Semiconductor ultrasonic cleaning machine

Abstract

The application belongs to the technical field of semiconductor cleaning equipment, and particularly relates to a semiconductor ultrasonic cleaning machine, which comprises a cleaning box and a loading component, the loading component is inserted into the inside of the cleaning box, the loading component comprises an external sleeve, an inner rotating sealing plate, a series handle and a clamping component, and the external sleeve is uniformly inserted into the upper part of the cleaning box. When the semiconductor wafer immersed in the water body is cleaned by the cleaning box through the ultrasonic resonance of the water body in the inside, the pressure control air pump controls the sliding rod cylinder to move up and down along the inner wall of the butt joint rod cylinder in circulation through the pressure control, thereby continuously changing the actual height of the semiconductor wafer, avoiding the poor cleaning effect of the semiconductor wafers with the same height caused by the resonance problem, and ensuring that the resonance water body can act on the outer surface of the semiconductor wafer more uniformly through the centrifugal rotation of the clamped semiconductor wafer in the process of vertical sliding under the driving action of the bottom twisting base, thereby improving the cleaning efficiency of the device.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor cleaning equipment technology, specifically a semiconductor ultrasonic cleaning machine. Background Technology

[0002] Currently, ultrasound propagates in liquids, causing the liquid and the cleaning tank to vibrate together at the ultrasonic frequency. The liquid and the cleaning tank have their own inherent frequencies when they vibrate, and these vibration frequencies are sound wave frequencies. With the continuous development of the cleaning industry, more and more industries and enterprises are using ultrasonic cleaning machines. In the semiconductor industry, ultrasonic cleaning machines are used to clean semiconductors.

[0003] In a semiconductor ultrasonic cleaning machine with announcement number CN223888609U, multiple semiconductor wafers are separated by a clamping assembly, and the actual height of the clamping assembly is adjusted up and down to avoid the ultrasonic waves being blocked by semiconductor wafers of the same height, thus preventing mutual interference between the ultrasonic waves received by semiconductor wafers of the same height and the resulting deterioration in cleaning effect. However, in this case, the semiconductor wafers are all set in the series of clamping blocks. When the ultrasonic waves act on the outer surface of the semiconductor wafers through water, they can only vibrate from the front and back sides, resulting in a relatively uniform force-bearing surface on the semiconductor wafers and a decrease in the cleaning efficiency of the device. Therefore, improvements are needed. Summary of the Invention

[0004] To address the difficulty of thoroughly cleaning semiconductor wafers using existing technologies, the present invention provides a semiconductor ultrasonic cleaning machine, comprising a cleaning chamber and a loading component, wherein the loading component is inserted into the interior of the cleaning chamber. The loading component includes an external sleeve, an internal rotating sealing plate, a series handle, and a clamping component; The external sleeves are evenly inserted into the upper part of the cleaning box, and each external sleeve has a connecting rod inserted into its outer surface. The series handles on the left and right sides are respectively inserted into the outer surfaces of the external sleeves on both sides. Since the connecting rod at the axis connects all the external sleeves together, holding the series handles on both sides can pull all the external sleeves upwards simultaneously. The top of the clamping component is inserted into the inner cavity of the inner rotating sealing plate, and the outer surface of the inner rotating sealing plate is rotatably connected to the top of the inner wall of the outer sleeve. The clamping components include a modified slide bar, a docking rod cylinder, a magnetic plug, and a connecting plate. The magnetic plug can be magnetically attached to the lower part near the metal component. The modified slide bar is installed inside the docking rod cylinder, the outer surface of the connecting plate is inserted into the inner cavity of the inner rotating sealing plate, and the top end of the modified slide bar is inserted into the inner cavity of the connecting plate. The inner cavity of the docking rod cylinder is provided with a guide groove. The outer surface of the magnetic plug is engaged with the bottom of the inner wall of the docking rod cylinder. The bottom of the magnetic plug is inserted into the inside of the cleaning box. The assembled outer sleeve is lifted upward by the series handles on both sides. Then, the semiconductor chip to be cleaned is inserted into the clamping component inside each outer sleeve. Subsequently, the loading component is inserted into the cleaning box to perform ultrasonic cleaning on the semiconductor chip. At this time, the cleaning box drives the clamping component to rotate on the axis.

