Punching processing die and method for waveguide type superconducting cavity parts made of high-purity niobium plate
Patent Information
- Application Number
- CN202611053830.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-15
- Publication Date
- 2026-09-25
AI Technical Summary
(4)方波导内部的几何形状和表面处理(如抛光、镀层)可以抑制多电子倍增放电现象,这种效应在强射频场下可能导致能量泄漏或腔体失谐
[0029]由上述技术方案可知,本发明提供的高纯铌板制造的波导型超导腔零件的冲压加工模具及方法中,该模具包括了冲压凹模组合件下部、冲压凹模组合件上部、冲压凸模组合件下部、冲压凸模组合件上部、冲压压板和变径圆弧冲压凸模;冲压凹模组合件下部上设置有与方波导的Y型结构对应的第一Y型槽,且中间设置有与方波导的圆弧段对应的弧形腔;冲压凹模组合件上部设置有与第一Y型槽对应的第二Y型槽,该冲压凹模组合件上部安装于冲压凹模组合件下部的上端,且安装后第二Y型槽与所述第一Y型槽对应;冲压凸模组合件上部安装于冲压凸模组合件下部的上端,形成的冲压凸模模组能够穿过第二Y型槽后与第一Y型槽适配,以在冲压凸模模组受外部压力时,能够将设置在冲压凹模组合件下部上的待冲压板料冲压为方波导的Y型结构;冲压压板上开设有与第二Y型槽对应的第三Y型槽,该冲压压板安装于冲压凹模组合件上部的上端;变径圆弧冲压凸模与方波导的圆弧段适配,其用于在冲压方波导的圆弧段时安装于冲压凸模组合件下部的底端中心位置,安装后变径圆弧冲压凸模与弧形腔适配。在进行冲压加工时,首先将冲压凹模组合件下部和上部安装为一体,以及将冲压凸模组合件上部和下部安装为一体,然后计算半波导零件3D模型的展开尺寸,并根据材料的延展性能和零部件的预留加工尺寸确定待冲压板料的下料尺寸,并进行下料。进一步,擦拭冲压凹模模组的表面,在冲压凹模模组的内表面涂抹润滑油,然后将加工好的待冲压板料嵌入到冲压凹模模组上的板料定位槽内。之后将冲压压板安装在冲压凹模模组上,以实现凸模模组的定位。进一步,将冲压凸模模组均匀涂抹润滑油后,随着冲压压板的定位放置在冲压凹模模组的板料上,然后将安装完成的全套模具放置在油压机的平台中心进行半波导Y型结构的冲压。冲压结束后,将冲压压板拆除,然后将冲压凸模模组去除,并将冲压凸模模组与变径圆弧冲压凸模安装在一起。进一步,将冲压压板重新安装后,将安装有变径圆弧冲压凸模的冲压凸模模组安装在冲压凹模模组上进行半波导圆弧段的冲压,得到半波导零件。由此可见,本方案采用分两次冲压的方法,首先冲压方波导Y型分布的矩形方波导,在冲压完成后,再冲压中心部分的变径圆弧段。能够解决由于半波导零件带有变径圆弧,采用现有一次冲压会造成中心部分首先形变,Y型分布的矩形方波导在冲压下行过程中,会由于没有受到凸模模具的约束而材料褶皱,冲压结果不符合工艺要求的问题。此外,本方案不仅解决了半波导冲压成型的问题,而且将冲压与加工模具结合,冲压完成后,还可以以模具为基准进行零件加工,实现模具的多功能用途。
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Figure CN122806939A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of superconducting cavity processing and manufacturing technology, and in particular to a stamping die and method for waveguide-type superconducting cavity parts made of high-purity niobium plate. Background Technology
[0002] In the application of superconducting cavities, square waveguides play a major and important role. (1) As a microwave transmission line, a square waveguide can efficiently feed the electromagnetic energy generated by an external microwave source into the superconducting cavity to excite the required acceleration mode (such as the TM mode). Its rectangular structure is easy to match with the standard rectangular waveguide interface and can control the coupling degree (by adjusting the aperture, probe or ring position) to avoid energy reflection. (2) By designing the coupling structure of the square waveguide (such as the position and shape of the coupling hole), specific working modes (such as the π mode) in the superconducting cavity can be excited preferentially, while suppressing other competing modes (such as higher-order modes or asymmetric modes). The polarization direction of the square waveguide can also match the electric field orientation of the cavity to improve energy transmission efficiency. (3) When the superconducting cavity is running at low temperature (such as 2K), the square waveguide is usually in the room temperature or intermediate temperature range. Square waveguides using oxygen-free copper or coated superconducting materials (such as niobium) can reduce radio frequency loss and withstand high power transmission (such as tens of kilowatts to megawatts) of continuous wave or high duty cycle. (4) The internal geometry and surface treatment (such as polishing and coating) of the square waveguide can suppress the multi-electron multiplication discharge phenomenon, which may lead to energy leakage or cavity detuning under strong radio frequency fields. (5) The square waveguide is usually combined with a vacuum window or cryogenic isolation section to maintain the ultra-vacuum environment (~10) of the superconducting cavity while transmitting microwaves. -8 Pa), and isolate the heat conduction between room temperature and low temperature regions (e.g., using stainless steel bellows or aluminum nitride windows). (6) In the superconducting cavity, the accelerated beam will excite harmful high-order modes (HOMs), which can be extracted by an additional square waveguide coupler (HOM coupler) and absorbed by the load to prevent beam instability and cavity overheating.
