A solid-state battery uv curing frame adhesive coating method, device and system

CN122806706APending Publication Date: 2026-09-25SHENZHEN GEESUN INTELLIGENT TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202610944227.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-06-29
Publication Date
2026-09-25

AI Technical Summary

Technical Problem

[0005]有鉴于此,本申请的目的在于提供一种固态电池UV固化框架胶涂覆方法、装置及系统,能够避免因刻痕波动导致喷胶量与真实需求不匹配的问题

Benefits of technology

[0016]本申请实施例提供了一种固态电池UV固化框架胶涂覆方法、装置及系统,该方法包括:在目标极片经过激光刻痕装置进行刻痕后,根据目标极片对应的实际刻痕深度分布数据对喷胶装置的出胶参数进行第一次调整,以使目标极片在对喷胶装置的出胶参数进行第一次调整完成后进行UV固化;在目标极片完成UV固化后,对目标极片对应的表面高度曲线和基准面高度进行数值比较,得到目标极片对应的胶层厚度分布数据;根据胶层厚度分布数据对喷胶装置的出胶参数进行第二次调整,以使后续极片通过第二次调整完成后的喷胶装置完成UV固化框架胶涂覆。通过本申请能够避免因刻痕波动导致喷胶量与真实需求不匹配的问题。

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Abstract

The application provides a solid-state battery UV curing frame glue coating method, device and system. The method comprises the following steps: after a target pole piece is engraved by a laser engraving device, the glue discharge parameters of a glue spraying device are adjusted for the first time according to the actual engraving depth distribution data corresponding to the target pole piece, so that the target pole piece is subjected to UV curing after the first-time adjustment of the glue discharge parameters of the glue spraying device is completed; after the target pole piece is subjected to UV curing, the surface height curve corresponding to the target pole piece and the reference surface height are compared numerically to obtain glue layer thickness distribution data corresponding to the target pole piece; and the glue discharge parameters of the glue spraying device are adjusted for the second time according to the glue layer thickness distribution data, so that subsequent pole pieces are subjected to UV curing by the glue spraying device after the second-time adjustment is completed. The application can avoid the problem that the glue spraying amount does not match the actual demand due to engraving fluctuation.
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Description

Technical Field

[0001] This invention relates to the field of solid-state battery technology, and more specifically, to a method, apparatus, and system for coating a UV-curable framework adhesive for solid-state batteries. Background Technology

[0002] In the manufacturing process of solid-state batteries, an insulating frame needs to be formed at the edges of the electrodes to prevent direct contact between the positive and negative electrodes, which could cause an internal short circuit. This frame also provides edge support during subsequent isostatic pressing and stacking processes to prevent the electrodes from deforming under pressure. Currently, UV (Ultraviolet) printing technology, combining laser-assisted marking with rapid UV curing, can achieve micron-level precision and has a fast curing speed. It is also more suitable for sensitive solid-state electrolyte materials such as sulfides and is considered by the industry to be a technology with significant industrialization potential.

[0003] A typical UV-printed frame process is as follows: First, an ultrafast laser (picosecond / femtosecond level) is used to precisely etch microgrooves or channels with a depth of about 15–20 μm on the edge of the electrode; then, UV-curable insulating adhesive is sprayed or filled into the laser grooves through a nozzle to form a closed frame structure around the electrode; finally, the adhesive is rapidly cured by UV irradiation to ensure that the frame is stably formed and can withstand the subsequent high-voltage bonding and the actual operating pressure of the battery cell.

[0004] However, due to factors such as laser thermal drift, uneven electrode surface tension, and material thickness tolerance, the actual scoring depth fluctuates by ±3-5μm or even more, resulting in a mismatch between the subsequent adhesive application amount and the actual requirements. If the scoring is too deep, the adhesive filling is insufficient, and the adhesive layer shrinks after curing, forming a depression; if the scoring is too shallow, the adhesive overflows, contaminating the active area of ​​the electrode. Summary of the Invention

[0005] In view of this, the purpose of this application is to provide a method, apparatus and system for coating a UV-curable frame adhesive for solid-state batteries, which can avoid the problem of mismatch between the amount of adhesive sprayed and the actual needs caused by the fluctuation of the groove.

[0006] In a first aspect, embodiments of this application provide a method for coating a UV-curable framework adhesive for solid-state batteries, the method comprising: After the target electrode sheet used to manufacture solid-state batteries is marked by a laser marking device, the actual marking depth distribution data corresponding to the target electrode sheet is received by the marking depth detection device. Based on the actual groove depth distribution data corresponding to the target electrode, the glue dispensing parameters of the glue spraying device are adjusted for the first time so that the target electrode enters the UV curing device for UV curing after the first adjustment of the glue dispensing parameters of the glue spraying device is completed. After the target electrode has completed UV curing, the surface height curve of the target electrode detected by the curing detection device is received. By numerically comparing the surface height curve corresponding to the target electrode with the reference surface height, the thickness distribution data of the adhesive layer corresponding to the target electrode is obtained. The dispensing parameters of the adhesive spraying device are adjusted a second time based on the adhesive layer thickness distribution data, so that the subsequent electrode sheets can complete the UV curing frame adhesive coating through the adhesive spraying device after the second adjustment.

[0007] In one possible implementation, the step of numerically comparing the surface height curve corresponding to the target electrode and the reference surface height to obtain the adhesive layer thickness distribution data corresponding to the target electrode includes: Substituting the surface height curve and reference plane height corresponding to the target electrode into the following formula, the adhesive layer thickness distribution data corresponding to the target electrode is obtained; ; in, The adhesive layer thickness is located at position x on the target electrode in the adhesive layer thickness distribution data. The height at position x on the target electrode in the surface height curve. The reference plane height.

[0008] In one possible implementation, the second adjustment of the adhesive dispensing parameters of the adhesive spraying device based on the adhesive layer thickness distribution data includes: Based on the adhesive layer thickness distribution data and the theoretical adhesive layer thickness, the current dispensing compensation coefficient is adjusted to obtain the initial dispensing compensation coefficient; Determine the target extrusion compensation coefficient based on the initial extrusion compensation coefficient; The glue dispensing parameters of the glue spraying device are adjusted a second time based on the target glue dispensing compensation coefficient.

