Mounting head and component mounting device

Abstract

The mounting head includes: multiple shafts connected to component nozzles and arranged along a first direction intersecting the lifting direction; a shaft holder that holds the multiple shafts so that they can be lifted and lowered individually; a manifold having an airflow path for supplying airflow to the component nozzles; and multiple flow sensors. The airflow path includes multiple terminal flow paths, each corresponding to and connected to a specific component nozzle. Each flow sensor is individually connected to a terminal flow path to measure the airflow rate in that terminal flow path. The manifold is positioned on a side separated from the shaft holder in a second direction, which intersects both the lifting direction and the first direction.

Description

Technical Field

[0001] This disclosure relates to a mounting head and a component mounting device having the mounting head. Background Technology

[0002] Previously, component mounting devices that use the suction nozzle of the mounting head to hold the component and mount the component to the substrate are known (see, for example, Patent Document 1).

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2008-103412 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] In the mounting head of Patent Document 1, a manifold containing a portion of the airflow path supplying air to the nozzle is located near a lifting mechanism that moves the nozzle up and down along the Z-axis. The manifold is equipped with a valve that switches between positive and negative pressure air, and a flow sensor that measures the flow rate of the air flowing in the airflow path. When the distance between the nozzle and the manifold is long, the responsiveness of the switching between positive and negative pressure air decreases.

[0008] The purpose of this disclosure is to solve the aforementioned problem by providing a mounting head with improved air switching responsiveness and a component mounting device having the mounting head.

[0009] Solution for solving the problem

[0010] To achieve the aforementioned objective, the mounting head of this disclosure comprises: a plurality of shafts connected to component nozzles and arranged along a first direction intersecting the lifting direction; a shaft retainer that holds the plurality of shafts so that they can be lifted and lowered individually; a manifold having an airflow path for supplying air to the component nozzles; a plurality of valve devices corresponding to the component nozzles, each valve device including a first valve and a second valve mounted on the manifold and switching the air supplied to the nozzles; and a plurality of flow sensors. The airflow path comprises: a positive pressure flow path connected to a positive pressure source; a negative pressure flow path connected to a negative pressure source; multiple terminal flow paths corresponding to and connected to the plurality of component nozzles; multiple positive pressure inlet flow paths that individually connect the plurality of first valves to the positive pressure flow path; multiple connecting flow paths that corresponding to the plurality of valve devices and connecting the first valves to the second valves; and multiple negative pressure inlet flow paths that individually connect the plurality of second valves to the negative pressure flow path. The flow sensor is connected separately to the terminal flow path to measure the air flow rate in the terminal flow path. The manifold is located on the side that is separated from the shaft retainer in a second direction, which intersects the lifting direction and the first direction.

[0011] In addition, the component mounting apparatus disclosed herein includes: the aforementioned mounting head; a component supply unit that supplies components to the component suction nozzle of the mounting head; and a substrate transport mechanism that transports a substrate on which the components are mounted by the mounting head.

[0012] Invention Effects

[0013] According to this disclosure, a mounting head with improved air switching responsiveness and a component mounting device having the mounting head can be provided. Attached Figure Description

[0014] Figure 1 This is a top view of the component mounting device according to the embodiment.

[0015] Figure 2 This is a perspective view of the mounting head in the implementation method.

[0016] Figure 3 This is a perspective view of the mounting head in the implementation method.

[0017] Figure 4 This is a summary side view of the mounting head in the implementation method.

[0018] Figure 5 This is a perspective view of the mounting head in the implementation method.

[0019] Figure 6 This is a schematic side view of the first and second suction nozzle units according to the embodiment.

[0020] Figure 7 This is a top view showing the nozzle component at the lower part of the mounting head in the embodiment.

[0021] Figure 8 This is a top view showing the lifting motor at the top of the mounting head in the embodiment.

[0022] Figure 9 This is a schematic cross-sectional view showing the peripheral structure of the manifold in the embodiment.

[0023] Figure 10 This is a summary front view showing the state in which the connecting structure is installed on the mounting head in the embodiment.

[0024] Figure 11 This is a summary side view showing the state in which the connecting structure is installed on the mounting head in the embodiment.

[0025] Figure 12 This is a schematic perspective view showing the manifold and its surrounding structure in the embodiment.

[0026] Figure 13 This is a schematic perspective view showing the manifold and its surrounding structure in the embodiment.

[0027] Figure 14 This is a schematic perspective view of the manifold in the implementation method.

[0028] Figure 15 This is a schematic perspective view of the manifold in the implementation method.

[0029] Figure 16 This is a schematic perspective view of the sensor substrate according to the embodiment.

[0030] Figure 17 This is a schematic cross-sectional view illustrating a method for mounting a sensor substrate according to an embodiment onto a manifold.

[0031] Figure 18 This is a schematic cross-sectional view illustrating a method for mounting a sensor substrate according to an embodiment onto a manifold.

[0032] Figure 19 This is a schematic cross-sectional view showing the airflow path of the manifold in the embodiment.

[0033] Figure 20 This is a schematic diagram showing the connection relationship of the airflow path of the mounting head in the embodiment.

[0034] Figure 21 This is a block diagram illustrating the control system in the component mounting device of the embodiment. Detailed Implementation

[0035] (Regarding the proposed scheme)

[0036] The first embodiment of this disclosure includes an installation head comprising: a plurality of shafts connected to component nozzles and arranged along a first direction intersecting the lifting direction; a shaft retainer that holds the plurality of shafts so that they can be lifted and lowered individually; a manifold having an airflow path for supplying air to the component nozzles; a plurality of valve devices corresponding to the component nozzles, the valve devices including a first valve and a second valve mounted on the manifold and switching the air supplied to the nozzles; and a plurality of flow sensors. The airflow path comprises: a positive pressure flow path connected to a positive pressure source; a negative pressure flow path connected to a negative pressure source; multiple terminal flow paths corresponding to and connected to the plurality of component nozzles; multiple positive pressure inlet flow paths that individually connect the plurality of first valves to the positive pressure flow path; multiple connecting flow paths that corresponding to the plurality of valve devices and connecting the first valves to the second valves; and multiple negative pressure inlet flow paths that individually connect the plurality of second valves to the negative pressure flow path. The flow sensor is connected separately to the terminal flow path to measure the air flow rate in the terminal flow path. The manifold is located on the side that is separated from the shaft retainer in a second direction, which intersects the lifting direction and the first direction.

[0037] According to the mounting head of the first embodiment, the manifold equipped with a valve that switches between positive and negative air supply is positioned opposite the shaft, thus shortening the distance from the valve to the component nozzle. This reduces air resistance in the airflow path from the valve to the component nozzle, thereby improving the responsiveness of the positive / negative air switching.

[0038] According to a second aspect of this disclosure, based on the mounting head of the first aspect, the manifold has a first main surface and a second main surface. The first valve and the second valve are mounted on the first main surface, and the flow sensor is connected to the terminal flow path from the second main surface side. The second main surface is opposite to a plurality of the shafts.

[0039] According to the third aspect of this disclosure, based on the mounting head of the second aspect, the mounting head includes a substrate having the plurality of flow sensors, and the flow sensors are connected to the terminal flow path when the substrate is mounted on the second main surface of the manifold.

[0040] According to the fourth aspect of this disclosure, based on the mounting head of the third aspect, the second main surface of the manifold has a recess for avoiding interference with components mounted on the substrate.

[0041] According to the fifth aspect of this disclosure, based on any of the first to fourth aspects of the mounting head, the component nozzle is connected to the terminal flow path via an air filter, the air filter being housed within a manifold.

