Immersion cooling of embedded electronic components

Abstract

Electronic assemblies that perform immersion cooling of embedded electronic components and methods of construction thereof are described herein. An example electronic assembly includes a first carrier (102-1) and a second carrier (102-2) that are joined together to form a composite carrier (102). A set of components (104) that form an electronic circuit are embedded within the composite carrier (102) and are located between the first carrier (102-1) and the second carrier (102-2). A plurality of leads (108) integrated with the composite carrier (102) are configured to provide external access to a plurality of circuit nodes of the electronic circuit. An immersion cooling assembly (110) that at least partially encases the composite carrier (102) is configured to direct a cooling fluid (216) to flow through the composite carrier (102).

Description

Background Technology

[0001] Packaging plays a crucial role in ensuring the proper functioning, reliability, and ease of use of electronic components. Proper packaging of electronic components serves various purposes. For example, one function of a package can be to protect the delicate semiconductor die within from physical damage, contamination, electrostatic discharge (ESD), and other threats that could cause component malfunction if the die is not properly protected. Similarly, a package can provide a barrier against moisture and other environmental factors that can lead to component degradation and failure. Another function of a package can be to facilitate electrical connections between the internal circuitry of the component and external circuitry (e.g., the circuit board to which the electronic component is coupled). For example, metal leads, wires, bumps, and other such features allow electronic components to be soldered to or otherwise connected to a printed circuit board.

[0002] Heat dissipation can also be provided by a package configured to facilitate the removal of heat from the component's operating elements (e.g., semiconductor dies within the device package). In some cases, the electronic component package may include or be configured to interface with an additional cooling mechanism, such as by connecting to an external heat sink (e.g., a passive heat sink, a fluid-based active cooling device, etc.). Summary of the Invention

[0003] Power electronic devices are configured to handle relatively large voltages and currents in automotive, industrial, and other high-power applications and use cases. When these devices and systems generate, consume, and / or otherwise process and use electrical power, they can generate significant amounts of heat. For power circuits to function properly, it may be desirable to facilitate the dissipation of this heat, or even actively remove or transfer it from the heat-generating electronic components. Conventional methods for such heat removal include passive radiators and fluid-based active cooling systems (also known as active coolers), to which the electronic components can be physically attached (e.g., mounted on the surface of the radiator or cooler).

[0004] To further enhance the cooling capabilities of at least certain systems and scenarios, the immersion cooling implementations described herein are configured to facilitate the removal of heat from certain electronic components more effectively and efficiently compared to conventional methods. For example, the electronic components described herein may feature electronic parts that form electronic circuitry embedded within a composite carrier (e.g., implemented within or between two carrier boards to completely surround or enclose the electronic circuitry and parts and their connections). The electronic components described herein may include a cooling assembly along with the composite carrier embedding the electronic circuitry, the cooling assembly being configured to perform immersion cooling of the electronic circuitry. For example, by partially surrounding the composite carrier (e.g., which includes two printed circuit boards joined together, with circuitry located between them) and allowing cooling fluid to flow through at least both sides of the carrier, the various electronic parts of the electronic circuitry can be actively cooled in a very efficient and effective manner.

[0005] As an example implementation, an electronic component (e.g., an automotive power inverter assembly for an electric or hybrid vehicle) may include: 1) a first carrier and a second carrier (e.g., each implemented as a printed circuit board or other suitable board or circuit carrier structure), the first carrier being coupled to the second carrier to form a composite carrier; 2) a set of components forming an electronic circuit, the set of components being embedded within the composite carrier and located between the first and second carriers; 3) a plurality of leads integrated with the composite carrier and configured to provide external access to a plurality of circuit nodes of the electronic circuit; and 4) an immersion cooling assembly that at least partially covers the composite carrier and is configured to guide cooling fluid through the composite carrier.

[0006] As another example implementation, a method (e.g., a manufacturing process for manufacturing components or systems such as those described above) may include: 1) integrating a plurality of leads with a first carrier (e.g., a first printed circuit board, or other suitable board or circuit carrier structure); 2) coupling a set of components to the first carrier, the set of components forming an electronic circuit including a plurality of circuit nodes accessible from the outside via the plurality of leads; 3) after coupling the set of components to the first carrier, joining the first carrier to a second carrier (e.g., a second printed circuit board, or other suitable board or circuit carrier structure) to form a composite carrier; and 4) assembling an immersion cooling assembly to at least partially cover the composite carrier, the immersion cooling assembly being configured to guide cooling fluid through the composite carrier.

[0007] As another example implementation, the power inverter assembly may include: 1) a first carrier (e.g., a first printed circuit board) and a second carrier (e.g., a second printed circuit board), the first carrier being coupled to the second carrier to form a composite carrier; 2) a set of components forming a power inverter circuit, the set of components including a plurality of unpackaged semiconductor dies, each of the plurality of unpackaged semiconductor dies realizing a single power transistor, and the set of components being embedded within the composite carrier and located between the first carrier and the second carrier; 3) a plurality of leads integrated with the composite carrier and configured to provide external access to a plurality of circuit nodes of the power inverter circuit; and 4) an immersion cooling assembly configured for use in automotive applications, the immersion cooling assembly at least partially covering the composite carrier and configured to guide cooling fluid flow through the composite carrier.

[0008] Each of the foregoing exemplary embodiments is to be understood as illustrating a type of embodiment consistent with the following description. It should be understood that these examples are not intended to be limiting, and any aspect mentioned above or described herein may be used in conjunction with any embodiment based on the principles described herein. Details of these and other embodiments are set forth in the accompanying drawings and the following specification. Other features will also be apparent from the following specification, drawings, and claims. Attached Figure Description

[0009] Figure 1 Some aspects of an exemplary implementation of an electronic component based on the principles described herein are shown, the electronic component being configured to perform immersion cooling of embedded electronic parts.

[0010] Figures 2A to 2E Different views of an exemplary embodiment of an electronic component according to the principles described herein are shown, the electronic component being configured to perform immersion cooling of embedded electronic parts.

[0011] Figures 3A to 3B In contrast to certain aspects of conventional cooling systems based on the principles described herein, this electronic component is configured to perform immersion cooling of embedded electronic parts.

[0012] Figure 4 An exemplary method for constructing an electronic component according to the principles described herein is shown, the electronic component being configured to perform immersion cooling of embedded electronic parts.

[0013] Figure 5 Illustrative aspects relating to the preparation of a carrier and multiple leads for electronic components are shown, based on the principles described herein.

[0014] Figure 6 This illustrates the coupling of components according to the principles described herein. Figure 5 Examples related to the carrier.

[0015] Figure 7 An exemplary aspect relating to the joining of two carriers to form a composite carrier with embedded electronic circuitry, based on the principles described herein, is shown.

[0016] Figure 8 The usability of the principles described herein is shown. Figure 4 The method is an exemplary aspect of the first type of electronic component manufactured by this method.

[0017] Figure 9 The usability of the principles described herein is shown. Figure 4 An exemplary aspect of the method for manufacturing a second type of electronic component. Detailed Implementation

[0018] Electronic devices and components are configured to operate appropriately within certain temperature parameters. Therefore, passive and / or active temperature control mechanisms can be used to help maintain the temperature within the desired parameters during operation of electronic devices. More specifically, the principles described herein relate to immersion cooling of embedded electronic components (e.g., electronic components forming electronic circuits and simultaneously embedded between two carriers forming a composite carrier). For example, the carriers may be implemented, each free of a printed circuit board or other suitable type of board or circuit carrier structure or substrate (e.g., a directly bonded metal substrate, etc.). Various specific implementations of these principles include electronic assemblies, devices, equipment, and systems, along with the methods, processes, and techniques for their construction.

[0019] Maintaining certain types of electronic devices within a desired temperature range can be particularly challenging. As an example, electronic devices that consume or generate significant amounts of power (e.g., power inverter modules, high-power processors, electronic devices using power field-effect transistors (FETs) and / or other types of power transistors) may tend to heat up significantly during operation and require substantial cooling. Applications and use cases in automotive spaces (e.g., electric vehicles (EVs), hybrid vehicles, etc.) and / or other industrial environments with large machinery may employ high-power electronic devices, which can result in circuits generating substantial amounts of heat.

[0020] As another example, properly cooling electronic devices operating in certain environments (e.g., warm outdoor environments, enclosed environments with limited natural airflow, etc.) can also tend to be challenging. While passive cooling, which involves various types of heat sinks and natural airflow, can be suitable for cooling certain electronic devices, active cooling, which involves the forced passage of gaseous or liquid coolants, can be used in more challenging scenarios.

[0021] Passive heat sinks and active coolers typically operate by being attached to electronic components that often generate significant amounts of heat during operation. For example, one or more such components may be mounted (i.e., physically coupled) to the surface of a heat sink or active cooler, such that heat from the components (e.g., through thermal conduction caused by the physical coupling) is absorbed into the heat sink or active cooler and then dissipated into the atmosphere or elsewhere. Passive heat sinks can operate by having numerous thermally conductive fins, pins, or other elements that provide a large surface area for transferring heat to the ambient air. Similarly, active coolers can operate by using a manifold to pump fluid, which is physically attached to a heat source (e.g., an electronic component), so that the fluid is heated upon contact with the heat source (thus absorbing some of its heat), and then, as the fluid cools, it carries away the heat and dissipates it into the environment or elsewhere. In some cases, passive heat sinks and active coolers may be used in combination to attempt to cool electronic components more effectively.

