Continuous production equipment and method of edible mushroom substrate based on electron beam sterilization

Abstract

The application discloses a kind of based on electron beam sterilization edible mushroom substrate continuous production equipment and method, belong to edible mushroom production technical field.The based on electron beam sterilization edible mushroom substrate continuous production equipment includes supply device, conveying device, paving device, sterilization device and inoculation packaging device.The conveying device is located downstream of supply device, to accept and continuously transport edible mushroom substrate;Paving device is located on the conveying path of conveying device, and paving device is configured to spread edible mushroom substrate carried on conveying device into the layer of preset thickness;Sterilization device carries out electron beam irradiation sterilization to edible mushroom substrate;Inoculation packaging device receives the edible mushroom substrate after electron beam irradiation sterilization and carries out inoculation and packaging.In this way, paving device pre-spreads material into the continuous layer of uniform thickness, and then sends into irradiation area.Uniform layer ensures that electron beam penetration dose is consistent, so that sterilization effect is reliable and uniform, and also can improve electron beam utilization.

Description

Technical Field

[0001] This application relates to the field of edible fungi production technology, and in particular to a continuous production equipment and method for edible fungi substrate based on electron beam sterilization. Background Technology

[0002] Edible fungi are rich in nutrients such as protein and amino acids, and are low in fat, low in calories, and easily digestible, meeting the needs of a healthy diet and have now become one of the main foods for humans. Sterilization, inoculation, and packaging of the edible fungi substrate are key steps in the industrialized cultivation and production of edible fungi, and their process routes and equipment configurations directly affect the quality of the substrate bags, production efficiency, and operating costs.

[0003] The typical process for industrialized cultivation of edible fungi is as follows: First, cultivation materials such as sawdust, corn cobs, and wheat bran are mixed according to a formula, and the moisture content is adjusted. After stirring evenly, a cultivation substrate is formed. Then, the substrate is filled into polypropylene or polyethylene bags to form spawn bags. Next, the spawn bags are placed in a high-temperature sterilization autoclave, where high-temperature steam is introduced for sterilization. Heating and maintaining the temperature takes several hours. After sterilization, the spawn bags are transferred to a strong cooling workshop, where they are forcibly cooled to a suitable inoculation temperature through a refrigeration and purification system. After cooling, holes are punched in the surface of the spawn bags manually or mechanically, and liquid or solid spawn is inoculated. The inoculated spawn bags are then sent to a mycelium cultivation room for mycelial culture. Once the mycelium has fully grown, the fruiting management stage begins, and finally, the spawn bags are harvested, packaged, and shipped out of the factory.

[0004] In the above production process, the high-temperature sterilization of the mushroom bags and the subsequent strong cooling process are time-consuming and energy-intensive, resulting in low overall production efficiency. Summary of the Invention

[0005] This application provides an embodiment of a continuous production equipment and method for edible fungi substrate based on electron beam sterilization, the technical solution of which is as follows: According to one aspect of this application, a continuous production equipment for edible fungi substrate based on electron beam sterilization is provided, comprising: The supply device is configured to supply substrate for edible fungi. A conveying device, located downstream of the supply device, is used to receive and continuously convey the edible fungus substrate; A spreading device is located on the conveying path of the conveying device, and the spreading device is configured to spread the edible fungus substrate carried on the conveying device into a material layer of a preset thickness. A sterilization device is located on the conveying path of the conveying device and downstream of the spreading device, and performs electron beam irradiation sterilization on the edible fungus substrate. An inoculation and packaging device, located downstream of the conveying device, receives the edible fungi substrate sterilized by electron beam irradiation and performs inoculation and packaging.

[0006] Optionally, the spreading device includes: A receiving mechanism is provided on the conveying path of the conveying device. The receiving mechanism has an inlet end and an outlet end to receive the edible fungus substrate conveyed by the upstream conveying device. A leveling mechanism is installed at the discharge end of the receiving mechanism or downstream of the receiving mechanism. The leveling mechanism has a preset gap with the bearing surface of the conveying device to scrape the edible fungus substrate output from the receiving mechanism to a first preset thickness.

[0007] Optionally, the spreading device further includes a spreading mechanism installed inside or downstream of the receiving mechanism and positioned upstream of the leveling mechanism, to spread the edible fungus substrate falling into the receiving mechanism along a first direction, the first direction being perpendicular to the conveying direction of the conveying device.

[0008] Optionally, the receiving mechanism includes a receiving frame and a discharging frame, both of which are located above the bearing surface of the conveying device. The spreading mechanism is installed in the receiving frame, and the discharging frame is connected to the discharging end of the receiving frame and has a discharging port. The leveling mechanism includes a scraper and a first adjusting structure. The scraper is movably installed in the discharge frame, and the first adjusting structure is installed on the discharge frame and connected to the scraper. The first adjusting structure is configured to drive the scraper to move in order to adjust the gap between the scraper and the bearing surface.

[0009] Optionally, the scraper is inclined relative to the bearing surface, and the upper end of the scraper is closer to the receiving frame than the lower end of the scraper; the scraper is rotatably connected to the discharge frame. The first adjustment structure drives the scraper to rotate, thereby adjusting the distance between the lower end of the scraper and the bearing surface.

[0010] Optionally, the spreading device further includes a compaction mechanism, which is disposed between the leveling mechanism and the sterilization device and located above the bearing surface of the conveying device; The compaction mechanism is configured to compress the edible fungus substrate output from the leveling mechanism to a second preset thickness, the second preset thickness being less than the first preset thickness.

[0011] Optionally, the compaction mechanism includes a pressure roller and a second adjustment structure; The pressure roller is movably installed in the discharge frame and located above the bearing surface of the conveying device, and the axial direction of the pressure roller is perpendicular to the conveying direction of the conveying device; The second adjustment structure is mounted on the discharge frame and connected to the pressure roller. The second adjustment structure is configured to drive the pressure roller to move in order to adjust the gap between the pressure roller and the bearing surface.

[0012] Optionally, the material spreading mechanism includes a connecting component, multiple plates, and a driving mechanism; Multiple plates are located in the receiving frame and are arranged at intervals along the first direction, and each plate is mounted on the connecting assembly; The connecting component is movably mounted on the receiving frame and connected to the driving mechanism. The driving mechanism drives the connecting component to reciprocate along the first direction, thereby driving the multiple plates to reciprocate within the receiving frame.

[0013] Optionally, the conveying device includes a conveyor belt structure, the discharge end of the supply device is provided with a feeding structure, and the inlet end of the inoculation and packaging device is provided with a discharging structure; The end of the feeding structure is located above the spreading device, and the feeding structure receives the edible fungus substrate output by the supply device and transports it to the spreading device. The spreading device is located at the front end of the conveyor belt structure. The conveyor belt structure extends from the spreading device through the irradiation area of ​​the sterilization device and carries the edible fungus substrate treated by the spreading device through the irradiation area continuously. The feeding structure is located between the sterilization device and the inoculation and packaging device, and conveys the edible fungus substrate that has been sterilized by irradiation to the inoculation and packaging device. The feeding structure is in a sterile environment.

[0014] Optionally, the sterilization device includes an electron beam accelerator and a scanning mechanism; The electron beam accelerator generates an electron beam for sterilization, and the scanning mechanism unfolds the electron beam to form a scanning beam. The scanning width of the scanning beam covers the width of the edible fungus substrate on the support surface in the first direction. The supply device includes a housing and a stirring mechanism, wherein the stirring mechanism is installed in the housing; The inoculation and packaging device includes a storage mechanism, an inoculation mechanism, and a packaging mechanism. The storage mechanism is located downstream of the conveying device, the inoculation mechanism is located below the storage mechanism, and the packaging mechanism is located downstream of the inoculation mechanism.