[0042] According to the sixth embodiment of this disclosure, based on any of the first to fifth embodiments of the mounting head, multiple shafts are arranged in two rows with a gap in a second direction that intersects the lifting direction and the first direction, and two manifolds are respectively arranged on one side and the other side of the second direction in a manner opposite to the shafts of each row.

[0043] According to the seventh embodiment of this disclosure, the manifold is mounted on the shaft retainer based on any one of the mounting heads in the first to sixth embodiments.

[0044] According to the eighth embodiment of this disclosure, based on any of the first to seventh embodiments of the mounting head, the flow sensor is a shunt flow sensor.

[0045] The ninth embodiment of the present disclosure includes: a mounting head according to any one of the first to eighth embodiments; a component supply unit that supplies components to the component suction nozzle of the mounting head; and a substrate transport mechanism that transports a substrate on which the components are mounted by the mounting head.

[0046] (Implementation Method)

[0047] The following description describes exemplary embodiments of the mounting head and component mounting device according to this disclosure, with reference to the accompanying drawings. This disclosure is not limited to the specific structures of the following embodiments; structures derived from the same technical concept are included in this disclosure. The structures, shapes, etc., described below are illustrative examples and can be appropriately modified according to the specifications of the mounting head and component mounting device.

[0048] In the following figures, the corresponding elements will be labeled with the same reference numerals, and repeated descriptions will be omitted. In addition, the two axes orthogonal to each other in the horizontal plane will be designated as the X-axis direction of the substrate transport direction and the Y-axis direction orthogonal to the substrate transport direction, and the height direction orthogonal to the horizontal plane will be designated as the Z-axis direction.

[0049] (Component mounting device)

[0050] First refer to Figure 1 To illustrate the structure of component mounting device 2. Figure 1 This is a top view showing the component mounting device 2 of the embodiment.

[0051] The component mounting device 2 has the function of mounting components (electronic components) such as molds and IC chips supplied from the component supply units 4 and 6 onto the substrates W1 and W2. The component mounting device 2 constitutes a component mounting system for mounting components onto the substrates W1 and W2.

[0052] The component mounting apparatus 2 of this embodiment has the function of processing two substrates W1 and W2 in parallel using two component supply units 4 and 6 and two mounting heads 26A and 26B. The component mounting apparatus 2 is not limited to processing multiple substrates in parallel, but can also be used to process only one substrate at a time.

[0053] At the center of the base 8, substrate transport mechanisms 10 and 12 are arranged along the X-axis. Substrate transport mechanisms 10 and 12 transport substrates W1 and W2, which are brought in from upstream, along the X-axis and position them at designated installation locations. Substrate transport mechanisms 10 and 12 then move substrates W1 and W2, after component installation, downstream. Substrate transport mechanisms 10 and 12 can be, for example, conveyors equipped with transport rollers and drive motors, or combinations of sliders and electric actuators.

[0054] Component supply units 4 and 6 are arranged on both sides of the substrate conveying mechanisms 10 and 12 along the Y-axis. On each of the component supply units 4 and 6, multiple belt feeders 14 and 16 are arranged side-by-side along the X-axis. The belt feeders 14 and 16 are respectively mounted on trolleys 15 and 17, and feed the carrier belt containing the components to predetermined component supply positions by intermittently feeding the components.

[0055] exist Figure 1 In the middle, on both sides of the base 8 in the X-axis direction, Y-axis beams 18 and 20 with Y-axis linear drive mechanisms are arranged along the Y-axis direction. Y-axis beams 18 and 20 have linear guide rails extending along the Y-axis direction, allowing X-axis beams 22 and 24 to slide freely and engage along the Y-axis direction.

[0056] X-axis beams 22 and 24 each have movable worktables 22T and 24T that move along linear guideways (not shown) extending in the X-axis direction, and X-axis linear drive mechanisms (not shown) that move the movable worktables 22T and 24T along the linear guideways. Mounting heads 26A and 26B are mounted on the movable worktables 22T and 24T. The mounting heads 26A and 26B are detachable from the movable worktables 22T and 24T.

[0057] The first mounting head 26A, which engages with the X-axis beam 22, is a mounting head that picks up components supplied from the component supply unit 4 and mounts them onto the substrates W1 and W2. The second mounting head 26B, which engages with the X-axis beam 24, is a mounting head that picks up components supplied from the component supply unit 6 and mounts them onto the substrates W2 and W1.

[0058] Y-axis beams 18 and 20 and X-axis beams 22 and 24 constitute a mounting head moving mechanism that allows mounting heads 26A and 26B to move within the XY plane.

[0059] Component recognition cameras 28 and 30 are respectively installed between component supply units 4 and 6 and substrate transport mechanisms 10 and 12. Mounting heads 26A and 26B, from which components are taken out of component supply units 4 and 6, move upwards towards component recognition cameras 28 and 30, thereby acquiring images of the components held on mounting heads 26A and 26B. By performing recognition processing on the acquired images, the positional offset of the components held on mounting heads 26A and 26B is detected.

[0060] Mounting heads 26A and 26B are equipped with integrated movable mounting head cameras 32 and 34, respectively. The mounting head cameras 32 and 34 are mounted on the mounting heads 26A and 26B with their optical axes facing downwards, and capture images of substrates W1 and W2 from above and downwards, respectively. By processing the captured images, the positional offset of substrates W1 and W2, i.e., the positional offset of the mounting points, is detected. Then, based on the detection results of the component positional offset and the mounting point positional offset, positional correction is performed during component mounting. Positional correction includes rotational alignment to ensure that the rotational position of the component about the θ axis is aligned in the correct direction.

[0061] The component mounting device 2 also includes a main control unit 36. The main control unit 36 ​​is a control unit that controls each component of the component mounting device 2. The main control unit 36 ​​is, for example, a microcomputer, which includes a processor and a memory storing a computer program executed by the processor.

[0062] (Installation head)

[0063] Next, regarding the detailed structure of mounting heads 26A and 26B, we will use... Figure 2 The following figures will illustrate this. The two mounting heads 26A and 26B have the same construction, and therefore will be referred to as "mounting head 26" in the following description.

[0064] Figure 2 , Figure 3 These are 3D views of the mounting head 26. Figure 4 This is a summary side view of the installation head 26. Figure 5 This is a 3D outline of the mounting head 26.

[0065] like Figures 2-5 As shown, the mounting head 26 includes a mounting head cover 38 that covers the upper part of the mounting head 26. A main substrate 39 for controlling the entire mounting head 26 is disposed inside the mounting head cover 38. The main substrate 39 and... Figure 1 The main control unit 36 ​​shown is electrically connected, and the main board 39 is also called the "mounting head control unit".

[0066] The mounting head 26 further includes a first suction nozzle unit 40 and a second suction nozzle unit 50 as a unit for adsorption components.

[0067] The nozzle units 40 and 50 are units that include multiple component nozzles and a drive mechanism for driving the multiple component nozzles. The first nozzle unit 40 has multiple component nozzles 41 (41A~41H) arranged along the X-axis direction, and the second nozzle unit 50 has multiple component nozzles 51 (51A~51H) arranged along the X-axis direction.

[0068] In this embodiment, component suction nozzle 41 has eight component suction nozzles 41A to 41H, and component suction nozzle 51 has eight component suction nozzles 51A to 51H. The number of component suction nozzles 41 and 51 in suction nozzle units 40 and 50 is not limited to eight, but can be any number.

[0069] The first suction nozzle unit 40 and the second suction nozzle unit 50 are arranged in the Y-axis direction, which is orthogonal to the X-axis direction, forming two rows of suction nozzle units. One mounting head 26 has 8 × two rows = a total of 16 component suction nozzles 41 and 51. It should be noted that the suction nozzle units 40 and 50 are not limited to the arrangement of two rows; for example, they can also be arranged in only one row.

