An ultrasonic vacuum cleaning device and method for semiconductor precision parts

Abstract

The application relates to the technical field of semiconductor precision part cleaning and purifying, and discloses a semiconductor precision part purifying device and method cooperating with ultrasonic and vacuum cleaning, wherein the semiconductor precision part purifying device cooperating with ultrasonic and vacuum cleaning comprises a cleaning box, a storage box, a sealing cover, a sealing frame, a part containing basket, a linkage support assembly, a sealing element, an ultrasonic generator, a vacuum pump and a drying assembly; a communication pipe is connected between the cleaning box and the storage box, and a bidirectional conveying pump is arranged on the communication pipe. The application has the advantages of reasonable design, simple and convenient operation, realization of vacuum ultrasonic cooperative purifying and cleaning of semiconductor precision parts, effective avoidance of cleaning dead angles, direct drying treatment of the parts in the cleaning box after the purifying of the parts is completed, avoidance of secondary pollution in the transferring process, filtration of sundries in the cleaning medium, and repeated use.

Description

Technical Field

[0001] This invention relates to the field of semiconductor precision component cleaning and purification technology, and in particular to a semiconductor precision component purification device and method using ultrasonic-assisted vacuum cleaning. Background Technology

[0002] Currently, ultrasonic combined with vacuum cleaning has been widely used in the surface cleaning, chip removal and decontamination of precision semiconductor parts. By utilizing the vacuum environment to reduce the gas content of the liquid, and in conjunction with the ultrasonic cavitation effect, it can effectively improve the cleaning and purification effect of the surface and micropores of precision parts. Corresponding vacuum ultrasonic cleaning equipment for semiconductor parts has also emerged in the existing technology.

[0003] However, in practical applications, existing traditional equipment often uses fixed grid frames or hanging baskets to place precision parts, which makes it inconvenient to pick up and put down parts, and the loading and unloading operations are cumbersome. It is also easy to cause parts to collide and be damaged. At the same time, most traditional equipment sets up purification and drying operations separately, and the posture of parts remains relatively fixed during the cleaning and drying process, which can easily form cleaning blind spots and drying dead corners. This can easily lead to incomplete cleaning of the surface and crevices of parts, uneven drying, and the easy retention of water stains, dirt and moisture, which will affect the purification quality of semiconductor precision parts.

[0004] Therefore, this invention proposes a novel ultrasonic-assisted vacuum cleaning device and method for purifying precision semiconductor components to solve the above problems.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of the invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art by proposing an ultrasonic-assisted vacuum cleaning device and method for purifying precision semiconductor components.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] An ultrasonic-assisted vacuum cleaning device for purifying precision semiconductor components includes a cleaning chamber, a storage chamber, a sealing cover, a sealing frame, a component holding basket, a linkage support assembly, a sealing element, an ultrasonic generator, a vacuum pump, and a drying assembly. A connecting pipe connects the cleaning chamber and the storage chamber, and a bidirectional delivery pump is installed on the connecting pipe. The sealing cover and the sealing frame are slidably fitted onto the outer top and inner top of the cleaning chamber, respectively, and the sealing frame is fixedly connected to the sealing cover for sealing the top of the cleaning chamber. The component holding basket is rotatably installed inside the cleaning chamber for holding the components to be purified. The linkage support assembly is located on the sealing cover. The top inner wall of the cleaning chamber is connected to the parts holding basket for linkage control of the lifting and lowering of the parts holding basket and the self-rotation adjustment of the parts holding basket; the sealing element is set on the top of the cleaning chamber and is detachably sealed to the sealing cover to improve the sealing performance between the sealing cover and the sealing frame and the cleaning chamber; the ultrasonic generator is set on the inner wall of the cleaning chamber to achieve ultrasonic purification of the parts in conjunction with the cleaning medium; the vacuum pump is fixedly installed on one side of the cleaning chamber and the air inlet of the vacuum pump is connected to the cleaning chamber; the drying component is set on the sealing cover and the storage box and connected to the linkage support component for drying the purified parts.