[0005] Furthermore, the modified slide bar includes: A pressure-controlled air pump, the outer surface of which is inserted into the inner cavity of a connecting plate via a connector; A hollow guide tube is inserted at the top end of which is connected to the bottom end of a pressure-controlled air pump. Because the pressure-controlled air pump and the hollow guide tube are restricted by the connecting plate at the top, they are always kept at a fixed height during actual operation. The sliding rod cylinder has its inner wall slidably connected to the outer surface of the hollow guide tube, and its outer surface slidably connected to the inner wall of the docking rod cylinder. A connecting sleeve is fitted onto the bottom of the outer surface of the sliding rod cylinder, and the outer surface of the connecting sleeve is slidably connected to the inner cavity of the docking rod cylinder through a guide groove. When the pressure-controlled air pump pressurizes or depressurizes the inside of the sliding rod cylinder, it can drive the sliding rod cylinder to slide vertically along the inner wall of the hollow guide tube.

[0006] Furthermore, the modified slide bar also includes: A lateral clamping plate is provided, with isolation plates evenly inserted on the outer surface of the lateral clamping plate away from the sliding rod cylinder. The semiconductor sheet is inserted into the gap between the isolation plates of the two lateral clamping plates on both sides to achieve a clamping effect. The adjustable distance push rod has one end inserted into the middle of the outer surface of the side clamping plate, and the other end slidably connected to the inner cavity of the connecting jacket. The adjustable distance push rod can slide laterally along the inner cavity of the connecting jacket. After the side clamping plates on both sides clamp the semiconductor chip, the bolt of the adjustable distance push rod is tightened to achieve the effect of fastening the adjustable distance push rod.

[0007] Furthermore, the cleaning tank includes: The container has symmetrically arranged vibrating components on both sides of its inner wall to vibrate the water inside the container. A water pump is inserted into the left side of the inner cavity of the container, and a water delivery pipe is inserted into the center of the shaft on the outer surface of the water pump. The drain plate is rotatably connected to the right side of the container's inner cavity. When the drain plate is opened, wastewater can be discharged through the drain channel on the right side of the container.

[0008] Furthermore, the cleaning tank also includes: A flip-top cover is symmetrically arranged on both sides of the top of the storage box. The inner cavity of the flip-top cover is evenly provided with reserved openings. The outer surface of the flip-top cover is rotatably connected to the outer surface of the storage box through a rotating joint. The flip handles are symmetrically inserted on both sides of the outer surface of the flip cover; The control panel is located on the front of the storage box; The rotating base is evenly distributed at the bottom of the inner wall of the storage box; Speed-reducing components are symmetrically arranged on both sides of the bottom of the inner wall of the container.

[0009] Furthermore, the torsion base includes: A fixed chassis, the bottom of which is inserted into the bottom of the inner cavity of the container; The rotary table shell has its outer surface rotatably connected to the inner wall of the fixed chassis. The upper surface of the rotary table shell has symmetrically provided grooves on both sides. The bottom of the magnetic plug is inserted into the upper surface of the rotary table shell through the reserved grooves.

[0010] Furthermore, the torsion base also includes: The metal inner sleeve is symmetrically fitted on both sides of the upper part of the inner wall of the rotary table shell, and the inner wall of the metal inner sleeve is inserted into the inner wall of the rotary table shell through a reserved groove. When the magnetic plug is inserted into the reserved groove, the magnetic force of the metal inner sleeve and the magnetic plug will make the docking rod cylinder more firmly inserted into the upper surface of the rotary table shell. A control motor is provided, the bottom of which is inserted into the center of the shaft of the fixed chassis. A filler plug is inserted into the top of the control motor shaft, and the top of the filler plug is inserted into the center of the shaft of the rotary table shell.

