Cutting apparatus and method of manufacturing cut product

Abstract

The present invention provides a cutting device capable of cutting and inspecting with high productivity. The cutting device (1) includes: a first conveying mechanism (7) and a second conveying mechanism (11) for holding and conveying the cut item (S1); a first inspection mechanism (8) for inspecting the first surface (F1) of the cut item (S1) when it is positioned in a first inspection position (Q1); and a second inspection mechanism (9) for inspecting the second surface (F2) of the cut item (S1) when it is positioned in a second inspection position (Q2). The first conveying mechanism (7) is configured to convey multiple cut items (S1) to both the first inspection position (Q1) and the second inspection position (Q2), and the second conveying mechanism (11) is also configured to convey multiple cut items (S1) to both the first inspection position (Q1) and the second inspection position (Q2).

Description

Technical Field

[0001] This disclosure relates to a cutting device and a method for manufacturing a cut-off article. Background Technology

[0002] Japanese Patent Application Publication No. 2023-076250 (Patent Document 1) discloses an invention related to a cutting device. This cutting device monolithically divides a cutting object (a packaging substrate) into multiple cut pieces (electronic components) by cutting the object. The cutting device includes an inspection mechanism for inspecting the lower surface of the electronic component and an inspection mechanism for inspecting the upper surface of the electronic component. More specifically, a first optical inspection camera is arranged upstream and a second optical inspection camera is arranged downstream in the conveying direction of the electronic component.

[0003] In the case of the cutting device, the molded surface of the electronic component is inspected using a first optical inspection camera, and then the solder ball / lead surface of the electronic component is inspected using a second optical inspection camera. The inspection mechanism typically includes illumination suitable for the object being inspected. In the case of the cutting device, the illumination used with the first optical inspection camera includes illumination suitable for inspecting the molded surface, and the illumination used with the second optical inspection camera includes illumination suitable for inspecting the solder ball / lead surface.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2023-076250 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] In recent years, the demand for cutting devices has diversified. For example, there is a desire to efficiently cut a wider variety of objects and to efficiently inspect the cut products obtained through cutting. For instance, sometimes one side of the object being cut is entirely a molded surface sealed with resin, while the other side is a solder ball / lead surface partially sealed with resin. In order to obtain multiple cut products from such objects, the cutting device disclosed in Patent Document 1 (Japanese Patent Application Publication No. 2023-076250) is utilized.

[0009] In order to properly cut the object to be cut using the cutting device, the object to be cut is fixed on the processing table with the molded surface facing upwards, and the blade approaches the object to be cut from the molded surface side, thereby cutting the object. Then, if the device structure of Patent Document 1 is used directly, the solder ball / lead surface of the object to be cut is inspected using the first optical inspection camera on the upstream side, and the molded surface is inspected using the second optical inspection camera on the downstream side.

[0010] This lighting is unsuitable for the objects being inspected. Therefore, in order to perform proper inspection, the lighting used with the first optical inspection camera is replaced with lighting suitable for inspecting the solder ball / lead surface, and the lighting used with the second optical inspection camera is replaced with lighting suitable for inspecting the molded surface. Adjustments such as alignment or focusing of each inspection mechanism are also required. This replacement or adjustment is time-consuming and labor-intensive.

[0011] The purpose of this disclosure is to provide a cutting device and a method for manufacturing cut products that enable highly productive cutting and inspection.

[0012] Technical means to solve the problem

[0013] The cutting device disclosed herein includes:

[0014] The processing table holds the object to be cut.

[0015] A cutting mechanism that cuts the object to be cut, which is held on the processing table, into multiple cut pieces;

[0016] The first conveying mechanism holds and conveys multiple of the cut items;

[0017] The second conveying mechanism holds and conveys multiple of the cut items;

[0018] A first inspection mechanism inspects the first surface of the plurality of cut items while they are positioned in a first inspection position; and

[0019] The second inspection mechanism inspects the second surface of the plurality of cut items while they are positioned in the second inspection position.

[0020] The first conveying mechanism is configured to convey a plurality of the cut items to both the first inspection position and the second inspection position.

[0021] The second conveying mechanism is also configured to convey a plurality of the cut items to both the first inspection position and the second inspection position.

[0022] The method for manufacturing cut articles disclosed herein uses the cutting device and includes the following steps:

[0023] The object to be cut, held on the processing table, is cut into multiple pieces;

[0024] With the plurality of cut items positioned at the second inspection position by the first conveying mechanism, the second surface of the plurality of cut items is inspected by the second inspection mechanism.

[0025] Transferring the plurality of the cut items from the first conveying mechanism to the second conveying mechanism; and

[0026] With the plurality of cut items positioned at the first inspection position by the second conveying mechanism, the first surface of the plurality of cut items is inspected by the first inspection mechanism.