[0009] Preferably, the linkage support assembly includes two connecting plates, two sliders, and a servo motor; the two connecting plates are fixedly installed on the top inner wall of the sealing cover and are parallel to each other; the two sliders are respectively fixedly installed on the bottom side of the corresponding connecting plates, one of the sliders is provided with an installation cavity, and the parts holding basket is rotatably installed on the two sliders; the servo motor is fixedly installed in the installation cavity and is connected to the parts holding basket for transmission.

[0010] Preferably, the drying assembly includes a storage tank, a hollow plate, a connecting hose, and a regulating valve; the storage tank is fixedly installed on the top of the storage box; the hollow plate is fixedly installed on one side of two connecting plates that are close to each other, and multiple distribution pipes are fixedly installed on the bottom side of the hollow plate; the connecting hose is fixedly installed on the sealing cover and communicates with the hollow plate and the storage tank; the regulating valve is fixedly installed on the connecting hose.

[0011] Preferably, the sealing element includes an elastic telescopic sealing cover and a magnetic frame; the elastic telescopic sealing cover is fixedly installed on the top of the cleaning tank; the magnetic frame is fixedly installed on the top of the elastic telescopic sealing cover and is attracted and fixed to the inner wall of the top side of the sealing cover.

[0012] Preferably, a sealing groove is provided on the inner wall of the top side of the sealing cover, and the magnetic frame can be detachably and sealingly attached to the sealing groove.

[0013] Preferably, the ultrasonic-assisted vacuum cleaning semiconductor precision component purification device further includes a lifting adjustment assembly, which includes multiple support blocks and multiple electric cylinders. The multiple support blocks are all fixedly installed on the outside of the cleaning tank, and the multiple electric cylinders are respectively fixedly installed on the corresponding support blocks and arranged in parallel with each other. The telescopic ends of the multiple electric cylinders are all fixedly installed on the bottom side of the sealing cover.

[0014] Preferably, the ultrasonic-assisted vacuum cleaning device for semiconductor precision parts further includes an exhaust pipe and an exhaust valve. The exhaust pipe is fixedly installed on the top of the sealing cover and connected to the cleaning chamber, and an exhaust valve is fixedly installed on the exhaust pipe.

[0015] Preferably, the ultrasonic-assisted vacuum cleaning device for purifying semiconductor precision parts further includes a filter plate and a counterweight. The filter plate is rotatably mounted on the inner walls of the front and rear sides of the storage box and is adapted to the outlet of the connecting pipe located inside the storage box. The counterweight is fixedly mounted on the side of the filter plate away from the connecting pipe.

[0016] Preferably, the ultrasonic-assisted vacuum cleaning device for purifying precision semiconductor components further includes a voltage regulator tube, which is fixedly installed on the top of the storage tank and connected to the cleaning tank.

[0017] This invention also provides a method for using an ultrasonic-assisted vacuum cleaning device for purifying precision semiconductor components, comprising the following steps:

[0018] S1: The sealing cover is moved upward by the lifting adjustment component, so that the top of the cleaning box is open. The sealing cover will be controlled by the linkage support component to move the parts holding basket upward to a position that is easy to pick up and put down the parts. An appropriate amount of cleaning medium is injected into the cleaning box. Then the parts that need to be cleaned are placed in the parts holding basket and the sealing cover and parts holding basket are lowered back by the lifting adjustment component. During this process, the sealing cover and sealing frame, together with the sealing element, will achieve a sealed connection between the cleaning box and the sealing cover.

[0019] S2: The space inside the cleaning chamber is evacuated by a vacuum pump. Then, the ultrasonic generator and the cleaning medium work together to clean the parts in the parts holding basket. At the same time, the linkage support component controls the slow rotation of the parts holding basket, thereby avoiding dead corners in the cleaning of the parts and effectively improving the efficiency of the parts cleaning.

[0020] S3: After cleaning, the cleaning medium and impurities in the cleaning tank are extracted into the storage tank by a two-way transfer pump and connecting pipe. When the cleaning medium is transported into the storage tank, the filter plate deflects automatically to prevent impurities from entering the storage tank. Then, the parts in the parts holding basket are dried by the drying component. After drying, drying gas is injected into the cleaning tank to a slightly positive pressure state. Then, the sealing cover is moved upward by the lifting adjustment component to open the cleaning tank. At the same time, the seal is disengaged from the sealing cover. Then, the operator takes out the parts in the parts holding basket.

