A method of laser processing of a thin film material

Abstract

The application provides a laser processing method of a film material, which is used for processing a plurality of contour line structures on the film material and removing the contour line structures, the contour line structures are composed of a continuous reciprocating turning contour pattern, and the contour line structures comprise M processing sections arranged along a preset direction and turning sections alternately connected between both ends of adjacent processing sections; each processing section is divided into n segments along the extension direction of the processing section, and all the segments are divided into n segment groups, and each segment group is composed of an i-th segment of each processing section arranged along the preset direction; the laser processing method comprises the following steps: in a laser processing process, each segment group is processed in turn according to the order from near to far of a thread drawing device, and the thread drawing device draws away the processed segment from the film material; before the laser processes a current segment of a current processing section, a last processed segment of the current processing section has been drawn away by the thread drawing device. The method guarantees the stability of the cutting process and the effective utilization of the beam energy.

Description

Technical Field

[0001] This application belongs to the field of laser processing, and specifically relates to a laser processing method for thin film materials. Background Technology

[0002] When processing thin films with lasers, especially when creating complex and dense patterns, a common application scenario involves creating intricate cutout patterns and separating them from the film body. These complex cutout patterns are narrow, and the material to be separated from the film body is called "waste wire" (the laser scans the outline of the cutout pattern, separating the film portion within it). Current technologies typically employ continuous scanning paths (i.e., the laser scans continuously along the direction of the cutout pattern) or other conventional, simple sequential scanning paths. This approach has several drawbacks: First, to ensure processing quality and avoid thermal deformation, the laser processing speed is slow, leading to incomplete waste wire removal. Second, the waste wires generated during processing may not completely detach and may remain suspended or fall, obstructing the subsequent laser beam path. This obstruction can cause the laser energy to absorb or scatter, resulting in insufficient energy reaching the film, leading to incomplete processing, poor cross-sectional quality, unstable processes, and even the risk of laser reflection damaging the equipment. Summary of the Invention

[0003] In view of this, this application provides a laser processing method for thin film materials, used to process multiple contour line structures on the thin film material and remove the contour line structures. The contour line structures are composed of continuously reciprocating contour patterns, comprising M processing segments arranged along a preset direction and alternating transition segments between the ends of adjacent processing segments; the extension direction of the processing segments is not parallel to the preset direction; characterized in that…

[0004] Each processing segment is divided into n segments along its extension direction, and all segments are divided into n segment groups. Each segment group consists of the i-th segment of each processing segment arranged along a preset direction, where 1≤i≤n; a drawing device is provided above the film material.

[0005] The laser processing method includes:

[0006] During laser processing, each segment group is processed sequentially in order from closest to furthest from the drawing device. A negative pressure is formed inside the drawing device to draw the processed segments away from above the thin film material.

[0007] When processing each segment group, each segment of each processing segment is processed one by one along the preset direction. When the laser is processing the current segment of the current processing segment, the previously processed segment of the current processing segment has been removed by the wire drawing device.

[0008] As some of the embodiments, the length of each segment is 5mm to 35mm.

[0009] As some of the embodiments, each segment group is divided into multiple segment units along a preset direction, and each segment unit includes multiple segments arranged along the preset direction;

[0010] The laser processing module for emitting lasers includes multiple laser processing units arranged along a preset direction, with one laser processing unit used to process one segment unit.

[0011] When processing each segment group with laser, multiple laser processing units work synchronously, and each laser processing unit processes each segment of each processing segment one by one along a preset direction.

[0012] As some embodiments, the M processing segments arranged along a preset direction include a first type of processing segment and a second type of processing segment arranged alternately along the preset direction. The extension direction of the first type of processing segment and the extension direction of the second type of processing segment are intersected and have the same length. The length of the i-th segment of the first type of processing segment is the same as the length of the i-th segment of the second type of processing segment.

[0013] The outline of the turning segment is an arc.

[0014] As some embodiments, the horizontal component of the force provided by the wire drawing device is not parallel to the extension direction of the first type of processing segment and the second type of processing segment;

[0015] Each segment's outline includes a parallel first outline and a second outline, and a third outline connecting the ends of the two. When processing the outline of each segment, start from the end of the segment away from the drawing device, process along the outline towards the other end closer to the drawing device, and then return to process the remaining outline in the direction away from the drawing device. Of the first and second outlines, the one closer to the drawing device is processed first.

