Component mounting apparatus and component supply apparatus

Abstract

The component mounting apparatus of the present disclosure includes a first component conveying path that conveys a plurality of components from a component storage section that stores the plurality of components to a first component supply position, a second component conveying path that conveys the plurality of components from the component storage section to a second component supply position, and a head that has a plurality of nozzles that pick up the plurality of components from the first component supply position and the second component supply position.

Description

Technical Field

[0001] This disclosure relates to component installation apparatus and component supply apparatus. Background Technology

[0002] For example, Patent Document 1 discloses a mounting device comprising a turret-type mounting head for picking up components delivered from a feeder. The mounting head comprises multiple nozzle units formed by unitizing multiple nozzles parallel to a drive shaft, and a turret platform for rotating the multiple nozzle units about a rotation axis. During the rotation of the nozzle units, the mounting head simultaneously picks up multiple components using the multiple nozzles arranged along the delivery direction of the components delivered by the feeder.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2018-032700 Summary of the Invention

[0006] However, the device in Patent Document 1 is such that multiple parts are held by multiple nozzles in a tape feeding component that houses the parts one by one in the recesses arranged at equal intervals on the tape. Regarding feeders equipped with a mechanism for arranging and conveying multiple parts in a scattered state, conventionally, the nozzles hold the leading part of the arranged and conveyed parts, thus there is room for improvement in supplying parts to multiple part supply positions where the nozzles can hold the parts.

[0007] Therefore, the purpose of this disclosure is to solve the aforementioned problem and to provide a component mounting device and a component supply device capable of supplying components in a discrete state to multiple component supply positions that can hold the component in the mouth.

[0008] Methods for solving problems

[0009] To achieve the aforementioned objective, one aspect of this disclosure relates to a component mounting device, wherein,

[0010] The component mounting device includes:

[0011] A first component transport path transports the multiple components from a component storage section that stores multiple components to a first component supply position;

[0012] A second component transport path, which transports the plurality of components from the component receiving section to the second component supply position; and

[0013] The head has a plurality of mouths that pick up the plurality of components from the first component supply position and the second component supply position.

[0014] One aspect of this disclosure relates to a component supply device assembled with a component mounting device, which mounts a component picked up by a nozzle onto a substrate, wherein...

[0015] The component supply device has multiple component conveying paths that convey components taken out from a component storage section that stores multiple components in a scattered state.

[0016] The multiple component transport paths include:

[0017] A first component transport path, which transports the component to a first component supply position where the mouth can pick up the component; and

[0018] A second component transport path transports the component to a second component supply position that is different from the first component supply position.

[0019] Invention Effects

[0020] According to the component mounting device and component supply device disclosed herein, it is possible to supply components in a scattered state to multiple component supply positions that can hold the components in place. Attached Figure Description

[0021] Figure 1 This is a schematic perspective view of an example of the component mounting device according to Embodiment 1 of this disclosure.

[0022] Figure 2 This is a schematic perspective view of an example of a component supply device according to Embodiment 1 of this disclosure.

[0023] Figure 3 This is a schematic front view of an example of a component supply device according to Embodiment 1 of this disclosure.

[0024] Figure 4 This is a schematic diagram illustrating an example of the supply locations of multiple components.

[0025] Figure 5 Is Figure 3 The outline sectional view obtained by cutting with AA line.

[0026] Figure 6A This is a schematic diagram showing a cross-section of an example of the transport path of the first component.

[0027] Figure 6B This is a schematic diagram showing a cross-section of an example of the transport path of the first component.

[0028] Figure 7 This is a control block diagram of an example of the component mounting apparatus according to Embodiment 1 of this disclosure.

[0029] Figure 8 This is a schematic diagram of an example of a connecting part.

[0030] Figure 9 Is Figure 8 The outline sectional view obtained by cutting with BB line.

[0031] Figure 10 Is Figure 9 The outline partial enlarged sectional view obtained by enlarging the Z1 part.

[0032] Figure 11 Is Figure 9 A partial enlarged sectional view of the Z2 section.

[0033] Figure 12 This is a schematic diagram illustrating another example of a component supply device.

[0034] Figure 13 This is a schematic cross-sectional view showing another example of the first component transport path.

[0035] Figure 14 This is a partial enlarged view showing another example of the transport path for the first component. Detailed Implementation

[0036] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In addition, the elements are exaggerated in the drawings for ease of explanation.

[0037] In this specification, terms such as "first" and "second" are used for illustrative purposes only and should not be construed as indicating, explicitly or implicitly, relative importance or order of precedence of technical features. Features defined as "first" and "second" explicitly or implicitly include one or more of those features.

[0038] (Implementation Method 1)

[0039] Figure 1 This is a schematic perspective view of an example of the component mounting device 100 according to Embodiment 1 of this disclosure. It should be noted that the X, Y, and Z directions in the figure represent the depth direction, width direction, and height direction of the component mounting device 100.

[0040] like Figure 1 As shown, the component mounting device 100 includes a plurality of component supply devices 1 and a component assembly device 90. Furthermore, the component mounting device 100 includes a fixing table 80 that fixes the plurality of component supply devices 1 in a row. The plurality of component supply devices 1 are arranged in a row along the X direction on the fixing table 80.

[0041] The component supply device 1 conveys multiple components in an arranged row. Furthermore, the component supply device 1 conveys the arranged components to multiple component supply positions P1 and P2. It should be noted that this embodiment describes an example of the component supply device 1 that removes components from the component storage section 3, which stores multiple components in a scattered state, and conveys the removed components. Details regarding the component supply device 1 will be described later. It should be noted that in this specification, the multiple component supply positions P1 and P2 are sometimes referred to as the first component supply position P1 and the second component supply position P2.

[0042] The component assembly device 90 picks up multiple components that are transported to multiple component supply positions P1 and P2, and assembles them in the specified positions.

[0043] The component assembly device 90 includes a head 91 and a plurality of nozzles 92 mounted on the head 91.

[0044] The head 91 is capable of moving along the X, Y, and Z directions. For example, the head 91 can move above the multiple component supply device 1 and above the substrate of the assembly component.

[0045] The multiple nozzles 92 are devices capable of picking up and holding components. The multiple nozzles 92 pick up multiple components disposed at multiple component supply positions P1, P2 of the multiple component supply device 1. The multiple nozzles 92 hold the picked-up multiple components and assemble them at predetermined positions on the substrate.

[0046] Multiple nozzles 92 are arranged at a predetermined spacing. For example, multiple nozzles 92 are arranged in two rows with four nozzles in each row along the direction (X direction) in which multiple component supply devices 1 are arranged.

[0047] The component supply device 1 is assembled to the component mounting device 100, which mounts the component 60 picked up by the nozzle 92 onto the substrate.

[0048] Figure 2 This is a schematic perspective view of an example of the component supply device 1 according to Embodiment 1 of this disclosure. Figure 3 This is a schematic front view of an example of the component supply device 1 according to Embodiment 1 of this disclosure. It should be noted that the X, Y, and Z directions in the figure represent the short side direction, long side direction, and height direction of the component supply device 1.

