Chip recycling device and chip recycling method

Abstract

The application relates to the display field and specifically discloses a chip recycling device and a chip recycling method. The chip recycling device comprises a first container and a second container. The first container is communicated with the second container, and a density adjusting unit and a flow control unit are arranged on the first container. When multiple chips with different masses and same volumes fall into the first container and are in a first state in a sorting liquid in the first container, the density adjusting unit adds solutes into the sorting liquid in the first container in batches according to the masses of the corresponding chips, so as to adjust the density of the sorting liquid, and the chips with corresponding masses change from the first state to a second state in batches. The flow control unit drives the sorting liquid in the first container to flow, so that the chips in the second state enter the second container from the first container. A collecting unit is arranged at the bottom of the second container. According to the above mode, the normal chip waste caused by the scrapped panel is reduced.

Description

Technical Field

[0001] This application relates to the display field, and more particularly to a chip recycling apparatus and a chip recycling method. Background Technology

[0002] The fabrication of a micro LED display panel requires transferring millions to tens of millions of micro LED chips from a growth substrate onto a driver backplane. The driver backplane then drives the LED chips to emit light, thereby forming an image display.

[0003] However, during this process, display defects will inevitably occur, such as damaged LED chips or abnormal driving circuits. When there are too many defects, they are difficult to repair or the repair cost is too high, so the driver backplane needs to be scrapped. Scrapping will waste a lot of normal LED chips, and LED chips are expensive. It is difficult to effectively collect and reuse normally emitting chips, which will increase the overall production cost.

[0004] Therefore, how to reduce the waste of normal chips caused by scrapped panels, thereby reducing costs, has become an urgent problem to be solved in this field. Summary of the Invention

[0005] This application discloses a chip recycling device and a chip recycling method, the purpose of which is to reduce the waste of normal chips caused by scrapping panels, thereby reducing costs.

[0006] This application discloses a chip recycling device, comprising: a first container and a second container, the first container being connected to the second container; the first container containing a sorting liquid, and the first container being provided with a density adjustment unit and a flow control unit; the density adjustment unit being used to add solute to the sorting liquid in the first container to adjust the density of the sorting liquid; the flow control unit being used to drive the sorting liquid in the first container to generate directional flow; when multiple chips of different masses but the same volume fall into the first container and are in a first state in the sorting liquid in the first container, the density adjustment unit adds solute to the sorting liquid in the first container in batches according to the mass of the corresponding chip, so as to adjust the density of the sorting liquid in batches to change the chips of the corresponding mass from the first state to a second state; the flow control unit drives the sorting liquid in the first container to flow so that the chips in the second state enter the second container from the first container; the second container contains a cleaning liquid for cleaning the chips entering the second container; a collection unit is provided at the bottom of the second container for collecting the chips that fall onto the collection unit.

[0007] Optionally, the density adjustment unit includes a storage bin and a feeding mechanism. The storage bin is connected to the feeding mechanism. The storage bin is used to store solute, and the feeding mechanism is used to add solute to the sorting liquid in the first container according to the mass of the corresponding chip, so as to adjust the density of the sorting liquid in the first container to change the chip of the corresponding mass from the first state to the second state.

[0008] Optionally, the bottom of the first container is provided with at least two baffles, and a collection area is formed between two adjacent baffles, the collection area being used to accommodate the chip in the first state.

[0009] Optionally, the first container includes a first sidewall and a second sidewall disposed opposite to each other. The first sidewall is provided with an injection port, and the second sidewall is provided with an outlet. The second sidewall is a shared sidewall of the first container and the second container. The injection port and the outlet are positioned correspondingly, and the injection port is connected to the flow control unit. The positions of both the injection port and the outlet are higher than the top of the baffle, and the liquid level of the sorting liquid is lower than the height of the injection port relative to the bottom of the first container. The first container and the second container are connected through the outlet. The flow control unit drives the sorting liquid in the container to flow so that the chip in the second state enters the second container through the outlet.

[0010] Optionally, the collecting unit includes a receiving substrate, the surface of which is provided with a plurality of grooves, the plurality of grooves matching the shape of the chip; each groove is provided with an adhesive layer for bonding with the chip falling into the groove.

[0011] Optionally, a detection device is also provided on the side wall of the first container. The detection device is positioned higher than the top of the baffle and is communicatively connected to the density adjustment unit and the flow control unit. When the detection device detects that the chip is in a first state, it transmits a detection signal to the density adjustment unit and the flow control unit. The density adjustment unit adds solute to the sorting liquid in the first container based on the acquired detection signal, and the flow control unit stops driving the flow of the sorting liquid in the first container based on the acquired detection signal. When the detection device detects that the chip is in a second state, it transmits a detection signal to the density adjustment unit and the flow control unit. The density adjustment unit stops adding solute to the sorting liquid in the first container based on the acquired detection signal, and the flow control unit drives the flow of the sorting liquid in the first container based on the acquired detection signal to allow the chip in the second state to enter the second container through the outlet.

[0012] Optionally, the second container is further provided with a stirring mechanism, which is used to stir the cleaning liquid in the second container at a preset time interval, so that the chips that are not stuck to the groove and have sunk to the bottom of the second container are resuspended.

[0013] This application also discloses a chip recycling method, applied to the aforementioned chip recycling apparatus, comprising the following steps: Preparation steps: Provide a drive backplane, on which multiple chips of different masses but the same volume are bonded; release the chips retained on the drive backplane into the sorting liquid in the first container, and put the multiple chips in the first container in a first state. Separation step: Add solute to the sorting liquid in the first container until the density of the sorting liquid in the first container reaches the first target value, so that some of the chips change from the first state to the second state; Collection step: Drive the sorting liquid in the first container to flow, and transfer the portion of the chip that has reached the second state from the first container into the second container for collection; The separation and collection steps are repeated N times until all the chips are separated from the first container and collected in the second container. In each loop step, the first target value gradually increases relative to the previous loop step, so as to change the chips of different qualities from the first state to the second state in the first container in batches.

