Optoelectronic module comprising an ultrasonic transducer and imaging apparatus using the module

Abstract

The present application provides an optoelectronic module and an imaging device comprising the module, which is exemplified as an endoscope (e.g. a bronchoscope). The optoelectronic module comprises a housing, an image sensor and an ultrasonic transducer, which is disposed wholly on the rear side of the image sensor. The front surface of the image sensor has a circumference S, and the cross-section of the optoelectronic module along the front surface has a circumference H, and S < H < 1.6S is satisfied. In one embodiment, an illumination assembly such as a flashing LED is located within the minimum circumscribed circle of the front surface of the image sensor. The present application has a plurality of technical advantages, such as being able to minimize the size of the insertion portion of the endoscope, and being able to provide real-time visual assistance during insertion of the ultrasonic probe.

Description

Technical Field

[0001] This invention relates to an optoelectronic module with an ultrasonic transducer, and an imaging device (such as a medical or industrial endoscope) using the optoelectronic module. More specifically, this invention relates to a small optoelectronic module comprising an ultrasonic transducer, an image sensor, an illumination assembly, and other optional components. Background Technology

[0002] Ultrasound images (also known as ultrasound maps) are generated by emitting ultrasound pulses into tissue using a transducer or probe. Ultrasound waves are sound waves with frequencies higher than the human audible range (>20,000 Hz). Ultrasound pulses produce different echoes when they encounter tissues with different reflective properties; these echoes are recorded and displayed as images. Medical ultrasound is commonly used to image internal organs as well as other body structures such as tendons, muscles, joints, and blood vessels. While medical ultrasound typically uses transducers designed for external use (e.g., through the lower abdominal wall in gynecological ultrasound examinations), in some cases, ultrasound transducers are configured for insertion into internal organs or other body structures. One example of such an application is hysterosalpingography (also known as intrahysteroscopic ultrasound or saline infusion ultrasound), a procedure specifically designed to image the uterus. The procedure involves inserting a fluid and an ultrasound probe together into the uterine cavity to provide ultrasound images of the uterine structures. However, during hysterosalpingography, the insertion of the ultrasound probe is often performed "blindly," meaning there is no real-time visual guidance during the insertion process.

[0003] An angioscope (such as a coronary angioscope) is a flexible endoscopic device used to visually examine the inside of blood vessels. It is inserted into the artery and provides real-time, high-resolution imaging of the vessel wall. This is particularly useful for diagnosing vascular diseases such as plaque buildup or thrombosis. However, an angioscope cannot examine the body structures surrounding the blood vessels.

[0004] Furthermore, there is a pressing need for miniature endoscopes in many industrial and medical applications. For example, when the body's natural orifices and cavities are narrow, miniature endoscopes are needed to traverse these orifices and cavities to reach target sites within the body. In single-incision laparoscopic surgery, miniature endoscopes are preferred to provide an internal view of the surgical site, especially when the incision itself is very small. Sometimes, patients may experience discomfort when the endoscope is inserted; using miniature endoscopes helps alleviate this discomfort and minimizes trauma to the patient. In addition, physicians can utilize miniature endoscopes to optimize diagnostic and procedural procedures. For instance, transnasal endoscopy can sometimes replace transoral endoscopy.

[0005] To meet miniaturization requirements, an obvious solution is to reduce the size of each individual component within the endoscope, such as using a smaller camera or a smaller fiber bundle. However, the extent to which size can be reduced is limited, and each reduction comes at the cost of performance and assembly complexity.

[0006] Fortunately, this invention provides a completely new solution that can solve all of the above problems. Summary of the Invention

[0007] One aspect of the invention provides an optoelectronic module that can optionally be bundled with an external working channel. The optoelectronic module includes a housing (or sleeve) having a longitudinal axis, an image sensor fixed to the distal end of the housing, and an ultrasonic transducer (or ultrasonic probe) located within the housing. The ultrasonic transducer is positioned entirely behind the image sensor along the longitudinal axis.

[0008] Another aspect of the present invention provides an imaging apparatus for imaging the inner surface of a tubular structure and its surrounding external environment. The imaging apparatus includes: (1) a photoelectric module for insertion into the tubular structure as described above; (2) a first receiving device located outside the tubular structure for receiving signals from an image sensor; and (3) a second receiving device located outside the tubular structure for receiving signals from an ultrasonic transducer.

[0009] The above-mentioned features and advantages of the invention, as well as other features and advantages, will become apparent from the following detailed description of the preferred embodiment of the invention, taken in conjunction with the accompanying drawings. Attached Figure Description

[0010] The figures in the accompanying drawings illustrate the invention by way of example and not limitation, wherein the same reference numerals refer to similar elements. All figures are schematic and generally show only the parts necessary to illustrate the invention. For the sake of simplicity and clarity, the elements shown in the figures and discussed below are not necessarily drawn to scale. Well-known structures and devices are shown in simplified form to avoid unnecessarily obscuring the invention. Other parts may be omitted or shown only schematically.

[0011] Figure 1 An optoelectronic module, which can optionally be bundled with an external working channel, is shown according to an exemplary embodiment of the present invention.

[0012] Figure 2 A general optoelectronic module structure according to an exemplary embodiment of the present invention is shown.

[0013] Figure 3 The structure of a general imaging apparatus according to an exemplary embodiment of the present invention is shown.

[0014] Figure 4 An imaging apparatus according to an exemplary embodiment of the present invention is shown, wherein the ultrasonic transducer of the imaging apparatus is connected to an ultrasonic handpiece.

[0015] Figure 5 The structure of an optoelectronic module according to an exemplary embodiment of the present invention is shown.

