A laser scribing method, device, medium and computer device for a perovskite thin film battery

Abstract

The application provides a laser scribing method, device, medium and computer equipment for a perovskite thin film battery. The laser scribing method of the application clamps and fixes the thin film battery substrate to be processed through a bearing platform; a flying light path assembly is driven by a gas floating driving assembly to move linearly relative to the static thin film battery substrate along a main processing direction, so as to drive a plurality of processing light beams to perform scribing work; during the scribing process, the actual track of the previous process scribe line is detected in advance at a predetermined spatial position in front of the current processing light beam, the actual track is calculated with a theoretical reference track, deviation data containing a spatial position mapping relationship and a dynamic compensation instruction are generated; the optical execution assembly is driven to perform fine adjustment movement relative to the flying light path assembly through a fine driving mechanism in response to the dynamic compensation instruction, the processing position of the plurality of processing light beams is adjusted in real time, and dynamic following compensation of the track of the previous process scribe line is realized.

Description

Technical Field

[0001] This invention relates to a laser scribing method, apparatus, medium, and computer equipment for perovskite thin-film solar cells, belonging to the field of thin-film solar cell manufacturing technology. Background Technology

[0002] Perovskite solar cells, as a next-generation photovoltaic technology, have attracted much attention from the industry due to their high photoelectric conversion efficiency and low manufacturing cost. In the mass production of large-area perovskite thin-film solar cell modules, a high-precision laser scribing process is necessary to cut the large-area thin film layer into multiple series-connected sub-cell units. This laser scribing process typically includes three scribing steps: P1, P2, and P3. The area between two adjacent scribing lines, such as P1 and P2, or P2 and P3, is called the dead zone. The dead zone cannot generate photoelectric conversion efficiency; therefore, minimizing the width of the dead zone while ensuring that the scribing lines do not intersect or short-circuit is the core technological requirement for improving the effective power generation area and overall photoelectric conversion efficiency of perovskite solar cell modules.

[0003] However, existing laser scribing equipment faces insurmountable control bottlenecks when dealing with the demands of large-area, high-rate-of-production: First, most existing scribing equipment uses traditional mechanical guide rails to drive bulky gantry frames or worktables for long-stroke processing. When pursuing increased production capacity and processing speed, the huge inertia of the mechanical system results in extremely slow dynamic response.

[0004] Secondly, glass substrates in real industrial settings often exhibit microscopic surface undulations. Furthermore, due to the influence of preceding processes, the previous scribe line is usually not a perfectly straight line, but rather exhibits micrometer-level localized bending deviations. Because existing high-inertia drive shafts have extremely low response bandwidths, they are simply unable to track these high-frequency microscopic trajectory deviations and surface undulations in real time during high-speed motion. To prevent short circuits caused by overlapping scribe lines, a large dead zone width must be reserved as a safety margin, severely restricting the improvement of battery efficiency.

[0005] Third, traditional error closed-loop control often employs pure time-domain feedback logic, which involves a serial process from error detection to system delay and then to actuator compensation. During the acceleration and deceleration phases of high-speed scribing equipment or when mechanical resonance exists, the time-domain delay can cause severe spatial misalignment, resulting in compensation actions not only failing to correct the deviation but potentially exacerbating the oscillations in the machining position.

[0006] In addition, in order to increase production capacity, existing technologies have begun to try to introduce parallel scribing of multiple beams. However, due to the limitations of mechanical structure, it is usually only possible to use a single motor to drive the entire frame for uniform coarse adjustment. It is not possible to perform independent high-frequency decoupling compensation for individual deviations caused by optical aberrations or local film differences in each beam.

[0007] Therefore, the existing laser scribing process for perovskite thin-film solar cells has many defects and needs to be improved and perfected. Summary of the Invention

[0008] In view of the shortcomings of the prior art, the purpose of this invention is to provide a laser scribing method, apparatus, medium and computer equipment for perovskite thin film batteries.

[0009] According to an embodiment of the present invention, a first embodiment is provided: a laser scribing method for perovskite thin-film solar cells, applied to a laser scribing device, comprising the following steps: The thin-film battery substrate to be processed is clamped and fixed on the support platform to maintain its static state relative to the support platform; The original laser beam is acquired and output as a multi-path processing beam through a beam splitting optical path system. The air-bearing drive component drives the flying optical path component to move linearly along the main processing direction relative to the stationary thin-film battery substrate, thereby driving multiple processing beams to perform scribing operations on the surface of the thin-film battery substrate. During the scribing operation of the multi-beam processing, at a predetermined spatial position in front of the current processing beam, the actual trajectory of the previous process scribing is detected in advance. The actual trajectory is calculated and compared with the theoretical reference trajectory to generate deviation data containing spatial position mapping relationship. Dynamic compensation command is generated based on the deviation data. The micro-motion drive mechanism responds to the dynamic compensation command and drives the optical execution component to make fine-tuning movements relative to the flying optical path component, so as to adjust the processing position of the multi-path processing beam on the surface of the thin-film battery substrate in real time and realize dynamic tracking compensation of the scribe line trajectory of the previous process.

[0010] Furthermore, the step of driving the flying optical path assembly to move linearly along the main processing direction relative to the stationary thin-film battery substrate via the air-bearing drive assembly includes: driving the optical transmission module of the flying optical path assembly to move linearly along the Y direction via the air-bearing drive assembly to perform a scribing operation on the surface of the stationary thin-film battery substrate; after a single linear movement is completed, driving the support platform to move the thin-film battery substrate a preset distance along the X direction to repeat the scribing operation; wherein, the main processing direction is the Y direction, and the stepping direction perpendicular to the Y direction is the X direction.

[0011] Further, the step of calculating the deviation data containing the spatial position mapping relationship by solving the actual trajectory and the theoretical reference trajectory includes: extracting the spatial offset of the actual trajectory by a displacement sensor arranged on the flight optical path component; constructing a spatial position synchronization buffer in the control system, binding the spatial offset with the real-time position feedback pulse of the air-bearing drive component to generate the deviation data corresponding to the physical coordinates of a specific Y direction, and storing the deviation data into the spatial position synchronization buffer in sequence according to the detected spatial sequence; calculating the corresponding spatial compensation delay pulse number based on the physical span between the detection spot of the displacement sensor and the current processing beam; when the real-time running pulses of the air-bearing drive component accumulate to the spatial compensation delay pulse number, using position event-triggered control logic, retrieving the corresponding deviation data sequentially from the spatial position synchronization buffer to generate the dynamic compensation command.

[0012] Furthermore, it also includes a filtering step for defects on the surface of the thin-film battery substrate: calculating the spatial change rate of the spatial offset between adjacent spatial sampling points in real time; when the spatial change rate exceeds a preset abrupt change limit, determining that the currently extracted spatial offset is a local abnormal noise point caused by dust or film edge collapse; removing the local abnormal noise point, and generating reconstruction deviation data based on historical normal spatial offsets through an interpolation algorithm; storing the reconstruction deviation data in the spatial position synchronization buffer.

[0013] Furthermore, the micro-motion drive mechanism is a voice coil motor or a piezoelectric ceramic driver, and the optical execution component includes a focusing lens; the step of responding to the dynamic compensation command through the micro-motion drive mechanism and driving the optical execution component to perform fine-tuning motion relative to the flying optical path component includes: while the multi-path processing beam is performing a scribing operation along the Y direction, the focusing lens is driven by the micro-motion drive mechanism to perform a high-frequency translation in the X direction, so as to correct the landing point coordinates of the multi-path processing beam in the X direction in real time, so that the actual trajectory of the current scribing operation and the actual trajectory of the previous process scribing line maintain a constant parallel distance in the X direction.

