A workpiece cleaning method and system

Abstract

The present application discloses a workpiece cleaning method and system, belonging to the technical field of semiconductor manufacturing equipment maintenance. The method comprises: generating first surface topography information of a reference workpiece; generating second surface topography information of the first workpiece after the first workpiece is covered with an attachment layer; comparing the first surface topography information with the second surface topography information to obtain three-dimensional distribution information of the attachment layer, and generating cutting information of the attachment layer according to the three-dimensional distribution information; and removing at least part of the attachment layer with a cutting tool of a cleaning device according to the cutting information. By comparing to obtain the three-dimensional distribution information of the attachment layer and removing it by physical cutting, the damage to the workpiece body caused by chemical corrosion and global over-treatment in the prior art is avoided, and precise local cleaning of the semiconductor workpiece is achieved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing equipment maintenance technology, and specifically to a workpiece cleaning method and system. Background Technology

[0002] As semiconductor technology continues to evolve and the size of semiconductor devices shrinks, the demands on manufacturing precision and equipment performance are increasing. In semiconductor manufacturing processes such as physical vapor deposition (PVD), semiconductor components inside the vacuum chamber, such as collimators, spray heads, masks, and heaters, accumulate large amounts of contaminants, including thin metal films, as the deposition process progresses. These contaminants adhere to the surface of the components and the sidewalls of the holes, affecting the operational efficiency of the equipment and the accuracy of the process. To save on component replacement costs, cleaning and recycling contaminated components has become a major way for the industry to reduce costs. However, the specifications of these precision components have a significant impact on the yield of semiconductor devices; after cleaning, they must be restored to their original size and specifications to truly realize their recycling value.

[0003] In the prior art, patent application WO2025000312A1 discloses a workpiece cleaning method and system. This method uses an image recognition module to obtain feature information such as the type, size, shape, and surface cleanliness of the workpiece, and calculates the corresponding cleaning parameters based on fuzzy logic, then cleans the workpiece by spraying a cleaning solution. This solution relies on chemical cleaning solutions for cleaning, which has the following drawbacks: while dissolving contaminants, chemical cleaning solutions easily corrode the surface of the workpiece, causing dimensional distortion or surface damage, rendering precision parts unusable; moreover, this solution only obtains the current cleanliness level of the workpiece and cannot accurately identify the actual thickness and specific distribution of the adhering layer, making it a comprehensive treatment that is prone to over- or under-treatment.

[0004] US Patent Publication No. US10464108B2 discloses a workpiece cleaning apparatus and method. This method identifies the type of part to apply a corresponding cleaning program and uses the drag force generated by the gas flow to remove contaminants from the surface of the part. However, this method uses gas blowing for cleaning, which has limited ability to remove metal deposits with strong adhesion, and it also fails to achieve accurate positioning and targeted removal of the three-dimensional distribution of the deposited layer.

[0005] Furthermore, existing technologies include immersion cleaning with acidic or alkaline chemical solutions, high-pressure water jet cleaning, and laser cleaning. Chemical immersion cleaning also poses the problem of corroding the workpiece surface; the powerful impact of high-pressure water jets often causes damage or micro-pits on the surface of precision parts; and laser cleaning may create heat-affected zones, leading to thermal deformation of the parts. More importantly, none of these cleaning methods can accurately identify the actual thickness and specific distribution of deposits, resulting in a comprehensive treatment that can easily cause unnecessary over-processing or surface stress damage during removal, rendering the precision parts unable to meet the accuracy requirements for recycling and reuse.

[0006] In another technical direction, US Patent Publication No. US7433799B2 discloses a method for determining shape data. This method determines the shape data of missing parts by comparing a reference template of the workpiece before use with the undamaged part of the workpiece after use, for blade repair and reconstruction. However, this method addresses the problem of reconstructing missing workpiece material; its purpose is to determine the geometry that needs to be supplemented, rather than identifying and removing excess deposits on the workpiece, and it does not involve cleaning processes that physically remove the surface deposits of semiconductor workpieces.

[0007] In this field, it is generally believed that due to the extremely high dimensional accuracy requirements of semiconductor precision components, physical contact cutting inevitably damages the workpiece surface, leading to dimensional deviations. Therefore, the industry has long favored non-contact chemical or fluid treatment methods in semiconductor component cleaning, avoiding mechanical cutting solutions. However, the applicant has discovered that when the three-dimensional distribution information of the adhesion layer can be accurately obtained, controlling the cutting tool to physically remove only the adhesion layer area can not only avoid damage to the workpiece but also fundamentally eliminate the risk of chemical corrosion. Summary of the Invention

[0008] The present invention aims to solve the following technical problems existing in the current semiconductor workpiece cleaning technology: how to achieve accurate positioning of the adhesion layer through comparison calculation, and on this basis, achieve accurate local removal of the adhesion layer by physical cutting, thereby avoiding damage to the workpiece body caused by chemical corrosion, thermal damage and over-processing of the whole area, and extending the service life of precision workpieces.

[0009] The present invention provides a workpiece cleaning method, comprising: generating first surface morphology information of a reference workpiece, wherein the reference workpiece is either the first workpiece in an unused state or a second workpiece having the same design specifications as the first workpiece; generating second surface morphology information of the first workpiece after an adhesion layer covers the first workpiece; comparing the first surface morphology information with the second surface morphology information to obtain three-dimensional distribution information of the adhesion layer, and generating cutting information of the adhesion layer based on the three-dimensional distribution information; and removing at least a portion of the adhesion layer using a cutting tool of a cleaning device based on the cutting information of the adhesion layer.

[0010] Furthermore, the first surface morphology information includes: a three-dimensional design drawing of the first workpiece; or a three-dimensional morphology scan of the first workpiece before use; or a three-dimensional morphology scan of a second workpiece with the same design specifications as the first workpiece before use.

[0011] Furthermore, comparing the first surface topography information with the second surface topography information to obtain the three-dimensional distribution information of the adhesion layer includes: calculating the difference between the elevation of each coordinate point in the second surface topography information and the elevation of the corresponding coordinate point in the first surface topography information, and identifying the area with a non-zero difference as the distribution area of ​​the adhesion layer.

[0012] Furthermore, the step of removing at least a portion of the adhesion layer with the cutting tool includes: determining at least one of the feed rate and revolutions of the cutting tool and the length of the adjustment shaft of the cleaning device based on the cutting information, wherein the adjustment shaft is configured to fix the cutting tool.