[0016] Figure 6 The structure of an optoelectronic module according to an exemplary embodiment of the present invention is shown.

[0017] Figure 7 An example of an imaging apparatus according to an exemplary embodiment of the present invention is shown—a bronchoscope.

[0018] Figure 8 An example of an imaging apparatus according to an exemplary embodiment of the present invention is shown—a universal endoscope.

[0019] Figure 9 A general-purpose optoelectronic module according to an exemplary embodiment of the present invention is shown.

[0020] Figure 10 This is a cross-sectional view of various optoelectronic modules according to exemplary embodiments of the present invention, which have different designs of image sensor surfaces (or "front surfaces") and housings.

[0021] Figure 11 A specific optoelectronic module according to an exemplary embodiment of the present invention is shown.

[0022] Figure 12 This illustrates the difference between the circumcircle and the minimum bounding circle of the same polygon.

[0023] Figure 13 This is a radial cross-sectional view taken along a non-circular surface, illustrating an optoelectronic module according to an exemplary embodiment of the present invention.

[0024] Figure 14 An optoelectronic module with a lens is shown according to an exemplary embodiment of the present invention.

[0025] Figure 15 An optoelectronic module according to an exemplary embodiment of the present invention is shown, which has a square lens that matches the surface of a square sensor.

[0026] Figure 16 This is an axial cross-sectional view of a photoelectric module according to an exemplary embodiment of the present invention, showing different positions of the light source.

[0027] Figure 17 This is a radial cross-sectional view taken along a non-circular surface, illustrating the structure and dimensions of an optoelectronic module according to an exemplary embodiment of the present invention.

[0028] Figure 18 This is a radial cross-sectional view taken along a non-circular surface, illustrating the structure and dimensions of another optoelectronic module according to an exemplary embodiment of the present invention.

[0029] Figure 19 This is a radial cross-sectional view taken along a non-circular surface, showing the structure and dimensions of yet another optoelectronic module according to an exemplary embodiment of the present invention.

[0030] Figure 20 The diagram shows a radial cross-sectional view illustrating the structure of a photoelectric module according to an exemplary embodiment of the present invention. Detailed Implementation

[0031] In the following description, numerous specific details are set forth for purposes of explanation in order to provide a thorough understanding of the invention. However, it will be apparent to those skilled in the art that the invention may be practiced without these specific details, or by equivalent designs.

[0032] Wherever numerical ranges are disclosed herein, unless otherwise expressly stated, the range is considered a continuous range and includes the minimum value, the maximum value, and all values ​​between the minimum and maximum values ​​within that range. Furthermore, if a range involves integers, it includes only all integers from the minimum value (inclusive) to the maximum value (inclusive). Additionally, when multiple ranges are provided to describe a feature or characteristic, these ranges can be combined with each other.

[0033] It should also be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. For example, when an element is referred to as "on," "connected to," or "coupled to" another element, it may be directly on, directly connected to, or directly coupled to another element, or there may be intermediate elements. Conversely, when an element is referred to as "directly on," "directly connected to," or "directly coupled to" another element, it indicates that there are no intermediate elements.

[0034] Throughout the specification and claims, unless the context clearly specifies otherwise, the following terms shall have the meaning expressly assigned herein. The phrase "in one embodiment" does not necessarily refer to the same embodiment, although it may indeed refer to the same embodiment. Similarly, the phrase "in another embodiment" does not necessarily refer to different embodiments, although it may indeed refer to different embodiments. Therefore, as described below, various embodiments of the invention can be combined without departing from the scope or spirit of the invention.

[0035] Furthermore, the term "or" as used herein is the XOR operator, equivalent to the terms "and / or," unless the context clearly specifies otherwise. The term "based on" is not an exclusive description and may also refer to being based on other factors not described herein, unless the context clearly specifies otherwise. Additionally, throughout the specification, the meanings of "a," "an," and "the" include plural references. The meaning of "in..." includes "within..." and "on...".

[0036] Furthermore, all numerical values ​​are "approximate" or "approximate" values ​​as shown, taking into account experimental errors and variations that would be expected by one of ordinary skill in the art. It should be understood that all numerical values ​​and ranges disclosed herein are approximate values ​​and approximate ranges, whether or not they are accompanied by the word "approximately". It should also be understood that the term "approximately" as used herein, when combined with numerical values, refers to values ​​within ±0.01%, ±0.1%, ±0.5%, ±1%, ±2%, ±3%, ±5%, ±10%, or ±15%. It should be understood that when a numerical range is disclosed herein, any value falling within that range is also considered to have been specifically disclosed.

[0037] For reference Figure 1 The present invention provides an optoelectronic module 100, which can optionally be bundled together with an external working channel 400. Figure 1 (a) Figure 1 (b) shows its cross-sectional view. Figure 2 As shown, the optoelectronic module 100 itself may include: (i) a housing 160 (or sleeve) having a longitudinal axis (L); (ii) an image sensor 110 fixed to the distal end of the housing 160; and (iii) an ultrasonic transducer 210 (or ultrasonic probe) located within the housing 160. The ultrasonic transducer 210 is located entirely behind the image sensor 110 along the longitudinal axis (L).

[0038] The present invention also provides, for example Figure 3 The imaging device 500 shown is used to image the inner surface of a tubular structure and its surrounding external environment. The imaging device 500 may include: (1) as... Figure 1 and 2 The diagram shows an optoelectronic module 100 for insertion inside the tubular structure; (2) a first receiving device 190 located outside the tubular structure for receiving signals from the image sensor 110; and (3) a second receiving device 290 located outside the tubular structure for receiving signals from the ultrasonic transducer 210.

