Retaining disc, probe station having the same, and wafer testing system

Abstract

To provide a holding plate capable of making temperature distribution of the upper surface more uniform. The above problem is solved by the holding plate described below, in which the cooling layer includes a heat exchange layer, a lead-in layer, and a lead-out layer, the heat exchange layer has a first space extending in the horizontal direction inside, the lead-in layer has a second space extending in the horizontal direction inside, the lead-out layer has a third space extending in the horizontal direction inside, the holding plate further has: a flow path (α) connecting the second space with the first space, capable of moving the refrigerant led into the inside of the second space to the inside of the first space; and a flow path (β) connecting the first space with the third space, capable of moving the refrigerant in the inside of the first space to the inside of the third space, the refrigerant is led into the inside of the second space possessed by the lead-in layer from the outside, and moved to the inside of the first space possessed by the heat exchange layer through the flow path (α), and then moved to the inside of the third space possessed by the lead-out layer and discharged to the outside.

Description

Technical Field

[0001] The present invention relates to a holding disk, a probe station having the holding disk, and a wafer testing system. Background Technology

[0002] For example, in the semiconductor manufacturing process, semiconductor wafers undergo various processes to form multiple chip-shaped semiconductor devices. The electrical characteristics of each semiconductor device on the wafer are then inspected, and a dicing machine is used to cut and separate them, removing defective semiconductor chips.

[0003] Here, the electrical characteristics are checked using a wafer testing system consisting of a probe station and a tester.

[0004] The probe station has: a holding disk for holding a wafer on which a plurality of semiconductor chips are formed; and a probe card holding portion for holding a probe card having a plurality of probes that contact the electrode pads of the semiconductor chips and connect the electrode pads to the terminals of the tester.

[0005] When the probe contacts the electrode pads of the semiconductor chip, the terminal of the tester is connected to the electrode pads of the semiconductor chip. The tester supplies power and signals to the semiconductor chip to make it operate. The tester detects the output from the semiconductor chip to perform the operation test.

[0006] Furthermore, for semiconductor devices, specifications sometimes require operation not only at room temperature but also at high or low temperatures. Therefore, the holding plate has a heating mechanism (heater, etc.) and a cooling mechanism, thereby maintaining the holding plate at a specified temperature while inspecting the wafer held on the holding plate. Summary of the Invention

[0007] The problem the invention aims to solve

[0008] Here, it is preferable that the upper surface of the holding disk in contact with the wafer has a more uniform temperature distribution. If the temperature distribution on the upper surface of the holding disk is uneven, the inspection quality may deteriorate.

[0009] The purpose of this invention is to provide a holding disk that enables a more uniform temperature distribution on the upper surface, a probe station including the holding disk, and a wafer testing system.

[0010] Solution for solving the problem

[0011] In order to solve the above problems, the inventors conducted in-depth research and thus completed this invention.

[0012] The present invention comprises the following (1) to (10).

[0013] (1) A holding disk having an upper heating layer and a lower cooling layer stacked together, the holding disk being capable of maintaining a wafer held on its upper surface at a predetermined temperature, wherein,

[0014] The cooling layer includes a heat exchange layer, an inlet layer, and an outlet layer.

[0015] The heat exchange layer has a first space that extends horizontally inside.

[0016] The inlet layer is located below the heat exchange layer, and has a second space extending horizontally inside, with an inlet flow path or inlet hole for introducing refrigerant from the outside into the interior of the second space.

[0017] The discharge layer has a third space extending horizontally inside, and has a discharge path or discharge port for discharging the refrigerant inside the third space to the outside.

[0018] The holding plate also features:

[0019] A flow path α, which connects the second space to the first space, allows the refrigerant introduced into the second space to move into the first space; and

[0020] Flow path β connects the first space and the third space, enabling the refrigerant inside the first space to move into the third space.

[0021] The refrigerant is introduced from the outside into the second space of the inlet layer, and moves through the flow path α into the first space of the heat exchange layer to cool the wafer and / or the heating layer, and then moves into the third space of the outlet layer and is discharged to the outside.

[0022] (2) The holding plate according to (1) above, wherein, in the cooling layer, the heat exchange layer, the inlet layer and the outlet layer are stacked in the order of the heat exchange layer, the inlet layer and the outlet layer.

