuit board 3, and the grounding portion 5 is located at the four corners of the opening, separated by conductive components 8F. This allows for reduced radiated noise without obstructing surface wiring from the electronic components 4, and enables higher density installation.

[0109] Furthermore, although the example shown is of a case where the grounding part 5 is opposite to the four corners of the opening through a conductive component 8F, which is very preferable from a stability point of view, it is not limited to four corners; any one or more is acceptable. In addition, if only one is provided, it does not have to be at a corner.

[0110] The other structures and operations are substantially the same as those of the electronic control device in the second embodiment described above, and detailed descriptions are omitted.

[0111] In the electronic control device of the seventh embodiment of the present invention, almost the same effect as that of the electronic control device of the second embodiment described above can also be obtained.

[0112] In addition, the protrusion 7 forms a rectangular opening toward the circuit board 3, and the grounding part 5 is located opposite the four corners of the opening through the conductive parts 8, thereby enabling the reduction of radiated noise and further high-density installation.

[0113] In addition, in this embodiment, any one or more of the structures in the third to sixth embodiments can be combined.

[0114] <Eighth Implementation Method>

[0115] Reference Figure 15 The electronic control device of the eighth embodiment of the present invention will be described. Figure 15 This is a top perspective view of the housing of the electronic control device according to the eighth embodiment.

[0116] exist Figure 15 In the electronic control device 100G of this embodiment, the protrusion 7 forms a rectangular opening facing the circuit board 3, and the grounding portion 5 is located opposite the four sides of the opening with conductive components 8G in between. By arranging the conductive components 8G around the entire electronic component 4 in this way, the shielding effect is further improved, and radiated noise can be significantly reduced.

[0117] The other structures and operations are substantially the same as those of the electronic control device in the second embodiment described above, and detailed descriptions are omitted.

[0118] In the electronic control device of the eighth embodiment of the present invention, almost the same effect as that of the electronic control device of the second embodiment described above can also be obtained.

[0119] In addition, the protrusion 7 forms a rectangular opening toward the circuit board 3, and the grounding part 5 is located opposite the four sides of the opening through the conductive component 8, thereby greatly reducing radiated noise.

[0120] In addition, in this embodiment, any one or more of the structures in the third to sixth embodiments can be combined.

[0121] <Ninth Implementation Method>

[0122] Reference Figure 16 and Figure 17 The electronic control device according to the ninth embodiment of the present invention is described. Figure 16 This is a perspective view of the housing of the electronic control device according to the ninth embodiment. Figure 17 The electronic control device according to the ninth embodiment is equivalent to Figure 2 The diagram of the cross section along line II.

[0123] exist Figure 16 and Figure 17In the electronic control device 100H of this embodiment, the protrusion 7H is separate from the upper housing 1 and is thermally connected via a heat dissipation component 6H1. Furthermore, the heat dissipation component 6H is specifically provided on the high-heat-generating component 4a1 within the electronic component 4, and the protrusion 7H and conductive component 8H are provided around the electronic component 4 depending on the position of the heat dissipation component 6H. Therefore, since the heat dissipation component 6H is coated on the high-heat-generating component 4a1, heat dissipation is improved, and the arrangement of the protrusion 7H and conductive component 8H more reliably prevents the heat dissipation component 6H from leaking towards the circuit board 3.

[0124] Furthermore, a folded-back portion 7H1 extending in the direction of the high-heat-generating component 4a and the low-heat-generating component 4b is provided on the top surface of the protrusion 7H opposite to the side of the high-heat-generating component 4a and the low-heat-generating component 4b. As a result, the contact area with the conductive component 8H is increased, thereby further reducing radiated noise, and the folded-back portion 7H1 can more reliably prevent the heat dissipation component 6H from leaking towards the circuit board 3.

[0125] The other structures and operations are substantially the same as those of the electronic control device in the first embodiment described above, and detailed descriptions are omitted.

[0126] In the electronic control device of the ninth embodiment of the present invention, almost the same effect as that of the electronic control device of the first embodiment described above can also be obtained.

[0127] Furthermore, since a folding portion 7H1 extending in the direction of the high-heat-generating component 4a and the low-heat-generating component 4b is provided on the top surface of the protrusion 7 opposite to the side of the high-heat-generating component 4a and the low-heat-generating component 4b, the radiated noise can be reliably further reduced and the contamination of the heat dissipation component 6H can be prevented.

[0128] In addition, in this embodiment, the protrusion 7H may not be separate from the upper shell 1 but may be integral, or as in the first embodiment, the protrusion 7H may not be provided with a conductive component 8H but may be positioned opposite the grounding part 5 with the space between them. Regardless of whether there is a conductive component 8H, any one or more of the structures in the third to eighth embodiments can be combined.

[0129] <Tenth Implementation>

[0130] Reference Figure 18 The electronic control device according to the tenth embodiment of the present invention will be described. Figure 18 The electronic control device according to the tenth embodiment is equivalent to Figure 2 The diagram of the cross section along line II.