[0015] According to another aspect of this application, a continuous production method for edible fungi substrate based on electron beam sterilization is provided. The method is applied to the aforementioned continuous production equipment for edible fungi substrate based on electron beam sterilization, and the method includes: S1: Provides substrate for edible fungi; S2: The edible fungus substrate is continuously conveyed along the conveying direction; S3: Before the edible fungus substrate enters the irradiation area, the edible fungus substrate in the continuous conveying state is subjected to online material spreading treatment so that the edible fungus substrate forms a continuous material layer of a preset thickness on the bearing surface; S4: The continuous material layer is continuously conveyed through the irradiation area, and the continuous material layer is subjected to online irradiation sterilization treatment using an electron beam to obtain a sterile edible fungus substrate; S5: Inoculate the sterile edible fungus substrate that has been sterilized by electron beam irradiation, and package the inoculated edible fungus substrate.

[0016] Optionally, the material spreading process in S3 includes: S31: Spread the edible fungus substrate along a first direction, which is perpendicular to the conveying direction; S32: Smooth the surface of the spread-out edible fungus substrate and control the thickness of the edible fungus substrate to a first preset thickness; S33: Apply pressure to the leveled edible fungus substrate to compress the thickness of the edible fungus substrate from the first preset thickness to the second preset thickness, so as to increase the bulk density of the edible fungus substrate, wherein the second preset thickness is less than the first preset thickness.

[0017] The beneficial effects of the technical solutions provided in this application include at least the following: A continuous production line for edible fungi substrate based on electron beam sterilization is provided. The equipment includes a feeding device, a conveying device, a spreading device, a sterilization device, and an inoculation and packaging device. The conveying device is located downstream of the feeding device to receive and continuously transport the edible fungi substrate. The spreading device is located on the conveying path of the conveying device and is configured to spread the edible fungi substrate carried on the conveying device into a layer of predetermined thickness. The sterilization device is located on the conveying path of the conveying device and downstream of the spreading device, and performs electron beam irradiation sterilization on the edible fungi substrate. The inoculation and packaging device is located downstream of the conveying device to receive the electron beam-sterilized edible fungi substrate and perform inoculation and packaging. Thus, the feeding, spreading, sterilization, inoculation, and packaging devices are connected sequentially to form a complete mushroom bag preparation production line. The spreading device is placed upstream of the sterilization device, pre-spreading the material into a continuous layer of uniform thickness before sending it into the irradiation zone. A uniform material layer ensures consistent electron beam penetration dose, avoiding incomplete sterilization in thick areas and preventing damage to surface nutrients in thin areas due to excessive dose, resulting in reliable and uniform sterilization effect; at the same time, the continuous material layer morphology can also improve electron beam utilization. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a continuous production equipment for edible fungi substrate based on electron beam sterilization provided in an embodiment of this application; Figure 2 yes Figure 1 The diagram shows a partial structural schematic of a continuous production equipment for edible fungi substrate based on electron beam sterilization. Figure 3 This is a schematic diagram of the structure of a conveying device and a material spreading device provided in an embodiment of this application; Figure 4 This is a schematic diagram of the internal structure of a material spreading device provided in an embodiment of this application; Figure 5 This is a schematic diagram of the internal structure of another material spreading device provided in an embodiment of this application; Figure 6 yes Figure 5 A schematic diagram of the material spreading device from another perspective; Figure 7 This is a schematic diagram of the structure of a supply device provided in an embodiment of this application.

[0020] Explanation of reference numerals in the attached figures: 10. Supply device; 11. Feeding structure; 12. Housing; 13. Mixing mechanism; 20. Conveying device; 21. Bearing surface; 22. Conveyor belt structure; 30. Spreading device; 31. Receiving mechanism; 311. Receiving frame; 312. Discharge frame; 3121. Arc-shaped guide hole; 3122. First side plate; 3123. Top plate; 32. Spreading mechanism; 321. Connecting assembly; 322. Plate body; 33. Scraping mechanism; 331. Scraper; 332. First adjustment structure; 3321. Swing arm; 3322. Telescopic component; 34. Mounting bracket; 35. Compacting mechanism; 351. Pressure roller; 352. Second adjustment structure; 3521. Rotating shaft; 3522. Swing rod; 40. Sterilization device; 50. Inoculation and packaging device; 51. Discharge structure; 60. Clean room; d1. First direction. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0022] Although this application can readily be embodied in various forms, only some specific embodiments are shown in the accompanying drawings and will be described in detail in this specification. It is understood that this specification should be regarded as an exemplary illustration of the principles of this application and is not intended to limit the application to what is described herein.

[0023] Therefore, a feature pointed out in this specification is used to describe one feature of one embodiment of this application, and does not imply that every embodiment of this application must have the described feature. Furthermore, it should be noted that this specification describes many features. While certain features may be combined to illustrate possible system designs, these features may also be used in other combinations not explicitly stated. Therefore, unless otherwise stated, the described combinations are not intended to be limiting.

[0024] In the embodiments shown in the accompanying drawings, the directional indications (such as up, down, left, right, front, and back) used to explain the structure and movement of the various elements of this application are relative rather than absolute. These descriptions are appropriate when these elements are in the positions shown in the drawings. If the descriptions of the positions of these elements change, these directional indications also change accordingly.

[0025] Please refer to Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a schematic diagram of the structure of a continuous production equipment for edible fungi substrate based on electron beam sterilization, provided in an embodiment of this application. Figure 2 yes Figure 1 The diagram shows a partial structural schematic of a continuous production equipment for edible mushroom substrate based on electron beam sterilization. Figure 3 This is a schematic diagram of the structure of a conveying device 20 and a spreading device 30 provided in an embodiment of this application. The continuous production equipment for edible fungi substrate based on electron beam sterilization may include: a supply device 10, a conveying device 20, a spreading device 30, a sterilization device 40, and an inoculation and packaging device 50.

[0026] The supply device 10 is configured to supply edible fungi substrate. The supply device 10 can be a silo, hopper, or mixing tank, used to store or receive the edible fungi substrate (such as bulk material mixed from sawdust, corn cobs, bran, etc.), and continuously supply the material to downstream equipment. A screw discharge mechanism or belt discharge mechanism can be installed at the bottom of the supply device 10 to achieve quantitative and stable material supply. In this embodiment, "material" refers to the edible fungi substrate, which is the object continuously conveyed, spread, sterilized, inoculated, and packaged throughout the entire process.

[0027] The conveying device 20 is located downstream of the supply device 10 to receive and continuously transport the edible fungus substrate. The conveying device 20 can be a belt conveyor, with its conveyor belt forming a bearing surface 21. The starting end of the conveying device 20 is located below the material outlet of the supply device 10, receiving the material output from the supply device 10 and continuously transporting the material forward in a horizontal direction. The conveying device 20 passes through the working areas of the spreading device 30 and the sterilization device 40, and its end extends to the inlet of the inoculation and packaging device 50.

[0028] The spreading device 30 is located on the conveying path of the conveying device 20. The spreading device 30 is configured to spread the edible fungus substrate carried on the conveying device 20 into a layer of preset thickness. During the conveying process of the conveying device 20, the material is spread and leveled by the spreading device 30 to form a continuous layer of preset thickness and uniform thickness. The spreading device 30 can be a baffle type, a scraper type, or a vibrating spreading device. In this embodiment, the preset thickness refers to the layer thickness determined based on factors such as electron beam energy, material type, and bulk density, which ensures that the material receives an effective sterilization dose within the irradiation area.