[0021] Compared with the prior art, the present invention provides a semiconductor precision component cleaning device and method for ultrasonic-assisted vacuum cleaning, which has the following beneficial effects:

[0022] 1. Through the cooperation of the sealing cover, sealing frame and sealing element, good sealing performance can be maintained while lifting the sealing cover to pick up and put down parts, which can meet the working requirements of vacuum cleaning and avoid sealing failure affecting the vacuum purification effect.

[0023] 2. The linkage support component can link the parts holding basket with the sealing cover. When the sealing cover is raised and lowered to open the cleaning box, the parts holding basket can extend synchronously, which greatly facilitates the handling of the parts to be cleaned. At the same time, the parts holding basket can rotate during the cleaning process. Combined with ultrasonic cleaning, it can eliminate purification dead corners and improve the cleaning and purification effect.

[0024] 3. After cleaning, the cleaning medium can be directly transferred to the storage tank, and the parts can be dried directly in the cleaning tank by the drying component. There is no need to transfer the wet parts out of the cleaning tank for drying, which avoids secondary contamination of the parts during the transfer process and effectively improves the processing efficiency of the entire purification process.

[0025] 4. By using filter plates and counterweights installed in the storage tank, impurities will not be blocked from entering when the cleaning medium is conveyed to the storage tank. At the same time, impurities will be automatically filtered when the cleaning medium is conveyed to the cleaning tank, preventing impurities from flowing back into the cleaning tank and affecting subsequent cleaning.

[0026] In summary, this device can achieve vacuum ultrasonic synergistic purification and cleaning of precision semiconductor components. The overall operation is convenient, effectively avoiding cleaning dead spots. After the components are purified, they can be dried directly in the device to avoid secondary contamination during the transfer process. In addition, the cleaning medium can be filtered for easy reuse. Attached Figure Description

[0027] Figure 1 This is a three-dimensional structural schematic diagram of a semiconductor precision component purification device for ultrasonic synergistic vacuum cleaning proposed in this invention.

[0028] Figure 2 In this invention Figure 1 A schematic diagram of the cross-sectional structure;

[0029] Figure 3 for Figure 2 Front view structural diagram;

[0030] Figure 4 This is a schematic diagram of the structure of the sealing cover, sealing frame, and lifting adjustment assembly in this invention;

[0031] Figure 5 This is a schematic diagram of the drying component in this invention;

[0032] Figure 6 This is a schematic diagram of the parts holding basket and servo motor in this invention;

[0033] Figure 7 This is a schematic diagram of the cleaning box and sealing components in this invention.

[0034] In the diagram: 1. Cleaning tank; 11. Storage tank; 12. Connecting pipe; 13. Two-way transfer pump; 14. Filter plate; 141. Counterweight; 15. Pressure stabilizing pipe; 2. Sealing cover; 201. Exhaust pipe; 202. Exhaust valve; 21. Sealing frame; 22. Electric cylinder; 23. Elastic telescopic sealing cover; 231. Magnetic suction frame; 3. Parts holding basket; 301. Servo motor; 31. Slider; 32. Connecting plate; 4. Ultrasonic generator; 5. Storage tank; 51. Connecting hose; 52. Regulating valve; 53. Hollow plate; 54. Distribution pipe; 6. Vacuum pump. Detailed Implementation

[0035] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0036] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0037] Reference Figure 1-7An ultrasonic-assisted vacuum cleaning device for purifying precision semiconductor components includes a cleaning chamber 1, a storage chamber 11, a sealing cover 2, a sealing frame 21, a component holding basket 3, a linkage support assembly, a sealing element, an ultrasonic generator 4, a vacuum pump 6, and a drying assembly. A connecting pipe 12 connects the cleaning chamber 1 and the storage chamber 11, and a bidirectional delivery pump 13, preferably a diaphragm pump, is installed on the connecting pipe 12. The sealing cover 2 and the sealing frame 21 are connected to the outer top and inner top of the cleaning chamber 1 respectively via a sealed sliding fit, and the sealing frame 21 is fixedly connected to the inner top wall of the sealing cover 2 for sealing the top of the cleaning chamber 1. The component holding basket 3 is rotatably installed inside the cleaning chamber 1 for holding the components to be purified. The component holding basket 3 is hollow, and the different storage units for holding the components are preferably drawer-type with magnetic limiting, which avoids interference between the cleaning medium and the components, prevents water accumulation, and facilitates the handling of components.