[0039] The ultrasound transducer 210 functions as both a transmitter and receiver of sound waves, enabling medical professionals to visualize the internal structures of the human body in real time. The ultrasound transducer 210 emits sound waves (e.g., at frequencies of 5-40 MHz) into the body. As the sound waves pass through different tissues, a portion is reflected back to the transducer. These returned sound echoes are analyzed by ultrasound equipment within a second receiving device 290 and used to construct an image of the scanned area. The ultrasound transducer 210 can convert electrical energy into acoustic energy, and then convert the acoustic waves back into measurable and displayable electrical energy upon receiving the sound echoes.

[0040] The ultrasonic transducer 210 can be made of conventional piezoelectric materials (such as lead zirconate titanate, PZT) or semiconductor materials, and can be selected from any suitable transducer, such as linear array transducers, convex array transducers, phased array transducers, intracavity transducers, and 3D / 4D transducers. Each transducer element can be equipped with an independent cable. These cables can be bundled together and connected to the ultrasonic processing unit in the second receiving device 290. To reduce the number of cables leading from the probe head, an application-specific integrated circuit (ASIC) can be built into the probe head. This ASIC can contain high-voltage switching and control circuitry for driving the individual transducer elements and routing the echo signals to the processing unit in the second receiving device 290. In this case, only a small number of coaxial cables are needed to transmit ultrasonic, transmitted and received signals, control signals, and power between the probe head and the ultrasonic processing unit.

[0041] In one embodiment, the second receiving device 290 includes electronics for processing ultrasound images from the ultrasound transducer 210. The imaging device 500 may be a combined ultrasound and endoscopy system (CUES). According to some embodiments, endoscopic images and ultrasound images are simultaneously displayed in real time on one monitor or two separate monitors, allowing physicians to simultaneously observe both the surface and internal tissues of an organ; furthermore, these images can be electronically transmitted to other devices, such as workstations and / or PACS (Medical Image Archiving and Communication Systems) located remotely. According to some embodiments, ultrasound images and camera images can achieve precise positional and directional correspondence within body cavities (e.g., blood vessels).

[0042] In one embodiment, the imaging device 500 includes an ultrasonic handpiece 280 connected to the ultrasonic transducer 210, such as... Figure 4As shown. The ultrasonic handle 280 can be configured for user hand gripping or is motor-driven. The imaging device 500 may also include an external working channel 400 bundled with the optoelectronic module 100. The ultrasonic handle 280 is configured to rotate the ultrasonic transducer 210 about an axis (T) parallel to the longitudinal axis (L). The ultrasonic handle 280 is also configured to push / pull the ultrasonic transducer 210 forward and backward (i.e., distal and proximal) within the housing 160 in a direction parallel to the longitudinal axis (L).

[0043] Therefore, the ultrasonic transducer 210 is located in the ultrasonic gel / fluid channel 220 within the housing 160, and the ultrasonic transducer 210 can be rotated about an axis (T) parallel to the longitudinal axis (L) by rotating the ultrasonic handle 280, as shown below. Figure 5 As shown. By pushing / pulling the ultrasonic handle 280, the ultrasonic transducer 210 can be moved forward and backward (towards distally and proximally) within the ultrasonic gel / fluid channel 220 in a direction parallel to the longitudinal axis (L).

[0044] In such Figure 5 and Figure 6 In some embodiments shown in (a), the photoelectric module 100 may further include an illumination assembly 130, an ultrasonic gel / fluid channel 220, a gel / fluid outlet 142 located on the channel 220, and a wire 119 connected to the image sensor 110. Figure 6 Figures (b) and (c) are cross-sectional views of the photoelectric module 100 along lines AA and BB, respectively, illustrating an exemplary spatial layout of channel 220, image sensor 110, wire 119, and illumination assembly 130. These air gaps are eliminated when the gel / fluid fills channel 220 and flows out from outlet 142 into the air gaps surrounding the photoelectric module 100. This design is preferred because the sound waves used in ultrasound cannot effectively penetrate air. Even a thin layer of air between the transducer and a surface such as skin can impede the propagation of sound waves. The gel / fluid fills these gaps, forming a seamless connection. The gel / fluid can serve as a coupling medium, allowing high-frequency sound waves to enter the body without distortion from the transducer and be reflected back. This ensures that the returned echo is clear enough to form an accurate image. By achieving uninterrupted sound wave transmission, the gel / fluid contributes to generating clearer, more detailed ultrasound images.

[0045] Reference Figure 2 The image sensor 110 has a front surface 111 and a rear side 113. The rear side 113 is located within the channel 220 between the front surface 111 and the ultrasonic probe 210. In other words, the ultrasonic transducer 210 is located entirely behind the rear side 113 along the longitudinal axis L.

[0046] An exemplary embodiment of the imaging device 500 may be a hemoscope, for example... Figure 3 The coronary angioscope shown is illustrated. Another exemplary embodiment of the imaging device 500 is as follows: Figure 7 The image shown is a bronchoscope. Another exemplary embodiment of the imaging device 500 for imaging the inner surface of the tubular structure 300 and its surrounding external environment is shown below. Figure 8 The image shows an endoscope 30. When the tubular structure 300 is, for example, a lumen within a human or animal body, the endoscope 30 becomes an instrument usable in human medicine and veterinary medicine. However, it should be understood that when the tubular structure 300 is part of an industrial installation, equipment, product, machine, production line, etc., the endoscope 30 can also be used as an industrial endoscope.