[0003] Traditional 1.3 GHz superconducting cavities typically consist of a single or multiple cells in the middle, connected to a bundle tube and flanges at both ends. In contrast, 1.3 GHz waveguide-type superconducting cavities have square waveguide resonant structures on one or both sides, exhibiting a Y-shaped distribution (see...). Figure 1 and Figure 2 It is made of two half-wave conduction electron beams welded together (see...) Figure 3There are generally two methods for processing half-waveguides. The first method is to process them directly from a single piece of raw material. However, due to the high price of high-purity niobium (over 4000 yuan / kg), this method results in significant material waste, with the material cost for each waveguide resonant structure exceeding 200,000 yuan. The second method is to stamp two half-waveguides separately, which can save a considerable amount of material costs. However, unlike traditional stamping, which typically stamps circular arc structures or unidirectional linear structures (such as...), this method... Figure 1 The cell and tube bundle are stamped together, while the square waveguide structure is Y-shaped with a variable-diameter arc segment at the center, and the cross-sectional profile of the three sides is rectangular (see...). Figure 3 The three sides have an included angle of 120°. The structure of the stamped parts is quite special, and the stamping process is difficult. Existing stamping solutions are not able to obtain effective square waveguides. Summary of the Invention
[0004] In view of this, and to address the above shortcomings, it is necessary to provide a stamping die and method for waveguide-type superconducting cavity parts made of high-purity niobium plates, so as to realize the stamping process of square waveguides.
[0005] In a first aspect, the present invention provides a stamping die for a waveguide-type superconducting cavity part made of high-purity niobium plate, comprising: a lower part of a stamping die assembly, an upper part of a stamping die assembly, a lower part of a stamping punch assembly, an upper part of a stamping punch assembly, a stamping plate, and a variable-diameter arc stamping punch.
[0006] The lower part of the stamping die assembly is provided with a first Y-shaped groove corresponding to the Y-shaped structure of the square waveguide, and the middle part is provided with an arc-shaped cavity corresponding to the arc segment of the square waveguide; the upper part of the stamping die assembly is provided with a second Y-shaped groove corresponding to the first Y-shaped groove, and the upper part of the stamping die assembly is installed on the upper end of the lower part of the stamping die assembly, and after installation, the second Y-shaped groove corresponds to the first Y-shaped groove;
[0007] The upper part of the stamping punch assembly is mounted on the upper end of the lower part of the stamping punch assembly, and the formed stamping punch module can pass through the second Y-shaped groove and fit with the first Y-shaped groove, so that when the stamping punch module is subjected to external pressure, it can stamp the sheet material to be stamped on the lower part of the stamping die assembly into a Y-shaped structure of a square waveguide; the stamping plate has a third Y-shaped groove corresponding to the second Y-shaped groove, and the stamping plate is mounted on the upper end of the upper part of the stamping die assembly;
[0008] The variable-diameter circular arc stamping punch is adapted to the circular arc segment of the square waveguide. It is used to be installed at the bottom center of the lower part of the stamping punch assembly when stamping the circular arc segment of the square waveguide. After installation, the variable-diameter circular arc stamping punch is adapted to the arc cavity.
[0009] Preferably, the lower part of the stamping die assembly, the upper part of the stamping die assembly, the lower part of the stamping punch assembly, the upper part of the stamping punch assembly, the stamping plate, and the variable diameter arc stamping punch are all made of 7075 aluminum alloy, and the surface is hardened to ensure that the hardness of the die meets the stamping requirements of superconducting niobium material.
[0010] Preferably, a first recess is provided at the bottom center of the upper part of the stamping punch assembly, and a first boss is provided at the top center of the lower part of the stamping punch assembly. When the upper part and the lower part of the stamping punch assembly are installed, they are installed by the cooperation of the first boss and the first recess, and by fixing with screws.
[0011] Preferably, a second recess is provided at the center of the bottom of the lower part of the stamping punch assembly, and a second boss is provided at the top of the variable diameter arc stamping punch; when the lower part of the stamping punch assembly is installed with the variable diameter arc stamping punch, the second boss and the second recess cooperate with each other and are fixed by screws.
[0012] Preferably, the included angle of the second Y-shaped groove on the upper part of the stamping die assembly is provided with a triangular chamfer structure to reduce the resistance of the niobium material during the stamping process and avoid material tearing.
[0013] Preferably, the upper top of the stamping die assembly is provided with a sheet metal positioning groove for mounting the sheet metal to be stamped.
[0014] Preferably, the upper part of the stamping die assembly and the lower part of the stamping die assembly, as well as the stamping plate and the upper part of the stamping die assembly, are fixedly connected by screws.