[0022] However, at least one technical problem with conventional cooling methods is the limitation on how efficiently heat can be transferred from one surface of an electronic component to the cooling system plate (e.g., the surface of a passive radiator or active cooler to which the electronic component is attached). For example, if the bottom of a flat component is mounted on a cooling device, a significant amount of heat may be drawn from the bottom of the component when it heats up, and some heat may radiate from the top (depending on how much heat is generated). This can create a bottleneck in heat transfer that does not allow for the heat dissipation that might be expected. Additionally, even when using a larger cooling system to attempt to draw out and dissipate heat at a higher rate to keep up with the generated heat, another technical challenge related to the size of the cooling system may arise, as it may be desirable to house these electronic components in a relatively small space (e.g., under the hood of a vehicle where the engine and many other components are located, where physical space is extremely valuable).

[0023] At least one technical solution to these technical problems described herein relates to immersion cooling of embedded electronic components. Some circuits do not encapsulate electronic components in a conventional manner (e.g., using expensive substrates and wire bonding to form the circuit, and using molding compounds to seal and protect them, etc.), but can be formed by directly mounting unencapsulated electronic components on a carrier (e.g., a printed circuit board that facilitates the desired connection between components), and then bonding a second carrier to the top of the components to completely embed and protect the circuit between the two carriers. This combination of two carriers (in which the electronic components forming the electronic circuit can be embedded) is referred to herein as a composite carrier. As used herein, various types of circuit carriers (e.g., first carrier, second carrier, composite carrier, etc.) may be referred to as carriers or substrates. As will be described, it should be understood that such carriers can be implemented by substrates (e.g., printed circuit boards, other suitable boards without printed circuit elements, etc.) or by other suitable circuit-carrying structures or substrates (e.g., directly bonded metal substrates, etc.).

[0024] Encapsulating electronic components in this manner (i.e., embedding components within a composite substrate) can offer several technical effects and advantages. For example, at least one technical effect is that the delicate electronic components embedded within the composite substrate are well protected from environmental influences, including from cooling fluids that could corrode the components or otherwise cause circuit malfunctions or problems if the cooling fluids come into direct contact with them. However, in situations where such protection is lacking, the immersion cooling technique described herein involves mounting an immersion cooling assembly around the composite substrate (i.e., such that the immersion cooling assembly at least partially covers the composite substrate (and its embedded circuitry, as described above)). By covering the circuitry in this way, the immersion cooling assembly described herein can guide cooling fluid flow across the composite substrate to more efficiently and effectively absorb the heat generated by the embedded circuitry. In some examples, this covering of the composite substrate allows the cooling fluid to be guided not only across one side of the composite substrate but also simultaneously across the opposite side.

[0025] The technical effects and advantages of allowing cooling fluid to directly contact both sides of a composite substrate covering electronic circuitry can be significant. As an example, heat can be transferred more efficiently to the cooling fluid, which is brought into direct contact with the composite substrate, compared to a cooling system where heat is conventionally transferred from electronic components to a surface-mounted cooling system (e.g., via pads, which has its own drawbacks, as described and illustrated in more detail below). This means the circuitry can be cooled more efficiently, potentially enabling the use of more compact, space-saving cooling packages (e.g., immersion cooling assemblies configured to produce the same cooling effect as conventional active coolers, but occupying less space).

[0026] Other technical effects and benefits of the immersion cooling principle described herein include: the elimination of the need for solder to couple electronic circuitry to the immersion cooling system (because the system encapsulates the composite substrate and guides cooling fluid directly across the board (e.g., in some examples, including both sides of the board). Furthermore, immersion cooling assemblies can be advantageous because they allow for compact cooling solutions and reduced costs, as certain manufacturing processes can be omitted and / or otherwise simplified (e.g., eliminating potentially expensive substrates; omitting assembly steps such as die attachment, wire bonding, molding, trimming, and finishing for the package, etc.). Power savings resulting from improved cooling efficiency and effectiveness can also be provided by the immersion cooling principle described herein, as will become apparent in the following description.

[0027] While the principles described herein can be advantageous in a variety of environments, applications, and use cases, specific examples of power inverter components (e.g., those configurable for use in automotive environments, such as within electric vehicles) will be used as operational examples throughout the following description. As will be described, power inverters can be useful in various environments, such as converting direct current (DC) power from the battery of an electric vehicle into alternating current (AC) power that can be used to perform the mechanical work involved in propelling the vehicle. Therefore, and as will be described in more detail below, the automotive power inverter device described herein can apply immersion cooling principles to efficiently remove heat from embedded electronic components and provide the benefits described herein.

[0028] Various specific embodiments will now be described in more detail with reference to the accompanying drawings. It should be understood that the specific embodiments described below are provided as non-limiting examples and are applicable to a wide range of situations. Additionally, it should be understood that other specific embodiments not expressly described herein may also fall within the scope of the claims set forth below. Based on the principles described herein, immersion cooling of embedded electronic components can produce any or all of the technical effects mentioned above, as well as various additional technical benefits that will be described below and / or become apparent.

[0029] Figure 1 Exemplary aspects of a specific implementation of an electronic component 100 according to the principles described herein, the electronic component being configured to perform immersion cooling of embedded electronic components, are shown. More specifically, Figure 1 The electronic assembly 100, shown in an exploded view on the left and an assembled side view on the right, includes various components that collectively perform both: 1) the function of a specific electronic circuit (e.g., a power inverter or other suitable circuit); and 2) the function of cooling the electronic circuit during operation (i.e., dissipating heat generated by the circuit). As shown, these components of the electronic assembly 100 include: a first carrier plate 102-1 and a second carrier plate 102-2, which are joined to form a composite carrier plate 102; a set of components 104 that form the electronic circuit and include electrical connections 106 provided by (e.g., integrated with) the first carrier plate 102-1; a plurality of leads 108; and an immersion cooling assembly 110 (including at least a first portion 110-1 and a second portion 110-2, which are combined to form the immersion cooling assembly 110).

[0030] As shown in assembly steps 112-1 and 112-2 regarding the exploded view, various components of electronic assembly 100 can be assembled in multiple operations (such operations will be described in more detail below with reference to methods and processes for constructing electronic assemblies such as electronic assembly 100). More specifically, step 112-1 shows how carrier plates 102-1 and 102-2 can be joined together to form composite carrier plate 102, within which a set of components 104 forming electronic circuitry are embedded. Then, step 112-2 shows how portions 110-1 and 110-2 of the immersion cooling assembly 110 can be assembled around composite carrier plate 102 to at least partially cover carrier plate 102 and provide ports (e.g., including at least one port 114 and...). Figure 1 (Another port not shown in the view) is used to introduce cooling fluid into the composite carrier 102 for the purpose of cooling the electronic circuitry. Each of these components will now be described in more detail.

[0031] Composite carrier 102 illustrates a composite when the first carrier 102-1 and the second carrier 102-2 are joined together at step 112-1. Each of the carriers 102-1 and 102-2 can be implemented in any suitable manner to provide a platform on which electronic circuitry can be built (e.g., by means of components carrying circuitry and providing structural support for those components, by means of providing electrical connections between some or all of the components, etc.). As an example, the first carrier can be a first printed circuit board (PCB), and the second carrier can be a second PCB. In this case, the electronic circuitry may include various components coupled to the PCB (e.g., specifically coupled to the first PCB), and one or more electrical connections, such as electrical connection 106 provided by the PCB (e.g., by the first PCB as shown). For example, these electrical connections (including electrical connection 106) may each include pads (e.g., first pads and second pads) and traces connecting the pads (e.g., traces connecting the first and second pads within the first PCB).

[0032] By constructing a circuit on a first PCB and then encasing the circuit between the first PCB (i.e., the first carrier board 102-1) and the second PCB (i.e., the second carrier board 102-2), a set of components 104 constituting the circuit can be protected from moisture (e.g., cooling fluid, which is guided to flow across the surface of the composite carrier board 102) and other environmental factors that could damage or interfere with the components if they were not encased and protected by the PCB. For example, instead of flowing through isolation channels or chambers within the immersion cooling assembly 110 (e.g., compartments provided by the cooling assembly and configured to prevent direct contact of the fluid with the PCB), the fluid can be guided to directly contact the composite carrier board 102 to facilitate (when the cooling fluid is pumped through the cooling assembly) the efficient transfer of heat from the circuit, through the carrier board (e.g., the PCB), to the cooling fluid.

[0033] In other examples, other types of carrier boards may be used to replace or in conjunction with the PCB described above. For example, some or all of the components in component 104 may be disposed on a substrate (such as a direct bonded metal (DBM) substrate) configured to replace the PCB or to support components in addition to the PCB (e.g., a DBM substrate, which is part of a device package of components that are then disposed on the PCB).