[0070] Based on the number of nozzles 41 and 51, the other components of nozzle units 40 and 50 also have the same number, which are also expressed as "〇〇 (〇〇A~〇〇H)" in the following description and drawings.

[0071] Figure 6 This is a schematic side view of the first suction unit 40 and the second suction unit 50.

[0072] The first suction unit 40 has multiple shafts 45 (45A~45H), multiple pulleys 46 (46A~46H), and multiple air connections 47 (47A~47H) as a drive mechanism for driving multiple component suction nozzles 41.

[0073] In addition to the first suction nozzle unit 40 and the second suction nozzle unit 50, the mounting head 26 also includes a motor unit 60. The motor unit 60 includes multiple lifting motors 42 (42A~42H) and multiple output shafts 43 (43A~43H), multiple lifting motors 52 (52A~52H) and multiple output shafts 53 (53A~53H), as well as brackets 63 and 64 described later.

[0074] The lifting motor 42 is a linear motor that moves the output shaft 43 up and down along the Z-axis (arrow Z1). An offset block 44 (44A~44H) is connected to the lower end of the output shaft 43. The offset block 44 is a block used to offset the position of the output shaft 43 relative to the shaft 45 in the horizontal direction. The output shaft 43 is connected to the upper surface of the offset block 44, and the shaft 45 is connected to the lower surface of the offset block 44.

[0075] Shaft 45 is used to raise and lower the component suction nozzle 41 and is connected to the component suction nozzle 41. By raising and lowering the output shaft 43 and shaft 45 together (arrow Z1), the component suction nozzle 41 mounted on the lower end of shaft 45 is raised and lowered (arrow Z2).

[0076] A pulley 46 is mounted on the middle section of shaft 45. The pulley 46 engages with... Figure 5 The belt connected to the rotary motor 100 shown rotates, causing multiple pulleys 46 to rotate together around the Z-axis. Simultaneously, multiple shafts 45 and multiple component suction nozzles 41 rotate together. It should be noted that any structure can be used to transmit power from the belt to the pulleys 46; for example, the structure described in Japanese Patent No. 4894841 can be used.

[0077] Air connection 47 is a connecting member for supplying air to the suction holes 48 (48A~48H) of the component suction nozzle 41. A... Figure 4 The connecting hoses 72 (72A~72H) are shown.

[0078] Similarly, the second suction unit 50, as a drive mechanism for driving the multiple component suction nozzles 51, has multiple shafts 55 (55A~55H), multiple pulleys 56 (56A~56H), and multiple air connection parts 57 (57A~57H). An offset block 54 (54A~54H) is provided between the shaft 55 and the output shaft 53.

[0079] The component suction nozzle 51, connected to the shaft 55, rises and falls as a unit (arrow Z3) along with the output shaft 53 and shaft 55. A suction hole 58 (58A~58H) is provided at the lower end of the component suction nozzle 51, and air is supplied to the suction hole 58 via an air connection 57. The air connection 57 is connected to... Figure 4 The connecting hoses 82 (82A~82H) are shown. The pulleys 56, mounted on the middle section of shaft 55, respectively engage with... Figure 5 The belt connected to the rotary motor 102 shown in the diagram, when the rotary motor 102 rotates the multiple pulleys 56, the multiple shafts 55 and the multiple component suction nozzles 51 rotate together around the Z-axis direction.

[0080] The bias block 44 biases the position of shaft 45 in the Y-axis direction relative to the lifting motor 42 and the output shaft 43 to a side away from the second suction unit 50 (arrow Y1). The bias block 54 biases the position of shaft 55 in the Y-axis direction relative to the lifting motor 52 and the output shaft 53 to a side away from the first suction unit 40 (arrow Y2).

[0081] Figure 7 This is a top view showing the component suction nozzle 41 and component suction nozzle 51 at the lower part of the mounting head 26. Figure 8 This is a top view showing the lifting motors 42 and 52 at the top of the mounting head 26.

[0082] like Figure 7 As shown, a guide block 37 is provided between component nozzle 41 and component nozzle 51. The guide block 37 is a block used to guide the lifting and lowering movements of component nozzles 41 and 51 respectively. The guide block 37 has a first surface 37A for engaging multiple component nozzles 41 and a second surface 37B for engaging multiple component nozzles 51. Grooves (not shown) are provided on the first surface 37A and the second surface 37B to position the component nozzles 41 and 51 horizontally in a lifting and lowering state.

[0083] Regarding the spacing between component nozzle 41 and component nozzle 51, the spacing in the Y-axis direction is D1, and the spacing in the X-axis direction is D2. Due to the presence of guide block 37, the spacing D1 in the Y-axis direction needs to ensure a certain length.

[0084] return Figure 6The first bracket 63 is a component that holds a plurality of lifting motors 42 and a plurality of lifting motors 52 at a first height position. The second bracket 64 is a component that holds a plurality of lifting motors 42 and a plurality of lifting motors 52 at a second height position lower than the first height position. Both brackets 63 and 64 are also used as components for mounting the support frame 90 described later.

[0085] Mounting head 26 further includes a shaft holding part 66 that holds shafts 45 and 55 in a height-adjustable manner. The structure of the shaft holding part 66 will be described later.

[0086] like Figure 4 As shown, the mounting head 26 is a structure associated with the first suction nozzle unit 40 and includes a manifold 70, a connecting hose 72 (72A~72H), a valve 74 (74A~74H) and a valve 76 (76A~76H).

[0087] Manifold 70 is a component for allowing air supplied to the component nozzle 41 to flow through. Manifold 70 has multiple internal flow paths through which air flows, and multiple valves 74 and 76 are installed in communication with these internal flow paths.

[0088] Valves 74 and 76 are components used to switch the type of air supplied to the component nozzle 41 by switching the communication state between the internal flow paths of the switching manifold 70. A valve 74 and a valve 76 are paired to form a valve device 69. Valve 74 is located downstream, and valve 76 is located upstream. Each valve device 69 is provided for each shaft 45, that is, for each component nozzle 41.

[0089] In this embodiment, the manifold 70 allows positive pressure air, negative pressure air, and atmospheric pressure air to flow separately. By opening and closing the valves 74 and 76, one type of air can be selectively supplied to the component nozzle 41. The valves 74 and 76 are, for example, solenoid valves, and more specifically, three-port solenoid valves.

[0090] Similarly, the second suction unit 50 has a manifold 80, a connecting hose 82 (82A~82H), a valve 84 (84A~84H) and a valve 86 (86A~86H).

[0091] Figure 9 This is a schematic longitudinal sectional view showing the peripheral structure of manifolds 70 and 80.

[0092] like Figure 9As shown, the manifold 70 has multiple airflow paths 71 internally, and valves 74 and 76 are installed in communication with the airflow paths 71. Valves 74 are electrically connected to the I / O board 73 via connectors 75 (75A~75H) and wiring (not shown). Valves 76 are also electrically connected to the I / O board 73 via connectors 77 (77A~77H) and wiring (not shown).

[0093] A sensor substrate 78 is also electrically connected to the I / O substrate 73. The sensor substrate 78 is a substrate on which a flow sensor for measuring the flow rate of air flowing in the internal flow path of the manifold 70 is mounted. The sensor substrate 78 is mounted on the manifold 70, and more particularly on the second main surface 70B of the manifold 70 opposite to the first main surface 70A on which the valves 74 and 76 are mounted.

[0094] The I / O substrate 73 is fixed to the upper surface (third surface) of the manifold 70 via the fixing member 79.