[0023] (3) The holding disc according to (1) or (2) above, wherein,

[0024] The inlet layer is located directly below the heat exchange layer.

[0025] The second space of the inlet layer is not connected to the inlet flow path and flow path α, nor does it have any holes other than the inlet hole.

[0026] A hole serving as the flow path α is formed on the upper surface of the second space, or the flow path α is formed through the upper surface of the second space.

[0027] When the second space is filled with the refrigerant introduced from the outside, the refrigerant that has passed through the flow path α moves into the interior of the first space.

[0028] (4) The holding disc according to any one of (1) to (3) above, wherein,

[0029] The discharge layer is located directly below the inlet layer.

[0030] The inlet layer has pillars extending from its lower surface to its upper surface inside the second space.

[0031] A through hole is formed in the support, which forms at least a portion of the flow path β.

[0032] (5) The holding disc according to any one of (1) to (4) above, wherein,

[0033] A groove is formed inside the heat exchange layer to connect the outlet of flow path α to the inlet of flow path β. This groove forms part of the inner surface of the first space. The refrigerant flowing from flow path α into the heat exchange layer flows to flow path β via the groove.

[0034] (6) The holding disc according to any one of (1) to (5) above, wherein,

[0035] The third space of the discharge layer is not connected to the discharge flow path and flow path β, nor does it have any holes other than the discharge hole.

[0036] (7) The holding disc according to any one of (1) to (6) above, wherein,

[0037] The retaining disc also has a tube, one end of which is located outside the inlet layer, extending into the interior of the second space within the inlet layer, and having a plurality of ejection holes on its outer surface.

[0038] The refrigerant introduced from one end of the tube moves inside the tube and is released from the ejection hole of the tube into the interior of the second space of the inlet layer, where it accumulates.

[0039] (8) A holding disk having an upper heating layer and a lower cooling layer stacked together, the holding disk being capable of maintaining a wafer held on its upper surface at a predetermined temperature, wherein,

[0040] The cooling layer has a space that extends horizontally inside.

[0041] The retaining disc has a tube, one end of which is located outside the cooling layer, extending into the interior of the space within the cooling layer, and has multiple ejector holes on its outer surface.

[0042] The refrigerant introduced from one end of the tube moves inside the tube and is released from the nozzles of the tube into the interior of the space of the cooling layer, where it accumulates.

[0043] (9) A probe station, wherein,

[0044] The probe station has a holding disk as described in any one of (1) to (8) above.

[0045] (10) A wafer testing system, wherein,

[0046] The wafer testing system has the probe station described in (9) above.

[0047] Invention Effects

[0048] According to the present invention, it is possible to provide a holding disk that enables a more uniform temperature distribution on the upper surface, a probe station having the holding disk, and a wafer testing system. Attached Figure Description

[0049] Figure 1 This is a schematic perspective view of the first holding disc of the present invention.

[0050] Figure 2 yes Figure 1 A sectional view along line AA.

[0051] Figure 3 The diagram shows the state after the first retaining disk of the present invention has been disassembled, showing the upper surface of each layer (each component).

[0052] Figure 4 The diagram shows the state after disassembling the first retaining disc of the present invention, showing the lower surface of each layer (each component).

[0053] Figure 5 It is a schematic three-dimensional diagram showing the tubes that exist inside the cooling layer (especially the inlet layer).

[0054] Figure 6 This is a schematic partial cross-sectional view used to illustrate the flow of refrigerant in the first holding tray of the present invention.

[0055] Figure 7 This is a schematic cross-sectional view of the second retaining disc of the present invention when cut along the vertical direction. Detailed Implementation

[0056] This invention is described.

[0057] The present invention includes two types of retaining disks.