[0034] In some embodiments, a direct-bonded metal (DBM) substrate may be used, which includes an insulating layer disposed between a first metal layer and a second metal layer. For example, the insulating layer may be a ceramic layer. In some embodiments, the insulating layer may be or may include, for example, a ceramic material, such as alumina (Al2O3) or aluminum nitride (AlN).

[0035] In some specific implementations, the DBM substrate can be formed by bonding one or more metal layers (e.g., a first metal layer, a second metal layer, etc.) to an insulating layer (e.g., a ceramic layer, etc.). For example, a high-temperature process can be used to bond one or more metal layers to the insulating layer.

[0036] In some embodiments, the first metal layer and / or the second metal layer may be configured to function as a heat sink. In some embodiments, the first metal layer and / or the second metal layer may be coupled to a heat sink. In some embodiments, at least a portion of one or more of the first metal layer or the second metal layer may be exposed by a molding material.

[0037] In some embodiments, the first metal layer and / or the second metal layer may be or may include a patterned metal layer, which includes one or more conductive traces. In some embodiments, the first metal layer and / or the second metal layer may be or may include a patterned layer configured to form one or more electrical circuits, one or more conductive blind vias and / or through-holes, etc.

[0038] In some embodiments, the DBM substrate may be or may include a direct-bonded copper (DBC) substrate (e.g., a DBM having a copper metal layer). In some embodiments, such as in a DBC substrate embodiment, the first metal layer and / or the second metal layer may be implemented as copper layers.

[0039] In some implementations, one or more semiconductor dies may be embedded within a layer (rather than being surface-mounted). For example, as further described and illustrated herein, one or more semiconductor dies may be disposed within a recess or cavity of a layer (e.g., a substrate, printed circuit board, conductive layer, insulating layer, etc.).

[0040] For illustration, a set of components 104 is shown applied to the first carrier 102-1 prior to the bonding of the first carrier 102-1 and the second carrier 102-2, such that when the composite carrier 102 is fully assembled (i.e., by performing step 112-1), the set of components is ultimately embedded within the composite carrier 102 (i.e., embedded between the first and second carriers). The set of components 104 may include any suitable electronic components, conductive components, or other elements that can be used to form an electronic circuit. Several example components that may be included within the set of components 104 will now be described.

[0041] In some specific implementations, a set of components 104 may include at least one unpackaged semiconductor die. For example, in one example, the unpackaged semiconductor die may implement an integrated circuit that includes multiple transistors (e.g., a processor or other such integrated circuit that may include a large number of transistors implementing logic or mixed signal processing, etc.).

[0042] As another example, unpackaged semiconductor dies can be used to implement one or more power transistors (e.g., a single power transistor) for manipulating current to provide power for doing work (e.g., current used in a motor of an electric vehicle, etc.). For example, these types of power transistors can be implemented using power metal-oxide-semiconductor field-effect transistors (MOSFETs) made using silicon (Si) semiconductors, silicon carbide (SiC) semiconductors, or gallium nitride (GaN) semiconductors. In some embodiments, a set of components 104 may include multiple unpackaged semiconductor dies. For example, multiple power FETs (e.g., power MOSFETs) can be used to implement other circuitry used in half-bridge, full-bridge, or automotive power inverter devices. In some embodiments involving multiple semiconductor dies, the dies may be identical or may be manufactured using at least the same type of semiconductor (e.g., all semiconductor dies may be manufactured using silicon (Si) semiconductors, all semiconductor dies may be manufactured using silicon carbide (SiC) semiconductors, etc.). In other embodiments involving multiple semiconductor dies, hybrid dies manufactured using different semiconductors may be used. For example, a set of components 104 may include both a first semiconductor die made using silicon (Si) semiconductors and a second semiconductor die made using silicon carbide (SiC) semiconductors.

[0043] In some embodiments, one or more semiconductor dies (e.g., one or more semiconductor components) included in a set of components 104 may be or may include power semiconductor dies. In some embodiments, the semiconductor dies may implement one or more transistors, or a portion thereof, of a transistor or transistor-based circuit. For example, one or more of the following may be implemented on a semiconductor die: a metal-oxide-semiconductor field-effect transistor (MOSFET) device, an insulated-gate bipolar transistor (IGBT), an integrated circuit (IC), an inverter, a power conversion circuit, a bridge circuit, a fast recovery diode (FRD), or a diode, etc. In some embodiments, components implemented (or partially implemented) by one or more semiconductor dies may be used in or included within an electric vehicle (EV).

[0044] More than one semiconductor die may be included in the specific embodiments described herein. In some specific embodiments involving more than one semiconductor die, different semiconductor substrates (e.g., silicon carbide (SiC) substrates, silicon (Si) substrates, gallium nitride (GaN) substrates, etc.) may be used to fabricate different semiconductor dies. In other words, for example, different semiconductor dies may be fabricated on different semiconductor wafers or materials. This may be referred to as a hybrid die configuration. For example, a SiC substrate may be used to form a first semiconductor die, and a silicon substrate may be used to form a second semiconductor die (separate from the first semiconductor die). As another example, a SiC substrate may be used to fabricate an IGBT, while a silicon substrate may be used to fabricate a controller.

[0045] In some exemplary embodiments, the package (e.g., a power module) may be a hybrid device package comprising one or more semiconductor dies integrated onto a uniform electronic power substrate (e.g., a ceramic substrate, DBM or DBC substrate, AMB substrate, elastomeric substrate, organic substrate, phenolic substrate, or PCB / FR-4 substrate). In some embodiments, multiple semiconductor devices (e.g., which may be fabricated on the same substrate, such as a SiC substrate) are suitable for high-power applications.

[0046] Among the set of components 104 included in electronic assembly 100, one or more conductive elements configured to form electrical connections between other components may be included. For example, a first semiconductor die may be connected to a second semiconductor die by means of an electrical connection (e.g., wire bonding, clamps, etc.) extending directly from the first die to the second die, or by means of pads or traces formed in a first conductive layer (e.g., a metal layer) of an electronic power substrate. A first semiconductor die among a plurality of semiconductor dies may also be connected to lead frame posts by means of electrical connections (such as wire bonding or clamps). In other words, the set of components 104 may include one or more conductive clamps, wire bonds, or other conductive elements configured to electrically couple semiconductor dies (e.g., unpackaged semiconductor dies) to each other and / or to other components within the electronic circuitry.

[0047] One or more wire bonds (which may be included in at least some of the embodiments described herein) may be replaced by other types of conductive elements. For example, in some embodiments, one or more wire bonds may be replaced by conductive clips. Conductive clips may be coupled to another component (e.g., attachment pads, lead frames, semiconductor dies, etc.) using, for example, solder (e.g., soldering process), sintering coupling (e.g., sintering process), or welding. In some embodiments, one or more wire bonds and / or conductive clips may be used as input and / or output power terminals, signal terminals, power terminals, or other suitable terminals.

[0048] A set of components 104 can be connected to conductive elements (e.g., electrical clips or wire bonding; pads on a PCB, DBM substrate, or other suitable carrier) using any suitable electrical connection or connector applicable to a particular implementation. For example, soldering, sintering, bonding mechanisms, and / or other suitable methods of connecting electronic components can be used.

[0049] In some specific implementations, welding can be or may include a process of joining two surfaces (e.g., metal surfaces) together using molten filler metal (e.g., metal alloys, tin (Sn), lead (Pb), silver (Ag), copper (Cu)) (which may be referred to as solder or welding material).

[0050] In some embodiments, sintering can be or may include a process of fusing particles together into a solid block by using, for example, a combination of pressure and / or heat without melting the material. In some embodiments, sintering may include agglomerating materials (e.g., powdered sintering materials) into a solid or porous block without liquefaction by heating the material (and, in some cases, compressing the material). In some embodiments, materials that can be used for sintering include metals such as silver (Ag), copper (Cu), and / or metal alloys. In some embodiments, the sintered bond may have desired electrical and / or thermal conductivity, durability, and a relatively high melting temperature.

[0051] In some specific implementations, one or more components of the components described herein may be coupled using materials such as, for example, welding materials, sintering materials (e.g., silver, copper) and / or other metal-to-metal bonding materials.

[0052] In some specific implementations, coupling of components may be performed using processes such as welding, sintering (e.g., silver sintering, copper sintering) and / or other metal-to-metal bonding processes.

[0053] Electronic circuit packaging typically includes applying a molding compound (e.g., a molding material or compound, encapsulation material) around the circuit to protect it using this non-conductive layer / material. For example, the molding compound can be a non-conductive material formed (applied, etc.) using a transfer molding process or a compression molding process. The molding material can be or includes organic materials (e.g., polymers or plastic materials such as epoxy resins, polysiloxanes, phenolic resins, etc.), inorganic materials (e.g., non-conductive ceramics or conductive metal materials, etc.), and / or other suitable materials as appropriate for a particular implementation. In some implementations, the molding compound may include a separate plastic housing that is included within a semiconductor device assembly.

