A soldering machine for microcircuit boards

Abstract

The application relates to the technical field of circuit board welding, and discloses a welding machine for micro circuit board welding, which comprises a base, a micro circuit board body and electronic components. The upper end of the base is provided with a transfer mechanism for moving the micro circuit board body. The upper part of the transfer mechanism is provided with a tin soldering mechanism for soldering the micro circuit board body and the electronic components. The tin soldering mechanism comprises a first fixing ring and a second fixing ring. The outer sides of the first fixing ring and the second fixing ring are fixedly connected with two groups of fixing frames. The first fixing ring and the second fixing ring are rotatably connected with a ring plate. The electronic components can be prevented from moving during tin spraying and soldering under the limitation of the limiting pipe. The electronic components can be subjected to tin spraying treatment and surrounding soldering at the bottom, so that the conditions of virtual soldering and missed soldering can be avoided, the processing precision of soldering is ensured, and the quality and firmness of soldering are improved.

Description

Technical Field

[0001] This invention relates to the field of circuit board welding technology, specifically a welding machine for welding micro circuit boards. Background Technology

[0002] When soldering micro circuit boards, the electronic components that need to be soldered include resistors, capacitors, diodes, transistors, integrated circuits, etc. These electronic components are tiny and have densely packed pins. They need to be accurately installed on the micro circuit board according to the circuit diagram and component list and then soldered to fix them. Laser soldering is an advanced soldering technology that uses a laser as a heat source to precisely control and rapidly heat low-melting-point solder.

[0003] However, the small and delicate size of the objects being welded increases the difficulty of the process. When adding solder for laser welding, issues such as incomplete soldering or missing solder may occur. Furthermore, the thermal stress or mechanical vibration generated during the welding process may cause micro-displacement of the micro-electronic components, leading to inaccurate welding, bridging, or even damage to adjacent components. To address these issues, we propose a welding machine for micro-circuit board welding. Summary of the Invention

[0004] The present invention solves the above-mentioned technical problems by adopting the following technical solution: a welding machine for welding micro circuit boards is provided, including a base, a micro circuit board body, and electronic components. The upper end of the base is provided with a transfer mechanism for moving the micro circuit board body. Above the transfer mechanism is a soldering mechanism for welding the micro circuit board body and electronic components. The soldering mechanism includes a first fixing ring and a second fixing ring. Two sets of fixing frames are fixedly connected to the outer sides of the first fixing ring and the second fixing ring. A ring plate is rotatably connected between the first fixing ring and the second fixing ring. A toothed block is fixedly connected to the outer side of the ring plate. A mounting block is provided on the inner side of the ring plate. A solder spray tube and a laser welding gun are mounted on the outer side of the mounting block.

[0005] Preferably, a first fixing frame is fixedly connected to the outer side of the first fixing ring, a first motor is installed on the inner side of the first fixing frame, a first gear is fixedly connected to the output end of the first motor, the first gear meshes with a gear block, a second fixing frame is fixedly connected to the inner side of the ring plate, a second motor is installed on the inner side of the second fixing frame, and the output end of the second motor is fixedly connected to the mounting block.

[0006] Preferably, a connecting rod is fixedly connected to the inner side of the ring plate, and a limiting tube is fixedly connected to one end of the connecting rod. The limiting tube is located at the center of the ring plate. A second lug is fixedly connected to the front end of one of the two sets of fixing frames. A fan is rotatably connected to the lower end of the second lug. A fourth gear is fixedly connected to the upper end of the fan through the second lug. The fourth gear meshes with a gear block.

[0007] Preferably, a support rod is fixedly connected between the two sets of fixed frames, and a feeding tray is rotatably connected to the upper end of the support rod. The electronic components are arranged sequentially on the upper end of the feeding tray. A top plate is fixedly connected to the upper end of the two sets of fixed frames, and two sets of first lugs are fixedly connected to the lower end of the top plate. A sliding rod is fixedly connected between the two sets of first lugs.