[0014] Furthermore, in the step of outputting the original laser beam into multiple processing beams through the beam splitting optical path system, the beam splitting optical path system divides the original laser beam into multiple independent sub-processing beams; the optical execution component includes multiple focusing lenses corresponding one-to-one with each of the sub-processing beams, and the micro-motion driving mechanism includes multiple independent actuation units that independently drive each of the focusing lenses; the step of generating dynamic compensation commands based on the deviation data includes: calculating and generating individual compensation commands specific to each of the sub-processing beams based on the deviation data; the step of responding to the dynamic compensation commands and driving the optical execution component to perform fine-tuning motion relative to the flying optical path component through the micro-motion driving mechanism includes: each of the actuation units responds to the corresponding individual compensation commands to independently fine-tune the processing position of each sub-processing beam on the surface of the thin-film battery substrate.

[0015] Furthermore, it also includes a dynamic span calibration step: acquiring temperature change data and corresponding thermal deformation parameters of the flying optical path component under continuous operation; calculating and dynamically updating the physical span between the detection spot of the displacement sensor and the current processing beam in real time based on the thermal deformation parameters; and recalculating the spatial compensation delay pulse number using the dynamically updated physical span to eliminate the spatiotemporal synchronization matching error caused by the mechanical thermal expansion of the flying optical path component in real time.

[0016] Furthermore, the step of responding to the dynamic compensation command and driving the optical execution component to make fine adjustments relative to the flying optical path component through the micro-motion drive mechanism further includes: acquiring the Z-axis height undulation data of the thin-film battery substrate surface in real time through a ranging sensor disposed on the flying optical path component, wherein the Z-axis is perpendicular to the plane containing the XY direction; generating a depth-of-focus compensation command based on the Z-axis height undulation data; and driving the focusing lens in the optical execution component to translate in the Z-axis through the micro-motion drive mechanism to dynamically adjust the focal height of the multi-path processing beam in real time, so as to keep the focal point always within the target processing film layer.

[0017] Furthermore, the linear motion process of the flight optical path component along the main processing direction includes an acceleration phase, a constant speed processing phase, and a deceleration phase; within the acceleration phase and the deceleration phase, the operating speed of the air-bearing drive component changes non-linearly; the step of retrieving deviation data using position event-triggered control logic when the cumulative real-time operating pulses of the air-bearing drive component reach the number of spatial compensation delay pulses ensures that the retrieval and release of the deviation data are always strictly synchronized with the physical coordinates under the non-linear speed change state, avoiding position matching errors caused by time domain control.

[0018] Furthermore, the surface of the thin-film battery substrate needs to undergo multiple parallel scribing processes in sequence to cut and form multiple series-connected sub-cell units; the previous process scribing is a physical scribing line formed by the previously completed P1 scribing process or P2 scribing process; the current processing beam is the beam that is performing the subsequent P2 scribing process or P3 scribing process, and the fine-tuning motion is used to maximally compress the processing dead zone width between two adjacent scribing processes.

[0019] According to an embodiment of the present invention, a second solution is provided as follows: A laser scribing device for a perovskite thin-film solar cell includes: A support platform is configured to clamp and fix the thin-film battery substrate to be processed in order to maintain its stationary state relative to the support platform; The beam splitting optical path system is configured to acquire the original laser beam and output the original laser beam as a multi-path processing beam; An air-bearing drive assembly and a flying optical path assembly driven therefrom, wherein the air-bearing drive assembly is configured to drive the flying optical path assembly to move linearly along the main processing direction relative to a stationary thin-film battery substrate, so as to drive multiple processing beams to perform scribing operations on the surface of the thin-film battery substrate. The detection sensor, arranged on the flying optical path assembly and located at a predetermined spatial position in front of the current processing beam, is configured to detect the actual trajectory of the previous process etch line in advance. The control system, communicatively connected to the detection sensor and the air-bearing drive assembly, is configured to calculate deviation data containing spatial position mapping between the actual trajectory and the theoretical reference trajectory, and generate dynamic compensation commands based on the deviation data; and A micro-motion drive mechanism and an optical actuator driven therefrom are mounted on the flying optical path assembly. The micro-motion drive mechanism is communicatively connected to the control system and is configured to respond to the dynamic compensation command and drive the optical actuator to perform fine-tuning motion relative to the flying optical path assembly, so as to adjust the processing position of the multi-path processing beam on the surface of the thin-film battery substrate in real time and realize dynamic tracking compensation of the scribe line trajectory of the previous process.

[0020] A computer device includes a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform the following steps: The thin-film battery substrate to be processed is clamped and fixed on a support platform to maintain its stationary state relative to the support platform. A raw laser beam is acquired and output as multiple processing beams through a beam splitting system. An air-bearing drive component drives a flying optical path component to move linearly along the main processing direction relative to the stationary thin-film battery substrate, thereby causing the multiple processing beams to perform scribing operations on the surface of the thin-film battery substrate. During the scribing operation of the multiple processing beams, at a predetermined spatial position in front of the current processing beam, the actual trajectory of the previous process scribing is detected in advance. The actual trajectory is calculated and compared with the theoretical reference trajectory to generate deviation data containing spatial position mapping relationships. A dynamic compensation command is generated based on the deviation data. A micro-motion drive mechanism responds to the dynamic compensation command and drives an optical execution component to perform fine-tuning movements relative to the flying optical path component, thereby adjusting the processing position of the multiple processing beams on the surface of the thin-film battery substrate in real time and achieving dynamic tracking compensation of the previous process scribing trajectory.

[0021] A computer-readable storage medium storing a computer program, which, when executed by a processor, causes the processor to perform the following steps: The thin-film battery substrate to be processed is clamped and fixed on a support platform to maintain its stationary state relative to the support platform. A raw laser beam is acquired and output as multiple processing beams through a beam splitting system. An air-bearing drive component drives a flying optical path component to move linearly along the main processing direction relative to the stationary thin-film battery substrate, thereby causing the multiple processing beams to perform scribing operations on the surface of the thin-film battery substrate. During the scribing operation of the multiple processing beams, at a predetermined spatial position in front of the current processing beam, the actual trajectory of the previous process scribing is detected in advance. The actual trajectory is calculated and compared with the theoretical reference trajectory to generate deviation data containing spatial position mapping relationships. A dynamic compensation command is generated based on the deviation data. A micro-motion drive mechanism responds to the dynamic compensation command and drives an optical execution component to perform fine-tuning movements relative to the flying optical path component, thereby adjusting the processing position of the multiple processing beams on the surface of the thin-film battery substrate in real time and achieving dynamic tracking compensation of the previous process scribing trajectory.

[0022] Compared with the prior art, the unique advantages of the technical solution provided in this application are as follows: This application provides a laser scribing method for perovskite thin-film batteries. By adopting a macro-micro decoupling architecture that combines a static substrate with an air-bearing flight optical path, the method separates the long-stroke high-speed linear transport from the high-frequency micron-level motion compensation, effectively overcoming the physical constraints of large inertia loads on high-frequency dynamic response in traditional equipment.

[0023] Meanwhile, this solution introduces a spatial feedforward read-ahead mechanism, which detects the actual trajectory of the previous process scribe line ahead of the current processing beam and calculates and generates deviation data containing spatial position mapping relationships. This fundamentally solves the spatiotemporal misalignment problem that is prone to occur in high-speed processing with traditional time-domain closed-loop feedback. Based on the strict alignment of the above-mentioned spatial physical coordinates, the system controls the micro-motion drive mechanism to fine-tune the processing position of multiple processing beams in real time, and performs precise dynamic tracking compensation for the micro-bending deviation of the previous scribe line. Thus, while preventing scribe line crossover short circuits and improving parallel processing capacity, the system maximizes the compression of the process dead zone width, ultimately achieving further compression of the process dead zone width and increasing the effective power generation area of ​​the module. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] in: Figure 1 A schematic flowchart illustrating a laser scribing method for a perovskite thin-film battery provided in this application embodiment; Figure 2 This application provides a block diagram of spatial location synchronization and dynamic compensation control logic for embodiments; Figure 3 A schematic diagram of the module structure of a laser scribing device for a perovskite thin-film battery provided in this application embodiment; Figure 4 This is a schematic diagram of the hardware structure of a computer device provided in an embodiment of this application.