[0013] Furthermore, the first workpiece includes a first region and a second region, the first region having a flat surface and the second region having an uneven surface, and the step of removing at least a portion of the adhesive layer with the cutting tool includes: first removing the adhesive layer located in the first region, and then removing the adhesive layer located in the second region.

[0014] Further, removing the attached layer located in the second region includes: a rough milling step with a first cutting parameter, followed by a finishing step with a second cutting parameter, wherein the material removal rate of the first cutting parameter is higher than the material removal rate of the second cutting parameter.

[0015] Furthermore, after removing at least a portion of the adhesive layer with the cutting tool, the process further includes removing the remaining portion of the adhesive layer by a sandblasting process.

[0016] The present invention also provides a workpiece cleaning system, comprising: a scanning device configured to generate first surface morphology information of a reference workpiece, and to generate second surface morphology information of the first workpiece after an adhesion layer covers the first workpiece, wherein the reference workpiece is either the first workpiece in an unused state or a second workpiece having the same design specifications as the first workpiece; an information acquisition device configured to compare the first surface morphology information with the second surface morphology information to obtain three-dimensional distribution information of the adhesion layer, and to generate cutting information of the adhesion layer based on the three-dimensional distribution information; and a cleaning device comprising: a stage configured to fix the first workpiece; a cutting tool configured to clean the first workpiece; and a controller configured to control the cutting tool to remove at least a portion of the adhesion layer based on the cutting information of the adhesion layer.

[0017] Furthermore, the scanning device includes: a sensor configured to acquire surface data of a workpiece; and a processor configured to generate the first surface morphology information and / or the second surface morphology information based on the surface data acquired by the sensor.

[0018] Furthermore, the cutting tool includes multiple cutting tools having different sizes and / or shapes from one another.

[0019] Furthermore, the workpiece cleaning system further includes a sandblasting device configured to remove the remaining portion of the adhesion layer by a sandblasting process after the cutting tool has removed at least a portion of the adhesion layer.

[0020] Furthermore, the first workpiece includes a first region and a second region, the first region having a flat surface and the second region having an uneven surface, and the controller is further configured to control the cutting tool to first remove the adhesive layer located in the first region and then remove the adhesive layer located in the second region.

[0021] Compared with the prior art, the present invention has the following beneficial effects: First, by comparing the surface morphology information of the workpiece before use and the surface morphology information of the workpiece after use, the difference calculation can be performed to accurately locate the three-dimensional distribution of the adhesion layer on the workpiece (including position and thickness), which solves the defect in the prior art that it is impossible to accurately identify the specific distribution position of the adhesion layer.

[0022] Second, the cutting information obtained through comparison drives the cutting tool to perform physical local removal, achieving precise cleaning. Compared to existing technologies such as all-area chemical immersion, high-pressure water jet, or laser cleaning, this solution only performs physical removal in the area where the adhesion layer is distributed, effectively avoiding damage to the workpiece body caused by chemical corrosion, impact damage from high-pressure water jet, and thermal deformation problems caused by laser.

[0023] Third, the use of physical cutting as the primary means of removing the adhesion layer significantly reduces reliance on chemical cleaning agents. Since the residual thickness of the adhesion layer after rough milling and finishing is extremely small (e.g., approximately 10 to 15 micrometers), chemical cleaning only needs to be applied to this very thin residual layer. Compared to traditional full-area chemical immersion (where the adhesion layer thickness can reach hundreds of micrometers), this significantly shortens the reaction time of the diffusion rate control step, substantially reduces the amount of cleaning fluid used and wastewater treatment costs, and minimizes environmental impact.

[0024] Fourth, by adopting a zoned cleaning strategy, the adhesion layer in the flat areas is removed first, which reduces the adhesion of the adhesion layer in the upper surface area, causing cracks or peeling. Then, the adhesion layer in the uneven areas is removed. Combined with the strategy of rough milling to quickly remove most of the material and fine finishing to ensure surface quality, a balance between high efficiency and high precision is achieved.

[0025] Fifth, after cutting and removing the remaining deposited layer, sandblasting is used to remove the remaining deposited layer. This not only thoroughly cleans the workpiece but also improves the surface roughness of the hole sidewalls. This allows the cleaned workpiece to more effectively capture stray particles on non-parallel paths during subsequent use, thereby improving the purity of the deposited beam. Attached Figure Description

[0026] Figure 1A and Figure 1B These are perspective views of a workpiece before and after use, according to some embodiments of the present invention. Figure 2 This is a system architecture diagram of a workpiece cleaning system according to some embodiments of the present invention; Figure 3 This is a schematic diagram of a scanning device according to some embodiments of the present invention; Figure 4 This is a schematic diagram of a cleaning device according to some embodiments of the present invention; Figure 5 This is a flowchart of a workpiece cleaning method according to some embodiments of the present invention; Figure 6 This is a first surface topography diagram according to some embodiments of the present invention; Figure 7 This is a second surface topography diagram according to some embodiments of the present invention; Figure 8 This is a third surface topography diagram according to some embodiments of the present invention; Figures 9 to 16 This is a cross-sectional schematic diagram of different stages of a workpiece cleaning method according to some embodiments of the present invention.

[0027] Explanation of reference numerals in the attached drawings: 10A, 10B—First workpiece; 20—First workpiece; 100P—Hole; 102—Main body; 102US—Upper surface; 102US1—First upper surface; 102US2—Second upper surface; 102SW1—First sidewall; 102SW2—Second sidewall; 104—First hole; 106—Second hole; 108—Adhesive layer; 113—Third hole; 200—Workpiece cleaning system; 201—Scanning device; 202—Main body ; 202A—Protrusion; 202US—Upper surface; 202US1—First upper surface; 202US2—Second upper surface; 202SW1—First sidewall; 202SW2—Second sidewall; 203—Cleaning device; 204—First hole; 205—Controller; 206—Second hole; 207—Sandblasting device; 208—Adhesive layer; 208-1—First part; 208-2—Second part; 208-3—Third part; 208-4—Fourth part 208-5—Fifth Part; 209—Stage; 210—Fixed Part; 211—Working Area; 212—Cantilever; 213—Third Hole; 214—Fixer; 216—Adjusting Shaft; 218—Cutting Tool; 218-1—First Cutting Tool; 218-2—Second Cutting Tool; 218-3—Third Cutting Tool; 218-4—Fourth Cutting Tool; 218-5—Fifth Cutting Tool; 218-6—Sixth Cutting Tool; 219—Optical Scanner 220—Sensing base; 222—Light; 224—Light receiver; 226—Processor; 227—Rotating stage; 228—Support shaft; 230—Base; 240—Information acquisition device; 250—Transmission medium; 260—Transmission medium; 600—First surface morphology image; 700—Second surface morphology image; 800—Third surface morphology image; M50—Workpiece cleaning method; R1—First region; R2—Second region; S501-S510—Steps. Detailed Implementation

[0028] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention. The embodiments are only used to explain the present invention and do not constitute a limitation on the scope of protection of the present invention.