[0049] like Figure 2 and Figure 3As shown, the component supply device 1 includes a main body 2, a component arrangement section 4, multiple component transport paths 5A and 5B, a light sensor 6, and an indicator light 7. Additionally, the component supply device 1 includes a transport force application section 10, which applies a transport force to transport the multiple components 60. The component arrangement section 4 supports the component storage section 3. It should be noted that in this specification, the multiple component transport paths 5A and 5B are sometimes referred to as the first component transport path 5A and the second component transport path 5B.

[0050] The component supply device 1 arranges and organizes multiple components 60 stored in the component storage section 3 using the component sorting and arranging section 4, and then transports the multiple components 60 to multiple component supply positions P1 and P2 on the upper surface of the main body section 2 via the first component transport path 5A and the second component transport path 5B. The transport of the multiple components 60 in the first component transport path 5A and the second component transport path 5B is performed by applying a transport force by the transport force application section 10. In this embodiment, the transport force application section 10 transports the multiple components 60 in the first component transport path 5A and the second component transport path 5B by introducing air.

[0051] Furthermore, the component supply device 1 uses a light sensor 6 to detect the presence or absence of components 60 in the first component transport path 5A and the second component transport path 5B. For example, if the component supply device 1 detects that no component 60 is present in either the first component transport path 5A or the second component transport path 5B, the conveying force application unit 10 applies a conveying force to the multiple components 60. Additionally, if the component supply device 1 detects that no component 60 is present in either the first component transport path 5A or the second component transport path 5B while applying a conveying force, it illuminates an indicator light 7. This informs the user that no component 60 is present in the component storage unit 3.

[0052] The components of the component supply device 1 are described in detail.

[0053] <Main Body>

[0054] The main body 2 is the main body of the component supply device 1. A first component supply position P1 and a second component supply position P2 for conveying multiple components 60 are provided on the upper surface of the main body 2. The first component supply position P1 and the second component supply position P2 are provided with openings that allow the components 60 to protrude from the main body 2.

[0055] Figure 4 This is a schematic diagram showing an example of multiple component supply locations P1 and P2.

[0056] like Figure 4As shown, on the upper surface of the main body 2 of the component supply device 1, the first component supply position P1 and the second component supply position P2 are provided at a distance from each other. Specifically, the first component supply position P1 and the second component supply position P2 are arranged at a predetermined distance L1 in the long side direction of the component supply device 1, that is, the long side direction (Y direction) of the main body 2.

[0057] In this embodiment, the spacing L1 is equal to the spacing between the plurality of nozzles 92 of the component assembly device 90.

[0058] return Figure 2 and Figure 3 The main body 2, as a conveying force application unit 10, has a mechanism for generating air for conveying multiple components 60. Specifically, the main body 2, as a structure of the conveying force application unit 10, has an air inlet passage 11, a conveying air supply passage 12, a conveying air control valve 13, an air suction passage 14, and a suction air control valve 15.

[0059] Compressed air is introduced into the air inlet 11a located on the side of the rear end of the main body 2 through the air inlet 11a. The air inlet 11 leads to the air supply passage 12 inside the main body 2. For example, the air inlet 11 is constructed of piping. Alternatively, a pump for supplying compressed air may be connected to the air inlet 11a.

[0060] The air supply path 12 is a flow path that supplies air to the first component transport path 5A and the second component transport path 5B. In this embodiment, the air supply path 12 connects the main body 2 to the component arrangement section 4. Air supplied from the air supply path 12 passes through the component arrangement section 4 and is supplied to the first component transport path 5A and the second component transport path 5B. The air supply path 12 is constructed, for example, by a tube and / or piping. An air supply control valve 13 is provided in the air supply path 12.

[0061] The air supply control valve 13 controls the air flowing in the air supply passage 12. Specifically, the air supply control valve 13 controls the supply and stop of air from the air supply passage 12 to the first component transport passage 5A and the second component transport passage 5B. For example, when the air supply control valve 13 is open, air passes through the air supply passage 12 and is supplied to the first component transport passage 5A and the second component transport passage 5B. When the air supply control valve 13 is closed, air no longer passes through the air supply passage 12 and is no longer supplied to the first component transport passage 5A and the second component transport passage 5B.

[0062] The air suction path 14 is a flow path for drawing in air. Air is drawn in through an air suction port 14a located on the side of the main body 2. The air suction path 14 extends from the air suction port 14a to the first component supply position P1 and the second component supply position P2. For example, the air suction path 14 is constructed of pipes and / or piping. Alternatively, an air-drawing pump may be connected to the air suction port 14a.

[0063] The component supply device 1 can be set to negative pressure by drawing air from the air suction path 14. As a result, it can attract the component 60, assist in conveying the component 60 to the first component supply position P1 and the second component supply position P2, and hold the component 60 at the first component supply position P1 and the second component supply position P2.

[0064] An air intake control valve 15 is provided in the air intake path 14.

[0065] The suction air control valve 15 controls the air flowing in the air suction passage 14. For example, when the suction air control valve 15 is open, the air in the air suction passage 14 is drawn in, creating a negative pressure. When the suction air control valve 15 is closed, the air in the air suction passage 14 is no longer drawn in.

[0066] <Component Storage Section>

[0067] The component storage section 3 stores multiple components 60. The component storage section 3 is, for example, a box for storing multiple components 60. The component storage section 3 is disposed on top of the component arrangement section 4, and multiple components 60 are supplied from the component storage section 3 to the component arrangement section 4. The component storage section 3 is detachably mounted to the component supply device 1. The component storage section 3 is provided with a component discharge port for discharging components to the outside.

[0068] Multiple components 60 stored in the component storage section 3 fall from the component inlet under their own weight and are thus inserted into the component sorting and arrangement section 4.

[0069] <Component Arrangement Department>

[0070] The component arrangement section 4 is a part that arranges and organizes multiple components 60. In other words, the component arrangement section 4 is a mechanism for taking out components 60 one by one from the component storage section 3.

[0071] Figure 5 Is Figure 3 The outline sectional view obtained by cutting with AA line.

[0072] like Figure 5 As shown, the component sorting and arranging unit 4 has multiple storage chambers 30 and multiple doors 31. The component sorting and arranging unit 4 has a number of storage chambers 30 and doors 31 corresponding to the number of component transport paths 5A and 5B.

[0073] In the component sorting and arranging unit 4, multiple components 60 are inserted from a component storage unit 3 into multiple storage chambers 30. The component sorting and arranging unit 4 supplies the components 60 inserted into the multiple storage chambers 30 to the first component transport path 5A and the second component transport path 5B through multiple doors 31, respectively. For example, the components 60 are supplied to the first component transport path 5A and the second component transport path 5B through multiple doors 31 by gravity.

[0074] The following describes the details of the component arrangement section 4.

[0075] The storage chamber 30 is formed by a through hole that runs through the component arrangement section 4 in the vertical direction. In this specification, "vertical direction" refers to the vertical direction, specifically the Z-direction. The storage chamber 30 is formed by a conical through hole whose diameter decreases towards the lower part of the component arrangement section 4. More specifically, the storage chamber 30 is formed by a through hole in the shape of an inverted frustum cone.