[0029] The sterilization device 40 is located on the conveying path of the conveying device 20 and downstream of the spreading device 30, and performs electron beam irradiation sterilization on the edible fungus substrate. The inoculation and packaging device 50, located downstream of the conveying device 20, receives the electron beam-sterilized edible fungus substrate and performs inoculation and packaging. The inoculation and packaging device 50 can first spray liquid spawn onto the sterilized loose edible fungus substrate (inoculating both the interior and surface of the material simultaneously), and then fill the inoculated material into mushroom bags or bottles and seal them to form mushroom bags. Inoculation and packaging can be completed in the same device (spawn spraying and bagging are carried out continuously), or they can be completed sequentially in two independent units: an inoculation device and a packaging device.

[0030] In this embodiment, after the equipment is started, the supply device 10, the spreading device 30, the sterilization device 40, and the inoculation and packaging device 50 are sequentially connected and operate in coordination via the conveying device 20. The material continuously undergoes the supply, spreading, sterilization, inoculation, and packaging processes. Specifically, during the supply stage, the operator feeds the edible fungus substrate (in bulk form, with a moisture content typically of 60%–65%) into the supply device 10. The supply device 10 stirs the substrate and continuously outputs the material through the bottom outlet onto the bearing surface 21 of the conveying device 20. The conveying device 20 receives the material and continuously conveys it forward. When the material passes the spreading device 30, the spreading device 30 spreads the material along its width and smooths the surface, forming a continuous layer of material of a preset thickness on the bearing surface 21. Spreading and conveying are performed synchronously; the material spreads during movement without needing to pause or slow down.

[0031] The uniform material layer after spreading is loaded into the irradiation area of ​​the sterilization device 40 by the conveying device 20. An electron beam accelerator generates a high-energy electron beam, which is expanded by a scanning mechanism into a scanning beam that covers the material layer. This beam vertically irradiates the continuously passing material layer from above, penetrating the layer and killing microorganisms within. Because the material passes through in a continuous layer, the entire irradiation window is always covered by material in the scanning area, with no irradiation gaps. The speed and electron beam dose parameters of the conveying device 20 can be preset according to the material type and sterilization requirements to ensure that the material receives a sufficient and uniform irradiation dose, resulting in a sterile edible mushroom substrate.

[0032] The sterilized aseptic material continues to be conveyed by the conveyor 20 to the inoculation and packaging device 50 at the end. This device first sprays liquid inoculum evenly onto the inside and surface of the material using a spraying method to achieve large-area, uniform inoculation. Immediately afterwards, the inoculated material is packed into mushroom bags or bottles and sealed to produce mushroom bags that can directly enter the mycelium growth and cultivation stage. From material supply to finished mushroom bag production, all processes are seamlessly connected, with materials in continuous motion at all times, without intermediate storage or batch processing, enabling one-stop continuous production.

[0033] Thus, the continuous production equipment for edible fungi substrate based on electron beam sterilization in this embodiment of the application connects the supply device 10, the spreading device 30, the sterilization device 40, and the inoculation and packaging device 50 sequentially through the conveying device 20, forming a complete material flow path. This enables the complete preparation process of mushroom bags, including "supply, spreading, sterilization, inoculation, and packaging." By integrating sterilization, inoculation, and packaging into the same equipment, the material remains on the same conveying line from sterilization to sealing. This avoids the risk of secondary contamination of sterilized material during the waiting period for inoculation or transfer, ensuring the cleanliness of the inoculation environment and the success rate of inoculation. Furthermore, it eliminates the need for labor, time, and equipment investment required for material transfer, shortens the production cycle, and reduces operating costs.

[0034] Furthermore, the material spreading device 30 is located upstream of the sterilization device 40. The material is spread into a continuous layer of a preset thickness before irradiation, which can solve the problem of uneven material thickness under natural stacking conditions. The uniform material layer ensures that the electron beam penetrates the entire thickness direction with a consistent dose, which can avoid the problem of insufficient sterilization at the bottom of the thick area and damage to the nutrients on the surface of the thin area due to excessive dose. The sterilization effect is reliable and highly uniform. The use of a continuous material layer through the irradiation area results in higher electron beam utilization.

[0035] In summary, this application provides a continuous production equipment for edible fungi substrate based on electron beam sterilization. The equipment includes a supply device 10, a conveying device 20, a spreading device 30, a sterilization device 40, and an inoculation and packaging device 50. The conveying device 20 is located downstream of the supply device 10 to receive and continuously convey the edible fungi substrate. The spreading device 30 is located on the conveying path of the conveying device 20 and is configured to spread the edible fungi substrate carried on the conveying device 20 into a layer of a predetermined thickness. The sterilization device 40 is located on the conveying path of the conveying device 20 and downstream of the spreading device 30, and performs electron beam irradiation sterilization on the edible fungi substrate. The inoculation and packaging device 50 is located downstream of the conveying device 20 to receive the electron beam-sterilized edible fungi substrate and perform inoculation and packaging. Thus, the supply, spreading, sterilization, inoculation, and packaging devices are connected sequentially to form a complete mushroom bag preparation production line. The material spreading device 30 is positioned upstream of the sterilization zone, pre-spreading the material into a continuous layer of uniform thickness before sending it into the irradiation zone. The uniform material layer ensures consistent electron beam penetration dose, avoiding incomplete sterilization in thick areas and preventing damage to the surface nutrients in thin areas due to excessive dose, thus ensuring reliable and uniform sterilization effect; at the same time, the continuous material layer shape can also improve electron beam utilization.

[0036] Please refer to Figure 1 , Figure 2 and Figure 3 In one optional embodiment, the continuous production equipment for edible fungi substrate based on electron beam sterilization also includes a clean room 60, which, for example, can be a closed workshop with a cleanliness level of 100 or 1000.

[0037] The conveying device 20 includes a conveyor belt structure 22. The discharge end of the supply device 10 is provided with a feeding structure 11, and the inlet end of the inoculation and packaging device 50 is provided with a discharging structure 51. The end of the feeding structure 11 is located above the spreading device 30. The feeding structure 11 receives the edible fungus substrate output by the supply device 10 and conveys it to the spreading device 30. The spreading device 30 is located at the front end of the conveyor belt structure 22. The material falls from the end of the feeding structure 11 into the spreading device 30. The conveyor belt structure 22 extends from the spreading device 30 through the irradiation area of ​​the sterilization device 40, carrying the edible fungus substrate treated by the spreading device 30 continuously through the irradiation area. The discharging structure 51 is located between the sterilization device 40 and the inoculation and packaging device 50, and conveys the irradiated and sterilized edible fungus substrate to the inoculation and packaging device 50. The discharging structure 51 is in a sterile environment.

[0038] The feeding structure 11 can be any one or a combination of a belt conveyor, a chain conveyor, or a vibrating conveyor. The feeding structure 11 is located outside the cleanroom 60 and has no special requirements for cleanliness. It can be an open or semi-enclosed structure, designed with the stable conveying of materials and controllable material drop position as its design objectives. The conveyor belt structure 22 can be a belt conveyor.

