An electrical soldering iron system

Abstract

The application provides an electric soldering iron system, belongs to the technical field of electric soldering iron control, is used for realizing mixed power control, double-dimension life prediction and distributed data tracing, and can improve welding quality and efficiency. Through analysis on pressure and temperature signals, the application realizes accurate real-time segmentation of welding process parameters, so that the power control strategy can be changed from a single feedback mode to a multi-stage mixed mode. Based on the segmentation and control switching of data processing, the heat demand in the initial stage of welding can be proactively addressed, and fine adjustment can be performed in the stable period. Without sacrificing temperature control stability, the heat response speed is greatly improved, and the inherent contradiction between fast response and stable suppression of overshoot in traditional control methods is solved.

Description

Technical Field

[0001] This invention relates to the field of soldering iron control technology, and more particularly to a soldering iron system. Background Technology

[0002] Soldering iron systems are indispensable basic tools in the fields of electronic manufacturing and repair. They mainly consist of three parts: a soldering station that provides energy and control, a handle that is easy to operate, and a soldering pen that directly contacts the solder joint. In modern industrial production, especially in automated soldering scenarios, increasingly higher demands are placed on the management of the quality, efficiency, and lifespan of the soldering process. Soldering iron systems that integrate more data acquisition and intelligent processing capabilities have become the direction of technological development. The core of this lies in how to use digital signal processing technology to achieve more precise control and more comprehensive management of the soldering process.

[0003] Existing intelligent soldering iron systems typically employ a technical solution that integrates a temperature sensor into the handle or soldering pen, using a microcontroller (MCU) on the soldering station to achieve PID closed-loop constant temperature control. Some more advanced systems add a position sensor to enable energy-saving functions such as sleep / wake-up. However, in practical applications, the power control method is rather rigid, and simple constant temperature control or linear pressure compensation is difficult to adapt to complex soldering conditions. Especially when dealing with different solder joints with significant differences in heat capacity, slow temperature recovery or temperature overshoot can easily occur. Furthermore, the lifespan assessment method is too crude, as relying solely on usage time or number of uses cannot accurately reflect the actual wear and tear of the soldering pen under different soldering intensities, leaving room for improvement. Summary of the Invention

[0004] This invention provides a soldering iron system for achieving hybrid power control, dual-dimensional lifespan prediction, and distributed data traceability, which can improve soldering quality and efficiency.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: In a first aspect, a soldering iron system is provided for use in a system comprising a soldering station, a handle, and a soldering pen, including: The signal acquisition module is used to acquire feedback signals from the posture sensor and pressure sensor at the handle end, as well as the temperature sensor signal at the soldering pen end. The power adjustment module is used to dynamically adjust the output power of the welding station according to the welding posture and pressure represented by the feedback signal; The data processing module is used to calculate and record relevant judgment data of the soldering iron based on the feedback signal.

[0006] Optionally, the power regulation module includes a rapid temperature adjustment submodule, which has at least one of the following control strategies built-in, which can be selected by the user or adaptively identified and adapted: The first strategy is to map the power pulse to the pressure range, control the positive correlation between the pressure magnitude and the power pulse duty cycle, and control the output power in an open-loop manner under the maximum temperature range of the welding station. The second strategy is to map the pressure range to the over-temperature range, control the pressure magnitude and the over-temperature value to be positively correlated, and configure the mapping slope of the low pressure range to be less than the mapping slope of the high pressure range. The third strategy is to perform interval weighted temperature compensation. The welding stage is determined by the power fluctuation and the rate of temperature loss. At different welding stages, the corresponding interval weighting value is selected according to the pressure to compensate the surface temperature of the welding pen.

[0007] Optionally, it also includes an attitude assessment module, and the pose sensor includes a gyroscope, wherein the attitude assessment module is configured as follows: If the gyroscope data shows an acceleration characteristic after being stationary, it is determined to be in a picked-up state, triggering the power adjustment module to start heating. If the calculated angle indicates that the soldering pen is in a horizontal position, it is determined to be in a desktop position, and the power adjustment module is triggered to stop heating. If the gyroscope data shows characteristics of violent movement followed by stillness, it is determined to be a falling state, triggering the power adjustment module to stop heating. If the pose data recovers to the initial static state, it is determined to be in sleep mode.

[0008] Optionally, the data processing module includes: The life detection submodule is used to measure the voltage and current transmitted to the soldering pen in real time to calculate the power, and to perform weighted calculation and accumulation based on the temperature and the magnitude of the pressure to obtain the coating wear condition; and to record the number of soldering operations in which the soldering pen withstands the maximum thermal shock to evaluate the life of the heating wire. The quality monitoring submodule outputs an over-temperature or abnormal temperature warning signal when the temperature rise time or overshoot ratio exceeds the preset safety threshold during PID temperature control.

[0009] Optionally, it also includes a data traceability module, which is configured as follows: Encrypted communication is established with the readable IC built into the soldering pen, and the unique ID of the soldering pen, the total flow of welding energy, the number of large temperature difference impacts and the performance of control parameters are written to or read from the readable IC. The lifespan data and control parameters of the soldering pen are uploaded to a cloud server via a communication network for traceability.