[0076] Door 31 arranges multiple components 60 into a single column along the vertical direction and discharges them into the first component conveying path 5A or the second component conveying path 5B. The aperture of door 31 is constant.

[0077] The door 31 is formed by a through hole, the diameter of which is designed to allow multiple components 60 to pass through one by one. For example, if the component 60 has a long side direction and a short side direction, the diameter of the door 31 is larger than the dimension of the component 60 in the short side direction and smaller than the dimension in the long side direction.

[0078] The inner wall of storage chamber 30 is formed by an inclined surface. At door 31, it is formed by a wall surface extending in the vertical direction.

[0079] Thus, in this embodiment, components are taken out one by one from the plurality of components 60 that have been placed into the storage chamber 30. In addition, the components 60 taken out from the storage chamber 30 are transported in a line by air introduced into the first component transport path 5A and the second component transport path 5B.

[0080] <Multiple component transport paths>

[0081] Multiple component transport routes 5A and 5B are transport routes that transport multiple components 60 from the component receiving section 3 to multiple component supply positions P1 and P2. Multiple component transport routes 5A and 5B include a first component transport route 5A that transports multiple components 60 from the component receiving section 3 to a first component supply position P1, and a second component transport route 5B that transports multiple components 60 from the component receiving section 3 to a second component supply position P2. The first component transport route 5A transports components 60 to the first component supply position P1, where multiple nozzles 92 can pick up components 60. The second component transport route 5B transports components 60 to a second component supply position P2, which is different from the first component supply position P1.

[0082] The first component conveying path 5A and the second component conveying path 5B are, for example, made of pipes.

[0083] Figure 6A and Figure 6B This is a schematic diagram showing a cross-section of an example of the first component transport path 5A.

[0084] like Figure 6A and Figure 6B As shown, the first component transport path 5A is a tube with a through hole 8 inside. In the cross-section of the first component transport path 5A obtained by cutting it in a direction orthogonal to the transport direction of the component, the through hole 8 has a circular or elliptical shape.

[0085] However, the smaller the component, the smaller its volume and weight, and therefore the easier it is for the component to remain in the component transport path. Therefore, a high degree of machining accuracy (e.g., flatness accuracy) is required for the component transport path. By constructing the first component transport path 5A from tubing, it is possible to prevent multiple components 60 from remaining in the first component transport path 5A.

[0086] The first component transport path 5A has a conductive portion 50A on at least a portion of its inner surface, and a light-transmitting portion 50B. The conductive portion 50A is grounded.

[0087] For example, when the first component transport path 5A is made of a resin tube, multiple components 60 generate friction by contacting the inner surface of the first component transport path 5A. This friction causes them to become charged, and sometimes, due to static electricity, the multiple components 60 remain within the first component transport path 5A.

[0088] By providing a conductive part 50A on at least a portion of the inner surface of the first component transport path 5A, charging and static electricity are suppressed, and multiple components 60 can be prevented from remaining in the first component transport path 5A.

[0089] The conductive part 50A has electrostatic diffusion properties that allow for the smooth discharge of static electricity to the extent that the component 60 is not damaged. For example, the conductive part 50A is composed of a 10 4 Ω or higher and 10 9 The material used has a resistance of Ω or less. For example, carbon can also be used for the conductive part 50A.

[0090] The transparent part 50B may be a part made of a transparent component that allows light to pass through. Alternatively, the transparent part 50B may also be a window or a hole.

[0091] In this embodiment, a conductive portion 50A is provided throughout the first component transport path 5A, except for a portion thereof. A through portion 50B is provided in a portion of the first component transport path 5A.

[0092] Details regarding the structure of the first component conveyor path 5A will be provided later. It should be noted that the second component conveyor path 5B has the same structure as the first component conveyor path 5A.

[0093] <Optical Sensor>

[0094] Optical sensor 6 detects whether component 60 is present in multiple component transport paths 5A and 5B. Optical sensor 6 can be, for example, a photoelectric sensor or a photosensitive sensor. In this embodiment, component supply device 1 has two optical sensors 6 that detect whether component 60 is present in the first component transport path 5A and the second component transport path 5B.

[0095] The light sensor 6 is a sensor that detects the presence or absence of component 60 by means of light. The light sensor 6 can be a transmissive or reflective sensor.

[0096] The optical sensor 6 is disposed along the first component transport path 5A and the second component transport path 5B. In this embodiment, the optical sensor 6 is provided at the connecting portion 20 located along the first component transport path 5A and the second component transport path 5B. The structure of the connecting portion 20 will be described later.

[0097] <Report Light>

[0098] The report light 7 is a light provided on the side of the main body 2. For example, the report light 7 illuminates to inform the user when the parts are exhausted.

[0099] Next, use Figure 7 To illustrate the main structure of the control component mounting device 100.

[0100] Figure 7 This is a control block diagram of an example of the component mounting device 100 according to Embodiment 1 of this disclosure.

[0101] like Figure 7 As shown, the component mounting device 100 includes a control unit 40 that controls the component supply device 1 and the component assembly device 90.

[0102] <Control Department>

[0103] The control unit 40 can be implemented using semiconductor components or the like. For example, the control unit 40 can be composed of a microcomputer, CPU, MPU, GPU, DSP, FPGA, or ASIC. The functions of the control unit 40 can be implemented solely by hardware, or by combining hardware and software. The control unit 40 reads data and programs stored in memory or other storage units and performs various calculations to achieve the specified functions.

[0104] The control unit 40 may also be provided in the component supply device 1 or the component assembly device 90. Alternatively, the control unit 40 may also be provided in a device that is separate from the component supply device 1 and the component assembly device 90.

[0105] The control unit 40 can also control the light sensor 6, the report light 7, the supply air control valve 13, and the suction air control valve 15 in the component supply device 1. Specifically, the control unit 40 can also control the report light 7, the supply air control valve 13, and the suction air control valve 15 based on the detection result of the light sensor 6.

[0106] For example, when the light sensor 6 detects that there is no component 60 in the first component transport path 5A and the second component transport path 5B, the control unit 40 opens the transport air control valve 13 and transports the component 60 in the first component transport path 5A and the second component transport path 5B towards the first component supply position P1 and the second component supply position P2 by air.

[0107] Alternatively, when the control unit 40 is in the state of having the delivery air control valve 13 open, and the light sensor 6 detects that the first component delivery path 5A and the second component delivery path 5B do not have a component 60 for a predetermined time, the control unit 40 closes the delivery air control valve 13 and the suction air control valve 15, and illuminates the report light 7. This allows the user to be informed that the component has been used up.

[0108] In addition, the control unit 40 controls the head 91, which includes multiple mouths 92, in the component assembly device 90.