[0011] Furthermore, the deceleration element includes: A vertical support plate, the bottom of which is inserted into the bottom of the inner wall of the container, a controller is inserted into the top of the inner cavity of the vertical support plate, and distance sensing elements are evenly arranged on the outer surface of the vertical support plate. A sliding plug has force-receiving push rods symmetrically inserted into its inner cavity. The end of the force-receiving push rod away from the sliding plug is slidably connected to the inner wall of the controller via an inner pulley. The controller can push the sliding plug towards the side closer to the clamping component by pushing the force-receiving push rod.

[0012] Furthermore, the deceleration element also includes: The rotating shaft is rotatably connected to the center of the inner cavity of the sliding plug at its top end. The outer hub sleeve has its inner wall axially connected to the outer surface of the rotating shaft via a bearing, and expansion washers are evenly distributed on the outer surface of the outer hub sleeve.

[0013] The beneficial effects of this invention are as follows: 1. The semiconductor wafer is installed in the loading component of the device. When the cleaning tank cleans the semiconductor wafer submerged in the water through ultrasonic resonance, the pressure-controlled air pump controls the sliding rod cylinder to slide up and down along the inner wall of the docking rod cylinder through pressure control, thereby continuously changing the actual height of the semiconductor wafer. This avoids the semiconductor wafers of the same height from having poor cleaning effect due to resonance. During the vertical sliding process, the held semiconductor wafer also rotates centrifugally under the drive of the bottom torsional base, so that the force surface of the semiconductor wafer is more uniform. This ensures that the resonating water can act more evenly on the outer surface of the semiconductor wafer, thereby improving the cleaning efficiency of the device.

[0014] 2. When the semiconductor wafer rotates centrifugally in the resonant water along with the clamping component, turbulence will be formed between the water and the outer surface of the semiconductor wafer. Impurities detached from the outer surface of the semiconductor wafer will be thrown into the water due to the centrifugal force and the impact of the turbulence. This avoids the problem of impurities detached from the outer surface of the semiconductor wafer adhering to the gap between the side clamping plate and the isolation plate, which would lead to an increase in dirt on the side clamping part of the semiconductor wafer.

[0015] 3. When the loading component is inserted into the cleaning tank, the magnetic plug at the bottom of the docking rod cylinder will insert into the reserved groove of the rotary table shell, achieving a quick connection between the clamping component and the rotary table shell. At the same time, the magnetic plug and the metal inner sleeve will generate a magnetic attraction, increasing the contact stress between the modified slide rod and the reserved groove. This prevents the modified slide rod from slipping on the rotary table shell when it rotates at high speed, thus avoiding the problem of the modified slide rod detaching from the reserved groove.

[0016] 4. After ultrasonic cleaning inside the cleaning chamber, the semiconductor wafers undergo a self-cleaning process by idling before removal to remove water stains adhering to their outer surfaces. During this self-cleaning process, the docking rod cylinder impacts the expansion washer on the outer surface of the outer hub sleeve as it rotates. Each time the docking rod cylinder impacts the expansion washer, it decelerates to prevent the clamping components from rotating too fast during idling. Simultaneously, the vibration generated by the impact is fed back to the clamping components, causing the semiconductor wafers inside the clamping components to vibrate. This dislodgings water stains from the side clamping plates, isolation plates, and the gaps between the semiconductor wafers. Combined with the centrifugal rotation of the clamping components, this further cleans the adhering water stains. Attached Figure Description

[0017] Figure 1 This is the front view of the present invention; Figure 2 This is a cross-sectional view of the present invention; Figure 3 This is a cross-sectional view of the loading component of the present invention; Figure 4 This is a schematic diagram of the modified slide bar of the present invention; Figure 5 This is a cross-sectional view of the sliding rod cylinder of the present invention; Figure 6 This is a cross-sectional view of the container box of the present invention; Figure 7 This is a cross-sectional view of the fixed chassis of the present invention; Figure 8 This is a schematic diagram of the speed-reducing element of the present invention.