[0014] Optionally, the step of providing a drive backplane, on which multiple chips of different masses but the same volume are bonded, and releasing the chips retained on the drive backplane into the sorting liquid of the first container, and placing the multiple chips in a first state within the first container, includes: Identify the bad spots on the driver backplane, and destroy and remove the chips at the bad spots; Heating the drive backplate melts the bonding material of the remaining chip bonded to the drive backplate, thereby releasing the chip from the drive backplate and dropping it into the first container containing sorting liquid, and causing the chip to sink to the bottom of the first container, reaching the first state. The chips include red, green, and blue chips, and the mass difference between the red, green, and blue chips is greater than or equal to 10%. The red chip, the green chip, and the blue chip all have the same epitaxial layer size, but the electrode widths of the red chip, the green chip, and the blue chip are different.

[0015] Optionally, the step of driving the sorting liquid flow within the first container to transfer a portion of the chips that have reached the second state from the first container into the second container, and collecting them within the second container, further includes: The chip that has entered the second container is placed in the cleaning solution in the second container for cleaning; The cleaned chip is then transferred to a receiving substrate. The chips transferred to the receiving substrate are dried.

[0016] The chip recycling device provided in this application mainly comprises a first container and a second container connected to each other. The first container stores a sorting liquid and is equipped with a density adjustment unit and a flow control unit. The density adjustment unit can add solute to the sorting liquid in the first container to control the density of the sorting liquid. The flow control unit can drive the sorting liquid in the first container to form a directional flow, so that the chips that have reached the second state are sent from the first container into the second container along with the flow of the liquid. When multiple chips of the same volume but different mass fall into the first container, the density adjustment unit sorts them in batches according to their different masses. The density of the sorting liquid is adjusted to sequentially switch chips of different quality specifications from a first state to a second state. Simultaneously, the flow control unit drives the sorting liquid to flow in a directional manner, transporting the chips switched to the second state to a second container. The second container contains cleaning fluid, which cleans and removes impurities from the chips after sorting. A collection unit is installed at the bottom of the second container to collect the cleaned chips. This achieves automated sorting, cleaning, and collection of chips of different qualities mixed together, enabling the chips to be reused and reducing the waste of normal chips when scrapping panels, thereby reducing costs. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the embodiments of this application and form part of the specification. They serve to demonstrate implementation methods of this application and, together with the textual description, explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort. In the drawings: Figure 1 This is a schematic diagram of the drive backplate placed above the chip recycling device in the first embodiment of the chip recycling device of this application; Figure 2 This is a schematic diagram of the red chip, green chip, and blue chip in the first embodiment of the chip recycling device of this application; Figure 3 This is a schematic diagram of the drive backplate being placed above the chip recycling device in the second embodiment of the chip recycling device of this application; Figure 4 This is a step diagram of an embodiment of the chip recycling method of this application; Figure 5 This is a step diagram illustrating the preparation steps in one embodiment of the chip recycling method of this application; Figure 6 This is a step diagram of the collection step in one embodiment of the chip recycling method of this application.

[0018] Among them, 10 is a chip recycling device; 100 is a first container; 110 is a sorting liquid; 120 is a density adjustment unit; 121 is a storage bin; 122 is a feeding mechanism; 130 is a flow control unit; 140 is a solute; 150 is a chip; 151 is a red chip; 152 is a green chip; 153 is a blue chip; 160 is a baffle; 161 is a collection area; 170 is a first sidewall; 171 is an injection port; 180 is a second sidewall; 181 is an outlet; 190 is a detection device; 191 is a light generator; 192 is a light receiver; 200 is a second container; 210 is a stirring mechanism; 220 is a cleaning liquid; 230 is a collection unit; 231 is a receiving substrate; 232 is a groove; 233 is an adhesive layer; 300 is a drive backplate; and 400 is a valve. Detailed Implementation

[0019] The present application will now be described in detail with reference to the accompanying drawings and optional embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0020] Figure 1 This is a schematic diagram showing the drive backplate positioned above the chip recycling device in the first embodiment of this application. Figure 2 This is a schematic diagram of the red, green, and blue chips in the first embodiment of the chip recycling device of this application; as shown. Figure 1 and Figure 2As shown in the figure, this application discloses a chip recycling device 10, including: a first container 100 and a second container 200, the first container 100 and the second container 200 are connected, the first container 100 contains a sorting liquid 110, and the first container 100 is provided with a density adjustment unit 120 and a flow control unit 130. The density adjustment unit 120 is used to add solute 140 to the sorting liquid 110 in the first container 100 to adjust the density of the sorting liquid 110; the flow control unit 130 is used to drive the sorting liquid 110 in the first container 100 to generate directional flow; when multiple chips 150 with different masses and the same volume fall into the first container 100 and are in a first state in the sorting liquid 110 of the first container 100... The density adjustment unit 120 adds solute 140 to the sorting liquid 110 in the first container 100 in batches according to the mass of the corresponding chip 150, so as to adjust the density of the sorting liquid 110 and change the chips 150 of the corresponding mass from the first state to the second state in batches; the flow control unit 130 drives the sorting liquid 110 in the first container 100 to flow so that the chips 150 in the second state enter the second container 200 from the first container 100; the second container 200 is filled with cleaning liquid 220 for cleaning the chips 150 entering the second container 200; a collection unit 230 is provided at the bottom of the second container 200 for collecting the chips 150 that fall into the collection unit 230.