[0054] However, in some specific implementations, these molding techniques are suitable for, for example... Figure 1Components such as the electronic component 100 shown may not be necessary. This is because a set of components 104 can be completely protected and covered by the composite carrier 102 (i.e., by bonding the first carrier 102-1 to the second carrier 102-2). In other embodiments, certain molding techniques (e.g., for the individual components included in a set of components 104) may still be employed according to the principles described herein.

[0055] Multiple leads 108 may be integrated with the composite substrate 102 and may be configured to provide external access to multiple circuit nodes of the electronic circuitry. For example, different nodes of the electronic circuitry (such as pads for unpackaged semiconductor dies), nodes associated with certain conductive components (such as electrical clips or wires, pads, and / or vias of the PCBs implementing the first substrate 102-1 and / or the second substrate 102-2), etc., may be exposed to external circuitry via leads 108 (which connect to the components and extend out of the composite substrate 102, as shown).

[0056] In some examples, lead 108 may be constructed or added to electronic component 100 as part of a lead frame. For example, although referred to as a lead frame in at least some parts of this specific embodiment, the lead frame described herein may include any type of conductive portion of the package (e.g., conductive portion, conductive terminal, etc.) that provides external connection points from the package. Thus, the lead frame may be referred to as a conductive portion of the package.

[0057] In some embodiments, one or more portions of the leadframe may be coupled to pads (e.g., bonding pads) located on at least a portion of a DBM substrate, PCB, or another suitable carrier described herein. The semiconductor device package described herein may include multiple signal terminals. These signal terminals may be power terminals, input signal terminals, output signal terminals, etc. In some embodiments, multiple signal terminals may be included within the leadframe. In some embodiments, the leadframe may include any type of conductive portion of the package (e.g., conductive portion, conductive terminal) that provides external connection points from the package. Thus, the leadframe may be referred to as a conductive portion of a package or assembly. In some embodiments, one or more portions of the leadframe may be coupled to pads (e.g., bonding pads) located on at least a portion of a DBM substrate and / or a semiconductor die.

[0058] The immersion cooling assembly 110 may be assembled around the fully assembled composite carrier plate 102 (in which a set of components 104 of electronic circuitry are fully embedded) to at least partially cover the composite carrier plate 102. Additionally, as shown in port 114, the immersion cooling assembly 110 may include an inlet port (for allowing fluid to flow in) and an outlet port (for releasing fluid). Figure 1 Only one port (port 114) is shown. The immersion cooling assembly 110 can be configured to guide the cooling fluid through the composite carrier 102 as cooling fluid is pumped into the inlet port and simultaneously released and circulated out of the outlet port. In this way, when the electronic circuitry generates heat, the cooling fluid can draw heat away from the composite carrier 102, which would otherwise pose a problem for the electronic assembly 100 if it were not drawn away and dissipated.

[0059] Although Figure 1 Unless explicitly stated otherwise, it should be understood that spacer materials may be used within electronic components 100, such as between respective carriers 102-1 and 102-2 (when they are bonded together), between the immersion cooling assembly 110 and the composite carrier 102, or elsewhere. In some embodiments, spacer materials may be included between certain elements of the device, such as between the lead frame and the substrate, between the semiconductor die and the substrate, or between the device and the substrate. Such spacer materials may be or may include epoxy resins, polysiloxane adhesives, conductive materials, non-conductive materials, organic materials, semiconductor materials, metal alloys, metal foams, or phase change materials, etc.

[0060] In some implementations, a module (e.g., a device including semiconductor devices within a package) may be included in another module. A module may be referred to as a package. For example, one or more modules may be one or more sub-modules included within another module. In other words, a first module may be included as a sub-module within a second module. More specifically, reference is made to modules such as those implemented by electronic component 100, which may act as sub-modules of larger modules (such as circuits, systems, or devices employing electronic component 100) and may include multiple instances of electronic component 100.

[0061] As mentioned above, a specific application of an electronic component (such as electronic component 100) can be used in a power inverter assembly (e.g., a power inverter assembly configured for use in an automotive application). For example, in this type of specific implementation, the power inverter assembly may include a first printed circuit board (PCB) and a second PCB that respectively implement a first carrier 102-1 and a second carrier 102-2. The first PCB may be bonded to the second PCB to form a composite PCB that implements the composite carrier 102. The power inverter assembly may also include a set of components forming a power inverter circuit. The set of components may implement a set of components 104 and may include a plurality of unpackaged semiconductor dies, each of which implements a single power transistor. The set of components may be embedded within the composite PCB between the first PCB and the second PCB, as per [reference to...]. Figure 1 As described for component 104.

[0062] In this example, the power inverter assembly may also include multiple leads integrated with the composite PCB and configured to provide external access to multiple circuit nodes of the power inverter circuitry. These multiple leads may implement the multiple leads 108 described above for this example. The power inverter assembly may also include an immersion cooling assembly, which implements immersion cooling assembly 110 and is specifically configured in this example (e.g., by virtue of its shape, the properties of its material, etc.) for use in automotive applications. The immersion cooling assembly may at least partially cover the composite PCB and may be configured to guide cooling fluid flow through the composite PCB.

[0063] For example, Figures 2A to 2E An exemplary embodiment of a power inverter assembly is shown, as described above, which implements electronic component 100 and is configured to perform immersion cooling of embedded electronic components in the context of an automotive power inverter. Figures 2A to 2E In this document, example power inverter components are shown from various perspectives to illustrate various aspects of components based on the principles described herein. While this specific embodiment is described as elements implementing electronic component 100 in a particular manner (e.g., where the carrier board is implemented by a PCB, the semiconductor die by a single transistor die, the electronic circuitry by power inverter circuitry, etc.), it should be understood that these same elements may be implemented in other ways for other embodiments. For example, the carrier board may be implemented by substrates or carriers other than PCBs, the semiconductor die by components other than single transistors, the electronic circuitry by circuitry configured to perform functions other than those of a power inverter, and so on.

[0064] Figure 2A A front view 200-A of a fully assembled power inverter assembly is shown (corresponding to the assembled electronic assembly 100 described above). This power inverter assembly is referred to herein as power inverter assembly 200, and will be... Figures 2A to 2E The various views 200-A to 200-E are shown in the diagram.

[0065] Figure 2A The corresponding reference numerals are used in the following and other figures to indicate corresponding elements of the components. For example, front view 200-A shows that the power inverter assembly 200 includes a composite PCB 202, which corresponds to the components related to the following figures: Figure 1The composite carrier 102 described, and similarly in other examples below, uses reference numerals ending with "02" (or "02-1", "02-2", etc., when only a portion of the composite carrier is mentioned) to indicate a specific implementation of the carrier (such as a PCB). The power inverter assembly 200 will be understood as incorporating a set of components 204 (corresponding to a set of components 104) and electrical connections (corresponding to electrical connections 106) within the composite PCB 202. These components are not explicitly illustrated in front view 200-A because they are obscured by other components of the assembly, but will be depicted in other views below. However, front view 200-A of the power inverter assembly 200 does show a plurality of leads 208 (corresponding to the plurality of leads 108 described above) and an assembled immersion cooling assembly 210 (corresponding to the immersion cooling assembly 110 of the electronic assembly 100).

[0066] The composite PCB 202 is shown to include various vias to allow access to certain leads 208 located on the top of the component. These leads can be used for certain control signals and / or other relatively low-power signaling (e.g., gate signals, sensor signals, etc.) that may be used in a particular implementation of the power inverter circuitry. Different implementations may access these leads in different ways (e.g., directly through the leads, through an insert board, etc., which connects to the vias via press-fit pins and press-fit sockets), as will be described and illustrated in more detail below. Additional (larger) leads 208 are also shown to be included at the bottom of the component. For the power inverter circuitry implementation, these leads 208 will be understood to represent leads configured to handle larger voltages and / or currents associated with the power inverter function of the circuitry. For example, in one example, these pins may include a positive DC input lead (DC+), a negative DC (or ground) input lead (DC-), and an AC output lead (AC).

[0067] Along with the various elements directly corresponding to those described above with respect to electronic component 100, power inverter assembly 200 is shown to also include other elements. For example, power inverter assembly 200 is shown to include an input port 214-1 and an output port 214-2 into which cooling fluid 216 may be introduced and out of which cooling fluid 216 may be discharged. As will be further described and illustrated below with respect to other views of power inverter assembly 200, inlet port 214-1 may be configured to allow cooling fluid 216 to flow in (e.g., when the fluid is at a relatively low temperature), and outlet port 214-2 may be configured to release cooling fluid 216 (e.g., after the fluid has absorbed heat from the power inverter circuitry of composite PCB 202 and is therefore at a relatively high temperature).

[0068] Figure 2BPerspective view 200-B of the power inverter assembly 200 is shown. The same components described above with respect to front view 200-A are labeled in perspective view 200-B, although some additional details are visible in the perspective view. For example, the cylindrical nature of ports 214-1 and 214-2 is more apparent in perspective view 200-B as cooling fluid 216 circulates through; the example thickness of the composite PCB 202 and leads 208 is illustrated more clearly; additional details related to the construction and assembly of the immersion cooling assembly 210 (e.g., screws and other fastening mechanisms, etc.) are shown, and so on.