[0109] For example, the control unit 40 can also control the head 91 to simultaneously pick up components 60 located at the first component supply position P1 and the second component supply position P2 of the component supply device 1. Here, when the spacing between the plurality of nozzles 92 provided on the head 91 is equal to the interval between the first component supply position P1 and the second component supply position P2, it is easy to pick up the plurality of components 60 located at both the first component supply position P1 and the second component supply position P2. Simultaneous picking here means lowering the plurality of nozzles 92 and holding the plurality of components 60 with the plurality of nozzles 92. The head 91 can also hold the plurality of components 60 one by one through multiple holding actions (movement of the nozzles 92 in the vertical direction), or it can hold the plurality of components 60 by lowering the plurality of nozzles 92 simultaneously. The head 91 then mounts the plurality of components 60 held in this way onto a substrate.

[0110] For example, the control unit 40 can also control the head 91 to alternately pick up components 60 located at the first component supply position P1 and the second component supply position P2 of the component supply device 1. Here, alternate picking means that the component 60 held by the head 91 is mounted on the substrate by holding the component 60 from one of the first component supply position P1 and the second component supply position P2 using one of the multiple nozzles 92, and then holding the component 60 from the other of the first component supply position P1 and the second component supply position P2 using one of the multiple nozzles 92 of the head 91.

[0111] For example, the control unit 40 may select at least one of the components 60 located at the first component supply position P1 and the components 60 located at the second component supply position P2 based on the detection result of the light sensor 6, and control the head 91 to pick up at least one of the selected components 60. For example, if a component 60 in the second component supply path 5B is detected but no component 60 in the first component transport path 5A is detected, the control unit 40 may select the component 60 located at the second component supply position P2 and control the head 91 to pick up the component 60.

[0112] Next, use Figures 8-11 The detailed structure of the first component conveyor 5A, the optical sensor 6, and the connecting part 20 will be explained below.

[0113] Figure 8 This is a schematic diagram of an example of the connecting part 20. Figure 9 Is Figure 8 The outline sectional view obtained by cutting with AA line. Figure 10 Is Figure 9 The outline partial enlarged sectional view obtained by enlarging the Z1 part. Figure 11 Is Figure 9 A partial enlarged sectional view of the Z2 section.

[0114] like Figure 8 and Figure 9 As shown, the first component transport path 5A includes a first transport path 51, a second transport path 52, and a third transport path 53. The connecting part 20 has a mechanism for connecting the first transport path 51, the second transport path 52, and the third transport path 53, and a mechanism for detecting the presence or absence of component 60 in the second transport path 52 by the photosensitive sensor 6.

[0115] Conductive portions 50A are provided on at least a portion of the inner surfaces of the first conveying path 51 and the third conveying path 53. In this embodiment, the first conveying path 51 and the third conveying path 53 are tubular materials, and at least the entire inner surface of the first conveying path 51 and the third conveying path 53 is composed of conductive portions 50A. The conductive portions 50A are light-transmitting components, and the first conveying path 51 and the third conveying path 53 are also light-transmitting.

[0116] At least a portion of the second transport path 52 is provided with a light-transmitting portion 50B through which the light from the light sensor 6 can pass. In this embodiment, the second transport path 52 is entirely composed of the light-transmitting portion 50B. Specifically, the second transport path 52 is a transparent tube. The second transport path 52 has one end located on the upstream side and another end located on the downstream side.

[0117] In this specification, the first conveying path 51, the second conveying path 52, and the third conveying path 53 are sometimes referred to as the first pipe 51, the second pipe 52, and the third pipe 53.

[0118] The first conveying path 51 is positioned upstream of the second conveying path 52 in the conveying direction of the plurality of components 60 and is connected to one end of the second conveying path 52. The third conveying path 53 is positioned downstream of the second conveying path 52 in the conveying direction of the plurality of components 60 and is connected to the other end of the second conveying path 52.

[0119] Through holes 8A, 8B, and 8C are respectively provided inside the first conveying path 51, the second conveying path 52, and the third conveying path 53. The first conveying path 51, the second conveying path 52, and the third conveying path 53 are arranged such that the through holes 8A, 8B, and 8C are connected in the conveying direction. In addition, the through holes 8A, 8B, and 8C have a circular shape in cross-section.

[0120] The first conveying path 51, the second conveying path 52, and the third conveying path 53 are fixed in a state where they are connected by the connecting part 20.

[0121] Thus, at the first component transport path 5A, conductive parts 50A are provided on the first transport path 51 and the third transport path 53, and a transmittance part 50B through which the detection light of the optical sensor 6 can pass is provided on the second transport path 52. This allows the optical sensor 6 to detect the component 60 while suppressing the charging and static electricity caused by friction generated when the multiple components 60 move along the first component transport path 5A. Generally, conductive components are mostly made of opaque materials; therefore, when conductive parts 50A are provided, it is difficult to use sensors such as electrostatic capacitance sensors or ultrasonic sensors to detect the component 60. In the component supply device 1, a transmittance part 50B through which the detection light of the optical sensor 6 passes is provided on the second transport path 52 for detecting the component 60, thereby enabling the optical sensor 60 to detect the component 60.

[0122] The connecting part 20 includes a first retaining member 21, a second retaining member 22, a third retaining member 23, and a fixing part 24.

[0123] The first retainer 21 internally holds the second conveying path 52. For example, the first retainer 21 is provided with a retaining hole 21A for holding the second conveying path 52. The retaining hole 21A of the first retainer 21 communicates along the conveying direction. The length of the retaining hole 21A of the first retainer 21 in the conveying direction is greater than the length of the second conveying path 52.

[0124] Furthermore, the first retainer 21 has a first end E1 on the upstream side of the conveying direction and a second end E2 on the downstream side of the conveying direction. In this embodiment, the first end E1 is the bottom surface of a recess provided on the side of the first retainer 21 on the upstream side of the conveying direction. The second end E2 is the bottom surface of a recess provided on the side of the first retainer 21 on the downstream side of the conveying direction.

[0125] Furthermore, a light guide path 25 for guiding the detection light of the light sensor 6 is provided in the first holding member 21. The light guide path 25 guides the detection light of the light sensor 6 to the transmission portion 50B of the second transport path 52. The light guide path 25 extends in a direction intersecting the second transport path 52, that is, in a direction intersecting the transport direction. The light guide path 25 is, for example, a through hole.

[0126] In this embodiment, the light sensor 6 is a transmissive type light sensor. The light sensor 6 includes a light-emitting part 6A and a light-receiving part 6B. The light-emitting part 6A emits detection light. The light-receiving part 6B receives the detection light emitted from the light-emitting part 6A.

[0127] The detection light emitted from the light-emitting unit 6A passes through the light guide path 25 and goes to the light-receiving unit 6B. A transmission part 50B of the second transport path 52 is provided along the light guide path 25. When the component 60 is present in the transmission part 50B of the second transport path 52, the detection light is blocked by the component 60. Therefore, the light-receiving unit 6B does not receive the detection light or receives it poorly. In this case, the control unit 40 can determine that the component 60 is present in the second transport path 52. On the other hand, when the component 60 is not present in the transmission part 50B of the second transport path 52, the detection light is not blocked by the component 60 and is incident on the light-receiving unit 6B. In this case, the control unit 40 can determine that the component 60 is not present in the second transport path 52.