[0021] The chip recycling device 10 provided in this application mainly comprises a first container 100 and a second container 200 connected to each other. The first container 100 stores a sorting liquid 110 and is equipped with a density adjustment unit 120 and a flow control unit 130. The density adjustment unit 120 can add solute 140 to the sorting liquid 110 in the first container 100 to adjust the density of the sorting liquid 110. The flow control unit 130 can drive the sorting liquid 110 in the first container 100 to form a directional flow, so that the chips 150 that have reached the second state are sent from the first container 100 into the second container 200 along with the flow of the liquid. When multiple chips 150 of the same volume but different mass fall into the first container 100, the density adjustment unit 120 uses the density adjustment unit 120 to determine the density of the chips 150. The density of the sorting liquid 110 is adjusted in batches according to 50 different qualities, so that chips 150 of different quality specifications are switched from the first state to the second state in sequence. At the same time, the flow control unit 130 drives the sorting liquid 110 to flow in a directional manner, and transports the chips 150 switched to the second state into the second container 200. The second container 200 contains cleaning liquid 220, which can clean and remove impurities from the chips 150 after sorting. The bottom of the second container 200 is equipped with a collection unit 230, which can collect the cleaned chips 150. In this way, an automated sorting, cleaning and collection operation is formed for chips 150 of different qualities mixed together, so that the chips 150 can be reused later, reducing the waste of normal chips 150 when scrapping panels, thereby reducing costs.

[0022] It should be noted that the first state of chip 150 in this application can be understood as the state in which chip 150 sinks to the bottom of the first container 100 after entering the first container 100; the second state of chip 150 can be understood as the state in which chip 150 floats to a predetermined position from the bottom of the first container 100. In this embodiment, the sorting liquid 110 can be any one of water, acetone or tetrachloroethylene, and the solute 140 can be an inorganic salt, sugar or resin. The initial density of the sorting liquid 110 is less than the density of all chips 150, so that the chips 150 that initially fall into the first container 100 will sink to the bottom of the first container 100. By adding solute 140 to the sorting liquid 110 in batches, the density of the sorting liquid 110 is changed, so that chips 150 of different masses can float to the predetermined position from the bottom of the first container 100 in batches.

[0023] Specifically, the density adjustment unit 120 includes a storage bin 121 and a feeding mechanism 122. The storage bin 121 is connected to the feeding mechanism 122. The storage bin 121 is used to store solute 140. The feeding mechanism 122 is used to add solute 140 to the sorting liquid 110 of the first container 100 according to the mass of the corresponding chip 150, so as to adjust the density of the sorting liquid 110 of the first container 100 to change the corresponding mass of chip 150 from the first state to the second state.

[0024] This embodiment of the application sets up a density adjustment unit 120 on the first container 100, uses the storage bin 121 of the density adjustment unit 120 to store solute 140, and then uses a feeding mechanism 122 to add the corresponding amount of solute 140 to the sorting liquid 110 according to the density threshold corresponding to different mass chips 150, gradually adjusting the density of the sorting liquid 110 to the preset value, thereby ensuring that after each adjustment, only the chips 150 of the corresponding target mass meet the density condition and float to the second state, while the chips 150 of other masses remain in the first state and sink to the bottom of the first container 100, thereby realizing the batch sorting of chips 150 of different specifications, avoiding the mixed flow of chips 150 of different masses, and ensuring the sorting accuracy.

[0025] Once the density of the sorting liquid 110 is adjusted to the target value, the density of the corresponding mass of chip 150 will be less than the density of the sorting liquid 110. Therefore, the chip 150 of that mass will float from the bottom of the first container 100 and enter the second state. At this time, the chip 150 of that mass has floated to the area where the flow control unit 130 acts in the sorting liquid 110. The flow control unit 130 then drives the sorting liquid 110 to generate directional flow, causing these floating chips 150 to flow with the liquid. Finally, they enter the second container 200 from the first container 100 through the connecting channel, completing the sorting and conveying of this batch of chips 150. After completion, the density adjustment unit 120 can add solute 140 again to increase the density of the sorting liquid 110 and perform the sorting of the next batch of higher quality chips 150 until all chips 150 of different masses in the first container 100 have been sorted.

[0026] Furthermore, the bottom of the first container 100 is provided with at least two baffles 160, and a collection area 161 is formed between two adjacent baffles 160. The collection area 161 is used to accommodate the chip 150 in the first state.

[0027] In this embodiment of the application, a baffle 160 is also provided at the bottom of the first container 100. The bottom of the first container 100 is divided into multiple independent collection areas 161 by adjacent baffles 160. When chips 150 of different qualities fall into the first container 100, chips 150 of different qualities can be separated and placed in corresponding areas before the sorting is completed, so as to avoid mixing of chips 150 of different batches during the sorting process and ensure the sorting accuracy.

[0028] In addition, the baffle 160 can also buffer and stabilize the flow of the directional sorting liquid 110, preventing fluctuations in the liquid flow rate from disrupting the suspension or settling state of the chips 150 that have not reached the separation conditions, thereby further improving the sorting stability.

