Chip tray integrated dust removal device

Abstract

The application discloses a kind of chip tray integration dust removal device, it is related to the technical field of semiconductor chip packaging.The device includes rack, empty tray dust removal mechanism and finished product tray dust removal mechanism.Empty tray dust removal mechanism is transferred between first placement assembly, first dust removal module and second placement assembly by first transfer module, and first dust removal module adopts the closed loop flow field of blowing and sucking mirror image arrangement to the tray double face synchronous dust removal.Finished product tray dust removal mechanism is sent into dust removal station by linear conveying module, and the protective assembly of protective net is driven by lower pressure assembly and adheres to the surface of chip, and second transfer module drives dust removal suction head to scan and adsorb dust above protective net.The device integrates two kinds of dust removal mode of empty tray and finished product tray, effectively prevents dust secondary pollution and protects chip from contact damage, dust removal efficiency is high, consistency is good, and it is suitable for tray high cleanliness processing needs in semiconductor packaging production line.

Description

Technical Field

[0001] This application relates to the field of semiconductor chip packaging technology, and in particular to an integrated dust removal device for chip trays. Background Technology

[0002] In the semiconductor chip packaging, testing, and storage transfer processes, chip trays (also known as material trays or empty material boxes) are standardized carriers for holding chips, wafers, and other micro-precision components. Chips themselves are devices with micron-level precision, requiring extremely high cleanliness of the working environment. Micron-level dust, debris, static electricity particles, and other contaminants, once adhering to the chip surface or pin areas, can easily cause serious quality problems such as chip short circuits, pin scratches, poor packaging bonding, test failures, and even the scrapping of entire batches. Therefore, industry standards strictly require chip trays to undergo thorough dust removal and purification treatment before being put into production lines and after being recycled and reused to ensure that there are no residual particles on the tray surface or in the receiving slots.

[0003] Currently, the commonly used dust removal method is manual operation: the operator holds a compressed air gun in one hand to blow away the surface of the tray, while the other hand, or through a simple stand, holds a negative pressure suction pipe to collect the dust while blowing. This operating mode relies on equipment that is essentially an open chamber or semi-open workstation. When the high-pressure airflow impacts the tray surface, the adhering dust is instantly thrown up and spreads randomly in all directions. The simple negative pressure fan, operating in an open environment, cannot create a directional, closed collection flow field, and a large amount of the thrown dust cannot be captured in time. Some of the dust will fall back down with the turbulence and deposit on the cleaned tray surface, causing secondary pollution and posing a risk of damage to the chips. Furthermore, manual handheld blowing and suction is inefficient, makes it difficult to guarantee consistent cleaning, and lacks effective differentiated and protective dust removal methods for the upper and lower surfaces of the tray, as well as for finished product trays containing chips. Summary of the Invention

[0004] The technical problem to be solved by the present invention is that the existing chip tray dust removal methods mostly involve manual hand-held air gun blowing combined with negative pressure suction. In an open environment, the impact of high-pressure airflow can easily cause dust to spread disorderly and be deposited again on the surface of the cleaned tray, resulting in poor cleaning consistency. Furthermore, there is a lack of effective dust removal methods to differentiate between empty trays and finished product trays. When removing dust from finished product trays, the chips are easily damaged by airflow impact or contact.

[0005] The technical solution adopted in this invention is to provide an integrated dust removal device for chip trays, including a frame and an empty tray dust removal mechanism and a finished product tray dust removal mechanism disposed on the frame. The empty tray dust removal mechanism transfers the empty tray between a first placement component, a first dust removal module, and a second placement component via a first transfer module. The first dust removal module uses a closed-loop blow-suction flow field arranged in a mirror image to synchronously remove dust from both sides of the tray. The finished product tray dust removal mechanism sends the tray loaded with chips into the dust removal station via a linear conveying module. A pressing component drives a protective component with a protective mesh to adhere to the chip surface for physical isolation. The second transfer module drives the dust removal suction head to scan and adsorb dust above the protective mesh. Through the above structure, integrated dust removal processing of empty trays and finished product trays is achieved.