[0128] The second retainer 22 is connected to the first end E1 of the first retainer 21 at a position upstream of the second conveying path 52 in the conveying direction, thus connecting the first conveying path 51 to the second conveying path 52. For example, the second retainer 22 is provided with a retaining hole 22A for retaining the first conveying path 51. The retaining hole 22A of the second retainer 22 communicates along the conveying direction. A portion of the downstream side of the first conveying path 51 in the conveying direction protrudes from the retaining hole 22A of the second retainer 22 and is disposed in the retaining hole 21A of the first retainer 21.

[0129] The third retainer 23 is connected to the second end E2 of the first retainer 21 at a position downstream of the second conveying path 52 in the conveying direction, and the third conveying path 53 is connected to the second conveying path 52. For example, the third retainer 23 is provided with a retaining hole 23A for retaining the third conveying path 53. The retaining hole 23A of the third retainer 23 communicates along the conveying direction. A portion of the upstream side of the third conveying path 53 in the conveying direction protrudes from the retaining hole 23A of the third retainer 23 and is disposed in the retaining hole 21A of the first retainer 21.

[0130] The second retainer 22 and the third retainer 23 may also be tubular flanges, for example. For example, the second retainer 22 and the third retainer 23 may be integrally formed with the first conveying path 51 and the third conveying path 53, respectively. The second retainer 22 and the third retainer 23 may also be bonded to the first conveying path 51 and the third conveying path 53, respectively, using an adhesive or the like. Alternatively, the first conveying path 51 and the third conveying path 53 may be pressed into the retaining holes 22A and 23A of the second retainer 22 and the third retainer 23, respectively.

[0131] The fixing part 24 presses the second retaining member 22 against the first end E1 of the first retaining member 21 and presses the third retaining member 23 against the second end E2 of the first retaining member 21, thereby fixing the second retaining member 22 and the third retaining member 23 to the first retaining member 21. The fixing part 24 fixes the two ends of the second conveying path 52 to the first conveying path 51 and the third conveying path 53 respectively. The fixing part 24 is, for example, a clamp. With this structure, the first conveying path 51, the second conveying path 52 and the third conveying path 53, which form the air flow path, are tightly connected and fixed, preventing air from flowing out from the joint of the component conveying path 5A. When the component 60 is conveyed by air, the air pressure in the component conveying path 5A affects the conveying speed of the component 60. By preventing air from flowing out of the component conveying path 5A by the fixing part 24, the air pressure in the component conveying path 5A can be maintained within a specified range when compressed air is supplied to the component conveying path 5A. Therefore, the component 60 can be conveyed toward the component supply positions P1 and P2 at a desired speed.

[0132] like Figure 10As shown, the opening of the through hole 8B of the second conveying path 52 on the upstream side of the conveying direction is larger than the opening of the through hole 8A of the first conveying path 51 on the downstream side of the conveying direction. That is, the size D20 of the opening of the through hole 8B of the second conveying path 52 on the upstream side of the conveying direction is larger than the size D10 of the opening of the through hole 8A of the first conveying path 51 on the downstream side of the conveying direction. In this embodiment, the through holes 8A and 8B are circular in cross-section, therefore, the sizes D10 and D20 are diameters.

[0133] A portion of the through-hole 8B in the second conveying path 52 on the upstream side of the conveying direction is formed in a conical shape. Specifically, in the second conveying path 52, the size of the through-hole 8B continuously decreases as the opening of the through-hole 8B moves downstream in the conveying direction. Furthermore, the size D21 of the through-hole 8B remains constant as it moves downstream in the second conveying path 52.

[0134] Thus, at the junction of the first conveying path 51 and the second conveying path 52, the opening of the through hole 8B of the second conveying path 52 is larger than the opening of the through hole 8A of the first conveying path 51. As a result, the component 60 can be conveyed smoothly at this junction.

[0135] like Figure 11 As shown, the opening of the through hole 8C of the third conveying path 53 on the upstream side of the conveying direction is larger than the opening of the through hole 8B of the second conveying path 52 on the downstream side of the conveying direction. That is, the size D21 of the opening of the through hole 8C of the third conveying path 53 on the upstream side of the conveying direction is larger than the size D30 of the opening of the through hole 8B of the second conveying path 52 on the downstream side of the conveying direction. In this embodiment, the through holes 8A and 8B are circular in cross-section, therefore sizes D21 and D30 are diameters. Furthermore, size D21 is smaller than size D20.

[0136] A portion of the through-hole 8C in the third conveying path 53 on the upstream side of the conveying direction is formed in a conical shape. Specifically, in the third conveying path 53, the size of the through-hole 8C continuously decreases as the opening of the through-hole 8C moves downstream from the upstream side of the conveying direction. In addition, the size D31 of the through-hole 8C remains constant as it moves downstream from the middle of the third conveying path 53.

[0137] Thus, at the junction of the second conveying path 52 and the third conveying path 53, the opening of the through hole 8C of the third conveying path 53 is larger than the opening of the through hole 8B of the second conveying path 52. As a result, the component 60 can be conveyed smoothly at this junction.

[0138] The component supply device 1 according to Embodiment 1 of this disclosure can achieve the following effects.

[0139] The component supply device 1 is a component supply device assembled in the component mounting device 100, which mounts the component 60 picked up by the nozzle 92 onto a substrate. The component supply device 1 includes multiple component transport paths 5A and 5B, which transport components 60 taken from the component storage section 3, which stores multiple components 60 in a scattered state. The multiple component transport paths 5A and 5B include a first component transport path 5A and a second component transport path 5B. The first component transport path 5A transports the component 60 to a first component supply position P1 where the nozzle 92 can pick up the component 60. The second component transport path 5B transports the component 60 to a second component supply position P2, which is different from the first component supply position P1.

[0140] According to this structure, loosely arranged components 60 can be supplied to component supply positions P1 and P2, which are maintained by the nozzle 92. In the component supply device 1, components taken from a component storage section 3 can be conveyed to the first component transport path 5A and the second component transport path 5B. As a result, the number of components used in the production of a single substrate can be increased from a single component storage section 3, thus achieving excellent efficiency in terms of storage of the component storage section 3 and component inventory management. Generally, the number of components stored in the component storage section 3 is greater than the number of components stored in the tape and reel components, thus reducing the number of components in stock. Therefore, the component supply device 1 of this disclosure is more efficient in terms of storage, inventory, and other management aspects compared to component supply devices that have one component transport path for each component storage section.

[0141] The component supply device 1 includes a conveying force application unit 10, which applies a conveying force for conveying the component 60 in the first component conveying path 5A and the second component conveying path 5B.

[0142] According to this structure, component 60 can be transported in the first component transport path 5A and the second component transport path 5B.

[0143] The conveying force application unit 10 introduces air into the first component conveying path 5A and the second component conveying path 5B.

[0144] According to this structure, component 60 can be transported using air within the first component transport path 5A and the second component transport path 5B.

[0145] The component supply device 1 includes a component sorting and arranging section 4, which sorts and arranges a plurality of components 60 supplied from the component storage section 3 and supplies the plurality of components 60 to the first component conveying path 5A and the second component conveying path 5B.