[0009] In one possible implementation, determining the target extrusion compensation coefficient based on the initial extrusion compensation coefficient includes: Obtain at least one process parameter value under various process parameter types for UV-cured frame adhesive coating of the solid-state battery at the current moment; the process parameter type is adhesive characteristic parameter, equipment operating parameter, or electrode substrate parameter; process parameter refers to the parameter that affects the adhesive spraying of the adhesive spraying device. The initial dispensing compensation coefficient is corrected based on at least one process parameter value under each process parameter type to obtain the target dispensing compensation coefficient.

[0010] In one possible implementation, the step of correcting the initial discharge compensation coefficient based on at least one process parameter value under each process parameter type to obtain the target discharge compensation coefficient includes: Based on at least one process parameter value under each process parameter type, determine the correction factor corresponding to each process parameter; The initial extrusion compensation coefficient is corrected according to each correction factor to obtain the target extrusion compensation coefficient.

[0011] In one possible implementation, before making a second adjustment to the dispensing parameters of the adhesive spraying device based on the adhesive layer thickness distribution data, the method further includes: Based on the comparison between the adhesive layer thickness distribution data and the preset thickness threshold, it is determined whether the adhesive layer thickness distribution data meets the preset adhesive layer thickness threshold condition. If the adhesive layer thickness distribution data does not meet the preset adhesive layer thickness threshold condition, the process jumps to the second adjustment of the adhesive dispensing parameters of the spraying device based on the adhesive layer thickness distribution data to continue execution.

[0012] Secondly, embodiments of this application also provide a solid-state battery UV-curable frame adhesive coating apparatus, the apparatus comprising: The receiving module is used to receive the actual marking depth distribution data of the target electrode detected by the marking depth detection device after the target electrode for manufacturing solid-state battery is marked by the laser marking device. The adjustment module is used to make a first adjustment to the glue dispensing parameters of the glue spraying device based on the actual groove depth distribution data corresponding to the target electrode, so that the target electrode can enter the UV curing device for UV curing after the first adjustment of the glue dispensing parameters of the glue spraying device is completed. The receiving module is also used to receive the surface height curve of the target electrode detected by the curing detection device after the target electrode has completed UV curing. The numerical comparison module is used to numerically compare the surface height curve and the reference surface height corresponding to the target electrode to obtain the adhesive layer thickness distribution data corresponding to the target electrode. The adjustment module is also used to make a second adjustment to the glue dispensing parameters of the glue spraying device based on the glue layer thickness distribution data, so that the subsequent electrode sheets can complete the UV curing frame adhesive coating through the glue spraying device after the second adjustment.

[0013] Thirdly, embodiments of this application also provide a solid-state battery UV-curable frame adhesive coating system, wherein a laser marking device, a marking depth detection device, an adhesive spraying device, a UV curing device, and a curing detection device are arranged sequentially along the electrode conveying direction; the system also includes the solid-state battery UV-curable frame adhesive coating device as described in the second aspect.

[0014] Fourthly, embodiments of this application also provide an electronic device, including: a processor, a storage medium, and a bus, wherein the storage medium stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor communicates with the storage medium via the bus, and the processor executes the machine-readable instructions to perform the steps of the solid-state battery UV-curable frame adhesive coating method as described in any of the first aspects.

[0015] Fifthly, embodiments of this application also provide a computer-readable storage medium storing a computer program, which, when executed by a processor, performs the steps of the solid-state battery UV-curable frame adhesive coating method as described in any of the first aspects.

[0016] This application provides a method, apparatus, and system for UV-curing framework adhesive coating of solid-state batteries. The method includes: after a target electrode is scored using a laser scoring device, adjusting the dispensing parameters of a spraying device for the first time based on the actual scoring depth distribution data corresponding to the target electrode, so that the target electrode undergoes UV curing after the first adjustment of the dispensing parameters; after the target electrode completes UV curing, comparing the surface height curve and the reference surface height corresponding to the target electrode to obtain the adhesive layer thickness distribution data corresponding to the target electrode; and adjusting the dispensing parameters of the spraying device for the second time based on the adhesive layer thickness distribution data, so that subsequent electrodes complete the UV-curing framework adhesive coating using the spraying device after the second adjustment. This application avoids the problem of mismatch between the amount of adhesive dispensed and the actual requirements due to scoring fluctuations. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A flowchart of a solid-state battery UV-curable frame adhesive coating method provided in an embodiment of this application is shown; Figure 2 A flowchart of a solid-state battery UV-curable frame adhesive coating apparatus provided in an embodiment of this application is shown; Figure 3 This paper illustrates an architecture diagram of a solid-state battery UV-curable frame adhesive coating system provided in an embodiment of this application. Figure 4 A schematic diagram of the structure of an electronic device provided in an embodiment of this application is shown. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It should be understood that the accompanying drawings in this application are for illustrative and descriptive purposes only and are not intended to limit the scope of protection of this application. Furthermore, it should be understood that the schematic drawings are not drawn to scale. The flowcharts used in this application illustrate operations implemented according to some embodiments of this application. It should be understood that the operations in the flowcharts may not be implemented in sequence, and steps without logical contextual relationships may be reversed or implemented simultaneously. In addition, those skilled in the art, guided by the content of this application, may add one or more other operations to the flowcharts, or remove one or more operations from the flowcharts.

[0020] Furthermore, the described embodiments are merely some, not all, of the embodiments of this application. The components of the embodiments of this application described and illustrated herein can typically be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0021] To enable those skilled in the art to utilize the content of this application, and in conjunction with the specific application scenario of "solid-state battery technology," the following embodiments are provided. For those skilled in the art, the general principles defined herein can be applied to other embodiments and application scenarios without departing from the spirit and scope of this application. Although this application is primarily described within the "solid-state battery technology field," it should be understood that this is merely an exemplary embodiment.