[0006] The specific technical solution of this invention is as follows: an integrated dust removal device for chip trays, comprising: a frame; an empty tray dust removal mechanism disposed on the frame, including a first dust removal module, a first transfer module, a first placement component, and a second placement component, wherein the first placement component and the second placement component are respectively disposed on both sides of the first dust removal module, the first transfer module having an adsorption gripper, the adsorption gripper being horizontally movable above the first placement component, the first dust removal module, and the second placement component; and a finished product tray dust removal mechanism disposed on the frame, including at least one set of a second dust removal module, a second transfer module, and a connection to the second dust removal module. The dust removal module is equipped with at least one set of feeding components. The second dust removal module includes a dust removal nozzle, a pressing component, and a protective component. The pressing component includes a pressing cylinder and a pressing plate fixed to the output end of the pressing cylinder. The protective component is fixed to the pressing plate and includes a protective net. The feeding component includes a linear conveying module and a feeding plate fixed to the output end of the linear conveying module. The feeding plate is located below the pressing plate. The second transfer module has horizontal and vertical degrees of freedom of movement. The dust removal nozzle is fixed to the drive end of the second transfer module and is located above the protective net.

[0007] The aforementioned integrated dust removal device for chip trays includes a first placement component and a second placement component with the same structure, both comprising: a storage rack, which is a cubic frame formed by four vertical rods; a material level sensor, fixedly installed on the vertical rods, with its detection end facing the inside of the storage rack; a lifting cylinder, vertically installed directly below the storage rack, with its cylinder body fixedly connected to the frame; and a lifting plate, horizontally fixed to the piston rod end of the lifting cylinder, the outer contour dimension of the lifting plate being smaller than the inner frame dimension of the storage rack, and the lifting plate being raised and lowered on the inner side of the vertical rods.

[0008] In the aforementioned integrated dust removal device for chip trays, the first transfer module is a linear module with a drag chain, and the adsorption gripper is fixedly installed on the slide of the linear module.

[0009] The aforementioned integrated dust removal device for chip trays includes a first dust removal module comprising: a dust removal box with a placement slot in its middle; an upper dust removal component and a lower dust removal component, which are respectively integrated into the dust removal box. The upper dust removal component and the lower dust removal component are arranged in a mirror image opposite each other directly above and below the placement slot, and their respective dust removal ends face the placement slot.

[0010] The aforementioned integrated dust removal device for chip trays has the same structure for both the upper and lower dust removal components, each comprising: an outer shell, which has a trapezoidal cross-section perpendicular to its length, with the upper base at the top and the lower base at the bottom, open as an adsorption end face; an adsorption pipe, fixedly connected to the upper base of the trapezoidal outer shell and communicating with the internal space of the outer shell; an inner shell, housed inside the outer shell, which has a trapezoidal cross-section and a smaller external dimension than the outer shell, with a uniform gap between the outer wall of the inner shell and the inner wall of the outer shell to form a surrounding air passage, which is divided into two paths extending along the two sides of the trapezoidal inner shell, converging at the top region of the inner shell and communicating with the adsorption pipe; a fan installed in the internal space of the inner shell; and an air inlet pipe fixedly disposed on the inner wall of the inner shell, with its inlet end passing through the inner shell and the outer shell wall.

[0011] In the aforementioned integrated dust removal device for chip trays, the linear conveying module of the feeding component is a linear module with a drag chain.

[0012] In the aforementioned integrated dust removal device for chip trays, the second transfer module is a two-axis transfer module, whose drive end moves linearly in both the horizontal and vertical directions.

[0013] The aforementioned integrated dust removal device for chip trays includes two pressing cylinders in the pressing assembly. The two pressing cylinders are vertically installed on both sides of the end of the conveying path of the linear conveying module. The output ends of the two pressing cylinders are arranged vertically downward and are fixedly connected to a horizontal pressing plate.

[0014] The aforementioned integrated dust removal device for chip trays further includes the following protective components: a mounting frame fixed to the lower pressure plate, the mounting frame having two through-type clearance slots, the solid portion between the two clearance slots forming a crossbeam; and a tensioning component including three tensioning rods, a U-shaped plate, and two L-shaped plates, the U-shaped plate being fixed to the bottom of the crossbeam and having a downward-opening U-shaped groove, one tensioning rod being fixedly installed in the U-shaped groove, and the two L-shaped plates being respectively fixed to the two side edges of the mounting frame and located between the two clearance slots. At the mutually distant sides, each of the L-shaped plates has an inwardly opening L-shaped groove, and two additional tension rods are respectively disposed in the two L-shaped grooves; one end of the protective net is fixedly wound around the tension rod in one L-shaped groove, and the other end is fixedly wound around the tension rod in the other L-shaped groove; the middle section of the protective net goes down and wraps around the tension rod in the U-shaped groove; the protective net is tensioned by the three tension rods, the end edges of the U-shaped plates and the edges of the L-shaped plates, and covers the area below the mounting frame.