[0008] Preferably, a movable block is slidably connected to the outer side of the slide rod, and an electric push rod is provided on one side of one of the two sets of first support ears. The output end of the electric push rod is fixedly connected to the movable block, and an electric push rod is fixedly connected to the lower end of the movable block. A material picking head is installed at the output end of the electric push rod.

[0009] Preferably, the transfer mechanism includes two sets of first connecting plates, the lower end of one set of the two sets of fixing frames is fixedly connected to the first connecting plate, the lower ends of the two sets of first connecting plates are fixedly connected to the base, an arc plate is fixedly connected to the upper end of the first connecting plate, a first sliding groove is provided on the opposite side of the two sets of first connecting plates, a first slider is slidably connected to the inner side of the first sliding groove, and a push plate is fixedly connected between the two sets of first sliders.

[0010] Preferably, a second connecting plate is fixedly connected to the front end of the first connecting plate, a slot is provided at the upper end of the second connecting plate, a toothed plate is slidably connected to the inner side of the slot, a second gear is rotatably connected to the inner side of the base, the lower end of the toothed plate passes through the second connecting plate and meshes with the second gear, and a lifting platform is fixedly connected between the two sets of toothed plates.

[0011] Preferably, a third connecting plate is fixedly connected to the front end of the second connecting plate, and the lower end of the other set of the two sets of fixing frames is fixedly connected to the third connecting plate. A second sliding groove is provided on the opposite side of each of the two sets of third connecting plates. A second slider is slidably connected to the inner side of the second sliding groove. A toothed plate is fixedly connected between the two sets of second sliders. A third gear is rotatably connected to the inner side of the base. The lower end of the toothed plate meshes with the third gear. A translation stage is fixedly connected to the upper end of the toothed plate.

[0012] Preferably, an electric actuator three is installed on the inner side of the base, the output end of the electric actuator three is fixedly connected to the push plate, a connecting block is installed on the outer side of the output end of the electric actuator three, a toothed plate three is fixedly connected to the front end of the connecting block, the upper end of the toothed plate three meshes with the second gear, a toothed plate four is fixedly connected to the front end of the toothed plate three, the upper end of the toothed plate four meshes with the third gear, and both the toothed plate three and the toothed plate four are movably connected to the outer side of the electric actuator three.

[0013] Compared with the prior art, the present invention provides a welding machine for soldering micro circuit boards, which has the following beneficial effects: 1. This welding machine for micro circuit board soldering uses a solder spray tube to first spray solder around the electronic component and treat its bottom. When the electric pusher pushes the pick-up head to place the electronic component on the micro circuit board body, the adhesive force of the solder at the bottom of the electronic component can fix the electronic component on the micro circuit board body in advance. Furthermore, under the restriction of the limiting tube, the electronic component can be prevented from moving during solder spraying, thereby ensuring the accuracy and consistency of the soldering.

[0014] 2. This welding machine for micro-circuit board soldering involves the following steps: After the electronic component with solder sprayed on its bottom contacts the micro-circuit board body, the second motor drives the solder spraying tube to flip to the lower side. Then, the solder spraying tube will again spray solder around the periphery of the contact area between the micro-circuit board body and the electronic component. After the second motor drives the laser welding gun to flip back to the lower side, the laser welding gun will then weld and fuse the solder around the contact area between the micro-circuit board body and the electronic component. This avoids the phenomena of wire hanging and burrs during soldering, and also avoids the occurrence of cold solder joints and missing solder joints, ensuring the processing accuracy of the soldering and guaranteeing the aesthetics of the soldering.