[0016] Each transition segment includes two arc profiles. When machining each transition segment, the arc profile closer to the drawing device is machined first.

[0017] In some embodiments, the thin film material is placed on a carrier, and a laser processing module for emitting laser light is located above the carrier. The carrier can carry the thin film material along a first direction, so that the thin film material first passes under the laser processing module and then under the wire drawing device. The force provided by the wire drawing device has a horizontal component that is parallel to or at an acute angle to the first direction.

[0018] As one embodiment, a blowing device is also provided above the support member. The blowing device and the wire drawing device are located on both sides of the processing area of ​​the laser processing module along the first direction, and the blowing direction of the blowing device is the same as the horizontal component direction of the force provided by the wire drawing device.

[0019] The processing area corresponds to the processing area when the laser irradiates the thin film material.

[0020] As some embodiments, an air knife is provided between the laser processing module and the wire drawing device. The wire drawing device includes a collecting tube and a collector. The collecting tube and the collector are internally connected. The collector is connected to an external vacuum generator.

[0021] The opening size of the air outlet section of the air knife gradually decreases along the air outlet direction, causing the compressed air entering the air knife to increase sharply in velocity after being ejected from the air outlet section. This creates a low-pressure zone at the tail end of the air outlet section relative to its surrounding environment, generating an upwardly inclined adsorption force on the surface of the processed segment. The air outlet section exits obliquely towards the film material, and under the guidance of the guide arc surface provided at the end of the air knife, it tilts upward into the collection pipe. The air inlet direction of the collection pipe is tilted upward relative to the carrier.

[0022] As some embodiments, the collection tube is a Venturi tube to increase the adsorption force on the processed fragments;

[0023] The collecting pipe, located at the inner end of the collector and near the center of the collector, has a variable diameter structure. Along its extension direction, the distance between the pipe wall and the inner wall of the collector first decreases and then increases.

[0024] The movement trajectory of the processed thin film material drawn into the collector is spiral-shaped.

[0025] As some of the embodiments, during laser processing, the carrier moves along a first direction carrying the thin film material.

[0026] The laser processing method for thin film materials proposed in this application divides each processing segment into multiple segments along its extension direction. Before processing the current segment of the current processing segment, the previously processed segment is removed using a wire-drawing device. This fundamentally avoids the problems of waste wire hanging or floating and obstructing, reflecting, or attenuating the subsequent laser beam, ensuring the stability of the cutting process and the effective utilization of beam energy. Furthermore, it improves the processing quality and efficiency of laser processing of thin film materials, and the method is simple. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0028] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which this application can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0029] Figure 1 This is a schematic diagram of the outline structure of one embodiment of the present application;

[0030] Figure 2 This is a simplified structural diagram of a laser processing device for a laser processing method using thin film materials proposed in this application;

[0031] Figure 3 This is a schematic diagram of the laser processing path proposed in this application when processing segments and transition sections;

[0032] Figure 4 This is a schematic diagram of the structure of a laser processing equipment for a laser processing method using thin film materials proposed in this application;

[0033] Figure 5 This is a schematic diagram of the structure of an air knife and wire drawing device according to an embodiment of this application;

[0034] Figure 6 This is a schematic diagram of the structure of an air knife according to an embodiment of this application;

[0035] Figure 7 This is a simulation diagram of the flow velocity in the cross section of the wire drawing device according to an embodiment of this application. Detailed Implementation

[0036] The embodiments of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0037] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] After a laser processes a complex and dense contour pattern on a thin film material, in order to effectively remove the thin film portion within the contour pattern, also known as waste wire, a relatively large force is usually used to remove the waste wire, such as pulling the waste wire away with a relatively large force. In order to ensure processing efficiency, the waste wire is removed while the contour pattern is being processed. Due to the physical characteristics of the waste wire and the large force required, there are problems such as the waste wire easily blocking the laser during the processing, resulting in poor processing quality, and difficulty in providing an effective time window and physical space for timely removal of the waste wire.