[0047] In an exemplary embodiment, the endoscope 30 includes a photoelectric module 100 having a shell-like housing, configured to be inserted into the tubular structure 300 to image its inner surface and surrounding external environment. For example, the photoelectric module 100 can be inserted into a patient through a natural orifice (such as the mouth, nose, urethra, bladder, vagina, or anus). Therefore, the endoscope 30 can be used in various configurations as an endoscopy (EUS), gastroscopy, colonoscopy, endoscopic retrograde cholangiopancreatography (ERCP), etc. Applications of the endoscope 30 include diagnostic observation for conditions such as endometrial polyps, infertility, abnormal bleeding, and pelvic pain; and surgical treatment for conditions such as embryonic arrest and uterine malformations.

[0048] The endoscope 30 may also include an insertion tube or shaft 32 having: (i) a distal end connected to the proximal end of the photoelectric module 100; and (ii) a proximal end connected to the receiving device 200. The receiving device 200 includes a first receiving device 190 located outside the tubular structure for receiving signals from the image sensor 110, a second receiving device 290 located outside the tubular structure for receiving signals from the ultrasonic transducer 210, or a combination of both. The shaft 32 may be flexible, rigid, or semi-rigid, and is configured to extend proximally through the tubular structure 300 to apply force to the photoelectric module 100 to control its movement within the tubular structure 300 while simultaneously retracting the photoelectric module 100 from the tubular structure 300.

[0049] The receiving device 200 is typically located outside the tubular structure 300 and is used to receive signals from the image sensor and ultrasonic transducer within the optoelectronic module 100 (described later). For example, the shaft 32 may include at least one electrical lead 321 coupled to the optoelectronic module 100 and transmitting electrical signals from the optoelectronic module 100 to the receiving device 200. The shaft 32 is detachably coupled to (or removably connected to) a housing 33 of the receiving device 200, which may house, for example, a processor board 34, a camera board, and an image acquisition card 35, as well as a power supply 36. The power supply 36 may be, for example, one or more conventional disposable dry batteries or lithium-ion rechargeable batteries. The processor board 34 may be coupled to a computer 38 via a cable 37a for storing and retrieving images generated by the endoscope 30. Alternatively or supplementally, the housing 33 may include an antenna 37b and a wireless chipset 201, such as a wireless chipset compliant with the IEEE 802.11 WiFi standard, for wirelessly transmitting video images generated by the endoscope 30 to the computer 38 or a display 39 without the need for cable 37a. This configuration is particularly suitable for physician office environments because it allows computers and monitors to be placed outside sterile areas, while also giving physicians greater operational flexibility when using the endoscope 30.

[0050] As an alternative or supplementary solution, computer 38 may be configured with image processing software that receives image data output from endoscope 30 as input and generates two-dimensional or three-dimensional reconstructed images of the body cavity and surrounding tissues that can be displayed on display 39. This display can show dynamic images (video) and may be implemented as a cathode ray tube (CRT), liquid crystal display, or similar device.

[0051] In an exemplary embodiment, a processor configured with software can receive a series of still images of an object generated by the photoelectric module 100 as input, and output a three-dimensional rendering of the object based on these still images for display. The housing 33 may also include a switch 40 for activating the photoelectric module 100, switching image modes, and activating the image acquisition card 35 to capture still images from the video stream generated by the photoelectric module 100.

[0052] Shaft 32 can be configured to couple the optoelectronic module 100 to the circuitry within housing 33 in any suitable manner. For example, the availability of low-cost modular imaging system components makes it possible to manufacture disposable components of endoscope 30 at very low cost. In one embodiment, shaft 32 is configured to detachably couple the optoelectronic module 100 to the circuitry within housing 33. In this way, shaft 32 and optoelectronic module 100 are disposable and can be removed from housing 33 after use on a single patient, eliminating the need for sterilization or reprocessing and reducing the risk of contamination. Housing 33 is then sterilized and fitted with a new shaft and optoelectronic module for use on another patient.

[0053] In a preferred embodiment, shaft 32 may act as a traction rod and may include multiple scale marks or reference points 322, enabling the physician to measure the distance traveled by photoelectric module 100 into tubular structure 300 (e.g., body cavity).

[0054] Other known structures can be incorporated into the endoscope 30 as needed. For example, an ergonomic handle can be used for ease of operation. A mechanism for bending the shaft 32 can be introduced into the endoscope. The physician can bend or flex it by pulling or releasing a cable (not shown). The module 100 can be rotated or manipulated via the flexible shaft or cable 32.

[0055] Endoscope 30 can be operated manually, automatically, or a combination of both to perform or complete selected tasks. Some functions of the endoscope can be implemented using components comprising hardware, software, firmware, or a combination thereof. While general-purpose components such as a general-purpose computer or oscilloscope can be used in endoscope 30, specialized or custom components such as circuits, integrated circuits, or software may also be used. For example, some functions are implemented by a series of software instructions executed by a data processor integrated into a general-purpose or custom computer. In some embodiments, the data processor or computer includes volatile memory for storing instructions and / or data, and / or non-volatile memory for storing instructions and / or data, such as a magnetic hard disk and / or removable media. In some embodiments, the device includes network connectivity. In some embodiments, the device includes a user interface that typically includes one or more input devices (e.g., for inputting instructions and / or parameters) and output devices (e.g., for feedback of operating parameters and detection results).