[0015] 3. This welding machine for micro-circuit board welding first sprays solder onto the bottom of the electronic component and positions it on the micro-circuit board body. Solder is then present at the connection between the micro-circuit board body and the electronic component. Then, the solder spraying tube rotates to spray solder around the periphery of the connection between the micro-circuit board body and the electronic component. Finally, a laser welding gun rotates around the circumference of the electronic component to perform laser welding without dead angles. This allows the solder to melt and fill the tiny gaps between the micro-circuit board body and the electronic component, ensuring a tighter and more solid weld between the micro-circuit board body and the electronic component, thereby improving the quality and strength of the weld. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a partial structural diagram of the present invention. Figure 1 ; Figure 3Schematic diagram of the soldering mechanism of the present invention Figure 1 ; Figure 4 Schematic diagram of the soldering mechanism of the present invention Figure 2 ; Figure 5 Cross-sectional view of the soldering mechanism of the present invention Figure 1 ; Figure 6 Cross-sectional view of the soldering mechanism of the present invention Figure 2 ; Figure 7 This is a partial structural diagram of the present invention. Figure 2 ; Figure 8 This is a schematic diagram of the transfer mechanism of the present invention; Figure 9 Cross-sectional view of the transfer mechanism of the present invention Figure 1 ; Figure 10 Cross-sectional view of the transfer mechanism of the present invention Figure 2 .

[0017] In the diagram: 1. Base; 2. Micro-circuit board body; 3. Electronic components; 4. Transfer mechanism; 41. First connecting plate; 42. Arc plate; 43. First slide groove; 44. First slider; 45. Push plate; 46. Second connecting plate; 47. Slot; 48. Toothed plate one; 49. Lifting platform; 410. Third connecting plate; 411. Second slide groove; 412. Second slider; 413. Toothed plate two; 414. Translation platform; 5. Soldering mechanism; 51. First fixing ring; 52. Second fixing ring; 53. Ring plate; 54. Toothed block; 55. Fixing frame one; 56. First motor; 57. 58. First gear; 59. Fixing frame 2; 50. Second motor; 510. Mounting block; 511. Tin spray tube; 512. Laser welding gun; 513. Connecting rod; 514. Limiting tube; 6. Fixing frame; 7. Support rod; 8. Feeding tray; 9. Top plate; 10. First lug; 11. Slide rod; 12. Moving block; 13. Electric push rod 1; 14. Electric push rod 2; 15. Material picking head; 16. Electric push rod 3; 17. Connecting block; 18. Gear plate 3; 19. Gear plate 4; 20. Second gear; 21. Third gear; 22. Second lug; 23. Fan; 24. Fourth gear. Detailed Implementation

[0018] The technical solutions of the present invention will now be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention.

[0019] Please see Figure 1 - Figure 10A welding machine for soldering micro-circuit boards includes a base 1, a micro-circuit board body 2, and electronic components 3. The upper end of the base 1 is provided with a transfer mechanism 4 for moving the micro-circuit board body 2. Above the transfer mechanism 4 is a soldering mechanism 5 for soldering the micro-circuit board body 2 and the electronic components 3. The soldering mechanism 5 includes a first fixing ring 51 and a second fixing ring 52. The outer sides of the first fixing ring 51 and the second fixing ring 52 are jointly fixedly connected to two sets of fixing frames 6. The first fixing ring 51 and the second fixing ring 52 are jointly rotatably connected to a ring plate 53. The outer side of the ring plate 53 is fixedly connected to a toothed block 54. The inner side of the ring plate 53 is provided with a mounting block 510. The outer side of the mounting block 510 is equipped with a solder spray tube 511 and a laser soldering gun 512.

[0020] In this embodiment, a first fixing frame 55 is fixedly connected to the outer side of the first fixing ring 51, a first motor 56 is installed on the inner side of the first fixing frame 55, a first gear 57 is fixedly connected to the output end of the first motor 56, the first gear 57 meshes with the tooth block 54, a second fixing frame 58 is fixedly connected to the inner side of the ring plate 53, a second motor 59 is installed on the inner side of the second fixing frame 58, and the output end of the second motor 59 is fixedly connected to the mounting block 510.

[0021] Specifically, by setting commands to the second motor 59 and the first motor 56, the first motor 56 causes the first gear 57 to rotate, and by meshing with the gear block 54, the ring plate 53 drives the tin spray tube 511 to rotate around the electronic component 3, thereby spraying tin around the bottom of the electronic component 3.

[0022] In this embodiment, a connecting rod 513 is fixedly connected to the inner side of the ring plate 53. One end of the connecting rod 513 is fixedly connected to a limiting tube 514. The limiting tube 514 is located at the center of the ring plate 53. A second lug 22 is fixedly connected to the front end of one of the two sets of fixing brackets 6. A fan 23 is rotatably connected to the lower end of the second lug 22. A fourth gear 24 is fixedly connected to the upper end of the fan 23 through the second lug 22. The fourth gear 24 meshes with the tooth block 54.