[0026] Figure 5 This is an isometric view of the overall structure of a laser scribing device for a perovskite thin-film battery provided in an embodiment of this application.

[0027] Figure 6 This is a macro-micro decoupling execution and detection diagram provided for embodiments of this application.

[0028] 1.1-Laser control cabinet; 1.2-Marble base; 1.3-Laser source; 1.4-Laser main optical path cavity; 1.5-Laser branch optical path cavity; 1.6-Optical path cavity; 1.7-Flying optical path assembly; 4.1-Displacement sensor; 4.2-Micro-motion drive mechanism; 4.3-Distance sensor. Detailed Implementation

[0029] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] Example 1 This embodiment is combined with the appendix Figure 1 and attached Figure 2 This paper elaborates on the basic process and control logic of a laser scribing method for perovskite thin-film batteries provided in this application.

[0031] In the mass production of perovskite solar cells, to maximize the effective power generation area of ​​the module, the dead zone width between the P1, P2, and P3 scribing lines must be drastically compressed. However, the actual film layer is affected by the preceding processes, and the previous scribing line, such as the P1 line, often exhibits micron-level local bending and irregular undulations. Traditional laser scribing equipment typically uses mechanical guides to drag heavy glass substrates or large gantry frames for long-distance scanning. When pursuing high-volume processing speeds of 1.5 m / s or higher, this huge mechanical inertia leads to an extremely low dynamic response band. Traditional high-inertia spindles, when running at high speeds, struggle to achieve micron-level, high-frequency left-right oscillations to accurately follow the bending trajectory of the previous scribing line. To avoid the processing beam crossing and short-circuiting with the previous scribing line, the process necessitates increasing the dead zone width, for example, requiring a safety gap of 50 to 100 microns, which directly results in a decrease in photoelectric conversion efficiency.

[0032] To overcome the limitations of physical inertia mentioned above, this embodiment provides a laser scribing method for perovskite thin-film solar cells, including the following steps: S1: The thin-film battery substrate to be processed is clamped and fixed on the support platform to maintain its static state relative to the support platform. This solution changes the traditional heavy-load motion mode. During the high-speed laser scribing process, the large-mass glass substrate is stably adsorbed or clamped on the support platform to maintain absolute stillness, eliminating mechanical vibration and motion errors caused by the acceleration and deceleration of heavy objects from the source.

[0033] S2: Obtain the original laser beam and output the original laser beam as a multi-processing beam through a beam splitting optical path system.

[0034] S3: The air-bearing drive assembly drives the flying optical path assembly 1.7 to move linearly along the main processing direction relative to the stationary thin-film battery substrate, thereby driving multiple processing beams to perform scribing operations on the surface of the thin-film battery substrate. In the physical coordinate system defined in this embodiment, the main processing direction is the Y direction. The air-bearing drive assembly eliminates the contact friction of traditional mechanical guide rails. Since it only needs to support the extremely lightweight flying optical path assembly 1.7, the macroscopic spindle can enter a uniform speed range of over 2 m / s with extremely high acceleration, forming a high-speed scanning reference trajectory with high straightness in the Y direction. The air-bearing drive assembly can be selected as an air-bearing linear motor.

[0035] S4: During the scribing operation of the multi-path processing beams, at a predetermined spatial position in front of the current processing beam, the actual trajectory of the previous process scribing line is detected in advance; the actual trajectory and the theoretical reference trajectory are calculated to generate deviation data containing spatial position mapping relationship, and a dynamic compensation command is generated based on the deviation data.

[0036] This step implements the key decoupling control logic, meaning the system eliminates its reliance on time delay mechanisms and adopts sequential control logic based on position event triggering for data flow: as the detection spot advances with the flight optical path component 1.7, the underlying hardware sequentially reads the true shape of the trajectory ahead based on spatial physical coordinates, extracts the offset, and forms an ordered compensation command stream. This comparison and execution judgment specific to spatial coordinates ensures that the compensation action is strictly anchored to a defined physical spatial point, avoiding position matching errors in the system state under high-speed operation.

[0037] In the actual mass production of perovskite thin-film batteries, the surface of the thin-film battery substrate needs to undergo multiple parallel scribing processes sequentially to cut and form multiple series-connected sub-cell units. The previous process scribing mentioned in this step specifically refers to the previously completed P1 scribing process, such as the scribing process on the underlying conductive film, or the physical scribing finally formed by the P2 scribing process. Correspondingly, the current processing beam refers to the beam currently performing the subsequent P2 or P3 scribing process. Through the fine-tuning motion of this embodiment, it is possible to ensure that the currently executed P2 or P3 scribing is precisely parallel and as close as possible to the previously completed P1 or P2 scribing, thereby effectively compressing the process dead zone width between two adjacent scribing processes and maintaining a constant parallel spacing between them.

[0038] S5: The micro-motion drive mechanism 4.2 responds to the dynamic compensation command and drives the optical execution component to make fine-tuning movements relative to the flying optical path component 1.7, so as to adjust the processing position of the multi-path processing beam on the surface of the thin-film battery substrate in real time and realize dynamic tracking compensation of the scribe line trajectory of the previous process.

[0039] This step spatially superimposes and decouples the macroscopic drive unit (air-bearing drive assembly) responsible for the large-stroke Y-axis main motion and the microscopic drive unit (micro-motion drive mechanism 4.2) responsible for small-stroke and high-frequency compensation in terms of mechanical architecture. In actual scribing operations, when the system detects a local bending deviation of, for example, 3 micrometers in the X-axis of the previous process scribing line, the air-bearing drive assembly continues its high-speed linear motion in the Y-axis. Simultaneously, the micro-motion drive mechanism 4.2, mounted on the air-bearing drive assembly, responds in real-time to dynamic compensation commands, driving the optical execution component to perform a corresponding 3-micrometer lateral shift adjustment in the XY plane. Through this macro-micro composite motion, the actual landing point of the current processing beam can accurately align with and dynamically follow the local bending trajectory of the previous process scribing line.

[0040] Furthermore, addressing the unavoidable surface warping of glass substrates in real-world industrial environments, this embodiment performs high-precision tracking in the XY plane while simultaneously performing Z-axis focus compensation. Specifically, a ranging sensor 4.3 mounted on the flying optical path assembly 1.7 acquires real-time Z-axis height undulation data of the thin-film battery substrate surface, where Z is perpendicular to the plane containing the XY directions. The control system calculates and generates a depth-of-focus compensation command based on this Z-axis height undulation data. The voice coil motor or piezoelectric ceramic driver inside the micro-motion drive mechanism 4.2 can not only perform X-axis lateral movement but also respond to the depth-of-focus compensation command, driving the focusing lens in the optical execution assembly to perform synchronous translation in the Z-direction. This dynamically adjusts the focal height of the multi-path processing beams in real time, maintaining the focus precisely locked within the target processing film layer, preventing laser etching from penetrating or failing to penetrate due to substrate warping.

[0041] S6: After the linear motion along the main processing direction is completed in a single operation, the control system drives the support platform to move the thin-film battery substrate, which is in a stationary clamping state, a preset distance along the X direction in preparation for repeating the scribing operation in the next column; wherein, the stepping direction perpendicular to the Y direction is the X direction.

