A heating element assembly and electronic atomization device

Abstract

The present application relates to the technical field of aerosol atomization, in particular to a heating element assembly and an electronic atomization device. The heating element assembly comprises a first heat-conducting base body, a second heat-conducting base body and a heating base body. The first heat-conducting base body has a first liquid-conducting channel therein, and the second heat-conducting base body has a second liquid-conducting channel therein. The first heat-conducting base body and the second heat-conducting base body are base bodies of different materials, and the inner diameter of the first liquid-conducting channel is greater than the inner diameter of the second liquid-conducting channel. The first heat-conducting base body and the second heat-conducting base body are base bodies of different materials, and the inner diameter of the first liquid-conducting channel is greater than the inner diameter of the second liquid-conducting channel. Since the heating element assembly comprises the first heat-conducting base body and the second heat-conducting base body of different materials, the heat-conducting base body of the heating element assembly is composed of two heat-conducting base bodies of different materials, and the two heat-conducting base bodies of different materials can overcome the problems of small atomization amount, low atomization efficiency, poor smoking taste, liquid leakage and burnt wick caused by the single-material heat-conducting base body.

Description

Technical Field

[0001] This invention relates to the field of aerosol atomization technology, specifically to a heating element assembly and an electronic atomization device. Background Technology

[0002] In a traditional electronic atomization device, the heating element assembly is located below the liquid storage chamber. The heating element assembly has a liquid guiding channel. The liquid atomizing liquid in the liquid storage chamber flows into the liquid guiding channel of the heating element assembly under the action of gravity. After the heating element assembly is powered on and heated, the atomizing liquid passing through the liquid guiding channel is heated and atomized and enters the atomization channel.

[0003] Traditional heating element components consist of a stacked thermally conductive substrate and a heating substrate. The thermally conductive substrate is a single material, such as a pure ceramic substrate or a pure glass substrate. Pure ceramic substrates have problems such as low atomization volume in the first few puffs, low atomization efficiency, poor puffing experience, and wicking issues. Pure glass substrates have problems such as leakage and wicking issues. Summary of the Invention

[0004] This invention provides a heating element assembly and an electronic atomization device to solve the problems of small atomization volume, low atomization efficiency, poor inhalation taste, leakage, and wicking that are common in traditional heating element assemblies with single-material thermally conductive substrates.

[0005] In one embodiment, a heating element assembly is provided, comprising:

[0006] A first thermally conductive substrate, wherein the first thermally conductive substrate has a first liquid-conducting channel;

[0007] The second thermally conductive substrate has a first surface and a second surface facing away from each other. The first thermally conductive substrate is disposed on the first surface of the second thermally conductive substrate. The second thermally conductive substrate has a second liquid channel, which is connected to the first liquid channel.

[0008] A heating substrate, at least partially disposed on the second surface of the second thermally conductive substrate, the heating substrate being used to generate heat energy;

[0009] The first thermally conductive substrate and the second thermally conductive substrate are made of different materials, and the inner diameter of the first liquid guiding channel is larger than the inner diameter of the second liquid guiding channel.

[0010] In one embodiment, the first thermally conductive substrate is a ceramic substrate, and the first thermally conductive substrate is formed and fixed on the first surface of the second thermally conductive substrate by injection molding and sintering.

[0011] In one embodiment, a portion of the first thermally conductive substrate is embedded within the second liquid-conducting channel.

[0012] In one embodiment, the second thermally conductive substrate is a glass substrate, and the second liquid channel is a straight hole extending along the thickness direction of the second thermally conductive substrate.

[0013] In one embodiment, the thickness of the second thermally conductive substrate is less than the thickness of the first thermally conductive substrate; or, the thickness of the second thermally conductive substrate is less than or equal to 2 mm.

[0014] In one embodiment, the heating substrate includes a heating part and a connecting part. The heating part is disposed on the second surface of the second heat-conducting substrate. One end of the connecting part is connected to the heating part, and the other end of the connecting part extends to the first surface of the second heat-conducting substrate. The connecting part fixes the heating substrate to the second heat-conducting substrate.

[0015] In one embodiment, the portion of the connection on the first surface is embedded in the first thermally conductive substrate.

[0016] In one embodiment, the device further includes a mounting base having an inlet, an outlet, and a mounting cavity, wherein the inlet, the mounting cavity, and the outlet are sequentially connected. The inlet of the mounting base is used to connect with the outlet of the liquid storage cavity, and the outlet of the mounting base is used to connect with the atomizing channel. The first thermally conductive substrate, the second thermally conductive substrate, and the heating substrate are installed in the mounting cavity of the mounting base, wherein the first surface of the second thermally conductive substrate faces the inlet, and the second surface of the second thermally conductive substrate faces the outlet.

[0017] In one embodiment, the heating substrate further includes a side surface located between the first surface and the second surface, a portion of the connecting portion is located on the side surface of the heating substrate, and the side surface of the heating substrate and the inner wall of the mounting cavity are separated by the connecting portion to form a return air channel.

[0018] In one embodiment, the mounting base is an elastic silicone structure, and the outer wall of the mounting base is provided with an annular protruding sealing portion.

[0019] In one embodiment, an electronic atomizing device is provided, comprising:

[0020] The housing has a liquid storage chamber and an atomizing chamber that communicate with each other. The liquid storage chamber is used to store atomizing liquid, and the liquid storage chamber has a liquid outlet that communicates with the atomizing chamber.

[0021] A heating element assembly is installed inside the atomizing chamber.

[0022] In one embodiment, the device further includes a circuit board, a positive terminal, a negative terminal, and an elastic bracket installed within the housing. The positive terminal and the negative terminal are mounted on the elastic bracket. One end of the positive terminal is electrically connected to the circuit board, and the other end of the positive terminal is electrically connected to the heating substrate. One end of the negative terminal is electrically connected to the circuit board, and the other end of the negative terminal is electrically connected to the heating substrate.

[0023] According to the heating element assembly and electronic atomizing device of the above embodiments, since the heating element assembly includes a first heat-conducting substrate and a second heat-conducting substrate of different materials, the heat-conducting substrate of the heating element assembly is composed of two heat-conducting substrates of different materials. The two heat-conducting substrates of different materials can overcome the problems of small atomization amount, low atomization efficiency, poor inhalation taste, leakage and clogging caused by a single heat-conducting substrate.

[0024] The first heat-conducting substrate is a ceramic substrate, and the second heat-conducting substrate is a glass substrate. The ceramic and glass substrates are combined, with the heating element located on the glass substrate. This design allows both the ceramic and glass substrates to be thinner than a single-material heat-conducting substrate. A thinner ceramic substrate effectively enhances liquid conductivity, making liquid flow smoother. During aspiration, it prevents the ceramic substrate from absorbing too much heat, which could lead to insufficient atomization temperature and affect the amount and feel of atomization. Adding a glass substrate below the ceramic substrate effectively increases the strength of the heating element, avoiding the strength loss issues caused by the thinner ceramic substrate. The glass substrate effectively isolates the lower surface of the ceramic substrate from heat absorption, preventing the heat from the heating area from being absorbed by other areas. This focused temperature allows for more complete atomization of the liquid, improving the flavor.