[0015] In a second aspect, the present invention provides a stamping method for waveguide-type superconducting cavity components manufactured from high-purity niobium plates, implemented based on a stamping die for waveguide-type superconducting cavity components manufactured from high-purity niobium plates as described in any of the first aspects, the method comprising the following steps:
[0016] S1: The lower part of the stamping die assembly and the upper part of the stamping die assembly are installed as one unit to obtain the stamping die module;
[0017] S2: The upper part of the stamping punch assembly and the lower part of the stamping punch assembly are installed as one piece to obtain the stamping punch module;
[0018] S3: Calculate the unfolded dimensions of the 3D model of the half-waveguide component, and calculate the blanking dimensions of the sheet metal to be stamped based on the ductility of the material and the reserved processing dimensions of the component, and process the sheet metal to be stamped according to the blanking dimensions;
[0019] S4: Wipe the surface of the stamping die assembly and apply lubricating oil to the inner surface of the stamping die assembly. Then, insert the processed sheet metal to be stamped into the sheet metal positioning groove on the stamping die assembly.
[0020] S5: Install the stamping plate onto the stamping die assembly;
[0021] S6: After evenly applying lubricating oil to the stamping punch assembly, place it on the sheet metal of the stamping die assembly along with the positioning of the stamping plate.
[0022] S7: Place the completed set of molds stably in the center of the hydraulic press platform to stamp the semi-waveguide Y-shaped structure;
[0023] S8: After stamping is completed, remove the stamping plate, then remove the stamping punch assembly, and install the stamping punch assembly together with the variable diameter arc stamping punch.
[0024] S9: Reinstall the stamping plate, and then place the stamping punch module with the variable diameter arc stamping punch on the stamping die module to stamp the arc segment of the half waveguide to obtain the half waveguide part.
[0025] Preferably, when stamping the Y-shaped structure of the semi-waveguide, the hydraulic press pressure is 115-125 tons, the stamping descent speed is 5.5-6.5 mm / s, and the holding time is 2-4 minutes; when stamping the arc segment structure of the semi-waveguide, the hydraulic press pressure is 115-125 tons, the stamping descent speed is 5.5-6.5 mm / s, and the holding time is 1-2 minutes.
[0026] Preferably, after step S9, the method further includes:
[0027] S10: Remove the upper part of the stamping punch assembly and the stamping die assembly, place the stamped half waveguide part in the lower part of the stamping die assembly, and press it with the lower part of the stamping punch assembly. Press the three sides with pressure blocks and screws, and fix it on the machining center equipment. Using the mold as the reference, process the dimensions of the half waveguide Y-shaped structure with reference to the drawing dimensions.
[0028] S11: After the Y-shaped structure dimensions are processed, remove the half waveguide, flip it over and fix it on the machining center equipment. Using the center of the arc segment of the equipment platform and the half waveguide part as the reference, and referring to the dimensions in the drawing, process the height of the arc segment to finally complete the processing of the part.
[0029] As can be seen from the above technical solution, the stamping die and method for waveguide-type superconducting cavity parts manufactured from high-purity niobium plates provided by the present invention includes a lower part of a stamping die assembly, an upper part of a stamping die assembly, a lower part of a stamping punch assembly, an upper part of a stamping punch assembly, a stamping pressure plate, and a variable-diameter arc stamping punch; the lower part of the stamping die assembly is provided with a first Y-shaped groove corresponding to the Y-shaped structure of the square waveguide, and an arc-shaped cavity corresponding to the arc segment of the square waveguide is provided in the middle; the upper part of the stamping die assembly is provided with a second Y-shaped groove corresponding to the first Y-shaped groove, and the upper part of the stamping die assembly is installed on the upper end of the lower part of the stamping die assembly, and after installation, the second Y-shaped groove and the first Y-shaped groove are aligned. The Y-shaped groove corresponds to the upper part of the stamping punch assembly, which is installed at the upper end of the lower part of the stamping punch assembly. The formed stamping punch module can pass through the second Y-shaped groove and fit with the first Y-shaped groove so that when the stamping punch module is subjected to external pressure, it can stamp the sheet material to be stamped on the lower part of the stamping die assembly into a Y-shaped structure of a square waveguide. A third Y-shaped groove corresponding to the second Y-shaped groove is opened on the stamping plate, which is installed at the upper end of the upper part of the stamping die assembly. The variable diameter arc stamping punch fits with the arc segment of the square waveguide. It is used to install at the bottom center of the lower part of the stamping punch assembly when stamping the arc segment of the square waveguide. After installation, the variable diameter arc stamping punch fits with the arc cavity. During the stamping process, the lower and upper parts of the stamping die assembly are first assembled as one unit, as are the upper and lower parts of the stamping punch assembly. Then, the unfolded dimensions of the 3D model