[0039] This application proposes a laser processing method for thin film materials, used to process multiple contour structures on the thin film material and remove waste filaments within the contour structures. The thin film material in this application can be single-layer or multi-layer, such as a metal thin film, like copper foil, which can be used in the fabrication of photovoltaic modules. The contour structure is hollowed out; that is, the laser processes only the contour, leaving the area within the contour unprocessed. Only the portion of the thin film material within the contour pattern is removed. Figure 1 As shown, the contour structure 100 is composed of a continuous reciprocating contour pattern. The contour structure 100 includes M processing segments arranged along a preset direction and turning segments 20 that alternately connect the two ends of adjacent processing segments.

[0040] Specifically, two adjacent processing sections can be parallel to each other or not parallel to each other, but adjacent processing sections do not intersect each other; the extension direction of the processing section can be perpendicular to or not perpendicular to the preset direction; the turning section 20 can be a straight line or an arc. Figure 1 In the example shown, the extension directions of two adjacent processing segments are not parallel, and neither are they perpendicular or parallel to the preset direction. The turning segment 20 is an arc. Of course, this is just one example and is not limited to this. Specifically, the turning segment 20 between the i-th processing segment and the (i+1)-th processing segment connects at one end to the end of the i-th processing segment and at the other end to the end of the (i+1)-th processing segment on the same side. Multiple turning segments 20 are alternately located at one end and the other end between two adjacent processing segments 1, such as... Figure 1 As shown, the transition segment 20 between the first processing segment and the second processing segment is located at the right end, and the transition segment 20 between the second processing segment and the third processing segment is located at the left end. This process is repeated to make the outline structure 100 a continuous reciprocating folding pattern.

[0041] Each processing segment is divided into n segments along its extension direction. All segments of all processing segments are divided into n segment groups. Each segment group consists of the i-th segment of each processing segment arranged along a preset direction, where 1 ≤ i ≤ n. Figure 1 In the diagram, the M segments within the dashed box constitute a segment group, which consists of the second segment A2 of the first processing segment to the second segment of the Mth processing segment.

[0042] Further, see Figure 2 A wire-drawing device 200 is provided above the thin film material to remove waste wires within the contour of the processed section and the turning section 20 during laser processing. The specific structure of the wire-drawing device 200 can be found in the following description, and its structure can also be a conventional structure of the prior art.

[0043] The laser processing method of this application includes:

[0044] During the laser processing, each segment group is processed sequentially in order from near to far from the wire drawing device 200. A negative pressure is formed inside the wire drawing device 200 to draw the processed segment away from above the thin film material.

[0045] In this process, before the laser processes the current segment of the current processing segment, the previously processed segment of the current processing segment has already been removed by the wire drawing device.

[0046] In other words, the laser processing method is to process one segment group at a time, and switch to the next segment group after processing the current segment group, until all segment groups are processed. The order of processing multiple segment groups is based on the distance between the segment group and the wire drawing device 200 from near to far.

[0047] It should be noted that since the laser processing trajectory is a contour line structure, the processed segment removed here is the thin film portion within the segment contour. To achieve better waste wire removal, processing begins with the segment group closest to the wire-drawing device 200. Due to the large area of ​​the thin film material and the need to process multiple contour line structures 100 on it, while the area of ​​the laser processing module is limited, the wire-drawing device 200 is generally initially located on the side of the area to be processed on the thin film material. After each segment group is processed by the laser, the thin film material moves towards the wire-drawing device 200, bringing the next segment group closer to the wire-drawing device 200 for better removal of the processed segments from the next segment group.

[0048] The laser scanning direction (path) is the same as the extension direction (path) of the contour structure 100.

[0049] Assuming the wire drawing device 200 is located in Figure 1On the right side of the outline structure 100 shown in the view (which is also above the outline structure 100), the first segment group (A1, B1, C1, ..., M1) in the outline structure 100 is processed first, then the second segment group (A2, B2, C2, ..., M2) is processed, and so on to complete the nth segment group (An, Bn, Cn, ..., Mn).

[0050] Because when the laser processes the i-th segment of the current processing segment, the (i-1)-th segment of the current processing segment has already been removed from the thin film material, thus completely avoiding its hanging or falling and obstruction of the subsequent laser scanning path, providing an excellent working condition for any subsequent waste removal operation. Specifically, for example, after processing segment A1 of the first processing segment, since segment A2 is not directly processed but other segments in the first segment group are processed along a preset direction, segment A1 can be removed during the time between processing segment A1 and preparing to process segment A2. When the laser processes segment A2, segment A1 will not obstruct the laser scanning of segment A2.