[0025] The combination of ceramic and glass substrates can effectively improve liquid conduction and retention capabilities. A thinner ceramic substrate results in a shorter atomized liquid path, allowing for rapid supply of liquid to the heating area during suction. Adding a glass substrate beneath the ceramic substrate eliminates the need for liquid retention on the lower surface, enabling the ceramic's pore size and porosity to be adjusted extensively based on the atomized liquid concentration, achieving optimal compatibility between the heating element and the atomized liquid. This combination offers the advantages of leak-proof operation and rapid liquid flow, preventing wick clogging caused by blocked liquid channels.

[0026] The thermal conductivity of the glass substrate is higher than that of the porous ceramic substrate. The heating substrate is fixed to the glass substrate, which allows the glass substrate to disperse the heat generated by the heating substrate more quickly. This results in more uniform heating of both the glass and ceramic substrates, effectively avoiding problems such as liquid splattering or core burning caused by excessively high or low local temperatures, while also improving atomization efficiency.

[0027] Ceramic substrates can form a larger inner diameter first liquid-conducting channel, while glass substrates can form a smaller inner diameter second liquid-conducting channel. Ceramic substrates are typically manufactured using injection molding and sintering. After sintering, ceramic particles are formed on the surface of the ceramic substrate. These particles will detach under long-term erosion by the atomizing liquid and high-temperature atomization. Because the glass substrate has a smaller second liquid-conducting channel, the detached ceramic particles are blocked by the glass substrate, preventing them from falling into the atomization channel and thus avoiding entry into the consumer's mouth with the aerosol during suction, improving the consumer experience. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of a heating element assembly according to one embodiment;

[0029] Figure 2 This is a schematic diagram of the structure of a heating element assembly according to one embodiment;

[0030] Figure 3 This is an exploded structural diagram of a heating element assembly according to one embodiment, in which the connection portion of the heating substrate is hidden;

[0031] Figure 4 This is a cross-sectional view of a heating element assembly according to one embodiment, along a section perpendicular to a third direction.

[0032] Figure 5 This is a schematic diagram of the structure of a second heat-conducting substrate and a heat-generating substrate according to one embodiment;

[0033] Figure 6 A cross-sectional view of a mounting base according to one embodiment;

[0034] Figure 7 This is a schematic diagram of the structure of a heating element assembly according to one embodiment;

[0035] Figure 8 This is a schematic diagram of the structure of a heating element assembly according to one embodiment;

[0036] Figure 9 This is a cross-sectional view of a heating element assembly according to one embodiment, along a section perpendicular to a third direction.

[0037] Figure 10 A cross-sectional view of an electronic atomizing device according to one embodiment along a section perpendicular to a third direction;

[0038] Figure 11 for Figure 10 A magnified view of part A in the middle;

[0039] The accompanying diagrams are labeled as follows:

[0040] 100-Heating element assembly, 1-First heat-conducting substrate, 11-First liquid-conducting channel, 2-Second heat-conducting substrate, 21-First surface, 22-Second surface, 23-Second liquid-conducting channel, 3-Heating substrate, 31-Heating part, 32-Connecting part, 33-Electrical connection part, 4-Fixing bracket, 41-Inlet, 42-Outlet, 43-Mounting cavity, 44-Return gas channel, 45-Sealing part;

[0041] 200-Shell, 210-Liquid storage chamber, 2101-Liquid outlet, 220-Atomizing chamber, 230-Mouth, 240-Atomizing channel, 250-Circuit board, 260-Battery, 270-Positive terminal, 280-Negative terminal, 290-Elastic support, 300-Rigid support. Detailed Implementation

[0042] Traditional heating element components consist of a stacked thermally conductive substrate and a heating substrate, wherein the thermally conductive substrate is a pure ceramic substrate or a pure glass substrate.

[0043] When the thermally conductive substrate is a pure ceramic substrate, the following problems exist:

[0044] During inhalation, the heating substrate heats up, but the temperature rises in the first half is absorbed by the ceramic substrate, causing the temperature of the heating substrate to drop and the atomized liquid to burn incompletely. As a result, the atomization volume is small, the atomization efficiency is low, and the inhalation taste is poor in the first few puffs.

[0045] During assembly, the substrate needs to maintain a certain thickness to meet the assembly strength. Otherwise, it will cause the ceramic to break during assembly. If the substrate is too thin, the assembly will be fragile and leak. If the substrate is too thick, the liquid will not flow smoothly and the core will stick. Therefore, the substrate thickness should be designed only when the above two points are balanced. The substrate thickness directly affects the liquid discharge efficiency. Continuous suction or high-power suction may cause the core to stick.

[0046] The heating element with a pure ceramic substrate is entirely below the liquid surface. When suction is performed, the temperature around the heating substrate will be higher than that of other areas. When the atomized liquid in the low-temperature area comes into instantaneous contact with the high temperature around the heating wire, it will cause liquid explosion.

[0047] The ceramic substrate is relatively thick. To ensure that no vacuum occurs in the atomizing chamber during suction, a return air groove needs to be added to the bottom of the atomizing chamber and the ceramic sealing silicone mounting surface. The return air groove is generally 0.3mm wide and 0.15mm deep. This return air groove requires very high precision. If the return air groove is too large, the return air will be too fast and cause ceramic leakage. If the return air groove is too small, it will be easy to get blocked, affecting the lower liquid core. It is difficult to achieve the required precision in actual processing or production, and the processing difficulty is high.

[0048] When the thermally conductive substrate is a pure glass substrate, the following problems exist:

[0049] The heating element with a pure glass substrate mainly conducts liquid by drilling micropores in the glass substrate. The pore diameter is mostly 0.01-0.05mm. If the pore diameter is too small, it needs to be processed with professional laser equipment, which has disadvantages such as high processing difficulty, high cost, and difficulty in controlling the pore diameter accuracy.

[0050] The liquid guiding holes of the pure glass substrate are straight holes. If the channel is too straight and the hole diameter is large, the liquid will flow too fast and cause leakage. If the hole diameter is small, the liquid will not flow smoothly and the core will burn. However, its advantage is that the atomized liquid can restore the original flavor to the maximum extent when it is drawn in, and no other odors will be produced.

[0051] Based on the above analysis, this application proposes a heating element assembly with multiple layers of thermally conductive substrates of different materials. The heating element assembly includes a first thermally conductive substrate and a second thermally conductive substrate of different materials. The thermally conductive substrate of the heating element assembly is composed of two thermally conductive substrates of different materials. The two thermally conductive substrates of different materials can overcome the problems of small atomization amount, low atomization efficiency, poor sucking taste, leakage and wicking caused by a single thermally conductive substrate.