[0023] Specifically, after the bottom soldering of electronic component 3 is completed, the second electric push rod 14 pushes the pick-up head 15 downward to place electronic component 3 inside the limiting tube 514 and connect electronic component 3 with the micro circuit board body 2. Then, the second electric push rod 14 retracts the pick-up head 15 and removes a set of electronic components 3. When the first gear 57 meshes with the tooth block 54 to make it rotate, the tooth block 54 simultaneously meshes with the fourth gear 24, causing the fan 23 to run, which can blow away the smoke generated during soldering.

[0024] In this embodiment, a support rod 7 is fixedly connected between the two sets of fixed frames 6. The upper end of the support rod 7 is rotatably connected to a feeding tray 8. Electronic components 3 are arranged sequentially on the upper end of the feeding tray 8. The upper ends of the two sets of fixed frames 6 are fixedly connected to a top plate 9. The lower end of the top plate 9 is fixedly connected to two sets of first ears 10. A slide rod 11 is fixedly connected between the two sets of first ears 10. A moving block 12 is slidably connected to the outside of the slide rod 11. An electric push rod 13 is provided on one side of one of the two sets of first ears 10. The output end of the electric push rod 13 is fixedly connected to the moving block 12. An electric push rod 2 14 is fixedly connected to the lower end of the moving block 12. A material picking head 15 is installed on the output end of the electric push rod 2 14.

[0025] Specifically, electric push rod 13 pushes moving block 12 to move electric push rod 2 14 above loading tray 8, and then starts electric push rod 2 14 to grab the electronic component 3 placed on loading tray 8 through picking head 15. After picking up electronic component 3, electric push rod 13 starts again to pull electric push rod 2 14 back to its original position, so that solder spray tube 511 starts to spray solder on the bottom of electronic component 3.

[0026] In this embodiment, the transfer mechanism 4 includes two sets of first connecting plates 41. The lower end of one of the two sets of fixing frames 6 is fixedly connected to the first connecting plate 41. The lower ends of the two sets of first connecting plates 41 are fixedly connected to the base 1. An arc plate 42 is fixedly connected to the upper end of the first connecting plate 41. A first sliding groove 43 is provided on the opposite side of the two sets of first connecting plates 41. A first slider 44 is slidably connected to the inner side of the first sliding groove 43. A push plate 45 is fixedly connected between the two sets of first sliders 44.

[0027] Specifically, the micro circuit board body 2 to be soldered is placed on the upper end of the two sets of first connecting plates 41 and placed at the front end of the push plate 45. Then, the electric push rod 3 16 is activated. The output end of the electric push rod 3 16 drives the push plate 45 forward by retracting, thereby pushing the micro circuit board body 2 forward. The arc plate 42 is set to adjust the micro circuit board body 2 during the movement to make its position standardized.

[0028] In this embodiment, a second connecting plate 46 is fixedly connected to the front end of the first connecting plate 41. A slot 47 is provided at the upper end of the second connecting plate 46. A toothed plate 48 is slidably connected to the inner side of the slot 47. A second gear 20 is rotatably connected to the inner side of the base 1. The lower end of the toothed plate 48 passes through the second connecting plate 46 and meshes with the second gear 20. A lifting platform 49 is fixedly connected between the two sets of toothed plates 48.

[0029] Specifically, during the movement, toothed plate 3 18 and toothed plate 4 19 move forward simultaneously under the action of electric push rod 3 16, and toothed plate 3 18 meshes with the second gear 20, causing the second gear 20 to rotate. At the same time, the second gear 20 meshes with toothed plate 1 48, causing toothed plate 1 48 to move downward, thereby causing the lifting platform 49 to descend between the two sets of second connecting plates 46. Immediately afterwards, push plate 45 pushes the micro circuit board body 2 onto the lifting platform 49.