[0095] Similar to manifold 70, manifold 80 has multiple airflow paths 81, and valves 84 and 86 are installed in communication with the airflow paths 81. Valve 84 (second valve) is electrically connected to I / O board 83 via connector 85 (85A~85H) and wiring not shown, and valve 86 (first valve) is also electrically connected to I / O board 83 via connector 87 (87A~87H) and wiring not shown.

[0096] The I / O substrate 83 is fixed to the upper surface of the manifold 80 via a fixing member 89. A sensor substrate 88 on which a flow sensor is mounted is also electrically connected to the I / O substrate 83.

[0097] I / O board 73 is connected to via wiring (not shown) Figure 2 , Figure 3 The main substrate 39 is electrically connected. The I / O substrate 83 is not connected to the main substrate 39, but is electrically connected to the I / O substrate 73 via wiring not shown.

[0098] According to the above structure, the wiring of valves 74 and 76 (a total of 16 wires) and the wiring of sensor substrate 78 (a total of 1 wire) are connected to I / O substrate 73, and the wiring of valves 84 and 86 (a total of 16 wires) and the wiring of sensor substrate 88 (a total of 1 wire) are also connected to I / O substrate 83. In this state, by connecting I / O substrate 83 to I / O substrate 73 and connecting I / O substrate 73 to main substrate 39, the opening and closing control of all valves 74, 76, 84, and 86 can be executed in main substrate 39, and the measured values ​​of each flow sensor of sensor substrates 78 and 88 can be obtained.

[0099] Furthermore, when performing maintenance on valves 74, 76, 84, 86, sensor substrates 78, 88, etc., only the wiring between I / O substrate 73 and connectors 75, 77, and the wiring between I / O substrate 83 and connectors 85, 87 need to be individually plugged and unplugged. Therefore, compared to directly connecting each wiring to the main substrate 39, there is no need to plug and unplug unrelated wiring or remove and install the head cover 38 and other structures, which improves the workability during maintenance.

[0100] In this embodiment, communication in each wiring is carried out via serial communication.

[0101] return Figure 4 The mounting head 26 further includes a support frame 90.

[0102] The support frame 90 is a frame used to support the components of the mounting head 26, including the nozzle units 40 and 50. The support frame 90 is fixed to the movable worktable 22T or 24T (see also...) by means of bolts or a clamping mechanism. Figure 1 , Figure 4 In this embodiment, the support frame 90 cantilevered the components of the mounting head 26, including the nozzle units 40 and 50, to one side in the Y-axis direction via the mounting members 92, 94, and 96, which will be described later.

[0103] The support frame 90 has three types of mounting components: a first mounting component 92, a second mounting component 94, and a third mounting component 96.

[0104] All three mounting components 92, 94, and 96 are configured to protrude from the support frame 90 toward one side in the Y-axis direction. Mounting components 92, 94, and 96 can also be referred to as "support columns" as components that cantilever the components of the mounting head 26, including the nozzle units 40 and 50.

[0105] The first mounting component 92 is mounted on the first bracket 63 of the motor unit 60, the second mounting component 94 is mounted on the second bracket 64 of the motor unit 60, and the third mounting component 96 is mounted on the second blocks 106 and 108 described later.

[0106] With this configuration, high rigidity can be achieved by cantilevering the box-shaped motor unit 60 and the shaft retaining portion 66 using mounting members 92, 94, and 96. This allows for the elimination of the need for multiple lifting motors 42, 52 themselves ( Figure 6 It has high rigidity and eliminates the need for additional components (such as rigid plates) to the lifting motors 42 and 52 to ensure high rigidity, resulting in lightweight and miniaturized effects related to the mounting head 26.

[0107] like Figure 5As shown, the mounting head 26 also includes rotary motors 100 and 102.

[0108] Rotary motors 100 and 102 are respectively used to make Figure 6 The rotary motors 100 and 102 rotate the multiple shafts 45 and 55 as shown. The rotary motor 100 rotates the multiple shafts 45 synchronously via a belt and pulley 46 (not shown), and the rotary motor 102 rotates the multiple shafts 55 synchronously via another belt and pulley 56 (not shown).

[0109] like Figure 5 As shown, the two rotary motors 100 and 102 are supported by the second blocks 106 and 108 of the shaft retainer 66.

[0110] The shaft retaining part 66 includes a first block 104 and a shaft housing 105. Figure 6 , Figure 9 ) and the second block 106, 108.

[0111] The first block 104 is... Figure 6 The first block 104 holds the shafts 45 and 55 in a manner through which they can pass. The first block 104 holds a plurality of shaft housings 105 through which the shafts 45 and 55 pass, respectively. Each shaft housing 105 is a cylindrical member extending vertically, and inside the shaft housing 105 is a rotating body 105A (see reference) having a splined structure that guides the shafts 45 and 55 along the Z-axis direction. Figure 9 The rotating body 105A is assembled within the shaft housing 105 in a state where it can rotate about the Z-axis. Therefore, the shaft retaining part 66 supports the shafts 45 and 55 so that they can move along the Z-axis and rotate about the Z-axis.

[0112] The second blocks 106 and 108 are used to support the rotary motors 100 and 102 respectively. The second blocks 106 and 108 are respectively arranged on the outer side in the X-axis direction relative to the first block 104. A third mounting member 96, which is protruding from the support frame 90, is mounted on the second blocks 106 and 108.

[0113] like Figure 5 As shown, the mounting head 26 also has connecting structural members 110 and 112.

[0114] Connecting members 110 and 112 are components that connect the motor unit 60 and the shaft holding part 66 to each other. Connecting members 110 and 112 extend along the Z-axis direction in such a way that they connect the motor unit 60, which is separated from each other in the Z-axis direction, and the shaft holding part 66.

[0115] By setting up connecting components 110 and 112, bending of the front end of the mounting head 26 that occurs when multiple shafts 45 or multiple shafts 55 are lowered simultaneously, as described later, can be suppressed, thereby improving installation accuracy. Connecting components 110 and 112 can also be referred to as "hangers".

[0116] In this embodiment, the upper ends of the connecting structural members 110 and 112 are mounted on the second bracket 64 of the motor unit 60, and the lower ends of the connecting structural members 110 and 112 are mounted on the second blocks 106 and 108 of the shaft retaining part 66.

[0117] like Figure 4 As shown, cooling fans 114 and 116 are installed in the motor unit 60.

[0118] Cooling fans 114 and 116 are fans used to cool the lifting motors 42 and 52, which are heat-generating elements, and are provided at positions to blow air onto the lifting motors 42 and 62 that house the lifting motors 42 and 52. In this embodiment, cooling fans 114 and 116 are fixed between the first bracket 63 and the second bracket 64 of the motor unit 60.

[0119] like Figure 8 As shown, cooling fan 114 and cooling fan 116 are positioned opposite each other in the Y-axis direction. Cooling fan 114 is configured to blow air into the lifting motor 42 in the +Y direction, and cooling fan 116 is configured to blow air into the lifting motor 52 in the -Y direction.

[0120] By arranging the two cooling fans 114 and 116 opposite each other, the lifting motors 42 and 52 of the suction units 40 and 50 can be efficiently cooled even when two rows of suction units 40 and 50 are arranged in the Y-axis direction. Furthermore, the airflow from the two cooling fans 114 and 116 collides with each other, causing air to flow outwards along the X-axis direction, which is orthogonal to the Y-axis direction. Therefore, not only can the lifting motors 42 and 52 in the central part of the X-axis direction be efficiently cooled, but also the lifting motors 42 and 52 at both ends of the X-axis direction can be efficiently cooled.