[0039] The feeding structure 51 can be a belt conveyor, chain conveyor, or closed screw conveyor. The feeding structure 51 is located in a sterile environment, which is formed by the large amount of ozone generated by electron beam irradiation during the operation of the sterilization device 40. Ozone has a broad-spectrum sterilization effect, effectively sterilizing the space where the feeding structure 51 is located and the interior of the conveying channel. This creates and maintains a sterile environment between the discharge end of the sterilization device 40 and the inlet end of the inoculation and packaging device 50, ensuring that the irradiated sterilized edible fungus substrate remains sterile throughout the entire process of conveying to the inoculation and packaging device 50, avoiding secondary contamination. Furthermore, this sterile environment can be further ensured by placing the feeding structure 51 within a clean room 60, or by using a closed conveying system combined with internal positive pressure maintenance and / or auxiliary sterilization devices. The feeding structure 51 conveys the irradiated sterilized aseptic edible fungus substrate from the discharge end of the sterilization device 40 to the inoculation and packaging device 50, maintaining the sterility of the material throughout the entire conveying process and avoiding secondary contamination.

[0040] Specifically, the feeding structure 11, conveyor belt structure 22, and unloading structure 51 are arranged sequentially in a straight line. The conveyor belt structure 22 is horizontally positioned, while the feeding structure 11 and unloading structure 51 are inclined, such that the end of the feeding structure 11 is above the front end of the conveyor belt structure 22, and the end of the conveyor belt structure 22 is above the front end of the unloading structure 51. Under its own gravity, the material falls from the end of the feeding structure 11 onto the conveyor belt structure 22, and then, after being conveyed by the conveyor belt structure 22, falls from the end onto the unloading structure 51. There is no need to set up independent transfer mechanisms between each section; seamless transfer of materials can be achieved through spatial arrangement. Alternatively, transition guide plates can be set to further guide the falling trajectory of the material and prevent spillage or accumulation.

[0041] During equipment operation, the edible fungus substrate is output from the supply device 10 and conveyed to its end by the feeding structure 11, falling onto the bearing surface 21 at the front end of the conveyor belt structure 22 under its own gravity. The spreading device 30 is a bottomless frame structure, directly erected above the bearing surface 21 of the conveyor belt structure 22. As the material moves forward with the conveyor belt structure 22, the spreading device 30 directly flattens and smooths the material on the bearing surface 21. The treated material remains on the bearing surface 21 of the conveyor belt structure 22 in a uniform layer form and continues to be conveyed forward. The conveyor belt structure 22 carries the uniform layer of material after spreading into the irradiation area below the sterilization device 40, where it is sterilized by electron beam irradiation and continues to move forward. Subsequently, the material is transferred to the unloading structure 51, which continues to convey it in a clean environment to the inoculation and packaging device 50 to complete the inoculation and packaging. The unloading structure 51 is located inside the cleanroom 60, allowing sterile materials to enter the clean environment after irradiation sterilization for subsequent conveying, inoculation, and packaging. This avoids secondary contamination of sterilized materials by airborne microorganisms during transport. The loading structure 11 and conveyor belt structure 22 are located outside the cleanroom 60. The cleanroom 60 only requires purification of the unloading structure 51 and the inoculation and packaging area. Compared to placing the entire equipment inside the cleanroom 60, this reduces the construction cost and operating energy consumption of the cleanroom 60. Furthermore, the sequentially arranged conveyor structures in a straight line minimize the material flow path and conveying distance, resulting in a small equipment footprint. Materials do not require turning or transfer between processes, leading to high transmission efficiency.

[0042] Please refer to Figure 2 , Figure 3 and Figure 4 , Figure 4 This is a schematic diagram of the internal structure of a material spreading device 30 provided in an embodiment of this application. In an optional embodiment, the material spreading device 30 may include a receiving mechanism 31 and a leveling mechanism 33. The receiving mechanism 31 is disposed on the conveying path of the conveying device 20, and has an inlet end and an outlet end to receive the edible fungus substrate conveyed by the upstream conveying device 20.

[0043] The spreading device 30 may also include a spreading mechanism 32, which is installed inside or downstream of the receiving mechanism 31 and upstream of the leveling mechanism 33, so as to spread the edible fungus substrate falling into the receiving mechanism 31 along the first direction d1, which is perpendicular to the conveying direction of the conveying device 20.

[0044] The leveling mechanism 33 is installed at the discharge end of the receiving mechanism 31 or downstream of the receiving mechanism 31. The leveling mechanism 33 is located downstream of the spreading mechanism 32. There is a preset gap between the leveling mechanism 33 and the bearing surface 21 of the conveying device 20 so as to scrape the edible fungus substrate output from the receiving mechanism 31 to a first preset thickness.

[0045] For example, the receiving mechanism 31 can be a frame structure with an open top and a bottom close to the conveyor belt bearing surface 21. Its inlet end is located below the outlet of the supply device 10, and the material output by the supply device 10 falls into the receiving mechanism 31 from the inlet end. Alternatively, the inlet end of the receiving mechanism 31 can be located below the end of the feeding structure 11, and the material conveyed by the feeding structure 11 can fall into the receiving mechanism 31 from the top opening. The spreading mechanism 32 is installed inside the receiving mechanism 31 and can be composed of multiple plates 322 arranged at intervals along the first direction d1 (i.e., the width direction of the conveyor belt). Each plate 322 moves back and forth along the first direction d1 under the drive of the driving mechanism, repeatedly spreading the material accumulated at the bottom of the receiving mechanism 31 to both sides, so that the material is initially evenly distributed throughout the entire width of the conveyor belt. The leveling mechanism 33 is installed at the discharge end of the receiving mechanism 31. A preset gap is maintained between its lower edge and the conveyor belt bearing surface 21. When the material moves forward with the conveyor belt and passes through this gap, material exceeding the gap thickness is blocked and scraped back by the leveling mechanism 33, allowing only material with a thickness less than or equal to the gap to pass through. Through the coordinated operation of these three components, the material is spread out on the conveyor belt bearing surface 21 and scraped to a first preset thickness, achieving the continuous material spreading function of "receiving, widening, and fixing thickness." Here, the first direction d1 is the direction perpendicular to the conveying direction, and the size of the preset gap determines the first preset thickness of the material after leveling. In this embodiment, since no compaction mechanism is provided, the first preset thickness is the aforementioned "preset thickness." In other embodiments with a compaction mechanism, the "preset thickness" corresponds to the "second preset thickness" mentioned below. For example, the first preset thickness can be 30mm. The material spreading mechanism 32 spreads the material along its width, ensuring uniform distribution across the conveyor belt and preventing uneven distribution that could lead to localized areas of excessive thickness or thinness. The leveling mechanism 33 precisely controls the material layer thickness through a preset gap, ensuring a consistent thickness of material entering the irradiation area. This guarantees that the electron beam penetration depth matches the material thickness, allowing both the surface and bottom layers to receive an effective sterilization dose. The distance between the material spreading mechanism 32 and the bearing surface 21 is greater than the distance between the leveling mechanism 33 and the bearing surface 21. This ensures that the material thickness after initial spreading by the material spreading mechanism 32 remains greater than the leveling gap, guaranteeing that the leveling mechanism 33 always has sufficient material to scrape and preventing it from scraping dry due to an excessively thin material layer.

[0046] Please refer to Figure 2 , Figure 3 and Figure 4In one optional embodiment, the receiving mechanism 31 may include a receiving frame 311 and a discharging frame 312, both located above the bearing surface 21 of the conveying device 20. A spreading mechanism 32 is installed within the receiving frame 311. The discharging frame 312 is connected to the discharging end of the receiving frame 311 and has a discharge port. Both the receiving frame 311 and the discharging frame 312 are bottomless frame structures, connected to each other, and jointly erected above the bearing surface 21 of the conveying device 20. The bottoms of both the receiving frame 311 and the discharging frame 312 are close to the bearing surface 21, with a small gap between them to avoid friction and to ensure the normal operation of the conveying device 20. The spreading mechanism 32 is installed within the receiving frame 311 and reciprocates along the first direction d1.