of the semi-waveguide component are calculated. Based on the material's ductility and the pre-machining dimensions of the components, the blanking dimensions of the sheet metal to be stamped are determined, and blanking is performed. Next, the surface of the stamping die assembly is wiped clean, and lubricating oil is applied to the inner surface of the stamping die assembly. Then, the machined sheet metal to be stamped is embedded into the sheet metal positioning groove on the stamping die assembly. Afterward, the stamping pressure plate is installed on the stamping die assembly to position the punch assembly. Finally, after evenly applying lubricating oil to the stamping punch assembly, it is placed on the sheet metal of the stamping die assembly along with the positioning of the stamping pressure plate. The completed set of dies is then placed in the center of the hydraulic press platform for stamping the semi-waveguide Y-shaped structure. After stamping, the stamping plate is removed, then the stamping punch assembly is removed and installed together with the variable-diameter arc stamping punch. Further, after reinstalling the stamping plate, the stamping punch assembly with the variable-diameter arc stamping punch is installed on the stamping die assembly to stamp the arc segment of the half-waveguide, obtaining the half-waveguide part. Therefore, this solution uses a two-stage stamping method: first, the rectangular square waveguide with a Y-shaped distribution is stamped; after stamping, the variable-diameter arc segment in the center is stamped. This solves the problem that, due to the variable-diameter arc in the half-waveguide part, existing single-stage stamping methods cause deformation in the center first, and the Y-shaped rectangular square waveguide wrinkles during the stamping process due to the lack of constraint from the punch, resulting in stamping results that do not meet process requirements.In addition, this solution not only solves the problem of half-waveguide stamping, but also combines stamping with processing molds. After stamping, parts can be processed based on the mold, realizing the multi-functional use of the mold. Attached Figure Description
[0030] Figure 1 This is a schematic diagram of a 1.3 GHz single-cell waveguide superconductor.
[0031] Figure 2 This is a schematic diagram of a 1.3 GHz single 3-cell waveguide superconductor.
[0032] Figure 3 A schematic diagram of a square waveguide structure decomposed into two half-waveguides.
[0033] Figure 4 An exploded view of a stamping die for a waveguide-type superconducting cavity part made of high-purity niobium plate, provided in an embodiment of the present invention.
[0034] Figure 5 This is a cross-sectional view of a stamping die for a waveguide-type superconducting cavity part made of high-purity niobium plate, provided in an embodiment of the present invention.
[0035] Figure 6 This is a schematic diagram of the lower part of a stamping die assembly provided in an embodiment of the present invention.
[0036] Figure 7 This is a schematic diagram of the upper part of a stamping die assembly provided in an embodiment of the present invention.
[0037] Figure 8 An exploded view of a stamping die assembly provided in an embodiment of the present invention.
[0038] Figure 9 This is a schematic diagram of a stamping die assembly provided in an embodiment of the present invention.
[0039] Figure 10 This is a schematic diagram of the lower part of a stamping punch assembly provided in an embodiment of the present invention.
[0040] Figure 11 This is a schematic diagram of the upper part of a stamping punch assembly provided in an embodiment of the present invention.
[0041] Figure 12 This is an exploded view of a stamping punch assembly provided in an embodiment of the present invention.
[0042] Figure 13 This is a schematic diagram of a stamping punch module provided in an embodiment of the present invention.
[0043] Figure 14 This is a schematic diagram of a sheet material to be stamped, provided in an embodiment of the present invention.
[0044] Figure 15 This is a schematic diagram of a sheet material to be stamped provided in an embodiment of the present invention.
[0045] Figure 16 This is a schematic diagram of a stamping plate provided in an embodiment of the present invention.
[0046] Figure 17 This is a schematic diagram of a stamping plate installed according to an embodiment of the present invention.
[0047] Figure 18 This is a schematic diagram of a punch module after placement, provided in an embodiment of the present invention.
[0048] Figure 19 This is a schematic diagram of a metal pad placement provided in an embodiment of the present invention.
[0049] Figure 20 This is a schematic diagram of the stamping plate and stamping punch module after removal, as provided in an embodiment of the present invention.
[0050] Figure 21 This is a schematic diagram of a variable diameter circular arc stamping punch provided in an embodiment of the present invention.
[0051] Figure 22 This is a schematic diagram of the installation of a variable diameter circular arc stamping punch and a stamping punch module provided in an embodiment of the present invention.
[0052] Figure 23 This is a bottom schematic diagram of the lower part of a stamping punch assembly provided in an embodiment of the present invention.
[0053] Figure 24 This is a schematic diagram of a variable diameter circular arc stamping punch and a stamping punch module installed on a stamping die module, according to an embodiment of the present invention.
[0054] Figure 25 This is a schematic diagram of a stamped half-waveguide component provided in an embodiment of the present invention.
[0055] Figure 26 This is a schematic diagram showing the height processing of a half-waveguide component.