[0121] like Figure 9 As shown, the mounting head 26 also includes: a manifold mounting member 200 for mounting the manifold 70 to the first block 104; and a manifold mounting member 202 for mounting the manifold 80 to the first block 104. At least two manifold mounting members 200 and 202 are provided at different height positions, and the manifolds 70 and 80 are respectively mounted to the first block 104 via a fixing mechanism such as screws (not shown).

[0122] Next, refer to Figure 10 , Figure 11 . Figure 10 , Figure 11 These are the front and side views showing the state in which connecting structural members 110 and 112 are installed on the mounting head 26.

[0123] like Figure 10 and Figure 11 As shown, the cooling fan 114 is fixed to the brackets 63 and 64 by the fan mounting bracket 115. The fan mounting bracket 115 fixes the upper part of the cooling fan 114 to the first bracket 63 and the lower part of the cooling fan 114 to the second bracket 64 by a fixing mechanism such as screws (not shown).

[0124] (manifold)

[0125] Next, regarding the peripheral structure of manifolds 70 and 80, we will use... Figure 12 The following figures will be used for illustration. It should be noted that manifold 70, manifold 80 and their surrounding structures have the same construction, therefore the following description will mainly focus on manifold 70 and its surrounding structures.

[0126] Figure 12 , Figure 13 These are perspective views showing the manifold 70 and its surrounding structure. Figure 14 , Figure 15 These are perspective views showing the manifold 70 separately.

[0127] like Figure 12 , Figure 13 As shown, the manifold 70 has three surfaces: a first main surface 70A (first side surface), a second main surface 70B (second side surface), and a third surface 70C (upper surface). The first main surface 70A is for mounting valves 74 and 76, the second main surface 70B is for mounting sensor substrate 78, and the third surface 70C is for mounting fixing member 79 for fixing I / O substrate 73. Figure 13 ) face.

[0128] exist Figure 12 , Figure 13 In the example shown, the I / O substrate 73 is housed in the substrate housing 154. Figure 13 The fixing member 79 shown fixes the substrate housing 154 to the third surface 70C of the manifold 70, thereby fixing the I / O substrate 73 relative to the manifold 70.

[0129] like Figure 14 As shown, a plurality of ports for connecting the airflow path 71 of the manifold 70 to valves 74, 76 (not shown) are provided on the first main surface 70A of the manifold 70. Figure 14In the example shown, there are six columns of ports arranged vertically, including ports 160 (160A~160H), 162 (162A~162H), 164 (164A~164H), 166 (166A~166H), 168 (168A~168H), and 170. Port 170 is, for example, a slot configured on the first main surface 70A of the manifold 70.

[0130] The manifold 70 also serves as an airflow path 71, incorporating a negative pressure flow path 172 and a positive pressure flow path 174. The negative pressure flow path 172 is connected to a negative pressure source 212 via ports V1 and V2 and connecting members not shown. The positive pressure flow path 174 is connected to a positive pressure source 214 via port P1 and connecting members not shown. The negative pressure source 212 is, for example, a vacuum pump, and the positive pressure source 214 is, for example, an air compressor.

[0131] like Figure 15 As shown, the second main surface 70B of the manifold 70 has multiple ports for connecting the airflow path 71 of the manifold 70 to a flow sensor on the sensor substrate 78 (not shown). Furthermore, the second main surface 70B of the manifold 70 has a step 70Ba recessed towards the first main surface 70A at its upper part. Therefore, other components can be arranged in the space above the step 70Ba, and the thickness of the component mounting device 2 in the Y-axis direction can be reduced.

[0132] exist Figure 15 In the example shown, ports 176 (176A~176H) for communication with the flow sensor on the sensor substrate 78 and recesses 178 (178A~178H) different from ports 176 are alternately provided on the second main surface 70B. The recesses 178 are shaped to accommodate components (e.g., resistors) mounted on the sensor substrate 78 that are different from the flow sensor and are not connected to the airflow path 71. The second main surface 70B of the manifold 70 has recesses 178 for accommodating components mounted on the sensor substrate 78 at a position lower than the step 70Ba. By utilizing the recesses 178 to avoid interference with components mounted on the sensor substrate 78, the thickness of the integrated manifold 70 and sensor substrate 78 in the Y-axis direction can be reduced.

[0133] Figure 16 This is a three-dimensional view of the sensor substrate 78. Figure 17 , Figure 18 This is a longitudinal sectional view used to illustrate the method of mounting the sensor substrate 78 onto the manifold 70.

[0134] like Figure 16 As shown, the sensor substrate 78 includes a substrate body 180, a plurality of flow sensors 182 (182A~182H), an I / O chip 183, a connector 222, and an integrated circuit 224.

[0135] The substrate body 180 is a plate-shaped substrate for mounting the flow sensor 182 and other electrical components. The flow sensor 182 is a component for measuring the flow rate of air flowing in the terminal flow path 161 (161A~161H) of the air flow path 71 in the manifold 70. Multiple flow sensors 182 are arranged in a row with spacing between them and inserted into... Figure 15 The manifold 70 shown has multiple ports 176, each in turn.

[0136] I / O chip 183 is a chip used for electrical connection to multiple flow sensors 182 respectively. I / O chip 183 is electrically connected to the flow sensors 182 respectively via wiring formed on the substrate body 180. I / O chip 183 is also connected to I / O substrate 73 (not shown) via wiring. Figure 12 )connect.

[0137] like Figure 17 As shown, the flow sensor 182 of this embodiment has two connecting portions 184, and the port 176 of the manifold 70 also has two corresponding recesses 177. The two recesses 177 are connected to the terminal flow path 161 through a branch path 179. One branch path 179 is formed downstream of the other branch path 179. The two connecting portions 184 are convex, and a seal 185 is disposed around the lower part of each connecting portion 184. The seal 185 is, for example, an O-ring. The opening diameter of the recess 177 is larger than the diameter of the connecting portion 184, so that even if the positions of the multiple connecting portions 184 of the flow sensor 182 mounted on the substrate body 180 are slightly offset from the positions of the multiple recesses 177 of the port 176 of the manifold 70, they can be assembled. Moreover, by setting the sealing surface 177a as the side of the manifold 70 that extends continuously with the recess 177 rather than the interior of the recess 177, the allowable range of positional offset can be increased. This reduces the required assembly precision for the sensor substrate 78, thereby lowering manufacturing costs and improving the workability of the mounting head 26 during assembly. With the two connecting portions 184 inserted into the two recesses 177, the substrate body 180 is fixed to the second main surface 70B of the manifold 70 using a screw or other fixing member (not shown), thereby fixing the flow sensor 182 in a connected state to the terminal flow path 161. The connecting portion 184 has an internal hole 187 communicating with the flow sensor 182, which is a diversion-type sensor that detects flow rate by utilizing the differential pressure of air flowing in from the recess 177 of the port 176 through the hole 187 of the connecting portion 184.

[0138] like Figure 18 As shown, the sensor substrate 78 can be mounted on the manifold 70 and the flow sensor 182 can be connected to the terminal flow path 161 in the air flow path 71 of the manifold 70, and the flow sensor 182 can be used to measure the flow rate of the air flowing in the terminal flow path 161.

[0139] (Airflow path)

[0140] Next, regarding the airflow path 71 of the manifold 70, using Figure 19 and Figure 20 The accompanying diagram is used for illustration.

[0141] Figure 19 This is a longitudinal sectional view of the airflow path 71 of the manifold 70. Figure 20 This is a diagram showing the connection relationship of the airflow path Ap of the mounting head 26.