[0018] In the diagram: 1. Cleaning tank; 2. Loading component; 21. Connecting handle; 22. External sleeve; 23. Internal rotating sealing plate; 24. Clamping component; 241. Connecting plate; 242. Connecting rod cylinder; 243. Magnetic plug; 25. Modified sliding rod; 251. Pressure-controlled air pump; 252. Hollow guide tube; 253. Sliding rod cylinder; 254. Adjustable push rod; 255. Side clamping plate; 256. Isolation plate; 11. Storage box; 12. Water pump; 13. Drainage rotating plate; 14. 15. Vibration component; 16. Flip cover; 17. Reserved opening; 18. Flip handle; 19. Operation panel; 20. Torsional base; 31. Fixed chassis; 32. Rotary disc shell; 33. Control motor; 34. Filling plug; 35. Reserved groove; 36. Metal inner sleeve; 4. Speed ​​reduction component; 47. Vertical support plate; 48. Distance sensing component; 49. Controller; 40. Sliding plug; 41. Force-bearing push rod; 42. Rotating shaft core; 43. Outer hub sleeve; 44. Expansion washer. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for a particular purpose.

[0020] Example 1, please refer to Figures 1-5 The present invention provides a technical solution: a semiconductor ultrasonic cleaner, comprising a cleaning tank 1 and a loading component 2, wherein the loading component 2 is inserted into the interior of the cleaning tank 1; Loading component 2 includes an outer sleeve 22, an inner rotating sealing plate 23, a series handle 21, and a clamping component 24; The external sleeves 22 are evenly inserted into the upper part of the cleaning box 1, and each external sleeve 22 has a connecting rod inserted into its outer surface. The series handles 21 on the left and right sides are respectively inserted into the outer surface of the external sleeves 22 on both sides. Since the connecting rod at the shaft connects all the external sleeves 22 together, holding the series handles 21 on both sides can pull all the external sleeves 22 upwards simultaneously. The top of the clamping component 24 is inserted into the inner cavity of the inner rotating sealing plate 23, and the outer surface of the inner rotating sealing plate 23 is rotatably connected to the top of the inner wall of the outer sleeve 22. The clamping component 24 includes a modified slide bar 25, a docking rod cylinder 242, a magnetic plug 243, and a connecting plate 241. The magnetic plug 243 can be magnetically attached to the lower part near the metal component. The modified slide bar 25 is set inside the docking rod cylinder 242, the outer surface of the connecting plate 241 is inserted into the inner cavity of the inner rotating sealing plate 23, and the top end of the modified slide bar 25 is inserted into the inner cavity of the connecting plate 241. The inner cavity of the docking rod cylinder 242 is provided with a guide groove. The outer surface of the magnetic plug 243 is engaged with the bottom of the inner wall of the docking rod cylinder 242. The bottom of the magnetic plug 243 is inserted into the inside of the cleaning box 1. The assembled outer sleeve 22 is lifted upward by the series handles 21 on both sides. Then, the semiconductor chip to be cleaned is inserted into the clamping component 24 inside each outer sleeve 22. Subsequently, the loading component 2 is inserted into the cleaning box 1 to perform ultrasonic cleaning on the semiconductor chip. At this time, the cleaning box 1 drives the clamping component 24 to rotate axially.