[0029] For ease of understanding, in the following embodiments, Figure 1A , Figure 1B The first workpiece 10A shown (before and after use) and Figure 3 , Figure 4 The first workpiece 20 shown is a workpiece of the same type and model. Among them, Figure 1A Unused workpieces are indicated by the mark 10A. Figure 1B Used workpieces covered by an adhesion layer are designated by the mark 10B. In cases involving scanning ( Figure 3 ) and cleaning ( Figure 4 In the specific steps thereafter, the first workpiece is uniformly represented by the mark 20; when distinguishing between its pre-use state and post-use state, it is still referred to by marks 10A and 10B respectively. The following text will select the appropriate mark according to the specific scenario, and the correspondence between the marks is as described above.

[0030] In semiconductor manufacturing, semiconductor components (also known as semiconductor workpieces), such as shields, component trays, or heaters inside the vacuum chamber, accumulate a large amount of contaminants, including thin films, during the deposition process. Existing solutions often involve immersion cleaning with acidic or alkaline chemical solutions. While these methods can remove contaminants, the chemical cleaning agents, while dissolving the contaminants, can easily corrode the semiconductor components, causing dimensional distortion or surface damage, ultimately rendering the precision parts unusable. Furthermore, if the semiconductor workpiece has holes, chemical cleaning can corrode the sidewalls of the holes, making them too thin and reducing the stability of subsequent processes. Common alternative solutions to these problems include high-pressure water jet cleaning or laser cleaning. While high-pressure water jet cleaning avoids chemical contamination, the powerful impact of the water jet often damages the surface of precision parts or creates micro-pits. Laser cleaning, on the other hand, can create heat-affected zones, leading to thermal deformation of the parts. Moreover, these cleaning methods—acid / alkali immersion cleaning, high-pressure water jet cleaning, or laser cleaning—often cannot accurately identify the actual thickness and distribution of the deposits, resulting in a global treatment that can easily cause unnecessary over-processing or surface stress damage during removal. To overcome the aforementioned bottlenecks, this invention proposes a workpiece cleaning method. This method combines scanning positioning and precision cutting, belonging to physical film removal technology. By comparing surface scan images of the part before and after use, the distribution location of contaminants on the part is precisely located. Based on this distribution location, the cutting tool is driven to perform precise localized physical cleaning of the contaminant areas. This method significantly reduces reliance on chemical cleaning agents, not only greatly avoiding the risk of chemical corrosion to the part itself, thus effectively extending the service life of precision workpieces, but also ensuring that the original surface of the part is not damaged. This significantly reduces equipment maintenance costs and meets environmentally friendly process requirements.

[0031] Figure 1A and Figure 1BThese are perspective views of a first workpiece 10A and a first workpiece 10B according to some embodiments of the present invention. The first workpiece 10A may be an unused workpiece, and the first workpiece 10B may be a used workpiece. In one embodiment, the first workpiece 10A and the first workpiece 10B are of the same type and model and are the same workpiece. In another embodiment, the first workpiece 10A and the first workpiece 10B are only of the same type and model, but are different individual workpieces.

[0032] Reference Figure 1A The first workpiece 10A includes a main body 102 and a plurality of holes 100P perpendicularly penetrating the main body 102 and forming an array. The first workpiece 10A can be a collimator, configured in a physical vapor deposition (PVD) process or other deposition process, to bombard a solid target with high-energy particles. Based on the principle of kinetic energy, metal particles on the target are ejected and deposited onto the substrate. The holes 100P on the first workpiece 10A are positioned between the target and the substrate to collimate the high-energy particles, ensuring a high degree of directional consistency among the high-energy particles passing through the first workpiece 10A, thereby ensuring the uniformity and stability of the thin film deposition. The first workpiece 10A can also be a spray head, configured to uniformly distribute the gases generated during the process through the holes 100P to the substrate, ensuring the uniformity, accuracy, and stability of the thin film deposition or etching process.

[0033] The first workpiece 10A may include a first region R1 and a second region R2, wherein the first region R1 may have a flat surface and the second region R2 may have an uneven surface. Specifically, the second region R2 may have a concave surface and be surrounded by the first region R1. However, the surface morphology of the first workpiece 10A is not limited thereto. For example, the first workpiece 10A may also include only a flat surface, only a concave surface, only an upwardly convex surface, or a combination of any of the aforementioned surface morphologies.

[0034] The main body 102 of the first workpiece 10A may include a first sidewall 102SW1 located outside the first region R1 and an upper surface 102US, and the upper surface 102US may further include a first upper surface 102US1 located in the first region R1 and a second upper surface 102US2 located in the second region R2. The first upper surface 102US1 defines a first hole 104 and a second hole 106 of a plurality of holes 100P, and the second upper surface 102US2 defines a third hole 113 of a plurality of holes 100P. The first hole 104 may have a different shape than the second hole 106. Specifically, the cross-section of the first hole 104 may be polygonal, and the cross-section of the second hole 106 may be circular or elliptical. In some embodiments, the cross-section of the first hole 104 may be hexagonal. In the array of holes 100P, the second hole 106 is located on the outermost side and defines the six vertex regions of the array. The first hole 104 may have the same or different shape as the third hole 113. Specifically, the cross-section of the third hole 113 may be polygonal. However, the shape and distribution of the first hole 104, the second hole 106, and the third hole 113 are not limited thereto. Furthermore, the first hole 104, the second hole 106, and the third hole 113 have a second sidewall 102SW2 adjacent to the first upper surface 102US1 or the second upper surface 102US2, which connects the upper and lower surfaces of the first workpiece 10A and forms a channel for particles or gas to pass through. In some embodiments, some of the plurality of holes 100P may have discontinuous second sidewalls 102SW2. For example, please refer to... Figure 4 , Figure 4 The first workpiece 20 shown corresponds to Figure 1A The first workpiece 10A is shown, and is its side view. Figure 4 In the middle, the second hole 206 (corresponding to Figure 1A The second sidewall 202SW2 of the second hole 106 (corresponding to) Figure 1A The second sidewall 102SW2 has a stepped protrusion 202A. In this configuration, the top of the second sidewall 202SW2 of the second hole 206 extends to a depth of approximately 7 to 8 centimeters to the top of the protrusion 202A. However, the configuration of the second sidewall 102SW2 is not limited to this. The depth of the second sidewall 102SW2 of the plurality of holes 100P can be approximately 1 to 20 centimeters.