[0142] like Figure 20 As shown, the mounting head 26 has an airflow path Ap that allows air to flow through the negative pressure source 212, the positive pressure source 214, and the open atmosphere. The airflow path 71 is a flow path disposed within the manifold 70 in the airflow path Ap. The airflow path Ap includes a negative pressure flow path Ap1 connecting the negative pressure source 212 to the valve 74, a positive pressure flow path Ap2 connecting the positive pressure source 214 to the valve 76 (first valve), a connecting flow path 167 connecting the valve 74 to the valve 76, a terminal flow path Ap3 connecting the valve 74 (second valve) to the component nozzle 41, and a port 170 open to the atmosphere.

[0143] like Figure 19 As shown, port 160 is referred to as (A), port 162 as (B), port 164 as (C), port 166 as (D), port 168 as (E), and port 170 as (F).

[0144] like Figure 19 As shown, the airflow path 71 within the manifold 70, in addition to the negative pressure flow path 172 and the positive pressure flow path 174, also includes terminal flow paths 161 (161A~161H), negative pressure inlet flow paths 163 (163A~163H), connecting flow paths 167 (167A~167H), and positive pressure inlet flow paths 175 (175A~175H). Negative pressure flow paths 172 and 163 are part of negative pressure flow path Ap1 and are formed within the manifold 70. Positive pressure flow paths 174 and 175 are part of positive pressure flow path Ap2 and are formed within the manifold 70. The end P2 of the positive pressure flow path 174 is sealed by a plug.

[0145] Port 160 is the upstream end of terminal flow path 161 and is the connection port connecting terminal flow path 161 to valve 74. Terminal flow path 161 is connected to connection portion 186 of manifold 70. Terminal flow path Ap3 is the flow path from valve 74 to component suction nozzle 41. Terminal flow path 161, as the upstream portion of terminal flow path Ap3, is formed inside manifold 70, and port 160 is the starting point of terminal flow path 161.

[0146] An air filter 188 is disposed between the terminal flow path 161 and the connecting part 186. The aforementioned connecting hose 72 is connected to the connecting part 186. Figure 4 Air flowing in the terminal flow path 161 is supplied to the component nozzle 41. Thus, the terminal flow path Ap3 includes the terminal flow path 161 and the connecting hose 72.

[0147] Ports 162 (B) and 164 (C) are both connected to port 160 (A) via valve 74. Port 162 is connected to negative pressure flow path 172 via negative pressure inlet flow path 163 and is supplied with negative pressure air. Negative pressure inlet flow path 163 is a flow path used to introduce the negative pressure supplied to negative pressure flow path 172 into valve 74, with one end connected to port 162 and the other end connected to negative pressure flow path 172. Port 164 is connected to the upper port 166 via connecting flow path 167. Connecting flow path 167 is a flow path used to connect the two valves 74 and 76 constituting valve device 69 to each other, with one end connected to port 164 and the other end connected to port 166 (D).

[0148] Ports 168(E) and 170(F) are both connected to port 166(D) via valve 76. Port 168 is connected to positive pressure flow path 174 via positive pressure inlet flow path 175 and is supplied with positive pressure air. Positive pressure inlet flow path 175 is a flow path used to introduce the positive pressure supplied to positive pressure flow path 174 into valve 76, with one end connected to port 168 and the other end connected to positive pressure flow path 174. Port 170 is a slot formed on the first main surface 70A along the X-axis direction, open to the atmosphere.

[0149] like Figure 20 As shown, valve 74 switches between a state where port 160(A) is connected to port 162(B) and a state where port 160(A) is connected to port 164(C). When port 160(A) is connected to port 162(B), negative pressure air is supplied from negative pressure source 212 (one of the air supply sources) to component nozzle 41, which is connected to the end of terminal flow path 161, via port 162(B) and negative pressure inlet flow path 163. When port 160(A) is connected to port 164(C), air upstream of valve 74 is supplied to component nozzle 41 via port 164(C), connecting flow path 167, and port 166(D).

[0150] Valve 76 switches between a state where port 166(D) is connected to port 168(E) and a state where port 166(D) is connected to port 170(F). When port 166(D) is connected to port 168(E), positive pressure air is supplied downstream of port 166(D) from a positive pressure source 214, which serves as an air supply source, via port 168(E) and positive pressure inlet flow path 175. When port 166(D) is connected to port 170(F), the air pressure downstream of port 166(D) via port 170(F), which is open to atmospheric pressure, becomes atmospheric pressure.

[0151] According to the above structure, (1) when both valve 74 and valve 76 are closed, valve 74 connects port 160 (A) to port 162 (B), thus supplying negative pressure air to component nozzle 41 and drawing air into component nozzle 41. (2) when both valve 74 and valve 76 are open, valve 74 connects port 160 (A) to port 164 (C), and valve 76 connects port 166 (D) to port 168 (E), thus supplying positive pressure air to component nozzle 41 and ejecting air from component nozzle 41. (3) when valve 74 is open and valve 76 is closed, valve 74 connects port 160 (A) to port 164 (C), and valve 76 connects port 166 (D) to port 170 (F), thus component nozzle 41 is open to the atmosphere and the air pressure inside it becomes atmospheric pressure.

[0152] In this way, by switching the connection state between the ports through the operation of the two valves 74 and 76, one type of air selected from three types of air—negative pressure air, positive pressure air, and atmospheric pressure air—can be supplied (connected) to the multiple component nozzles 41 respectively.

[0153] like Figure 12 , Figure 13 As shown, in the manifold 70, valves 74 and 76 are mounted on the first main surface 70A, sensor substrate 78 is mounted on the second main surface 70B, and I / O substrate 73 is mounted on the third surface 70C. In this way, by utilizing each surface of the manifold 70 to mount each component, the space around the manifold 70 can be effectively utilized, thereby achieving miniaturization of the mounting head 26.

[0154] Furthermore, an I / O board 73 is positioned above valves 74 and 76 and sensor board 78, and a main board 39 is positioned above the I / O board 73. Thus, the main board 39, I / O board 73, valves 74 and 76, and sensor board 78 are arranged sequentially from top to bottom. This allows for easy installation and removal of the various wirings.

[0155] Figure 21This is a block diagram showing the control system of the component mounting device 2, which includes two mounting heads 26A and 26B.

[0156] like Figure 21 As shown, the main control unit 36 ​​is electrically connected to the main substrate 39 (mounting head control unit) of each of the two mounting heads 26A and 26B via communication cables. In each of the mounting heads 26A and 26B, the main substrate 39 is electrically connected to the I / O substrate 73 (first I / O control unit), the lifting motors 42 and 52 (Z-axis drive unit), and the rotary motors 100 and 102.

[0157] The main board 39 is connected to the I / O board 73 via a serial communication cable 311 (a first serial communication cable), and the I / O board 73 is electrically connected to the I / O board 83 (a second I / O control unit) via a serial communication cable 313 (a third serial communication cable). Thus, the main board 39 is connected to the I / O board 73 and the I / O board 83 in a communicable state through serial communication.

[0158] The I / O board 73 is also electrically connected to the sensor board 78 via a serial communication cable 312 (a second serial communication cable). As described above, the sensor board 78 has I / O chips 183 that are respectively connected to flow sensors 182A to 182H, and is connected to the I / O chips 183. Therefore, the I / O board 73 and the sensor board 78 can be connected using a single communication cable 312.

[0159] The I / O board 73 is also electrically connected to multiple valves 74A~74H and multiple valves 76A~76H. The I / O board 73 is connected to each of the valves 74A~74H and 76A~76H via a cable.

[0160] Similarly, the I / O board 83 is electrically connected to the sensor board 88 via a communication cable 314 (a fourth serial communication cable) for serial communication, and is also electrically connected to multiple valves 84A~84H and multiple valves 86A~86H via separately provided cables.