[0030] In this embodiment, the front end of the second connecting plate 46 is fixedly connected to the third connecting plate 410, and the lower end of the other set of the two sets of fixing brackets 6 is fixedly connected to the third connecting plate 410. The two sets of third connecting plates 410 are provided with a second sliding groove 411 on opposite sides. The inner side of the second sliding groove 411 is slidably connected to the second slider 412. The two sets of second sliders 412 are fixedly connected to a toothed plate 413. The inner side of the base 1 is rotatably connected to the third gear 21. The lower end of the toothed plate 413 meshes with the third gear 21. The upper end of the toothed plate 413 is fixedly connected to a translation stage 414.

[0031] Specifically, the toothed plate 419 meshes with the third gear 21, and the third gear 21 rotates during the movement of the toothed plate 419. When the third gear 21 rotates, it meshes with the toothed plate 213, causing the toothed plate 213 to move the translation stage 414 from front to back, so that the rear end of the translation stage 414 contacts the lifting platform 49. When the push plate 45 pushes the second set of micro circuit board bodies 2 forward, the movement of the second set of micro circuit board bodies 2 will push the first set of soldered micro circuit board bodies 2 and electronic components 3 onto the translation stage 414.

[0032] In this embodiment, an electric actuator 16 is installed on the inner side of the base 1. The output end of the electric actuator 16 is fixedly connected to the push plate 45. A connecting block 17 is installed on the outer side of the output end of the electric actuator 16. A toothed plate 18 is fixedly connected to the front end of the connecting block 17. The upper end of the toothed plate 18 meshes with the second gear 20. A toothed plate 19 is fixedly connected to the front end of the toothed plate 18. The upper end of the toothed plate 19 meshes with the third gear 21. Both the toothed plate 18 and the toothed plate 19 are movably connected to the outer side of the electric actuator 16.

[0033] Specifically, when the electric actuator 16 is activated again, the output end of the electric actuator 16 pushes the push plate 45 to move back to its original position. At the same time, the gear plate 18 and the gear plate 19 follow suit and move back, and re-engage the second gear 20 and the third gear 21 respectively. This causes the lifting platform 49 to move the micro circuit board body 2 upward, and the gear plate 413 to move the translation platform 414 from back to front.