[0029] In this embodiment, the first container 100 includes a first sidewall 170 and a second sidewall 180 disposed opposite to each other. The first sidewall 170 is provided with an inlet 171, and the second sidewall 180 is provided with an outlet 181. The second sidewall 180 is a shared sidewall of the first container 100 and the second container 200. The positions of the inlet 171 and the outlet 181 correspond, and the inlet 171 is connected to the flow control unit 130. The positions of both the inlet 171 and the outlet 181 are higher than the top of the baffle 160, and the liquid level of the sorting liquid 110 is lower than the height of the inlet 171 relative to the bottom of the first container 100. The first container 100 and the second container 200 are connected through the outlet 181. The flow control unit 130 drives the sorting liquid 110 in the container to flow so that the chip 150 in the second state enters the second container 200 through the outlet 181.

[0030] The flow control unit 130 can be a liquid-driven pump, such as an electromagnetic pump or a piezoelectric pump; by connecting the liquid-driven pump to the injection port 171, the directional movement of the sorting liquid 110 is driven.

[0031] In this embodiment, by setting the inlet 171 and outlet 181 above the top of the baffle 160, and controlling the initial liquid level of the sorting liquid 110 to be lower than the height of the inlet 171, the flow control unit 130 can drive the sorting liquid 110 to flow from the inlet 171, which will only drive the chips 150 that have floated above the baffle 160 and are in the second state to flow towards the outlet 181. This will not agitate the chips 150 that are at the bottom in the first state within the collection area 161 between the baffles 160, further preventing the chips 150 at the bottom from being prematurely carried out by the liquid flow, thus ensuring the accuracy of the sorting process. Simultaneously, the flow of the sorting liquid 110 carries the floating chips 150 from the first container 100 through the outlet 181 into the second container 200, achieving automatic transport of the chips 150 without the need for an additional complex transfer structure, simplifying the overall structure of the device.

[0032] Furthermore, the liquid level is always lower than the height of the injection port 171 to prevent liquid overflow. At the same time, the height of the liquid flow is always above the top of the baffle 160, which ensures that the floating chip 150 can flow smoothly with the liquid flow through the baffle 160 and enter the outlet 181 without being blocked by the baffle 160 and affecting the sorting process.

[0033] Valves 400 can be installed on both the inlet 171 and the outlet 181. These valves 400 can be solenoid valves. When the flow control unit 130 needs to drive the sorting liquid 110 to flow, both valves 400 at the inlet 171 and outlet 181 open simultaneously. Conversely, when the flow control unit 130 does not need to drive the sorting liquid 110 to flow, both valves 400 at the inlet 171 and outlet 181 close. This allows for flexible control of the liquid flow and the connection between the first container 100 and the second container 200 according to different stages of the sorting operation. During the density adjustment unit 120's adjustment of the sorting liquid 110 density, valves 400 are closed to stop the liquid flow, preventing premature flow of the chips 150 before the density is properly adjusted. This ensures orderly batch sorting and further improves the controllability and sorting accuracy of the chip recovery device 10.

[0034] Furthermore, a detection device 190 is also provided on the side wall of the first container 100. The detection device 190 is positioned higher than the top of the baffle 160. The detection device 190 is communicatively connected to the density adjustment unit 120 and the flow control unit 130. When the detection chip 150 of the detection device 190 is in the first state, the detection device 190 transmits the detection signal to the density adjustment unit 120 and the flow control unit 130 respectively. The density adjustment unit 120 adds solute 140 to the sorting liquid 110 of the first container 100 according to the acquired detection signal. The flow control unit 130 adds solute 140 to the sorting liquid 110 of the first container 100 according to the acquired detection signal. When the detection device 190 detects that the chip 150 is in the second state, the detection device 190 transmits the detection signal to the density adjustment unit 120 and the flow control unit 130 respectively. The density adjustment unit 120 stops adding solute 140 to the sorting liquid 110 in the first container 100 according to the acquired detection signal. The flow control unit 130 drives the sorting liquid 110 in the first container 100 to flow so that the chip 150 in the second state enters the second container 200 through the outlet 181 according to the acquired detection signal.

[0035] In this embodiment, by setting a detection device 190 with a height higher than the top of the baffle 160, the detection device 190 can identify in real time whether the current batch of chips 150 has completed the state transition, without the need for manual monitoring, thus realizing a fully automated sorting operation. When all the chips 150 to be separated are in the first state, it indicates that the liquid density still needs to be adjusted. At this time, the detection device 190 will send a detection signal to the density adjustment unit 120 and the flow control unit 130. After processing the acquired detection signal, the density unit will continue to add solute 140 to the sorting liquid 110 in the first container 100. At the same time, after processing the acquired detection signal, the flow control unit 130 will stop driving the flow of the sorting liquid 110. This avoids the accidental washing away of chips 150 that have not completed their state transition. When the detection device 190 detects that the target chip 150 has completed its state transition (from the first state to the second state), it transmits the detection signal to the density adjustment unit 120 and the flow control unit 130. After the density adjustment unit 120 receives and processes the detection signal, it stops adding solute 140 to the first container 100. At the same time, after the flow control unit 130 receives and processes the detection signal, it drives the sorting liquid 110 to flow, so that the batch of chips 150 that have reached the second state are sent from the first container 100 to the second container 200 through the outlet 181 for cleaning and collection. This achieves automated operation and further avoids sorting errors caused by manual operation.

[0036] Specifically, the detection device 190 may include a light generator 191 and a light receiver 192. The light generator 191 and the light receiver 192 may be respectively disposed on two opposite side walls of the first container 100. The light generator 191 emits a detection beam toward the light receiver 192. The height of the beam is higher than the top of the baffle 160. When the chip 150 floats to the height of the beam, the chip 150 will block the beam. The light receiver 192 will not be able to receive the complete beam of the light generator 191, and will determine that the chip 150 has entered the second state. The corresponding detection signal is output to the density adjustment unit 120 and the flow control unit 130. After receiving the detection signal, the density adjustment unit 120 stops adding solute 140 into the first container 100. After receiving the detection signal, the flow control unit 130 drives the sorting liquid 110 in the first container 100 to flow, so that the chip 150 that has reached the second state enters the second container 200 from the first container 100 through the outlet 181 for cleaning and collection.