[0010] Secondly, a method for controlling an electric soldering iron is provided, including the following steps: Acquire the pressure signal from the pressure sensor in the handle and the temperature signal from the temperature sensor in the soldering pen; Calculate the second derivative of the pressure signal and the first derivative of the temperature signal to generate a time-domain differential parameter pair; Based on the temporal crossover point between the peak time of the second derivative and the turning point of the slope of the first derivative in the time-domain differential parameter pair, a welding process is divided into four sub-stages: contact period, stabilization period, finishing period and settling period, and a stage division identifier sequence is generated. Obtain the heat capacity coefficient of the soldering pen, which characterizes the thermal properties of the soldering pen, and extract the real-time pressure value of the pressure signal during the contact period and map it to generate a dynamic contact thermal resistance coefficient. Based on the contact period label in the stage division identifier sequence, combined with the first derivative of the pressure signal, the dynamic contact thermal resistance coefficient and the welding pen heat capacity coefficient, the advanced compensation heat value is calculated, and the advanced power pulse parameter is generated. Power pulses are injected into the soldering pen in an open-loop manner according to the advanced power pulse parameters, and when the stage division identifier sequence is switched to the stable period label, the control is switched to closed-loop PID control to generate the first temperature control status data.

[0011] Furthermore, after generating the first temperature control status data, the following steps are also included: Acquire the pressure signal from the pressure sensor in the handle and the temperature signal from the temperature sensor in the soldering pen; Calculate the second derivative of the pressure signal and the first derivative of the temperature signal to generate a time-domain differential parameter pair; Based on the temporal crossover point between the peak time of the second derivative and the turning point of the slope of the first derivative in the time-domain differential parameter pair, a welding process is divided into four sub-stages: contact period, stabilization period, finishing period and settling period, and a stage division identifier sequence is generated. Obtain the heat capacity coefficient of the soldering pen, which characterizes the thermal properties of the soldering pen, and extract the real-time pressure value of the pressure signal during the contact period and map it to generate a dynamic contact thermal resistance coefficient. Based on the contact period label in the stage division identifier sequence, combined with the first derivative of the pressure signal, the dynamic contact thermal resistance coefficient and the welding pen heat capacity coefficient, the advanced compensation heat value is calculated, and the advanced power pulse parameter is generated. Power pulses are injected into the soldering pen in an open-loop manner according to the advanced power pulse parameters, and when the stage division identifier sequence is switched to the stable period label, the control is switched to closed-loop PID control to generate the first temperature control status data.

[0012] Furthermore, after generating the leading power pulse parameters, the following steps are also included: The amplitude of the advanced power pulse parameter is extracted as a substitute index for welding strength. The average value of the first derivative of the pressure signal during the contact period is extracted as a steady-state wear behavior feature. The peak value of the second derivative of the pressure signal during the contact period is extracted as a rigid impact feature. A first set of life influence factors is generated. Obtain a coating temperature coefficient table that reflects the coating loss rate at different temperatures. Calculate the cumulative steady-state wear value of the coating based on the welding strength substitution index and steady-state wear behavior characteristics in the first set of life-affecting factors, combined with the coating temperature coefficient table. The rigid impact characteristic quantity in the first life influencing factor set is compared with the preset safety rigidity threshold. If it exceeds the safety rigidity threshold, an early failure risk coefficient is introduced to amplify the steady-state wear accumulation value of the coating in a step-wise manner to generate the first wear life prediction value. Independent of the calculation path of the first wear life prediction value, the number of times the stage division identifier sequence switches from the resting period to the contact period is counted as the number of thermal shocks to generate the second life prediction value. After generating the first wear life prediction value and the second wear life prediction value, the following steps are also included: Obtain the deviation threshold used to determine the degree of deviation of the life model, compare the first wear life prediction value with the second life prediction value, calculate the deviation ratio, and generate cross-validation results; If the cross-validation result exceeds the deviation threshold, an upward adjustment safety factor is obtained to compensate for the decrease in heat conduction efficiency, and the amplitude of the lead power pulse parameter is corrected using the upward adjustment safety factor to generate the corrected lead power pulse parameter. The corrected advanced power pulse parameters are used to derive and update the heat capacity coefficient of the soldering pen, thereby generating adaptive heat capacity parameters.

[0013] Furthermore, after generating the leading power pulse parameters, the following steps are also included: Obtain weighting coefficients for balancing electrical energy input and mechanical pressure, and combine the peak value of the first derivative of the pressure signal during the contact period with the amplitude of the advance power pulse parameter according to the weighting coefficients to generate a single welding energy reference index. The welding strength index is generated by correlating the single welding energy reference index with the average value of the temperature signal during the contact period and the stabilization period. The welding strength index is packaged with the timestamps in the stage division identifier sequence to generate welding event summary data.