[0069] Figure 2C A bottom view 200-C of the power inverter assembly 200 is shown (i.e., looking upwards at the three leads 208 shown as extending from the bottom of the composite PCB 202, when the PCB is oriented in views 200-A and 200-B). The same components as those marked in the front views 200-A and perspective views 200-B are again labeled in bottom view 200-C, although bottom view 200-C further shows how fluid 216 can be directed across both sides of the composite PCB 202 in some specific embodiments. More specifically, as shown, an immersion cooling assembly 210 can be configured to direct some of the cooling fluid 216 (in...) Figure 2C Cooling fluid 216-1 flows over the first surface of the composite carrier (e.g., in this example, over the first surface of the composite PCB 202), while guiding other cooling fluids 216 (in... Figure 2C The cooling fluid (labeled as cooling fluid 216-2) flows over the second surface of the composite carrier that is opposite to the first surface (e.g., in this example, over the opposite surface of the composite PCB 202).

[0070] By guiding cooling fluid across both surfaces of the carrier board, as shown in the figure, the power inverter assembly 200 can cool the circuitry more effectively and efficiently compared to guiding cooling fluid across only a single surface. As described, since the carrier board (e.g., in this example, composite PCB 202) incorporates and protects the electronic circuitry (e.g., the power inverter circuitry) that serves as the primary source of heat to be removed / dissipated, an immersion cooling assembly configured to draw heat away from both sides of the board while generating heat during operation can be highly effective and offers the various advantages described herein.

[0071] Figure 2DA side view 200-D of the power inverter assembly 200 is shown. In side view 200-D, the same elements as those labeled and described above with respect to the other views are again labeled, provided they are not obscured, including a specific port 214 that may represent either port 214-1 or 214-2 (depending on which side is being viewed). Some additional details are more clearly visible from side view 200-D than in the other views.

[0072] Figure 2E A cross-sectional view 200-E of the power inverter assembly 200 is shown. Together with other elements illustrated and described with respect to the other views of the power inverter assembly 200, cross-sectional view 200-E further shows the aforementioned set of components 204 (corresponding to the set of components 104 described with respect to the electronic assembly 100), which can be configured to form the power inverter circuitry. Although illustrated in cross-sectional view 200-E, it should be understood that components 204 may be embedded within a composite PCB 202 (e.g., between the first and second PCBs) to be protected from cooling fluid that can be guided through both sides of the composite PCB 202 by the immersion cooling assembly 210.

[0073] A set of components 204 may include one or more semiconductor dies, one or more conductive elements (e.g., wires, clamps, etc.), other discrete components (e.g., capacitors, resistors, etc.), and / or any other electronic components or other circuit elements that may be used in a particular implementation. As mentioned above with respect to set of components 104, set of components 204 may include at least one unpackaged semiconductor die, such as a die that implements a single power transistor (e.g., a power MOSFET made using silicon (Si) semiconductor or silicon carbide (SiC) semiconductor). Multiple such dies (i.e., multiple power transistors) may be interconnected within a circuit formed by set of components 204 to establish a half-bridge circuit, a full-bridge circuit, or other suitable power inverter circuit. Set of components 204 may also include at least one conductive clamp configured to electrically couple the unpackaged semiconductor dies to each other (and / or to other components) within the power inverter circuit. In some specific implementations, a hybrid die configuration may be used (e.g., a set of components 204 may include a plurality of unpackaged semiconductor dies, including a first semiconductor die made using silicon (Si) semiconductors and a second semiconductor die made using silicon carbide (SiC) semiconductors).

[0074] Figures 3A to 3BIn contrast to certain aspects of conventional cooling systems for electronic components based on the principles described herein, this electronic component is configured to perform immersion cooling of embedded electronic components. More specifically, comparison 320 is shown as an example of certain differences between conventional cooling system 322 and power inverter assembly 200 proposed as utilizing the novel principles described herein.

[0075] exist Figure 3A and Figure 3B Both are shown in exploded views of their respective cooling systems. For example, in the exploded view of conventional cooling system 322, multiple electronic devices 324 are shown, each physically coupled to the surface of an active cooler 328 via corresponding pads 325 and cover plates 326. As shown, the active cooler 328 includes ports (similar to ports 214-1 and 214-2 of the power inverter assembly 200) into which cooling fluid can be introduced and removed. Despite these similarities, a point of contrast illustrated by comparison 320 is that the active cooler 328 is not an immersion cooling assembly like immersion cooling assembly 210, but is only able to absorb heat from one surface (rather than two surfaces) of the multiple electronic devices 324. As mentioned, this may be less efficient and effective than absorbing heat from both sides simultaneously, as immersion cooling assembly 210 is shown to be able to do so (since each port is shown to be associated with two fluid paths, which are associated with the top and bottom surfaces of the composite PCB 202).

[0076] As another point of comparison illustrated by Comparison 320, a close-up view of one of the pads in corresponding pad 325 is shown. Figure 3A The bottom is shown as an example of how small voids and defects in the solder layer can lead to lower thermal performance by hindering heat transfer from the surfaces of the multiple electronic devices 324 to the active cooler 328. Conversely, as mentioned above and as... Figure 3B As shown in the exploded view, the power inverter assembly 200 does not rely on pads to couple the first portion 210-1 and the second portion 210-2 of the immersion cooling assembly 210 to the composite PCB 202. Therefore, the power inverter assembly 200 avoids the undesirable voids and heat transfer suppression that such pads might introduce. The immersion nature of the assembly and the fact that the composite PCB 202 tightly encloses the assembly eliminates any need for a solder layer and the potential thermal problems that might be introduced therefrom.

[0077] As another point of comparison illustrated by Comparison 320, the fluid flowing through the active cooler 328 is separated from the electronic device 324 via the top surface of the active cooler 328 and via the corresponding pads 325. Conversely, as described, the cooling fluid guided through the immersion cooling assembly 210 can directly contact the composite PCB 202. This is because the PCB itself can be configured to act as a highly efficient heat conductor (e.g., superior to...). Figure 3A The illustrated pads 325 have gaps and defects, and since the PCB can incorporate other unencapsulated components (e.g., semiconductor dies, etc.) that do not otherwise impede heat transfer, the transfer of heat to the cooling fluid can be very efficient and effective in the case of the power inverter assembly 200 compared to the case of the conventional cooling system 322.

[0078] Figure 4 An exemplary method 430 for constructing an electronic component according to the principles described herein is shown, the electronic component being configured to perform immersion cooling of embedded electronic parts. For example, electronic components, such as a specific embodiment of electronic component 100 (e.g., power inverter component 200 or another suitable embodiment), can be assembled or constructed based on the steps of method 430. Although Figure 4 The exemplary operations 431 to 439 according to one specific implementation are shown, but other specific implementations of method 430 may omit, add, reorder, and / or modify them. Figure 4 Any of the operations shown in operations 431 to 439. In some examples, Figure 4 As shown or about Figure 4 The multiple operations described may be performed concurrently (e.g., in parallel) with each other, rather than sequentially as illustrated and / or described.

[0079] Each of operations 431 through 439 will now be described in more detail. (As in...) Figure 4 The label attached to certain operations indicates (e.g., "see..."). Figure 5 "See also" Figure 6 (etc.), some aspects of some operations in the illustrative method 430 are in Figures 5 to 9 Further examples and references are provided below. Figures 5 to 9 Describe it.

[0080] At operation 431, a first carrier and a second carrier can be prepared for use in an electronic assembly. For example, the first carrier and the second carrier (also referred to as carriers) may correspond to first carrier 102-1 and second carrier 102-2, respectively, and can be implemented from any carrier described herein (e.g., PCB, DBM substrate, etc.). At operation 431, the first and second carriers can be prepared by constructing in any suitable manner or otherwise obtaining them (e.g., by procuring prefabricated PCBs from a supplier entity). In some embodiments, the carrier can be implemented from a PCB designed to incorporate electrical connections (configured to interconnect various components disposed on (between) the PCB) to form an electronic circuit. Designs for such PCBs can be manufactured by printing (e.g., depositing, etching, etc.) various conductive layers (e.g., copper layers) onto insulating (e.g., dielectric) material layers to form the PCB. In some cases, the boards can be procured by providing designs for the first carrier and / or the second carrier to a supplier (e.g., a board manufacturing entity) that offers services including manufacturing carriers to order.

[0081] Although the preparation of two carrier boards is shown as being included as part of operation 431, it should be understood that the first and second carrier boards may be manufactured separately and / or at different times. Additionally, it should be understood that the two carrier boards may be identical or may have significant differences. For example, the first carrier board may include various pads, traces, and other conductive elements to provide electrical connections for components to be applied to the first carrier board, while the second carrier board may not include these elements. On the other hand, the second carrier board may have different conductive elements to provide different electrical connections. Additionally, either or both of the first and second carrier boards may include vias, as will be described and illustrated in more detail below.