[0034] In use, the micro-circuit board body 2 to be soldered is placed on the upper end of the two sets of first connecting plates 41 and placed at the front end of the push plate 45. Then, the electric push rod 3 16 is activated. The output end of the electric push rod 3 16 retracts, driving the push plate 45 forward, thereby pushing the micro-circuit board body 2 forward. During the movement, the toothed plate 3 18 and the toothed plate 4 19 move forward simultaneously under the action of the electric push rod 3 16. The toothed plate 3 18 meshes with the second gear 20, causing the second gear 20 to rotate. At the same time, the second gear 20 meshes with the toothed plate 1 48, causing the toothed plate 1 48 to move downward, thereby lowering the lifting platform 49 between the two sets of second connecting plates 46. Immediately afterwards, the push plate 45 pushes the micro-circuit board body 2 onto the lifting platform 49. On the other hand, gear plate 419 meshes with the third gear 21, and the third gear 21 rotates during the movement of gear plate 419. When the third gear 21 rotates, it meshes with gear plate 213, causing gear plate 213 to move from front to back with the translation stage 414, so that the rear end of the translation stage 414 contacts the lifting stage 49. After transferring the first set of micro-circuit board bodies 2 to be soldered onto the lifting stage 49, the electric push rod 316 is activated again. The output end of the electric push rod 316 pushes the push plate 45 to move backward back to its original position. At the same time, gear plate 318 and gear plate 419 follow closely and move backward, and mesh with the second gear 20 and the third gear 21 again, so that the lifting stage 49 drives the micro-circuit board body 2 to move upward, so that the gear plate The second motor 413 drives the translation stage 414 to move from back to front. When welding begins, commands are first set for the second motor 59 and the first motor 56. Then, the electric push rod 13 pushes the moving block 12 to move the electric push rod 14 above the loading tray 8. Then, the electric push rod 14 is activated, and the picking head 15 picks up the electronic component 3 placed on the loading tray 8. After picking up the electronic component 3, the electric push rod 13 is activated again to pull the electric push rod 14 back to its original position. At this time, the first motor 56 is activated, and the solder spray tube 511 begins to spray solder on the bottom of the electronic component 3. The first motor 56 causes the first gear 57 to rotate, which meshes with the gear block 54 to cause the ring plate 53 to drive the solder spray tube 511 to rotate around the electronic component 3, thereby soldering the electronic component 3. After one complete tin-spraying cycle around the bottom, the electric push rod 14 pushes the pick-up head 15 downwards, placing the electronic component 3 inside the limiting tube 514 and connecting it to the micro-circuit board body 2. Then, the electric push rod 14 retracts the pick-up head 15 and removes a set of electronic components 3. After placing the first set of electronic components 3 at the designated point on the micro-circuit board body 2, the second motor 59 drives the mounting block 510 to rotate, causing the tin-spraying tube 511 and laser soldering gun 512 to flip, aligning the tin-spraying tube 511 with the connection point between the micro-circuit board body 2 and the electronic component 3. The first motor 56 is then restarted, rotating the tin-spraying tube 511 to spray tin onto the outer side of the connection point between the micro-circuit board body 2 and the electronic component 3. Immediately afterwards, the second motor 59 is restarted again.The solder spray tube 511 and laser soldering gun 512 are flipped again, aligning the laser soldering gun 512 with the junction of the micro-circuit board body 2 and the electronic component 3. Simultaneously, the flipped-up solder spray tube 511 is aligned with the bottom of the next set of electronic components 3 to be soldered. When the first motor 56 causes the ring plate 53 to rotate, the laser soldering gun 512 melts and solders the solder around the junction of the micro-circuit board body 2 and the electronic component 3. At the same time, the solder spray tube 511 also sprays solder onto the bottom of the next set of electronic components 3 to be soldered, allowing the electronic component 3 to be positioned before contacting the micro-circuit board body 2. After the soldering of body 2 and electronic component 3 is completed, simply place the second set of micro-circuit board bodies 2 back onto the two sets of first connecting plates 41, activate electric push rod 3 16, and operate as above. When push plate 45 pushes the second set of micro-circuit board bodies 2 forward, the movement of the second set of micro-circuit board bodies 2 will push the soldered first set of micro-circuit board bodies 2 and electronic component 3 onto the translation stage 414. Then, electric push rod 3 16 pushes push plate 45 back to its original position, and the first set of soldered micro-circuit board bodies 2 and electronic component 3 will be moved out by the translation stage 414, making it convenient for staff to remove them for the next step of operation.

[0035] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A welding machine for soldering micro circuit boards, comprising a base (1), a micro circuit board body (2), and electronic components (3), characterized in that: The upper end of the base (1) is provided with a transfer mechanism (4) for moving the micro circuit board body (2). Above the transfer mechanism (4) is a soldering mechanism (5) for soldering the micro circuit board body (2) and electronic components (3). The soldering mechanism (5) includes a first fixing ring (51) and a second fixing ring (52). The outer sides of the first fixing ring (51) and the second fixing ring (52) are fixedly connected to two sets of fixing frames (6). The first fixing ring (51) and the second fixing ring (52) are rotatably connected to a ring plate (53). The outer side of the ring plate (53) is fixedly connected to a toothed block (54). The inner side of the ring plate (53) is provided with a mounting block (510). The outer side of the mounting block (510) is equipped with a solder spray tube (511) and a laser soldering gun (512).

2. The welding machine for micro circuit board soldering according to claim 1, characterized in that: A first fixing frame (55) is fixedly connected to the outer side of the first fixing ring (51). A first motor (56) is installed on the inner side of the first fixing frame (55). A first gear (57) is fixedly connected to the output end of the first motor (56). The first gear (57) meshes with the tooth block (54). A second fixing frame (58) is fixedly connected to the inner side of the ring plate (53). A second motor (59) is installed on the inner side of the second fixing frame (58). The output end of the second motor (59) is fixedly connected to the mounting block (510).