[0161] In this way, flow sensors 182A~182H, valves 74A~74H, and valves 76A~76H are connected together on I / O board 73, and flow sensors 192A~192H, valves 84A~84H, and valves 86A~86H are connected together on I / O board 83. Furthermore, I / O board 83 is connected to I / O board 73, and I / O board 73 is connected to main board 39. Additionally, flow sensors 182A~182H are connected to a single sensor board 78, and sensor board 78 is connected to I / O board 73 using serial communication wiring. Similarly, flow sensors 192A~192H are connected to a single sensor board 88, and sensor board 88 is connected to I / O board 83 using serial communication wiring.

[0162] Based on the above structure, the internal wiring of the mounting head 26 is simplified, thus enabling the mounting head 26 to be lightweight.

[0163] Furthermore, when maintaining valves 74, 76, 84, 86, and flow sensors 182 and 192, it is not necessary to remove the wiring between them and the upstream main board 39. Instead, only the wiring between the corresponding components and the I / O boards 73 and 83 needs to be removed. Therefore, it is not necessary to remove other unrelated wiring or the mounting cover 38 covering the main board 39, which improves the operability of maintenance.

[0164] (Effect)

[0165] As described above, the mounting head 26 of this embodiment includes: a plurality of shafts 45 connected to the component suction nozzle 41 and arranged along an X-axis direction intersecting the lifting direction; a shaft holding part 66 that holds the plurality of shafts 45 so that they can be lifted and lowered individually; a manifold 70 having an air flow path 71 for supplying air to the component suction nozzle 41; a plurality of valve devices 69 corresponding to the component suction nozzle 41, the valve devices 69 including a valve 76 (first valve) and a valve 74 (second valve) installed in the manifold 70 and switching the air supplied to the component suction nozzle 41; and a plurality of flow sensors 182. The airflow path 71 includes: a positive pressure flow path 174 connected to a positive pressure source 214; a negative pressure flow path 172 connected to a negative pressure source 212; a terminal flow path 161, which is provided with multiple corresponding to and connected to the corresponding component nozzles 41; multiple positive pressure inlet flow paths 175, which individually connect multiple valves 76 to the positive pressure flow path 174; a connecting flow path 167, which is provided with multiple corresponding to multiple valve devices 69 and connects valves 76 and valves 74; and multiple negative pressure inlet flow paths 163, which individually connect multiple valves 74 to the negative pressure flow path 172. A flow sensor 182 is individually connected to the terminal flow path 161 to measure the airflow in the terminal flow path 161. The manifold 70 is disposed on the side separated from the shaft holding part 66 in the Y-axis direction, which intersects the lifting direction and the X-axis direction.

[0166] With this structure, the manifold 70, equipped with valves 74 and 76 that switch between positive and negative air supply, is positioned opposite the shaft, thus shortening the distance from valves 74 and 76 to the component suction nozzle 41. This reduces air resistance in the airflow path from valves 74 and 76 to the component suction nozzle 41, thereby improving the responsiveness of positive / negative air switching. Furthermore, the flow sensor 182 is connected separately to the terminal flow path 161, allowing for a closer arrangement between the flow sensor 182 and the component suction nozzle 41 compared to conventional configurations, thus improving the accuracy of airflow detection.

[0167] In addition, in the past, two manifolds were sometimes installed on the mounting head 26 in relation to two different types of valves. However, according to the mounting head 26 of this embodiment, two types of valves are installed on one manifold, so the overall size of the manifold can be reduced, and as a result, the mounting head 26 can also be reduced in size.

[0168] Furthermore, in the mounting head 26 of the embodiment, the manifold 70 has a first main surface 70A and a second main surface 70B. Valves 76 and 74 are mounted on the first main surface 70A, and a flow sensor 182 is connected to the terminal flow path 161 from the second main surface 70B side. The second main surface 70B is opposite to a plurality of shafts 45.

[0169] With this structure, space saving is achieved by using the first main surface 70A and the second main surface 70B, which are two opposing surfaces of the manifold 70. In addition, the manifold 70, on which the flow sensor 182 is mounted, is positioned near the shaft, so the flow sensor 182 can be positioned close to the component nozzle 41 compared to the past, thereby improving the detection accuracy of air flow.

[0170] In addition, in the mounting head 26 of the embodiment, the mounting head includes a sensor substrate 78 having a plurality of flow sensors 182. When the sensor substrate 78 is mounted on the second main surface 70B of the manifold 70, the flow sensors 182 are connected to the terminal flow path 161.

[0171] With this structure, the installation of the flow sensor 182 into the manifold 70 becomes easy.

[0172] Furthermore, in the mounting head 26 of the embodiment, the component suction nozzle 41 is connected to the terminal flow path 161 via an air filter 188, which is housed within the manifold 70. Since the air filter 188 is housed within the manifold 70, the mounting head 26 can be miniaturized.

[0173] Furthermore, in the mounting head 26 of this embodiment, multiple shafts 45 are arranged in two rows with a gap in the Y-axis direction, which intersects the lifting direction (Z-axis direction) and the X-axis direction. Two manifolds 70 and 80 are respectively arranged on one side and the other side of the Y-axis direction, opposite to each row of shafts 45. This improves the responsiveness to air switching between the nozzles 41 of each component connected to the two rows of shafts 45.

[0174] As described above, the component mounting apparatus 2 of the embodiment includes: a mounting head 26; a component supply unit 4 that supplies components to the component suction nozzle 41 of the mounting head 26; and a substrate transport mechanism 10 that transports the substrate W1 on which the components are mounted by the mounting head 26.

[0175] Based on this structure, a lightweight and miniaturized mounting head 26 is used, which enables high-speed movement of the mounting head 26 and suppresses vibrations that occur during the movement of the mounting head 26. Therefore, a high-productivity and high-precision component mounting device 2 can be achieved.

[0176] Additionally, in the mounting head 26 of the embodiment, a sensor substrate 78 is mounted on the second main surface 70B of the manifold 70. This sensor substrate 78 is equipped with a connector 222 or an integrated circuit 224. The connector 222 or integrated circuit 224 is located above the step 70Ba of the second main surface 70B.

[0177] With this structure, a large component such as a connector 222 or an integrated circuit 224 that is mounted on the sensor substrate 78 is arranged in the recessed portion at the upper part of the manifold 70, thereby reducing the thickness of the integrated manifold 70 and sensor substrate 78 in the Y-axis direction and enabling the mounting head 26 to be miniaturized.

[0178] In addition, the mounting head 26 of the embodiment also includes: a plurality of lifting motors 42, which are respectively arranged corresponding to a plurality of shafts 45 for lifting the shafts; and cooling fans 114 and 116, which blow air to the plurality of lifting motors 42 along the Y-axis direction.

[0179] Since the manifold 70 is not located near the lifting motor 42, which serves as the lifting mechanism, as was done in the past, the cooling fans 114 and 116 can be located near the lifting motor 42, thereby improving the cooling efficiency of the lifting motor 42.

[0180] Furthermore, in the mounting head 26 of the embodiment, the manifold 70 has a first main surface 70A for mounting valves 74 and 76, a second main surface 70B for mounting flow sensor 182, and a third surface 70C for mounting I / O board 73. With this structure, valves 74 and 76, flow sensor 182, and I / O board 73 can be mounted using each surface of the manifold 70, thereby saving space.

[0181] Furthermore, the mounting head 26 in this embodiment includes two valves: an upstream valve 76 and a downstream valve 74. With this configuration, by including the two valves 74 and 76, it is possible to select, for example, one of three air supply sources to supply air to the component nozzle 41.

[0182] (other)

[0183] The present disclosure has been described above by way of the above embodiments, but the present disclosure is not limited to the above embodiments.