[0042] This embodiment constructs a mechanical coordinate system based on a Y-axis air-bearing component driving a lightweight optical path for high-speed scanning, combined with an X-axis support platform driving a heavy-duty substrate for low-speed stepping. This scheme decouples the overall scribing process into macroscopic long-stroke linear motion and microscopic short-stroke high-frequency correction motion, achieving the following technical effects: 1. It effectively solves the technical contradiction that traditional single-axis drive systems are limited by the overall large inertia load, thus making it impossible to balance large-stroke high-speed operation and high-frequency fine-tuning compensation.

[0043] 2. Through the aforementioned macro-micro decoupling architecture, the micro-motion drive mechanism 4.2 avoids the suppression of dynamic response capability by large-mass mechanical loads, thereby achieving extremely high frequency band response characteristics. This enables the system to perform high-frequency, micron-level dynamic and precise tracking of minute geometric distortions in the preceding scribing process. Furthermore, while ensuring that adjacent scribing lines do not cross-circuit, it maximizes the reduction of the process dead zone width between adjacent scribing processes, effectively increasing the effective power generation area of ​​the thin-film battery module.

[0044] Example 2 This embodiment is based on the laser scribing method for perovskite thin-film batteries in Embodiment 1, and further incorporates the attached... Figure 2 The algorithm involved in this laser scribing method is explained in detail.

[0045] In high-speed laser scribing, traditional error closed-loop control often employs pure time-domain feedback logic. This means that after the detection system acquires the error, it sends it to the actuator for compensation after a fixed time delay. However, when the air-bearing drive component is in acceleration / deceleration phases or when there are slight speed fluctuations due to mechanical resonance, the operating speed becomes non-linear. In this case, the fixed time delay can lead to severe spatial misalignment, causing the compensation action to fall on incorrect physical coordinates.

[0046] Furthermore, in real industrial settings, the surface of thin-film battery substrates inevitably accumulates fine dust or has localized edge chipping from previous processes. If the displacement sensor 4.1 mistakes these sudden surface defects for normal trajectory bending and directly generates compensation commands, it will cause the micro-motion drive mechanism 4.2 to generate severe abnormal vibrations, thereby causing the current processing beam to deviate from the safe processing area.

[0047] To address the aforementioned issues of spatiotemporal misalignment and abnormal data interference, this embodiment further elaborates on step S4 in Embodiment 1: Step S401: Using the displacement sensor 4.1 installed on the flight optical path assembly 1.7, the actual trajectory spatial offset of the previous process scribe line relative to the theoretical reference trajectory is obtained; simultaneously, the real-time position feedback pulse of the air buoyancy drive assembly during linear motion is obtained. The actual trajectory spatial offset and the real-time position feedback pulse are spatially bound together to generate deviation data corresponding to a specific Y-direction physical coordinate, and the deviation data is sequentially stored in the spatial position synchronization buffer.

[0048] Specifically, the actual trajectory spatial offset can be expressed as a one-dimensional vector ΔXi, which represents the difference between the coordinates of the actual etched line detected by the displacement sensor 4.1 in the X direction and the coordinates of the ideal straight line at the i-th sampling period. The spatial coordinate binding is achieved by constructing a binary data structure containing position coordinates and offset. Specifically, the system reads the real-time pulse count value P_c of the grating ruler of the air-bearing drive component at the current sampling moment, and encapsulates the calculated target execution pulse value P_t and ΔXi into a structure [P_t, ΔXi] to form the deviation data.

[0049] This step is fundamental to spatial synchronization. The underlying hardware captures the current pulse value and packages it with the offset, storing it in a buffer queue to ensure that each error has a clear physical spatial assignment. For example, suppose the air-bearing drive component is currently running at the 10,000th pulse position in the Y direction, and the displacement sensor 4.1 detects that the preceding scribe line has deviated to the right by 3 micrometers, i.e., ΔXi = +3μm. If, based on the physical span calculation, it is known that the beam will need to wait 5,000 pulses to reach this position, then the system generates the deviation data [15000, +3], and pushes it into the spatial position synchronization buffer.

[0050] Step S402: Before binding the actual trajectory spatial offset to spatial coordinates, the system performs filtering logic on the continuously collected data stream: extracting the actual trajectory spatial offset between adjacent sampling points and calculating its spatial change rate; determining whether the spatial change rate exceeds a preset abrupt change threshold; if it exceeds the abrupt change threshold, determining that the currently collected actual trajectory spatial offset is abnormal data caused by surface defects and discarding it; subsequently, calling the historical interpolation algorithm, combining historical normal data to reconstruct the true deviation data at the coordinate point, and storing the reconstructed deviation data in the spatial position synchronization buffer.

[0051] In a real manufacturing process, the curvature of the engraved lines is continuous and smooth, while changes in depth or position caused by dust or chipping often exhibit instantaneous step-like characteristics. By comparing threshold values ​​for the rate of spatial change, the system can automatically identify and eliminate such abnormal signals.

[0052] The specific process for extracting the offset and calculating the spatial rate of change is as follows: The system continuously samples according to a fixed spatial step size or time cycle, extracting the actual trajectory spatial offset ΔXi of the current cycle and the normal offset ΔX(i-1) of the previous cycle. The spatial rate of change V_s between the two points is calculated using the following formula: V_s=│ΔXi-ΔX(i-1)│ / ΔY Where ΔY is the physical distance traveled by the air-float drive component in the Y direction between two adjacent samplings.

[0053] A threshold value V_th is pre-defined in the system to represent the maximum curvature of the normal process etching lines. The calculated V_s is compared with V_th. If V_s > V_th, the current offset ΔXi is determined to be a step-type abnormal data caused by dust particles or local edge chipping. Once determined to be abnormal data, the system rejects ΔXi and immediately calls the historical interpolation algorithm for reconstruction.

[0054] This embodiment employs a first-order linear extrapolation or second-order polynomial fitting algorithm based on multiple preceding valid sampling points. Taking first-order linear extrapolation as an example, the reconstructed deviation data ΔXir is expressed as follows: ΔXir=ΔX(i-1)+(ΔX(i-1)-ΔX(i-2)) The system replaces the original abnormal data with the calculated ΔXir and participates in subsequent coordinate binding and caching, thereby eliminating sudden noise on the physical surface at the digital level and ensuring the continuity and smoothness of subsequent fine-tuning movements.

[0055] Step S403: Obtain the physical span between the detection spot of the displacement sensor 4.1 and the current processing beam; calculate the corresponding spatial compensation delay pulse number based on the physical span and the physical resolution of the real-time position feedback pulse; during the movement of the flying optical path component 1.7, accumulate the real-time running pulses of the real-time position feedback pulse; when the accumulation of the real-time running pulses reaches the spatial compensation delay pulse number, use the position event-triggered control logic to sequentially retrieve the corresponding deviation data from the spatial position synchronization buffer to generate the dynamic compensation command.

[0056] The steps for defining the physical span include: the physical span L refers to the fixed physical distance between the center of the detection spot of the displacement sensor 4.1 and the center of the focusing spot of the processing beam behind it on the mechanical assembly structure along the Y-axis, for example, L=50mm.

[0057] The specific steps for pulse count conversion include: Assuming the physical resolution of the grating ruler configured in the air-bearing drive assembly is R, with units of pulses per millimeter, the system calculates the spatial compensation delay pulse count P_delay using multiplication operations. The calculation formula is as follows: P_delay=L×R This value represents the total number of spatial pulses that the light beam must traverse to reach the current detection point. Based on step S401, the target execution pulse value is: P_target = P_c + P_delay The specific process of sequentially retrieving deviation data is as follows: The spatial position synchronization buffer is constructed as a buffer queue in memory. During the high-speed movement of the flight optical path component 1.7, the high-speed counter at the hardware level accumulates the real-time operation feedback pulse P_(real-time) of the air-bearing grating ruler in real time. The system's hardware comparator continuously compares P_(real-time) with the target execution pulse value P_target in the first structure of the queue at an extremely high clock frequency. When the condition P_(real-time)≥P_target is met, the interrupt mechanism is triggered. The control system immediately pops out the structure at the head of the queue, parses the corresponding spatial offset, and converts it into an analog voltage or pulse command, which is then sent to the micro-motion drive mechanism 4.2. Thus, the data sequential consumption process strictly anchored to the physical coordinates is completed.