[0052] The first heat-conducting substrate is a ceramic substrate, and the second heat-conducting substrate is a glass substrate. The ceramic and glass substrates are combined, with the heating element located on the glass substrate. This design allows both the ceramic and glass substrates to be thinner than a single-material heat-conducting substrate. A thinner ceramic substrate effectively enhances liquid conductivity, making liquid flow smoother. During aspiration, it prevents the ceramic substrate from absorbing too much heat, which could lead to insufficient atomization temperature and affect the amount and feel of atomization. Adding a glass substrate below the ceramic substrate effectively increases the strength of the heating element, avoiding the strength loss issues caused by the thinner ceramic substrate. The glass substrate effectively isolates the lower surface of the ceramic substrate from heat absorption, preventing the heat from the heating area from being absorbed by other areas. This focused temperature allows for more complete atomization of the liquid, improving the flavor.

[0053] The combination of ceramic and glass substrates can effectively improve liquid conduction and retention capabilities. A thinner ceramic substrate results in a shorter atomized liquid path, allowing for rapid supply of liquid to the heating area during suction. Adding a glass substrate beneath the ceramic substrate eliminates the need for liquid retention on the lower surface, enabling the ceramic's pore size and porosity to be adjusted extensively based on the atomized liquid concentration, achieving optimal compatibility between the heating element and the atomized liquid. This combination offers the advantages of leak-proof operation and rapid liquid flow, preventing wick clogging caused by blocked liquid channels.

[0054] The thermal conductivity of the glass substrate is higher than that of the porous ceramic substrate. The heating substrate is fixed to the glass substrate, which allows the glass substrate to disperse the heat generated by the heating substrate more quickly. This results in more uniform heating of both the glass and ceramic substrates, effectively avoiding problems such as liquid splattering or core burning caused by excessively high or low local temperatures, while also improving atomization efficiency.

[0055] Ceramic substrates can form a larger inner diameter first liquid-conducting channel, while glass substrates can form a smaller inner diameter second liquid-conducting channel. Ceramic substrates are typically manufactured using injection molding and sintering. After sintering, ceramic particles are formed on the surface of the ceramic substrate. These particles will detach under long-term erosion by the atomizing liquid and high-temperature atomization. Because the glass substrate has a smaller second liquid-conducting channel, the detached ceramic particles are blocked by the glass substrate, preventing them from falling into the atomization channel and thus avoiding entry into the consumer's mouth with the aerosol during suction, improving the consumer experience.

[0056] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by associated similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the invention. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present invention are not shown or described in the specification. This is to avoid obscuring the core parts of the invention with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0057] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0058] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this invention, unless otherwise specified, include both direct and indirect connections (linkages).

[0059] Please refer to Figures 1 to 4In one embodiment, a heating element assembly 100 is provided for installation within an electronic atomizing device, with the heating element assembly 100 located below the liquid storage chamber within the electronic atomizing device. The heating element assembly 100 generates heat energy to heat and atomize the atomized liquid drawn from the liquid storage chamber. For ease of description, the heating element assembly 100 has three perpendicular directions: a first direction, a second direction, and a third direction. The first direction is the thickness direction of the heating element assembly 100 and also the direction of liquid flow. The second direction is the length direction of the heating element assembly 100, and the third direction is the width direction of the heating element assembly 100. When the heating element assembly 100 is installed within the electronic atomizing device, the first direction is the direction in which the electronic atomizing device is upright, and the mouthpiece of the electronic atomizing device is located at one end of the electronic atomizing device in the first direction.

[0060] The heating element assembly 100 mainly includes a first thermally conductive substrate 1, a second thermally conductive substrate 2, and a heating substrate 3. The first thermally conductive substrate 1 and the second thermally conductive substrate 2 are stacked and installed along a first direction, that is, the first thermally conductive substrate 1 and the second thermally conductive substrate 2 are stacked and installed along the thickness direction. In the first direction, that is, the thickness direction, the second thermally conductive substrate 2 has a first surface 21 and a second surface 22 facing away from each other. The first thermally conductive substrate 1 is disposed on the first surface 21 of the second thermally conductive substrate 2, and at least a portion of the heating substrate 3 is disposed on the second surface 22 of the second thermally conductive substrate 2.

[0061] The first thermally conductive substrate 1 and the second thermally conductive substrate 2 are thermally conductive substrates made of different materials. Preferably, the first thermally conductive substrate 1 is a ceramic substrate, and the second thermally conductive substrate 2 is a glass substrate, and the first thermally conductive substrate 1 is a pure ceramic substrate, and the second thermally conductive substrate 2 is a pure glass substrate. In other embodiments, the first thermally conductive substrate 1 and / or the second thermally conductive substrate 2 can be substrates of other materials, for example, the first thermally conductive substrate 1 is a mixed substrate of ceramic and other materials, and the second thermally conductive substrate 2 is a mixed substrate of glass and other materials.

[0062] In this embodiment, the first thermally conductive substrate 1 has a first liquid guiding channel 11. The first thermally conductive substrate 1 is a ceramic substrate, and the first liquid guiding channel 11 is an irregular channel formed by injection molding. A complex and interconnected gap space is distributed within the first thermally conductive substrate 1, forming the first liquid guiding channel 11. When the first thermally conductive substrate 1 is installed in the atomization chamber of an electronic atomizing device, the sides of the first thermally conductive substrate 1 in the second and third directions are sealed, allowing the first thermally conductive substrate 1 to conduct the atomizing liquid along the first direction.

[0063] The second thermally conductive substrate 2 has a second liquid guiding channel 23. The second thermally conductive substrate 2 is a glass substrate, and the second liquid guiding channel 23 is a straight hole extending along a first direction. The glass substrate can be processed with a laser to form the second liquid guiding channel 23. Multiple second liquid guiding channels 23 are arrayed within the second thermally conductive substrate 2. One end of the second liquid guiding channel 23 is located on the first surface 21, and the other end of the second liquid guiding channel 23 is located on the second surface 22. After the first liquid guiding substrate 1 and the second liquid guiding substrate 2 are stacked and installed, the first liquid guiding channel 11 and the second liquid guiding channel 23 are connected.

[0064] The inner diameter of the first liquid guiding channel 11 is larger than the inner diameter of the second liquid guiding channel 23. The first liquid guiding channel 11 is an irregular channel, and its narrowest point has a larger inner diameter than that of the second liquid guiding channel 23. The pore size of the second liquid guiding channel 23 is approximately 0.01-0.05 mm. The second liquid guiding channel 23 is a glass micropore. The glass micropore can form a capillary adsorption effect, which can actively draw the atomized liquid in the first liquid guiding channel 11 into the glass micropore, thereby improving the atomization efficiency. Furthermore, the active adsorption of the glass micropore can also prevent the atomized liquid from leaking out when not in use.

[0065] The first thermally conductive substrate 1 is a ceramic substrate, and the second thermally conductive substrate 2 is a glass substrate. Both ceramic and glass substrates have good thermal conductivity, which can improve heating atomization efficiency. The heating substrate 3 is a heating element, which is used to generate heat energy. The heating element is a metal sheet that can convert electrical energy into heat energy. For example, the heating substrate 3 is a copper sheet structure.