[0056] Figure 9 and 11 The structural configuration of the optoelectronic module 100 is illustrated schematically. (Reference) Figure 9 and 11, the optoelectronic module 100 comprises a housing 160 and an image sensor 110. The image sensor 110 is located inside the housing 160, and has a front surface 111 with a perimeter S, which can range, for example, from about 2.3 mm to about 6 mm, such as from about 2.3 mm to about 4 mm, and from about 4 mm to about 6 mm. The housing 160 may have a thickness T of less than 0.1 mm. The cross-section of the optoelectronic module along the front surface 111 has a perimeter H. The perimeter of a circle or ellipse may also be referred to as its circumference. In various embodiments, S<H<1.6S, for example S<H<1.5S, S<H<1.45S, S<H<1.41S, S<H<1.3S, S<H<1.2S, S<H<1.11S, S<H<1.075S, S<H<1.05S and S<H<1.025S. Figure 10 shows cross-sectional views of various optoelectronic modules with different image sensor front surfaces and housing designs. A cross-section refers to the intersection surface of a three-dimensional object (e.g., the optoelectronic module 100) and a plane (e.g., the front surface 111). From designs (a) to (f), H decreases from 1.6S to 1.025S, and even further to 1.02S and 1.01S.

[0057] Although as Figure 9 , 10 and 11 show the shapes and dimensions of various components, the cross-section of the optoelectronic module 100 along the front surface 111 can have any regular shape (e.g., circular), and can also have an irregular shape. Although the front surface 111 generally has a regular shape (e.g., a polygon, such as a rectangle and a square), it can also have an irregular shape.

[0058] With reference to Figure 11 , the optoelectronic module 100 comprises the image sensor 110 located inside the cylindrical housing 160, and the image sensor 110 has a non-circular front surface 111. The image sensor 110 is located at the distal end (or front end) of the optoelectronic module 100, and the non-circular front surface 111 points or faces forward. In various embodiments, the image sensor 110 can be any suitable device having a photosensitive surface (e.g., the non-circular surface 111) that can be used for capturing images, such as charge-coupled device (CCD) and complementary metal oxide semiconductor (CMOS) image sensors. An ultrasonic transducer 210 (or ultrasonic probe) located inside the housing 160 and behind the image sensor 110 is not shown here.

[0059] As a principle of plane geometry, based on any given non-circular plane 111, a smallest enclosing circle 120 can always be uniquely determined. It should be understood that the concept of "circumscribed circle" is different from the concept of "smallest enclosing circle" (also referred to as "minimum enclosing circle"). With reference to Figure 12 , in geometry, a polygon (in Figure 12In the example of triangle T, the circumcircle is denoted by CC, which passes through all the vertices of the polygon (triangle T has 3 vertices in this example). The center of this circle CC is called the circumcenter, and its radius is called the circumcircle radius. A polygon with a circumcircle is called an inscribed polygon (sometimes called a cocircular polygon because its vertices are cocircular). All regular polygons, all isosceles trapezoids, all triangles, and all rectangles are inscribed polygons.

[0060] The minimum circle problem, or minimum covering circle problem, is a mathematical problem that asks for the smallest circle in the Euclidean plane that contains all points in a given set of points. (See also...) Figure 12 The minimum bounding circle of an MBC is the smallest circle that completely encloses the polygon (e.g., triangle T). Not all polygons have a circumcircle, because the vertices of a polygon may not all lie on a circle, but every polygon (even any non-circular, irregular 2D shape) has a minimum bounding circle, which can be constructed using a linear-time algorithm. Figure 12 As shown, even if a polygon has a circumcircle, it may not coincide with its minimum enclosing circle. For an obtuse triangle T, the minimum enclosing circle MBC has the longest side of the triangle as its diameter, does not pass through the vertex opposite the longest side, and is much smaller than CC.

[0061] In various embodiments, the size and dimensions of the optoelectronic module 100 are designed based on the radius Rmbc of the minimum enclosing circle MBC. For example... Figure 11 As shown, the cylindrical shell 160 is constructed with an inner radius and an outer radius Rc equal to Rmbc. The thickness of the shell 160 wall is Th = Rc - Rmbc. The various components of module 100 are arranged within a space defined by a straight cylinder with radius Rmbc and length L, as shown... Figure 11 As shown. There is no particular limitation on the length L, but it should be as short as possible. In some embodiments, the length L can be adjusted as needed. For example, when a lens needs to be mounted in front of the front surface 111, the module 100 can extend forward slightly to accommodate the lens, thereby making the length L slightly longer. Alternatively, the lens can also protrude outward from the front surface 111.

[0062] Except for outwardly protruding lenses (if present), all components of module 100 are configured to reside within the housing 160 as defined above. Reference Figure 9 , 11 13 and 14, these components may include, but are not limited to, one or more lighting components 130, one or more optional working components 140, and optical components 150, etc.

[0063] Although components 130, 140, and 150 can be placed anywhere within the cylindrical housing 160, in a preferred embodiment of the invention, the lighting component 130 and the working component 140 should obscure the front surface 111 as little as possible, and the optical component (lens) 150 should cover or overlap the front surface 111 as much as possible.

[0064] In one representative embodiment, the non-circular surface 111 has a square shape, and the diagonal of the square is equal to the diameter of the smallest enclosing circle 120 (2 × Rmbc). However, it should be understood that the non-circular surface 111 can be any polygonal shape, such as a triangle, rectangle, pentagon, and hexagon, etc. Reference Figure 13 An arc can be defined by a chord and an arc. Therefore, the four sides (a, b, c, d) of the square surface 111 are taken as four chords, and the arcs on the minimum enclosing circle located between the two endpoints of each chord are four corresponding arcs (Arc1, Arc2, Arc3, Arc4). Each chord and its corresponding arc together form four arcs (S1, S2, S3, S4).