[0015] The aforementioned integrated dust removal device for chip trays includes a finished product tray dust removal mechanism comprising multiple sets of second dust removal modules and multiple sets of feeding components. The multiple sets of second dust removal modules and the multiple sets of feeding components are arranged in a one-to-one correspondence and are arranged in parallel on the frame.

[0016] The beneficial effects of this invention are: 1. Enables integrated dust removal for both empty and finished pallets, allowing for compatibility of two operating modes on the same equipment, significantly reducing equipment space requirements and transfer steps, and improving overall production line efficiency.

[0017] 2. The empty pallet dust removal system adopts a closed-loop airflow field with a mirrored arrangement of blowing and suction. Through the synergistic effect of positive pressure blowing by the fan and negative pressure suction by the adsorption pipe, the stripped dust is directionally drawn into the air passage and discharged in time, effectively preventing dust escape and secondary deposition, and achieving deep double-sided cleaning of the pallet.

[0018] 3. The finished product tray dust removal system uses a protective mesh to physically isolate the chip components. The dust removal head only absorbs dust through the holes in the protective mesh, avoiding direct contact between the head and the chip or damage from suction. This ensures that fine particles are removed, balancing efficient dust removal with device safety.

[0019] 4. The protective components adopt a multi-point tensioning structure with three tensioning rods, U-shaped plates, and L-shaped plates, so that the protective net forms a continuous and flat coverage surface that fits tightly against the tray surface. The clearance groove structure provides movement space for the suction head to scan, ensuring that there are no dead corners in dust removal.

[0020] 5. Multiple sets of feeding components and the second dust removal module can be arranged in parallel, with each channel operating independently. This supports simultaneous or alternating dust removal of multiple finished product pallets, significantly improving batch processing capacity and meeting production line cycle time requirements.

[0021] 6. Empty pallet transfer adopts a linear module and adsorption gripper in conjunction with a lifting cylinder for automatic material handling. Finished pallets are automatically moved in and out of the workstation by the linear conveyor module. The entire process requires no manual intervention, has good dust removal effect, reduces labor intensity and eliminates the uncertainty of human operation. Attached Figure Description

[0022] Figure 1 It is a three-dimensional view of the device; Figure 2 This is a partial view of the device, mainly showing the dust collection box; Figure 3 It is a 3D view of where the components are placed; Figure 4 This is a 3D view of the first dust removal module; Figure 5 This is a cross-sectional view of the upper dust removal component; Figure 6 This is a three-dimensional view of the dust removal mechanism for finished product pallets; Figure 7 This is a 3D view of the second dust removal module; Figure 8 This is a detailed structural view of the second dust removal module; Figure 9 This is a three-dimensional view of the tensioning component.

[0023] Explanation of reference numerals in the attached drawings: 1. Frame; 11. Outer shell; 12. Inner shell; 13. Fan; 14. Air inlet duct; 15. Air passage; 16. Adsorption duct; 17. Dust collection box; 18. Placement slot; 21. First transfer module; 211. Adsorption gripper; 22. Storage rack; 23. Vertical rod; 24. Material level sensor; 25. Lifting cylinder; 26. Lifting plate; 3. Second transfer module; 31. Dust collection nozzle; 32. Pressing cylinder; 33. Pressing plate; 34. Mounting frame; 35. Clearance slot; 36. Crossbeam; 41. Tensioning rod; 42. Protective net; 43. L-shaped plate; 44. U-shaped plate; 51. Linear conveyor module; 52. Feed plate. Detailed Implementation

[0024] In the description of this invention, it should be understood that the terms center, longitudinal, transverse, length, width, thickness, front, back, left, right, upper, lower, axial, radial, vertical, horizontal, inner, and outer, indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Furthermore, the terms first and second are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as first or second may explicitly or implicitly include one or more of that feature. In the description of this invention, "multiple" means two or more, unless otherwise explicitly specified.

