Underwater femtosecond laser-assisted water-abrasive hydrodynamic pressure effect machining equipment

Abstract

The application relates to an underwater femtosecond laser-assisted water-abrasive hydrodynamic pressure effect machining equipment, which comprises an outer shell internally provided with a machining cavity, a fluid circulation mechanism, a wafer clamping mechanism, a laser focusing mechanism, a variable convergence angle converging wedge module, an online monitoring system and an information acquisition and control system; the variable convergence angle converging wedge module comprises a first converging flow guide component, a second converging flow guide component and a driving mechanism, a converging flow channel parallel to the machining surface of a wafer to be machined is formed between the first converging flow guide component and the second converging flow guide component; at least one of the two converging flow guide components is connected with the driving mechanism, the driving mechanism drives the converging flow guide components to displace relative to the machining cavity to change the convergence angle between the two converging flow guide components and the width change of the converging flow channel along the fluid flow direction. By adjusting the convergence angle, the velocity gradient and the dynamic pressure gradient in the wafer machining area can be changed, so that the flow field regulation capability and the machining stability are improved.

Description

Technical Field

[0001] This invention relates to the field of laser processing and polishing machine technology, and in particular to an underwater femtosecond laser-assisted water-abrasive hydrodynamic pressure effect processing equipment. Background Technology

[0002] With the increasing demands for precision and quality in modern industrial material surface processing, traditional machining methods are no longer sufficient to meet the requirements for high-precision, low-damage processing of hard and brittle materials such as silicon carbide, sapphire, and silicon wafers. In recent years, laser processing technology has gradually become an important means of material surface processing due to its advantages such as non-contact operation, high precision, and low heat-affected zone. However, laser processing alone still has limitations in terms of material removal efficiency and surface quality in certain areas.

[0003] Water-abrasive hydrodynamic processing, as a novel composite processing method, combines the hydrodynamic effect, the mechanical removal effect of abrasive flow, and the surface modification effect of femtosecond laser. This technology introduces a water-abrasive mixture into the femtosecond laser processing, which not only removes processing heat and residue but also utilizes hydrodynamic pressure to promote the migration or removal of photo-induced bubbles, thereby improving processing stability and surface finish.

[0004] However, existing underwater laser-assisted water-abrasive fluid hybrid processing equipment typically incorporates convergent channels in the wafer processing area to increase fluid velocity and generate hydrodynamic pressure. However, these channels often employ guide members with fixed or preset angles, or can only change the channel cross-sectional area through overall displacement, making it difficult to continuously alter the geometric convergence angle between the working surfaces during processing. Since different wafer materials, processing locations, laser parameters, and water-abrasive flow states require different hydrodynamic pressure distributions, fixed or limited-adjustment convergence structures are ill-suited to adapt to varying processing conditions. Furthermore, devices that partially alter the channel cross-section are primarily used for flow control or throttling, aiming to narrow or close the channel rather than adjusting the convergence angle and hydrodynamic pressure gradient parallel to the wafer processing surface while maintaining continuous fluid flow. Therefore, there is a need to design an underwater femtosecond laser-assisted water-abrasive fluid hydrodynamic pressure effect processing equipment capable of actively changing the convergence angle during wafer processing and maintaining continuous flow through the processing channel. This has significant theoretical research value and engineering application potential. Summary of the Invention

[0005] In view of this, the purpose of the present invention is to provide an underwater femtosecond laser-assisted water-abrasive hydrodynamic pressure effect processing equipment, which can change the velocity gradient and hydrodynamic pressure gradient in the wafer processing area by adjusting the convergence angle, so as to improve the flow field regulation capability and processing stability.

[0006] This invention is implemented using the following scheme: an underwater femtosecond laser-assisted water-abrasive hydrodynamic effect processing equipment, comprising an outer shell with an internal processing cavity, a fluid circulation mechanism, a wafer clamping mechanism, a laser focusing mechanism, a variable convergence angle convergence wedge module, an online monitoring system, and an information acquisition and control system; the variable convergence angle convergence wedge module is disposed within the processing cavity; the variable convergence angle convergence wedge module includes a first convergence guide member, a second convergence guide member, and a driving mechanism arranged opposite to each other, wherein a convergence channel parallel to the processing surface of the wafer to be processed is formed between the first and second convergence guide members; at least one of the first and second convergence guide members is connected to the driving mechanism, and the driving mechanism drives the convergence guide member to move relative to the processing cavity to change the convergence angle between the two convergence guide members and the width of the convergence channel along the fluid flow direction.