[0014] Furthermore, after generating the second temperature control status data, the following steps are also included: Based on the power value corresponding to the power adjustment command in the second temperature control status data and the actual rise time of the temperature signal, the overshoot ratio is calculated to generate the first quality index. Based on the frequency of dynamic change of the integral coefficients in the adaptive PID parameter pair, the power fluctuation frequency is calculated, and a second quality index is generated. Obtain the factory test data of the soldering pen refill, and compare the combination of the first quality index and the second quality index with the factory test data of the refill. If the data exceeds the allowable range, output a warning signal and generate a quality warning event.

[0015] Thirdly, an electronic device is provided, comprising: a processor and a memory; the memory is used to store a computer program, which, when executed by the processor, causes the electronic device to perform the soldering iron system described in the first aspect.

[0016] In one possible design, the electronic device described in the third aspect may further include a transceiver. This transceiver may be a transceiver circuit or an interface circuit. The transceiver can be used for communication between the electronic device described in the third aspect and other electronic devices.

[0017] In the embodiments of the present invention, the electronic device described in the third aspect may be a terminal, or a chip (system) or other component or assembly disposed in the terminal, or a system containing the terminal.

[0018] Fourthly, a computer-readable storage medium is provided, comprising: a computer program or instructions; when the computer program or instructions are executed on a computer, the computer causes the computer to perform the soldering iron system described in the first aspect.

[0019] In summary, the above methods and systems have the following technical effects: 1. This invention analyzes pressure and temperature signals to achieve precise real-time segmentation of welding process parameters, enabling the power control strategy to transform from a single feedback mode to a multi-stage hybrid mode. Based on data processing segmentation and control switching, it can proactively address the heat demand in the early stages of welding and make fine adjustments during the stabilization period. Without sacrificing temperature control stability, it significantly improves the thermal response speed and resolves the inherent contradiction between rapid response and stable overshoot suppression in traditional control methods.

[0020] 2. This invention separates and quantifies the two core mechanisms affecting the lifespan of soldering pens: physical wear and thermal shock fatigue. It uses intermediate data such as welding strength substitute index and wear behavior characteristics generated during the control process to evaluate coating loss, avoiding the need for additional high-cost sensors. At the same time, it independently records the number of thermal shocks to evaluate the lifespan of the heating wire. Based on the calculation method of data reuse and dual model verification, it improves the accuracy and reliability of lifespan prediction and provides accurate data support for predictive maintenance. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the soldering iron system provided in an embodiment of the present invention; Figure 2 This is a block diagram of a soldering iron system provided in an embodiment of the present invention; Figure 3 This is a flowchart illustrating the soldering iron control method provided in an embodiment of the present invention. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0024] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0026] Figure 1 and Figure 2 This is a schematic diagram of the device provided in an embodiment of the present invention. An electric soldering iron system, applied in a system including a soldering station, a handle, and a soldering pen, includes: The signal acquisition module is used to acquire feedback signals from the posture sensor and pressure sensor at the handle end, as well as the temperature sensor signal at the soldering pen end. The power adjustment module is used to dynamically adjust the output power of the welding station according to the welding posture and pressure represented by the feedback signal; The data processing module is used to calculate and record relevant judgment data of the soldering iron based on the feedback signal.

[0027] The power regulation module includes a rapid temperature adjustment submodule, which has at least one of the following control strategies built-in, which can be selected by the user or adaptively identified and matched: The first strategy is to map the power pulse to the pressure range, control the positive correlation between the pressure magnitude and the power pulse duty cycle, and control the output power in an open-loop manner under the maximum temperature range of the welding station. The second strategy is to map the pressure range to the over-temperature range, control the pressure magnitude and the over-temperature value to be positively correlated, and configure the mapping slope of the low pressure range to be less than the mapping slope of the high pressure range. The third strategy is to perform interval weighted temperature compensation. The welding stage is determined by the power fluctuation and the rate of temperature loss. At different welding stages, the corresponding interval weighting value is selected according to the pressure to compensate the surface temperature of the welding pen.

[0028] It also includes an attitude assessment module, and the attitude sensor includes a gyroscope. The attitude assessment module is configured as follows: If the gyroscope data shows an acceleration characteristic after being stationary, it is determined to be in a picked-up state, triggering the power adjustment module to start heating. If the calculated angle indicates that the soldering pen is in a horizontal position, it is determined to be in a desktop position, and the power adjustment module is triggered to stop heating. If the gyroscope data shows characteristics of violent movement followed by stillness, it is determined to be a falling state, triggering the power adjustment module to stop heating. If the pose data recovers to the initial static state, it is determined to be in sleep mode.