[0025] This solution proposes an integrated dust removal device for chip trays, referring to... Figure 1 and Figure 6 The device includes a frame 1 as a supporting base, on which an empty pallet dust removal mechanism and a finished pallet dust removal mechanism are arranged to achieve integrated dust removal processing for empty pallets without chips and finished pallets with chips.

[0026] Reference Figure 1 and Figure 2 The empty pallet dust removal mechanism consists of a first dust removal module, a first transfer module 21, a first placement component, and a second placement component. The first placement component and the second placement component are respectively located on both sides of the first dust removal module. They adopt the same structural form and are responsible for receiving empty pallets to be dusted and empty pallets that have been dusted, respectively.

[0027] Reference Figure 2 and Figure 3 Taking one set of placement components as an example, the placement component includes a storage rack 22, which is a cubic frame formed by four vertical rods 23. Its internal space is used for stacking and loading pallets. A level sensor 24 is fixedly installed on each vertical rod 23, with its detection end facing the pallet stacking area, to detect in real time whether there are still pallets on the storage rack 22. The placement component also includes a lifting cylinder 25, which is vertically installed directly below the storage rack 22, and its cylinder body is fixedly connected to the frame 1. A horizontal lifting plate 26 is fixedly installed at the piston rod end of the lifting cylinder 25. The outer contour dimension of the lifting plate 26 is smaller than the inner frame dimension of the storage rack 22, allowing it to move freely up and down inside the vertical rods 23. The lifting plate 26 is used to lift the entire stack of pallets from the bottom, delivering the top pallet to a predetermined gripping height through an upward movement, cooperating with the first transfer module 21 to complete the pallet-by-pallet transfer.

[0028] The first transfer module 21 is a linear module with a cable chain, and its slide serves as the drive end, reciprocating in the horizontal direction. An adsorption gripper 211 is fixedly installed on the drive end, which can grip and release the tray using a negative pressure suction cup or similar method. The complete working process of the first transfer module 21 is as follows: after gripping the empty, dust-free tray located on the first placement component, it is first transferred to the first dust removal module for dust removal. After the dust removal process is completed, the clean tray is then transferred and placed on the second placement component.

[0029] Reference Figure 1 , Figure 4 and Figure 5 The first dust removal module includes a dust removal box 17, with a placement slot 18 in the middle. The space of the placement slot 18 is just large enough to accommodate a tray placed horizontally, ensuring that both the upper and lower surfaces of the tray are within the effective range of the dust removal components. An upper dust removal assembly and a lower dust removal assembly are integrated within the dust removal box 17. The upper and lower dust removal assemblies have identical structures and are arranged in a mirror image opposite each other directly above and below the placement slot 18, with their respective dust removal ends facing each other towards the tray inside the placement slot 18.

[0030] The specific structure of one dust removal assembly is described below. The dust removal assembly includes an outer shell 11, which has a trapezoidal cross-section perpendicular to its length. The upper base of the trapezoid is at the top, and the lower base is at the bottom, open as an adsorption end face. An adsorption pipe 16 is fixedly connected to the top of the outer shell 11, communicating with the internal space of the outer shell 11 and leading to an external negative pressure generation and dust collection system. Inside the outer shell 11 is an inner shell 12, also trapezoidal in cross-section, but smaller in size than the outer shell 11, allowing the inner shell 12 to be fully contained within the outer shell 11. A uniform gap is maintained between the outer wall of the inner shell 12 and the inner wall of the outer shell 11, forming a surrounding air passage 15. This air passage 15 is specifically divided into two paths, extending upwards along the two sides of the trapezoid of the inner shell 12, converging at the top region of the inner shell 12, and communicating with the adsorption pipe 16 at the top of the outer shell 11. The adsorption pipe 16 is fixedly installed at the upper bottom of the trapezoidal outer shell 11; the planes where the lower bottoms of the trapezoidal outer shell 11 and inner shell 12 are located together constitute the adsorption end face.