[0082] At operation 432, multiple leads may be integrated with the first carrier. For example, a set of leads, as described with respect to leads 108 and / or 208, may be included as part of the carrier, coupled to the carrier, or otherwise integrated as part of the carrier. Additionally, as part of operation 432 or operation 431, multiple vias configured to provide access to the multiple leads may be formed within the first and / or second carriers. For an illustration of preparing a carrier having integrated leads and vias providing access to the leads, refer to... Figure 5 .

[0083] As shown in the figure Figure 5 Illustrative aspects related to the preparation of a first and a second carrier board, which have multiple leads for an electronic assembly constructed by method 430, are depicted. Figure 5In this context, carrier board 502-1 represents a first PCB that can be prepared (e.g., constructed, designed, procured, etc.) to serve as a first carrier board, while carrier board 502-2 represents a second PCB that can be similarly prepared (e.g., constructed, ordered, and obtained, etc.) to serve as a second carrier board. Figure 5 Both the front view (left side in the attached figure) and the side view (right side in the attached figure) show the two carrier plates.

[0084] Figure 5 Multiple leads 508 integrated with the carrier board 502-1 are shown. These leads are located on the top and bottom of the board and will be understood as similar to leads 208 described above. Vias, indicated by small circles in the front view and narrow channels in the side view, are also shown to provide access to some of the leads 508. Additionally, certain electrical connections 506 (e.g., conductive power pads applied to the top of the board's insulating layer, etc.) are shown included (and selectively coupled to some leads 508) to prepare for coupling components to the carrier board. These power pads may be configured for semiconductor dies to be mounted and act as current paths for signals with high current. Conductive inlays (e.g., copper inlays) may be included within the board and used to implement some or all of the leads 508, as well as other signal pins, current paths, or power terminals, etc.

[0085] Figure 5 Carrier 502-2 is also shown, but as mentioned above, in some cases, this carrier may be constructed separately from carrier 502-1 (e.g., ordered at different times, from different suppliers, etc.). Carrier 502-2 is also shown to include vias configured to provide access (through the second carrier) to leads 508 integrated with the first carrier (i.e., carrier 502-1). Additionally or alternatively, certain gate and sensor paths (e.g., traces) may be integrated into the second carrier, which differs from the power paths incorporated into the first carrier. In this example, a concave region of carrier 502-2 is shown to be included to facilitate the accommodation of components coupled to carrier 502-1 (as will be described and illustrated in more detail below) when the two carriers 502-1 and 502-2 are joined together as a single composite carrier. In some examples, spacer or filler material may be included between the carriers when joined together to promote more efficient heat transfer, less component vibration, etc.

[0086] Back Figure 4At operation 433, a set of components may be coupled to a first carrier board to form (e.g., possibly connected to electrical connections provided at least by the first carrier board) an electronic circuit. The electronic circuit may include multiple circuit nodes capable of external access via multiple leads and / or vias prepared at operation 431 and integrated into the carrier board at operation 432. The components coupled to the first carrier board at operation 433 may include any of the components described herein. As an example, a set of components may include an unpackaged semiconductor die implementing a single power transistor (e.g., a power FET, etc.), which is combined with electrical clips or other conductive elements to form a power inverter circuit such as those described.

[0087] For example, Figure 6 This document illustrates certain aspects related to coupling components to carrier plate 502-1, based on the principles described herein. For example... Figure 6 As shown, the same carrier 502-1, electrical connection 506, and lead 508 described above remain, while certain components 504 have been added to the assembly. These components 504 include an unpackaged semiconductor die 542 directly coupled to the power pad (i.e., electrical connection 506), and an electrical clip 544 coupled between the pad of the semiconductor die and the power pad of the electrical connection 506 (thus forming an additional electrical connection). As shown in the side view, the components coupled to the first carrier 502-1 at operation 433 alter the contour of the carrier 502-1 so that the concave region mentioned above included in the carrier 502-2 facilitates the accommodating of the components while still sealing the circuitry from the external environment (e.g., including sealing it from cooling fluids that can be guided through the composite carrier).

[0088] Back Figure 4 At operation 434, the first carrier may be coupled to the second carrier to form a composite carrier. For example, operation 434 may be performed after a set of components is coupled to the first carrier at operation 433, such that when the boards are coupled and the composite carrier is formed, the electronic circuitry (including all components, some of component 504) is embedded within the composite carrier (i.e., in the concave region between the two carriers).

[0089] For example, Figure 7 Exemplary aspects related to bonding two carrier boards to form a composite carrier board with embedded electronic circuitry, based on the principles described herein, are shown. More specifically, Figure 7A composite carrier 502 with protruding leads 508 is shown, formed when carriers 502-1 and 502-2 are joined, as shown in the side view on the right side of the figure. This side view is to be understood as showing a cross-sectional view so that the embedded electronic components are visible. However, it should be understood that without the cross-section, these components can be fully embedded and sealed (e.g., protected from external environmental influences) between the carriers. Joining the first and second carriers to form the composite carrier 502 may involve: heating the plates, placing the plates under pressure, reflowing or otherwise activating the bonding material between the plates (e.g., solder, sintering material, epoxy resin, etc.) and / or other suitable bonding techniques.

[0090] Back Figure 4 Operation 435 represents a decision point in method 430 where it is determined whether an additional carrier board (referred to herein as an insert board) may be needed for the component being constructed. For some applications, an insert board (e.g., an additional PCB, etc.) connected to various leads (e.g., via pins and vias, which will be described in more detail below) can help expose the circuitry to external components used to control and / or be controlled by the circuitry. For example, if a legacy component is configured to be connected to another device by being laid flat on the device, the presence of an immersion cooling assembly covering at least a portion of a composite carrier board may interfere with the board laid flat on the device and / or otherwise desired coupled to other components. In such cases, an insert board that remains outside the immersion cooling assembly while being electrically coupled to the composite carrier board (which is inside the immersion cooling assembly) can be used to facilitate various physical and / or electrical couplings of the component. In these cases, operation 435 may resolve to "yes," and the flow of method 430 may proceed to the "yes" branches including operations 436 through 439, as shown in the figure.

[0091] Conversely, other applications may not require the same type of access, or may otherwise lack any practical utility for external insert boards as described above. For example, these implementations may utilize other configurations to physically and / or electrically couple electronic components to external devices. In these cases, an insert board simultaneously coupled to the composite carrier board outside the immersion cooling assembly would therefore not provide any particular advantage, and operation 435 could resolve to "No". The flow of method 430 can then proceed to only the "No" branch of operation 436, and then terminate, as shown.

[0092] It should be understood that this is related to operation 435 (and in Figure 4The "Yes" and "No" branches (marked in the middle) result in two different variations in the construction of the electronic assembly 100. First, the "Yes" branch produces a composite carrier and electronic assembly, the composite carrier including multiple vias configured to provide access to multiple leads, and the electronic assembly also including multiple press-fit sockets configured to provide access to the multiple vias. Conversely, the "No" branch produces a composite carrier including multiple vias configured to provide access to multiple leads without press-fit sockets to provide access to the multiple vias. In other words, as illustrated by the power inverter assembly 200 in views 200-A to 200-E, the electronic assembly may include a composite carrier and an immersion cooling assembly without additional insert plates. The various operations of the "Yes" and "No" branches will now be described separately.

[0093] Operation 436 is shown to be performed as part of both a "yes" branch and a "no" branch following operation 435. At operation 436, an immersion cooling assembly may be assembled to at least partially cover the composite carrier plate formed at operation 434. As described and illustrated, the immersion cooling assembly may include an inlet port configured to allow cooling fluid to flow in and an outlet port configured to release cooling fluid. The immersion cooling assembly assembled at operation 436 to cover the composite carrier plate may be configured to direct cooling fluid flow through the composite carrier plate. In some specific embodiments, as further described, the immersion cooling assembly may be configured to direct cooling fluid flow through both: 1) a first surface of the composite carrier plate; and 2) a second surface of the composite carrier plate opposite the first surface.

[0094] To illustrate operation 436, Figure 8 This illustrates certain aspects of this type of electronic component (which either does not include or has not yet had an insert plate added). More specifically, Figure 8 Perspective view 800-A shows the complete electronic assembly (i.e., the final product of method 430 if the "No" branch is selected). Front view 800-B shows the same electronic assembly from the front (similar to front view 200-A described above), while side view 800-C shows the same electronic assembly from the side (similar to side view 200-D described above). If the "No" branch is selected, it should be understood that operation 436 is the final operation of method 430, and the electronic assembly shown in views 800-A to 800-C will be understood as representing the completed assembly (i.e., in this case, neither the press-fit socket nor the insert plate is included in the assembly). Conversely, if the "Yes" branch is selected, views 800-A to 800-C will be understood as representing the electronic assembly at an intermediate step before the addition of the press-fit socket and the insert plate.