[0056] In the figure: stamping die assembly 10, lower part of stamping die assembly 11, first Y-shaped groove 111, arc cavity 112, upper part of stamping die assembly 12, second Y-shaped groove 121, triangular chamfer structure 122, sheet metal positioning groove 123, stamping punch assembly 20, lower part of stamping punch assembly 21, first boss 211, second recess 212, upper part of stamping punch assembly 22, first recess 221, stamping pressure plate 30, third Y-shaped groove 31, variable diameter arc stamping punch 40, second boss 41, sheet metal to be stamped 50, half waveguide part 60, pressure block 70, metal pad 80. Detailed Implementation
[0057] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of this invention. The embodiments described in this application are merely some embodiments of this invention, and not all embodiments. Based on the spirit of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this invention.
[0058] In the description of this invention, it should be noted that the terms "front," "rear," "inner," "outer," "right," "left," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0059] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0060] like Figure 4-26 As shown, the present invention provides a stamping die for waveguide-type superconducting cavity parts made of high-purity niobium plate, comprising: a lower part 11 of stamping die assembly, an upper part 12 of stamping die assembly, a lower part 21 of stamping punch assembly, an upper part 22 of stamping punch assembly, a stamping pressure plate 30, and a variable diameter arc stamping punch 40.
[0061] The lower part 11 of the stamping die assembly is provided with a first Y-shaped groove 111 corresponding to the Y-shaped structure of the square waveguide, and an arc cavity 112 corresponding to the arc segment of the square waveguide is provided in the middle; the upper part 12 of the stamping die assembly is provided with a second Y-shaped groove 121 corresponding to the first Y-shaped groove 111. The upper part 12 of the stamping die assembly is installed on the upper end of the lower part 11 of the stamping die assembly, and after installation, the second Y-shaped groove 121 corresponds to the first Y-shaped groove 111.
[0062] The upper part 22 of the stamping punch assembly is installed on the upper end of the lower part 21 of the stamping punch assembly, and the formed stamping punch module 20 can pass through the second Y-shaped groove 121 and fit with the first Y-shaped groove 111, so that when the stamping punch module 20 is subjected to external pressure, it can stamp the sheet material 50 to be stamped on the lower part 11 of the stamping die assembly into a Y-shaped structure of a square waveguide; the stamping pressure plate 30 has a third Y-shaped groove 31 corresponding to the second Y-shaped groove 121, and the stamping pressure plate 30 is installed on the upper end of the upper part 12 of the stamping die assembly;
[0063] The variable diameter arc stamping punch 40 is adapted to the arc segment of the square waveguide. It is used to install at the bottom center of the lower part 21 of the stamping punch assembly when stamping the arc segment of the square waveguide. After installation, the variable diameter arc stamping punch 40 is adapted to the arc cavity 112.
[0064] In one embodiment, the lower part 11 of the stamping die assembly, the upper part 12 of the stamping die assembly, the lower part 21 of the stamping punch assembly, the upper part 22 of the stamping punch assembly, the stamping plate 30, and the variable diameter arc stamping punch 40 are all made of 7075 aluminum alloy and the surface is hardened to ensure that the hardness of the die meets the stamping requirements of superconducting niobium material.
[0065] In one embodiment, a first recess 221 is provided at the bottom center of the upper part 22 of the stamping punch assembly, and a first boss 211 is provided at the top center of the lower part 21 of the stamping punch assembly. When the upper part 22 and the lower part 21 of the stamping punch assembly are installed, they are installed by the cooperation of the first boss 211 and the first recess 221, and by fixing with screws.
[0066] In one embodiment, a second recess 212 is provided at the center of the bottom end of the lower part 21 of the stamping punch assembly, and a second boss 41 is provided at the top end of the variable diameter arc stamping punch 40; when the lower part 21 of the stamping punch assembly and the variable diameter arc stamping punch 40 are installed, they are installed by the cooperation of the second boss 41 and the second recess 212, and by fixing with screws.
[0067] In one embodiment, a triangular chamfer structure 122 is provided at the included angle of the second Y-shaped groove 121 on the upper part 12 of the stamping die assembly to reduce the resistance of the niobium material during the stamping process and avoid material tearing.
[0068] In one embodiment, the top of the upper part 12 of the stamping die assembly is provided with a sheet metal positioning groove 123 for mounting the sheet metal 50 to be stamped.
[0069] In one embodiment, the upper part 12 of the stamping die assembly and the lower part 11 of the stamping die assembly, as well as the stamping plate 30 and the upper part 12 of the stamping die assembly, are fixedly connected by screws.
[0070] The present invention also provides a stamping method for waveguide-type superconducting cavity components made of high-purity niobium plates. This method is based on a stamping die for waveguide-type superconducting cavity components made of high-purity niobium plates as described in any of the above embodiments. The method may include the following steps:
[0071] S1: The lower part 11 of the stamping die assembly and the upper part 12 of the stamping die assembly are installed together to obtain the stamping die module 10;
[0072] In this step, before stamping, first install the lower part 11 and the upper part 12 of the stamping die assembly as a single unit. Use a wrench to tighten the M10 hex socket screws, paying attention to the fit of the steps to ensure the die is properly installed. Figure 6-9 As shown, the upper 12 corners of the stamping die assembly feature a triangular chamfer design to reduce the resistance of the niobium material during stamping and prevent material tearing. Figure 7 As shown.