[0031] A fan 13 is installed inside the inner housing 12, with the airflow direction of the fan 13 facing the placement slot 18. That is, the fan 13 of the upper dust removal component blows downwards, and the fan 13 of the lower dust removal component blows upwards. An air inlet duct 14 is fixedly installed on the inner wall of the inner housing 12. The inlet end of the air inlet duct passes through the walls of the inner housing 12 and the outer housing 11 and is connected to an external clean air source. When the device is running, clean air is introduced into the inner housing 12 through the air inlet duct 14, pressurized and accelerated by the fan 13, and blown onto the surface of the tray placed in the placement slot 18. The strong airflow blows the dust particles on the tray off the surface and lifts them up. At the same time, the adsorption pipe 16 continuously performs negative pressure suction. The airflow carrying dust is immediately drawn into the air passage 15 between the outer housing 11 and the inner housing 12 under the combined action of the positive pressure at the outlet of the fan 13 and the negative pressure in the adsorption pipe 16. It then flows upwards along the air passage 15 on both sides of the trapezoid and finally merges into the adsorption pipe 16 and is completely drawn away. The upper and lower dust removal components act on the upper and lower surfaces of the tray, respectively, achieving deep dust removal on both sides of the tray through a closed-loop blow-suction flow field. After the first transfer module 21 transfers the tray from the first placement component to the placement slot 18, the first dust removal module immediately performs the aforementioned dust removal action. After dust removal is completed, the first transfer module 21 picks up the clean tray and places it in the storage rack 22 of the second placement component.

[0032] Reference Figure 6 and Figure 7 The finished product pallet dust removal mechanism is used to handle finished product pallets loaded with semiconductor chips. It includes at least one set of second dust removal modules, one set of second transfer modules 3, and at least one set of feeding components corresponding to each of the second dust removal modules. The second transfer module 3 is a two-axis transfer module with two linear motion degrees of freedom in the horizontal and vertical directions. Its drive end can perform planar positioning and vertical lifting. The feeding components are multiple sets arranged symmetrically. Taking one set as an example, the feeding component includes a linear conveyor module 51. This linear conveyor module 51 also adopts the form of a linear module with a drag chain. A feeding plate 52 is fixedly installed at its output end. The feeding plate 52 is used to support the finished product pallet placed by the operator and transport the pallet to the dust removal station in a straight line. The finished product pallet refers to a pallet that has been cleaned by the empty pallet dust removal mechanism and then loaded with semiconductor chips through the loading process.

[0033] The second dust removal module includes a dust removal nozzle 31, a pressing assembly, and a protective assembly. The dust removal nozzle 31 is fixedly installed on the drive end of the second transfer module 3, and has a negative pressure channel inside, with an adsorption port at the lower end. The pressing assembly includes two pressing cylinders 32, which are vertically installed on both sides of the end of the conveying path of the linear conveying module 51. The output ends of the cylinders are arranged vertically downwards, and the output ends of the two pressing cylinders 32 are fixedly connected to a horizontal pressing plate 33, which can synchronously drive the pressing plate 33 to rise and fall in the vertical direction. The protective assembly is installed on the pressing plate 33 and moves downwards with it.

[0034] Reference Figure 8 and Figure 9 The protective assembly consists of a mounting frame 34, a protective net 42, and a tensioning assembly. The mounting frame 34 has two through slots forming clearance slots 35, providing space for the downward movement of the dust suction head 31. The solid portion between the two clearance slots 35 forms a crossbeam 36. The protective assembly also includes a protective net 42, which is woven from a flexible material and has evenly distributed fine perforations on its surface. The aperture of these perforations is designed to allow only dust particles to pass through, while chip components larger than the aperture are effectively blocked. The protective net 42 is tightly mounted to the mounting frame 34 using a tensioning assembly. The tensioning assembly specifically includes three tension rods 41, a U-shaped plate 44, and two L-shaped plates 43. The U-shaped plate 44 is fixedly installed at the bottom of the crossbeam 36, and this U-shaped plate 44 has a downward-opening U-shaped groove, within which one of the tension rods 41 is fixedly installed. Two L-shaped plates 43 are fixedly installed on the two side edges of the mounting frame 34, specifically on the sides of the two clearance grooves 35 that are far apart from each other. Each L-shaped plate 43 has an inwardly opening L-shaped groove. Two tension rods 41 are respectively set in the L-shaped grooves of the two L-shaped plates 43. One end of the protective net 42 is fixedly wound around the tension rod 41 set in one of the L-shaped plates 43, and the other end is fixedly wound around the tension rod 41 set in the other L-shaped plate 43; the middle section of the protective net 42 goes down and wraps around the tension rod 41 located in the U-shaped groove of the U-shaped plate 44. Through the combined action of the two end edges of the U-shaped plate 44, the edges of the two L-shaped plates 43, and the three tension rods 41, the protective net 42 is fully tightened to form a continuous and flat protective surface covering the area below the mounting frame 34.