[0058] Furthermore, the linear motion process of the flight optical path component 1.7 along the main processing direction completely includes an acceleration phase, a constant speed processing phase, and a deceleration phase. During the acceleration and deceleration phases, the operating speed of the air-bearing drive component changes non-linearly. In this control logic, the system eliminates reliance on conventional time-domain delay mechanisms and adopts an event-triggered mechanism based on position feedback pulse comparison. When the accumulated real-time operation feedback pulses reach the target execution pulse value, compensation is immediately triggered. This ensures that even under non-linear speed changes, the retrieval and release of the deviation data can always maintain strict synchronization with the physical coordinates, effectively avoiding position matching errors generated by time-domain control during the acceleration and deceleration phases.

[0059] This embodiment achieves the following technical effects by introducing a low-level spatial binding algorithm and an abnormal data reconstruction mechanism: Replacing traditional time-domain feedback with position event-triggered control logic ensures that even when the device is in acceleration / deceleration phases or experiencing speed fluctuations, the compensation action of the micro-motion drive mechanism 4.2 can still accurately correspond to the predetermined physical spatial coordinates, realizing high-precision spatial synchronous feedforward control. The data anti-jitter and trajectory reconstruction logic effectively filters out interference from sudden abnormal factors such as substrate surface dust and localized edge chipping of the preceding process film layers on the closed-loop control, ensuring the smooth operation of the micro-motion drive mechanism 4.2, thereby improving the processing stability and yield rate during component mass production.

[0060] Example 3 Based on the aforementioned spatial position synchronization and data reconstruction control, this embodiment further provides advanced control and compensation methods to address coupling errors caused by multi-path parallel processing in mass continuous production and mechanical thermal drift caused by continuous high-speed operation.

[0061] To improve processing capacity, existing perovskite scribing processes typically incorporate beam splitting systems to achieve parallel scribing of multiple beams. However, current multi-beam equipment usually employs only a single drive mechanism to perform uniform coarse adjustment of the entire optical frame. Due to processing aberrations of optical components, differences in optical path transmission distance, and inhomogeneities in local substrate films, each processing beam typically exhibits slight individual positional deviations at its actual landing point. In this situation, if an overall linkage compensation method is used, cross-coupling errors between the beams are easily introduced, making independent and precise correction impossible.

[0062] On the other hand, the air-bearing drive component generates heat during prolonged, continuous, high-frequency reciprocating motion, causing thermal expansion of the mechanical beam or base carrying the optical components, resulting in mechanical thermal drift. This thermal deformation alters the actual physical distance between the detection spot of the displacement sensor 4.1 and the laser processing spot. Under the aforementioned position event-triggered control mechanism, even minute thermal deformation of the physical span can lead to calculation errors in the generated spatial compensation delay pulse count, causing the compensation command to be executed prematurely or delayed, ultimately compromising the accuracy of the system's spatial synchronization.

[0063] To overcome the aforementioned technical challenges, this embodiment provides a laser scribing method for perovskite thin-film solar cells, further including the following specific control steps: Step S501: The beam-splitting optical path system uses a beam-splitting mirror group or diffractive optical elements to spatially divide the single original laser beam into N parallel processing beams. Correspondingly, the micro-motion drive mechanism 4.2 integrates N independent micro-actuators, each of which is independently mechanically connected to a corresponding set of focusing lenses in the optical execution component. Commonly used micro-actuators include piezoelectric ceramic drivers or high-frequency voice coil motors.

[0064] To address the inherent positional differences in each beam caused by optical aberrations or initial installation, the control system pre-acquires and stores a set of optical axis offset matrices Mb=[bias1,bias2,...biasN] containing N static offset components during the calibration phase. Here, N represents the total number of the sub-processing beams, n is an index variable identifying each sub-processing beam, and its value range is a positive integer satisfying 1≤n≤N; biasn represents the initial static deviation of the nth sub-processing beam in the X direction.

[0065] During the real-time line marking operation, the control system retrieves the reconstruction deviation data ΔXir from the solution output in Example 2 as the trajectory following reference shared by multiple beams. Subsequently, based on the reconstruction deviation data and the optical axis offset matrix, the control system generates a dynamic compensation instruction array CMD=[cmd1,cmd2,...,cmdN] containing N independent components through parallel calculation using the following mathematical relationship: cmdn=K×(ΔXir+biasn) Where cmdn represents the control command value sent to the nth micro actuator, such as the drive voltage or the number of digital pulses; K is the displacement-electrical conversion gain coefficient of the micro actuator.

[0066] The N micro-actuators receive corresponding commands from the command array CMD in parallel, and independently drive their attached focusing lenses to perform microscopic translational motion in the X direction. This not only achieves dynamic tracking of the overall bending trend of the previous process scribe line, but also simultaneously eliminates cross-coupling errors between the various sub-processing beams, ensuring that the focus of each processing beam falls precisely within its theoretically safe processing zone.

[0067] Step S404: This step, as a background parallel process, corrects the physical span conversion parameters involved in step S403 of Embodiment 2 in real time. Specifically, a high-precision temperature sensor attached to the base of the flight optical path component 1.7 is used to acquire the temperature change data ΔT of the flight optical path component 1.7 in continuous operation in real time.

[0068] The system incorporates the linear expansion coefficient α of the mechanical base material as a thermal deformation parameter. Based on the thermal expansion formula, the physical elongation ΔL = α × L0 × ΔT at the current moment is calculated, where L0 is the initial calibration span at room temperature. The system then dynamically updates the current actual physical span accordingly. Ld=L0+ΔL The system uses the dynamically updated actual physical span Ld, combined with the physical resolution R of the grating ruler, to recalculate the number of spatial compensation delay pulses P_delaynew: P_delaynew=Ld×R When the system pushes the newly acquired deviation data into the spatial position synchronization buffer in step S401, its target execution pulse value will be calculated using the updated parameters, that is: P_target = P_c + P_delaynew Through the above-mentioned dynamic parameter correction process, the slow mechanical thermal drift is offset in real time at the digital control level.

[0069] This embodiment eliminates the beam cross-interference problem caused by the multi-actuator independent control architecture within the micro-motion drive mechanism 4.2. This solution achieves parallel processing of multiple beams to improve production efficiency while ensuring the independent adjustment accuracy of the landing point coordinates of each sub-processing beam. Furthermore, the dynamic span calibration step incorporates the thermal deformation of mechanical components as a compensation variable, dynamically correcting it within the underlying pulse conversion model. This mechanism enables the equipment to maintain the accuracy of position event triggering logic even during long-term continuous operation or when affected by ambient temperature fluctuations, preventing positional offsets caused by spatial feedforward compensation, thereby improving processing accuracy and process consistency in continuous mass production.

[0070] Example 4 During high-speed dynamic tracking compensation, the micro-motion drive mechanism 4.2 generates a high-frequency lateral movement in the X direction. This lateral movement is superimposed on the macroscopic linear movement of the air-bearing drive component in the Y direction, causing the actual trajectory of the processing beam on the thin-film battery substrate surface to evolve from an ideal straight line into a microscopic wavy curve. In this physical process, the actual composite vector velocity of the light spot on the thin-film battery substrate surface increases instantaneously with the increase of lateral movement amplitude and frequency. If the output power or pulse repetition frequency of the original laser beam source remains constant, the sudden increase in composite vector velocity will directly lead to a decrease in the laser energy density of the local scribing area. The instantaneous drop in energy density will cause the perovskite film to become shallower, and the bottom conductive material or transport layer material to be incompletely stripped, thereby causing the electrical isolation between adjacent sub-cells to fail, seriously affecting the power generation performance of the final photovoltaic module.