[0051] Furthermore, when processing the segments in each segment group, considering the large area of ​​the segment group, preferably, each segment group is divided into multiple segment units along a preset direction, and each segment unit includes multiple segments arranged along the preset direction; wherein, the laser processing module for emitting lasers includes multiple laser processing units arranged along the preset direction, and one laser processing unit is used to process one segment unit; when laser processing each segment group, multiple laser processing units work synchronously, and when each laser processing unit processes each segment unit, it processes each segment of each processing segment one by one along the preset direction.

[0052] More specifically, suppose the first laser processing unit is responsible for processing segments A1, B1, and C1 in the first segment group, and the other laser processing unit is responsible for processing segments (M-2)1, (M-1)1, and M1 in the first segment group. The two laser processing units work simultaneously, each completing its corresponding three segments. For example, after the first laser processing unit completes the first segment A1 in the first processing segment, it jumps to the first segment B1 in the second processing segment according to a preset direction for laser scanning, and then jumps to the first segment C1 in the third processing segment for laser scanning. All laser processing units work together to complete the laser scanning of the entire area of ​​the thin film material.

[0053] In this laser scanning method, the previous segment and the next segment are processed independently of each other, which can be called non-adjacent jump (correspondingly, adjacent jump can be understood as scanning along the extension direction of the processing segment, first scanning A1, then scanning A2, and so on until An). In this way, by using non-adjacent jump, a key time delay and physical space are provided for the newly processed segment to alleviate the influence of thermal stress and for the segment to detach from the thin film material. At the same time, multiple laser processing units work simultaneously, which greatly improves work efficiency.

[0054] Each laser processing unit may include a laser for emitting a laser beam and necessary optical components.

[0055] More specifically, when scanning segments with the same sequence number in each processing segment along a preset direction, either "interval jump" can be used, where each segment goes from one end to the other; or "S-shaped jump" can be used, where the previous segment is scanned from the left end to the right end, and the next segment is scanned from the right end to the left end, and so on.

[0056] The laser processing method for thin film materials proposed in this application divides each processing segment into multiple segments along its extension direction. Before processing the current segment, the previously processed segment of the current segment is removed using a wire-drawing device. This fundamentally avoids the problems of waste wire hanging or floating and obstructing, reflecting, or attenuating the subsequent laser beam, ensuring the stability of the cutting process and the effective utilization of beam energy. Furthermore, since laser processing generates fumes, this method can further effectively prevent fumes from obstructing the laser beam.

[0057] Furthermore, considering that the ends of the contour structure 100 are turning segments 20, when processing the entire contour structure 100, it is preferable to first process multiple turning segments 20 arranged along a predetermined direction at the same end, which can also be called end turning segment groups, then process all segment groups, and finally process the end turning segment groups at the other end. In order to facilitate the separation of the segments of the hollow structure from the thin film material body, the end turning segment group that is first processed by the laser is preferably a complete closed pattern.

[0058] As another embodiment, the length of each segment is 5mm to 35mm. Segmenting the processing section ensures that each processing section can be processed quickly. The length of each segment is controlled within the range of 5mm to 35mm. This length range avoids heat accumulation or incomplete processing due to excessively long segments (i.e., the thickness of the laser-processed film is less than its own thickness, and the entire thickness of the segment is not processed, making the segment difficult to detach). It also avoids excessively frequent laser jumps and reduced work efficiency caused by excessively short segments.

[0059] Furthermore, the total area of ​​all the contour structures to be processed on the thin film material is (1600~2600) mm × (900~1500) mm, and the area of ​​each contour structure is (160~220) mm × (160~220) mm. The width W of each processing segment is 0.2 mm~2 mm, and the spacing between adjacent processing segments is 10 mm~50 mm. It can be seen that the hollow pattern to be processed is complex, and the width of the processing segment itself and the spacing between adjacent processing segments are very small, while the processing area is relatively large, which places high demands on processing accuracy and processing efficiency.