[0022] It should be noted that the term "comprising" will be used in the embodiments of this application to indicate the presence of the features declared thereafter, but does not exclude the addition of other features.

[0023] Solid-state batteries are considered the core direction of next-generation power batteries due to their high energy density and high safety. In the manufacturing process of solid-state batteries, an insulating frame needs to be formed at the edges of the electrodes to prevent direct contact between the positive and negative electrodes, which could cause internal short circuits. It also provides edge support during subsequent isostatic pressing and stacking processes to prevent electrode deformation under pressure. Currently, the main manufacturing processes for the frame include stencil printing, pre-formed frame transfer, dispensing, and UV printing (laser marking + UV adhesive spraying + UV curing). Among these, UV printing technology, combining laser-assisted marking with rapid UV curing, can achieve micron-level precision and has a fast curing speed. It is also more suitable for sensitive solid-state electrolyte materials such as sulfides and is considered by the industry to be a technology with great industrialization potential.

[0024] A typical UV-printed frame process is as follows: First, an ultrafast laser (picosecond / femtosecond level) is used to precisely etch microgrooves or channels with a depth of about 15–20 μm on the edge of the electrode; then, UV-curable insulating adhesive is sprayed or filled into the laser grooves through a nozzle to form a closed frame structure around the electrode; finally, the adhesive is rapidly cured by UV lamp irradiation to ensure that the frame is stably formed and can withstand the subsequent high-voltage bonding and the actual operating pressure of the battery cell.

[0025] The current mainstream open-loop control process in the industry, which involves "laser marking—quantitative adhesive spraying—UV curing," is implemented as follows: Laser marking station: A picosecond laser is used to etch microgrooves on the edge of the electrode according to preset parameters. Parameters such as laser power, scanning speed, and repetition frequency are set by the process engineer during changeover and remain constant throughout the production process. After marking is completed, the electrode directly enters the next station without online measurement of the actual marking depth.

[0026] Quantitative glue spraying station: A precision dispensing valve or piezoelectric nozzle is used to spray glue according to a preset single dispensing amount or coating speed. The glue dispensing amount is set based on the results of the prior DOE (Design of Experiments) calibration and is a fixed value during production or only varies according to a simple time / position curve, and is not related to the actual score depth.

[0027] UV curing station: A mercury lamp or LED UV light source is used to irradiate and cure the adhesive layer at a fixed energy (e.g., 2000–12000 mJ / cm²). After curing, the adhesive frame is attached to the edge of the electrode, providing insulation and support.

[0028] Quality Inspection: Existing production lines typically have offline sampling inspection stations (such as manual microscope sampling or offline 3D profilometer sampling) after curing to check the continuity, width, and thickness of the adhesive frame. The inspection results are not fed back to the front-end adhesive application system in real time, but are only used for batch-level process traceability.

[0029] The main drawbacks of existing technologies include: (1) The depth of the marking cannot be detected: Affected by factors such as laser thermal drift, uneven surface tension of the electrode, and thickness tolerance of the incoming material, the actual marking depth fluctuates by ±3-5μm or even more. The existing technology does not perform online detection of the marking depth, resulting in a mismatch between the amount of adhesive sprayed and the actual requirements. When the marking is too deep, the adhesive filling is insufficient, and the adhesive layer shrinks after curing, forming a depression; when the marking is too shallow, the adhesive overflows, contaminating the active area of ​​the electrode.

[0030] (2) Decoupling of glue application amount and scoring depth: The existing solution uses a preset value for glue application amount, which is an "open-loop" control and cannot be compensated in real time according to the actual scoring depth of each electrode. When the production line speed increases or different specifications of electrode are produced, the preset glue application amount is difficult to adapt quickly, resulting in a decrease in yield.

[0031] (3) Lack of online thickness / filling inspection after curing: Existing technology only evaluates the quality of the adhesive layer through offline sampling after curing, and cannot achieve 100% online inspection. Whether the adhesive layer completely fills the scratches after curing, and whether there are local depressions or protrusions, cannot be captured in real time.

[0032] (4) Data silos between front and back stations, with no closed-loop feedback: Even if defects are detected in the back station, the detection results cannot be transmitted back to the front station gluing system in real time for adjustment. By the time batch defects are discovered, a large number of scraps have been generated, and manual shutdown and recalibration of the gluing parameters are required, which seriously affects the production line cycle time (the current UV printing frame process cycle time is relatively slow, which is one of the bottlenecks in industrialization).

[0033] (5) Poor process stability and long changeover and debugging time: Due to the lack of real-time data-driven adaptive capability, a lot of trial production and debugging are required when the production line changes or materials are changed, which increases non-production time.

[0034] In view of this, this application provides a method for UV-curing frame adhesive coating of solid-state batteries. By adding online detection of the marking depth and real-time control of the adhesive dispensing amount before spraying, the adhesive dispensing amount is ensured to accurately match the marking volume. At the same time, online detection of the adhesive layer thickness and leveling status is added after UV curing, and the detection results are fed back to the coating area in real time, forming a dual closed-loop control of feedforward + feedback. This significantly improves the accuracy, consistency and production line yield of the frame adhesive coating, and shortens the changeover and debugging time.

[0035] The following is a detailed description of a solid-state battery UV-curable frame adhesive coating method provided in the embodiments of this application.

[0036] Reference Figure 1The diagram shown is a flowchart of a solid-state battery UV-curable frame adhesive coating method provided in an embodiment of this application. This method is applied to a solid-state battery UV-curable frame adhesive coating device in a solid-state battery UV-curable frame adhesive coating system. The solid-state battery UV-curable frame adhesive coating system is arranged sequentially along the electrode conveying direction by a laser marking device, a marking depth detection device, a glue spraying device, a UV curing device, and a curing detection device. The laser marking device, the marking depth detection device, the glue spraying device, the UV curing device, and the curing detection device are connected to the solid-state battery UV-curable frame adhesive coating device through a high-speed industrial bus (such as EtherCAT) to achieve microsecond-level data interaction.