[0007] Furthermore, at least one of the first and second convergent flow guiding components is rotatably connected to the processing cavity via a rotating shaft, and the driving mechanism is connected to a position on the convergent flow guiding component away from the rotating shaft.

[0008] Furthermore, at least one of the first and second convergent flow guiding components is provided with multiple adjustment parts along the fluid flow direction. The multiple adjustment parts are respectively connected to the corresponding drive mechanism to change the angular position at different positions of the convergent flow guiding component.

[0009] Furthermore, the first and second convergent flow guiding components are rigid flow guiding plates, flexible flow guiding plates, or chain-like flow guiding plates formed by multiple hinged segments.

[0010] Furthermore, the outer shell has an inlet end and an outlet end communicating with the processing cavity at both ends. The fluid circulation mechanism includes a processing fluid circulation pipeline connected to both ends of the outer shell. The circulation pipeline is provided with a filter, a stirrer, and a variable pressure water pump in sequence along the fluid flow direction; a rectifier, a waste collection chamber, a waste liquid recovery tank, and a drain valve; the rectifier is provided inside the outer shell near the inlet end, the slag discharge end of the filter is connected to the waste collection chamber, and a drain branch is connected to the end of the processing fluid circulation pipeline between the filter and the stirrer. The drain branch is connected to the waste liquid recovery tank and is provided with a drain valve.

[0011] Furthermore, the wafer clamping mechanism is located on the outer shell and includes a wafer support platform located below the processing cavity and embedded in the bottom of the outer shell. The wafer support platform has a negative pressure adsorption hole, and a negative pressure suction pipe connected to the lower port of the negative pressure adsorption hole is provided below the wafer support platform. A sealing ring is fitted on the outer periphery of the wafer support platform.

[0012] Furthermore, the laser focusing mechanism includes a lens, a galvanometer, and a laser source arranged sequentially from bottom to top. The lens is located above the processing cavity and embedded in the top of the outer shell. A sealing ring is fitted around the outer periphery of the lens. The galvanometer and the lens are coaxially arranged with the wafer support stage. The laser source emits laser light, which passes through the galvanometer and the lens and is directed toward the wafer support stage.

[0013] Furthermore, the online monitoring system includes an acoustic emission signal monitor, a spectral signal monitor, and a vision camera; the acoustic emission signal monitor is located on the top of the housing and is used to collect acoustic emission signals during the processing; the spectral signal monitor is located above the housing and at the propagation path of the scattered laser, and is used to collect the scattered or reflected spectral signals of the wafer processing surface; the vision camera is located above the lens or on the coaxial observation optical path of the laser focusing mechanism, and is used to collect images of the wafer surface morphology and bubbles in the processing area.

[0014] Furthermore, the information acquisition and control system includes a data acquisition card, a host computer, and a PLC controller; the acoustic emission signal monitor, the spectral signal monitor, and the visual camera are all connected to the data acquisition card, and the host computer is communicatively connected to the PLC controller.

[0015] Compared with the prior art, the present invention has the following beneficial effects: the femtosecond laser of the present invention is focused onto the wafer surface by a galvanometer and a lens, and works synergistically with the dynamic pressure effect formed by the water-abrasive mixed fluid. By adjusting the convergence angle, the velocity gradient and dynamic pressure gradient in the wafer processing area can be changed to improve the flow field regulation capability and processing stability, and achieve flow field control suitable for different processing states.

[0016] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below through specific embodiments and related drawings. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present invention; Figure 2 This is a top view of the convergent flow channel according to an embodiment of the present invention; Figure 3 This is an isometric schematic diagram of the external structure of the processing cavity according to an embodiment of the present invention; In the diagram: 1-Variable pressure water pump; 2-Inlet end; 3-Rectifier; 4-Acoustic emission signal monitor; 5-Sealing ring; 6-Lens; 7-Galvanometer; 8-Laser source; 9-Vision camera; 10-Scattered laser; 11-Housing shell; 12-Spectral signal monitor; 13-Outlet end; 14-Data acquisition card; 15-Host computer; 16-Wafer support stage; 17-Negative pressure suction pipe; 18-Waste collection chamber; 19-Filter; 20-PLC controller; 21-Waste liquid recovery tank; 22-Drain valve; 23-Agitator; 24-Rotating shaft; 25-Telescopic rod; 26-Control motor; 27-First convergent flow guiding component; 28-Second convergent flow guiding component. Detailed Implementation