[0066] At least a portion of the heating substrate 3 is disposed on the second surface 22 of the second thermally conductive substrate 2. Preferably, the majority of the heating substrate 3 is located on the second surface 22 of the second thermally conductive substrate 2, such that the heat generated by the heating substrate 3 is close to the outlet of the second liquid channel 23 of the second thermally conductive substrate 2, allowing the atomized liquid to be quickly discharged after atomization.

[0067] In this embodiment, the manufacturing method of the heating element assembly 100 is as follows:

[0068] The glass sheet is cut into a block structure, and then a second liquid guiding channel 23 is processed on the glass sheet by laser drilling to form a glass substrate, that is, to form a second heat-conducting substrate 2.

[0069] Please refer to Figure 5 The sheet-shaped heating substrate 3 is fixedly installed on the second surface 22 of the second heat-conducting substrate 2;

[0070] Please refer to Figure 1 and Figure 2The ceramic slurry is molded and fixed onto the first surface 21 of the second thermally conductive substrate 2 by injection molding and sintering, thereby forming the first thermally conductive substrate 1 on the first surface 21 of the second thermally conductive substrate 2.

[0071] In this embodiment, the heating element assembly 100 is installed in the atomization chamber 220 of the electronic atomization device. In the first direction, the heating element assembly 100 is located below the liquid storage chamber 210 of the electronic atomization device, and the atomization channel 240 of the electronic atomization device is located below the heating element assembly 100. The first heat-conducting substrate 1 is closer to the liquid storage chamber 210 than the second heat-conducting substrate 2, and the second heat-conducting substrate 2 is closer to the atomization channel 240 than the first heat-conducting substrate 1.

[0072] In use, the atomized liquid in the storage chamber 210 is discharged from the outlet 2101 of the storage chamber 210 and enters the first liquid guiding channel 11 of the first heat-conducting substrate 1. The atomized liquid then enters the second liquid guiding channel 23 from the first liquid guiding channel 11. After the heating substrate 3 is energized and generates heat, the heat is successively transferred to the second heat-conducting substrate 2 and the first heat-conducting substrate 1 to heat and atomize the atomized liquid in the first liquid guiding channel 11 and the second liquid guiding channel 23. The aerosol formed by heating and atomization is discharged from the first liquid guiding channel 11 and enters the atomization channel 240, and is finally inhaled by the consumer.

[0073] In this embodiment, since the heating element assembly 100 includes a first heat-conducting substrate 1 and a second heat-conducting substrate 2 of different materials, the heat-conducting substrate of the heating element assembly 100 is composed of two heat-conducting substrates of different materials. The two heat-conducting substrates of different materials can overcome the problems of small atomization amount, low atomization efficiency, poor sucking taste, leakage and clogging caused by a single heat-conducting substrate.

[0074] The first heat-conducting substrate 1 is a ceramic substrate, and the second heat-conducting substrate 2 is a glass substrate. The ceramic and glass substrates are combined, and the heating element is located on the glass substrate. This configuration allows both the ceramic and glass substrates to be thinner than a single-material heat-conducting substrate. A thinner ceramic substrate effectively enhances liquid conductivity, making liquid flow smoother. During aspiration, it prevents the ceramic substrate from absorbing too much heat, which could lead to insufficient atomization temperature and affect the amount and feel of atomization. Adding a glass substrate below the ceramic substrate effectively increases the strength of the heating element, avoiding the strength loss issues caused by the thinner ceramic substrate. The glass substrate effectively isolates the lower surface of the ceramic substrate from heat absorption, preventing the heat from the heating area of ​​the heating element from being absorbed by other areas. This focused temperature allows for more complete atomization of the liquid, improving the flavor.

[0075] The combination of ceramic and glass substrates can effectively improve liquid conduction and retention capabilities. A thinner ceramic substrate results in a shorter atomized liquid path, allowing for rapid supply of liquid to the heating area during suction. Adding a glass substrate beneath the ceramic substrate eliminates the need for liquid retention on the lower surface, enabling the ceramic's pore size and porosity to be adjusted extensively based on the atomized liquid concentration, achieving optimal compatibility between the heating element and the atomized liquid. This combination offers the advantages of leak-proof operation and rapid liquid flow, preventing wick clogging caused by blocked liquid channels.

[0076] The thermal conductivity of the glass substrate is higher than that of the porous ceramic substrate. The heating substrate is fixed to the glass substrate, which allows the glass substrate to disperse the heat generated by the heating substrate more quickly. This results in more uniform heating of both the glass and ceramic substrates, effectively avoiding problems such as liquid splattering or core burning caused by excessively high or low local temperatures, while also improving atomization efficiency.

[0077] The ceramic matrix can form a first liquid guiding channel 11 with a larger inner diameter, while the glass matrix can form a second liquid guiding channel 23 with a smaller inner diameter. The ceramic matrix is ​​typically manufactured using injection molding and sintering. After sintering, ceramic particles are formed on the surface of the ceramic matrix. These particles will detach under long-term erosion by the atomizing liquid and high-temperature atomization. Because the glass matrix has a smaller second liquid guiding channel 23, the detached ceramic particles will be blocked by the glass matrix, preventing them from falling into the atomization channel and thus avoiding them from entering the consumer's mouth with the aerosol during suction, improving the consumer experience.

[0078] In this embodiment, the first thermally conductive substrate 1 is directly fixed to the first surface 21 of the second thermally conductive substrate 2 by injection molding and sintering, so that the molding and fixing of the first thermally conductive substrate 1 are completed in one step, which can improve the manufacturing efficiency of the heating element assembly 100. In addition, the ceramic substrate can be directly sintered on the glass substrate during the high-temperature sintering process, which can improve the firmness of the connection between the first thermally conductive substrate 1 and the second thermally conductive substrate 2.

[0079] In one embodiment, a portion of the first thermally conductive substrate 1 is embedded within the second liquid-conducting channel 23. During the injection molding process, a portion of the ceramic slurry in the first thermally conductive substrate 1 partially permeates and embeds into the second liquid-conducting channel 23 before high-temperature sintering. After high-temperature sintering, a small portion of the first thermally conductive substrate 1 remains embedded within the second liquid-conducting channel 23, thus forming a stable connection between the first thermally conductive substrate 1 and the second thermally conductive substrate 2. Furthermore, the portion of the first thermally conductive substrate 1 embedded within the second liquid-conducting channel 23 does not block the second liquid-conducting channel 23; that is, the second liquid-conducting channel 23 remains unobstructed, allowing the atomized liquid in the first liquid-conducting channel 11 to enter the second liquid-conducting channel 23 for heating and atomization.

[0080] In one embodiment, the first thermally conductive substrate 1 can also be fixed to the first surface 21 of the second thermally conductive substrate 2 by other means. For example, the first thermally conductive substrate 1 is first injection molded and sintered into a ceramic sheet, and then the ceramic sheet is fixed to the first surface 21 of the second thermally conductive substrate 2 by bonding, snapping, or other means.