[0027] The method for manufacturing cut articles disclosed herein uses the cutting device and includes the following steps:

[0028] The object to be cut, held on the processing table, is cut into multiple pieces;

[0029] With the plurality of cut items positioned at the first inspection position by the first conveying mechanism, the first surface of the plurality of cut items is inspected by the first inspection mechanism.

[0030] Transferring the plurality of the cut items from the first conveying mechanism to the second conveying mechanism; and

[0031] With the plurality of cut items positioned in the second inspection position by the second conveying mechanism, the second surface of the plurality of cut items is inspected by the second inspection mechanism.

[0032] The effects of the invention

[0033] According to this disclosure, a cutting device and a method for manufacturing cut items are available that can perform cutting and inspection with high productivity. Attached Figure Description

[0034] [ Figure 1 [Illustrated plan view of the cutting device 1]

[0035] [ Figure 2 [This is a schematic front view of the portion between the processing table 5M and the placement table 14 in the cutting device 1, and shows the state SA1 where the first conveying mechanism 7 is positioned at the pick-up position T1 and adsorbs the cut item S1 held on the processing table 5M from above.]

[0036] [ Figure 3This indicates that the cut item S1 is positioned at the first inspection position Q1 by the first conveying mechanism 7, which is state SA2.

[0037] [ Figure 4 [This indicates that the second conveying mechanism 11, located at the receiving position U1, receives and maintains the cut item S1 held by the first conveying mechanism 7 in a state SA3.]

[0038] [ Figure 5 This indicates the state SA4 where the cut item S1 is positioned at the second inspection position Q2 via the second conveying mechanism 11.

[0039] [ Figure 6 [SA5] indicates that the second conveying mechanism 11 is in the position U2, placing the cut item S1 on the placement table 14.

[0040] [ Figure 7 [] indicates that the first conveying mechanism 7 is configured at the pick-up position T1 and is holding the cut product S1 on the processing table 5M from above in a state SB1.

[0041] [ Figure 8 This indicates that the cut item S1 is positioned at the second inspection position Q2 by the first conveying mechanism 7.

[0042] [ Figure 9 [This indicates that the second conveying mechanism 11, located at the receiving position U1, receives and maintains the cut item S1 held by the first conveying mechanism 7 in state SB3.]

[0043] [ Figure 10 This indicates the state SB4 where the cut item S1 is positioned at the first inspection position Q1 via the second conveying mechanism 11.

[0044] [ Figure 11 ] indicates that the second conveying mechanism 11 is in the position U2, placing the cut item S1 on the placement table 14. SB5.

[0045] [ Figure 12 [This indicates that the first conveying mechanism 7 receives and maintains the cut item S1 held by the second conveying mechanism 11 in a state SC5.]

[0046] [ Figure 13 [] indicates that the first conveying mechanism 7 is in the position U2, placing the cut item S1 on the placement table 14. SC6. Detailed Implementation

[0047] The embodiments of this disclosure will now be described. In the embodiments described below, when numbers, quantities, etc., are mentioned, the scope of this disclosure is not necessarily limited to the stated numbers, quantities, etc., unless specifically stated otherwise. Unless specifically stated otherwise, each component is not necessarily essential to this disclosure. The same reference numerals are assigned to the same parts and equivalent parts, and repeated descriptions are sometimes avoided.

[0048] (Cutting device 1)

[0049] Figure 1 This is a schematic plan view of the cutting device 1. The cutting device 1 includes a cutting module A1 ( Figure 1 The cutting device 1 includes a monitor 20 and a computer 50, which receive various input commands and perform actions. Furthermore, in... Figure 1 In this process, the monitor 20 and the computer 50 are included in the inspection / storage module B1, but may also be included in the cutting module A1. The cutting device 1 monolithizes the object to be cut (the packaging substrate) into multiple cut pieces (package parts) by cutting the object to be cut. Hereinafter, a method for manufacturing the cut piece S1 using the cutting device 1 will be described in detail.

[0050] (Cut off object P1)

[0051] In the case of a packaging substrate, such as a substrate or lead frame on which a semiconductor chip is mounted, it is sealed with resin. Examples of packaging substrates include: Ball Grid Array (BGA) packaging substrates, Land Grid Array (LGA) packaging substrates, Chip Size Package (CSP) packaging substrates, Light Emitting Diode (LED) packaging substrates, and Quad Flat No-leaded (QFN) packaging substrates, etc.

[0052] The cutting device 1 further inspects each of the multiple cut-off items (electronic components) that have been monolithically processed. Images of each cut-off item are captured, and inspections are performed based on these images. Inspection data is generated from the inspection, and each cut-off item is classified as either "good" or "defective."