[0038] The linkage support assembly is set on the top inner wall of the sealing cover 2 and connected to the parts holding basket 3. The linkage support assembly includes two connecting plates 32, two sliders 31 and a servo motor 301. The two connecting plates 32 are fixedly installed on the top inner wall of the sealing cover 2 and are parallel to each other. The two sliders 31 are respectively fixedly installed on the bottom side of the corresponding connecting plates 32. One of the sliders 31 is provided with an installation cavity. The parts holding basket 3 is rotatably installed on the two sliders 31. The servo motor 301 is fixedly installed in the installation cavity and is connected to the parts holding basket 3 by magnetic coupling. This enables linkage control between the parts holding basket 3 and the sealing cover 2, and also enables the parts holding basket 3 to rotate on its own. This improves the cleaning effect of the parts and avoids cleaning dead corners. The magnetic coupling connection between the servo motor 301 and the parts holding basket 3 can prevent the servo motor 301 from being interfered with by adverse factors such as the humid environment inside the cleaning tank 1.

[0039] A sealing element is disposed on the top of the cleaning tank 1 and is detachably and sealingly connected to the sealing cover 2. The sealing element includes an elastic telescopic sealing cover 23 and a magnetic frame 231. The elastic telescopic sealing cover 23 is fixedly installed on the top of the cleaning tank 1. A sealing groove is provided on the inner wall of the top side of the sealing cover 2. The magnetic frame 231 is fixedly installed on the top of the elastic telescopic sealing cover 23 and is attracted and fixed to the inner wall of the top side of the sealing cover 2. The magnetic frame 231 is detachably and sealingly engaged in the sealing groove, which can cooperate with the sealing cover 2 and the sealing frame 21 to achieve the top sealing of the cleaning tank 1, without affecting the opening of the top of the cleaning tank 1, and makes it easy to detach the magnetic frame 231 from the sealing groove when it is necessary to control the opening of the cleaning tank 1.

[0040] An ultrasonic generator 4 is installed on the inner wall of the cleaning chamber 1 to achieve ultrasonic purification of parts in conjunction with the cleaning medium, wherein the cleaning medium is preferably deionized pure water; a vacuum pump 6 is fixedly installed on one side of the cleaning chamber 1, and the air inlet of the vacuum pump 6 is connected to the cleaning chamber 1 for vacuuming the internal space of the cleaning chamber 1.

[0041] The drying assembly is mounted on the sealing cover 2 and the storage tank 11 and connected to the linkage support assembly. The drying assembly includes a storage tank 5, a hollow plate 53, a connecting hose 51, and a regulating valve 52. The storage tank 5 is fixedly installed on the top of the storage tank 11, and the gas stored in the storage tank 5 is preferably dry nitrogen. The hollow plate 53 is fixedly installed on one side of the two connecting plates 32 that are close to each other, and multiple distribution pipes 54 are fixedly installed on the bottom side of the hollow plate 53. The multiple distribution pipes 54 are all connected to the hollow plate 53, and the multiple distribution pipes 54 and the hollow plate 53 form an integrated jet structure. The connecting hose 51 is fixedly installed on the sealing cover 2 and is connected to the hollow plate 53 and the storage tank 5. The regulating valve 52 is fixedly installed on the connecting hose 51, and the regulating valve 52 is preferably an electrically controlled regulating valve, which can dry the parts by blowing nitrogen after the parts are cleaned and purified and the cleaning medium is transferred to the storage tank 11.