[0095] Back Figure 4 Continuing with the "Yes" branch, operation 437 is shown as relating to preparing an insert plate having a plurality of press-fit pins configured to couple with a plurality of press-fit sockets, which, at operation 438, are coupled to a plurality of vias on the composite carrier plate. These press-fit pins and sockets may (for the insert plate or other elements coupled to the insert plate) provide access to the plurality of vias, and thus provide access to leads and / or associated circuit nodes, as described above. As described above, the insert plate may include a plurality of press-fit pins configured to couple with a plurality of press-fit sockets. Alternatively, press-fit sockets may be included on the insert plate, wherein pins are coupled to vias on the composite carrier plate. In either case, the insert plate may be configured to be coupled to the composite carrier plate via the coupling between the plurality of press-fit pins and the plurality of press-fit sockets, and may be configured to be external to the immersion cooling assembly when the insert plate is coupled to the composite carrier plate.

[0096] At operation 439 (still within the "Yes" branch), the insert board can be coupled to the composite carrier board via multiple press-fit pins and multiple press-fit sockets. As described, when this coupling between the insert board and the composite carrier board is performed, the insert board can be located outside the immersion cooling assembly. The press-fit pins / sockets or other suitable connection mechanisms can be long or wide enough to allow this to happen (i.e., enabling the insert board to connect to the composite carrier board while remaining outside the immersion cooling assembly).

[0097] For example, Figure 9 An exemplary aspect of the latter type of electronic component that can be manufactured using method 430 is shown (i.e., when the board is to be inserted and the “yes” branch is selected at operation 435). Figure 9 Perspective view 900-A (corresponding to perspective view 800-A), front view 900-B (corresponding to front view 800-B), and side view 900-C (corresponding to side view 800-C) of the electronic component are included. However, as shown from various angles, this specific embodiment of the electronic component is depicted as including an insert plate 950 located outside the immersion cooling assembly and coupled to the composite carrier plate via press-fit pins and sockets 952. As described above, the press-fit pins and sockets 952 may be coupled in either orientation (i.e., with the pins on the insert plate and the sockets on the composite carrier plate, or vice versa), and / or replaced with other suitable mechanisms that allow the insert plate 950 to be electrically connected to the composite carrier plate while remaining outside the immersion cooling assembly.

[0098] The following examples describe specific implementations of immersion cooling of embedded electronic components (e.g., electronic assemblies, construction methods, devices, apparatuses, etc.) based on the principles described herein.

[0099] Example 1: An electronic component comprising: a first carrier and a second carrier, the first carrier being coupled to the second carrier to form a composite carrier; a set of components forming an electronic circuit, the set of components being embedded within the composite carrier and located between the first carrier and the second carrier; a plurality of leads integrated with the composite carrier and configured to provide external access to a plurality of circuit nodes of the electronic circuit; and an immersion cooling assembly at least partially covering the composite carrier and configured to guide cooling fluid through the composite carrier.

[0100] Example 2: An electronic component according to any of the preceding embodiments, wherein the immersion cooling component is configured to guide the cooling fluid through a first surface of the composite carrier and through a second surface of the composite carrier opposite to the first surface.

[0101] Example 3: An electronic component according to any one of the preceding embodiments, wherein: the first carrier is a first printed circuit board (PCB); the second carrier is a second PCB; and the electronic circuit includes an electrical connection provided by the first PCB, the electrical connection including a first pad, a second pad, and a trace, the trace connecting the first pad and the second pad within the first PCB.

[0102] Example 4: An electronic component according to any of the preceding embodiments, wherein the immersion cooling component includes an inlet port and an outlet port, the inlet port being configured to allow the cooling fluid to flow in, and the outlet port being configured to release the cooling fluid.

[0103] Example 5: An electronic component according to any one of the preceding embodiments, wherein the set of components includes an unpackaged semiconductor die.

[0104] Example 6: An electronic component according to any of the preceding embodiments, wherein the unpackaged semiconductor die realizes a single power transistor.

[0105] Example 7: An electronic component according to any of the preceding examples, wherein the single power transistor is a power metal-oxide-semiconductor field-effect transistor (MOSFET) manufactured using silicon carbide (SiC) semiconductor.

[0106] Example 8: An electronic component according to any of the preceding embodiments, wherein the set of components further includes a conductive clip configured to electrically couple the unpackaged semiconductor die to another component within the electronic circuit.

[0107] Example 9: An electronic component according to any one of the foregoing embodiments, wherein the unpackaged semiconductor die realizes an integrated circuit including a plurality of transistors.

[0108] Example 10: An electronic component according to any one of the preceding embodiments, wherein the set of components includes a plurality of unpackaged semiconductor dies, the plurality of unpackaged semiconductor dies including a first semiconductor die made using silicon (Si) semiconductors and a second semiconductor die made using silicon carbide (SiC) semiconductors.

[0109] Example 11: An electronic component according to any one of the preceding embodiments, wherein: the composite carrier includes a plurality of vias configured to provide access to the plurality of leads; and the electronic component further includes a plurality of press-fit sockets configured to provide access to the plurality of vias.

[0110] Example 12: The electronic component according to any one of the preceding embodiments further includes an insertion plate having a plurality of press-fit pins configured to be coupled to a plurality of press-fit sockets, wherein: the insertion plate is configured to be coupled to the composite carrier through the coupling between the plurality of press-fit pins and the plurality of press-fit sockets; and the insertion plate is configured to be located outside the immersion cooling assembly when the insertion plate is coupled to the composite carrier.

[0111] Example 13: An electronic component according to any of the preceding embodiments, wherein the composite carrier includes a plurality of vias configured to provide access to the plurality of leads without requiring a mating socket to provide access to the plurality of vias.

[0112] Example 14: An electronic component according to any one of the preceding embodiments, wherein the electronic component implements a power inverter component configured for use in an automotive application.

[0113] Example 15: A method comprising: integrating a plurality of leads with a first carrier; coupling a set of components to the first carrier, the set of components forming an electronic circuit including a plurality of circuit nodes accessible from the outside via the plurality of leads; after coupling the set of components to the first carrier, joining the first carrier to a second carrier to form a composite carrier; and assembling an immersion cooling assembly to at least partially cover the composite carrier, the immersion cooling assembly being configured to guide cooling fluid through the composite carrier.

[0114] Example 16: The method according to any one of the preceding embodiments, wherein: the immersion cooling assembly includes an inlet port and an outlet port, the inlet port being configured to allow the cooling fluid to flow in, and the outlet port being configured to release the cooling fluid; and the immersion cooling assembly being configured to guide the cooling fluid through a first surface of the composite carrier and through a second surface of the composite carrier opposite to the first surface.

[0115] Example 17: The method according to any one of the preceding embodiments, wherein the set of components includes an unpackaged semiconductor die that realizes a single power transistor.

[0116] Example 18: The method according to any one of the preceding embodiments, the method further comprising: forming a plurality of vias in the composite carrier, the plurality of vias being configured to provide access to the plurality of leads; coupling a plurality of press-fit sockets to the plurality of vias to provide access to the plurality of vias; preparing an insert plate having a plurality of press-fit pins configured to be coupled to the plurality of press-fit sockets; and coupling the insert plate to the composite carrier by coupling the plurality of press-fit pins and the plurality of press-fit sockets, wherein when the insert plate is coupled to the composite carrier, the insert plate is located outside the immersion cooling assembly.

[0117] Example 19: A power inverter assembly comprising: a first carrier and a second carrier, the first carrier being coupled to the second carrier to form a composite carrier; a set of components forming a power inverter circuit, the set of components including a plurality of unpackaged semiconductor dies, each of the plurality of unpackaged semiconductor dies realizing a single power transistor, and the set of components being embedded within the composite carrier and located between the first carrier and the second carrier; a plurality of leads integrated with the composite carrier and configured to provide external access to a plurality of circuit nodes of the power inverter circuit; and an immersion cooling assembly configured for use in an automotive application, the immersion cooling assembly at least partially covering the composite carrier and configured to guide cooling fluid flow through the composite carrier.

[0118] Example 20: A power inverter assembly according to any of the preceding embodiments, wherein the immersion cooling assembly is configured to guide the cooling fluid through a first surface of the composite carrier and through a second surface of the composite carrier opposite to the first surface.

[0119] Several implementation schemes have been described. However, it should be understood that various modifications may be made without departing from the spirit and scope of this specification.

[0120] It should also be understood that when an element is mentioned as being located on, connected to, electrically connected to, coupled to, or electrically coupled to another element, the element may be directly located on, connected to, or coupled to the other element, or one or more intermediate elements may be present. Conversely, when an element is mentioned as being directly located on, directly connected to, or directly coupled to another element, no intermediate elements are present. Although the terms "directly located on," "directly connected to," or "directly coupled to" may not be used throughout the specific embodiments, elements shown as being directly located on, directly connected to, or directly coupled to may be so referred to. The claims of this application may be amended to describe the illustrative relationships described in the specification or shown in the drawings.

[0121] The various devices and techniques described herein can be implemented using a variety of semiconductor processing and / or packaging techniques. Some implementations can be implemented using various types of semiconductor processing techniques associated with semiconductor substrates, including but not limited to, silicon (Si), gallium arsenide (GaAs), silicon carbide (SiC), etc.