[0037] Once all chips 150 in the batch have been delivered, and no chip 150 is blocking the light beam, the light receiver 192 can receive the complete light beam again. It will then transmit the detection signal to the density adjustment unit 120. After receiving the detection signal, the density adjustment unit 120 will start adding solute 140 to the first container 100 in the next round. After receiving the detection signal, the flow control unit 130 will stop driving the flow of the sorting liquid 110 in the first container 100, thereby performing the sorting of the next batch of chips 150. This real-time detection achieves automated control, which not only has a fast response speed but also improves sorting efficiency and accuracy.

[0038] Furthermore, the collecting unit 230 includes a receiving substrate 231, the surface of which is provided with a plurality of grooves 232, the grooves 232 matching the shape of the chip 150; each groove 232 is provided with an adhesive layer 233, which is used to bond the chip 150 that falls into the groove 232. The adhesive layer 233 in the groove 232 can be a removable adhesive, such as photolytic or thermally degradable adhesive, to better fix the chip 150 and to release the chip 150 later through the removable adhesive.

[0039] In this embodiment, a receiving substrate 231 is installed at the bottom of the second container 200 to collect multiple chips 150 that have entered the second container 200.

[0040] When multiple sorted chips 150 fall into the second container 200, they are first cleaned by the cleaning solution 220 in the second container 200 to remove surface impurities. After cleaning, the chips 150 sink to the receiving substrate 231 at the bottom of the second container 200. Each chip 150 can fall into the corresponding shaped groove 232 and contact the adhesive layer 233 in the groove 232. The adhesive layer 233 can stably fix the chip 150 in the groove 232, preventing the chip 150 from being displaced by the cleaning solution 220, and also preventing the chips 150 from colliding with each other and causing damage to the pins or functional areas. This ensures the integrity of the recovered chips 150 and facilitates subsequent unified removal for testing and reuse.

[0041] Figure 3 This is a schematic diagram showing the drive backplane positioned above the chip recycling device in the second embodiment of the present application. Figure 3 The illustrated embodiment is based on Figure 1 Improvements, such as Figure 2 As shown, the second container 200 is also provided with a stirring mechanism 210. The stirring mechanism 210 is used to stir the cleaning liquid 220 in the second container 200 at a preset time interval, so that the chip 150 that is not stuck to the groove 232 and has sunk to the bottom of the second container 200 is resuspended.

[0042] The difference between this embodiment and the previous embodiment is that, in this embodiment, a stirring mechanism 210 is additionally provided in the second container 200. When multiple chips 150 of the same batch in the second state enter the second container 200 from the first container 100 through the outlet 181, the chips 150 will first undergo preliminary cleaning in the cleaning solution 220 of the first container 100. Some chips 150 will smoothly sink and fall into the groove 232 of the receiving substrate 231 for adhesive bonding, thereby completing the collection of some chips 150; while other chips 150 may be... Due to reasons such as mutual stacking and adhesion, the chips 150 may not be able to fall smoothly into the corresponding grooves 232 of the receiving substrate 231. At this time, the stirring mechanism 210 gently stirs the cleaning liquid 220 in the second container 200 at preset time intervals, thereby causing the chips 150 that failed to fall into the grooves 232 to be resuspended. The chips 150 are moved again under the disturbance of the cleaning liquid 220, increasing the probability of the chips 150 falling into the grooves 232, avoiding the chips 150 from accumulating on the side walls or stacking on top of other chips 150 and being unable to be collected, thus improving the success rate of chip 150 collection.

[0043] At the same time, the flow of liquid brought about by stirring can better wash away the residual sorting liquid 110 and other impurities attached to the surface of chip 150, further improving the cleaning effect of chip 150, ensuring the cleanliness of recycled chip 150, and meeting the requirements for subsequent reuse. After stirring is completed, the stirring stops, and chip 150 will sink again and finally fall into the corresponding groove 232 of the receiving substrate 231 and be fixed by the adhesive layer 233 to complete the collection.

[0044] Figure 4 This is a step diagram of an embodiment of the chip recycling method of this application. Figure 5 This is a step diagram illustrating the preparation steps in one embodiment of the chip recycling method of this application; Figure 6 This is a step diagram of the collection step in one embodiment of the chip recycling method of this application.

[0045] like Figures 4 to 6 As shown in the figure, this application embodiment also discloses a chip 150 recycling method, applied to the chip recycling device 10 described above, including the following steps: S1: Preparation steps: Provide a drive backplate 300, on which multiple chips 150 of different masses and the same volume are bonded. Release the chips 150 retained on the drive backplate 300 into the sorting liquid 110 of the first container 100, and put the multiple chips 150 in the first container 100 in a first state. S2: Separation step: Add solute 140 to the sorting liquid 110 in the first container 100 until the density of the sorting liquid 110 in the first container 100 reaches the first target value, so that some chips 150 change from the first state to the second state. S3: Collection step: Drive the sorting liquid 110 in the first container 100 to flow, and transfer the chips 150 that have reached the second state from the first container 100 into the second container 200 for collection. S4: Repeat the separation and collection steps N times until all chips 150 are separated from the first container 100 and collected in the second container 200. In each loop step, the first target value gradually increases relative to the previous loop step, which can transform 150 chips of different qualities from the first state to the second state in the first container 100 in batches.