[0021] Modified slide bar 25 includes: The pressure-controlled air pump 251 has its outer surface inserted into the inner cavity of the connecting plate 241 via a socket. Hollow guide tube 252, the top end of hollow guide tube 252 is inserted into the bottom end of pressure control air pump 251. Because pressure control air pump 251 and hollow guide tube 252 are restricted by the top connecting plate 241, they are always kept at a fixed height position during actual operation. The sliding rod cylinder 253 has its inner wall slidably connected to the outer surface of the hollow guide tube 252, and its outer surface slidably connected to the inner wall of the docking rod cylinder 242. A connecting sleeve is fitted onto the bottom of the outer surface of the sliding rod cylinder 253, and the outer surface of the connecting sleeve is slidably connected to the inner cavity of the docking rod cylinder 242 through a guide groove. When the pressure-controlled air pump 251 pressurizes or depressurizes the interior of the sliding rod cylinder 253, it can drive the sliding rod cylinder 253 to slide vertically along the inner wall of the hollow guide tube 252.

[0022] Modified slider 25 also includes: A side clamping plate 255 has an isolation plate 256 evenly inserted on the outer surface of the side clamping plate 255 away from the sliding rod cylinder 253. The semiconductor sheet is inserted into the gap of the isolation plate 256 of the two side clamping plates 255 respectively to achieve the clamping effect. The adjusting push rod 254 has one end inserted into the middle of the outer surface of the side clamping plate 255, and the other end slidably connected to the inner cavity of the connecting jacket. The adjusting push rod 254 can slide laterally along the inner cavity of the connecting jacket. After the side clamping plates 255 on both sides clamp the semiconductor chip, the bolt part of the adjusting push rod 254 is tightened to achieve the effect of fastening the adjusting push rod 254.

[0023] First, all the external sleeves 22 and clamping components 24 are pulled out from the inside of the cleaning box 1 by lifting the two series handles 21 on both sides. Then, the semiconductor wafers to be cleaned are loaded into the clamping components 24 inside each external sleeve 22.

[0024] After the semiconductor wafers are installed, the loading component 2 is inserted into the cleaning tank 1. Then, water is injected into the cleaning tank 1 by the water pump 12 on the left side. Then, the internal vibration component 14 is activated so that the semiconductor wafers immersed in the water are subjected to ultrasonic vibration to achieve the cleaning work.

[0025] When loading a semiconductor wafer, the semiconductor wafer is vertically inserted into the area between the two lateral clamping plates 255, and then clamped by the two isolation plates 256. Then, the nut of the adjusting push rod 254 is screwed to fix the lateral clamping plate 255, thus completing the work of clamping the semiconductor wafer.

[0026] When the semiconductor wafer is immersed in the cleaning tank 1 for ultrasonic cleaning, the pressure control air pump 251 at the top will pressurize and then depressurize the inside of the sliding rod cylinder 253 through the hollow guide tube 252 in a cyclical pressure control operation. At this time, the sliding rod cylinder 253 slides vertically along the outer surface of the hollow guide tube 252 under the action of pressure, thereby driving the held semiconductor wafer to reciprocate in a vertical height.

[0027] Example 2, please refer to Figures 1-8 The present invention provides a technical solution: based on embodiment 1, the cleaning tank 1 includes: The container 11 has symmetrically arranged vibration components 14 on both sides of its inner wall. The vibration components 14 on both sides vibrate the water inside the container 11. The water pump 12 is inserted into the left side of the inner cavity of the container 11, and a water delivery pipe is inserted into the shaft of the outer surface of the water pump 12. The drain plate 13 is rotatably connected to the right side of the inner cavity of the container 11. When the drain plate 13 is opened, wastewater can be discharged through the drain channel on the right side of the container 11.

[0028] Cleaning tank 1 also includes: The flip cover 15 is symmetrically arranged on both sides of the top of the storage box 11. The inner cavity of the flip cover 15 is evenly provided with reserved openings 16. The outer surface of the flip cover 15 is rotatably connected to the outer surface of the storage box 11 through a rotating joint. The flip handle 17 is symmetrically inserted into both sides of the outer surface of the flip cover 15; The control panel 18 is located on the front of the storage box 11; The rotating base 3 is evenly distributed at the bottom of the inner wall of the storage box 11; Speed ​​reduction element 4 is symmetrically arranged on both sides of the bottom of the inner wall of the container 11.