[0060] Furthermore, such as Figure 1 As shown, the M processing segments arranged along a preset direction include a first type of processing segment 11 and a second type of processing segment 12 arranged alternately along the preset direction. The extension directions of the first type of processing segment 11 and the second type of processing segment 12 intersect (but the ends are turning segments so they do not intersect). The first type of processing segment 11 and the second type of processing segment 12 have the same length, and the length of the i-th segment of the first type of processing segment 11 is the same as the length of the i-th segment of the second type of processing segment 12; more specifically, Figure 1 Both the first type of processing section 11 and the second type of processing section 12 are straight lines, in the shape of strips, from... Figure 1 From the perspective shown, both sections tilt towards each other when viewed from left to right. Of course, the first type of processing segment 11 and the second type of processing segment 12 can also be curves, in which case the contour structure resembles a compressed sine wave.

[0061] The contour of the transition segment 20 is an arc. Preferably, relative to the wire drawing device 200, along a predetermined direction, the arcs connecting the two ends of adjacent processing segments are alternately arranged with concave and convex shapes. It is also assumed that the wire drawing device 200 is located... Figure 1 From the upper right side of the outline structure 100 shown in the viewpoint, all the turning segments 20 at the right end of the outline structure 100 are concave arcs relative to the drawing device 200, and all the turning segments 20 at the left end of the outline structure 100 are convex arcs relative to the drawing device 200.

[0062] In another embodiment, the horizontal component of the force provided by the wire drawing device 200 is not parallel to the extension directions of the first type of processing section 11 and the second type of processing section 12; for example... Figure 3As shown, the contour lines of each segment include a parallel first contour S11 and a second contour S12, and a third contour S13 connecting the ends of the two. When processing the contour of each segment, starting from the end of the segment away from the wire drawing device 200, processing is carried out along the contour towards the other end closer to the wire drawing device 200, and then the remaining contour is processed in the direction away from the wire drawing device 200. The one closer to the wire drawing device 200 of the first contour S11 and the second contour S11 is processed first. Each turning segment 20 includes two (co-centered) arc contours. When processing each turning segment 20, the arc contour closer to the wire drawing device of the two arc contours is processed first.

[0063] This path design can further avoid problems such as laser beam obstruction, laser reflection, or laser energy attenuation caused by suspended waste wires; at the same time, since smoke and dust are generated during laser processing, this path design can further prevent smoke and dust from obstructing the laser.

[0064] Among them, the third contour S13 in the first type of processing segment 11 and the second type of processing segment 12 is preferably an arc segment.

[0065] Figure 3 middle, Figure 3 (a) can correspond to Figure 1 One of the segments in the first type of processing segment 11, Figure 3 (b) can correspond to Figure 1 The turning point at the right end, segment 20. Figure 3 (d) can correspond to Figure 1 One of the segments in the second type of processing section 11, Figure 3 (c) can correspond to Figure 1 middle Figure 1 The turning point at the left end is 20.

[0066] against Figure 3 The example shown also assumes that the wire drawing device 200 is located in Figure 3 The outline structure 100 is shown above and to the right of the viewpoint. Figure 3 The arrow at the top points in the direction of the horizontal component of the force provided by the wire drawing device 200. Thus, when machining the contour structure 100, the corresponding [parts / sections] are machined first. Figure 1 The turning point on the right end, section 20 ( Figure 3 (b) Then process each segment group in order from right to left, and finally process the corresponding segments. Figure 1 The turning point on the left (20) Figure 3 (c)). From Figure 3 It can be seen from this that Figure 3 (b) The outline of the turning segment 20 is a complete closed figure, while the other three figures are not complete closed figures.

[0067] More specifically, such as Figure 3 As shown in (a), when processing this segment, following the direction indicated by the arrows around the segment in the figure, it is preferable to start from the vicinity of the junction point between the first contour S11 and the third contour S13 (for example, the junction point or the middle position of the third contour S13), process along the first contour S11 towards the direction closer to the wire drawing device 200, until reaching the end of the first contour S11 near the wire drawing device 200, then jump clockwise to the second contour S12, and process along the second contour S12 towards the direction away from the wire drawing device 200, until returning to the starting point to complete the processing of all contour lines of the segment.