[0018] It should be noted that the following detailed descriptions are exemplary and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0019] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0020] like Figures 1-3 As shown, an underwater femtosecond laser-assisted water-abrasive hydrodynamic effect processing equipment includes a shell 11 with an internal processing cavity, a fluid circulation mechanism, a wafer clamping mechanism, a laser focusing mechanism, a variable convergence angle convergence wedge module, an online monitoring system, and an information acquisition and control system. The shell 11 is generally light-shielding. The variable convergence angle convergence wedge module is disposed within the processing cavity. The variable convergence angle convergence wedge module includes a first convergence guide member 27 and a second convergence guide member 28 arranged opposite to each other, and a driving mechanism. A convergence channel parallel to the processing surface of the wafer to be processed is formed between the first and second convergence guide members. At least one of the first and second convergence guide members is connected to the driving mechanism. The driving mechanism drives the convergence guide members to move relative to the processing cavity to change the convergence angle between the two convergence guide members and the width of the convergence channel along the fluid flow direction. The adjustment direction of the convergence angle is parallel to the processing surface of the wafer to be processed, so as to change the fluid velocity gradient and hydrodynamic pressure gradient along the wafer surface direction in the wafer processing area. The first convergent flow guiding component and the second convergent flow guiding component each have a first convergent working surface and a second convergent working surface facing the convergent flow channel.

[0021] The first and second convergent flow guiding components are respectively connected to corresponding driving mechanisms. The two driving mechanisms can operate synchronously or separately to form a symmetrical convergent flow channel or an asymmetrical convergent flow channel.

[0022] The femtosecond laser is focused onto the wafer surface by a galvanometer and a lens, and works synergistically with the hydrodynamic pressure effect formed by the water-abrasive mixture. By adjusting the convergence angle, the velocity gradient and hydrodynamic pressure gradient in the wafer processing area can be changed to improve the flow field regulation capability and processing stability.

[0023] In this embodiment, the first convergent flow guide member 27 and the second convergent flow guide member 28 are rigid flow guide plates. At least one of the first convergent flow guide member and the second convergent flow guide member is rotatably connected to the processing cavity via a rotating shaft. The driving mechanism is connected to a position on the convergent flow guide member away from the rotating shaft.

[0024] In this embodiment, the driving mechanism can be an electric push rod, including a control motor 26 and a telescopic rod 25. One end of the telescopic rod is connected to the control motor, and the other end is connected to the corresponding convergent flow guiding component. The control motor drives the telescopic rod to extend or retract, causing the corresponding convergent flow guiding component to rotate around the rotation axis. When the control motor 26 drives the telescopic rod 25 to produce different displacements, the included angle between the first convergent flow guiding component 27 and the second convergent flow guiding component 28 changes, thereby changing the convergence angle α and the width of the convergent flow channel along the fluid flow direction.

[0025] The converging flow guiding component in this invention is not limited to a single form. In specific implementations, the first and second converging flow guiding components can also be flexible guide plates or chain-like guide plates formed by multiple hinged segments. At least one of the first and second converging flow guiding components is provided with multiple adjustment sections along the fluid flow direction. The number of driving mechanisms on the outside of the converging flow guiding component corresponds one-to-one with the number of adjustment sections. The multiple adjustment sections are connected to the corresponding driving mechanisms to change the angular position at different locations of the converging flow guiding component. If a flexible guide plate is used, the converging flow guiding component can be divided into multiple segments along the fluid flow direction, with each segment being an adjustment section. If a chain-like guide plate formed by multiple hinged segments is used, each segment can also be an adjustment section. Multiple driving mechanisms drive multiple adjustment sections to shift, and each adjustment section changes its own angular position, thereby enabling the multiple adjustment sections to collectively change the convergence angle between the two converging flow guiding components and the width of the converging flow channel along the fluid flow direction.

[0026] In this embodiment, the outer shell 11 has an inlet end 2 and an outlet end 13 at both ends that communicate with the processing cavity. The fluid circulation mechanism includes a processing fluid circulation pipeline connected to both ends of the outer shell 11. The circulation pipeline is provided with a filter 19, a stirrer 23 and a variable pressure water pump 1 in sequence along the fluid flow direction; a rectifier 3, a waste collection chamber 18, a waste liquid recovery tank 21 and a drain valve 22. The rectifier 3 is provided inside the outer shell 11 near the inlet end 2. The slag discharge end of the filter 19 is connected to the waste collection chamber 18. A drain branch is connected to the end of the processing fluid circulation pipeline between the filter 19 and the stirrer 23. The drain branch is connected to the waste liquid recovery tank 21 and is provided with a drain valve 22, which is used to discharge the waste liquid in the circulation pipeline into the waste liquid recovery tank 21 when the processing fluid is replaced, the equipment is cleaned or the pollution level of the circulating fluid reaches a set threshold.