[0053] Here, the object to be cut is P1 ( Figure 1 Using a packaging substrate, the object to be cut, P1, is monolithically divided into multiple cut items, S1, by a cutting device 1. Figure 2 In the following description, the resin-sealed surface of both the object to be cut P1 and the cut product S1 is referred to as the molding surface F1. Figure 2The surface opposite to the molding surface F1 is called the solder ball / lead surface F2. Figure 2 ).

[0054] [Implementation Method 1]

[0055] (Cut-off module A1)

[0056] The cutting module A1 cuts the object P1 ( Figure 1 ) to manufacture multiple cut products S1 ( Figure 2 The inspection / storage module B1 inspects each of the multiple cut items S1 and then stores the cut items S1 in a tray. In the cutting device 1, each component can be attached to, detached from, and replaced relative to other components.

[0057] The cutting module A1 includes a substrate supply unit 3, a positioning unit 4, a processing table 5M, a processing table 5N, a cutting mechanism 6, and a first conveying mechanism 7. The substrate supply unit 3 pushes the cutting objects P1 one by one out of the material box M1, thereby supplying the cutting objects P1 one by one to the positioning unit 4. The cutting objects P1 are cut with solder ball / lead surface F2 (… Figure 2 Configure it in an upward orientation.

[0058] The positioning unit 4 positions the object to be cut, P1, pushed out from the substrate supply unit 3 onto the guide rail unit 4a. The cutting device 1 has a structure with two processing tables 5M and 5N, forming a double cutting table. The positioning unit 4 transports the object to be cut, P1, to the processing tables 5M and 5N, and the processing tables 5M and 5N hold the object to be cut, P1.

[0059] Processing tables 5M and 5N each include a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the object to be cut, P1, which is conveyed by the positioning part 4 from below, by adsorbing it. The rotating mechanism 5b moves the holding member 5a along... Figure 1 Rotate in the θ1 direction (i.e., in Figure 1 (Rotation in the XY plane). The moving mechanism 5c moves the holding member 5a along the Y-axis of the figure.

[0060] For example, after the worktable 5M picks up the object to be cut, the first position confirmation camera 5d photographs the object to be cut, confirming its position. The confirmation using the first position confirmation camera 5d may be, for example, confirmation of the position of a mark set on the object to be cut, P1. This mark may be, for example, a mark used to determine the cutting position of the object to be cut, P1.

[0061] Then, the processing table 5M moves along the Y-axis of the figure toward the cutting mechanism 6. After the processing table 5M moves below the cutting mechanism 6, it is aligned, and then the processing table 5M moves relative to the cutting mechanism 6, thereby cutting the object P1. The cutting mechanism 6 cuts the object P1 into multiple cut pieces S1 by using the blade 6a to cut it.

[0062] Whenever the object P1 is cut by the blade 6a of the cutting mechanism 6, the object P1 (cut item S1) is photographed and confirmed by the second position confirmation camera 6b included in the cutting mechanism 6. The confirmation using the second position confirmation camera 6b is, for example, the confirmation of the cut position and the width of the cut of the object P1.

[0063] After the cutting object P1 is cut, the processing table 5M, while holding multiple monolithically cut pieces S1, moves away from the cutting mechanism 6 along the Y-axis as shown in the figure. During this movement, the upper surface (solder ball / lead wire surface F2) of the cut pieces S1 is cleaned by the first cleaner 5e. Figure 2 Cleaning and drying.

[0064] Figure 2 This is a schematic front view showing the portion between the processing table 5M and the placement table 14 in the cutting device 1. The first conveying mechanism 7 has a main body 7a and a moving shaft 7b, and can convey the cut item S1 along the moving shaft 7b while the main body 7a holds the cut item S1.

[0065] Using the first cleaner 5e ( Figure 1 After the cleaning and drying are completed, such as Figure 2 As shown, when the first conveying mechanism 7 is configured in the pick-up position T1, the first conveying mechanism 7 picks up the cut product S1 held on the processing table 5M from above. Figure 2 SA1 indicates that the first conveying mechanism 7 is positioned at the pick-up position T1 and holds the cut item S1 from above on the processing table 5M. After picking up the cut item S1 from the processing table 5M, the first conveying mechanism 7 conveys the cut item S1 toward the first inspection mechanism 8 and the second inspection mechanism 9 of the inspection / storage module B1.

[0066] like Figure 3 As shown, the cut item S1 is conveyed upwards (arrow AR1), and then positioned so as to face the cleaning nozzle 10a and drying nozzle 10b of the second cleaner 10 respectively (arrow AR2, arrow AR3) to clean and dry the lower surface (molded surface F1) of the cut item S1. Then, the cut item S1 is further conveyed by the first conveying mechanism 7 and positioned in a position facing the first inspection mechanism 8 (first inspection position Q1) (arrow AR4). Figure 3This indicates the state SA2, where the cut item S1 is positioned at the first inspection position Q1 via the first conveying mechanism 7.