[0065] like Figure 13 As shown, one or more lighting components 130 (130a, 130b, 130c, 130d) can be arranged in one, two, three, or all of the four arcs (S1, S2, S3, and S4). Similarly, one or more optional operating components 140 (if present) can also be arranged in one, two, three, or all of the four arcs (S1, S2, S3, and S4).

[0066] refer to Figure 14 An electronic circuit board 112 (which may be flexible or rigid) is configured to support an image sensor 110 mounted thereon. The circuit board 112 provides necessary power to the image sensor 110 and can export still images and / or video streams captured by the image sensor. An ultrasonic transducer 210 (not shown) is located entirely behind the electronic circuit board 112 along a longitudinal axis (L). In other words, the electronic circuit board 112 is located between the front surface 111 and the ultrasonic probe 210 (not shown).

[0067] refer to Figure 14The optical assembly 150 will be described using a lens or microlens 150 as an example. However, it should be understood that the optical assembly 150 may be a reflective optical system, or a combination of a lens and a reflective optical system. The optical assembly 150 may include multiple optical elements, such as a lens assembly, lenses, and protective glass, and is configured to receive reflected light from a target object. The lens assembly may include multiple lenses (fixed or movable) that can provide a field of view of at least 90 degrees (90°), typically 120 degrees, and up to about 180 degrees or 230 degrees. The lens assembly can provide a depth of field of about 2 to 200 millimeters.

[0068] In such Figure 15 In the preferred embodiment shown, lens 150 has the same shape and size as front surface 111. For example, lens 150 can be exactly the same as front surface 111, and is a square lens with a perimeter S. Such a lens can perfectly match (overlap) with such sensor surface.

[0069] Lens 150 can be used as an objective lens and may include coatings such as chromatic aberration correction coatings and hydrophobic coatings. In many applications, wide-angle objectives are typically used to prevent the omission of areas of interest, such as lesions. For example, the field of view of such an objective lens 150 may be 170° to 230°. A fisheye lens with a field of view greater than 180° may also be used as lens 150. In operation, lens 150 focuses the reflected light from the observed target, image sensor 110 detects the focused reflected light, and then an A / D converter converts the analog image signal obtained by the photoelectric conversion performed by image sensor 110 into a digital image signal.

[0070] In various embodiments, the lens has a short total optical length (optical path), such as 5 mm or less. The lens can be configured to provide a large angle of incidence, for example, a principal angle of incidence greater than 20°, such as 20-40°, and to provide minimal distortion (e.g., less than 80%).

[0071] Referring to references 13 and 14, one or more illumination components 130 may be selected from: a light source, an optical fiber optically coupled to the light source, a light diffuser (e.g., an illumination lens) optically coupled to the light source, or any combination thereof. The illumination components 130 emit light of the same or different wavelengths independently of each other. Examples of light sources include light-emitting diodes (LEDs), incandescent lamps (e.g., halogen lamps), gas discharge lamps (e.g., mercury vapor lamps), fluorescent lamps, arc lamps, ultraviolet lamps (e.g., Wood's lamps), infrared lamps, or any combination thereof. Examples of LEDs include white LEDs, infrared LEDs, near-infrared LEDs, ultraviolet LEDs, or any other type of LED. An optical fiber is a light carrier used to transmit light from a distant light source. An exemplary light diffuser is made of polycarbonate and has a reflective coating on its surface. Similar to the image sensor 110, an electronic circuit board assembly may also be configured to carry an LED capable of illuminating the field of view of the lens 150. In a preferred embodiment, the light source is a flashing LED, which helps to shorten the "LED on" time, thereby reducing the heat generated. Flashing LEDs are particularly useful when the module is so small that thermal management becomes critical or even decisive. In a preferred embodiment, such flashing LEDs are used with a lens 150 and a front surface 111 having the same shape and size (e.g., both are as shown in the image). Figure 15 (The same square shape shown). The flashing LED can be located behind the image sensor 110 and transmit light emission to the tip of the module 100 via one or more optical fibers 130. (As shown) Figure 16 As shown, a light-blocking element 116 can be used to prevent the strong light emission of the LED from having any negative impact or interference on the sensor. The light-blocking element 116 can be, for example, a coating on the back of the image sensor 110.

[0072] The light source can be located at any suitable position on the endoscope 30. (See again) Figure 16 The light source can be located at the far end (LP1) of the photoelectric module 100. In another embodiment, the light source is located in the middle or rear part (LP2, i.e., near end) of the photoelectric module 100 and transmits light to the far end of the module 100 through one or more optical fibers. In yet another embodiment, the light source is located outside the photoelectric module 100 (LP3) and transmits light to the far end of the module 100 through one or more longer optical fibers.

[0073] Back Figure 13 and 14One or more optional working components 140 can be any desired component other than the illumination component 130 and optical components such as the lens 150. An example of a working component 140 could be a working channel, which can be a hollow opening configured for inserting surgical instruments to manipulate various tissues. For example, microforceps can be inserted into the working channel to remove polyps or obtain biopsy samples.

[0074] The working assembly 140 can be a channel for injection, inflation, and aspiration. For example, it can inject fluids (liquids and / or gases) to remove contaminants such as blood, feces, and other debris from the lens 150. A jet channel can be configured to provide a high-pressure fluid jet (e.g., water or saline) to clean the walls of a body cavity (e.g., the colon). The working assembly 140 can be placed outside the housing 160 but bound or connected to it, thereby forming a configuration such as... Figure 1 , 4 External working channel 400 is shown in 5 and 6.