[0047] The leveling mechanism 33 includes a scraper 331 and a first adjusting structure 332. The scraper 331 is movably mounted in the discharge frame 312 and is arranged across the width of the bearing surface 21. The first adjusting structure 332 is mounted on the discharge frame 312 and connected to the scraper 331. The first adjusting structure 332 is configured to drive the scraper 331 to move, thereby adjusting the gap between the scraper 331 and the bearing surface 21.

[0048] The material spreading device 30 may also include a mounting bracket 34, which is fixedly mounted on the ground or a fixed platform on both sides of the conveying device 20 for fixing the receiving frame 311 and the discharging frame 312. During operation, material falls from the supply device 10 into the receiving frame 311. The spreading mechanism 32 reciprocates along the first direction d1 within the receiving frame 311, spreading the material to both sides. The spread material then moves forward with the conveying device 20 into the discharging frame 312. When it reaches the scraper 331, it passes through the gap between the lower edge of the scraper 331 and the bearing surface 21, with the thickness limited to a preset gap value, and is then output from the outlet. When the spreading thickness needs to be changed, the height or angle of the scraper 331 is adjusted by the first adjustment structure 332, thereby increasing or decreasing the gap between the scraper 331 and the bearing surface 21 to adapt to the spreading thickness requirements of different types of edible fungi substrates, improving the versatility and flexibility of the equipment.

[0049] Since both the receiving frame 311 and the discharging frame 312 adopt a bottomless structure and are directly erected above the bearing surface 21, the bearing surface 21 of the conveying device 20 serves as both the material bearing surface 21 and the power source for conveying, which simplifies the equipment structure. The spreading mechanism 32 is installed in the receiving frame 311 and reciprocates inside the frame to fully spread the accumulated material before it enters the discharging frame 312. This prevents the material from piling up too high before entering the scraper 331, which could cause the scraper 331 to jam or be damaged.

[0050] Please refer to Figure 2 , Figure 3 and Figure 4 In one alternative embodiment, the scraper 331 is inclined relative to the bearing surface 21, and the upper end of the scraper 331 is closer to the receiving frame 311 than the lower end of the scraper 331. The scraper 331 is inclined relative to the bearing surface 21, and its upper end is closer to the receiving frame 311 than its lower end. That is, the scraper 331 extends downward from the receiving frame 311 to the discharge frame 312, and the upper end is inclined against the material forward direction, so that the scraper 331 is in a "facing the material" posture.

[0051] The scraper 331 is rotatably connected to the discharge frame 312; the upper end of the scraper 331 is rotatably connected to the side wall of the discharge frame 312 via a rotating shaft, allowing the scraper 331 to swing around the rotating shaft. The first adjustment structure 332 drives the scraper 331 to rotate, thereby adjusting the distance between the lower end of the scraper 331 and the bearing surface 21. The first adjustment structure 332 is movably mounted on the discharge frame 312 and movably connected to the scraper 331 (for example, abutting against the back of the scraper 331 or connected to the middle of the scraper 331 via a connecting rod). By adjusting the extension amount of the first adjustment structure 332, the scraper 331 can be pushed to rotate around the rotating shaft, thereby changing the tilt angle of the scraper 331 relative to the bearing surface 21.

[0052] For example, the discharge frame 312 includes two opposing first side plates 3122 and a top plate 3123, with the top plate 3123 fixedly connected to the upper ends of the two first side plates 3122. The upper end of the scraper 331 is rotatably connected to the two first side plates 3122 of the discharge frame 312 via a pivot, allowing the scraper 331 to swing around the pivot. A first adjustment structure 332 is movably mounted on the top plate 3123 of the discharge frame 312 and movably connected to the scraper 331. The first adjustment structure 332 may include a swing arm 3321 and a telescopic member 3322 (the telescopic member 3322 may be a cylinder or a lead screw). The first end of the swing arm 3321 is fixedly connected to the scraper 331, and the second end of the swing arm 3321 is movably connected to the output end of the telescopic member 3322. The telescopic member 3322 is movably mounted on the top plate 3123 of the discharge frame 312, and drives the scraper 331 to rotate around the pivot by driving the swing arm 3321 to swing.

[0053] During operation, when the telescopic component 3322 drives the swing arm 3321 to move, the scraper 331 rotates around the pivot, and the lower end of the scraper 331 rises and falls accordingly: when it descends, the gap decreases and the output material layer becomes thinner; when it rises, the gap increases and the output material layer becomes thicker, thereby adjusting the distance between the lower end of the scraper 331 and the bearing surface 21. When the material moves forward with the conveying device 20, it first contacts the upper inclined surface of the scraper 331, and is then gradually guided to pass through the gap between the lower end of the scraper 331 and the bearing surface 21, presenting a guiding effect. Compared with the vertically set scraper 331, the inclined scraper 331 has less resistance to the material, is less likely to cause material to accumulate and block in front of the scraper 331, and the material flow is smoother.

[0054] Please refer to Figure 2 , Figure 3 , Figure 5 and Figure 6 , Figure 5 This is a schematic diagram of the internal structure of another material spreading device 30 provided in an embodiment of this application. Figure 6 yes Figure 5 The schematic diagram of the spreading device 30 from another perspective shows that, in an optional embodiment, the spreading device 30 may further include a compaction mechanism 35. The compaction mechanism 35 is disposed between the leveling mechanism 33 and the sterilization device 40, and is located above the bearing surface 21 of the conveying device 20; that is, the compaction mechanism 35 is located downstream of the leveling mechanism 33 and before the sterilization device 40, above the bearing surface 21 of the conveying device 20, and immediately after the leveling mechanism 33. The compaction mechanism 35 is configured to press the edible fungus substrate output from the leveling mechanism 33 to a second preset thickness, the second preset thickness being less than the first preset thickness.

[0055] The compaction mechanism 35 can be a pressure roller 351, a pressure plate, or a belt tensioning device, etc. After the material is scraped to the first preset thickness by the leveling mechanism 33, it is evenly spread on the bearing surface 21 and continues to move forward. When it reaches the position of the compaction mechanism 35, the compaction mechanism 35 applies pressure to the material from above, compressing and densifying the loose material, so that the material thickness is reduced from the first preset thickness to the second preset thickness, and the material enters the irradiation area of ​​the sterilization device 40 in a denser state to receive electron beam irradiation.

[0056] The leveling action can only control the geometric thickness of the material, but it is difficult to change the bulk density of the material in its loose state. The compaction mechanism 35 applies pressure to compress the loose material into shape, giving the material layer good integrity and shape retention. This prevents loosening, displacement, or edge collapse during transportation, ensuring that the material can pass through the irradiation area continuously in a stable and regular form. At the same time, the compaction action can reduce the air gaps inside the material, improve the structural stability of the material layer, and avoid material deformation caused by vibration or movement during transportation, ensuring the consistency of irradiation conditions. In addition, the reduced thickness of the compacted material layer facilitates more uniform penetration of the electron beam into the material layer, improving the consistency of sterilization effect.

[0057] It should be clarified that, in the embodiments of this application, the "preset thickness" in "the spreading device 30 is configured to spread the edible fungus substrate carried on the conveying device 20 into a material layer of preset thickness" refers to the thickness of the material layer after final processing and shaping by the spreading device 30 before the material enters the irradiation area of ​​the sterilization device 40. In embodiments without a compaction mechanism 35, this "preset thickness" is the "first preset thickness" formed by the leveling mechanism 33; in embodiments with a compaction mechanism 35, since the thickness of the material after compaction is the actual thickness that will ultimately receive electron beam irradiation, this "preset thickness" corresponds to the "second preset thickness" formed by the compaction mechanism 35, and in this case, the "first preset thickness" serves as an intermediate transition thickness before compaction, used to distinguish it from the "second preset thickness".