[0027] In this embodiment, the wafer clamping mechanism is mounted on the outer casing and includes a wafer support platform 16 located below the processing cavity and embedded in the bottom of the outer casing. A convergence channel is located above the wafer support platform 16. The wafer support platform 16 is used to hold the wafer to be processed. A negative pressure adsorption hole is provided on the wafer support platform 16. A negative pressure suction pipe 17 connected to the lower port of the negative pressure adsorption hole is provided below the wafer support platform 16. A sealing ring 5 is fitted around the outer periphery of the wafer support platform 16.

[0028] In this embodiment, the laser focusing mechanism includes a lens 6, a galvanometer 7, and a laser source 8 arranged sequentially from bottom to top. The lens 6 is located above the processing cavity and embedded in the top of the outer shell. A sealing ring 5 is fitted around the outer periphery of the lens 6. The galvanometer 7 and the lens 6 are coaxially arranged with the wafer support stage 16. The laser source 8 emits laser light that passes through the galvanometer 7 and the lens 6 and is directed toward the wafer support stage 16.

[0029] In this embodiment, the online monitoring system includes an acoustic emission signal monitor 4, a spectral signal monitor 12, and a vision camera 9. The acoustic emission signal monitor 4 is disposed on the top of the housing and is used to collect acoustic emission signals during the processing. The spectral signal monitor 12 is disposed above the housing and located at the propagation path of the scattered laser 10, and is used to collect the scattered or reflected spectral signals of the wafer processing surface. The vision camera 9 is disposed above the lens 6 or on the coaxial observation optical path of the laser focusing mechanism, and is used to collect images of the wafer surface morphology and bubbles in the processing area.

[0030] In this embodiment, the information acquisition and control system includes a data acquisition card 14, a host computer 15, and a PLC controller 20. The acoustic emission signal monitor 4, the spectral signal monitor 12, and the visual camera 9 are all connected to the data acquisition card 14. The data acquisition card 14 is used to acquire, convert, and temporarily store the processing status signals output by each monitor, and transmit the processing status signals to the host computer 15. The host computer 15 is communicatively connected to the PLC controller 20 and is used to analyze, display, and judge the processing status signals, and generate control commands to send to the PLC controller 20. The PLC controller 20 is electrically connected to the variable pressure water pump 1, the drain valve 22, the stirrer 23, and the control motor 26, respectively. It is used to adjust the output pressure of the variable pressure water pump 1 according to the control commands sent by the host computer 15, control the opening or closing of the drain valve 22, control the operation of the stirrer 23, and output electrical signals to control the operation of the control motor 26.

[0031] Specific processing steps: First, the wafer to be processed is placed on the wafer support stage 16. The sealing ring 5 is used to improve the sealing between the wafer support stage 16 and the cavity. The vacuum tube 17 is used to evacuate the space at the bottom of the wafer, so that the wafer is stably adsorbed and fixed on the surface of the wafer support stage 16 under the action of pressure difference.

[0032] Subsequently, the PLC controller 20 controls the motor 26 to operate according to preset processing parameters. The motor 26 drives the telescopic rod 25 to produce corresponding displacement, causing at least one of the first converging guide member 27 and the second converging guide member 28 to rotate around the rotation axis 24, thereby changing the convergence angle α between the first and second converging working surfaces. By adjusting the convergence angle α, the converging flow channel forms different width variations along the fluid flow direction, thereby changing the velocity gradient and dynamic pressure gradient of the water-abrasive mixture in the processing area.

[0033] During the processing fluid circulation, the water flow and abrasive particles are first uniformly mixed in the agitator 23 to form a water-abrasive mixed fluid. Subsequently, the mixed fluid is transported to the inlet end 2 by the variable pressure water pump 1, and after being rectified by the rectifier 3, it enters the processing chamber inside the outer casing 11. The rectified water-abrasive mixed fluid enters the convergent flow channel formed by the first convergent flow guide component 27 and the second convergent flow guide component 28. Under the constraint of the two convergent working surfaces, a contraction flow is generated. By changing the output displacement of the drive mechanism, the convergence angle α between the first and second convergent working surfaces can be adjusted, so that different velocity gradients and dynamic pressure gradients are formed in the wafer processing area.