[0067] (Inspection / Storage Module B1)

[0068] Reference Figure 1 and Figure 3 Inspection / Storage Module B1 ( Figure 1 The device includes a first inspection mechanism 8, a second inspection mechanism 9, a second conveying mechanism 11, a platform 14, and an extraction unit 15. The first inspection mechanism 8 has a first optical inspection camera 12 and a first illumination 16. The first illumination 16 is provided above the first optical inspection camera 12, and the first illumination 16 illuminates the cut product S1 when the first optical inspection camera 12 is used for inspection.

[0069] like Figure 3 As shown, when the cut product S1 is positioned at the first inspection position Q1 by the first conveying mechanism 7, the first optical inspection camera 12 takes a picture of the molded surface F1 (first surface) of the cut product S1. The first optical inspection camera 12 is configured to take a picture from above near the cut product S1 positioned at the first inspection position Q1.

[0070] Reference Figure 4 After taking a picture using the first optical inspection camera 12, the first conveying mechanism 7 moves together with the cut item S1 (arrow AR5) to a position facing the second conveying mechanism 11, and places the cut item S1 on the main body 11a of the second conveying mechanism 11.

[0071] The second conveying mechanism 11 has a main body 11a and a moving shaft 11b. When the main body 11a holds the cut item S1, the cut item S1 can be conveyed along the moving shaft 11b. Figure 4 The second conveying mechanism 11 shown is located in the receiving position U1. In the state of being located in the receiving position U1, the second conveying mechanism 11 receives from and holds the cut item S1 held by the first conveying mechanism 7. Figure 4 This indicates that the second conveying mechanism 11, located at the receiving position U1, receives and maintains the cut item S1 held by the first conveying mechanism 7 in a state SA3.

[0072] like Figure 5 As shown, the main body 11a of the second conveying mechanism 11 reverses vertically while holding the cut item S1. The cut item S1 is positioned by the second conveying mechanism 11 at a position facing the second inspection mechanism 9 (second inspection position Q2). Figure 5 This indicates the state SA4, where the cut item S1 is positioned at the second inspection position Q2 via the second conveying mechanism 11.

[0073] The second inspection mechanism 9 includes a second optical inspection camera 13 and a second illumination 17. The second illumination 17 is positioned above the second optical inspection camera 13, and illuminates the cut-off piece S1 during inspection using the second optical inspection camera 13. With the cut-off piece S1 positioned at the second inspection position Q2 by the second conveying mechanism 11, the second optical inspection camera 13 captures an image of the solder ball / lead surface F2 (second surface) of the cut-off piece S1. The second optical inspection camera 13 is configured to capture an image from above near the cut-off piece S1 positioned at the second inspection position Q2.

[0074] Reference Figure 6 After taking a picture using the second optical inspection camera 13, the second conveying mechanism 11 moves together with the cut item S1 to a position facing the mounting table 14 and places the cut item S1 on the mounting table 14. Figure 6 The second conveying mechanism 11 shown is located at the loading position U2. Figure 6 SA5 indicates that the second conveying mechanism 11 has placed the cut item S1 on the loading table 14 at the loading position U2.

[0075] In this embodiment, given a reference direction (X direction) extending in a straight line, the positions along the reference direction are sequentially designated as pickup positions T1, starting from the left side of the paper. Figure 2 ), First inspection position Q1 ( Figure 3 ), second inspection position Q2 ( Figure 5 ) and placement position U2 ( Figure 6 ).

[0076] Refer again Figure 1 The inspected cut-out products S1 are arranged on the mounting stage 14. The mounting stage 14 is movable along the Y-axis shown in the figure. The extraction unit 15 transfers the cut-out products S1 arranged on the mounting stage 14 to a tray. The cut-out products S1 are classified as "good" or "defective" based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13. Based on the classification results, the extraction unit 15 transfers each cut-out product S1 to a good product tray 15a or a defective product tray 15b.

[0077] [Implementation Method 2]

[0078] In embodiment 1, at the time point when the cutting of the object P1 is completed, the cut product S1 is positioned with solder ball / lead surface F2 ( Figure 2 The object is arranged with its face upwards. On the other hand, even at the point when the cutting of the object P1 is completed, the cut surface S1 is molded with its face F1 facing upwards. Figure 2 In the case of the configuration with the material box M1 facing upwards, that is, from the material box M1 ( Figure 1When the object to be cut, P1, is supplied to the positioning unit 4 and is arranged with the molded surface F1 facing upwards, the cutting device 1 can also perform the inspection efficiently.