[0035] The implementation process of this application is as follows: The complete dust removal process for empty pallets and finished product pallets will be described step by step below in conjunction with the structure of the device.

[0036] Dust removal process for empty pallets: In the initial state, multiple empty trays awaiting dust removal are stacked in the storage rack 22 of the first placement component. The material level sensor 24 detects the presence of the trays and transmits the signal to the control system. The lifting cylinder 25 is in the retracted state, and the lifting plate 26 is in the lowest position. The suction gripper 211 of the first transfer module 21 is in the standby position above the first placement component.

[0037] The control system issues a material handling command, and the piston rod of the lifting cylinder 25 extends upward, pushing the lifting plate 26 to rise. The lifting plate 26 lifts the entire stack of empty pallets upward until the top pallet reaches the preset gripping height. The linear module of the first transfer module 21 is activated, and the drive end equipped with the suction gripper 211 moves horizontally to directly above the pallet. Then, the suction gripper 211 descends or directly uses negative pressure to suction the upper surface of the pallet, grabbing the top empty pallet.

[0038] After the suction gripper 211 firmly grasps the tray, the lifting cylinder 25 can maintain or slightly lower to disengage. The first transfer module 21 drives the suction gripper 211 and the tray to move horizontally towards the first dust removal module. After reaching directly above the placement slot 18 of the dust removal box 17, the suction gripper 211 lowers to smoothly place the empty tray into the placement slot 18, and then releases the suction. The suction gripper 211 is then lifted and moved out of the placement slot 18 area.

[0039] The first dust removal module begins operation. The upper and lower dust removal components activate simultaneously: an external clean air source supplies clean air into the inner housing 12 through the air inlet duct 14. The fan 13 inside the inner housing 12 rotates at high speed, pressurizing the clean air and blowing it out from the opening at the bottom of the inner housing 12. The upper dust removal component blows a strong downward airflow that impacts the upper surface of the empty tray, while the lower dust removal component blows an upward airflow that impacts the lower surface of the empty tray. Under the impact of the airflow, the dust adhering to the upper and lower surfaces of the tray is stripped off and dispersed.

[0040] Meanwhile, the adsorption pipe 16 continuously generates suction force through an external negative pressure source. As the dust particles are carried by the airflow to the periphery of the lower-pressure adsorption end face, they are immediately drawn into the air passage 15 between the outer shell 11 and the inner shell 12. The airflow carrying the dust flows upward along the air passages 15 on both sides of the trapezoidal inner shell 12, and the two airflows converge at the top, entering the adsorption pipe 16, and are finally extracted and discharged into the dust collection and filtration system. The upper and lower dust removal components form a closed-loop blowing-suction flow field that covers both sides, preventing dust from escaping or flowing back, and completing the deep cleaning of the upper and lower surfaces of the empty tray after a set time.

[0041] After dust removal is completed, the fan 13 stops running, and the adsorption pipe 16 can enter the pressure holding or closed state. The adsorption gripper 211 of the first transfer module 21 moves again above the placement slot 18 and descends to adsorb and grab the cleaned tray, remove it from the placement slot 18 and transfer it horizontally to the storage rack 22 of the second placement component.

[0042] The lifting cylinder 25 of the second placement component rises, causing the lifting plate 26 or the tray stack already on the storage rack 22 to rise to the receiving position; the suction gripper 211 places the clean tray on top of the stack and then releases. Then the lifting cylinder 25 descends back to its original position, completing the storage of the clean tray. The material level sensor 24 updates its status. The first transfer module 21 returns to the direction of the first placement component, preparing to pick up the next empty tray, and so on, until all empty trays in the first placement component have been processed, or until the second placement component is full, at which point the process pauses.

[0043] Dust removal process for finished product pallets: The operator places the finished product tray, already loaded with semiconductor chips, horizontally on the feed plate 52 of a feeding component, with the chip side of the tray facing upwards. The automatic process of this feeding channel is then started.