[0058] Please refer to Figure 2 , Figure 3 , Figure 5 and Figure 6 In one optional embodiment, the compaction mechanism 35 may include a pressure roller 351 and a second adjustment structure 352. The pressure roller 351 is movably mounted in the discharge frame 312 and located above the bearing surface 21 of the conveying device 20. The axial direction of the pressure roller 351 is perpendicular to the conveying direction of the conveying device 20. The pressure roller 351 may be a cylindrical stainless steel roller, and its length direction may be parallel to the width direction of the conveyor belt. The second adjustment structure 352 is mounted on the discharge frame 312 and connected to the pressure roller 351. The second adjustment structure 352 is configured to drive the pressure roller 351 to move, thereby adjusting the gap between the pressure roller 351 and the bearing surface 21.

[0059] During equipment operation, after being output by the leveling mechanism 33, the material advances with the conveyor 20 in a uniform layer of a first preset thickness. When the material reaches the position of the pressure roller 351, it passes through the gap between the pressure roller 351 and the bearing surface 21. The pressure roller 351 applies continuous and gradual rolling and compacting pressure to the material, compressing it to a second preset thickness corresponding to the gap size. Since the pressure roller 351 spans the width direction, it can apply uniform pressure to all materials in the width direction simultaneously, ensuring the lateral consistency of the compaction effect; the rolling and compacting method ensures that the material is subjected to continuous and gradual force, making it less likely to experience local over-compression or under-compression. The pressure roller 351 can rotate freely during operation to reduce frictional resistance with the material.

[0060] When it is necessary to change the compaction thickness, the operator drives the pressure roller 351 to move up and down through the second adjustment structure 352, increasing or decreasing the gap between the pressure roller 351 and the bearing surface 21 to adapt to the compaction requirements of different types of edible fungi substrates.

[0061] In one exemplary embodiment, the discharge frame 312 has an arc-shaped guide hole 3121. The second adjustment structure 352 may include a rotating shaft 3521, a rocker arm 3522, and a drive motor. The pressure roller 351 passes through the rotating shaft 3521, with both ends of the pressure roller 351 passing through the arc-shaped guide hole 3121, allowing it to move along the arc-shaped trajectory of the guide hole. The first end of the rocker arm 3522 is rotatably mounted on the outside of the side plate, and the second end of the rocker arm 3522 is rotatably connected to the rotating shaft 3521. The output end of the drive motor is connected to the first end of the rocker arm 3522, driving the rocker arm 3522 to rotate around its first end, thereby causing the end of the pressure roller 351 to move along the arc-shaped guide hole 3121, thus adjusting the gap between the pressure roller 351 and the bearing surface 21.

[0062] Please refer to Figure 2 , Figure 3 , Figure 5 and Figure 6 Optionally, the discharge frame 312 includes two first side plates 3122, which are arranged opposite each other along a first direction d1 and are both located above the bearing surface 21. A pressure roller 351 is installed between the two side plates, and a second adjustment structure 352 is installed on the side plates and movably connected to the pressure roller 351. The width of the pressure roller 351 is equal to or slightly smaller than the distance between the two first side plates 3122. When the material passes under the pressure roller 351, it is constrained within the width range defined by the two first side plates 3122 and cannot overflow to both sides. The width of the material after compaction is consistent with that before compaction.

[0063] Please refer to Figure 2 , Figure 3 , Figure 4 and Figure 5In one optional embodiment, the material spreading mechanism 32 may include a connecting component 321, a plurality of plates 322 and a driving mechanism; the plurality of plates 322 are located in the receiving frame 311 and are arranged at intervals along the first direction d1, and each plate 322 is mounted on the connecting component 321; the connecting component 321 is movably mounted on the receiving frame 311 and connected to the driving mechanism, and the driving mechanism drives the connecting component 321 to reciprocate along the first direction d1, so as to drive the plurality of plates 322 to reciprocate within the receiving frame 311.

[0064] In the material feeding mechanism 32, the connecting component 321 can be two parallel connecting rods or a crossbeam, arranged along the width direction of the conveying device 20; multiple plates 322 are rectangular thin metal plates, arranged at intervals along the length direction of the connecting component 321, and each plate 322 is fixedly installed on the connecting component 321. The connecting component 321 is movably installed on the receiving frame 311. For example, both ends of the connecting component 321 pass through the mounting holes in the side wall of the receiving frame 311 and are connected to the drive mechanism. The drive mechanism can be a cylinder, hydraulic cylinder, or motor combined with a crank-slider mechanism. The receiving frame 311 includes four second side plates connected end to end in sequence. The second side plate closer to the discharge frame 312 is smaller in height, and its bottom is connected to the top plate 3123 of the discharge frame 312, forming the discharge end of the receiving frame 311. The drive mechanism is arranged outside the receiving frame 311, and its output reciprocating motion is transmitted to each plate 322 through the connecting component 321.

[0065] During operation, after the material falls from the supply device 10 into the receiving frame 311, it accumulates on the conveyor belt bearing surface 21 at the bottom of the receiving frame 311. The drive mechanism starts, driving the connecting assembly 321 to reciprocate along the width direction, and all the plates 322 move synchronously. During the movement, each plate 322 continuously disperses and pushes the accumulated material to both sides, so that the distribution of the material in the width direction gradually becomes more uniform; the material flattened by the plates 322 moves forward with the conveyor belt and is transported to the downstream scraping mechanism 33.

[0066] Multiple plates 322 are arranged at intervals along the length of the connecting assembly 321, which is equivalent to setting multiple material-dispersing teeth along the entire width of the conveyor belt. During reciprocating movement, the material is repeatedly dispersed and flattened, making it suitable for edible mushroom substrates with a certain degree of stickiness or uneven particle size. Each plate 322 is driven synchronously by the same connecting assembly 321, eliminating the need for a separate drive for each plate 322, resulting in low equipment cost and convenient maintenance. The connecting assembly 321 is mounted on the receiving frame 311, and the drive mechanism is located outside the receiving frame 311 for easy maintenance and component replacement.

[0067] Please refer to Figure 1In one optional embodiment, the sterilization device 40 may include an electron beam accelerator and a scanning mechanism; the electron beam accelerator generates an electron beam for sterilization, and the scanning mechanism unfolds the electron beam to form a scanning beam, the scanning width of which covers the width of the edible fungus substrate on the bearing surface 21 in the first direction d1.

[0068] The electron beam accelerator can be a DC high-voltage electron accelerator (such as the high-frequency high-voltage Dynamitron, transformer-type ICT, etc., suitable for 2-10MeV) or a radio frequency linear electron accelerator (Linac, suitable for 5-20MeV) to generate a MeV-level electron beam. The electron beam energy can be selected in the range of 2MeV to 20MeV according to the material type and material layer thickness, with a beam current power of not less than 100kW and a scanning non-uniformity of less than 5%. The scanning mechanism can use a scanning magnet or scanning coil, which uses an alternating magnetic field to make the electron beam reciprocate in a direction perpendicular to the conveying direction, thus unfolding it into a scanning beam. The scanning width of the scanning beam covers the entire width of the edible fungus substrate on the bearing surface 21 of the conveying device 20 in the first direction d1, ensuring that all materials within the width range can be irradiated by the electron beam.