[0131] exist Figure 18In the electronic control device 100I of this embodiment, in addition to the protrusion 7, the upper housing 1 is also provided with a heat dissipation component dividing protrusion 7I that protrudes from the surface opposite to the electronic component 4 toward the circuit board 3. A heat dissipation component 6I is filled in the space divided by the protrusion 7 and the heat dissipation component dividing protrusion 7I, in the space containing the high-heat-generating component 4a and the low-heat-generating component 4b. By providing the heat dissipation component dividing protrusion 7I, heat conduction from the high-heat-generating component 4a to other components can be prevented, and the coating amount of the heat dissipation component 6I can be minimized, thereby improving heat dissipation.

[0132] The other structures and operations are substantially the same as those of the electronic control device in the first embodiment described above, and detailed descriptions are omitted.

[0133] In the electronic control device of the tenth embodiment of the present invention, almost the same effect as that of the electronic control device of the first embodiment described above can also be obtained.

[0134] In addition, the upper housing 1 is provided with a heat dissipation component dividing protrusion 7I that protrudes from the surface opposite to the electronic component 4 toward the circuit board 3. In the space divided by the protrusion 7 and the heat dissipation component dividing protrusion 7I, a heat dissipation component 6 is filled in the space containing the high-heat-generating component 4a and the low-heat-generating component 4b, thereby improving heat dissipation, further reducing radiated noise and preventing heat from being conducted from the high-heat-generating component 4a to other components.

[0135] In addition, in this embodiment, the conductive component 8 can be provided as in the second embodiment, so that the heat dissipation component is divided by a protrusion 7I that is opposite to the grounding part 5 across a space. Regardless of whether the conductive component 8 is present, any one or more structures from the third to the ninth embodiments can be combined.

[0136] <Eleventh Implementation Method>

[0137] Reference Figure 19 The electronic control device according to the eleventh embodiment of the present invention is described. Figure 19 It is equivalent to the electronic control device according to the eleventh embodiment. Figure 2 The diagram of the cross section along line II.

[0138] exist Figure 19In the electronic control device 100J of this embodiment, the protrusion 7J and the heat sink 9J are separately provided from the upper housing 1J and are physically connected to the upper housing 1J by screws or the like. Alternatively, the protrusion 7J and the heat sink 9J do not necessarily need to be physically connected to the upper housing 1J; they can be electrically connected via conductive components such as gaskets. This improves manufacturing ease, enhances heat dissipation, reduces radiated noise, and prevents heat from being conducted from the high-heat-generating component 4a to other components.

[0139] The other structures and operations are substantially the same as those of the electronic control device in the first embodiment described above, and detailed descriptions are omitted.

[0140] In the electronic control device of the eleventh embodiment of the present invention, almost the same effect as that of the electronic control device of the first embodiment described above can also be obtained.

[0141] In addition, in this embodiment, as in the first embodiment, the conductive component 8 may not be provided, but the protrusion 7J may be positioned opposite the grounding portion 5 with a gap in space. Regardless of whether the conductive component 8 is provided, any one or more structures from the third to the tenth embodiments can be combined.

[0142] <Twelfth Implementation>

[0143] Reference Figure 20 The electronic control device according to the twelfth embodiment of the present invention will be described. Figure 20 The equivalent of the electronic control device in the twelfth embodiment Figure 2 The diagram of the cross section along line II.

[0144] Figure 20 In the electronic control device 100K shown in this embodiment, the protrusion 7K is separately provided from the upper housing 1K, and the housing heat sink 9K is also separately provided from the upper housing 1K. The housing heat sink 9K and the protrusion 7K are thermally connected via the heat dissipation member 6K1. By making the housing heat sink 9K and the protrusion 7K separate in this way, the ease of manufacturing can be improved.

[0145] The other structures and operations are substantially the same as those of the electronic control device in the eleventh embodiment described above, and detailed descriptions are omitted.

[0146] In the electronic control device of the twelfth embodiment of the present invention, almost the same effect as that of the electronic control device of the eleventh embodiment described above can also be obtained.

[0147] In addition, in this embodiment, as in the first embodiment, the conductive component 8 may not be provided, but the protrusion 7K may be positioned opposite the grounding portion 5 with a gap in space. Regardless of whether the conductive component 8 is provided, any one or more structures from the third to the tenth embodiments can be combined.

[0148] <Thirteenth Implementation Method>

[0149] Reference Figure 21 The electronic control device according to the thirteenth embodiment of the present invention is described. Figure 21 The equivalent of the electronic control device in the thirteenth embodiment Figure 2 The diagram of the cross section along line II.

[0150] Figure 21 In the electronic control device 100L of this embodiment, the protrusion 7L is separately provided from the upper housing 1L, and the housing heat sink 9L is also separately provided from the upper housing 1L. The housing heat sink 9L and the protrusion 7L are thermally connected via the heat dissipation component 6L1. By making the housing heat sink 9L and the protrusion 7L separate, manufacturing ease can be improved, and by filling the heat dissipation component 6L1, heat dissipation performance and radiated noise reduction performance can be improved.