[0037] The following is an illustrative description of each step in the UV-cured framework adhesive coating method for solid-state batteries: S101. After the target electrode sheet used to manufacture solid-state batteries is marked by a laser marking device, the actual marking depth distribution data corresponding to the target electrode sheet detected by the marking depth detection device is received.

[0038] In this embodiment, after the target electrode is marked by a laser marking device and before it enters the adhesive spraying device for adhesive application, a marking depth detection device (i.e., a high-precision non-contact depth sensor, such as a confocal displacement sensor or a laser triangulation sensor, which acquires the distribution curve of the marking depth h(x) along the edge of the target electrode with μm-level resolution) is installed. The marking depth detection device scans the target electrode point by point or line by line to obtain the actual marking depth distribution data. The actual marking depth distribution data includes the marking depth at various positions on the microgrooves or traces etched by the laser marking device on the target electrode. Then, the marking depth detection device uploads the detected actual marking depth distribution data corresponding to the target electrode to the solid-state battery UV curing frame adhesive coating device.

[0039] The actual scratch depth distribution data includes the scratch depth at each position x on the microgroove or trace of the target electrode.

[0040] S102. Based on the actual groove depth distribution data corresponding to the target electrode, the glue dispensing parameters of the glue spraying device are adjusted for the first time so that the target electrode enters the UV curing device for UV curing after the first adjustment of the glue dispensing parameters of the glue spraying device is completed.

[0041] In this embodiment of the application, the solid-state battery UV-curable frame adhesive coating device performs a first adjustment to the adhesive dispensing parameters of the adhesive spraying device through the following steps: Step 1: Calculate the target adhesive volume distribution data required for the target electrode based on the actual groove depth distribution data, the curing shrinkage rate of the UV adhesive, and the preset overflow height margin.

[0042] In this application embodiment, the curing shrinkage rate of the UV adhesive refers to the percentage reduction in volume of the UV adhesive during the process of changing from a liquid to a solid state (curing). The preset overflow height margin refers to a pre-set height value added on top of the indentation depth h(x). Its purpose is to ensure that after the UV adhesive is coated, cured, and undergoes volume shrinkage, the surface of the adhesive is slightly higher than the surface of the electrode, forming a small, controllable protrusion to meet the minimum requirements for adhesive layer thickness in subsequent processes (such as bonding with a diaphragm or another electrode, ensuring interface contact, etc.).

[0043] The target ejection volume distribution data includes the target ejection volume at each position x on the microgroove or trace of the target electrode.

[0044] Specifically, by substituting the actual notch depth distribution data, the curing shrinkage rate of the UV adhesive, and the preset overflow height allowance into the following formula, the target adhesive volume distribution data required for the target electrode is obtained: ; in, The target ejection volume is the volume at position x on the microgroove or trace of the target electrode in the target ejection volume distribution data (considering the curing shrinkage rate of the UV adhesive). To increase the position x at which the microgroove or trace is not on the target electrode. The first theoretical dispensing volume of excess glue. To increase the position x on the microgroove or trace of the target electrode The second theoretical glue dispensing volume after the excess glue. This represents the actual scratch depth at position x on the microgroove or trace of the target electrode in the actual scratch depth distribution data. Let x be the width of the groove or channel at position x on the target electrode.

[0045] Step 2: Determine the glue spraying control parameters of the glue spraying device based on the target glue dispensing volume.

[0046] In the embodiments of this application, the glue spraying control parameters of the glue spraying device can be determined by traditional methods such as a pre-calibrated glue dispensing volume-glue spraying control parameter comparison table, theoretical flow calculation, or closed-loop feedback adjustment. It is only necessary to ensure that the glue spraying device can spray glue according to the target glue dispensing volume distribution data under the glue spraying control parameters.

[0047] The glue spraying control parameters include the amplitude of the piezoelectric ceramic driving voltage, the nozzle opening, the pulse frequency, or the screw valve speed.

[0048] Step 3: Send the glue spraying control parameters of the glue spraying device to the glue spraying device, thereby completing the first adjustment of the glue dispensing parameters of the glue spraying device.

[0049] In the embodiments of this application, the dispensing parameters include dispensing pressure, nozzle opening, dispensing frequency, or spraying speed.

[0050] Among them, by controlling the amplitude of the piezoelectric ceramic driving voltage of the glue spraying device, the nozzle opening of the glue spraying device can be adjusted; by adjusting the air supply pressure, pulse frequency, screw valve speed or platform moving speed of the glue spraying device, the glue spraying pressure, dispensing frequency, glue flow rate or spraying speed of the glue spraying device can be adjusted respectively.

[0051] Here, in the piezoelectric jet valve, the amplitude of the driving voltage determines the degree of deformation of the piezoelectric ceramic, which in turn determines the lifting height of the valve core, i.e., the nozzle opening. This is direct control of the piezoelectric jet valve. Whether it's a piezoelectric valve or a screw valve, the adhesive usually needs to be delivered to the valve or screw inlet under stable back pressure. This back pressure is the spray pressure. Adjusting the electro-proportional valve of the air supply system controls the spray pressure. For a piezoelectric jet valve, one driving voltage pulse corresponds to one valve opening action, forming one adhesive dot. Therefore, the pulse frequency directly determines the number of dots per unit time. Adjusting the pulse frequency of the piezoelectric ceramic driving signal controls the dispensing frequency. For a screw valve, the adhesive is extruded by the motor-driven screw rotation. The faster the screw speed, the larger the volume of adhesive extruded per unit time. Adjusting the speed of the motor driving the screw controls the adhesive flow rate. In continuous scribing or spraying modes, the distribution speed of the adhesive strip on the electrode is determined by the relative movement of the nozzle and the electrode. Adjusting the platform movement speed that drives the electrode or nozzle controls the spraying speed.

[0052] S103. After the target electrode has completed UV curing, receive the surface height curve of the target electrode detected by the curing detection device.

[0053] In this embodiment, after UV curing, a curing detection device (high-precision thickness / morphology detection sensor, such as a spectral confocal sensor or a line laser 3D profilometer) is used to perform a full inspection of the surface height, thickness, and leveling status of the cured adhesive layer on the target electrode. Then, the curing detection device uploads the detected surface height curve corresponding to the target electrode to the solid-state battery UV-cured frame adhesive coating device.