[0029] The above combination Figure 1 and 2 The apparatus provided in the embodiments of the present invention has been described in detail. The following details a method for controlling a soldering iron provided in the embodiments of the present invention, including the following steps: Acquire the pressure signal from the pressure sensor in the handle and the temperature signal from the temperature sensor in the soldering pen; Calculate the second derivative of the pressure signal and the first derivative of the temperature signal to generate a time-domain differential parameter pair; Based on the temporal crossover point between the peak time of the second derivative and the turning point of the slope of the first derivative in the time-domain differential parameter pair, a welding process is divided into four sub-stages: contact period, stabilization period, finishing period and settling period, and a stage division identifier sequence is generated. Obtain the heat capacity coefficient of the soldering pen, which characterizes the thermal properties of the soldering pen, and extract the real-time pressure value of the pressure signal during the contact period and map it to generate a dynamic contact thermal resistance coefficient. Based on the contact period label in the stage division identifier sequence, combined with the first derivative of the pressure signal, the dynamic contact thermal resistance coefficient and the welding pen heat capacity coefficient, the advanced compensation heat value is calculated, and the advanced power pulse parameter is generated. Power pulses are injected into the soldering pen in an open-loop manner according to the advanced power pulse parameters, and when the stage division identifier sequence is switched to the stable period label, the control is switched to closed-loop PID control to generate the first temperature control status data.

[0030] The system precisely divides the welding process into stages by calculating the time-domain differentials of the pressure and temperature signals in real time. Specifically, the welding process is divided into contact period, stabilization period, finishing period, and settling period, with the moment when the peak of the second derivative of the pressure signal appears and the moment when the slope of the first derivative (heating rate) of the temperature signal turns as the time intersection point.

[0031] During the contact phase, the system performs feedforward heat compensation in an open-loop manner. By acquiring the average first derivative of the pressure signal during the contact phase and combining it with the pre-stored heat capacity coefficient of the soldering iron, a leading power pulse is calculated and output to overcome the initial heat sink of the solder joint. When switching to the steady-state phase, the control strategy seamlessly switches to closed-loop PID control.

[0032] In one specific embodiment of the present invention, the system synchronously acquires pressure and temperature signals at a high-frequency sampling rate of, for example, 1 kHz using a built-in microcontroller (MCU).

[0033] Traditional single-threshold judgment is easily affected by sensor static drift and the force applied by different operators. This system uses time-domain differentiation technology to calculate the second derivative of the pressure signal and the first derivative of the temperature signal. The second derivative of the pressure signal mathematically represents the degree of abrupt change in the pressure rate and is used to capture the micromechanical characteristics at the moment when the soldering pen and the solder pad make rigid contact. The first derivative of the temperature signal represents the real-time rate of temperature change.

[0034] In a typical welding operation, the specific process of stage segmentation is as follows: The moment the soldering pen descends and makes contact with the hard pad, the upward slope of the pressure signal changes abruptly. The system captures this abrupt change and detects that the second derivative of the pressure signal reaches a positive peak (e.g., at t = 50ms). This peak precisely defines the starting point of physical contact on the physical boundary. Subsequently, due to the heat absorption of the pad, the temperature of the soldering pen tip begins to decrease. The system detects the moment when the slope of the first derivative of the temperature signal changes from negative to positive (e.g., at t = 85ms), indicating that heat has begun to be steadily conducted to the pad, and preliminary thermal equilibrium has been established.

[0035] The time-series intersection point (i.e., the interval between 50ms and 85ms) between the peak of the second derivative and the turning point of the slope of the first derivative is precisely defined as the contact period.

[0036] Feedforward compensation involves extracting the mean value of the first derivative of the pressure signal (e.g., 40 g / s) within the defined contact period to assess the mechanical impact contact rate, while simultaneously extracting the absolute pressure value within the contact period in real time.

[0037] The pressure applied by the operator directly determines the effective physical contact area between the soldering tip and the solder pad, which in turn determines the contact thermal resistance between them: the greater the pressure, the tighter the contact, the smaller the dynamic contact thermal resistance, and the faster the transient rate of heat loss to the solder pad. Based on this physical mechanism, the system first calculates the dynamic contact thermal resistance coefficient using a preset inverse proportional mapping model based on the real-time pressure value. .

[0038] Subsequently, the soldering iron heat capacity coefficient preset in the system memory was combined with the following parameters. (e.g., 0.8 J / ℃), the mean of the first derivative of the pressure signal, and the dynamic contact thermal resistance coefficient. Together, they calculate the instantaneous heat that needs to be replenished. Because of the introduction of thermal resistance assessment, the system can accurately characterize the smoothness of heat loss channels.

[0039] For example, under low thermal resistance (high pressure) conditions, heat is lost very quickly, and the system will output a leading power pulse with higher amplitude and shorter pulse width to quickly fill the thermal deficit; Under high thermal resistance (low pressure) conditions, the amplitude is reduced to avoid localized overheating. The system then generates adaptive lead power pulse parameters (e.g., amplitude of 90W, duration of 100ms) and directly drives the power drive circuit in an open-loop manner. By incorporating "heating before cooling" feedforward injection based on dynamic thermal resistance assessment, it truly achieves precise compensation based on actual physical conduction capacity, effectively overcoming the "heat sink effect" at the moment of contact and avoiding a precipitous drop in temperature.