[0151] The other structures and operations are substantially the same as those of the electronic control device in the first embodiment described above, and detailed descriptions are omitted.

[0152] In the electronic control device of the thirteenth embodiment of the present invention, almost the same effect as that of the electronic control device of the first embodiment described above can also be obtained.

[0153] In addition, in this embodiment, as in the first embodiment, the conductive component 8 may not be provided, but the protrusion 7L may be positioned opposite the grounding portion 5 with a gap in space. Regardless of whether the conductive component 8 is provided, any one or more structures from the third to the tenth embodiments can be combined.

[0154] <Other>

[0155] Furthermore, the present invention is not limited to the embodiments described above, and includes various modifications. The embodiments described above are given in detail for the purpose of readily understanding the present invention, and are not intended to be limited to all the structures described.

[0156] Furthermore, a portion of the structure of one embodiment can be replaced with the structure of another embodiment, and a structure of another embodiment can be added to the structure of one embodiment. Additionally, other structures can be added, deleted, or replaced regarding a portion of the structure of each embodiment.

[0157] Symbol Explanation

[0158] 1, 1J, 1K, 1L… Upper shell (shell)

[0159] 2…Lower shell (shell)

[0160] 3…Circuit Board

[0161] 4… Electronic components

[0162] 4a, 4a1… High-heat-generating components (heat-generating components)

[0163] 4b… Low-heating components (heating components)

[0164] 4c…Substrate

[0165] 5… Grounding part

[0166] 6, 6A1, 6C, 6D, 6E, 6E1, 6H, 6H1, 6I, 6K, 6K1, 6L, 6L1… Heat dissipation components

[0167] 7, 7B, 7D, 7E, 7H, 7J, 7K, 7L... protrusions

[0168] 7B1…box section

[0169] 7B2…foot

[0170] 7C1…Concave-convex portion (concave-convex surface)

[0171] 7E1, 7H1… Turnaround Section

[0172] 7I…Protrusions for dividing heat dissipation components

[0173] 8, 8F, 8G, 8H… conductive components

[0174] 9, 9J, 9K, 9L… casing heat sink

[0175] 10… connectors

[0176] 11…Noise Current Path

[0177] 100, 100A, 100A1, 100B, 100C, 100D, 100E, 100F, 100G, 100H, 100I, 100J, 100K, 100L… Electronic control devices.

Claims

1. An electronic control device, characterized in that, have: Circuit boards containing electronic components; and The housing that houses the circuit board. The housing has a protrusion, which has a top surface opposite the circuit board. At least a portion of the upper surface of the electronic component is thermally connected to the housing via a heat dissipation component. At least a portion of the side of the electronic component is opposite to the protrusion, separated by the heat dissipation component.

2. The electronic control device according to claim 1, characterized in that, The protrusion is opposite to the ground portion disposed on the circuit board through a conductive component, and forms an electrical connection or capacitive coupling with the ground portion through the conductive component.

3. The electronic control device according to claim 1, characterized in that, The protrusion includes: a box portion forming an opening toward the circuit board; and a foot portion protruding from the box portion toward the circuit board.

4. The electronic control device according to claim 2, characterized in that, The protrusion forms a rectangular opening toward the circuit board, and the grounding portion is located at the four corners of the opening, separated by the conductive component.

5. The electronic control device according to claim 2, characterized in that, The protrusion forms a rectangular opening toward the circuit board, and is opposite to the grounding portion at the four sides of the opening, separated by the conductive component.

6. The electronic control device according to claim 1, characterized in that, The housing has uneven surfaces on the surface opposite to the plurality of electronic components. The distance between the uneven surface and the circuit board varies depending on the height of the electronic component to which the uneven surface is located.

7. The electronic control device according to claim 1, characterized in that, The protrusion is separately disposed from the housing and is thermally connected to the housing via the heat dissipation component.

8. The electronic control device according to claim 7, characterized in that, At least a portion of the top surface of the protrusion opposite to the circuit board is provided with a folded portion extending in the direction of the electronic component.

9. The electronic control device according to claim 1, characterized in that, The electronic component includes a heat-generating component. The heat-generating component is thermally connected to the housing via the heat dissipation component. The side of the heat-generating component opposite to the protrusion is separated from the heat-dissipating component by the protrusion.

10. The electronic control device according to claim 9, characterized in that, On the top surface of the protrusion opposite to the side of the heating element, a folded portion extending in the direction of the heating element is provided.

11. The electronic control device according to claim 1, characterized in that, The heat dissipation component is a semi-cured adhesive component.

12. The electronic control device according to claim 1, characterized in that, The housing is provided with a heat dissipation protrusion extending from the surface opposite to the electronic components toward the circuit board. The space defined by the protrusion and the heat dissipation component is filled with the heat dissipation component in the space containing the heat-generating component.

Images