[0146] With this structure, the component arrangement unit 4 can be used to arrange and organize multiple components 60 that are conveyed to the first component conveying path 5A and the second component conveying path 5B.

[0147] The component mounting apparatus 100 according to Embodiment 1 of this disclosure includes the component supply apparatus 1 and the component assembly apparatus 90 described above. For example, the component mounting apparatus 100 includes a first component transport path 5A, a second component transport path 5B, and a head 91. The first component transport path 5A transports multiple components 60 from a component storage section 3 that stores multiple components 60 to a first component supply position P1. The second component transport path 5B transports multiple components 60 from the component storage section 3 to a second component supply position P2. The head 91 has multiple nozzles 92 for picking up multiple components 60 from the first component supply position P1 and the second component supply position P2.

[0148] In this structure, the same effect as described in component supply device 1 can be achieved.

[0149] The component mounting device 100 includes a control unit 40 with a control head 91. The control unit 40 controls the head 91 to simultaneously pick up the component 60 located at the first component supply position P1 and the component 60 located at the second component supply position P2.

[0150] With this structure, the speed of mounting multiple components 60 onto the substrate can be increased. In the component mounting apparatus 100, compared with the structure of picking up multiple components of the same type from multiple component supply devices that supply components of the same type, multiple components can be picked up in one holding action (the vertical movement of the nozzle 92), thus increasing the mounting speed.

[0151] The control unit 40 controls the head 91 to alternately pick up the component 60 located at the first component supply position P1 and the component 60 located at the second component supply position P2.

[0152] With this structure, the number of components used in the production of a substrate can be increased from a component storage section, while the number of components that can be installed on the substrate per unit time can also be increased. For example, when the moving speed of the head 91 exceeds the speed at which multiple components 60 are supplied to component supply positions P1 and P2, the first component supply position P1 and the second component supply position P2 function as buffers for each other, thus enabling efficient supply and installation of multiple components 60 to the substrate.

[0153] The component mounting device 100 includes an optical sensor 6 for detecting components 60 within the first component transport path 5A and the second component transport path 5B. Based on the detection result of the optical sensor 6, the control unit 40 selects at least one of the components 60 located at the first component supply position P1 and the components 60 located at the second component supply position P2, and the control head 91 picks up at least one of the selected components 60.

[0154] According to this structure, when there is no component 60 in either the first component transport path 5A or the second component transport path 5B, a component can be supplied from the component transport path where the component 60 is present.

[0155] The component mounting device 100 includes a main body 2, which has a first component supply position P1 and a second component supply position P2. The main body 2 has a long side direction (Y direction), and the first component supply position P1 and the second component supply position P2 are arranged in the long side direction or in a direction intersecting the long side direction.

[0156] With this structure, the component 60 located at the first component supply position P1 and the component 60 located at the second component supply position P2 can be picked up efficiently.

[0157] The first component supply position P1 and the second component supply position P2 are set apart by a gap L1, and the gap L1 is equal to the distance between the plurality of nozzles 92.

[0158] With this structure, multiple component 60 components in a scattered state can be simultaneously supplied to multiple component supply positions P1 and P2 of the component 60 at multiple adjacent nozzles 92. As a result, the component 60 located at the first component supply position P1 and the component 60 located at the second component supply position P2 can be picked up more efficiently.

[0159] (Other implementation methods)

[0160] It should be noted that this embodiment illustrates an example where the component supply device 1 includes a light sensor 6 and an indicator light 7, but it is not limited to this. The light sensor 6 and the indicator light 7 are not essential components.

[0161] This embodiment illustrates an example where multiple component supply locations P1 and P2 include two component supply locations P1 and P2, but it is not limited to this. Multiple component supply locations P1 and P2 can be any locations that include more than two component supply locations.

[0162] This embodiment illustrates an example where multiple component transport paths 5A and 5B include two component transport paths 5A and 5B, but it is not limited to this. Multiple component transport paths 5A and 5B can be any path that includes two or more component transport paths.

[0163] Figure 12 This is a schematic diagram showing another example of the component supply device 1.

[0164] like Figure 12 As shown, four component supply positions P1 to P4 and four component transport paths 5A to 5D can also be provided in the component supply device 1. For example, the first component transport path 5A to the fourth component transport path 5D supply multiple components 60 from the component receiving section 3. The first component transport path 5A to the fourth component transport path 5D can also transport multiple components 60 to the first component supply position P1 to the fourth component supply position P4 respectively.

[0165] The third component supply position P3 and the fourth component supply position P4 can also be arranged with a predetermined interval L1 in the long side direction (Y direction) of the component supply device 1. The first component supply position P1 and the third component supply position P3 can also be arranged with a predetermined interval L2 in the short side direction (X direction) that intersects the long side direction (Y direction) of the component supply device 1. The second component supply position P2 and the fourth component supply position P4 can also be arranged with a predetermined interval L2 in the short side direction (X direction) that intersects the long side direction (Y direction) of the component supply device 1. The intervals L1 and L2 can also be equal to the spacing between the plurality of nozzles 92 of the head 91.

[0166] In addition, Figure 12 In the example shown, the component arrangement section 4 may also have four storage chambers 30 and four doors 31.

[0167] With this structure, the number of components used in the production of a single substrate can be further increased from a component storage section 3, thus achieving excellent efficiency in the storage of the component storage section 3, the management of component inventory, etc.

[0168] This embodiment illustrates an example where the second component transport path 5B has the same structure as the first component transport path 5A, but it is not limited thereto. For example, the second component transport path 5B may also have a different structure than the first component transport path 5A.

[0169] This embodiment illustrates an example where multiple component transport paths 5A and 5B are constructed of pipes, but is not limited to this. For example, multiple component transport paths 5A and 5B may also be constructed of piping, troughs, or rods.

[0170] This embodiment illustrates an example where the first transport path 51 and the third transport path 53 are opaque to light, but it is not limited to this. For example, the first transport path 51 and the third transport path 53 may also be constructed from light-transmitting components. In this case, the first transport path 51, the second transport path 52, and the third transport path 53 may also be integrally formed.

[0171] This embodiment describes an example where the entire second transport path 52 is composed of a light-transmitting portion 50B, but it is not limited to this. For example, it is sufficient that at least a portion of the second transport path 52 is provided with a light-transmitting portion 50B.

[0172] Figure 13 This is a schematic cross-sectional view showing another example of the first component transport path 5A.

[0173] like Figure 13 As shown, the second transport path 52 may also have a transparent portion 50B at the point where it intersects with the light guide path 25. In the second transport path 52, the portion other than the transparent portion 50B may be opaque. Alternatively, a conductive portion 50A may be provided in the portion other than the transparent portion 50B. The transparent portion 50B may be, for example, a transparent window or a hole.

[0174] In this embodiment, an example is described in which a portion of the through hole 8B of the second conveying path 52 on the upstream side of the conveying direction is formed in a conical shape and tends downstream from the second conveying path 52 while the size D21 of the through hole 8B remains constant, but it is not limited to this.