[0035] In some embodiments, the cross-section of the collimator aperture 100P is mostly hexagonal, and the cross-section of the spray head aperture 100P is mostly circular. However, the first workpiece 10A may also be a workpiece that is a component of other semiconductor devices, and its aperture shape and distribution are not limited thereto.

[0036] Reference Figure 1B The first workpiece 10B is roughly the same as Figure 1ASimilar to the first workpiece 10A shown, the difference is that the first sidewall 102SW1, the upper surface 102US, and the second sidewall 102SW2 of the partial holes 100P in the first workpiece 10B are covered by an adhesion layer 108, wherein the adhesion layer 108 is the contaminant generated in the deposition process described above. The first workpiece 10B may be a workpiece after the deposition process, wherein the adhesion layer 108 attached to the first workpiece 10B may include copper, aluminum, or other metallic materials.

[0037] Similar to the first workpiece 10A, the first workpiece 10B can also be a collimator, a spray head, or other semiconductor equipment component. Specifically, the adhesive layer 108 originates from the target material. After sputtering, some particles ejected from the target material collide with and deposit on the first workpiece 10B, failing to eject further out of the hole 100P. The adhesive layer 108 primarily adheres to the first sidewall 102SW1, the upper surface 102US, and the second sidewall 102SW2 of the hole 100P of the first workpiece 10B.

[0038] This invention utilizes the solid-state characteristic of the adhesion layer 108 adhering to the first workpiece 10B. By scanning the three-dimensional morphology of the adhesion layer 108, cutting information of the adhesion layer 108 on the first workpiece 10B is accurately obtained. After obtaining this cutting information, the adhesion layer 108 is effectively removed by controlling a cutting tool to physically scrape it off, thus avoiding damage to the workpiece 10B. This method relies on accurate information about the distribution position of the adhesion layer 108 to avoid accidentally damaging the first workpiece 10B. Therefore, this invention provides a workpiece cleaning method. This cleaning method first scans the first surface morphology information of the first workpiece 10A (i.e., the unused workpiece not covered by the adhesion layer 108), then scans the second surface morphology information of the first workpiece 10B (i.e., the used workpiece covered by the adhesion layer 108), and compares the first and second surface morphology information to generate cutting information of the adhesion layer 108. Then, based on the cutting information of the adhesion layer 108, the cutting tool is controlled to accurately scrape the adhesion layer 108 off the first workpiece 10B. In some embodiments, the first surface topography information may be Figure 6 The first surface topography diagram 600 is shown. In some embodiments, the second surface topography information may be... Figure 7 The second surface topography diagram 700 is shown. The first surface topography information can also be a three-dimensional design drawing of the first workpiece 10A or a three-dimensional topography scan of the second workpiece before use, wherein the second workpiece has the same type, model or design specifications as the first workpiece 10A, but can be the same workpiece or a different workpiece.

[0039] Figure 2This is a system diagram of a workpiece cleaning system 200 according to some embodiments of the present invention. The workpiece cleaning system 200 is configured to perform a workpiece cleaning method M50 (shown in...). Figure 5 Its cleaning objects can be such as Figure 1B The first workpiece 10B is shown covered by the adhesion layer 108. The workpiece cleaning system 200 may include a scanning device 201, an information acquisition device 240, a cleaning device 203, and a sandblasting device 207. The scanning device 201 transmits the information it generates regarding the first workpiece 10A and the first workpiece 10B to the information acquisition device 240 via a transmission medium 250 (such as a network transmission, physical interface, or storage medium). Similarly, the information acquisition device 240 may transmit the information it generates regarding the adhesion layer 108 to the cleaning device 203 via a transmission medium 260 (such as a network transmission, physical interface, or storage medium). In some embodiments, the workpiece cleaning system 200 may include only the scanning device 201 and the cleaning device 203, or only the cleaning device 203.

[0040] Based on the above description, the scanning device 201 is configured to generate first surface topography information (such as...). Figure 6 The first surface topography diagram 600 and the second surface topography information (such as...) are shown. Figure 7 The second surface topography diagram 700 is shown. The information acquisition device 240 is configured to generate cutting information for the adhesion layer (adhesion layer 108 as shown in FIG. 1) based on the first and second surface topography information. The cleaning device 203 is configured to clean the workpiece having the adhesion layer. The sandblasting device 207 is configured to remove the remaining adhesion layer by a sandblasting process after the main portion of the adhesion layer has been removed by the cleaning device 203. The sandblasting device 207 can be replaced by other suitable devices.

[0041] Figure 3 This is a schematic diagram of a scanning device 201 according to some embodiments of the present invention. The scanning device 201 includes an optical scanning device 219, a processor 226, and a rotating stage 227, wherein the optical scanning device 219 is electrically connected to the processor 226.

[0042] The optical scanning device 219 further includes a sensing base 220 and a light source 222 and a light receiver 224 fixed on the sensing base 220. The light source 222 is configured to project a light beam onto the surface of a first workpiece 20 fixed to a rotating stage 227, and the light receiver 224 is configured to receive the light beam reflected or scattered from the surface of the first workpiece 20 and generate a sensing signal. The optical scanning device 219 may include at least one of the light source 222 and the light receiver 224. In one embodiment, the optical scanning device 219 uses natural light as the light source, so the light source 222 may be omitted. In other embodiments, the sensor of the scanning device 201 may be a laser displacement sensor, a structured light sensor, a contact probe, or an X-ray tomography sensor, etc., capable of acquiring three-dimensional surface topographic data.

[0043] Processor 226 is configured to generate first surface topography information (e.g., based on sensing signals transmitted from optical scanning device 219) Figure 6 The first surface topography diagram 600 shown) and / or the second surface topography information (such as...) Figure 7 The second surface topography diagram 700 is shown. In some embodiments, the processor configured to generate the first surface topography information and the processor configured to generate the second surface topography information may be different processors and may correspond to different optical scanning devices.