[0034] Under the aforementioned flow field, the femtosecond laser emitted by laser source 8 is focused by galvanometer 7 and lens 6 and then irradiates the wafer surface. This synergistic effect with the hydrodynamic pressure generated by the water-abrasive fluid achieves a combined laser modification and abrasive polishing of the wafer surface. During the process, acoustic emission signal monitor 4 is used to collect acoustic emission signals, visual camera 9 is used to observe the wafer surface morphology and bubble state, and spectral signal monitor 12 is used to collect the scattered or reflected spectral signals of the wafer surface. The acoustic emission signals, visual signals, and spectral signals are transmitted to the host computer 15 via data acquisition card 14.

[0035] During processing, the data acquisition card 14 collects, converts, and temporarily stores the processing status signals output by the acoustic emission signal monitor 4, the spectral signal monitor 12, and the vision camera 9, and transmits the processing status signals to the host computer 15. The host computer 15 analyzes and judges the bubble distribution, surface damage status, acoustic emission intensity changes, or spectral changes, generates control commands, and sends them to the PLC controller 20. The PLC controller 20 adjusts the output pressure of the variable pressure pump 1, the mixing state of the stirrer 23, and the output displacement of the drive mechanism according to the control commands. By changing the convergence angle α between the first convergence working surface and the second convergence working surface, the dynamic pressure gradient field of the processing area is adjusted in real time. When a flexible continuous convergence working surface is used, the drive mechanism can also change the local contour of the flexible working surface to further adjust the convergence channel morphology. The processed water-abrasive mixture is discharged through the outlet 13 and enters the filter 19 for separation. The processing residue enters the waste collection chamber 18. The separated water-abrasive mixture is returned to the agitator 23 for recycling. When the processing fluid no longer meets the processing requirements after multiple cycles, or when equipment cleaning and maintenance are required, the femtosecond laser irradiation is stopped and the transformer water pump 1 is turned off. The drain valve 22 is opened, allowing the waste liquid in the processing chamber, outlet 13, filter 19, and circulation pipeline to be discharged into the waste liquid recovery tank 21 through the drain valve 22. The solid processing residue separated by the filter 19 enters the waste collection chamber 18, and the liquid waste liquid enters the waste liquid recovery tank 21 for centralized collection, thereby achieving the separation and recycling of solid residue and waste liquid.

[0036] The core of this invention lies in changing the geometric convergence angle between the first and second convergence working surfaces by using a variable convergence angle convergence wedge module, thereby actively adjusting the velocity gradient and dynamic pressure gradient of the water-abrasive mixture in the wafer processing area, and achieving flow field control suitable for different processing states.

[0037] Unless otherwise stated, if any of the technical solutions disclosed in this invention specify a numerical range, then the disclosed numerical range is a preferred numerical range. Anyone skilled in the art should understand that the preferred numerical range is merely one among many feasible numerical values ​​that has a more obvious or representative technical effect. Because there are many numerical values, it is impossible to list them all. Therefore, this invention discloses only some numerical values ​​to illustrate the technical solutions of this invention. Furthermore, the numerical values ​​listed above should not constitute a limitation on the scope of protection of this invention.

[0038] If this invention discloses or relates to mutually fixedly connected components or structural parts, then, unless otherwise stated, a fixed connection can be understood as: a detachable fixed connection (e.g., using bolts or screws), or a non-detachable fixed connection (e.g., riveting, welding). Of course, mutually fixed connections can also be replaced by an integral structure (e.g., manufactured in one piece using a casting process) (except where it is obviously impossible to use an integral molding process).

[0039] In addition, unless otherwise stated, the terms used in any of the technical solutions disclosed in this invention to indicate positional relationships or shapes include states or shapes that are similar to, close to, or approximate with those states or shapes.

[0040] Any component provided by this invention can be assembled from multiple individual components or can be a single component manufactured by a one-piece molding process.

[0041] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the protection scope of the present invention.