[0058] The first holding disk of the present invention has a structure in which an upper heating layer and a lower cooling layer are stacked. This holding disk is capable of maintaining a wafer held on the upper surface at a predetermined temperature. The cooling layer includes a heat exchange layer, an inlet layer, and a outlet layer. The heat exchange layer has a first space extending horizontally inside. The inlet layer is located below the heat exchange layer and has a second space extending horizontally inside, and has an inlet flow path or inlet hole for introducing refrigerant from the outside into the interior of the second space. The outlet layer has a third space extending horizontally inside and has an outlet flow path or outlet hole for discharging the refrigerant inside the third space to the outside. The retaining disk further comprises: a flow path α connecting the second space to the first space, enabling the refrigerant introduced into the second space to move into the first space; and a flow path β connecting the first space to the third space, enabling the refrigerant in the first space to move into the third space. The refrigerant is introduced from the outside into the second space of the inlet layer and moves through the flow path α into the first space of the heat exchange layer to cool the wafer and / or the heating layer, and then moves into the third space of the outlet layer and is discharged to the outside.

[0059] The second holding disk of the present invention has a structure in which an upper heating layer and a lower cooling layer are stacked. The holding disk is capable of maintaining a wafer held on the upper surface at a predetermined temperature. The cooling layer has a space that extends horizontally inside. The holding disk has a tube, one end of which is located outside the cooling layer. The tube extends into the interior of the space of the cooling layer and has a plurality of ejection holes on its outer surface. The refrigerant introduced from the one end of the tube moves inside the tube and is released from the ejection holes of the tube into the interior of the space of the cooling layer and accumulates inside the space.

[0060] The first holding disc of the present invention will be described using the accompanying drawings.

[0061] Figure 1 This is a schematic perspective view of the first holding disc of the present invention. Figure 2 yes Figure 1 The AA-line sectional view. Additionally... Figure 3 and Figure 4 This shows the state after the first holding disk of the present invention has been disassembled. Figure 3 Showing the upper surface of each layer (component), Figure 4The lower surface of each layer (component) is shown. Figure 5 It is a schematic three-dimensional diagram showing the tubes that exist inside the cooling layer (especially the inlet layer). Figure 6 This is a schematic partial cross-sectional view used to illustrate the flow of refrigerant in the first holding tray of the present invention.

[0062] also, Figures 1-6 The illustration shows a preferred embodiment of the first holding disc of the present invention, but the first holding disc of the present invention is not limited to the embodiment shown. For Figure 7 Similarly, it illustrates a preferred configuration of the second holding disc of the present invention, which is not limited to [specific configuration]. Figure 7 The shape shown.

[0063] For example, the following are examples of using the heating layer 3 with the upper surface (3s) of the heating layer 3 being horizontal, but it can also be used with the upper surface (3s) of the heating layer 3 not being horizontal (e.g., vertical).

[0064] Furthermore, in the first and second retaining disks of the present invention described later, the tube (tube 50) is a configuration in which two tubes form concentric circles and are connected by two straight tubes in the radial direction. However, in the first and second retaining disks of the present invention, the tube is not limited to such a configuration.

[0065] exist Figures 1-6 In this invention, the first holding disk 1 has a structure in which an upper heating layer 3 and a lower cooling layer 4 are stacked. Furthermore, it can hold the wafer on the upper surface for 3 seconds. The holding unit is not particularly limited; for example, it can be a conventionally known unit. Specifically, for example, a suction hole is provided on the upper surface of the heating layer 3 for 3 seconds, and this suction hole is connected to a suction unit such as a vacuum unit, allowing the wafer to be held on the upper surface for 3 seconds by suction through this suction hole. Figures 1-7 The illustrations of units such as suction holes are omitted in the text.

[0066] The heating layer 3 is not particularly limited as long as it includes units capable of heating the wafer held on its upper surface 3s; such units can be, for example, conventionally known units. Specifically, a heating layer including a planar heater can be cited as an example.

[0067] The first holding disk 1 of the present invention can maintain the wafer held on the upper surface 3s of the heating layer 3 at a predetermined temperature by heating based on the heating layer 3 and cooling based on the cooling layer 4.

[0068] For semiconductor devices, the specifications require that they not only operate at room temperature, but also at high temperatures (e.g., around 200°C) or low temperatures (e.g., around -60°C).

[0069] In the first holding disk 1 of the present invention, the held wafer can be adjusted to a desired temperature in the range of, for example, 200 to -60°C.

[0070] As a refrigerant, brine, which can be used as a secondary refrigerant in indirect refrigeration, and previously known non-active fluorinated inert liquids (fluorinated liquids, etc.) can be used.