[0046] In this embodiment, during the preparation step, after the chip 150 is released from the drive backplane 300, all chips 150 with the same volume but different mass sink to the bottom of the first container 100 and remain in the first state. At this time, the initial density of the sorting liquid 110 is lower than the density of all chips 150, ensuring that all chips 150 are in the bottom state in the initial state, providing a basis for subsequent batch sorting.

[0047] In the separation step, the density adjustment unit 120 adds solute 140 according to the preset first target density, gradually increasing the density of the sorting liquid 110 to the first target value. This density is just greater than the density of the lowest mass chip 150 in the current batch, causing the corresponding batch of chips 150 to float and change to the second state, while the other chips 150 with larger mass remain at the bottom in the first state because their density is greater than that of the sorting liquid 110.

[0048] After separation, the process proceeds to the collection step. The flow control unit 130 drives the sorting liquid 110 to flow in a specific direction, sending the floating second-state chips 150 into the second container 200 for cleaning and collection. Then, the process continues until all chips 150 have been sorted and collected.

[0049] During each cycle, the first target density value of the sorting liquid 110 is gradually increased. Since the chips 150 have the same volume but different masses, they correspond to different densities. The first target value gradually increases with the number of cycles. Different chips 150 can be allowed to complete the state transition in order of increasing density. Each batch only separates chips 150 of the corresponding density, avoiding the mixing and separation of chips 150 of different specifications, and ensuring the accuracy of sorting.

[0050] The entire method adjusts the density of the sorting liquid 110 in batches, and uses the liquid flow to transport the sorted chips 150, and then cleans and collects them. It can automatically complete the separation and recycling of multiple chips 150 of different quality in one go without manual sorting, which greatly improves the recycling efficiency of waste panel chips 150, reduces recycling costs, and reduces the waste of reusable chips 150.

[0051] Furthermore, the chip 150 recycling method of this application embodiment is applied to the chip recycling device 10 provided in this application embodiment. The chip recycling device 10 mainly comprises a first container 100 and a second container 200 that are interconnected. The first container 100 stores a sorting liquid 110 and is equipped with a density adjustment unit 120 and a flow control unit 130. The density adjustment unit 120 can add solute 140 to the sorting liquid 110 in the first container 100 to adjust the density of the sorting liquid 110. The flow control unit 130 can drive the sorting liquid 110 in the first container 100 to form a directional flow, so that the chip 150 that has reached the second state is sent from the first container 100 into the second container 200 along with the flow of the liquid. When multiple chips 150 of the same volume but different mass fall into the first container 100, The density adjustment unit 120 adjusts the density of the sorting liquid 110 in batches according to the different masses of the chips 150, so that chips 150 of different mass specifications are switched from the first state to the second state in sequence. At the same time, the flow control unit 130 drives the sorting liquid 110 to flow in a directional manner, and transports the chips 150 switched to the second state to the second container 200. The second container 200 contains cleaning liquid 220, which can clean and remove impurities from the chips 150 that have entered after sorting. The bottom of the second container 200 is equipped with a collection unit 230, which can collect the cleaned chips 150. In this way, an automated sorting, cleaning and collection operation is formed for chips 150 of different masses mixed together, so that the chips 150 can be reused later, reducing the waste of normal chips 150 when scrapping panels, thereby reducing costs.

[0052] To facilitate understanding, let's take three different colored chips 150—red chip 151, green chip 152, and blue chip 153—with the following weight distribution: red chip 151 is greater than green chip 152, and green chip 152 is greater than blue chip 153. When multiple red chips 151, green chips 152, and blue chips 153 fall into the first container 100 and sink to the collection area 161 at the bottom of the first container 100, sorting the chips 150 of different colors requires three cyclic steps, as detailed below: During the first cycle, solute 140 is added to the sorting solution in the first container 100 via density adjustment unit 120. The density of sorting liquid 110 is first adjusted to a target value that is greater than the density of blue chip 153 and less than the density of green chip 152. At this time, only the blue chip 153 with a smaller density will float and change to the second state. The red chip 151 and green chip 152 still have a density greater than the density of sorting liquid 110 and remain at the bottom in the first state. Then, flow control unit 130 drives the sorting liquid 110 to flow, transporting all the floating blue chips 153 to the second container 200. In the second container 200, the chips are first cleaned by cleaning liquid 220. Then, the blue chips 153 sink into the groove 232 on the receiving substrate 231 at the bottom of the second container 200 and adhere to the adhesive layer 233 in the groove 232, thereby completing the cleaning and collection of the blue chips 153.

[0053] After the first cycle is completed, the second cycle begins. Solute 140 is added to the sorting solution in the first container 100 through the density adjustment unit 120 to increase the density of the sorting liquid 110 to a first target value that is greater than the density of the green chip 152 and less than the density of the red chip 151. At this time, the density of the green chip 152 is less than the density of the sorting liquid 110, so it floats and changes to the second state. The red chip 151 remains at the bottom. The green chip 152 is then transported to the second container 200 through the flow control unit 130. In the second container 200, it is first cleaned by the cleaning solution 220. Then, the green chip 152 sinks into the groove 232 on the receiving substrate 231 at the bottom of the second container 200 and adheres to the adhesive layer 233 in the groove 232, thereby completing the cleaning and collection of the green chip 152.

[0054] Finally, in the third cycle, solute 140 is added to the sorting solution in the first container 100 through the density adjustment unit 120 to increase the density of the sorting liquid 110 to a first target value greater than the density of the red chip 151. The remaining red chips 151 all float to the surface and change to the second state. Then, the green chip 152 is transported to the second container 200 through the flow control unit 130. In the second container 200, the red chip 151 is first cleaned by the cleaning solution 220. Then, the red chip 151 sinks into the groove 232 on the receiving substrate 231 at the bottom of the second container 200 and adheres to the adhesive layer 233 in the groove 232, thereby completing the cleaning and collection of the red chip 151.