Claims

1. An underwater femtosecond laser-assisted water-abrasive hydrodynamic pressure effect processing equipment, characterized in that: The system includes an outer shell with an internal processing cavity, a fluid circulation mechanism, a wafer clamping mechanism, a laser focusing mechanism, a variable convergence angle convergence wedge module, an online monitoring system, and an information acquisition and control system. The variable convergence angle convergence wedge module is disposed within the processing cavity. The variable convergence angle convergence wedge module includes a first convergence guide member, a second convergence guide member, and a driving mechanism arranged opposite to each other. A convergence channel parallel to the processing surface of the wafer to be processed is formed between the first and second convergence guide members. At least one of the first and second convergence guide members is connected to the driving mechanism, which drives the convergence guide member to move relative to the processing cavity to change the convergence angle between the two convergence guide members and the width of the convergence channel along the fluid flow direction.

2. The underwater femtosecond laser-assisted water-abrasive hydrodynamic pressure effect processing equipment according to claim 1, characterized in that: At least one of the first and second convergent flow guiding components is rotatably connected to the processing cavity via a rotating shaft, and the driving mechanism is connected to a position on the convergent flow guiding component away from the rotating shaft.

3. The underwater femtosecond laser-assisted water-abrasive hydrodynamic pressure effect processing equipment according to claim 1, characterized in that: At least one of the first and second convergent flow guiding components is provided with multiple adjustment parts along the fluid flow direction. The multiple adjustment parts are respectively connected to the corresponding drive mechanism to change the angular position at different positions of the convergent flow guiding component.

4. The underwater femtosecond laser-assisted water-abrasive hydrodynamic pressure effect processing equipment according to claim 1, characterized in that: The first and second convergent flow guiding components are rigid flow guiding plates, flexible flow guiding plates, or chain-like flow guiding plates formed by multiple hinged segments.

5. The underwater femtosecond laser-assisted water-abrasive hydrodynamic pressure effect processing equipment according to claim 1, characterized in that: The outer shell has an inlet end and an outlet end at both ends that communicate with the processing cavity. The fluid circulation mechanism includes a processing fluid circulation pipeline connected to both ends of the outer shell. The circulation pipeline is provided with a filter, a stirrer, and a variable pressure water pump in sequence along the fluid flow direction; a rectifier, a waste collection chamber, a waste liquid recovery tank, and a drain valve; the rectifier is located inside the outer shell near the inlet end. The slag discharge end of the filter is connected to the waste collection chamber. A drain branch is connected to the end of the processing fluid circulation pipeline between the filter and the stirrer. The drain branch is connected to the waste liquid recovery tank and is equipped with a drain valve.

6. The underwater femtosecond laser-assisted water-abrasive hydrodynamic pressure effect processing equipment according to claim 1, characterized in that: The wafer clamping mechanism is located on the outer shell and includes a wafer support platform located below the processing cavity and embedded in the bottom of the outer shell. The wafer support platform has a negative pressure adsorption hole, and a negative pressure suction pipe connected to the lower port of the negative pressure adsorption hole is provided below the wafer support platform. A sealing ring is fitted on the outer periphery of the wafer support platform.

7. The underwater femtosecond laser-assisted water-abrasive hydrodynamic pressure effect processing equipment according to claim 1, characterized in that: The laser focusing mechanism includes a lens, a galvanometer, and a laser source arranged sequentially from bottom to top. The lens is located above the processing cavity and embedded in the top of the outer shell. A sealing ring is fitted around the outer periphery of the lens. The galvanometer and the lens are coaxially arranged with the wafer support stage. The laser source emits laser light, which passes through the galvanometer and the lens and is directed toward the wafer support stage.

8. The underwater femtosecond laser-assisted water-abrasive hydrodynamic pressure effect processing equipment according to claim 1, characterized in that: The online monitoring system includes an acoustic emission signal monitor, a spectral signal monitor, and a vision camera. The acoustic emission signal monitor is located on the top of the housing and is used to collect acoustic emission signals during the processing. The spectral signal monitor is located above the housing and at the propagation path of the scattered laser and is used to collect the scattered or reflected spectral signals of the wafer processing surface. The vision camera is located above the lens or on the coaxial observation optical path of the laser focusing mechanism and is used to collect images of the wafer surface morphology and bubbles in the processing area.

9. The underwater femtosecond laser-assisted water-abrasive hydrodynamic pressure effect processing equipment according to claim 8, characterized in that: The information acquisition and control system includes a data acquisition card, a host computer, and a PLC controller; the acoustic emission signal monitor, the spectral signal monitor, and the visual camera are all connected to the data acquisition card, and the host computer is communicatively connected to the PLC controller.

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