[0071] The cooling layer 4 includes a heat exchange layer 21, an inlet layer 23, and an outlet layer 25. These layers are stacked in the order of heat exchange layer 21, inlet layer 23, and outlet layer 25. In use, they are arranged from the bottom in the vertical direction in the order of outlet layer 25, inlet layer 23, and heat exchange layer 21, so that the upper surface 3s is horizontal.

[0072] Furthermore, in the first holding tray of the present invention, the cooling layer includes a heat exchange layer, an inlet layer, and an outlet layer, which are preferably stacked in the order of heat exchange layer, inlet layer, and outlet layer. However, they may not be stacked in this order. For example, the cooling layer may be stacked in the order of heat exchange layer, outlet layer, and inlet layer.

[0073] Figures 1-6 The first holding plate 1 of the present invention, as shown, has an upper cover 11, a heat exchange section 13, an inlet section 15, an outlet section 17, and a lower cover 19, which are stacked together.

[0074] Furthermore, a heat exchange layer 21 is formed by stacking the top cover 11 and the heat exchange section 13, and the heat exchange layer 21 has a first space 211 that extends horizontally inside.

[0075] In addition, an inlet layer 23 is formed by stacking the inlet portion 15 and the outlet portion 17. The inlet layer 23 has a second space 231 inside that is surrounded by the upper surface of the outlet portion 17 and the inner surface of the inlet portion 15 and extends in the horizontal direction.

[0076] Furthermore, a discharge layer 25 is formed by stacking the discharge section 17 and the lower cover 19. The discharge layer 25 has a third space 251 inside that is surrounded by the upper surface of the lower cover 19 and the inner surface of the discharge section 17 and extends in the horizontal direction.

[0077] Furthermore, it is preferable that the first space 211, the second space 231, and the third space 251 all expand horizontally during use. That is, the first holding disk 1 of the present invention is preferably configured such that the first space 211, the second space 231, and the third space 251 expand horizontally during use.

[0078] The import layer 23 will be explained.

[0079] As described above, the inlet layer 23 exists below the heat exchange layer 21. Figures 1-6In the first holding disk 1 of the present invention, as shown, the guide layer 23 is located directly below the heat exchange layer 21 and is adjacent to the heat exchange layer 21. Furthermore, the guide layer 23 has a second space 231 extending horizontally inside.

[0080] Furthermore, it has a pipe 50 as an inlet flow path, which is used to introduce refrigerant from the outside into the interior of the second space 231. In addition, if the first holding plate of the present invention does not have an inlet flow path such as a pipe, the refrigerant may be introduced from the outside into the interior of the second space 231 through an inlet hole that connects the outside to the interior of the second space 231, instead of through an inlet flow path.

[0081] like Figures 1-4 As shown, one end 51 of the tube 50 exists outside the inlet layer 23 and extends into the interior of the second space 231 of the inlet layer 23.

[0082] Preferably, the portion of the tube 50 in contact with the wall forming the second space 231 inside the second space 231 is smaller. In this case, the temperature distribution on the upper surface of the heating layer 3 becomes more uniform.

[0083] exist Figures 3-5 In the first holding disc 1 of the present invention shown, the tube 50 is a configuration in which two tubes form concentric circles and are connected in the radial direction by two straight tubes. For example... Figure 5 As shown, the refrigerant introduced into the pipe 50 from one end 51 flows within the pipe 50 in the direction of the arrow. Furthermore, the refrigerant is released from multiple ejection holes 53 formed on the outer surface of the pipe 50 into the interior of the second space 231 of the inlet layer 23. Moreover, at least a portion of the refrigerant accumulates inside the second space 231.

[0084] like Figure 5 As shown, the tube 50 preferably has a circular portion. Furthermore, it is preferable that the ejection holes 53 are formed approximately evenly on the circumference of this circle. In this case, the first holding disc 1 of the present invention can be cooled more uniformly in the horizontal direction.

[0085] Furthermore, it is preferable that the ejector hole 53 is also formed at the end of the tube 50 that is farther from one end 51. In this case, since the refrigerant is supplied directly to the end that is farther from one end 51, the first holding plate 1 of the present invention can be cooled more uniformly in the horizontal direction.

[0086] The first holding disk 1 of the present invention has a flow path α that connects the second space 231 to the first space 211 of the heat exchange layer 21 described later.