[0054] The surface height curve includes the height of each position x on the microgroove or trace of the target electrode.

[0055] S104. Compare the surface height curve of the target electrode with the reference surface height to obtain the adhesive layer thickness distribution data corresponding to the target electrode.

[0056] In this embodiment, the adhesive layer thickness distribution data includes the actual adhesive layer thickness at each position x on the microgroove or trace of the target electrode. Specifically, the solid-state battery UV-curable frame adhesive coating device substitutes the surface height curve and reference plane height corresponding to the target electrode into the following formula to obtain the adhesive layer thickness distribution data corresponding to the target electrode; ; in, The adhesive layer thickness is located at position x on the target electrode in the adhesive layer thickness distribution data. The height at position x on the target electrode in the surface height curve. The reference plane height.

[0057] S105. Adjust the glue dispensing parameters of the glue spraying device a second time based on the glue layer thickness distribution data, so that the subsequent electrode sheets can complete the UV curing frame adhesive coating through the glue spraying device after the second adjustment.

[0058] In this embodiment of the application, the solid-state battery UV-curable frame adhesive coating device performs a second adjustment to the adhesive dispensing parameters of the adhesive spraying device through the following steps: Step 1: Based on the adhesive layer thickness distribution data and the theoretical adhesive layer thickness, adjust the current adhesive dispensing compensation coefficient to obtain the initial adhesive dispensing compensation coefficient.

[0059] In this embodiment, the glue dispensing compensation coefficient refers to a dimensionless proportionality factor used to correct the glue dispensing deviation of the glue spraying device. The initial glue dispensing compensation coefficient is obtained by substituting the glue layer thickness distribution data, the current glue dispensing compensation coefficient, and the theoretical glue layer thickness into the following formula.

[0060] ; in, Let x be the initial adhesive discharge compensation coefficient at position x on the target electrode. Let x be the theoretical adhesive layer thickness at position x on the target electrode. This represents the actual adhesive layer thickness at position x on the target electrode in the adhesive layer thickness distribution data. Let x be the theoretical adhesive layer thickness at position x on the target electrode.

[0061] Step 2: Determine the target extrusion compensation coefficient based on the initial extrusion compensation coefficient.

[0062] In this embodiment, the initial extrusion compensation coefficient can be directly determined as the target extrusion compensation coefficient, or it can be incorporated into the auxiliary process parameters for calculating the compensation coefficient to construct a multi-parameter coupled extrusion compensation coefficient model. Specifically: i. Obtain at least one process parameter value under various process parameter types for UV curing framework adhesive coating of solid-state batteries at the current moment; the process parameter type is adhesive property parameter, equipment operating parameter or electrode substrate parameter; the process parameter refers to the parameter that affects the adhesive spraying device.

[0063] In this application embodiment, the adhesive properties parameters may include UV frame adhesive temperature, adhesive viscosity, adhesive tank air supply pressure, and batch solid content deviation of the adhesive; the equipment operating parameters may include the ambient temperature and humidity of the spraying device, nozzle wear attenuation coefficient, target electrode conveying line speed fluctuation value, and UV curing light intensity attenuation; the electrode substrate parameters may include the target electrode substrate surface roughness, target electrode edge warpage, and batch electrode substrate material difference coefficient.

[0064] ii. Correct the initial dispensing compensation coefficient based on at least one process parameter value under each process parameter type to obtain the target dispensing compensation coefficient.

[0065] In this embodiment, the initial glue discharge compensation coefficient is corrected through the following steps: (1) Determine the correction factor corresponding to each process parameter based on at least one process parameter value under each process parameter type.

[0066] In this application embodiment, the calibration correction factor corresponding to the preset process parameter value range where each process parameter value falls is determined as the correction factor corresponding to each process parameter. Examples include the adhesive temperature-viscosity characteristic correction factor, the equipment operating condition attenuation correction factor, and the electrode substrate characteristic correction factor.

[0067] Here, each calibration correction factor is obtained by preset process parameter threshold ranges through process calibration experiments, and real-time sensor data is automatically assigned to participate in the calculation. Temperature and humidity sensors, online adhesive viscosity detectors, conveyor line encoders, UV light intensity meters, and other devices are connected to collect the aforementioned auxiliary parameters in real time. These parameters are then coupled with adhesive layer thickness deviation calculations to dynamically correct the adhesive compensation coefficient, suppressing coating quality fluctuations caused by environmental factors, consumables, equipment aging, and substrate differences.

[0068] (2) The initial extrusion compensation coefficient is corrected according to each correction factor to obtain the target extrusion compensation coefficient.

[0069] In the embodiments of this application, the target extrusion compensation coefficient is obtained by substituting each correction factor and the initial extrusion compensation coefficient into the following formula.

[0070] ; in, The target adhesive discharge compensation coefficient at position x on the target electrode is given. This is the nth correction factor.

[0071] Step 3: Adjust the glue dispensing parameters of the glue spraying device a second time according to the target glue dispensing compensation coefficient.

[0072] In this embodiment of the application, according to the target dispensing compensation coefficient, the dispensing parameter adjustment rule of the glue spraying device is matched from the preset dispensing parameter adjustment rule library (which includes multiple dispensing parameter adjustment rules and their corresponding dispensing compensation coefficient matching conditions) to perform a second adjustment on the dispensing parameter of the glue spraying device.

[0073] Specifically, the glue dispensing parameter adjustment rule library converts the glue dispensing compensation coefficient K into a linked quantitative adjustment of the following four types of core adjustable glue dispensing parameters to adapt to mainstream spraying or dispensing modes: (1) Adjustment of spraying pressure: When the glue discharge compensation coefficient K>1, it indicates that the glue layer is too thin and the glue discharge needs to be increased. Then the spraying pressure P is increased proportionally, i.e., P_new=P_old×K; when the glue discharge compensation coefficient K<1, it indicates that the glue layer is too thick and the glue discharge needs to be reduced. Then the spraying pressure is decreased proportionally, i.e., P_new=P_old×K.