[0079] like Figure 7 As shown, when the first conveying mechanism 7 is configured in the pick-up position T1, the first conveying mechanism 7 picks up the cut product S1 held on the processing table 5M from above. Figure 7 This indicates that the first conveying mechanism 7 is positioned at the pick-up position T1 and holds the cut item S1 from above on the processing table 5M in state SB1. After picking up the cut item S1 from the processing table 5M, the first conveying mechanism 7 conveys the cut item S1 toward the first inspection mechanism 8 and the second inspection mechanism 9 of the inspection / storage module B1.

[0080] like Figure 8 As shown, the cut item S1 is conveyed upwards (arrow AR1), and then, in a manner that faces the cleaning nozzle 10a and drying nozzle 10b of the second cleaner 10 respectively (arrow AR2, arrow AR3), the lower surface (solder ball / lead wire surface F2) of the cut item S1 is cleaned and dried.

[0081] Then, the cut item S1 is further conveyed by the first conveying mechanism 7 and positioned in the opposite position to the second inspection mechanism 9 (second inspection position Q2) (arrow AR4). Figure 8 This indicates the state SB2, where the cut item S1 is positioned at the second inspection position Q2 by the first conveying mechanism 7. While the cut item S1 is positioned at the second inspection position Q2 by the first conveying mechanism 7, the second optical inspection camera 13 takes a picture of the solder ball / lead surface F2 (second surface) of the cut item S1.

[0082] Reference Figure 9 After taking a picture using the second optical inspection camera 13, the first conveying mechanism 7 moves together with the cut item S1 (arrow AR5) to a position facing the second conveying mechanism 11, and places the cut item S1 on the main body 11a of the second conveying mechanism 11.

[0083] Figure 9 The second conveying mechanism 11 shown is located in the receiving position U1. In the state of being located in the receiving position U1, the second conveying mechanism 11 receives from and holds the cut item S1 held by the first conveying mechanism 7. Figure 9 This indicates that the second conveying mechanism 11, located at the receiving position U1, receives and maintains the cut item S1 held by the first conveying mechanism 7 in state SB3.

[0084] like Figure 10As shown, the main body 11a of the second conveying mechanism 11 reverses vertically while holding the cut item S1. The cut item S1 is positioned by the second conveying mechanism 11 at a position facing the first inspection mechanism 8 (first inspection position Q1). Figure 10 This indicates the state SB4 where the cut item S1 is positioned at the first inspection position Q1 via the second conveying mechanism 11. While the cut item S1 is positioned at the first inspection position Q1 via the second conveying mechanism 11, the first optical inspection camera 12 takes a picture of the molded surface F1 (first surface) of the cut item S1.

[0085] Reference Figure 11 After taking a picture using the first optical inspection camera 12, the second conveying mechanism 11 moves together with the cut item S1 to a position facing the placement table 14 and places the cut item S1 on the placement table 14. Figure 11 The second conveying mechanism 11 shown is located at the loading position U2. Figure 11 This indicates that the second conveying mechanism 11 is in the position U2, placing the cut item S1 on the loading table 14. (SB5)

[0086] Then, similarly to Embodiment 1, in the extraction unit 15, the cut product S1 is classified as "good" or "defective" based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13.

[0087] (Functions and Effects)

[0088] As described in Embodiments 1 and 2, in the cutting device 1, the first conveying mechanism 7 is configured to convey the cut item S1 to the first inspection position Q1. Figure 3 ) and the second inspection position Q2 ( Figure 8 These two positions, and the second conveying mechanism 11 is also configured to convey the cut item S1 to the first inspection position Q1. Figure 10 ) and the second inspection position Q2 ( Figure 5 These two positions.

[0089] Therefore, at the point in time when the cutting of object P1 is completed, whether the cut item S1 is with solder ball / lead surface F2 ( Figure 2 In the case of a configuration with the front facing upwards, or in the case of a cut-off piece S1 with the molded surface F1 ( Figure 7 In the case of an upward-facing configuration, inspections can be performed without requiring changes to the lighting or adjustments for inspection (optimization of inspection) on either the first inspection mechanism 8 or the second inspection mechanism 9. Furthermore, the increased inspection sequence in a cutting device that includes two inspection mechanisms also provides high versatility as a cutting device. Therefore, according to the cutting device 1, high versatility as a cutting device is achieved, enabling highly productive cutting and inspection.

[0090] [Modification of Implementation Method 2]

[0091] In embodiment 2, after the inspection by the first inspection mechanism 8, the cut product S1 is placed on the placement stage 14 with the molded surface F1 facing downwards. As a variation, such as... Figure 12 As shown, after the inspection is carried out by the first inspection mechanism 8, the main body 11a of the second conveying mechanism 11 can be reversed up and down while holding the cut item S1.