[0029] The torsion base 3 includes: The base 31 is fixed, and the bottom of the base 31 is inserted into the bottom of the inner cavity of the container 11. The outer surface of the rotary table shell 32 is rotatably connected to the inner wall of the fixed base 31. The two sides of the upper surface of the rotary table shell 32 are symmetrically provided with reserved grooves 35. The bottom of the magnetic plug 243 is inserted into the upper surface of the rotary table shell 32 through the reserved grooves 35.

[0030] The torsion base 3 also includes: The metal inner sleeve 36 is symmetrically fitted on both sides of the upper part of the inner wall of the rotary table shell 32, and the inner wall of the metal inner sleeve 36 is inserted into the inner wall of the rotary table shell 32 through the reserved groove 35. When the magnetic plug 243 is inserted into the reserved groove 35, the magnetic force of the metal inner sleeve 36 and the magnetic plug 243 will make the docking rod cylinder 242 more firmly inserted into the upper surface of the rotary table shell 32. A control motor 33 is inserted at its bottom into the center of the inner wall of the fixed chassis 31. A filling plug 34 is inserted at the top of the control motor 33's rotating shaft, and the top of the filling plug 34 is inserted into the center of the inner cavity of the rotary table shell 32.

[0031] Speed ​​reduction element 4 includes: A vertical support plate 41 is inserted into the bottom of the inner wall of the container 11. A controller 43 is inserted into the top of the inner cavity of the vertical support plate 41. A distance sensing element 42 is evenly arranged on the outer surface of the vertical support plate 41. The sliding plug 44 has a force-receiving push rod 45 symmetrically inserted into its inner cavity. The end of the force-receiving push rod 45 away from the sliding plug 44 is slidably connected to the inner wall of the controller 43 through an inner pulley. The controller 43 can push the sliding plug 44 towards the side closer to the clamping component 24 by pushing the force-receiving push rod 45.

[0032] Speed ​​reduction element 4 also includes: Rotate the shaft core 46, and the top end of the rotating shaft core 46 is rotatably connected to the axis of the inner cavity of the sliding plug 44; The outer hub sleeve 47 is connected to the outer surface of the rotating shaft core 46 at the axial center of the inner wall of the outer hub sleeve 47 through a bearing. Expansion washers 48 are evenly provided on the outer surface of the outer hub sleeve 47.

[0033] When the clamping components 24 are uniformly inserted into the storage box 11, the bottom end of the docking rod cylinder 242 is inserted into the reserved groove 35 of the corresponding rotary disc shell 32 through the magnetic plug 243. The connection strength between the modified slide rod 25 and the rotary disc shell 32 is simply strengthened by the adsorption of the magnetic plug 243 and the metal inner sleeve 36. When the vibrating component 14 vibrates the water, the control motor 33 inside each fixed chassis 31 also drives the rotary disc shell 32 to rotate in a circle by twisting the filling plug 34. At this time, the semiconductor chip clamped by the side plate 255 also rotates in a circle, thereby continuously changing the facing point of the outer surface of the semiconductor chip, making the force surface of the semiconductor chip more uniform. Furthermore, the semiconductor chip rotating in the water can throw off the impurity particles that detach from the outer surface through centrifugal force, thereby achieving the effect of reducing residual impurities.

[0034] After the vibration component 14 inside the cleaning tank 1 finishes working, first open the drain plate 13 on the right side to completely drain the wastewater inside. Then start the torsion base 3 to drive the corresponding clamping component 24 to rotate freely, so as to shake off the water stains on the clamping component 24 and the outer surface of the semiconductor chip, reducing the water residue on the outer surface. After the cleaning is completed, pull out the loading component 2 to remove the semiconductor chip inside. Then, flip the flip cover 15 on both sides by pulling the flip handle 17 to fully open the top of the cleaning tank 1 and perform maintenance and cleaning work inside the cleaning tank 1.