[0074] (2) Nozzle opening adjustment: Based on the reference opening, the nozzle diameter is linearly fine-tuned according to the dispensing compensation coefficient K. The opening adjustment amount is positively correlated with K, that is, if K is too large, the nozzle diameter is appropriately increased, and if K is too small, the nozzle diameter is narrowed to adapt to the needs of different dispensing amounts.

[0075] (3) Spraying relative speed adjustment: Keep the electrode conveying reference speed constant, and adjust the glue density by finely adjusting the reciprocating speed of the spray nozzle. When K>1, reduce the spraying speed to prolong the glue application time; when K<1, increase the spraying speed to shorten the glue application time.

[0076] (4) Adjustment of piezoelectric dispensing frequency: For piezoelectric dispensing mode, when K>1, increase the pulse frequency to increase the amount of dispensing per unit time; when K<1, decrease the pulse frequency to reduce the amount of dispensing per unit time.

[0077] Meanwhile, to ensure the stability of equipment operation and the continuity of the coating process, the system will set parameter adjustment limit protection. When the compensation coefficient K calculated in a single calculation fluctuates too much, causing the converted glue dispensing parameters to exceed the preset process allowable range, the system will automatically limit the adjustment range of the parameters to keep them within the safe process boundary and prevent quality problems caused by over-adjustment.

[0078] Optionally, before making a second adjustment to the dispensing parameters of the adhesive spraying device based on the adhesive layer thickness distribution data, the method further includes: Step 1: Based on the comparison between the adhesive layer thickness distribution data and the preset thickness threshold, determine whether the adhesive layer thickness distribution data meets the preset adhesive layer thickness threshold condition.

[0079] In this embodiment, the preset thickness threshold includes a maximum adhesive layer thickness and a minimum adhesive layer thickness. If the adhesive layer thickness distribution data contains an actual adhesive layer thickness greater than the maximum adhesive layer thickness or less than the minimum adhesive layer thickness, then the adhesive layer thickness distribution data does not meet the preset adhesive layer thickness threshold condition.

[0080] Step 2: If the adhesive layer thickness distribution data does not meet the preset adhesive layer thickness threshold condition, then proceed to the second adjustment of the adhesive dispensing parameters of the spraying device based on the adhesive layer thickness distribution data to continue execution.

[0081] Additionally, if the adhesive layer thickness distribution data does not meet the preset adhesive layer thickness threshold condition, the target electrode sheet is marked and sorted out (too thick or too thin), and the deviation information is used to fine-tune the adhesive spraying parameters of subsequent electrodes. If the thickness of a single sheet exceeds the tolerance or there are unfilled areas, an NG signal is triggered, and the sorting mechanism rejects the electrode sheet, recording the defect type for process traceability.

[0082] In summary, the embodiments of this application address the "incoming material fluctuation" problem through a first adjustment and the "process drift" problem through a second adjustment, providing dual protection to ensure the quality of the adhesive frame for each electrode sheet. This solves the technical problems encountered during the UV-cured frame adhesive (adhesive frame) coating process for solid-state battery electrodes, such as inaccurate adhesive filling due to laser marking depth fluctuations, uncontrollable surface smoothness after curing, and the lack of real-time data linkage and closed-loop feedback between preceding and following process stages. Specifically, this includes: (1) When the laser marking depth fluctuates at the micrometer level, the existing fixed glue output or preset glue output curve cannot be adaptively adjusted, resulting in insufficient glue filling in the marking area (causing voids and bubbles) or glue overflow (contaminating the active area of ​​the electrode), which directly affects the insulation performance of the glue frame and the yield of subsequent lamination. (2) There is a lack of online detection methods for the thickness and leveling of the adhesive layer after UV curing. Defective products cannot be identified in real time and fed back to the front-end adhesive coating process for process correction, resulting in batch defects. (3) The front-end gluing and the back-end curing and testing are independent of each other and do not form a data closed loop. When the production line changes or the incoming materials fluctuate, it relies on manual shutdown and debugging, which seriously restricts the production cycle and process stability.

[0083] Based on the same inventive concept, this application also provides a solid-state battery UV-curable framework adhesive coating device corresponding to the solid-state battery UV-curable framework adhesive coating method. Since the principle of the device in this application is similar to the solid-state battery UV-curable framework adhesive coating method described above, the implementation of the device can refer to the implementation of the method, and the repeated parts will not be described again.

[0084] Reference Figure 2 The diagram shown is a schematic of a solid-state battery UV-curable frame adhesive coating apparatus provided in an embodiment of this application. The apparatus includes: The receiving module 201 is used to receive the actual marking depth distribution data of the target electrode detected by the marking depth detection device after the target electrode for manufacturing solid-state battery has been marked by the laser marking device. The adjustment module 202 is used to make a first adjustment to the glue dispensing parameters of the glue spraying device according to the actual scratch depth distribution data corresponding to the target electrode, so that the target electrode enters the UV curing device for UV curing after the first adjustment of the glue dispensing parameters of the glue spraying device is completed. The receiving module 201 is also used to receive the surface height curve of the target electrode detected by the curing detection device after the target electrode has completed UV curing. The numerical comparison module 203 is used to perform a numerical comparison between the surface height curve and the reference surface height corresponding to the target electrode to obtain the adhesive layer thickness distribution data corresponding to the target electrode. The adjustment module 202 is also used to make a second adjustment to the glue dispensing parameters of the glue spraying device according to the glue layer thickness distribution data, so that the subsequent electrode sheets can complete the UV curing frame adhesive coating through the glue spraying device after the second adjustment.

[0085] In one possible implementation, the numerical comparison module 203 is specifically used to substitute the surface height curve and reference plane height corresponding to the target electrode into the following formula to obtain the adhesive layer thickness distribution data corresponding to the target electrode. ; in, The adhesive layer thickness is located at position x on the target electrode in the adhesive layer thickness distribution data. The height at position x on the target electrode in the surface height curve. The reference plane height.