[0092] The first conveying mechanism 7 receives and holds the cut item S1 held by the second conveying mechanism 11. Figure 12 This indicates that the first conveying mechanism 7 receives and maintains the cut item S1 held by the second conveying mechanism 11 in a state SC5.

[0093] The first conveying mechanism 7 moves together with the cut item S1 to a position facing the placement table 14 and places the cut item S1 on the placement table 14. Figure 13 The first conveying mechanism 7 shown is located at the loading position U2. Figure 13 This indicates that the first conveying mechanism 7 is in the position U2, placing the cut item S1 on the placement table 14. (SC6)

[0094] Here, the first conveying mechanism 7 is configured to move to a pick-up position T1 and a placement position U2. The pick-up position T1 is the position for picking up and holding multiple cut-out items S1 on the processing table 5M, and the placement position U2 is the position for placing the multiple cut-out items S1 on the placement table 14. According to this structure, the cut-out items S1 can be placed on the placement table 14 with the solder ball / lead surface F2 facing down.

[0095] [Postscript]

[0096] The embodiments of this disclosure have been described above, but the content of the embodiments of this disclosure can be summarized as shown in the following appendices.

[0097] [Postscript 1]

[0098] A cutting device, comprising:

[0099] The processing table holds the object to be cut.

[0100] A cutting mechanism that cuts the object to be cut, which is held on the processing table, into multiple cut pieces;

[0101] The first conveying mechanism holds and conveys multiple of the cut items;

[0102] The second conveying mechanism holds and conveys multiple of the cut items;

[0103] A first inspection mechanism inspects the first surface of the plurality of cut items while they are positioned in a first inspection position; and

[0104] The second inspection mechanism inspects the second surface of the plurality of cut items while they are positioned in the second inspection position.

[0105] The first conveying mechanism is configured to convey a plurality of the cut items to both the first inspection position and the second inspection position.

[0106] The second conveying mechanism is also configured to convey a plurality of the cut items to both the first inspection position and the second inspection position.

[0107] According to the structure described in Appendix 1, both the first and second conveying mechanisms are configured to transport multiple cut items to the first inspection position and the second inspection position, respectively. Therefore, at the start of inspection, the inspection of the cut items can be flexibly initiated regardless of whether the first side of the cut item is facing down (e.g., facing the inspection mechanism) or the second side is facing down. For example, compared to a situation where the first conveying mechanism is configured to transport multiple cut items only to the first inspection position and the second conveying mechanism is configured to transport multiple cut items only to the second inspection position, the structure described in Appendix 1 allows for more flexible setting of the inspection sequence, such as inspecting the first side before inspecting the second side or inspecting the second side before inspecting the first side, enabling cutting and inspection to be performed with high productivity.

[0108] [Postscript 2]

[0109] According to the cutting device described in Appendix 1

[0110] It also includes a mounting platform capable of holding multiple of the cut items.

[0111] The second conveying mechanism is configured to move to a receiving position and a placing position, the receiving position being a position for receiving and holding the plurality of cut items held by the first conveying mechanism, and the placing position being a position for placing the plurality of cut items on the placing table.

[0112] According to the structure described in Appendix 2, after the second conveying mechanism receives and holds multiple cut items from the first conveying mechanism at the receiving position, the second conveying mechanism moves to the placement position, thereby placing the multiple cut items on the placement table.

[0113] [Postscript 3]

[0114] According to the cutting device described in Appendix 2, wherein,

[0115] The first conveying mechanism is configured to move to a pick-up position and a placement position, the pick-up position being a position for picking up and holding a plurality of the cut items on the processing table, and the placement position being a position for placing the plurality of the cut items on the placement table.

[0116] According to the structure described in Appendix 3, the following actions can be achieved, for example: a first conveying mechanism moves multiple cut items to one of a first inspection position and a second inspection position and inspects the multiple cut items; then, a second conveying mechanism moves the multiple cut items to the other of the first inspection position and the second inspection position and inspects the multiple cut items; then, after the first conveying mechanism receives and holds the multiple cut items from the second conveying mechanism, the first conveying mechanism moves to a placement position and places the multiple cut items on a placement table. Thus, it is possible to select the state of the cut items (first side down or second side down) when they are housed in the good product tray 15a or the defective product tray 15b.

[0117] [Postscript 4]

[0118] According to the cutting device described in Appendix 3, wherein...

[0119] The first conveying mechanism receives and holds a plurality of the cut items held by the second conveying mechanism. The first conveying mechanism moves together with the plurality of cut items to a position facing the mounting platform and places the plurality of cut items on the mounting platform.