[0075] In a preferred embodiment, a thermal management system is integrated within the photoelectric module 100. The ultrasound probe, image sensor, light source such as an LED, and associated electronic circuitry all dissipate some power as heat. Therefore, a qualified photoelectric module 100 must have an acceptable operating temperature and ensure that the heat dissipated to the patient's body is within permissible limits. According to some embodiments of the invention, using metal to construct the electronic circuit board support is important for conductivity and heat transfer purposes. This electronic circuit board support can act as a heat sink, dissipating heat from some or all of the electronic components (especially the light source, such as the LED) inside the module 100, thereby reducing the overall temperature of the module 100. This can solve or at least mitigate the major problem of temperature rise at the endoscope tip and / or any of its components (especially when using LED illuminators).

[0076] According to one embodiment of this specification, the metal support frame may be configured as a heat sink. To better function as a heat sink, the metal support frame may optionally be equipped with internal fluid channels. The circulation of fluid within the metal support frame ensures that the distal tip of the endoscope does not overheat and maintains its temperature at an acceptable level. In one embodiment, the fluid used within the channels is water. In another embodiment, the fluid is air or a gas (e.g., carbon dioxide).

[0077] Figure 17 It shows Figure 13 An exemplary configuration of the optoelectronic module 100. A circular illumination fiber 1 with a diameter of D2 is a specific example of the illumination assembly 130. A rectangular lens 2 is as follows... Figure 15A specific example of the optical component 150 shown has a diagonal length of D1 and side lengths W1 and W2, respectively. The front surface 111 of the image sensor (not shown) is located behind the lens 2 and has the same shape as the lens 2. The sheath 7 can be a dedicated adhesive sheath, an example of the housing 160 described above. Figure 17 In the specific embodiment shown, H is approximately 1.11S. For example... Figure 17 As shown, three identical optical fibers 1 are placed within each of the four arcs. For example, a square lens with W1=W2=1.0 mm and D1=1.41 mm is surrounded by twelve optical fibers 1 with a diameter D2=0.17 mm. These fibers are evenly distributed in the four arcs, and each arc has the same height, i.e., S1=S2=0.21 mm. In other embodiments, each of the four arcs may include one large optical fiber with a diameter of 0.17 mm, two medium-sized optical fibers with a diameter of 0.14 mm, and two small optical fibers with a diameter of 0.1 mm.

[0078] Figure 18 It shows Figure 13 Another exemplary configuration of the optoelectronic module 100. Circular illumination optical fibers 1 with different diameters D2, D3, and D4 are a specific example of the illumination assembly 130. A circular lens 2 with a diameter D1 is as follows... Figure 15 A specific example of the optical assembly 150 is shown. A square image sensor 110 with a side length W1 is located behind the lens 2. The sheath 7 can be a dedicated adhesive sheath, which is an example of the housing 160 as described above. Figure 18 In the specific embodiment shown, H is approximately 1.11S. For example, a circular lens 2 with a diameter D1 = 1.0 mm (located in front of a square image sensor 110 with a side length W1 = 1.0 mm) is surrounded by twenty optical fibers. In such... Figure 18 Each of the four bows shown contains one large optical fiber with a diameter of D2 = 0.17 mm, two medium-sized optical fibers with a diameter of 0.14 mm, and two small optical fibers with a diameter of D4 = 0.1 mm. The height S1 of each bow is approximately 0.20 mm or 0.21 mm. In other embodiments, each of the four bows may include three identical optical fibers with a diameter of 0.16 mm or 0.17 mm.

[0079] The optical fiber in each bow shape as described above can be replaced by a large "D-shaped" optical fiber. The base length and height of the "D-shaped" optical fiber can be in the range of, for example, 0.7-1.0 mm and 0.16-0.19 mm, respectively. Figure 19 This illustrates such a "D-shaped" optical fiber 1. Figure 19 and Figure 17They are basically the same, except that the three optical fibers in each bow are replaced by a large "D-shaped" optical fiber with a base length L=0.9 mm and a fiber height H=0.18 mm. Figure 19 Other dimensions can be W1 = 1.0 mm, S1 = 0.2 mm, and D1 = 1.4 mm. Similarly, as... Figure 18 The five optical fibers in each bow shown can also be replaced by a single large "D-shaped" optical fiber, which will not be elaborated here for the sake of simplicity.

[0080] Figure 20 This is an axial cross-sectional view of an exemplary structure for a photoelectric module. Within housing 160, a microlens system 150 (e.g., a square lens) is positioned in front of a CMOS sensor 110, which is mounted on a circuit board 112. A light-blocking element 116 is positioned behind the circuit board 112 and surrounds the CMOS sensor 110, such that the front surface 111 detects only reflected light from the observed object, without interference from the strong light from the LED 114. The LED 114 is mounted on circuit board 115, and light emitted from the LED 114 passes through a light guide 130 (e.g., a... Figure 17 , 18 The optical fiber (shown in 19) transmits to the tip of the module. Wires connect to circuit boards 112 and 115. The ultrasonic transducer 210 (not shown) is located entirely behind the electronic circuit board 112 along the longitudinal axis (L). In other words, the electronic circuit board 112 is located between the front surface 111 and the ultrasonic probe 210 (not shown).

[0081] In the foregoing specification, numerous specific details have been described with reference to embodiments of the invention, which may vary in different specific implementations. Therefore, this specification and drawings should be considered illustrative rather than restrictive. The unique and exclusive reference to the scope of the invention, and the scope of the invention as intended by the applicant, is limited only to the literal scope of the claims finally granted in this application (as ultimately approved, including any subsequent amendments) and their equivalents.