[0073] S2: The upper part 22 and the lower part 21 of the stamping punch assembly are installed as a whole to obtain the stamping punch module 20;
[0074] In this step, consider installing the upper part 22 and the lower part 21 of the stamping punch assembly as a single unit. Tighten them with M10 screws, paying attention to the fit between the boss and the concave side to ensure proper installation. Figure 10-13 As shown.
[0075] S3: Calculate the unfolded dimensions of the 603D model of the half-waveguide component, and calculate the blanking dimensions of the sheet metal 50 to be stamped based on the ductility properties of the material and the reserved processing dimensions of the component, and process the sheet metal 50 to be stamped according to the blanking dimensions.
[0076] In this step, the unfolded dimensions of the 603D model of the semi-waveguide component are calculated using software. Based on the material's ductility and the pre-machining allowance for the component, the dimensions of the stamped sheet 50 are calculated and then processed. Figure 14As shown. For ease of installation, the width of the sheet metal positioning groove 123 on the upper part 12 of the stamping die assembly is slightly larger than this dimension by 0.1-0.2mm, and the depth is consistent with the sheet metal thickness.
[0077] For example, in one embodiment, the width of the rectangular side of the sheet material to be processed is 143.80 mm, the diameter of the center hole is 50 mm, the included angle of the Y-shaped side is 120°, and the chamfer of the adjacent Y-shaped side is 15 mm.
[0078] S4: Wipe the surface of the stamping die assembly 10 and apply lubricating oil to the inner surface of the stamping die assembly 10. Then, insert the processed sheet metal 50 to be stamped into the sheet metal positioning groove 123 on the stamping die assembly 10.
[0079] In this step, wipe and inspect the surface of the stamping die assembly 10 to ensure there are no foreign objects or impurities. Then, apply lubricating oil evenly to the inner surface of the die. After applying lubricating oil evenly to the sheet metal 50 to be stamped, place it on the stamping die assembly 10 and embed it into the sheet metal positioning groove 123 of the assembly to ensure stable placement. Figure 15 As shown.
[0080] S5: Install the stamping plate 30 onto the stamping die assembly 10;
[0081] In this step, consider installing the stamping plate 30 on the die assembly. Use a torque wrench to adjust the torque to 2 N·m, and gently tighten it symmetrically with M10 hexagonal screws to ensure that the three sides of the sheet metal are evenly stressed during stamping and to prevent wrinkling of the niobium sheet. The stamping plate 30 also ensures the accurate positioning of the stamping punch assembly 20 and guides the assembly during the stamping process. Figure 16-18 As shown.
[0082] S6: After evenly applying lubricating oil to the stamping punch assembly 20, place it on the sheet metal of the stamping die assembly 10 along with the positioning of the stamping plate 30;
[0083] In this step, after evenly applying lubricating oil to the stamping punch assembly 20, it is placed on the sheet metal of the stamping die assembly 10 along with the positioning of the stamping plate 30, in preparation for the stamping and forming of the sheet metal. Figure 18 As shown.
[0084] S7: Place the completed set of molds stably in the center of the hydraulic press platform to stamp the semi-waveguide Y-shaped structure;
[0085] In this step, the completed mold set is placed stably on the four-column hydraulic press, visually positioned at the center of the press platform. Because the stamping punch assembly 20 has a relatively small overall thickness to save mold material and reduce machining, metal pads 80 of equal height can be placed on its three sides for auxiliary stamping, ensuring the mold is fully stamped in place. Figure 19 As shown. The hydraulic press pressure can be set to 120 tons, the stamping descent speed can be set to 6 mm / s, and the pressure holding time can be set to 3 minutes for automatic stamping.
[0086] S8: After stamping is completed, remove the stamping plate 30, then remove the stamping punch assembly 20, and install the stamping punch assembly 20 together with the variable diameter arc stamping punch 40.
[0087] In this step, after the automatic stamping is completed, the hydraulic press returns to its original position. To facilitate the smooth demolding of the stamping punch assembly 20, the stamping plate 30 needs to be removed first, and then the punch is taken out of the mold. The stamped half-waveguide parts 60 are then processed sequentially. Figure 20 As shown. The second step is to prepare the stamping of the variable diameter arc section of the half-waveguide. Specifically, the stamping punch module 20 and the variable diameter arc stamping punch 40 are installed together, with a mating boss in the center. Tighten with M10 screws to ensure the mold is properly installed. Figure 21-23 As shown.
[0088] S9: Reinstall the stamping plate 30, and then place the stamping punch module 20 with the variable diameter arc stamping punch 40 on the stamping die module 10 to stamp the arc segment of the half waveguide, thereby obtaining the half waveguide part 60.
[0089] In this step, the stamping plate 30 is first reinstalled to position the stamping punch assembly 20. Then, the reinstalled stamping punch assembly 20 is placed on the stamping die assembly 10 to stamp the semi-waveguide variable diameter arc segment. The pressure is set to 120 tons, the stamping speed to 6 mm / s, and the holding time to 1 minute. Figure 24 As shown, after stamping, the stamping plate 30, the stamping punch assembly 20, and the stamped half-waveguide part 60 are removed sequentially, thus completing the stamping process of the half-waveguide. Figure 25 As shown.