[0040] After generating the first temperature control status data, the following steps are also included: During the stabilization period, the error value between the temperature signal and the target set temperature value is acquired in real time, and the error change rate and error precipitate rate of the error value are calculated. The real-time output power value of the soldering station is acquired synchronously, and the power change rate and power spurious change rate of the output power value are calculated. A multidimensional control input matrix is ​​constructed based on the error value, error change rate, error precipitate rate, and output power value, power change rate, and power precipitate rate. Basic PID parameters are generated by mapping the multidimensional control input matrix according to the preset control strategy model. The high-frequency fluctuation amplitude and pressure value of the pressure signal are acquired in real time, and the basic PID parameters are corrected based on the high-frequency fluctuation amplitude and pressure value of the pressure signal to generate an adaptive PID parameter pair. Based on the adaptive PID parameters and the error value, calculate and output the power adjustment command to generate the second temperature control status data; When the stage division identifier sequence is switched to the closing period label, the closing temperature offset for reducing residual solder oxidation is obtained, and the target set temperature value is actively reduced according to the closing temperature offset to generate a closing temperature control command. Detailed implementation method: After generating the first temperature control status data, the system enters the stable closed-loop control phase.

[0042] To completely resolve the contradictions of "slow temperature recovery" or "temperature overshoot" that easily occur when dealing with complex pads (such as pads of different sizes and different heat absorption rates) in the traditional single feedback mode, this embodiment adopts a composite dynamic PID regulation strategy of "main control loop + auxiliary pressure correction loop".

[0043] Step 1: The multi-dimensional matrix optimization system for basic PID parameters not only focuses on the current temperature deviation, but also on the changing trends of temperature and energy.

[0044] Specifically, the control system's microcontroller (MCU) calculates six core input parameters in real time: (Error value): The difference between the actual temperature and the target set temperature; (Error Change Rate): The first derivative of the error value, reflecting the rate at which current temperature is lost or accumulated; (Error Sharp Change Rate): The second derivative of the error value, reflecting the acceleration of the temperature change rate (i.e., the sudden change in thermal conductivity of the pad due to solder melting or contact with the chassis). P (Real-time Output Power): The current power output status of the soldering station; (Power change rate): The first derivative of the output power; (Power swiftness): The second derivative of the output power.

[0045] The system integrates the above six parameters into a multi-dimensional control input matrix, and dynamically looks up or calculates the most suitable basic PID parameters (including the basic proportional coefficient) for the current state using a preset neural network PID algorithm or fuzzy PID algorithm. Integral coefficient and differential coefficients ).

[0046] This process can extremely sensitively capture microscopic states such as "secondary heat drop when the tin surface melts", thus intervening in power output in advance.

[0047] Step Two: Adaptive Correction Based on Pressure Signal After acquiring the basic PID parameters, considering that the mechanical pressure applied by the operator directly changes the contact thermal resistance between the soldering pen and the solder pad, the system further introduces a pressure signal for parameter correction. The high-frequency fluctuation amplitude of the pressure signal is acquired in real time. Based on the current pressure values, the following correction model is established (using the integral coefficient as an example): In the formula, is the adaptive integral coefficient of the final output; f(Press) is the gain function related to the pressure value (the higher the pressure, the lower the thermal resistance, and the gain can be adjusted appropriately to prevent overshoot). This is the sensitivity adjustment coefficient.

[0048] Through the two-step method of "first selecting multi-dimensional states, then dynamically correcting pressure", the system finally generates an adaptive PID parameter pair and outputs a precise power adjustment command (i.e., the second temperature control state data) accordingly, thus maintaining extremely high temperature control stability even in the most demanding large solder joint welding.

[0049] When the soldering process switches to the final stage, the system reads the preset final temperature offset (e.g., 25°C) and actively lowers the target set temperature value to guide the solder pen to cool down smoothly and reduce residual solder oxidation.

[0050] After generating the aforementioned lead power pulse parameters, the following steps are also included: The amplitude of the advanced power pulse parameter is extracted as a substitute index for welding strength. The average value of the first derivative of the pressure signal during the contact period is extracted as a steady-state wear behavior feature. The peak value of the second derivative of the pressure signal during the contact period is extracted as a rigid impact feature. A first set of life influence factors is generated. Obtain a coating temperature coefficient table that reflects the coating loss rate at different temperatures. Calculate the cumulative steady-state wear value of the coating based on the welding strength substitution index and steady-state wear behavior characteristics in the first set of life-affecting factors, combined with the coating temperature coefficient table. The rigid impact characteristic quantity in the first life influencing factor set is compared with the preset safety rigidity threshold. If it exceeds the safety rigidity threshold, an early failure risk coefficient is introduced to amplify the steady-state wear accumulation value of the coating in a step-wise manner to generate the first wear life prediction value. Independent of the calculation path of the first wear life prediction value, the number of times the stage division identifier sequence switches from the resting period to the contact period is counted as the number of thermal shocks to generate the second life prediction value. After generating the first wear life prediction value and the second wear life prediction value, the following steps are also included: Obtain the deviation threshold used to determine the degree of deviation of the life model, compare the first wear life prediction value with the second life prediction value, calculate the deviation ratio, and generate cross-validation results; If the cross-validation result exceeds the deviation threshold, an upward adjustment safety factor is obtained to compensate for the decrease in heat conduction efficiency, and the amplitude of the lead power pulse parameter is corrected using the upward adjustment safety factor to generate the corrected lead power pulse parameter. The corrected advanced power pulse parameters are used to derive and update the heat capacity coefficient of the soldering pen, thereby generating adaptive heat capacity parameters. Detailed implementation method: The system constructs a two-dimensional lifetime model based on coating wear and thermal shock. The calculation model for coating wear increment is as follows: in, This refers to the increase in coating wear caused by a single welding operation. The coating temperature coefficients corresponding to different operating temperatures. The amplitude of the leading power pulse parameter (characterizing welding strength). : The average value of the first derivative of the pressure signal during the contact period (characterizing mechanical impact).