[0071] To overcome the aforementioned process defects, this embodiment provides a laser scribing method for perovskite thin-film solar cells. During the execution of step S5, the following steps are performed simultaneously: Step S601: During the scribing operation, the control system acquires the instantaneous main processing speed Vy of the air-float drive component in the Y direction in real time. At the same time, the control system extracts the instantaneous fine-tuning speed Vx of the multi-path processing beam in the X direction according to the dynamic compensation command retrieved and released and the mechanical response parameters of the micro-motion drive mechanism 4.2.

[0072] The control system calculates the actual combined vector velocity Vtotal of the current processing spot on the surface of the thin-film battery substrate in real time. The calculation formula is as follows:

[0073] Step S602: Pre-set and store the target energy density reference value required for the target processing film layer, as well as the pulse energy and light output frequency response model of the laser source in the control system.

[0074] The control system synchronously generates laser energy modulation commands based on the actual synthesized vector velocity Vtotal calculated in real time. Specifically, when there is lateral displacement compensation in the X direction causing the actual synthesized vector velocity Vtotal to be greater than the instantaneous main processing speed Vy, the control system sends the laser energy modulation command to the laser source of the original laser beam through a high-speed digital-to-analog converter interface. This command is used to drive the laser source to proportionally increase the output peak power or proportionally increase the pulse repetition frequency, so that the physical heat input per unit area of ​​the thin-film battery substrate increases synchronously with the increase of the vector velocity.

[0075] By employing real-time vector velocity calculation and dynamic feedforward modulation of laser energy, the uneven local energy distribution caused by microscopic transverse displacement compensation motion is eliminated, ensuring that the processing beam maintains a constant and consistent energy density at any point along the entire curved scribing trajectory. This approach effectively avoids insufficient scribing depth or underlying film residue issues caused by localized process energy drops, guaranteeing the electrical isolation performance and physical scribing quality of multiple scribing processes, thereby improving the overall yield and photoelectric conversion efficiency of large-area perovskite thin-film solar cell modules.

[0076] Example 5 To address the high-speed spatial misalignment problem caused by the inherent physical response delay of the underlying actuator, this embodiment provides a laser scribing method for perovskite thin-film solar cells.

[0077] Under high-speed scribing conditions, although the system achieves the issuance of compensation commands at precise spatial coordinates through pulse accumulation, the micro-motion drive mechanism 4.2 in the physical world inevitably experiences a millisecond-level physical lag time from receiving electrical commands from the control system to overcoming its own mechanical inertia and finally reaching the designated physical position. For example, when the air-bearing drive component operates at a high speed of 2 m / s and the micro-motion drive mechanism 4.2 has a 1-millisecond physical lag, this time difference will cause the machining beam to deviate by 2 mm along the main machining direction. This intrinsic lag of the underlying hardware causes the peak of the fine-tuning mechanical action to lag significantly behind the peak of the actual scribing, resulting in the compensation action falling on the wrong physical coordinates, ultimately leading to physical inaccuracies in the spatial synchronization mechanism under ultra-high-speed conditions.

[0078] This embodiment introduces a hardware-in-the-loop phase lead compensation model into the control flow. Specifically, after obtaining the target execution pulse value in step S403 and before the execution pulse trigger comparison, the following control steps are added: Step S701: During the initialization or calibration phase of equipment operation, the control system drives the micro-motion drive mechanism 4.2 to execute multiple sets of step response movements with different amplitudes through the built-in excitation algorithm. The step response process of the micro-motion drive mechanism 4.2 from receiving the electrical command to outputting the full amplitude of the actual mechanical displacement is simultaneously measured and recorded. The physical hysteresis time constant Tdelay of the actuator itself is extracted and stored in the system's underlying control register.

[0079] Step S702: During the high-speed scribing operation, the control system acquires the current instantaneous main machining speed Vy of the air flotation drive component in real time.

[0080] Based on the instantaneous main machining speed Vy and the physical hysteresis time constant Tdelay, the control system calculates in real time the physical distance of the blind zone traversed by the compensation component along the main machining direction during the hysteresis response. Then, combining this with the physical resolution R of the air-bearing component grating ruler defined in Embodiment 2, the corresponding phase lead compensation pulse number Plead is calculated using the following formula: Plead=Vy×Tdelay×R Before pushing the binary structure containing the target execution pulse value P_target into the spatial position synchronization buffer, the control system uses the calculated phase advance compensation pulse number to perform reverse compensation correction on the target execution pulse value, generating an advance execution pulse value P_target_advance, i.e.: P_target_advance=P_target-Plead The system's hardware comparator is now modified to compare the real-time running feedback pulse with the updated advance execution pulse value P_target_advance. When the real-time accumulated pulses match, the system releases the dynamic compensation command in advance. This advance precisely offsets the mechanical response delay of the micro-motion drive mechanism 4.2 in the physical time domain.

[0081] By introducing a phase lead compensation model, the inherent response time of the actuator is converted into spatial pulse advance. This ensures that, at extremely high scribing speeds, the mechanical compensation action of the micro-motion drive mechanism 4.2 can precisely match and overlap with the geometric distortion points of the preceding process scribing lines, guaranteeing the closed-loop effectiveness of the spatial feedforward logic under ultra-high-speed conditions. This lead compensation mechanism frees the control accuracy of the equipment from the rigid response limits of the voice coil motor or piezoelectric ceramic underlying hardware, breaking through the engineering bottleneck of the sharp drop in processing accuracy after speed increases in traditional equipment, and providing a reliable algorithmic control foundation for further increasing single-machine productivity.

[0082] Example 6 To address the blind zone problem inherent in geometric depth detection-based scribing processes for perovskite thin-film solar cells, this embodiment provides a laser scribing method for perovskite thin-film solar cells.

[0083] In traditional laser scribing quality monitoring, the Z-axis ranging sensor 4.3 described in Example 1 can typically only measure the physical geometric depth of the scribing lines. However, the core objective of the scribing processes for perovskite thin-film solar cells (P1, P2, P3) is to achieve optical and electrical isolation between the film layers. In actual processing, sometimes although the geometric scribing depth reaches the theoretical design value, due to the influence of laser thermal effects, extremely thin conductive debris may still remain at the bottom of the trench, or localized thermal remelting of the material may occur. This microscopic material residue cannot be detected by conventional ranging sensors 4.3, leading to dead zone leakage between adjacent sub-cells and severely weakening the photoelectric performance of the final assembly. Specifically, during the scribing operation using the multi-beam processing, the following control steps are executed simultaneously: Step S801: An optical transmission detection module or an optical reflection detection module is added to the flight optical path assembly 1.7, located behind the current processing beam. During the high-speed scanning of the air-bearing drive assembly along the main processing direction, the optical transmission detection module is used to synchronously scan the newly etched process lines in situ, acquiring the online optical density (OD) data of the bottom of the process lines in real time. The online optical density (OD) data can extremely sensitively reflect the true degree of material peeling and light transmission performance at the bottom of the grooves.

[0084] Step S802: A qualified optical density threshold ODth, representing the complete removal of material from the bottom of the scribe line, is pre-set in the control system. The control system compares and analyzes the real-time acquired online optical density OD data with the qualified optical density threshold ODth. When it is determined that the current online optical density OD is greater than the qualified optical density threshold ODth, it is determined that there is residual conductive material at the bottom of the current process scribe line or insufficient light transmittance due to thermal remelting.