[0120] According to the structure described in Appendix 4, for example, the following actions can be performed: the first conveying mechanism moves multiple cut items to one of the first inspection position and the second inspection position and inspects the multiple cut items; then, the second conveying mechanism moves multiple cut items to the other of the first inspection position and the second inspection position and inspects the multiple cut items; then, after the first conveying mechanism receives and holds the multiple cut items from the second conveying mechanism, the first conveying mechanism moves to the placement position and places the multiple cut items on the placement table.

[0121] [Postscript 5]

[0122] The cutting device according to any one of Appendices 1 to 4, wherein...

[0123] The second conveying mechanism is configured to reverse the orientation of the multiple cut items while holding them in place.

[0124] According to the structure described in Appendix 5, for example, when performing an inspection, it is easy to switch between the first and second sides of the cut item that are to be inspected, or when placing the cut item, it is easy to set which of the first and second sides of the cut item faces upward or downward.

[0125] [Postscript 6]

[0126] A method for manufacturing a cut article, using a cutting device according to any one of Appendices 1 to 5, the method comprising the following steps:

[0127] The object to be cut, held on the processing table, is cut into multiple pieces;

[0128] With the plurality of cut items positioned at the second inspection position by the first conveying mechanism, the second surface of the plurality of cut items is inspected by the second inspection mechanism.

[0129] Transferring the plurality of the cut items from the first conveying mechanism to the second conveying mechanism; and

[0130] With the plurality of cut items positioned at the first inspection position by the second conveying mechanism, the first surface of the plurality of cut items is inspected by the first inspection mechanism.

[0131] According to the structure described in Appendix 6, the first conveying mechanism and the second conveying mechanism are each configured to convey multiple cut items to the first inspection position and the second inspection position, thereby enabling the second side to be inspected before the first side is inspected. For example, compared to the case where the first conveying mechanism is configured to convey multiple cut items only to the first inspection position and the second conveying mechanism is configured to convey multiple cut items only to the second inspection position, cutting and inspection can be performed with high productivity.

[0132] [Postscript 7]

[0133] A method for manufacturing a cut article, using a cutting device according to any one of Appendices 1 to 5, the method comprising the following steps:

[0134] The object to be cut, held on the processing table, is cut into multiple pieces;

[0135] With the plurality of cut items positioned at the first inspection position by the first conveying mechanism, the first surface of the plurality of cut items is inspected by the first inspection mechanism.

[0136] Transferring the plurality of the cut items from the first conveying mechanism to the second conveying mechanism; and

[0137] With the plurality of cut items positioned in the second inspection position by the second conveying mechanism, the second surface of the plurality of cut items is inspected by the second inspection mechanism.

[0138] According to the structure described in Appendix 7, the first conveying mechanism and the second conveying mechanism are each configured to convey multiple cut items to the first inspection position and the second inspection position, thereby enabling the first side to be inspected before the second side is inspected. For example, compared to the case where the first conveying mechanism is configured to convey multiple cut items only to the first inspection position and the second conveying mechanism is configured to convey multiple cut items only to the second inspection position, cutting and inspection can be performed with high productivity.

[0139] [Postscript 8]

[0140] A method for manufacturing a cut article, using a cutting device according to Appendix 3 or 4, the method comprising the following steps:

[0141] The object to be cut, held on the processing table, is cut into multiple pieces;

[0142] With the plurality of cut items positioned at the second inspection position by the first conveying mechanism, the second surface of the plurality of cut items is inspected by the second inspection mechanism.

[0143] The multiple cut items are transferred from the first conveying mechanism to the second conveying mechanism;

[0144] With the plurality of cut items positioned at the first inspection position by the second conveying mechanism, the first surface of the plurality of cut items is inspected by the first inspection mechanism.

[0145] Transferring the plurality of the cut items from the second conveying mechanism to the first conveying mechanism; and

[0146] The first conveying mechanism places a plurality of the cut items on the loading platform.

[0147] According to the structure described in Appendix 8, for example, regarding the posture of the cut item, by transferring the cut item from the first conveying mechanism to the second conveying mechanism, the posture for inspecting the second side is changed to the posture for inspecting the first side. Furthermore, by transferring the cut item from the second conveying mechanism to the first conveying mechanism, the posture for inspecting the first side can be changed to a posture suitable for the first conveying mechanism to place the cut item on the loading table. Furthermore, the state of the cut item (first side down or second side down) when it is housed in the good product tray 15a or the defective product tray 15b can be selected.