[0052] In addition, the system calculates the normalized deviation ratio between the first wear life prediction value (coating) and the second wear life prediction value (thermal shock count of heating wire) for cross-validation: in, The deviation ratio, This represents the normalized percentage of coating lifetime consumption. This represents the normalized percentage of heating wire lifespan consumption.

[0053] like If the value exceeds the preset threshold, it indicates that the heat conduction efficiency of the soldering pen has decreased. The system retrieves and adjusts the safety factor to correct the amplitude of the leading power pulse, and updates the heat capacity coefficient of the soldering pen in reverse to achieve adaptive compensation for device aging. Detailed implementation method: The system constructs a two-dimensional lifetime model based on kinetic physics mechanisms, considering both coating wear and thermal shock. Building upon traditional time-accumulation-based assessments, this embodiment introduces the classic Archard wear equation (…). A variant of the model assigns a clear mechanical damage connotation to the time-domain derivative of the pressure signal: The first derivative of force is related to emergency dynamics, which characterizes the steady-state wear rate caused by micro-vibration impact and surface fatigue cracks. The second derivative of force corresponds to the "acceleration" of the impact, characterizing the risk of transient early failure caused by surface indentation, edge chipping, etc., resulting from peak loads and rigid collisions. The calculation and judgment logic for coating wear in a single welding process is as follows: Step 1: Calculate the steady-state wear increment of the coating: in, The steady-state wear increment of the coating caused by a single welding operation; The coating temperature coefficients corresponding to different operating temperatures; The amplitude of the leading power pulse parameter (characterizing the intensity of thermal strain); It is the average value of the first derivative of the pressure signal during the contact period (characterizing steady-state mechanical fatigue wear caused by abrupt changes).

[0055] Step 2: Combine rigid impact assessment to determine early failure risk and generate the first wear life prediction value: The peak value of the second derivative of the pressure signal during the contact period is extracted as a rigid impact characteristic quantity. System judgment Is it greater than the preset safety rigidity threshold? .

[0056] like This indicates that a violent rigid collision occurred at the moment of contact, triggering the risk of early failure, at which point the total wear increment... ( (For an early failure risk coefficient greater than 1, a step-wise penalty amplification is applied to the wear accumulation). like Then the total wear increment .

[0057] Will The cumulative amount is taken into account to generate the first wear life prediction value (coating).

[0058] In addition, the system independently calculates the normalized deviation ratio between the first wear life prediction value (coating) and the second life prediction value (thermal shock count of heating wire) for cross-validation: in, The deviation ratio, This represents the normalized percentage of coating lifetime consumption. This represents the normalized percentage of heating wire lifespan consumption. If the value exceeds the preset threshold, it indicates that the internal heat conduction efficiency of the soldering pen has abnormally decreased. The system retrieves and adjusts the safety factor to correct the amplitude of the leading power pulse, and updates the heat capacity coefficient of the soldering pen in reverse to achieve adaptive compensation for device aging.

[0059] After generating the aforementioned lead power pulse parameters, the following steps are also included: Obtain weighting coefficients for balancing electrical energy input and mechanical pressure, and combine the peak value of the first derivative of the pressure signal during the contact period with the amplitude of the advance power pulse parameter according to the weighting coefficients to generate a single welding energy reference index. The welding strength index is generated by correlating the single welding energy reference index with the average value of the temperature signal during the contact period and the stabilization period. The welding strength index is packaged with the timestamps in the stage division identifier sequence to generate welding event summary data. Detailed implementation method: The system combines electrical energy input with mechanical pressure during a single welding operation to calculate a reference energy index for that operation. In the formula, This serves as a reference indicator for the energy required for a single welding operation. A dimensionless weighting coefficient used to balance electrical energy input and mechanical pressure. This represents the peak value of the first derivative of the pressure signal during the contact period.

[0061] By The welding strength index is generated by multiplying the average temperature during the contact period and the stabilization period, and then packaged with the timestamp to generate welding event summary data.

[0062] After generating the second temperature control status data, the following steps are also included: Based on the power value corresponding to the power adjustment command in the second temperature control status data and the actual rise time of the temperature signal, the overshoot ratio is calculated to generate the first quality index. Based on the frequency of dynamic change of the integral coefficients in the adaptive PID parameter pair, the power fluctuation frequency is calculated, and a second quality index is generated. Obtain the factory test data of the soldering pen refill, and compare the combination of the first quality index and the second quality index with the factory test data of the refill. If the data exceeds the allowable range, output a warning signal and generate a quality warning event.