[0035] During self-cleaning, when each torsion base 3 drives the clamping component 24 to rotate axially, the rotating docking rod cylinders 242 on both sides will rotate as equivalent to cylinders on the corresponding circumference. At this time, the vertical support plates 41 on the front and rear sides, by activating the top controller 43, push the force-bearing push rod 45 towards the rotating docking rod cylinder 242. Subsequently, the docking rod cylinder 242 will collide with the expansion washer 48 on the outer surface of the outer hub sleeve 47 during rotation. With the precise control of the distance sensing element 42, the docking rod cylinder 242 will not collide with the outer hub sleeve 47, while the expansion washer 48 will expand after being impacted. The outer hub sleeve 47 will rotate along the outer surface of the rotating shaft core 46 under the impact to achieve the force relief effect, and will not completely jam the docking rod cylinder 242. Therefore, the docking rod cylinder 242 will decelerate every time it hits the expansion washer 48 to prevent the clamping component 24 from rotating too fast when it is idling. At the same time, the vibration generated by the impact will be fed back to the clamping component 24, causing the semiconductor plate set inside the clamping component 24 to vibrate, thereby shaking off the water stains in the gap between the side clamping plate 255, the isolation plate 256 and the semiconductor plate. Combined with the centrifugal rotation of the clamping component 24, the attached water stains are further cleaned.

[0036] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A semiconductor ultrasonic cleaner, comprising a cleaning chamber (1) and a loading component (2), the loading component (2) being inserted into the interior of the cleaning chamber (1); Its features are: The loading component (2) includes an outer sleeve (22), an inner rotating sealing plate (23), a series handle (21), and a clamping component (24). The external sleeves (22) are evenly inserted into the upper part of the cleaning box (1), and each external sleeve (22) has a connecting rod inserted into its outer surface. The series handles (21) on the left and right sides are respectively inserted into the outer surface of the external sleeves (22) on both sides. The top of the clamping component (24) is inserted into the inner cavity of the inner rotating sealing plate (23), and the outer surface of the inner rotating sealing plate (23) is rotatably connected to the top of the inner wall of the outer sleeve (22). The clamping component (24) includes a modified slide bar (25), a docking rod cylinder (242), a magnetic plug (243), and a connecting plate (241). The modified slide bar (25) is installed inside the docking rod cylinder (242), the outer surface of the connecting plate (241) is inserted into the inner cavity of the inner rotating sealing plate (23), and the top end of the modified slide bar (25) is inserted into the inner cavity of the connecting plate (241). The inner cavity of the docking rod cylinder (242) is provided with a guide groove. The outer surface of the magnetic plug (243) is engaged with the bottom of the inner wall of the docking rod cylinder (242). The bottom of the magnetic plug (243) is inserted into the inside of the cleaning box (1). The assembled outer sleeve (22) is lifted upward by the series handles (21) on both sides. Then, the semiconductor wafer to be cleaned is inserted into the clamping component (24) inside each outer sleeve (22). Then, the loading component (2) is inserted into the cleaning box (1) to perform ultrasonic cleaning on the semiconductor wafer. At this time, the cleaning box (1) drives the clamping component (24) to rotate axially.

2. The semiconductor ultrasonic cleaning machine according to claim 1, characterized in that: The modified slide bar (25) includes: A pressure-controlled air pump (251) has its outer surface inserted into the inner cavity of a connecting plate (241) via a socket. A hollow guide tube (252) is inserted at the top end of a pressure-controlled air pump (251); The inner wall of the sliding rod cylinder (253) is slidably connected to the outer surface of the hollow guide tube (252), and the outer surface of the sliding rod cylinder (253) is slidably connected to the inner wall of the docking rod cylinder (242). A connecting sleeve is fitted to the bottom of the outer surface of the sliding rod cylinder (253), and the outer surface of the connecting sleeve is slidably connected to the inner cavity of the docking rod cylinder (242) through a guide groove.