[0044] The rotating stage 227 may include a base configured to place and fix the first workpiece 20 and rotate it. The rotating stage 227 further includes a support shaft 228 and a base 230, wherein the base 230 is configured to rotate about the x-axis and is configured to connect to a moving device located below the base 230 and capable of moving the base 230 along the x, y, and z directions. One end of the support shaft 228 is connected to the base 230 and the other end is connected to the base fixing the first workpiece 20, and the support shaft 228 can rotate synchronously with the base 230, thereby enabling the optical scanning device 219 to obtain coordinate information of the first workpiece 20 at different angles across the entire viewing angle. In some embodiments, the base may also drive the first workpiece to rotate about a specific axis. However, the components and configuration of the optical scanning device 219 and the rotating stage 227 are not limited thereto. In some embodiments, the optical scanning device 219 may orbit the first workpiece 20 along a fixed track to obtain coordinate information of the first workpiece 20 at different angles across the entire viewing angle.

[0045] In one embodiment, the information acquisition device 240 is used to receive the first surface topography information of the first workpiece generated by the scanning device 201 (e.g., ... Figure 6 The first surface topography diagram 600 and the second surface topography information (such as...) are shown. Figure 7The second surface topography image 700 shown provides cutting information for generating the adhesion layer. This cutting information may include information about the distribution and / or thickness of the adhesion layer, information about parameters such as the cutting rate, information about the start and end points of the cutting by the cutting tool, or other information related to the cutting process. In some embodiments, the cutting information may include a third surface topography image (such as...). Figure 8 The third surface topography diagram 800 shown is a three-dimensional topography diagram of the adhesion layer, which can be obtained by the difference between the first surface topography diagram and the second surface topography diagram or by other calculation formulas. The information acquisition device 240 can be a circuit composed of hardware, a program composed of software, or other modules composed of hardware and software. In some embodiments, the information acquisition device 240 may include computer-aided manufacturing software. The information acquisition device 240 may be integrated into the scanning device 201 or the cleaning device 203, or it may operate independently of the scanning device 201 or the cleaning device 203.

[0046] Figure 4 This is a schematic diagram of a cleaning device 203 according to some embodiments of the present invention. The cleaning device 203 includes a controller 205, a stage 209, and a cutting tool 218.

[0047] The cleaning device 203 is configured to clean the first workpiece 20, which corresponds to Figure 1B The first workpiece 10B shown is used and covered by the adhesion layer 108, and Figure 4 The schematic diagram of the cross-section of the first workpiece 20 shown is along... Figure 1B The drawing is based on the tangent AA'. The main body 202 of the first workpiece 20, the holes 200P (including the first hole 204, the second hole 206, and the third hole 213), and the adhesion layer 208 covering the first workpiece 20 respectively correspond to Figure 1B The main body 102, the holes 100P (including the first hole 104, the second hole 106 and the third hole 113) and the attachment layer 108 covering the first workpiece 10B are shown.

[0048] like Figure 4 As shown, the adhesion layer 208 may be located on the first sidewall 202SW1 and the upper surface 202US of the first workpiece 20. The adhesion layer 208 may also be located on the second sidewall 202SW2 of the hole 200P, wherein the depth of the portion of the adhesion layer 208 extending from the top of the hole 200P to the bottom of the hole 200P may be less than about one-quarter of the overall depth of the hole 200P. Specifically, the depth of this portion may be about 0.25 to 2.5 cm. However, the depth of the adhesion layer 208 extending from the top of the hole 200P to the bottom of the hole 200P is not limited to this. In some embodiments, the adhesion layer 208 extends to the bottom of the hole 200P, that is, completely covering the second sidewall 202SW2 of the hole 200P.

[0049] The controller 205 is configured to receive cutting information of the adhesion layer 208 generated by the information acquisition device 240, and control the cutting tool 218 to remove at least a portion of the adhesion layer 208 based on the cutting information. This control method can be CNC control or other suitable control methods. Specifically, the controller 205 can determine at least one of the feed rate, revolutions, and length of the adjusting axis 216 of the cutting tool 218 based on the cutting information, and control the cleaning device 203 to perform a cleaning operation accordingly.

[0050] The stage 209 includes a base 210, a cantilever 212, and an adjustment shaft 216, and defines the working area 213 of the cleaning device 203, where the cutting tool 218 performs the cleaning process. The base 210 is configured to support and fix a workpiece to be cleaned (such as the first workpiece 20). The two ends of the cantilever 212 are connected to the base 210 and the adjustment shaft 216, respectively. The cantilever 212 is configured to support and fix the adjustment shaft 216. The adjustment shaft 216 is configured to clamp the cutting tool 218, and the position of the cutting tool 218 within the working area 211 of the cleaning device 205 can be adjusted by changing the length of the adjustment shaft 216. However, the components and configuration of the stage 209 are not limited thereto.

[0051] The cutting tool 218 is configured to remove at least a portion of the adhesion layer 218 covering the first workpiece 20. The cutting tool 218 may include at least a first cutting tool 218-1, a second cutting tool 218-2, a third cutting tool 218-3, a fourth cutting tool 218-4, a fifth cutting tool 218-5, and a sixth cutting tool 218-6 (shown respectively). Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 and Figure 15 Different cutting tools 218 may have different sizes and shapes, and appropriate ones may be selected and replaced according to the material of the adhesion layer 208 or its distribution position on the first workpiece 20. However, the types of cutting tools 218 are not limited thereto.

[0052] Figure 5 The present invention provides a flowchart of a workpiece cleaning method M50 according to some embodiments of the present invention. The workpiece cleaning method M50 includes steps S501, S502, S503, S504, S505, S506, S507, S508, S509, and S510. For ease of understanding, the workpiece cleaning method M50 follows the steps shown in Figures 1 to 510. Figure 4 The middle part of the reference symbols, and corresponding to Figures 6 to 16 The components in the process. However, the execution of the workpiece cleaning method M50 is not limited to this.