[0042] Based on the above, and referring to Figure 1-4 As shown, it also includes a lifting and adjusting assembly, which includes multiple support blocks and multiple electric cylinders 22. The multiple support blocks are all fixedly installed on the outside of the cleaning tank 1, and the multiple electric cylinders 22 are respectively fixedly installed on the corresponding support blocks and arranged in parallel with each other. The telescopic ends of the multiple electric cylinders 22 are all fixedly installed on the bottom side of the sealing cover 2. The multiple electric cylinders 22 are synchronously controlled by a synchronous controller. The number of electric cylinders 22 is not less than two, and preferably four. In addition, the electric cylinders 22 are preferably multi-section electric cylinders, which can adjust the relative position relationship between the sealing cover 2 and the cleaning tank 1 as needed, so as to facilitate the opening and closing of the cleaning tank 1 and the handling of parts.

[0043] Based on the above, and referring to Figure 1-3 As shown, the ultrasonic-assisted vacuum cleaning device for semiconductor precision parts also includes an exhaust pipe 201 and an exhaust valve 202. The exhaust pipe 201 is fixedly installed on the top of the sealing cover 2 and connected to the cleaning chamber 1. The exhaust valve 202 is fixedly installed on the exhaust pipe 201, which can discharge the residual nitrogen in the cleaning chamber 1 after drying.

[0044] Based on the above, and referring to Figure 2-3As shown, the ultrasonic-assisted vacuum cleaning device for purifying semiconductor precision parts also includes a filter plate 14 and a counterweight 141. The filter plate 14 is rotatably mounted on the inner walls of the front and rear sides of the storage box 11 and is adapted to the outlet of the connecting pipe 12 located inside the storage box 11. The counterweight 141 is fixedly mounted on the side of the filter plate 14 away from the connecting pipe 12. When the bidirectional pump 13 delivers the cleaning medium into the storage box 11, it can push the filter plate 14 to deflect, so that the cleaned impurities and cleaning medium can smoothly enter the storage box 11. At the same time, when the bidirectional pump 13 delivers the cleaning medium from the storage box 11 into the cleaning box 1, it can effectively filter the impurities in the cleaning medium, preventing the impurities from returning to the cleaning box 1 and causing accumulation.

[0045] Based on the above, and referring to Figure 2-3 As shown, the ultrasonic-assisted vacuum cleaning semiconductor precision component purification device also includes a voltage regulator 15. The voltage regulator 15 is fixedly installed on the top of the storage box 11 and connected to the cleaning box 1, which can keep the air pressure in the storage box 11 and the cleaning box 1 in the same state, so as to avoid interfering with the normal pumping of the bidirectional delivery pump 13 to the cleaning medium.

[0046] In this embodiment, the cleaning tank 1 is also provided with a liquid level observation window for observing the liquid level of the cleaning medium inside the cleaning tank 1.

[0047] Working principle:

[0048] First, the power is turned on. The synchronous controller controls multiple electric cylinders 22 to extend synchronously, causing the sealing cover 2 to move upward, so that the top of the cleaning tank 1 gradually opens. During this process, the sealing cover 2 drives the slider 31 through the connecting plate 32, so that the parts holding basket 3 moves upward synchronously until it moves to a position that is convenient for picking up and putting in the parts, and then the electric cylinder 22 stops moving. Then, an appropriate amount of deionized pure water is injected into the cleaning tank 1 as a cleaning medium. The liquid level of the cleaning medium should be such that it submerges the slider 31 but does not interfere with the air inlet of the vacuum pump 6 and the inlet of the pressure stabilizing pipe 15 located in the cleaning tank 1. Then, the semiconductor precision parts to be cleaned are placed in the parts holding basket 3 in an orderly manner. The multiple electric cylinders 22 are started again to drive the sealing cover 2 and the parts holding basket 3 to return to their original position. Finally, the sealing cover 2, together with the sealing frame 21, squeezes the magnetic suction frame 231, so that the magnetic suction frame 231 is stuck into the sealing slot. At the same time, the magnetic suction frame 231 is attracted and fixed to the top inner wall of the sealing cover 2, thus completing the sealing connection between the cleaning tank 1 and the sealing cover 2.