[0081] Please refer to Figure 4 In one embodiment, in the first direction, in the thickness direction, the thickness of the second thermally conductive substrate 2 is less than the thickness of the first thermally conductive substrate 1. Preferably, the thickness of the second thermally conductive substrate is less than or equal to 2 mm, for example, the thickness of the second thermally conductive substrate 2 is 1.5 mm or 1.8 mm.

[0082] The thickness of the second thermally conductive substrate 2 is less than or equal to 2 mm. The distance between the first surface 21 and the second surface 22 of the second thermally conductive substrate 2 is shorter, that is, the second thermally conductive substrate 2 has a shorter second liquid guiding channel 23. The heat generated by the heating substrate 3 located on the second surface 22 can be transferred to the first surface 21 of the second thermally conductive substrate 2 more quickly, and to the first thermally conductive substrate 1 more quickly. The heat generated from the lower end of the second thermally conductive substrate 2 can be transferred to the upper end of the second thermally conductive substrate 2 and the first thermally conductive substrate 1 more quickly. That is, the heat can be quickly spread throughout the entire second thermally conductive substrate 2 and the first thermally conductive substrate 1, so that the atomized liquid in the entire second liquid guiding channel 23 can be quickly heated and atomized, especially in the first few inhalations, so that the atomized liquid in the second liquid guiding channel 23 can be quickly atomized, ensuring the atomization volume in the first few inhalations and improving the user experience.

[0083] The thickness of the second heat-conducting substrate 2 is less than or equal to 2 mm. The second heat-conducting substrate 2 has a shorter second liquid-conducting channel 23, and the pores of the second liquid-conducting channel 23 have lower adsorption capacity. When encountering a relatively thick atomized liquid, the second liquid-conducting channel 23 is less prone to clogging, preventing the second heat-conducting substrate 2 from burning during suction. Furthermore, the thickness of the second heat-conducting substrate 2 is less than or equal to 2 mm. The heating substrate 3 is fixed to the second heat-conducting substrate 2, and the bending length of the heating substrate 3 is shorter. The shorter bending structure simplifies the structure of the heating substrate 3, making it more stable and less prone to deformation and breakage. This results in a tighter and more secure fit between the heating substrate 3 and the second heat-conducting substrate 2, preventing localized dry burning during suction and thus preventing the heating substrate 3 from burning during suction.

[0084] Please refer to Figures 2 to 5In one embodiment, the heating substrate 3 includes a heating part 31 and a connecting part 32. The heating part 31 has a mesh-like structure and is attached to the second surface 22 of the second heat-conducting substrate 2. The mesh-like structure of the heating part 31 covers the entire or most of the area of ​​the second surface 22 of the second heat-conducting substrate 2. The heating part 31 has a sufficient area to increase the heat generation per unit time. At the same time, the heating part 31 covers the entire or most of the area of ​​the second surface 22 of the second heat-conducting substrate 2, which can increase the contact area between the heating part 31 and the second heat-conducting substrate 2, improve the heat conduction efficiency, and allow the heat generated by the heating part 31 to be transferred to the second heat-conducting substrate 2 more quickly and evenly, thereby improving the atomization efficiency of the atomizing liquid.

[0085] The second heat-conducting substrate 2 also includes a side surface located between the first surface 21 and the second surface 22. The connecting portion 32 can be a strip-shaped structure. Multiple connecting portions 32 are connected around the periphery of the heating element 31. One end of the connecting portion 32 is perpendicularly connected to the periphery of the heating element 31, and the other end of the connecting portion 32 extends from the side surface of the second heat-conducting substrate 2 to the first surface 21. The connecting portion 32 has an inverted L-shaped structure, with the end of the connecting portion 32 away from the heating element 31 bent and folded against the first surface 21 of the second heat-conducting substrate 2. With this configuration, the heating element 31 is located on the second surface 22 of the second heat-conducting substrate 2, and one end of the heating element 31 is bent and folded against the first surface 21 of the second heat-conducting substrate 2, thus fixing the heating element 3 to the second heat-conducting substrate 2. Furthermore, the multiple connecting portions 32 extending from different sides of the heating element 3 and bending and folding against the first surface 21 of the second heat-conducting substrate 2 form a wrap-around fixed connection, which can improve the stability of the connection between the heating element 3 and the second heat-conducting substrate 2 and prevent the heating element 3 from loosening or detaching.

[0086] In one embodiment, the heating substrate 3 can also be fixed to the second surface 22 of the second heat-conducting substrate 2 by means of bonding, spraying, or other methods.

[0087] Please refer to Figure 2 , Figure 3 and Figure 8 In one embodiment, the heating element 31 has two electrical connection portions 33 at both ends in the second direction, and the electrical connection portions 33 are solid planar structures. The two electrical connection portions 33 are respectively used to connect to the positive and negative terminals within the electronic atomization device. The heating substrate 3 abuts against the positive terminal within the electronic atomization device through one electrical connection portion 33, and the heating substrate 3 abuts against the negative terminal within the electronic atomization device through the other electrical connection portion 33, thereby electrically connecting the heating substrate 3 to the circuit board within the electronic atomization device to form a heating circuit. The circuit board can control the heating of the heating substrate 3. The planar structure of the electrical connection portions 33 allows the heating element 31 to have connecting pieces of the same thickness on both sides of the mesh structure, effectively simplifying the structure of the heating element 31, reducing costs, and facilitating the installation of the heating element assembly 100.

[0088] In one embodiment, the electrical connection portion 33 of the heating element 31 can also be configured as a plug-in terminal. The two electrical connection portions 33 are respectively connected to the positive terminal and the negative terminal in the electronic atomization device by plugging in, which can also realize the electrical connection between the heating substrate 3 and the circuit board in the electronic atomization device to form a heating circuit.

[0089] Please refer to Figure 2 , Figure 3 and Figure 8 In one embodiment, the heating substrate 3 is an integral structure, with the heating element 31 and the connecting element 32 integrally formed. The connecting element 32 is bent to form an inverted L-shaped structure. This configuration provides the heating substrate 3 with higher structural stability, particularly at the connection between the heating element 31 and the connecting element 32, effectively improving the robustness of the connection between the heating substrate 3 and the second heat-conducting substrate 2. In other embodiments, the heating element 31 and the connecting element 32 can also be fixed together by welding or other methods.