3. The semiconductor ultrasonic cleaning machine according to claim 2, characterized in that: The modified slide bar (25) also includes: A lateral clamping plate (255) has a side surface of which is evenly fitted with a partition plate (256) on the side away from the sliding rod cylinder (253). An adjustable push rod (254) is provided, one end of which is inserted into the middle of the outer surface of the side plate (255), and the other end of which is slidably connected to the inner cavity of the connecting jacket.

4. The semiconductor ultrasonic cleaning machine according to claim 1, characterized in that: The cleaning tank (1) includes: Storage box (11), on both sides of the inner wall of the storage box (11) are symmetrically provided with vibration components (14). A water pump (12) is inserted into the left side of the inner cavity of the container (11), and a water delivery pipe is inserted into the shaft of the outer surface of the water pump (12); The drain plate (13) is rotatably connected to the right side of the inner cavity of the container (11).

5. The semiconductor ultrasonic cleaning machine according to claim 4, characterized in that: The cleaning tank (1) also includes: A flip cover (15) is symmetrically arranged on both sides of the top of the container (11). The inner cavity of the flip cover (15) is evenly provided with reserved openings (16). The outer surface of the flip cover (15) is rotatably connected to the outer surface of the container (11) through a rotating joint. A flip handle (17) is symmetrically inserted on both sides of the outer surface of the flip cover (15); The control panel (18) is located on the front of the storage box (11); The rotating base (3) is evenly distributed at the bottom of the inner wall of the container (11); Speed-reducing elements (4) are symmetrically arranged on both sides of the bottom of the inner wall of the container (11).

6. The semiconductor ultrasonic cleaning machine according to claim 5, characterized in that: The torsion base (3) includes: A fixed chassis (31) is inserted into the bottom of the inner cavity of the container (11); The outer surface of the rotary disk shell (32) is rotatably connected to the inner wall of the fixed chassis (31). The upper surface of the rotary disk shell (32) is symmetrically provided with reserved grooves (35) on both sides. The bottom of the magnetic plug (243) is inserted into the upper surface of the rotary disk shell (32) through the reserved grooves (35).

7. The semiconductor ultrasonic cleaning machine according to claim 6, characterized in that: The torsion base (3) also includes: Metal inner sleeve (36) is symmetrically sleeved on both sides of the upper part of the inner wall of the rotary table shell (32), and the inner wall of the metal inner sleeve (36) is inserted into the inner wall of the rotary table shell (32) through a reserved groove (35). A control motor (33) is inserted at the bottom of the control motor (33) into the center of the inner wall of the fixed chassis (31). A filler plug (34) is inserted at the top of the control motor (33) shaft. The top of the filler plug (34) is inserted into the center of the inner cavity of the rotary table shell (32).

8. The semiconductor ultrasonic cleaning machine according to claim 5, characterized in that: The deceleration element (4) includes: A vertical support plate (41) is inserted into the bottom of the inner wall of the container (11), and a controller (43) is inserted into the top of the inner cavity of the vertical support plate (41). A distance sensing element (42) is uniformly arranged on the outer surface of the vertical support plate (41). A sliding plug (44) has a force-bearing push rod (45) symmetrically inserted into its inner cavity. The end of the force-bearing push rod (45) away from the sliding plug (44) is slidably connected to the inner wall of the controller (43) through an inner pulley.

9. The semiconductor ultrasonic cleaning machine according to claim 8, characterized in that: The deceleration element (4) also includes: Rotate the shaft core (46), the top end of which is rotatably connected to the axis of the inner cavity of the sliding plug (44); The outer hub sleeve (47) is connected to the outer surface of the rotating shaft core (46) at the axial center of the inner wall of the outer hub sleeve (47) through a bearing. The outer surface of the outer hub sleeve (47) is uniformly provided with expansion washers (48).

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