[0148] The embodiments of this disclosure have been described above. It should be considered that the embodiments disclosed herein are exemplary and not limiting in all respects. The scope of this disclosure is defined by the claims and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0149] Explanation of icon numbers

[0150] 1 Cutting device, 3 Substrate supply unit, 4 Positioning unit, 4a Guide rail unit, 5M, 5N Processing table, 5a Holding member, 5b Rotation mechanism, 5c Moving mechanism, 5d First position confirmation camera, 5e First cleaner, 6 Cutting mechanism, 6a Blade, 6b Second position confirmation camera, 7 First conveying mechanism, 7a, 11a Main body, 7b, 11b Moving axis, 8 First inspection mechanism, 9 Second inspection mechanism, 10 Second cleaner, 10a Cleaning nozzle, 10b Drying nozzle, 11 Second conveying mechanism, 12 First optical inspection camera, 13 Second optical inspection camera, 14 Placement stage, 15 Extraction unit, 15a Good product tray, 15b Defective product tray, 16 First illumination, 17 Second illumination, 20 Monitor, 50 Computer, A1 Cutting module, B1 Inspection / storage module, F1 Molded surface (first surface), F2 Lead surface (second surface), M1 Material box, P1 object to be cut, Q1 first inspection position, Q2 second inspection position, S1 cut item, T1 pick-up position, U1 receiving position, U2 placement position.

Claims

1. A cutting device, comprising: The processing table holds the object to be cut. A cutting mechanism that cuts the object to be cut, which is held on the processing table, into multiple cut pieces; The first conveying mechanism holds and conveys multiple of the cut items; The second conveying mechanism holds and conveys multiple of the cut items; The first inspection mechanism inspects the first surface of the plurality of cut items while they are arranged in the first inspection position; as well as The second inspection mechanism inspects the second surface of the plurality of cut items while they are positioned in the second inspection position. The first conveying mechanism is configured to convey a plurality of the cut items to both the first inspection position and the second inspection position. The second conveying mechanism is also configured to convey a plurality of the cut items to both the first inspection position and the second inspection position.

2. The cutting device according to claim 1, It also includes a mounting platform capable of holding multiple of the cut items. The second conveying mechanism is configured to move to a receiving position and a placing position, the receiving position being a position for receiving and holding the plurality of cut items held by the first conveying mechanism, and the placing position being a position for placing the plurality of cut items on the placing table.

3. The cutting device according to claim 2, wherein, The first conveying mechanism is configured to move to a pick-up position and a placement position, the pick-up position being a position for picking up and holding a plurality of the cut items on the processing table, and the placement position being a position for placing the plurality of the cut items on the placement table.

4. The cutting device according to claim 3, wherein, The first conveying mechanism receives and holds a plurality of the cut items held by the second conveying mechanism. The first conveying mechanism moves together with the plurality of cut items to a position facing the mounting platform and places the plurality of cut items on the mounting platform.

5. The cutting device according to any one of claims 1 to 4, wherein, The second conveying mechanism is configured to reverse the orientation of the multiple cut items while holding them in place.

6. A method for manufacturing a cut article, using the cutting device as described in any one of claims 1 to 5, the method for manufacturing the cut article comprising the following steps: The object to be cut, held on the processing table, is cut into a plurality of cut pieces; With the plurality of cut items positioned at the second inspection position by the first conveying mechanism, the second surface of the plurality of cut items is inspected by the second inspection mechanism. The multiple cut items are transferred from the first conveying mechanism to the second conveying mechanism; as well as With the plurality of cut items positioned at the first inspection position by the second conveying mechanism, the first surface of the plurality of cut items is inspected by the first inspection mechanism.

7. A method for manufacturing a cut article, using the cutting device as described in any one of claims 1 to 5, the method for manufacturing the cut article comprising the following steps: The object to be cut, held on the processing table, is cut into a plurality of cut pieces; With the plurality of cut items positioned at the first inspection position by the first conveying mechanism, the first surface of the plurality of cut items is inspected by the first inspection mechanism. The multiple cut items are transferred from the first conveying mechanism to the second conveying mechanism; as well as With the plurality of cut items positioned in the second inspection position by the second conveying mechanism, the second surface of the plurality of cut items is inspected by the second inspection mechanism.

8. A method for manufacturing a cut article, using the cutting device as described in any one of claims 3 or 4, the method for manufacturing the cut article comprising the following steps: The object to be cut, held on the processing table, is cut into a plurality of cut pieces; With the plurality of cut items positioned at the second inspection position by the first conveying mechanism, the second surface of the plurality of cut items is inspected by the second inspection mechanism. The multiple cut items are transferred from the first conveying mechanism to the second conveying mechanism; With the plurality of cut items positioned at the first inspection position by the second conveying mechanism, the first surface of the plurality of cut items is inspected by the first inspection mechanism. The multiple cut items are transferred from the second conveying mechanism to the first conveying mechanism; as well as The first conveying mechanism places a plurality of the cut items on the loading platform.

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