[0044] The linear conveyor module 51 of the feeding assembly starts working, driving the feeding plate 52 and the finished product tray on it to move forward in a straight line, feeding it at a constant speed towards the dust removal station directly below the pressing assembly. When the finished product tray has completely entered directly below the pressing plate 33 and reached the predetermined position, the linear conveyor module 51 stops.

[0045] The two pressing cylinders 32 of the pressing assembly operate synchronously, with the piston rods extending downwards, causing the pressing plate 33 and the protective assembly mounted on it to descend vertically as a whole. The mounting bracket 34, tensioning assembly, and protective netting 42, which is tensioned by the tensioning rod 41, move downwards together until the lower surface of the protective netting 42 gently and completely adheres to the upper surface of the finished product tray. At this point, the chip components on the finished product tray are completely covered and physically blocked by the protective netting 42.

[0046] The second transfer module 3 is activated. First, the dust removal nozzle 31 is moved above a relief groove 35 of the protective component by the horizontal axis. Then, the vertical axis drives the dust removal nozzle 31 to extend downward into the relief groove 35, so that the adsorption port of the dust removal nozzle 31 is close to the upper surface of the protective net 42 but does not make contact.

[0047] The second transfer module 3 moves the dust removal nozzle 31 horizontally within the clearance groove 35 area according to the grid or serpentine scanning path set in the program. The suction port sequentially scans the entire surface of the corresponding clearance groove 35 area of ​​the protective mesh 42. During the movement, a negative pressure is continuously generated inside the dust removal nozzle 31. The negative pressure airflow penetrates the tiny through holes on the protective mesh 42, sucking up dust particles attached to the surface of the finished product tray and the grooves between chips and sucking them into the nozzle channel. Chips and other larger objects are effectively blocked by the protective mesh 42 and will not be sucked or displaced. After completing the suction of one clearance groove 35, the dust removal nozzle 31 can rise and move horizontally above another clearance groove 35, and then descend again to perform the same scanning suction, ensuring that the entire upper surface of the tray is covered by the dust removal nozzle 31.

[0048] After the entire area is scanned and adsorbed, the dust removal nozzle 31 rises and exits the clearance groove 35, returning to its initial height. The piston rod of the downward cylinder 32 retracts upward, causing the downward pressure plate 33 and the protective components to rise, and the protective net 42 detaches from the surface of the finished product tray.

[0049] The linear conveyor module 51 restarts, removing the feed plate 52 along with the dust-removed finished product pallet from the dust removal station and returning it to the operator's side. The operator removes the clean finished product pallet, completing a single finished product pallet dust removal process. Multiple feeding components and corresponding second dust removal modules can simultaneously or alternately perform the above steps to achieve continuous and efficient operation.

[0050] It should be understood that although this specification is described according to various embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. An integrated dust removal device for chip trays, characterized in that, include: Rack (1); An empty pallet dust removal mechanism is provided on the frame (1) and includes a first dust removal module, a first transfer module (21), a first placement component and a second placement component. The first placement component and the second placement component are respectively provided on both sides of the first dust removal module. The first transfer module (21) has an adsorption gripper (211). The adsorption gripper (211) is horizontally movable above the first placement component, the first dust removal module and the second placement component. The finished product pallet dust removal mechanism is installed on the frame (1) and includes at least one second dust removal module, a second transfer module (3), and at least one feeding assembly corresponding to the second dust removal module. The second dust removal module includes a dust removal suction head (31), a pressing assembly, and a protective assembly. The pressing assembly includes a pressing cylinder (32) and a pressing plate (33) fixed to the output end of the pressing cylinder (32). The protective assembly is fixed to the pressing plate (33). The feeding assembly includes a protective net (42), and includes a linear conveying module (51) and a feeding plate (52) fixed to the output end of the linear conveying module (51). The feeding plate (52) is located below the lower pressure plate (33). The second transfer module (3) has horizontal and vertical degrees of freedom of movement. The dust removal nozzle (31) is fixed to the drive end of the second transfer module (3) and is located above the protective net (42).

2. The integrated dust removal device for chip trays according to claim 1, characterized in that, The first placement component and the second placement component have the same structure, both including: The storage rack (22) is a cubic frame formed by four vertical rods (23); A material level sensor (24) is fixedly installed on the vertical rod (23), with its detection end facing the inside of the storage rack (22); The lifting cylinder (25) is vertically installed directly below the storage rack (22), and its cylinder body is fixedly connected to the frame (1); The lifting plate (26) is horizontally fixed to the end of the piston rod of the lifting cylinder (25). The outer contour dimension of the lifting plate (26) is smaller than the inner frame dimension of the storage rack (22). The lifting plate (26) is raised and lowered inside the vertical rod (23).