[0175] In this embodiment, an example is described in which a portion of the through hole 8C of the third conveying path 53 on the upstream side of the conveying direction is formed in a conical shape and tends downstream from the third conveying path 53 while the size D31 of the through hole 8C remains constant, but it is not limited to this.

[0176] Figure 14 This is a partial enlarged view showing another example of the first component transport path 5A.

[0177] like Figure 14 As shown, the through hole 8A of the first conveying path 51, the through hole 8B of the second conveying path 52, and the through hole 8C of the third conveying path 53 may also have a conical shape in which the diameter gradually decreases from upstream to downstream in the conveying direction. That is, the through hole 8A of the first conveying path 51, the through hole 8B of the second conveying path 52, and the through hole 8C of the third conveying path 53 may not have a portion with a constant diameter.

[0178] In this structure, multiple components 60 can also move smoothly at the connection points of the first conveying path 51, the second conveying path 52 and the third conveying path 53.

[0179] This embodiment describes an example where the conveying force application unit 10 has a mechanism for introducing air, but it is not limited to this. For example, the conveying force application unit 10 may also have a mechanism for conveying multiple components 60 by forces such as vibration, electromagnetic force, belt conveyor or gravity.

[0180] For example, the structure of multiple component conveying paths 5A and 5B of component supply device 1 can also be applied to ball feeders or rod feeders.

[0181] When used with a ball feeder, the multiple component transport paths 5A and 5B can also be formed by grooves. Additionally, the through portion 50B of the second transport path 52 can also be a hole.

[0182] When a rod-type feeder is used, the component storage section 3 can also use a rod-type housing. It is also possible to branch from one rod-type housing to multiple component transport paths 5A and 5B, and supply multiple components 60 to multiple component supply positions P1 and P2. In this case, the rod itself can also be a component transport path 5A or 5B.

[0183] For example, the component storage unit 3 may also have a structure with an inlet for feeding components 60. That is, the structure of the component conveying path 5A can also be applied to the "hopper type" feeder described in Japanese Utility Model Application Publication No. 4-125238. For example, the component storage unit 3 may also have a hopper that can hold multiple components 60 and move up and down, a component feeding path with an inlet at the lower end for feeding components 60 supplied from the hopper into the component conveying paths 5A and 5B, and a stopper disposed at the inlet to stop the components 60. The stopper may also release the stop of the components 60 by lowering the hopper and feeding the components 60 into the component conveying paths 5A and 5B.

[0184] This embodiment describes an example where the first component transport path 5A is composed of a first transport path 51, a second transport path 52, and a third transport path 53, but it is not limited to this. For example, the first component transport path 5A may not have a third transport path 53. For example, the first component transport path 5A may simply have a conductive portion 50A provided at least on a portion of its inner surface and a light-transmitting portion 50B. For example, the first component transport path 5A may also be a tube in which at least the inner surface, except for the light-transmitting portion 50B, is composed of a conductive portion 50A.

[0185] This embodiment describes an example of detecting component 60 within the first component transport path 5A and the second component transport path 5B using the optical sensor 6, but it is not limited to this. For example, if multiple component transport paths 5A and 5B do not have conductive portions 50A, other sensors may be used to detect component 60 within the first component transport path 5A and the second component transport path 5B. For example, a magnetic sensor, a capacitive sensor, or an ultrasonic sensor may be used instead of the optical sensor 6.

[0186] This embodiment describes an example where the component supply device 1 includes a connecting portion 20, but it is not limited to this. For example, the connecting portion 20 is not a necessary structure.

[0187] This embodiment illustrates an example where a portion of the first conveying path 51 and the third conveying path 53 protrudes from the second retainer 22 and the third retainer 23 and is disposed within the retaining hole 21A of the first retainer 21, but is not limited thereto. For example, both ends of the second conveying path 52 may protrude from the first retainer 21 and be disposed within the retaining holes 22A and 23A of the second retainer 22 and the third retainer 23.

[0188] This embodiment describes an example where the component arrangement section 4 consists of a storage chamber 30 and a door 31, but it is not limited to this. Alternatively, the component arrangement section 4 may have a movable part capable of moving up and down or rotating, with the door 31 disposed on the movable part. This can prevent the component 60 from becoming blocked at the portion of the door 31 connected to the storage chamber 30. Furthermore, the component arrangement section 4 may be configured to intermittently blow air into the portion of the door 31 connected to the storage chamber 30. In this case, the control unit 40 may also control the movement of the movable part and control the airflow based on the detection result of the light sensor 6.

[0189] This embodiment illustrates an example where the supply air control valve 13 and the suction air control valve 15 are provided in the main body 2, but it is not limited to this. For example, the supply air control valve 13 and the suction air control valve 15 may not be provided in the main body 2.

[0190] The above-described embodiments illustrate the present invention, but this disclosure is not limited to the above-described embodiments. The technology in this disclosure is not limited thereto and can also be applied to embodiments with appropriate modifications, substitutions, additions, omissions, etc.

[0191] This disclosure is fully described with reference to the accompanying drawings and preferred embodiments, but various modifications and alterations will be apparent to those skilled in the art. It should be understood that such modifications and alterations are included as long as they do not depart from the scope of this disclosure based on the attached technical solutions.

[0192] Furthermore, the general and specific solutions disclosed herein can also be implemented by systems, methods, computer programs and computer-readable storage media, and combinations thereof.

[0193] (Postscript)

[0194] The following technology is disclosed through the description of the above embodiments.

[0195] (Technology 1) A component mounting apparatus, wherein the component mounting apparatus comprises: a first component conveying path that conveys the plurality of components from a component receiving section that receives a plurality of components to a first component supply position; a second component conveying path that conveys the plurality of components from the component receiving section to a second component supply position; and a head having a plurality of mouths that pick up the plurality of components from the first component supply position and the second component supply position.

[0196] This structure allows for the supply of components in a scattered state to multiple component supply positions that can be held by the mouth.

[0197] (Technology 2) The component mounting apparatus according to Technology 1, wherein the component mounting apparatus further comprises a control unit for controlling the head, the control unit controlling the head to simultaneously pick up a first component located at the first component supply position and a second component located at the second component supply position.

[0198] This structure allows for the simultaneous maintenance of multiple component supply positions from the mouth while keeping the components in a scattered state.

[0199] (Technology 3) The component mounting apparatus according to Technology 1, wherein the component mounting apparatus further comprises a control unit for controlling the head, the control unit controlling the head to alternately pick up a first component located at the first component supply position and a second component located at the second component supply position.

[0200] This structure allows for an increase in the number of components used in the production of a substrate while simultaneously increasing the number of components that can be installed on the substrate per unit time, all from a component storage section.

[0201] (Technology 4) The component mounting apparatus according to Technology 1, wherein the component mounting apparatus further comprises: a control unit that controls the head; and a sensor that detects components in the first component transport path and the second component transport path, wherein the control unit selects at least one of a first component located at the first component supply position and a second component located at the second component supply position based on the detection result of the sensor, and the control unit controls the head to pick up at least one of the selected first component and second component.