[0069] During operation, the electron beam accelerator generates continuous or pulsed high-energy electron beams, which, upon entering the scanning mechanism, are deflected reciprocally along the width direction under the influence of an alternating magnetic field, forming a scanning band covering the entire width of the material. The conveying device 20, carrying a uniformly spread layer of edible fungi substrate, passes beneath the scanning beam at a set speed. The electron beam penetrates the material layer to irradiate and kill the microorganisms within. The material passes through the irradiation area continuously and at a uniform speed, ensuring consistent irradiation dose along the conveying direction. The matching of the material layer thickness with the electron beam energy allows the electron beam to penetrate the material layer, ensuring sufficient sterilization dose is received even at the bottom of the material.

[0070] The small amount of ozone generated during irradiation can be promptly discharged through the equipment's exhaust system, preventing ozone accumulation in the irradiation area from adversely affecting the equipment or materials. The exhaust airflow also cools the scanning window membrane, preventing it from overheating. The electron beam irradiation dose can be flexibly controlled by adjusting the accelerator beam intensity and the conveyor speed, allowing for rapid adjustment of process parameters based on different material types and sterilization requirements.

[0071] Please refer to Figure 1 and Figure 7 , Figure 7 This is a schematic diagram of a supply device provided in an embodiment of this application. The supply device includes a housing and a stirring mechanism, which is installed in the housing to stir and mix the edible fungus substrate inside the housing. A material outlet is provided at the bottom of the housing, and a discharge valve is installed on the outside of the housing to control the opening and closing of the material outlet. The stirred and mixed edible fungus substrate is output to the feeding structure through the material outlet.

[0072] In one optional embodiment, the inoculation and packaging device may include a storage mechanism, an inoculation mechanism, and a packaging mechanism. The storage mechanism is located downstream of the conveying device and is used to receive and temporarily store the sterile edible fungi substrate after electron beam irradiation sterilization. The inoculation mechanism is located below the storage mechanism, and the packaging mechanism is located downstream of the inoculation mechanism. The sterile edible fungi substrate in the storage mechanism is inoculated by the inoculation mechanism and then sent to the packaging mechanism for bagging. The inoculation mechanism may adopt an integrated bagging and inoculation machine structure, for example, by simultaneously spraying liquid inoculum into the interior and surface of the material through spray holes on the hollow auger shaft and / or the jacketed sleeve during the screw conveyor process, achieving large-area uniform inoculation. The number of storage, inoculation, and packaging mechanisms can be set to multiple groups according to production capacity requirements. Multiple groups of mechanisms can be arranged side-by-side sharing the upstream conveying device, or they can be connected to independent conveying channels to achieve multi-station parallel operation and further improve production efficiency.

[0073] Please refer to Figure 1 and Figure 5 This application also provides a continuous production method for edible fungi substrate based on electron beam sterilization. The method is applied to the continuous production equipment for edible fungi substrate based on electron beam sterilization in the above embodiments, and includes: S1: Provide substrate for edible fungi.

[0074] S2: Continuously convey the edible fungus substrate along the conveying direction.

[0075] S3: Before the edible fungus substrate enters the irradiation area, the edible fungus substrate in continuous conveying state is subjected to online material laying treatment so that the edible fungus substrate forms a continuous material layer on the bearing surface 21.

[0076] S4: The continuous material layer is continuously conveyed through the irradiation area, and the continuous material layer is sterilized by online irradiation using an electron beam to obtain a sterile edible fungus substrate.

[0077] S5: Inoculate the sterile edible fungus substrate that has been sterilized by electron beam irradiation, and package the inoculated edible fungus substrate.

[0078] This method can be implemented using the continuous production equipment for edible fungi substrate based on electron beam sterilization as described above. However, the method itself is not limited to this specific equipment structure. Any combination of equipment that can achieve continuous conveying, online material spreading, online irradiation, and online packaging can be used to implement this method.

[0079] In one specific implementation, the operator first checks the status of each component of the equipment, confirming that there is sufficient material in the supply device 10, the conveying device 20 is operating normally, all mechanisms of the spreading device 30 have been adjusted to the required parameters, the electron beam accelerator of the sterilization device 40 has been preheated to a stable operating state, and the inoculation and packaging device 50 is ready with packaging materials. The equipment is then started, and materials are continuously output from the supply device 10, initiating the sterilization and packaging process.

[0080] It is understandable that "continuous material layer" refers to the uninterrupted, continuous thin layer of material formed on the bearing surface 21 along the conveying direction, rather than a discrete unit form carried by containers such as pallets or boxes. After the material is spread and flattened on the bearing surface 21, it moves forward seamlessly along the conveying direction, forming a continuous "material belt". This continuous material layer has no interruption or interval in the conveying direction, and there is always material covering the area below the electron beam scanning zone, eliminating the "material-free period" caused by pallet gaps in palletized transport. The term "online" means that the material spreading process is an integral part of the continuous conveying process, and the material is spread in real time during the conveying process without the need for pauses or offline processing.

[0081] In this way, the material is in continuous motion from supply to packaging, and the material laying and conveying are carried out simultaneously, forming a seamless continuous material layer without stopping or slowing down. The electron beam irradiates the material throughout the entire irradiation window, resulting in higher utilization and a larger processing capacity per unit time. The irradiation dose received by each section of material is uniform, which is beneficial to the stability of product quality between batches. At the same time, irradiation sterilization is naturally completed in the continuous conveying process, no longer occupying extra time as a separate batch process, which can shorten the overall production cycle, improve production efficiency, and reduce equipment idle rate.

[0082] In one optional implementation, the material spreading process in S3 includes: S31: Spread the edible fungus substrate along the first direction d1, which is perpendicular to the conveying direction. After the material falls from the supply device 10 into the receiving mechanism 31, the spreading mechanism 32 moves back and forth along the first direction d1 (i.e., the width direction of the conveyor belt, perpendicular to the conveying direction) under the drive mechanism. The plate 322 of the spreading mechanism 32 repeatedly disperses and pushes the material accumulated at the bottom of the receiving mechanism 31 to both sides, so that the material is distributed more evenly in the width direction.

[0083] S32: The surface of the spread edible mushroom substrate is smoothed to control its thickness to a first preset thickness. The spread material moves forward with the conveyor belt and reaches the scraper 331 in the discharge frame 312. A preset gap (e.g., 30mm) is maintained between the scraper 331 and the bearing surface 21. When the material passes under the gap, material exceeding the gap thickness is blocked by the scraper 331, allowing only material with a thickness less than or equal to the gap to pass through, thereby controlling the material thickness to the first preset thickness (e.g., 30mm).

[0084] S33: Apply pressure to the leveled edible mushroom substrate, compressing its thickness from the first preset thickness to the second preset thickness to increase its bulk density. The second preset thickness is less than the first preset thickness. The leveled material continues to advance, reaching the position of the pressure roller 351 of the compaction mechanism 35. A small gap (e.g., 20mm) is maintained between the pressure roller 351 and the bearing surface 21. As the material passes under the pressure roller 351, the roller applies downward crushing pressure, compressing the loose material into a dense state, reducing its thickness from the first preset thickness (30mm) to the second preset thickness (20mm), thus increasing the bulk density. In this way, through compaction and shaping, the material layer achieves good integrity and shape retention, making it less prone to loosening, displacement, or edge collapse during transport, ensuring that the material can continuously pass through the irradiation area in a stable and regular shape.

[0085] In an optional embodiment, in S33, the compaction degree of the compaction mechanism 35 (i.e., the bulk density range corresponding to the second preset thickness) can be determined through conventional process tests based on the material characteristics of the edible fungus substrate and the electron beam energy value, with the premise of ensuring sterilization effect.