[0055] At this point, all three different colored chips 150 have been sorted and collected in batches. The entire process does not require manual sorting and can automatically separate the three mixed chips 150 according to color specifications. The sorting accuracy is high, the recycling efficiency is high, and it is convenient for subsequent classification and reuse.

[0056] Specifically, the step S1, which involves providing a drive backplane 300 on which multiple chips 150 of different masses but the same volume are bonded, and releasing the chips 150 retained on the drive backplane 300 into the sorting liquid 110 of the first container 100, and placing the multiple chips 150 in a first state within the first container 100, includes: S11: Identify bad spots on the driver backplane 300, and destroy and remove the chip 150 at the bad spot; S12: Heat the drive backplate 300 to melt the bonding material of the remaining chip 150 bonded to the drive backplate 300, so as to release the chip 150 from the drive backplate 300 and let it fall into the first container 100 containing the sorting liquid 110, and let the chip 150 sink to the bottom of the first container 100, reaching the first state. Among them, the various chips 150 include a red chip 151, a green chip 152, and a blue chip 153, and the quality difference between the three chips 151, 152, and 153 is greater than or equal to 10%. The epitaxial layer dimensions of red chip 151, green chip 152, and blue chip 153 are all the same, and the electrode widths of red chip 151, green chip 152, and blue chip 153 are different.

[0057] In this embodiment, the LED chip 150 can be transferred and die-bonded onto the driving backplate 300 by mass transfer or other methods to prepare the required panel, and the driving backplate 300 can be inspected (e.g., by AOI after lighting up the chip 150) to obtain the location of the defective pixels on the driving backplate 300.

[0058] Then, for the defective locations on the drive backplane 300 that needs to be scrapped, the chips 150 at the defective locations are destroyed by laser, for example, by directly breaking the chips 150. After breaking them, the fragments are removed by blowing with nitrogen gas, so that most of the chips 150 that can emit light normally can be retained on the drive backplane 300. By removing the damaged chips 150 at the defective locations first and retaining the normal and intact chips 150, unusable chips 150 can be eliminated in advance, reducing invalid sorting operations and improving the overall efficiency of subsequent sorting and recycling.

[0059] The entire driver backplane 300 can then be heated using a heating panel, causing the indium / tin bonding materials between the driver backplane 300 and all intact chips 150 to melt and lose their adhesive bonding effect. At this point, all intact chips 150 will detach from the driver backplane 300. When the driver backplane 300 is placed above the first container 100, multiple detached chips 150 will fall into the sorting liquid 110 in the first container 100 below. Releasing the chips 150 by heating and melting the bonding materials does not damage the functional areas and pins of the intact chips 150, effectively preserving the integrity of the chips 150 and meeting the performance requirements for subsequent reuse.

[0060] In this process, the initial density of the sorting liquid 110 is lower than the density of all intact chips 150. The chips 150 will sink directly to the bottom of the first container 100 and remain in the first state of sinking, thereby completing the preparation for feeding the chips 150 to be sorted.

[0061] In this embodiment, the epitaxial layer dimensions of the three types of chips 150—red chip 151, green chip 152, and blue chip 153—are identical, differing only in electrode width. Therefore, their volumes are essentially the same. The difference in electrode width directly leads to a significant distinction in the overall mass of the chips 150. Furthermore, the mass difference between the three types of chips 150 is no less than 10%, making the density difference between the different colored chips 150 sufficiently obvious. When adjusting the density of the sorting liquid 110 in batches, it is relatively easy to distinguish the different chips 150, and the problem of overlapping density ranges causing different chips 150 to mix and float is less likely to occur, further ensuring sorting accuracy.

[0062] Furthermore, step S3, which involves driving the sorting liquid 110 within the first container 100 to flow, causing a portion of the chips 150 that have reached the second state to enter the second container 200 and be collected within the second container 200, further includes: S31: The chip 150 that has entered the second container 200 is placed in the cleaning solution 220 in the second container 200 for cleaning; S32: Transfer the cleaned chip 150 to a receiving substrate 231; S33: The chip 150 transferred to the receiving substrate 231 is dried.

[0063] When multiple chips 150 of the same batch (with the same quality) reach the second state, after being sorted and entering the second container 200, the surface sorting liquid 110 and attached impurities are first rinsed in the cleaning solution 220 of the second container 200 to remove the residual solute 140 adhering to the sorting process.

[0064] Then, the chip 150 sinks into the groove 232 of the receiving substrate 231 and is bonded by the adhesive layer 233 within the groove 232, thereby using the receiving substrate 231 to collect multiple chips 150 within the second container 200. The adhesive layer 233 within the groove 232 can be a removable adhesive, such as a photolytic or thermally degradable adhesive, to better fix the chip 150 and allow for release of the chip 150 later using the removable adhesive.

[0065] Finally, the receiving substrate 231 can be removed from the second container 200, and the multiple chips 150 on the receiving substrate 231 can be dried. The drying method can be IR drying, air knife drying, heating drying, etc., to dry the surface liquid of the receiving substrate 231 and the multiple chips 150. After drying, the chips 150 can be kept in a dry and clean state, so that the chips 150 can be reused. This avoids the impact of moisture or impurities on the function of the chips 150, and further ensures the quality of the recycled chips 150.

[0066] It should be noted that the inventive concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.