3. The integrated dust removal device for chip trays according to claim 1, characterized in that, The first transfer module (21) is a linear module with a drag chain, and the suction gripper (211) is fixedly installed on the slide of the linear module.

4. The integrated dust removal device for chip trays according to claim 1, characterized in that, The first dust removal module includes: A dust collection box (17) has a placement slot (18) in its middle section; The upper dust removal component and the lower dust removal component are respectively integrated in the dust removal box (17). The upper dust removal component and the lower dust removal component are arranged in a mirror image opposite each other directly above and below the placement slot (18), and their respective dust removal ends are facing the placement slot (18).

5. The integrated dust removal device for chip trays according to claim 4, characterized in that, The upper dust removal component and the lower dust removal component have the same structure, both including: The outer shell (11) has a trapezoidal cross section perpendicular to its length direction, with the upper base at the top and the lower base at the bottom and open as an adsorption end face; The adsorption pipe (16) is fixedly connected to the upper bottom of the trapezoid of the outer shell (11) and communicates with the internal space of the outer shell (11); The inner shell (12) is housed inside the outer shell (11). The cross-section of the inner shell (12) is trapezoidal and its external dimensions are smaller than those of the outer shell (11). The outer wall of the inner shell (12) and the inner wall of the outer shell (11) maintain a uniform distance to form a surrounding air passage (15). The air passage (15) is divided into two paths, which extend along the two sides of the trapezoid of the inner shell (12) and converge at the top of the inner shell (12) to connect to the adsorption pipe (16). A fan (13) is installed in the internal space of the inner housing (12); An air inlet duct (14) is fixedly installed on the inner wall of the inner shell (12), and its inlet end passes through the inner shell (12) and the outer shell (11) wall.

6. The integrated dust removal device for chip trays according to claim 1, characterized in that, The linear conveying module (51) of the feeding assembly is a linear module with a drag chain.

7. The integrated dust removal device for chip trays according to claim 1, characterized in that, The second transfer module (3) is a two-axis transfer module, and its drive end moves linearly in the horizontal and vertical directions.

8. The integrated dust removal device for chip trays according to claim 1, characterized in that, The pressing assembly includes two pressing cylinders (32), which are vertically installed on both sides of the end of the conveying path of the linear conveying module (51). The output ends of the two pressing cylinders (32) are arranged vertically downward and are fixedly connected to a horizontal pressing plate (33).

9. The integrated dust removal device for chip trays according to claim 1, characterized in that, The protective components also include: Mounting bracket (34) is fixed to the lower pressure plate (33). The mounting bracket (34) has two through-type relief grooves (35). The solid part between the two relief grooves (35) forms a crossbeam (36). The tensioning assembly includes three tensioning rods (41), a U-shaped plate (44), and two L-shaped plates (43). The U-shaped plate (44) is fixed to the bottom of the crossbeam (36) and has a U-shaped groove with a downward opening. One tensioning rod (41) is fixedly installed in the U-shaped groove. The two L-shaped plates (43) are respectively fixed to the two sides of the mounting bracket (34) and are respectively located on the sides of the two clearance grooves (35) that are far apart from each other. Each L-shaped plate (43) has an L-shaped groove with an inward opening. The other two tensioning rods (41) are respectively set in the two L-shaped grooves. One end of the protective net (42) is fixedly wound around the tension rod (41) in one of the L-shaped grooves, and the other end is fixedly wound around the tension rod (41) in another L-shaped groove. The middle section of the protective net (42) goes down and wraps around the tension rod (41) in the U-shaped groove. The protective net (42) is tensioned by the three tension rods (41), the end edge of the U-shaped plate (44) and the edge of the L-shaped plate (43), and covers the area below the mounting frame (34).

10. The integrated dust removal device for chip trays according to claim 1, characterized in that, The finished product pallet dust removal mechanism includes multiple sets of the second dust removal modules and multiple sets of the feeding components. The multiple sets of the second dust removal modules and the multiple sets of the feeding components are arranged in a one-to-one correspondence and are arranged in parallel on the frame (1).

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