[0202] With this structure, for example, if a component runs out in either the first component transport path or the second component transport path, multiple components can be picked up from the component transport path where components are present.

[0203] (Technology 5) The component mounting apparatus according to any one of Technologies 1 to 4, wherein the component mounting apparatus further comprises a conveying force applying part, which applies a conveying force for conveying the plurality of components in the first component conveying path and the second component conveying path.

[0204] This structure enables efficient and effective transport of multiple components within the first and second component transport paths.

[0205] (Technology 6) The component mounting apparatus according to any one of Technology 1 to 5, wherein the component mounting apparatus further comprises a component sorting and arranging section, which sorts and arranges the plurality of components supplied from the component storage section and supplies the plurality of components to the first component conveying path and the second component conveying path.

[0206] This structure enables the arrangement of multiple components that are fed to the first component conveyor path and the second component conveyor path.

[0207] (Technology 7) A component mounting device according to any one of technologies 1 to 6, wherein the component mounting device further comprises a main body portion having a first component supply position and a second component supply position, the main body portion having a long side direction, and the first component supply position and the second component supply position being arranged in the long side direction or in a direction intersecting the long side direction.

[0208] This structure allows for the supply of components in a scattered state to multiple component supply positions that can be held by the mouth.

[0209] (Technology 8) A component installation device according to any one of Technologies 1 to 7, wherein the first component supply position and the second component supply position are provided with a gap between them, the gap being equal to the spacing between the plurality of nozzles.

[0210] This structure allows for the simultaneous supply of components in a scattered state to multiple adjacent nozzles.

[0211] (Technology 9) A component supply device assembled with a component mounting device that mounts a component picked up by a mouth onto a substrate, wherein the component supply device has a plurality of component transport paths that transport components taken from a component storage section that stores a plurality of components in a scattered state, the plurality of component transport paths including: a first component transport path that transports the component to a first component supply position where the mouth can pick up the component; and a second component transport path that transports the component to a second component supply position different from the first component supply position.

[0212] This structure allows for the supply of components in a scattered state to multiple component supply positions that can be held by the mouth.

[0213] (Technology 10) The component supply device according to Technology 9, wherein the component supply device further comprises a conveying force applying part, which applies a conveying force for conveying the component in the first component conveying path and the second component conveying path.

[0214] This structure enables efficient and effective transport of multiple components within the first and second component transport paths.

[0215] (Technology 11) The component supply device according to Technology 10, wherein the conveying force application unit introduces air into the first component conveying path and the second component conveying path.

[0216] This structure enables more efficient and effective transport of multiple components within the first and second component transport paths.

[0217] Industrial availability

[0218] This disclosure is useful, for example, as a component supply device and a component mounting device for supplying multiple components.

[0219] Explanation of reference numerals in the attached figures

[0220] 1. Component supply device

[0221] 2 Main body

[0222] 3. Component storage section

[0223] 4. Component Arrangement Section

[0224] 5A First Component Conveyor Path

[0225] 5B Second Component Conveyor Path

[0226] 5C Third Component Conveyor Path

[0227] 5D Fourth Component Conveyor Path

[0228] 6. Light Sensor

[0229] 7. Reporting Light

[0230] 8, 8A, 8B, 8C Through holes

[0231] 10. Conveying force application section

[0232] 11 Air Inlet Path

[0233] 11a Air inlet

[0234] 12 Air supply path

[0235] 13 Air delivery control valve

[0236] 14 Air intake path

[0237] 14a Air intake port

[0238] 15 Suction Air Control Valve

[0239] 20 Connecting parts

[0240] 21 First retainer

[0241] 21A Retaining Hole

[0242] 22 Second retainer

[0243] 22A retaining hole

[0244] 23 Third retainer

[0245] 23A retaining hole

[0246] 24 Fixing part

[0247] 25 Light guide path

[0248] 30 Storage Room

[0249] 31 doors

[0250] 40 Control Department

[0251] 50A conductive part

[0252] 50B Through Department

[0253] 51 First transport route

[0254] 52 Second transport route

[0255] 53 Third transport route

[0256] 60 parts

[0257] 80 fixed platform

[0258] 90-part assembly device

[0259] 91 heads

[0260] 92 mouth

[0261] CX1 central axis

[0262] P1 First component supply location

[0263] P2 Second component supply location

[0264] P3 Third Component Supply Location

[0265] P4 is the supply location for the fourth component.

Claims

1. A component mounting device, wherein, The component mounting device includes: A first component transport path transports the multiple components from a component storage section that stores multiple components to a first component supply position; A second component transport path transports the plurality of components from the component receiving section to the second component supply position; as well as The head has a plurality of mouths that pick up the plurality of components from the first component supply position and the second component supply position.

2. The component mounting device according to claim 1, wherein, The component mounting device also includes a control unit for controlling the head. The control unit controls the head to simultaneously pick up the first component located at the first component supply position and the second component located at the second component supply position.

3. The component mounting device according to claim 1, wherein, The component mounting device also includes a control unit for controlling the head. The control unit controls the head to alternately pick up a first component located at the first component supply position and a second component located at the second component supply position.

4. The component mounting device according to claim 1, wherein, The component mounting device also includes: Control unit, which controls the head; and Sensors that detect components within the first component transport path and the second component transport path. Based on the detection results of the sensor, the control unit selects at least one of a first component located at the first component supply position and a second component located at the second component supply position. The control unit controls the head to pick up at least one of the selected first component and second component.

5. The component mounting device according to any one of claims 1 to 4, wherein, The component mounting device further includes a conveying force applying unit that applies a conveying force for conveying the plurality of components in the first component conveying path and the second component conveying path.

6. The component mounting device according to any one of claims 1 to 5, wherein, The component mounting device further includes a component sorting and arranging section, which sorts and arranges the plurality of components supplied from the component storage section and supplies the plurality of components to the first component conveying path and the second component conveying path.

7. The component mounting device according to any one of claims 1 to 6, wherein, The component mounting device further includes a main body, which has a first component supply position and a second component supply position. The main body has a long side direction. The first component supply position and the second component supply position are arranged in the direction of the long side or in the direction intersecting the direction of the long side.

8. The component mounting device according to any one of claims 1 to 7, wherein, The first component supply position and the second component supply position are arranged at intervals from each other. The interval is equal to the distance between the plurality of mouths.

9. A component supply device, assembled to a component mounting device, the component mounting device mounting a component picked up by a nozzle onto a substrate, wherein, The component supply device has multiple component conveying paths that convey components taken out from a component storage section that stores multiple components in a scattered state. The multiple component transport paths include: A first component transport path, which transports the component to a first component supply position where the mouth can pick up the component; and A second component transport path transports the component to a second component supply position that is different from the first component supply position.

10. The component supply device according to claim 9, wherein, The component supply device further includes a conveying force applying unit that applies a conveying force for conveying the component in the first component conveying path and the second component conveying path.

11. The component supply device according to claim 10, wherein, The conveying force application unit introduces air into the first component conveying path and the second component conveying path.

Images