[0067] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A chip recycling device, characterized in that, include: A first container and a second container are connected. The first container contains a sorting liquid and is equipped with a density adjustment unit and a flow control unit. The density adjustment unit is used to add solute to the sorting liquid in the first container to adjust the density of the sorting liquid; the flow control unit is used to drive the sorting liquid in the first container to generate directional flow. When multiple chips of different masses but the same volume fall into the first container and are in a first state in the sorting liquid of the first container, the density adjustment unit adds solute to the sorting liquid of the first container in batches according to the mass of the corresponding chip, so as to adjust the density of the sorting liquid and change the chips of the corresponding mass from the first state to the second state in batches. The flow control unit drives the sorting liquid in the first container to flow so that the chip in the second state can be moved from the first container into the second container; The second container contains cleaning fluid for cleaning the chips that enter the second container; a collection unit is provided at the bottom of the second container for collecting the chips that fall onto the collection unit.

2. The chip recycling device according to claim 1, characterized in that, The density adjustment unit includes a storage bin and a feeding mechanism. The storage bin is connected to the feeding mechanism. The storage bin is used to store solute. The feeding mechanism is used to add solute to the sorting liquid in the first container according to the mass of the corresponding chip, so as to adjust the density of the sorting liquid in the first container to change the chip of the corresponding mass from the first state to the second state.

3. The chip recycling device according to claim 2, characterized in that, The bottom of the first container is provided with at least two baffles, and a collection area is formed between two adjacent baffles. The collection area is used to accommodate the chip in the first state.

4. The chip recycling device according to claim 3, characterized in that, The first container includes a first sidewall and a second sidewall disposed opposite to each other. An inlet is provided on the first sidewall, and an outlet is provided on the second sidewall. The second sidewall is a shared sidewall of the first container and the second container. The inlet and the outlet are positioned correspondingly, and the inlet is connected to the flow control unit. The positions of both the inlet and the outlet are higher than the top of the baffle, and the liquid level of the sorted liquid is lower than the height of the inlet relative to the bottom of the first container. The first container and the second container are connected through the outlet; The flow control unit drives the sorting liquid flow within the container to allow the chip in the second state to enter the second container via the outlet.

5. The chip recycling device according to claim 4, characterized in that, The collection unit includes a receiving substrate, the surface of which is provided with a plurality of grooves, the plurality of grooves being matched with the shape of the chip; each groove is provided with an adhesive layer, the adhesive layer being used to adhere to the chip falling into the groove.

6. The chip recycling device according to claim 5, characterized in that, A detection device is also provided on the side wall of the first container. The detection device is positioned higher than the top of the baffle. The detection device is communicatively connected to the density adjustment unit and the flow control unit, respectively. When the detection device detects that the chip is in the first state, the detection device transmits the detection signal to the density adjustment unit and the flow control unit respectively. The density adjustment unit adds solute to the sorting liquid in the first container according to the acquired detection signal. The flow control unit stops driving the flow of the sorting liquid in the first container according to the acquired detection signal. When the detection device detects that the chip is in the second state, the detection device transmits the detection signal to the density adjustment unit and the flow control unit respectively. The density adjustment unit stops adding solute to the sorting liquid in the first container according to the acquired detection signal. The flow control unit drives the sorting liquid in the first container to flow so that the chip in the second state enters the second container through the outlet according to the acquired detection signal.

7. The chip recycling device according to claim 6, characterized in that, The second container is also equipped with a stirring mechanism, which is used to stir the cleaning liquid in the second container at a preset time interval, so that the chip that is not stuck to the groove and has sunk to the bottom of the second container is resuspended.

8. A chip recycling method, characterized in that, The chip recycling apparatus as described in any one of claims 1 to 7 includes the following steps: Preparation steps: Provide a drive backplane, on which multiple chips of different masses but the same volume are bonded; release the chips retained on the drive backplane into the sorting liquid in the first container, and put the multiple chips in the first container in a first state. Separation step: Add solute to the sorting liquid in the first container until the density of the sorting liquid in the first container reaches the first target value, so that some of the chips change from the first state to the second state; Collection step: Drive the sorting liquid in the first container to flow, and transfer the portion of the chip that has reached the second state from the first container into the second container for collection; The separation and collection steps are repeated N times until all the chips are separated from the first container and collected in the second container. In each loop step, the first target value gradually increases relative to the previous loop step, so as to change the chips of different qualities from the first state to the second state in the first container in batches.

9. The chip recycling method according to claim 8, characterized in that, The step of providing a driving backplane on which multiple chips of different masses but the same volume are bonded, releasing the chips retained on the driving backplane into the sorting liquid in the first container, and placing the multiple chips in a first state within the first container includes: Identify the bad spots on the driver backplane, and destroy and remove the chips at the bad spots; Heating the drive backplate melts the bonding material of the remaining chip bonded to the drive backplate, thereby releasing the chip from the drive backplate and dropping it into the first container containing sorting liquid, and causing the chip to sink to the bottom of the first container, reaching the first state. The chips include red, green, and blue chips, and the mass difference between the red, green, and blue chips is greater than or equal to 10%. The red chip, the green chip, and the blue chip all have the same epitaxial layer size, but the electrode widths of the red chip, the green chip, and the blue chip are different.

10. The chip recycling method according to claim 9, characterized in that, The step of driving the sorting liquid flow in the first container to transfer a portion of the chips that have reached the second state from the first container into the second container, and collecting them in the second container, further includes: The chip that has entered the second container is placed in the cleaning solution in the second container for cleaning; The cleaned chip is then transferred to a receiving substrate. The chips transferred to the receiving substrate are dried.

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