[0085] At this point, the control system extracts the error characteristic and generates an optical characteristic feedback command. Based on the optical characteristic feedback command, the control system performs adaptive processing parameter correction when executing the next parallel scribing process on the current thin-film battery substrate, or when processing the next batch of thin-film battery substrates. Specific correction methods include: superimposing the depth-of-focus compensation command described in Example 1 to fine-tune the downcutting depth of the focusing lens in the Z direction; or coordinating the laser energy modulation command described in Example 4 to compensate for the actual laser energy density applied to the target processed film layer.

[0086] By using online optical density indicators instead of traditional physical depth indicators as the quality evaluation benchmark, it is possible to directly penetrate the geometric surface and accurately identify microscopic material residues and thermal damage at the bottom of the scribing lines. This allows for the most fundamental control over the true electrical and optical isolation effects of perovskite scribing. Integrating the in-situ optical detection results with the aforementioned Z-axis focusing system and laser energy modulation system enables the laser scribing equipment to adaptively evolve and correct for batch differences and local inhomogeneities in the film layer, further improving the yield rate in the large-area module production process.

[0087] Example 7 This embodiment is combined with the appendix Figure 3 Module structure and attachments Figure 5 With appendix Figure 6 The document provides a detailed structural diagram of a laser scribing device for perovskite thin-film solar cells. This device physically maps the laser scribing methods described in Examples 1 to 6 above, enabling efficient mass production of large-area perovskite thin-film solar cell modules.

[0088] This application provides a laser scribing device for perovskite thin-film batteries, comprising a mechanical support system, an optical transmission system, a macro-micro composite drive system, and a central control system.

[0089] I. Mechanical load-bearing and stable base system. For example... Figure 5 As shown, the underlying support structure of the laser marking equipment adopts a large-mass marble base 1.2. This marble base 1.2 naturally possesses extremely high seismic damping characteristics and an extremely low coefficient of thermal expansion, providing a physical foundation for the high-speed operation of the entire machine to eliminate high-frequency mechanical vibration and resist environmental thermal drift.

[0090] The mechanical support system is mounted on the marble base 1.2 and includes a support platform. This support platform is equipped with a vacuum adsorption component for firmly clamping the thin-film battery substrate to be processed and maintaining it in a relatively static state. An X-axis stepper motor is connected to the bottom of the support platform, which, after a single main processing direction marking is completed, drives the support platform to move the thin-film battery substrate a preset distance along the X-axis.

[0091] II. Optical transmission systems. For example... Figure 5 As shown, the optical transmission system includes a laser as a laser source 1.3 and a beam-splitting optical path system. The laser source 1.3 generates a raw laser beam, which enters the interior of the beam-splitting optical path system. Physically, the beam-splitting optical path system is a closed structure consisting of a main laser path cavity 1.4, a branch laser path cavity 1.5, and an optical path cavity 1.6 connected in sequence. The raw laser beam is evenly divided into multiple independent sub-processing beams by a beam-splitting mirror group integrated inside the cavity, and finally guided into the flying optical path assembly 1.7 on the active side.

[0092] III. Macro-micro Composite Drive and Detection System. The macro-micro composite drive system adopts a spatially decoupled architecture, specifically including an air-float drive component and a micro-motion drive mechanism 4.2.

[0093] The air-bearing drive assembly, serving as the macroscopic spindle, carries the flight optical path assembly 1.7 and performs high-speed linear scanning motion along the Y-direction, which is the main machining direction. The air-bearing drive assembly is equipped with a high-resolution grating ruler for real-time feedback of position pulses.

[0094] like Figure 6 As shown, the micro-motion drive mechanism 4.2 serves as a micro-compensation axis and is mounted on the air-bearing drive assembly. The micro-motion drive mechanism 4.2 integrates multiple independent micro-actuators. Each micro-actuator is mechanically connected to the corresponding focusing lens in the optical execution assembly, and is used to drive the focusing lens to perform high-frequency lateral fine-tuning motion in the XY plane.

[0095] In addition, such as Figure 6 As shown, a displacement sensor 4.1 is fixedly installed at the front end of the flying optical path assembly 1.7, which is used to detect the actual trajectory spatial offset of the previous process line at a predetermined spatial position in front of the current processing beam; a distance sensor 4.3 is equipped on its side, which is used to acquire the Z-axis height undulation data of the thin film battery substrate surface in real time.

[0096] IV. Central control system and underlying hardware circuitry. For example... Figure 5 As shown, a laser control cabinet 1.1 is integrated on the side of the device. The core motherboard and digital signal processor of the central control system are both located inside the laser control cabinet 1.1 and are electrically connected to the displacement sensor 4.1, distance sensor 4.3, micro-motion drive mechanism 4.2, and air-bearing drive assembly. The central control system is equipped with a spatial position synchronization buffer, configured to execute core algorithm instructions such as abnormal data filtering, physical span conversion, position event trigger comparison, and dynamic thermal deformation parameter calibration as described in the previous embodiment, and finally output high-frequency dynamic compensation instructions to the micro-motion drive mechanism 4.2.

[0097] The laser marking device described in this embodiment, through... Figure 5 Modular spatial decoupling hardware shown Figure 6 The precision sensing layout shown fundamentally overcomes the physical bottleneck of single-axis, high-inertia equipment in high-speed machining, and achieves extreme compression of the machining dead zone width on the mass production site.

[0098] Figure 4 An internal structural diagram of a computer device in one embodiment is shown. This computer device can specifically be a terminal or a server. Figure 4As shown, the computer device includes a processor, memory, and network interface connected via a system bus. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system and may also store a computer program that, when executed by the processor, enables the processor to implement the laser scribing method. The memory may also store a computer program that, when executed by the processor, enables the processor to implement the laser scribing method. Those skilled in the art will understand that... Figure 4 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0099] In one embodiment, a computer device is provided, including a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform the following steps: The thin-film battery substrate to be processed is clamped and fixed on the support platform to maintain its static state relative to the support platform; The original laser beam is acquired and output as a multi-path processing beam through a beam splitting optical path system. The air-bearing drive component drives the flying optical path component 1.7 to move linearly along the main processing direction relative to the stationary thin-film battery substrate, so as to drive the multi-path processing beam to perform scribing operations on the surface of the thin-film battery substrate. During the scribing operation of the multi-beam processing, at a predetermined spatial position in front of the current processing beam, the actual trajectory of the previous process scribing is detected in advance. The actual trajectory is calculated and compared with the theoretical reference trajectory to generate deviation data containing spatial position mapping relationship. Dynamic compensation command is generated based on the deviation data. The micro-motion drive mechanism 4.2 responds to the dynamic compensation command and drives the optical execution component to make fine-tuning movements relative to the flying optical path component 1.7, so as to adjust the processing position of the multi-path processing beam on the surface of the thin-film battery substrate in real time and realize dynamic tracking compensation of the scribe line trajectory of the previous process.

[0100] In one embodiment, a computer-readable storage medium is provided storing a computer program that, when executed by a processor, causes the processor to perform the following steps: The thin-film battery substrate to be processed is clamped and fixed on the support platform to maintain its static state relative to the support platform; The original laser beam is acquired and output as a multi-path processing beam through a beam splitting optical path system. The air-bearing drive component drives the flying optical path component 1.7 to move linearly along the main processing direction relative to the stationary thin-film battery substrate, so as to drive the multi-path processing beam to perform scribing operations on the surface of the thin-film battery substrate. During the scribing operation of the multi-beam processing, at a predetermined spatial position in front of the current processing beam, the actual trajectory of the previous process scribing is detected in advance. The actual trajectory is calculated and compared with the theoretical reference trajectory to generate deviation data containing spatial position mapping relationship. Dynamic compensation command is generated based on the deviation data. The micro-motion drive mechanism 4.2 responds to the dynamic compensation command and drives the optical execution component to make fine-tuning movements relative to the flying optical path component 1.7, so as to adjust the processing position of the multi-path processing beam on the surface of the thin-film battery substrate in real time and realize dynamic tracking compensation of the scribe line trajectory of the previous process.