[0090] S10: Remove the stamping punch assembly 20 and the upper part 12 of the stamping die assembly, place the stamped half waveguide part 60 in the lower part 11 of the stamping die assembly, and press it with the lower part 21 of the stamping punch assembly. Press the three sides with the pressure block 70 and the screw, and fix it on the machining center equipment. With the mold as the reference, process the Y-shaped structure dimensions of the half waveguide according to the drawing dimensions.
[0091] In this step, the stamping punch assembly 20 and the upper part 12 of the stamping die assembly are removed. Then, the stamped half-waveguide part 60 is placed in the groove of the stamping die assembly 10 and pressed tightly by the lower part 21 of the stamping punch assembly. The three sides are pressed tightly by the pressure block 70 and the screw. Figure 26 As shown. Then it is fixed on the machining center equipment, and processed with the mold as the reference, referring to the dimensions and process of the drawing.
[0092] S11: After the Y-shaped structure dimensions are processed, remove the half waveguide, flip it over and fix it on the machining center equipment. Using the center of the 60 arc segment of the equipment platform and the half waveguide part as the reference, and referring to the dimensions in the drawing, process the height of the arc segment to finally complete the processing of the part.
[0093] In this step, after the height of the semi-rectangular waveguide is processed, the semi-rectangular waveguide is removed, flipped upside down, and fixed on the machining center equipment. Using the center of the equipment platform and the center arc as a reference, and referring to the dimensions in the drawing and the processing technology, the height of the arc segment is processed, and the processing of the component is finally completed.
[0094] In summary, the stamping die and method for manufacturing waveguide-type superconducting cavity parts from high-purity niobium plates provided by this invention have at least the following beneficial effects:
[0095] (1) This solution uses stamping to solve the forming problem of the half waveguide. Furthermore, in order to solve the stamping problem of the half waveguide, this solution adopts a two-stage stamping process. The stamping dies for the rectangular waveguide section and the stamping dies for the variable diameter arc section are designed as separate units, and are positioned and combined through the stop structure. This achieves the process requirement of using one set of dies to realize the two-stage stamping process, and can realize the multi-functional purpose of dies for stamping and processing.
[0096] (2) In order to avoid tearing at the corner of the half waveguide caused by rapid stamping, this solution designs a triangular chamfer structure 122 to ensure that the material forming meets the process requirements.
[0097] (3) In the prior art, there is no stamping of square waveguides with a Y-shaped distribution. This type of superconducting cavity is the first of its kind to be developed in China. Some technical solutions use a method of processing a whole piece of material, and the cost of high-purity niobium material is hundreds of thousands of yuan. This invention solves the stamping method of square waveguides with a Y-shaped distribution, realizes the stamping of parts, saves a lot of material costs, and improves the utilization rate of materials.
[0098] The above method embodiments and device embodiments are based on the same inventive concept. For the description of the device embodiments, please refer to the description of the method embodiments, which will not be repeated here.
[0099] The modules or units in the device of this invention can be merged, divided, and deleted according to actual needs. The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the invention. Those skilled in the art will understand that implementing all or part of the processes of the above embodiments and making equivalent changes according to the claims of this invention still fall within the scope of the invention.
Claims
1. A stamping die for a waveguide-type superconducting cavity component made of high-purity niobium plate, characterized in that, include: The lower part of the stamping die assembly, the upper part of the stamping die assembly, the lower part of the stamping punch assembly, the upper part of the stamping punch assembly, the stamping plate, and the variable diameter arc stamping punch; The lower part of the stamping die assembly is provided with a first Y-shaped groove corresponding to the Y-shaped structure of the square waveguide, and the middle part is provided with an arc-shaped cavity corresponding to the arc segment of the square waveguide; the upper part of the stamping die assembly is provided with a second Y-shaped groove corresponding to the first Y-shaped groove, and the upper part of the stamping die assembly is installed on the upper end of the lower part of the stamping die assembly, and after installation, the second Y-shaped groove corresponds to the first Y-shaped groove; The upper part of the stamping punch assembly is mounted on the upper end of the lower part of the stamping punch assembly, and the formed stamping punch module can pass through the second Y-shaped groove and fit with the first Y-shaped groove, so that when the stamping punch module is subjected to external pressure, it can stamp the sheet material to be stamped on the lower part of the stamping die assembly into a Y-shaped structure of a square waveguide; the stamping plate has a third Y-shaped groove corresponding to the second Y-shaped groove, and the stamping plate is mounted on the upper end of the upper part of the stamping die assembly; The variable-diameter circular arc stamping punch is adapted to the circular arc segment of the square waveguide. It is used to be installed at the bottom center of the lower part of the stamping punch assembly when stamping the circular arc segment of the square waveguide. After installation, the variable-diameter circular arc stamping punch is adapted to the arc cavity.