[0184] This disclosure has been fully described with reference to the accompanying drawings and in connection with preferred embodiments, but various modifications and variations will be apparent to those skilled in the art. It should be understood that such modifications and variations are also included in this disclosure as long as they do not depart from the scope of the accompanying technical solutions. Furthermore, changes in the combination and order of elements in each embodiment can be implemented without departing from the scope and spirit of this disclosure.

[0185] Industrial availability

[0186] Any mounting head and component mounting device having the mounting head are applicable to this disclosure.

[0187] Explanation of reference numerals in the attached figures:

[0188] 2. Component mounting device

[0189] 4 and 6 Component Supply Department

[0190] 8 abutment

[0191] 10, 12 Substrate transport mechanism

[0192] 14 Belt Feeder

[0193] 15 cars

[0194] 16 Belt Feeder

[0195] 17 cars

[0196] 18, 20 Y-axis beams

[0197] 22, 24 X-axis beams

[0198] 26, 26A, 26B mounting heads

[0199] 28 and 30 component recognition cameras

[0200] Install head cameras at 32 and 34

[0201] 36 Main Control Department

[0202] 37. Bootstrap Block

[0203] 37A First Page

[0204] 37B Second Page

[0205] 38 Install the headgear

[0206] 39 Main base board

[0207] 40 First suction unit

[0208] 41, 41A-41H component nozzles

[0209] 42, 42A-42H Lifting Motors

[0210] 43, 43A-43H output shafts

[0211] 44 First bias block

[0212] 45, 45A-45H axes

[0213] 46, 46A-46H pulleys

[0214] 47, 47A-47H Air Connection Section

[0215] 48, 48A-48H Adsorption pores

[0216] 50 Second suction unit

[0217] 51, 51A-51H component nozzles

[0218] 52, 52A-52H lifting motors

[0219] 53, 53A-53H output shafts

[0220] 54 Second bias block

[0221] 55, 55A-55H shafts

[0222] 56, 56A-56H pulleys

[0223] 57, 57A-57H Air Connection Section

[0224] 58, 58A-58H Adsorption pores

[0225] 60 motor units

[0226] 62 Lifting Motor

[0227] 63 First bracket

[0228] 64 Second bracket

[0229] 66 Shaft retaining part

[0230] 69 Valve assembly

[0231] 70 manifold

[0232] 70A First Main Face

[0233] 70B Second Main Face

[0234] 70Ba Steps

[0235] 70C Third Side

[0236] 71 Airflow Path

[0237] 72, 72A-72H Connecting hoses

[0238] 73 I / O base

[0239] 74, 74A-74H valves (second valve)

[0240] 75, 75A-75H connectors

[0241] 76, 76A-76H valves (first valve)

[0242] 77, 77A-77H connectors

[0243] 78 Sensor substrate

[0244] 79 Fixed components

[0245] 80 manifold

[0246] 81 Airflow Path

[0247] 82, 82A-82G, 82H connecting hoses

[0248] 83 I / O base

[0249] 84, 84A-84H valves (second valve)

[0250] 85, 85A-85H connectors

[0251] 86, 86A-86H valves (first valve)

[0252] 87, 87A-87H connectors

[0253] 88 Sensor substrate

[0254] 89 Fixed components

[0255] 90 Support Frame

[0256] 92 First installation component

[0257] 94 Second installation component

[0258] 96 Third installation component

[0259] 100, 102 Rotary Motors

[0260] 104 First block

[0261] 105 Shaft Housing

[0262] 105A Rotational Body

[0263] 106, 108 Second block

[0264] 110 and 112 connecting structural components

[0265] 114 Cooling Fan

[0266] 115 Fan mounting hardware

[0267] 116 Cooling Fan

[0268] 154 Baseboard Storage Box

[0269] 160, 160A-160H ports

[0270] Terminal flow paths 161, 161A-161H

[0271] 162, 162A-162H ports

[0272] 163, 163A-163H Negative Pressure Inlet Flow Path

[0273] 164, 164A-164H ports

[0274] 166, 166A-166H ports

[0275] 167, 167A-167H connection flow path

[0276] 168, 168A-168H ports

[0277] Port 170

[0278] 172 Negative Pressure Flow Path

[0279] 174 Positive Pressure Flow Path

[0280] 175, 175A-175H Positive Pressure Inlet Flow Path

[0281] 176, 176A-176H ports

[0282] 177 recess

[0283] 177a Sealing Surface

[0284] 178, 178A-178H concave part

[0285] 179 branching path

[0286] 180 Main body of the substrate

[0287] 182, 182A-182H Flow Sensors

[0288] 183 I / O chip

[0289] 184 Connecting Part

[0290] 185 Seals

[0291] 186 Connecting part

[0292] 187 holes

[0293] 188 Air Filter

[0294] 192, 192A-192H Flow Sensors

[0295] 200, 202 Manifold Installation Components

[0296] 212 Negative Pressure Source

[0297] 214 Positive pressure source

[0298] 222 connector

[0299] 224 Integrated Circuits

[0300] 311, 312, 313, 314 Communication Cables

[0301] Ports A, B, C, D, E, and F

[0302] Ap airflow path

[0303] W1, W2 substrate.

Claims

1. An mounting head, wherein, The mounting head has: Multiple shafts are connected to component suction nozzles and are arranged along a first direction intersecting the lifting direction; A shaft retainer that holds the plurality of shafts so that they can be raised and lowered individually; A manifold having an airflow path for supplying air to the nozzle of the component; A plurality of valve devices are provided corresponding to the component nozzle, each valve device including a first valve and a second valve installed in the manifold and switching the air supplied to the component nozzle; and Multiple flow sensors, The airflow path includes: A positive pressure flow path, which is connected to a positive pressure source; The negative pressure flow path is connected to the negative pressure source. The terminal flow path is provided in multiple ways corresponding to the multiple component nozzles and is connected to the corresponding component nozzles; Multiple positive pressure inlet flow paths connect multiple first valves to the positive pressure flow paths individually; A flow path is provided, corresponding to multiple valve devices, and connecting the first valve and the second valve; and Multiple negative pressure inlet flow paths connect multiple second valves to the negative pressure flow paths individually. The flow sensor is connected separately to the terminal flow path to measure the air flow rate in the terminal flow path. The manifold is positioned on a side that is separated from the shaft retainer in a second direction, which intersects the lifting direction and the first direction.

2. The mounting head according to claim 1, wherein, The manifold has a first main surface and a second main surface. The first valve and the second valve are installed on the first main surface. The flow sensor is connected to the terminal flow path from the second main surface side. The second main surface is opposite to the plurality of axes.

3. The mounting head according to claim 2, wherein, The mounting head includes a substrate with the plurality of flow sensors, and the flow sensors are connected to the terminal flow path when the substrate is mounted on the second main surface of the manifold.

4. The mounting head according to claim 3, wherein, The second main surface of the manifold has a recess for avoiding interference with components mounted on the substrate.

5. The mounting head according to any one of claims 1 to 4, wherein, The component nozzle is connected to the terminal flow path via an air filter. The air filter is housed within the manifold.

6. The mounting head according to any one of claims 1 to 5, wherein, The plurality of said shafts are arranged in two columns with a gap in the second direction. The two manifolds are respectively arranged on one side and the other side of the second direction, opposite to the axes of each column.

7. The mounting head according to any one of claims 1 to 6, wherein, The manifold is mounted on the shaft retainer.

8. The mounting head according to any one of claims 1 to 7, wherein, The flow sensor is a shunt flow sensor.

9. A component mounting device, wherein, The component mounting device includes: The mounting head according to any one of claims 1 to 8; A component supply unit that supplies components to the component suction nozzle of the mounting head; and A substrate transport mechanism that transports a substrate mounted by the mounting head.

Images