[0086] In one possible implementation, the adjustment module 202 is specifically used to adjust the current dispensing compensation coefficient according to the adhesive layer thickness distribution data and the theoretical adhesive layer thickness to obtain an initial dispensing compensation coefficient; determine a target dispensing compensation coefficient according to the initial dispensing compensation coefficient; and make a second adjustment to the dispensing parameters of the glue spraying device according to the target dispensing compensation coefficient.

[0087] In one possible implementation, the adjustment module 202 is specifically used to obtain at least one process parameter value under various process parameter types for UV curing framework adhesive coating of the solid-state battery at the current moment; the process parameter type is adhesive characteristic parameter, equipment operating parameter, or electrode substrate parameter; the process parameter refers to the parameter that affects the adhesive spraying of the adhesive spraying device; the initial adhesive discharge compensation coefficient is corrected according to at least one process parameter value under various process parameter types to obtain the target adhesive discharge compensation coefficient.

[0088] In one possible implementation, the adjustment module 202 is specifically used to determine the correction factor corresponding to each process parameter based on at least one process parameter value under each process parameter type; and to correct the initial dispensing compensation coefficient based on each correction factor to obtain the target dispensing compensation coefficient.

[0089] In one possible implementation, the device further includes a judgment module 204, configured to, before making a second adjustment to the dispensing parameters of the glue spraying device based on the glue layer thickness distribution data, determine whether the glue layer thickness distribution data meets the preset glue layer thickness threshold condition based on a comparison result between the glue layer thickness distribution data and a preset thickness threshold; if the glue layer thickness distribution data does not meet the preset glue layer thickness threshold condition, then jump to making a second adjustment to the dispensing parameters of the glue spraying device based on the glue layer thickness distribution data to continue execution.

[0090] This application provides a solid-state battery UV-curable frame adhesive coating apparatus. The apparatus includes: a receiving module, used to receive actual marking depth distribution data of the target electrode after it has been marked by a laser marking device; an adjustment module, used to adjust the dispensing parameters of a spraying device for the first time based on the actual marking depth distribution data of the target electrode, so that the target electrode enters a UV curing device for UV curing after the first adjustment of the dispensing parameters of the spraying device; the receiving module is also used to receive the surface height curve of the target electrode detected by a curing detection device after the UV curing of the target electrode; a numerical comparison module, used to compare the surface height curve of the target electrode with the reference surface height to obtain adhesive layer thickness distribution data of the target electrode; and the adjustment module is also used to adjust the dispensing parameters of the spraying device for the second time based on the adhesive layer thickness distribution data, so that subsequent electrodes complete UV-curable frame adhesive coating through the spraying device after the second adjustment. This application avoids the problem of mismatch between the amount of adhesive dispensed and the actual requirements due to marking fluctuations.

[0091] Reference Figure 3 The diagram shown is an architectural diagram of a solid-state battery UV-curable frame adhesive coating system provided in an embodiment of this application. The system is arranged in sequence along the electrode conveying direction, including a laser marking device, a marking depth detection device, an adhesive spraying device, a UV curing device, a curing detection device, and a sorting and unloading device; the system also includes a solid-state battery UV-curable frame adhesive coating device.

[0092] Here, the system consists of six functional units, each interconnected via an EtherCAT bus with the solid-state battery UV curing frame adhesive coating unit (industrial PC + real-time motion control card) and interfaced with the MES system. Functional descriptions of each core unit: A. Laser marking device and marking depth detection device: (1) Configure a picosecond / femtosecond laser and etch insulating adhesive frame grooves on the edge of the electrode according to the reference parameters. The laser is connected to the solid-state battery UV curing frame adhesive coating device CCU and can receive power fine-tuning commands issued by the CCU (used to cooperate with long-term process optimization of feedback closed loop).

[0093] (2) Configure a high-precision confocal displacement sensor (resolution ≤ 0.1 μm, sampling frequency ≥ 10 kHz), and install it directly above the electrode conveyor line, vertically aligned with the etched area. The sensor performs line scanning or dot matrix scanning as the electrode moves to acquire a depth data array. B. Adhesive spraying device: Equipped with a precision piezoelectric injection valve or servo screw valve, the response time is ≤1 ms. The spray head is connected to the CCU via an analog / digital interface, receiving the target adhesive volume parameters (such as spray frequency f and single-point volume v) calculated by the CCU in real time. The spray head has an XYZ three-axis servo motion platform, which can move precisely along the electrode edge trajectory.

[0094] C. UV curing equipment: Equipped with a high-power UV-LED surface light source (wavelength 365 nm or 395 nm), the curing energy is adjustable (2000–12000 mJ / cm²). A uniform light-receiving lens is placed in front of the light source to ensure uniform light exposure of the adhesive layer. The curing time is controlled by the conveyor line speed.

[0095] D. Curing detection device: A line laser 3D profilometer (Z-axis resolution ≤1 μm, X-axis resolution ≤10 μm) was configured to perform a full-width scan of the cured adhesive layer to acquire 3D point cloud data. Algorithms were then used to extract the adhesive layer thickness distribution and filling status indicators.

[0096] E. Sorting and feeding device: Equipped with a high-speed pneumatic nozzle or mechanical gripper, after receiving the NG signal from the CCU, it removes the defective electrode sheets to the waste bin.

[0097] like Figure 4 As shown in the embodiment of this application, an electronic device 400 includes a processor 401, a memory 402, and a bus. The memory 402 stores machine-readable instructions executable by the processor 401. When the electronic device is running, the processor 401 communicates with the memory 402 via the bus. The processor 401 executes the machine-readable instructions to perform the steps of the solid-state battery UV-cured frame adhesive coating method described above.

[0098] Specifically, the memory 402 and processor 401 can be general-purpose memory and processor, without any specific limitations. When the processor 401 runs the computer program stored in the memory 402, it can execute the above-mentioned solid-state battery UV curing frame adhesive coating method.

[0099] Corresponding to the above-described solid-state battery UV-curable frame adhesive coating method, this application embodiment also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, performs the steps of the above-described solid-state battery UV-curable frame adhesive coating method.