[0063] The system comprehensively evaluates thermal response performance by analyzing the overshoot ratio, rise time, and settling time during a single complete heating process. The overshoot ratio is calculated as follows: In the formula: For overshoot ratio, This refers to the peak temperature reached by the temperature signal during the heating process. A target temperature is set, where the stabilization time is defined as the time span required for the temperature signal to recover and remain within a preset error band (e.g., a temperature range of ±2 degrees Celsius) from the point of contact when it is disturbed by the heat load.

[0064] The system combines a first quality indicator, which includes the overshoot ratio, rise time, and settling time, with a second quality indicator, which characterizes control stability, namely the frequency of dynamic change of the integral coefficient, to obtain the factory test data of the soldering pen refill as a judgment benchmark. If any of the above indicators is detected to exceed the pre-stored factory test qualified range, such as the settling time being greater than the preset maximum allowable recovery time, an early warning signal is output, generating a quality early warning event.

[0065] The electronic device provided in this embodiment of the invention, exemplarily, can be a network device, or a chip (system) or other component or assembly that can be disposed in a network device. The electronic device may include a processor. Optionally, the electronic device may also include a memory and / or a transceiver. The processor is coupled to the memory and transceiver, for example, by means of a communication bus connection.

[0066] In the several embodiments provided in this invention, it should be understood that the disclosed systems and methods can also be implemented in other ways. The system and method embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0067] In addition, the functional modules in the various embodiments of the present invention can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0068] If the aforementioned functions are implemented as software functional modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, an electronic device, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention.

[0069] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A soldering iron system, characterized in that, Applications include systems containing soldering stations, handles, and soldering pens, including: The signal acquisition module is used to acquire feedback signals from the posture sensor and pressure sensor at the handle end, as well as the temperature sensor signal at the soldering pen end. The power adjustment module is used to dynamically adjust the output power of the welding station according to the welding posture and pressure represented by the feedback signal; The data processing module is used to calculate and record the relevant judgment data of the soldering iron based on the feedback signal.

2. The soldering iron system according to claim 1, characterized in that, The power regulation module includes a rapid temperature adjustment submodule, which has at least one of the following control strategies built-in, which can be selected by the user or adaptively identified and matched: The first strategy is to map the power pulse to the pressure range, control the positive correlation between the pressure magnitude and the power pulse duty cycle, and control the output power in an open-loop manner under the maximum temperature range of the welding station. The second strategy is to map the pressure range to the over-temperature range, control the pressure magnitude and the over-temperature value to be positively correlated, and configure the mapping slope of the low pressure range to be less than the mapping slope of the high pressure range. The third strategy is to perform interval weighted temperature compensation. The welding stage is determined by the power fluctuation and the rate of temperature loss. At different welding stages, the corresponding interval weighting value is selected according to the pressure to compensate the surface temperature of the welding pen.

3. The soldering iron system according to claim 2, characterized in that, It also includes an attitude assessment module, and the attitude sensor includes a gyroscope. The attitude assessment module is configured as follows: If the gyroscope data shows an acceleration characteristic after being stationary, it is determined to be in a picked-up state, triggering the power adjustment module to start heating. If the calculated angle indicates that the soldering pen is in a horizontal position, it is determined to be in a desktop position, and the power adjustment module is triggered to stop heating. If the gyroscope data shows characteristics of violent movement followed by stillness, it is determined to be a falling state, triggering the power adjustment module to stop heating. If the pose data recovers to the initial static state, it is determined to be in sleep mode.

4. The soldering iron system according to claim 1, characterized in that, The data processing module includes: The life detection submodule is used to measure the voltage and current transmitted to the soldering pen in real time to calculate the power, and to perform weighted calculation and accumulation based on the temperature and the magnitude of the pressure to obtain the coating wear condition; and to record the number of soldering operations in which the soldering pen withstands the maximum thermal shock to evaluate the life of the heating wire. The quality monitoring submodule outputs an over-temperature or abnormal temperature warning signal when the temperature rise time or overshoot ratio exceeds the preset safety threshold during PID temperature control.

5. The soldering iron system according to claim 4, characterized in that, It also includes a data traceability module, which is configured as follows: Encrypted communication is established with the readable IC built into the soldering pen, and the unique ID of the soldering pen, the total flow of welding energy, the number of large temperature difference impacts and the performance of control parameters are written to or read from the readable IC. The lifespan data and control parameters of the soldering pen are uploaded to a cloud server via a communication network for traceability.