[0068] like Figure 3 As shown in (b), when processing this transition segment, following the direction indicated by the arrows around the segment in the figure, it is preferable to process arc S21 first, and then process arc S22 counterclockwise. Specifically, the starting point is preferably near the lower end of arc S21, processing counterclockwise and returning to the starting point. Similarly, as... Figure 3 As shown in (c), it is preferable to process arc S21 first, and then process arc S22 counterclockwise. Specifically, the starting position is preferably from the lower end of arc S21.

[0069] Similarly, such as Figure 3 As shown in (d), preferably starting from the vicinity of the junction point between the first contour S11 and the third contour S13 (e.g., the junction point or the middle position of the third contour S13), the processing proceeds along the first contour S11 towards the direction closer to the wire drawing device 20 until the end of S11 near the wire drawing device 200 is reached. Then, the process jumps counterclockwise to the second contour S12 and proceeds along the second contour S12 towards the direction away from the wire drawing device 200 until the process returns to the starting point and all contour lines of the segment are completed.

[0070] Figure 3 In the diagram, the circle represents the preferred starting point position.

[0071] Furthermore, during laser processing, the wire-drawing device 200 generates an upward-sloping suction force on the surface of the processed fragment, causing the waste wire to detach from the thin film material. Considering that traditional fragment-drawing methods can easily cause the processed fragment to get stuck in the gaps of the thin film material, or that mechanical scraping may damage the thin film material, this application avoids both fragment jamming and damage to the thin film material by generating an upward-sloping suction force on the surface of the processed fragment.

[0072] As another embodiment, such as Figure 2 , Figure 4As shown, the thin film material is placed on the carrier 300, and the laser processing module 400 for emitting laser light is located above the carrier 300. The carrier 300 can carry the thin film material and move along the first direction, so that the thin film material first passes under the laser processing module 400 and then under the wire drawing device 200. The force provided by the wire drawing device 200 has a horizontal component that is parallel to or at an acute angle to the first direction. Figure 2 The first direction is the X-axis direction in the figure.

[0073] Specifically, the laser processing module 400 includes at least a laser for emitting a laser beam and necessary optical elements, such as a focusing lens (field lens). In this application, it may further include a galvanometer to control the scanning direction of the laser beam. Since the multiple contour structures 100 to be processed on the thin film material occupy a large area, while the area of ​​the laser processing module is limited, in one embodiment of this application, after each portion is processed by the laser, the carrier 300 moves the thin film material a certain distance along the first direction toward the drawing device 200. As described above, since the area of ​​the segment group is large, the laser processing module 400 may include multiple laser processing units arranged along a preset direction.

[0074] As another embodiment, such as Figure 2 As shown, a blowing device 500 is also provided above the carrier 300. The blowing device 500 and the wire drawing device 200 are located on both sides of the processing area of ​​the laser processing module 400 along the first direction, and the blowing direction of the blowing device 500 is the same as the horizontal component of the force provided by the wire drawing device 200. By cooperating with the wire drawing device 200 and the blowing device 500, the processed segments and turning sections can be collected into the wire drawing device 200 more efficiently. Here, the processing area corresponds to the processing area when the laser irradiates the thin film material. Here, the blowing direction of the blowing device 500 and the horizontal component of the force provided by the wire drawing device 200 are not necessarily exactly the same, as long as they can work together to remove waste wire.

[0075] Generally, after the laser processing module 400 is installed, it remains stationary. In order to complete the processing of large-format thin film materials, as mentioned above, the carrier 300 will move along the first direction with the thin film material. The processing area of ​​the laser processing module 400 can be considered as a fixed spatial position. The structure of the blowing device 500 can be a conventional structure of the prior art, as long as its blowing direction meets the requirements.

[0076] like Figure 2 , Figure 5As shown, an air knife 600 is provided between the laser processing module 400 and the wire drawing device 200. The wire drawing device 200 includes a collecting tube 210 and a collector 220. The collecting tube 210 and the collector 220 are internally connected. The collector 210 is connected to an external vacuum generator, so that a negative pressure can be formed inside the wire drawing device 200 to draw away the segment.