[0090] In one embodiment, the connecting portion 32 of the heating substrate 3 is partially embedded within the first thermally conductive substrate 1 on the first surface 21 of the second thermally conductive substrate 2. During manufacturing, the heating substrate 3 is first bent and fixed to the second thermally conductive substrate 2. One end of the connecting portion 32 of the heating substrate 3 is bent and then fastened to the first surface 21 of the second thermally conductive substrate 2. Ceramic slurry is then injection molded and sintered onto the first surface 21 of the second thermally conductive substrate 2. At this point, the ceramic slurry encapsulates the connecting portion 32 located on the first surface 21 of the second thermally conductive substrate 2. After sintering, the portion of the connecting portion 32 located on the first surface 21 of the second thermally conductive substrate 2 is embedded within the first thermally conductive substrate 1. This configuration improves the stability of the connection between the first thermally conductive substrate 1 and the second thermally conductive substrate 2, and also fixes the heating substrate 3 to the first thermally conductive substrate 1, improving the overall connection stability of the heating element assembly 100. Furthermore, the heat generated by the heating substrate 3 can be transferred to the first thermally conductive substrate 1 more quickly and evenly, improving atomization efficiency.

[0091] Please refer to Figures 6 to 9 In one embodiment, the heating element assembly 100 further includes a mounting base 4, which is a flexible material structure, such as silicone. The first thermally conductive substrate 1, the second thermally conductive substrate 2, and the heating substrate 3 are installed in the mounting base 4 to form an assembly, which is then installed into the atomization chamber 220 of the electronic atomizing device. The flexible material mounting base 4 not only allows the heating element assembly 100 to be installed more stably in the atomization chamber 220, but also provides a sealing effect, preventing the atomized liquid from leaking along the inner wall of the atomization chamber 220 into the atomization channel 240.

[0092] The mounting base 4 fixes the first heat-conducting substrate 1, the second heat-conducting substrate 2, and the heating substrate 3 together to form a unit structure. This allows the heating element assembly 100 to be installed as a standard unit structure in different electronic atomization devices, effectively reducing costs in mass production. Furthermore, the overall thickness of the heating element assembly 100 can be set to be consistent with the thickness of heating element assemblies 100 in existing technologies, allowing it to be directly installed in existing electronic atomization devices without requiring further development, thus reducing development and manufacturing costs.

[0093] In one embodiment, the mounting base 4 can also be made of rigid plastic. Rigid plastic mounting base 4 has advantages such as high structural stability, light weight, and good heat insulation. In particular, its good heat insulation helps to trap the heat generated by the heating element 3 within the mounting base 4, improving the heating and atomization efficiency of the heating element 3, thereby reducing power consumption and extending the battery life of the electronic atomization device. Of course, the mounting base 4 can also be made of other materials, such as a polymer material or a metal material.

[0094] Please refer to Figures 6 to 9 In one embodiment, the mounting base 4 is a cap-shaped structure, having an inlet 41, an outlet 42, and a mounting cavity 43. In a first direction, the inlet 41, mounting cavity 43, and outlet 42 of the mounting base 4 are sequentially distributed and connected. The inlet 41 is located on one side of the mounting base 4 in the first direction, and the outlet 42 is located on the other side of the mounting base 4 in the first direction. When the heating element assembly 100 is installed in the electronic atomizing device, the side of the mounting base 4 with the inlet 41 faces the liquid storage cavity 210 in the electronic atomizing device, and the inlet 41 is connected to the liquid outlet 2101 of the liquid storage cavity 210, so that the atomizing liquid in the liquid storage cavity 210 can enter the mounting cavity 43 of the mounting base 4 through the inlet 41, and then enter the heating element assembly 100 to achieve heating and atomization.

[0095] The first thermally conductive substrate 1 and the second thermally conductive substrate 2 are stacked and installed within the mounting cavity 43. The first thermally conductive substrate 1 is closer to the inlet 41 than the second thermally conductive substrate 2, and the second thermally conductive substrate 2 is closer to the outlet 42 than the first thermally conductive substrate 1. In the first direction, the inlet 41, the first thermally conductive substrate 1, the second thermally conductive substrate 2, and the outlet 42 are arranged sequentially. With this arrangement, the atomizing liquid entering the heating element assembly 100 enters through the inlet 41, passes through the first thermally conductive substrate 1, and then enters the second thermally conductive substrate 2 for atomization. The atomized gas is then discharged from the outlet 42. That is, the inlet 41 of the mounting base 4 is the inlet of the atomizing liquid, and the outlet 42 of the mounting base 4 is the outlet of the atomized gas.

[0096] Please refer to Figures 6 to 9In one embodiment, the mounting base 4 has an approximately cuboid shape, with a square inlet 41 and a square outlet 42. Correspondingly, the mounting base 4 contains a first heat-conducting substrate 1 and a second heat-conducting substrate 2, both of cuboid shape. This configuration results in the heating element assembly 100 forming an approximately cuboid structure. Since electronic atomizing devices are generally flat, the cuboid heating element assembly 100 can be adapted to the flatness of the electronic atomizing device, allowing for a more compact layout within the device. In other embodiments, when the electronic atomizing device has a cylindrical structure, the heating element assembly 100 can also be cylindrical to accommodate the device.

[0097] Please refer to Figures 6 to 9 In one embodiment, the area of ​​the inlet 41 of the mounting base 4 is smaller than the surface area of ​​the first heat-conducting substrate 1 facing the inlet 41. In other words, the area of ​​the inlet 41 is smaller than the side area of ​​the mounting base 4 with the inlet 41. This arrangement creates an annular limiting structure around the inlet 41 of the mounting base 4 to fix the first heat-conducting substrate 1 in place. That is, the periphery of the side of the first heat-conducting substrate 1 facing the inlet 41 abuts against the inner wall of the mounting base 4, forming a limiting installation.

[0098] Please refer to Figures 6 to 9 In one embodiment, the mounting base 4 can be a cap-shaped structure, and the area of ​​the outlet 42 of the mounting base 4 is equal to or slightly smaller than the end face area of ​​the entire mounting base 4, with one end of the mounting base 4 forming a large opening. This configuration avoids the side wall of the mounting base 4 blocking the atomized gas generated by the heating element 3, allowing the atomized gas to be quickly discharged from the larger outlet 42.

[0099] In one embodiment, in the uninstalled state, the volume of the mounting cavity 43 within the mounting base 4 is slightly smaller than the combined volume of the first heat-conducting substrate 1, the second heat-conducting substrate 2, and the heating substrate 3. During installation, the combined assembly of the first heat-conducting substrate 1, the second heat-conducting substrate 2, and the heating substrate 3 is inserted into the mounting cavity 43 through the outlet 42. The mounting base 4 expands under elasticity and restrains the first heat-conducting substrate 1, the second heat-conducting substrate 2, and the heating substrate 3 located within the mounting cavity 43.

[0100] When fully installed, the mounting base 4 is in an expanded and stretched state. A portion of the connecting part 32 of the heating element 3 is located between the side of the first heat-conducting base 2 and the inner wall of the mounting cavity 43. This connecting part 32 separates the side of the first heat-conducting base 2 and the inner wall of the mounting cavity 43, forming a return air channel 44. One end of the return air channel 44 is connected to the first liquid channel 11 or the inlet 41, and the other end is connected to the outlet 42. This allows the atomized liquid in the storage cavity 410 to flow into the first heat-conducting base 1 and the second heat-conducting base 2, and the storage cavity 410 can then return air through the return air channel 44 to form a gas-liquid circulation, ensuring the continuous and smooth outflow of the atomized liquid and preventing a vacuum from forming and blocking the outflow of the atomized liquid. The return air channel 44 formed in the heating element assembly 100 is created through the separation of the connecting part 32, eliminating the need for additional design steps and eliminating the return air channel on the inner wall of the atomizing cavity 220 in conventional technologies, effectively reducing manufacturing difficulty and cost.