[0087] like Figures 2-4As shown, a hole 153 is formed in the first holding plate 1 of the present invention, extending from the upper surface of the inlet portion 15 to the second space 231. Additionally, a slit-type hole 133 extending along the thickness direction is also formed in the heat exchange portion 13, which will be described later. Furthermore, these holes (holes 153, holes 133) are connected, forming a flow path α.

[0088] The second space 231 of the inlet layer 23 in the first holding plate 1 of the present invention is only connected to the ejection hole 53 and the flow path α of the tube 50, which is the aforementioned inlet flow path, and is not connected to other flow paths. Therefore, when the second space 231 is filled with refrigerant by supplying refrigerant to the second space 231 through the ejection hole 53 via the tube 50, the refrigerant will move to the first space 211 through the flow path α.

[0089] In addition, Figures 1-6 In the first holding disk 1 of the present invention shown in the figure, a hole 153 is formed that extends from the upper surface of the inlet portion 15 to the second space 231. However, it may not be a hole, but rather a flow path that extends from the upper surface of the inlet portion 15 to the second space 231. Alternatively, the flow path connecting the second space 231 to the first space 211 of the heat exchange layer 21 (described later) may be formed, for example, on the side surface of the first holding disk 1 of the present invention, without passing through the upper surface of the inlet portion 15.

[0090] Figures 1-6 The first retaining disk 1 of the present invention, as shown, has an inlet layer 23 having a support column 159 extending from its lower surface to its upper surface inside the second space 231. Furthermore, a through hole is formed in the support column 159, which forms at least a portion of the flow path β described later. This will be explained later.

[0091] The heat exchange layer 21 will be described.

[0092] The heat exchange layer 21 has a first space that extends horizontally inside.

[0093] like Figure 3 As shown, in the heat exchange section 13 of the first holding plate 1 of the present invention, a plurality of grooves 135 are formed on its upper surface. Furthermore, when the heat exchange section 13 is sealed to the upper cover 11, the grooves 135 form a space between them. Figures 1-6 In the first holding disk 1 of the present invention, which is shown as a preferred example, the space formed by the groove 135 corresponds to the first space 211.

[0094] Furthermore, in the illustrated configuration, the surface of the heat exchange section 13 with the groove 135 is made to fit tightly against the upper cover 11. However, the surface of the heat exchange section 13 with the groove 135 can also fit tightly against the upper surface of the inlet section 15 (i.e., the heat exchange section 13 can also be flipped upside down). In this case, there is a groove 135 between the inlet section 15 and the heat exchange section 13, and the space formed therein corresponds to the first space.

[0095] The slot 135 connects the orifice 133, which serves as the outlet of flow path α, to the inlet of flow path β, which will be described later. This will be explained in more detail later.

[0096] The discharge layer 25 will be described.

[0097] The discharge layer 25 is preferably located below the inlet layer 23. Figures 1-5 In the first holding disc 1 of the present invention, as shown, the discharge layer 25 is located directly below the inlet layer 23 and is adjacent to the inlet layer 23. Furthermore, the discharge layer 25 has a third space 251 extending horizontally inside.

[0098] Furthermore, it has a discharge path or discharge port for discharging the refrigerant inside the third space 251 to the outside. Figures 1-5 In the case of the discharge layer 25 of the first holding disc 1 of the present invention shown, there is a straight tube 60 as a discharge flow path.

[0099] Furthermore, the third space 251 of the discharge layer 25 is connected to the flow path β. The flow path β is a flow path that connects the third space 251 to the aforementioned first space 211 and enables the refrigerant inside the first space 211 to move into the third space 251.

[0100] As described above, a hole 153 is formed in the first retaining plate 1 of the present invention, extending from the upper surface of the inlet portion 15 to the second space 231. Additionally, a hole 137, identical to the slit-type hole 133 extending along its thickness direction, is formed in the heat exchange portion 13. Furthermore, a through hole 157 is formed in the support column 159 formed inside the second space 231 of the inlet layer 23.

[0101] Furthermore, these holes (holes 153 and 137) are connected to the through hole 157 to form flow path β.

[0102] In the case of the first holding disc 1 of the present invention, the third space 251 of the discharge layer 25 is only connected to the discharge flow path and flow path β such as the pipe 60, and is not connected to any other flow path.