[0049] Vacuum pump 6 is started to evacuate the internal space of cleaning chamber 1, and stops working after the set vacuum level is reached. The vacuum level is determined by adding a vacuum sensor according to existing known technology by those skilled in the art. Then, ultrasonic generator 4 is started, and ultrasonic cavitation effect is used in conjunction with cleaning medium to purify and clean the parts in parts holding basket 3. At the same time, servo motor 301 is started. The output shaft of servo motor 301 drives parts holding basket 3 to rotate stably and slowly through magnetic coupling transmission, so that all surfaces of the parts can contact the cleaning medium and eliminate cleaning dead corners.

[0050] After cleaning, the bidirectional transfer pump 13 is started to transport the cleaning medium containing impurities in the cleaning tank 1 to the storage tank 11 through the connecting pipe 12. During the transportation process, the water pressure pushes the filter plate 14 to deflect, allowing the impurities and cleaning medium to smoothly enter the storage tank 11. After the cleaning medium has been completely transported, the regulating valve 52 is opened to transport the dry nitrogen in the storage tank 5 to the hollow plate 53 through the connecting hose 51. The nitrogen is then evenly sprayed out through multiple distribution pipes 54. At the same time, the parts holding basket 3 continues to rotate, thereby drying the parts in the parts holding basket 3. After drying, the regulating valve 52 is closed, and nitrogen is continued to be charged into the cleaning tank 1 to a slightly positive pressure state. Then, the exhaust valve 202 is opened to discharge the residual nitrogen mixed with water vapor from the cleaning tank 1. Then, the sealing cover 2 is moved upward by the electric cylinder 22 to open the cleaning tank 1. Finally, the operator can take out the cleaned semiconductor precision parts from the parts holding basket 3.

[0051] All standard parts used in this invention can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

Claims

1. A semiconductor precision component purification device for ultrasonic-assisted vacuum cleaning, characterized in that, include: A cleaning tank (1) and a storage tank (11) are connected by a connecting pipe (12), and a bidirectional conveying pump (13) is installed on the connecting pipe (12). The sealing cover (2) and the sealing frame (21) are slidably fitted on the top outer side of the cleaning box (1) and the top inner side of the cleaning box (1), respectively, and the sealing frame (21) is fixedly connected to the sealing cover (2) for sealing the top of the cleaning box (1). The parts holding basket (3) is rotatably installed inside the cleaning box (1) for holding the parts to be cleaned; The linkage support assembly is set on the inner wall of the top side of the sealing cover (2) and connected to the parts holding basket (3), and is used for the linkage control of the lifting of the parts holding basket (3) and the sealing cover (2) and the self-rotation adjustment of the parts holding basket (3); A sealing element is provided on the top of the cleaning tank (1) and is detachably and sealingly connected to the sealing cover (2) to improve the sealing performance between the sealing cover (2) and the sealing frame (21) and the cleaning tank (1); An ultrasonic generator (4) is installed on the inner wall of the cleaning tank (1) to achieve ultrasonic cleaning of parts in conjunction with the cleaning medium. A vacuum pump (6) is fixedly installed on one side of the cleaning box (1), and the air inlet of the vacuum pump (6) is connected to the cleaning box (1). A drying assembly, mounted on the sealing cover (2) and the storage box (11) and connected to the linkage support assembly, is used for drying the cleaned parts.

2. The semiconductor precision component purification device for ultrasonic synergistic vacuum cleaning according to claim 1, characterized in that, The linkage support component includes: The two connecting plates (32) are fixedly installed on the inner wall of the top side of the sealing cover (2) and are parallel to each other; Two sliders (31) are fixedly installed on the bottom side of the corresponding connecting plate (32), and one of the sliders (31) has an installation cavity. The parts holding basket (3) is rotatably installed on the two sliders (31). The servo motor (301) is fixedly installed in the mounting cavity and is connected to the parts holding basket (3) for transmission.

3. The semiconductor precision component purification device for ultrasonic synergistic vacuum cleaning according to claim 2, characterized in that, The drying assembly includes: Storage tank (5) is fixedly installed on top of storage box (11); A hollow plate (53) is fixedly installed on one side of two connecting plates (32) that are close to each other, and multiple distribution pipes (54) are fixedly installed on the bottom side of the hollow plate (53); Connecting hose (51) is fixedly installed on sealing cover (2) and connected to hollow plate (53) and storage tank (5); The regulating valve (52) is fixedly installed on the connecting hose (51).