[0101] Please refer to Figures 6 to 9 In one embodiment, the circumferential outer wall of the mounting base 4 is provided with an annular protruding sealing part 45. The circumferential outer wall of the mounting base 4 is an outer wall parallel to the first direction. The outer walls at both ends of the mounting base 4 are perpendicular to the first direction. One outer wall of the mounting base 4 perpendicular to the first direction is provided with an inlet 41, and the other outer wall is provided with an outlet 42.

[0102] The outer circumferential wall of the mounting base 4 may be provided with one or more sealing parts 45, which form a sealing ring. When the heating element assembly 100 is installed in the atomizing chamber 220 of the electronic atomizing device, the heating element assembly 100 is connected to the inner wall of the atomizing chamber 220 of the electronic atomizing device through the sealing part 45, so as to fix the heating element assembly 100 more firmly in the electronic atomizing device and achieve a sealing effect, which can prevent the atomized liquid discharged from the liquid storage chamber 210 from leaking out along the outer wall of the mounting base 4.

[0103] Please refer to Figure 10 and Figure 11 In one embodiment, an electronic atomizing device is provided, which includes a housing 200 and a heating element assembly 100 as described in any of the above embodiments.

[0104] The housing 200 has a connected liquid storage chamber 210 and an atomizing chamber 220. The housing 200 is provided with an oil storage tank and a mounting base to form the liquid storage chamber 210 and the atomizing chamber 220. The liquid storage chamber 210 and the atomizing chamber 220 are arranged side by side along a first direction. The housing 200 has a suction nozzle 230 at one end in the first direction. The end of the housing 200 with the suction nozzle 230 is the upper end. The liquid storage chamber 210 is located above the atomizing chamber 220, and the atomizing chamber 220 is located below the liquid storage chamber 210. The liquid storage chamber 210 is used to store the atomizing liquid. Below the liquid storage chamber 210, there is a liquid outlet 2101, which communicates with the atomizing chamber 220. The heating element assembly 100 is installed inside the atomizing chamber 220. The inlet 41 of the heating element assembly 100 is located below the liquid outlet of the liquid storage chamber 210, and the inlet 41 of the heating element assembly 100 communicates with the liquid outlet of the liquid storage chamber 210. This allows the atomizing liquid in the liquid storage chamber 210 to flow into the atomizing chamber 220 under the influence of gravity, and then enter the heating element assembly 100 for heating and atomization.

[0105] Below the atomizing chamber 220 is a connected atomizing channel 240. One end of the atomizing channel 240 is located on the side or bottom of the housing 200, and the other end of the atomizing channel 240 is located in the mouthpiece 230. The atomized gas generated by the heating element assembly 100 can enter the atomizing channel 240 for the user to inhale.

[0106] In this embodiment, the electronic atomizing device also includes other components for achieving atomization, such as a circuit board 250, a battery 260, a positive terminal 270, and a negative terminal 280. The circuit board 250 is electrically connected to the battery 260, the positive terminal 270, and the negative terminal 280. The positive terminal 270 and the negative terminal 280 extend along a first direction. The upper ends of the positive terminal 270 and the negative terminal 280 respectively abut against the electrical connection portion 33 of the heating element assembly 100 to form an electrical connection. The lower ends of the positive terminal 270 and the negative terminal 280 are electrically connected to the circuit board 250 via cables or flexible circuit boards. In a second direction, the positive terminal 270 and the negative terminal 280 are spaced apart, and their positions can be interchanged.

[0107] In this embodiment, since the heating element assembly 100 includes a first heat-conducting substrate 1 and a second heat-conducting substrate 2 of different materials, the heat-conducting substrate of the heating element assembly 100 is composed of two heat-conducting substrates of different materials. The two heat-conducting substrates of different materials can overcome the problems of small atomization amount, low atomization efficiency, poor sucking taste, leakage and clogging caused by a single heat-conducting substrate.

[0108] The first heat-conducting substrate 1 is a ceramic substrate, and the second heat-conducting substrate 2 is a glass substrate. The ceramic and glass substrates are combined, and the heating element is located on the glass substrate. This configuration allows both the ceramic and glass substrates to be thinner than a single-material heat-conducting substrate. A thinner ceramic substrate effectively enhances liquid conductivity, making liquid flow smoother. During aspiration, it prevents the ceramic substrate from absorbing too much heat, which could lead to insufficient atomization temperature and affect the amount and feel of atomization. Adding a glass substrate below the ceramic substrate effectively increases the strength of the heating element, avoiding the strength loss issues caused by the thinner ceramic substrate. The glass substrate effectively isolates the lower surface of the ceramic substrate from heat absorption, preventing the heat from the heating area of ​​the heating element from being absorbed by other areas. This focused temperature allows for more complete atomization of the liquid, improving the flavor.

[0109] The combination of ceramic and glass substrates can effectively improve liquid conduction and retention capabilities. A thinner ceramic substrate results in a shorter atomized liquid path, allowing for rapid supply of liquid to the heating area during suction. Adding a glass substrate beneath the ceramic substrate eliminates the need for liquid retention on the lower surface, enabling the ceramic's pore size and porosity to be adjusted extensively based on the atomized liquid concentration, achieving optimal compatibility between the heating element and the atomized liquid. This combination offers the advantages of leak-proof operation and rapid liquid flow, preventing wick clogging caused by blocked liquid channels.

[0110] The thermal conductivity of the glass substrate is higher than that of the porous ceramic substrate. The heating substrate is fixed to the glass substrate, which allows the glass substrate to disperse the heat generated by the heating substrate more quickly. This results in more uniform heating of both the glass and ceramic substrates, effectively avoiding problems such as liquid splattering or core burning caused by excessively high or low local temperatures, while also improving atomization efficiency.

[0111] The ceramic matrix can form a first liquid guiding channel 23 with a larger inner diameter, while the glass matrix can form a second liquid guiding channel 23 with a smaller inner diameter. The ceramic matrix is ​​typically manufactured using injection molding and sintering. After sintering, ceramic particles are formed on the surface of the ceramic matrix. These particles will detach under long-term erosion by the atomizing liquid and high-temperature atomization. Because the glass matrix has a smaller second liquid guiding channel 23, the detached ceramic particles will be blocked by the glass matrix, preventing them from falling into the atomization channel and thus avoiding them from entering the consumer's mouth with the aerosol during suction, improving the consumer experience.