2. The stamping die for waveguide-type superconducting cavity parts manufactured from high-purity niobium plates according to claim 1, characterized in that, The lower part of the stamping die assembly, the upper part of the stamping die assembly, the lower part of the stamping punch assembly, the upper part of the stamping punch assembly, the stamping plate, and the variable diameter arc stamping punch are all made of 7075 aluminum alloy and the surface is hardened to ensure that the hardness of the die meets the stamping requirements of superconducting niobium material.
3. The stamping die for waveguide-type superconducting cavity parts manufactured from high-purity niobium plates according to claim 1, characterized in that, A first recess is provided at the bottom center of the upper part of the stamping punch assembly, and a first boss is provided at the top center of the lower part of the stamping punch assembly. The upper and lower parts of the stamping punch assembly are installed by the cooperation of the first boss and the first recess, and are fixed by screws.
4. The stamping die for waveguide-type superconducting cavity parts manufactured from high-purity niobium plates according to claim 3, characterized in that, A second recess is provided at the center of the bottom of the stamping punch assembly, and a second boss is provided at the top of the variable diameter arc stamping punch. When the lower part of the stamping punch assembly is installed with the variable diameter arc stamping punch, the second boss and the second recess cooperate with each other and are fixed by screws.
5. The stamping die for waveguide-type superconducting cavity parts manufactured from high-purity niobium plates according to claim 1, characterized in that, The upper part of the stamping die assembly has a triangular chamfered structure at the included angle of the second Y-shaped groove to reduce the resistance of the niobium material during the stamping process and avoid material tearing.
6. The stamping die for waveguide-type superconducting cavity parts manufactured from high-purity niobium plates according to claim 1, characterized in that, The upper top of the stamping die assembly is provided with a sheet metal positioning groove for installing the sheet metal to be stamped.
7. The stamping die for waveguide-type superconducting cavity parts manufactured from high-purity niobium plates according to claim 4, characterized in that, The upper part of the stamping die assembly and the lower part of the stamping die assembly, as well as the stamping plate and the upper part of the stamping die assembly, are all fixedly connected by screws.
8. A stamping method for a waveguide-type superconducting cavity component made of high-purity niobium plate, characterized in that, The method is achieved using a stamping die for a waveguide-type superconducting cavity component manufactured from a high-purity niobium plate as described in any one of claims 1-7, and includes the following steps: S1: The lower part of the stamping die assembly and the upper part of the stamping die assembly are installed as one unit to obtain the stamping die module; S2: The upper part of the stamping punch assembly and the lower part of the stamping punch assembly are installed as one piece to obtain the stamping punch module; S3: Calculate the unfolded dimensions of the 3D model of the half-waveguide component, and calculate the blanking dimensions of the sheet metal to be stamped based on the ductility of the material and the reserved processing dimensions of the component, and process the sheet metal to be stamped according to the blanking dimensions; S4: Wipe the surface of the stamping die assembly and apply lubricating oil to the inner surface of the stamping die assembly. Then, insert the processed sheet metal to be stamped into the sheet metal positioning groove on the stamping die assembly. S5: Install the stamping plate onto the stamping die assembly; S6: After evenly applying lubricating oil to the stamping punch assembly, place it on the sheet metal of the stamping die assembly along with the positioning of the stamping plate. S7: Place the completed set of molds stably in the center of the hydraulic press platform to stamp the semi-waveguide Y-shaped structure; S8: After stamping is completed, remove the stamping plate, then remove the stamping punch assembly, and install the stamping punch assembly together with the variable diameter arc stamping punch. S9: Reinstall the stamping plate, and then place the stamping punch module with the variable diameter arc stamping punch on the stamping die module to stamp the arc segment of the half waveguide to obtain the half waveguide part.
9. The stamping method for waveguide-type superconducting cavity parts manufactured from high-purity niobium plates according to claim 8, characterized in that, When stamping the Y-shaped structure of the semi-waveguide, the hydraulic press pressure is 115-125 tons, the stamping descent speed is 5.5-6.5 mm / s, and the holding time is 2-4 minutes; when stamping the arc segment structure of the semi-waveguide, the hydraulic press pressure is 115-125 tons, the stamping descent speed is 5.5-6.5 mm / s, and the holding time is 1-2 minutes.
10. The stamping method for waveguide-type superconducting cavity parts manufactured from high-purity niobium plates according to claim 8, characterized in that, Following step S9, the procedure further includes: S10: Remove the upper part of the stamping punch assembly and the stamping die assembly, place the stamped half waveguide part in the lower part of the stamping die assembly, and press it with the lower part of the stamping punch assembly. Press the three sides with pressure blocks and screws, and fix it on the machining center equipment. Using the mold as the reference, process the dimensions of the half waveguide Y-shaped structure with reference to the drawing dimensions. S11: After the Y-shaped structure dimensions are processed, remove the half waveguide, flip it over and fix it on the machining center equipment. Using the center of the arc segment of the equipment platform and the half waveguide part as the reference, and referring to the dimensions in the drawing, process the height of the arc segment to finally complete the processing of the part.