[0077] like Figure 6 As shown, the opening size of the air outlet section of the air knife 600 gradually decreases along the air outlet direction, causing the compressed air entering the air knife 600 to increase rapidly in velocity after being ejected from the air outlet section. Based on Bernoulli's principle, a low-pressure zone relative to its surrounding environment is formed at the tail end of the air outlet section, generating an upwardly inclined adsorption force on the surface of the processed segment or turning section. The air outlet section exits obliquely towards the thin film material, and under the guidance of the guide arc surface 610 at the end of the air knife 600, it tilts upward into the collection pipe 210, thereby entering the collector 220 for directional collection of the processed segment. The air inlet direction of the collection pipe 210 is tilted upward relative to the carrier 300. The air outlet direction of the air knife 600 and the air inlet direction of the collection pipe 210 are both tangent to the two ends of the guide arc surface 610, and the guide arc surface 610 protrudes towards the carrier 300.

[0078] Specifically, by setting a guide arc surface 610 protruding towards the thin film material, based on the Coanda effect, the air outlet direction of the air knife 600 will deviate from its original direction of movement and flow onto the guide arc surface 610, and be guided into the collection pipe 210. Based on Bernoulli's principle, the air knife 600 can efficiently peel off waste fibers, and the guide arc surface 510 of the air knife 600 enables controllable waste fiber collection trajectory, providing a reliable, stable, and directionally controllable adsorption method.

[0079] Furthermore, the air knife 600 has an air velocity of 5 m / s to 25 m / s. At this velocity, it can promptly adsorb and remove the cut waste filament fragments from the processing area, preventing them from falling back or scattering. Combined with the aforementioned segmented scanning and non-adjacent jump processing methods, this air velocity also prevents waste filaments from obstructing the laser. In addition, this air velocity improves the processing environment, preventing smoke and particulate matter pollution.

[0080] In another embodiment, the collection tube 210 is a Venturi tube to increase the adsorption force on the processed fragments; wherein, as... Figure 5As shown, the collecting tube 210, located at the inner end of the collector 220 and near the center of the collector 220, has a variable-diameter wall structure. Along the extending direction of the collecting tube 210, the distance between the wall of this variable-diameter section and the inner wall of the collector 220 first decreases and then increases, thus increasing the flow rate and reducing the pressure. The movement trajectory of the processed film material drawn into the collector 220 is spiral, which is more conducive to collecting waste filaments. Furthermore, the collector 220 is cylindrical, which can reduce the collection resistance at the inner wall surface of the collector.

[0081] Specifically, when the high-speed airflow passes through the variable-diameter section at the end of the collecting pipe 210, the flow velocity increases and the pressure decreases, forming a strong local negative pressure zone. This negative pressure zone further accelerates and converges the waste filaments. When superimposed with the low-pressure zone corresponding to the air knife 600, it together generates a strong, directional upward airflow that draws the waste filaments into the collector, achieving efficient waste filament collection.

[0082] like Figure 7 As shown in the figure, a simulation diagram of the cross-sectional flow velocity of the drawing device according to an embodiment of this application is presented. It can be seen from the figure that when the high-speed airflow passes through the variable diameter section at the end of the collecting pipe 210, the flow velocity increases significantly, and the trajectory of the segment in the collector 220 is a high-speed spiral.

[0083] Because this application uses segmented scanning, each segment of waste filament is small in size and light in weight. The air knife based on Bernoulli's principle uses high-speed airflow to adsorb the waste filament segments, and then the collection tube based on Venturi's principle works together to ensure that the waste filament segments can be completely removed from the processing area, avoiding the problem of thin and long waste filaments easily getting tangled or attached in traditional waste removal methods.

[0084] As another embodiment, during the laser processing, the carrier 300 synchronously moves the thin film material along the first direction, that is, the galvanometer in the laser processing module 400 moves the thin film material synchronously while controlling the laser beam processing, which can further improve the processing efficiency of the contour structure.

[0085] The various embodiments in this specification are described in a progressive, parallel, or combined manner. Each embodiment focuses on its differences from other embodiments, and similar or identical parts between embodiments can be referred to interchangeably. For the apparatuses disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple, and relevant parts can be referred to the method section.