[0100] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems and devices described above can be referred to the corresponding processes in the method embodiments, and will not be repeated here. In the several embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. Furthermore, multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed mutual coupling or direct coupling or communication connection can be through some communication interfaces; the indirect coupling or communication connection of devices or modules can be electrical, mechanical, or other forms.

[0101] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0102] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0103] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a processor-executable, non-volatile, computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the solid-state battery UV-curing frame adhesive coating method described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, ROM, RAM, magnetic disks, or optical disks.

[0104] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for coating a solid-state battery UV-curable frame adhesive, characterized in that, The method includes: After the target electrode sheet used to manufacture solid-state batteries is marked by a laser marking device, the actual marking depth distribution data corresponding to the target electrode sheet is received by the marking depth detection device. Based on the actual groove depth distribution data corresponding to the target electrode, the glue dispensing parameters of the glue spraying device are adjusted for the first time so that the target electrode enters the UV curing device for UV curing after the first adjustment of the glue dispensing parameters of the glue spraying device is completed. After the target electrode has completed UV curing, the surface height curve of the target electrode detected by the curing detection device is received. By numerically comparing the surface height curve corresponding to the target electrode with the reference surface height, the thickness distribution data of the adhesive layer corresponding to the target electrode is obtained. The dispensing parameters of the adhesive spraying device are adjusted a second time based on the adhesive layer thickness distribution data, so that the subsequent electrode sheets can complete the UV curing frame adhesive coating through the adhesive spraying device after the second adjustment.

2. The solid-state battery UV-curable frame adhesive coating method according to claim 1, characterized in that, The step of numerically comparing the surface height curve corresponding to the target electrode with the reference surface height to obtain the adhesive layer thickness distribution data corresponding to the target electrode includes: Substituting the surface height curve and reference plane height corresponding to the target electrode into the following formula, the adhesive layer thickness distribution data corresponding to the target electrode is obtained; ; in, The adhesive layer thickness is located at position x on the target electrode in the adhesive layer thickness distribution data. The height at position x on the target electrode in the surface height curve. The reference plane height.

3. The solid-state battery UV-curable frame adhesive coating method according to claim 1, characterized in that, The second adjustment of the glue dispensing parameters of the glue spraying device based on the glue layer thickness distribution data includes: Based on the adhesive layer thickness distribution data and the theoretical adhesive layer thickness, the current dispensing compensation coefficient is adjusted to obtain the initial dispensing compensation coefficient; Determine the target extrusion compensation coefficient based on the initial extrusion compensation coefficient; The glue dispensing parameters of the glue spraying device are adjusted a second time based on the target glue dispensing compensation coefficient.

4. The solid-state battery UV-curable frame adhesive coating method according to claim 3, characterized in that, The step of determining the target discharge compensation coefficient based on the initial discharge compensation coefficient includes: Obtain at least one process parameter value under various process parameter types for UV-cured frame adhesive coating of the solid-state battery at the current moment; the process parameter type is adhesive characteristic parameter, equipment operating parameter, or electrode substrate parameter; process parameter refers to the parameter that affects the adhesive spraying of the adhesive spraying device. The initial dispensing compensation coefficient is corrected based on at least one process parameter value under each process parameter type to obtain the target dispensing compensation coefficient.

5. The solid-state battery UV-curable frame adhesive coating method according to claim 4, characterized in that, The step of correcting the initial dispensing compensation coefficient based on at least one process parameter value under each process parameter type to obtain the target dispensing compensation coefficient includes: Based on at least one process parameter value under each process parameter type, determine the correction factor corresponding to each process parameter; The initial extrusion compensation coefficient is corrected according to each correction factor to obtain the target extrusion compensation coefficient.

6. The solid-state battery UV-curable frame adhesive coating method according to claim 1, characterized in that, Before making a second adjustment to the dispensing parameters of the glue spraying device based on the glue layer thickness distribution data, the method further includes: Based on the comparison between the adhesive layer thickness distribution data and the preset thickness threshold, it is determined whether the adhesive layer thickness distribution data meets the preset adhesive layer thickness threshold condition. If the adhesive layer thickness distribution data does not meet the preset adhesive layer thickness threshold condition, the process jumps to the second adjustment of the adhesive dispensing parameters of the spraying device based on the adhesive layer thickness distribution data to continue execution.

7. A solid-state battery UV-curable frame adhesive coating apparatus, the apparatus comprising: The receiving module is used to receive the actual marking depth distribution data of the target electrode detected by the marking depth detection device after the target electrode for manufacturing solid-state battery is marked by the laser marking device. The adjustment module is used to make a first adjustment to the glue dispensing parameters of the glue spraying device based on the actual groove depth distribution data corresponding to the target electrode, so that the target electrode can enter the UV curing device for UV curing after the first adjustment of the glue dispensing parameters of the glue spraying device is completed. The receiving module is also used to receive the surface height curve of the target electrode detected by the curing detection device after the target electrode has completed UV curing. The numerical comparison module is used to numerically compare the surface height curve and the reference surface height corresponding to the target electrode to obtain the adhesive layer thickness distribution data corresponding to the target electrode. The adjustment module is also used to make a second adjustment to the glue dispensing parameters of the glue spraying device based on the glue layer thickness distribution data, so that the subsequent electrode sheets can complete the UV curing frame adhesive coating through the glue spraying device after the second adjustment.

8. A solid-state battery UV-curable frame adhesive coating system, characterized in that, The system is arranged in sequence along the electrode conveying direction, including a laser marking device, a marking depth detection device, a glue spraying device, a UV curing device, and a curing detection device; the system also includes a solid-state battery UV curing frame adhesive coating device as described in claim 7.

9. An electronic device, characterized in that, include: The device includes a processor, a storage medium, and a bus, wherein the storage medium stores machine-readable instructions executable by the processor, and when the electronic device is in operation, the processor communicates with the storage medium via the bus, and the processor executes the machine-readable instructions to perform the steps of the solid-state battery UV-curable frame adhesive coating method as described in any one of claims 1 to 6.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, performs the steps of the solid-state battery UV-curable frame adhesive coating method as described in any one of claims 1 to 6.