[0101] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and RAMbus dynamic RAM (RDRAM), etc.

[0102] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0103] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A laser scribing method for perovskite thin-film solar cells, applied to laser scribing equipment, characterized in that, Includes the following steps: The thin-film battery substrate to be processed is clamped and fixed on the support platform to maintain its static state relative to the support platform; The original laser beam is acquired and output as a multi-path processing beam through a beam splitting optical path system. The air-bearing drive component drives the flying optical path component to move linearly along the main processing direction relative to the stationary thin-film battery substrate, thereby driving multiple processing beams to perform scribing operations on the surface of the thin-film battery substrate. During the scribing operation of the multi-beam processing, at a predetermined spatial position in front of the current processing beam, the actual trajectory of the previous process scribing is detected in advance. The actual trajectory is calculated and compared with the theoretical reference trajectory to generate deviation data containing spatial position mapping relationship. Dynamic compensation command is generated based on the deviation data. The micro-motion drive mechanism responds to the dynamic compensation command and drives the optical execution component to make fine-tuning movements relative to the flying optical path component, so as to adjust the processing position of the multi-path processing beam on the surface of the thin-film battery substrate in real time and realize dynamic tracking compensation of the scribe line trajectory of the previous process.

2. The laser scribing method for perovskite thin-film solar cells according to claim 1, characterized in that, The step of driving the flying optical path assembly to move linearly along the main processing direction relative to the stationary thin-film battery substrate via the air-bearing drive assembly includes: The optical transmission module of the flight optical path component is driven by the air-bearing drive component to move linearly along the Y direction in order to perform a scribing operation on the surface of the thin-film battery substrate when it is stationary. After a single linear motion is completed, the carrier platform is driven to move the thin-film battery substrate a preset distance along the X direction to repeat the scribing operation; The main machining direction is the Y direction, and the stepping direction perpendicular to the Y direction is the X direction.

3. The laser scribing method for perovskite thin-film solar cells according to claim 2, characterized in that, The step of calculating the deviation data containing the spatial position mapping relationship by solving the actual trajectory and the theoretical reference trajectory includes: The spatial offset of the actual trajectory is extracted by displacement sensors arranged on the flight optical path assembly; In the control system, a spatial position synchronization buffer is constructed, and the spatial offset is bound to the real-time position feedback pulse of the air flotation drive component in spatial coordinates to generate the deviation data corresponding to the physical coordinates in a specific Y direction. The deviation data is then stored in the spatial position synchronization buffer according to the detected spatial sequence. The corresponding number of spatial compensation delay pulses is calculated based on the physical distance between the detection spot of the displacement sensor and the current processing beam. When the cumulative real-time operating pulses of the air flotation drive component reach the number of spatial compensation delay pulses, the corresponding deviation data is retrieved sequentially from the spatial position synchronization buffer using position event-triggered control logic to generate the dynamic compensation instruction.

4. The laser scribing method for perovskite thin-film solar cells according to claim 3, characterized in that, It also includes a filtering step for defects on the surface of the thin-film battery substrate: Real-time calculation of the spatial rate of change of the spatial offset between adjacent spatial sampling points; When the spatial change rate exceeds the preset abrupt change limit, the currently extracted spatial offset is determined to be a local abnormal noise caused by dust or film edge collapse. The local abnormal noise points are removed, and reconstructed deviation data is generated based on the historical normal spatial offset using an interpolation algorithm; The reconstructed deviation data is stored in the spatial location synchronization cache.

5. The laser scribing method for perovskite thin-film solar cells according to claim 2, characterized in that, The micro-motion drive mechanism is a voice coil motor or a piezoelectric ceramic driver, and the optical actuation component includes a focusing lens; The step of responding to the dynamic compensation command and driving the optical actuator to perform fine-tuning motion relative to the flight optical path assembly via the micro-motion drive mechanism includes: While the multi-path processing beams are performing scribing operations along the Y direction, the focusing lens is driven by the micro-motion drive mechanism to perform high-frequency translation in the X direction, so as to correct the landing point coordinates of the multi-path processing beams in the X direction in real time, so that the actual trajectory of the current scribing operation and the actual trajectory of the previous process scribing line maintain a constant parallel distance in the X direction.

6. The laser scribing method for perovskite thin-film solar cells according to claim 1, characterized in that, In the step of outputting the original laser beam into multiple processing beams through a beam splitting optical path system, the beam splitting optical path system divides the original laser beam into multiple independent sub-processing beams; The optical execution component includes multiple focusing lenses that correspond one-to-one with each of the sub-processing beams, and the micro-motion drive mechanism includes multiple independent actuation units that independently drive each of the focusing lenses; The step of generating dynamic compensation instructions based on the deviation data includes: calculating and generating individual compensation instructions specific to each of the sub-processing beams based on the deviation data; The step of responding to the dynamic compensation command through the micro-motion drive mechanism and driving the optical execution component to perform fine-tuning motion relative to the flying optical path component includes: each of the actuation units responding to the corresponding individual compensation command to independently fine-tune the processing position of each sub-processing beam on the surface of the thin-film battery substrate.

7. The laser scribing method for perovskite thin-film solar cells according to claim 3, characterized in that, It also includes a dynamic span calibration step: Acquire the temperature change data and corresponding thermal deformation parameters of the flight optical path component under continuous operation; Based on the thermal deformation parameters, the physical distance between the detection spot of the displacement sensor and the current processing beam is calculated and updated in real time. Using the dynamically updated physical span, the number of spatial compensation delay pulses is recalculated to eliminate the spatiotemporal synchronization matching error caused by the mechanical thermal expansion of the flight optical path components in real time.

8. A laser scribing apparatus for a perovskite thin-film solar cell, used to perform the laser scribing method for a perovskite thin-film solar cell as described in any one of claims 1 to 7, characterized in that, The device includes: A support platform is configured to clamp and fix the thin-film battery substrate to be processed in order to maintain its stationary state relative to the support platform; The beam splitting optical path system is configured to acquire the original laser beam and output the original laser beam as a multi-path processing beam; An air-bearing drive assembly and a flying optical path assembly driven therefrom, wherein the air-bearing drive assembly is configured to drive the flying optical path assembly to move linearly along the main processing direction relative to a stationary thin-film battery substrate, so as to drive multiple processing beams to perform scribing operations on the surface of the thin-film battery substrate. The detection sensor, arranged on the flying optical path assembly and located at a predetermined spatial position in front of the current processing beam, is configured to detect the actual trajectory of the previous process etch line in advance. The control system, communicatively connected to the detection sensor and the air-bearing drive assembly, is configured to calculate deviation data containing spatial position mapping between the actual trajectory and the theoretical reference trajectory, and generate dynamic compensation commands based on the deviation data; and A micro-motion drive mechanism and an optical actuator driven therefrom are mounted on the flying optical path assembly. The micro-motion drive mechanism is communicatively connected to the control system and is configured to respond to the dynamic compensation command and drive the optical actuator to perform fine-tuning motion relative to the flying optical path assembly, so as to adjust the processing position of the multi-path processing beam on the surface of the thin-film battery substrate in real time and realize dynamic tracking compensation of the scribe line trajectory of the previous process.

9. A computer-readable storage medium, characterized in that, The device contains a computer program that, when executed by a processor, causes the processor to perform the steps of the laser scribing method for a perovskite thin-film solar cell as described in any one of claims 1 to 7.

10. A computer device, characterized in that, It includes a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform the steps of the laser scribing method for a perovskite thin-film solar cell as described in any one of claims 1 to 7.

Images