[0053] Figure 6 , Figure 7 and Figure 8 These are schematic diagrams of a first surface topography diagram 600, a second surface topography diagram 700, and a third surface topography diagram 800, respectively, according to some embodiments of the present invention. Figures 9 to 16 This is a cross-sectional view of a workpiece cleaning method according to some embodiments of the present invention during one or more stages. In steps S501 to S503 of the workpiece cleaning method M50, components with the same or corresponding functions are identical except for the first digit of the reference symbol (e.g., ...). Figure 1A The first hole 104 and Figure 4 The first holes 204 correspond to each other (for simplicity, only one set of reference symbols will be used in the following description). In steps S504 to S510 of the workpiece cleaning method M50, since it involves the cleaning of the workpiece... Figure 4 The cleaning steps of the first workpiece 20 shown below, therefore, if the following description refers to the steps already indicated... Figure 4 For components, their reference symbols are retained. Figure 4 The reference symbols used.

[0054] Regarding step S501, please also refer to... Figure 3 Step S501 includes generating first surface morphology information of at least one of the first workpiece 20 and the second workpiece using the scanning device 201. The first surface morphology information may be a three-dimensional design drawing of the first workpiece 20, a three-dimensional morphology scan of the first workpiece 20 before use, or a three-dimensional morphology scan of the second workpiece before use, wherein the second workpiece has the same type, model, or design specifications as the first workpiece 20, but is different from the first workpiece 20. In some embodiments, the first surface morphology information may be... Figure 6 The first surface topography diagram 600 is shown.

[0055] Step S501 further includes generating second surface morphology information of the first workpiece 20 by scanning device 201 after the adhesion layer covers the first workpiece 20, wherein the second surface morphology information includes the three-dimensional morphology of the adhesion layer. In some embodiments, the second surface morphology information may be... Figure 7 The second surface topography diagram 700 is shown.

[0056] Regarding step S502, please also refer to... Figure 4 Step S502 includes generating cutting information for the adhesion layer 208 covering the first workpiece 20 based on the first surface information and the second surface topography information using the information acquisition device 240. In some embodiments, the cutting information may be... Figure 8The third surface topography image 800 is shown. Specifically, the information acquisition device 240 can overlap and compare the first surface topography image 600 and the second surface topography image 700 to locate the third surface topography image 800 of the adhesion layer 208, that is, the distribution information such as the position or thickness of the adhesion layer 208 on the first workpiece 20 after use. This comparison can be achieved through difference calculation, that is, calculating the difference between the elevation of each spatial coordinate point in the second surface topography image 700 and the elevation of the corresponding coordinate point in the first surface topography image 600. The area with a non-zero difference corresponds to the distribution position of the adhesion layer 208, and the difference is the thickness of the adhesion layer 208 at that position. The information acquisition device 240 converts this difference distribution into a cutting path and cutting parameters that the cutting tool 218 can execute, generating cutting information. However, the method by which the information acquisition device 240 generates the cutting information of the adhesion layer 208 is not limited to this.

[0057] Regarding step S503, please also refer to... Figure 4 Step S503 includes selecting the cutting tool 218 to be used and adjusting the cleaning parameters via the controller 205 based on the cutting information of the adhesion layer 208. The cleaning parameters include at least one of the feed rate and revolutions of the cutting tool 218 and the length of the adjusting shaft 216. The controller 205 may also determine the type of cutting tool 218 to be used based on the position and material of the adhesion layer 208. However, the cleaning parameters that the controller can adjust are not limited to this.

[0058] Regarding step S504, please also refer to... Figure 9 and Figure 10 . Figure 9 A first workpiece 20 that has not yet undergone a cleaning process is shown. An adhesion layer 208 covering the first workpiece 20 may be located on the upper surface 202US and / or the second sidewall 202SW2 of the hole 200P. Specifically, the adhesion layer 208 may include a first portion 208-1 of the portion of the first sidewall 202SW1 and the first upper surface 202US1 adjacent to the first hole 204 in the first region R1; a second portion 208-2 of the portion of the first sidewall 202SW1 and the first upper surface 202US1 adjacent to the second hole 206 in the first region R1; a third portion 208-3 of the second upper surface 202US2 in the second region R2; a fourth portion 208-4 of the second sidewall 202SW2 of the first hole 204 in the first region R1 and the second sidewall 202SW2 of the third hole 213 in the second region R2; and a fifth portion 208-5 of the second sidewall 202SW2 of the second hole 206 in the first region R1. However, the distribution location of the attachment layer 208 is not limited to this.

[0059] Please refer to Figure 10Step S504 includes removing at least one of the first portion 208-1 or the second portion 208-2 of the adhesion layer 208 using a first cutting tool 218-1 of the cutting tool 218. Subsequently, the other portion of the first portion 208-1 or the second portion 208-2 of the adhesion layer 208 is removed using the first cutting tool 218-1 of the cutting tool 218. However, the order in which the first portion 208-1 and the second portion 208-2 of the adhesion layer 208 are removed is not limited, and the first portion 208-1 and the second portion 208-2 of the adhesion layer 208 may be removed simultaneously. After removing the first portion 208-1 and / or the second portion 208-2 of the adhesion layer 208 in step S504, at least a portion of the first portion 208-1 and / or the second portion 208-2 will remain on the first workpiece 20. The first cutting tool 218-1 may have a flat or beveled cutting edge, and its diameter may be approximately 10 to 20 mm. In some embodiments, the diameter of the cutting edge of the first cutting tool 218-1 may be about 15 to 17 mm. In some embodiments, the first cutting tool 218-1 may be a face mill.

[0060] Regarding step S505, please also refer to... Figure 11 Step S505 includes removing a third portion 208-3 of the adhesion layer 208 located on the second upper surface 202US2 of the first workpiece 20 in the second region R2 using a second cutting tool 218-2 of the cutting tool 218. After removing the third portion 208-3 of the adhesion layer 208 in step S505, at least a portion of the third portion 208-3 remains on the first workpiece 20. The second cutting tool 218-2 may have a beveled cutting edge with a diameter of about 10 to 20 mm. In some embodiments, the diameter of the cutting edge of the second cutting tool 218-2 may be about 15 to 17 mm. In some embodiments, the second cutting tool 218-2 may be a face mill.

[0061] Regarding step S506, please also refer to... Figure 12 Step S506 includes removing at least a portion of the fourth portion 208-4 of the adhesion layer 208 located on the second sidewall 202SW2 of the first hole 204 in the first region R1 and the second region R2 of the first workpiece 20 using a third cutting tool 218-3 of the cutting tool 218. After removing the fourth portion 208-4 of the adhesion layer 208 in step S506, at least a portion of the fourth portion 208-4 remains on the first workpiece 20. The third cutting tool 218-3 may have a flat or beveled cutting edge with a diameter of about 10 to 20 mm. In some embodiments, the diameter of the cutting edge of the third cutting tool 218-3 may be about 10 to 14 mm. In some embodiments, the third cutting tool 218-3 may be a beveled blade.