[0086] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A laser processing method for a thin film material, used to process multiple contour structures on the thin film material and remove the contour structures, wherein the contour structures are composed of continuously reciprocating contour patterns, including M processing segments arranged along a preset direction and transition segments alternately connected between the ends of adjacent processing segments; characterized in that, Each processing segment is divided into n segments along its extension direction. All segments are divided into n segment groups. Each segment group consists of the i-th segment of each processing segment arranged along a preset direction, where 1≤i≤n. A fiber-drawing device is provided above the thin film material; The laser processing method includes: During laser processing, each segment group is processed sequentially in order of distance from the drawing device from near to far. A negative pressure is formed inside the drawing device to draw the processed segments away from above the thin film material. In this process, before the laser processes the current segment of the current processing segment, the previously processed segment of the current processing segment has already been removed by the wire drawing device.

2. The laser processing method for thin film materials according to claim 1, characterized in that, Each of the segments is 5mm to 35mm in length.

3. The laser processing method for thin film materials according to claim 1, characterized in that, Each segment group is divided into multiple segment units along a preset direction, and each segment unit includes multiple segments arranged along the preset direction; The laser processing module for emitting lasers includes multiple laser processing units arranged along a preset direction, with one laser processing unit used to process one segment unit. When processing each segment group with laser, multiple laser processing units work synchronously, and each laser processing unit processes each segment of each processing segment one by one along a preset direction.

4. The laser processing method for thin film materials according to claim 1, characterized in that, The M processing segments arranged along a preset direction include a first type of processing segment and a second type of processing segment arranged alternately along the preset direction. The extension direction of the first type of processing segment and the extension direction of the second type of processing segment are intersected and have the same length. The length of the i-th segment of the first type of processing segment is the same as the length of the i-th segment of the second type of processing segment. The outline of the turning segment is an arc.

5. The laser processing method for thin film materials according to claim 4, characterized in that, The force provided by the wire drawing device has a horizontal component that is not parallel to the extension direction of the first type of processing section and the second type of processing section. Each segment's outline includes a parallel first outline and a second outline, and a third outline connecting the ends of the two. When processing the outline of each segment, start from the end of the segment away from the drawing device, process along the outline towards the other end closer to the drawing device, and then return to process the remaining outline in the direction away from the drawing device. Of the first and second outlines, the one closer to the drawing device is processed first. Each transition segment includes two arc profiles. When machining each transition segment, the arc profile closer to the drawing device is machined first.

6. The laser processing method for thin film materials according to claim 1, characterized in that, The thin film material is placed on the carrier, and the laser processing module for emitting laser is located above the carrier. The carrier can carry the thin film material along the first direction, so that the thin film material first passes under the laser processing module and then under the wire drawing device. The force provided by the wire drawing device has a horizontal component direction that is parallel to or at an acute angle to the first direction.

7. The laser processing method for thin film materials according to claim 6, characterized in that, A blowing device is also provided above the support member. The blowing device and the wire drawing device are located on both sides of the processing area of ​​the laser processing module along the first direction, and the blowing direction of the blowing device is the same as the horizontal component of the force provided by the wire drawing device. The processing area corresponds to the processing area when the laser irradiates the thin film material.

8. The laser processing method for thin film materials according to claim 6 or 7, characterized in that, An air knife is provided between the laser processing module and the wire drawing device. The wire drawing device includes a collecting tube and a collector. The collecting tube is internally connected to the collector, and the collector is connected to an external vacuum generator. The opening size of the air outlet section of the air knife gradually decreases along the air outlet direction, causing the compressed air entering the air knife to increase sharply in velocity after being ejected from the air outlet section. This creates a low-pressure zone at the tail end of the air outlet section relative to its surrounding environment, generating an upwardly inclined adsorption force on the surface of the processed segment. The air outlet section exits obliquely towards the film material, and under the guidance of the guide arc surface provided at the end of the air knife, it tilts upward into the collection pipe. The air inlet direction of the collection pipe is tilted upward relative to the carrier.

9. The laser processing method for thin film materials according to claim 8, characterized in that, The collection tube is a Venturi tube to increase the adsorption force on the processed fragments; The collecting pipe, located at the inner end of the collector and near the center of the collector, has a variable diameter structure. Along its extension direction, the distance between the pipe wall and the inner wall of the collector first decreases and then increases. The movement trajectory of the processed thin film material drawn into the collector is spiral-shaped.

10. The laser processing method for thin film materials according to claim 6, characterized in that, During laser processing, the carrier moves along a first direction carrying the thin film material.

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