3. A welding machine for micro circuit board soldering according to claim 1, characterized in that: A connecting rod (513) is fixedly connected to the inner side of the ring plate (53). One end of the connecting rod (513) is fixedly connected to a limiting tube (514). The limiting tube (514) is located at the center of the ring plate (53). A second ear (22) is fixedly connected to the front end of one of the two sets of fixing frames (6). A fan (23) is rotatably connected to the lower end of the second ear (22). A fourth gear (24) is fixedly connected to the upper end of the fan (23) through the second ear (22). The fourth gear (24) meshes with the tooth block (54).

4. A welding machine for micro circuit board soldering according to claim 1, characterized in that: A support rod (7) is fixedly connected between the two sets of fixed frames (6). The upper end of the support rod (7) is rotatably connected to a feeding tray (8). The electronic components (3) are arranged sequentially on the upper end of the feeding tray (8). The upper ends of the two sets of fixed frames (6) are fixedly connected to a top plate (9). The lower end of the top plate (9) is fixedly connected to two sets of first ears (10). A slide rod (11) is fixedly connected between the two sets of first ears (10).

5. A welding machine for micro circuit board soldering according to claim 4, characterized in that: A movable block (12) is slidably connected to the outside of the slide rod (11). One side of one of the two sets of first support ears (10) is provided with an electric push rod one (13). The output end of the electric push rod one (13) is fixedly connected to the movable block (12). The lower end of the movable block (12) is fixedly connected with an electric push rod two (14). The output end of the electric push rod two (14) is equipped with a material taking head (15).

6. A welding machine for micro circuit board soldering according to claim 1, characterized in that: The transfer mechanism (4) includes two sets of first connecting plates (41). The lower end of one of the two sets of fixing frames (6) is fixedly connected to the first connecting plate (41). The lower ends of the two sets of first connecting plates (41) are fixedly connected to the base (1). An arc plate (42) is fixedly connected to the upper end of the first connecting plate (41). A first sliding groove (43) is provided on the opposite side of the two sets of first connecting plates (41). A first slider (44) is slidably connected to the inner side of the first sliding groove (43). A push plate (45) is fixedly connected between the two sets of first sliders (44).

7. A welding machine for micro circuit board soldering according to claim 6, characterized in that: The front end of the first connecting plate (41) is fixedly connected to the second connecting plate (46). The upper end of the second connecting plate (46) is provided with a slot (47). The inner side of the slot (47) is slidably connected to a toothed plate (48). The inner side of the base (1) is rotatably connected to a second gear (20). The lower end of the toothed plate (48) passes through the second connecting plate (46) and meshes with the second gear (20). The two sets of toothed plates (48) are fixedly connected to a lifting platform (49).

8. A welding machine for micro circuit board soldering according to claim 7, characterized in that: The front end of the second connecting plate (46) is fixedly connected to the third connecting plate (410). The lower end of the other set of the two sets of fixing frames (6) is fixedly connected to the third connecting plate (410). The two sets of third connecting plates (410) are provided with a second sliding groove (411) on opposite sides. The inner side of the second sliding groove (411) is slidably connected to the second slider (412). The two sets of second sliders (412) are fixedly connected to a toothed plate (413). The inner side of the base (1) is rotatably connected to the third gear (21). The lower end of the toothed plate (413) meshes with the third gear (21). The upper end of the toothed plate (413) is fixedly connected to a translation stage (414).

9. A welding machine for micro circuit board soldering according to claim 8, characterized in that: An electric actuator three (16) is installed on the inner side of the base (1). The output end of the electric actuator three (16) is fixedly connected to the push plate (45). A connecting block (17) is installed on the outer side of the output end of the electric actuator three (16). A toothed plate three (18) is fixedly connected to the front end of the connecting block (17). The upper end of the toothed plate three (18) meshes with the second gear (20). A toothed plate four (19) is fixedly connected to the front end of the toothed plate three (18). The upper end of the toothed plate four (19) meshes with the third gear (21). Both the toothed plate three (18) and the toothed plate four (19) are movably connected to the outer side of the electric actuator three (16).

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