[0122] It should also be understood that when an element (such as a layer, region, or substrate) is mentioned as being located on, connected to, electrically connected to, coupled to, or electrically coupled to another element, the element may be directly located on, connected to, or coupled to the other element, or one or more intermediate elements may be present. Conversely, when an element is mentioned as being directly located on, directly connected to, or directly coupled to another element or layer, no intermediate elements or layers are present.

[0123] Although the terms "directly located on," "directly connected to," or "directly coupled to" may not be used throughout the specific embodiments, elements shown as being directly located on, directly connected to, or directly coupled to may be referred to as such. The claims of this application may be amended to describe the illustrative relationships described in the specification or shown in the drawings.

[0124] As used herein, the singular form may include the plural form unless the context clearly indicates otherwise. In addition to the orientations depicted in the figures, spatial relative terms (e.g., above, on, above, below, under, beneath, etc.) are intended to cover different orientations of the device during use or operation. In some embodiments, the relative terms above and below may respectively include vertically above and vertically below. In some embodiments, adjacent terms may include laterally adjacent or horizontally adjacent.

[0125] While certain features of the described embodiments have been exemplified as described herein, many modifications, substitutions, variations, and equivalents will now occur to those skilled in the art. Therefore, it should be understood that the appended claims are intended to cover all such modifications and variations falling within the scope of the embodiments. It should be understood that these modifications and variations are presented by way of example only and not limitation, and various changes in form and detail are possible. Any part of the apparatus and / or method described herein can be combined in any combination, except for mutually exclusive combinations. The embodiments described herein may include various combinations and / or sub-combinations of the functions, components, and / or features of the different embodiments described.

[0126] Furthermore, the logical flow depicted in the accompanying drawings does not require the specific or sequential order shown to achieve the desired result. Additionally, other steps may be provided, or steps may be eliminated from the described flow, and other components may be added to or removed from the described system. Therefore, other embodiments are within the scope of the following claims.

[0127] It should be understood that although the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. Without departing from the scope of the specific implementation of this disclosure, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. As used herein, terms and / or include any and all combinations of one or more of the associated enumerated items.

[0128] While certain features of the described embodiments have been exemplified as described herein, many modifications, substitutions, variations, and equivalents will be apparent to those skilled in the art. Therefore, it should be understood that the appended claims are intended to cover such modifications and variations falling within the scope of the embodiments. It should be understood that these modifications and variations are presented by way of example only and not limitation, and various changes in form and detail are possible. Any part of the apparatus and / or method described herein can be combined in any combination, except for mutually exclusive combinations. The embodiments described herein may include various combinations and / or sub-combinations of the functions, components, and / or features of the different embodiments described. Therefore, the scope of this disclosure is not limited to the specific combinations claimed below, but extends to cover any combination of features or exemplary embodiments described herein, regardless of whether that specific combination is specifically enumerated in the appended claims at this time.

Claims

1. An electronic component (100), the electronic component comprising: A first carrier (102-1) and a second carrier (102-2), wherein the first carrier (102-1) is bonded to the second carrier (102-2) to form a composite carrier (102); A set of components (104) forming an electronic circuit, the set of components (104) being embedded within the composite carrier (102) and located between the first carrier (102-1) and the second carrier (102-2); Multiple leads (108), integrated with the composite carrier (102) and configured to provide external access to multiple circuit nodes of the electronic circuit; and An immersion cooling assembly (110) at least partially covers the composite carrier (102) and is configured to guide cooling fluid (216) through the composite carrier (102).

2. The electronic component according to claim 1, wherein the immersion cooling component (110) is configured to guide the cooling fluid (216) through a first surface of the composite carrier (102) and through a second surface of the composite carrier (102) opposite to the first surface.

3. The electronic component according to claim 1, wherein: The first carrier (102-1) is the first printed circuit board (PCB); The second carrier (102-2) is the second PCB; and The electronic circuit includes an electrical connection (106) provided by the first PCB, the electrical connection including a first pad, a second pad and a trace, the trace connecting the first pad and the second pad within the first PCB.

4. The electronic assembly of claim 1, wherein the immersion cooling assembly (110) includes an inlet port (214-1) and an outlet port (214-2), the inlet port being configured to allow the cooling fluid (216) to flow in, and the outlet port being configured to release the cooling fluid (216).

5. The electronic assembly of claim 1, wherein the set of components (104) comprises unpackaged semiconductor dies.

6. The electronic component of claim 5, wherein the unpackaged semiconductor die realizes a single power transistor.

7. The electronic component of claim 6, wherein the single power transistor is a power metal-oxide-semiconductor field-effect transistor (MOSFET) manufactured using silicon carbide (SiC) semiconductor.

8. The electronic assembly of claim 5, wherein the set of components (104) further includes a conductive clip configured to electrically couple the unpackaged semiconductor die to another component within the electronic circuit.

9. The electronic component of claim 5, wherein the unpackaged semiconductor die realizes an integrated circuit comprising a plurality of transistors.

10. The electronic component of claim 1, wherein the set of components (104) comprises a plurality of unpackaged semiconductor dies, the plurality of unpackaged semiconductor dies comprising: A first semiconductor die made using silicon (Si) semiconductors, and a second semiconductor die made using silicon carbide (SiC) semiconductors.

11. The electronic component according to claim 1, wherein: The composite carrier (102) includes a plurality of vias configured to provide access to the plurality of leads (108); and The electronic component also includes a plurality of press-fit sockets (952) configured to provide access to the plurality of vias.

12. The electronic component of claim 11, further comprising an insert plate (950) having a plurality of press-fit pins (952) configured to couple with the plurality of press-fit sockets (952), wherein: The insertion plate (950) is configured to be coupled to the composite carrier (102) via coupling between the plurality of press-fit pins (952) and the plurality of press-fit sockets (952); and The insertion plate (950) is configured to be located outside the immersion cooling assembly (110) when the insertion plate (950) is coupled to the composite carrier (102).

13. The electronic component of claim 1, wherein the composite carrier (102) includes a plurality of vias configured to provide access to the plurality of leads (108) without requiring a mating socket (952) to provide access to the plurality of vias.

14. The electronic component of claim 1, wherein the electronic component (100) implements a power inverter component (200) configured for use in an automotive application.

15. A method (430), the method comprising: Multiple leads (108) are integrated with the first carrier (102-1); A set of components (104) is coupled to the first carrier (102-1), the set of components (104) forming an electronic circuit, the electronic circuit including multiple circuit nodes, the multiple circuit nodes being accessible from the outside via the multiple leads (108); After coupling the set of components (104) to the first carrier (102-1), the first carrier (102-1) is joined to the second carrier (102-2) to form a composite carrier (102); and An immersion cooling assembly (110) is assembled to at least partially cover the composite carrier (102), the immersion cooling assembly (110) being configured to guide cooling fluid (216) through the composite carrier (102).

16. The method of claim 15, wherein: The immersion cooling assembly (110) includes an inlet port (214-1) and an outlet port (214-2), the inlet port being configured to allow the cooling fluid (216) to flow in, and the outlet port (214-2) being configured to release the cooling fluid (216); and The immersion cooling assembly (110) is configured to guide the cooling fluid (216) through a first surface of the composite carrier (102) and through a second surface of the composite carrier (102) opposite to the first surface.

17. The method of claim 15, wherein the set of components (104) comprises an unpackaged semiconductor die that implements a single power transistor.

18. The method according to claim 15, further comprising: A plurality of vias are formed within the composite carrier (102), the plurality of vias being configured to provide access to the plurality of leads (108); Multiple press-fit sockets (952) are coupled to the multiple vias to provide access to the multiple vias; Prepare an insertion board (950) having a plurality of press-fit pins (952) configured to be coupled to a plurality of press-fit sockets (952); as well as The insert plate (950) is coupled to the composite carrier (102) by coupling the plurality of press-fit pins (952) and the plurality of press-fit sockets (952), and when the insert plate (950) is coupled to the composite carrier (102), the insert plate (950) is located outside the immersion cooling assembly (110).

19. A power inverter assembly (200), the power inverter assembly comprising: A first carrier (102-1) and a second carrier (102-2), wherein the first carrier (102-1) is bonded to the second carrier (102-2) to form a composite carrier (102); A set of components (104) forms a power inverter circuit, the set of components (104) includes a plurality of unpackaged semiconductor dies, each of the plurality of unpackaged semiconductor dies realizing a single power transistor, and the set of components (104) is embedded in the composite carrier (102) and located between the first carrier (102-1) and the second carrier (102-2); Multiple leads (108), integrated with the composite carrier (102) and configured to provide external access to multiple circuit nodes of the power inverter circuit; and An immersion cooling assembly (110) configured for use in automotive applications, the immersion cooling assembly (110) at least partially covering the composite carrier (102) and configured to guide cooling fluid (216) through the composite carrier (102).

20. The power inverter assembly of claim 19, wherein the immersion cooling assembly (110) is configured to guide the cooling fluid (216) through a first surface of the composite carrier (102) and through a second surface of the composite carrier (102) opposite to the first surface.

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