Claims

1. A photoelectric module (100) optionally bundled with an external working channel (400), characterized in that, The photoelectric module (100) includes: (i) A housing (160) or sleeve having a longitudinal axis (L); (ii) An image sensor (110) fixed at the distal end of the housing (160); and (iii) An ultrasonic transducer (210) or ultrasonic probe located within the housing (160); The ultrasonic transducer (210) is located entirely behind the image sensor 110 along the longitudinal axis (L).

2. The optoelectronic module according to claim 1, characterized in that, By rotating the ultrasonic handle (280) connected to the ultrasonic transducer (210), the ultrasonic transducer (210) can be rotated about an axis (T) parallel to the longitudinal axis (L).

3. The optoelectronic module according to claim 1, characterized in that, It also includes an ultrasonic gel / fluid channel (220) located within the housing (160); wherein, by pushing and pulling an ultrasonic handle (280) connected to the ultrasonic transducer (210), the ultrasonic transducer (210) can move forward and backward within the ultrasonic gel / fluid channel 220 in a direction parallel to the longitudinal axis (L).

4. The optoelectronic module according to claim 3, characterized in that, It also includes an illumination assembly (130), a gel / fluid outlet (142) disposed on the ultrasonic gel / fluid channel (220), and a wire (119) connected to the image sensor (110).

5. The optoelectronic module according to claim 1, characterized in that, The image sensor (110) has a front surface (111) and a rear side (113). Furthermore, the rear side (113) is located between the front surface (111) and the ultrasonic probe (210), or the ultrasonic transducer (210) is located entirely behind the rear side (113) along the longitudinal axis (L).

6. The optoelectronic module according to claim 1, characterized in that, The front surface (111) has a perimeter S, and the photoelectric module (100) has a perimeter H along the cross section of the front surface (111), where S < H < 1.6S.

7. The optoelectronic module according to claim 6, characterized in that, It also includes one or more lighting components (130); wherein the housing (160) is cylindrical and the image sensor (110) has a non-circular front surface; The inner diameter of the cylindrical shell is substantially the same as the diameter of the smallest enclosing circle of the non-circular front surface. Furthermore, the image sensor (110) and the one or more illumination components (130) are both confined within the cylindrical housing.

8. The optoelectronic module according to claim 7, characterized in that, The non-circular front surface is a square, and the diagonal of the square is equal to the diameter of the smallest enclosing circle.

9. The optoelectronic module according to claim 8, characterized in that, Using the four sides of the square as four chords, the arcs on the smallest enclosing circle located between the two endpoints of each chord are four corresponding arcs, and each chord and its corresponding arc together form four arcs; Furthermore, at least one of the four arcs is provided with one or more lighting components (130).

10. The photoelectric module according to claim 9, characterized in that, Each of the four arcs is provided with one or more lighting components (130).

11. The optoelectronic module according to claim 7, characterized in that, It also includes a lens located in front of the non-circular front surface.

12. The optoelectronic module according to claim 11, characterized in that, The lens and the front surface have the same shape and size, and are configured to overlap each other.

13. An imaging device (500) for imaging the inner surface of a tubular structure and its surrounding external environment, characterized in that, include: (1) The photoelectric module (100) as described in claim 1, for insertion into the tubular structure (300); (2) A first receiving device (190) located outside the tubular structure (300) for receiving signals from the image sensor (110); as well as (3) A second receiving device (290) located outside the tubular structure (300) for receiving signals from the ultrasonic transducer (210).

14. The imaging apparatus according to claim 13, characterized in that, It also includes an ultrasonic handpiece (280) connected to the ultrasonic transducer (210). The ultrasonic handle (280) is configured for a user to hold and grip; The ultrasonic handpiece (280) is configured to rotate the ultrasonic transducer (210) about an axis (T) parallel to the longitudinal axis (L); Furthermore, the ultrasonic handle (280) is configured to push and pull the ultrasonic transducer (210) so that it moves forward and backward within the housing (160) in a direction parallel to the longitudinal axis (L).

15. The imaging apparatus according to claim 13, characterized in that, It also includes an external working channel (400) bundled together with the optoelectronic module (100).

16. The imaging apparatus according to claim 13, characterized in that, The imaging device is an industrial endoscope or a medical endoscope; wherein the inner surface of the tubular structure (300) is the inner surface of the lumen inside the body, and the imaging device (500) is a vascular endoscope, a bronchoscope, or an endoscope used in human medicine and veterinary medicine.

17. The imaging apparatus according to claim 13, characterized in that, It also includes a shaft (32) or an insertion tube; wherein the shaft (32) has: (i) a distal end connected to the proximal end of the photoelectric module (100); and (ii) a proximal end connected to the receiving device (200); Furthermore, the shaft (32) is configured to extend proximally through the tubular structure (300) so that force can be applied to the photoelectric module (100) to control its movement within the tubular structure (300), while the photoelectric module (100) can be withdrawn from the tubular structure (300).

18. The imaging apparatus according to claim 17, characterized in that, The shaft (32) includes at least one electrical lead (321) which is coupled to the optoelectronic module (100) and transmits electrical signals from the optoelectronic module (100) to the receiving device (200).

19. The imaging apparatus according to claim 17, characterized in that, The shaft (32) is provided with multiple scale marks for users to measure the distance traveled by the photoelectric module (100) within the tubular structure (300).

20. The imaging apparatus according to claim 13, characterized in that, It also includes a processor configured with software that receives multiple still images of the target object generated by the photoelectric module (100) as input, and outputs a three-dimensional rendering of the object for display based on the multiple still images.

Images