[0112] Please refer to Figure 11In one embodiment, the electronic atomizing device further includes an elastic support 290, which is installed inside the housing 200. The positive terminal 270 and the negative terminal 280 are mounted on the elastic support 290. This configuration allows the positive terminal 270 and the negative terminal 280 to be flexibly mounted. Under the elastic action of the elastic support 290, the positive terminal 270 and the negative terminal 280 can form a stable contact with the electrical connection portion 33 of the heating substrate 3, ensuring the stability of the electrical connection. Furthermore, the flexible docking of the positive terminal 270 and the negative terminal 280 with the heating substrate 3 allows them to float, providing a certain pressure relief space. This avoids the excessive pressure generated when the positive terminal 270 and the negative terminal 280 make a hard docking with the heating substrate 3, which could crush the first heat-conducting substrate 1 and the second heat-conducting substrate 2, thus improving the service life of the heating element assembly 200 and the entire electronic atomizing device.

[0113] Specifically, the elastic bracket 290 can be made of elastic silicone. The elastic bracket 290 has two through mounting holes. The positive terminal 270 and the negative terminal 280 are respectively inserted into one of the mounting holes of the elastic bracket 290. The elastic bracket 290 fixes the positive terminal 270 and the negative terminal 280 in a binding manner. Both ends of the positive terminal 270 and the negative terminal 280 are exposed in the elastic bracket 290 to realize the electrical connection between the positive terminal 270 and the negative terminal 280.

[0114] In one embodiment, a rigid support 300 is further provided inside the housing 200, and an elastic support 290 is mounted on the rigid support 300. The rigid support 300 can be a rigid plastic structure. The rigid support 300 can provide support for the elastic support 290, ensuring the stability of the installation positions of the positive terminal 270 and the negative terminal 280.

[0115] This document describes various exemplary embodiments with reference to them. However, those skilled in the art will recognize that changes and modifications can be made to the exemplary embodiments without departing from the scope of this document. For example, various operational steps and components for performing operational steps can be implemented in different ways depending on the specific application or considering any number of cost functions associated with the operation of the system (e.g., one or more steps can be deleted, modified, or combined with other steps).

[0116] While the principles herein have been illustrated in various embodiments, numerous modifications to the structures, arrangements, proportions, elements, materials, and components, particularly suited to specific environments and operational requirements, may be used without departing from the principles and scope of this disclosure. These modifications and other alterations or alterations will be included within the scope of this document. Those skilled in the art will recognize that many changes can be made to the details of the above embodiments without departing from the fundamental principles of the invention.

Claims

1. A heating element assembly (100), characterized in that, include: A first thermally conductive substrate (1) has a first liquid channel (11) inside the first thermally conductive substrate (1). The second thermally conductive substrate (2) has a first surface (21) and a second surface (22) facing away from each other. The first thermally conductive substrate (1) is disposed on the first surface (21) of the second thermally conductive substrate (2). The second thermally conductive substrate (2) has a second liquid channel (23) inside, and the second liquid channel (23) is connected to the first liquid channel (11). A heating substrate (3), at least a portion of which is disposed on the second surface (22) of the second thermally conductive substrate (2), the heating substrate (3) being used to generate heat energy; The first thermally conductive substrate (1) and the second thermally conductive substrate (2) are substrates made of different materials, and the inner diameter of the first liquid channel (11) is larger than the inner diameter of the second liquid channel (23).

2. The heating element assembly (100) as described in claim 1, characterized in that, The first thermally conductive substrate (1) is a ceramic substrate, and the first thermally conductive substrate (1) is formed and fixed on the first surface (21) of the second thermally conductive substrate (2) by injection molding and sintering.

3. The heating element assembly (100) as described in claim 2, characterized in that, Part of the first thermally conductive substrate (1) is embedded in the second liquid channel (23).

4. The heating element assembly (100) as claimed in claim 1, characterized in that, The second thermally conductive substrate (2) is a glass substrate, and the second liquid channel (23) is a straight hole extending along the thickness direction of the second thermally conductive substrate (2).

5. The heating element assembly (100) as described in claim 4, characterized in that, The thickness of the second thermally conductive substrate (2) is less than the thickness of the first thermally conductive substrate (1); or, the thickness of the second thermally conductive substrate (2) is less than or equal to 2 mm.

6. The heating element assembly (100) as claimed in claim 1, characterized in that, The heating substrate (3) includes a heating part (31) and a connecting part (32). The heating part (31) is disposed on the second surface (22) of the second heat-conducting substrate (2). One end of the connecting part (32) is connected to the heating part (31), and the other end of the connecting part (32) extends to the first surface (21) of the second heat-conducting substrate (2). The connecting part (32) fixes the heating substrate (3) to the second heat-conducting substrate (2).

7. The heating element assembly (100) as claimed in claim 6, characterized in that, The portion of the connecting part (32) located on the first surface (21) is embedded in the first thermally conductive substrate (1).

8. The heating element assembly (100) as claimed in claim 6, characterized in that, It also includes a mounting base (4), which has an inlet (41), an outlet (42) and a mounting cavity (43). The inlet (41), the mounting cavity (43) and the outlet (42) are connected in sequence. The inlet (41) of the mounting base (4) is used to connect with the outlet (2101) of the liquid storage cavity (210), and the outlet (42) of the mounting base (4) is used to connect with the atomizing channel (240). The first thermally conductive substrate (1), the second thermally conductive substrate (2) and the heating substrate (3) are installed in the mounting cavity (43) of the mounting base (4). The first surface (21) of the second thermally conductive substrate (2) faces the inlet (41), and the second surface (22) of the second thermally conductive substrate (2) faces the outlet (42).

9. The heating element assembly (100) as claimed in claim 8, characterized in that, The heating base (3) also includes a side surface located between the first surface (21) and the second surface (22), a portion of the connecting part (32) is located on the side surface of the heating base (3), and the side surface of the heating base (3) and the inner wall of the mounting cavity (43) are separated by the connecting part (32) to form a return air channel (44).

10. The heating element assembly (100) as claimed in claim 8, characterized in that, The mounting base (4) is an elastic silicone structure, and the outer wall of the mounting base (4) is provided with an annular protruding sealing part (45).

11. An electronic atomizing device, characterized in that, include: The housing (200) has a liquid storage chamber (210) and an atomizing chamber (220) in communication. The liquid storage chamber (210) is used to store atomizing liquid and has an outlet (2101) in communication with the atomizing chamber (220). The heating element assembly (100) according to any one of claims 1 to 10 is installed in the atomizing chamber (220).

12. The electronic atomizing device as described in claim 11, characterized in that, It also includes a circuit board (250), a positive terminal (270), a negative terminal (280) and an elastic bracket (290) installed in the housing (200). The positive terminal (270) and the negative terminal (280) are mounted on the elastic bracket (290). One end of the positive terminal (270) is electrically connected to the circuit board (250) and the other end of the positive terminal (270) is electrically connected to the heating substrate (3). One end of the negative terminal (280) is electrically connected to the circuit board (250) and the other end of the negative terminal (280) is electrically connected to the heating substrate (3).

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