[0103] The discharge layer 25 preferably has a support 257 inside the third space 251.

[0104] use Figure 6The flow of refrigerant in the first holding plate 1 of the present invention will be described.

[0105] Figure 6 It is Figure 2 The enlarged portion of the drawing is a schematic partial cross-sectional view illustrating the flow of refrigerant in the first holding tray of the present invention.

[0106] Refrigerant is introduced from the outside into the second space 231 of the inlet layer 23. When the second space 231 of the inlet layer 23 is filled, the refrigerant moves into the first space 211 of the heat exchange layer 21 through the flow path α formed by the holes 153 formed on the upper surface of the inlet portion 15 and the holes 133 formed on the heat exchange portion 13. That is, the groove 135 formed on the upper surface of the heat exchange portion 13 is connected to the outlet of the flow path α. Here, the groove 135 corresponds to the first space 211.

[0107] The refrigerant primarily cools the wafer and / or heating layer 3 within the first space 211.

[0108] Subsequently, the refrigerant flows into flow path β, which is formed by connecting the holes 153 formed on the upper surface of the inlet 15, the holes 137 formed in the heat exchange section 13, and the through holes 157 formed in the support column 159. That is, the groove 135 formed on the upper surface of the heat exchange section 13 is connected to the inlet of flow path β. Furthermore, the refrigerant flowing into the heat exchange layer 21 from flow path α flows to flow path β via the groove 135.

[0109] Then, the refrigerant moves into the interior of the third space 251 of the discharge layer 25 and is discharged to the outside.

[0110] The above uses Figures 1-6 The first holding disk of the present invention has been described.

[0111] Here, the first holding disk of the present invention may be from Figures 1-6 The diagram shows the shape of the first holding tray of the present invention after the tube 50 has been removed.

[0112] Furthermore, the second holding disk of the present invention can be from... Figures 1-6 The first holding tray of the present invention shown has its shape after the heat exchange layer, inlet layer, outlet layer, flow path α, and flow path β have been removed. For example, it can be as follows: Figure 7The holding disk 10 shown is constructed with an upper heating layer 3 and a lower cooling layer 4 stacked together. The holding disk 10 can maintain a wafer held on the upper surface for 3 seconds at a predetermined temperature. The cooling layer 4 has a space 41 that extends horizontally inside. The holding disk 10 has a tube 50, one end 51 of which is located outside the cooling layer 4. The tube 50 extends into the space 41 of the cooling layer 4 and has a plurality of ejection holes 53 on its outer surface. The refrigerant introduced from the end 51 of the tube 50 moves inside the tube 50 and is released from the ejection holes 53 of the tube 50 into the space 41 of the cooling layer 4 and accumulates inside the space 41.

[0113] In addition, Figures 1-6 and Figure 7 In the figures, elements marked with the same reference numerals may be the same elements.

[0114] exist Figures 1-7 In the illustrated first and second holding discs of the present invention, the materials of the heating layer 3, upper cover 11, heat exchange section 13, inlet section 15, outlet section 17, and lower cover 19 are not particularly limited, and can be made of conventionally known materials. Specifically, they can be made of metals such as aluminum, stainless steel, and copper.

[0115] In addition, the upper cover 11, heat exchange section 13, inlet section 15, outlet section 17, and lower cover 19 are preferably joined together by diffusion bonding, for example.

[0116] <Probe Station>

[0117] The probe station of the present invention is a probe station having the first holding disk of the present invention or the second holding disk of the present invention.

[0118] In the probe station of the present invention, the portion other than the holding plate is not particularly limited, and may be, for example, a portion known in the prior art. The probe station of the present invention may be configured as follows: the probe station has the first holding plate or the second holding plate of the present invention; and a probe card holding portion known in the prior art, which holds a probe card having a plurality of probes that contact, for example, the electrode pads of a semiconductor chip and connect the electrode pads to the terminals of the tester.

[0119] <Wafer Testing System>

[0120] The wafer testing system of the present invention is a wafer testing system having the probe station of the present invention.

[0121] The wafer testing system of this invention can include the probe station of this invention, and there are no particular limitations on other components. Other components may, for example, be conventionally known testers.