[0062] In this document, "rough milling" focuses on maximizing the material removal rate by using high feed and large depth of cut to quickly overcome material shear stress, but it will generate a large heat-affected layer and residual stress. "Finish milling" adopts low feed and small depth of cut to eliminate the geometric deviations and work hardening of rough milling. By suppressing cutting vibration and micro-cutting of the cutting edge, it achieves extremely low surface roughness and precise dimensional tolerances.

[0063] Step S506 may include a rough milling step, and the thickness of the fourth portion 208-4 of the adhesive layer 208 removed in step S506 may be about 30 to 80 micrometers. However, the thickness of the fourth portion 208-4 of the adhesive layer 208 removed in step S506 is not limited to this.

[0064] Regarding step S507, please also refer to... Figure 13 Step S507 includes removing at least a portion of the fifth portion 208-5 of the adhesion layer 208 located on the second sidewall 202SW2 of the second hole 206 in the first region R1 of the first workpiece 20 using a fourth cutting tool 218-4 of the cutting tool 218. After removing the fifth portion 208-5 of the adhesion layer 208 in step S507, at least a portion of the fifth portion 208-5 remains on the first workpiece 20. The fourth cutting tool 218-4 may have a flat or beveled cutting edge with a diameter of about 10 to 20 mm. In some embodiments, the diameter of the cutting edge of the fourth cutting tool 218-4 may be about 10 to 14 mm. In some embodiments, the fourth cutting tool 218-4 may be a beveled cutter. Step S507 may include a rough milling step, and the thickness of the fifth portion 208-5 of the adhesion layer 208 removed in step S507 may be about 30 to 80 micrometers. However, the thickness of the fifth portion 208-5 of the adhesive layer 208 removed in step S507 is not limited to this.

[0065] Regarding step S508, please also refer to... Figure 14Step S508 includes removing at least another portion of the fourth portion 208-4 of the adhesion layer 208 located on the second sidewall 202SW2 of the first hole 204 in the first region R1 and the second region R2 of the first workpiece 20 using a fifth cutting tool 218-5 of the cutting tool 218. After removing the fourth portion 208-4 of the adhesion layer 208 in step S508, at least a portion of the fourth portion 208-4 remains on the first workpiece 20. The fifth cutting tool 218-5 may have a flat or beveled cutting edge with a diameter of about 2 to 10 mm. In some embodiments, the diameter of the cutting edge of the fifth cutting tool 218-5 may be about 7 to 9 mm. In some embodiments, the fifth cutting tool 218-5 may be a beveled blade. Step S508 may include a finishing step, whereby the remaining thickness of the fourth portion 208-4 of the adhesion layer 208 removed in step S508 may be about 10 to 15 micrometers, or about 10% of the original thickness of the adhesion layer 208 before removal. However, the thickness of the fourth portion 208-4 of the adhesive layer 208 removed in step S508 is not limited to this.

[0066] Regarding step S509, please also refer to... Figure 15 Step S509 includes removing at least another portion of the fifth portion 208-5 of the adhesion layer 208 located on the second sidewall 202SW2 of the second hole 206 in the first region R1 of the first workpiece 20 using a sixth cutting tool 218-6 of the cutting tool 218. After removing the fifth portion 208-5 of the adhesion layer 208 in step S509, at least a portion of the fifth portion 208-5 remains on the first workpiece 20. The diameter of the sixth cutting tool 218-6 may be about 2 to 10 mm. In some embodiments, the diameter of the cutting edge of the sixth cutting tool 218-6 may be about 7 to 9 mm. In some embodiments, the sixth cutting tool 218-6 may be a beveled cutter. Step S509 may include a finishing step, whereby the remaining thickness of the fifth portion 208-5 of the adhesion layer 208 removed in step S509 may be about 10 to 15 micrometers, or about 10% of the original thickness of the adhesion layer 208 before removal. However, the thickness of the fifth portion 208-5 of the adhesive layer 208 removed in step S509 is not limited to this.

[0067] Steps S504 and S505 are steps to clean the upper surface 202US of the first workpiece 20, and steps S506 to S509 are steps to clean the second sidewall 202SW2 of the hole 200P of the first workpiece 20. Cleaning the upper surface 202US first reduces the adhesion of the adhesive layer 208 on the upper surface 202US or the second sidewall 202SW2 of the hole 200P, causing cracks or peeling to appear before the removal process. This makes the adhesive layer 208 easier to remove in subsequent cleaning steps, thereby improving the removal efficiency of the adhesive layer 208.

[0068] Steps S504 to S509 describe the steps involved in cleaning the first workpiece 20 using the cutting tool 218. However, the number of cleaning operations, areas, steps, sequence, and type of tool used for the first workpiece are not limited to those described in steps S504 to S509. Steps S504 to S509 may be partially omitted, or additional cleaning steps may be added.

[0069] Regarding step S510, please also refer to... Figure 16 Step S510 includes removing the remaining adhering layer 208 using a sandblasting process via a sandblasting apparatus 207. The sandblasting process can substantially remove all of the adhering layer 208 and improve the surface roughness of the second sidewall 202SW2 of the aperture 200P. The aperture 200P with a higher surface roughness can effectively capture stray particles on non-parallel paths. The micro-rough structure of the second sidewall 202SW2 of the aperture 200P increases the adhesion coefficient and induces a diffuse diffusion effect, causing stray particles to lose kinetic energy after multiple collisions and adsorb onto the second sidewall 202SW2. This suppresses film contamination or inhomogeneity caused by particle reflection back to the substrate, ensuring the purity of the deposition beam. Specifically, the surface roughness of the second sidewall 202SW2 of the aperture 200P after sandblasting can be approximately 3 to 10 micrometers. However, the surface roughness of the aperture 200P after sandblasting is not limited to this.

[0070] In addition to the sandblasting process shown in step S510, the remaining adhesion layer 208 can also be removed by cleaning processes such as chemical cleaning. The cleaning solution for chemical cleaning may include components such as nitric acid, hydrochloric acid, or sulfuric acid. However, the method for removing the remaining adhesion layer 208 is not limited to this. Since the fine cleaning in steps S508 and S509 has removed most of the adhesion layer 208, leaving only about 10 to 15 micrometers of residual adhesion layer 208, the subsequent chemical cleaning can significantly reduce the amount of cleaning solution used and the reaction time. Compared to processes that directly perform chemical cleaning without physical film removal, the cleaning method of the present invention can effectively improve the removal efficiency and accuracy of the adhesion layer 208, reduce damage to the first workpiece 20, and significantly improve the stability of corrosion control.