[0086] It should be noted that the dimensions of the areas may have been exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element is referred to as "on top of" another element, it can be directly on the other element, or there may be intermediate elements. Additionally, it is understood that when an element is referred to as "below" another element, it can be directly below the other element, or there may be more than one intermediate element. Furthermore, it is also understood that when an element is referred to as "between" two elements, it can be the only layer between the two elements, or there may be more than one intermediate element. Similar reference numerals throughout indicate similar elements.

[0087] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0088] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. A continuous production equipment for edible fungi substrate based on electron beam sterilization, characterized in that, include: The supply device is configured to supply substrate for edible fungi. A conveying device, located downstream of the supply device, is used to receive and continuously convey the edible fungus substrate; A spreading device is located on the conveying path of the conveying device, and the spreading device is configured to spread the edible fungus substrate carried on the conveying device into a material layer of a preset thickness. A sterilization device is located on the conveying path of the conveying device and downstream of the spreading device, and performs electron beam irradiation sterilization on the edible fungus substrate. An inoculation and packaging device, located downstream of the conveying device, receives the edible fungi substrate sterilized by electron beam irradiation and performs inoculation and packaging.

2. The continuous production equipment for edible fungi substrate based on electron beam sterilization according to claim 1, characterized in that, The material spreading device includes: A receiving mechanism is provided on the conveying path of the conveying device. The receiving mechanism has an inlet end and an outlet end to receive the edible fungus substrate conveyed by the upstream conveying device. A leveling mechanism is installed at the discharge end of the receiving mechanism or downstream of the receiving mechanism. The leveling mechanism has a preset gap with the bearing surface of the conveying device to scrape the edible fungus substrate output from the receiving mechanism to a first preset thickness.

3. The continuous production equipment for edible fungi substrate based on electron beam sterilization according to claim 2, characterized in that, The spreading device further includes a spreading mechanism, which is installed inside or downstream of the receiving mechanism and positioned upstream of the leveling mechanism, to spread the edible fungus substrate falling into the receiving mechanism along a first direction, the first direction being perpendicular to the conveying direction of the conveying device.

4. The continuous production equipment for edible fungi substrate based on electron beam sterilization according to claim 3, characterized in that, The receiving mechanism includes a receiving frame and a discharging frame. Both the receiving frame and the discharging frame are located above the bearing surface of the conveying device. The spreading mechanism is installed in the receiving frame, and the discharging frame is connected to the discharging end of the receiving frame and has a discharging port. The leveling mechanism includes a scraper and a first adjusting structure. The scraper is movably installed in the discharge frame, and the first adjusting structure is installed on the discharge frame and connected to the scraper. The first adjusting structure is configured to drive the scraper to move in order to adjust the gap between the scraper and the bearing surface.

5. The continuous production equipment for edible fungi substrate based on electron beam sterilization according to claim 4, characterized in that, The scraper is inclined relative to the bearing surface, and the upper end of the scraper is closer to the receiving frame than the lower end of the scraper. The scraper is rotatably connected to the discharge frame. The first adjustment structure drives the scraper to rotate, thereby adjusting the distance between the lower end of the scraper and the bearing surface.

6. The continuous production equipment for edible fungi substrate based on electron beam sterilization according to claim 4, characterized in that, The material spreading device also includes a compaction mechanism, which is disposed between the leveling mechanism and the sterilization device and located above the bearing surface of the conveying device; The compaction mechanism is configured to compress the edible fungus substrate output from the leveling mechanism to a second preset thickness, the second preset thickness being less than the first preset thickness.

7. The continuous production equipment for edible fungi substrate based on electron beam sterilization according to claim 6, characterized in that, The compaction mechanism includes a pressure roller and a second adjustment structure; The pressure roller is movably installed in the discharge frame and located above the bearing surface of the conveying device, and the axial direction of the pressure roller is perpendicular to the conveying direction of the conveying device; The second adjustment structure is mounted on the discharge frame and connected to the pressure roller. The second adjustment structure is configured to drive the pressure roller to move in order to adjust the gap between the pressure roller and the bearing surface.

8. The continuous production equipment for edible fungi substrate based on electron beam sterilization according to claim 7, characterized in that, The material laying mechanism includes a connecting component, multiple plates, and a driving mechanism; Multiple plates are located in the receiving frame and are arranged at intervals along the first direction, and each plate is mounted on the connecting assembly; The connecting component is movably mounted on the receiving frame and connected to the driving mechanism. The driving mechanism drives the connecting component to reciprocate along the first direction, thereby driving the multiple plates to reciprocate within the receiving frame.

9. The continuous production equipment for edible fungi substrate based on electron beam sterilization according to claim 1, characterized in that, The conveying device includes a conveyor belt structure, the discharge end of the supply device is provided with a feeding structure, and the inlet end of the inoculation and packaging device is provided with a discharging structure. The end of the feeding structure is located above the spreading device, and the feeding structure receives the edible fungus substrate output by the supply device and transports it to the spreading device. The spreading device is located at the front end of the conveyor belt structure. The conveyor belt structure extends from the spreading device through the irradiation area of ​​the sterilization device and carries the edible fungus substrate treated by the spreading device through the irradiation area continuously. The feeding structure is located between the sterilization device and the inoculation and packaging device, and conveys the edible fungus substrate that has been sterilized by irradiation to the inoculation and packaging device. The feeding structure is in a sterile environment.

10. The continuous production equipment for edible fungi substrate based on electron beam sterilization according to claim 1, characterized in that, The sterilization device includes an electron beam accelerator and a scanning mechanism; The electron beam accelerator generates an electron beam for sterilization, and the scanning mechanism unfolds the electron beam to form a scanning beam. The scanning width of the scanning beam covers the width of the edible fungus substrate on the support surface in the first direction. The supply device includes a housing and a stirring mechanism, wherein the stirring mechanism is installed in the housing; The inoculation and packaging device includes a storage mechanism, an inoculation mechanism, and a packaging mechanism. The storage mechanism is located downstream of the conveying device, the inoculation mechanism is located below the storage mechanism, and the packaging mechanism is located downstream of the inoculation mechanism.

11. A continuous production method for edible fungi substrate based on electron beam sterilization, wherein the method is applied to the continuous production equipment for edible fungi substrate based on electron beam sterilization as described in any one of claims 1 to 10, characterized in that, The method includes: S1: Provides substrate for edible fungi; S2: The edible fungus substrate is continuously conveyed along the conveying direction; S3: Before the edible fungus substrate enters the irradiation area, the edible fungus substrate in the continuous conveying state is subjected to online material spreading treatment so that the edible fungus substrate forms a continuous material layer of a preset thickness on the bearing surface; S4: The continuous material layer is continuously conveyed through the irradiation area, and the continuous material layer is subjected to online irradiation sterilization treatment using an electron beam to obtain a sterile edible fungus substrate; S5: Inoculate the sterile edible fungus substrate that has been sterilized by electron beam irradiation, and package the inoculated edible fungus substrate.

12. The method according to claim 11, characterized in that, The material spreading process in S3 includes: S31: Spread the edible fungus substrate along a first direction, which is perpendicular to the conveying direction; S32: Smooth the surface of the spread-out edible fungus substrate and control the thickness of the edible fungus substrate to a first preset thickness; S33: Apply pressure to the leveled edible fungus substrate to compress the thickness of the edible fungus substrate from the first preset thickness to the second preset thickness, so as to increase the bulk density of the edible fungus substrate, wherein the second preset thickness is less than the first preset thickness.

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