[0122] The tester supplies power and various test signals from the terminals connected to the probes, and analyzes the signals output by the electrodes of the chip to confirm whether it is operating normally.

[0123] When the probe contacts the electrode pads of the semiconductor chip, the terminal of the tester is connected to the electrode pads of the semiconductor chip. The tester supplies power and signals to the semiconductor chip to make it operate. The tester detects the output from the semiconductor chip to perform the operation test.

[0124] This application claims priority based on Japanese Patent Application No. 2024-24229, filed on February 21, 2024, the entire contents of which are incorporated herein by reference.

[0125] Explanation of reference numerals in the attached figures

[0126] 1. First holding disc of the present invention; 3. Heating layer; 4. Cooling layer; 3s. Upper surface; 10. Second holding disc of the present invention; 11. Upper cover; 13. Heat exchange section; 133. Hole; 137. Hole; 15. Inlet section; 153. Hole; 157. Through hole; 159. Support; 17. Discharge section; 19. Lower cover; 21. Heat exchange layer; 211. First space; 23. Inlet layer; 231. Second space; 25. Discharge layer; 251. Third space; 257. Support; 41. Space; 50. Tube; 51. One end of the tube; 53. Ejection hole; 60. Tube.

Claims

1. A holding disk having an upper heating layer and a lower cooling layer stacked together, the holding disk being capable of maintaining a wafer held on its upper surface at a predetermined temperature, wherein, The cooling layer includes a heat exchange layer, an inlet layer, and an outlet layer. The heat exchange layer has a first space that extends horizontally inside. The inlet layer is located below the heat exchange layer, and has a second space extending horizontally inside, with an inlet flow path or inlet hole for introducing refrigerant from the outside into the interior of the second space. The discharge layer has a third space extending horizontally inside, and has a discharge path or discharge port for discharging the refrigerant inside the third space to the outside. The holding plate also features: Flow path α, which connects the second space to the first space, enables the refrigerant introduced into the interior of the second space to move into the interior of the first space; as well as Flow path β connects the first space and the third space, enabling the refrigerant inside the first space to move into the third space. The refrigerant is introduced from the outside into the second space of the inlet layer, and moves through the flow path α into the first space of the heat exchange layer to cool the wafer and / or the heating layer, and then moves into the third space of the outlet layer and is discharged to the outside.

2. The holding disc according to claim 1, wherein, In the cooling layer, the heat exchange layer, the inlet layer, and the outlet layer are stacked in the order of heat exchange layer, inlet layer, and outlet layer.

3. The holding disc according to claim 1 or 2, wherein, The inlet layer is located directly below the heat exchange layer. The second space of the inlet layer is not connected to the inlet flow path and flow path α, nor does it have any holes other than the inlet hole. A hole serving as the flow path α is formed on the upper surface of the second space, or the flow path α is formed through the upper surface of the second space. When the second space is filled with the refrigerant introduced from the outside, the refrigerant that has passed through the flow path α moves into the interior of the first space.

4. The holding disc according to any one of claims 1 to 3, wherein, The discharge layer is located directly below the inlet layer. The inlet layer has pillars extending from its lower surface to its upper surface inside the second space. A through hole is formed in the support, which forms at least a portion of the flow path β.

5. The holding disc according to any one of claims 1 to 4, wherein, A groove is formed inside the heat exchange layer to connect the outlet of flow path α to the inlet of flow path β. This groove forms part of the inner surface of the first space. The refrigerant flowing from flow path α into the heat exchange layer flows to flow path β via the groove.

6. The holding disc according to any one of claims 1 to 5, wherein, The third space of the discharge layer is not connected to the discharge flow path and flow path β, nor does it have any holes other than the discharge hole.

7. The holding disc according to any one of claims 1 to 6, wherein, The retaining disc also has a tube, one end of which is located outside the inlet layer, extending into the interior of the second space within the inlet layer, and having a plurality of ejection holes on its outer surface. The refrigerant introduced from one end of the tube moves inside the tube and is released from the ejection hole of the tube into the interior of the second space of the inlet layer, where it accumulates.

8. A probe station, wherein, The probe station has a holding disk as described in any one of claims 1 to 7.

9. A wafer testing system, wherein, The wafer testing system has the probe station as described in claim 8.

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