6. A soldering iron control method, applied to the soldering iron system according to any one of claims 1-5, characterized in that, Includes the following steps: Acquire the pressure signal from the pressure sensor in the handle and the temperature signal from the temperature sensor in the soldering pen; Calculate the second derivative of the pressure signal and the first derivative of the temperature signal to generate a time-domain differential parameter pair; Based on the temporal crossover point between the peak time of the second derivative and the turning point of the slope of the first derivative in the time-domain differential parameter pair, a welding process is divided into four sub-stages: contact period, stabilization period, finishing period and settling period, and a stage division identifier sequence is generated. Obtain the heat capacity coefficient of the soldering pen, which characterizes the thermal properties of the soldering pen, and extract the real-time pressure value of the pressure signal during the contact period and map it to generate a dynamic contact thermal resistance coefficient. Based on the contact period label in the stage division identifier sequence, combined with the first derivative of the pressure signal, the dynamic contact thermal resistance coefficient and the welding pen heat capacity coefficient, the advanced compensation heat value is calculated, and the advanced power pulse parameter is generated. Power pulses are injected into the soldering pen in an open-loop manner according to the advanced power pulse parameters, and when the stage division identifier sequence is switched to the stable period label, the control is switched to closed-loop PID control to generate the first temperature control status data.

7. The method according to claim 6, characterized in that, After generating the first temperature control status data, the following steps are also included: During the stabilization period, the error value between the temperature signal and the target set temperature value is acquired in real time, and the error change rate and error precipitate rate of the error value are calculated. The real-time output power value of the soldering station is acquired synchronously, and the power change rate and power spurious change rate of the output power value are calculated. A multidimensional control input matrix is ​​constructed based on the error value, error change rate, error precipitate rate, and output power value, power change rate, and power precipitate rate. Basic PID parameters are generated by mapping the multidimensional control input matrix according to the preset control strategy model. The high-frequency fluctuation amplitude and pressure value of the pressure signal are acquired in real time, and the basic PID parameters are corrected based on the high-frequency fluctuation amplitude and pressure value of the pressure signal to generate an adaptive PID parameter pair. Based on the adaptive PID parameters and the error value, calculate and output the power adjustment command to generate the second temperature control status data; When the stage division identifier sequence is switched to the closing period label, the closing temperature offset for reducing residual solder oxidation is obtained, and the target set temperature value is actively reduced according to the closing temperature offset to generate a closing temperature control command.

8. The method according to claim 6, characterized in that, After generating the aforementioned lead power pulse parameters, the following steps are also included: The amplitude of the advanced power pulse parameter is extracted as a substitute index for welding strength. The average value of the first derivative of the pressure signal during the contact period is extracted as a steady-state wear behavior feature. The peak value of the second derivative of the pressure signal during the contact period is extracted as a rigid impact feature. A first set of life influence factors is generated. Obtain a coating temperature coefficient table that reflects the coating loss rate at different temperatures. Calculate the cumulative steady-state wear value of the coating based on the welding strength substitution index and steady-state wear behavior characteristics in the first set of life-affecting factors, combined with the coating temperature coefficient table. The rigid impact characteristic quantity in the first life influencing factor set is compared with the preset safety rigidity threshold. If it exceeds the safety rigidity threshold, an early failure risk coefficient is introduced to amplify the steady-state wear accumulation value of the coating in a step-wise manner to generate the first wear life prediction value. Independent of the calculation path of the first wear life prediction value, the number of times the stage division identifier sequence switches from the resting period to the contact period is counted as the number of thermal shocks to generate the second life prediction value. After generating the first wear life prediction value and the second wear life prediction value, the following steps are also included: Obtain the deviation threshold used to determine the degree of deviation of the life model, compare the first wear life prediction value with the second life prediction value, calculate the deviation ratio, and generate cross-validation results; If the cross-validation result exceeds the deviation threshold, an upward adjustment safety factor is obtained to compensate for the decrease in heat conduction efficiency, and the amplitude of the lead power pulse parameter is corrected using the upward adjustment safety factor to generate the corrected lead power pulse parameter. The corrected advanced power pulse parameters are used to derive and update the heat capacity coefficient of the soldering pen, thereby generating adaptive heat capacity parameters.

9. The method according to claim 7, characterized in that, After generating the aforementioned lead power pulse parameters, the following steps are also included: Obtain weighting coefficients for balancing electrical energy input and mechanical pressure, and combine the peak value of the first derivative of the pressure signal during the contact period with the amplitude of the advance power pulse parameter according to the weighting coefficients to generate a single welding energy reference index. The welding strength index is generated by correlating the single welding energy reference index with the average value of the temperature signal during the contact period and the stabilization period. The welding strength index is packaged with the timestamps in the stage division identifier sequence to generate welding event summary data.

10. The method according to claim 7, characterized in that, After generating the second temperature control status data, the following steps are also included: Based on the power value corresponding to the power adjustment command in the second temperature control status data and the actual rise time of the temperature signal, the overshoot ratio is calculated to generate the first quality index. Based on the frequency of dynamic change of the integral coefficients in the adaptive PID parameter pair, the power fluctuation frequency is calculated, and a second quality index is generated. Obtain the factory test data of the soldering pen refill, and compare the combination of the first quality index and the second quality index with the factory test data of the refill. If the data exceeds the allowable range, output a warning signal and generate a quality warning event.

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