[0071] The above embodiments are merely preferred embodiments of the present invention. Based on the technical concept of the present invention, those skilled in the art can reasonably foresee the following variations: (a) Structural equivalent replacement: The sensor of the scanning device 201 can be any sensor capable of acquiring three-dimensional morphological information of the workpiece surface, such as an optical sensor (e.g., a light receiver 224 in conjunction with a light source 222), a laser displacement sensor, a structured light sensor, a contact probe sensor, or an X-ray tomography sensor. The mechanical structure of the rotating stage 227 can be replaced by a multi-axis robotic arm that clamps the workpiece and rotates it at multiple angles.

[0072] (ii) Material substitution: The cutting tool 218 can be made of high-speed steel, cemented carbide, ceramic, or diamond-coated cutting tools. The material of the first workpiece 10A / 10B is not limited to collimators or spray heads, but can also be metal or alloy parts that need to be cleaned in shields, heaters, or other semiconductor equipment. The material of the adhesion layer 208 is not limited to copper or aluminum, but can also be other deposited metal materials commonly used in semiconductor processes, such as titanium, tungsten, and tantalum.

[0073] (III) Adjustment of Step Order: The order of steps S504 and S505 can be interchanged; the order of steps S506 and S507 can be interchanged; the order of steps S508 and S509 can be interchanged. In specific scenarios, the order of rough milling and finishing steps can also be adjusted for certain areas. For example, rough milling and finishing can be performed on the sidewall of the first hole first, and then rough milling and finishing can be performed on the sidewall of the second hole.

[0074] (iv) Connection Variation: The connection between the adjusting shaft 216 and the cutting tool 218 can be a fixed connection or a detachable connection to facilitate the replacement of different types of cutting tools. Data transmission between the scanning device 201 and the information acquisition device 240 can be achieved through different methods such as wired network, wireless network, Bluetooth, or USB interface.

[0075] The above-described specific embodiments are merely preferred embodiments of the present invention and are not intended to limit the present invention.

Claims

1. A method for cleaning a workpiece, characterized in that, include: Generate first surface topography information for a reference workpiece, wherein the reference workpiece is either the first workpiece in an unused state or a second workpiece with the same design specifications as the first workpiece; After the adhesion layer covers the first workpiece, the second surface morphology information of the first workpiece is generated; The first surface topography information is compared with the second surface topography information to obtain the three-dimensional distribution information of the adhesion layer, and the cutting information of the adhesion layer is generated based on the three-dimensional distribution information; and Based on the cutting information of the adhesion layer, at least a portion of the adhesion layer is removed by the cutting tool of the cleaning device.

2. The workpiece cleaning method as described in claim 1, wherein, The first surface morphology information includes: a three-dimensional design drawing of the first workpiece; or a three-dimensional morphology scan of the first workpiece before use; or a three-dimensional morphology scan of a second workpiece with the same design specifications as the first workpiece before use.

3. The workpiece cleaning method as described in claim 1, wherein, Comparing the first surface topography information with the second surface topography information to obtain the three-dimensional distribution information of the adhesion layer includes: calculating the difference between the elevation of each coordinate point in the second surface topography information and the elevation of the corresponding coordinate point in the first surface topography information, and identifying the area with a non-zero difference as the distribution area of ​​the adhesion layer.

4. The workpiece cleaning method as described in claim 1, wherein, The step of removing at least a portion of the adhesion layer with the cutting tool includes: determining at least one of the feed rate and revolutions of the cutting tool and the length of the adjustment shaft of the cleaning device based on the cutting information, wherein the adjustment shaft is configured to fix the cutting tool.

5. The workpiece cleaning method according to any one of claims 1 to 4, wherein, The first workpiece includes a first region and a second region, the first region having a flat surface and the second region having an uneven surface, and the step of removing at least a portion of the adhesive layer with the cutting tool includes: first removing the adhesive layer located in the first region, and then removing the adhesive layer located in the second region.

6. The workpiece cleaning method as described in claim 5, wherein, Removing the attached layer located in the second region includes: a rough milling step with a first cutting parameter, followed by a finishing step with a second cutting parameter, wherein the material removal rate of the first cutting parameter is higher than the material removal rate of the second cutting parameter.

7. The workpiece cleaning method according to any one of claims 1 to 4, wherein, After removing at least a portion of the adhesive layer with the cutting tool, the process further includes removing the remaining portion of the adhesive layer by a sandblasting process.

8. A workpiece cleaning system, characterized in that, include: The scanning device is configured to generate first surface morphology information of a reference workpiece, and to generate second surface morphology information of the first workpiece after the attachment layer covers the first workpiece, wherein the reference workpiece is either the first workpiece in an unused state or a second workpiece with the same design specifications as the first workpiece. An information acquisition device is configured to compare the first surface morphology information with the second surface morphology information to obtain the three-dimensional distribution information of the adhesion layer, and to generate cutting information of the adhesion layer based on the three-dimensional distribution information; and Cleaning device, including: A stage, configured to hold the first workpiece; Cutting tools, configured to clean the first workpiece; and The controller is configured to control the cutting tool to remove at least a portion of the adhesive layer based on the cutting information of the adhesive layer.

9. The workpiece cleaning system as claimed in claim 8, wherein, The scanning device includes: Sensors, configured to acquire surface data of the workpiece; and The processor is configured to generate the first surface topography information and / or the second surface topography information based on the surface data acquired by the sensor.

10. The workpiece cleaning system as claimed in claim 8, wherein, The cutting tool includes multiple cutting tools, which have different sizes and / or shapes from one another.

11. The workpiece cleaning system of claim 8, further comprising a sandblasting device configured to remove the remaining portion of the adhesion layer by a sandblasting process after the cutting tool has removed at least a portion of the adhesion layer.

12. The workpiece cleaning system as claimed in claim 8, wherein, The first workpiece includes a first region and a second region, the first region having a flat surface and the second region having an uneven surface, and the controller is further configured to control the cutting tool to first remove the adhesive layer located in the first region and then remove the adhesive layer located in the second region.

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