4. The semiconductor precision component purification device for ultrasonic synergistic vacuum cleaning according to claim 1, characterized in that, The sealing element includes: An elastic telescopic sealing cover (23) is fixedly installed on the top of the cleaning tank (1); The magnetic frame (231) is fixedly installed on the top of the elastic telescopic sealing cover (23) and adsorbed and fixed to the inner wall of the top side of the sealing cover (2).

5. The semiconductor precision component purification device for ultrasonic synergistic vacuum cleaning according to claim 4, characterized in that, A sealing slot is provided on the inner wall of the top side of the sealing cover (2), and the magnetic frame (231) can be detachably and sealingly attached to the sealing slot.

6. The semiconductor precision component purification device for ultrasonic synergistic vacuum cleaning according to claim 1, characterized in that, It also includes a lifting adjustment assembly, which includes multiple support blocks and multiple electric cylinders (22). The multiple support blocks are all fixedly installed on the outside of the cleaning tank (1), and the multiple electric cylinders (22) are respectively fixedly installed on the corresponding support blocks and arranged in parallel to each other. The telescopic ends of the multiple electric cylinders (22) are all fixedly installed on the bottom side of the sealing cover (2).

7. The semiconductor precision component purification device for ultrasonic synergistic vacuum cleaning according to claim 1, characterized in that, It also includes an exhaust pipe (201) and an exhaust valve (202). The exhaust pipe (201) is fixedly installed on the top of the sealing cover (2) and connected to the cleaning box (1), and the exhaust valve (202) is fixedly installed on the exhaust pipe (201).

8. The semiconductor precision component purification device for ultrasonic synergistic vacuum cleaning according to claim 1, characterized in that, It also includes a filter plate (14) and a counterweight (141). The filter plate (14) is rotatably mounted on the inner walls of the front and rear sides of the storage box (11) and is adapted to the outlet of the connecting pipe (12) located inside the storage box (11). The counterweight (141) is fixedly mounted on the side of the filter plate (14) away from the connecting pipe (12).

9. The semiconductor precision component purification device for ultrasonic synergistic vacuum cleaning according to claim 1, characterized in that, It also includes a voltage regulator (15), which is fixedly installed on the top of the storage box (11) and connected to the cleaning box (1).

10. A method of using a semiconductor precision component cleaning device for ultrasonic synergistic vacuum cleaning according to any one of claims 1 to 9, characterized in that, Includes the following steps: S1: First, control the sealing cover (2) to move upward through the lifting adjustment component, so that the cleaning box (1) is in the open state. At the same time, control the part holding basket (3) to move upward through the linkage support component to a position that is easy to pick up and put in the parts. Inject an appropriate amount of cleaning medium into the cleaning box (1) and place the parts that need to be cleaned into the part holding basket (3). Then, control the sealing cover (2) and the part holding basket (3) to reset downward through the lifting adjustment component. After resetting, the sealing connection between the cleaning box (1) and the sealing cover (2) is achieved through the cooperation of the sealing cover (2), the sealing frame (21) and the sealing element. S2: The space inside the cleaning box (1) is evacuated by the vacuum pump (6), and the parts in the parts holding basket (3) are cleaned by the ultrasonic generator (4) and the cleaning medium. At the same time, the rotation of the parts holding basket (3) is controlled by the linkage support component, which can effectively improve the efficiency of parts cleaning and avoid dead corners in parts cleaning. S3: After cleaning, the cleaning medium and debris in the cleaning tank (1) are transported to the storage tank (11) by the bidirectional conveying pump (13) and the connecting pipe (12). During this process, the filter plate (14) deflects on its own, so that the debris and cleaning medium can enter the storage tank (11). Then, the parts in the parts holding basket (3) are dried by the drying component. S4: After drying is completed, continue to inject drying gas into the cleaning box (1) through the drying component to a slightly positive pressure state. Then, control the sealing cover (2) to move upward through the lifting adjustment component to control the cleaning box (1) to be in an open state. At the same time, the seal is disconnected from the sealing cover (2). Then the operator takes out the parts in the parts holding basket (3).

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